TWI844075B - A transparent flexible board and method for manufacturing the transparent flexible board - Google Patents

Abstract

A transparent flexible board, comprises: a transparent substrate, a transparent adhesive layer, a first transparent electrode, a transparent resistance layer and a second transparent electrode. The first transparent electrode is connected to the transparent substrate through the transparent adhesive layer, and the second transparent electrode is connected to the first transparent electrode through the transparent resistance layer. The transparent substrate is made by a dibenzylamine, a diacid anhydride, a dimethylacetamide and a nanodiamond solution. The transparent adhesive layer is made by a polyimide compound that comprises a siloxane material, and the transparent resistance layer is made by one of a metal oxide material and a metal nitride material. The first transparent electrode and the second transparent electrode are made by one of an aluminum-doped zinc oxide (AZO) and an indium tin oxide (ITO). Therefore, the transparent substrate of present invention comprises nanodiamonds (ND), so that the transparent flexible board has a better thermal conductivity and a lower dielectric coefficient.

Description

Transparent soft board element and manufacturing method thereof

The present invention relates to a transparent soft board element and a manufacturing method thereof, in particular to a transparent soft board element containing nanodiamonds (ND) and a manufacturing method thereof.

Generally speaking, resistive memory is a type of non-volatile memory. Moreover, resistive memory mainly presents a structure in which an upper metal electrode layer, a lower metal electrode layer and a memory layer are vertically stacked. The memory layer is generally a resistance switching layer composed of transition metal oxides (TMO). In the environment of different bias electric fields, the resistance of the memory can switch between a high resistance state and a low resistance state. However, the oxidation degree of the transition metal oxide is the main factor affecting the resistance switching characteristics and operating performance of the resistive memory.

In addition, the resistance transition layer of most non-volatile memories on the market currently contains metals, metal oxides or metal nitrides with color, which makes the non-volatile memory as a whole unable to present a completely transparent state, and thus it is difficult to use non-volatile memory in virtual reality devices. Therefore, non-volatile memory needs to be improved. In addition, most non-volatile memories on the market are made into silicon substrates or sapphire substrates, and both silicon substrates and sapphire substrates cannot be bent.

However, flexible electronic components are the current trend in 3C and medical devices, and polyimide (PI) has the characteristics of being bendable, resistant to high temperatures, and resistant to chemical corrosion, making it the first choice for flexible substrates. Nowadays, the density of electronic components has increased, and the heat energy generated by the stacking of electronic components has increased dramatically. High temperatures will affect the operating speed and life of electronic components, so how to reduce the temperature has become an important issue today.

The main purpose of the present invention is to improve the substrate material composition of the transparent soft board element so that the transparent soft board element not only remains fully transparent but also reduces the thermal conductivity and dielectric constant.

To achieve the aforementioned purpose, the present invention provides a transparent soft board element and a method for manufacturing the transparent soft board element.

The transparent flexible plate element is mainly composed of a transparent substrate, a transparent adhesive material, a first transparent electrode, a transparent resistor material and a second transparent electrode. The transparent adhesive material is connected to the transparent substrate and is composed of a polyimide composite synthesized from a siloxane material. The first transparent electrode is connected to the transparent adhesive material and is composed of one of aluminum oxide zinc or indium oxide tin.

The transparent resistor is connected to the first transparent electrode and is made of a metal oxide material or a metal nitride material. When subjected to different bias electric fields, the transparent resistor will form a memory structure with adjustable resistance. The second transparent electrode is connected to the transparent resistor and is made of a material of aluminum zinc oxide or indium tin oxide.

The transparent substrate is composed of a fluorine-containing or asymmetric diphenylamine, a fluorine-containing or asymmetric dianhydride, a dimethylacetamide (DMAc) and a nanodiamond solution, and the nanodiamond solution contains a nanodiamond (ND).

In this embodiment, the ratio of the nanodiamond (ND) is 0.1-5% of the total of the diphenylamine, dianhydride, dimethylacetamide (DMAc) and nanodiamond solution, and the particle size of the nanodiamond (ND) is 1-20 nanometers.

