TWI853012B - Additively manufactured electronic (ame) circuits having side-mounted components and additive manufacturing methods thereof - Google Patents

Abstract

The disclosure relates to systems and methods for using additive manufacturing (AM) to fabricate printed circuits having side-mounted components and contacts. More specifically, the disclosure is directed to additive manufacturing methods for fabricating electronic components (AME), for example; printed circuit board (PCB), flexible printed circuit (FPC) and high-density interconnect printed circuit board (HDIPCB) (the PCBs, FPCs, and HDIPCB’s together referred to as AMEs, or AME circuits), having conductive contacts and/or components along the Z axis of side walls or facets of the each of the printed AMEs.

Description

Laminated electronic (AME) circuit with side mounted components and laminated manufacturing method thereof

The present invention relates to systems and methods for manufacturing printed circuits with side mounted components and contacts using additive manufacturing (AM). More specifically, the present invention relates to additive manufacturing methods for manufacturing, for example, electronic components (AME); printed circuit boards (PCBs), flexible printed circuits (FPCs), and high density interconnect printed circuit boards (HDIPCBs) having conductive contacts and/or components along the Z-axis of the sidewalls or sides of each of the printed AMEs (PCBs, FPCs, and HDIPCBs are collectively referred to as AMEs, or AME circuits).

There is an increasing need for electronic devices with small form factors in all fields such as: manufacturing, commercial, consumer, military, aviation, IoT, etc. Products with these smaller form factors rely on pressed circuit boards with tightly spaced digital and analog circuits placed very closely together. Increasing device complexity and tight packaging restrictions lead to a significant increase in the number of layers and board thickness of the circuit boards, such as in mobile communication devices. However, in many cases, most reductive manufacturing methods lead to lower limits on form factor capabilities.

The increase in the number of layers and thus the thickness of the side surfaces and the required complexity as discussed herein may create opportunities for providing hitherto unused and (due to current manufacturing methods) impractical surfaces for mounting various components while ensuring reliable connectivity and functionality.

The present invention relates to overcoming one or more of the above-identified disadvantages by using multilayer manufacturing techniques and systems.

In various examples, configurations and implementations, multilayer manufacturing methods are disclosed, for example, for manufacturing electronic components (AME); printed circuit boards (PCBs), flexible printed circuits (FPCs) and high density interconnect printed circuit boards (HDIPCBs) having conductive contacts and/or components along the Z-axis of the sidewalls or sides of each of the printed AMEs.

In another configuration, a plurality of side mounted contacts are orthogonally separated and configured to operate as a quadrature separated element for an electrical small antenna (ESA).

In another embodiment, a method is provided herein for using laminate manufacturing to manufacture at least one of: a printed circuit board (PCB), a flexible printed circuit (FPC), and a high density interconnect printed circuit board (HDIPCB), each of which includes at least one of: a side-mounted component and a plurality of side-mounted contacts, the method comprising: providing an inkjet printing system having: a first print head suitable for dispensing dielectric ink; a second print head suitable for dispensing conductive ink; a transmitter operably coupled to the first and second print heads, which is configured to transport a substrate to each print head; and a computer-aided manufacturing ("CAM") module in communication with each of the first and second print heads , the CAM further comprises a central processing module (CPM) including at least one processor in communication with a non-transitory computer readable storage medium, the non-transitory computer readable storage medium being configured to store instructions which, when executed by the at least one processor, cause the CAM to control the inkjet printing system by performing steps comprising: receiving a 3D observation file representing at least one of the following: PCB, FPC and HDIPCB (each of which comprises at least one side mounted component); and generating a file library having a plurality of files, each file representing a substantially 2D layer for printing at least one of the following: PCB, FPC and HDIPCB (each of which comprises at least one side mounted component); The invention relates to a method for printing a PCB (a PCB having a side-mounted component) and a metafile representing at least the following printing sequence; providing a dielectric inkjet ink composition and a conductive inkjet ink composition; using a CAM module, obtaining a first layer file; using a first print head, forming a pattern corresponding to the dielectric inkjet ink; curing the pattern corresponding to the dielectric inkjet ink; using a second print head, forming a pattern corresponding to the conductive ink, the pattern also corresponding to a substantially 2D layer for printing at least one of the following: a PCB, an FPC and an HDI PCB (each of which includes at least one side-mounted component); sintering the pattern corresponding to the conductive inkjet ink; using a CAM module, obtaining from a file library a subsequent layer representing a subsequent layer for printing at least one of the following: Subsequent files: PCB, FPC and HDIPCB (each of which includes at least one side-mounted component); the subsequent files include printing instructions for patterns representing at least one of the following: dielectric ink and conductive ink; repeating the steps of using a first print head to form a pattern corresponding to the dielectric ink to using a CAM module to obtain subsequent, substantially 2D layers from a 2D file library, wherein after printing the final layer, at least one of the PCB, FPC and HDIPCB (each of which includes at least one side-mounted component) includes a plurality of conductive side-mounted contacts that are operable to mount at least one component; and coupling at least one component to the plurality of printed side contacts as appropriate.

It should be noted that the archive contains the layout of traces and dielectric isolation (DI) materials generated by computer-aided design (CAD), as well as the meta-files required for their retrieval, including, for example, markings required for use in the laminate manufacturing system used, printing time sequence and other information.

In another exemplary embodiment, at least one of the following is provided herein: a printed circuit board (PCB), a flexible printed circuit (FPC), and a high density interconnect printed circuit board (HDIPCB), each of which includes a plurality of side mounted contact pads, each contact pad being sized and configured to be operably coupled with a chip package.

In an exemplary embodiment, a plurality of side mounted contacts are sized and configured to operate as part of a socket sized and configured to be operable for complementary sockets of individual printed circuit boards (PCBs), flexible printed circuits (FPCs), and high density interconnect printed circuit boards (HDI PCBs).

These and other features of the system and method for AME circuits with side mounted components and contacts will become apparent from the following detailed description when read in conjunction with the drawings and illustrative, non-limiting examples.

10: Electronic components manufactured by multilayer manufacturing

20: Electronic components manufactured by multilayer manufacturing

100: Upper surface

101:Edge surface

102: Traces

103:Through hole

104: Contacts

105: Contact pad

106: Contacts

107: Contacts

108: Contacts

109: Socket

110: Chip packaging

120q: Chip packaging

130: Chip packaging

140: Electrical small antenna

141: Port

142: Port

202: Side

203:Traces

205: Chip packaging

206: Chip packaging

207: Side contacts

208: Chip packaging

209: Complementary surface

209': Socket

210: Groove

211':Traces

221: Contacts

222: Contacts

500: Electronic components manufactured by multilayer manufacturing

501: Socket part

502: Contact pad

6.1: Lines

600: Printing board

601: Printed circuit structure/DI material

602: Outer surface of printed circuit board

603: Hollow structure/excess material

603': Excess material

604': Surface/component farthest from the side of the printed circuit structure

605: Excess material/hollow structure

606: Formed structure/protrusion

606': Conductive materials

614: Bottom

616: Bottom

In order to better understand the AME circuit with side mounted components and contacts, its manufacturing method and composition, with respect to exemplary embodiments thereof, reference is made to the accompanying examples and drawings, wherein: FIG. 1 is an isometric schematic diagram of a printed circuit manufactured using the disclosed method; FIG. 2 is an isometric schematic diagram of an AME circuit complementary to the AME schematically illustrated in FIG. 1 manufactured using the disclosed method; FIG. 3 is a schematic diagram of an electrical miniature antenna with orthogonal separated antenna elements manufactured using the disclosed method; and FIGS. 4A-4C are schematic diagrams of an AME circuit manufactured using the disclosed method. 5 is a schematic illustration of a socket protrusion sized and configured to operably couple with a complementary socket in another printed circuit, the socket being manufactured using the disclosed method and system; FIG. 6 is a schematic diagram illustrating a peripheral extension structure surrounding the conductive side-mounted contacts, protrusions, and coupling elements illustrated in FIGS. 1, 2, and 5; FIG. 7 depicts an AME circuit manufactured using the described method, having a plurality of side contacts configured to fit in a PLCC socket, similar to that shown in FIG. 8.

