TWI845002B - Semiconductor package module and method for fabrication of the same - Google Patents

Abstract

A semiconductor package module and the method for fabrication of the same are provided. The method for fabricating the semiconductor package module includes providing a circuit substrate which has a plurality of grounding pads. Firstly, a plurality of electronic components are assembled on the circuit substrate. A conductive structure is formed on at least one of the grounding pads and recesses, which the electronic components are assembled in, are framed by the conductive structure and a surface of the circuit substrate. After filling a molding compound into the recess, the conductive structure and the molding compound are grinded. Subsequently, a conductive material is formed on the conductive structure and the molding compound. Along the normal direction of the circuit substrate, the conductive material, the conductive structure and the circuit substrate are cut after the formation of the conductive material. In this method, the conductive structure is formed before filling the molding compound into the recess. Hence, the formation of bubbles inside the conductive structure can be prevented, thereby improving the integrity of the electromagnetic interference (EMI) shielding.

Description

Semiconductor package module and manufacturing method thereof

The present invention relates to a semiconductor package module, in particular to a semiconductor package module with electromagnetic shielding effect and a manufacturing method of the semiconductor package module.

With the development of diversified functions of electronic products, the semiconductor package modules in electronic products need to accommodate more and more electronic components, and the installation distance between electronic components is gradually reduced. In order to avoid mutual interference between electronic components, electromagnetic shielding materials (such as metal) must be installed between the electronic components that will affect each other to achieve the electromagnetic shielding effect. As for the electromagnetic shielding of general semiconductor package modules, it can be divided into "intra-module electromagnetic shielding" to prevent mutual interference between electronic components in a single module and "inter-module electromagnetic shielding" to prevent mutual interference between electronic components in multiple modules.

The manufacturing method of electromagnetic shielding in the module is to laser cut grooves in the area where the electromagnetic shielding material is to be set after the electronic components are covered with molding compound. Then, the electromagnetic shielding material is filled in the groove. This method of cutting the groove first and then filling it is easy to produce air holes when filling the electromagnetic shielding material, thereby affecting the electromagnetic shielding effect.

On the other hand, the manufacturing method of electromagnetic shielding between modules is to form multiple semiconductor package modules by cutting the molding material covering multiple electronic components, and then forming an electromagnetic shielding layer on each semiconductor package module by sputtering or other methods. However, the sputtering process easily causes the electromagnetic shielding layer to be formed on the portion of the package module that does not require electromagnetic shielding, causing the package module to be contaminated by the electromagnetic shielding layer and causing problems such as short circuits. In addition, during the sputtering process, each package module needs to be separated from each other and maintain a certain distance to ensure that an electromagnetic shielding layer with sufficient lateral thickness can be formed. However, this spacing placement method not only takes up additional space in the sputtering chamber, but also requires additional time to separate these package modules, making it difficult to increase production capacity.

Therefore, the present invention provides a semiconductor package module and a manufacturing method thereof to improve the electromagnetic shielding effect and production efficiency.

The present invention provides a method for manufacturing a semiconductor package module, comprising providing a circuit substrate, the circuit substrate comprising a first surface and a plurality of ground pads, wherein the ground pads are located on the first surface; a plurality of electronic components are arranged on the first surface of the circuit substrate, wherein each of the electronic components is located between two adjacent ground pads; a conductive structure is formed on at least one of the ground pads, wherein the conductive structure and a portion of the first surface form at least one groove, and the electronic component is located in the groove; In one, a sealing material is filled, wherein the sealing material completely covers the electronic component and has an outer surface exposed to the external environment; the conductive structure and the sealing material are ground from the outer surface; after grinding the conductive structure and the sealing material, a conductive material is formed on the conductive structure and the sealing material, wherein the conductive material is electrically connected to the conductive structure, and the conductive material, the conductive structure and the circuit substrate completely cover the sealing material; and the conductive material, the conductive structure and the circuit substrate are cut along the normal direction of the circuit substrate.

