TWI843332B - Temperature balancing plate and manufacturing method thereof - Google Patents
Temperature balancing plate and manufacturing method thereof Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000001125 extrusion Methods 0.000 claims abstract description 60
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- 239000012530 fluid Substances 0.000 claims abstract description 14
- 238000012935 Averaging Methods 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000005304 joining Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
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Abstract
本創作提出一種均溫板及其製造方法,該均溫板包含一第一板體及一第二板體、一腔室、一通道、一第一穿孔、一密封管體、一第一擠壓件、以及一工作流體,其中該密封管體在對應於該第一擠壓件的位置之內壁面相貼合。該均溫板的製造方法依序包含下列步驟:將第一板體的第一接合面密封接合於第二板體的第二接合面;將一密封管體插入該通道,使一工作流體由該密封管體進入該腔室,再使該腔室內形成真空;將一第一擠壓件設置於該第一穿孔,並將該密封管體擠壓至其內壁面相貼合。藉此本創作不需在板體面外設置突出部以實施閉合,可節省體積。The present invention proposes a temperature averaging plate and a manufacturing method thereof, wherein the temperature averaging plate comprises a first plate body and a second plate body, a chamber, a channel, a first through-hole, a sealing tube body, a first extrusion piece, and a working fluid, wherein the inner wall surface of the sealing tube body at the position corresponding to the first extrusion piece is in contact with each other. The manufacturing method of the temperature averaging plate comprises the following steps in sequence: sealingly joining the first joint surface of the first plate body to the second joint surface of the second plate body; inserting a sealing tube body into the channel so that a working fluid enters the chamber through the sealing tube body, and then forming a vacuum in the chamber; setting a first extrusion piece at the first through-hole, and extruding the sealing tube body until the inner wall surface thereof is in contact with each other. As a result, the present invention does not need to set a protrusion outside the plate body surface to implement closure, which can save volume.
Description
本創作是關於一種熱傳遞元件,特別是關於一種均溫板。 This invention is about a heat transfer element, in particular about a heat sink.
均溫板是一種常見的散熱裝置,由於其佔用空間小,且可以大面積的導熱,是故在電子產品中被廣泛地使用。均溫板的工作原理是由其所具有的腔室中的工作流體,在低壓的條件下對流並產生相變化,藉此將熱能由高溫處帶往低溫處。 Vapor chamber is a common heat dissipation device. It is widely used in electronic products because it takes up little space and can conduct heat over a large area. The working principle of the vapor chamber is that the working fluid in the chamber convects and produces phase change under low pressure conditions, thereby transferring heat energy from high temperature to low temperature.
在傳統製造過程中,兩板體密合後,導管可從開口處伸入腔室中抽低壓,再注入工作流體,然後再封閉開口處。此步驟結束後,導管從開口處被截斷,然後以焊接方式將開口封死。如圖11中所示,為了避免影響腔室內工作流體導熱效果,此開口處被設計成突出部91的形式。然而這個突出部91在許多體積限縮、零件空間需求高的電子產品中,造成了嚴重的設計不便性。具體而言,電子產品製造商必須規劃一個空間容納該突出部91,耗費更多成本開模製造零件以對應其外型。
In the traditional manufacturing process, after the two plates are sealed, the conduit can be extended from the opening into the chamber to draw low pressure, then inject the working fluid, and then seal the opening. After this step, the conduit is cut off from the opening and then sealed by welding. As shown in Figure 11, in order to avoid affecting the heat conduction effect of the working fluid in the chamber, this opening is designed in the form of a
有鑑於此,提出一種更佳的改善方案,乃為此業界亟待解決的問題。 In view of this, proposing a better improvement solution is an urgent problem to be solved in this industry.
本創作的主要目的在於,提出一種均溫板及其製造方法,該均溫板不需要其板體面外用以封閉該均溫板內腔室的突出部,方便使用該均溫板的產品內部設計,節省空間。 The main purpose of this invention is to propose a temperature averaging board and its manufacturing method, which does not require a protrusion outside the board body to seal the inner chamber of the temperature averaging board, which facilitates the internal design of the product using the temperature averaging board and saves space.
