TWI845761B - Polyamide resin composition for sliding parts, and sliding parts - Google Patents
Polyamide resin composition for sliding parts, and sliding parts Download PDFInfo
- Publication number
- TWI845761B TWI845761B TW109131609A TW109131609A TWI845761B TW I845761 B TWI845761 B TW I845761B TW 109131609 A TW109131609 A TW 109131609A TW 109131609 A TW109131609 A TW 109131609A TW I845761 B TWI845761 B TW I845761B
- Authority
- TW
- Taiwan
- Prior art keywords
- polyamide resin
- resin composition
- sliding parts
- thermoplastic elastomer
- reactive functional
- Prior art date
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- 229920006122 polyamide resin Polymers 0.000 title claims abstract description 81
- 239000011342 resin composition Substances 0.000 title claims abstract description 44
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 52
- 125000000524 functional group Chemical group 0.000 claims abstract description 40
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 40
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 27
- 239000002245 particle Substances 0.000 claims abstract description 27
- 239000000314 lubricant Substances 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 19
- 239000007787 solid Substances 0.000 claims abstract description 18
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 229920006039 crystalline polyamide Polymers 0.000 claims abstract description 12
- 125000003368 amide group Chemical group 0.000 claims abstract description 11
- 239000006082 mold release agent Substances 0.000 claims abstract description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 22
- -1 fatty acid ester compound Chemical class 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 8
- 239000000194 fatty acid Substances 0.000 claims description 8
- 229930195729 fatty acid Natural products 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 150000001336 alkenes Chemical class 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000011737 fluorine Substances 0.000 claims description 7
- 229910052731 fluorine Inorganic materials 0.000 claims description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 230000009849 deactivation Effects 0.000 claims description 6
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 6
- 150000008064 anhydrides Chemical group 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims 1
- 229920006345 thermoplastic polyamide Polymers 0.000 claims 1
- 238000002156 mixing Methods 0.000 description 14
- 229920000728 polyester Polymers 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
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- 238000011156 evaluation Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 125000004018 acid anhydride group Chemical group 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
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- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 239000010687 lubricating oil Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 3
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- 230000009477 glass transition Effects 0.000 description 3
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- 239000002994 raw material Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 2
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- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N Caprolactam Natural products O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
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- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
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- 239000002585 base Substances 0.000 description 2
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- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 2
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- PEVRKKOYEFPFMN-UHFFFAOYSA-N 1,1,2,3,3,3-hexafluoroprop-1-ene;1,1,2,2-tetrafluoroethene Chemical group FC(F)=C(F)F.FC(F)=C(F)C(F)(F)F PEVRKKOYEFPFMN-UHFFFAOYSA-N 0.000 description 1
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
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- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
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- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L15/00—Compositions of rubber derivatives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本發明之目的為提供一種聚醯胺樹脂組成物,係成形性、耐熱安定性及韌性皆優良,且適合用於要求耐磨耗性、及滑動安定性優良之滑動零件的成形。本發明之滑動零件用聚醯胺樹脂組成物,含有結晶性聚醯胺樹脂(A)、具有能與該聚醯胺樹脂(A)之末端基及/或主鏈醯胺基反應之反應性官能基的改性聚烯烴樹脂(B)及/或具有能與該聚醯胺樹脂(A)之末端基及/或主鏈醯胺基反應之反應性官能基的熱塑性彈性體(C)、抗氧化劑(D)、脫模劑(E)、及固體潤滑劑(F);該改性聚烯烴樹脂(B)及/或該熱塑性彈性體(C)係於該聚醯胺樹脂(A)之基質中以粒徑5μm以下之微域分散。The object of the present invention is to provide a polyamide resin composition which has excellent formability, heat stability and toughness and is suitable for forming sliding parts requiring wear resistance and excellent sliding stability. The polyamide resin composition for sliding parts of the present invention comprises a crystalline polyamide resin (A), a modified polyolefin resin (B) having a reactive functional group capable of reacting with the terminal group and/or the main chain amide group of the polyamide resin (A) and/or a thermoplastic elastomer (C) having a reactive functional group capable of reacting with the terminal group and/or the main chain amide group of the polyamide resin (A), an antioxidant (D), a mold release agent (E), and a solid lubricant (F); the modified polyolefin resin (B) and/or the thermoplastic elastomer (C) are dispersed in a matrix of the polyamide resin (A) in microdomains with a particle size of less than 5 μm.
Description
本發明係關於聚醯胺樹脂組成物,詳細而言,係關於適合用於滑動零件之成形的聚醯胺樹脂組成物。The present invention relates to a polyamide resin composition, and more particularly to a polyamide resin composition suitable for forming sliding parts.
聚醯胺樹脂因為是結晶性而為滑動性優良的成形材料,為了獲得更優良之滑動特性,已知摻合二硫化鉬、石墨及氟樹脂等固體潤滑劑、各種潤滑油、或者矽油等液體潤滑劑等。Polyamide resin is a molding material with excellent sliding properties due to its crystalline properties. In order to obtain better sliding properties, it is known to be mixed with solid lubricants such as molybdenum disulfide, graphite and fluororesin, various lubricating oils, or liquid lubricants such as silicone oil.
此等滑動改良劑之中,固體潤滑劑需要大量地摻合,會有使為基礎之聚醯胺樹脂的靭性明顯地降低的缺點。液體潤滑劑雖能以相較較少的量賦予效果高的滑動性,但在大部分的情況,與為基礎之聚醯胺樹脂的相容性差,會有成形品之表面容易被液體潤滑劑污染而用途受到限制的缺點。Among these slip improvers, solid lubricants need to be blended in large quantities, which has the disadvantage of significantly reducing the toughness of the polyamide resin as the base. Liquid lubricants can provide high slip properties with a relatively small amount, but in most cases, they have poor compatibility with the polyamide resin as the base, and the surface of the molded product is easily contaminated by the liquid lubricant, which limits its use.
就改善如此之各種潤滑剤之摻合所導致之缺點的方法而言,有人提出將改性苯乙烯系聚合物與特定範圍之分子量之改性高密度聚乙烯摻合之方法(專利文獻1)、在使用高黏度之結晶性聚醯胺樹脂的同時,摻合改性聚烯烴樹脂之方法等(專利文獻2)。As methods for improving the disadvantages caused by the blending of various lubricants, some have proposed a method of blending a modified styrene polymer with a modified high-density polyethylene having a molecular weight within a specific range (Patent Document 1), a method of blending a modified polyolefin resin while using a high-viscosity crystalline polyamide resin, and the like (Patent Document 2).
藉由如此聚醯胺樹脂組成物,雖然可提供沒有如上述般之缺點而滑動特性優良的成形品,但近年來,因為成形品之輕量化、成形品形狀之複雜化等之趨勢,故要求成形性之改善、耐熱安定性之改善、及滑動特性之改善等更高水準的特性。 [先前技術文獻] [專利文獻]Although such a polyamide resin composition can provide a molded product with excellent sliding properties without the above-mentioned disadvantages, in recent years, due to the trend of lightweight molded products and complex shapes of molded products, higher-level properties such as improved moldability, improved heat resistance stability, and improved sliding properties are required. [Prior art literature] [Patent literature]
[專利文獻1]日本特開平8-157714號公報 [專利文獻2]WO2008/075699號公報[Patent document 1] Japanese Patent Publication No. 8-157714 [Patent document 2] WO2008/075699
[發明所欲解決之課題][Identify the problem you want to solve]
本發明之目的係提供一種聚醯胺樹脂組成物,成形性、耐熱安定性及韌性優良,且適合使用於要求耐磨耗性及滑動安定性優良之滑動零件的成形。 [解決課題之手段]The purpose of the present invention is to provide a polyamide resin composition having excellent moldability, heat stability and toughness, and suitable for use in the molding of sliding parts requiring excellent wear resistance and sliding stability. [Means for solving the problem]
本案發明者等,為了達成上述課題深入研究之結果,發現用以改善成形性、耐熱性而添加之抗氧化劑及脫模劑,會使滑動特性改善,更藉由添加固體潤滑劑至聚醯胺樹脂組成物維持韌性而改善滑動特性,而達成本發明。The inventors of this case, in order to achieve the above-mentioned results of in-depth research, found that the addition of antioxidants and mold release agents to improve moldability and heat resistance will improve the sliding properties, and further improved the sliding properties by adding solid lubricants to the polyamide resin composition to maintain toughness, thereby achieving this invention.