The present invention also provides a semiconductor package module, comprising a circuit substrate, the circuit substrate comprising a first surface, a second surface and a plurality of ground pads, wherein the first surface is opposite to the second surface, and the ground pad is arranged on the first surface; a conductive structure, arranged on the first surface and electrically connected to at least one of the ground pads, wherein the conductive structure forms at least one groove on the first surface; at least one electronic component, arranged in the groove and electrically connected to the circuit substrate; at least one sealing material, filled in the groove and covering the electronic component; a conductive material, arranged on the conductive structure and the sealing material, and covering the conductive structure and the sealing material; and a plurality of solders, arranged on the second surface of the circuit substrate, wherein the conductive structure comprises a side surface, and wherein the conductive material does not cover the side surface of the conductive structure.

Based on the above, a feature of the present invention is that a conductive structure is first formed around the electronic component to achieve lateral electromagnetic shielding, and then the sealing material is filled between the conductive structure and the electronic component. This step sequence can avoid the formation of air holes inside the conductive structure, ensure the integrity of the lateral electromagnetic shielding, and thus improve the effect of electromagnetic shielding.

At least one embodiment of the present invention discloses a method for manufacturing a semiconductor package module, and at least one embodiment of the present invention is described by a series of steps in FIG. 1A to FIG. 1H. Referring to FIG. 1A, first, a circuit substrate 100 is provided, wherein the circuit substrate 100 includes a first surface 100f and a plurality of ground pads 102. The ground pads 102 are all disposed on the same surface of the circuit substrate 100. As shown in FIG. 1A, each ground pad 102 is disposed on the first surface 100f of the circuit substrate 100 and is exposed on the first surface 100f.

In this embodiment, the circuit substrate 100 may further include a dielectric layer 101, wherein the dielectric layer 101 may have a first surface 100f, and the ground pad 102 may protrude from the first surface 100f. However, in other embodiments, the ground pad 102 may not protrude from the first surface 100f. For example, the top surface of the ground pad 102 may be aligned with the first surface 100f. In addition, in other embodiments, the circuit substrate 100 may further include at least one layer of solder mask (not shown), wherein the solder mask may cover the first surface 100f and expose the ground pads 102, and protrude from the top surface of these ground pads 102.

Please continue to refer to FIG. 1B , on the first surface 100f of the circuit substrate 100, a plurality of electronic components 104 are disposed, and each electronic component 104 can be disposed between two adjacent ground pads 102. The electronic component 104 disposed between two adjacent ground pads 102 is not limited to one, and can also be more than two electronic components 104. In addition, in addition to the ground pad 102, the circuit substrate 100 can also include a plurality of other pads (not shown) located on the first surface 100f. These pads can be provided for the electronic components 104 to be electrically connected to the circuit substrate 100 through these pads.

In this embodiment, a plurality of solder joints 106 are further provided on the electronic element 104. These solder joints 106 may be solder balls, copper pillars or various soldering structures suitable for electrical connection. The solder joints 106 are respectively connected to the above-mentioned pads (not shown), so that the electronic element 104 can be electrically connected to the circuit substrate 100 through these solder joints 106. In addition, in other embodiments, the electronic element 104 can be electrically connected to the circuit substrate 100 by wire bonding. The electronic element 104 may be a packaged chip or an unpackaged die.

As shown in FIG. 1C , after the electronic element 104 is disposed, a conductive structure 108 is then formed on the circuit substrate 100, and the conductive structure 108 is in direct contact with at least one of the ground pads 102, so that the conductive structure 108 is formed on at least one of the ground pads 102. The conductive structure 108 may include, for example, conductive paste, conductive glue, or other conductive materials with electromagnetic shielding function. In at least one embodiment of the present disclosure, the conductive structure 108 may be formed on the ground pad 102 by spraying, printing, dispensing, or three-dimensional printing, but the method of forming the conductive structure 108 is not limited thereto.

