TWI733060B - Wet treatment equipment and wet treatment method thereof - Google Patents

Abstract

A wet processing equipment is suitable for processing a plurality of wafers carried by a carrier jig. The wet processing equipment includes a conveying device, an etching zone, a first cleaning zone, a deoxidation zone and a second Cleaning area. The conveying device can convey the bearing jig to move. The etching zone is provided with a first chemical solution for immersing the carrier jig conveyed by the conveying device to etch a plurality of pins of the wafer. The first cleaning zone is located on the downstream side of the etching zone for cleaning the wafers on the carrier fixture output through the etching zone. The deoxidation zone is located on the downstream side of the first cleaning zone and is provided with a second chemical solution for immersing the carrier fixture conveyed by the conveying device to produce a deoxidation reaction on the leads of each wafer. The second cleaning zone is located on the downstream side of the deoxidation zone for cleaning the wafers on the carrier fixture output through the deoxidation zone.

Description

Wet treatment equipment and wet treatment method thereof

The present invention relates to a wet processing equipment, in particular to a wet processing equipment and a wet processing method for wet chemical processing of encapsulated wafers.

The existing blanks packaged by the QFN method need to be sawed by a dicing machine to separate them into multiple chips. During the process of sawing the insulating package of the material, the saw blade of the cutting machine can easily cause the metal pins on the side of each chip to be partially melted due to the high temperature generated during sawing, which makes the saw blade very difficult to move when moving. It is easy to pull the aforementioned molten metal to move to form a wire-like metal wire.

Among them, when the metal wire is directly connected between two adjacent pins, it will cause a short circuit of the chip. When the metal wire is pulled out from one of the pins but is spaced from another adjacent pin, or when the molten metal is not drawn into a wire, the chip will not be short-circuited. Although the aforementioned two situations will not cause a short circuit of the chip immediately, under the influence of the long-term thermal expansion and contraction of the chip, the metal wire or pin will migrate (migration), which is easy to cause the metal wire to interact with another phase. Adjacent pin contact or two Adjacent pins are in contact with each other, which in turn causes a short circuit of the chip.

Therefore, one of the objectives of the present invention is to provide a wet processing equipment that can overcome at least one of the disadvantages of the prior art.

Therefore, the wet processing equipment of the present invention is suitable for processing a plurality of wafers carried by a carrier jig. The wet processing equipment includes a conveying device, an etching zone, a first cleaning zone, and a deoxidation zone. , And a second cleaning zone.

The conveying device can convey the carrier jig to move along a first conveying direction. The etching area is provided with a first chemical solution for immersing the carrier jig conveyed by the conveying device to etch the pins of each of the wafers. The first cleaning zone is located on the downstream side of the etching zone for cleaning the wafers on the carrier fixture output through the etching zone. The deoxidation zone is located on the downstream side of the first cleaning zone, and has a second chemical solution for immersing the carrier jig conveyed by the conveying device to produce a deoxidation reaction on the pins of each chip. The second cleaning zone is located on the downstream side of the deoxidation zone for cleaning the wafers on the carrier fixture output through the deoxidation zone.

Another object of the present invention is to provide a wet processing method for wet processing equipment that can overcome at least one of the disadvantages of the prior art.

Therefore, the wet processing method of the wet processing equipment of the present invention is suitable for processing a plurality of wafers carried by a carrier jig, and the wet processing equipment of the wet processing equipment The processing method includes the following steps: transporting the carrier jig to move in a first transport direction through a transport device; and applying a first chemical solution to a plurality of wafers moving along the first transport direction through an etching zone The pins are etched; the wafers output from the etching zone along the first conveying direction are cleaned through a first cleaning zone; the second chemical solution pair is moved along the first conveying direction through a deoxidation zone The pins of each of the chips produce a deoxidation reaction; and the wafers output from the deoxidation zone along the first conveying direction are cleaned through a second cleaning zone.

The effect of the present invention is that the first chemical solution in the etching zone reacts with each pin of the chip or the wire generated by the sawing of the chip and etches each pin or wire, so that two adjacent pins or wires are etched. The distance between the pins can be increased to a preset length, or the metal wire can be removed to prevent the chip from contacting another adjacent pin due to thermal expansion and contraction during subsequent use, or It is two adjacent pins that touch each other, which leads to a short circuit.

1: chip

11: Insulation package

111: The first side

112: second side

113: Side

12: Pin

13: Metal thermal conductive layer

14: Metal protective layer

2: Bearing fixture

21: Carrier plate

211: Disc body

212: Carrying Unit

213: bump unit

214: Spacer unit

215: Through hole

216: positioning hole

217: protruding arm

218: bump

219: Block

220: groove

221: long face

222: short face

223: Carrier Sheet

23: cover

230: first opening

231: Board

232: positioning column

233: Hole Unit

234: Piercing

235: second opening

236: Stop Frame

237: Stop End

24: Side runner

25: End runner

300: Wet processing equipment

3: body

301: front end

302: backend

31: Humid zone

310: water

311: Feeding section

312: Wet section

313: Blow-dry section

314: spray parts

315: Jet Head

316: Side jet nozzle

32: Etching area

321: Separate section

322: Chemical Reaction Section

323: Dry section

324: The first liquid tank

325: The First Liquid

326: The first liquid spray nozzle

327: The first nozzle

328: Nozzle on the first side

33: The first cleaning area

331: First cleaning stage

332: second cleaning stage

333: The third cleaning stage

334: The fourth cleaning stage

335: The first sprinkler

336: First Jet Head

337: water

338: Sink

339: water

340: second sprinkler

341: Second Jet Head

342: The first spray

343: Third Jet Head

344: water

345: The second spray

346: Fourth Jet Head

347: Side Air Nozzle

348: Water

35: Deoxidation zone

351: Separate paragraph

352: Chemical Reaction Section

353: Blow Dry Section

354: Second Liquid Tank

355: The Second Liquid

356: The second liquid spray nozzle

357: second nozzle

358: second side nozzle

36: Second cleaning area

361: The first cleaning stage

362: second cleaning stage

363: Third cleaning stage

364: The first sprinkler

365: first jet head

366: water

367: Sink

368: water

369: second sprinkler

370: Second Jet Head

371: spray parts

372: The Third Jet Head

373: Side Air Nozzle

374: water

38: Inspection area

39: Remove area

391: Separate segment

392: Chemical Reaction Section

393: Blow Dry Section

394: The Third Liquid Tank

395: The Third Liquid

396: The third liquid spray nozzle

397: third nozzle

398: third side nozzle

40: Third cleaning area

401: The first cleaning stage

402: Second cleaning section

403: The first sprinkler

404: First Jet Head

405: water

406: spray parts

407: Second Jet Head

408: Side Air Nozzle

409: water

41: Zhonghe District

411: Separate paragraph

412: Chemical Reaction Section

413: Blow Dry Section

414: Fourth Liquid Tank

415: The Fourth Liquid

416: The fourth liquid spray nozzle

417: fourth nozzle

418: Fourth side nozzle

42: The fourth cleaning area

421: First cleaning stage

422: second cleaning stage

423: Third cleaning stage

424: The first sprinkler

425: First Jet Head

426: water

427: Sink

428: water

429: second sprinkler

430: Second Jet Head

431: spray parts

432: Third Jet Head

433: Side Air Nozzle

434: water

44: Dry zone

441: Blow Dry Section

442: Drying section

443: First blow

444: The second blow

45: Recirculation zone

5: Conveying device

51: The first conveying mechanism

511: Feeding front end

512: Discharge back end

513: Lower conveyor roller

514: Upper conveyor roller

515: solid roller

516: Liquid Cut Roller

52: The second conveying mechanism

521: Feeding back end

522: Discharge front end

6: Transfer device

61: Temporary Storage Organization

611: The first conveying unit

612: Lifting unit

613: The first conveyor wheel

614: guide rod

615: Sliding Frame

616: support rod

617: first drive assembly

62: Transverse mechanism

621: The second conveying unit

622: Transverse Unit

623: Second conveyor wheel

624: Rail

625: Sliding Parts

626: second drive assembly

S1: Delivery step

S2: Wetting step

S3: etching step

S4: The first cleaning step

S5: Deoxidation step

S6: Second cleaning step

S7: removal steps

S8: Third cleaning step

S9: Neutralization step

S10: Fourth cleaning step

S11: drying step

S12: Transfer steps

S13: Reflow step

D1: The first conveying direction

D2: Second conveying direction

D3: Left jet direction

D4: Right jet direction

X: front and rear direction

Y: left and right direction

Z: Up and down direction

The other features and effects of the present invention will be described in the embodiment with reference to the drawings Figure 1 is a bottom view of a wafer to be processed by an embodiment of the wet processing equipment of the present invention; Figure 2 is a side view of the wafer; Figure 3 is used to carry the wafer Fig. 4 is a top view of a cover plate of the bearing jig; Fig. 5 is an incomplete three-dimensional exploded view of the bearing jig; Fig. 6 is the bearing jig Figure 7 is an incomplete cross-sectional view of the carrier jig, showing that the chip is assembled in the carrier jig; Figure 8 is an incomplete cross-sectional view of the carrier jig. Complete schematic side view; Figure 9 is an incomplete schematic side view of the carrier fixture; Figure 10 is a top view of the embodiment, illustrating the configuration relationship between a body, a conveying device, and a transfer device 11 is a side view of the embodiment; FIG. 12 is a side view of a wet area of the embodiment; FIG. 13 is a side view of a wet section of the wet area of the embodiment; FIG. 14 is A schematic side view of a drying section of the wet zone in this embodiment; 15 is a side view of an etching zone of this embodiment; FIG. 16 is a schematic side view of a chemical reaction section of the etching zone of this embodiment; FIG. 17 is a blow-drying section of the etching zone of this embodiment Fig. 18 is a side view of a first cleaning zone of this embodiment; Fig. 19 is a side view of a fourth cleaning section of the first cleaning zone of this embodiment; Fig. 20 is this embodiment Fig. 21 is a side view of a drying section of the deoxidation zone of this embodiment; Fig. 22 is a side view of a second cleaning zone of this embodiment; 23 is a schematic side view of a third cleaning section of the second cleaning zone of this embodiment; Figure 24 is a side view of a removal zone of this embodiment; Figure 25 is a side view of the removal zone of this embodiment Fig. 26 is a side view of a third cleaning zone in this embodiment; Fig. 27 is a side view of a second cleaning zone in the third cleaning zone in this embodiment; 28 is a side view of a neutralization zone of this embodiment; Figure 29 is a side view of a drying section of the neutralization zone of this embodiment; Figure 30 is a side view of a fourth cleaning zone of this embodiment Side view; Figure 31 is a schematic side view of a third cleaning section of the fourth cleaning zone of this embodiment Figure 32 is a side view of a drying zone of this embodiment; Figure 33 is a perspective view of a transfer device of this embodiment; Figure 34 is a side view of a transfer device of this embodiment; Figure 35 Is an incomplete top view of this embodiment; FIG. 36 is a step flow chart of the wet processing method of this embodiment; FIG. 37 is an incomplete top view of this embodiment, illustrating a second conveying unit in a first position And Figure 38 is an incomplete top view of this embodiment, illustrating the second conveying unit in a second position.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

1 and FIG. 2, FIG. 1 is a bottom view of a wafer 1 to be processed by an embodiment of the wet processing equipment 300 of the present invention, and FIG. 2 is a side view of the wafer 1. Chip 1 is packaged by, for example, a dual row quad flat no lead (DR-QFN) method, a quad flat no lead (QFN) method, or a dual no lead (DFN) method. Become. The wafer 1 is a rectangle as an example, of course, it can also be a square. The chip 1 includes an insulating package body 11 and a plurality of pins 12. A metal thermally conductive layer 13 and a metal protective layer 14. The insulating package 11 has a first surface 111, a second surface 112 opposite to the first surface 111, and four side surfaces 113 connected between the first surface 111 and the second surface 112. Each pin 12 is made of copper and partly covered by an insulating package 11. Some of the pins 12 are arranged in a double row at the side surfaces 113 on the two short sides. One row of pins 12 is exposed on the first side 111 of the insulating package 11, and the other row of pins 12 is It is exposed on the first surface 111 and the side surface 113 of the insulating package 11 at the same time. The remaining parts of the pins 12 are arranged in a single row at the side surfaces 113 of the two long sides, and are exposed on the first surface 111 and the side surface 113 of the insulating package 11 at the same time. The thermal conductive metal layer 13 is made of, for example, tin and partially covered by the insulating package 11. The thermal conductive metal layer 13 can be exposed on the first surface 111 of the insulating package 11. The metal protection layer 14 is made of, for example, silver and is plated on the metal heat-conducting layer 13 to shield the metal heat-conducting layer 13.

Referring to Figures 3, 4 and 5, a carrier jig 2 is used to simultaneously carry multiple chips 1 as shown in Fig. 1. The carrier jig 2 includes a carrier plate 21 and a detachable cover on the carrier plate 21的盖板23。 21 of the cover 23. The carrier plate 21 includes a rectangular plate body 211, a plurality of carrier units 212, a plurality of bump units 213, and four spacer units 214. The disk body 211 is formed with a plurality of through holes 215 arranged in an array and three positioning holes 216. Each positioning hole 216 is adjacent to the corresponding corner of the plate body 211. Each supporting unit 212 is formed on an inner peripheral surface 210 of the plate body 211 defining each through hole 215 and includes four protruding arms 217 and four supporting sheets 223. Each protruding arm 217 protrudes from the corresponding corner of the inner peripheral surface 210. Each bearer The sheet 223 is connected between the corresponding two adjacent protruding arms 217 to carry the first surface 111 (as shown in FIG. 2) or the second surface 112 (as shown in FIG. 2) of the wafer 1. In this embodiment, the first surface 111 is carried by each supporting sheet 223 for illustration. Each bump unit 213 includes four bumps 218 protruding on the top surface of the disk body 211, and the bumps 218 are adjacent to the four corners of the inner peripheral surface 210. Each cushion block unit 214 includes a plurality of cushion blocks 219 protrudingly disposed on the top surface of the plate body 211 and located at the corresponding corners of the plate body 211. The cushion blocks 219 define a plurality of grooves 220 that are mutually perpendicular and interlaced and communicated with each other. The top surface of the plate body 211 has two long face parts 221 and two short face parts 222. The two long face parts 221 are respectively located on the two long sides of the plate body 211, and the two short face parts 222 are respectively located on the two short sides of the plate body 211. Each long face 221 is located between the two corresponding cushion units 214, and each short face 222 is located between the corresponding two cushion units 214.

