TWI725745B - Substrate drying chamber - Google Patents

Abstract

The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the lower housing and configured to provide a path through which foreign materials impregnated in the sealing part or present around the sealing part are introduced and discharged to the outside.

Description

Substrate drying chamber

The invention relates to a substrate drying chamber. More specifically, the present invention relates to a method for allowing a supercritical fluid to be finally discharged after a drying process, by using a foreign substance discharging member formed in the lower housing to discharge immersed in a sealing member or present in the sealing member Surrounding foreign matter (such as particles) prevents foreign matter from being introduced into a substrate in a cavity, and allows a symmetrical flow of a supercritical fluid to uniformly distribute and supply the supercritical fluid inside the substrate drying chamber And a substrate drying chamber for discharging the supercritical fluid to improve the efficiency of substrate drying.

The manufacturing process of a semiconductor device includes various processes, such as a lithography process, an etching process, an ion implantation process, and the like. After each process is completed and before performing a subsequent process, a cleaning process and a drying process are performed to remove impurities and residues remaining on the surface of a wafer to clean the surface of the wafer.

For example, in a cleaning process of a wafer after an etching process, a chemical liquid used for the cleaning process is supplied to a surface of a wafer, and then deionized water (DIW) is supplied to perform a rinse process. After the rinsing process, a drying process is performed to remove the DIW remaining on the surface of the wafer to dry the wafer.

For example, as one of the methods of performing the drying process, a technique of drying a wafer by replacing the DIW on a wafer with isopropyl alcohol (IPA) is known.

However, as shown in FIG. 1, according to this conventional drying technique, during the drying process, a pattern formed on the wafer collapses due to the surface tension of IPA (which is a liquid). .

In order to solve the above problems, a supercritical drying technique in which the surface tension becomes zero has been proposed.

According to this supercritical drying technology, carbon dioxide (CO ₂ ) in a supercritical state is supplied to a wafer (one surface of the wafer is wetted with IPA in a cavity), so that the IPA on the wafer is dissolved In a supercritical CO ₂ fluid. _{Then, the supercritical CO 2} fluid in which the IPA is dissolved is gradually discharged from the cavity, so that the wafer can be dried without collapsing a pattern.

FIG. 2 shows a substrate processing chamber disclosed in Korean Patent Publication Application No. 10-2017-0137243, which is a related technology combined with a substrate processing apparatus using this supercritical fluid.

Referring to FIG. 2, in a process of removing an organic solvent in a supercritical drying process, an organic solvent can be introduced into a coupling surface of an upper body 430 and a lower body 420 forming a high pressure chamber 410 and contacting each other. on. The organic solvent introduced on the coupling surface of the upper body 430 and the lower body 420 becomes particles accumulated around the coupling surface.

After the supercritical drying process ends, the cavity is opened to unload the processed substrate to the outside. In this case, due to a pressure difference between the inside and the outside of one of the cavities, particles around the coupling surface of the upper body 430 and the lower body 420 can be introduced into the inside of the cavity.

According to Korean Patent Publication Application No. 10-2017-0137243, since a substrate is positioned below the coupling surface of the upper body 430 and the lower body 420, particles around the coupling surface of the upper body 430 and the lower body 420 are introduced to In the interior of the cavity, there is a high probability that some particles will be introduced onto the substrate due to gravity.

As described above, since the particles introduced onto the substrate cause a process defect, it is necessary to additionally install a barrier curtain around the coupling surface of the upper body 430 and the lower body 420 in order to prevent the introduction of particles. Therefore, there is a problem that the overall structure of one of the devices is complicated.

In addition, according to the related technology including Korean Patent Application No. 10-2017-0137243, the lower supply port 422 is used to supply a supercritical fluid for initial pressurization and to discharge the supercritical fluid after drying of a substrate. A discharge port 426 is not positioned at a center of the lower main body 420, so when the supercritical fluid is supplied and discharged, an asymmetric flow of the supercritical fluid is formed, making it difficult to uniformly distribute and supply the supercritical fluid and the self in the cavity. The cavity discharges supercritical fluid. Therefore, one of the problems of degradation of drying efficiency occurs.