In this embodiment, the dimethylacetamide (DMAc) is in liquid form, and the diphenylamine and dianhydride are both in powder form, so that the diphenylamine and dianhydride can be dissolved in the dimethylacetamide (DMAc) and nanodiamond solution.

The above-mentioned transparent flexible board element manufacturing method includes: a substrate manufacturing step, a bonding material manufacturing step, an electrode manufacturing step, a resistor material manufacturing step and an electrode manufacturing step.

The steps of making the above substrate are: providing a nanodiamond solution containing nanodiamonds (ND), and mixing diphenylamine, bis(dianhydride) and dimethylacetamide (DMAc) in the nanodiamond solution to form a transparent substrate.

The steps of making the above-mentioned bonding material are: mixing a fluorine-containing and asymmetric diamine with a fluorine-containing and asymmetric diamine, cooling and maintaining the temperature at an ice bath, then adding a dianhydride and a polydimethylsiloxane to obtain a precursor polyamide containing a siloxane material, heating and drying the polyamide to form a transparent bonding material, and then connecting the above-mentioned transparent bonding material to the above-mentioned transparent substrate.

The above-mentioned electrode manufacturing steps: using one of the methods of sputtering, heating evaporation or sol-gel method to form a first transparent electrode composed of a composite metal oxide on the above-mentioned transparent adhesive material.

The steps of making the above-mentioned resistor material: using one of the sputtering method, the heating evaporation method or the sol-gel method to form a transparent resistor material composed of a metal oxide material or a metal nitride material on the above-mentioned first transparent electrode.

The above-mentioned electrode is then fabricated in the following steps: a second transparent electrode made of a composite metal oxide is formed on the above-mentioned transparent resistor material by using one of the methods of sputtering, heating evaporation or sol-gel method.

In a preferred embodiment, when performing the substrate manufacturing step, all of the diphenylamine and a portion of the dianhydride are mixed with a portion of the dimethylacetamide (DMAc) to form a first mixed liquid, and then the remaining dianhydride is mixed with the remaining dimethylacetamide (DMAc) to form a second mixed liquid. Finally, the first mixed liquid, the second mixed liquid and the nanodiamond solution are coated and heated at a high temperature, and the dimethylacetamide (DMAc) is removed to form the transparent substrate.

In another preferred embodiment, when performing the substrate manufacturing step, the dimethylacetamide (DMAc) is first mixed with the nanodiamond solution to form a dimethylacetamide mixed solution, a portion of the dimethylacetamide mixed solution is mixed with all of the diphenylamine to form a third mixed solution, and another portion of the dimethylacetamide mixed solution is mixed with a portion of the dianhydride to form a fourth mixed solution, and then the remaining dianhydride is mixed with all of the dimethylacetamide (DMAc) to form a fifth mixed solution, and finally the third mixed solution, the fourth mixed solution and the fifth mixed solution are coated and heated at a high temperature, and the dimethylacetamide (DMAc) is removed to form the transparent substrate.

In another preferred embodiment, when performing the substrate manufacturing step, a portion of the dimethylacetamide (DMAc) and all of the diphenylamine are mixed in the nanodiamond solution to form a sixth mixed liquid, and then the remaining dimethylacetamide (DMAc) is mixed with all of the dianhydride to form a seventh mixed liquid. Finally, the sixth mixed liquid and the seventh mixed liquid are coated and heated at a high temperature, and the dimethylacetamide (DMAc) is removed to form the transparent substrate.

In another preferred embodiment, when performing the substrate manufacturing step, a portion of the dimethylacetamide (DMAc), a portion of the diphenylamine, a portion of the dianhydride and a portion of the nanodiamond solution are mixed to form an eighth mixed liquid, and the remaining dimethylacetamide (DMAc), the remaining diphenylamine, the remaining dianhydride and the remaining nanodiamond solution are mixed to form another eighth mixed liquid, and finally all the eighth mixed liquids are coated with high temperature heating, and the dimethylacetamide (DMAc) is removed to form the transparent substrate.

