TWI851469B - Thermal paste attachment method, packaging method, packaging structure and attachment device - Google Patents

Abstract

A method of attaching a heat sink, a method of packaging, a packaging structure, and an attachment device, wherein the method of attaching a heat sink comprises the steps of: forming a recessed structure on the heat sink, said recessed structure comprising a bottom and a side portion disposed on the bottom; and attaching the heat sink to a wafer, wherein said bottom is positioned opposite a backside position of said wafer, and said side portion is positioned opposite a side surface position of said wafer. The present invention pre-processes the heat sink before attaching the heat sink, and forms a cover for the wafer by forming a recessed structure on the heat sink, so as to make the heat sink and the wafer more compatible in the process of attaching the heat sink, and thus more closely fit together, and to reduce the generation of air bubbles.

Description

Heat sink attaching method, packaging method, packaging configuration and attaching device

This invention relates to the field of chip packaging technology, in particular to a heat sink attaching method, a packaging method, a packaging configuration and an attaching device.

Flip chip technology, also known as "flip chip packaging" or "flip chip packaging method", is a type of chip packaging technology. This packaging technology is to grow solder joints on the chip connection points, and then flip the chip over to make the solder joints directly connected to the substrate. Currently, flip chip technology has been widely used in microprocessor packaging, and has also become a mainstream packaging technology for graphics, special applications, and computer chipsets. In particular, representative examples of flip chip technology are glass flip chip packaging (Chip On Glass, COG) and thin film flip chip packaging (Chip On Film, COF).

In the above packaging process, the substrate is generally used as a packaging chip carrier to combine the chip with the substrate circuit, and a packaging gel is placed on the upper side of the substrate beside the chip for packaging. The chip will generate a lot of heat during use. If this heat cannot be effectively released, it will affect the performance and use of the chip. Therefore, after the packaging gel is used between the chip and the substrate, a heat sink is generally attached to the back of the chip to dissipate the heat of the chip.

In order to improve the heat dissipation effect, the current flip chip packaging will attach a heat sink to the surface of the package structure, especially the surface of the chip. However, with the development of technology, the requirements for chip performance are getting higher and higher. The higher the performance requirements, the more heat will be generated during the operation of the chip. At the same time, the heat generated by the circuit layer on the substrate will also increase accordingly. In order to avoid the high temperature of the package structure affecting the stability of performance, it is generally required that when attaching the heat sink to the back of the chip, the heat sink should also cover part of the substrate.

In the prior art, the heat sink is attached to the package structure by rolling. Since the chip has a certain height and the bottom filling package glue covering the chip has an irregular slope, the attachment method of the prior art is prone to generate bulges or bubbles at the transition position between the chip and the substrate, which not only affects the heat dissipation effect but also affects the flatness of the surface.

Based on this, it is necessary to provide a heat sink attaching method to solve the deficiencies in the prior art, which can make the heat sink and the chip more compatible during the process of attaching the heat sink, so that they can be more closely attached together and reduce the generation of bubbles.

In order to achieve the above purpose, this invention provides a heat sink attachment method, comprising the following steps:

A concave structure is formed on the heat sink, wherein the concave structure includes a bottom and a side portion located on the bottom;

The heat sink is attached to the chip, wherein the bottom portion is opposite to the back side of the chip, and the side portion is opposite to the side surface of the chip.

Furthermore, “forming a concave configuration on the heat sink” specifically includes: forming the concave configuration on the heat sink by a stamping process.

Furthermore, before "attaching the heat sink to the chip", the following steps are also included: inspecting the chip coated with the sealing glue to select the sealing glue that does not meet the requirements, wherein the sealing glue is coated on the four sides of the chip and is located on the substrate that encapsulates the aforementioned chip; when attaching the heat sink to the chip, part of the aforementioned heat sink is attached to the aforementioned sealing glue.

Furthermore, "testing the wafers coated with the sealant to select the sealant that does not meet the requirements" specifically includes the following steps: determining whether the distance L between the edge of the sealant and the side surface of the wafer is lower than L1, and determining that the sealant is unqualified when L is lower than L1.

