TWI731067B - 聚醯亞胺樹脂及聚醯亞胺樹脂組成物 - Google Patents
聚醯亞胺樹脂及聚醯亞胺樹脂組成物 Download PDFInfo
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- TWI731067B TWI731067B TW106113683A TW106113683A TWI731067B TW I731067 B TWI731067 B TW I731067B TW 106113683 A TW106113683 A TW 106113683A TW 106113683 A TW106113683 A TW 106113683A TW I731067 B TWI731067 B TW I731067B
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- structural unit
- polyimide resin
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- compound represented
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 80
- 239000009719 polyimide resin Substances 0.000 title claims abstract description 48
- 239000000203 mixture Substances 0.000 title claims description 21
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 23
- 150000001875 compounds Chemical class 0.000 claims abstract description 22
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims abstract description 22
- -1 diamine compound Chemical class 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims description 19
- 239000010954 inorganic particle Substances 0.000 claims description 12
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 description 25
- 239000002904 solvent Substances 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000010408 film Substances 0.000 description 16
- 239000003054 catalyst Substances 0.000 description 13
- 150000004985 diamines Chemical class 0.000 description 13
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 12
- 239000000470 constituent Substances 0.000 description 11
- 239000003960 organic solvent Substances 0.000 description 11
- 239000007787 solid Substances 0.000 description 11
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 150000002466 imines Chemical class 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 description 6
- 239000007810 chemical reaction solvent Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
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- 238000010438 heat treatment Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
