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TWI843332B - Temperature balancing plate and manufacturing method thereof - Google Patents

Temperature balancing plate and manufacturing method thereof Download PDF

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Publication number
TWI843332B
TWI843332B TW111147627A TW111147627A TWI843332B TW I843332 B TWI843332 B TW I843332B TW 111147627 A TW111147627 A TW 111147627A TW 111147627 A TW111147627 A TW 111147627A TW I843332 B TWI843332 B TW I843332B
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plate
plate body
groove
wall surface
hole
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TW111147627A
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Chinese (zh)
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TW202425732A (en
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林志曄
陳其亮
曾新平
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華晴材料股份有限公司
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Abstract

本創作提出一種均溫板及其製造方法,該均溫板包含一第一板體及一第二板體、一腔室、一通道、一第一穿孔、一密封管體、一第一擠壓件、以及一工作流體,其中該密封管體在對應於該第一擠壓件的位置之內壁面相貼合。該均溫板的製造方法依序包含下列步驟:將第一板體的第一接合面密封接合於第二板體的第二接合面;將一密封管體插入該通道,使一工作流體由該密封管體進入該腔室,再使該腔室內形成真空;將一第一擠壓件設置於該第一穿孔,並將該密封管體擠壓至其內壁面相貼合。藉此本創作不需在板體面外設置突出部以實施閉合,可節省體積。The present invention proposes a temperature averaging plate and a manufacturing method thereof, wherein the temperature averaging plate comprises a first plate body and a second plate body, a chamber, a channel, a first through-hole, a sealing tube body, a first extrusion piece, and a working fluid, wherein the inner wall surface of the sealing tube body at the position corresponding to the first extrusion piece is in contact with each other. The manufacturing method of the temperature averaging plate comprises the following steps in sequence: sealingly joining the first joint surface of the first plate body to the second joint surface of the second plate body; inserting a sealing tube body into the channel so that a working fluid enters the chamber through the sealing tube body, and then forming a vacuum in the chamber; setting a first extrusion piece at the first through-hole, and extruding the sealing tube body until the inner wall surface thereof is in contact with each other. As a result, the present invention does not need to set a protrusion outside the plate body surface to implement closure, which can save volume.

Description

均溫板及其製造方法Heat balancing plate and manufacturing method thereof

本創作是關於一種熱傳遞元件,特別是關於一種均溫板。 This invention is about a heat transfer element, in particular about a heat sink.

均溫板是一種常見的散熱裝置,由於其佔用空間小,且可以大面積的導熱,是故在電子產品中被廣泛地使用。均溫板的工作原理是由其所具有的腔室中的工作流體,在低壓的條件下對流並產生相變化,藉此將熱能由高溫處帶往低溫處。 Vapor chamber is a common heat dissipation device. It is widely used in electronic products because it takes up little space and can conduct heat over a large area. The working principle of the vapor chamber is that the working fluid in the chamber convects and produces phase change under low pressure conditions, thereby transferring heat energy from high temperature to low temperature.

在傳統製造過程中,兩板體密合後,導管可從開口處伸入腔室中抽低壓,再注入工作流體,然後再封閉開口處。此步驟結束後,導管從開口處被截斷,然後以焊接方式將開口封死。如圖11中所示,為了避免影響腔室內工作流體導熱效果,此開口處被設計成突出部91的形式。然而這個突出部91在許多體積限縮、零件空間需求高的電子產品中,造成了嚴重的設計不便性。具體而言,電子產品製造商必須規劃一個空間容納該突出部91,耗費更多成本開模製造零件以對應其外型。 In the traditional manufacturing process, after the two plates are sealed, the conduit can be extended from the opening into the chamber to draw low pressure, then inject the working fluid, and then seal the opening. After this step, the conduit is cut off from the opening and then sealed by welding. As shown in Figure 11, in order to avoid affecting the heat conduction effect of the working fluid in the chamber, this opening is designed in the form of a protrusion 91. However, this protrusion 91 has caused serious design inconveniences in many electronic products with limited volume and high part space requirements. Specifically, electronic product manufacturers must plan a space to accommodate the protrusion 91, and spend more money to open molds and manufacture parts to correspond to its appearance.

有鑑於此,提出一種更佳的改善方案,乃為此業界亟待解決的問題。 In view of this, proposing a better improvement solution is an urgent problem to be solved in this industry.

本創作的主要目的在於,提出一種均溫板及其製造方法,該均溫板不需要其板體面外用以封閉該均溫板內腔室的突出部,方便使用該均溫板的產品內部設計,節省空間。 The main purpose of this invention is to propose a temperature averaging board and its manufacturing method, which does not require a protrusion outside the board body to seal the inner chamber of the temperature averaging board, which facilitates the internal design of the product using the temperature averaging board and saves space.

