TWI726461B - Liquid heat-dissipation device - Google Patents
Liquid heat-dissipation device Download PDFInfo
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- TWI726461B TWI726461B TW108138649A TW108138649A TWI726461B TW I726461 B TWI726461 B TW I726461B TW 108138649 A TW108138649 A TW 108138649A TW 108138649 A TW108138649 A TW 108138649A TW I726461 B TWI726461 B TW I726461B
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- 239000007788 liquid Substances 0.000 title claims abstract description 154
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 71
- 239000000110 cooling liquid Substances 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000005192 partition Methods 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 230000004888 barrier function Effects 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 239000002826 coolant Substances 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明係與一種散熱系統有關,尤指一種液冷散熱裝置。The invention relates to a heat dissipation system, especially a liquid cooling heat dissipation device.
按,由於電子產業的快速發展,現今許多電子發熱元件須透過如水冷式散熱系統來進行冷卻,如此方可維持其正常之運作。By the way, due to the rapid development of the electronics industry, many electronic heating elements nowadays must be cooled by a water-cooled heat dissipation system, so as to maintain their normal operation.
而現今的水冷式散熱系統,主要仍係由一貼接於發熱源上的水冷頭、一提供該水冷頭水冷液的水箱、以及一帶動水冷液作流動的幫浦所構成,且彼此間透過管路的連接,使得水冷液得以在上述各構件內循環流動,從而將水冷頭所吸收的熱量帶走。更進一步地,可以再串接如水冷排等散熱構件,以幫助升溫的水冷液可加速冷卻,進而可快速循環再利用。However, the current water-cooled heat dissipation system is mainly composed of a water-cooling head attached to the heat source, a water tank that provides the water-cooling liquid of the water-cooling head, and a pump that drives the water-cooling liquid to flow, and passes through each other. The connection of the pipeline allows the water-cooling liquid to circulate in the above-mentioned components, thereby taking away the heat absorbed by the water-cooling head. Furthermore, heat dissipation components such as water cooling radiators can be connected in series to help the temperature-rising water cooling liquid to accelerate the cooling, and then it can be quickly recycled and reused.
然而,由於透過管路的連接,將使得水冷式散熱系統在各構件上較為零散而不便於安裝,因此亦有將各構件作整合的設計,例如將幫浦內藏於水箱中、或是將水箱與水冷頭一體構成等型式,進而可便於減少構件、以在較少構件下達到容易安裝與配置之目的。惟,此種已知的整合設計中,仍然沒有較有效地整合水箱、幫浦及水冷頭等結構,尤其內部輸送水冷液的通道沒有作更精簡的設計,以致水冷液在其內部流通上仍有過多不必要的途徑,如此不僅無法達到更加地縮小化,也造成配置上有多餘而不必要存在的設計。However, due to the connection of pipes, the water-cooled heat dissipation system will be scattered on the various components and not easy to install. Therefore, there are also designs that integrate various components, such as concealing the pump in the water tank, or putting the pump in the water tank. The water tank and the water cooling head are integrated into the same type, which can facilitate the reduction of components, so as to achieve the purpose of easy installation and configuration with fewer components. However, in this known integrated design, there is still no effective integration of water tanks, pumps, and water cooling heads. In particular, the internal channels for conveying water cooling liquid have not been designed more streamlined, so that the water cooling liquid still circulates in its internal flow. There are too many unnecessary ways, which not only fails to achieve further reduction, but also causes redundant and unnecessary designs in the configuration.
有鑑於此,本發明人係為改善並解決上述之缺失,乃特潛心研究並配合學理之運用,終於提出一種設計合理且有效改善上述缺失之本發明。In view of this, in order to improve and solve the above-mentioned shortcomings, the inventor of the present invention made great efforts to research and cooperate with the application of scientific theory, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned shortcomings.