Furthermore, after “attaching the heat sink to the chip”, it also includes using a roller pressing method to press the heat sink tightly.

Another embodiment of the invention also discloses a packaging method, comprising the following steps:

A chip and a circuit board are provided, wherein the chip is provided with a bump, and the circuit board comprises a substrate and a circuit layer and inner pins provided on the substrate;

Electrically bonding the inner pins of the circuit board to the bumps of the chip;

Forming a packaging colloid beside the aforementioned chip, and the packaging colloid is located on the upper side of the aforementioned substrate;

The heat sink is attached by the aforementioned heat sink attaching method, wherein the recessed structure of the heat sink is disposed outside the aforementioned chip, the bottom of the recessed structure is attached to the back of the aforementioned chip, and at least part of the side of the recessed structure is attached to the aforementioned packaging colloid.

Another embodiment of the present invention also discloses a packaging configuration, including packaging using the aforementioned packaging method.

Another embodiment of the invention also discloses a bonding device for the aforementioned heat sink bonding method, comprising:

A support frame, including a support table for placing a heat sink and a mold perforation arranged on the support table;

The driving unit is located on the upper side of the carrier platform;

The lower mold is arranged at the lower side of the aforementioned supporting platform and has a protruding block movable in the aforementioned mold through hole, and the aforementioned protruding block can protrude from the upper surface of the aforementioned supporting platform along the aforementioned mold through hole;

The upper mold is arranged on the upper side of the aforementioned supporting platform and cooperates with the aforementioned driving unit. The aforementioned upper mold includes an avoidance space opposite to the aforementioned mold perforation position; the aforementioned driving unit drives the upper mold to move toward or away from the aforementioned supporting platform.

Furthermore, the aforementioned attachment device also has a linkage mechanism and a driving connection member cooperating with the aforementioned linkage mechanism;

The linkage mechanism comprises a connecting rod, which is rotatably mounted on the supporting frame and can slide along the supporting frame; one end of the connecting rod is pivotally connected to the lower mold, and the other end of the connecting rod is opposite to the driving connecting piece;

The driving connecting piece is used to abut against the connecting rod to drive the connecting rod to rotate, and drives the lower mold to move during the rotation of the connecting rod.

Furthermore, the driving connector cooperates with the driving unit, and the driving unit drives the driving connector to move;

The driving connecting piece cooperates with the upper mold, and the upper mold can slide relative to the driving connecting piece.

Furthermore, the driving connecting member includes a connecting plate connected and fixed to the driving unit and an extending plate extending from the connecting plate toward the connecting rod;

The upper mold comprises a mold body, which is located below the connecting plate and can slide in a direction approaching or away from the connecting plate.

Furthermore, a sliding hole is provided on the aforementioned connecting plate, and the aforementioned upper mold includes a sliding rod provided on the aforementioned mold body, the aforementioned sliding rod slidingly cooperates with the aforementioned sliding hole, and a sliding rod limiting portion is provided on the aforementioned sliding rod, and the aforementioned sliding rod limiting portion is on the upper side of the aforementioned connecting plate and is used to abut against the upper surface of the aforementioned connecting plate.

Furthermore, a reset member is provided between the mold body and the connecting plate. Under the action of external force, the mold body moves toward the connecting plate and the reset member accumulates a rebound force. After the external force is removed, the mold body moves away from the connecting plate under the action of the rebound force of the reset member.

Furthermore, the aforementioned attaching device unloading unit includes an unloading protrusion and an unloading reset piece arranged in the aforementioned avoidance space. Under the action of external force, the aforementioned unloading protrusion moves in the direction of expanding the avoidance space. After the external force is removed, the aforementioned unloading protrusion is reset under the action of the unloading reset piece to reduce the aforementioned avoidance space.

Compared with the prior art, the invention pre-processes the heat sink before attaching it. By forming a concave structure on the heat sink, a cover for the chip is formed, so that the heat sink and the chip can be more compatible during the process of attaching the heat sink, so that they can fit together more closely and reduce the generation of bubbles.