為達上述目的,本創作提出的均溫板,其包含:一第一板體及一第二板體,其中該第一板體包含:一第一槽底面,其與該第二板體間隔設置;一第一內壁面,其環繞並連接該第一槽底面,且與該第一槽底面互不平行;一第一接合面,其環繞並連接於該第一內壁面;一外壁面,其環繞並連接該第一接合面之外側,且與該第一接合面互不平行;以及一溝部,其形成於該第一接合面,且連通於該第一內壁面及該外壁面,並朝向遠離該第二板體之方向凹陷;且該第二板體包含:一第二接合面,該第一接合面密封接合於該第二接合面;一腔室,其形成於該第一槽底面、該第一內壁面以及該第二板體之間;一通道,其形成於該第二板體及該溝部之間,並與該腔室連通;一第一穿孔,其形成於該溝部,並與該通道連通;一密封管體,其穿設於該通道;一第一擠壓件,其固設於該第一穿孔且該第一擠壓件貼合於該密封管體,且該密封管體在對應於該第一擠壓件的位置之管內面相貼合;以及一工作流體,其設置於該腔室內。 To achieve the above-mentioned purpose, the temperature equalization plate proposed in the invention comprises: a first plate body and a second plate body, wherein the first plate body comprises: a first groove bottom surface, which is spaced apart from the second plate body; a first inner wall surface, which surrounds and connects to the first groove bottom surface, and is not parallel to the first groove bottom surface; a first joint surface, which surrounds and connects to the first inner wall surface; an outer wall surface, which surrounds and connects to the outer side of the first joint surface, and is not parallel to the first joint surface; and a groove portion, which is formed on the first joint surface, connected to the first inner wall surface and the outer wall surface, and is recessed in a direction away from the second plate body; and the first The two plates include: a second joint surface, the first joint surface is sealed and joined to the second joint surface; a chamber formed between the first groove bottom surface, the first inner wall surface and the second plate; a channel formed between the second plate and the groove and connected to the chamber; a first through hole formed in the groove and connected to the channel; a sealing tube penetrated in the channel; a first extrusion piece fixed to the first through hole and the first extrusion piece is attached to the sealing tube, and the sealing tube is attached to the inner surface of the tube at the position corresponding to the first extrusion piece; and a working fluid is arranged in the chamber.

為達上述目的,本創作提出的另一種均溫板,其具有:一第一板體及一第二板體,其中該第一板體包含: 一第一槽底面,其與該第二板體間隔設置;一第一內壁面,其環繞並連接該第一槽底面,且與該第一槽底面互不平行;一第一接合面,其環繞並連接於該第一內壁面;一外壁面,其環繞並連接該第一接合面之外側,且與該第一接合面互不平行;以及一溝部,其形成於該第一接合面,且連通於該第一內壁面及該外壁面,並朝向遠離該第二板體之方向凹陷;且該第二板體包含:一第二接合面,該第一接合面密封接合於該第二接合面;一腔室,其形成於該第一槽底面、該第一內壁面以及該第二板體之間;一通道,其形成於該第二板體及該溝部之間,並與該腔室連通;一第二穿孔,其形成於該第二板體,並與該通道連通;一密封管體,其穿設於該通道;一第二擠壓件,其設置於該第二穿孔且該第二擠壓件貼合於該密封管體,且該密封管體在對應於該第二擠壓件的位置之管內面相貼合;以及一工作流體,其設置於該腔室內。 To achieve the above-mentioned purpose, the invention proposes another temperature-averaging plate, which has: a first plate body and a second plate body, wherein the first plate body comprises: a first groove bottom surface, which is spaced apart from the second plate body; a first inner wall surface, which surrounds and connects to the first groove bottom surface, and is not parallel to the first groove bottom surface; a first joint surface, which surrounds and connects to the first inner wall surface; an outer wall surface, which surrounds and connects to the outer side of the first joint surface, and is not parallel to the first joint surface; and a groove portion, which is formed on the first joint surface, connected to the first inner wall surface and the outer wall surface, and is recessed in a direction away from the second plate body; and the The second plate includes: a second joint surface, the first joint surface is sealed and joined to the second joint surface; a chamber formed between the first groove bottom surface, the first inner wall surface and the second plate; a channel formed between the second plate and the groove and connected to the chamber; a second through hole formed in the second plate and connected to the channel; a sealing tube penetrated in the channel; a second extrusion piece, which is arranged in the second through hole and the second extrusion piece is attached to the sealing tube, and the sealing tube is attached to the inner surface of the tube at the position corresponding to the second extrusion piece; and a working fluid, which is arranged in the chamber.

本創作還提出一種均溫板的製造方法,用以製造前述之均溫板,其依序包含以下步驟:將一第一板體的一第一接合面密封接合於一第二板體的一第二接合面,同時一通道及一腔室形成於該第一板體與該第二板體之間,其中,該通道與該腔室相連通,且該第一板體形成有一第一穿孔,並與該通道連通;將一密封管體插入該通道,並使一工作流體由該密封管體進入該腔室,且透過該密封管體使該腔室內形成真空狀態; 將一第一擠壓件設置於該第一穿孔,並同時將該密封管體擠壓至該密封管體上對應於該第一擠壓件的位置之管內面相貼合,藉此該腔室形成密封狀態。 This invention also proposes a method for manufacturing a temperature balancing plate, which is used to manufacture the aforementioned temperature balancing plate, and includes the following steps in sequence: sealingly joining a first joint surface of a first plate body to a second joint surface of a second plate body, and forming a channel and a chamber between the first plate body and the second plate body, wherein the channel is connected to the chamber, and the first plate body is formed with a first through hole, which is connected to the channel; inserting a sealed tube body into the channel, and allowing a working fluid to enter the chamber from the sealed tube body, and forming a vacuum state in the chamber through the sealed tube body; A first extrusion piece is set at the first through hole, and the sealed tube body is extruded to fit the inner surface of the tube corresponding to the position of the first extrusion piece on the sealed tube body, thereby forming a sealed state in the chamber.

因此,本創作的優點在於,使用擠壓件在透過均溫板板體面內的穿孔將密封管體密合,故製造時不需要在板體面外突出一個部份用以實施閉合。如此一來,使用本創作為元件的相關產品便可節省空間以容納其他的元件。 Therefore, the advantage of this invention is that the extrusion parts are used to seal the sealing tube through the perforations in the surface of the temperature-averaging plate, so there is no need to protrude a part outside the plate surface for closing during manufacturing. In this way, related products using this invention as a component can save space to accommodate other components.