In the last preferred embodiment, when performing the substrate manufacturing step, the dimethylacetamide (DMAc) is first mixed with the nanodiamond solution to form a dimethylacetamide mixed solution, and then a portion of the dimethylacetamide (DMAc) is mixed with all the diphenylamine to form a ninth mixed solution, and a portion of the dianhydride is mixed with all the dimethylacetamide mixed solution to form a tenth mixed solution, and the remaining dianhydride is mixed with the remaining dimethylacetamide (DMAc) to form an eleventh mixed solution. Finally, the ninth mixed solution, the tenth mixed solution and the eleventh mixed solution are coated and heated at a high temperature, and the dimethylacetamide (DMAc) is removed to form the transparent substrate.

The feature of the present invention is that the first transparent electrode is connected to the transparent substrate through a transparent adhesive material, and the second transparent electrode is connected to the first transparent electrode through a transparent resistor material, so that the transparent substrate, the first transparent electrode and the second transparent electrode are stacked in sequence, and the entire transparent soft board element can be transparent. In addition, the transparent substrate is composed of diphenylamine, dianhydride, dimethylacetamide (DMAc) and nano-diamond solution, so that the thermal conductivity of the transparent soft board element can be between 0.2 and 0.5, and the dielectric constant of the transparent soft board element can be between 2.5 and 3, so that the transparent soft board element can also reduce the thermal conductivity and dielectric constant.

1: Transparent soft board components

11: Transparent substrate

12: Transparent adhesive material

13: First transparent electrode

131: First electrode layer

14: Transparent resistor material

141: Resistor layer

15: Second transparent electrode

151: Second electrode layer

2: Manufacturing method of transparent soft board components

21: Substrate manufacturing steps

22: Then the material is made into steps

23: Electrode manufacturing steps

24: Resistor material manufacturing steps

25: Electrode re-production step

FIG1 is a schematic diagram of a transparent soft board element of the present invention; FIG2 is a flow chart of the steps of manufacturing a transparent soft board element of the present invention; FIG3 is a schematic diagram of the substrate manufacturing step in FIG2; FIG4 is a schematic diagram of the bonding material manufacturing step in FIG2; FIG5 is a schematic diagram of the electrode manufacturing step in FIG2; FIG6 is a schematic diagram of the resistor material manufacturing step in FIG2; FIG7 is a schematic diagram of the electrode manufacturing step in FIG2; FIG8 is a schematic diagram of the substrate manufacturing step in the second preferred embodiment; FIG9 is a schematic diagram of the substrate manufacturing step in the third preferred embodiment; FIG10 is a schematic diagram of the substrate manufacturing step in the fourth preferred embodiment; and FIG11 is a schematic diagram of the substrate manufacturing step in the fifth preferred embodiment.

In order to facilitate a deeper and more detailed understanding of the structure, use and features of the present invention, a preferred embodiment is given and described in detail with the help of the drawings as follows: Please refer to Figures 1 and 2. In the first preferred embodiment, the transparent flexible board element 1 of the present invention is manufactured by a transparent flexible board element manufacturing method 2, so that the transparent flexible board element 1 forms a transparent substrate 11, a transparent adhesive material 12, a first transparent electrode 13, a transparent resistor material 14 and a second transparent electrode 15.