[Related technical documents] [Patent Document] (Patent Document 1) Korean Patent Publication Application No. 10-2017-0137243 (Publication date: December 13, 2017, title: Apparatus and method for treating substrate).

technical problem

One of the technical objects of the present invention is to discharge the foreign matter immersed in a sealing member or existing around the sealing member by using a foreign matter discharging member formed in the lower casing when finally discharging a supercritical fluid after a drying process (Such as particles) to prevent foreign matter from being introduced onto a substrate in a cavity.

Another technical purpose of the present invention is to prevent one of the following problems by arranging the substrate on a substrate placement plate that is higher than the coupling surface of a lower casing and an upper casing: During the cavity, the particles provided around a sealing member on the coupling surface of the lower casing and the upper casing are introduced onto the substrate due to gravity due to a height difference between the substrate and the coupling surface.

Another technical purpose of the present invention is to provide a supply path of a supercritical fluid for initial pressurization through an integrated supply/discharge port and an organic solvent formed on the substrate after drying of a substrate is dissolved in one of the supercritical fluids. A discharge path of the critical fluid, whereby a symmetric flow of the supercritical fluid supplied and discharged is induced to uniformly distribute and supply the supercritical fluid in a cavity and discharge the supercritical fluid from the cavity to improve the drying efficiency of the substrate.

Another technical purpose of the present invention is to use a substrate placement plate, which is essential for substrate placement, to block particles that are reintroduced when the cavity is opened after the end of a drying process, and to block the supercritical fluid for initial pressurization at an initial stage of the drying process Flow directly to the surface of a substrate to prevent a pattern formed on the substrate from collapsing, prevent particles that may be contained in the supercritical fluid for initial pressurization from accumulating on the substrate, or reduce the accumulation of particles, and due to the substrate The volume occupied by the placement plate reduces the working volume of the cavity and reduces the time of a drying process. Problem solution

A substrate drying chamber according to the present invention includes: an upper casing; a lower casing, which is detachably coupled to the upper casing; and a sealing member, which is provided for coupling between the lower casing and the upper casing On the surface; a substrate placement board, which is coupled to a bottom surface of the lower housing and a substrate is placed on it, wetted by an organic solvent, a pattern is formed on the substrate; an upper supply port, which forms In a central area of the upper casing to point to the substrate placement plate, and configured to provide a supply path of a supercritical fluid for drying; an integrated supply/discharge port formed in the lower casing , And is configured to provide a supply path of an initial pressurizing supercritical fluid according to a supply of the drying supercritical fluid and the organic solvent is dissolved in the drying supercritical fluid after the substrate is dried A discharge path of a mixed fluid; and a foreign matter discharge member formed in the lower housing and configured to provide foreign matter immersed in the sealing member or present around the sealing member through which the foreign matter is introduced and discharged to One of the external paths.

In the substrate drying chamber according to the present invention, the foreign matter discharge member may include: a foreign material inflow path formed vertically along an edge of the lower casing to be positioned below the sealing member and configured to provide the A path through which foreign matter is introduced; and a foreign matter discharge path, which is formed to extend from a distal end of the foreign matter inflow path to a side surface of the lower housing, and is configured to provide the foreign matter to be discharged through it A path to the outside.

In the substrate drying chamber according to the present invention, the integrated supply/discharge port that provides the discharge path of the mixed fluid can be opened or closed while opening the foreign matter discharging part and thus discharging the foreign matter.

In the substrate drying chamber according to the present invention, the foreign substance inflow path forming the foreign substance discharge member may have a shape corresponding to a shape of a groove of the edge of the lower casing.

In the substrate drying chamber according to the present invention, a plurality of vent holes formed vertically may be formed in a bottom surface of the groove, and the foreign matter discharge path may communicate with the plurality of vent holes.

In the substrate drying chamber according to the present invention, the sealing member and the foreign material inflow path may be coupled in a dovetail manner, and when the substrate drying chamber is opened due to the separation of the upper casing and the lower casing, It can prevent the release of the sealing part.

In the substrate drying chamber according to the present invention, the integrated supply/discharge port may be formed to extend from one side surface of the lower casing to the other side surface and be formed on one of the one side surface and the other side surface Place the board in the middle area to point to the substrate.

In the substrate drying chamber according to the present invention, the integrated supply/discharge port may include: a first pipeline formed from the side surface of the lower housing to the middle area; and a common port formed at The intermediate zone is connected with the first pipeline and is formed to point to the substrate placement plate; and a second pipeline is configured to communicate with the common port and the first pipeline in the intermediate zone, and forms To extend to the other side surface of the lower shell.