如前所述之均溫板,其中:該溝部包含:一擴張區,其位於該溝部之中段;一內溝區,其連通該第一內壁面及該擴張區;以及一外溝區,其連通該擴張區及該外壁面;其中,該擴張區之寬度大於該內溝區及該外溝區之寬度,且該第一穿孔連通於該擴張區。 The temperature equalizing plate as described above, wherein: the groove portion includes: an expansion area, which is located in the middle section of the groove portion; an inner groove area, which connects the first inner wall surface and the expansion area; and an outer groove area, which connects the expansion area and the outer wall surface; wherein the width of the expansion area is greater than the width of the inner groove area and the outer groove area, and the first through hole is connected to the expansion area.

如前所述之均溫板,其中該第一擠壓件於該第一穿孔之固設方式為緊配合。 As described above, the temperature equalizing plate, wherein the first extrusion member is fixed to the first through hole in a tight fit.

如前所述之均溫板,其中該第一板體更具有:一散熱槽,其位於該第一板體遠離該第二板體之一面,並朝接近該第二板體之方向凹陷,該散熱槽用以增加接觸欲散熱之物品的面積。 As described above, the first plate further has: a heat dissipation groove, which is located on a surface of the first plate away from the second plate and is recessed toward the second plate. The heat dissipation groove is used to increase the area of contact with the object to be dissipated.

如前所述之均溫板,其中:該第二板體更具有:一第二槽底面,其與該第一板體間隔設置;以及一第二內壁面,其環繞並連接該第二槽底面,且該第二接合面環繞連接於該第二內壁面,該第二內壁面與該第二槽底面互不平行; 其中,該腔室形成於該第一槽底面、該第一內壁面、該第二槽底面、以及該第二內壁面之間。 The temperature equalizing plate as described above, wherein: the second plate body further has: a second groove bottom surface, which is spaced apart from the first plate body; and a second inner wall surface, which surrounds and connects to the second groove bottom surface, and the second joint surface surrounds and connects to the second inner wall surface, and the second inner wall surface and the second groove bottom surface are not parallel to each other; Wherein, the chamber is formed between the first groove bottom surface, the first inner wall surface, the second groove bottom surface, and the second inner wall surface.

如前所述之均溫板,其中該第二板體更具有:一溝蓋部,其形成於該第二接合面,且對應於該溝部之位置,朝向遠離該第一板體之方向凹陷,藉此該通道形成於該溝部與該溝蓋部之間。 As described above, the second plate body further has: a groove cover portion, which is formed on the second joint surface and is concave in a direction away from the first plate body corresponding to the position of the groove portion, so that the channel is formed between the groove portion and the groove cover portion.

如前所述之均溫板,其更具有:一第二穿孔,其形成於該第二板體,並與該通道連通;以及一第二擠壓件,其固設於該第二穿孔且該第二擠壓件貼合於該密封管體;其中,該密封管體在對應於該第二擠壓件的位置之管內面相貼合。 The temperature equalizing plate as described above further comprises: a second through hole formed in the second plate body and connected to the channel; and a second extrusion piece fixedly arranged in the second through hole and the second extrusion piece is attached to the sealing tube body; wherein the sealing tube body is attached to the inner surface of the tube at the position corresponding to the second extrusion piece.

如前所述之均溫板的製造方法,其中,該第二板體形成有一第二穿孔,該第二穿孔與該通道連通;該均溫板的製造方法更包含下列步驟:將一第二擠壓件設置於該第二穿孔,並同時將該密封管體擠壓至該密封管體對應於該第二擠壓件的位置之管內面相貼合。 As described above, the manufacturing method of the temperature averaging plate, wherein the second plate body is formed with a second through hole, and the second through hole is connected to the channel; the manufacturing method of the temperature averaging plate further comprises the following steps: a second extrusion piece is arranged at the second through hole, and the sealing tube body is extruded until the inner surface of the sealing tube body corresponding to the position of the second extrusion piece is in contact with each other.

10:第一板體 10: First plate

11:第一槽底面 11: Bottom of the first groove

12:第一內壁面 12: First inner wall surface

13:第一接合面 13: First joint surface

131:溝部 131: Groove

1311:擴張區 1311: Expansion Zone

1312:內溝區 1312: Inner trench area

1313:外溝區 1313: Outer trench area

14:外壁面 14: Outer wall

15:散熱槽 15: Heat sink

20:第二板體 20: Second plate

21:第二槽底面 21: Bottom of the second groove

22:第二內壁面 22: Second inner wall surface

23:第二接合面 23: Second joint surface

231:溝蓋部 231: Groove cover

30:第一穿孔 30: First piercing

31:第二穿孔 31: Second piercing

40:第一擠壓件 40: First extrusion piece

41:第二擠壓件 41: Second extrusion piece

50:密封管體 50: Sealing tube body

60:腔室 60: Chamber

70:通道 70: Channel

91:突出部 91: protrusion

圖1為本創作之均溫板立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the temperature equalization plate of this creation.

圖2為本創作之均溫板的底側仰視示意圖。 Figure 2 is a bottom view of the temperature equalizing plate of this invention.

圖3為本創作之均溫板的立體分解示意圖。 Figure 3 is a three-dimensional exploded diagram of the temperature equalizing plate of this creation.

圖4為本創作之均溫板中第一板體的俯視示意圖。 Figure 4 is a top view of the first plate in the temperature equalization plate of this invention.

圖5為本創作之均溫板中密封管體置於通道時的第一板體之俯視示意圖。 Figure 5 is a top view of the first plate body when the sealed tube body is placed in the channel in the temperature equalization plate of this invention.

圖6為本創作圖2之均溫板中之A-A剖面的通道之側面剖視示意圖。 Figure 6 is a schematic side cross-sectional view of the channel at section A-A in the temperature equalizing plate of Figure 2 of this work.