Furthermore, forming the conductive structure 108 further includes forming a plurality of conductive layers (not shown in the figure) on the ground pad 102. In the embodiment shown in FIG. 2, the material of the conductive structure 108 may be a conductive paste and include a plurality of conductive layers (not shown in the figure). These conductive layers are stacked along the z-axis direction. For example, firstly, a first conductive layer 109a is formed on the ground pad 102 by spraying, and the first conductive layer 109a is pre-cured. According to the characteristics of different conductive pastes, the pre-curing method may be to irradiate or heat the conductive layer. For conductive pastes with specific components, the pre-curing step may even be omitted.

Subsequently, the second conductive layer 109b and the third conductive layer 109c are sequentially formed on the first conductive layer 109a in the same manner. In this embodiment, the third conductive layer 109c protrudes from the top surface of the electronic component 104. That is, on the circuit substrate 100, the height (i.e., thickness) of the conductive structure 108 is greater than the total height (i.e., total thickness) of the electronic component 104 plus the solder joint 106. It should be particularly noted that the number of conductive layers can be more than one layer, and is not limited to the three layers listed above.

Please refer to FIG. 1C and FIG. 3 together, wherein FIG. 3 is a top view of the semiconductor package module manufacturing method shown in FIG. 1C. The conductive structure 108 and a portion of the circuit substrate 100 form at least one groove 110, wherein the shape of the conductive structure 108 may be a mesh, as shown in FIG. 3. Specifically, although the conductive structure 108 is a plurality of separate units from each other from the perspective of the cross-sectional view of FIG. 1C, the conductive structure 108 is substantially a continuous wall structure, and the side wall of the continuous wall is equivalent to the side wall of the groove 110. The conductive structure 108 has a top surface 108t' away from the circuit substrate 100 and parallel to the x-y plane, wherein the x-y plane is a plane parallel to the x-axis and the y-axis. As can be seen from FIG. 3, these grooves 110 are separated from each other by the conductive structure 108 on the x-y plane. Although in this embodiment, the shape of the groove 110 on the x-y plane is a rectangle, in various other embodiments, the shape of the groove 110 on the x-y plane is not limited to a rectangle.

As shown in FIG. 3 , the electronic components 104 are disposed in each groove 110, and the electronic components 104 do not contact the conductive structure 108. In this embodiment, only one electronic component 104 is disposed in each groove 110. However, in other embodiments of the present invention, the number of electronic components 104 in a single groove 110 is not limited thereto, and more than two electronic components 104 may be disposed in a single groove 110.

Please refer to FIG. 1D . After forming the conductive structure 108, a sealing material 112 is filled into each groove 110 to completely isolate the conductive structure 108 from the electronic element 104. That is, the sealing material 112 can completely cover the electronic element 104 so that the conductive structure 108 and the electronic element 104 do not contact each other. The filled sealing material 112 can form an outer surface 112o' exposed to the external environment above the electronic element 104. The sealing material 112 can include an insulating material such as an organic resin (such as epoxy resin) or the like.

Please refer to FIG. 1D and FIG. 1E together. After filling the sealing material 112, the conductive structure 108 and the sealing material 112 are ground from the top surface 108t' and the outer surface 112o', so that the conductive structure 108 and the sealing material 112 respectively form a new top surface 108t and a new outer surface 112o, wherein the top surface 108t is aligned with the outer surface 112o, as shown in FIG. 1E. In an embodiment of the present invention, the sealing material 112 and the conductive structure 108 can be ground by, for example, laser cutting, ion beam cutting or chemical mechanical grinding.

Referring to FIG. 1E , after grinding the sealing material 112 and the conductive structure 108, a plurality of solders 114 are disposed on the second surface 100s of the circuit substrate 100, and the solders 114 are electrically connected to the circuit substrate 100. It should be noted that in this embodiment, the solders 114 can be disposed directly after the grinding step, but in other embodiments, the order of the steps of disposing the solders 114 and the grinding step is not limited thereto.