本發明之主要目的,在於可提供一種液冷散熱裝置,其係利用幫浦及液冷頭在液冷箱上的相對配置關係,以有效縮小液冷箱所需佔用的空間,從而能更加容易地直接將其安裝在發熱源上。The main purpose of the present invention is to provide a liquid-cooled heat dissipation device, which utilizes the relative arrangement relationship of the pump and the liquid-cooled head on the liquid-cooled box to effectively reduce the space occupied by the liquid-cooled box, thereby making it easier Install it directly on the heat source.
本發明之另一目的,在於可提供一種液冷散熱裝置,其係有效簡化冷卻液於液冷箱內的流動路徑,使幫浦直接由液冷箱抽冷卻液並以由上而下的方式注入液冷頭內,以最短的路徑但能提高冷卻液衝擊力的方式,達到較佳地冷卻效果。Another object of the present invention is to provide a liquid-cooled heat dissipation device, which effectively simplifies the flow path of the cooling liquid in the liquid-cooled box, so that the pump can directly pump the cooling liquid from the liquid-cooled box in a top-down manner It is injected into the liquid cold head to achieve a better cooling effect with the shortest path but can increase the impact force of the coolant.
為了達成上述之主要目的,本發明係提供一種液冷散熱裝置,包括一儲液箱、一液冷頭、以及一幫浦;儲液箱內部係具有一儲液空間,並於其外部具有一底部、以及與底部相鄰的一第一側部,且第一側部內設有一與儲液空間相連通的容置空間;液冷頭設於儲液箱之底部,包含一蓋部、以及一與蓋部密合的冷卻板,以於蓋部內形成一冷卻空間;幫浦則設於容置空間內;其中,儲液箱內係設有一連通容置空間與冷卻空間的注液孔、以及一連通冷卻空間與儲液空間的換液孔;俾藉由幫浦將裝載於儲液空間內的冷卻液吸入容置空間內,再透過注液孔打入冷卻空間,以使冷卻液於冷卻空間進行熱交換後再由換液孔回流至儲液空間。In order to achieve the above-mentioned main objective, the present invention provides a liquid-cooled heat dissipation device, which includes a liquid storage tank, a liquid cooling head, and a pump; the liquid storage tank has a liquid storage space inside, and a liquid storage space outside the liquid storage tank. The bottom and a first side adjacent to the bottom, and the first side is provided with an accommodating space communicating with the liquid storage space; the liquid cooling head is arranged at the bottom of the liquid storage tank and includes a cover, and A cooling plate tightly fitted with the cover to form a cooling space in the cover; the pump is arranged in the accommodating space; wherein the liquid storage tank is provided with a liquid injection hole connecting the accommodating space and the cooling space , And a liquid exchange hole connecting the cooling space and the liquid storage space; the cooling liquid loaded in the liquid storage space is sucked into the containing space by the pump, and then injected into the cooling space through the liquid injection hole to make the cooling liquid After the heat exchange is performed in the cooling space, it flows back to the liquid storage space from the liquid exchange hole.
為了達成上述之另一目的,本發明係提供一種液冷散熱裝置,其係於儲液空間與容置空間之間設有一阻隔壁,且阻隔壁上設有一連通容置空間與儲液空間的通孔,通孔位於注液孔上方;俾由離心式幫浦以垂直向下的動力帶動冷卻液,同時進一步利用重力加強冷卻液被注入冷卻空間內時所產生的衝擊力,以增加冷卻液停駐於冷卻空間內的時間。In order to achieve the above-mentioned other object, the present invention provides a liquid-cooled heat dissipation device, which is provided with a barrier wall between the liquid storage space and the accommodating space, and the barrier wall is provided with a communicating accommodating space and the liquid storage space The through hole is located above the liquid injection hole; the centrifugal pump drives the coolant with a vertical downward power, and at the same time, it further uses gravity to strengthen the impact force generated when the coolant is injected into the cooling space to increase cooling The time the liquid stays in the cooling space.
為了使 貴審查委員能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。In order to enable your reviewer to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the accompanying drawings are only for reference and illustration, and are not used to limit the present invention. .