Provided herein are examples, configurations, and implementations of systems and methods for manufacturing printed circuits with side-mounted components and contacts. More specifically, provided herein are examples, configurations, and implementations of laminate manufacturing methods for manufacturing at least one of printed circuit boards (PCBs), flexible printed circuits (FPCs), and high-density interconnect printed circuit boards (HDIPCBs) (collectively referred to as AME, or AME circuits, as indicated above); each of the printed circuits having conductive contacts and/or components along the Z axis of the side-external (in other words, side-mounted) printed circuits.

The systems and methods described herein provide exposed conductive traces on the side interface of a printed board. Conductive traces and contacts can be formed side by side and/or one on top of the other. Each side contact should be connected to a signal trace inside the board, in other words, to any printed board layer and at any height. Similarly, vertical (or horizontal, see, e.g., FIG. 3 ) conductive contacts or traces can be formed in any exposed surface of a laminated fabrication structure, where the conductive contact or trace material is significantly different from the construction material (e.g., dielectric insulation material), thereby creating probes, connectors, ports, etc.

In standard laminate manufacturing techniques where metal traces and dielectric materials are used, and more particularly in the case of inkjet printing, vertical metal components may be printed in cavities, holes or apertures (such as (filled or coated) vias in PCBs) surrounding the entire metal structure. In an exemplary embodiment, the metallic, conductive inclusions may be exposed, typically toward the edge of the host material (typically a non-conductive material).

In some embodiments, a structure of side contacts is first produced using known methods that surrounds the entire vertical conductive structure to be exposed and excess material is removed (e.g., by slicing or grinding it). In other configurations, the system may include a print head equipped with support material that can be removed by washing.

Here, the systems, methods, and compositions described herein can be used to form/fabricate the described AMEs, including side mounted conductive elements (e.g., traces, contacts, sockets, orthogonal split antenna elements) coupled to components as appropriate, using a combination of print heads with conductive and dielectric ink compositions (using, for example, an inkjet printing device or using several passes) in a single, continuous laminate manufacturing (AM) process. Using the systems, methods, and compositions described herein, the insulating and/or dielectric portions of the printed board can be formed using thermosetting resin materials (see, for example, 100 in FIG. 1 ). This printed dielectric inkjet ink (DI) material is printed with an optimized 3D pattern, including precise recesses and protrusions, which are shaped to form a hollow cylinder or other vertical hollow structure (see, for example, 603, 605, FIG. 6) whose periphery extends beyond the side (101 in FIG. 1 and 202 in FIG. 2, respectively).

Although reference is made to inkjet inks, other layered fabrication methods (also known as rapid prototyping, rapid manufacturing, aerosol printing, laser induced forward transfer (LIFT), and 3D printing) are also encompassed in embodiments of the disclosed methods. In exemplary embodiments, the described AME circuits including side mounted contacts, traces, ports, and the like may also be fabricated by selective laser sintering (SLS) processes, direct metal laser sintering (DMLS), electron beam melting (EBM), selective thermal sintering (SHS), or stereolithography (SLA). The described AME circuits including side mounted contacts, traces, ports and the like may be fabricated from any suitable laminated fabrication material, such as metal powders (e.g., cobalt chromium, steel, aluminum, titanium and/or nickel alloys, gold), gas atomized metal powders, thermoplastic powders (e.g., polylactic acid (PLA), acrylonitrile butadiene styrene (ABS) and/or high density polyethylene (HDPE)), photopolymer resins (e.g., UV curable photopolymers such as PMMA), thermosetting resins, thermoplastic resins, or any other suitable material to achieve the functionality as described herein.

The system used may typically include several subsystems and modules. Such subsystems and modules may be, for example: other conductive and dielectric print heads, mechanical subsystems for controlling the movement of the print heads, substrates (or chucks) for heating and conveying; ink composition injection systems; curing/sintering subsystems; computerized subsystems having at least one processor or CPU configured to control the process and generate suitable printing instructions, component placement systems (such as robotic arms), material removal subsystems (such as laser applicators, lathes, tools and the like), machine vision systems, and command and control systems for controlling 3D printing.

Therefore and in an exemplary embodiment, a method is provided herein for using laminate manufacturing to manufacture at least one of: a printed circuit board (PCB), a flexible printed circuit (FPC), and a high density interconnect printed circuit board (HDIPCB), each of which includes at least one of: a side-mounted component and a plurality of side-mounted contacts, the method comprising: providing an inkjet printing system having: a first print head suitable for dispensing dielectric ink; a second print head suitable for dispensing conductive ink; a transmitter operably coupled to the first and second print heads, which is configured to transport a substrate to each print head; and a computer-aided manufacturing ("CAM") in communication with each of the first and second print heads. ) module, the CAM further comprising a central processing module (CPM) including at least one processor communicating with a non-transitory computer readable storage medium, the non-transitory computer readable storage medium being configured to store instructions, the instructions when executed by the at least one processor causing the CAM to control the inkjet printing system by performing steps including: receiving a 3D observation file representing at least one of the following: PCB, FPC and HDIPCB (each of which includes at least one side-mounted component); and generating a file library having a plurality of files, each file representing a substantially 2D layer for printing at least one of the following: PCB, FPC and HDIPCB (each of which includes at least one side-mounted component); side-mounted components), and a metafile representing at least the following printing sequence; providing a dielectric inkjet ink composition and a conductive inkjet ink composition; using a CAM module, obtaining a first layer file; using a first print head, forming a pattern corresponding to the dielectric inkjet ink; curing the pattern corresponding to the dielectric inkjet ink; using a second print head, forming a pattern corresponding to the conductive ink, the pattern also corresponding to a substantially 2D layer for printing at least one of the following: PCB, FPC and HDIPCB (each of which includes at least one side-mounted component); sintering the pattern corresponding to the conductive inkjet ink; using a CAM module, obtaining from a file library a subsequent layer representing the printing of at least one of the following Subsequent files: PCB, FPC and HDIPCB (each of which includes at least one side-mounted component); the subsequent files include printing instructions for patterns representing at least one of the following: dielectric ink and conductive ink; repeating the steps of using a first print head to form a pattern corresponding to the dielectric ink to using a CAM module to obtain subsequent, substantially 2D layers from a 2D file library, wherein after printing the final layer, at least one of the PCB, FPC and HDIPCB (each of which includes at least one side-mounted component) includes a plurality of conductive side-mounted contacts that are operable to mount at least one component; and coupling at least one component to the plurality of printed side contacts as appropriate.