為達上述目的,本創作提出的均溫板,其包含:一第一板體及一第二板體,其中該第一板體包含:一第一槽底面,其與該第二板體間隔設置;一第一內壁面,其環繞並連接該第一槽底面,且與該第一槽底面互不平行;一第一接合面,其環繞並連接於該第一內壁面;一外壁面,其環繞並連接該第一接合面之外側,且與該第一接合面互不平行;以及一溝部,其形成於該第一接合面,且連通於該第一內壁面及該外壁面,並朝向遠離該第二板體之方向凹陷;且該第二板體包含:一第二接合面,該第一接合面密封接合於該第二接合面;一腔室,其形成於該第一槽底面、該第一內壁面以及該第二板體之間;一通道,其形成於該第二板體及該溝部之間,並與該腔室連通;一第一穿孔,其形成於該溝部,並與該通道連通;一密封管體,其穿設於該通道;一第一擠壓件,其固設於該第一穿孔且該第一擠壓件貼合於該密封管體,且該密封管體在對應於該第一擠壓件的位置之管內面相貼合;以及一工作流體,其設置於該腔室內。 To achieve the above-mentioned purpose, the temperature equalization plate proposed in the invention comprises: a first plate body and a second plate body, wherein the first plate body comprises: a first groove bottom surface, which is spaced apart from the second plate body; a first inner wall surface, which surrounds and connects to the first groove bottom surface, and is not parallel to the first groove bottom surface; a first joint surface, which surrounds and connects to the first inner wall surface; an outer wall surface, which surrounds and connects to the outer side of the first joint surface, and is not parallel to the first joint surface; and a groove portion, which is formed on the first joint surface, connected to the first inner wall surface and the outer wall surface, and is recessed in a direction away from the second plate body; and the first The two plates include: a second joint surface, the first joint surface is sealed and joined to the second joint surface; a chamber formed between the first groove bottom surface, the first inner wall surface and the second plate; a channel formed between the second plate and the groove and connected to the chamber; a first through hole formed in the groove and connected to the channel; a sealing tube penetrated in the channel; a first extrusion piece fixed to the first through hole and the first extrusion piece is attached to the sealing tube, and the sealing tube is attached to the inner surface of the tube at the position corresponding to the first extrusion piece; and a working fluid is arranged in the chamber.
為達上述目的,本創作提出的另一種均溫板,其具有:一第一板體及一第二板體,其中該第一板體包含: 一第一槽底面,其與該第二板體間隔設置;一第一內壁面,其環繞並連接該第一槽底面,且與該第一槽底面互不平行;一第一接合面,其環繞並連接於該第一內壁面;一外壁面,其環繞並連接該第一接合面之外側,且與該第一接合面互不平行;以及一溝部,其形成於該第一接合面,且連通於該第一內壁面及該外壁面,並朝向遠離該第二板體之方向凹陷;且該第二板體包含:一第二接合面,該第一接合面密封接合於該第二接合面;一腔室,其形成於該第一槽底面、該第一內壁面以及該第二板體之間;一通道,其形成於該第二板體及該溝部之間,並與該腔室連通;一第二穿孔,其形成於該第二板體,並與該通道連通;一密封管體,其穿設於該通道;一第二擠壓件,其設置於該第二穿孔且該第二擠壓件貼合於該密封管體,且該密封管體在對應於該第二擠壓件的位置之管內面相貼合;以及一工作流體,其設置於該腔室內。 To achieve the above-mentioned purpose, the invention proposes another temperature-averaging plate, which has: a first plate body and a second plate body, wherein the first plate body comprises: a first groove bottom surface, which is spaced apart from the second plate body; a first inner wall surface, which surrounds and connects to the first groove bottom surface, and is not parallel to the first groove bottom surface; a first joint surface, which surrounds and connects to the first inner wall surface; an outer wall surface, which surrounds and connects to the outer side of the first joint surface, and is not parallel to the first joint surface; and a groove portion, which is formed on the first joint surface, connected to the first inner wall surface and the outer wall surface, and is recessed in a direction away from the second plate body; and the The second plate includes: a second joint surface, the first joint surface is sealed and joined to the second joint surface; a chamber formed between the first groove bottom surface, the first inner wall surface and the second plate; a channel formed between the second plate and the groove and connected to the chamber; a second through hole formed in the second plate and connected to the channel; a sealing tube penetrated in the channel; a second extrusion piece, which is arranged in the second through hole and the second extrusion piece is attached to the sealing tube, and the sealing tube is attached to the inner surface of the tube at the position corresponding to the second extrusion piece; and a working fluid, which is arranged in the chamber.