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- 239000000126 substance Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
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- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 4
- 239000002981 blocking agent Substances 0.000 description 4
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 3
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
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- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- JJYPMNFTHPTTDI-UHFFFAOYSA-N 3-methylaniline Chemical compound CC1=CC=CC(N)=C1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 2
- LJMPOXUWPWEILS-UHFFFAOYSA-N 3a,4,4a,7a,8,8a-hexahydrofuro[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1C2C(=O)OC(=O)C2CC2C(=O)OC(=O)C21 LJMPOXUWPWEILS-UHFFFAOYSA-N 0.000 description 2
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000000010 aprotic solvent Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 2
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
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- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
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- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
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- RCNBXBQGBCGTPB-UHFFFAOYSA-N (4-dodecylphenyl)methanamine Chemical compound CCCCCCCCCCCCC1=CC=C(CN)C=C1 RCNBXBQGBCGTPB-UHFFFAOYSA-N 0.000 description 1
- DGAGEFUEKIORSQ-UHFFFAOYSA-N (4-ethylphenyl)methanamine Chemical compound CCC1=CC=C(CN)C=C1 DGAGEFUEKIORSQ-UHFFFAOYSA-N 0.000 description 1
- HMTSWYPNXFHGEP-UHFFFAOYSA-N (4-methylphenyl)methanamine Chemical compound CC1=CC=C(CN)C=C1 HMTSWYPNXFHGEP-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
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- YJLVXRPNNDKMMO-UHFFFAOYSA-N 3,4,5,6-tetrafluorophthalic acid Chemical compound OC(=O)C1=C(F)C(F)=C(F)C(F)=C1C(O)=O YJLVXRPNNDKMMO-UHFFFAOYSA-N 0.000 description 1
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- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 1