An embodiment of the invention: A method for attaching a heat sink patch comprises the following steps:

S200: forming a recessed structure 10 on the heat sink 100, wherein the recessed structure 10 comprises a bottom 101 and a side portion 102 located on the bottom 101, as shown in FIG. 1;

S400: attaching the heat sink 100 to the chip 200, wherein the bottom 101 is opposite to the back surface 201 of the chip 200, and the side 102 is opposite to the side surface 202 of the chip 200, as shown in FIG. 2.

The invention pre-processes the heat sink before attaching it. By forming a recessed structure 10 on the heat sink, a cover for the chip 200 is formed. Therefore, during the process of attaching the heat sink, the heat sink 100 and the chip 200 can be more compatible and more tightly attached together, reducing the generation of bubbles.

In this embodiment, "forming the concave configuration 10 on the heat sink 100" specifically includes: using a stamping process to form the concave configuration 10 on the heat sink 100. In this embodiment, the heat sink 100 is a metal material, such as aluminum. The heat sink 100 has a certain ductility and can be deformed, so the concave configuration 10 can be generated by a stamping process. The concave configuration 10 can be more conveniently set by stamping.

The process of “S400: attaching the heat sink 100 to the chip 200” also includes the following steps:

S300: inspecting the chip coated with the sealing glue 400 to select the sealing glue 400 that does not meet the requirements, wherein the sealing glue 400 is coated around the chip 200 and is located on the substrate 300 that encapsulates the aforementioned chip 200; when the heat sink 100 is attached to the chip 200, part of the aforementioned heat sink 100 is attached to the aforementioned sealing glue 400.

The sealing glue body 400 is arranged in a ring shape and formed around the chip 200. In order to improve the heat dissipation performance of the substrate 300, the existing process requires that part of the heat dissipation paste 100 be attached to the upper surface of the substrate 300 after the heat dissipation paste 100 is attached, so as to dissipate the heat of the circuit layer on the substrate 300. The above requirements require that the heat dissipation paste 100 be attached to the chip 200 and the substrate 300 at the same time, and the sealing glue body 400, as a glue that seals the chip 200 and the substrate 300, will inevitably be wrapped after the heat dissipation paste 100 is attached. Therefore, in the process of attaching the heat dissipation paste 100, the chip 200, the substrate 300 and the sealing glue body 400 need to be considered at the same time. Since the heights of these three parts are inconsistent, this also causes the heat dissipation paste after attachment to be easy to wrap more bubbles.

In the present embodiment, during the pretreatment of the heat sink 100, the recessed structure 10 formed on the heat sink 100 can not only cover the chip 200, but also cover the sealing gel body 400 beside the chip 200. That is, the shape of the recessed structure 10 is actually compatible with the overall structure formed by the chip 200 and the sealing gel body 400. After the heat sink 100 is attached, the recessed structure 10 can simultaneously cover the chip 200 and the sealing gel body 400, thereby better achieving the attachment of the heat sink 100.

However, since the shape of the sealing gel body 400 is uncontrollable, and the concave configuration 10 formed after the heat sink 100 is pressed is fixed, in order to achieve a better effect after the heat sink 100 is attached, the sealing gel body 400 needs to be tested after it is formed, and the sealing gel body 400 that does not meet the requirements is selected. In this embodiment, the sealing gel body 400 needs to meet certain size requirements, so that the heat sink 100 can better cover the sealing gel body 400. If the size of the sealing gel body 400 is too small, a gap will easily be formed between the heat sink 100 and the sealing gel body 400 after being attached, thereby causing a lot of air bubbles after attachment. Therefore, in this step, a relatively small sealing gel body needs to be selected.

Specifically, “S300: inspecting the wafer 200 coated with the sealing glue 400 to select the sealing glue 400 that does not meet the requirements” specifically includes the following steps:

It is determined whether the distance L between the edge of the sealant 400 and the side of the chip 200 is lower than L1. If L is lower than L1, the sealant 400 is judged to be unqualified. If the straight line distance L between the edge of the sealant 400 and the plane where the side of the chip 200 is located is too small, it means that the sealant 400 is stored too small, the sealant 400 is too dry, and it is difficult to form a close fit with the heat sink 100. It can be understood that the specific value of L1 is set according to the actual product needs.