After the solder 114 is provided, as shown in FIG. 1F , a conductive material 116 is formed on the outer surface 112o of the sealing material 112 and the top surface 108t of the conductive structure 108, thereby forming a semiconductor package connecting board 10. Specifically, the semiconductor package connecting board 10 can be a working panel or a substrate strip, so the semiconductor package connecting board 10 includes a plurality of circuit board units. In other words, a semiconductor package connecting board 10 can manufacture a plurality of semiconductor package modules.

The conductive material 116 must completely cover the outer surface 112o of the sealing material 112 and be connected to the top surface 108t of the conductive structure 108 to form a complete shield around the electronic element 104, thereby achieving the effect of electromagnetic shielding. In some embodiments of the present invention, the method of forming the conductive material 116 may include deposition, such as physical vapor deposition, chemical vapor deposition or other suitable processes, wherein the aforementioned physical vapor deposition may be sputtering. In this way, the conductive material 116 can be deposited on the coplanar surface formed by the outer surface 112o of the sealing material 112 and the top surface 108t of the conductive structure 108.

After the conductive material 116 is formed, the semiconductor package interconnect 10 is cut. As shown in FIG1G , the second surface 100s of the circuit substrate 100 is used as the starting point, and the cutting is performed along the normal direction of the circuit substrate 100, that is, the circuit substrate 100 is cut from the second surface 100s. During the cutting process, the cutter (not shown) passes through the circuit substrate 100, the conductive structure 108, and the conductive material 116 in sequence to form a plurality of completely separated semiconductor package modules 12, as shown in FIG1H .

In order to achieve electromagnetic shielding between electronic components 104, the cutting path must be located between two adjacent semiconductor package modules 12. In other words, the cutting path must be located between two adjacent electronic components 104 and pass through the circuit substrate 100, the conductive structure 108 and the conductive material 116. In addition, the cutting path must not pass through the sealing material 112, that is, the sealing material 112 must not be cut, so that a complete electromagnetic shielding can be formed.

The present invention further discloses a semiconductor package module. As shown in FIG4 , a semiconductor package module 40 of an embodiment of the present invention includes a circuit substrate 400, a conductive structure 408, an electronic component 404, a sealing material 412, a conductive material 416, and a solder 414. The circuit substrate 400 includes a first surface 400f and a second surface 400s relative to the first surface 400f, and includes a plurality of ground pads 402, wherein the ground pads 402 are located on the first surface 400f of the circuit substrate 400.

It should be noted that the structure of the circuit substrate 400 may be substantially the same as the circuit substrate 100 in FIG. 1A , wherein the ground pad 402 may be the same as the ground pad 102 . The main difference between the circuit substrate 400 and the circuit substrate 100 is the size difference. The circuit substrate 100 in the aforementioned embodiment may be a workpiece connecting board or a substrate strip, while the circuit substrate 400 in the present embodiment may be a circuit board unit.

Please continue to refer to FIG. 4 , the conductive structure 408 is located on at least one ground pad 402 and directly contacts the ground pad 402. Taking FIG. 4 as an example, the conductive structure 408 can directly contact multiple ground pads 402. However, in other embodiments, the conductive structure 408 can directly contact only a single ground pad 402. The conductive structure 408 has a top surface 408t, and the top surface 408t is far away from the first surface 400f of the circuit substrate 400. Part of the side surface 408w of the conductive structure 408 and a part of the first surface 400f form at least one groove 410. The groove 410 contains at least one electronic component 404, and the number of electronic components 404 varies according to the requirements of different component packaging.

In this embodiment, the electronic component 404 is electrically connected to the circuit substrate 400 by a plurality of solder joints 406, and the solder joints 406 are not limited to solder balls, but can be various soldering structures suitable for electrical connection, such as solder pillars. On the other hand, the installed electronic component 404 must still be kept in the groove 410, which means that the height (i.e., thickness) of the electronic component 404 after connecting the solder joints 406 will not exceed the top surface 408t of the conductive structure 408.