請參閱圖1及圖2,係分別為本發明之立體分解圖、以及另一視角之立體分解圖。本發明係提供一種液冷散熱裝置,其係可裝配於一電子發熱元件上,並用以幫助該電子發熱元件進行散熱。該液冷散熱裝置包括一儲液箱1、一液冷頭2、以及一幫浦3;其中:Please refer to FIG. 1 and FIG. 2, which are respectively a three-dimensional exploded view of the present invention and a three-dimensional exploded view from another perspective. The present invention provides a liquid-cooled heat dissipation device, which can be assembled on an electronic heating element and used to help the electronic heating element to dissipate heat. The liquid cooling device includes a
該儲液箱1在外觀上可為一方型體或圓型體構成,其內部具有一供冷卻液裝載的儲液空間10,並於該儲液箱1外部具有一底部11、以及與該底部11相鄰的一第一側部12,且該第一側部12向該儲液箱1內凹設有一容置空間120,該容置空間120與該儲液空間10之間以一通孔121相連通(如圖3所示);其中,可於該儲液空間與該容置空間120之間設有一阻隔壁121a,而該通孔121即設於該阻隔壁121a上並予以貫通。而在本發明所舉之實施例中,該儲液箱1外部還具有一頂部100,且該儲液空間10係由該頂部100向該儲液箱1內凹設而形成者,並可於該頂部100上增設一箱蓋101,該箱蓋101可為透明材質製成,以供人眼可由該儲液箱1外部透過該箱蓋101,而觀看該儲液空間10內之冷卻液的殘存量。The
該液冷頭2係設於上述儲液箱1之底部11上,並包含一蓋部20、以及一由該蓋部20下方密合的冷卻板21,以於該蓋部20內形成一冷卻空間200。而在本發明所舉之實施例中,該蓋部20可由該儲液箱1之底部11一體突出所構成,而該冷卻板21上則可設有複數間隔排列且位於該冷卻空間200內的鰭片210,以透過鰭片210的排列方向來限制冷卻液的流動方向一致,並可由儲液箱1之底部11向下突設一隔緣200a,該隔緣200a係橫截而抵接於該等鰭片210上,以進一步限制流入冷卻空間200內的冷卻液僅得由各鰭片210間通過。The liquid
該幫浦3係用以提供冷卻液流動的動力,並設於上述儲液箱1之容置空間120內,即係由該儲液箱1之第一側面12而將該幫浦3朝該容置空間120內組裝,並可進一步以一封蓋122蓋合。The
再請一併參閱圖3及圖4所示,由於上述儲液箱1之底部11係與其第一側面12相鄰,故可於該儲液箱1內設有一連通於該容置空間120與該冷卻空間200之間的注液孔201,以透過上述幫浦3的運作,而能由通孔121將位於儲液空間10內的冷卻液吸入容置空間120內,再透過注液孔201打入該冷卻空間200內,進而使冷卻液可提供液冷頭2對發熱元件進行散熱。而在本發明所舉之實施例中,該幫浦3係為一離心式幫浦,其軸心朝向該通孔121而將卻液吸入容置空間120內,並透過離心式的葉輪將冷卻液朝向該注液孔201打入冷卻空間200內;換言之,該通孔121係位於該注液孔201上方,並經由幫浦3的帶動而使冷卻液由上而下進入注液孔201以衝擊至冷卻空間200內,此除了有幫浦3以垂直向下的動力帶動外,也能進一步利用重力加強冷卻液被注入冷卻空間200內時所產生的衝擊力,從而增加冷卻液停駐於冷卻空間200內的時間。更甚者,亦可於該冷卻空間200內擴增一蓄水區200b,所述蓄水區200b由冷卻液流向的反向、或是與各鰭片210反向設置,以供冷卻液通過注液孔201衝擊下來後,能夠於所述蓄水區200b囤積後再一併流向各鰭片210。Please refer to FIGS. 3 and 4 together. Since the
承上所述,上述儲液箱1內更設有一連通於該冷卻空間200與該儲液空間10之間的換液孔202;當上述被注入冷卻空間200的冷卻液,在通過液冷頭2之各鰭片210而帶走冷卻板21所吸收的熱量後,即可通過該換液孔202回流至儲液空間10內,以待降低溫度或另行排出該儲液箱1外以其它手段進行冷卻後,再供幫浦3吸入並注入冷卻空間200來循環使用。Continuing from the above, the
是以,藉由上述之構造組成,即可得到本發明液冷散熱裝置。Therefore, the liquid-cooled heat sink of the present invention can be obtained by the above-mentioned structure composition.