亦即,本發明係以下之構成。 [1] 一種滑動零件用聚醯胺樹脂組成物,含有結晶性聚醯胺樹脂(A)、具有能與該聚醯胺樹脂(A)之末端基及/或主鏈醯胺基反應之反應性官能基的改性聚烯烴樹脂(B)及/或具有能與該聚醯胺樹脂(A)之末端基及/或主鏈醯胺基反應之反應性官能基的熱塑性彈性體(C)、抗氧化劑(D)、脫模劑(E)、及固體潤滑劑(F); 該改性聚烯烴樹脂(B)及/或該熱塑性彈性體(C)係於該聚醯胺樹脂(A)之基質中以粒徑5μm以下之微域分散。 [2] 如[1]之滑動零件用聚醯胺樹脂組成物,其中,該抗氧化劑(D)及該脫模劑(E)係抑制該改性聚烯烴樹脂(B)與該熱塑性彈性體(C)所具有之該反應性官能基之失活的化合物。 [3] 如[1]或[2]之滑動零件用聚醯胺樹脂組成物,其中,該反應性官能基係酸酐基。 [4] 如[1]~[3]中任一項之滑動零件用聚醯胺樹脂組成物,其中,該抗氧化劑(D)係受阻酚系抗氧化劑。 [5] 如[1]~[4]中任一項之滑動零件用聚醯胺樹脂組成物,其中,該脫模劑(E)係高級脂肪酸酯系化合物。 [6] 如[1]~[5]中任一項之滑動零件用聚醯胺樹脂組成物,其中,該熱塑性彈性體(C)係苯乙烯系及/或烯烴系熱塑性彈性體。 [7] 如[1]~[6]中任一項之滑動零件用聚醯胺樹脂組成物,其中,該固體潤滑劑(F)係氟系潤滑劑及/或丙烯酸改性聚有機矽氧烷。 [8] 一種滑動零件,係從如[1]~[7]中任一項之滑動零件用聚醯胺樹脂組成物所獲得。 [發明之效果]That is, the present invention is constituted as follows. [1] A polyamide resin composition for sliding parts, comprising a crystalline polyamide resin (A), a modified polyolefin resin (B) having a reactive functional group capable of reacting with the terminal group and/or main chain amide group of the polyamide resin (A), and/or a modified polyolefin resin (B) having a reactive functional group capable of reacting with the terminal group and/or main chain amide group of the polyamide resin (A). A thermoplastic elastomer (C) having a reactive functional group that reacts with a chain amide group, an antioxidant (D), a mold release agent (E), and a solid lubricant (F); The modified polyolefin resin (B) and/or the thermoplastic elastomer (C) are dispersed in a micro-domain with a particle size of less than 5 μm in the matrix of the polyamide resin (A). [2] The polyamide resin composition for sliding parts as described in [1], wherein the antioxidant (D) and the mold release agent (E) are compounds that inhibit the deactivation of the reactive functional groups possessed by the modified polyolefin resin (B) and the thermoplastic elastomer (C). [3] A polyamide resin composition for sliding parts as described in [1] or [2], wherein the reactive functional group is an anhydride group. [4] A polyamide resin composition for sliding parts as described in any one of [1] to [3], wherein the antioxidant (D) is a hindered phenol antioxidant. [5] A polyamide resin composition for sliding parts as described in any one of [1] to [4], wherein the mold release agent (E) is a higher fatty acid ester compound. [6] A polyamide resin composition for sliding parts as described in any one of [1] to [5], wherein the thermoplastic elastomer (C) is a styrene-based and/or olefin-based thermoplastic elastomer. [7] A polyamide resin composition for sliding parts as described in any one of [1] to [6], wherein the solid lubricant (F) is a fluorine-based lubricant and/or an acrylic modified polyorganosiloxane. [8] A sliding part obtained from the polyamide resin composition for sliding parts as described in any one of [1] to [7]. [Effect of the invention]
本發明之聚醯胺樹脂組成物不僅成形性、耐熱安定性及韌性優良,且耐磨耗性改善,並且摩擦係數之變化少等滑動特性更進一步地改善。此外,本發明之聚醯胺樹脂組成物可兼具低磨耗性及低摩擦性。The polyamide resin composition of the present invention not only has excellent formability, heat stability and toughness, but also has improved wear resistance, and further improved sliding properties such as less variation in friction coefficient. In addition, the polyamide resin composition of the present invention can have both low wear and low friction.
以下,具體地說明本發明。本發明之滑動零件用聚醯胺樹脂組成物含有結晶性聚醯胺樹脂(A)、具有能與上述聚醯胺樹脂(A)之末端基及/或主鏈醯胺基反應之反應性官能基的改性聚烯烴樹脂(B)(以下,也稱為改性聚烯烴樹脂(B)。)及/或具有能與上述聚醯胺樹脂(A)之末端基及/或主鏈醯胺基反應之反應性官能基的熱塑性彈性體(C)(以下也稱為熱塑性彈性體(C)。)、抗氧化劑(D)、脫模劑(E)及固體潤滑劑(F)。The present invention is described in detail below. The polyamide resin composition for sliding parts of the present invention contains a crystalline polyamide resin (A), a modified polyolefin resin (B) having a reactive functional group capable of reacting with the terminal group and/or the main chain amide group of the polyamide resin (A) (hereinafter, also referred to as the modified polyolefin resin (B)) and/or a thermoplastic elastomer (C) having a reactive functional group capable of reacting with the terminal group and/or the main chain amide group of the polyamide resin (A) (hereinafter, also referred to as the thermoplastic elastomer (C)), an antioxidant (D), a mold release agent (E) and a solid lubricant (F).
各成分之摻合量係以令結晶性聚醯胺樹脂(A)、改性聚烯烴樹脂(B)、熱塑性彈性體(C)及固體潤滑劑(F)之全部樹脂成分之合計為100質量份時的質量份來表示。本發明之聚醯胺樹脂組成物中,摻合量係就這樣成為聚醯胺樹脂組成物中之含量。The blending amount of each component is expressed as the mass parts when the total mass parts of all resin components of crystalline polyamide resin (A), modified polyolefin resin (B), thermoplastic elastomer (C) and solid lubricant (F) are 100 mass parts. In the polyamide resin composition of the present invention, the blending amount is the content in the polyamide resin composition.