Alternatively or additionally, the method disclosed herein for manufacturing a side-mounted component on an AME further comprises: using a first print head, printing a pattern corresponding to a through hole, the pattern corresponding to a through hole extending along the periphery from the side of at least one of a PCB, an FCP, and an HDIPCB; curing the pattern corresponding to the through hole; using a second print head, printing a pattern corresponding to a conductive portion of the through hole; sintering the pattern corresponding to the conductive portion of the through hole; and removing at least a portion of the cured vertical portion of the dielectric pattern extending along the periphery, thereby exposing a portion of the conductive ink, wherein the step of removing at least a portion of the cured vertical portion of the dielectric pattern extending along the periphery comprises using at least one of the following: a laser applicator, a lathe, a tool, and a resin removal member, thereby exposing the conductive contact.

The use of the term "module" does not imply that the components or functionality described or claimed as part of the module are all configured in a (single) common package. Rather, any or all of the various components of a module (whether control logic or other components) may be combined in a single package or maintained separately and may further be distributed in multiple groups or packages or across multiple (remote) locations and devices. Furthermore, in certain exemplary embodiments, the term "module" refers to an integrated or distributed hardware unit.

In the exemplary embodiment, in the case of the first print head, the term "dispensing" is used to refer to a device for dispensing inkjet ink droplets. The dispenser can be, for example, a device for dispensing small amounts of liquid, including a microvalve, a piezoelectric dispenser, a continuous jet print head, a boiling (bubble jet) dispenser, and other devices that affect the temperature and properties of the fluid flowing through the dispenser.

The set of executable instructions is further configured to cause the processor, when executed, to: generate a 2D file library of a plurality of subsequent layer files using the 3D observation file, each subsequent file representing a substantially two-dimensional (2D) subsequent layer for printing a subsequent portion of at least one of a PCB, an FPC, and an HDI PCB, wherein the PCB, the FPC, and the HDI PCB include at least one of the following: a side mounted component and a plurality of side mounted contacts, wherein each subsequent layer file is indexed by a printing order.

In the context of the present disclosure, the term "2D file library" refers to a set of defined files that together define a single AME of contacts for side-mounted components or multiple AMEs of contacts for side-mounted components for a given purpose when assembled and printed. In addition, the term "2D file library" may also be used to refer to a collection of 2D files or any other grid graphic file format (images are represented as a collection of pixels, usually in the form of a rectangular grid, such as BMP, PNG, TIFF, GIF) that can be indexed, retrieved, and reassembled to provide sequential structural layers of a given AME circuit (whether the retrieval is for the AME of contacts for side-mounted components as a whole, or for a given specific 2D layer within an AME).

In addition, each file in the 2D file library has associated metadata that defines at least the printing order of the layers and other descriptions about the printing system, such as printing speed (m/sec), the order of CI and DI, and the like. In the context of the present disclosure, "metadata" is generally used herein to refer to data that describes other data, such as data that describes the CI and/or DI patterns to be printed. However, it should be understood that as used herein, the term "data" can refer to either data or metadata.

Then, using the file library, 2D files for printing are captured and for example (depending on metadata of for example the 2D layer files) conductive ink patterns are generated, which include conductive portions of each of the 2D layer files for printing conductive portions of the capture layer of the AME with contacts for the side mounted component, and then ink patterns are generated, which correspond to dielectric ink portions of each of the 2D layer files for printing dielectric portions of (the same or different) layers of the AME with contacts for the side mounted component, wherein the CAM module is configured and operable to control each of the first and second print heads, thereby obtaining the 2D layer. Next, depending on the printing sequence configured in the metadata of the 2D file, a pattern of the dielectric ink corresponding to the extracted 2D layer file is formed using the first printing head, and the DI pattern is cured. Next, a pattern of the conductive ink corresponding to the extracted 2D layer file is formed using the second printing head and the pattern corresponding to the conductive ink is sintered, thereby obtaining a single, substantially 2D layer of AME having contacts for side-mounted components. In the context of the present disclosure, a substantially 2D layer means forming a single layer of a film having a thickness between about 10 μm and about 55 μm, for example between about 15 μm and about 45 μm or between about 17 μm and about 35 μm.

Therefore and in an exemplary embodiment, the method of forming/manufacturing at least one AME comprising side-mounted conductive elements (e.g., traces, pads, contacts, sockets) coupled to components as appropriate, using the systems and compositions provided, further comprises, before or in a similar manner to the step of coupling at least one component as appropriate (e.g., by automatically placing the chip and soldering these elements to the now exposed side contacts 207n, FIG. 2): using a CAM module, accessing a file library; obtaining a generated file representing a 2D subsequent layer of the PCB; and repeating the steps for forming the subsequent layer.

The term "chip" refers to a packaged, singulated, integrated circuit (IC) device. The singulated IC may be packaged in a housing or another structure ("chip package") that facilitates, for example, coupling of the singulated IC to an AME circuit. Therefore, and in the context of the present disclosure, the term "chip package" may specifically refer to a housing that is used to house a singulated IC device (interchangeable with a "chip") for insertion (socket mounting) or soldering (surface mounting) onto a circuit board (such as an AME circuit), thereby creating side mounting sites ("side contacts" of the chip). In electronic devices, the term chip package or chip carrier may refer to materials added around a component or integrated circuit to enable the component or integrated circuit to be handled and incorporated into the circuit without damage. In addition, the chip or chip package used in conjunction with the systems, methods and compositions described herein can be a Quad Flat Pack (QFP) package, a Thin Small Outline Package (TSOP), a Small Outline Integrated Circuit (SOIC) package, a Small Outline J-Lead (SOJ) package, a Plastic Leaded Chip Carrier (PLCC) package, a Wafer Level Chip Scale Package (WLCSP), a Mold Array Process-Ball Grid Array (MAPBGA) package, a Ball-Grid Array (BGA), a Quad Flat No-Lead (QFN) package, a Land Grid Array (Land Grid Array; LGA) package, passive component, or a combination of two or more of the aforementioned devices.

Thus, the CAM module may include: a 2D file library storing files converted from a 3D observation file of an AME having contacts for side mounted components. As used herein, the term "library" refers to a collection of 2D layer files derived from a 3D observation file, which contains information required to print each conductive and dielectric pattern, which can be accessed and used by a data collection application that can be executed by a computer readable medium. The CAM further includes a processor that communicates with the library; a memory device that stores a set of operation instructions executed by the processor; a micro-mechanical inkjet print head that communicates with the processor and the library; and a print head interface circuit that communicates with the 2D file library, the memory and the micro-mechanical inkjet print head, and the 2D file library are configured to provide printer operation parameters specific to the functional layer.

In certain configurations, the systems provided herein further include a robotic arm in communication with and under the control of the CAM module, equipped with a tool, rotary drill, laser source, or other DI removal member, configured to remove excess material from the structure surrounding the conductive material forming the side-mounted contacts, thereby exposing the contacts, ports, traces, and other conductive structures. In certain alternative or other configurations, the systems provided herein further include a third print head configured to dispense support ink.

Using an additional support ink head, the method for forming/fabricating at least one AME including a side-mounted conductive element (e.g., traces, contacts, sockets, orthogonal separated antenna elements) coupled to the component as appropriate may further include providing a support ink composition; after, sequentially or simultaneously with the step of using the first print head, the second print head or any other functional print head (and any arrangement thereof). Using the support ink print head, a predetermined pattern corresponding to a support representation generated by the CAM module from a 3D observation file and represented as a first (and subsequent), substantially 2D layer of a composite component for printing is formed, wherein the 2D pattern corresponds to a structure including conductive material extending beyond the edge of the printing plate, and the support ink is sized and configured to be removed. The predetermined pattern corresponding to the support representation can then be further processed (e.g., cured, cooled, cross-linked, and the like) to functionalize the pattern as a support as described above in a 2D layer of a side mounted contact, or, when used, a dielectric portion for defining a via. The process for depositing the support can then be repeated for each sequential layer as needed.