In the substrate drying chamber according to the present invention, the first pipeline and the common port can provide the supply path of the supercritical fluid for the initial pressurization, and the common port and the second pipeline can provide in which the organic solvent is dissolved in The discharge path of the mixed fluid in the supercritical fluid for drying.

In the substrate drying chamber according to the present invention, the substrate can be placed on a substrate placement plate that is higher than the coupling surface of the lower casing and the upper casing, and when the drying process ends and the lower casing When the body and the upper casing are detached from each other, it can prevent particles provided on the coupling surface around the sealing member from being introduced to the substrate due to gravity due to a height difference between the substrate and the coupling surface on.

In the substrate drying chamber according to the present invention, the substrate placement plate can block the supercritical fluid for initial pressurization supplied through the first pipeline and the common port, so that the supercritical fluid for initial pressurization is prevented from being sprayed directly To the substrate.

The substrate drying chamber according to the present invention may further include a substrate placing plate support having one end coupled to the bottom surface of the lower housing and the other end coupled to the substrate placing plate, And it is configured to separate the substrate placing plate from the bottom surface of the lower casing while supporting the substrate placing plate.

In the substrate drying chamber according to the present invention, a first separation space existing between the bottom surface of the lower housing and the substrate placing plate due to the substrate placing plate support can be induced through the integrated supply /The supercritical fluid for initial pressurization supplied by the discharge port moves along a bottom surface of the substrate placement plate to gradually diffuse into a processing area in which the substrate is placed.

The substrate drying chamber according to the present invention may further include a substrate support having one end coupled to a top surface of the substrate placement plate and the other end coupled to the substrate, and is configured to While supporting the substrate, the substrate is separated from the top surface of the substrate placement plate.

In the substrate drying chamber according to the present invention, a second separation space existing between the top surface of the substrate placement plate and the substrate due to the substrate support allows the bottom surface of the substrate to be exposed to penetration The supercritical fluid for initial pressurization supplied by the integrated supply/discharge port and the supercritical fluid for drying supplied through a nozzle, thereby reducing one time of the drying process. Beneficial invention effect

According to the present invention, when a supercritical fluid is finally discharged after a drying process, a foreign substance discharging member formed in the lower casing is used to discharge foreign substances immersed in a sealing member or existing around the sealing member (such as Particles) to prevent foreign matter from being introduced to a substrate in a cavity.

In addition, when the drying process is completed and the cavity is opened, the substrate can be placed on a substrate placement plate that is higher than the coupling surface of the lower housing and an upper housing to prevent the substrate from being provided on the lower housing and the upper housing. A problem that particles around a sealing component on the coupling surface of the upper casing are introduced to the substrate due to gravity due to a height difference between the substrate and the coupling surface.

In addition, according to the present invention, a supply path of a supercritical fluid for initial pressurization and a substrate after drying can be provided through an integrated supply/discharge port. An organic solvent formed on the substrate is dissolved in one of the supercritical fluids. A discharge path, so that by inducing a symmetric flow of the supercritical fluid supplied and discharged to uniformly distribute and supply the supercritical fluid into a cavity and discharge the supercritical fluid from the cavity to improve the drying of the substrate effectiveness.

In addition, according to the present invention, the collapse of a pattern formed on the substrate can be prevented by: using a substrate placement plate, which is essential for the layout of the substrate, to block the particles that are introduced again when the cavity is opened after the drying process is completed. The initial stage of the drying process prevents the supercritical fluid for initial pressurization from flowing directly to a surface of the substrate, prevents particles that may be contained in the supercritical fluid for initial pressurization from accumulating on the substrate, and reduces the amount of particles deposited, and The time of the drying process is reduced due to the reduction of the working volume of the cavity due to the volume occupied by the substrate placement plate.

The specific structure and function descriptions of the embodiments of the present invention disclosed herein are only illustrative and for the purpose of describing embodiments according to the concept of the present invention, and these embodiments according to the concept of the present invention may be in various forms Implementation and should not be construed as being limited to the embodiments described herein.