本創作還提出一種均溫板的製造方法,用以製造前述之均溫板,其依序包含以下步驟:將一第一板體的一第一接合面密封接合於一第二板體的一第二接合面,同時一通道及一腔室形成於該第一板體與該第二板體之間,其中,該通道與該腔室相連通,且該第一板體形成有一第一穿孔,並與該通道連通;將一密封管體插入該通道,並使一工作流體由該密封管體進入該腔室,且透過該密封管體使該腔室內形成真空狀態; 將一第一擠壓件設置於該第一穿孔,並同時將該密封管體擠壓至該密封管體上對應於該第一擠壓件的位置之管內面相貼合,藉此該腔室形成密封狀態。 This invention also proposes a method for manufacturing a temperature balancing plate, which is used to manufacture the aforementioned temperature balancing plate, and includes the following steps in sequence: sealingly joining a first joint surface of a first plate body to a second joint surface of a second plate body, and forming a channel and a chamber between the first plate body and the second plate body, wherein the channel is connected to the chamber, and the first plate body is formed with a first through hole, which is connected to the channel; inserting a sealed tube body into the channel, and allowing a working fluid to enter the chamber from the sealed tube body, and forming a vacuum state in the chamber through the sealed tube body; A first extrusion piece is set at the first through hole, and the sealed tube body is extruded to fit the inner surface of the tube corresponding to the position of the first extrusion piece on the sealed tube body, thereby forming a sealed state in the chamber.
因此,本創作的優點在於,使用擠壓件在透過均溫板板體面內的穿孔將密封管體密合,故製造時不需要在板體面外突出一個部份用以實施閉合。如此一來,使用本創作為元件的相關產品便可節省空間以容納其他的元件。 Therefore, the advantage of this invention is that the extrusion parts are used to seal the sealing tube through the perforations in the surface of the temperature-averaging plate, so there is no need to protrude a part outside the plate surface for closing during manufacturing. In this way, related products using this invention as a component can save space to accommodate other components.
如前所述之均溫板,其中:該溝部包含:一擴張區,其位於該溝部之中段;一內溝區,其連通該第一內壁面及該擴張區;以及一外溝區,其連通該擴張區及該外壁面;其中,該擴張區之寬度大於該內溝區及該外溝區之寬度,且該第一穿孔連通於該擴張區。 The temperature equalizing plate as described above, wherein: the groove portion includes: an expansion area, which is located in the middle section of the groove portion; an inner groove area, which connects the first inner wall surface and the expansion area; and an outer groove area, which connects the expansion area and the outer wall surface; wherein the width of the expansion area is greater than the width of the inner groove area and the outer groove area, and the first through hole is connected to the expansion area.
如前所述之均溫板,其中該第一擠壓件於該第一穿孔之固設方式為緊配合。 As described above, the temperature equalizing plate, wherein the first extrusion member is fixed to the first through hole in a tight fit.
如前所述之均溫板,其中該第一板體更具有:一散熱槽,其位於該第一板體遠離該第二板體之一面,並朝接近該第二板體之方向凹陷,該散熱槽用以增加接觸欲散熱之物品的面積。 As described above, the first plate further has: a heat dissipation groove, which is located on a surface of the first plate away from the second plate and is recessed toward the second plate. The heat dissipation groove is used to increase the area of contact with the object to be dissipated.