Please refer to FIG. 3 to FIG. 7, which are the steps of the manufacturing process of the transparent soft board element manufacturing method 2. Please refer to FIG. 1, FIG. 2 and FIG. 3. First, a substrate manufacturing step 21 is performed. When performing the substrate manufacturing step 21, a nanodiamond solution in a liquid state, a dimethylacetamide (DMAc) in a liquid state, a diphenylamine in a powder state and a dianhydride in a powder state are provided. Among them, both the diphenylamine and the dianhydride contain fluorine or an asymmetric structure, and the nanodiamond solution contains a particle size of 1 to 20 nanometers. Nanodiamond (ND) is prepared, and the proportion of nanodiamond (ND) accounts for 0.1-5% of the total of diphenylamine, dianhydride, dimethylacetamide (DMAc) and nanodiamond solution. Next, the nanodiamond solution, dimethylacetamide (DMAc), diphenylamine and dianhydride are coated and heated at high temperature, and dimethylacetamide (DMAc) is removed to form a transparent substrate 11. In this embodiment, the substrate preparation step 21 is performed in a glass three-neck bottle. First, a part of the dianhydride and the whole of the diphenylamine are mixed at room temperature. The mixture was mixed with a portion of dimethylacetamide (DMAc) at a stirring speed of 80 rpm, so that the diphenylamine and the dianhydride were dissolved in the dimethylacetamide (DMAc) to form a first mixed liquid. The remaining dianhydride and the remaining dimethylacetamide (DMAc) were mixed at a stirring speed of 80 rpm at room temperature, so that the dianhydride was dissolved in the dimethylacetamide (DMAc) to form a second mixed liquid. The first mixed liquid, the second mixed liquid and the nanodiamond solution were then placed in a vacuum environment. After degassing, the debubbled first mixed liquid, the second mixed liquid and the nano-diamond solution are coated, and finally heated to 300°C in a stepwise manner for dehydration cyclization reaction, and dimethylacetamide (DMAc) is removed to form a transparent substrate 11, thereby completing the substrate preparation step 21. In this embodiment, the above mixing action is carried out at a stirring speed of 80 rpm at room temperature and nitrogen is introduced into the three-necked flask throughout the process to prevent water vapor from affecting the molecular weight of the first mixed liquid, the second mixed liquid and the nano-diamond solution.

Please refer to FIG. 2 and FIG. 4. After the substrate manufacturing step 21 is completed, a bonding material manufacturing step 22 is started. When the bonding material manufacturing step 22 is performed, a fluorine-containing and asymmetric diamine and a fluorine-containing and asymmetric diamine are mixed, and the mixture is cooled in an ice bath and maintained at an ice bath temperature. Then, about 80% of an 1-2-dicarboxylic acid anhydride (IDPA) material is added to react. After a period of reaction, Then, a polydimethylsiloxane (PDMS) solution is added, and finally, the remaining 20% of the dianhydride (IDPA) material is added to mix to produce a precursor polyamide solution containing a siloxane material, wherein the viscosity of the precursor polyamide solution containing a siloxane material is observed by an operator visually until the viscosity rises and then the precursor polyamide solution containing a siloxane material is added. The ice bath was removed, and the reaction was continued for a period of time to produce a pale yellow viscous polyamide solution containing a precursor of a siloxane material, wherein the pale yellow viscous polyamide solution containing a precursor of a siloxane material has a solid content of approximately 15%, and the polyamide solution containing a precursor of a siloxane material was coated on a PET sheet and placed in a hot air circulation oven and heated to approximately 90°C for one hour, and then removed from the heat. The air circulation oven forms a polyamide film, then the polyamide film is removed from the PET sheet and fixed using a copper frame film mold, and then moved into the hot air circulation oven again and heated to about 300°C for dehydration and ring closing to obtain a transparent adhesive material 12 composed of a polyamide film containing a siloxane material. After the transparent adhesive material 12 is completed, the transparent adhesive material 12 is connected to the upper side of the transparent substrate 11.

Please refer to FIG. 2 and FIG. 5. After the bonding material forming step 22 is completed, an electrode forming step 23 is started. During the electrode forming step 23, a first transparent electrode 13 composed of a composite metal oxide is provided. The first transparent electrode 13 is formed on the transparent bonding material 12 by sputtering, heating evaporation or sol-gel method, so that the transparent bonding material 12 is located at As shown in the figure, between the transparent substrate 11 and the first transparent electrode 13, the first transparent electrode 13 has a plurality of first electrode layers 131, and each first electrode layer 131 is composed of the same metal material, and the metal material ratio of each first electrode layer 131 is different, so that the first transparent electrode 13 is stacked into a gradient electrode through the first electrode layers 131 with different metal material ratios.

