TW202407919A - Thermal paste attachment method, packaging method, packaging structure and attachment device - Google Patents

Abstract

A method of attaching a heat sink, a method of packaging, a packaging structure, and an attachment device, wherein the method of attaching a heat sink comprises the steps of: forming a recessed structure on the heat sink, said recessed structure comprising a bottom and a side portion disposed on the bottom; and attaching the heat sink to a wafer, wherein said bottom is positioned opposite a backside position of said wafer, and said side portion is positioned opposite a side surface position of said wafer. The present invention pre-processes the heat sink before attaching the heat sink, and forms a cover for the wafer by forming a recessed structure on the heat sink, so as to make the heat sink and the wafer more compatible in the process of attaching the heat sink, and thus more closely fit together, and to reduce the generation of air bubbles.

Description

Heat dissipation patch attachment method, packaging method, packaging configuration and attachment device

This invention relates to the field of chip packaging technology, especially the heat dissipation attachment method, packaging method, packaging configuration and attachment device.

Flip Chip technology, also known as "flip chip packaging" or "flip chip packaging method", is one of the chip packaging technologies. This packaging technology is to grow solder joints on the connection points of the chip, and then flip the chip over to directly connect the solder joints to the substrate. At present, flip-chip technology has been widely used in microprocessor packaging, and has also become a mainstream packaging technology for graphics, special applications, and computer chipsets. In particular, representative examples of flip-chip technology are chip-on-glass (COG) and chip-on-film (COF).

In the above-mentioned packaging process, a substrate is generally used as a package chip carrier to combine the chip with the substrate circuit, and a packaging colloid is provided on the upper side of the substrate next to the chip for packaging. The chip will generate a lot of heat during use. If this heat cannot be released effectively, it will affect the performance and usage of the chip. Therefore, after the encapsulation is completed between the chip and the substrate, a heat sink is usually attached to the back of the chip. to dissipate heat from the chip.

In order to improve the heat dissipation effect, current flip chip packaging attaches heat dissipation stickers to the surface of the package structure, especially the surface of the chip. However, with the development of technology, the requirements for chip performance are getting higher and higher. Higher performance requirements will increase the heat generated during the operation of the chip. At the same time, the heat generated by the circuit layer provided on the substrate will also increase accordingly. In order to prevent the high temperature of the package structure from affecting the stability of the performance, it is generally required that when a heat dissipation patch is attached to the back of the chip, the heat dissipation patch needs to cover part of the substrate at the same time.

In the prior art, the heat dissipation paste is attached to the package structure by rolling. Since the chip has a certain height and the bottom-filled encapsulant covering the periphery of the chip has an irregular slope shape, it is easy to use the prior art attachment method. The formation of arches or bubbles at the transition point between the chip and the substrate not only affects the heat dissipation effect but also affects the smoothness of the surface.

Based on this, it is necessary to provide a heat dissipation patch attachment method to solve the deficiencies in the existing technology. It can make the heat dissipation patch and the chip more suitable during the process of attaching the heat dissipation patch, so as to fit them together more closely. , reducing the generation of bubbles.

In order to achieve the above purpose, this creation provides a heat dissipation patch attachment method, including the following steps:

A recessed configuration is formed on the heat dissipation sticker, and the recessed configuration includes a bottom and sides located on the bottom;

The heat dissipation patch is attached to the chip, wherein the bottom portion is opposite to the back surface of the chip, and the side portion is opposite to the side surface of the chip.

Furthermore, "forming a recessed configuration on the heat dissipation pad" specifically includes: using a stamping process to form the aforementioned recessed configuration on the heat dissipation pad.

Furthermore, "attaching the heat dissipation patch to the chip" also includes the following steps: testing the chip coated with sealant to select the sealant that does not meet the requirements, wherein the sealant is coated around the chip and It is located on the substrate encapsulating the aforementioned chip; when attaching the heat dissipation patch to the chip, part of the aforementioned heat dissipation patch is attached to the aforementioned sealant.

Furthermore, "inspecting the wafer coated with sealant to select the sealant that does not meet the requirements" specifically includes the following steps: Determine whether the distance L between the edge of the sealant and the side of the aforementioned wafer is less than L1, and When L is lower than L1, the sealant is judged to be unqualified.

Furthermore, after "attaching the heat dissipation patch to the chip", it also includes using roller pressing to press the heat dissipation patch tightly.