The cover 23 includes a rectangular plate 231 and three positioning posts 232. The board 231 is formed with a plurality of perforated units 233 arranged in an array and a plurality of perforations 234. Each opening unit 233 includes a first opening 230 and four second openings 235 surrounding the first opening 230. The perforations 234 are adjacent to the two long sides and two short sides of the plate body 231 and surround the periphery of the opening units 233. The board 231 has a plurality of stop frames 236, and each stop frame 236 has a frame shape and defines a first opening 230. Each stop frame 236 is used to stop the second surface 112 of the chip 1. Each positioning post 232 is protrudingly provided on the bottom surface of the board 231 and adjacent to the corresponding corner of the board 231 to be latched in the corresponding positioning hole 216.

6 and 7, after each chip 1 is placed on the corresponding carrier unit 212, the four carrier sheets 223 of the carrier unit 212 will abut against the first surface 111 of the chip 1 Carrying wafer 1. Subsequently, the cover plate 23 is covered on the carrier plate 21, so that the positioning posts 232 (as shown in FIG. 4) are locked in the corresponding positioning holes 216 (as shown in FIG. 3), and the top surfaces of the bumps 218 and the cushion blocks 219 (Figure 3) The top surface abuts against the bottom surface of the plate body 231, and the assembly of the cover plate 23 is completed. At this time, most of the area of the first surface 111 of the wafer 1, and all the pins 12 and the metal protection layer 14 exposed on the first surface 111 will correspond to the through holes 215 of the carrier plate 21, thereby making the processing liquid, Fluids such as cleaning fluid or compressed air can flow into the wafer 1 in the carrier fixture 2 through the through hole 215 to perform chemical reactions, cleaning, or drying operations on the wafer 1. Most areas of the second surface 112 of the wafer 1 will correspond to the positions of the first opening 230 and the four second openings 235 of the corresponding opening unit 233 of the cover 23, thereby making the processing liquid, cleaning liquid or compressed air The fluid can flow into the wafer 1 in the carrier fixture 2 through the first opening 230 and the second opening 235 to perform chemical reactions, cleaning, or drying operations on the wafer 1.

The second surface 112 of the chip 1 is spaced a distance from a stop end 237 of the bottom surface of the stop frame 236 of the cover 23, thereby allowing the wafer 1 to be impacted by the aforementioned fluid between the carrier sheet 223 and the stop frame. The blocking ends 237 of 236 swing up and down. In addition, each side surface 113 of the chip 1 is spaced from the corresponding bumps 218 by a certain distance, thereby allowing the chip 1 to swing back and forth between the bumps 218 or from side to side when the chip 1 is impacted by the aforementioned fluid.

Referring to FIG. 8, each long surface portion 221 of the carrier plate 21 and the corresponding two block units 214, and the bottom surface of the plate body 231 of the cover 23 jointly define a side flow channel. twenty four. Referring to FIG. 9, each short surface portion 222 of the carrier plate 21 and the corresponding two block units 214, and the bottom surface of the plate body 231 of the cover 23 jointly define an end flow channel 25.

Referring to FIGS. 3, 4, 8 and 9, by each cushion block unit 214 with a plurality of cushion blocks 219 abutting against the bottom surface of the plate body 231, the contact area with the bottom surface of the plate body 231 can be reduced, so that the treatment liquid Or, the cleaning liquid is less likely to stick between the top surface of each block 219 and the bottom surface of the board 231. The groove 220 is designed to allow fluid to flow in it, so that when compressed air is blown to the grooves 220 on the left and right sides of the bearing fixture 2, the processing liquid or cleaning liquid in the grooves 220 can be blown out so that they can pass through The end runner 25 or the through hole 215 discharges. At the same time, the compressed air flowing in the groove 220 can also improve the effect of blowing away the residual processing liquid or cleaning liquid between the top surface of each cushion block 219 and the bottom surface of the board 231. In addition, when the compressed air is blown to the side flow passages 24 on the left and right sides of the supporting jig 2, the remaining processing liquid or cleaning liquid on the long surface portion 221 can be blown away and discharged through the through hole 215. In addition, compressed air can be blown to each wafer 1 and dried.

The perforations 234 of the cover plate 23 correspond to the design of each block unit 214, each long face part 221 and each short face part 222 of the carrier tray 21, so that compressed air is blown from above the cover plate 23 to the perforation holes 234 At this time, the compressed air can be blown to each block unit 214, each long face part 221, and each short face part 222 through the perforations 234, and can blow away the treatment liquid or cleaning liquid remaining on the aforementioned structure through the groove 220, The side runner 24 and the end runner 25 are discharged.

10 and 11, is an example of the wet processing equipment 300 of the present invention The embodiment is suitable for processing a plurality of wafers 1 (as shown in FIG. 7) carried by the carrying jig 2. The wet processing equipment 300 includes a body 3, a conveying device 5, and a transfer device 6.

The body 3 includes a front end 301 and a rear end 302. The directions passing through the front end 301 and the rear end 302 of the body 3 are defined as a front-rear direction X, a left-right direction Y perpendicular to the front-rear direction X, and an up-down direction Z perpendicular to the front-rear direction X and the left-right direction Y.

The body 3 includes a wet zone 31, an etching zone 32, a first cleaning zone 33, a deoxidation zone 35, a second cleaning zone 36, an inspection zone 38, a removal zone 39, and a third cleaning zone 40 , A neutralization zone 41, a fourth cleaning zone 42, a drying zone 44, and a recirculation zone 45. The aforementioned wet zone 31, etching zone 32, first cleaning zone 33, deoxidation zone 35, second cleaning zone 36, inspection zone 38, removal zone 39, third cleaning zone 40, neutralization zone 41, and fourth cleaning zone 42 and the drying zone 44 are arranged in a row from front to back along the front-rear direction X. The recirculation zone 45 extends in another row along the front-rear direction X and is arranged on the right side of the aforementioned row along the left-right direction Y. The recirculation zone 45 and the wet zone 31 jointly define a front end 301, and the recirculation zone 45 and the drying zone 44 jointly define a rear end 302.

The conveying device 5 includes a first conveying mechanism 51 and a second conveying mechanism 52 spaced apart from the first conveying mechanism 51 in the left-right direction Y. The first conveying mechanism 51 is arranged in the aforementioned wetting zone 31, etching zone 32, first cleaning zone 33, deoxidation zone 35, second cleaning zone 36, inspection zone 38, removal zone 39, third cleaning zone 40, and neutralization zone. Zone 41, the fourth cleaning zone 42, and the drying zone 44. The first conveying mechanism 51 has a wetted area 31 And a front end 511 of the feed material adjacent to the front end 301, and a rear end 512 of the discharge material located in the drying zone 44 and adjacent to the back end 302. The first conveying mechanism 51 can move the carrier jig 2 in the aforementioned areas along a first conveying direction D1 from front to back. The second conveying mechanism 52 is disposed in the recirculation zone 45 and has a feeding rear end 521 adjacent to the rear end 302 and a discharging front end 522 adjacent to the front end 301. The second conveying mechanism 52 can convey the supporting jig 2 in the return zone 45 along a second conveying direction D2 opposite to the first conveying direction D1.

Referring to FIGS. 12 and 13, the wetting zone 31 includes a feed section 311, a wetting section 312 located on the downstream side of the feed section 311, and a drying section 313 located on the downstream side of the wet section 312. The wetting section 312 includes a plurality of pairs of spraying elements 314 arranged at intervals along the first conveying direction D1. The two spraying elements 314 of each pair are spaced along the up-down direction Z. The lower spraying element 314 is used for spraying water 310 upward, and the upper spraying element 314 is used for spraying water 310 downward. Thereby, the aforementioned spraying member 314 can spray water 310 on the wafer 1 (as shown in FIG. 7) on the carrier jig 2 conveyed by the first conveying mechanism 51 to perform the wetting operation.

The first conveying mechanism 51 includes a plurality of lower conveying rollers 513 arranged at intervals in the front-rear direction X, and a plurality of upper conveying rollers 514 arranged at intervals in the front-rear direction X. The lower conveying rollers 513 and the upper conveying rollers 514 are located between the feeding front end 511 and the discharging rear end 512 (Figure 10). Each lower conveying roller 513 is an active roller, and each upper conveying roller 514 is A driven roller. The number of upper conveying rollers 514 is less than the number of lower conveying rollers 513, and each upper conveying roller 514 is positioned above the corresponding lower conveying roller 513. The first conveying mechanism 51 passes through the lower conveying roller 513 and the upper conveying roller 514 drives the carrier jig 2 to move along the first conveying direction D1.

12 and 14, the drying section 313 includes two pairs of air nozzles 315 located on the downstream side of the spray member 314, and two side air nozzles 316 (as shown in FIG. 14). The two pairs of air jets 315 are spaced apart along the first conveying direction D1, and the two air jets 315 of each pair are spaced apart along the up and down direction Z, and each jet head 315 is used to eject compressed air in the form of an air knife. Among them, the lower jet nozzle 315 is inclined upward and forward jets, and the upper jet nozzle 315 is inclined downward and forward jets. Thereby, the aforementioned air jet head 315 can jet the wafer 1 (as shown in FIG. 7) on the carrier jig 2 conveyed by the first conveying mechanism 51 to remove the water 310 on the wafer 1. The two side air nozzles 316 are spaced apart in the left and right direction Y, one of which is to inject the wafer 1 on the carrier fixture 2 conveyed by the first conveying mechanism 51 laterally along a left air blowing direction D3, and the other is The wafer 1 on the carrier fixture 2 is jetted laterally along a right jet direction D4 opposite to the left jet direction D3, thereby removing the water 310 on the wafer 1.

Referring to FIGS. 15 and 16, the etching zone 32 includes a partition section 321, a chemical reaction section 322 located on the downstream side of the partition section 321, and a drying section 323 located on the downstream side of the chemical reaction section 322. The dividing section 321 is located on the downstream side of the drying section 313 (as shown in FIG. 12) of the wet zone 31, and is used to separate the drying section 313 and the chemical reaction section 322 to prevent the chemical liquid in the chemical reaction section 322 from infiltrating into the drying section 313 Inside. The chemical reaction section 322 forms a first medicinal solution tank 324 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through. The first medicinal liquid trough 324 contains the first medicinal solution tank 324 for immersing the carrier jig 2 Liquid medicine 325. In this embodiment, the first chemical solution 325 is an etching solution used to etch the pins 12 of each wafer 1 (as shown in FIG. 1). The chemical reaction section 322 includes a plurality of first chemical liquid spray nozzles 326 arranged in the first chemical liquid tank 324 and spaced apart along the first conveying direction D1 and staggered up and down. One part of the first chemical liquid spraying heads 326 sprays the first chemical liquid 325 in the form of a water jet toward the wafer 1 on the carrier jig 2, while the other part sprays the first chemical liquid 325 in the form of a water jet toward the wafer 1 downward.药液325. The first conveying mechanism 51 also includes two solid rollers 515 and two liquid cutting rollers 516. The two solid rollers 515 are respectively located at the front and rear ends of the first liquid tank 324. The two liquid cutting rollers 516 respectively abut against the two solid rollers 515 to block the first liquid medicine 325 to prevent a large amount of it from overflowing into the partition section 321 and the drying section 323. The part supported by the supporting jig 2 of each liquid cutting roller 516 can move upward to allow the supporting jig 2 to pass between the solid roller 515 and the liquid cutting roller 516.

Referring to FIGS. 15 and 17, the drying section 323 includes two pairs of first spray heads 327 and two first side nozzles 328 located on the downstream side of the first liquid tank 324. The two pairs of first nozzles 327 are spaced apart along the first conveying direction D1, and the two first nozzles 327 of each pair are spaced apart along the vertical direction Z. The structure and arrangement of each first nozzle 327 are the same as those of the air jet 315 (Figure 12). The lower first nozzle 327 is tilted upward and jets forward, and the upper first nozzle 327 is tilted toward the front. Jet down and forward. Thereby, the aforementioned first spray head 327 can spray the wafer 1 (as shown in FIG. 7) on the carrier fixture 2 conveyed by the first conveying mechanism 51 to remove the first chemical liquid 325 on the wafer 1. The structure and arrangement of each first side nozzle 328 and the structure of the side air nozzle 316 (Figure 14) And the setting method is the same. The two first-side nozzles 328 are spaced apart in the left-right direction Y, and one of the two first-side nozzles 328 is laterally to the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left air jet direction D3 Air jet, and the other is to jet the wafer 1 on the carrier fixture 2 sidewardly along the right air jet direction D4, thereby removing the first chemical solution 325 on the wafer 1.

