TWI849373B - Assembling type electrical connector - Google Patents
Assembling type electrical connector Download PDFInfo
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- TWI849373B TWI849373B TW111100478A TW111100478A TWI849373B TW I849373 B TWI849373 B TW I849373B TW 111100478 A TW111100478 A TW 111100478A TW 111100478 A TW111100478 A TW 111100478A TW I849373 B TWI849373 B TW I849373B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
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- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
本申請有關於一種電連接器,更詳而言之,係指一種可以設置電子元件的組立式電連接器。The present application relates to an electrical connector, and more specifically, to an assembled electrical connector capable of arranging electronic components.
按,在現代的各式電子設備中,通常會設有電路母板與電子元件,所述電子元件係設置於電路母板上以執行運作,然,隨著電子設備輕薄短小的發展趨勢,使得電子設備內部空間大幅縮減,造成電路母板的尺寸被要求大幅縮減,使得電路母板無法提供足夠的區域設置電子元件,如此,將會導致電子設備的技術(功能)發展受到限制。In modern electronic devices, a motherboard and electronic components are usually provided. The electronic components are arranged on the motherboard to operate. However, with the development trend of electronic devices being thinner and smaller, the internal space of the electronic devices is greatly reduced, resulting in the requirement for the size of the motherboard to be greatly reduced, so that the motherboard cannot provide enough area to arrange the electronic components. This will limit the technical (functional) development of the electronic devices.
另外,因應電子設備的特殊需求及發展,電連接器的導電端子的數量與結構會被要求能夠客製化調整,然,目前的電連接器設計完成後,導電端子的數量與結構就會被確定而無法客製化調整。In addition, in response to the special needs and development of electronic devices, the number and structure of the conductive terminals of the electrical connector are required to be customized. However, after the current electrical connector design is completed, the number and structure of the conductive terminals are determined and cannot be customized.
有鑑於此,如何在小尺寸的電路母板上設置電子元件,使電子設備能夠持續朝輕薄短小的方向發展,且如何客製化調整電連接器的導電端子的數量與結構,目前已經成為現在業界亟欲挑戰克服的技術議題。In view of this, how to set up electronic components on a small-sized circuit motherboard so that electronic equipment can continue to develop in the direction of being thinner and lighter, and how to customize the number and structure of the conductive terminals of the electrical connector have become technical issues that the industry is eager to challenge and overcome.
鑒於上述先前技術之缺點,本申請係提供一種組立式電連接器,該組立式電連接器係可以對接一對接構件,該對接構件係具有一對接部位,該組立式電連接器係包括:一主層組立構件,該主層組立構件係具有一主層組立構件電路板、一主層組立構件電子元件、一主層組立構件膠芯與一主層組立構件主要導電端子組,其中,該主層組立構件電路板係具有一主層組立構件電路板電路結構;該主層組立構件電子元件係設置於該主層組立構件電路板,並電性連接該主層組立構件電路板電路結構;該主層組立構件膠芯係具有一主層組立構件膠芯容置空間,該主層組立構件膠芯容置空間係提供容置該主層組立構件電路板與該主層組立構件電子元件;該主層組立構件主要導電端子組係嵌設於該主層組立構件膠芯,該主層組立構件主要導電端子組係具有一主層組立構件主要導電端子組接觸結構與一主層組立構件主要導電端子組對接結構;該主層組立構件主要導電端子組接觸結構係進入該主層組立構件膠芯容置空間而接觸該主層組立構件電路板電路結構,俾藉由該主層組立構件電路板電路結構電性連接該主層組立構件電子元件;該主層組立構件主要導電端子組對接結構係離開該主層組立構件膠芯;以及一主要殼體,該主要殼體係具有一主要殼體容置空間與一主要殼體主層組立結構,其中,該主要殼體容置空間係提供容置該對接構件的對接部位,該主要殼體主層組立結構係提供組立該主層組立構件,使該主層組立構件主要導電端子組對接結構進入該主要殼體容置空間而跟該對接構件的對接部位對接。In view of the above-mentioned shortcomings of the prior art, the present application provides a modular electrical connector, which can be connected to a docking component, the docking component has a docking portion, and the modular electrical connector includes: a main layer modular component, the main layer modular component has a main layer modular component circuit board, a main layer modular component electronic component, a main layer modular component rubber core and a main layer modular component main conductive terminal set, wherein the main layer modular component circuit board has There is a main layer assembly component circuit board circuit structure; the main layer assembly component electronic component is arranged on the main layer assembly component circuit board and is electrically connected to the main layer assembly component circuit board circuit structure; the main layer assembly component rubber core has a main layer assembly component rubber core accommodating space, and the main layer assembly component rubber core accommodating space is provided to accommodate the main layer assembly component circuit board and the main layer assembly component electronic component; the main layer assembly component main conductive terminal group is embedded in the main layer assembly component The main conductive terminal set of the main layer assembly component has a main conductive terminal set contact structure and a main conductive terminal set docking structure; the main conductive terminal set contact structure of the main layer assembly component enters the main layer assembly component rubber core accommodating space and contacts the main layer assembly component circuit board circuit structure, so as to electrically connect the main layer assembly component electronic components through the main layer assembly component circuit board circuit structure; the main layer assembly component main conductive terminal set contact structure The terminal group docking structure is separated from the main layer assembly component rubber core; and a main shell, the main shell has a main shell accommodating space and a main shell main layer assembly structure, wherein the main shell accommodating space provides a docking position for accommodating the docking component, and the main shell main layer assembly structure provides for assembling the main layer assembly component, so that the main conductive terminal group docking structure of the main layer assembly component enters the main shell accommodating space and docks with the docking position of the docking component.
優選地,於上述的組立式電連接器中,該主層組立構件主要導電端子組接觸結構係為一插接結構,俾提供插接接觸該主層組立構件電路板電路結構,且提供將該主層組立構件電路板定位於該主層組立構件膠芯容置空間。Preferably, in the above-mentioned assembled electrical connector, the main conductive terminal group contact structure of the main layer assembled component is a plug-in structure to provide plug-in contact with the circuit structure of the main layer assembled component circuit board and to position the main layer assembled component circuit board in the main layer assembled component rubber core accommodating space.
優選地,於上述的組立式電連接器中,該主層組立構件膠芯還具有一主層組立構件膠芯止擋結構,該主層組立構件膠芯止擋結構係提供止擋該主層組立構件電路板的移動,俾將該主層組立構件電路板定位於該主層組立構件膠芯容置空間。Preferably, in the above-mentioned assembled electrical connector, the main layer assembled component rubber core also has a main layer assembled component rubber core stopping structure, and the main layer assembled component rubber core stopping structure is provided to stop the movement of the main layer assembled component circuit board so as to position the main layer assembled component circuit board in the main layer assembled component rubber core accommodating space.
優選地,於上述的組立式電連接器中,該主層組立構件主要導電端子組接觸結構係位於一第一位置或一第二位置,當該主層組立構件主要導電端子組接觸結構位於該第一位置時,該主層組立構件主要導電端子組接觸結構係位於該主層組立構件膠芯止擋結構與該主層組立構件主要導電端子組對接結構之間,或者,當該主層組立構件主要導電端子組接觸結構位於該第二位置時,該主層組立構件膠芯止擋結構係位於該主層組立構件主要導電端子組接觸結構與該主層組立構件主要導電端子組對接結構之間。Preferably, in the above-mentioned assembled electrical connector, the main layer assembled component main conductive terminal group contact structure is located at a first position or a second position. When the main layer assembled component main conductive terminal group contact structure is located at the first position, the main layer assembled component main conductive terminal group contact structure is located between the main layer assembled component rubber core stop structure and the main layer assembled component main conductive terminal group docking structure, or, when the main layer assembled component main conductive terminal group contact structure is located at the second position, the main layer assembled component rubber core stop structure is located between the main layer assembled component main conductive terminal group contact structure and the main layer assembled component main conductive terminal group docking structure.