The embodiments according to the concept of the present invention can be modified in various ways and can have various forms, so that these embodiments will be illustrated in the accompanying drawings and described in detail herein. However, it should be understood that the embodiments according to the concept of the present invention are not intended to be limited to the specific form of the present invention, but include all modifications, equivalents, and substitutions that fall within the spirit and scope of the present invention.

The terms first, second, and the like can be used to describe various components, but these components should not be limited by these terms. These terms can only be used for the purpose of distinguishing one component from another component, and for example, without departing from the scope of the present invention, a first component can be referred to as a second component, and similarly, the second component is also Can be referred to as the first component.

When a component is referred to as being “connected” or “coupled” to another component, it can be directly connected or coupled to another component, but it should be understood that there may be another component between the component and another component . In contrast, when a component is referred to as being “directly connected” or “directly coupled” to another component, it should be understood that there may not be another component between the component and the other component. Other expressions describing the relationship between components should also be explained as described above, that is, "between" and "directly between" or "adjacent to" and "directly adjacent to ".

The terms used herein are only used for the purpose of describing specific embodiments and are not intended to limit the present invention. Unless the context clearly indicates otherwise, the singular form includes the plural form. In this specification, the terms "include", "include", "have" and the like are used to designate the existence of a feature, a number, a step, an operation, a component, an element or the like described herein. A combination, and it should be understood that these do not exclude the possibility of pre-existing or adding one or more other features, numbers, steps, operations, components, elements, or a combination thereof.

Unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meanings commonly understood by those skilled in the art to which the present invention belongs. A general term defined in a dictionary should be interpreted as having a consistent meaning in the context of the related technology, and unless clearly defined in the present invention, it shall not be interpreted as having an ideal or excessive formal meaning.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a diagram of a substrate drying chamber according to an embodiment of the present invention, and FIG. 4 is an exemplary illustration of a foreign matter discharge member formed in a lower housing according to an embodiment of the present invention Figure 5 is a diagram showing another exemplary shape of a foreign matter discharging member formed in the lower casing according to an embodiment of the present invention, and Figure 6 is a diagram showing another exemplary shape according to the present invention. A diagram of a diffusion path of a supercritical fluid for initial pressurization of one embodiment, FIG. 7 is a diagram of a diffusion path of a supercritical fluid for drying according to an embodiment of the present invention, and FIG. 8 is A diagram showing a discharge path of a mixed fluid in which an organic solvent is dissolved in a supercritical fluid for drying according to an embodiment of the present invention, and FIG. 9 is used to describe preventing particles at the end of a drying process A schematic diagram of the principle introduced on a substrate, in which particles are present on a sealing member provided on a coupling surface of an upper casing and a lower casing and are present around the sealing member.

3-9, a substrate drying chamber 1 according to an embodiment of the present invention includes an upper housing 10, a lower housing 20, a sealing member 30, a substrate placement plate 40, and an integrated supply/discharge Port 50, an upper supply port 60, a substrate placement plate support 70, a substrate support 80, a housing driver 90, and a foreign matter discharge component 100.

The upper housing 10 and the lower housing 20 are detachably coupled to each other, and provide a space in which to perform a drying process. For example, the upper housing 10 and the lower housing 20 may each be configured to have a cylindrical shape, but the present invention is not limited thereto. As described below, the upper supply port 60 is formed in the upper housing 10, and the integrated supply/discharge port 50 and the foreign matter discharge member 100 are formed in the lower housing 20.

The sealing member 30 is provided on a coupling surface of the lower casing 20 and the upper casing 10, and maintains the airtightness of the coupling surface of the lower casing 20 and the upper casing 10 to block an inner area of the substrate drying chamber 1 With the outside. For example, the sealing member 30 may include a polymer material, but the present invention is not limited thereto.

The foreign matter discharging part 100 is formed in the lower housing 20, and when the drying process is completed, the foreign matter discharging part 100 provides for the introduction of foreign matter immersed in the sealing part 30 or present around the sealing part 30 during the drying process and discharged to the outside through it One of the paths.

The reason why the foreign matter is immersed in the sealing member 30 or exists around the sealing member 30 during the drying process and the principle of the foreign matter being discharged through the foreign matter discharging member 100 will be described as follows.

First, a drying process of one of the substrate drying chambers according to an embodiment of the present invention will be described as follows.