Another embodiment of this invention also discloses a packaging method, including the following steps:

Provide a chip and a circuit board. The chip is provided with bumps. The circuit board includes a substrate, a circuit layer and internal pins provided on the substrate;

Electrically connecting the internal pins of the aforementioned circuit board to the bumps of the aforementioned chip;

An encapsulating colloid is formed on the side of the aforementioned chip, and the encapsulating colloid is located on the upper side of the aforementioned substrate;

The aforementioned heat dissipation patch is attached using the aforementioned heat dissipation patch attachment method, wherein the recessed configuration of the heat dissipation patch is covered outside the aforementioned chip, the bottom of the recessed configuration is attached to the back of the aforementioned chip, and at least part of the aforementioned recessed configuration is The side portion is attached to the aforementioned packaging gel.

Another embodiment of the present invention also discloses a packaging configuration, which is packaged using the aforementioned packaging method.

Another embodiment of the present invention also discloses an attachment device used in the aforementioned heat dissipation attachment method, including:

The bearing frame includes a bearing platform for placing the heat dissipation patch and a mold perforation provided on the bearing platform;

The drive unit is located on the upper side of the bearing platform;

The lower mold is arranged on the lower side of the aforementioned bearing platform and has a protruding block movable in the aforementioned mold perforation. The aforementioned protruding block can protrude out of the upper surface of the aforementioned bearing platform along the aforementioned mold perforation;

The upper mold is arranged on the upper side of the bearing platform and cooperates with the driving unit. The upper mold includes an avoidance space opposite to the punching position of the mold; the driving unit drives the upper mold to move toward or away from the bearing platform.

Furthermore, the aforementioned attaching device also has a linkage mechanism and a driving connector that cooperates with the aforementioned linkage mechanism;

The aforementioned linkage mechanism includes a connecting rod, which is rotatably installed on the aforementioned bearing frame, and the aforementioned connecting rod can slide along the aforementioned bearing frame; one end of the aforementioned connecting rod is pivotally connected to the aforementioned lower mold, and the other end of the aforementioned connecting rod is connected to the aforementioned driving frame. The connectors are positioned relative to each other;

The driving connector is used to resist the connecting rod to drive the connecting rod to rotate, and drives the lower mold to move during the rotation of the connecting rod.

Further, the aforementioned driving connection piece cooperates with the aforementioned driving unit, and the aforementioned driving unit drives the aforementioned driving coupling piece to move;

The driving connecting piece cooperates with the upper mold, and the upper mold can slide relative to the driving connecting piece.

Furthermore, the driving connection piece includes a connecting plate connected and fixed with the driving unit and an extension plate extending from the connecting plate toward the connecting rod;

The upper mold includes a mold body, which is located under the connecting plate and can slide in a direction toward or away from the connecting plate.

Furthermore, the aforementioned connecting plate is provided with a sliding hole, and the aforementioned upper mold includes a sliding bar provided on the aforementioned mold body. The aforementioned sliding bar is slidably matched with the aforementioned sliding hole, and the aforementioned sliding bar is provided with a sliding bar limiting portion. The rod limiting portion is located on the upper side of the connecting plate and is used to offset the upper surface of the connecting plate.

Furthermore, a reset piece is provided between the mold body and the connection plate. Under the action of external force, the mold body moves in the direction close to the connection plate and the reset piece accumulates a rebound force. After the external force is removed, the rebound force of the reset piece Under this action, the mold body moves in a direction away from the connecting plate.

Furthermore, the aforementioned attachment device unloading unit, the aforementioned unloading unit includes a unloading bump and a unloading reset member arranged in the aforementioned avoidance space, and the aforementioned unloading bump moves in the direction of expanding the avoidance space under the action of external force. After the external force is removed, the blanking bump is reset and moved by the blanking reset member to reduce the avoidance space.

Compared with the prior art, in this invention, before attaching the heat dissipation patch, the heat dissipation patch is pre-processed, and a concave configuration is formed on the heat dissipation patch to form a cover for the chip, thereby improving the process of attaching the heat dissipation patch. It can make the heat dissipation patch and the chip more suitable, so that they fit together more closely and reduce the generation of bubbles.

Embodiment of this invention: a heat dissipation patch attachment method, including the following steps:

S200: Form a recessed configuration 10 on the heat dissipation patch 100. The recessed configuration 10 includes a bottom 101 and a side 102 located on the bottom 101, as shown in Figure 1;

S400: Attach the heat dissipation patch 100 to the chip 200, where the bottom 101 is opposite to the back 201 of the chip 200, and the side 102 is opposite to the side 202 of the chip 200, as shown in Figure 2 .