結晶性聚醯胺樹脂(A)只要是主鏈中具有醯胺鍵(-NHCO-)之結晶性的聚合物,便沒有特別之限定,可舉例如聚醯胺6(NY6)、聚醯胺66(NY66)、聚醯胺46(NY46)、聚醯胺11(NY11)、聚醯胺12(NY12)、聚醯胺610(NY610)、聚醯胺612(NY612)、聚己二醯間苯二甲胺(MXD6)、六亞甲基二胺-對苯二甲酸聚合物(6T)、六亞甲基二胺-對苯二甲酸及己二酸聚合物(66T)、六亞甲基二胺-對苯二甲酸及ε-己內醯胺共聚物(6T/6)、三甲基六亞甲基二胺-對苯二甲酸聚合物(TMD-T)、間苯二甲胺與己二酸及間苯二甲酸共聚物(MXD-6/I)、三六亞甲基二胺與對苯二甲酸及ε-己內醯胺共聚物(TMD-T/6)、二胺基二伸環己基甲烷(CA)與間苯二甲酸及月桂內醯胺共聚物等。此等可使用1種,亦可摻混2種以上使用。此等之中,宜使用聚醯胺6(NY6)、及聚醯胺66(NY66)。The crystalline polyamide resin (A) is not particularly limited as long as it is a crystalline polymer having an amide bond (-NHCO-) in the main chain, and examples thereof include polyamide 6 (NY6), polyamide 66 (NY66), polyamide 46 (NY46), polyamide 11 (NY11), polyamide 12 (NY12), polyamide 610 (NY610), polyamide 612 (NY612), poly(m-xylylene adipate) (MXD6), hexamethylenediamine-terephthalic acid polymer (6T) , hexamethylenediamine-terephthalic acid and adipic acid polymer (66T), hexamethylenediamine-terephthalic acid and ε-caprolactam copolymer (6T/6), trimethylhexamethylenediamine-terephthalic acid polymer (TMD-T), meta-phenylenediamine and adipic acid and isophthalic acid copolymer (MXD-6/I), tri-hexamethylenediamine and terephthalic acid and ε-caprolactam copolymer (TMD-T/6), diaminodicyclohexylmethane (CA) and isophthalic acid and lauryl lactam copolymer, etc. These can be used alone or in combination of two or more. Among these, polyamide 6 (NY6) and polyamide 66 (NY66) are preferably used.
結晶性聚醯胺樹脂(A)之相對黏度係沒有特別之限定,以96%硫酸溶液(聚醯胺樹脂濃度1g/dl,溫度25℃)測定,宜為2.0~5.0,更宜為2.0~3.5。The relative viscosity of the crystalline polyamide resin (A) is not particularly limited, but is preferably 2.0 to 5.0, more preferably 2.0 to 3.5, as measured with a 96% sulfuric acid solution (polyamide resin concentration 1 g/dl, temperature 25°C).
改性聚烯烴樹脂(B)係聚烯烴樹脂經改性而得者。就聚烯烴樹脂而言,可舉例如高密度聚乙烯、低密度聚乙烯、超高分子量聚乙烯、直鏈狀低密度聚乙烯、聚丙烯、聚(1-丁烯)、聚(4-甲基戊烯)等。此等可使用1種,亦可摻混2種以上使用。此等之中,宜使用高密度聚乙烯。The modified polyolefin resin (B) is a polyolefin resin obtained by modification. Examples of the polyolefin resin include high-density polyethylene, low-density polyethylene, ultra-high molecular weight polyethylene, linear low-density polyethylene, polypropylene, poly(1-butene), poly(4-methylpentene), etc. These can be used alone or in combination of two or more. Among these, high-density polyethylene is preferably used.
改性聚烯烴樹脂(B)中,為了改善與結晶性聚醯胺樹脂(A)之相容性,具有可與上述聚醯胺樹脂(A)之末端基(胺基或羧基)及/或主鏈醯胺基的反應性官能基。就該反應性官能基而言,可舉例如羧基、酸酐基、環氧基、㗁唑啉基、胺基、異氰酸酯基等。此等之中,考慮與該聚醯胺樹脂(A)之反應性高之觀點,宜為酸酐基。In order to improve the compatibility with the crystalline polyamide resin (A), the modified polyolefin resin (B) has a reactive functional group with the terminal group (amino group or carboxyl group) and/or the main chain amide group of the polyamide resin (A). Examples of the reactive functional group include carboxyl group, acid anhydride group, epoxy group, oxazoline group, amine group, isocyanate group, etc. Among these, an acid anhydride group is preferred from the viewpoint of high reactivity with the polyamide resin (A).
該反應性官能基之含量宜為於改性聚烯烴樹脂(B)中為0.05~8質量%,更宜為0.1~5質量%。上述具有反應性官能基之改性聚烯烴樹脂(B)之製造方法係沒有特別之限定,可列舉於製造聚烯烴樹脂之步驟中使具有上述反應性官能基之化合物反應之方法、將聚烯烴樹脂之丸粒與具有上述反應性官能基之化合物等混合,藉由擠製機等進行混練使其反應之方法等。The content of the reactive functional group in the modified polyolefin resin (B) is preferably 0.05 to 8% by mass, more preferably 0.1 to 5% by mass. The method for producing the modified polyolefin resin (B) having the reactive functional group is not particularly limited, and examples thereof include a method of reacting the compound having the reactive functional group in the step of producing the polyolefin resin, a method of mixing polyolefin resin pellets with the compound having the reactive functional group, and kneading the mixture by an extruder to cause the mixture to react, and the like.
改性聚烯烴樹脂(B)之摻合量只要是改性聚烯烴樹脂(B)能在該聚醯胺樹脂(A)之基質中以粒徑5μm以下之微域分散的量,便沒有特別之限定,通常相對於全部樹脂成分100質量%,係0.5~10質量%,宜為1~8質量%,更宜為2~6質量%。The amount of the modified polyolefin resin (B) blended is not particularly limited as long as it is an amount that can be dispersed in a microdomain with a particle size of less than 5 μm in the matrix of the polyamide resin (A). It is usually 0.5 to 10% by mass, preferably 1 to 8% by mass, and more preferably 2 to 6% by mass, relative to 100% by mass of the total resin component.
熱塑性彈性體(C)係沒有特別之限定,可舉例如苯乙烯系熱塑性彈性體、烯烴系熱塑性彈性體、聚醯胺系熱塑性彈性體、聚酯系熱塑性彈性體、聚胺甲酸酯系熱塑性彈性體等。此等可使用1種,亦可摻混2種以上來使用。The thermoplastic elastomer (C) is not particularly limited, and examples thereof include styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, polyamide-based thermoplastic elastomers, polyester-based thermoplastic elastomers, polyurethane-based thermoplastic elastomers, etc. These may be used alone or in combination of two or more.
苯乙烯系熱塑性彈性體係沒有特別之限定,可舉例如苯乙烯/丁二烯/苯乙烯嵌段共聚物(SBS)、為其氫化物之苯乙烯/乙烯-丁烯/苯乙烯嵌段共聚物(SEBS)苯乙烯/丁二烯共聚物(SBR)、為其氫化物之苯乙烯/乙烯/丁烯共聚物(HSBR)、苯乙烯/異丁烯/苯乙烯嵌段共聚物(SIS)、為其氫化物之苯乙烯/乙烯-丙烯/苯乙烯嵌段共聚物(SEPS)等。The styrene-based thermoplastic elastomer is not particularly limited, and examples thereof include styrene/butadiene/styrene block copolymer (SBS), styrene/ethylene-butylene/styrene block copolymer (SEBS) which is a hydrogenated product thereof, styrene/butadiene copolymer (SBR), styrene/ethylene/butylene copolymer (HSBR) which is a hydrogenated product thereof, styrene/isobutylene/styrene block copolymer (SIS), styrene/ethylene-propylene/styrene block copolymer (SEPS) which is a hydrogenated product thereof, and the like.
烯烴系熱塑性彈性體係沒有特別之限定,可舉例如乙烯/丙烯/二烯橡膠(EPDM)、乙烯/丙烯橡膠(EPR)、丁基橡膠(IIR)等橡膠、經動態交聯之烯烴系熱塑性彈性體、具柔軟性之乙烯系共聚物等。The olefin-based thermoplastic elastomer is not particularly limited, and examples thereof include rubbers such as ethylene/propylene/diene rubber (EPDM), ethylene/propylene rubber (EPR), butyl rubber (IIR), dynamically cross-linked olefin-based thermoplastic elastomers, and flexible ethylene-based copolymers.
聚醯胺系熱塑性彈性體係沒有特別之限定,可舉例如將結晶性且熔融溫度高的聚醯胺作為硬鏈段並將玻璃轉移溫度低之聚醚或聚酯作為軟鏈段的聚醚酯醯胺及聚酯醯胺等。The polyamide-based thermoplastic elastomer is not particularly limited, and examples thereof include polyetheresteramide and polyesteramide having a crystalline polyamide having a high melting point as a hard segment and a polyether or polyester having a low glass transition temperature as a soft segment.