First, during a set initial pressurization time, an initial pressurization supercritical fluid is supplied through the first pipeline 510 and the common port 520 constituting the integrated supply/discharge port 50, and after an initial pressurization time has elapsed, the initial pressurization time is blocked. The supply of supercritical fluid for pressurization can supply the supercritical fluid for drying through the upper supply port 60 during a drying time, and then, after the drying time has passed, the supercritical fluid for drying is blocked and passes through during a discharge time The common port 520 and the second pipeline 530 constituting the integrated supply/discharge port 50 discharge the mixed fluid. In this case, for example, the supply of the supercritical fluid for drying and the discharge of the mixed fluid can be repeated a predetermined number of times, that is, it can be cleaned. In the above-mentioned cleaning procedure, the supercritical fluid in the substrate drying chamber 1 and more specifically the supercritical fluid and the organic solvent dissolved in the supercritical fluid are immersed in a space between the polymer chains constituting the sealing member 30.

At the same time, when the drying process ends, since the internal pressure of one of the substrate drying chambers 1 drops below a critical point while the supercritical fluid is finally discharged, the supercritical fluid immersed in the sealing member 30 and dissolved in the supercritical fluid The phase change in the organic solvent causes the supercritical fluid to vaporize, the organic solvent is discharged from the sealing member 30 in the form of particles, and when the particles are not processed, there may be a phenomenon due to the particles being introduced onto a substrate W. One of the program defects.

An embodiment of the present invention is to prevent the above-mentioned problems. 9 is used to describe the principle of preventing particles from being introduced onto the substrate W, where the particles are present on the sealing member 30 provided on the coupling surface of the upper housing 10 and the lower housing 20 and are present around the sealing member 30, When the drying process ends, the foreign matter discharge member 100 formed in the lower housing 20 is used to provide a path for foreign matter (such as particles) immersed in or around the sealing member 30 to be introduced and discharged to the outside through it, This makes it possible to prevent contamination of the substrate W.

For example, the foreign matter discharge component 100 formed in the lower housing 20 may include a foreign matter inflow path 110 and a foreign matter discharge path 120.

The foreign material inflow path 110 is vertically formed along an edge of the lower casing 20 to be positioned at a lower portion of the sealing member 30, and provides one of the foreign materials immersed in the sealing member 30 and existing around the sealing member 30 to be introduced therethrough. path.

The foreign matter discharge path 120 is formed to extend from a lower distal end of the foreign material inflow path 110 to a side surface of the lower housing 20 and provide a path for the foreign matter to be discharged therethrough. For example, a pipeline for discharging foreign matter to the outside may be connected to a distal end of the foreign matter discharge path 120, and a valve for opening and closing the pipeline may be provided.

For example, as shown in FIG. 4, the foreign material inflow path 110 may be formed to have a groove shape corresponding to a shape of the edge of the lower housing 20. In addition, one or more foreign material discharge paths 120 and 121 may be provided to be formed to extend from the distal end of the lower portion of the foreign material inflow path 110 to the side surface of the lower housing 20. In FIG. 4, two foreign matter discharge paths 120 and 121 are shown, but this is only an example.

For example, the sealing member 30 and the foreign material inflow path 110 constituting the foreign material discharge member 100 are coupled in a dovetail manner, and therefore, when the substrate drying chamber 1 is opened due to the separation of the upper housing 10 and the lower housing 20, The foreign material inflow path 110 may be configured to prevent the release of the sealing member 30.

Alternatively, as shown in FIG. 5, a plurality of vent holes 130 formed vertically may be formed on a bottom surface of a groove constituting the foreign material inflow path 110 shown in FIG. 4, and the foreign matter discharge paths 120 and 121 may be It is configured to communicate with a plurality of vent holes 130. Here, the term “communication” means that a plurality of vent holes 130 and foreign matter discharge paths 120 and 121 are connected to each other and lead to each other.

At the same time, for example, when the drying process ends and the lower casing 20 and the upper casing 10 are disassembled from each other, the substrate W can be placed on a substrate placement plate 40 that is higher than the coupling surface of the lower casing 20 and the upper casing 10 , And when the drying process ends and the lower housing 20 and the upper housing 10 are disassembled from each other, the substrate drying chamber 1 can be formed to prevent particles from being attributed to gravity due to a height difference between the substrate W and the coupling surface. Introduced onto the substrate W, where particles are present around the sealing member 30 provided on the coupling surface.