In this invention, the heat dissipation patch is pre-processed before attaching the heat dissipation patch, and a concave configuration 10 is formed on the heat dissipation patch to cover the chip 200, so that the heat dissipation patch 100 can be made during the process of attaching the heat dissipation patch. It is more suitable for the chip 200 and thus fits together more closely, thereby reducing the generation of air bubbles.

In this embodiment, "forming the recessed structure 10 on the heat dissipation patch 100" specifically includes: forming the aforementioned recessed structure 10 on the heat dissipation patch 100 using a stamping process. In this embodiment, the heat dissipation patch 100 is made of metal, such as aluminum. The heat dissipation patch 100 has a certain degree of ductility and can be deformed, so the stamping process can be used to produce the recessed configuration 10 . The arrangement of the recessed configuration 10 can be more conveniently achieved by stamping.

"S400: Attaching the heat dissipation sticker 100 to the chip 200" also includes the following steps:

S300: Detect the wafer coated with the sealant 400 to select the sealant 400 that does not meet the requirements, wherein the sealant 400 is coated around the wafer 200 and located on the substrate 300 that encapsulates the wafer 200; When the heat dissipation paste 100 is attached to the chip 200 , part of the heat dissipation paste 100 is attached to the sealant 400 .

The sealant 400 is arranged in an annular shape and formed around the wafer 200 . In order to improve the heat dissipation performance of the substrate 300, the existing process requires a part of the heat dissipation paste 100 to be attached to the upper surface of the substrate 300 to dissipate heat from the circuit layer on the substrate 300 after the heat dissipation paste 100 is attached. The above requirements require the heat dissipation sticker 100 to be attached to the chip 200 and the substrate 300 at the same time. The sealant 400 serves as the colloid between the sealing chip 200 and the substrate 300 and will inevitably be wrapped after the heat dissipation sticker 100 is attached. Therefore, During the process of attaching the heat dissipation patch 100, three parts, namely the chip 200, the substrate 300 and the sealant 400, need to be considered at the same time. Since the heights of these three parts are inconsistent, this also causes the heat dissipation patch to be easily wrapped after being attached. of bubbles.

In this embodiment, during the preprocessing of the heat sink 100, the recessed structure 10 formed on the heat sink 100 can not only cover the chip 200, but also cover the sealant 400 on the side of the chip 200. That is to say, the shape of the recessed structure 10 actually matches the overall configuration formed by the chip 200 and the sealant 400. After the heat dissipation patch 100 is attached, the recessed structure 10 can simultaneously form a cover for the chip 200 and the sealant 400. design, so as to better realize the attachment of the heat dissipation sticker 100.

However, since the shape of the sealant 400 is uncontrollable, and the concave configuration 10 formed after stamping the heat dissipation patch 100 is fixed, in order to better realize the effect of the heat dissipation patch 100 after being attached, it is necessary after the sealant 400 is formed. The sealant 400 is tested and the sealants 400 that do not meet the requirements are selected. In this embodiment, the sealant 400 needs to meet certain size requirements, so that the heat dissipation patch 100 can better cover the sealant 400 . If the size of the sealant 400 is too small, a gap will easily form between the heat dissipation patch 100 and the sealant 400 after being attached, resulting in a lot of bubbles after attachment. Therefore, it actually needs to be picked out during this step. A relatively small size sealant.

Specifically, "S300: Test the wafer 200 coated with the sealant 400 to select the sealant 400 that does not meet the requirements" specifically includes the following steps:

It is determined whether the distance L between the edge of the sealant 400 and the side surface of the wafer 200 is lower than L1, and when L is lower than L1, the sealant 400 is determined to be unqualified. If the linear distance L between the edge of the sealant 400 and the plane on the side of the chip 200 is too small, it means that the sealant 400 is too small for storage and the sealant 400 is too dry, making it difficult to form a close fit with the heat sink 100 . It can be understood that the specific value of L1 is set according to actual product needs.

After "S400 attaches the heat sink to the chip", the following steps are also included:

S500: The heat dissipation patch 100 is pressed tightly using roller pressing. The heat dissipation patch 100 is pressed tightly onto the substrate 300, the sealant 400 and the chip 200 using a roller or roller configuration, thereby better achieving the attachment of the heat dissipation patch 100 and squeezing out some air bubbles.