In an exemplary embodiment, a first conductive inkjet ink may contain silver and another inkjet ink may contain copper, thereby enabling printing of integral, built-in ports with copper connection terminals or connectors with silver electrodes (see, e.g., 211', FIG. 2). Alternatively or additionally, other conductive materials that may be used in the conductive print head may be nickel, gold, aluminum, platinum and the like.

In some instances, the term "forming" (and its variants "formed", etc.) refers to pumping, injecting, pouring, releasing, displacing, dispensing, circulating, or otherwise placing a fluid or material (e.g., conductive ink) in contact with another material (e.g., a substrate, a resin, or another layer) using any suitable means known in the art.

Curing of insulating and/or dielectric layers or patterns deposited by a suitable print head as described herein may be achieved, for example, by heating, photopolymerization, drying, plasma deposition, annealing, promoting redox reactions, irradiation by ultraviolet beams, or a combination comprising one or more of the foregoing. Curing need not be performed by a single process and may involve several processes (e.g., drying and heating, and use of additional print head deposition crosslinking agents) performed simultaneously or sequentially.

Additionally and in another exemplary embodiment, crosslinking refers to joining the moieties together using a crosslinking agent by covalent bonding (i.e., forming a linking group) or by free radical polymerization of monomers such as, but not limited to, methacrylates, methacrylamides, acrylates, or acrylamides. In some configurations, the linking group grows to the end of the polymer arm.

Therefore, in an exemplary embodiment, the vinyl component is a monomer copolymer, and/or an oligomer selected from the group consisting of: multifunctional acrylates, carbonate copolymers thereof, urethane copolymers thereof, or a composition comprising monomers and/or oligomers of the foregoing substances. Therefore, the multifunctional acrylate is 1,2-ethylene glycol diacrylate, 1,3-propylene glycol diacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, dipropylene glycol diacrylate, neopentyl glycol diacrylate, ethoxylated neopentyl glycol diacrylate, propoxylated neopentyl glycol diacrylate, tripropylene glycol diacrylate, bisphenol-A-diglycidyl ether diacrylate, hydroxy pivalic acid neopentyl glycol diacrylate, ethoxylated bisphenol-A-diglycidyl ether diacrylate, polyethylene glycol diacrylate, Trihydroxymethylpropane triacrylate, ethoxylated trihydroxymethylpropane triacrylate, propoxylated trihydroxymethylpropane triacrylate, propoxylated glycerol triacrylate, tris(2-acryloxyethyl)isocyanurate, pentaerythritol triacrylate, ethoxylated pentaerythritol triacrylate, pentaerythritol tetraacrylate, ethoxylated pentaerythritol tetraacrylate, di(trihydroxymethylpropane) tetraacrylate, dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate, or a multifunctional acrylate composition comprising one or more of the foregoing.

In exemplary embodiments, the term "copolymer" means a polymer derived from two or more monomers (including trimers, tetramers, etc.), and the term "polymer" refers to any carbon-containing compound having repeating units derived from one or more different monomers.

Other functional heads may be located before, between, or after the inkjet ink printing heads used in the system for implementing the methods described herein. Such functional heads may include electromagnetic radiation sources configured to emit electromagnetic radiation of a predetermined wavelength (λ) (e.g., between 190 nm and about 400 nm, such as 395 nm in one exemplary embodiment) that may be used to accelerate and/or regulate and/or promote photopolymerizable insulating and/or dielectric materials that may be used in conjunction with metal nanoparticle dispersions used in conductive inks. Other functional heads may be heating elements, other printing heads with various inks (e.g., supports, pre-soldering connectivity inks, marking printing of various components (e.g., capacitors, transistors), and the like), and combinations of the foregoing.

Other similar functional steps (and therefore, support systems for affecting such steps) may be performed before or after each of the DI or metal conductive inkjet ink print heads (e.g., for sintering the conductive layer). Such steps may include (but are not limited to): a heating step (under the influence of a heating element or hot air); photobleaching (of the photoresist mask support pattern), photocuring or exposure to any other suitable source of actinic radiation (using, for example, a UV light source); drying (for example, using a vacuum region, or a heating element); (reactive) plasma deposition (for example, using a pressurized plasma gun and a plasma beam controller); crosslinking, such as by using a cationic initiator, such as [4-[(2-hydroxytetradecyl)-oxy]-phenyl]-phenyliodonium hexafluoroantiphonate for a flexible resin polymer solution or a flexible conductive resin solution; prior to coating; annealing, or promoting redox reactions and combinations thereof (the order in which these methods are utilized is irrelevant). In certain exemplary embodiments, laser (e.g., selective laser sintering/melting, direct laser sintering/melting) or electron beam melting may be used for the rigid resin and/or flexible portion. It should be noted that the conductive portion may be sintered even when the conductive portion is printed on top of the rigid resin portion assembly of the printed circuit board with side mounted components and contacts described herein.

Conductive ink compositions may be formulated taking into account requirements imposed by the deposition tool (e.g., in terms of viscosity and surface tension of the composition) and the deposition surface characteristics (e.g., hydrophilicity or hydrophobicity, and interfacial energy of the substrate or support material (e.g., glass) (if used) or the substrate layer on which the successive layers are deposited. For example, the viscosity of the conductive inkjet ink and/or DI (measured at the printing temperature (°C)) may be, for example, not less than about 5 cP, such as not less than about 8 cP, or not less than about 10 cP, and not more than about 30 cP, such as not more than about 20 cP, or not more than about 15 cP. The conductive inks can each be configured (e.g., formulated) to have a dynamic surface tension (referring to the surface tension when the jetted ink droplet is formed at the print head orifice) between about 25 mN/m and about 35 mN/m, such as between about 29 mN/m and about 31 mN/m, as measured by a maximum bubble pressure tensiometer at a surface age of 50 ms and 25°C. The dynamic surface tension can be adjusted so that the contact angle with the strippable substrate, support material, resin layer, or a combination thereof is between about 100° and about 165°.

In the exemplary embodiments, the term "chuck" is intended to mean a mechanism for supporting, holding, or retaining a substrate or workpiece. A chuck may include one or more parts. In one configuration, a chuck may include a combination of a stage and an insert (platform), jacketed or otherwise configured for heating and/or cooling and having another similar component, or any combination thereof.

In an exemplary embodiment, inkjet ink compositions, systems and methods for implementing direct, continuous or semi-continuous inkjet printing to form/fabricate at least one AME including side-mounted conductive elements (e.g., traces, contacts, sockets, antenna elements) that are optionally coupled to components can be patterned by ejecting droplets of liquid inkjet ink provided herein from an orifice at a time, such as, for example, on a removable substrate or any subsequent layer, operating the print head (or substrate) in two (X-Y) dimensions (it should be understood that the print head can also move in the Z axis) at a predetermined distance. The height of the print head can vary with the number of layers, maintaining, for example, a fixed distance. Each droplet can be configured to be directed, for example, by a pressure pulse, through a deformable piezo transistor (in certain configurations), from an orifice operably coupled to an orifice to a substrate along a predetermined trajectory. Printing of a first inkjet metallic ink can be increased and a greater number of layers can be accommodated. The provided inkjet printhead used in the methods described herein can provide a minimum layer film thickness equal to or less than about 0.3 μm-10,000 μm.