聚酯系熱塑性彈性體係沒有特別之限定,可舉例如將結晶性且熔融溫度高之聚酯作為硬鏈段並將玻璃轉移溫度低之聚醚或聚酯作為軟鏈段之聚醚聚酯及聚酯聚酯之嵌段共聚物等。The polyester-based thermoplastic elastomer is not particularly limited, and examples thereof include block copolymers of polyether polyester and polyester polyester, which have crystalline polyester with a high melting point as a hard segment and polyether or polyester with a low glass transition temperature as a soft segment.
聚胺甲酸酯系熱塑性彈性體係沒有特別之限定,可舉例如將結晶性且熔融溫度高之聚酯作為硬鏈段並將玻璃轉移溫度低之聚醚或聚酯作為軟鏈段之聚醚聚胺甲酸酯及聚酯聚胺甲酸酯等。The polyurethane-based thermoplastic elastomer is not particularly limited, and examples thereof include polyether polyurethane and polyester polyurethane having a crystalline polyester having a high melting point as a hard segment and a polyether or polyester having a low glass transition temperature as a soft segment.
此等熱塑性彈性體中,考慮韌性改良效果及彈性模數之平衡的觀點,宜為苯乙烯系及/或烯烴系熱塑性彈性體,更宜為苯乙烯系熱塑性彈性體,進一步宜為SEBS。Among these thermoplastic elastomers, from the viewpoint of the balance between the toughness improvement effect and the elastic modulus, styrene-based and/or olefin-based thermoplastic elastomers are preferred, styrene-based thermoplastic elastomers are more preferred, and SEBS is further preferred.
熱塑性彈性體(C)中,為了改善與結晶性聚醯胺樹脂(A)之相容性,具有可與該聚醯胺樹脂(A)之末端基(胺基或羧基)及/或主鏈醯胺基反應的反應性官能基。就該反應性官能基而言,可舉例如羧基、酸酐基、環氧基、㗁唑啉基、胺基、異氰酸酯基等。此等之中,考慮與該聚醯胺樹脂(A)之反應性高的觀點,宜為酸酐基。In order to improve the compatibility with the crystalline polyamide resin (A), the thermoplastic elastomer (C) has a reactive functional group that can react with the terminal group (amino group or carboxyl group) and/or the main chain amide group of the polyamide resin (A). Examples of the reactive functional group include a carboxyl group, anhydride group, epoxy group, oxazoline group, amine group, isocyanate group, etc. Among these, anhydride group is preferred from the viewpoint of high reactivity with the polyamide resin (A).
該反應性官能基之含量,在熱塑性彈性體(C)中宜為0.05~8質量%,更宜為0.1~5質量%。具有上述反應性官能基之熱塑性彈性體(C)之製造方法係沒有特別之限定,可列舉於製造熱塑性彈性體之步驟中,使具有上述反應性官能基之化合物反應的方法、將熱塑性彈性體之丸粒與具有上述反應性官能基之化合物等混合並以擠製機等進行混練使其反應之方法等。The content of the reactive functional group in the thermoplastic elastomer (C) is preferably 0.05 to 8% by mass, more preferably 0.1 to 5% by mass. The method for producing the thermoplastic elastomer (C) having the reactive functional group is not particularly limited, and examples thereof include a method of reacting a compound having the reactive functional group in the step of producing the thermoplastic elastomer, a method of mixing pellets of the thermoplastic elastomer and the compound having the reactive functional group and kneading them with an extruder to react, and the like.
針對熱塑性彈性體(C)之摻合量,只要是熱塑性彈性體(C)於上述聚醯胺樹脂(A)之基質中能以粒徑5μm以下之微域分散的量便沒有特別之限定,通常,相對於全部樹脂成分100質量%,為0.1~10質量%,宜為1~7質量%。There is no particular limitation on the amount of the thermoplastic elastomer (C) blended as long as the thermoplastic elastomer (C) can be dispersed in a micro-domain with a particle size of less than 5 μm in the matrix of the polyamide resin (A). Generally, the amount is 0.1 to 10% by mass, preferably 1 to 7% by mass, relative to 100% by mass of the total resin component.
抗氧化劑(D)宜為抑制改性聚烯烴樹脂(B)與熱塑性彈性體(C)具有之該反應性官能基之失活的化合物。「抑制反應性官能基之失活」係指「不與反應性官能基反應」。亦即,抗氧化劑(D)係不會妨害改性聚烯烴樹脂(B)與熱塑性彈性體(C)微分散於該聚醯胺樹脂(A)之基質中之化合物。The antioxidant (D) is preferably a compound that inhibits the deactivation of the reactive functional groups possessed by the modified polyolefin resin (B) and the thermoplastic elastomer (C). "Inhibiting the deactivation of the reactive functional groups" means "not reacting with the reactive functional groups". That is, the antioxidant (D) is a compound that does not hinder the microdispersion of the modified polyolefin resin (B) and the thermoplastic elastomer (C) in the matrix of the polyamide resin (A).
抗氧化劑(D)係沒有特別之限定,例如在改性聚烯烴樹脂(B)與熱塑性彈性體(C)具有之上述反應性官能基為酸酐基之情況,可列舉不具有與酸酐基反應之官能基之受阻酚系抗氧化劑、硫系抗氧化劑、磷系抗氧化劑等有機系抗氧化劑、及熱安定劑等,宜為受阻酚系抗氧化劑。此等可使用1種,亦可摻混2種以上來使用。就與酸酐基反應之官能基而言,可舉例如胺基、羥基等。此外,受阻酚結構之酚性羥基不該當於與酸酐基反應之官能基。胺系抗氧化劑因為會與上述反應性官能基反應使其失活故較不理想。The antioxidant (D) is not particularly limited. For example, when the above-mentioned reactive functional groups of the modified polyolefin resin (B) and the thermoplastic elastomer (C) are acid anhydride groups, hindered phenol-based antioxidants, organic antioxidants such as sulfur-based antioxidants and phosphorus-based antioxidants, and thermal stabilizers that do not have functional groups that react with acid anhydride groups can be listed, and hindered phenol-based antioxidants are preferred. One of these can be used, or two or more can be mixed and used. As for the functional groups that react with acid anhydride groups, for example, amino groups and hydroxyl groups can be mentioned. In addition, the phenolic hydroxyl group of the hindered phenol structure should not be the functional group that reacts with the acid anhydride group. Amine-based antioxidants are not ideal because they react with the above-mentioned reactive functional groups to deactivate them.
抗氧化劑(D)之摻合量,係相對於全部樹脂成分100質量份,宜為0.01~1質量份,更宜為0.1~0.5質量份。抗氧化劑(D)之摻合量若為上述範圍內,不僅會貢獻於改善聚醯胺樹脂組成物之滑動性與韌性,且因應聚醯胺樹脂組成物之量的適當的處方量,可防止隨時間經過的氧化劣化。The blending amount of the antioxidant (D) is preferably 0.01 to 1 part by mass, more preferably 0.1 to 0.5 parts by mass, relative to 100 parts by mass of the total resin component. If the blending amount of the antioxidant (D) is within the above range, it will not only contribute to improving the lubricity and toughness of the polyamide resin composition, but also prevent oxidative degradation over time according to the appropriate amount of the polyamide resin composition.