The roller pressing method for pressing the heat dissipation patch 100 can adopt an existing relatively mature process, which will not be described in detail here.

Another embodiment of this invention also discloses a packaging method, including the following steps:

S101: Provide a circuit board. The circuit board includes a substrate 300 and a circuit layer and internal pins provided on the substrate 300;

S102: Provide a chip 200, the aforementioned chip 200 is provided with bumps;

S103: Electrically connect the pins in the circuit board to the bumps of the chip 200;

S104: Form the encapsulating colloid 400 on the side of the aforementioned chip 200, and the encapsulating colloid 400 is located on the upper side of the aforementioned substrate 300;

S105: Attach the aforementioned heat dissipation patch 100 using the aforementioned heat dissipation patch attachment method, wherein the recessed structure 10 of the heat dissipation patch 100 is covered outside the aforementioned chip 200, and the bottom 101 of the recessed structure 10 is attached to the back of the aforementioned chip 200. 201. At least part of the side portion 102 of the recessed structure 10 is attached to the encapsulant 400 .

The packaging structure formed by the packaging method of this invention can better attach the heat dissipation patch 100 and reduce the bubbles generated after the heat dissipation patch 100 is attached.

Another embodiment of the present invention also discloses a packaging configuration, which is packaged using the aforementioned packaging method.

As shown in Figures 3-7, another embodiment of the present invention also discloses an attachment device of the aforementioned heat dissipation attachment method, including: a carrier 1, a drive unit 2, a lower mold 3 and an upper mold 4;

The aforementioned carrying frame 1 includes a frame body, a carrying platform 11 provided on the aforementioned frame body and used for placing the heat dissipation patch 100, and a mold through hole 12 provided on the carrying platform 11; the aforementioned mold through hole 12 completely penetrates the aforementioned carrying platform 11 in the vertical direction. ;

The aforementioned driving unit 2 is located on the upper side of the bearing platform 11;

The lower mold 3 is arranged on the lower side of the aforementioned bearing platform 11, and has a protruding block 31 that moves in the aforementioned mold perforation 12. The aforementioned protruding block 31 can protrude out of the upper surface of the aforementioned bearing platform 11 along the aforementioned mold perforation 12;

The upper mold 4 is disposed on the upper side of the bearing platform 11 and cooperates with the driving unit 2. The upper mold 4 includes an avoidance space 40 opposite to the position of the mold through hole 12; the driving unit 2 drives the upper mold 4 toward or away from the bearing. Move in the direction of Taiwan 11.

During use, the heat dissipation patch 100 is placed on the bearing platform 11 . After the heat dissipation patch 100 is placed, it faces the position of the mold perforation 12 and covers the mold perforation 12 . The driving unit 2 controls the upper mold 4 to move downward toward the bearing platform 11 and presses and positions the heat dissipation patch 100 between the upper mold 4 and the bearing platform 11, and then controls the protruding block 31 of the lower mold 3 to move and protrude. During the movement, the block 31 protrudes upward from the upper surface of the aforementioned bearing platform 11, thereby stamping the heat dissipation sticker 100 covering the mold hole 12, and the avoidance space 40 of the upper mold 4 forms an avoidance for the protruding block 31, so that Part of the heat dissipation patch 100 moves or extends toward the avoidance space 40 under the punching action of the protruding block 31 , thereby finally forming the aforementioned recessed configuration 10 on the heat dissipation patch 100 .

The shape of the recessed structure 10 is adapted to the shape of the protruding block 31 and the escape space 40. Under the extrusion of the protruding block 31 and the inner wall of the escape space 40, the heat dissipation patch is deformed or extended to form the recessed structure. Type 10.

In this embodiment, the aforementioned attachment device also has a linkage mechanism 5 and a driving connector 6 that cooperates with the aforementioned linkage mechanism 5;

The aforementioned linkage mechanism 5 includes a connecting rod 51. The aforementioned connecting rod 51 is rotatably installed on the aforementioned carrier frame 1. Specifically, the aforementioned aforementioned connecting rod 51 is rotatably installed on the aforementioned aforementioned frame body, and the aforementioned aforementioned connecting rod 51 can slide along the aforementioned aforementioned carrier frame 1. The aforementioned connecting rod 51 is provided with a waist-shaped hole, and the extending direction of the aforementioned waist-shaped hole is consistent with the extending direction of the connecting rod 51. The aforementioned frame is provided with a support column, and the aforementioned support column passes through the aforementioned waist-shaped hole, and the support column is connected with the waist-shaped hole. The waist-shaped hole can produce relative rotation and relative sliding between the two; the waist-shaped hole is provided at the center of the connecting rod 51 . In other embodiments, the support column can also be provided on the connecting rod 51, and corresponding waist-shaped holes can be provided on the aforementioned carrier frame 1. Based on the aforementioned embodiment, the above substitutions are easily conceivable by those skilled in the art. , which will not be described in detail here.