Referring to Figure 18, the first cleaning zone 33 includes a first cleaning section 331 located on the downstream side of the drying section 323 (Figure 15), a second cleaning section 332 located on the downstream side of the first cleaning section 331, and a second cleaning section 332 located on the downstream side of the first cleaning section 331. A third cleaning section 333 on the downstream side of the cleaning section 332, and a fourth cleaning section 334 on the downstream side of the third cleaning section 333. The first cleaning section 331 includes two first water jet heads 335 spaced apart along the up-down direction Z, and two first jet heads 336 spaced apart along the up-down direction Z and located on the downstream side of the first water jet head 335. The structure of each first water spray head 335 is the same as that of the first chemical liquid spray head 326 (as shown in FIG. 15). One of the two first water spray heads 335 sprays water 337 in the form of a water jet toward the wafer 1 on the carrier jig 2 upwards, and the other sprays water 337 in the form of a water jet toward the wafer 1 downwards. To perform the first cleaning on the wafer 1. The structure and arrangement of each first jet head 336 are the same as those of jet head 315 (as shown in Figure 12). The lower first jet head 336 is inclined upward and forward jets, while the upper first jet head 336 is Air jet downward and forward at an oblique angle. Thereby, the aforementioned first air jet head 336 can air jet the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 to remove the water 337 on the wafer 1.

The second cleaning section 332 is formed with a water tank 338 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through, and the water tank 338 contains water 339 for the carrier jig 2 to soak for cleaning the wafer 1. Two solid rollers 515 and two liquid cutting rollers 516 are also configured at the front and rear ends of the water tank 338. The second cleaning section 332 includes a plurality of second water nozzles 340 arranged in the water tank 338 and spaced apart along the first conveying direction D1 and arranged in a staggered up and down direction, and two first water nozzles 340 spaced apart in the vertical direction Z and located on the downstream side of the water tank 338 Two jet heads 341. One part of the second water spray heads 340 sprays water 339 in the form of a water jet to the wafer 1 on the carrier jig 2 upwards, and the other part sprays water 339 in the form of a water jet to the wafer 1 downwards, thereby, To perform the second cleaning on wafer 1. The structure and arrangement of each second air jet 341 are the same as the structure and arrangement of air jet 315 (Figure 12). The lower second air jet 341 is inclined upward and forward jets, while the upper second air jet 341 is Air jet downward and forward at an oblique angle. Thereby, the aforementioned second air jet head 341 can jet the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 to remove the water 339 on the wafer 1.

The third cleaning section 333 includes a plurality of pairs of first spraying elements 342 spaced apart along the first conveying direction D1, and two third air jets 343 spaced apart along the vertical direction Z and located on the downstream side of the first spraying element 342. The structure and arrangement of each first spraying element 342 are the same as the structure and arrangement of the spraying element 314 (as shown in FIG. 12). The two first spraying members 342 of each pair are spaced along the up-down direction Z. The lower first spraying member 342 is used to spray water 344 on the wafer 1 upward, and the upper first spraying member 342 is used to spray water 344 downwards. Chip 1 Spray 344 of water. Thereby, the aforementioned first spraying member 342 can perform the third cleaning on the wafer 1. The structure and arrangement of the third jet heads 343 are the same as those of the jet head 315 (Figure 12). The lower third jet head 343 is inclined upward and forward to jet the wafer 1 and the upper third jet head 343 jets the wafer 1 obliquely downward and forward. Thereby, the compressed gas sprayed by the aforementioned third spray head 343 can remove the water 344 on the wafer 1.

The fourth cleaning section 334 includes a plurality of pairs of second spraying members 345 arranged at intervals along the first conveying direction D1, two pairs of fourth spraying heads 346 located on the downstream side of the second spraying member 345, and two second spraying members 345 The side air nozzle 347 on the downstream side. The structure and arrangement of each second spraying element 345 are the same as the structure and arrangement of the spraying element 314 (as shown in FIG. 12). The two second spraying members 345 of each pair are spaced along the up-down direction Z, wherein the lower second spraying member 345 is used to spray water 348 upwards on the wafer 1, and the upper second spraying member 345 is used to spray downwards The wafer 1 is sprayed with water 348. Thereby, the aforementioned second spraying member 345 can perform the fourth cleaning on the wafer 1.

Referring to FIGS. 18 and 19, the two pairs of fourth air jets 346 are spaced apart along the first conveying direction D1, and the two fourth air jets 346 of each pair are spaced apart along the up-down direction Z. The structure and arrangement of each fourth air jet 346 are the same as that of air jet 315 (as shown in FIG. 12). The lower fourth air jet 346 is inclined upward and forward to jet the wafer 1 (as shown in FIG. 7). The upper fourth air jet head 346 is inclined downward and forward to jet the wafer 1. As a result, the compressed gas ejected from the fourth jet head 361 is The water 348 on the wafer 1 can be removed. The structure and arrangement of each side air nozzle 347 are the same as the structure and arrangement of the side air nozzle 316 (see FIG. 14). The two side air nozzles 347 are spaced apart in the left and right direction Y, and one of the two side air nozzles 347 is to blow sidewardly on the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left air blowing direction D3, The other is to spray sidewardly on the wafer 1 on the carrier jig 2 along the right spray direction D4 to remove the water 348 on the wafer 1.

20 and 21, the overall structure of the deoxidation zone 35 is the same as that of the etching zone 32 in FIG. 15. The deoxidation zone 35 includes a partition section 351, a chemical reaction section 352 located on the downstream side of the partition section 351, and a chemical reaction section 352 located on the downstream side of the partition section 351. The drying section 353 on the downstream side of the reaction section 352. The separating section 351 is located on the downstream side of the fourth cleaning section 334 (as shown in FIG. 18), and is used to separate the fourth cleaning section 334 from the chemical reaction section 352, so as to prevent the chemical liquid in the chemical reaction section 352 from infiltrating into the fourth cleaning section 334 . The chemical reaction section 352 forms a second medicinal solution tank 354 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through. The second medicinal liquid tank 354 contains the second medicinal solution tank 354 for immersing the carrier jig 2 Liquid medicine 355. Two solid rollers 515 and two liquid cutting rollers 516 are also arranged at the front and rear ends of the second liquid medicine tank 354. In this embodiment, the second chemical solution 355 is a deoxidizing solution used to generate a deoxidizing reaction on the pins 12 of each chip 1 (as shown in FIG. 1). The chemical reaction section 352 includes a plurality of second chemical liquid spray nozzles 356 arranged in the second chemical liquid tank 354 and spaced apart along the first conveying direction D1 and staggered up and down. A part of the second chemical liquid spraying heads 356 sprays the second chemical liquid 355 in the form of a water jet to the wafer 1 on the supporting jig 2 facing upwards, and the other part is directed downwards to the wafer The sheet 1 sprays the second liquid medicine 355 in the form of a water jet.

Referring to FIGS. 20 and 21, the drying section 353 includes two pairs of second spray heads 357 and two second side nozzles 358 located on the downstream side of the second liquid tank 354. The two pairs of second nozzles 357 are spaced apart along the first conveying direction D1, and the two second nozzles 357 of each pair are spaced apart along the vertical direction Z. The structure and arrangement of each second nozzle 357 are the same as those of the air jet 315 (Figure 12). The lower second nozzle 357 is tilted upward and jets forward, and the upper first nozzle 327 is tilted toward the front. Jet down and forward. In this way, the aforementioned first spray head 327 can jet the wafer 1 to remove the second chemical liquid 355 on the wafer 1. The structure and arrangement of each second side nozzle 358 are the same as the structure and arrangement of the side air nozzle 316 (see FIG. 14). The two second-side nozzles 358 are spaced apart in the left-right direction Y, and one of the two second-side nozzles 358 is laterally to the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left air jet direction D3 Air jets, and the other is to jet the wafer 1 on the carrier fixture 2 laterally along the right air jet direction D4, so as to remove the second chemical solution 355 on the wafer 1.

Referring to FIG. 22, the structure of the second cleaning area 36 is similar to the structure of the first cleaning area 33 in FIG. 18. The only difference is that the second cleaning area 36 is missing the third cleaning section 333 of the first cleaning area 33 (as shown in FIG. 18 ). The second cleaning zone 36 includes a first cleaning section 361 located on the downstream side of the drying section 353 (as shown in FIG. 20), a second cleaning section 362 located on the downstream side of the first cleaning section 361, and a second cleaning section 362 located on the downstream side of the first cleaning section 361. The third cleaning section 363 on the downstream side. The first cleaning section 361 includes two first water jets 364 spaced apart along the vertical direction Z, and Two first jet heads 365 spaced along the vertical direction Z and located on the downstream side of the first water jet head 364. The structure of each first sprinkler head 364 is the same as that of the first sprinkler head 335 (see FIG. 18). One of the two first water spray heads 364 sprays water 366 in the form of a water jet toward the wafer 1 (as shown in FIG. 7) on the carrier jig 2 upward, and the other sprays water in the form of a water jet toward the wafer 1 downward. 366, by this, the first cleaning of the wafer 1 is performed. The structure and arrangement of each first air jet 365 are the same as those of air jet 315 (as shown in Figure 12). The lower first air jet 365 is inclined upward and forward jets, while the upper first air jet 365 is Air jet downward and forward at an oblique angle. Thereby, the aforementioned first air jet head 365 can air jet to the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 to remove the water 366 on the wafer 1.

The second cleaning section 362 is formed with a water tank 367 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through, and the water tank 367 contains water 368 for the carrier jig 2 to soak for cleaning the wafer 1. Two solid rollers 515 and two liquid cutting rollers 516 are also configured at the front and rear ends of the water tank 367. The second cleaning section 362 includes a plurality of second sprinklers 369 arranged in the water tank 367 and spaced apart along the first conveying direction D1 and staggered up and down, and two first water nozzles 369 spaced in the vertical direction Z and located on the downstream side of the water tank 367 Two jet head 370. One part of the second water spray heads 369 sprays water 368 in the form of a water jet to the wafer 1 on the carrier jig 2 upwards, and the other part sprays water 368 in the form of a water jet to the wafer 1 downwards, thereby, To perform the second cleaning on wafer 1. The structure and arrangement of each second air jet 370 are the same as the structure and arrangement of air jet 315 (as shown in Figure 12). The formula is the same, the lower second jet head 370 is inclined upward and forward jets, and the upper second jet head 370 is inclined downward and forward jets. Thereby, the aforementioned second air jet head 370 can air jet the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 to remove the water 368 on the wafer 1.

Referring to Figures 22 and 23, the third cleaning section 363 includes a plurality of pairs of spraying elements 371 arranged at intervals along the first conveying direction D1, two pairs of third air jets 372 located on the downstream side of the spraying elements 371, and two spraying elements 371 Side jet nozzle 373 on the downstream side. The structure and arrangement of each spraying element 371 are the same as the structure and arrangement of the spraying element 314 (as shown in FIG. 12). The two spraying members 371 of each pair are spaced along the vertical direction Z. The lower spraying member 371 is used to spray water 374 on the wafer 1 upward, and the upper spraying member 371 is used to spray water 374 on the wafer 1 downward. Thereby, the aforementioned spraying member 371 can perform the third cleaning on the wafer 1.

The two pairs of third air jets 372 are spaced apart along the first conveying direction D1, and the two third air jets 372 of each pair are spaced apart along the up-down direction Z. The structure and arrangement of each third jet head 372 are the same as the structure and arrangement of jet head 315 (Figure 12). The lower third jet head 372 is inclined upward and forward to jet the wafer 1 and the upper third jet head 372 jets the wafer 1 obliquely downward and forward. Thereby, the compressed gas sprayed by the aforementioned third spray head 372 can remove the water 374 on the wafer 1. The structure and arrangement of the side air nozzles 373 are the same as the structure and arrangement of the side air nozzles 316 (as shown in FIG. 14). The two side air nozzles 373 are spaced apart in the left and right direction Y, One of the two side air nozzles 373 is to air the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left air jet direction D3, and the other is to carry the carrier along the right air jet direction D4. The wafer 1 on the jig 2 is jetted from the side to remove the water 374 on the wafer 1.

10 and 11, the inspection area 38 is located on the downstream side of the third cleaning section 363 (as shown in FIG. 22). When the first conveying mechanism 51 transports the carrier jig 2 to the inspection area 38, the worker controls the first conveying mechanism 51 to stop the operation, and the carrier jig 2 can stop at the inspection area 38. In this way, the worker can take out the carrier jig 2 to check the etching and cleaning conditions of the pins 12 of each chip 1 (as shown in FIG. 1).

Referring to FIG. 24, the overall structure of the removal zone 39 is the same as that of the etching zone 32 of FIG. 15. The removal zone 39 includes a partition section 391, a chemical reaction section 392 located on the downstream side of the partition section 391, and a chemical reaction section 392. The drying section 393 on the downstream side. The separating section 391 is located on the downstream side of the inspection area 38 (as shown in FIG. 11 ), and is used to separate the inspection area 38 from the chemical reaction section 392 to prevent the chemical liquid in the chemical reaction section 392 from infiltrating into the inspection area 38. The chemical reaction section 392 forms a third liquid tank 394 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through. The third liquid tank 394 contains a third liquid tank for the carrier jig 2 to soak. Liquid medicine 395. Two solid rollers 515 and two liquid cutting rollers 516 are also configured at the front and rear ends of the third liquid tank 394. In this embodiment, the third liquid medicine 395 is a silver stripping agent, which is used to remove the metal protection layer 14 of each chip 1 (as shown in FIG. 2). The chemical reaction section 392 includes a plurality of phases D1 arranged in the third liquid tank 394 and along the first conveying direction. The third liquid spray nozzles 396 are spaced apart and staggered up and down. A part of the third chemical liquid spraying heads 396 sprays the third chemical liquid 395 in the form of a water jet to the wafer 1 (as shown in FIG. 7) on the carrier jig 2 upward, and the other part sprays water downward to the wafer 1 The third liquid medicine 395 in the form of a knife.