The conductive structure 408 may include a material that can be laminated along the z-axis direction on the circuit substrate 400, such as a printed conductive paste, a conductive glue, or a similar material. However, in other embodiments, the material of the conductive structure 408 is not limited thereto.

Each groove 410 also includes a sealing material 412, which has an outer surface 412o, and the top surface 408t of the conductive structure 408 is coplanar with the outer surface 412o. The sealing material 412 fills the groove 410 and fills the gap between the electronic element 404 and the conductive structure 408, wherein the sealing material 412 completely covers the electronic element 404, so that the electronic element 404 is isolated from the conductive structure 408 and the conductive material 416.

The conductive material 416 is disposed on the conductive structure 408 and the sealing material 412, and covers the coplanar surface formed by the top surface 408t and the outer surface 412o. As shown in FIG. 4 , the conductive material 416 completely covers the outer surface 412o of the sealing material 412 and is connected to the conductive structure 408 to form an electromagnetic shielding shell. The conductive material 416 is in direct contact with the conductive structure 408 and the sealing material 412, respectively.

Although in the present embodiment, the conductive material 416 completely covers the top surface 408t of the conductive structure 408, in other embodiments, the conductive material 416 may only cover a portion of the top surface 408t of the conductive structure 408. It should be particularly noted that the conductive material 416 does not cover the side surface 408w of the conductive structure 408, and the sealing material 412 exposes a portion of the side surface 408w of the conductive structure 408. As can be seen from FIG. 4, this portion belongs to the outer portion of the side surface 408w, and the "outer side" here refers to the side of the semiconductor package module 40 in contact with the outside world (in contrast, the "inner side" portion of the side surface refers to the portion of the side surface 408w that forms the groove 410). In addition, a plurality of solders 414 are located on the second surface 400s of the circuit substrate 400 and are electrically connected to the circuit substrate 400. The solder 414 may include metals suitable for welding such as tin, copper, silver, indium, zinc, and their alloys.

In summary, in the embodiment of the present invention, a shielding structure capable of electromagnetically shielding electronic components is formed by the conductive structure on the side of the semiconductor package module and the conductive material on the top. In the embodiment of the manufacturing method, since the conductive structure on the side is formed first, and then the sealing material is filled into the groove formed by the conductive structure and the circuit substrate, compared with the general post-filling method (grooving on the molded molding material and filling the conductive structure into the groove), the sequence disclosed in the manufacturing method of the above embodiment is helpful to form a conductive structure without pores, thereby improving the electromagnetic shielding effect and achieving a smooth appearance.

On the other hand, since the conductive structure has already formed the electromagnetic shielding on the side, when the electromagnetic shielding layer on the top is subsequently deposited, it can enter the deposition chamber in a connected state, and there is no need to reserve space for side deposition, so the space utilization of the deposition chamber can be improved, and the time of separating multiple semiconductor packaging modules can be saved, thereby improving production capacity. Furthermore, in the process of depositing electromagnetic shielding materials, the deposited substances are easy to contaminate the circuit substrate at the bottom of the module. Compared with multiple single boards after cutting, the bottom of the uncut connected board is farther away from the deposition range above the module, so the deposition must pass through a longer path to reach the bottom of the connected board, thus reducing the risk of contamination of the circuit substrate (the bottom of the semiconductor package module).

Although the embodiments of the present invention have been disclosed above, they are not intended to limit the embodiments of the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the embodiments of the present invention. Therefore, the protection scope of the embodiments of the present invention shall be subject to the scope of the attached patent application.