優選地,於上述的組立式電連接器中,該主層組立構件膠芯係具有一主層組立構件膠芯引導結構,該主層組立構件膠芯引導結構係引導該主層組立構件主要導電端子組接觸結構移動,使該主層組立構件主要導電端子組接觸結構位於該第一位置或該第二位置。Preferably, in the above-mentioned assembled electrical connector, the main layer assembled component rubber core has a main layer assembled component rubber core guide structure, and the main layer assembled component rubber core guide structure guides the movement of the main layer assembled component main conductive terminal group contact structure so that the main layer assembled component main conductive terminal group contact structure is located at the first position or the second position.
另外,本申請還提供一種組立式電連接器,該組立式電連接器係可以對接一對接構件,該對接構件係具有一對接部位,該組立式電連接器係包括:一主層組立構件,該主層組立構件係具有一主層組立構件電子元件、一主層組立構件膠芯與一主層組立構件主要導電端子組,其中,該主層組立構件膠芯係具有一主層組立構件膠芯容置空間,該主層組立構件膠芯容置空間係提供容置該主層組立構件電子元件;該主層組立構件主要導電端子組係嵌設於該主層組立構件膠芯,該主層組立構件主要導電端子組係具有一主層組立構件主要導電端子組接觸結構與一主層組立構件主要導電端子組對接結構;該主層組立構件主要導電端子組接觸結構係進入該主層組立構件膠芯容置空間而接觸該主層組立構件電子元件;該主層組立構件主要導電端子組對接結構係離開該主層組立構件膠芯;以及一主要殼體,該主要殼體係具有一主要殼體容置空間與一主要殼體主層組立結構,其中,該主要殼體容置空間係提供容置該對接構件的對接部位,該主要殼體主層組立結構係提供組立該主層組立構件,使該主層組立構件主要導電端子組對接結構進入該主要殼體容置空間而跟該對接構件的對接部位對接。In addition, the present application also provides an assembled electrical connector, which can be connected to a docking component, the docking component has a docking portion, and the assembled electrical connector includes: a main layer assembled component, the main layer assembled component has a main layer assembled component electronic component, a main layer assembled component rubber core and a main layer assembled component main conductive terminal set, The main layer assembly component core has a main layer assembly component core accommodating space, and the main layer assembly component core accommodating space is provided to accommodate the main layer assembly component electronic components; the main layer assembly component main conductive terminal set is embedded in the main layer assembly component core, and the main layer assembly component main conductive terminal set has a main layer assembly component main conductive terminal set connection The contact structure and a main conductive terminal group docking structure of a main layer assembly component; the main conductive terminal group contact structure of the main layer assembly component enters the main layer assembly component plastic core accommodating space and contacts the main layer assembly component electronic components; the main conductive terminal group docking structure of the main layer assembly component is separated from the main layer assembly component plastic core; and a main shell, the main shell having A main shell accommodating space and a main shell main layer assembly structure, wherein the main shell accommodating space provides a docking position for accommodating the docking component, and the main shell main layer assembly structure provides a main layer assembly component for assembling the main layer assembly component so that the main conductive terminal group docking structure of the main layer assembly component enters the main shell accommodating space and docks with the docking position of the docking component.
優選地,於上述的組立式電連接器中,該主層組立構件主要導電端子組還具有至少一第一主層組立構件主要導電端子、多個第二主層組立構件主要導電端子與一主層組立構件橋接導電體,該主層組立構件橋接導電體係避開該第一主層組立構件主要導電端子,而提供橋接各個第二主層組立構件主要導電端子,使各個第二主層組立構件主要導電端子電性連接,而構成一第二主層組立構件主要導電電路。Preferably, in the above-mentioned assembled electrical connector, the main layer assembled component main conductive terminal group also has at least one first main layer assembled component main conductive terminal, multiple second main layer assembled component main conductive terminals and a main layer assembled component bridging conductor. The main layer assembled component bridging conductor avoids the first main layer assembled component main conductive terminal and provides a bridge to each second main layer assembled component main conductive terminal, so that each second main layer assembled component main conductive terminal is electrically connected to form a second main layer assembled component main conductive circuit.
優選地,於上述的組立式電連接器中,該主層組立構件主要導電端子組還具有多個第一主層組立構件主要導電端子與至少一第二主層組立構件主要導電端子,該第二主層組立構件主要導電端子係鄰近該多個第一主層組立構件主要導電端子之其中至少一者,俾提供遮蔽而減少鄰近的第一主層組立構件主要導電端子的訊號傳輸受到外界干擾的程度。Preferably, in the above-mentioned assembled electrical connector, the main layer assembled component main conductive terminal group also has a plurality of first main layer assembled component main conductive terminals and at least one second main layer assembled component main conductive terminal, and the second main layer assembled component main conductive terminal is adjacent to at least one of the plurality of first main layer assembled component main conductive terminals, so as to provide shielding and reduce the degree of external interference to the signal transmission of the adjacent first main layer assembled component main conductive terminals.
優選地,於上述的組立式電連接器中,該主要殼體還具有一主要殼體裝配結構,且該組立式電連接器還包括一次要殼體,該次要殼體係具有一次要殼體裝配結構,該主要殼體裝配結構係提供裝配該次要殼體裝配結構,使該主要殼體與該次要殼體結合成為一體,且該次要殼體還具有一次要殼體主層止擋結構,當該主要殼體裝配結構裝配該次要殼體時,該次要殼體主層止擋結構係對該主層組立構件提供止擋,俾止擋該主層組立構件相對該主要殼體移動的程度。Preferably, in the above-mentioned assembled electrical connector, the main shell also has a main shell assembly structure, and the assembled electrical connector also includes a secondary shell, the secondary shell has a secondary shell assembly structure, the main shell assembly structure is provided to assemble the secondary shell assembly structure so that the main shell and the secondary shell are combined into one body, and the secondary shell also has a secondary shell main layer stop structure, when the main shell assembly structure is assembled with the secondary shell, the secondary shell main layer stop structure provides a stop for the main layer assembly component to stop the main layer assembly component from moving relative to the main shell.
優選地,於上述的組立式電連接器中,該主要殼體裝配結構與該次要殼體裝配結構係為螺接結構或扣接結構。Preferably, in the above-mentioned assembled electrical connector, the main housing assembly structure and the secondary housing assembly structure are screw-connected structures or snap-connected structures.
優選地,於上述的組立式電連接器中,還可以連接一次層傳輸線材組,且該組立式電連接器還包括:一次層組立構件,該次層組立構件係具有一次層組立構件主要導電端子組,該次層組立構件主要導電端子組係具有一次層組立構件主要導電端子組接合結構與一次層組立構件主要導電端子組對接結構,其中,該次層組立構件主要導電端子組接合結構係提供接合該次層傳輸線材組;以及該主要殼體還具有一主要殼體次層組立結構,其中,該主要殼體次層組立結構係提供組立該次層組立構件,使該次層組立構件主要導電端子組對接結構進入該主要殼體容置空間而提供跟該對接構件的對接部位對接。Preferably, in the above-mentioned modular electrical connector, a primary transmission wire set can also be connected, and the modular electrical connector further comprises: a primary modular component, the secondary modular component having a primary modular component main conductive terminal set, the secondary modular component main conductive terminal set having a primary modular component main conductive terminal set joint structure and a primary modular component main conductive terminal set docking structure , wherein the main conductive terminal group joint structure of the sub-layer assembly component is provided for joining the sub-layer transmission wire group; and the main shell also has a main shell sub-layer assembly structure, wherein the main shell sub-layer assembly structure is provided for assembling the sub-layer assembly component, so that the main conductive terminal group docking structure of the sub-layer assembly component enters the main shell accommodating space and provides docking with the docking part of the docking component.
優選地,於上述的組立式電連接器中,該主層組立構件主要導電端子組對接結構與該次層組立構件主要導電端子組對接結構係分別抵接該對接部位相對的兩側,俾夾持定位該對接構件的對接部位。Preferably, in the above-mentioned assembled electrical connector, the main conductive terminal group docking structure of the main layer assembled component and the main conductive terminal group docking structure of the secondary layer assembled component respectively abut against two opposite sides of the docking portion to clamp and position the docking portion of the docking component.