Referring to FIGS. 24 and 25, the drying section 393 includes two pairs of third spray heads 397 and two third side nozzles 398 located on the downstream side of the third liquid tank 394. The two pairs of third nozzles 397 are spaced apart along the first conveying direction D1, and the two third nozzles 397 of each pair are spaced apart along the up-down direction Z. The structure and arrangement of the third nozzles 397 are the same as those of the first nozzle 327 (Figure 15). The lower third nozzle 397 is inclined upward and jets forward, and the upper third nozzle 397 is inclined. Jet down and forward. Thereby, the aforementioned third spray head 397 can spray the wafer 1 (as shown in FIG. 7) to remove the third chemical liquid 395 on the wafer 1. The structure and arrangement of each third side nozzle 398 are the same as the structure and arrangement of the first side nozzle 328 (as shown in FIG. 15). The two third-side nozzles 398 are spaced apart in the left-right direction Y, and one of the two third-side nozzles 398 is lateral to the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left air jet direction D3 Air jets, and the other is to jet the wafer 1 on the carrier fixture 2 laterally along the right air jet direction D4 to remove the third liquid medicine 395 on the wafer 1.

Referring to FIG. 26, the structure of the third cleaning zone 40 is similar to the structure of the first cleaning zone 33 of FIG. 18. The difference is that the third cleaning zone 40 lacks the second cleaning section 332 and the third cleaning section of the first cleaning zone 33. 333 (Figure 18). The third cleaning zone 40 includes one A first cleaning section 401 on the downstream side of the drying section 393 (as shown in FIG. 24), and a second cleaning section 402 located on the downstream side of the first cleaning section 401. The first cleaning section 401 includes two first water jet heads 403 spaced apart along the up-down direction Z, and two first jet heads 404 spaced apart along the up-down direction Z and located on the downstream side of the first water jet head 403. The structure of each first water spray head 403 is the same as that of the first water spray head 335 (as shown in FIG. 18). One of the two first water jets 403 sprays water 405 in the form of a water jet toward the wafer 1 (as shown in FIG. 7) on the carrier jig 2 upward, and the other sprays water in the form of a water jet toward the wafer 1 downward. 405. By this, the first cleaning of the wafer 1 is performed. The structure and arrangement of each first air jet 404 are the same as the structure and arrangement of the first air jet 336 (as shown in FIG. 18). The lower first air jet 404 is inclined upward and forward jets, and the upper first air jet 404 The jet is tilted downward and forward. Thereby, the aforementioned first air jet head 404 can jet the wafer 1 on the carrier fixture 2 conveyed by the first conveying mechanism 51 to remove the water 405 on the wafer 1.

Referring to Figures 26 and 27, the second cleaning section 402 includes a plurality of pairs of spraying elements 406 spaced apart along the first conveying direction D1, two pairs of second air jets 407 located on the downstream side of the spraying elements 406, and two spraying elements 406 The side air nozzle 408 on the downstream side. The structure and arrangement of each spraying element 406 are the same as the structure and arrangement of the second spraying element 345 (as shown in FIG. 18). The two spraying elements 406 of each pair are spaced apart along the up and down direction Z. The lower spraying element 406 is used to spray water 409 upward to the wafer 1 (as shown in FIG. 7), and the upper spraying element 406 is used to spray the wafer downwards. 1 Spray water 409. Thereby, the aforementioned spraying member 406 can perform the second cleaning on the wafer 1.

The two pairs of second air jets 407 are spaced apart along the first conveying direction D1, and the two second air jets 407 of each pair are spaced apart along the up-down direction Z. The structure and arrangement of each second jet head 407 are the same as the structure and arrangement of the fourth jet head 346 (Figure 18). The lower second jet head 407 is inclined upward and forward to jet the wafer 1 and the upper second The jet head 407 jets the wafer 1 obliquely downward and forward. Thereby, the compressed gas sprayed by the aforementioned second spray head 407 can remove the water 409 on the wafer 1. The structure and arrangement of the side air nozzles 408 are the same as the structure and arrangement of the side air nozzles 347 (see FIG. 19). The two side air nozzles 408 are spaced apart in the left and right direction Y, and one of the two side air nozzles 408 is to blow sidewardly on the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left air blowing direction D3, The other is to spray sidewardly on the wafer 1 on the carrier fixture 2 along the right spray direction D4 to remove the water 409 on the wafer 1.

Referring to FIG. 28, the overall structure of the neutralization zone 41 is similar to the structure of the etching zone 32 in FIG. 15. The neutralization zone 41 includes a partition section 411, a chemical reaction section 412 located on the downstream side of the partition section 411, and a chemical reaction section 412 The drying section 413 on the downstream side. The separating section 411 is located on the downstream side of the second cleaning section 402 (as shown in FIG. 26), and is used to separate the second cleaning section 402 from the chemical reaction section 412 to prevent the chemical liquid in the chemical reaction section 412 from infiltrating into the second cleaning section 402 . The chemical reaction section 412 forms a fourth liquid tank 414 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through, and the fourth liquid tank 414 contains a fourth liquid tank for the carrier jig 2 to soak. Liquid medicine 415. The front and rear ends of the fourth liquid tank 414 are the same There are two solid rollers 515 and two liquid cutting rollers 516 in this configuration. In this embodiment, the fourth chemical solution 415 is a neutralizer, which is used to neutralize and remove the oxide formed on the metal thermally conductive layer 13 of each wafer 1 (as shown in FIG. 2). The chemical reaction section 412 includes a plurality of fourth chemical liquid spray nozzles 416 arranged in the fourth chemical liquid tank 414 and spaced apart along the first conveying direction D1 and staggered up and down. A part of the fourth chemical liquid spraying heads 416 sprays the fourth chemical liquid 415 in the form of a water jet to the wafer 1 (as shown in FIG. 7) on the carrier jig 2 upward, and the other part sprays water downward to the wafer 1 The fourth liquid medicine 415 in the form of a knife.

Referring to FIGS. 28 and 29, the drying section 413 includes two pairs of fourth spray heads 417 and two fourth side nozzles 418 located on the downstream side of the fourth liquid tank 414. The two pairs of fourth nozzles 417 are spaced apart along the first conveying direction D1, and the two fourth nozzles 417 of each pair are spaced apart along the up-down direction Z. The structure and arrangement of the fourth nozzles 417 are the same as those of the first nozzle 327 (Figure 15). The lower fourth nozzle 417 is inclined upward and air jets forward, and the upper fourth nozzle 417 is inclined. Jet down and forward. Thereby, the aforementioned fourth spray head 417 can blow air to the wafer 1 (as shown in FIG. 7) to remove the fourth chemical solution 415 on the wafer 1. The structure and arrangement of each fourth side nozzle 418 are the same as the structure and arrangement of the first side nozzle 328 (as shown in FIG. 17). The two fourth side nozzles 418 are spaced apart along the left and right direction Y, and one of the two fourth side nozzles 418 is lateral to the wafer 1 on the carrier jig 2 conveyed by the first conveying mechanism 51 along the left air jet direction D3 Air jets, and the other is to jet the wafer 1 on the carrier fixture 2 laterally along the right air jet direction D4 to remove the fourth chemical solution 415 on the wafer 1.

Referring to FIG. 30, the structure of the fourth cleaning area 42 is the same as the structure of the second cleaning area 36 of FIG. 22. The fourth cleaning zone 42 includes a first cleaning section 421 located on the downstream side of the drying section 413 (as shown in Figure 28), a second cleaning section 422 located on the downstream side of the first cleaning section 421, and a second cleaning section 422 located on the downstream side of the first cleaning section 421. The third cleaning section 423 on the downstream side. The first cleaning section 421 includes two first water jet heads 424 spaced apart along the up-down direction Z, and two first jet heads 425 spaced apart along the up-down direction Z and located on the downstream side of the first water jet head 424. The structure of each first sprinkler head 424 is the same as the structure of the first sprinkler head 364 (FIG. 22). One of the two first water spray heads 424 sprays water 426 in the form of a water jet toward the wafer 1 (as shown in FIG. 7) on the carrier jig 2 upward, and the other sprays water in the form of a water jet toward the wafer 1 downward. 426, with this, the first cleaning of the wafer 1 is performed. The structure and arrangement of each first air jet 425 are the same as the structure and arrangement of the first air jet 365 (as shown in Figure 22). The lower first air jet 425 is inclined upward and forward jets, and the upper first air jet 425 The jet is tilted downward and forward. Thereby, the aforementioned first air jet 425 can jet the wafer 1 on the carrier fixture 2 conveyed by the first conveying mechanism 51 to remove the water 426 on the wafer 1.

The second cleaning section 422 is formed with a water tank 427 for the carrier jig 2 conveyed by the first conveying mechanism 51 to pass through, and the water tank 427 contains water 428 for the carrier jig 2 to soak for cleaning the wafer 1. Two solid rollers 515 and two liquid cutting rollers 516 are also configured at the front and rear ends of the water tank 427. The second cleaning section 422 includes a plurality of second cleaning sections arranged in the water tank 427 and spaced apart along the first conveying direction D1 and staggered up and down. The water jet 429, and two second air jets 430 spaced along the vertical direction Z and located on the downstream side of the water tank 427. One part of the second water spray heads 429 sprays water 428 in the form of a water jet to the wafer 1 on the carrier jig 2 upwards, and the other part sprays water 428 in the form of a water jet to the wafer 1 downwards, thereby, To perform the second cleaning on wafer 1. The structure and arrangement of each second air jet 430 are the same as the structure and arrangement of the second air jet 370 (as shown in FIG. 22). The lower second air jet 430 is inclined upward and forward jets, and the upper second air jet 430 The jet is tilted downward and forward. Thereby, the aforementioned second air jet head 430 can jet the wafer 1 on the carrier fixture 2 conveyed by the first conveying mechanism 51 to remove the water 428 on the wafer 1.

Referring to Figures 30 and 31, the third cleaning section 423 includes a plurality of pairs of spraying elements 431 arranged at intervals along the first conveying direction D1, two pairs of third air jets 432 located on the downstream side of the spraying elements 431, and two spraying elements 431 The side air nozzle 433 on the downstream side. The structure and arrangement of each spraying element 431 are the same as the structure and arrangement of the spraying element 370 (as shown in FIG. 22). The two spraying members 431 of each pair are spaced along the up and down direction Z. The lower spraying member 431 is used to spray water 434 upward to the wafer 1 (as shown in FIG. 7), and the upper spraying member 431 is used to spray the wafer downwards. 1 Spray 434 with water. Thereby, the aforementioned spraying member 431 can perform the third cleaning on the wafer 1.

The two pairs of third air jets 432 are spaced apart along the first conveying direction D1, and the two third air jets 432 of each pair are spaced apart along the up-down direction Z. The structure and arrangement of each third air jet 432 are the same as the structure and arrangement of the third air jet 372 (Figure 22). The formula is the same, the lower third air jet head 432 is inclined upward and forward to jet the wafer 1 while the upper third air jet 432 is inclined downward and forward to jet the wafer 1. Thereby, the compressed gas sprayed by the aforementioned third spray head 432 can remove the water 434 on the wafer 1. The structure and arrangement of the side air nozzles 433 are the same as the structure and arrangement of the side air nozzles 373 (as shown in FIG. 23). The two side air nozzles 433 are spaced apart in the left and right direction Y, and one of the two side air nozzles 433 is to air sidewardly on the wafer 1 on the carrier fixture 2 conveyed by the first conveying mechanism 51 along the left air blowing direction D3, The other is to spray sidewardly on the wafer 1 on the carrier jig 2 along the right spray direction D4 to remove the water 434 on the wafer 1.

Referring to FIG. 32, the drying zone 44 includes a drying section 441 located at the downstream side of the third cleaning section 423 (as shown in FIG. 30 ), and a drying section 442 located at the downstream side of the drying section 441. The drying section 441 includes a plurality of pairs of first blowing members 443 arranged at intervals along the first conveying direction D1. The two first blowing members 443 of each pair are spaced apart along the up and down direction Z, wherein the lower first blowing member 443 is used to blow compressed air in the form of an air knife to the wafer 1 (as shown in FIG. 7) upward, and the upper first blowing member 443 The blowing member 443 is used to blow compressed air in the form of an air knife to the wafer 1 downward. In this way, the wafer 1 on the carrier jig 2 is blow-dried. The drying section 442 includes a plurality of pairs of second blowing elements 444 spaced apart and staggered up and down along the first conveying direction D1. One part of the second blowing members 444 blows compressed air in the form of an air knife toward the wafer 1 on the carrier jig 2 upward, and the other part blows compressed air in the form of an air knife toward the wafer 1 downward, thereby, To dry the wafer 1 on the carrier fixture 2. In this embodiment, The temperature of the compressed air blown by the first blowing element 443 is, for example, equal to or less than 60° C., and the temperature of the compressed air blown by the second blowing element 444 is, for example, 85-90° C.