After "S400 Attaching the heat sink to the chip", the following steps are also included:

S500: Using roller pressing to press and fit the heat sink 100. Using rollers or wheels to press and fit the heat sink 100 on the substrate 300, the sealing gel 400 and the chip 200, the heat sink 100 can be better attached and some bubbles can be squeezed out.

The roller pressing method for compacting the heat sink 100 can adopt the existing relatively mature process, which will not be elaborated here.

Another embodiment of the invention also discloses a packaging method, comprising the following steps:

S101: providing a circuit board, the circuit board comprising a substrate 300 and a circuit layer and inner pins disposed on the substrate 300;

S102: providing a chip 200, wherein the chip 200 is provided with bumps;

S103: Electrically bonding the inner pins of the circuit board to the bumps of the chip 200;

S104: forming a packaging gel 400 beside the aforementioned chip 200, and the packaging gel 400 is located on the upper side of the aforementioned substrate 300;

S105: The aforementioned heat sink 100 is attached by the aforementioned heat sink attaching method, wherein the recessed structure 10 of the heat sink 100 is covered outside the aforementioned chip 200, the bottom 101 of the recessed structure 10 is attached to the back side 201 of the aforementioned chip 200, and at least a part of the side 102 of the aforementioned recessed structure 10 is attached to the aforementioned packaging colloid 400.

The packaging structure formed by the packaging method of the present invention can better adhere the heat sink 100 and reduce the bubbles generated after the heat sink 100 is adhered.

Another embodiment of the present invention also discloses a packaging configuration, including packaging using the aforementioned packaging method.

As shown in FIGS. 3-7 , another embodiment of the invention also discloses an attaching device of the aforementioned heat sink attaching method, comprising: a carrier 1, a driving unit 2, a lower mold 3 and an upper mold 4;

The aforementioned support frame 1 comprises a frame body, a support platform 11 disposed on the aforementioned frame body and used to place the heat sink 100, and a mold through hole 12 disposed on the support platform 11; the aforementioned mold through hole 12 completely penetrates the aforementioned support platform 11 along the vertical direction;

The aforementioned driving unit 2 is located on the upper side of the supporting platform 11;

The lower mold 3 is disposed at the lower side of the supporting platform 11 and has a protruding block 31 movable in the mold through hole 12. The protruding block 31 can protrude from the upper surface of the supporting platform 11 along the mold through hole 12.

The upper mold 4 is disposed on the upper side of the aforementioned support platform 11 and cooperates with the aforementioned driving unit 2. The aforementioned upper mold 4 includes an avoidance space 40 opposite to the position of the aforementioned mold through hole 12; the aforementioned driving unit 2 drives the upper mold 4 to move toward or away from the aforementioned support platform 11.

During use, the heat sink 100 is placed on the support platform 11 . After being placed, the heat sink 100 is positioned opposite to the aforementioned mold through-hole 12 and covers the mold through-hole 12 . The driving unit 2 controls the upper mold 4 to move downward toward the aforementioned support platform 11 and presses and positions the heat sink 100 between the upper mold 4 and the support platform 11, and then controls the protruding block 31 of the lower mold 3 to move. During the movement, the protruding block 31 protrudes upward from the upper surface of the aforementioned support platform 11, thereby pressing the heat sink 100 covering the mold perforation 12. The avoidance space 40 of the upper mold 4 forms an avoidance for the protruding block 31, so that part of the heat sink 100 moves or extends toward the avoidance space 40 under the impact of the protruding block 31, thereby finally forming the aforementioned concave configuration 10 on the heat sink 100.

The shape of the recessed structure 10 is compatible with the shapes of the protruding block 31 and the avoiding space 40 . Under the extrusion effect of the protruding block 31 and the inner wall of the avoiding space 40 , the heat sink is deformed or extended to form the recessed structure 10 .