圖7為本創作之均溫板中另一實施例的通道之側面剖視示意圖。 Figure 7 is a schematic side cross-sectional view of a channel in another embodiment of the temperature equalizing plate of this invention.

圖8為本創作之製造方法中的「第一板體與第二板體密封接合」步驟之示意圖。 Figure 8 is a schematic diagram of the step of "sealing the first plate and the second plate" in the manufacturing method of this invention.

圖9為本創作之製造方法中的「將密封管體插入第一板體與第二板體之間」步驟之示意圖。 Figure 9 is a schematic diagram of the step of "inserting the sealing tube between the first plate and the second plate" in the manufacturing method of this invention.

圖10為本創作之製造方法中的「以第一擠壓件及/或第二擠壓件擠壓密封管體至密合」步驟之示意圖。 Figure 10 is a schematic diagram of the step of "using the first extrusion piece and/or the second extrusion piece to extrude and seal the tube body until it is tightly fitted" in the manufacturing method of this invention.

圖11為先前技術的立體示意圖。 Figure 11 is a three-dimensional schematic diagram of the prior art.

首先請參考圖1至圖6,本創作提出一種均溫板,其具有一第一板體10、一第二板體20、一第一穿孔30、一第二穿孔31、一第一擠壓件40、一第二擠壓件41、一密封管體50、一腔室60、一通道70以及一工作流體。 First, please refer to Figures 1 to 6. This invention proposes a temperature equalization plate, which has a first plate body 10, a second plate body 20, a first through hole 30, a second through hole 31, a first extrusion member 40, a second extrusion member 41, a sealing tube 50, a chamber 60, a channel 70 and a working fluid.

第一板體10包含一第一槽底面11、一第一內壁面12、一第一接合面13、一溝部131、一外壁面14、以及一散熱槽15。第一槽底面11與第二板體20間隔設置。第一內壁面12環繞並連接第一槽底面11,且與第一槽底面11互不平行。第一接合面13環繞並連接於第一內壁面12。外壁面14環繞並連接第一接合面13之外側,且與第一接合面13互不平行。本實施例中,第一內壁面12垂直於第一槽底面11與第一接合面13,換言之,第一槽底面11與第一接合面13互相平行,但並不以此為限;在其他實施例中,第一槽底面11可不平行於第一接合面13,具體而言,第一槽底面11與第一內壁面12可形成一相對於第一接合面13具有底部深度變化之凹槽。 The first plate 10 includes a first groove bottom surface 11, a first inner wall surface 12, a first joint surface 13, a groove 131, an outer wall surface 14, and a heat sink 15. The first groove bottom surface 11 is spaced apart from the second plate 20. The first inner wall surface 12 surrounds and connects the first groove bottom surface 11, and is not parallel to the first groove bottom surface 11. The first joint surface 13 surrounds and connects the first inner wall surface 12. The outer wall surface 14 surrounds and connects the outer side of the first joint surface 13, and is not parallel to the first joint surface 13. In this embodiment, the first inner wall surface 12 is perpendicular to the first groove bottom surface 11 and the first joint surface 13. In other words, the first groove bottom surface 11 and the first joint surface 13 are parallel to each other, but this is not limited to this; in other embodiments, the first groove bottom surface 11 may not be parallel to the first joint surface 13. Specifically, the first groove bottom surface 11 and the first inner wall surface 12 may form a groove with a bottom depth variation relative to the first joint surface 13.

溝部131形成於第一接合面13,且連通於第一內壁面12及外壁面14,並朝向遠離第二板體20之方向凹陷。溝部131包含一擴張區1311、一內溝區1312、以及一外溝區1313。擴張區1311位於溝部131之中段。內溝區1312連 通第一內壁面12及擴張區1311。外溝區1313連通擴張區1311及外壁面14。其中,擴張區1311之寬度大於內溝區1312及外溝區1313之寬度,且第一穿孔30連通於擴張區1311。 The groove 131 is formed on the first joint surface 13, connected to the first inner wall surface 12 and the outer wall surface 14, and is recessed in a direction away from the second plate body 20. The groove 131 includes an expansion area 1311, an inner groove area 1312, and an outer groove area 1313. The expansion area 1311 is located in the middle section of the groove 131. The inner groove area 1312 connects the first inner wall surface 12 and the expansion area 1311. The outer groove area 1313 connects the expansion area 1311 and the outer wall surface 14. The width of the expansion area 1311 is greater than the width of the inner groove area 1312 and the outer groove area 1313, and the first through hole 30 is connected to the expansion area 1311.

散熱槽15位於第一板體10遠離第二板體20之一面,並朝接近第二板體20之方向凹陷。其用以增加接觸欲散熱之物品的面積。例如可將電腦之中央處理器容置於其中,並貼合其外型,藉此增加接觸面積,以達增加散熱效率之功效。在其他實施例中,第一板體10可不具有散熱槽15。 The heat sink 15 is located on a surface of the first plate 10 away from the second plate 20 and is recessed toward the second plate 20. It is used to increase the area of contact with the object to be cooled. For example, the central processing unit of a computer can be placed therein and fit its shape to increase the contact area and achieve the effect of increasing the heat dissipation efficiency. In other embodiments, the first plate 10 may not have the heat sink 15.