優選地,於上述的組立式電連接器中,還可以連接一主層傳輸線材組,且該主層組立構件還具有一主層組立構件次要導電端子組,該主層組立構件次要導電端子組係具有一主層組立構件次要導電端子組接合結構與一主層組立構件次要導電端子組對接結構,其中,該主層組立構件次要導電端子組接合結構係離開該主層組立構件膠芯,而提供接合該主層傳輸線材組,當該主要殼體主層組立結構組立該主層組立構件時,該主層組立構件次要導電端子組對接結構係進入該主要殼體容置空間而提供跟該對接構件的對接部位對接。Preferably, in the above-mentioned assembled electrical connector, a main layer transmission wire set can also be connected, and the main layer assembled component also has a main layer assembled component secondary conductive terminal set, and the main layer assembled component secondary conductive terminal set has a main layer assembled component secondary conductive terminal set bonding structure and a main layer assembled component secondary conductive terminal set docking structure, wherein the main layer assembled component secondary conductive terminal set bonding structure is separated from the main layer assembled component rubber core and provided for bonding the main layer transmission wire set, and when the main layer assembled component is assembled by the main shell main layer assembly structure, the main layer assembled component secondary conductive terminal set docking structure enters the main shell accommodating space and provides docking with the docking portion of the docking component.
優選地,於上述的組立式電連接器中,該主層組立構件次要導電端子組還具有一主層組立構件次要導電端子組卡接結構,該主層組立構件次要導電端子組卡接結構係提供卡接該主要殼體,俾限制該主層組立構件次要導電端子組相對該主要殼體移動的程度;該次層組立構件主要導電端子組還具有一次層組立構件主要導電端子組卡接結構,該次層組立構件主要導電端子組卡接結構係提供卡接該主要殼體,俾限制該次層組立構件主要導電端子組相對該主要殼體移動的程度。Preferably, in the above-mentioned assembled electrical connector, the main-layer assembled component secondary conductive terminal set also has a main-layer assembled component secondary conductive terminal set clamping structure, and the main-layer assembled component secondary conductive terminal set clamping structure is provided to clamp the main shell so as to limit the degree of movement of the main-layer assembled component secondary conductive terminal set relative to the main shell; the secondary-layer assembled component main conductive terminal set also has a primary-layer assembled component main conductive terminal set clamping structure, and the secondary-layer assembled component main conductive terminal set clamping structure is provided to clamp the main shell so as to limit the degree of movement of the secondary-layer assembled component main conductive terminal set relative to the main shell.
優選地,於上述的組立式電連接器中,該主層組立構件主要導電端子組對接結構與該主層組立構件次要導電端子組對接結構係抵接該對接部位的一第一側,該次層組立構件主要導電端子組對接結構係抵接該對接部位的一第二側,其中,該第一側與該第二側係為該對接部位相對的兩側,俾令該主層組立構件主要導電端子組對接結構、該主層組立構件次要導電端子組對接結構與該次層組立構件主要導電端子組對接結構可夾持定位該對接構件的對接部位。Preferably, in the above-mentioned assembled electrical connector, the main layer assembled component main conductive terminal group docking structure and the main layer assembled component secondary conductive terminal group docking structure abut a first side of the docking portion, and the secondary layer assembled component main conductive terminal group docking structure abuts a second side of the docking portion, wherein the first side and the second side are two opposite sides of the docking portion, so that the main layer assembled component main conductive terminal group docking structure, the main layer assembled component secondary conductive terminal group docking structure and the secondary layer assembled component main conductive terminal group docking structure can clamp and position the docking portion of the docking component.
優選地,於上述的組立式電連接器中,該主層組立構件膠芯還具有一主層組立構件膠芯扣接結構,當該主要殼體主層組立結構組立該主層組立構件時,該主層組立構件膠芯扣接結構係扣接該主要殼體。Preferably, in the above-mentioned assembled electrical connector, the main layer assembly component rubber core also has a main layer assembly component rubber core buckle structure, and when the main shell main layer assembly structure assembles the main layer assembly component, the main layer assembly component rubber core buckle structure is buckled to the main shell.
相較於先前技術,本申請係提供一種組立式電連接器,所提供的組立式電連接器可以設置電子元件,使電子元件無須直接設置於電路母板,而不會再受到電路母板尺寸的影響,如此,可以藉由電連接器在小尺寸的電路母板上設置電子元件,使電子設備能夠持續朝輕薄短小的方向發展。另外,本申請的組立式電連接器係藉由組立多個組立構件而構成,因此,在本申請的組立式電連接器設計完成後,仍然可以藉由多個組立構件的調整,而達成客製化調整組立式電連接器的導電端子的數量與結構,以滿足電子設備的特殊需求及發展。Compared with the prior art, the present application provides an assembled electrical connector. The assembled electrical connector provided can be used to set electronic components, so that the electronic components do not need to be directly set on the circuit motherboard and will no longer be affected by the size of the circuit motherboard. In this way, the electronic components can be set on a small-sized circuit motherboard through the electrical connector, so that electronic equipment can continue to develop in the direction of being thinner and smaller. In addition, the assembled electrical connector of the present application is constructed by assembling a plurality of assembled components. Therefore, after the design of the assembled electrical connector of the present application is completed, the number and structure of the conductive terminals of the assembled electrical connector can still be customized by adjusting the plurality of assembled components to meet the special needs and development of electronic equipment.
以下內容將搭配圖式,藉由特定的具體實施例說明本申請之技術內容,熟悉此技術之人士可由本說明書所揭示之內容輕易地了解本申請之其他優點與功效。本申請亦可藉由其他不同的具體實施例加以施行或應用。本說明書中的各項細節亦可基於不同觀點與應用,在不背離本申請之精神下,進行各種修飾與變更。尤其是,於圖式中各個元件的比例關係及相對位置僅具示範性用途,並非代表本申請實施的實際狀況。The following content will be accompanied by drawings to illustrate the technical content of this application through specific concrete embodiments. People familiar with this technology can easily understand other advantages and functions of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of this application. In particular, the proportional relationship and relative position of each component in the drawings are only for exemplary purposes and do not represent the actual situation of the implementation of this application.
另外,以下各實施例中相同或近似功能的結構或元件將採用相同的符號進行說明,且省略相同或均等技術特徵的描述,以使揭露的內容更為簡潔而容易明瞭。In addition, in the following embodiments, structures or elements with the same or similar functions will be described using the same symbols, and descriptions of the same or equivalent technical features will be omitted to make the disclosed content more concise and easy to understand.
本申請係提供一種組立式電連接器1,針對本申請的技術思想,請一併參考圖1至圖32。This application provides an assembled
如圖1至圖2所示的實施例,組立式電連接器1係連接例如為由導電線材所組成的主層傳輸線材組31與次層傳輸線材組32,且所述組立式電連接器1可以對接具有對接部位21的對接構件2,所述對接構件2係例如為電連接器構件或電路構件。如圖3至圖8所示的實施例,組立式電連接器1係包括:主層組立構件11、次層組立構件14、主要殼體12與次要殼體13。As shown in the embodiment of FIG. 1 to FIG. 2, the assembled
於本實施例中,所述主層組立構件11係具有主層組立構件電路板111、主層組立構件電子元件112、主層組立構件膠芯113、主層組立構件主要導電端子組114與主層組立構件次要導電端子組115。所述次層組立構件14係具有次層組立構件主要導電端子組141。In this embodiment, the main layer assembly component 11 comprises a main layer assembly component circuit board 111, a main layer assembly component electronic component 112, a main layer assembly component core 113, a main layer assembly component primary conductive terminal set 114 and a main layer assembly component secondary conductive terminal set 115. The secondary layer assembly component 14 comprises a secondary layer assembly component primary conductive terminal set 141.