In this embodiment, the aforementioned attachment device further comprises a linkage mechanism 5 and a driving connection member 6 cooperating with the aforementioned linkage mechanism 5;

The linkage mechanism 5 includes a connecting rod 51, which is rotatably mounted on the support frame 1. Specifically, the connecting rod 51 is rotatably mounted on the frame, and the connecting rod 51 can slide along the support frame 1. The connecting rod 51 is provided with a waist-shaped hole, and the extension direction of the waist-shaped hole is consistent with the extension direction of the connecting rod 51. The frame is provided with a supporting column, and the supporting column passes through the waist-shaped hole. The supporting column and the waist-shaped hole can produce relative rotation and relative sliding between the two; the waist-shaped hole is set at the center of the connecting rod 51. In other embodiments, the supporting column can also be set on the connecting rod 51, and the waist-shaped hole is correspondingly set on the support frame 1. The above embodiment is the basis, and the above replacement is easy for a person skilled in the art to think of, and will not be repeated here.

One end of the connecting rod 51 is pivotally connected to the lower mold 3, and the other end of the connecting rod 51 is opposite to the driving connecting member 6. The connecting rod 51 has a free end and a fixed end that are opposite to each other. The fixed end is pivotally connected to the lower mold 3, and the free end is opposite to the driving connecting member 6. The driving connecting member 6 is used to abut against the connecting rod 51 to drive the connecting rod 51 to rotate, and drive the lower mold 3 to move along the mold perforation 12 during the rotation of the connecting rod 51.

The arrangement of the connecting rod 51 facilitates the control of the movement of the lower mold 3. The driving connecting member 6 can be controlled by a separate driving member. In this embodiment, the driving connecting member 6 is controlled by the driving unit 2, thereby realizing that the entire device uses one driving unit, saving costs and avoiding space occupation. Thus, the configuration is more compact.

Specifically, the driving connector 6 cooperates with the driving unit 2, and the driving unit 2 drives the driving connector 6 to move;

The driving connector 6 cooperates with the upper mold 4 , and the upper mold 4 can slide relative to the driving connector 6 .

Since the driving unit 2 controls the movement of the driving connector 6 and the upper mold 4 at the same time, how to control the relative position relationship between the driving connector 6 and the upper mold 4 is crucial. In this embodiment, the driving connector 6 and the upper mold 4 can slide relative to each other in the driving direction of the driving unit 2, so that the movement control of the driving connector 6 does not affect the upper mold 4, or the movement control of the upper mold 4 does not affect the driving connector 6. The above configuration can realize that the driving connector 6 can move independently after moving to a certain stage, without the need to move synchronously with the upper mold 4 all the time.

It should be noted that when the driving unit 2 is a cylinder, the driving direction of the driving unit is the direction in which the push rod of the cylinder extends and contracts, that is, the extension direction of the push rod of the cylinder.

Specifically, the driving connecting member 6 includes a connecting plate 61 connected and fixed to the driving unit 2 and an extending plate 62 extending from the connecting plate 61 toward the connecting rod 51;

The upper mold 4 includes a mold body 41, which is located below the connecting plate 61 and can slide in a direction close to or away from the connecting plate 61. A pair of extension plates 62 are provided and are disposed opposite to each other on both sides of the connecting plate 61, and the two extension plates 62 are also located opposite to each other on both sides of the mold body 41.

A sliding hole is provided on the aforementioned connecting plate 61, and the aforementioned upper mold 4 includes a sliding rod 42 provided on the aforementioned mold body 41. The aforementioned sliding rod 42 is provided on one side of the mold body 41 facing the aforementioned connecting plate 61, and the sliding rod 42 is extended in the vertical direction. The aforementioned sliding rod 42 is slidably matched with the aforementioned sliding hole. A sliding rod limiting portion 43 is provided on the aforementioned sliding rod 42. The aforementioned sliding rod limiting portion 43 is located on the upper side of the aforementioned connecting plate 61 and is used to abut against the upper surface of the aforementioned connecting plate 61. The sliding rod limiting portion 43 is used to limit the aforementioned sliding rod 42 from passing through the aforementioned sliding hole.