Please refer to FIG. 2 and FIG. 6. After the electrode manufacturing step 23 is completed, a resistor material manufacturing step 24 is started. When performing the resistor material manufacturing step 24, a transparent resistor material 14 composed of a metal oxide material or a metal nitride material is provided. The transparent resistor material 14 is formed on the first transparent electrode 13 by sputtering, heating evaporation or sol-gel method, so that the first transparent electrode 13 is located between the transparent bonding material 12 and the transparent resistor material 14. In this embodiment, the material of the metal oxide material can be zinc oxide (ZnO), aluminum oxide (Al2O3), indium oxide (In2O3) or tin oxide. (SnO2), and the material of the metal nitride material can be one of zinc nitride (Zn3N2), aluminum nitride (AlN), indium nitride (InN) or tin nitride (Sn3N4). As shown in the figure, whether the transparent resistor material 14 is composed of a metal oxide material or a metal nitride material, the transparent resistor material 14 has a plurality of resistor layers 141, each of which is composed of the same metal material, and each of which has a different degree of oxidation, so that the transparent resistor material 14 is stacked into a gradient resistor film through resistor layers 141 with different degrees of oxidation.

Please refer to FIG. 2 and FIG. 7. After the resistor material manufacturing step 24 is completed, an electrode re-manufacturing step 25 is started. During the electrode re-manufacturing step 25, a second transparent electrode 15 composed of a composite metal oxide is provided. The second transparent electrode 15 is formed on the transparent resistor material 14 by sputtering, heating evaporation or sol-gel method, so that the transparent resistor material 14 is located on the first transparent The electrode 13 and the second transparent electrode 15 form a transparent flexible plate element 1. As shown in the figure, the second transparent electrode 15 has a plurality of second electrode layers 151, and each second electrode layer 151 is composed of the same metal material, and the metal material ratio of each second electrode layer 151 is different, so that the second transparent electrode 15 is stacked into a gradient electrode through the second electrode layers 151 with different metal material ratios.

In this embodiment, one of the sputtering methods described in the electrode manufacturing step 23 and the electrode re-manufacturing step 25 is to use a sputtering method to pass argon and oxygen into a vacuum sputtering machine to form an indium tin oxide (ITO) film or other metal oxide thin film from an indium tin oxide (ITO) target, and another method is to simultaneously sputter an indium oxide (In2O3) target and a tin oxide (SnO2) target or other metal oxide target to form an indium tin oxide (ITO) film or other metal oxide thin film.

In this embodiment, one of the heating evaporation methods described in the electrode manufacturing step 23 and the electrode re-manufacturing step 25 is to use an evaporation method to pass oxygen into a vacuum evaporator to evaporate a single indium tin oxide (ITO) material or a mixed material of indium tin oxide (In2O3) and tin oxide (SnO2) to form a metal oxide film such as an indium tin oxide (ITO) film, and another method is to use a furnace to heat and increase the temperature, pass oxygen at a high temperature, and at the same time, form a metal oxide film such as an indium tin oxide (ITO) film from a mixed material of indium oxide (In2O3) and tin oxide (SnO2).

In this embodiment, in one of the sol-gel methods in the electrode preparation step 23 and the electrode re-preparation step 25, a precursor of indium chloride (In2Cl3) is doped with tin chloride (SnCl4) containing 7at% tin (Sn) in air to form a solute, and ethylene glycol (ethylene glycol) is added to the solute. glycol) and a solvent to mix evenly and heat to form a solution, then the solution is applied by spin coating at a speed of about 2000 revolutions per minute and heated to 200°C at a rate of about 300°C per hour for one hour and then to 600°C for one hour to form a metal oxide film such as indium tin oxide (ITO) film; another method is to dissolve In(NO3)3‧2H2O in acetylacetone solution in nitrogen to form the former The driver is doped with SnCl4 dissolved in ethanol solution to form the solute, wherein SnCl4 contains 8-15wt% Sn. The solute is mixed with acetone solvent to form the solution. The solution is then applied at a speed of about 8.6 cm per minute by immersion method and heated to about 500°C for 20 minutes to form a metal oxide film such as indium tin oxide (ITO) film. Another method is to add indium acetate to the surface of the substrate. The precursor of 1,2-dimethoxy-1,4 ...

In this embodiment, the sputtering method described in the resistor material manufacturing step 24 is to introduce argon and oxygen into a vacuum sputtering machine to sputter a metal target such as a zinc (Zn) target or a zinc oxide (ZnO) target or a metal oxide target to form a metal oxide film such as a zinc oxide (ZnO) film.