The conveyors used in the described methods and implemented in the described systems that move between the various print heads can be configured to move at speeds between about 5 mm/sec and about 1000 mm/sec. For example, the speed of the chuck can depend on, for example, the desired transport volume, the number of print heads used in the method, the number and thickness of layers of printed circuit boards having side mounted components and contacts described herein that are printed, the curing time of the ink, the evaporation rate of the ink solvent, the distance between a first print head that jets a conductive ink containing metal particles or metal polymer slurry and a second print head that jets a second, thermosetting resin and board forming ink, and the like or a combination of factors including one or more of the foregoing.

In an exemplary embodiment, the volume of each droplet of the metal (or metallic) ink and/or the second, resin ink may be in the range of 0.5 to 300 picoliters (pL), such as 1-4 pL and depending on the strength of the drive pulse and the characteristics of the ink. The waveform used to eject a single droplet may be a 10V to about 70V pulse, or about 16V to about 20V, and may be ejected at a frequency between about 2kHz and about 500kHz.

The 3D observation file representing the printed circuit board with side mounted components and contacts for manufacturing may be: ODB, ODB++, .asm, STL, IGES, DXF, DMIS, NC, STEP, Catia, SolidWorks, Autocad, ProE, 3D Studio, Gerber, EXCELLON file, Rhino, Altium, Orcad or a file containing one or more of the foregoing; and the file representing at least one, essentially 2D layer (and uploaded to the library) may be, for example, a JPEG, GIF, TIFF, BMP, PDF file or a combination containing one or more of the foregoing.

In certain configurations, the CAM module further comprises a computer program product to form/manufacture at least one AME comprising side mounted conductive elements (e.g., traces, contacts, sockets, orthogonal split antenna elements) coupled to components (e.g., electronic components, machine parts, connectors, another AME circuit, and the like) as appropriate. The printed components may comprise discrete metal (conductive) components and resin (insulating and/or dielectric) components on a rigid portion or a flexible portion of the AME, each and all of which are printed simultaneously or sequentially and continuously as appropriate. The term "continuously" and variations thereof are intended to mean printing in a substantially uninterrupted process. In another exemplary embodiment, continuous refers to a layer, component, or structure having no significant breaks along the length of the layer, component, or structure.

The computer controlling the printing process described herein may include: a computer-readable storage medium having computer-readable program code implemented therewith, which, when executed by a processor in a digital computing device, causes a three-dimensional inkjet printing unit to perform the following steps: pre-processing computer-aided design/computer-aided manufacturing (CAD/CAM) generated information (e.g., 3D observation files) associated with the described AME circuits including side-mounted contacts, traces, ports, and the like to be manufactured, thereby generating a plurality of 2D files (in other words, representing at least one, substantially 2D, 3D image files for printing AME); D layer); directing a flow of droplets of metal material from a second inkjet print head of a three-dimensional inkjet printing unit at the substrate surface; directing a flow of droplets of DI resin material from a first inkjet print head at the substrate surface; or, alternatively or additionally, directing a flow of droplets of material from another inkjet print head (e.g., support ink); moving the substrate relative to the inkjet head in an x-y plane of the substrate, wherein for each of a plurality of layers (and/or patterns of conductive or DI inkjet ink within each layer), the step of moving the substrate relative to the inkjet head in an x-y plane of the substrate is performed in the layer-by-layer fabrication of the described AME circuit.

In addition, the computer program may include program code components for performing the steps of the method described herein, and a computer program product containing the program code components stored on a medium readable by a computer. The memory device used in the method described herein may be any of various types of one or more non-volatile memory storage devices (in other words, a memory device that does not lose information on it when power is lost). The term "memory device" is intended to cover installation media such as CD-ROM, floppy disk or tape devices or non-volatile memory such as magnetic media such as hard drives, SATA, SSD, optical storage, or ROM, EPROM, FLASH, etc. The memory device may also include other types of memory or combinations thereof. In addition, the memory medium may be located in a first computer (e.g., a provided 3D inkjet printer) executing a program, and/or may be located in a second, different computer connected to the first computer via a network (e.g., the Internet). In the latter case, the second computer may further provide the program instructions to the first computer for execution. The term "memory device" may also include two or more memory devices that may reside in different locations (e.g., in different computers connected via a network). Thus, for example, a bitmap library may reside on a memory device remote from a CAM module coupled to a provided 3D inkjet printer, and may be accessed by the provided 3D inkjet printer (e.g., via a wide area network).

Unless otherwise specifically stated, it should be understood, as will be apparent from the following discussion, that throughout this specification, discussions utilizing terms such as "processing", "loading", "communication", "detection", "computation", "determination", "analysis" or similar terms refer to the actions and/or processes of a computer or computing system, or similar electronic computing device, that manipulates and/or converts data represented in a physical manner (such as a transistor architecture) into other data similarly represented in the form of a physical structure (in other words, resin or metal/metallic) layer.

Methods, programs and libraries for use in connection with a PCB to be manufactured having side mounted contacts and/or components as described herein Computer Aided Design/Computer Aided Manufacturing (CAD/CAM generated information may be based on converted CAD/CAM data packages such as IGES, DXF, DWG, DMIS, NC files, GERBER® files, EXCELLON®, STL, EPRT files, ODB, ODB++, .asm, STL, IGES, STEP, Catia, SolidWorks, Autocad, ProE, 3D Studio, Gerber, Rhino, Altium, Orcad, Eagle files or software packages containing one or more of the foregoing. In addition, the properties associated with the graphic objects transfer the meta information required for manufacturing and can accurately define the PCB. Therefore and in an exemplary embodiment, GERBER®, EXCELLON®, DWG, DXF, STL, EPRT ASM and the like are converted into 2D files using a pre-processing algorithm as described herein.

A plurality of AMEs with side mounted contacts fabricated using the methods described herein may be partially embedded (and therefore partially exposed) in at least one of a PCB, FPC, and HDI PCB. As illustrated in FIG. 6 , component 604′ is partially embedded in a dielectric material (or “structure”) and may be directly printed from an exposed conductive ink extending beyond the outer peripheral surface 602 of the printed board 600. This may be achieved by designing vias (at least one of filled through-hole vias, blind vias, and buried vias) wherein at least a portion of the vias extend beyond the outer peripheral surface 602 (or sidewall) of the printed board 600. Alternatively or additionally, when implemented, after excess material (603, 603′) is removed along line 6.1 (see, e.g., FIG. 6 ), the remaining conductive material 606′ is partially embedded (in other words, partially exposed to surface 602). Instead, the design in a 3D observation file (e.g., Excellon file) can be projected or rasterized into a 2D layer file, which when fully manufactured defines a shaped structure 606 that can be used, for example, to couple an integrated circuit, or as a coupling base for a chip package together with another contact (see, e.g., 207.). And similar to through-hole manufacturing, when implemented, after removing excess material 605, it is configured to surround (encapsulate) conductive material 606' (see, e.g., FIG. 6), with the remaining conductive material 606' extending along the periphery to the surface 602.