One end of the aforementioned connecting rod 51 is pivotally connected to the aforementioned lower mold 3, and the other end of the aforementioned connecting rod 51 is opposite to the aforementioned driving connector 6; the aforementioned connecting rod 51 has a free end and a fixed end arranged oppositely, and the aforementioned fixed end is connected to the aforementioned lower mold 3. The mold 3 is pivoted, and the free end is opposite to the driving connector 6 . The driving connector 6 is used to resist the connecting rod 51 to drive the connecting rod 51 to rotate. During the rotation of the connecting rod 51, the lower mold 3 is driven to move along the mold hole 12.

The connecting rod 51 is conveniently arranged to control the movement of the lower mold 3. The driving connector 6 can be controlled by a separate driving member. In this embodiment, the aforementioned driving connector 6 is controlled by the driving unit 2, thereby realizing the entire The device uses one drive unit, which saves costs and avoids occupying space. This makes the configuration more compact.

Specifically, the aforementioned driving connector 6 cooperates with the aforementioned driving unit 2, and the aforementioned driving unit 2 drives the aforementioned driving connector 6 to move;

The driving connecting piece 6 cooperates with the upper mold 4 , and the upper mold 4 can slide relative to the driving connecting piece 6 .

Since the driving unit 2 controls the movement of the driving connector 6 and the upper mold 4 at the same time, how to control the relative positional relationship between the driving connector 6 and the upper mold 4 is very important. In this embodiment, the drive connector 6 and the upper mold 4 can slide relative to each other in the driving direction of the drive unit 2, so that the movement control of the drive connector 6 does not affect the upper mold 4, or the movement control of the upper mold 4 affects the drive. Connector 6 has no influence. The arrangement of the above configuration can realize that the driving connector 6 can move independently after the movement reaches a certain stage, and does not need to move synchronously with the upper mold 4 at all times.

It should be noted that when the driving unit 2 is a cylinder, the driving direction of the driving unit is the direction in which the push rod of the cylinder expands and contracts, that is, the direction in which the push rod of the cylinder extends.

Specifically, the driving connector 6 includes a connecting plate 61 that is fixedly connected to the driving unit 2 and an extension plate 62 extending from the connecting plate 61 toward the connecting rod 51;

The upper mold 4 includes a mold body 41 , which is located under the connecting plate 61 and can slide in a direction toward or away from the connecting plate 61 . The aforementioned extension plates 62 are provided with a pair and are arranged on both sides of the connecting plate 61 to offset each other, and the two extension plates 62 are also located opposite to each other on both sides of the mold body 41 .

The connecting plate 61 is provided with sliding holes, and the upper mold 4 includes a sliding rod 42 arranged on the mold body 41. The sliding rod 42 is arranged on one side of the mold body 41 facing the connecting plate 61, and the sliding rod 42 is arranged along the Extending in the vertical direction, the sliding rod 42 is slidably matched with the sliding hole. The sliding rod 42 is provided with a sliding rod limiting portion 43. The sliding rod limiting portion 43 is located on the upper side of the connecting plate 61 and is used for connecting with the aforementioned connecting plate 61. The upper surfaces of the plates 61 are in contact with each other, and the sliding rod limiting portion 43 is used to limit the sliding rod 42 from passing through the sliding hole.

A reset member 7 is provided between the mold body 41 and the connection plate 61. Under the action of external force, the mold body 41 moves in the direction close to the connection plate 61 and the reset member 7 accumulates rebound force. After the external force is removed, the reset member 7 is reset. Under the action of the resilient force of the component 7, the mold body 41 moves in a direction away from the connecting plate 61.

In this embodiment, the reset member 7 is a compression spring. Of course, in other embodiments, the reset member 7 can also be configured as a reed or a tension spring. The specific configuration of the reset member 7 is not specifically limited here.

During use, the driving unit 2 drives the driving connector 6 to move downward toward the direction of the bearing platform 11. Since the driving connector 6 cooperates with the upper mold 4, the driving connector 6 drives the upper mold 4 toward the bearing platform. Move in direction 11. After the upper mold 4 moves downward until the mold body 41 contacts the upper surface of the bearing platform 11 , the heat dissipation patch 100 is pressed and positioned between the mold body 41 and the bearing platform 11 .