於本實施例中,所述主層組立構件電路板111係具有可以傳輸非接地訊號或接地訊號的主層組立構件電路板電路結構1111。所述主層組立構件電子元件112係設置於主層組立構件電路板111,藉以電性連接所述主層組立構件電路板電路結構1111。另外,主層組立構件膠芯113係具有主層組立構件膠芯容置空間1131、主層組立構件膠芯扣接結構1132、主層組立構件膠芯止擋結構1133與主層組立構件膠芯引導結構1134。所述主層組立構件膠芯容置空間1131係提供容置主層組立構件電路板111與主層組立構件電子元件112。In this embodiment, the main layer component circuit board 111 has a main layer component circuit board circuit structure 1111 that can transmit a non-ground signal or a ground signal. The main layer component electronic element 112 is disposed on the main layer component circuit board 111 to be electrically connected to the main layer component circuit board circuit structure 1111. In addition, the main layer component rubber core 113 has a main layer component rubber core accommodating space 1131, a main layer component rubber core buckling structure 1132, a main layer component rubber core blocking structure 1133 and a main layer component rubber core guiding structure 1134. The main layer assembly component core accommodating space 1131 is provided to accommodate the main layer assembly component circuit board 111 and the main layer assembly component electronic element 112.
所述主層組立構件主要導電端子組114係嵌設於主層組立構件膠芯113。於本實施例中,主層組立構件主要導電端子組114係具有主層組立構件主要導電端子組接觸結構1141與主層組立構件主要導電端子組對接結構1142。主層組立構件主要導電端子組接觸結構1141係例如為進入主層組立構件膠芯容置空間1131的插接結構,而可以接觸(例如、插接接觸)主層組立構件電路板電路結構1111,以使主層組立構件主要導電端子組114電性連接主層組立構件電路板電路結構1111,而為主層組立構件電子元件112傳輸非接地訊號或接地訊號。如此,主層組立構件電子元件112可以避開電路母板直接設置於電連接器中,而不會再受到電路母板尺寸的影響,如此,可以藉由電連接器在小尺寸的電路母板上設置主層組立構件電子元件112,使電子設備能夠持續朝輕薄短小的方向發展。The main layer assembly component main conductive terminal set 114 is embedded in the main layer assembly component rubber core 113. In this embodiment, the main layer assembly component main conductive terminal set 114 has a main layer assembly component main conductive terminal set contact structure 1141 and a main layer assembly component main conductive terminal set docking structure 1142. The main layer component main conductive terminal group contact structure 1141 is, for example, a plug-in structure that enters the main layer component rubber core accommodating space 1131, and can contact (for example, plug-in contact) the main layer component circuit board circuit structure 1111, so that the main layer component main conductive terminal group 114 is electrically connected to the main layer component circuit board circuit structure 1111, and transmits non-ground signals or ground signals to the main layer component electronic components 112. In this way, the main layer assembly component electronic component 112 can be directly set in the electrical connector, avoiding the circuit motherboard, and will no longer be affected by the size of the circuit motherboard. In this way, the main layer assembly component electronic component 112 can be set on a small-sized circuit motherboard through an electrical connector, so that electronic equipment can continue to develop in the direction of being light, thin and short.
於本實施例中,所述主層組立構件次要導電端子組115係具有主層組立構件次要導電端子組接合結構1151與主層組立構件次要導電端子組對接結構1152,其中,主層組立構件次要導電端子組接合結構1151係提供接合主層傳輸線材組31,主層組立構件次要導電端子組對接結構1152係提供跟對接構件2的對接部位21對接。所述次層組立構件主要導電端子組141係具有次層組立構件主要導電端子組接合結構1411與次層組立構件主要導電端子組對接結構1412,其中,次層組立構件主要導電端子組接合結構1411係提供接合次層傳輸線材組32,次層組立構件主要導電端子組對接結構1412係提供跟對接構件2的對接部位21對接。In this embodiment, the main layer component secondary conductive terminal set 115 comprises a main layer component secondary conductive terminal set joint structure 1151 and a main layer component secondary conductive terminal set docking structure 1152, wherein the main layer component secondary conductive terminal set joint structure 1151 is provided for joining the main layer
另外,應說明的是,當主層組立構件主要導電端子組接觸結構1141插接接觸主層組立構件電路板電路結構1111時,主層組立構件主要導電端子組接觸結構1141係可以干涉(甚至、限制)主層組立構件電路板111的移動,而將主層組立構件電路板111定位於主層組立構件膠芯容置空間1131,除此之外,主層組立構件膠芯止擋結構1133係可以止擋主層組立構件電路板111的移動,藉以跟主層組立構件主要導電端子組接觸結構1141搭配,而確保主層組立構件電路板111定位於主層組立構件膠芯容置空間1131。In addition, it should be noted that when the main layer component main conductive terminal group contact structure 1141 is plugged into the main layer component circuit board circuit structure 1111, the main layer component main conductive terminal group contact structure 1141 can interfere with (or even restrict) the movement of the main layer component circuit board 111, thereby positioning the main layer component circuit board 111 at a certain position. The main layer component rubber core accommodating space 1131, in addition, the main layer component rubber core blocking structure 1133 can block the movement of the main layer component circuit board 111, so as to cooperate with the main layer component main conductive terminal group contact structure 1141 to ensure that the main layer component circuit board 111 is positioned in the main layer component rubber core accommodating space 1131.
所述主層組立構件膠芯引導結構1134係例如為軌道,可以嵌入主層組立構件主要導電端子組114,以提供引導主層組立構件主要導電端子組接觸結構1141移動,使主層組立構件主要導電端子組接觸結構1141可適應主層組立構件電路板電路結構1111而位於第一位置或第二位置。具體而言,如圖7所示的實施例,當主層組立構件主要導電端子組接觸結構1141位於第一位置時,主層組立構件主要導電端子組接觸結構1141係位於該主層組立構件膠芯止擋結構1133與該主層組立構件主要導電端子組對接結構1142之間。如圖8所示的實施例,當主層組立構件主要導電端子組接觸結構1141位於第二位置時,主層組立構件膠芯止擋結構1133係位於主層組立構件主要導電端子組接觸結構1141與主層組立構件主要導電端子組對接結構1142之間。The main layer assembly component rubber core guide structure 1134 is, for example, a track, which can be embedded in the main layer assembly component main conductive terminal group 114 to provide guidance for the movement of the main layer assembly component main conductive terminal group contact structure 1141, so that the main layer assembly component main conductive terminal group contact structure 1141 can adapt to the main layer assembly component circuit board circuit structure 1111 and be located at the first position or the second position. Specifically, as shown in the embodiment of FIG7, when the main layer assembly component main conductive terminal set contact structure 1141 is located at the first position, the main layer assembly component main conductive terminal set contact structure 1141 is located between the main layer assembly component rubber core stop structure 1133 and the main layer assembly component main conductive terminal set docking structure 1142. As shown in the embodiment of FIG8, when the main layer assembly component main conductive terminal set contact structure 1141 is located at the second position, the main layer assembly component rubber core stop structure 1133 is located between the main layer assembly component main conductive terminal set contact structure 1141 and the main layer assembly component main conductive terminal set docking structure 1142.
於本實施例中,主要殼體12係具有主要殼體容置空間121、主要殼體主層組立結構122與主要殼體次層組立結構124。主要殼體容置空間121係提供容置對接構件2的對接部位21。主要殼體主層組立結構122係提供組立主層組立構件11,使離開主層組立構件膠芯113的主層組立構件主要導電端子組對接結構1142與主層組立構件次要導電端子組接合結構1151分別進入主要殼體容置空間121,而跟對接構件2的對接部位21對接。主要殼體次層組立結構124係提供組立次層組立構件14,使次層組立構件主要導電端子組對接結構1412進入主要殼體容置空間121而提供跟對接構件2的對接部位21對接。主層組立構件主要導電端子組對接結構1142與該次層組立構件主要導電端子組對接結構1412係分別抵接該對接部位21相對的兩側,俾夾持定位該對接構件2的對接部位21。當主要殼體主層組立結構122組立主層組立構件11時,主層組立構件膠芯扣接結構1132係扣接主要殼體12,俾限制主層組立構件11相對主要殼體12移動的程度。In this embodiment, the
應說明的是,本申請組立式電連接器的前述實施例還可以省略部分構件,舉例而言,於本申請的實施例中,組立式電連接器可選擇包括:主層組立構件和主要殼體。It should be noted that the aforementioned embodiments of the assembled electrical connector of the present application may also omit some components. For example, in the embodiments of the present application, the assembled electrical connector may optionally include: a main layer assembled component and a main shell.