- OSFGNTLIOUHOKN-UHFFFAOYSA-N 4-[benzyl(methyl)sulfamoyl]benzoic acid Chemical compound C=1C=C(C(O)=O)C=CC=1S(=O)(=O)N(C)CC1=CC=CC=C1 OSFGNTLIOUHOKN-UHFFFAOYSA-N 0.000 description 1
- DVIPPHSQIBKWSA-UHFFFAOYSA-N 4-chlorophthalic acid Chemical compound OC(=O)C1=CC=C(Cl)C=C1C(O)=O DVIPPHSQIBKWSA-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
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- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
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- 238000005576 amination reaction Methods 0.000 description 1
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- 238000003491 array Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
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- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003660 carbonate based solvent Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
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- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
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- BNZSBPKOMCJCNW-UHFFFAOYSA-N cyclobutylsulfanylcyclobutane Chemical compound C1CCC1SC1CCC1 BNZSBPKOMCJCNW-UHFFFAOYSA-N 0.000 description 1
- ILUAAIDVFMVTAU-UHFFFAOYSA-N cyclohex-4-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CC=CCC1C(O)=O ILUAAIDVFMVTAU-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- ASJCSAKCMTWGAH-UHFFFAOYSA-N cyclopentane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCC1C(O)=O ASJCSAKCMTWGAH-UHFFFAOYSA-N 0.000 description 1
- 125000001142 dicarboxylic acid group Chemical group 0.000 description 1
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- 238000006358 imidation reaction Methods 0.000 description 1
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- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
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- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
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- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 description 1