此外,如圖6所示,本發明亦可進一步供上述水箱連接一液冷排5,且該儲液箱1上設有一迴流構件4連通其儲液空間10,並藉由該迴流構件4連接該液冷排5,以供該儲液箱1內的冷卻液可獲得降溫或冷卻。請一併參閱圖1、圖3及圖6所示,在本發明所舉之實施例中,該儲液箱1外部更具有一與上述第一側部12相背對的第二側部13,該迴流構件4即設於該第二側部13上,且該迴流構件4可包含一出液接頭40與一入液接頭41,並於該第二側部13上設有一對應該出液接頭41的出液孔130、與一對應該入液接頭41的入液孔131,而該第二側部13於該儲液空間10內更設有一區隔結構14,以於該區隔結構14內具有彼此分隔的一出液區140a與一入液區141a,且該出液區140a對應該出液孔130與該換液孔202,而該入液區141a則對應該入液孔131;更詳細地,該區隔結構14係包含一環圍該出、入液孔130、131及換液孔202的圍牆140,以及一設於該圍牆140內而區隔該出、入液孔130、131的分隔壁141,進而將該圍牆140內區分為所述出液區140a與所述入液區141a。此外,該區隔結構14對應所述入液區141a處係設有一回流口142,該回流口142可設於該圍牆140上緣且對應所述入液區141a處。In addition, as shown in FIG. 6, the present invention can further connect the above-mentioned water tank to a
再請參閱圖3及圖4所示,當上述冷卻液通過該換液孔202而回流至儲液空間10內時,透過上述區隔結構14可使冷卻液流至出液區140a,進而由出液接頭40可由管路52連接至液冷排5的輸入口50,即如圖6所示。而該液冷排5亦可增設一風扇6幫助冷卻液降溫,待冷卻液降溫後再由該液冷排5的輸出口51由另一管路52連接至入液接頭41,即如圖3及圖5所示,使降溫後的冷卻液流至入液區141a,並由回流口142回流至儲液箱1之儲液空間10內,以供上述幫浦3運作而循環利用。Please refer to FIGS. 3 and 4 again. When the cooling liquid flows back into the
再者,該第二側部13上亦可設有一補液孔132,並以一密封塞132a螺入塞合。Furthermore, the
而在其它實施例中,如圖7所示,上述迴流構件4亦可設於儲液箱1之箱蓋101上並連通儲液空間10,且該迴流構件4之出液接頭40與入液接頭41亦分別對應該區隔結構14之出液區140a與入液區141a。In other embodiments, as shown in FIG. 7, the above-mentioned
綜上所述,本發明確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。In summary, this invention clearly achieves the intended purpose of use, and solves the deficiencies of conventional knowledge, and because of its novelty and advancement, it fully meets the requirements of an invention patent application. The application is filed in accordance with the Patent Law. Please check and verify in detail. Grant the patent in this case to protect the rights of the inventor.
惟以上所述僅為本發明之較佳可行實施例,非因此即拘限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術、手段等變化,均同理皆包含於本發明之範圍內,合予陳明。However, the above descriptions are only the preferred and feasible embodiments of the present invention, and the scope of the patent of the present invention is not limited thereby. Therefore, all equivalent technologies, means and other changes made by using the description and drawings of the present invention are the same. It is included in the scope of the present invention, and is fully disclosed.