可選擇性地,所述主層組立構件係具有主層組立構件電路板、主層組立構件電子元件、主層組立構件膠芯與主層組立構件主要導電端子組,其中,主層組立構件電路板係具有主層組立構件電路板電路結構;主層組立構件電子元件係設置於主層組立構件電路板,並電性連接主層組立構件電路板電路結構;主層組立構件膠芯係具有主層組立構件膠芯容置空間,主層組立構件膠芯容置空間係提供容置主層組立構件電路板與主層組立構件電子元件;主層組立構件主要導電端子組係嵌設於主層組立構件膠芯,主層組立構件主要導電端子組係具有主層組立構件主要導電端子組接觸結構與主層組立構件主要導電端子組對接結構;主層組立構件主要導電端子組接觸結構係進入主層組立構件膠芯容置空間而接觸主層組立構件電路板電路結構,俾藉由主層組立構件電路板電路結構電性連接主層組立構件電子元件;主層組立構件主要導電端子組對接結構係離開主層組立構件膠芯。Optionally, the main layer assembly component comprises a main layer assembly component circuit board, a main layer assembly component electronic component, a main layer assembly component rubber core and a main layer assembly component main conductive terminal group, wherein the main layer assembly component circuit board has a main layer assembly component circuit board circuit structure; the main layer assembly component electronic component is arranged on the main layer assembly component circuit board and is electrically connected to the main layer assembly component circuit board circuit structure; the main layer assembly component rubber core has a main layer assembly component rubber core accommodating space, and the main layer assembly component rubber core accommodating space is provided to accommodate the main layer assembly component circuit board and the main layer assembly component electronic component. The main conductive terminal set of the main layer assembly component is embedded in the main layer assembly component rubber core, and the main conductive terminal set of the main layer assembly component has a main conductive terminal set contact structure and a main conductive terminal set docking structure of the main layer assembly component; the main conductive terminal set contact structure of the main layer assembly component enters the main layer assembly component rubber core accommodating space and contacts the circuit board circuit structure of the main layer assembly component, so as to electrically connect the main layer assembly component electronic components through the main layer assembly component circuit board circuit structure; the main conductive terminal set docking structure of the main layer assembly component is separated from the main layer assembly component rubber core.
可選擇性地,所述主要殼體係具有主要殼體容置空間與主要殼體主層組立結構,其中,主要殼體容置空間係提供容置對接構件的對接部位,主要殼體主層組立結構係提供組立主層組立構件,使主層組立構件主要導電端子組對接結構進入主要殼體容置空間而跟該對接構件的對接部位對接。Optionally, the main shell has a main shell accommodating space and a main shell main layer assembly structure, wherein the main shell accommodating space provides a docking position for accommodating docking components, and the main shell main layer assembly structure provides an assembly of main layer assembly components, so that the main conductive terminal group docking structure of the main layer assembly component enters the main shell accommodating space and docks with the docking position of the docking component.
如圖13至圖22所示的實施例,組立式電連接器1係包括:主層組立構件11、次層組立構件14、主要殼體12與次要殼體13。As shown in the embodiment of FIG. 13 to FIG. 22 , the assembled
所述主層組立構件11係具有主層組立構件電子元件112、主層組立構件膠芯113、主層組立構件主要導電端子組114與主層組立構件次要導電端子組115。The main layer assembly component 11 comprises a main layer assembly component electronic element 112 , a main layer assembly component core 113 , a main layer assembly component primary conductive terminal set 114 and a main layer assembly component secondary conductive terminal set 115 .
如圖19所示的實施例,所述主層組立構件膠芯113係具有主層組立構件膠芯容置空間1131,以藉由主層組立構件膠芯容置空間1131容置主層組立構件電子元件112,所述主層組立構件主要導電端子組114係嵌設於主層組立構件膠芯113,亦即,主層組立構件膠芯113可以對主層組立構件主要導電端子組114提供定位。於本實施例中,主層組立構件主要導電端子組114係具有主層組立構件主要導電端子組接觸結構1141與主層組立構件主要導電端子組對接結構1142。所述主層組立構件主要導電端子組接觸結構1141係進入主層組立構件膠芯容置空間1131而接觸主層組立構件電子元件112,俾令主層組立構件主要導電端子組114電性連接主層組立構件電子元件112,而傳輸非接地訊號或接地訊號。如此,主層組立構件電子元件112可以避開電路母板直接設置於電連接器中,而不會再受到電路母板尺寸的影響,如此,可以藉由電連接器在小尺寸的電路母板上設置主層組立構件電子元件112,使電子設備能夠持續朝輕薄短小的方向發展。As shown in the embodiment of FIG. 19 , the main layer assembly component core 113 has a main layer assembly component core accommodating space 1131, so as to accommodate the main layer assembly component electronic element 112 through the main layer assembly component core accommodating space 1131, and the main layer assembly component main conductive terminal set 114 is embedded in the main layer assembly component core 113, that is, the main layer assembly component core 113 can provide positioning for the main layer assembly component main conductive terminal set 114. In this embodiment, the main layer assembly component main conductive terminal set 114 has a main layer assembly component main conductive terminal set contact structure 1141 and a main layer assembly component main conductive terminal set docking structure 1142. The main layer assembly component main conductive terminal group contact structure 1141 enters the main layer assembly component core accommodating space 1131 and contacts the main layer assembly component electronic component 112, so that the main layer assembly component main conductive terminal group 114 is electrically connected to the main layer assembly component electronic component 112 to transmit a non-ground signal or a ground signal. In this way, the main layer assembly component electronic component 112 can be directly set in the electrical connector without the circuit motherboard, and will no longer be affected by the size of the circuit motherboard. In this way, the main layer assembly component electronic component 112 can be set on a small-sized circuit motherboard through the electrical connector, so that electronic equipment can continue to develop in the direction of being light, thin and short.
應說明的是,主層組立構件膠芯113係凹設有主層組立構件膠芯容置空間1131,使得主層組立構件膠芯容置空間1131係可以提供埋設主層組立構件電子元件112,讓主層組立構件電子元件112能夠以預期方式擺設,且可以對主層組立構件電子元件112提供適當保護。於本實施例中,由於主層組立構件電子元件112係埋設於主層組立構件膠芯容置空間1131,因此,可以藉由主層組立構件膠芯113限制主層組立構件電子元件112的設置位置,俾確保主層組立構件電子元件112能夠於適當位置接觸主層組立構件主要導電端子組接觸結構1141,且可以避免主層組立構件電子元件112凸出主層組立構件膠芯113,以使電連接器的尺寸能夠有效縮小,而讓設置本申請電連接器的電子設備能夠持續朝輕薄短小的方向發展。It should be noted that the main layer component rubber core 113 is recessed with a main layer component rubber core accommodating space 1131, so that the main layer component rubber core accommodating space 1131 can provide a space for burying the main layer component electronic components 112, so that the main layer component electronic components 112 can be arranged in an expected manner, and can provide appropriate protection for the main layer component electronic components 112. In the present embodiment, since the main layer component electronic component 112 is buried in the main layer component rubber core accommodating space 1131, the main layer component rubber core 113 can be used to limit the location of the main layer component electronic component 112, so as to ensure that the main layer component electronic component 112 can contact the main layer component main conductive terminal group contact structure 1141 at an appropriate position, and the main layer component electronic component 112 can be prevented from protruding from the main layer component rubber core 113, so that the size of the electrical connector can be effectively reduced, and the electronic equipment provided with the electrical connector of the present application can continue to develop in the direction of being light, thin and short.