After the mold body 41 comes into contact with the bearing platform 11, the driving unit 2 further drives the driving connector 6 to move downward. During the downward movement of the driving connector 6, the extension plate 62 contacts the free end of the connecting rod 51, and drives the connecting rod 6 to move downward. The rod 51 rotates, and the connecting rod 51 drives the fixed end of the connecting rod 51 to move upward during the rotation. The fixed end of the connecting rod 51 is pivotally connected with the lower mold 3 and can drive the lower mold 3 to move upward and finally move upward along the mold hole 12. The upper surface of the aforementioned bearing platform 11 is protruded, thereby stamping the heat dissipation patch 100 clamped and positioned between the mold body 41 and the bearing platform 11 .

After the mold body 41 is in contact with the bearing platform 11, the sliding rod 42 on the upper mold 4 and the sliding hole on the connecting plate 61 can relatively slide in the vertical direction during the further downward movement of the driving connector 6. In this process The middle mold body 41 does not need to move. When the driving unit 2 further drives the driving connector 6 to move downward, the mold body 41 is no longer affected by the force of the driving unit 2, and the driving connector 6 and the mold body 41 are in relative contact with each other. Sliding, the connecting plate 61 moves in the direction close to the mold body 41. In this process, the return member 7 located between the driving connecting member 6 and the mold body 41 is squeezed and accumulates rebound force, and the force of the driving unit 2 is cancelled. The resilient force accumulated on the rear reset part 7 separates the driving connection part 6 and the mold body 41 .

It can be understood that in order to facilitate the positioning of the reset member 7, a reset member positioning hole for positioning the reset member 7 is formed on the mold body 41. One end of the reset member 7 is positioned in the reset member positioning hole, and the other end of the reset member 7 is located in the reset member positioning hole. It extends on the connecting plate 61 and is against the connecting plate 61 or connected and fixed with the connecting plate 61 .

When the connecting rod 51 rotates, one end of the connecting rod 51 away from the extension plate 62 is pivotally connected to the lower mold 3, thereby driving the lower mold 3 to move upward. During the upward movement, the lower mold 3 drives the protruding block 31 to perforate the mold. 12 moves upward and finally protrudes from the upper surface of the bearing platform 11 . Since there is the upper mold 4 on the upper side of the bearing platform 11 , the protruding block 31 can penetrate deep into the avoidance space 40 on the upper mold 4 . At the same time, the protruding block 31 stamps the heat dissipation patch clamped between the upper mold and the bearing platform 11 , and when the protruding block 31 penetrates into the avoidance space 40 , part of the heat dissipation patch 100 moves or extends in the avoidance space 40 inside, thereby forming a recessed configuration 10 on the aforementioned heat dissipation patch 100 .

In this embodiment, there are two connecting rods 51 . The two connecting rods 51 are symmetrically arranged and both are rotatably mounted on the frame. The two connecting rods 51 are symmetrically arranged on both sides of the protruding block 31 . The two connecting rods 51 act on the protruding block 31 at the same time, thereby achieving better control over the movement of the protruding block 31 . It can be understood that the two connecting rods 51 are opposite to the two extending plates 62 respectively, and the two connecting rods 51 are controlled by the two extending plates 62 .

In order to better realize the control of the connecting rod 51 by the extending plate 62, the free end of the connecting rod 51 is provided with a roller, and the end of the extending plate 62 away from the connecting rod 61 is provided with a widening plate. The plane of the widening plate is in line with the connecting rod 61. The plane where the aforementioned extended plate 62 is located is vertical, and the arrangement of the widened plate can more conveniently realize the contact between the connecting rod 51 and the connecting rod 61 .

Furthermore, in order to better enable the molded heat dissipation patch to be detached from the upper mold 4, the attachment device also has a blanking unit 8. The blanking unit 8 includes a blanking bump 81 disposed in the avoidance space 40. and the blanking reset piece 82. Under the action of external force, the aforementioned blanking bump 81 moves in the direction of enlarging the avoidance space 40. After the external force is removed, the aforementioned blanking bump 81 resets and moves under the action of the blanking reset piece 82 to reduce the The aforementioned avoidance space 40.