脫模劑(E)宜為抑制改性聚烯烴樹脂(B)及熱塑性彈性體(C)具有之上述反應性官能基之失活的化合物。「抑制反應性官能基之失活」係指「不與反應性官能基反應」。亦即,脫模劑(E)係不會妨害改性聚烯烴樹脂(B)與熱塑性彈性體(C)微分散於該聚醯胺樹脂(A)之基質中之化合物。The release agent (E) is preferably a compound that inhibits the deactivation of the reactive functional groups possessed by the modified polyolefin resin (B) and the thermoplastic elastomer (C). "Inhibiting the deactivation of the reactive functional groups" means "not reacting with the reactive functional groups". That is, the release agent (E) is a compound that does not hinder the microdispersion of the modified polyolefin resin (B) and the thermoplastic elastomer (C) in the matrix of the polyamide resin (A).
脫模劑(E)係沒有特別之限定,可舉例如高級脂肪酸酯系化合物、醯胺系化合物、聚乙烯蠟、聚矽氧、聚環氧乙烷等。此等可使用1種,亦可摻混2種以上來使用。在改性聚烯烴樹脂(B)及熱塑性彈性體(C)具有之上述反應性官能基為酸酐基的情況,脫模劑(E)宜為高級脂肪酸酯系化合物。此外,高級脂肪酸係碳數超過10之脂肪酸,宜為碳數11~30之脂肪酸。金屬鹽化合物,因為會與上述反應性官能基反應使其失活故較不理想。The release agent (E) is not particularly limited, and examples thereof include higher fatty acid ester compounds, amide compounds, polyethylene wax, polysilicone, polyethylene oxide, and the like. One of these may be used alone, or two or more of these may be mixed and used. In the case where the reactive functional groups possessed by the modified polyolefin resin (B) and the thermoplastic elastomer (C) are anhydride groups, the release agent (E) is preferably a higher fatty acid ester compound. In addition, a higher fatty acid is a fatty acid having more than 10 carbon atoms, preferably a fatty acid having 11 to 30 carbon atoms. Metal salt compounds are less desirable because they react with the reactive functional groups and inactivate them.
脫模劑(E)之摻合量相對於全部樹脂成分100質量份,宜為0.05~1質量份,更宜為0.1~0.8質量份。脫模劑(E)之摻合量若為上述範圍內,不僅對於聚醯胺樹脂組成物之滑動性與韌性之改善有所貢獻,且可確保適當之脫模性。The amount of the release agent (E) blended is preferably 0.05 to 1 part by mass, more preferably 0.1 to 0.8 part by mass, relative to 100 parts by mass of the total resin component. If the amount of the release agent (E) blended is within the above range, it not only contributes to the improvement of the slip and toughness of the polyamide resin composition, but also ensures appropriate demolding properties.
抗氧化劑(D)與脫模劑(E)不會妨害改性聚烯烴樹脂(B)與熱塑性彈性體(C)微分散於該聚醯胺樹脂(A)之基質中。因此,改性聚烯烴樹脂(B)與熱塑性彈性體(C)會有效率地與上述聚醯胺樹脂(A)反應,於上述聚醯胺樹脂(A)之基質中以粒徑5μm以下之微域微分散。據認為其結果,改性聚烯烴樹脂(B)所致之改善滑動性之效果、與熱塑性彈性體(C)所致之韌性改善效果會有效地作用,而展現本發明之特有的效果。該粒徑宜為4μm以下,更宜為3.5μm以下。上述粒徑之下限值係沒有特別之限定,考慮流動性之觀點,宜為1μm以上,更宜為2μm以上。The antioxidant (D) and the mold release agent (E) do not interfere with the microdispersion of the modified polyolefin resin (B) and the thermoplastic elastomer (C) in the matrix of the polyamide resin (A). Therefore, the modified polyolefin resin (B) and the thermoplastic elastomer (C) react efficiently with the polyamide resin (A) and are microdispersed in the matrix of the polyamide resin (A) in a microdomain with a particle size of 5 μm or less. As a result, it is believed that the effect of improving the sliding property by the modified polyolefin resin (B) and the effect of improving the toughness by the thermoplastic elastomer (C) will work effectively, and the unique effect of the present invention will be exhibited. The particle size is preferably 4 μm or less, and more preferably 3.5 μm or less. The lower limit of the particle size is not particularly limited, but from the viewpoint of fluidity, it is preferably 1 μm or more, more preferably 2 μm or more.
固體潤滑劑(F)具有在貢獻於改善表面摩擦特性的同時,抑制韌性降低的效果,據認為藉由添加固體潤滑劑(F)至聚醯胺樹脂組成物中,而展現本發明之特有的效果。The solid lubricant (F) has the effect of contributing to improving the surface friction characteristics while suppressing the reduction of toughness. It is considered that the unique effect of the present invention is exhibited by adding the solid lubricant (F) to the polyamide resin composition.
固體潤滑劑(F)係沒有特別之限定,宜為氟系潤滑劑、及丙烯酸改性聚有機矽氧烷。此等可使用1種,亦可摻混2種以上來使用。The solid lubricant (F) is not particularly limited, but is preferably a fluorine-based lubricant or an acrylic modified polyorganosiloxane, either of which may be used alone or in combination of two or more.
就上述氟系潤滑劑而言,可舉例如四氟乙烯樹脂(PTFE)、全氟-烷氧基樹脂(PFA)、四氟乙烯-六氟丙烯共聚物樹脂(FEP)、四氟乙烯-乙烯共聚物樹脂(ETFE)、偏二氟乙烯樹脂(PVDF)、三氟氯乙烯樹脂(PCTFE)等。此等之中,考慮耐熱性、滑動特性等觀點,宜為PTFE。As for the above-mentioned fluorine-based lubricant, for example, tetrafluoroethylene resin (PTFE), perfluoro-alkoxy resin (PFA), tetrafluoroethylene-hexafluoropropylene copolymer resin (FEP), tetrafluoroethylene-ethylene copolymer resin (ETFE), vinylidene fluoride resin (PVDF), trifluorochloroethylene resin (PCTFE), etc. Among them, PTFE is preferred from the viewpoints of heat resistance, sliding properties, etc.
上述氟系潤滑劑之平均粒徑宜為1~200μm,更宜為7~100μm,進一步宜為10~50μm。若平均粒徑超過200μm,則在上述聚醯胺樹脂(A)之基質中之上述氟系潤滑劑之分散性變差,作為成形體之機械強度變得容易降低。另一方面,若平均粒徑未達1μm,則上述氟系潤滑劑之粒子變得容易產生二次凝聚,變得難以均勻地混合,作為成形體之機械強度變得容易降低。The average particle size of the fluorine-based lubricant is preferably 1 to 200 μm, more preferably 7 to 100 μm, and further preferably 10 to 50 μm. If the average particle size exceeds 200 μm, the dispersibility of the fluorine-based lubricant in the matrix of the polyamide resin (A) deteriorates, and the mechanical strength of the molded body tends to decrease. On the other hand, if the average particle size is less than 1 μm, the particles of the fluorine-based lubricant tend to produce secondary aggregation, and it becomes difficult to mix uniformly, and the mechanical strength of the molded body tends to decrease.
就上述丙烯酸改性聚有機矽氧烷而言,可舉例如對於聚有機矽氧烷至少接枝共聚(甲基)丙烯酸酯而得者。尤其宜為將(甲基)丙烯酸酯70質量%以上與其他可共聚之單體30質量%以下的混合物以質量比5/95~95/5之比例對於聚有機矽氧烷接枝共聚而得者。The acrylic modified polyorganosiloxane may be obtained by graft copolymerizing at least (meth)acrylate to polyorganosiloxane, and preferably by graft copolymerizing a mixture of 70% by mass or more of (meth)acrylate and 30% by mass or less of other copolymerizable monomers to polyorganosiloxane at a mass ratio of 5/95 to 95/5.