於本實施例中,所述主層組立構件次要導電端子組115係具有主層組立構件次要導電端子組接合結構1151、主層組立構件次要導電端子組對接結構1152與主層組立構件次要導電端子組卡接結構1153。所述主層組立構件次要導電端子組接合結構1151係提供接合主層傳輸線材組31,而傳輸非接地訊號或接地訊號。所述主層組立構件次要導電端子組卡接結構1153係提供卡接主要殼體12,俾藉由主要殼體12對主層組立構件次要導電端子組115提供定位,而限制主層組立構件次要導電端子組115相對主要殼體12移動的程度,進而避免主層組立構件次要導電端子組115輕易脫離主要殼體12。In this embodiment, the main layer component secondary conductive terminal set 115 comprises a main layer component secondary conductive terminal set joint structure 1151, a main layer component secondary conductive terminal set docking structure 1152 and a main layer component secondary conductive terminal set clamping structure 1153. The main layer component secondary conductive terminal set joint structure 1151 is provided to join the main layer transmission wire set 31 to transmit a non-ground signal or a ground signal. The main layer assembly component secondary conductive terminal set clamping structure 1153 is provided to clamp the
如圖15至圖17所示的實施例,所述次層組立構件14係具有次層組立構件主要導電端子組141,所述次層組立構件主要導電端子組141係具有次層組立構件主要導電端子組接合結構1411、次層組立構件主要導電端子組對接結構1412與次層組立構件主要導電端子組卡接結構1413。所述次層組立構件主要導電端子組接合結構1411係提供接合次層傳輸線材組32,而傳輸非接地訊號或接地訊號。所述次層組立構件主要導電端子組卡接結構1413係提供卡接主要殼體12,俾藉由主要殼體12對次層組立構件主要導電端子組141提供定位,而限制次層組立構件主要導電端子組141相對主要殼體12移動的程度,進而避免次層組立構件主要導電端子組141輕易脫離主要殼體12。As shown in the embodiment of FIG. 15 to FIG. 17 , the sub-assembly structure 14 has a sub-assembly structure main conductive terminal set 141, and the sub-assembly structure main conductive terminal set 141 has a sub-assembly structure main conductive terminal set joint structure 1411, a sub-assembly structure main conductive terminal set butt joint structure 1412, and a sub-assembly structure main conductive terminal set clamping structure 1413. The sub-assembly structure main conductive terminal set joint structure 1411 is provided for jointing the sub-layer transmission wire set 32 to transmit a non-ground signal or a ground signal. The sub-assembly component main conductive terminal set clamping structure 1413 is provided to clamp the
於本實施例中,所述主要殼體12係具有主要殼體容置空間121、主要殼體主層組立結構122、主要殼體次層組立結構124與主要殼體裝配結構123。所述主要殼體容置空間121係提供容置對接構件2的對接部位21。所述主要殼體主層組立結構122係提供組立主層組立構件11,使所述主層組立構件主要導電端子組對接結構1142與所述主層組立構件次要導電端子組對接結構1152分別進入主要殼體容置空間121,以分別提供跟對接構件2的對接部位21對接,而傳輸非接地訊號或接地訊號。In this embodiment, the
所述主要殼體次層組立結構124係提供組立次層組立構件14,使次層組立構件主要導電端子組對接結構1412進入主要殼體容置空間121,以提供跟對接構件2的對接部位21對接,而傳輸非接地訊號或接地訊號。所述主要殼體裝配結構123係例如為螺接結構或如圖25與圖29所示的扣接結構而可提供裝配次要殼體13,具體而言,如圖21至圖22所示,次要殼體13係具有次要殼體裝配結構131,所述主要殼體裝配結構123係提供裝配次要殼體裝配結構131,使主要殼體12與次要殼體13結合成為一體。The main
應說明的是,組立式電連接器1係可以藉由主要殼體12組立主層組立構件11與次層組立構件14而構成,因此,在電連接器設計完成後,仍然可以藉由主層組立構件11與次層組立構件14的調整,而達成客製化調整電連接器的導電端子的數量與結構,以滿足電子設備的特殊需求及發展。It should be noted that the assembled
另外,於本實施例中,所述主層組立構件主要導電端子組對接結構1142與所述主層組立構件次要導電端子組對接結構1152係例如為彈性結構,而可以分別彈性抵接對接構件2的對接部位21的第一側,所述次層組立構件主要導電端子組對接結構1412係例如為彈性結構,而可以彈性抵接對接構件2的對接部位21的第二側,其中,所述第一側與所述第二側係為對接構件2的對接部位21相對的兩側,俾令主層組立構件主要導電端子組對接結構1142、主層組立構件次要導電端子組對接結構1152與次層組立構件主要導電端子組對接結構1412可以夾持定位對接構件2的對接部位21。亦即,所述主層組立構件主要導電端子組對接結構1142、所述主層組立構件次要導電端子組對接結構1152與所述次層組立構件主要導電端子組對接結構1412係分別抵接對接部位21相對的兩側,俾夾持定位對接構件2的對接部位21,進而避免對接構件2的對接部位21輕易脫離主要殼體容置空間121,以保證組立式電連接器1跟對接構件2的對接關係符合預期。In addition, in this embodiment, the main layer assembly component main conductive terminal group docking structure 1142 and the main layer assembly component secondary conductive terminal group docking structure 1152 are, for example, elastic structures, and can elastically abut the first side of the
所述次要殼體13係具有次要殼體主層止擋結構132。當主要殼體裝配結構123裝配次要殼體13時,所述次要殼體主層止擋結構132係對主層組立構件11提供止擋,俾止擋主層組立構件11相對主要殼體12移動的程度。The
另外,如圖26所示的實施例,主層組立構件主要導電端子組114具有多個第一主層組立構件主要導電端子1143、多個第二主層組立構件主要導電端子1144與主層組立構件橋接導電體1145,所述主層組立構件橋接導電體1145係避開各個第一主層組立構件主要導電端子1143,而提供橋接各個第二主層組立構件主要導電端子1144,使各個第二主層組立構件主要導電端子1144電性連接,而構成第二主層組立構件主要導電電路。In addition, as shown in the embodiment of FIG. 26 , the main layer component main conductive terminal group 114 has a plurality of first main layer component main conductive terminals 1143, a plurality of second main layer component main conductive terminals 1144 and a main layer component bridge conductor 1145. The main layer component bridge conductor 1145 avoids each first main layer component main conductive terminal 1143 and provides a bridge to each second main layer component main conductive terminal 1144, so that each second main layer component main conductive terminal 1144 is electrically connected to form a second main layer component main conductive circuit.
應說明的是,所述第二主層組立構件主要導電電路可以提供傳輸接地訊號,以符合電連接器的客製化的需求。因此,本申請毋須額外增設橋接器就能夠達成電連接器上部分導電端子彼此之間的電性連接,而讓設置本申請電連接器的電子設備能夠持續朝輕薄短小的方向發展。It should be noted that the main conductive circuit of the second main layer assembly component can provide a transmission ground signal to meet the customized needs of the electrical connector. Therefore, the present application can achieve electrical connection between some conductive terminals on the electrical connector without the need for additional bridges, and the electronic device equipped with the electrical connector of the present application can continue to develop in the direction of being thinner and smaller.
此外,於本實施例中,所述第二主層組立構件主要導電端子1144係鄰近多個第一主層組立構件主要導電端子1143之其中至少一者,俾可傳輸接地訊號以為鄰近的第一主層組立構件主要導電端子1143的訊號傳輸提供遮蔽,而減少鄰近的第一主層組立構件主要導電端子1143的訊號傳輸受到外界干擾(所述外界干擾係例如為EMI 電磁干擾或雜訊干擾)的程度,而滿足電連接器的訊號傳輸要求。In addition, in this embodiment, the second main layer component main conductive terminal 1144 is adjacent to at least one of the multiple first main layer component main conductive terminals 1143, so that it can transmit a ground signal to provide shielding for the signal transmission of the adjacent first main layer component main conductive terminal 1143, thereby reducing the degree of external interference (the external interference is, for example, EMI electromagnetic interference or noise interference) to the signal transmission of the adjacent first main layer component main conductive terminal 1143, thereby meeting the signal transmission requirements of the electrical connector.
應說明的是,本申請組立式電連接器的前述實施例還可以省略部分構件,舉例而言,於本申請的實施例中,組立式電連接器可選擇僅包括主層組立構件和主要殼體。It should be noted that the aforementioned embodiments of the assembled electrical connector of the present application may also omit some components. For example, in the embodiments of the present application, the assembled electrical connector may selectively include only the main layer assembled components and the main shell.