In this embodiment, one of the methods of the heating evaporation method in the resistor material manufacturing step 24 is to use an evaporation method to introduce oxygen into a vacuum evaporator to evaporate a single zinc (Zn) material or zinc oxide (ZnO) material or other metal material or metal oxide material to form a zinc oxide (ZnO) film or other metal oxide film; another method is to use a furnace to heat the temperature to about 100°C~500°C and introduce oxygen, and at the same time, the zinc (Zn) material or zinc oxide (ZnO) material or other metal material or metal oxide material is formed into a zinc oxide (ZnO) film or other metal oxide film; and another method is Using the sol-gel method, zinc acetate (Zn(CH3COO)2‧2H2O) containing two crystal waters is used as the solute. The solute is added to anhydrous alcohol (ethanol, C2H5OH) with a solvent of 99.5% to prepare a concentration of 0.05 molar, and then placed on a constant temperature mixer and heated to about 60°C and stirred for two hours to obtain a clear and transparent zinc oxide (ZnO) solution. The solution is then applied at a speed of about 2000 revolutions per minute and heated to 200°C at a rate of about 200°C per hour. After drying for one hour, a zinc oxide (ZnO) film and other metal oxide films are formed.

Referring to FIG. 8 , in the second preferred embodiment, the substrate is prepared in step 21 different from the first preferred embodiment. As shown in the figure, in a three-necked glass bottle, dimethylacetamide (DMAc) and the nanodiamond solution are first mixed to form a dimethylacetamide mixed solution. Next, a portion of the dimethylacetamide mixed solution is mixed with all of the diphenylamine to form a third mixed solution. A portion of the dianhydride is mixed with another portion of the dianhydride to form a fourth mixed solution. Next, the remaining dianhydride is mixed with all of the dimethylacetamide (DMAc) to form a plurality of fifth mixed solutions. The third mixed liquid, the fourth mixed liquid and the fifth mixed liquid are degassed in a vacuum environment. Next, the degassed third mixed liquid, the fourth mixed liquid and the fifth mixed liquid are coated. Finally, they are heated to 300°C in a stepwise manner to perform a dehydration cyclization reaction and remove dimethylacetamide (DMAc) to form a transparent substrate 11. In this embodiment, the above mixing action is performed at a stirring speed of 80 rpm at room temperature and nitrogen is introduced into the three-necked flask throughout the process to prevent water vapor from affecting the molecular weight of the third mixed liquid, the fourth mixed liquid and the fifth mixed liquid and the nanodiamond solution.

Referring to FIG. 9 , in the third preferred embodiment, a substrate is prepared in step 21 different from the first preferred embodiment. As shown in the figure, in a three-necked glass bottle, a portion of dimethylacetamide (DMAc), all of the diphenylamine and the nanodiamond solution are mixed to form a sixth mixed liquid, and then all of the dianhydride and the remaining dimethylacetamide (DMAc) are mixed to form a seventh mixed liquid. The sixth mixed liquid and the seventh mixed liquid are then mixed in a vacuum evaporator. The bubbles are removed in an empty environment, and the debubbled sixth mixed liquid and the seventh mixed liquid are coated. Finally, the temperature is raised to 300°C in a staged manner to perform a dehydration cyclization reaction and remove dimethylacetamide (DMAc) to form a transparent substrate 11. In this embodiment, the above mixing action is performed at room temperature with a stirring speed of 80 rpm and nitrogen is introduced into the three-necked flask throughout the process to prevent water vapor from affecting the molecular weight of the sixth mixed liquid and the seventh mixed liquid.

Referring to FIG. 10 , in the fourth preferred embodiment, a substrate is prepared in step 21 different from the first preferred embodiment. As shown in the figure, in a three-necked glass bottle, a portion of dimethylacetamide (DMAc), a portion of diphenylamine, a portion of dianhydride and a portion of the nanodiamond solution are mixed to form an eighth mixed liquid, and the remaining dimethylacetamide (DMAc), the remaining diphenylamine, the remaining dianhydride and the remaining nanodiamond solution are mixed to form the other two eighth mixed liquids. The eighth mixed liquid is then debubbled in a vacuum environment. Next, the debubbled eighth mixed liquid is coated and finally heated to 300°C in a stepwise manner for dehydration and cyclization reaction to remove dimethylacetamide (DMAc) to form a transparent substrate 11. In this embodiment, the above mixing action is performed at a stirring speed of 80 rpm at room temperature and nitrogen is introduced into the three-necked flask throughout the process to prevent water vapor from affecting the molecular weight of the eighth mixed liquid.