就上述(甲基)丙烯酸酯而言,可舉例如丙烯酸甲酯、丙烯酸乙酯、丙烯酸異丙酯、丙烯酸正丙酯、丙烯酸正丁酯、丙烯酸異丁酯、丙烯酸2-乙基己酯、丙烯酸異辛酯、丙烯酸正辛酯、丙烯酸2-羥基乙酯、丙烯酸2-甲氧基乙酯等丙烯酸酯;甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸異丙酯、甲基丙烯酸正丙酯、甲基丙烯酸正丁酯、甲基丙烯酸異丁酯、甲基丙烯酸正己酯、甲基丙烯酸2-乙基己酯、甲基丙烯酸正月桂酯、甲基丙烯酸2-羥基乙酯、甲基丙烯酸2-乙氧基乙酯等甲基丙烯酸酯等。此等可使用1種,亦可摻混2種以上使用。此等之中,宜至少使用甲基丙烯酸甲酯作為一成分。As for the above-mentioned (meth)acrylate, for example, there can be mentioned acrylates such as methyl acrylate, ethyl acrylate, isopropyl acrylate, n-propyl acrylate, n-butyl acrylate, isobutyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, n-octyl acrylate, 2-hydroxyethyl acrylate, and 2-methoxyethyl acrylate; and methacrylates such as methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, n-propyl methacrylate, n-butyl methacrylate, isobutyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, n-lauryl methacrylate, 2-hydroxyethyl methacrylate, and 2-ethoxyethyl methacrylate. These can be used alone or in combination of two or more. Among these, it is preferable to use at least methyl methacrylate as one component.
就上述其他可共聚之單體而言,可舉例如苯乙烯、乙烯基甲苯、α-甲基苯乙烯等苯乙烯系化合物;丙烯腈、甲基丙烯腈等不飽和腈;氯乙烯、偏二氯乙烯等鹵素化烯烴;乙酸乙烯酯、丙酸乙烯酯等乙烯酯;丙烯醯胺、甲基丙烯醯胺、N-羥甲基丙烯醯胺等不飽和醯胺;丙烯酸、甲基丙烯酸、馬來酸酐等不飽和羧酸等之具有1個雙鍵之單體;乙二醇二甲基丙烯酸酯、丙二醇二甲基丙烯酸酯、1,4-丁二醇二甲基丙烯酸酯、甲基丙烯酸烯丙酯、三烯丙基氰尿酸酯、三烯丙基異氰尿酸酯等多不飽和單體等。此等可使用1種,亦可摻混2種以上使用。As for the above-mentioned other copolymerizable monomers, there can be mentioned styrene compounds such as styrene, vinyl toluene, α-methyl styrene; unsaturated nitriles such as acrylonitrile and methacrylonitrile; halogenated olefins such as vinyl chloride and vinylidene chloride; vinyl esters such as vinyl acetate and vinyl propionate; unsaturated amides such as acrylamide, methacrylamide, and N-hydroxymethylacrylamide; monomers having one double bond such as unsaturated carboxylic acids such as acrylic acid, methacrylic acid, and maleic anhydride; polyunsaturated monomers such as ethylene glycol dimethacrylate, propylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, allyl methacrylate, triallyl cyanurate, and triallyl isocyanurate, etc. These monomers can be used alone or in combination of two or more.
上述丙烯酸改性聚有機矽氧烷之平均粒徑宜為1~500μm,更宜為10~400μm,進一步宜為30~350μm。若平均粒徑超過500μm,則在上述聚醯胺樹脂(A)之基質中之上述丙烯酸改性聚有機矽氧烷之分散性變差,作為成形體之機械強度變得容易降低。另一方面,若平均粒徑未達1μm,則上述丙烯酸改性聚有機矽氧烷之粒子容易產生二次凝聚,變得難以均勻地混合,作為成形體之機械強度變得容易降低。The average particle size of the acrylic modified polyorganosiloxane is preferably 1 to 500 μm, more preferably 10 to 400 μm, and further preferably 30 to 350 μm. If the average particle size exceeds 500 μm, the dispersibility of the acrylic modified polyorganosiloxane in the matrix of the polyamide resin (A) becomes poor, and the mechanical strength of the molded body tends to decrease. On the other hand, if the average particle size is less than 1 μm, the particles of the acrylic modified polyorganosiloxane tend to produce secondary aggregation, becoming difficult to mix uniformly, and the mechanical strength of the molded body tends to decrease.
固體潤滑劑(F)之摻合量,宜為相對於全部樹脂成分100質量%,為0.1~20質量%,更宜為0.5~10質量%。若為0.1質量%以上,則有效地改善耐磨耗性、滑動安定性、及表面潤滑性。另一方面,若為20質量%以下,則聚醯胺樹脂組成物之機械物性有效地改善,尤其是韌性有效地改善。The amount of the solid lubricant (F) blended is preferably 0.1-20% by mass, more preferably 0.5-10% by mass, relative to 100% by mass of the total resin component. If it is 0.1% by mass or more, wear resistance, sliding stability, and surface lubricity are effectively improved. On the other hand, if it is 20% by mass or less, the mechanical properties of the polyamide resin composition are effectively improved, especially the toughness is effectively improved.
本發明之聚醯胺樹脂組成物中,只要是不妨害改性聚烯烴樹脂(B)及熱塑性彈性體(C)微分散於上述聚醯胺樹脂(A)之基質中的範圍,在上述(A)~(F)成分之外,亦可摻合以往聚醯胺樹脂組成物中摻合之為耐候性改良劑之碳黑、銅氧化物、鹼金屬鹵化物、光或熱安定劑、結晶成核劑、抗靜電劑、顏料、染料、偶聯劑等添加劑。另外,藉由在不損害聚醯胺樹脂組成物之韌性的範圍內摻合填充材,可大幅地改善成形品之強度、剛性。作為填充材,可舉例如玻璃纖維、碳纖維、金屬纖維、聚芳醯胺(aramid)纖維、石綿、鈦酸鉀晶鬚、矽灰石、玻璃片、玻璃珠、滑石、雲母、黏土、碳酸鈣、硫酸鋇、氧化鈦、氧化鋁等。本發明之聚醯胺樹脂組成物中,上述(A)~(F)成分之合計宜占70質量%以上,更宜占80質量%以上,進一步宜占90質量%以上。In the polyamide resin composition of the present invention, in addition to the above-mentioned components (A) to (F), additives such as carbon black, copper oxide, alkali metal halide, light or heat stabilizer, crystal nucleating agent, antistatic agent, pigment, dye, coupling agent, etc., which are conventionally blended in polyamide resin compositions as weather resistance improvers, can be blended as long as they do not interfere with the fine dispersion of the modified polyolefin resin (B) and the thermoplastic elastomer (C) in the matrix of the above-mentioned polyamide resin (A). In addition, by blending fillers within a range that does not impair the toughness of the polyamide resin composition, the strength and rigidity of the molded product can be greatly improved. Examples of fillers include glass fiber, carbon fiber, metal fiber, aramid fiber, sponge, potassium titanate whiskers, wollastonite, glass flakes, glass beads, talc, mica, clay, calcium carbonate, barium sulfate, titanium oxide, aluminum oxide, etc. In the polyamide resin composition of the present invention, the total amount of the above-mentioned components (A) to (F) preferably accounts for 70% by mass or more, more preferably 80% by mass or more, and further preferably 90% by mass or more.
本發明之聚醯胺樹脂組成物,例如藉由將各成分使用單軸擠製機、二軸擠製機、加壓揑合機等混練裝置進行混練來製造。混練裝置宜為二軸擠製機。就一實施態樣而言,混合上述(A)~(F)成分、及取決於用途之顏料等,投入至二軸擠製機。藉由於二軸擠製機均勻地混練可製造滑動性優良的聚醯胺樹脂組成物。二軸擠製機之混練溫度宜為220~300℃,混練時間宜為約2~15分鐘。The polyamide resin composition of the present invention can be produced by kneading the components using a kneading device such as a single-screw extruder, a two-screw extruder, a pressure extruder, etc. The kneading device is preferably a two-screw extruder. In one embodiment, the above-mentioned (A) to (F) components and pigments depending on the application are mixed and put into a two-screw extruder. A polyamide resin composition with excellent slip can be produced by uniformly kneading in a two-screw extruder. The kneading temperature of the two-screw extruder is preferably 220 to 300°C, and the kneading time is preferably about 2 to 15 minutes.