Furthermore, contacts, sockets, orthogonal separation conductive elements and the like fabricated using the methods described herein can be coupled to traces at any layer or combination of layers, thereby acting as ports and contact points specific to internal signal layers. In an exemplary embodiment, a plurality of side mounted contacts are orthogonally separated and orthogonally isolated, so that the orthogonally separated contacts can be sized and configured to operate as (in other words, can operate as) orthogonal isolation elements for electrical small antennas (ESAs, see, e.g., FIG. 3 ). As used herein, orthogonal separation is used to indicate that contacts protrude from a printed circuit along a perimeter such that the protrusions are orthogonal (perpendicular) to one another. As illustrated in FIG. 1 , for an electrically small antenna (ESA) 140, orthogonally separated and isolated contacts may be used as ports 141, 142. In the exemplary embodiment, the term "electrically small antenna" (ESA) refers to an antenna in which the largest dimension of the antenna does not exceed one tenth of the wavelength. Thus, a dipole with a length of λ/10, a ring with a diameter of λ/10, or a sheet with a diagonal dimension of λ/10 would be considered electrically small. As illustrated in FIG. 1 , using the laminate manufacturing method provided herein, it is possible to manufacture a dual-port diversity antenna as a single board by printing two orthogonally extending antennas, thereby improving multipath interference to improve the quality and reliability of wireless communications. This is especially valuable in wireless connections using the main multiple-input, multiple-output (MIMO) communication protocols, such as in 4G and 5G networks. In certain configurations, orthogonal separation and isolation allow the spatial separation required to exploit multipath signal propagation to be maintained.

In addition and as illustrated in Figures 1, 2, 4 and 5, a plurality of side-mounted contacts (see, e.g., Figure 6) manufactured using the methods described herein operate as part of a socket, wherein the socket can form a tongue-in-groove (and/or other topological coupling of complementary surfaces) coupling with a contact of an AME having a side-mounted assembly. Thus, for example, using the manufacturing methods described herein for forming side-mounted contacts, it is possible to have contacts of two or more AMEs having side-mounted assemblies operably coupled to each other at various angles.

A more complete understanding of the components, methods, assemblies, and devices disclosed herein may be obtained by reference to the accompanying drawings. Such drawings (also referred to herein as "figures") are merely schematic representations (e.g., illustrations) based on convenience and simplicity in illustrating the present disclosure, and are therefore not intended to indicate the relative sizes and dimensions of the device or its components and/or to define or limit the scope of the exemplary embodiments. Although specific terms are used in the following description for clarity, such terms are intended only to refer to the specific structures of the exemplary configurations selected for the illustrations in the drawings and are not intended to define or limit the scope of the present disclosure. In the drawings and the following description, it should be understood that the same numerical designations refer to components of the same function and/or composition and/or structure.

Turning to Figures 1-2 and 6, Figure 1 illustrates a perspective view of an AME (interchangeable with FPC and HDI PCB) 10. The AME 10 has an upper surface 100, and sidewalls, or edge surfaces 101. Side mounted contacts 104p, contact pads 105, and contacts 106 (see, e.g., Figures 4A-4C) are formed and connected to the active top layer using traces 102i, as examples of vias 103j, some are through-hole type vias (in other words, extending from the top layer to the bottom layer) and may be filled or coated vias, while other vias 103j may be filled or coated blind vias (i.e., terminated at an internal layer). Although not shown, some of the vias 103j may be buried vias (starting and ending between layers that are neither top nor bottom layers). As shown, the contacts 106 may be partially embedded/exposed 107 within the AME 10, as shown in the X-Y cross-sectional view in FIG. 6, which is formed by creating a through-hole type via in which a portion 603 is removed without removing any portion of the conductive filled via 604, thereby creating a partially embedded/exposed contact 107. Similarly, a side mounted contact pad 105 for a chip package (e.g., 208, FIG. 2) may be formed using structure 605, removing the structure and thereby forming the contact pad 105. In the context of the present disclosure, the term "partially embedded" means that when the disclosed method is used to fully manufacture the contacts of the AME with side-mounted components, at least the surface farthest from the side 602 of the printed circuit structure 601 (e.g., 604') realizes a protrusion 606 from the side 602 or makes 604' flush with the surface 602; and at least the bottom 614, 616 (the surface closest to the surface 602) is surrounded by the DI material 601.

As illustrated, various contacts 104p, contact pads 105, and connectors 106 and 207n may be connected to integrated circuits, or chip packages 110, 120q, 130, ESA 140 (FIG. 1), 205q, and 206 (FIG. 2) using integrally printed traces 102i and 203i. In addition, as illustrated with respect to ports 141 and 142 of ESA 140, these ports may be formed by blind vias formed starting at a bottom layer and terminating in subsequent layers above the bottom layer and below the top layer, as illustrated in FIG. 6. Another example of a contact fabricated by the method described herein using a blind via is illustrated in FIG. 2 by contact 222 and contact 221 (using a buried via).

The contact 108 of FIG. 1 may form part of a socket 109 configured to operably couple (in other words, maintain electrical continuity) with the complementary surface 209 and groove 210 of the AME 20 illustrated in FIG. 2, thereby effectively forming a tongue-and-groove coupling. The AME 20 may form another socket 209' having an exposed trace 211' configured to couple with another AME having a complementary surface (e.g., a protruding socket portion 501 of an AME 500 having a plurality of contact pads 502k). As illustrated in FIG. 5, the coupling may be continuous, resulting in an angle of 180° and a seemingly continuous surface, or at 90°. However, the complementary socket surfaces may be configured to operably connect adjacent AME circuits at any desired angle, thereby further enabling shrinkage of the package. Furthermore, by changing the angle between adjacent AMEs (essentially, folding the AMEs over each other), it is possible to shorten the contacts between components on the top surface, as well as add additional orthogonal separation and isolation ESAs for multipath communications.

In contrast, the side-mounted contacts fabricated using the AM methods described herein and shown in FIG. 7 can be used in exemplary embodiments to operably couple contacts of an AME having side-mounted components with a socket mounted in another AME circuit, such as a plastic leaded chip carrier (PLCC). AMEs having side-mounted contacts fabricated using the methods provided herein can similarly operate to engage in other types of sockets, such as ceramic leaded chip carriers (CLCCs).

As used herein, the term "comprising" and its derivatives are intended to be open terms that specify the presence of stated features, elements, components, groups, integers and/or steps but do not exclude the presence of other unstated features, elements, components, groups, integers and/or steps. The foregoing also applies to words with similar meanings, such as the terms "including", "having" and their derivatives.

All ranges disclosed herein are inclusive, and the endpoints are independently combinable with each other. "Combination" includes admixtures, mixtures, alloys, reaction products, and the like. Unless otherwise indicated herein or clearly contradicted by context, the terms "a", "an", and "the" herein do not indicate limitations of quantity and should be interpreted to cover both the singular and the plural. As used herein, the suffix "(s)" is intended to include both the singular and the plural forms of the term it modifies, thereby including one or more of the term (e.g., a print head includes one or more print heads). Throughout this specification, references to "an exemplary embodiment", "another exemplary embodiment", "exemplar embodiments", "certain configurations", etc., when present, mean that at least one exemplary embodiment described herein includes specific elements (e.g., properties, structures, steps, and/or features) described in conjunction with the exemplary embodiments, and may or may not exist in other configurations. In addition, it should be understood that the described elements may be combined in various configurations and in any suitable manner. In addition, in this document, the terms "first", "second", and the like do not indicate any order, quantity, or importance, but are used to indicate one element to another element.