第二板體20包含一第二槽底面21、一第二內壁面22、一第二接合面23、以及一溝蓋部231。第二槽底面21與第一板體10間隔設置。第二內壁面22環繞並連接於第二槽底面21。第二接合面23環繞並連接於第二內壁面22,且第一接合面13密封接合於第二接合面23。類似地,第二內壁面22與第二槽底面21互不平行。在本實施例中,第二內壁面22垂直於第二槽底面21,但並不以此為限。同樣地,在其他實施例中,第二槽底面21與第二內壁面22可形成一相對於第二接合面23具有底部深度變化之凹槽。在其他實施例中,第二板體20可不具有第二內壁面22與第二槽底面21。 The second plate 20 includes a second groove bottom surface 21, a second inner wall surface 22, a second joint surface 23, and a groove cover 231. The second groove bottom surface 21 is spaced apart from the first plate 10. The second inner wall surface 22 surrounds and is connected to the second groove bottom surface 21. The second joint surface 23 surrounds and is connected to the second inner wall surface 22, and the first joint surface 13 is sealed and joined to the second joint surface 23. Similarly, the second inner wall surface 22 and the second groove bottom surface 21 are not parallel to each other. In this embodiment, the second inner wall surface 22 is perpendicular to the second groove bottom surface 21, but is not limited thereto. Similarly, in other embodiments, the second groove bottom surface 21 and the second inner wall surface 22 may form a groove having a bottom depth variation relative to the second joint surface 23. In other embodiments, the second plate 20 may not have a second inner wall surface 22 and a second groove bottom surface 21.

溝蓋部231形成於第二接合面23上相對於第一板體10之溝部131的位置,朝向遠離第一板體10之方向凹陷。藉此通道70形成於溝蓋部231以及溝部131之間。在其他實施例中,第二板體20可不具有溝蓋部231,此時通道70形成於溝部131與第二板體20之間。 The groove cover 231 is formed on the second joint surface 23 at a position relative to the groove 131 of the first plate 10, and is recessed in a direction away from the first plate 10. Thus, the channel 70 is formed between the groove cover 231 and the groove 131. In other embodiments, the second plate 20 may not have the groove cover 231, and in this case, the channel 70 is formed between the groove 131 and the second plate 20.

本實施例中,腔室60形成於第一槽底面11、第一內壁面12、第二槽底面21、以及第二內壁面22之間。在前述第二板體20不具有第二內壁面22與第二槽底面21的其他實施例中,腔室60形成於第一槽底面11、第一內壁面12、以及第二板體20之間。工作流體位於腔室60內。 In this embodiment, the chamber 60 is formed between the first groove bottom surface 11, the first inner wall surface 12, the second groove bottom surface 21, and the second inner wall surface 22. In other embodiments in which the second plate body 20 does not have the second inner wall surface 22 and the second groove bottom surface 21, the chamber 60 is formed between the first groove bottom surface 11, the first inner wall surface 12, and the second plate body 20. The working fluid is located in the chamber 60.

第一穿孔30形成於第一板體10之溝部131的擴張區1311,且連通於通道70。第一擠壓件40固設於第一穿孔30內。本實施例中,第一擠壓件40以緊配合形式固設於第一穿孔30中,但並不以此為限,在其他實施例中,也可用焊接形式將第一擠壓件40固設於第一穿孔30中。 The first through hole 30 is formed in the expansion area 1311 of the groove 131 of the first plate 10 and is connected to the channel 70. The first extrusion piece 40 is fixed in the first through hole 30. In this embodiment, the first extrusion piece 40 is fixed in the first through hole 30 in a tight fit, but it is not limited to this. In other embodiments, the first extrusion piece 40 can also be fixed in the first through hole 30 by welding.

第二穿孔31形成於第二板體20,且連通於通道70。第二擠壓件41固設於第二穿孔31中,同樣地,本實施例中,第二擠壓件41是以緊配合的形式固設於第二穿孔31中。此外,本實施例中,第一穿孔30對應於第二穿孔31之位置,但並不以此為限;在其他實施例中,第一穿孔30可不對應於第二穿孔31之位置。 The second through hole 31 is formed in the second plate 20 and connected to the channel 70. The second extruding member 41 is fixed in the second through hole 31. Similarly, in this embodiment, the second extruding member 41 is fixed in the second through hole 31 in a tight fit. In addition, in this embodiment, the first through hole 30 corresponds to the position of the second through hole 31, but it is not limited to this; in other embodiments, the first through hole 30 may not correspond to the position of the second through hole 31.

接著請參考圖5至圖7。密封管體50穿設於通道70中,且第一擠壓件40與第二擠壓件41皆貼合於密封管體50。此外,密封管體50在對應於第一擠壓件40的位置之管內面相貼合;同樣的,密封管體50在對應第二擠壓件41的位置之管內面相貼合。具體而言,本實施例中的密封管體50於被第一擠壓件40及第二擠壓件41所夾擠的部分密封貼合。因為夾擠造成的變形,密封管體50中貼合部分的管體寬度擴張,第一板體10之溝部131中的擴張區1311部分用以容置密封管體50中該寬度擴張之部分。換言之,溝部131的寬度變化對應密封管體50的寬度變化,藉此容置被第一擠壓件40與第二擠壓件41夾擠之密封管體50。在其他實施例中,可以僅具有第一穿孔30與第一擠壓件40,或僅具有第二穿孔31與第二擠壓件41。 Next, please refer to Figures 5 to 7. The sealing tube body 50 is inserted into the channel 70, and the first extruder 40 and the second extruder 41 are both attached to the sealing tube body 50. In addition, the inner surface of the tube of the sealing tube body 50 is attached at a position corresponding to the first extruder 40; similarly, the inner surface of the tube of the sealing tube body 50 is attached at a position corresponding to the second extruder 41. Specifically, the sealing tube body 50 in the present embodiment is sealed and attached at the portion squeezed by the first extruder 40 and the second extruder 41. Due to the deformation caused by squeezing, the width of the sealing tube body 50 in the attached portion is expanded, and the expansion area 1311 in the groove 131 of the first plate body 10 is used to accommodate the portion of the sealing tube body 50 with the expanded width. In other words, the width change of the groove 131 corresponds to the width change of the sealing tube 50, thereby accommodating the sealing tube 50 squeezed by the first squeezing member 40 and the second squeezing member 41. In other embodiments, there may be only the first through hole 30 and the first squeezing member 40, or only the second through hole 31 and the second squeezing member 41.