- 235000015497 potassium bicarbonate Nutrition 0.000 description 1
- 239000011736 potassium bicarbonate Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 229940093956 potassium carbonate Drugs 0.000 description 1
- 235000011181 potassium carbonates Nutrition 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
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Abstract
一種聚醯亞胺樹脂，含有來自四羧酸二酐之構成單元A、與來自二胺化合物之構成單元B； 構成單元A含有來自下式(a-1)表示之化合物之構成單元(A-1)； 構成單元B含有來自下式(b-1)表示之化合物之構成單元(B-1)；
Description
本發明係關於聚醯亞胺樹脂及聚醯亞胺樹脂組成物。
聚醯亞胺樹脂具有優良之機械特性、耐熱性、耐藥品性，在電氣電子領域等，尤其廣泛利用作為光學構件用之材料。就光學構件中使用之材料而言，需要優良之耐熱性、機械特性，且需要優良之光學特性(高折射率等)及透明性。
例如，在專利文獻1中，有人提出含有具特定結構之聚醯亞胺樹脂及無機微粒的高折射率材料組成物。根據專利文獻1，可提供具有1.70以上之高折射率且耐熱性優良，玻璃轉化溫度為200℃以上之高折射率材料組成物。 [先前技術文獻] [專利文獻]
[專利文獻1]日本特開2001-348477號公報
[發明所欲解決之課題] 然而，專利文獻1所記載之高折射率材料組成物，就使用於光學構件之材料而言為必要之透明性低。
考慮以上情事，本發明之課題為提供可製作折射率高、透明性良好之聚醯亞胺薄膜的聚醯亞胺樹脂。 [解決課題之手段]
本案發明者們發現含有特定之構成單元的聚醯亞胺樹脂可解決上述課題，而完成了本發明。
也就是說，本發明係一種聚醯亞胺樹脂，含有來自四羧酸二酐之構成單元A、 與來自二胺化合物之構成單元B； 構成單元A含有來自下式(a-1)表示之化合物之構成單元(A-1)； 構成單元B含有來自下式(b-1)表示之化合物之構成單元(B-1)。 【化1】
(式(b-1)中之m及n各自獨立地為0或1之整數。) [發明之效果]
根據本發明，能提供可製作折射率高、透明性良好之聚醯亞胺薄膜的聚醯亞胺樹脂。
本發明之聚醯亞胺樹脂含有來自四羧酸二酐的構成單元A、及來自二胺化合物之構成單元B。 構成單元A含有來自下式(a-1)表示之化合物(聯苯四羧酸二酐(BPDA))之構成單元(A-1)。來自四羧酸二酐之構成單元A中，構成單元(A-1)宜為40莫耳%以上，更宜為50莫耳%以上，進一步宜為60莫耳%以上。
【化2】
就式(a-1)表示之化合物而言，可列舉下式(a-1-1)表示之3,3’,4,4’-BPDA(s-BP DA)、下式(a-1-2)表示之2,3,3’,4’-BPDA(a-BPDA)、下式(a-1-3)表示之2,2’,3,3’-BP DA(i-BPDA)。 s-BPDA就折射率、耐有機溶劑性之觀點較為理想，a-BPDA就耐熱性、溶液加工性之觀點較為理想，i-BPDA就耐熱性、溶液加工性之觀點較為理想。
【化3】
構成單元A宜更含有來自下式(a-2)表示之化合物的構成單元(A-2)。藉由含有構成單元(A-2)，可提高透明性、溶液加工性、耐熱性。 在來自四羧酸二酐之構成單元A中，構成單元(A-2)宜為60莫耳%以下，更宜為50莫耳%以下，進一步宜為40莫耳%以下。
相對於構成單元A，構成單元(A-1)及(A-2)合計的含量宜為40莫耳%以上，更宜為70莫耳%以上，進一步宜為85莫耳%以上，尤其宜為99莫耳%以上，最好宜為100莫耳%。
【化4】
來自二胺化合物之構成單元B含有來自下式(b-1)表示之化合物之構成單元(B-1)。藉由含有構成單元(B-1)可在維持透明性之狀態下，提高折射率、溶液加工性。 此外，構成單元B中之構成單元(B-1)的比率宜為50莫耳%以上，更宜為70莫耳%以上，進一步宜為85莫耳%以上，尤其宜為99莫耳%以上，最好宜為100莫耳%。
【化5】
(式(b-1)中之m及n各自獨立地為0或1之整數。)
構成單元B就構成單元(B-1)而言，宜含有來自下式(b-1-1)表示之化合物的構成單元(B-1-1)及/或來自下式(b-1-2)表示之化合物的構成單元(B-1-2)。
【化6】