本發明之聚醯胺樹脂組成物可廣泛地利用來作為要求滑動性之電氣電子零件、汽車零件、建築零件、及工業用零件等滑動零件之原料。就滑動零件而言,具體來說可列舉軸承、齒輪、車門限位器(door checker)、鏈導軌零件等。 [實施例]The polyamide resin composition of the present invention can be widely used as a raw material for sliding parts such as electrical and electronic parts, automobile parts, construction parts, and industrial parts that require sliding properties. Specifically, the sliding parts include bearings, gears, door checkers, chain guide parts, etc. [Example]
以下,使用實施例來具體地說明本發明,但本發明並不限定於此等實施例。此外,以下之各例中獲得之聚醯胺樹脂成形品之各物性係基於下述試驗方法來測定。Hereinafter, the present invention will be specifically described using examples, but the present invention is not limited to these examples. In addition, the various physical properties of the polyamide resin molded products obtained in the following examples are measured based on the following test methods.
實施例及比較例中使用之原材料係如同下述。 作為結晶性聚醯胺樹脂(A),使用(A1)~(A3)。 (A1)聚醯胺66(RV=3.4):EPR34W(上海神馬塑料科技術有限公司製)、熔點265℃ (A2)聚醯胺66(RV=2.8):Vydyne 21FSR(Ascend公司製)、熔點265℃ (A3)聚醯胺66(RV=2.4):EPR24(上海神馬塑料科技術有限公司製)、熔點265℃The raw materials used in the examples and comparative examples are as follows. As crystalline polyamide resin (A), (A1) to (A3) are used. (A1) Polyamide 66 (RV = 3.4): EPR34W (manufactured by Shanghai Shenma Plastic Technology Co., Ltd.), melting point 265°C (A2) Polyamide 66 (RV = 2.8): Vydyne 21FSR (manufactured by Ascend), melting point 265°C (A3) Polyamide 66 (RV = 2.4): EPR24 (manufactured by Shanghai Shenma Plastic Technology Co., Ltd.), melting point 265°C
作為改性聚烯烴樹脂(B),使用(B1)及(B2)。 (B1)馬來酸酐改性聚乙烯:MODIC DH0200(三菱化學(股)製) (B2)未改性聚乙烯:hi-zex 6203B(Prime Polymer Co., Ltd.製)As the modified polyolefin resin (B), (B1) and (B2) were used. (B1) Maleic anhydride-modified polyethylene: MODIC DH0200 (manufactured by Mitsubishi Chemical Co., Ltd.) (B2) Unmodified polyethylene: hi-zex 6203B (manufactured by Prime Polymer Co., Ltd.)
作為熱塑性彈性體(C),使用(C1)及(C2)。 (C1)馬來酸酐改性SEBS:Tuftec M-1943(旭化成(股)公司製) (C2)未改性SEBS:Tuftec H-1221(旭化成(股)公司製)As the thermoplastic elastomer (C), (C1) and (C2) were used. (C1) Maleic anhydride modified SEBS: Tuftec M-1943 (manufactured by Asahi Kasei Corporation) (C2) Unmodified SEBS: Tuftec H-1221 (manufactured by Asahi Kasei Corporation)
作為抗氧化劑(D),使用(D1)及(D2)。 (D1)受阻酚系抗氧化劑:三乙二醇-雙-3-(3-第三丁基-4-羥基-5-甲基苯基)丙酸酯(SONGWON公司製,SONGNOX2450) (D2)胺系抗氧化劑:NONFLEX DCD(精工化學(股)公司製)As the antioxidant (D), (D1) and (D2) were used. (D1) Hindered phenol antioxidant: triethylene glycol-bis-3-(3-tert-butyl-4-hydroxy-5-methylphenyl) propionate (SONGNOX2450, manufactured by SONGWON) (D2) Amine antioxidant: NONFLEX DCD (manufactured by Seiko Chemical Co., Ltd.)
作為脫模劑(E),使用(E1)~(E3)。 (E1)脂肪族酯:Ricolb WE-40(Clariant Japan K.K.製) (E2)硬脂酸鎂:N.P.1500-S(淡南化學工業(股)公司製) (E3)二十八酸鈣:Licomont Cav102(Clariant Japan K.K.製)As the mold release agent (E), (E1) to (E3) were used. (E1) Aliphatic ester: Ricolb WE-40 (manufactured by Clariant Japan K.K.) (E2) Magnesium stearate: N.P.1500-S (manufactured by Tamnan Chemical Industry Co., Ltd.) (E3) Calcium octadecanoate: Licomont Cav102 (manufactured by Clariant Japan K.K.)
作為固體潤滑劑(F),使用(F1)~(F3)。 (F1)PTFE:KT-300M(喜多村(股)公司製)、平均粒徑15μm (F2)丙烯酸改性聚有機矽氧烷:CHALINE R-170S(日信化學工業(股)公司製)、平均粒徑30μm (F3)聚矽氧粉末:KMP-590(Shin-Etsu Silicone Co. Ltd.製)、平均粒徑2μm 此外,平均粒徑係藉由以下方法測定。藉由微分干涉顯微鏡觀察各固體潤滑劑,拍攝照片。任意選擇該顯微鏡照片中之粒子中的10個粒子,測定選擇之粒子的長徑,將其平均值作為平均粒徑。As solid lubricants (F), (F1) to (F3) were used. (F1) PTFE: KT-300M (produced by Kitamura Co., Ltd.), average particle size 15μm (F2) Acrylic modified polyorganosiloxane: CHALINE R-170S (produced by Nissin Chemical Industry Co., Ltd.), average particle size 30μm (F3) Polysilicone powder: KMP-590 (produced by Shin-Etsu Silicone Co., Ltd.), average particle size 2μm In addition, the average particle size was measured by the following method. Each solid lubricant was observed by a differential interference microscope and photographed. Ten particles in the microscopic photograph were randomly selected, the length diameters of the selected particles were measured, and the average value thereof was taken as the average particle size.
[實施例1~13、比較例1~15] 評價樣本之製造係以表1及表2所示之聚醯胺樹脂組成物之摻合比例稱量各原料,以滾筒混合後,投入至二軸擠製機。二軸擠製機之設定溫度係250℃~300℃,混練時間設為5~10分鐘。使用獲得之丸粒,藉由射出成形機成形各種評價樣本。射出成形機之缸筒溫度設為250℃~290℃,模具溫度設為80℃。[Examples 1 to 13, Comparative Examples 1 to 15] The evaluation samples were prepared by weighing the raw materials according to the blending ratio of the polyamide resin composition shown in Tables 1 and 2, mixing them by rollers, and then feeding them into a two-axis extruder. The temperature of the two-axis extruder was set at 250℃ to 300℃, and the mixing time was set at 5 to 10 minutes. The obtained pellets were used to form various evaluation samples by an injection molding machine. The cylinder temperature of the injection molding machine was set at 250℃ to 290℃, and the mold temperature was set at 80℃.
各種評價、測定方法係如同下述。評價、測定結果表示於表1及表2中。 1.聚醯胺樹脂之相對黏度(96%硫酸溶液法) 使用烏氏黏度管,於25℃以96質量%硫酸溶液,且聚醯胺樹脂濃度1g/dl進行測定。The various evaluation and measurement methods are as follows. The evaluation and measurement results are shown in Tables 1 and 2. 1. Relative viscosity of polyamide resin (96% sulfuric acid solution method) Using an Oobleck viscometer, the measurement was performed at 25°C with 96 mass% sulfuric acid solution and a polyamide resin concentration of 1g/dl.