接著請參考圖8至圖10,在本實施例中,製造本創作的均溫板時,依序包含下列步驟:將第一板體10與第二板體20密封接合、將密封管體50插入第一板體10與第二板體20之間、以第一擠壓件40及/或第二擠壓件41擠壓密封管體50至密合。 Next, please refer to Figures 8 to 10. In this embodiment, the manufacturing of the temperature equalization plate of this invention includes the following steps in sequence: sealing the first plate 10 and the second plate 20, inserting the sealing tube 50 between the first plate 10 and the second plate 20, and squeezing the sealing tube 50 with the first extrusion piece 40 and/or the second extrusion piece 41 until it is tightly fitted.

於「第一板體10與第二板體20密封接合」之步驟中,首先將第一板體10的第一接合面13密封接合於第二板體20的第二接合面23,此時腔室60及通道70形成於第一板體10與第二板體20之間。其中,第一板體10形成有一第一穿孔30,且第二板體20形成有第二穿孔31,腔室60與通道70相連通。 In the step of "sealing the first plate 10 and the second plate 20", the first joint surface 13 of the first plate 10 is first sealed and joined to the second joint surface 23 of the second plate 20. At this time, the chamber 60 and the channel 70 are formed between the first plate 10 and the second plate 20. The first plate 10 is formed with a first through hole 30, and the second plate 20 is formed with a second through hole 31. The chamber 60 and the channel 70 are connected.

於「將密封管體50插入第一板體10與第二板體20之間」之步驟中,將一密封管體50插入通道70,並通入至腔室60,接著使一工作流體由密封管體50進入腔室60,再透過密封管體50使腔室60內形成真空狀態。 In the step of "inserting the sealing tube 50 between the first plate 10 and the second plate 20", a sealing tube 50 is inserted into the channel 70 and passed into the chamber 60, and then a working fluid is allowed to enter the chamber 60 from the sealing tube 50, and then a vacuum state is formed in the chamber 60 through the sealing tube 50.

於「以第一擠壓件40及/或第二擠壓件41擠壓密封管體50至密合」之步驟中,分別將第一擠壓件40設置於第一穿孔30,第二擠壓件41設置於第二穿孔31,並同時透過第一擠壓件40及第二擠壓件41對密封管體50實施擠壓,直至密封管體50對應於第一擠壓件40及第二擠壓件41的部分的管內面相貼合,阻斷密封管體50內部的連通,進而阻斷通道70的連通,藉此腔室60形成密封狀態。 In the step of "using the first extrusion piece 40 and/or the second extrusion piece 41 to squeeze the sealing tube 50 until it is tightly fitted", the first extrusion piece 40 is respectively set in the first through hole 30, and the second extrusion piece 41 is set in the second through hole 31, and the sealing tube 50 is squeezed by the first extrusion piece 40 and the second extrusion piece 41 at the same time until the inner surfaces of the sealing tube 50 corresponding to the first extrusion piece 40 and the second extrusion piece 41 are in contact with each other, thereby blocking the connection inside the sealing tube 50, and further blocking the connection of the channel 70, so that the chamber 60 forms a sealed state.

在其他實施例中,於「以第一擠壓件40及/或第二擠壓件41擠壓密封管體50至密合」之步驟中,在僅有第一穿孔30及第一擠壓件40或僅有第二穿孔31及第二擠壓件41之情形時,可將第一擠壓件40設置於第一穿孔30內朝第二板體20方向對密封管體50實施擠壓且另一側以模具進行支撐,或可將第二擠壓件41設置於第二穿孔31內朝第一板體10方向對密封管體50實施擠壓且另一側以模具進行支撐,直至密封管體50對應於第一擠壓件40或第二擠壓件41的管內面相貼合,最終亦可達成使腔室60形成密封狀態的結果。 In other embodiments, in the step of "using the first extrusion piece 40 and/or the second extrusion piece 41 to squeeze the sealing tube 50 until it is tightly fitted", when there are only the first through hole 30 and the first extrusion piece 40 or only the second through hole 31 and the second extrusion piece 41, the first extrusion piece 40 can be placed in the first through hole 30 and the sealing tube 50 can be squeezed toward the second plate 20. Extrusion and support on the other side with a mold, or the second extrusion piece 41 can be placed in the second through hole 31 to extrude the sealing tube 50 toward the first plate 10 and support on the other side with a mold until the sealing tube 50 is in contact with the inner surface of the first extrusion piece 40 or the second extrusion piece 41, and finally the chamber 60 can be sealed.

最後,將多餘的密封管體50外露部分剪除,即,將密封管體50突出於外壁面14的部分剪除,也可以再用焊料以焊接方式進一步密封,但並不以此為限。 Finally, the excess exposed portion of the sealing tube 50 is cut off, that is, the portion of the sealing tube 50 protruding from the outer wall surface 14 is cut off, and solder can be used to further seal it by welding, but it is not limited to this.

綜上所述,本創作的均溫板在製造過程中,在均溫板第一板體10的板體面範圍內的第一穿孔30及/或第二板體20的板體面範圍內的第二穿孔31,使用第一擠壓件40及/或第二擠壓件41將密閉管體50之管道擠壓至閉合,故不需要在第一板體10及第二板體20外側突出一個部份用以實施閉合。如此一來,應用本創作的均溫板作為散熱元件的相關產品便可節省空間以容納其他的元件。 In summary, during the manufacturing process of the heat spreader of the invention, the first through hole 30 within the plate surface of the first plate 10 of the heat spreader and/or the second through hole 31 within the plate surface of the second plate 20 are squeezed and closed by the first extrusion piece 40 and/or the second extrusion piece 41, so there is no need to protrude a portion outside the first plate 10 and the second plate 20 for closing. In this way, the related products using the heat spreader of the invention as a heat dissipation element can save space to accommodate other elements.