In the initial state, the aforementioned cutting bump 81 can occupy part of the space of the avoidance space 40. When the protruding block 31 protrudes toward the avoiding space 40, the aforementioned cutting bump 81 is squeezed by the protruding block 31, and is Under the action of the protruding block 31, it shrinks and moves inward, thereby expanding the space of the avoidance space 40. At this time, the blanking convex block 81 shrinks and leaves the space of the originally occupied avoidance space 40, which indirectly increases the avoidance space 40. When the blanking bump 81 shrinks and moves inward, the blanking reset member 82 is compressed, so that the blanking reset member 82 accumulates rebound force.

When the protruding block 31 squeezes the cutting bump 81 and moves inwards, the heat dissipation patch located at the opening of the escape space 40 is punched into the escape space 40 by the protrusion block 31 , thereby forming the aforementioned depression on the heat dissipation patch 100 Configuration 10, the aforementioned recessed configuration 10 is adapted to the shape of the aforementioned protruding block 31. After the force acting on the connecting rod 51 is canceled, the protruding block 31 leaves the avoidance space 40. At this time, the heat dissipation sticker 100 is easily adhered to the upper mold 4, and the blanking reset piece 82 drives the blanking bump 81 toward The direction of squeezing the avoidance space 40 is moved, and then the heat dissipation patch 100 is pushed out of the avoidance space 40 to complete the stamping and unloading of the heat dissipation patch.

The structure, characteristics and effects of the present invention have been described in detail based on the embodiments shown in the drawings. The foregoing descriptions are only preferred embodiments of the present invention. However, the scope of implementation of the present invention is not limited by the drawings. Any changes made to the concept of this creation, or modifications to equivalent embodiments with equivalent changes, shall be within the scope of protection of this creation as long as they do not exceed the spirit covered by the description and illustrations.

100:Heating patch 10: Concave configuration 101: Bottom 102: Side 200:wafer 201:Back 202:Side 300:Substrate 400:Sealing colloid 1: Bearing frame 11: Bearing platform 12: Mold perforation 2: Drive unit 3: Lower the mold 31:Protruding block 4: Upper mold 40: Avoidance space 41:Mold body 42: Slider 43:Sliding rod limit part 5: Linkage mechanism 51: Connecting rod 6: Drive connector 61:Connection board 62:Extension board 7:Reorder parts 8:Blanking unit 81:Blanking bump 82:Blanking reset piece

In order to explain the technical solutions in the embodiments of the present invention or the traditional technology more clearly, the drawings needed to be used in the description of the embodiments or the traditional technology will be briefly introduced below. Obviously, the drawings in the following description are only for the purpose of this invention. For some embodiments of creation, those with ordinary skill in the art can also obtain other drawings based on these drawings without exerting creative efforts.

Figure 1 is a schematic diagram of the heat dissipation patch forming a concave configuration in the method of attaching the heat dissipation patch disclosed in the embodiment of this invention; Figure 2 is a schematic diagram of the configuration after the heat dissipation patch is attached in the heat dissipation patch attachment method disclosed in the embodiment of this invention; Figure 3 is a first perspective view of the heat dissipation patch attachment device disclosed in the embodiment of this invention; Figure 4 is a second perspective view of the heat dissipation patch attachment device disclosed in the embodiment of this invention; Figure 5 is a diagram showing the positional relationship between the lower mold and the bearing platform in the heat dissipation patch attachment device disclosed in the embodiment of this invention; Figure 6 is a schematic diagram of the assembly configuration of the upper mold and the driving mechanism of the heat dissipation patch attachment device disclosed in the embodiment of this invention; Figure 7 is a schematic diagram of the internal structure of the heat dissipation patch attachment device disclosed in the embodiment of this invention.

100:Heating patch

101: Bottom

102: Side

200:wafer

201:Back

202:Side

300:Substrate

400:Sealing colloid

Claims (14)