構成單元B就構成單元(B-1)而言，考慮低著色性之觀點，也就是考慮獲得黃色指數(YI)小之聚醯亞胺薄膜之觀點，宜含有構成單元(B-1-1)。此時，構成單元(B-1)中之構成單元(B-1-1)的比率宜為50莫耳%以上，更宜為75莫耳%以上，進一步宜為100莫耳%。 此外，構成單元B就構成單元(B-1)而言，也宜含有構成單元(B-1-1)及構成單元(B-1-2)兩者。此時，構成單元(B-1)中之構成單元(B-1-1)及構成單元(B-1-2)合計之比率宜為50莫耳%以上，更宜為75莫耳%以上，進一步宜為100莫耳%。此外，構成單元(B-1-1)/構成單元(B-1-2)之莫耳比宜為50/50~90/10，更宜為70/30~ 90/10，進一步宜為75/25~85/15。
構成單元B可更含有來自下式(b-2)表示之化合物的構成單元(B-2)。
【化7】
構成單元B中之構成單元(B-2)的比率宜為50莫耳%以下，更宜為40莫耳%以下。藉由含有構成單元(B-2)，可在維持透明性之狀態下，提高溶液加工性。
相對於構成單元B，構成單元(B-1)及(B-2)之合計的含量宜為50莫耳%以上，更宜為70莫耳%以上，進一步宜為85莫耳%以上，尤其宜為99莫耳%以上，最好宜為100莫耳%。
本發明相關之聚醯亞胺樹脂的數目平均分子量考慮獲得之聚醯亞胺薄膜之機械強度的觀點，宜為5,000~100,000。其中，聚醯亞胺樹脂之數目平均分子量可藉由凝膠過濾層析等來進行測定。
本發明之聚醯亞胺樹脂製成厚度40μm之聚醯亞胺薄膜時的全光線透射率宜為85%以上，更宜為87%以上。 此外，製成厚度40μm之聚醯亞胺薄膜時，黃色指數(YI)宜為10.0以下，更宜為7.0以下，進一步宜為5.0以下。藉由在上述全光線透射率之範圍，且YI為上述範圍，在製成聚醯亞胺薄膜時可展現高無色透明性。 進一步地，製成聚醯亞胺薄膜時，折射率宜為1.65以上，更宜為1.70以上。
可藉由使上述之特定的四羧酸二酐成分與特定之二胺成分反應來製造本發明相關之聚醯亞胺樹脂。
四羧酸二酐成分必須含有上述之式(a-1)表示的化合物，因應需求含有式(a-2)表示之化合物。此外，二胺成分必須含有式(b-1)表示之化合物，因應需求含有式(b-2)表示之化合物。 其中，此等之化合物在可形成各別對應之構成單元的範圍內，可為它們的衍生物。
製造本發明相關之聚醯亞胺樹脂時，四羧酸二酐成分與二胺成分進料量的比，係相對於四羧酸二酐成分1莫耳，二胺成分為0.9~1.1莫耳較為理想。
此外，在製造本發明相關之聚醯亞胺樹脂時，除了使用四羧酸二酐成分、二胺成分以外，還可使用封端劑。就封端劑而言宜為單胺類或二羧酸類。就導入之封端劑的進料量而言，相對於四羧酸二酐成分1莫耳，宜為0.0001~0.1莫耳，尤其宜為0.001~0.06莫耳。就單胺類封端劑而言，建議為例如甲胺、乙胺、丙胺、丁胺、苄胺、4-甲基苄胺、4-乙基苄胺、4-十二烷基苄胺、3-甲基苄胺、3-乙基苄胺、苯胺、3-甲基苯胺、4-甲基苯胺等。此等中，可適宜使用苄胺、苯胺。就二羧酸類封端劑而言，宜為二羧酸類，可為部分閉環。建議為例如鄰苯二甲酸、鄰苯二甲酸酐、4-氯鄰苯二甲酸、四氟鄰苯二甲酸、2,3-二苯基酮二羧酸、3,4-二苯基酮二羧酸、環己烷-1,2-二羧酸、環戊烷-1,2-二羧酸、4-環己烯-1,2-二羧酸等。此等之中，可適宜使用鄰苯二甲酸、鄰苯二甲酸酐。
使上述之四羧酸二酐成分與二胺成分反應之方法沒有特別之限制，可使用公知方法。 就具體之反應方法而言，可列舉(1)於反應器中進料四羧酸二酐成分、二胺成分及反應溶劑，在室溫~80℃攪拌0.5~30小時，之後升溫進行醯亞胺化反應之方法、(2)於反應器中進料二胺成分及反應溶劑並使其溶解後，進料四羧酸二酐成分，因應需求在室溫~80℃攪拌0.5~30小時，之後升溫進行醯亞胺化反應之方法、(3)於反應器中進料四羧酸二酐成分、二胺成分及反應溶劑，立刻升溫進行醯亞胺化反應之方法等。
於聚醯亞胺樹脂之製造中使用之反應溶劑只要是不妨害醯亞胺化反應，可溶解生成之聚醯亞胺樹脂者即可。可舉例如非質子性溶劑、苯酚系溶劑、醚系溶劑、碳酸酯系溶劑等。
就非質子性溶劑之具體例而言，可列舉N,N-二甲基異丁基醯胺(DMIB)、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、N-甲基己內醯胺、1,3-二甲基咪唑啶酮、四甲基尿素等之醯胺系溶劑；γ-丁內酯、γ-戊內酯等之內酯系溶劑；六甲基磷醯胺、六甲基膦三醯胺等之含磷系醯胺系溶劑；二甲基碸、二甲基亞碸、環丁碸(sulfolane)等之含硫系溶劑；丙酮、環己烷、甲基環己烷等之酮系溶劑；甲吡啶、吡啶等之胺系溶劑、乙酸(2-甲氧基-1-甲基乙基)酯等之酯系溶劑等。
就苯酚系溶劑之具體例而言，可列舉苯酚、鄰甲酚、間甲酚、對甲酚、2,3-二甲苯酚、2,4-二甲苯酚、2,5-二甲苯酚、2,6-二甲苯酚、3,4-二甲苯酚、3,5-二甲苯酚等。 就醚系溶劑之具體例而言，可列舉1,2-二甲氧基乙烷、雙(2-甲氧基乙基)醚、1,2-雙(2-甲氧基乙氧基)乙烷、雙[2-(2-甲氧基乙氧基)乙基]醚、四氫呋喃、1,4-二