33, 34 and 35, the transfer device 6 is located at the rear end 302 of the body 3 and includes a temporary storage mechanism 61 located on the downstream side of the drying zone 44, and a traverse mechanism 62 located on the downstream side of the temporary storage mechanism 61 . The temporary storage mechanism 61 includes a first conveying unit 611 and a lifting unit 612. The first conveying unit 611 corresponds to the discharge rear end 512 of the first conveying mechanism 51 and has a plurality of first conveying wheels 613 arranged at intervals along the first conveying direction D1. The first conveying wheels 613 are used to receive the load-bearing jig 2 (as shown in FIG. 32) output from the discharge rear end 512, and can move the load-bearing jig 2 along the first conveying direction D1. The lifting unit 612 includes two guide rods 614, a sliding frame 615, multiple pairs of supporting rods 616, and a first driving assembly 617. The two guide rods 614 are arranged at intervals along the first conveying direction D1, and the axial direction of each guide rod 614 extends in the up-down direction Z. The sliding frame 615 is slidably connected to the two guide rods 614. A plurality of pairs of supporting rods 616 are arranged on the sliding frame 615 and arranged at intervals along the up-down direction Z, and the two supporting rods 616 of each pair are spaced apart along the front-to-rear direction X. Each supporting rod 616 can move in the up and down direction Z between the corresponding two first conveying wheels 613, so that each pair of supporting rods 616 can lift the supporting jig 2 on the first conveying wheel 613 upward The supporting fixture 2 is supported, or the supported supporting fixture 2 is placed on the first conveying wheel 613. The first driving assembly 617 is connected to the sliding frame 615 to drive the sliding frame 615 to move up or down in the up and down direction Z.

The traverse mechanism 62 includes a second conveying unit 621 and a traverse unit 622. The second conveying unit 621 includes a plurality of second conveying wheels 623 arranged at intervals along the first conveying direction D1. The second conveying wheels 623 are used to receive the load-bearing jig 2 output by the first conveying unit 611 and to transfer it. Output to the second conveying mechanism 52. The traverse unit 622 includes a guide rail 624, a sliding member 625, and a second driving assembly 626. The guide rail 624 has a long shape and its longitudinal direction extends in the left-right direction Y. The sliding member 625 is slidably connected to the guide rail 624 and can slide in the left-right direction Y, and the sliding member 625 is connected to the bottom end of the second conveying unit 621. The second driving assembly 626 is connected to the sliding member 625 to drive the sliding member 625 to slide in the left-right direction Y, so that the sliding member 625 can drive the second conveying unit 621 in a first position aligned with the first conveying unit 611 (as shown in FIG. 35), and move between a second position aligned with the rear end 521 of the feeding material (as shown in FIG. 38). When the second conveying unit 621 is at the first position, the second conveying unit 621 can receive the supporting fixture 2 output by the first conveying unit 611. When the second conveying unit 621 is in the second position, the second conveying unit 621 can convey the carried jig 2 to the second conveying mechanism 52. Thereby, the second conveying mechanism 52 can move the carrier jig 2 in the return zone 45 along the second conveying direction D2 (as shown in FIG. 10), and discharge the material through the discharge front end 522 (as shown in Fig. 10).

The following describes the processing method of the wet processing equipment 300: Referring to FIG. 36, the wet processing method of the wet processing equipment 300 of this embodiment includes the following steps: a conveying step S1, a wetting step S2, an etching step S3, a first Cleaning step S4, deoxidation step S5, second cleaning step S6, removal step S7, third cleaning step S8, neutralization step S9, fourth cleaning step S10, drying step S11, Transfer step S12, and reflow step S13.

Referring to FIGS. 10 and 36, in the conveying step S1, a plurality of supporting fixtures 2 are first fed into the first conveying mechanism 51 through the feeding front end 511 in sequence, and then through the first conveying mechanism 51 of the conveying device 5. Each carrier jig 2 is conveyed to move along the first conveying direction D1.

Referring to FIG. 7, FIG. 12 and FIG. 13, in the wetting step S2, the carrier fixture 2 fed onto the first conveying mechanism 51 through the feeding front end 511 will be located in the feeding section 311 of the wetting zone 31. Subsequently, the first conveying mechanism 51 conveys the carrier jig 2 to the wetting section 312 along the first conveying direction D1 and moves therein. The water 310 sprayed upward from the lower spray member 314 of the wetting section 312 will be sprayed to the wafer 1 through the through hole 215 of the carrier plate 21, and the water 310 sprayed downward from the upper spray member 314 will be sprayed through the first opening of the cover 23 230 and the second opening 235 are sprayed to the wafer 1. In this way, in addition to pre-cleaning the chip 1 to wash away the dust or dirt on it, the pins 12 (as shown in FIG. 6) and the metal protective layer 14 of the chip 1 can also be wetted, so that the chip 1 is In the subsequent steps, the reaction speed of each pin 12 and the metal protective layer 14 with the chemical liquid can be increased.

Referring to FIGS. 7, 12 and 14, then, the first conveying mechanism 51 conveys the carrier jig 2 to the drying section 313 along the first conveying direction D1 and moves therein. Firstly, the gas jetted by the lower jet head 315 adjacent to the wetted section 312 tilts upwards will be jetted to the wafer 1 through the through hole 215 and drive the water 310 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the upper air jet 315 adjacent to the wetting section 312 is inclined downward The sprayed gas will scrape off the water 310 discharged from the first opening 230 and the second opening 235. At the same time, the gas will be sprayed to the wafer 1 through the first opening 230 and the second opening 235 and drive the wafer 1 The remaining water 310 is discharged from the through hole 215 to perform the first drying operation on the wafer 1. In the same way, another pair of air jets 315 far from the wetting section 312 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

Referring to Figures 7, 8, 9 and 14, on the other hand, the gas ejected by one of the side jet nozzles 316 along the left jet direction D3 will be jetted to the wafer 1 through the corresponding side flow channel 24, and the other side The gas ejected by the jet nozzle 316 along the right jet direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can drive the water 310 on the wafer 1 (as shown in FIG. 13) through the through hole 215 or the end flow channel 25 It is discharged to perform the third drying operation on the wafer 1. In this way, it can be ensured that the water 310 on each wafer 1 is completely blown off, so as to prevent the water 310 on the wafer 1 from being carried to the etching area 32 of the next station to affect or dilute the first chemical solution 325 (as shown in FIG. 15).

Referring to FIGS. 7, 8, 9 and 15, in the etching step S3, the first conveying mechanism 51 drives the carrier fixture 2 into the first chemical tank 324 of the chemical reaction section 322 through the partition section 321 of the etching zone 32 . The supporting jig 2 is completely immersed in the first liquid medicine 325 when moving in the first liquid medicine tank 324. The first liquid medicine 325 can flow into the wafer 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the first chemical liquid 325 sprayed by the lower first chemical liquid spraying head 326 upwards will flow to the wafer 1 through the through hole 215, and the upper first chemical liquid spraying head 326 The first liquid medicine 325 sprayed downward will flow to the chip 1 through the first opening 230 and the second opening 235, so that the first liquid medicine 325 can flow smoothly in the supporting fixture 2. Thereby, the first chemical solution 325 can fully and reliably react with each pin 12 of the wafer 1 (as shown in FIG. 6) or with the wire generated by the sawing of the wafer 1 and etch each pin 12 or metal. Wire, so that the distance between two adjacent pins 12 can be increased to a preset length, or the wire is removed to prevent the chip 1 from expanding and contracting due to thermal expansion and contraction during subsequent use. The wire is in contact with another adjacent pin 12 or two adjacent pins 12 are in contact with each other, thereby causing a short circuit.

Referring to FIGS. 7 and 15, then, the first conveying mechanism 51 conveys the carrier jig 2 to the drying section 323 along the first conveying direction D1 and moves therein. First, the gas sprayed by the first spray head 327 tilted upward adjacent to the chemical reaction section 322 is sprayed to the wafer 1 through the through hole 215 and drives the first chemical solution 325 on the wafer 1 to pass through the first opening 230 and the second opening. The hole 235 is discharged. Subsequently, the gas sprayed by the first spray head 327 tilted downward adjacent to the chemical reaction section 322 will scrape off the first liquid medicine 325 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235. An opening 230 and a second opening 235 are sprayed to the wafer 1 and drive the first chemical solution 325 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. In the same way, another pair of first spray heads 327 far from the chemical reaction section 322 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

Referring to Figure 7, Figure 8, Figure 9 and Figure 17, on the other hand, the gas ejected by one of the first side nozzles 328 along the left jet direction D3 will pass through the corresponding side flow channel 24 is sprayed to wafer 1, and the gas sprayed by the other first side nozzle 328 along the right spray direction D4 will be sprayed to wafer 1 through the corresponding side flow channel 24, so that the gas can spray the remaining first drug on wafer 1 The liquid 325 (as shown in FIG. 16) is discharged from the through hole 215 or the end flow channel 25 to perform the third drying operation on the wafer 1. Thereby, it can be ensured that the first chemical liquid 325 on each wafer 1 is completely blown off.

Referring to Figures 7 and 18, in the first cleaning step S4, the first conveying mechanism 51 drives the carrier fixture 2 to first enter the first cleaning section 331 of the first cleaning zone 33, and the first cleaning section 331 is sprayed with first water. The water 337 sprayed upward by the head 335 will be sprayed to the wafer 1 through the through hole 215, and the water 337 sprayed downward by the upper first water spray head 335 will be sprayed to the wafer 1 through the first opening 230 and the second opening 235. The first cleaning is performed on each wafer 1 to wash off the first chemical solution 325 that has been blown dry on each wafer 1. Then, the gas ejected by the lower first jet head 336 tilted upward will be ejected to the wafer 1 through the through hole 215 and drive the water 337 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected by the upper first jet head 336 tilted downward will scrape off the water 337 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening. The hole 235 sprays to the wafer 1 and drives the water 337 on the wafer 1 to be discharged from the through hole 215 to dry the wafer 1.

After that, the first conveying mechanism 51 drives the carrying jig 2 into the water tank 338 of the second cleaning section 332. The carrying jig 2 is completely immersed in the water 339 when moving in the water tank 338. Water 339 can pass through the through hole 215, the first opening 230, and the second opening 235. The side runner 24 and the end runner 25 flow into the wafer 1 in the carrier fixture 2. In addition, the water 339 sprayed by the lower second water spray head 340 upward will flow to the wafer 1 through the through hole 215, and the water 339 sprayed by the upper second water spray head 340 downward will pass through the first opening 230 and the second opening. The holes 235 flow to the wafer 1 so that the water 339 can flow smoothly in the carrier jig 2 to perform a second cleaning on each wafer 1. Then, the gas ejected by the lower second air jet head 341 tilted upward will be ejected to the wafer 1 through the through hole 215 and drive the water 339 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected by the upper second jet head 341 tilted downward will scrape off the water 339 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 The water 339 sprayed to the wafer 1 and driven on the wafer 1 is discharged from the through hole 215 to dry the wafer 1.

The first conveying mechanism 51 then drives the carrier jig 2 into the third cleaning section 333. The water 344 sprayed upward from the lower first spray member 342 of the third cleaning section 333 is sprayed to the wafer 1 through the through hole 215, and the water 344 sprayed downward from the upper first spray member 342 is sprayed through the first opening 230 and The second opening 235 is sprayed to the wafer 1 to perform a third cleaning on each wafer 1. Then, the gas ejected by the lower third air jet head 343 tilted upward will be ejected to the wafer 1 through the through hole 215 and drive the water 344 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected by the upper third jet head 343 tilted downward will scrape off the water 344 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 The water 344 sprayed on the wafer 1 and driven on the wafer 1 is discharged from the through hole 215 to dry the wafer 1.

Referring to FIGS. 7, 8, 18 and 19, the first conveying mechanism 51 then drives the carrier jig 2 into the fourth cleaning section 334. The water 348 sprayed upward from the lower second spray member 345 of the fourth cleaning section 334 will be sprayed to the wafer 1 through the through hole 215, and the water 348 sprayed downward from the upper second spray member 345 through the first opening 230 and The second opening 235 is sprayed to the wafer 1 to perform a fourth cleaning on each wafer 1. The four-channel cleaning mechanism of the first cleaning zone 33 can ensure that the first chemical solution 325 remaining on each wafer 1 is completely cleaned and removed, so as to prevent the first chemical solution 325 remaining on the wafer 1 from being carried to the next station. The deoxidation zone 35 in turn affects the second chemical solution 355 (see FIG. 20).

The gas jetted by the fourth jet head 346 tilted upward and adjacent to the second spray member 345 will be jetted to the wafer 1 through the through hole 215 and drive the water 348 on the wafer 1 to be discharged from the first opening 230 and the second opening 235 . The gas sprayed by the fourth jet head 346 tilted downward adjacent to the second spray member 345 will scrape off the water 348 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening The 230 and the second opening 235 are sprayed to the wafer 1 and drive the water 348 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. In the same way, another pair of fourth jet heads 346 far from the second spray member 345 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

On the other hand, the gas emitted by one of the side jet nozzles 347 along the left jet direction D3 will be jetted to the wafer 1 through the corresponding side flow channel 24, and the gas jetted by the other side jet nozzle 347 along the right jet direction D4 Will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can drive the remaining water 348 on the wafer 1 through the through hole 215 or the end flow channel 25 is discharged to perform the third drying operation on the wafer 1. In this way, it can be ensured that the water 348 on each wafer 1 is completely blown off, so as to prevent the water 348 remaining on the wafer 1 from being carried to the deoxidation zone 35 of the next station, thereby affecting or diluting the second chemical solution 355.

Referring to Figure 7, Figure 8, Figure 9 and Figure 20, in the deoxidation step S5, the first conveying mechanism 51 drives the carrier fixture 2 through the partition section 351 of the deoxidation zone 35 into the second chemical tank of the chemical reaction section 352 354 within. The supporting jig 2 is completely immersed in the second liquid medicine 355 when moving in the second liquid medicine tank 354. The second liquid medicine 355 can flow into the wafer 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the second chemical liquid 355 sprayed by the lower second chemical liquid spraying head 356 upwards will flow to the chip 1 through the through hole 215, and the second chemical liquid 355 sprayed by the upper second chemical liquid spraying head 356 downwards will flow through the first An opening 230 and a second opening 235 flow to the chip 1 so that the second liquid medicine 355 can flow smoothly in the supporting fixture 2. Thereby, the second chemical solution 355 can sufficiently and reliably produce a deoxidation chemical reaction with each pin 12 of the chip 1 (as shown in FIG. 6). After the wafer 1 has undergone the etching step S3, since each pin 12 is in contact with water and gas, local oxidation will occur. Therefore, the second chemical solution 355 has a deoxidation effect on each pin 12, so that each pin 12 can be deoxidized. The passivation is copper oxide to form a protective layer to prevent the pins 12 from continuing to oxidize.