A reset member 7 is provided between the mold body 41 and the connecting plate 61. Under the action of an external force, the mold body 41 moves toward the connecting plate 61 and the reset member 7 accumulates a rebound force. After the external force is removed, the mold body 41 moves away from the connecting plate 61 under the action of the rebound force of the reset member 7.

In the present embodiment, the reset member 7 is a compression spring. Of course, in other embodiments, the reset member 7 can also be configured as a leaf spring or a tension spring. The specific configuration of the reset member 7 is not specifically limited here.

During use, the driving unit 2 drives the driving connector 6 to move downward toward the aforementioned supporting platform 11. Since the driving connector 6 cooperates with the upper mold 4, the driving connector 6 drives the upper mold 4 to move toward the supporting platform 11. After the upper mold 4 moves downward until the mold body 41 abuts against the upper surface of the supporting platform 11, the heat sink 100 is pressed and positioned between the mold body 41 and the supporting platform 11.

After the mold body 41 abuts against the supporting platform 11, the driving unit 2 further drives the driving connecting member 6 to move downward. During the downward movement of the driving connecting member 6, the extension plate 62 abuts against the free end of the connecting rod 51 and drives the connecting rod 51 to rotate. During the rotation process, the connecting rod 51 drives the fixed end of the connecting rod 51 to move upward. Since the fixed end of the connecting rod 51 is pivotally connected to the lower mold 3, it can drive the lower mold 3 to move upward and finally protrude upward along the mold through hole 12 from the upper surface of the aforementioned supporting platform 11, thereby pressing the heat sink 100 clamped and positioned between the mold body 41 and the supporting platform 11.

After the mold body 41 contacts the support platform 11, the driving connecting member 6 moves downward further because the sliding rod 42 on the upper mold 4 and the sliding hole on the connecting plate 61 can slide relative to each other in the vertical direction. During this process, the mold body 41 does not need to move. When the driving unit 2 further drives the driving connecting member 6 to move downward, the mold body 41 is no longer affected by the driving unit 2. Due to the influence of the force, the driving connector 6 and the mold body 41 slide relative to each other, and the connecting plate 61 moves toward the mold body 41. During this process, the reset member 7 between the driving connector 6 and the mold body 41 is squeezed and accumulates a rebound force. After the force of the driving unit 2 is removed, the rebound force accumulated in the reset member 7 separates the driving connector 6 and the mold body 41.

It can be understood that in order to facilitate the positioning of the aforementioned reset member 7, a reset member positioning hole for positioning the aforementioned reset member 7 is formed on the aforementioned mold body 41, one end of the reset member 7 is positioned in the reset member positioning hole, and the other end of the reset member 7 is extended and arranged on the connecting plate 61 and abuts against the connecting plate 61 or is connected and fixed to the connecting plate 61.

During the rotation of the connecting rod 51, one end of the connecting rod 51 away from the extension plate 62 is pivoted on the lower mold 3, so that the lower mold 3 can be driven to move upward. During the upward movement, the lower mold 3 drives the protruding block 31 to move upward in the mold through hole 12 and finally protrude from the upper surface of the supporting platform 11. Since there is an upper mold 4 on the upper side of the supporting platform 11, the protruding block 31 can penetrate into the escape space 40 on the upper mold 4. At the same time, the protruding block 31 presses the heat sink sandwiched between the upper mold and the supporting platform 11. When the protruding block 31 penetrates into the escape space 40, part of the heat sink 100 moves or extends in the escape space 40, thereby forming a concave structure 10 on the aforementioned heat sink 100.

In this embodiment, two connecting rods 51 are provided. The two connecting rods 51 are symmetrically provided and both are rotatably mounted on the frame, and the two connecting rods 51 are symmetrically provided on both sides of the protruding block 31. The two connecting rods 51 act on the protruding block 31 at the same time, thereby better realizing the control of the movement of the protruding block 31. It can be understood that the two connecting rods 51 are respectively opposite to the two extension plates 62, and the two connecting rods 51 are controlled by the two extension plates 62.