烷(1,4-dioxane)等。 此外，就碳酸酯系溶劑之具體的例子而言，可列舉碳酸二乙酯、碳酸甲基乙酯、碳酸伸乙酯、碳酸伸丙酯等。 上述反應溶劑中，宜為醯胺系溶劑或內酯系溶劑。此外，上述反應溶劑可單獨使用或可混合2種以上使用。
醯亞胺反應使用迪安-斯塔克裝置(Dean-Stark apparatus)等，邊將製造時生成之水除去邊進行反應較為理想。藉由進行如此之操作，可提高聚合度及醯亞胺化率。
在上述醯亞胺反應中，可使用公知之醯亞胺化觸媒。就醯亞胺化觸媒而言，可列舉鹼觸媒或酸觸媒。 就鹼觸媒而言，可列舉吡啶、喹啉、異喹啉、α-甲吡啶、β-甲吡啶、2,4-二甲吡啶、2,6-二甲吡啶、三甲胺、三乙胺、三丙胺、三丁胺、咪唑、N,N-二甲基苯胺、N,N-二乙基苯胺等之有機鹼觸媒；氫氧化鉀、氫氧化鈉、碳酸鉀、碳酸鈉、碳酸氫鉀、碳酸氫鈉等之無機鹼觸媒。 此外，就酸觸媒而言，可列舉巴豆酸、丙烯酸、反式-3-己烯酸、肉桂酸、苯甲酸、甲基苯甲酸、氧基苯甲酸、對苯二甲酸、苯磺酸、對甲苯磺酸、萘磺酸等。上述醯亞胺化觸媒可單獨使用或組合2種以上使用。 上述中考慮操作性之觀點，宜使用鹼觸媒，更宜使用有機鹼觸媒，進一步宜使用三乙胺。
使用上述觸媒時，考慮反應率及抑制凝膠化等之觀點，醯亞胺化反應之溫度宜為120~250℃，更宜為160~200℃。此外，反應時間在開始餾出生成水後，宜為0.5~10小時。 其中，未使用觸媒時之醯亞胺化反應的溫度宜為200~350℃。
本發明之聚醯亞胺樹脂組成物含有上述之本發明的聚醯亞胺樹脂，及折射率2.0以上且平均粒徑D50為20nm以下之無機粒子。 無機粒子之折射率，例如可藉由如下述方式進行測定來求得。亦即，將摻合至丙烯酸樹脂而得之含無機粒子塗布液塗布於PET薄膜，測定形成而得之塗布膜的折射率。此時，測定摻合有多種摻合份數之無機粒子而得之塗布膜，將測定點進行外插來算出無機粒子之折射率。就測定裝置而言例如可使用大塚電子(股)公司製之反射光譜膜厚計「FE-3000」。 此外，無機粒子之平均粒徑D50係例如使無機粒子分散至分散介質中來進行測定並算出。就測定裝置而言，例如可使用MicrotracBEL Corp.製之DLS粒度分布計「Nanotrac UPA-UT151」。 其中，無機粒子之折射率及平均粒徑D50也可採用型錄值。
就上述無機粒子而言，為氧化鋯粒子、氧化鈦粒子、氧化鋅粒子、硫化鋅粒子、氧化鉻粒子、鈦酸鋇粒子、矽粒子之至少任一者較為理想，宜為氧化鋯粒子及/或氧化鈦粒子。
上述無機粒子在聚醯亞胺樹脂組成物之固體成分中宜含有10~60質量%，更宜含有20~50質量%。
本發明相關之聚醯亞胺樹脂組成物在不損害本發明之效果的範圍，可混合各種添加劑製成聚醯亞胺樹脂組成物。就添加劑而言可舉例如抗氧化劑、光安定劑、界面活性劑、阻燃劑、塑化劑、上述聚醯亞胺樹脂以外之高分子化合物等。
該樹脂組成物之固體成分濃度可因應形成聚醯亞胺薄膜時的作業性等適當地選擇，可藉由添加有機溶劑來調整該組成物之固體成分濃度或黏度。該有機溶劑只要是可使聚醯亞胺樹脂溶解者便沒有特別之限定。
本發明之聚醯亞胺薄膜，係由上述之聚醯亞胺樹脂或上述之聚醯亞胺樹脂組成物之硬化物構成。也就是說，上述之聚醯亞胺樹脂或聚醯亞胺樹脂組成物進行醯亞胺化(硬化)而成之聚醯亞胺薄膜具有高折射率，根據構成單元於無色透明性也優良。 如此之聚醯亞胺薄膜的製作方法沒有特別之限制，可使用公知方法。可舉例如將含有有機溶劑之本發明相關的聚醯亞胺樹脂溶液、或含有聚醯亞胺樹脂與上述之各種添加劑的聚醯亞胺樹脂組成物塗布或成形為薄膜狀後，將該有機溶劑除去之方法等。
如以上方式獲得之聚醯亞胺薄膜的厚度宜為1~250μm，可因應用途等適當地設定。藉由使厚度為1~250μm，可在實用上使用作為自支撐膜。厚度更宜為1~50 μm。
本發明之聚醯亞胺樹脂(組成物)適合用於CCD或CMOS感測器等光學透鏡、 LED或有機EL等密封材料或光提取層、抗反射膜、多層光學膜、微透鏡陣列、彩色濾光片、柔性顯示器等。 [實施例]
以下藉由實施例來具體地說明本發明。但本發明並不因為此等之實施例而有任何之限制。
[實施例1] 於300mL之玻璃製5口圓底燒瓶加入作為二胺成分之雙(4-胺基苯基)碸(和歌山精化工業(股)公司製)22.017g(0.089莫耳)、作為有機溶劑之γ-丁內酯(三菱化學(股)公司製)54.90g、作為醯亞胺觸媒之三乙胺(關東化學(股)公司製)0.449g，在系統內溫度70℃，氮氣環境下，以旋轉數200rpm進行攪拌來獲得溶液。於其中一次性地添加作為脂環式四羧酸二酐成分之1,2,4,5-環己烷四羧酸二酐(三菱瓦斯化學(股)公司製)7.951g(0.035莫耳)、作為芳香族四羧酸二酐成分之3,3’,4,4’-聯苯四羧酸二酐(三菱化學(股)公司製)15.652g(0.053莫耳)及為有機溶劑之γ-丁內酯(三菱化學(股)公司製)13.73g後，以加熱套進行加熱，花費約20分鐘將反應系統內溫度提升至190℃。藉由在收集餾去之成分，且配合黏度上昇來調整旋轉數的狀態下，將反應系統內溫度保持在190℃進行回流5小時來獲得聚醯亞胺溶液。之後，在將反應系統內溫度冷卻至120℃後添加N,N-二甲基乙醯胺(三菱瓦斯化學(股)公司製)101.59g，進一步攪拌約3小時使其變得均勻，獲得固體成分濃度20質量%之聚醯亞胺樹脂溶液(A)。