可選擇性地,所述主層組立構件,該主層組立構件係具有主層組立構件電子元件、主層組立構件膠芯與主層組立構件主要導電端子組,其中,主層組立構件膠芯係具有主層組立構件膠芯容置空間,主層組立構件膠芯容置空間係提供容置主層組立構件電子元件;主層組立構件主要導電端子組係嵌設於主層組立構件膠芯,主層組立構件主要導電端子組係具有主層組立構件主要導電端子組接觸結構與主層組立構件主要導電端子組對接結構;主層組立構件主要導電端子組接觸結構係進入主層組立構件膠芯容置空間而接觸主層組立構件電子元件;主層組立構件主要導電端子組對接結構係離開主層組立構件膠芯。Optionally, the main layer assembly component comprises a main layer assembly component electronic component, a main layer assembly component rubber core and a main layer assembly component main conductive terminal set, wherein the main layer assembly component rubber core comprises a main layer assembly component rubber core accommodating space, and the main layer assembly component rubber core accommodating space is provided for accommodating the main layer assembly component electronic component; the main layer assembly component main conductive terminal set is embedded in the main layer assembly component The main conductive terminal set of the main layer assembly component has a main conductive terminal set contact structure and a main conductive terminal set docking structure; the main conductive terminal set contact structure of the main layer assembly component enters the main layer assembly component rubber core accommodating space and contacts the main layer assembly component electronic components; the main conductive terminal set docking structure of the main layer assembly component leaves the main layer assembly component rubber core.
可選擇性地,主要殼體係具有主要殼體容置空間與主要殼體主層組立結構,其中,主要殼體容置空間係提供容置對接構件的對接部位,主要殼體主層組立結構係提供組立主層組立構件,使主層組立構件主要導電端子組對接結構進入主要殼體容置空間而跟對接構件的對接部位對接。Optionally, the main shell has a main shell accommodating space and a main shell main layer assembly structure, wherein the main shell accommodating space provides a docking position for accommodating docking components, and the main shell main layer assembly structure provides an assembly of main layer assembly components, so that the main conductive terminal group docking structure of the main layer assembly component enters the main shell accommodating space and docks with the docking position of the docking component.
綜上所述,本申請係提供一種組立式電連接器,所提供的組立式電連接器可以設置電子元件,使電子元件無須直接設置於電路母板,而不會再受到電路母板尺寸的影響,如此,可以藉由電連接器在小尺寸的電路母板上設置電子元件,使電子設備能夠持續朝輕薄短小的方向發展。另外,本申請的組立式電連接器係藉由組立多個組立構件而構成,因此,在本申請的組立式電連接器設計完成後,仍然可以藉由多個組立構件的調整,而達成客製化調整組立式電連接器的導電端子的數量與結構,以滿足電子設備的特殊需求及發展。In summary, the present application provides an assembled electrical connector. The assembled electrical connector provided can be used to set electronic components, so that the electronic components do not need to be directly set on the circuit motherboard and will no longer be affected by the size of the circuit motherboard. In this way, the electronic components can be set on a small-sized circuit motherboard through the electrical connector, so that electronic equipment can continue to develop in the direction of being thinner and smaller. In addition, the assembled electrical connector of the present application is constructed by assembling a plurality of assembled components. Therefore, after the design of the assembled electrical connector of the present application is completed, the number and structure of the conductive terminals of the assembled electrical connector can still be customized by adjusting the plurality of assembled components to meet the special needs and development of electronic equipment.
上述實施例僅例示性說明本申請之原理及功效,而非用於限制本申請。任何熟習此項技術之人士均可在不違背本申請之精神及範疇下,對上述實施例進行修飾與改變。因此,本申請之權利保護範圍,應如本請的申請專利範圍所列。The above embodiments are merely illustrative of the principles and effects of this application, and are not intended to limit this application. Anyone familiar with this technology may modify and alter the above embodiments without violating the spirit and scope of this application. Therefore, the scope of protection of this application should be as listed in the scope of the patent application of this application.
1:組立式電連接器 11:主層組立構件 111:主層組立構件電路板 1111:主層組立構件電路板電路結構 112:主層組立構件電子元件 113:主層組立構件膠芯 1131:主層組立構件膠芯容置空間 1132:主層組立構件膠芯扣接結構 1133:主層組立構件膠芯止擋結構 1134:主層組立構件膠芯引導結構 114:主層組立構件主要導電端子組 1141:主層組立構件主要導電端子組接觸結構 1142:主層組立構件主要導電端子組對接結構 1143:第一主層組立構件主要導電端子 1144:第二主層組立構件主要導電端子 1145:主層組立構件橋接導電體 115:主層組立構件次要導電端子組 1151:主層組立構件次要導電端子組接合結構 1152:主層組立構件次要導電端子組對接結構 1153:主層組立構件次要導電端子組卡接結構 12:主要殼體 121:主要殼體容置空間 122:主要殼體主層組立結構 123:主要殼體裝配結構 124:主要殼體次層組立結構 13:次要殼體 131:次要殼體裝配結構 132:次要殼體主層止擋結構 14:次層組立構件 141:次層組立構件主要導電端子組 1411:次層組立構件主要導電端子組接合結構 1412:次層組立構件主要導電端子組對接結構 1413:次層組立構件主要導電端子組卡接結構 2:對接構件 21:對接部位 31:主層傳輸線材組 32:次層傳輸線材組 1: Assembled electrical connector 11: Main layer assembly component 111: Main layer assembly component circuit board 1111: Main layer assembly component circuit board circuit structure 112: Main layer assembly component electronic components 113: Main layer assembly component rubber core 1131: Main layer assembly component rubber core accommodating space 1132: Main layer assembly component rubber core buckle structure 1133: Main layer assembly component rubber core stop structure 1134: Main layer assembly component rubber core guide structure 114: Main layer assembly component main conductive terminal group 1141: Main layer assembly component main conductive terminal group contact structure 1142: Main layer assembly component main conductive terminal group docking structure 1143: First main layer assembly component main conductive terminal 1144: Second main layer assembly component main conductive terminal 1145: Main layer assembly component bridge conductor 115: Main layer assembly component secondary conductive terminal group 1151: Main layer assembly component secondary conductive terminal group joint structure 1152: Main layer assembly component secondary conductive terminal group docking structure 1153: Main layer assembly component secondary conductive terminal group clamping structure 12: Main shell 121: Main shell accommodating space 122: Main shell main layer assembly structure 123: Main shell assembly structure 124: Main shell secondary assembly structure 13: Secondary shell 131: Secondary shell assembly structure 132: Secondary shell main layer stop structure 14: Secondary layer assembly component 141: Secondary layer assembly component main conductive terminal group 1411: Secondary layer assembly component main conductive terminal group joint structure 1412: Secondary layer assembly component main conductive terminal group docking structure 1413: Secondary layer assembly component main conductive terminal group clamping structure 2: Docking component 21: Docking position 31: Main layer transmission wire group 32: Secondary layer transmission wire group
本申請的上述及其他方面、特徵以及其他優點,將通過以下結合圖式的實施例描述得到更清楚地理解。The above and other aspects, features and other advantages of the present application will be more clearly understood through the following description of embodiments in conjunction with the drawings.
圖1,係本申請之組立式電連接器的實施例的構件立體示意圖。FIG. 1 is a schematic three-dimensional diagram of components of an embodiment of the assembled electrical connector of the present application.
圖2,係本申請之組立式電連接器的實施例的構件立體示意圖。FIG. 2 is a schematic three-dimensional diagram of components of an embodiment of the assembled electrical connector of the present application.
圖3,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 3 is a schematic diagram showing an exploded view of the components of an embodiment of the assembled electrical connector of the present application.
圖4,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 4 is a schematic diagram showing an exploded view of the components of an embodiment of the assembled electrical connector of the present application.
圖5,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 5 is a schematic diagram showing an exploded view of the components of an embodiment of the assembled electrical connector of the present application.