Referring to FIG. 7 and FIG. 20, then, the first conveying mechanism 51 conveys the carrier jig 2 to the drying section 353 and moves in the first conveying direction D1. First, the gas sprayed by the second nozzle 357 that is adjacent to the lower part of the chemical reaction section 352 tilts upwards will pass through the The hole 215 sprays to the wafer 1 and drives the second chemical solution 355 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas sprayed by the second spray head 357 tilted downward adjacent to the upper part of the chemical reaction section 352 will scrape off the second liquid medicine 355 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the An opening 230 and a second opening 235 are sprayed to the wafer 1 and drive the second chemical solution 355 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. In the same way, another pair of second nozzles 357 far from the chemical reaction section 352 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

Referring to Figure 7, Figure 8, Figure 9 and Figure 21, on the other hand, the gas ejected by one of the second side nozzles 358 along the left ejection direction D3 will be ejected to the wafer 1 through the corresponding side flow channel 24, and the other The gas sprayed by the second side nozzle 358 along the right spray direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can flow the second chemical solution 355 remaining on the wafer 1 through the through hole 215 or the end. The lane 25 is discharged to perform the third drying operation on the wafer 1. Thereby, it can be ensured that the second chemical liquid 355 on each wafer 1 is completely blown off.

Referring to Figures 7 and 22, in the second cleaning step S6, the first conveying mechanism 51 drives the carrier fixture 2 to first enter the first cleaning section 361 of the second cleaning zone 36, and the first cleaning section 361 is sprayed with first water below the first cleaning section 361 The water 366 sprayed upward by the head 364 will be sprayed to the wafer 1 through the through hole 215, and the water 366 sprayed downward by the upper first water spray head 364 will be sprayed to the wafer 1 through the first opening 230 and the second opening 235. The first cleaning is performed on each wafer 1 to wash off the second chemical solution 355 that has been blown dry on each wafer 1. Next, below The gas jetted by a jet head 365 tilted upward will be jetted to the wafer 1 through the through hole 215 and drive the water 366 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected by the upper first jet head 365 tilted downward will scrape off the water 366 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening. The hole 235 sprays to the wafer 1 and drives the water 366 on the wafer 1 to be discharged from the through hole 215 to dry the wafer 1.

After that, the first conveying mechanism 51 drives the carrying jig 2 into the water tank 367 of the second cleaning section 362. The carrying jig 2 is completely immersed in the water 368 when it moves in the water tank 367. The water 368 can flow into the wafer 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the water 368 sprayed by the lower second water spray head 369 upwards will flow to the wafer 1 through the through hole 215, and the water 368 sprayed by the upper second water spray head 369 downwards will flow through the first opening 230 and the second opening. The holes 235 flow to the wafer 1 so that the water 368 can flow smoothly in the carrier jig 2 to perform a second cleaning on each wafer 1. Then, the gas ejected by the lower second air jet head 370 tilted upward will be ejected to the wafer 1 through the through hole 215 and drive the water 368 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected by the upper second jet head 370 tilted downward will scrape off the water 368 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 The water 368 sprayed on the wafer 1 and driven on the wafer 1 is discharged from the through hole 215 to dry the wafer 1.

Referring to Figure 7, Figure 8, Figure 9, Figure 22 and Figure 23, the first conveying mechanism 51 Then drive the carrying jig 2 into the third cleaning section 363. The water 374 sprayed upward from the lower spray member 371 of the third cleaning section 363 is sprayed to the wafer 1 through the through hole 215, and the water 374 sprayed downward from the upper spray member 371 is sprayed through the first opening 230 and the second opening. 235 sprayed to wafer 1 to perform the third cleaning of each wafer 1. The three cleaning mechanisms in the second cleaning zone 36 can ensure that the second chemical solution 355 remaining on each wafer 1 is completely cleaned and removed, so as to prevent the second chemical solution 355 remaining on the wafer 1 from being carried to the next station. The removal area 39 in turn affects the third liquid medicine 395 (Figure 24).

The gas ejected by the third air jet head 372 tilted upward and adjacent to the spray member 371 is sprayed to the wafer 1 through the through hole 215 and drives the water 374 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas sprayed by the third jet head 372 tilted downward adjacent to the spraying member 371 will scrape off the water 374 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and The second opening 235 sprays to the wafer 1 and drives the water 374 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. In the same way, another pair of third air jet heads 372 far from the spraying element 371 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

Finally, the gas emitted by one of the side jet nozzles 373 along the left jet direction D3 will be jetted to the wafer 1 through the corresponding side flow channel 24, and the gas jetted by the other side jet nozzle 373 along the right jet direction D4 will pass through The corresponding side flow channel 24 is sprayed to the wafer 1 so that the gas can drive the remaining water 374 on the wafer 1 to be discharged from the through hole 215 or the end flow channel 25 to perform the third drying operation on the wafer 1. In this way, it can ensure that each chip 1 The upper water 374 is completely blown off to prevent the remaining water 374 on the wafer 1 from being carried to the removal area 39 of the next station to affect or dilute the third chemical solution 395.

10 and 11, the first conveying mechanism 51 will then drive the carrier jig 2 into the inspection area 38, and the staff can stop the operation by controlling the first conveying mechanism 51 to take out the carrier jig 2 and inspect each wafer 1 The etching status of pin 12.

Referring to FIGS. 7, 8, 9 and 24, in the removal step S7, the first conveying mechanism 51 drives the carrier fixture 2 to enter the third chemical tank of the chemical reaction section 392 through the partition section 391 of the removal zone 39 394. The supporting jig 2 is completely immersed in the third liquid medicine 395 when moving in the third liquid medicine tank 394. The third liquid medicine 395 can flow into the wafer 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the third chemical liquid 395 sprayed by the lower third chemical liquid spraying head 396 upwards will flow to the wafer 1 through the through hole 215, and the third chemical liquid 395 sprayed downwards by the upper third chemical liquid spraying head 396 will flow through the first An opening 230 and a second opening 235 flow to the chip 1 so that the third liquid medicine 395 can flow smoothly in the supporting fixture 2. Thereby, the third chemical solution 395 can sufficiently and reliably produce a chemical reaction with the metal protective layer 14 of the wafer 1 to remove the metal protective layer 14. That is, the removal step S7 is a silver stripping step of stripping off the metal protective layer 14. .

Referring to FIGS. 7 and 24, then, the first conveying mechanism 51 conveys the carrier jig 2 to the drying section 393 along the first conveying direction D1 and moves therein. First of all, the gas sprayed by the third nozzle 397 at the bottom adjacent to the chemical reaction section 392 tilts upwards will pass through the The hole 215 is sprayed to the wafer 1 and drives the third chemical solution 395 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas sprayed by the third spray head 397 tilted downward adjacent to the chemical reaction section 392 will scrape off the third liquid medicine 395 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235. An opening 230 and a second opening 235 are sprayed to the wafer 1 and drive the third liquid 395 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. In the same way, another pair of third chemical solutions 395 far from the chemical reaction section 322 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

Referring to Figures 7, 8, 9 and 25, on the other hand, the gas ejected by one of the third side nozzles 398 along the left air ejection direction D3 will be ejected to the wafer 1 through the corresponding side flow channel 24, and the other The gas sprayed by the third side nozzle 398 along the right spray direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can flow the third chemical solution 395 remaining on the wafer 1 through the through hole 215 or the end. The lane 25 is discharged to perform the third drying operation on the wafer 1. Thereby, it can be ensured that the third chemical liquid 395 on each wafer 1 is completely blown off.

Referring to Figures 7 and 26, in the third cleaning step S8, the first conveying mechanism 51 drives the carrier fixture 2 to first enter the first cleaning section 401 of the third cleaning zone 40, and the first cleaning section 401 is sprayed with water first. The water 405 sprayed upward by the head 403 will be sprayed to the wafer 1 through the through hole 215, and the water 366 sprayed downward by the upper first water spray head 403 will be sprayed to the wafer 1 through the first opening 230 and the second opening 235. The first cleaning is performed on each wafer 1 to wash off the third chemical solution 395 that has been blown dry on each wafer 1. Next, below The gas ejected by an air jet 404 tilted upward will be ejected to the wafer 1 through the through hole 215 and drive the water 405 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected by the upper first jet head 404 tilted downward will scrape off the water 405 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening. The hole 235 sprays to the wafer 1 and drives the water 405 on the wafer 1 to be discharged from the through hole 215 to dry the wafer 1.

Referring to FIGS. 7, 8, 9, 26 and 27, the first conveying mechanism 51 then drives the carrier jig 2 into the second cleaning section 402. The water 409 sprayed upward from the lower spray member 406 of the second cleaning section 402 will be sprayed to the wafer 1 through the through hole 215, while the water 409 sprayed downward from the upper spray member 406 will be sprayed through the first opening 230 and the second opening. 235 is sprayed to wafer 1 to perform a second cleaning on each wafer 1. The two cleaning mechanisms in the third cleaning zone 40 can ensure that the third chemical solution 395 remaining on each wafer 1 is completely cleaned and removed, so as to prevent the third chemical solution 395 remaining on the wafer 1 from being carried to the next station. The neutralization zone 41 in turn affects the fourth liquid medicine 415 (Figure 28).

The gas jetted by the second jet head 407 slanting upwards adjacent to the spraying member 406 will be jetted to the wafer 1 through the through hole 215 and drive the water 409 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas sprayed by the second jet head 407 tilted downward adjacent to the spray member 406 will scrape off the water 409 discharged from the first opening 230 and the second opening 235. At the same time, the gas will also pass through the first opening 230 and The second opening 235 sprays to the wafer 1 and drives the water 409 on the wafer 1 to be discharged from the through hole 215 to perform the The first drying operation. In the same way, another pair of second air jets 407 away from the spraying element 406 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

Finally, the gas emitted by one of the side jet nozzles 408 along the left jet direction D3 will be jetted to the wafer 1 through the corresponding side flow channel 24, and the gas jetted by the other side jet nozzle 408 along the right jet direction D4 will pass through The corresponding side flow channel 24 is sprayed to the wafer 1 so that the gas can drive the remaining water 374 on the wafer 1 to be discharged from the through hole 215 or the end flow channel 25 to perform the third drying operation on the wafer 1. In this way, it can be ensured that the water 409 on each wafer 1 is completely blown off, so as to prevent the water 409 remaining on the wafer 1 from being carried to the neutralization zone 41 of the next station, thereby affecting or diluting the fourth chemical solution 415.

Referring to Figure 7, Figure 8, Figure 9 and Figure 28, in the neutralization step S9, the first conveying mechanism 51 drives the carrier fixture 2 through the partition section 411 of the neutralization zone 41 into the fourth chemical tank of the chemical reaction section 412 414 within. The supporting jig 2 is completely immersed in the fourth liquid medicine 415 while moving in the fourth liquid medicine tank 414. The fourth liquid medicine 415 can flow into the wafer 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the fourth chemical liquid 415 sprayed by the lower fourth chemical liquid spraying head 416 upwards will flow to the chip 1 through the through hole 215, and the fourth chemical liquid 415 sprayed by the upper fourth chemical liquid spraying head 416 downwards will flow through the first An opening 230 and a second opening 235 flow to the chip 1 so that the fourth liquid medicine 415 can flow smoothly in the supporting fixture 2. Thereby, the fourth chemical solution 415 can sufficiently and reliably generate a chemical neutralization reaction with the metal thermally conductive layer 13 of the wafer 1 to neutralize and remove the oxide formed on the metal thermally conductive layer 13.

Referring to FIGS. 7 and 28, then, the first conveying mechanism 51 conveys the carrier jig 2 to the drying section 413 along the first conveying direction D1 and moves therein. First, the gas ejected by the fourth spray head 417 tilted upward adjacent to the chemical reaction section 412 will be sprayed to the wafer 1 through the through hole 215 and drive the fourth chemical solution 415 on the wafer 1 through the first opening 230 and the second opening. The hole 235 is discharged. Subsequently, the gas ejected by the fourth nozzle 417 tilted downward adjacent to the chemical reaction section 412 will scrape off the fourth chemical liquid 415 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235. An opening 230 and a second opening 235 are sprayed to the wafer 1 and drive the fourth chemical solution 415 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. In the same way, another pair of fourth chemical solutions 415 far from the chemical reaction section 412 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

Referring to Figures 7, 8, 9, and 29, finally, the gas ejected by one of the fourth side nozzles 418 along the left jet direction D3 will be ejected to the wafer 1 through the corresponding side flow channel 24, and the other fourth side nozzle 418 will be ejected to the wafer 1 through the corresponding side flow channel 24. The gas ejected by the side nozzle 418 along the right jet direction D4 will be sprayed to the wafer 1 through the corresponding side flow channel 24, so that the gas can transfer the fourth chemical solution 415 remaining on the wafer 1 through the through hole 215 or the end flow channel 25. It is discharged to perform the third drying operation on the wafer 1. Thereby, it can be ensured that the fourth chemical solution 415 on each wafer 1 is completely blown off.