With respect to systems, methods, AME circuits and programs, the term "operable" means that the system and/or device and/or program or a certain element or step is fully functionally dimensioned, adapted and calibrated, including elements used to perform the functions described when activated, coupled, implemented, executed, realized or when the executable program is executed by at least one processor associated with the system and/or device and meets applicable operability requirements. With respect to systems and AME circuits, the term "operable" means that the system and/or circuit is fully functional and calibrated, including logic used to perform the functions described when executed by at least one processor and meets applicable operability requirements.

Similarly, the term "about" means that amounts, dimensions, formulations, parameters, and other quantities and features are not and need not be exact, but may be approximate and/or larger or smaller as necessary, reflecting tolerances, conversion factors, rounding, measurement errors, and the like, as well as other factors known to those skilled in the art. In general, amounts, dimensions, formulations, parameters, or other quantities or features are "about" or "approximate" whether or not expressly stated.

Therefore and in an embodiment, provided herein is an laminated electronic (AME) circuit (interchangeable with AME) comprising or containing at least one of a printed circuit board (PCB), a flexible printed circuit (FPC) and a high density interconnect PCB (HDIPCB), the AME circuit comprising at least one of the following: a side mounted component and a plurality of side mounted contacts, wherein (i) the plurality of side mounted contacts are partially embedded in an A ME circuit, (ii) the component side-mounted to the AME circuit is a chip package of a unitized IC without a package corresponding to the side-mounting, wherein (iii) the chip package is at least one of the following: a quad flat pack (QFP) package, a thin small outline package (TSOP), a small integrated circuit (SOIC) package, a small lead J (SOJ) package, a plastic lead chip carrier (PLCC) package, a wafer level chip scale package (WCP), a wafer level chip scale package (WLP), a wafer level chip scale package (WLP), a wafer level chip scale package (WSC ...SP), a wafer level chip scale package (WSP), a wafer level chip scale package (WLP), a wafer level chip scale package (WSC), a wafer level chip scale package (WSP), a wafer level chip scale package (WLP), a wafer level chip scale package (WSP), a wafer level chip scale package (WLP), a wafer level chip scale package (WSP), a wafer level chip scale package (WSP), a wafer level chip scale package (WLP), a wafer level chip scale package (WSP), a small form factor integrated circuit (SOIC) package, a small form factor integrated circuit (SOIC) package, a small form factor J lead (SOJ) package, a plastic lead chip carrier (PLCC) package, a (iv) a plurality of side mounted contacts are at least one of partially embedded filled through-hole vias, partially embedded blind vias, and partially embedded buried vias, (v) orthogonal separation, wherein (vi) the orthogonal separation contacts can be used as an electrical small antenna (ESA) ), (vii) a plurality of side mounted contacts are operable as part of a socket, wherein (viii) the socket forms a tongue and groove for coupling with at least one other AME circuit, wherein (ix) at least one side contact forms a contact for at least one of the tongue and groove, and wherein (x) the plurality of side mounted contacts are sized and configured to match contacts of a socket mounted in another AME.

In another embodiment, a method for an electronic (AME) circuit for laminate manufacturing is provided herein, wherein the electronic circuit for laminate manufacturing includes at least one of a printed circuit board (PCB), a flexible printed circuit (FPC), and a high density interconnect PCB (HDIPCB), and the AME circuit includes at least one of the following: a side-mounted component and a plurality of side-mounted contacts, and the method includes: providing an inkjet printing system having: a first print head suitable for dispensing dielectric ink; a second print head suitable for dispensing conductive ink; and a third print head for dispensing conductive ink. a conveyor operably coupled to the first and second print heads, configured to convey the substrate to each print head; and a computer-aided manufacturing ("CAM") module in communication with each of the first and second print heads, the CAM further comprising a central processing module (CPM) including at least one processor in communication with a non-transitory computer-readable storage medium, the non-transitory computer-readable storage medium being configured to store instructions that, when executed by the at least one processor, cause the CAM to control the inkjet printing system by performing steps comprising: receiving a 3D observation file, the The files represent AME circuits each including at least one side-mounted component; and a file library having a plurality of files, each file representing a substantially 2D layer for printing AME circuits each including at least one side-mounted component, and a metafile representing at least a printing order; providing a dielectric inkjet ink composition and a conductive inkjet ink composition; using a CAM module to obtain a first layer file; using a first print head to form a pattern corresponding to the dielectric inkjet ink; curing the pattern corresponding to the dielectric inkjet ink; using a second print head to form a pattern corresponding to the conductive ink The method comprises the steps of: forming a substantially 2D layer of an AME circuit for printing each of which includes at least one side-mounted component; sintering the pattern corresponding to the conductive inkjet ink; using the CAM module, obtaining a subsequent file representing a subsequent layer of an AME circuit for printing each of which includes at least one side-mounted component from a file library; the subsequent file includes printing instructions for a pattern representing at least one of the following: a dielectric ink and a conductive ink; repeatedly using the first print head to form a pattern corresponding to the dielectric ink to using the CAM module to obtain a subsequent file from the 2D file library, The method comprises printing a substantially 2D layer, wherein after printing the final layer, each AME circuit including at least one side-mounted component includes a plurality of conductive side-mounted contacts operable to mount at least one component; and optionally coupling at least one component to the plurality of printed side contacts, wherein (xi) the plurality of side-mounted contacts are partially embedded in the AME circuit, and wherein (xii) at least one side-mounted component is a chip package that is at least one of the following: a quad flat (QFP) package, a thin small package (TSOP), a small integrated circuit (SI) package, or a semiconductor package. a SOIC package, a small outline J-lead (SOJ) package, a plastic lead chip carrier (PLCC) package, a wafer level chip scale package (WLCSP), a mold array process-ball grid array (MAPBGA) package, a quad flat no-lead (QFN) package, and a land grid array (LGA) package, (xiii) the plurality of side mounted contacts are at least one of partially embedded filled through-hole vias, partially embedded blind vias, and partially embedded buried vias, wherein (xiv) the plurality of side mounted contacts are orthogonally separated , (xv) the orthogonal separation contact can be operated as an orthogonal isolation element of an electrical small antenna (ESA), wherein (xvi) a plurality of side mounted contacts can be operated as part of a socket, (xvii) a tongue and groove are formed to couple with at least one other AME circuit, wherein (xviii) at least one side contact forms a contact for at least one of the tongue and groove, and the method further comprises (xix) using a first printing head, printing a pattern corresponding to a through hole, the pattern corresponding to a through hole extending from a surface of the AME circuit along a periphery; The pattern of the through hole should be cured; using a second printing head, printing a pattern corresponding to the conductive portion of the through hole; sintering the pattern corresponding to the conductive portion of the through hole; and removing at least a portion of the vertical portion of the cured dielectric pattern extending along the periphery, thereby exposing a portion of the conductive ink, wherein the step of removing at least a portion of the vertical portion of the cured dielectric pattern extending along the periphery includes using at least one of the following: a laser applicator, a lathe, a tool and a resin removal member, thereby exposing the conductive contact, and wherein the (xx) removal step further includes shaping the embedded contact.