如前所述之均溫板,其中:該第二板體更具有:一第二槽底面,其與該第一板體間隔設置;以及一第二內壁面,其環繞並連接該第二槽底面,且該第二接合面環繞連接於該第二內壁面,該第二內壁面與該第二槽底面互不平行; 其中,該腔室形成於該第一槽底面、該第一內壁面、該第二槽底面、以及該第二內壁面之間。 The temperature equalizing plate as described above, wherein: the second plate body further has: a second groove bottom surface, which is spaced apart from the first plate body; and a second inner wall surface, which surrounds and connects to the second groove bottom surface, and the second joint surface surrounds and connects to the second inner wall surface, and the second inner wall surface and the second groove bottom surface are not parallel to each other; Wherein, the chamber is formed between the first groove bottom surface, the first inner wall surface, the second groove bottom surface, and the second inner wall surface.
如前所述之均溫板,其中該第二板體更具有:一溝蓋部,其形成於該第二接合面,且對應於該溝部之位置,朝向遠離該第一板體之方向凹陷,藉此該通道形成於該溝部與該溝蓋部之間。 As described above, the second plate body further has: a groove cover portion, which is formed on the second joint surface and is concave in a direction away from the first plate body corresponding to the position of the groove portion, so that the channel is formed between the groove portion and the groove cover portion.
如前所述之均溫板,其更具有:一第二穿孔,其形成於該第二板體,並與該通道連通;以及一第二擠壓件,其固設於該第二穿孔且該第二擠壓件貼合於該密封管體;其中,該密封管體在對應於該第二擠壓件的位置之管內面相貼合。 The temperature equalizing plate as described above further comprises: a second through hole formed in the second plate body and connected to the channel; and a second extrusion piece fixedly arranged in the second through hole and the second extrusion piece is attached to the sealing tube body; wherein the sealing tube body is attached to the inner surface of the tube at the position corresponding to the second extrusion piece.
如前所述之均溫板的製造方法,其中,該第二板體形成有一第二穿孔,該第二穿孔與該通道連通;該均溫板的製造方法更包含下列步驟:將一第二擠壓件設置於該第二穿孔,並同時將該密封管體擠壓至該密封管體對應於該第二擠壓件的位置之管內面相貼合。 As described above, the manufacturing method of the temperature averaging plate, wherein the second plate body is formed with a second through hole, and the second through hole is connected to the channel; the manufacturing method of the temperature averaging plate further comprises the following steps: a second extrusion piece is arranged at the second through hole, and the sealing tube body is extruded until the inner surface of the sealing tube body corresponding to the position of the second extrusion piece is in contact with each other.
10:第一板體 10: First plate
11:第一槽底面 11: Bottom of the first groove
12:第一內壁面 12: First inner wall surface
13:第一接合面 13: First joint surface
131:溝部 131: Groove
1311:擴張區 1311: Expansion Zone
1312:內溝區 1312: Inner trench area
1313:外溝區 1313: Outer trench area
14:外壁面 14: Outer wall
15:散熱槽 15: Heat sink
20:第二板體 20: Second plate
21:第二槽底面 21: Bottom of the second groove
22:第二內壁面 22: Second inner wall surface
23:第二接合面 23: Second joint surface
231:溝蓋部 231: Groove cover
30:第一穿孔 30: First piercing
31:第二穿孔 31: Second piercing
40:第一擠壓件 40: First extrusion piece
41:第二擠壓件 41: Second extrusion piece
50:密封管體 50: Sealing tube body
60:腔室 60: Chamber
70:通道 70: Channel
91:突出部 91: protrusion
圖1為本創作之均溫板立體示意圖。 Figure 1 is a three-dimensional schematic diagram of the temperature equalization plate of this creation.