The substrate placement plate 40 is coupled to a bottom surface 22 of the lower casing 20, and is a component of the substrate W placed thereon, which wets and forms an organic solvent on the substrate W.

For example, a first line 510 and a common port 520 that constitute the integrated supply/discharge port 50 supplies a supercritical fluid for initial pressurization that can be blocked by the substrate placement plate 40 to prevent direct spraying onto the substrate W.

More specifically, as shown in Fig. 6 showing a diffusion path of the supercritical fluid for initial pressurization and Fig. 8 showing a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying , A drying process time can be reduced so that the collapse of a pattern formed on the substrate W can be prevented by the following: the use of the substrate placement plate 40, which is essential for configuring the substrate W and is one of the targets of the drying process, prevents the drying process After the end, the particles introduced again when the substrate drying chamber 1 is opened, and at an initial stage of the drying process, the supercritical fluid for initial pressurization is prevented from flowing directly to a surface of the substrate W, and the supercritical fluid for initial pressurization may be prevented from The accumulation of particles on the substrate W is a problem, which may reduce the amount of particles deposited, and the drying process time can be reduced due to the reduction in the volume occupied by the substrate placement plate 40 and the reduction in the working volume of the substrate drying chamber 1.

The integrated supply/discharge port 50 is formed to extend from one side surface 24 to the other side surface 26 of the lower housing 20, and is formed from an intermediate area 28 of one side surface 24 and the other side surface 26 toward the substrate placement plate 40. The integrated supply/discharge port 50 is a component used to provide a supply path for the supercritical fluid for initial pressurization and a discharge path for the supercritical fluid in which the organic solvent formed on the substrate W is dissolved after the substrate is dried. .

An integrated supply/discharge port 50 provides a supply path for the supercritical fluid for initial pressurization and a discharge path for the supercritical fluid in which the organic solvent formed on the substrate W is dissolved after the substrate is dried, so that there is a One of the supplied and discharged supercritical fluid flows symmetrically to uniformly distribute and supply the supercritical fluid into the substrate drying chamber 1 and discharge the supercritical fluid from the substrate drying chamber 1 to improve substrate drying efficiency.

For example, the integrated supply/discharge port 50 includes: a first pipeline 510 formed from a side surface 24 of the lower housing 20 to a middle region 28; a common port 520 formed to be in the middle region 28 with the first The pipeline 510 communicates and faces the substrate placement plate 40; and a second pipeline 530, which is configured to communicate with the common port 520 and the first pipeline 510 in the intermediate region 28, and is formed as another portion extending to the lower housing 20 One side surface 26. The first pipeline 510 and the common port 520 can be configured to provide a supply path of the supercritical fluid for initial pressurization, and the common port 520 and the second pipeline 530 can be configured to provide the supercritical fluid in which the organic solvent is dissolved. Discharge path.

The upper supply port 60 is formed in a central area of the upper casing 10 to point to the substrate placement plate 40 to provide a supply path of the supercritical fluid for drying.

The substrate placement board support 70 has one end coupled to the bottom surface 22 of the lower housing 20 and the other end coupled to a component of the substrate placement board 40, and it supports the substrate placement board 40 while holding the substrate placement board 40. It is separated from the bottom surface 22 of the lower housing 20.

For example, a first separation space R1 existing between the bottom surface 22 of the lower housing 20 and the substrate placement plate 40 due to the substrate placement plate support 70 can be performed by allowing supply through the integrated supply/discharge port 50 The supercritical fluid for the initial pressurization moves along a bottom surface of the substrate placement plate 40, which causes the supercritical fluid for the initial pressurization to gradually diffuse to a function in a processing area where the substrate W is placed.

The substrate support 80 has one end coupled to a top surface of the substrate placement plate 40 and the other end is coupled to a component of the substrate W, and it supports the substrate W while connecting the substrate W and the top surface of the substrate placement plate 40 Separate.

For example, a second separation space R2 existing between the top surface of the substrate placement plate 40 and the substrate W due to the substrate support 80 is performed by exposing a bottom surface of the substrate W through an integrated supply/discharge port The supercritical fluid for initial pressurization supplied by 50 and the supercritical fluid for drying supplied through the upper supply port 60 are a function of reducing the time of a drying process.