A heat dissipation patch attachment method, which includes the following steps: A recessed configuration is formed on the heat dissipation sticker, and the recessed configuration includes a bottom and a side portion located on the bottom; and The heat dissipation patch is attached to the chip, wherein the bottom portion is opposite to the back surface of the chip, and the side portion is opposite to the side surface of the chip. According to the aforementioned method of attaching a heat dissipation patch according to claim 1, “forming a recessed configuration on the heat dissipation patch” specifically includes: forming the aforementioned recessed configuration on the aforementioned heat dissipation patch using a stamping process. For example, the method of attaching a heat dissipation patch as described in claim 1, wherein: "attaching the heat dissipation patch to the chip" also includes the following steps: The wafer coated with sealant is inspected to select the sealant that does not meet the requirements, wherein the sealant is coated around the wafer and located on the substrate encapsulating the wafer; and When the heat dissipation patch is attached to the chip, part of the heat dissipation patch is attached to the sealant. For example, the heat dissipation patch attachment method mentioned in claim 1, wherein: "Inspecting the chip coated with sealing colloid to select the sealing colloid that does not meet the requirements" specifically includes the following steps: Determine whether the distance L between the edge of the sealant and the side surface of the wafer is lower than L1, and when L is lower than L1, the sealant is determined to be unqualified. The heat dissipation patch attaching method as described in claim 1, wherein: after "attaching the heat dissipation patch to the chip", it also includes using a rolling method to press the heat dissipation patch tightly. An encapsulation method, which includes the following steps: Provide a chip and a circuit board. The chip is provided with bumps. The circuit board includes a substrate, a circuit layer and internal pins provided on the substrate; Electrically connecting the internal pins of the aforementioned circuit board to the bumps of the aforementioned chip; An encapsulating colloid is formed on the side of the chip, and the encapsulating colloid is located on the upper side of the substrate; and The heat dissipation patch is attached using the heat dissipation patch attachment method described in any one of claims 1 to 5, wherein the recessed configuration of the heat dissipation patch is provided outside the chip, and the bottom of the recessed configuration is attached to the chip On the back side, at least part of the side portion of the aforementioned recessed configuration is attached to the aforementioned encapsulant. An encapsulation configuration, which is encapsulated using the encapsulation method mentioned in claim 6. An attachment device for the heat dissipation patch attachment method as described in any one of claims 1 to 5, which includes: The bearing frame includes a bearing platform for placing the heat dissipation patch and a mold perforation provided on the aforementioned bearing platform; The driving unit is located on the upper side of the aforementioned bearing platform; The lower mold is arranged on the lower side of the aforementioned bearing platform and has a protruding block movable in the aforementioned mold perforation. The aforementioned protruding block can protrude out of the upper surface of the aforementioned bearing platform along the aforementioned mold perforation; and The upper mold is arranged on the upper side of the bearing platform and cooperates with the driving unit. The upper mold includes an avoidance space opposite to the punching position of the mold; the driving unit drives the upper mold to move toward or away from the bearing platform. The attachment device as described in claim 8, wherein: the attachment device further has a linkage mechanism and a driving connector that cooperates with the linkage mechanism; The aforementioned linkage mechanism includes a connecting rod, which is rotatably installed on the aforementioned bearing frame, and the aforementioned connecting rod can slide along the aforementioned bearing frame; one end of the aforementioned connecting rod is pivotally connected to the aforementioned lower mold, and the other end of the aforementioned connecting rod is connected to the aforementioned driving frame. The connectors are positioned relative to each other; and The driving connector is used to resist the connecting rod to drive the connecting rod to rotate, and drives the lower mold to move during the rotation of the connecting rod. The attachment device according to claim 9, wherein: the driving connector cooperates with the driving unit, and the driving unit drives the driving connector to move; and The driving connecting piece cooperates with the upper mold, and the upper mold can slide relative to the driving connecting piece. The attachment device according to claim 9, wherein: the driving connection member includes a connecting plate connected and fixed to the driving unit and an extension plate extending from the connecting plate toward the connecting rod; and The upper mold includes a mold body, which is located under the connecting plate and can slide in a direction toward or away from the connecting plate. The attachment device according to claim 11, wherein: the connecting plate is provided with a sliding hole, the upper mold includes a sliding rod provided on the mold body, the sliding rod is slidably matched with the sliding hole, and the sliding rod is provided with a sliding hole. The sliding rod limiting part is located on the upper side of the connecting plate and is used to offset the upper surface of the connecting plate. The attachment device according to claim 9, wherein: a reset member is provided between the mold body and the connecting plate, and the mold body moves in a direction closer to the connecting plate under the action of external force and causes the reset member to accumulate rebound force. After the external force is removed, the mold body moves in a direction away from the connecting plate under the action of the resilience of the reset member. The attachment device according to claim 9, wherein: the attachment device blanking unit includes a lowering bump and a lowering reset member arranged in the avoidance space. Under the action of external force, the lowering bump The block moves in the direction of enlarging the avoidance space. After the external force is removed, the aforementioned blanking convex block resets and moves under the action of the aforementioned blanking reset member to reduce the aforementioned avoidance space.