圖2為本創作之均溫板的底側仰視示意圖。 Figure 2 is a bottom view of the temperature equalizing plate of this invention.
圖3為本創作之均溫板的立體分解示意圖。 Figure 3 is a three-dimensional exploded diagram of the temperature equalizing plate of this creation.
圖4為本創作之均溫板中第一板體的俯視示意圖。 Figure 4 is a top view of the first plate in the temperature equalization plate of this invention.
圖5為本創作之均溫板中密封管體置於通道時的第一板體之俯視示意圖。 Figure 5 is a top view of the first plate body when the sealed tube body is placed in the channel in the temperature equalization plate of this invention.
圖6為本創作圖2之均溫板中之A-A剖面的通道之側面剖視示意圖。 Figure 6 is a schematic side cross-sectional view of the channel at section A-A in the temperature equalizing plate of Figure 2 of this work.
圖7為本創作之均溫板中另一實施例的通道之側面剖視示意圖。 Figure 7 is a schematic side cross-sectional view of a channel in another embodiment of the temperature equalizing plate of this invention.
圖8為本創作之製造方法中的「第一板體與第二板體密封接合」步驟之示意圖。 Figure 8 is a schematic diagram of the step of "sealing the first plate and the second plate" in the manufacturing method of this invention.
圖9為本創作之製造方法中的「將密封管體插入第一板體與第二板體之間」步驟之示意圖。 Figure 9 is a schematic diagram of the step of "inserting the sealing tube between the first plate and the second plate" in the manufacturing method of this invention.
圖10為本創作之製造方法中的「以第一擠壓件及/或第二擠壓件擠壓密封管體至密合」步驟之示意圖。 Figure 10 is a schematic diagram of the step of "using the first extrusion piece and/or the second extrusion piece to extrude and seal the tube body until it is tightly fitted" in the manufacturing method of this invention.
圖11為先前技術的立體示意圖。 Figure 11 is a three-dimensional schematic diagram of the prior art.
首先請參考圖1至圖6,本創作提出一種均溫板,其具有一第一板體10、一第二板體20、一第一穿孔30、一第二穿孔31、一第一擠壓件40、一第二擠壓件41、一密封管體50、一腔室60、一通道70以及一工作流體。
First, please refer to Figures 1 to 6. This invention proposes a temperature equalization plate, which has a
第一板體10包含一第一槽底面11、一第一內壁面12、一第一接合面13、一溝部131、一外壁面14、以及一散熱槽15。第一槽底面11與第二板體20間隔設置。第一內壁面12環繞並連接第一槽底面11,且與第一槽底面11互不平行。第一接合面13環繞並連接於第一內壁面12。外壁面14環繞並連接第一接合面13之外側,且與第一接合面13互不平行。本實施例中,第一內壁面12垂直於第一槽底面11與第一接合面13,換言之,第一槽底面11與第一接合面13互相平行,但並不以此為限;在其他實施例中,第一槽底面11可不平行於第一接合面13,具體而言,第一槽底面11與第一內壁面12可形成一相對於第一接合面13具有底部深度變化之凹槽。
The
溝部131形成於第一接合面13,且連通於第一內壁面12及外壁面14,並朝向遠離第二板體20之方向凹陷。溝部131包含一擴張區1311、一內溝區1312、以及一外溝區1313。擴張區1311位於溝部131之中段。內溝區1312連