然後，藉由於玻璃基板上塗布聚醯亞胺樹脂溶液(A)，保持於60℃30分鐘、100℃1小時使溶劑揮發來獲得具有自支撐性之無色透明的一次乾燥薄膜，進一步藉由將該薄膜固定於不鏽鋼架，於280℃氮氣環境下乾燥2小時來除去溶劑，獲得厚度40μm之聚醯亞胺薄膜。由獲得之聚醯亞胺薄膜的FT-IR分析確認原料的峰消失且出現來自醯亞胺骨架的峰。 該聚醯亞胺薄膜之全光線透射率為86.3%，在波長400nm之透射率為37.9%， 在波長420nm之透射率為76.8%，在波長450nm之透射率為84.0%，YI値為4.9，Tg為379℃，折射率nD為1.67。
[實施例2] 在與實施例1所使用之同樣的300mL玻璃製5口圓底燒瓶中，加入作為二胺成分之雙[4-(4-胺基苯氧基)苯基]碸(和歌山精化工業(股)公司製)7.025g(0.016莫耳)、雙(4-胺基苯基)碸(和歌山精化工業(股)公司製)16.133g(0.065莫耳)、作為有機溶劑之γ-丁內酯(三菱化學(股)公司製)53.86g、作為醯亞胺化觸媒之三乙胺(關東化學(股)公司製)0.411g，在系統內溫度70℃，氮氣環境下，以旋轉數200rpm進行攪拌來獲得溶液。於其中一次性地添加作為脂環式四羧酸二酐成分之1,2,4, 5-環己烷四羧酸二酐(三菱瓦斯化學(股)公司製)7.282g(0.032莫耳)、作為芳香族四羧酸二酐成分之3,3’,4,4’-聯苯四羧酸二酐(三菱化學(股)公司製)14.336g(0. 049莫耳)及為有機溶劑之γ-丁內酯(三菱化學(股)公司製)13.47g後，以加熱套進行加熱， 花費約20分鐘將反應系統內溫度提升到190℃。藉由在收集餾去之成分，且配合黏度上升來調整旋轉數的狀態下，將反應系統內溫度保持於190℃進行回流5小時來獲得聚醯亞胺溶液。之後，在反應系統內溫度冷卻至120℃後添加N,N-二甲基乙醯胺(三菱瓦斯化學(股)公司製)100.51g，進一步攪拌約3小時使其變均勻，獲得固體成分濃度20質量%之聚醯亞胺樹脂溶液(B)。 然後，藉由於玻璃基板上塗布獲得之聚醯亞胺樹脂溶液(B)，於加熱板保持在100℃60分鐘，使溶劑揮發而獲得具有自支撐性之無色透明的一次乾燥薄膜，進一步地將該薄膜固定於不鏽鋼架，在熱風乾燥機中以250℃加熱2小時使溶劑蒸發，獲得厚度40μm之聚醯亞胺薄膜。由獲得之聚醯亞胺薄膜的FT-IR分析確認原料的峰消失且出現來自醯亞胺骨架的峰。 該聚醯亞胺薄膜之全光線透射率為87.7%，在波長400nm之透射率為82.7%， 在波長420nm之透射率為53.1%，在波長450nm之透射率為84.4%，YI値為6.4，Tg為282℃，折射率nD為1.67。
[實施例3] 於具備不鏽鋼製半月型攪拌葉、氮氣導入管、溫度計、玻璃製端帽的300mL之4口圓底燒瓶中，加入氧化鋯粒子分散液(SZR-DMAc，堺化學工業(股)公司製(固體成分濃度31質量%))30.00g、DMAc(三菱瓦斯化學(股)公司製)32.00g，在室溫，氮氣環境下，以旋轉數200rpm進行攪拌獲得氧化鋯粒子稀釋分散液(固體成分濃度15質量%)。然後，使用T.K.HOMODISPER Model 2.5(PRIMIX Corporation製)將該稀釋分散液60.00g與聚醯亞胺樹脂溶液(A)45g(固體成分濃度20質量%)以旋轉數2000rpm進行5分鐘混練，獲得混練物。 使用之氧化鋯粒子分散液的分散介質係DMAc，D50為10nm以下，氧化鋯粒子之折射率為2.11。
然後，藉由於玻璃基板上塗布混練物，保持在60℃30分鐘、100℃1小時，使溶劑揮發來獲得具有自支撐性之無色透明的一次乾燥薄膜，進一步地藉由將該薄膜固定於不鏽鋼架，在280℃氮氣環境下乾燥2小時來除去溶劑，獲得厚度40μm之聚醯亞胺薄膜。由獲得之聚醯亞胺薄膜的FT-IR分析確認原料的峰消失且出現來自醯亞胺骨架的峰。 該聚醯亞胺薄膜之全光線透射率為87.5%，在波長400nm之透射率為44.3%， 在420nm之透射率為78.0%，在波長420nm之透射率為53.1%，在波長450nm之透射率為82.7%，YI値為4.8，Tg為363℃，折射率nD為1.71。