In order to better realize the control of the extension plate 62 on the connecting rod 51, a roller is provided at the free end of the connecting rod 51, and a widening plate is provided at the end of the extension plate 62 away from the connecting rod 61. The plane where the widening plate is located is perpendicular to the plane where the extension plate 62 is located. The setting of the widening plate can more conveniently realize the contact between the connecting rod 51 and the connecting rod 61.

Furthermore, in order to better allow the heat sink to fall off the upper mold 4 after molding, the attaching device also has a blanking unit 8, which includes a blanking protrusion 81 and a blanking reset piece 82 arranged in the avoidance space 40. Under the action of external force, the blanking protrusion 81 moves in the direction of expanding the avoidance space 40. After the external force is removed, the blanking protrusion 81 is reset under the action of the blanking reset piece 82 to reduce the avoidance space 40.

In the initial state, the aforementioned material removal protrusion 81 can occupy part of the avoidance space 40. When the protruding block 31 protrudes toward the avoidance space 40, the aforementioned material removal protrusion 81 is squeezed by the protruding block 31, and under the action of the protruding block 31, it shrinks and moves inward, thereby expanding the space of the avoidance space 40. At this time, the material removal protrusion 81 shrinks and leaves the space of the avoidance space 40 originally occupied, thereby indirectly increasing the space of the avoidance space 40. In the process of the material removal protrusion 81 shrinking and moving inward, the material removal reset member 82 is compressed to allow the material removal reset member 82 to accumulate rebound force.

In the process of the protruding block 31 squeezing the blanking protrusion 81 to move inwardly, the heat sink located at the opening of the escape space 40 is pressed into the escape space 40 by the protruding block 31, so that the aforementioned concave configuration 10 is formed on the heat sink 100, and the aforementioned concave configuration 10 is compatible with the shape of the aforementioned protruding block 31. After the force acting on the connecting rod 51 is withdrawn, the protruding block 31 leaves the escape space 40. At this time, the heat sink 100 is easily adhered to the upper mold 4, and the blanking reset member 82 drives the blanking protrusion 81 to move in the direction of squeezing the escape space 40, thereby pushing the heat sink 100 out of the escape space 40 to complete the blanking of the heat sink after being pressed.

The above is a detailed description of the structure, features and effects of the present invention based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present invention, but the present invention is not limited to the scope of implementation shown in the drawings. Any changes made according to the concept of the present invention, or modified into equivalent embodiments with equivalent changes, which still do not exceed the spirit covered by the instructions and drawings, should be within the protection scope of the present invention.

100: heat sink 10: recessed configuration 101: bottom 102: side 200: chip 201: back 202: side 300: substrate 400: sealing gel 1: carrier 11: carrier table 12: mold perforation 2: drive unit 3: lower mold 31: protrusion block 4: upper mold 40: avoidance space 41: mold body 42: slide bar 43: slide bar limiter 5: linkage mechanism 51: connecting rod 6: drive connector 61: connecting plate 62: extension plate 7: reset piece 8: unloading unit 81: unloading protrusion block 82: unloading reset piece

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the traditional technology, the drawings required for use in the embodiments or the traditional technology descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.

Figure 1 is a schematic diagram of the heat sink after forming a concave configuration in the heat sink attachment method disclosed in the present invention; Figure 2 is a schematic diagram of the configuration after the heat sink is attached in the heat sink attachment method disclosed in the present invention; Figure 3 is a first three-dimensional diagram of the heat sink attachment device disclosed in the present invention; Figure 4 is a second three-dimensional diagram of the heat sink attachment device disclosed in the present invention; Figure 5 is a position relationship diagram of the lower mold and the carrier in the heat sink attachment device disclosed in the present invention; Figure 6 is a schematic diagram of the assembly configuration of the upper mold and the driving mechanism in the heat sink attachment device disclosed in the present invention; Figure 7 is a schematic diagram of the internal configuration of the heat sink attachment device disclosed in the present invention.