通第一內壁面12及擴張區1311。外溝區1313連通擴張區1311及外壁面14。其中,擴張區1311之寬度大於內溝區1312及外溝區1313之寬度,且第一穿孔30連通於擴張區1311。
The
散熱槽15位於第一板體10遠離第二板體20之一面,並朝接近第二板體20之方向凹陷。其用以增加接觸欲散熱之物品的面積。例如可將電腦之中央處理器容置於其中,並貼合其外型,藉此增加接觸面積,以達增加散熱效率之功效。在其他實施例中,第一板體10可不具有散熱槽15。
The
第二板體20包含一第二槽底面21、一第二內壁面22、一第二接合面23、以及一溝蓋部231。第二槽底面21與第一板體10間隔設置。第二內壁面22環繞並連接於第二槽底面21。第二接合面23環繞並連接於第二內壁面22,且第一接合面13密封接合於第二接合面23。類似地,第二內壁面22與第二槽底面21互不平行。在本實施例中,第二內壁面22垂直於第二槽底面21,但並不以此為限。同樣地,在其他實施例中,第二槽底面21與第二內壁面22可形成一相對於第二接合面23具有底部深度變化之凹槽。在其他實施例中,第二板體20可不具有第二內壁面22與第二槽底面21。
The
溝蓋部231形成於第二接合面23上相對於第一板體10之溝部131的位置,朝向遠離第一板體10之方向凹陷。藉此通道70形成於溝蓋部231以及溝部131之間。在其他實施例中,第二板體20可不具有溝蓋部231,此時通道70形成於溝部131與第二板體20之間。
The
本實施例中,腔室60形成於第一槽底面11、第一內壁面12、第二槽底面21、以及第二內壁面22之間。在前述第二板體20不具有第二內壁面22與第二槽底面21的其他實施例中,腔室60形成於第一槽底面11、第一內壁面12、以及第二板體20之間。工作流體位於腔室60內。
In this embodiment, the
第一穿孔30形成於第一板體10之溝部131的擴張區1311,且連通於通道70。第一擠壓件40固設於第一穿孔30內。本實施例中,第一擠壓件40以緊配合形式固設於第一穿孔30中,但並不以此為限,在其他實施例中,也可用焊接形式將第一擠壓件40固設於第一穿孔30中。
The first through
第二穿孔31形成於第二板體20,且連通於通道70。第二擠壓件41固設於第二穿孔31中,同樣地,本實施例中,第二擠壓件41是以緊配合的形式固設於第二穿孔31中。此外,本實施例中,第一穿孔30對應於第二穿孔31之位置,但並不以此為限;在其他實施例中,第一穿孔30可不對應於第二穿孔31之位置。
The second through
接著請參考圖5至圖7。密封管體50穿設於通道70中,且第一擠壓件40與第二擠壓件41皆貼合於密封管體50。此外,密封管體50在對應於第一擠壓件40的位置之管內面相貼合;同樣的,密封管體50在對應第二擠壓件41的位置之管內面相貼合。具體而言,本實施例中的密封管體50於被第一擠壓件40及第二擠壓件41所夾擠的部分密封貼合。因為夾擠造成的變形,密封管體50中貼合部分的管體寬度擴張,第一板體10之溝部131中的擴張區1311部分用以容置密封管體50中該寬度擴張之部分。換言之,溝部131的寬度變化對應密封管體50的寬度變化,藉此容置被第一擠壓件40與第二擠壓件41夾擠之密封管體50。在其他實施例中,可以僅具有第一穿孔30與第一擠壓件40,或僅具有第二穿孔31與第二擠壓件41。
Next, please refer to Figures 5 to 7. The sealing
接著請參考圖8至圖10,在本實施例中,製造本創作的均溫板時,依序包含下列步驟:將第一板體10與第二板體20密封接合、將密封管體50插入第一板體10與第二板體20之間、以第一擠壓件40及/或第二擠壓件41擠壓密封管體50至密合。
Next, please refer to Figures 8 to 10. In this embodiment, the manufacturing of the temperature equalization plate of this invention includes the following steps in sequence: sealing the
於「第一板體10與第二板體20密封接合」之步驟中,首先將第一板體10的第一接合面13密封接合於第二板體20的第二接合面23,此時腔室60及通道70形成於第一板體10與第二板體20之間。其中,第一板體10形成有一第一穿孔30,且第二板體20形成有第二穿孔31,腔室60與通道70相連通。
In the step of "sealing the
於「將密封管體50插入第一板體10與第二板體20之間」之步驟中,將一密封管體50插入通道70,並通入至腔室60,接著使一工作流體由密封管體50進入腔室60,再透過密封管體50使腔室60內形成真空狀態。
In the step of "inserting the sealing
於「以第一擠壓件40及/或第二擠壓件41擠壓密封管體50至密合」之步驟中,分別將第一擠壓件40設置於第一穿孔30,第二擠壓件41設置於第二穿孔31,並同時透過第一擠壓件40及第二擠壓件41對密封管體50實施擠壓,直至密封管體50對應於第一擠壓件40及第二擠壓件41的部分的管內面相貼合,阻斷密封管體50內部的連通,進而阻斷通道70的連通,藉此腔室60形成密封狀態。