10:第一板體 10: First plate

20:第二板體 20: Second plate

41:第二穿孔 41: Second piercing

50:密封管體 50: Sealing tube body

Claims (10)

一種均溫板,其具有: 一第一板體及一第二板體,其中該第一板體包含: 一第一槽底面,其與該第二板體間隔設置; 一第一內壁面,其環繞並連接該第一槽底面,且與該第一槽底面互不平行; 一第一接合面,其環繞並連接於該第一內壁面; 一外壁面,其環繞並連接該第一接合面之外側,且與該第一接合面互不平行;以及 一溝部,其形成於該第一接合面,且連通於該第一內壁面及該外壁面,並朝向遠離該第二板體之方向凹陷;且 該第二板體包含: 一第二接合面,該第一接合面密封接合於該第二接合面; 一腔室,其形成於該第一槽底面、該第一內壁面以及該第二板體之間; 一通道,其形成於該第二板體及該溝部之間,並與該腔室連通; 一第一穿孔,其形成於該溝部,並與該通道連通; 一密封管體,其穿設於該通道; 一第一擠壓件,其固設於該第一穿孔且該第一擠壓件貼合於該密封管體,且該密封管體在對應於該第一擠壓件的位置之管內面相貼合;以及 一工作流體,其設置於該腔室內。 A temperature-averaging plate, comprising: a first plate body and a second plate body, wherein the first plate body comprises: a first groove bottom surface, which is spaced apart from the second plate body; a first inner wall surface, which surrounds and connects to the first groove bottom surface, and is not parallel to the first groove bottom surface; a first joint surface, which surrounds and connects to the first inner wall surface; an outer wall surface, which surrounds and connects to the outer side of the first joint surface, and is not parallel to the first joint surface; and a groove portion, which is formed on the first joint surface, connected to the first inner wall surface and the outer wall surface, and is recessed in a direction away from the second plate body; and the second plate body comprises: a second joint surface, the first joint surface is sealed and joined to the second joint surface; a chamber, which is formed between the first groove bottom surface, the first inner wall surface and the second plate body; A channel formed between the second plate and the groove and connected to the chamber; A first through hole formed in the groove and connected to the channel; A sealing tube penetrated in the channel; A first extrusion piece fixed to the first through hole and affixed to the sealing tube, and the sealing tube is affixed to the inner surface of the tube corresponding to the position of the first extrusion piece; and A working fluid is disposed in the chamber. 如請求項1所述之均溫板,其中: 該溝部包含: 一擴張區,其位於該溝部之中段; 一內溝區,其連通該第一內壁面及該擴張區;以及 一外溝區,其連通該擴張區及該外壁面; 其中,該擴張區之寬度大於該內溝區及該外溝區之寬度,且該第一穿孔連通於該擴張區。 The temperature equalization plate as described in claim 1, wherein: The groove portion includes: An expansion zone located in the middle section of the groove portion; An inner groove zone connecting the first inner wall surface and the expansion zone; and An outer groove zone connecting the expansion zone and the outer wall surface; Wherein, the width of the expansion zone is greater than the width of the inner groove zone and the outer groove zone, and the first through hole is connected to the expansion zone. 如請求項1所述之均溫板,其中該第一擠壓件於該第一穿孔之固設方式為緊配合。A temperature equalizing plate as described in claim 1, wherein the first extrusion piece is fixed to the first through hole in a tight fit. 如請求項1所述之均溫板,其中該第一板體更具有: 一散熱槽,其位於該第一板體遠離該第二板體之一面,並朝接近該第二板體之方向凹陷,該散熱槽用以增加接觸欲散熱之物品的面積。 The temperature equalizing plate as described in claim 1, wherein the first plate body further has: A heat dissipation groove, which is located on a surface of the first plate body away from the second plate body and is recessed toward the second plate body, and the heat dissipation groove is used to increase the area of contact with the object to be dissipated. 如請求項1所述之均溫板,其中: 該第二板體更具有: 一第二槽底面,其與該第一板體間隔設置;以及 一第二內壁面,其環繞並連接該第二槽底面,且該第二接合面環繞連接於該第二內壁面,該第二內壁面與該第二槽底面互不平行; 其中,該腔室形成於該第一槽底面、該第一內壁面、該第二槽底面、以及該第二內壁面之間。 The temperature equalizing plate as described in claim 1, wherein: The second plate body further has: A second groove bottom surface, which is spaced apart from the first plate body; and A second inner wall surface, which surrounds and connects to the second groove bottom surface, and the second joint surface surrounds and connects to the second inner wall surface, and the second inner wall surface and the second groove bottom surface are not parallel to each other; Wherein, the chamber is formed between the first groove bottom surface, the first inner wall surface, the second groove bottom surface, and the second inner wall surface. 如請求項1所述之均溫板,其中該第二板體更具有: 一溝蓋部,其形成於該第二接合面,且對應於該溝部之位置,朝向遠離該第一板體之方向凹陷,藉此該通道形成於該溝部與該溝蓋部之間。 The temperature equalizing plate as described in claim 1, wherein the second plate body further has: A groove cover portion, which is formed on the second joint surface and is recessed in a direction away from the first plate body corresponding to the position of the groove portion, so that the channel is formed between the groove portion and the groove cover portion. 如請求項1所述之均溫板,其更具有: 一第二穿孔,其形成於該第二板體,並與該通道連通;以及 一第二擠壓件,其固設於該第二穿孔且該第二擠壓件貼合於該密封管體; 其中,該密封管體在對應於該第二擠壓件的位置之管內面相貼合。 