圖6,係本申請之組立式電連接器的實施例的構件前視示意圖。FIG. 6 is a schematic front view of the components of an embodiment of the assembled electrical connector of the present application.
圖7,係圖6所示之組立式電連接器沿線段AA截切的構件截面示意圖。FIG. 7 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 6 taken along line segment AA.
圖8,係圖6所示之組立式電連接器沿線段A’A’截切的構件截面示意圖。FIG8 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG6 taken along line segment A’A’.
圖9,係圖6所示之組立式電連接器沿線段EE截切的構件截面示意圖。FIG. 9 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 6 taken along line segment EE.
圖10,係圖6所示之組立式電連接器沿線段BB截切的構件截面示意圖。FIG. 10 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 6 taken along line BB.
圖11,係圖6所示之組立式電連接器沿線段CC截切的構件截面示意圖。FIG. 11 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 6 taken along line CC.
圖12,係圖6所示之組立式電連接器沿線段DD截切的構件截面示意圖。FIG. 12 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 6 taken along line segment DD.
圖13,係本申請之組立式電連接器的實施例的構件立體示意圖。FIG. 13 is a schematic three-dimensional diagram of components of an embodiment of the assembled electrical connector of the present application.
圖14,係本申請之組立式電連接器的實施例的構件立體示意圖。FIG. 14 is a schematic three-dimensional diagram of components of an embodiment of the assembled electrical connector of the present application.
圖15,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 15 is a schematic diagram showing an exploded view of the components of an embodiment of the assembled electrical connector of the present application.
圖16,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 16 is a schematic diagram showing an exploded view of the components of an embodiment of the assembled electrical connector of the present application.
圖17,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 17 is a schematic diagram showing an exploded view of the components of an embodiment of the assembled electrical connector of the present application.
圖18,係本申請之組立式電連接器的實施例的構件前視示意圖。FIG. 18 is a schematic front view of the components of an embodiment of the assembled electrical connector of the present application.
圖19,係圖18所示之組立式電連接器沿線段FF截切的構件截面示意圖。FIG. 19 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 18 cut along line segment FF.
圖20,係圖18所示之組立式電連接器沿線段GG截切的構件截面示意圖。FIG. 20 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 18 cut along line segment GG.
圖21,係圖18所示之組立式電連接器沿線段HH截切的構件截面示意圖。FIG. 21 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 18 taken along line segment HH.
圖22,係圖18所示之組立式電連接器沿線段II截切的構件截面示意圖。FIG. 22 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 18 taken along line segment II.
圖23,係本申請之組立式電連接器的實施例的構件立體示意圖。FIG. 23 is a three-dimensional schematic diagram of components of an embodiment of the assembled electrical connector of the present application.
圖24,係本申請之組立式電連接器的實施例的構件立體示意圖。FIG. 24 is a schematic three-dimensional diagram of components of an embodiment of the assembled electrical connector of the present application.
圖25,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 25 is a schematic diagram showing the exploded components of an embodiment of the assembled electrical connector of the present application.
圖26,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 26 is a schematic diagram showing the exploded components of an embodiment of the assembled electrical connector of the present application.
圖27,係本申請之組立式電連接器的實施例的構件前視示意圖。FIG. 27 is a schematic front view of the components of an embodiment of the assembled electrical connector of the present application.
圖28,係圖27所示之組立式電連接器沿線段JJ截切的構件截面示意圖。FIG. 28 is a schematic cross-sectional view of the components of the assembled electrical connector shown in FIG. 27 taken along line segment JJ.
圖29,係圖27所示之組立式電連接器沿線段KK截切的構件截面示意圖。FIG. 29 is a schematic diagram of a cross-section of the components of the assembled electrical connector shown in FIG. 27 cut along line segment KK.
圖30,係圖27所示之組立式電連接器沿線段LL截切的構件截面示意圖。FIG. 30 is a schematic diagram of a cross-section of the components of the assembled electrical connector shown in FIG. 27 cut along line segment LL.
圖31,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 31 is a schematic diagram showing the exploded components of an embodiment of the assembled electrical connector of the present application.
圖32,係本申請之組立式電連接器的實施例的構件分解示意圖。FIG. 32 is a schematic diagram showing the exploded components of an embodiment of the assembled electrical connector of the present application.
1:組立式電連接器 1: Assembled electrical connector
11:主層組立構件 11: Main layer assembly components
111:主層組立構件電路板 111: Main layer assembly component circuit board
1111:主層組立構件電路板電路結構 1111: Main layer assembly component circuit board circuit structure
112:主層組立構件電子元件 112: Main layer assembly components and electronic components
113:主層組立構件膠芯 113: Main layer assembly component rubber core
1133:主層組立構件膠芯止擋結構 1133: Main layer assembly component rubber core stop structure
1134:主層組立構件膠芯引導結構 1134: Main layer assembly component rubber core guide structure
114:主層組立構件主要導電端子組 114: Main conductive terminal group of main layer assembly components
1141:主層組立構件主要導電端子組接觸結構 1141: Main layer assembly component main conductive terminal assembly contact structure
1142:主層組立構件主要導電端子組對接結構 1142: The main conductive terminal group docking structure of the main layer assembly components
115:主層組立構件次要導電端子組 115: Main layer assembly component secondary conductive terminal assembly
1151:主層組立構件次要導電端子組接合結構 1151: Main layer assembly component secondary conductive terminal assembly joint structure
1152:主層組立構件次要導電端子組對接結構 1152: Main layer assembly component secondary conductive terminal assembly docking structure
1153:主層組立構件次要導電端子組卡接結構 1153: Main layer assembly component secondary conductive terminal assembly clamping structure
12:主要殼體 12: Main shell
122:主要殼體主層組立結構 122: Main shell main layer assembly structure
123:主要殼體裝配結構 123: Main shell assembly structure
124:主要殼體次層組立結構 124: Main shell sub-assembly structure
13:次要殼體 13: Secondary shell
131:次要殼體裝配結構 131: Secondary shell assembly structure
141:次層組立構件主要導電端子組 141: Main conductive terminal group of the secondary assembly components
1413:次層組立構件主要導電端子組卡接結構 1413: Second-layer assembly component main conductive terminal assembly clamping structure
2:對接構件 2: Docking components
21:對接部位 21: Docking point
31:主層傳輸線材組 31: Main layer transmission cable set
32:次層傳輸線材組 32: Secondary transmission cable set
Claims (15)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210465723.3A CN116264363A (en) | 2021-12-15 | 2022-04-26 | Assembly type electrical connector |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110147067 | 2021-12-15 | ||
| TW110147067 | 2021-12-15 |
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| Publication Number | Publication Date |
|---|---|
| TW202327181A TW202327181A (en) | 2023-07-01 |
| TWI849373B true TWI849373B (en) | 2024-07-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111100478A TWI849373B (en) | 2021-12-15 | 2022-01-05 | Assembling type electrical connector |
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| Country | Link |
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| CN (1) | CN116264361A (en) |
| TW (1) | TWI849373B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5125846A (en) * | 1991-07-25 | 1992-06-30 | Molex Incorporated | Input-output electrical connector |
| CN2466823Y (en) * | 2001-02-28 | 2001-12-19 | 宣得股份有限公司 | Light-emitting element pin receiving device of connector |
| TWM312054U (en) * | 2006-11-23 | 2007-05-11 | Ud Electronic Corp | Connector structure improvement |
-
2022
- 2022-01-05 TW TW111100478A patent/TWI849373B/en active
- 2022-04-26 CN CN202210451865.4A patent/CN116264361A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5125846A (en) * | 1991-07-25 | 1992-06-30 | Molex Incorporated | Input-output electrical connector |
| CN2466823Y (en) * | 2001-02-28 | 2001-12-19 | 宣得股份有限公司 | Light-emitting element pin receiving device of connector |
| TWM312054U (en) * | 2006-11-23 | 2007-05-11 | Ud Electronic Corp | Connector structure improvement |
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| Publication number | Publication date |
|---|---|
| TW202327181A (en) | 2023-07-01 |
| CN116264361A (en) | 2023-06-16 |
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