<本發明><The present invention>
儲液箱 1Reservoir 1
儲液空間10
頂部 100Top 100
箱蓋 101
底部11
第一側部12
容置空間120
通孔121Through
阻隔壁121a
封蓋122
第二側部13
出液孔 130
入液孔 131
補液孔 132
密封塞132a
區隔結構14
圍牆140
出液區140a
分隔壁 141
入液區141a
回流口 142
液冷頭 2
蓋部20
冷卻空間200
隔緣200a
蓄水區200b
注液孔 201Filling
換液孔 202
冷卻板21Cooling
鰭片210
幫浦 3
迴流構件 4
出液接頭40
入液接頭41
液冷排 5
輸入口50Input port 50
輸出口51
管路52
風扇 6
圖1係本發明之立體分解圖。Figure 1 is a perspective exploded view of the present invention.
圖2係本發明另一視角之立體分解圖。Figure 2 is a perspective exploded view of the present invention from another perspective.
圖3係本發明內部構造之剖面示意圖。Figure 3 is a schematic cross-sectional view of the internal structure of the present invention.
圖4係根據圖3之4-4斷面剖視圖。Fig. 4 is a cross-sectional view according to Fig. 3, section 4-4.
圖5係根據圖3之5-5-斷面剖視圖。Fig. 5 is a cross-sectional view according to the section 5-5- of Fig. 3.
圖6係本發明外接液冷排之示意圖。Fig. 6 is a schematic diagram of the external liquid cooling row of the present invention.
圖7係本發明另一實施例之立體分解圖。Fig. 7 is an exploded perspective view of another embodiment of the present invention.
儲液箱 1
儲液空間10
頂部100
箱蓋101
通孔121
封蓋122
第二側部13
出液孔130
入液孔 131
補液孔 132
密封塞132a
區隔結構14
回流口142
液冷頭 2
冷卻板21
鰭片210
幫浦 3
迴流構件 4
出液接頭40
入液接頭41
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108138649A TWI726461B (en) | 2019-10-25 | 2019-10-25 | Liquid heat-dissipation device |
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| TW108138649A TWI726461B (en) | 2019-10-25 | 2019-10-25 | Liquid heat-dissipation device |
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| TWI726461B true TWI726461B (en) | 2021-05-01 |
| TW202117255A TW202117255A (en) | 2021-05-01 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2890823Y (en) * | 2006-01-25 | 2007-04-18 | 卢振涛 | Heat exchanger |
| TWM359740U (en) * | 2009-01-09 | 2009-06-21 | Cooler Master Co Ltd | Improved structure of water-cooling head |
| TWM458779U (en) * | 2013-03-13 | 2013-08-01 | Cooler Master Co Ltd | Water-cooling type heat dissipating device |
| TWM477138U (en) * | 2013-12-31 | 2014-04-21 | Kuan Ding Industrial Co Ltd | Liquid cooled heat dissipation device |
| TWM547124U (en) * | 2017-05-26 | 2017-08-11 | Kuan Ding Technology Co Ltd | Water-cooling heat dissipation device |
| TW201841096A (en) * | 2018-06-01 | 2018-11-16 | 大陸商深圳市研派科技有限公司 | Tubeless liquid cooling heat dissipation system including a heat dissipating device, a pumping device, a water tank and a heat absorbing device |
-
2019
- 2019-10-25 TW TW108138649A patent/TWI726461B/en active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2890823Y (en) * | 2006-01-25 | 2007-04-18 | 卢振涛 | Heat exchanger |
| TWM359740U (en) * | 2009-01-09 | 2009-06-21 | Cooler Master Co Ltd | Improved structure of water-cooling head |
| TWM458779U (en) * | 2013-03-13 | 2013-08-01 | Cooler Master Co Ltd | Water-cooling type heat dissipating device |
| TWM477138U (en) * | 2013-12-31 | 2014-04-21 | Kuan Ding Industrial Co Ltd | Liquid cooled heat dissipation device |
| TWM547124U (en) * | 2017-05-26 | 2017-08-11 | Kuan Ding Technology Co Ltd | Water-cooling heat dissipation device |
| TW201841096A (en) * | 2018-06-01 | 2018-11-16 | 大陸商深圳市研派科技有限公司 | Tubeless liquid cooling heat dissipation system including a heat dissipating device, a pumping device, a water tank and a heat absorbing device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202117255A (en) | 2021-05-01 |
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