The temperature equalizing plate as described in claim 1 further comprises: a second through hole formed in the second plate body and connected to the channel; and a second extrusion piece fixed to the second through hole and the second extrusion piece is attached to the sealing tube body; wherein the sealing tube body is attached to the inner surface of the tube at the position corresponding to the second extrusion piece. 一種均溫板,其具有: 一第一板體及一第二板體,其中該第一板體包含: 一第一槽底面,其與該第二板體間隔設置; 一第一內壁面,其環繞並連接該第一槽底面,且與該第一槽底面互不平行; 一第一接合面,其環繞並連接於該第一內壁面; 一外壁面,其環繞並連接該第一接合面之外側,且與該第一接合面互不平行;以及 一溝部,其形成於該第一接合面,且連通於該第一內壁面及該外壁面,並朝向遠離該第二板體之方向凹陷;且 該第二板體包含: 一第二接合面,該第一接合面密封接合於該第二接合面; 一腔室,其形成於該第一槽底面、該第一內壁面以及該第二板體之間; 一通道,其形成於該第二板體及該溝部之間,並與該腔室連通; 一第二穿孔,其形成於該第二板體,並與該通道連通; 一密封管體,其穿設於該通道; 一第二擠壓件,其設置於該第二穿孔且該第二擠壓件貼合於該密封管體,且該密封管體在對應於該第二擠壓件的位置之管內面相貼合;以及 一工作流體,其設置於該腔室內。 A temperature-averaging plate, comprising: a first plate body and a second plate body, wherein the first plate body comprises: a first groove bottom surface, which is spaced apart from the second plate body; a first inner wall surface, which surrounds and connects to the first groove bottom surface, and is not parallel to the first groove bottom surface; a first joint surface, which surrounds and connects to the first inner wall surface; an outer wall surface, which surrounds and connects to the outer side of the first joint surface, and is not parallel to the first joint surface; and a groove portion, which is formed on the first joint surface, connected to the first inner wall surface and the outer wall surface, and is recessed in a direction away from the second plate body; and the second plate body comprises: a second joint surface, the first joint surface is sealed and joined to the second joint surface; a chamber, which is formed between the first groove bottom surface, the first inner wall surface and the second plate body; A channel formed between the second plate and the groove and connected to the chamber; A second through hole formed in the second plate and connected to the channel; A sealing tube penetrating the channel; A second extrusion piece disposed in the second through hole and affixed to the sealing tube, and the sealing tube is affixed to the inner surface of the tube corresponding to the position of the second extrusion piece; and A working fluid disposed in the chamber. 一種均溫板的製造方法,其依序包含下列步驟: 將一第一板體的一第一接合面密封接合於一第二板體的一第二接合面,同時一通道及一腔室形成於該第一板體與該第二板體之間,其中,該通道與該腔室相連通,且該第一板體形成有一第一穿孔,並與該通道連通; 將一密封管體插入該通道,並使一工作流體由該密封管體進入該腔室,且透過該密封管體使該腔室內形成真空狀態; 將一第一擠壓件設置於該第一穿孔,並同時將該密封管體擠壓至該密封管體上對應於該第一擠壓件的位置之管內面相貼合,藉此該腔室形成密封狀態。 A method for manufacturing a temperature-averaging plate comprises the following steps in sequence: Sealing a first joint surface of a first plate body to a second joint surface of a second plate body, and forming a channel and a chamber between the first plate body and the second plate body, wherein the channel is connected to the chamber, and the first plate body is formed with a first through hole, which is connected to the channel; Inserting a sealed tube body into the channel, and allowing a working fluid to enter the chamber from the sealed tube body, and forming a vacuum state in the chamber through the sealed tube body; Placing a first extrusion piece at the first through hole, and at the same time extruding the sealed tube body to fit the inner surface of the tube corresponding to the position of the first extrusion piece on the sealed tube body, thereby forming a sealed state in the chamber. 如請求項9所述之均溫板的製造方法,其中,該第二板體形成有一第二穿孔,該第二穿孔與該通道連通;該均溫板的製造方法更包含下列步驟: 將一第二擠壓件設置於該第二穿孔,並同時將該密封管體擠壓至該密封管體對應於該第二擠壓件的位置之管內面相貼合。 The manufacturing method of the temperature balancing plate as described in claim 9, wherein the second plate body is formed with a second through hole, and the second through hole is connected to the channel; the manufacturing method of the temperature balancing plate further comprises the following steps: A second extrusion piece is arranged at the second through hole, and the sealing tube body is extruded until the inner surface of the sealing tube body corresponding to the position of the second extrusion piece is in contact with each other.
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CN111366021A (en) * 2018-12-25 2020-07-03 讯凯国际股份有限公司 Temperature-equalizing plate and manufacturing method thereof
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TW202223322A (en) * 2020-12-01 2022-06-16 奇鋐科技股份有限公司 Vapor chamber structure

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TWM345222U (en) * 2008-06-20 2008-11-21 Celsia Technologies Taiwan Inc Vacuum chamber and supporting structure thereof
US20100006268A1 (en) * 2008-07-14 2010-01-14 Meyer Iv George Anthony Vapor chamber and supporting structure of the same
CN111366021A (en) * 2018-12-25 2020-07-03 讯凯国际股份有限公司 Temperature-equalizing plate and manufacturing method thereof
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TW202223322A (en) * 2020-12-01 2022-06-16 奇鋐科技股份有限公司 Vapor chamber structure

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