Referring to FIG. 11 , in the fifth preferred embodiment, the substrate is prepared in step 21 different from the first preferred embodiment. As shown in the figure, in a three-necked glass bottle, dimethylacetamide (DMAc) and the nanodiamond solution are first mixed to form a dimethylacetamide mixed solution, and then a portion of the dimethylacetamide (DMAc) is mixed with all the diphenylamine to form a ninth mixed solution. Next, the dianhydride is divided into three dianhydrides, two of which are mixed with the dimethylacetamide mixed solution to form two tenth mixed solutions, and then the last dianhydride is mixed with the remaining dimethylacetamide (DMAc) to form a tenth mixed solution. The eleventh mixed liquid is formed, and the ninth mixed liquid, the tenth mixed liquid and the eleventh mixed liquid are degassed in sequence under a vacuum environment. Next, the degassed ninth mixed liquid, the tenth mixed liquid and the eleventh mixed liquid are coated, and heated to 300°C in a stepwise manner for dehydration and cyclization reaction, and dimethylacetamide (DMAc) is removed to form the transparent substrate 11. In this embodiment, the above mixing action is carried out at room temperature with a stirring speed of 80 rpm and nitrogen is introduced into the three-necked flask throughout the process to prevent water vapor from affecting the molecular weight of the ninth mixed liquid, the tenth mixed liquid and the eleventh mixed liquid.

The above-mentioned embodiments are only for the convenience of explaining the present invention and are not intended to be limiting. Without departing from the spirit and scope of the present invention, various simple modifications and alterations made by skilled persons in the industry according to the scope of the present invention and the invention description should still be included in the scope of the following patent application.

1: Transparent soft board components

11: Transparent substrate

12: Transparent adhesive material

13: First transparent electrode

14: Transparent resistor material

15: Second transparent electrode

Claims (10)