Referring to FIGS. 7 and 30, in the fourth cleaning step S10, the first conveying mechanism 51 drives the carrier jig 2 to enter the first cleaning section 421 of the fourth cleaning zone 42 first, and the first cleaning section 421 is sprayed with water first. The water 426 sprayed upward by the head 424 will be sprayed to the wafer 1 through the through hole 215, and the water 426 sprayed downward by the upper first water spray head 424 will be sprayed through The first opening 230 and the second opening 235 are sprayed to the wafer 1 to perform a first cleaning on each wafer 1 to wash off the fourth chemical solution 415 that has been blown dry on each wafer 1. Then, the gas ejected by the lower first jet head 425 tilted upward will be ejected to the wafer 1 through the through hole 215 and drive the water 426 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. Subsequently, the gas ejected by the upper first jet head 425 tilted downward will scrape off the water 426 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening. The hole 235 sprays to the wafer 1 and drives the water 426 on the wafer 1 to be discharged from the through hole 215 to dry the wafer 1.

After that, the first conveying mechanism 51 drives the carrying jig 2 into the water tank 427 of the second cleaning section 422. The carrying jig 2 is completely immersed in the water 428 when moving in the water tank 427. The water 428 can flow into the wafer 1 in the carrier fixture 2 through the through hole 215, the first opening 230, the second opening 235, the side flow channel 24 and the end flow channel 25. In addition, the water 428 sprayed by the lower second water spray head 429 upwards will flow to the wafer 1 through the through hole 215, and the water 428 sprayed by the upper second water spray head 429 downwards will flow through the first opening 230 and the second opening. The holes 235 flow to the wafer 1 so that the water 428 can flow smoothly in the carrier jig 2 to perform a second cleaning on each wafer 1. Then, the gas ejected by the lower second air jet head 430 tilted upward will be ejected to the wafer 1 through the through hole 215 and drive the water 428 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas ejected by the upper second jet head 430 tilted downward will scrape off the water 428 discharged from the first opening 230 and the second opening 235, and at the same time, the gas will also pass through the first opening 230 and the second opening 235 Spray to crystal The wafer 1 drives the water 428 on the wafer 1 to be discharged from the through hole 215 to dry the wafer 1.

Referring to FIGS. 7, 8, 30 and 31, the first conveying mechanism 51 then drives the carrier jig 2 into the third cleaning section 423. The water 434 sprayed upward from the lower spray member 431 of the third cleaning section 423 is sprayed to the wafer 1 through the through hole 215, and the water 434 sprayed downward from the upper spray member 431 is sprayed through the first opening 230 and the second opening. 235 sprayed to wafer 1 to perform the third cleaning of each wafer 1. The three cleaning mechanisms in the fourth cleaning zone 42 can ensure that the fourth chemical solution 415 remaining on each wafer 1 is completely cleaned and removed.

The gas jetted by the third jet head 432 from the lower side adjacent to the spraying member 431 tilts upwards will be jetted to the wafer 1 through the through hole 215 and drive the water 434 on the wafer 1 to be discharged from the first opening 230 and the second opening 235. The gas sprayed by the third spray head 432 above the spraying element 431 inclining downward will scrape off the water 434 discharged from the first opening 230 and the second opening 235. At the same time, the gas will also pass through the first opening 230 and The second opening 235 sprays to the wafer 1 and drives the water 434 on the wafer 1 to be discharged from the through hole 215 to perform the first drying operation on the wafer 1. In the same way, another pair of third air jets 432 far from the spraying member 431 will also perform the second drying operation on the wafer 1 in the aforementioned manner.

Finally, the gas emitted by one of the side jet nozzles 433 along the left jet direction D3 will be jetted to the wafer 1 through the corresponding side flow channel 24, and the gas jetted by the other side jet nozzle 433 along the right jet direction D4 will pass through The corresponding side flow channel 24 is sprayed to the wafer 1 so that the gas can drive the remaining water 434 on the wafer 1 to be discharged from the through hole 215 or the end flow channel 25 to perform the third drying operation on the wafer 1. In this way, it can ensure that each chip 1 The water 434 on it was completely blown away.

Referring to Figures 7 and 32, in the drying step S11, the first conveying mechanism 51 drives the carrier fixture 2 to enter the drying section 441 of the drying zone 44 first, and the first blowing members 443 below are sprayed upward. It will be sprayed to the wafer 1 through the through hole 215, and the gas sprayed downward from each of the first blowing members 443 located above will be sprayed to the wafer 1 through the first opening 230 and the second opening 235. Since the temperature of the compressed air blown by the first blowing member 443 is, for example, 60° C. or less, each wafer 1 can be dried first.

The first conveying mechanism 51 then drives the carrier jig 2 into the drying section 442, and the gas sprayed upward by the second blowing members 444 located below will be sprayed to the wafer 1 through the through holes 215, and the upper portion The gas sprayed downward by the second blowing member 444 will be sprayed to the wafer 1 through the first opening 230 and the second opening 235. Since the temperature of the compressed air blown by the second blowing member 444 is, for example, 85-90° C., each wafer 1 can be dried first.

Referring to FIGS. 37 and 38, in the transfer step S12, the first conveying mechanism 51 drives the carrying jig 2 to discharge through the discharge rear end 512 and enter the first conveying unit 611 of the temporary storage mechanism 61, and then, the first The first conveying wheel 613 of the conveying unit 611 will convey the supporting jig 2 to the second conveying unit 621 of the traverse mechanism 62 along the first conveying direction D1. Next, the second driving assembly 626 drives the second conveying unit 621 through the sliding member 625 (as shown in Fig. 35) to move from the first position shown in Fig. 38 to the second position shown in Fig. 39, so that the second conveying unit 621 is aligned. The second conveying mechanism 52.

Referring to FIGS. 34 and 37, it should be noted that if the traverse mechanism 62 fails to operate, the first conveying wheel 613 of the first conveying unit 611 will not move along the first conveying direction D1 to convey the carrier jig 2 . At this time, the first driving assembly 617 of the lifting unit 612 drives the sliding frame 615 to move up a certain distance in the up and down direction Z, so that the pair of supporting rods 616 can move the supporting fixture 2 on the first conveying wheel 613 upward. Lift and move away from the first conveying wheel 613. Thereby, to allow the next carrying jig 2 discharged from the discharge rear end 512 to be moved to the first conveying unit 611, the other pair of supporting rods 616 can be positioned on the first conveying wheel 613 in the aforementioned manner. The upper supporting jig 2 is lifted upward to move away from the first conveying wheel 613. In this way, the function of temporarily storing the bearing fixture 2 is achieved. After the traverse mechanism 62 is repaired, the first drive assembly 617 of the lifting unit 612 drives the sliding frame 615 to move down a distance in the up and down direction Z, so that the pair of supporting rods 616 can place the supporting fixture 2 back On the first conveying wheel 613. Then, the first conveying wheel 613 can convey the supporting fixture 2 to the second conveying unit 621.

10 and 38, in the reflow step S13, the second conveying wheel 623 of the second conveying unit 621 in the second position moves along the second conveying direction D2 to convey the carrier jig 2 so that the carrier jig 2 passes through The rear end 521 of the material is fed to the second conveying mechanism 52. Subsequently, the second conveying mechanism 52 can move the carrier jig 2 along the second conveying direction D2, so that the carrier jig 2 is discharged through the discharge front end 522. Thereby, at the front end 301 of the machine body 3, the loading and unloading operations of the carrying jig 2 can be processed at the same time, which can save the number of workers and personnel and labor costs.

2 and FIG. 11, in another implementation aspect of this embodiment, if each wafer 1 does not have the metal protective layer 14, the removing step S7 can be omitted in the step of the wet processing method of the wet processing equipment 300 , The third cleaning step S8, the neutralization step S9, and the fourth cleaning step S10, that is, the removal area 39, a third cleaning area 40, a neutralization area 41, and a fourth cleaning area 42 of the wet processing equipment 300 Stop operation. That is, the wet processing equipment 300 can choose to execute or stop the removal step S7 (ie the silver stripping step), the third cleaning step S8, the neutralization step S9, and the fourth cleaning step S10 according to the form of the wafer 1, so that the wet The modular processing device 300 is very flexible in use to meet the needs of users.

Referring to FIGS. 20 and 22, in another implementation aspect of this embodiment, as the characteristics of the second chemical solution 355 used in the deoxidation zone 35 are different, the second cleaning step S6 can be omitted in the foregoing manufacturing process. That is to say, the second cleaning zone 36 does not need to be opened. In this way, the wet processing equipment 300 can flexibly adjust and control whether to open the second cleaning area 36 according to the characteristics of the second chemical liquid 355 used in the deoxidation zone 35. The foregoing operation method will not affect the etching step S3 and the first cleaning step S4, so that the wet processing equipment 300 can still perform the micro-etching operation on the wafer 1 reliably.

Referring to FIG. 7, the wet processing equipment 300 is matched with a dedicated carrier fixture 2 (Boat or Carrier for short) design, so that the chip 1 can selectively carry the first surface 111 downwards for the carrier sheets 223 to carry, or The second surface 112 faces downward for the supporting sheets 223 to carry. In this way, the flexibility in use can be improved to meet the needs of use, and the quality of the processed wafer 1 can be improved.

In summary, the wet processing equipment 300 of the present embodiment can fully and reliably interact with the pins 12 of the chip 1 or the chips 1 produced by sawing by the first chemical solution 325 in the etching zone 32. The metal wire generates a chemical reaction and etches each pin 12 or metal wire, so that the distance between two adjacent pins 12 can be increased to a preset length, or the metal wire is removed to prevent the wafer 1 from being In the subsequent use, due to thermal expansion and contraction, the metal wire contacts another adjacent pin 12 or two adjacent pins 12 contact each other, thereby causing a short circuit, so it can indeed achieve the purpose of the invention. .

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

2: Bearing fixture

300: Wet processing equipment

3: body

301: front end

302: backend

31: Humid zone

32: Etching area

33: The first cleaning area

35: Deoxidation zone

36: Second cleaning area

38: Inspection area

39: Remove area

40: Third cleaning area

41: Zhonghe District

42: The fourth cleaning area

44: Dry zone

45: Recirculation zone

5: Conveying device

51: The first conveying mechanism

511: Feeding front end

512: Discharge back end

52: The second conveying mechanism

521: Feeding back end

522: Discharge front end

6: Transfer device

D1: The first conveying direction

D2: Second conveying direction

X: front and rear direction

Y: left and right direction

Claims (26)