Although the foregoing disclosure of 3D printing at least one AME including side mounted contacts, traces, ports and the like using inkjet printing based on a converted 3D observed CAD/CAM data package has been described with respect to some exemplary configurations, other exemplary configurations will be apparent to those skilled in the art from the disclosure herein. Furthermore, the exemplary configurations described are presented merely as examples and are not intended to limit the scope of the invention. Rather, the novel methods, programs, libraries and systems described herein may be implemented in a variety of other forms without departing from the spirit thereof. Therefore, other combinations, omissions, substitutions and modifications will be apparent to those skilled in the art from the disclosure herein.

10: Electronic components manufactured by multilayer manufacturing

100: Upper surface

101:Edge surface

102:Traces

103:Through hole

104: Contacts

105: Contact pad

106: Contacts

107: Contacts

108: Contacts

109: Socket

110: Chip packaging

120q: Chip packaging

130: Chip packaging

140: Electrical small antenna

141: Port

142: Port

Claims (21)

An laminated electronic (AME) circuit includes at least one of a printed circuit board (PCB), a flexible printed circuit (FPC) and a high density interconnect PCB (HDIPCB), wherein the AME circuit includes at least one of the following: a side mounted component, and a plurality of side mounted contacts including at least one of a partially embedded filled through hole, a partially embedded blind hole and a partially embedded buried through hole. An AME circuit as claimed in claim 1, wherein the plurality of side-mounted contacts are partially embedded in the AME circuit. An AME circuit as claimed in claim 2, wherein the component side-mounted to the AME circuit is a chip package. The AME circuit of claim 3, wherein the chip package is at least one of the following: a Quad Flat Pack (QFP) package, a Thin Small Outline Package (TSOP), a Small Outline Integrated Circuit (SOIC) package, a Small Outline J-Lead (SOJ) package, a Plastic Leaded Chip Carrier (PLCC) package, a Wafer Level Chip Scale Package (WLCSP), a Mold Array Process-Ball Grid Array (MAPBGA) package, a Quad Flat No-Lead (QFN) package, and a Land Grid Array (LGA) package. An AME circuit as claimed in claim 1, wherein the plurality of side mounted contacts are orthogonally separated. As in the AME circuit of claim 5, the orthogonal separation contact can be operated as an orthogonal isolation element of an electrical small antenna (ESA). An AME circuit as claimed in claim 1, wherein the plurality of side mounted contacts can operate as part of a socket. An AME circuit as claimed in claim 7, wherein the socket forms a tongue and groove for coupling with at least one other AME circuit. An AME circuit as claimed in claim 8, wherein at least one of the side contacts forms a contact for at least one of the tenon and the groove. An AME circuit as claimed in claim 5, wherein the plurality of side mounted contacts are sized and configured to match contacts of a socket mounted in another AME. A method for using laminated fabrication for laminated fabricated electronic (AME) circuits, the laminated fabricated electronic circuits comprising at least one of a printed circuit board (PCB), a flexible printed circuit (FPC) and a high density interconnect PCB (HDI PCB), the AME circuits comprising at least one of the following: a side mounted component, and a partially embedded filled through-hole via, a partially embedded blind via and a partially embedded buried via. The method comprises: a. providing an inkjet printing system having: i. a first print head adapted to dispense a dielectric ink; ii. a second print head adapted to dispense a conductive ink; iii. a transmitter operably coupled to the first and second print heads and configured to transfer a substrate to each print head; and iv. a computer-aided manufacturing ("CAM") module operably coupled to the first and second print heads and configured to transfer a substrate to each print head; The CAM further comprises a central processing module (CPM) including at least one processor in communication with a non-transitory computer-readable storage medium, the non-transitory computer-readable storage medium being configured to store instructions that, when executed by the at least one processor, cause the CAM to control the inkjet printing system by performing steps comprising: receiving a 3D observation file representing each of the at least one AME circuits of a side-mounted component and a plurality of side-mounted contacts comprising at least one of a partially embedded filled through-hole, a partially embedded blind hole, and a partially embedded buried through-hole; and generating a file library having a plurality of files, each file representing a substantially 2D layer for printing the AME circuits each comprising at least one side-mounted component and the plurality of side-mounted contacts, and a metafile representing at least a printing order b. providing a dielectric inkjet ink composition and a conductive inkjet ink composition; c. using the CAM module to obtain a first layer file; d. using the first print head to form a pattern corresponding to the dielectric inkjet ink; e. curing the pattern corresponding to the dielectric inkjet ink; f. using the second print head to form a pattern corresponding to the conductive ink, the pattern also corresponding to the component for printing each comprising at least one side-mounted component and comprising a portion g. sintering the pattern corresponding to the conductive inkjet ink; h. using the CAM module to obtain a subsequent file from the library, which represents a 2D layer for printing the components each comprising at least one side mounted component and at least one of the partially embedded filled through-hole type through-hole, partially embedded blind hole and partially embedded buried through-hole; a subsequent layer of an AME circuit of the plurality of side-mounted contacts of at least one of the blind holes and a portion of the buried through hole embedded in the dielectric ink; the subsequent file includes printing instructions representing a pattern of at least one of the following: the dielectric ink, and the conductive ink; i. repeatedly using the first print head to form the pattern corresponding to the dielectric ink to using the CAM module to obtain the subsequent, substantially 2D layer from the 2D file library, wherein after printing the final layer, the AME circuits each comprising at least one side-mounted component include a plurality of conductive side-mounted contacts and the plurality of side-mounted contacts comprising at least one of a partially embedded filled through-hole, a partially embedded blind hole, and a partially embedded buried through-hole, operable to mount at least one component; and j. coupling at least one component to the plurality of printed side contacts as appropriate. A method as claimed in claim 11, wherein the plurality of side-mounted contacts are partially embedded in the AME circuit. The method of claim 11, wherein the at least one side-mounted component is a chip package, which is at least one of the following: a quad flat package (QFP), a thin small package (TSOP), a small integrated circuit (SOIC) package, a small J-lead (SOJ) package, a plastic lead chip carrier (PLCC) package, a wafer-level chip scale package (WLCSP), a mold array process-ball grid array (MAPBGA) package, a quad flat no-lead (QFN) package, and a land grid array (LGA) package. As in the method of claim 13, the plurality of side mounted contacts are at least one of: a partially embedded filled through-hole, a partially embedded blind hole, and a partially embedded buried through-hole. A method as claimed in claim 14, wherein the plurality of side mounted contacts are orthogonally separated. A method as claimed in claim 15, wherein the orthogonally separated contacts can be operated as an orthogonal isolation element of an electrical small antenna (ESA). A method as claimed in claim 11, wherein the plurality of side mounted contacts can operate as part of a socket. The method of claim 17, wherein the socket forms a tongue and groove for coupling with at least one other AME circuit. A method as claimed in claim 18, wherein at least one of the side contacts forms a contact for at least one of the tenon and the groove. The method of claim 11 further comprises: a. using the first printing head to print a pattern corresponding to a through hole, the pattern corresponding to the through hole extending from the surface of the AME circuit along the periphery; b. curing the pattern corresponding to the through hole; c. using the second printing head to print a pattern corresponding to a conductive portion of the through hole; d. sintering the pattern corresponding to the conductive portion of the through hole; and e. removing at least a portion of a vertical portion of the cured dielectric pattern extending along the periphery, thereby exposing a portion of the conductive ink, wherein the step of removing at least a portion of a vertical portion of the cured dielectric pattern extending along the periphery comprises using at least one of the following: a laser applicator, a lathe, a tool, and a resin removal member, thereby exposing the conductive contact. The method of claim 20, wherein the removing step further comprises shaping the embedded contact.