In the step of "using the
在其他實施例中,於「以第一擠壓件40及/或第二擠壓件41擠壓密封管體50至密合」之步驟中,在僅有第一穿孔30及第一擠壓件40或僅有第二穿孔31及第二擠壓件41之情形時,可將第一擠壓件40設置於第一穿孔30內朝第二板體20方向對密封管體50實施擠壓且另一側以模具進行支撐,或可將第二擠壓件41設置於第二穿孔31內朝第一板體10方向對密封管體50實施擠壓且另一側以模具進行支撐,直至密封管體50對應於第一擠壓件40或第二擠壓件41的管內面相貼合,最終亦可達成使腔室60形成密封狀態的結果。
In other embodiments, in the step of "using the
最後,將多餘的密封管體50外露部分剪除,即,將密封管體50突出於外壁面14的部分剪除,也可以再用焊料以焊接方式進一步密封,但並不以此為限。
Finally, the excess exposed portion of the sealing
綜上所述,本創作的均溫板在製造過程中,在均溫板第一板體10的板體面範圍內的第一穿孔30及/或第二板體20的板體面範圍內的第二穿孔31,使用第一擠壓件40及/或第二擠壓件41將密閉管體50之管道擠壓至閉合,故不需要在第一板體10及第二板體20外側突出一個部份用以實施閉合。如此一來,應用本創作的均溫板作為散熱元件的相關產品便可節省空間以容納其他的元件。
In summary, during the manufacturing process of the heat spreader of the invention, the first through
10:第一板體 10: First plate
20:第二板體 20: Second plate
41:第二穿孔 41: Second piercing
50:密封管體 50: Sealing tube body
Claims (10)
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM345222U (en) * | 2008-06-20 | 2008-11-21 | Celsia Technologies Taiwan Inc | Vacuum chamber and supporting structure thereof |
| US20100006268A1 (en) * | 2008-07-14 | 2010-01-14 | Meyer Iv George Anthony | Vapor chamber and supporting structure of the same |
| CN111366021A (en) * | 2018-12-25 | 2020-07-03 | 讯凯国际股份有限公司 | Temperature-equalizing plate and manufacturing method thereof |
| US20210199385A1 (en) * | 2019-12-27 | 2021-07-01 | Asia Vital Components (China) Co., Ltd. | Vapor chamber having sealing structure |
| TW202223322A (en) * | 2020-12-01 | 2022-06-16 | 奇鋐科技股份有限公司 | Vapor chamber structure |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM345222U (en) * | 2008-06-20 | 2008-11-21 | Celsia Technologies Taiwan Inc | Vacuum chamber and supporting structure thereof |
| US20100006268A1 (en) * | 2008-07-14 | 2010-01-14 | Meyer Iv George Anthony | Vapor chamber and supporting structure of the same |
| CN111366021A (en) * | 2018-12-25 | 2020-07-03 | 讯凯国际股份有限公司 | Temperature-equalizing plate and manufacturing method thereof |
| US20210199385A1 (en) * | 2019-12-27 | 2021-07-01 | Asia Vital Components (China) Co., Ltd. | Vapor chamber having sealing structure |
| TW202223322A (en) * | 2020-12-01 | 2022-06-16 | 奇鋐科技股份有限公司 | Vapor chamber structure |
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