The housing driver 90 is a component used to open or close the cavity. After the drying process ends, the lower housing 20 is driven to separate from the upper housing 10 to open the cavity, or when the drying process is initiated, the housing driver 90 may perform driving the lower housing 20 and coupling the lower housing 20 to the upper housing The body 10 functions as a closed cavity. Although the housing driver 90 has been shown as driving the lower housing 20 in the drawings, this is only an example, and the housing driver 90 can be configured to drive the upper housing 10.

For example, the supercritical fluid for initial pressurization and the supercritical fluid for drying may include carbon dioxide (CO ₂ ), and the organic solvent may include alcohol, but the present invention is not limited thereto. As a specific example, the alcohol may include methanol, ethanol, 1-propanol, 2-propanol (isopropanol (IPA)), and 1-butanol, but the present invention is not limited thereto.

For example, according to a supercritical drying technique performed in a substrate drying chamber according to an embodiment of the present invention, CO ₂ in a supercritical state is supplied to the substrate W, and one surface of the substrate W is in the cavity such as alcohol or The similar organic solvent wets, so that the alcohol on the substrate W is dissolved in a supercritical CO ₂ fluid. _{Then, the supercritical CO 2} fluid in which the alcohol is dissolved is gradually discharged from the cavity, so that the substrate W can be dried without collapsing a pattern.

1: Substrate drying chamber 10: Upper shell 20: Lower shell 22: bottom surface 24: One side surface 26: The other side surface 28: Middle area 30: Sealing parts 40: substrate placement board 50: Integrated supply/drain port 60: Upper supply port 70: substrate placement board support 80: substrate support 90: housing drive 100: Foreign body emission parts 110: Foreign logistics inbound path 120: foreign matter discharge path 121: Foreign matter discharge path 130: Vent 410: high pressure chamber 420: lower main body 422: Down Supply Port 426: Drain Port 430: upper body 510: The first pipeline 520: Common Port 530: second pipeline R1: The first separation space R2: Second separation space W: substrate

FIG. 1 is a diagram showing a pattern collapse phenomenon that occurs during a substrate drying process according to the related art.

FIG. 2 shows a diagram of a conventional substrate drying chamber.

FIG. 3 is a diagram showing a substrate drying chamber according to an embodiment of the present invention.

4 is a diagram showing an exemplary shape of a foreign matter discharging member formed in a lower casing according to an embodiment of the present invention.

FIG. 5 is a diagram showing another exemplary shape of the foreign matter discharging member formed in the lower casing according to an embodiment of the present invention.

Fig. 6 is a diagram showing a diffusion path of a supercritical fluid for initial pressurization according to an embodiment of the present invention.

Fig. 7 is a diagram showing a diffusion path of a supercritical fluid for drying according to an embodiment of the present invention.

FIG. 8 is a diagram showing a discharge path of a mixed fluid in which an organic solvent is dissolved in a supercritical fluid for drying according to an embodiment of the present invention.

Figure 9 is a diagram for describing the principle of preventing particles from being introduced onto a substrate at the end of a drying process, in which particles are present in a sealing member provided on a coupling surface of an upper housing and a lower housing And exist around the sealing part.

1: Substrate drying chamber

10: Upper shell

20: Lower shell

22: bottom surface

24: One side surface

26: The other side surface

30: Sealing parts

40: substrate placement board

50: Integrated supply/drain port

60: Upper supply port

70: substrate placement board support

80: substrate support

90: housing drive

100: Foreign body emission parts

110: Foreign logistics inbound path

120: foreign matter discharge path

121: Foreign matter discharge path

510: The first pipeline

520: Common Port

530: second pipeline

R1: The first separation space

R2: Second separation space

W: substrate

Claims (14)