[比較例1] 於500mL之玻璃製5口圓底燒瓶中，加入作為二胺成分之雙(3-胺基苯基)碸(和歌山精化工業(股)公司製)24.83g(0.10莫耳)、作為芳香族四羧酸二酐成分之3, 3’,4,4’-聯苯四羧酸二酐(三菱化學(股)公司製)29.11g(0.099莫耳)、作為封端劑之鄰苯二甲酸酐0.296g(0.002莫耳)、作為有機溶劑之N,N-二甲基乙醯胺(三菱瓦斯化學(股)公司製)280g，在室溫，氮氣環境下，以旋轉數200rpm攪拌約12小時來獲得聚醯胺酸溶液。
然後，藉由於玻璃基板上塗布聚醯胺酸溶液，於60℃30分鐘、100℃1小時，更於300℃氮氣環境下乾燥2小時來除去溶劑，並藉由醯亞胺化來獲得厚度40μm之聚醯亞胺薄膜。由獲得之聚醯亞胺薄膜的FT-IR分析確認原料的峰消失且出現來自醯亞胺骨架的峰。 該聚醯亞胺薄膜之全光線透射率為83.7%，在波長400nm之透射率為22.0%， 在420nm之透射率為64.0%，在波長450nm之透射率為74.3%，YI値為13.2，Tg為285℃，折射率nD為1.70。
[實施例4] 於500mL之玻璃製5口圓底燒瓶中加入作為二胺成分之雙[4-(4-胺基苯氧基)苯基]碸(和歌山精化工業(股)公司製)22.192g(0.051莫耳)、作為芳香族四羧酸二酐成分之3,3’,4,4’-聯苯四羧酸二酐(三菱化學(股)公司製)15.004g(0.049莫耳)、作為封端劑之鄰苯二甲酸酐0.296g(0.002莫耳)、作為有機溶劑之N,N-二甲基乙醯胺(三菱瓦斯化學(股)公司製)137.798g，在室溫，氮氣環境下，以旋轉數200rpm攪拌約12小時獲得聚醯胺酸溶液。
然後，藉由於玻璃基板上塗布聚醯胺酸溶液，於60℃30分鐘、100℃1小時，進一步地於300℃氮氣環境下乾燥2小時來除去溶劑，並藉由醯亞胺化來獲得厚度30μm之聚醯亞胺薄膜。由獲得之聚醯亞胺薄膜的FT-IR分析確認原料的峰消失且出現來自醯亞胺骨架的峰。 該聚醯亞胺薄膜之全光線透射率為88.37%，在波長400nm之透射率為1.9%， 在420nm之透射率為27.7%，在波長450nm之透射率為75.2%，YI値為19.9、Tg為278℃，折射率nD為1.67。
在本實施例中，固體成分濃度及薄膜厚度以如下述方式來求得。 (1) 固體成分濃度： 脂環式聚醯亞胺樹脂及二氧化鈦分散液之固體成分濃度的測定藉由以AS O NE Corporation.製之小型電爐「MMF-1」將樣本以300℃×30min條件進行加熱，從加熱前後之樣本的重量差來算得。 (2) 薄膜厚度： 薄膜厚度之測定係使用Mitutoyo Corporation.製之測微器來進行測定。
對於獲得之聚醯亞胺薄膜之上述評價係以如下之方式來進行。結果表示於下述表1。 (1) 全光線透射率、YI(黃色指數，Yellow Index)： 測定係依循JIS K7105，使用日本電色工業(股)公司製之色彩-濁度同時測定器「COH400」來進行測定。
(2) 玻璃轉化溫度： 使用SII NanoTechnology Inc.製之差示掃描量熱計裝置「DSC6200」，以升溫速度10℃/min之條件來進行DSC測定，求得玻璃轉化溫度。 (3) 折射率： 薄膜之折射率及阿貝數(Abbe number)之測定係使用ATAGO CO., LTD.製之阿貝折射計「DR-M4/1550」，以D線(589nm)、溫度：23℃條件進行測定。其中，以D線測定而得之折射率記載為nD。 (4) 在400nm、420nm及450nm之透射率 使用島津製作所(股)公司製之紫外光-可見光-近紅外線分光光度計「UV-310 0PC」來進行測定。
【表1】
Claims (5)
- 一種聚醯亞胺樹脂，含有來自四羧酸二酐之構成單元A、與來自二胺化合物之構成單元B；該構成單元A含有來自下式(a-1)表示之化合物之構成單元(A-1)及來自下式(a-2)表示之化合物之構成單元(A-2)，且在該構成單元A中，該構成單元(A-2)之比率為60莫耳%以下；該構成單元B含有來自下式(b-1)表示之化合物之構成單元(B-1)，在該構成單元B中，該構成單元(B-1)之比率為85莫耳%以上，且該構成單元(B-1)含有50莫耳%以上之來自下式(b-1-1)表示之化合物之構成單元(B-1-1)；
- 如申請專利範圍第1項之聚醯亞胺樹脂，其中，構成單元B更含有來自下式(b-2)表示之化合物之構成單元(B-2)；
- 一種聚醯亞胺樹脂組成物，含有：如申請專利範圍第1或2項之聚醯亞胺樹脂，及折射率為2.0以上且平均粒徑D50為20nm以下之無機粒子。
- 如申請專利範圍第3項之聚醯亞胺樹脂組成物，其中，該無機粒子為氧化鋯粒子及/或氧化鈦粒子。
- 一種聚醯亞胺薄膜，係由如申請專利範圍第1或2項之聚醯亞胺樹脂、或如申請專利範圍第3或4項之聚醯亞胺樹脂組成物之硬化物構成。
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