A transparent flexible plate element comprises: a transparent substrate; a transparent bonding material connected to the transparent substrate and composed of a polyimide compound synthesized from a siloxane material; a first transparent electrode connected to the transparent bonding material and composed of one of aluminum zinc oxide or indium tin oxide; a transparent resistor material connected to the first transparent electrode and composed of one of a metal oxide material or a metal nitride material, wherein the transparent resistor material is When subjected to different bias electric fields, a memory structure with adjustable resistance will be formed; and a second transparent electrode connected to the transparent resistor material, which is composed of one of aluminum zinc oxide or indium tin oxide; its characteristics are: the transparent substrate is composed of a fluorine-containing or asymmetric diphenylamine, a fluorine-containing or asymmetric dianhydride, a dimethylacetamide (DMAc) and a nanodiamond solution, and the nanodiamond solution contains a nanodiamond (ND). As described in claim 1, the transparent soft board element, wherein the proportion of the above-mentioned nanodiamond (ND) accounts for 0.1-5% of the total of the above-mentioned diphenylamine, dianhydride, dimethylacetamide (DMAc) and nanodiamond solution. The transparent soft board element as described in claim 1, wherein the particle size of the nanodiamond (ND) is 1 to 20 nanometers. The transparent soft plate element as described in claim 1, wherein the dimethylacetamide (DMAc) is in liquid form, and the diphenylamine and the dianhydride are both in powder form, so that the diphenylamine and the dianhydride can be dissolved in the dimethylacetamide (DMAc) and nanodiamond solution. A method for manufacturing a transparent flexible board element comprises: a substrate manufacturing step: providing a nanodiamond solution containing nanodiamond (ND) in a glass three-necked bottle, and mixing diphenylamine, 1,2-dicarboxylic anhydride, and 1,2-dimethylacetamide (DMAc) with the nanodiamond solution at room temperature at a stirring speed of 80 rpm to form a transparent substrate; a bonding material manufacturing step: mixing a fluorine-containing and asymmetric diamine with a fluorine-containing and asymmetric diamine, cooling and maintaining the temperature at an ice bath, and then adding 1,2-dicarboxylic anhydride and a polydimethylsiloxane to obtain a precursor polyamide containing a siloxane material, and heating and drying the polyamide to form a transparent A bonding material is formed, and the transparent bonding material is connected to the transparent substrate; an electrode manufacturing step: a first transparent electrode composed of a composite metal oxide is formed on the transparent bonding material by one of the methods of sputtering, heating evaporation or sol-gel method; a resistor material manufacturing step: a transparent resistor material composed of a metal oxide material or a metal nitride material is formed on the first transparent electrode by one of the methods of sputtering, heating evaporation or sol-gel method; and an electrode re-manufacturing step: a second transparent electrode composed of a composite metal oxide is formed on the transparent resistor material by one of the methods of sputtering, heating evaporation or sol-gel method. As described in claim 5, the manufacturing method of the transparent flexible board element, wherein, when performing the substrate manufacturing step, all of the diphenylamine and a portion of the dianhydride are mixed with a portion of the dimethylacetamide (DMAc) to form a first mixed liquid, and then the remaining dianhydride is mixed with the remaining dimethylacetamide (DMAc) to form a second mixed liquid, and finally the first mixed liquid, the second mixed liquid and the nanodiamond solution are coated and heated at a high temperature, and the dimethylacetamide (DMAc) is removed to form the transparent substrate. As described in claim 5, the manufacturing method of the transparent flexible board element, wherein, when performing the substrate manufacturing step, the dimethylacetamide (DMAc) is first mixed with the nanodiamond solution to form a dimethylacetamide mixed solution, a portion of the dimethylacetamide mixed solution is mixed with all of the diphenylamine to form a third mixed solution, and another portion of the dimethylacetamide mixed solution is mixed with a portion of the dianhydride to form a fourth mixed solution, and then the remaining dianhydride is mixed with all of the dimethylacetamide (DMAc) to form a fifth mixed solution, and finally the third mixed solution, the fourth mixed solution and the fifth mixed solution are coated and heated at a high temperature, and the dimethylacetamide (DMAc) is removed to form the transparent substrate. As described in claim 5, the manufacturing method of the transparent flexible board element, wherein, when performing the substrate manufacturing step, a portion of the dimethylacetamide (DMAc) and all of the diphenylamine are mixed in the nanodiamond solution to form a sixth mixed liquid, and then the remaining dimethylacetamide (DMAc) is mixed with all of the dianhydride to form a seventh mixed liquid, and finally the sixth mixed liquid and the seventh mixed liquid are coated and heated at a high temperature, and the dimethylacetamide (DMAc) is removed to form the transparent substrate. As described in claim 5, the manufacturing method of the transparent flexible board element, wherein, when performing the substrate manufacturing step, a portion of the dimethylacetamide (DMAc), a portion of the diphenylamine, a portion of the dianhydride and a portion of the nanodiamond solution are mixed to form an eighth mixed liquid, and the remaining dimethylacetamide (DMAc), the remaining diphenylamine, the remaining dianhydride and the remaining nanodiamond solution are mixed to form another eighth mixed liquid, and finally all the eighth mixed liquids are coated with high temperature heating, and the dimethylacetamide (DMAc) is removed to form the transparent substrate. As described in claim 5, the manufacturing method of the transparent flexible board element, wherein, when performing the substrate manufacturing step, the dimethylacetamide (DMAc) is first mixed with the nanodiamond solution to form a dimethylacetamide mixed solution, and then a portion of the dimethylacetamide (DMAc) is mixed with all of the diphenylamine to form a ninth mixed solution, and a portion of the dianhydride is mixed with all of the dimethylacetamide mixed solution to form a tenth mixed solution, and the remaining dianhydride is mixed with the remaining dimethylacetamide (DMAc) to form an eleventh mixed solution, and finally, the ninth mixed solution, the tenth mixed solution and the eleventh mixed solution are coated and heated at a high temperature, and the dimethylacetamide (DMAc) is removed to form the transparent substrate.

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