A wet processing equipment is suitable for processing a plurality of wafers carried by a carrier jig. The wet processing equipment includes: a conveying device capable of transporting the carrier jig to move along a first conveying direction; and an etching Zone, with a first chemical solution for immersing the carrier fixture conveyed by the conveying device to etch the pins of each wafer; a first cleaning zone located on the downstream side of the etching zone for cleaning through the The wafers on the carrier jig output from the etching zone; a deoxidation zone is located on the downstream side of the first cleaning zone, and has a deoxidation zone for the carrier jig conveyed by the conveying device to soak in order to immerse each of the wafers The pins generate a second chemical solution for deoxidation reaction; and a second cleaning zone located on the downstream side of the deoxidation zone for cleaning the wafers and the etching zone on the carrier fixture output through the deoxidation zone A first liquid bath for the carrier jig to pass through and accommodating the first liquid medicine is formed, and the etching area includes two first spray heads and two second spray heads located on the downstream side of the first liquid bath. One side nozzle, the two first spray heads are spaced apart along a vertical direction perpendicular to the first conveying direction, and are used to spray the wafers on the carrier jig to remove the first chemical liquid. The side nozzles are spaced apart along a left and right direction perpendicular to the up and down direction, and are used to spray the wafers on the supporting fixture laterally to remove the first liquid medicine. The wet processing equipment according to claim 1, wherein the etching zone further includes a plurality of first chemical liquid spraying heads arranged in the first chemical liquid tank, and the first chemical liquid spraying heads are arranged in the first chemical liquid tank. One part of a chemical liquid spray head sprays the first chemical liquid in the form of a water jet to the wafers upwards, and the other part sprays the first chemical liquid in the form of a water jet to the wafers downwards, the two first side nozzles One of them is to jet the wafers in a left jet direction, and the other of them is to jet the wafers in a right jet direction opposite to the left jet direction. The wet processing equipment according to claim 1, wherein the first cleaning zone includes a first cleaning section and a second cleaning section located on the downstream side of the first cleaning section, and the first cleaning section includes two First water jets spaced apart along a vertical direction perpendicular to the first conveying direction, and two first air jets spaced along the up and down direction and located on the downstream side of the two first water jets, the two first water jets The head is used to spray water in the form of a water jet to the wafers, the first spray head is used to spray the wafers to remove the water, the second cleaning section forms a water tank, and the water tank contains a water tank for cleaning the wafers. The water of the wafer, the second cleaning section includes two second water jets spaced apart along the up and down direction, and two second air jets spaced along the up and down direction and located on the downstream side of the two second water jets, The two second water jets are used for spraying the water in the form of water jets on the wafers, and the two second air jets are used for jetting the wafers to remove the water. The wet processing equipment according to claim 3, wherein the first cleaning zone further includes a third cleaning section located on the downstream side of the second cleaning section, and the third cleaning section includes a plurality of pairs along the first conveying direction. First spraying elements arranged at intervals, and two third spray heads spaced apart along the up and down direction and located on the downstream side of the first spraying elements, the two first spraying elements of each pair are opposite to each other along the up and down direction The interval is used to spray the water on the wafers, the two The third jet head is used to jet the wafers to remove the water. The wet processing equipment according to claim 4, wherein the first cleaning zone includes a fourth cleaning section located on the downstream side of the third cleaning section, and the fourth cleaning section includes a plurality of pairs of phases along the first conveying direction. The second spraying elements arranged at intervals, two fourth air jets spaced along the vertical direction and located on the downstream side of the second spraying elements, and two side air jets located on the downstream side of the second spraying elements, each A pair of two second spraying members are spaced apart along the up and down direction for spraying the water on the wafers, the two fourth air jets are used for jetting the wafers to remove the water, and the two side air nozzles A left-right direction perpendicular to the up-down direction is spaced apart for removing the water by air jetting the wafers on the carrier jig conveyed by the first conveying mechanism. One of the air jet nozzles on both sides is The wafers are jetted in a left jet direction, and the other is jetted toward the wafers in a right jet direction opposite to the left jet direction. The wet processing equipment according to claim 1, wherein the deoxidation zone forms a second chemical liquid tank for passing the supporting jig and accommodating the second chemical liquid, and the deoxidation zone includes Two second spray heads and two second side nozzles located on the downstream side of the second chemical liquid tank, the two second spray heads are spaced apart in the up and down direction for jetting the wafers to remove the second chemical liquid, The two second-side nozzles are spaced apart along the left and right direction to spray the wafers laterally to remove the second chemical liquid. The wet processing equipment according to claim 6, wherein the deoxidation zone further comprises a plurality of second liquid chemical spray heads arranged in the second liquid chemical tank, and a part of the second chemical liquid spray heads faces upward Spray water jet shape on these wafers The second chemical liquid of the formula, and the other part sprays the second chemical liquid in the form of a water jet to the wafers downwards, one of the two second side nozzles sprays the wafers along a left air jet direction, and The other is to jet the wafers in a right jet direction opposite to the left jet direction. The wet processing equipment according to claim 1, wherein the second cleaning zone includes a first cleaning section and a second cleaning section located on the downstream side of the first cleaning section, and the first cleaning section includes two First water jets spaced along a vertical direction perpendicular to the first conveying direction, and two first air jets spaced along the up-down direction and located on the downstream side of the two first water jets, the two first water jets The water spray head is used to spray water in the form of a water jet to the wafers, the first spray head is used to spray the wafers to remove the water, the second cleaning section forms a water tank, and the water tank contains a water tank for cleaning the wafers. Waiting for the water of the wafer, the second cleaning section includes two second water jets spaced along the up and down direction, and two second air jets spaced along the up and down direction and located on the downstream side of the two second water jets The two second water spray heads are used to spray the water in the form of water jets to the wafers, and the two second spray heads are used to spray water to the wafers to remove the water. The wet processing equipment according to claim 8, wherein the second cleaning zone further includes a third cleaning section located on the downstream side of the second cleaning section, and the third cleaning section includes a plurality of pairs along the first conveying direction. Spraying elements arranged at intervals, two third air jets spaced along the vertical direction and located on the downstream side of the spraying elements, and two side air jets spaced apart along the vertical direction and located on the downstream side of the spraying elements , The two spraying members of each pair are spaced along the up and down direction for spraying the water on the wafers, the two third The air jet head is used to air jet the wafers to remove the water, and the air jet nozzles on both sides are spaced apart in a left and right direction perpendicular to the up and down direction for the first transport mechanism to transport the carrier fixture on the The wafers are jetted laterally to remove the water, one of the two side jet nozzles jets the wafers in a left jet direction, and the other of them jets in a right jet direction opposite to the left jet direction. These chips are jetted. The wet processing equipment according to claim 6, wherein each of the wafers has a metal thermally conductive layer and a metal protective layer formed on the metal thermally conductive layer, and the wet processing equipment further includes a second cleaning zone A removal zone on the downstream side, and a third cleaning zone located on the downstream side of the removal zone. The removal zone forms a third liquid tank for the carrying jig to pass through, the third liquid tank A third chemical solution used for immersing the wafers to remove the metal protective layer of each of the wafers is contained, and the removal area includes two third spray heads and two third spray heads located on the downstream side of the third chemical solution tank. Side nozzles, the two third spray heads are spaced in the up and down direction for jetting the wafers to remove the third chemical solution, and the two third side nozzles are spaced in the left and right direction for laterally facing the wafers Air jets to remove the third chemical solution, and the third cleaning area is used to clean the wafers on the carrier fixture output through the removal area. The wet processing equipment according to claim 10, wherein the removal area further includes a plurality of third liquid medicine spray heads arranged in the third liquid medicine tank, and a part of the third liquid medicine spray heads faces upward The third chemical liquid in the form of a water jet is sprayed on the wafers, and the third chemical liquid in the form of a water jet is sprayed on the wafers with the other part downwards. One of the two third side nozzles is sprayed along a left side. The direction of gas jets the wafers, and the other is jets of the wafers in a right jet direction opposite to the left jet direction. The wet processing equipment according to claim 10, wherein the third cleaning zone includes a first cleaning section and a second cleaning section located on the downstream side of the first cleaning section, and the first cleaning section includes two The first water jets spaced apart along the up and down direction, and two first jet heads spaced along the up and down direction and located on the downstream side of the two first water jets, the two first water jets are used to spray the wafers Water jet in the form of water, the first jet head is used to jet the wafers to remove the water, the second cleaning section includes a plurality of pairs of spraying elements arranged at intervals along the first conveying direction, two along the top and bottom The second air nozzles spaced apart in the direction and located on the downstream side of the spraying elements, and two side air nozzles spaced along the up-and-down direction and located on the downstream side of the spraying elements, the two spraying elements of each pair are along the The upper and lower directions are spaced apart to spray the water on the wafers, the two second air jets are used to jet the wafers to remove the water, and the two air jet nozzles are spaced apart along the left and right directions to spray the water on the wafers. The wafers on the carrier jig conveyed by a conveying mechanism are jetted laterally to remove the water. One of the two air jet nozzles jets the wafers along a left jet direction, and the other jets air jets along a left jet direction. A right jet direction opposite to the left jet direction jets the wafers. The wet processing equipment according to claim 10, further comprising a neutralization zone located on the downstream side of the third cleaning zone, and a fourth cleaning zone located on the downstream side of the neutralization zone, the neutralization zone forming a The fourth chemical liquid tank for the carrier jig to pass through, and the fourth chemical liquid tank is used for immersing the wafers to neutralize and remove the oxide formed on the metal thermally conductive layer of each of the wafers The neutralization zone includes two fourth spray heads and two fourth side nozzles located on the downstream side of the fourth liquid tank, and the two fourth spray heads are spaced apart along the up and down direction for matching the The wafer jets are used to remove the fourth chemical solution, the two fourth side nozzles are spaced apart in the left and right direction for laterally jetting the wafers to remove the fourth chemical solution, and the fourth cleaning area is used to clean through The chips on the carrier fixture output from the neutralization zone. The wet processing equipment according to claim 13, wherein the neutralization zone further includes a plurality of fourth chemical liquid spray heads arranged in the fourth chemical liquid tank, and a part of the fourth chemical liquid spray heads faces upward The fourth chemical liquid in the form of a water jet is sprayed on the wafers, and the fourth chemical liquid in the form of a water jet is sprayed on the wafers with the other part downward, one of the two fourth side nozzles is along a left jet direction The wafers are air-jetted, and the other is air-jetting the wafers in a right air-jet direction opposite to the left air-jet direction. The wet processing equipment according to claim 13, wherein the fourth cleaning zone includes a first cleaning section and a second cleaning section located on the downstream side of the first cleaning section, and the first cleaning section includes two The first water jets spaced apart along the up and down direction, and two first jet heads spaced along the up and down direction and located on the downstream side of the two first water jets, the two first water jets are used to spray the wafers Water jet in the form of water, the first jet head is used to jet the wafers to remove the water, the second cleaning section forms a water tank containing the water for cleaning the wafers, the second The cleaning section includes two second water jets spaced along the up and down direction, and two second air jets spaced along the up and down direction and located on the downstream side of the two second water jets. The two second water jets are used for Spray water jet shape on these wafers The two second air jets are used for jetting the wafers to remove the water. The wet processing equipment according to claim 15, wherein the fourth cleaning zone further includes a third cleaning section located on the downstream side of the second cleaning section, and the third cleaning section includes a plurality of pairs along the first conveying direction. Spraying elements arranged at intervals, two third air jets spaced along the vertical direction and located on the downstream side of the spraying elements, and two side air jets spaced apart along the vertical direction and located on the downstream side of the spraying elements , The two spraying members of each pair are spaced along the up and down direction for spraying the water on the wafers, the two third air jets are used for air jets on the wafers to remove the water, and the two air jets Spaced along the left and right directions for the wafers on the carrier fixture conveyed by the first conveying mechanism to be sprayed laterally to remove the water, and one of the air nozzles on both sides is along a left spraying direction The wafers are air-jetted, and the other is air-jetting the wafers in a right air-jet direction opposite to the left air-jet direction. The wet processing equipment according to claim 13, further comprising a wetting zone located on the upstream side of the etching zone, and a drying zone located on the downstream side of the fourth cleaning zone, the wet zone being used for wetting the conveyed by the conveying device For the wafers on the carrier fixture, the drying zone is used to dry the wafers by blowing hot air. The wet processing equipment according to claim 1, further comprising a wetting zone located on the upstream side of the etching zone, and a drying zone located on the downstream side of the second cleaning zone, the wet zone being used for wetting the conveyed by the conveying device For the wafers on the carrier fixture, the drying zone is used to dry the wafers by blowing hot air. The wet processing equipment according to claim 17 or 18, wherein the conveying device The device includes a first conveying mechanism, and a second conveying mechanism spaced apart from the first conveying mechanism along the left and right direction. The first conveying mechanism can convey the carrier jig to move along the first conveying direction, and has a Located at the front end of the feed in the wetting zone and at the rear end of the discharge in the drying zone, the second conveying mechanism can convey the carrier jig to move in a second conveying direction opposite to the first conveying direction, and has A feed back end adjacent to the discharge back end, and a discharge front end adjacent to the feed front end. The wet processing equipment also includes a transfer device, the transfer device including a downstream side of the drying zone Temporary storage mechanism, and a traverse mechanism located on the downstream side of the temporary storage mechanism. The temporary storage mechanism includes a first conveying unit and an elevating unit. The first conveying unit corresponds to the discharge rear end for receiving For the bearing jig output from the discharge rear end, the lifting unit includes a plurality of pairs of supporting rods arranged at intervals along the up and down direction, and each pair of supporting rods can be raised and lowered in the up and down direction and used to support the second The bearing fixture on a conveying unit, the traversing mechanism includes a second conveying unit, and a traversing unit for driving the second conveying unit to be aligned with the first along the left and right direction Move between the first position of the conveying unit and a second position aligned with the rear end of the feeding. When the second conveying unit is in the first position, the second conveying unit can be supported by the first conveying unit. When the second conveying unit is in the second position of the output bearing jig, the second conveying unit can convey the bearing jig to the second conveying mechanism. The wet processing equipment according to claim 1, further comprising a wetting zone located on the upstream side of the etching zone, the wetting zone comprising a plurality of pairs along the first conveyor Spraying elements arranged at intervals, two air nozzles spaced in the vertical direction and located on the downstream side of the spraying elements, and two side air nozzles spaced apart in the left-right direction and located on the downstream side of the spraying elements, The two spraying members of each pair are spaced along the up and down direction to spray the water on the wafers, the two air jet heads are used to air the wafers to remove the water, and the two air jet nozzles are used to The wafers on the carrier jig conveyed by the first conveying mechanism are jetted laterally to remove the water, one of the two side jet nozzles jets the wafers along a left jet direction, and the other The wafers are jetted in a right jet direction opposite to the left jet direction. A wet processing method of wet processing equipment is suitable for processing a plurality of wafers carried by a carrier jig. The wet processing method of the wet processing equipment includes the following steps: The carrier jig is moved in a conveying direction; the pins of each wafer moving along the first conveying direction are etched with the first chemical solution through an etching zone; and the leads of each wafer moving along the first conveying direction are etched through a first cleaning zone. The wafers output from the etching zone in the first conveying direction are cleaned; through a deoxidation zone, a second chemical solution is used to generate a deoxidation reaction on the leads of the wafers moving along the first conveying direction; and The wafers output from the deoxidation zone along the first conveying direction are cleaned through a second cleaning zone. The wet processing method of the wet processing equipment as described in claim 21, which also includes It includes a drying step after cleaning the wafers in the second cleaning zone, and drying the wafers by blowing hot air through a drying zone. The wet processing method of the wet processing equipment according to claim 22, further comprising a removing step after cleaning the wafers in the second cleaning area and before the drying step, and performing a third step through a removing area. The chemical solution generates a chemical reaction on a metal protection layer of each wafer output from the second cleaning zone along the first conveying direction to remove the metal protection layer. The processing method further includes a step after the removal step and The cleaning step before the drying step cleans the wafers output from the removal area along the first conveying direction through a third cleaning area. The wet treatment method of the wet treatment equipment according to claim 23, further comprising a neutralization step after the cleaning step and before the drying step, passing through a neutralization zone with the fourth chemical liquid pair along the A thermally conductive metal layer of each wafer output from the third cleaning zone in the first conveying direction generates a chemical reaction to neutralize and remove the oxide formed on the metal protective layer. The processing method further includes a step after the neutralization step In the cleaning step before the drying step, the wafers output from the neutralization zone along the first conveying direction are cleaned through a fourth cleaning zone. The wet processing method of the wet processing equipment according to claim 22, wherein the conveying device conveys the carrier jig in the first conveying direction through a first conveying mechanism, and further comprises a step after the drying step A transfer step, and a reflow step after the transfer step. In the transfer step, the carrier jig is transferred to a second conveying mechanism of the conveying device through a transfer device, and in the reflow step , Through the second loss The conveying mechanism conveys the carrier jig to move in a second conveying direction opposite to the first conveying direction. The wet processing method of the wet processing equipment according to claim 21, further comprising a wetting step in the etching area before the pins are etched, and the wafers are wetted through a wet area.

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