A substrate drying chamber, comprising: an upper casing; a lower casing, which is detachably coupled to the upper casing; a sealing member, which is provided on a coupling surface of the lower casing and the upper casing On; a substrate placement board, which is coupled to a bottom surface of the lower housing and a substrate is placed on it, wetted by an organic solvent, a pattern is formed on the substrate; an upper supply port, which is formed in the A central area of the upper casing is directed to the substrate placement plate, and is configured to provide a supply path of a supercritical fluid for drying; an integrated supply/discharge port formed in the lower casing, and It is configured to provide a supply path of a supercritical fluid for initial pressurization according to a supply of the supercritical fluid for drying and a mixing in which the organic solvent is dissolved in the supercritical fluid for drying after the substrate is dried A discharge path for fluid; and a foreign matter discharge member formed in the lower housing and configured to provide foreign matter immersed in the sealing member or present around the sealing member through which foreign matter is introduced and discharged to the outside A path, wherein the foreign matter discharge member includes: a foreign matter inflow path formed vertically along an edge of the lower casing to be positioned below the sealing member, and configured to provide for the foreign matter to be introduced therethrough Path; and a foreign matter discharge path, which is formed to extend from a distal end of the foreign material inflow path to a side surface of the lower shell, and is configured to provide a path through which the foreign matter is discharged to the outside. Such as the substrate drying chamber of claim 1, wherein the integrated supply/discharge port that provides the discharge path of the mixed fluid is opened or closed while the foreign matter discharge part is opened and thus the foreign matter is discharged. The substrate drying chamber of claim 1, wherein the foreign substance inflow path forming the foreign substance discharge member has a shape corresponding to a shape of a groove of the edge of the lower casing. Such as the substrate drying chamber of claim 3, wherein a plurality of vent holes formed vertically are formed in a bottom surface of the groove, and the foreign matter discharge path is communicated with the plurality of vent holes. Such as the substrate drying chamber of claim 1, wherein the sealing member and the foreign flow inflow path are coupled in a dovetail manner, and when the substrate drying chamber is opened due to the separation of the upper casing and the lower casing, Prevent the release of the sealing part. The substrate drying chamber of claim 1, wherein the integrated supply/discharge port is formed to extend from one side surface to the other side surface of the lower casing, and is formed on one of the one side surface and the other side surface Place the board in the middle area to point to the substrate. Such as the substrate drying chamber of claim 6, wherein the integrated supply/discharge port includes: a first pipeline formed from the side surface of the lower housing to the middle area; and a common port formed in the The intermediate zone is connected with the first pipeline and is formed to point to the substrate placement plate; and a second pipeline is configured to connect with the common port and the first pipeline in the intermediate zone And formed to extend to the other side surface of the lower shell. The substrate drying chamber of claim 7, wherein: the first pipeline and the common port provide the supply path of the supercritical fluid for the initial pressurization; and the common port and the second pipeline provide the organic solvent in which the organic solvent is dissolved in the The discharge path of the mixed fluid in the supercritical fluid for drying. Such as the substrate drying chamber of claim 7, wherein the substrate placement plate blocks the supercritical fluid for initial pressurization supplied through the first pipeline and the common port, so that the supercritical fluid for initial pressurization is prevented from being sprayed directly to On the substrate. Such as the substrate drying chamber of claim 1, wherein the substrate is placed on a substrate placement plate that is higher than the coupling surface of the lower casing and the upper casing, and when the drying process ends and the lower casing And when the upper casing is detached from each other, preventing particles around the sealing member provided on the coupling surface from being introduced onto the substrate due to gravity due to a height difference between the substrate and the coupling surface. For example, the substrate drying chamber of claim 1, further comprising a substrate placing board support, the substrate placing board support having one end coupled to the bottom surface of the lower housing and another end coupled to the substrate placing board One end is configured to separate the substrate placing plate from the bottom surface of the lower housing while supporting the substrate placing plate. For example, the substrate drying chamber of claim 11, wherein the substrate placement plate support forms a first separation space between the bottom surface of the lower housing and the substrate placement plate, wherein the first separation space induces penetration through the integrated type The supercritical fluid for initial pressurization supplied by the supply/discharge port moves along a bottom surface of the substrate placement plate to gradually diffuse into a processing area in which the substrate is placed. Such as the substrate drying chamber of claim 1, which further includes a substrate support having one end coupled to a top surface of the substrate placement plate and the other end coupled to the substrate, and is configured To separate the substrate from the top surface of the substrate placement plate while supporting the substrate. The substrate drying chamber of claim 13, wherein the substrate support forms a second separation space between the top surface of the substrate placement plate and the substrate, wherein the second separation space exposes the bottom surface of the substrate to The supercritical fluid for initial pressurization supplied through the integrated supply/discharge port and the supercritical fluid for drying supplied through a nozzle, thereby reducing one time of the drying process.

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