10: Semiconductor package connecting board

100, 400: Circuit board

100f, 400f: first surface

100s, 400s: Second surface

101: Dielectric layer

102, 402: Grounding pad

104, 404: Electronic components

106, 406: Soldering points

108, 408: Conductive structure

108t, 108t’, 408t: top surface

109a: first conductive layer

109b: Second conductive layer

109c: The third conductive layer

110, 410: groove

112, 412: Sealing material

112o, 112o’, 412o: outer surface

114, 414: Solder

116, 416: Conductive materials

12, 40: Semiconductor packaging module

408w: side surface

Figures 1A to 1H show cross-sectional views of a method for manufacturing a semiconductor package module according to at least one embodiment of the present invention. Figure 2 shows a cross-sectional view of another embodiment of the method for manufacturing a semiconductor package module according to Figure 1C. Figure 3 shows a top view of the method for manufacturing a semiconductor package module according to Figure 1C. Figure 4 shows a cross-sectional view of a semiconductor package module according to at least one embodiment of the present invention.

40: semiconductor package module 400: circuit substrate 400f: first surface 400s: second surface 402: ground pad 404: electronic component 406: solder joint 408: conductive structure 408w: side surface 408t: top surface 410: groove 412: sealing material 412o: outer surface 414: solder 416: conductive material

Claims (10)

A method for manufacturing a semiconductor package module, the method comprising: providing a circuit substrate, the circuit substrate comprising a first surface and a plurality of ground pads, wherein the ground pads are located on the first surface; arranging a plurality of electronic components on the first surface of the circuit substrate, wherein each of the electronic components is located between two adjacent ground pads; forming a conductive structure on at least one of the ground pads, wherein the conductive structure and a portion of the first surface form at least one groove, and the electronic component is located in the groove; filling each of the grooves with a dense The method comprises the steps of: preparing a sealing material, wherein the sealing material completely covers the electronic element and has an outer surface exposed to the external environment; grinding the conductive structure and the sealing material from the outer surface; forming a conductive material on the conductive structure and the sealing material after grinding the conductive structure and the sealing material, wherein the conductive material is electrically connected to the conductive structure, and the conductive material, the conductive structure and the circuit substrate completely cover the sealing material; and cutting the conductive material, the conductive structure and the circuit substrate along the normal direction of the circuit substrate. The method of claim 1, wherein the step of forming the conductive structure on at least one of the ground pads comprises: Forming a plurality of conductive layers on at least one of the ground pads. A method as described in claim 2, wherein the conductive structure protrudes from the top surface of each of the electronic components. The method described in claim 1 further includes: before forming the conductive material, a plurality of solders are arranged on a second surface of the circuit substrate, wherein the first surface and the second surface are respectively located on opposite sides of the circuit substrate. As described in claim 4, cutting the conductive material, the conductive structure and the circuit substrate along the normal direction of the circuit substrate further includes: cutting from the second surface to the first surface. The method as described in claim 5, wherein in the process of cutting the conductive material, the conductive structure and the circuit substrate along the normal direction of the circuit substrate, the conductive material, the conductive structure and the circuit substrate are cut along a cutting path, wherein the cutting path is located between two adjacent semiconductor package modules. A semiconductor package module comprises: a circuit substrate comprising a first surface, a second surface and a plurality of ground pads, wherein the first surface is opposite to the second surface and the ground pads are arranged on the first surface; a conductive structure arranged on the first surface and electrically connected to at least one of the ground pads, wherein the conductive structure forms at least one groove on the first surface and the conductive structure is a continuous wall structure; at least one electronic component arranged in the groove and electrically connected to the circuit substrate; at least one sealing material filled in the groove and covering the electronic component; and a conductive material arranged on the conductive structure and the sealing material and covering the conductive structure and the sealing material; wherein the conductive structure comprises a side surface, wherein the conductive material does not cover the side surface of the conductive structure, and the sealing material exposes a portion of the side surface of the conductive structure. A semiconductor package module as described in claim 7, wherein the conductive structure further comprises: a top surface, and each of the sealing materials comprises an outer surface, wherein the top surface and the outer surface are coplanar. A semiconductor package module as described in claim 7, wherein the conductive material completely covers and directly contacts the sealing material. A semiconductor package module as described in claim 7, wherein the conductive material directly contacts the conductive structure.

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