2.聚醯胺樹脂之熔點 使用差示掃描量熱計(Seiko Instruments Inc.,EXSTAR 6000),以升溫速度20℃/分鐘進行測定,求得吸熱峰部溫度。2. Melting point of polyamide resin A differential scanning calorimeter (Seiko Instruments Inc., EXSTAR 6000) was used to measure the temperature at a heating rate of 20°C/min to obtain the endothermic peak temperature.
3.拉伸強度、拉伸彈性模數、拉伸伸度 依循ISO178測定。3.Tensile strength, tensile modulus, and tensile elongation Measured in accordance with ISO178.
4.耐衝擊性 依循ISO179-1測定。4. Impact resistance Measured in accordance with ISO179-1.
5.滑動性 使用推力式磨耗試驗機,使聚甲醛(POM)製之圓筒成形品接觸聚醯胺樹脂平板,且該聚醯胺樹脂平板係於表面平均地塗布了一定量的將摻合有二硫化鉬之滑脂、矽砂與火山灰以質量比率成為1:1:1之方式予以混合所製得的粉塵,以30分鐘、負荷荷重30kgf/cm2 、速度40mm/sec之條件連續地滑動。之後,從磨耗前後之重量差與摩擦試驗時之收斂後之磨耗荷重之值算出動摩擦係數。5. Sliding property Using a thrust wear tester, a cylindrical molded product made of polyoxymethylene (POM) was brought into contact with a polyamide resin plate on which a certain amount of dust prepared by mixing grease mixed with molybdenum disulfide, silica sand and volcanic ash in a mass ratio of 1:1:1 was evenly applied. The plate was continuously slid for 30 minutes at a load of 30kgf/ cm2 and a speed of 40mm/sec. The dynamic friction coefficient was then calculated from the weight difference before and after the wear and the wear load after convergence during the friction test.
6.粒徑 切出成形之評價樣本,使用裝設有玻璃刀之切片機製作剖面。以微分干涉顯微鏡觀察製得的剖面,拍攝相片。在該顯微鏡相片中之改性聚烯烴樹脂(B)及熱塑性彈性體(C)之微域之中,任意選擇分散徑最大的10個微域,測定選擇之微域的長徑,將其平均值作為粒徑。6. Particle size Cut out the evaluation sample after forming, and make a cross section using a microtome equipped with a glass knife. Observe the obtained cross section with a differential interference microscope and take a photo. Among the microdomains of the modified polyolefin resin (B) and the thermoplastic elastomer (C) in the microscope photo, randomly select the 10 microdomains with the largest dispersion diameter, measure the length of the selected microdomains, and take the average value as the particle size.
[表1] [Table 1]
[表2] [Table 2]
實施例1~13可獲得夏比衝擊強度為6kJ/m2 以上,且磨耗量及動摩擦係數低,兼具韌性及滑動性之聚醯胺樹脂組成物。此外,拉伸彈性模數及拉伸伸度沒有大的損失。比較例1~3係因為韌性的不足,滑動時之脆性的表面破壞僅靠聚烯烴樹脂之合金係無法抑制,磨耗量變大。比較例4~7係雖然韌性足夠,但拉伸彈性模量並不足,粉塵會進入至材料表面,還是容易磨耗,難以發揮聚烯烴樹脂之滑動改質效果。比較例8或12因為配方有未改性之聚烯烴樹脂、或未改性之熱塑性彈性體,難以形成微分散之微域,成為難以展現優良之物性的粒徑而較不理想。比較例9~11,因為各別使用胺系抗氧化劑或脂肪酸金屬鹽,與聚烯烴樹脂或熱塑性彈性體之反應性官能基反應,產生使反應性官能基失活的作用,故無法形成微分散之微域。比較例13係摻合固體潤滑劑,但因為單純為聚矽氧粉末,凝聚物容易形成於聚醯胺樹脂組成物中,因此在聚矽氧粉末與聚醯胺樹脂之界面容易產生脆性破壞,磨耗量變大。比較例14及15雖然摻合固體潤滑劑,但沒有摻合聚烯烴樹脂或熱塑性彈性體,故雖然動摩擦係數低但無法抑制脆性破壞,無法減低磨耗量。Examples 1 to 13 can obtain a polyamide resin composition with a Charpy impact strength of more than 6 kJ/ m2 , low wear and dynamic friction coefficient, and both toughness and sliding properties. In addition, there is no significant loss in tensile modulus and tensile elongation. Comparative Examples 1 to 3 are due to insufficient toughness, and the brittle surface damage during sliding cannot be suppressed by the alloy of polyolefin resin alone, and the wear becomes larger. Comparative Examples 4 to 7 are sufficient in toughness, but the tensile modulus is insufficient, dust will enter the material surface, and it is still easy to wear, and it is difficult to exert the sliding modification effect of polyolefin resin. Comparative Examples 8 and 12 are not ideal because they contain unmodified polyolefin resins or unmodified thermoplastic elastomers, which make it difficult to form micro-dispersed micro-domains and result in a particle size that is difficult to exhibit excellent physical properties. Comparative Examples 9 to 11 use amine antioxidants or fatty acid metal salts, respectively, which react with the reactive functional groups of the polyolefin resins or thermoplastic elastomers to inactivate the reactive functional groups, and thus fail to form micro-dispersed micro-domains. Comparative Example 13 is mixed with a solid lubricant, but because it is simply polysilicone powder, agglomerates are easily formed in the polyamide resin composition, so brittle failure is easily generated at the interface between the polysilicone powder and the polyamide resin, and the wear amount becomes larger. Although Comparative Examples 14 and 15 are mixed with a solid lubricant, they are not mixed with polyolefin resin or thermoplastic elastomer, so although the dynamic friction coefficient is low, brittle failure cannot be suppressed and the wear amount cannot be reduced.
圖1係以微分干涉顯微鏡觀察實施例2之剖面而得之圖像。可知聚烯烴樹脂及熱塑性彈性體在聚醯胺樹脂之基質中以粒徑5μm以下之微域均勻地微分散之情況。另一方面,圖2係以微分干涉顯微鏡觀察比較例10之剖面而得之圖像。上述2種改質材不均勻地分散在聚醯胺樹脂之基質,沒有形成微分散。且存在有大型的微域,有在磨耗時應力集中,成為磨耗之起點的可能性。 [產業上利用性]FIG1 is an image obtained by observing the cross section of Example 2 using a differential interference microscope. It can be seen that the polyolefin resin and the thermoplastic elastomer are uniformly dispersed in the matrix of the polyamide resin in microdomains with a particle size of less than 5 μm. On the other hand, FIG2 is an image obtained by observing the cross section of Comparative Example 10 using a differential interference microscope. The above two modified materials are unevenly dispersed in the matrix of the polyamide resin and are not microdispersed. In addition, there are large microdomains, which may concentrate stress during wear and become the starting point of wear. [Industrial Utilization]
本發明之聚醯胺樹脂組成物係兼具優良之靭性與滑動特性的成形材料。尤其適合於要求耐磨耗性、滑動安定性優良的滑動零件用,作為能使用在廣泛領域中的工程塑膠,可期待其對於產業界有大的貢獻。The polyamide resin composition of the present invention is a molding material having both excellent toughness and sliding properties. It is particularly suitable for sliding parts requiring excellent wear resistance and sliding stability. As an engineering plastic that can be used in a wide range of fields, it is expected to make a great contribution to the industry.
無。without.
[圖1]以微分干涉顯微鏡觀察實施例2所製作之評價樣本之剖面而得的圖像。 [圖2]以微分干涉顯微鏡觀察比較例10所製作之評價樣本之剖面而得的圖像。[Figure 1] An image obtained by observing the cross section of the evaluation sample prepared in Example 2 using a differential interference microscope. [Figure 2] An image obtained by observing the cross section of the evaluation sample prepared in Comparison Example 10 using a differential interference microscope.
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