100:Heat dissipation patch

101: Bottom

102: Side

200: Chip

201:Back

202: Side

300: Substrate

400: Sealing gel body

Claims (11)

A method for attaching a heat sink, comprising the following steps: forming a concave configuration on the heat sink, the concave configuration comprising a bottom and a side portion located on the bottom; and attaching the heat sink to a chip, wherein the bottom is opposite to the back of the chip, and the side portion is opposite to the side of the chip; before "attaching the heat sink to the chip", the method further comprises the following steps: inspecting the chip coated with a sealing colloid to select the sealing colloid that does not meet the requirements, wherein the sealing colloid is coated around the chip and is located on a substrate that encapsulates the chip; and when attaching the heat sink to the chip, part of the heat sink is attached to the sealing colloid. According to the aforementioned heat sink attaching method of claim 1, "forming a concave configuration on the heat sink" specifically includes: using a stamping process to form the aforementioned concave configuration on the aforementioned heat sink. For example, the heat sink attachment method mentioned in claim 1, wherein: "testing the chip coated with the sealing gel to select the sealing gel that does not meet the requirements" specifically includes the following steps: judging whether the distance L between the edge of the sealing gel and the side surface of the chip is lower than L1, and when L is lower than L1, judging that the sealing gel is unqualified. As in claim 1, the method for attaching a heat sink, wherein: after "attaching the heat sink to the chip", it also includes pressing the heat sink tightly with a roller. An attaching device for a heat sink attaching method as described in any one of claims 1 to 4, comprising: a support frame, comprising a support platform for placing the heat sink and a mold perforation disposed on the support platform; a driving unit, located on the upper side of the support platform; a lower mold, disposed on the lower side of the support platform and having a protruding block movable on the mold perforation, the protruding block can protrude from the upper surface of the support platform along the mold perforation; and an upper mold, disposed on the upper side of the support platform and cooperating with the driving unit, the upper mold comprising an avoidance space relative to the mold perforation position; the driving unit drives the upper mold to move toward or away from the support platform. As in claim 5, the attachment device further comprises a linkage mechanism and a driving connection member cooperating with the linkage mechanism; the linkage mechanism comprises a connecting rod, the connecting rod is rotatably mounted on the supporting frame, and the connecting rod can slide along the supporting frame; one end of the connecting rod is pivotally connected to the lower mold, and the other end of the connecting rod is opposite to the driving connection member; and the driving connection member is used to abut against the connecting rod to drive the connecting rod to rotate, and drive the lower mold to move during the rotation of the connecting rod. According to the attachment device mentioned in claim 6, wherein: the aforementioned driving connector cooperates with the aforementioned driving unit, and the aforementioned driving unit drives the aforementioned driving connector to move; and the aforementioned driving connector cooperates with the aforementioned upper mold, and the aforementioned upper mold can slide relative to the aforementioned driving connector. According to the attachment device of claim 6, the driving connector includes a connecting plate connected and fixed to the driving unit and an extension plate extending from the connecting plate toward the connecting rod; and the upper mold includes a mold body, which is located below the connecting plate and can slide in a direction close to or away from the connecting plate. According to claim 8, the attachment device, wherein: a sliding hole is provided on the connecting plate, the upper mold includes a sliding rod provided on the mold body, the sliding rod is slidably matched with the sliding hole, a sliding rod limiting portion is provided on the sliding rod, and the sliding rod limiting portion is located on the upper side of the connecting plate and is used to abut against the upper surface of the connecting plate. According to the attachment device of claim 6, a reset member is provided between the mold body and the connecting plate. Under the action of external force, the mold body moves toward the direction close to the connecting plate and the reset member accumulates a rebound force. After the external force is removed, the mold body moves away from the connecting plate under the action of the rebound force of the reset member. According to the attachment device of claim 6, wherein: the attachment device unloading unit comprises an unloading convex block and an unloading reset member disposed in the avoidance space, the unloading convex block moves in the direction of expanding the avoidance space under the action of an external force, and after the external force is removed, the unloading convex block is reset under the action of the unloading reset member to reduce the avoidance space.