TWI717595B - Carrier for electronic component testing device - Google Patents

Abstract

[ Subject ] To provide a carrier for an electronic component test device that can cope with the thinning of the electronic component under test. [ Solution ] A component carrier 710 for holding IC components with a plurality of terminals HB protruding from the bottom surface on the IC socket 50 installed in the electronic component testing device, including: a thin film 750, which is a sheet-like chip on which IC components are placed The member forms a plurality of small holes 753 corresponding to the positions of the plurality of terminals HB, and constitutes the bottom of the component carrier 710; and the core body 740 is set on the test tray TST carried in the electronic component testing device , And fix the outer peripheral portion 750A of the film 750 with a plurality of shim 749; the lowest point of the shim 749 is set at a higher position than the lowest point of the film 750.

Description

Carrier for electronic component testing device

The invention relates to a carrier for an electronic component testing device.

As a carrier for electronic component testing equipment that transports electronic components under test such as BGA (Ball Grid Array) type IC packages to sockets for electronic components for quality inspection, etc., it is known that the electronic component under test is seated The seat part of the tester is formed with a through hole for exposing the contact part (terminal) of the electronic component under test in the direction of the contact terminal of the socket for the electronic component. The outer peripheral part is fixed to the carrier body (for example, refer to Patent Document 1). [ Prior Patent Document ] [ Patent Document ]

[Patent Document 1] JP 2010-156546 A

[The problem to be solved by the invention ]

In the carrier for the electronic component test device described in Patent Document 1, because the rivet is provided at the bottom of the carrier body, the terminals of the electronic component under test are shortened due to the requirement of thinning of the electronic component under test , There is the possibility of interference between rivets and sockets for electronic components,

The problem to be solved by the present invention is to provide a carrier for an electronic component testing device that can cope with the thinning of the electronic component under test. [ Means to solve the problem ]

[1] The carrier for the electronic component testing device of the present invention holds a plurality of terminals protruding from the bottom surface of the tested electronic component on the socket provided in the electronic component testing device, and includes: a sheet, which is used to mount the tested electronic component The electronic component is formed with a plurality of through holes corresponding to the positions of the plurality of terminals, and constitutes the bottom of the carrier; and the body part is set on the tray carried in the electronic component testing device and borrowed A shim piece fixes the outer periphery of the shim; the lowest point of the shim is set at a higher position than the lowest point of the shim.

[2] In this invention, an inclined surface may be formed on the bottom surface of the main body portion so as to be inclined from the inner peripheral side to the outer peripheral side of the bottom surface to the high side; the plurality of shim pieces are formed on the inclined surface.

[3] In this invention, the plurality of shims are formed on the side surface of the main body.

[4] It is also possible in the invention to form a stepped portion on the bottom surface of the main body such that the height of the bottom surface on the outer peripheral side of the stepped portion becomes higher than the height of the bottom surface on the inner peripheral side of the stepped portion. ; The plurality of shims are formed on the bottom surface than the step portion on the outer peripheral side.

[5] In this invention, the sheet is a film, and the outer peripheral part is fixed to the main body part by the plurality of shimming sheets in a state of being given tension. [ Effects of the invention ]

According to the present invention, because the lowest point of the shim piece that fixes the outer periphery of the sheet to the main body is set to a higher position than the lowest point of the sheet, regardless of the protruding height of the terminal of the electronic component under test from the bottom surface, Both can prevent the interference between the shim and the socket. This can cope with the thinning of the electronic components under test.

Hereinafter, an embodiment of the present invention will be described based on the drawings. Fig. 1 is a schematic cross-sectional view showing an electronic component testing device using a component carrier according to an embodiment of the present invention. Fig. 2 is a perspective view showing the electronic component testing device of Fig. 1. Fig. 3 is a schematic diagram for explaining the transfer of the tray of the electronic component testing device in Figs. 1 and 2.

The electronic component testing device shown in Figures 1 and 2 applies high temperature or low temperature thermal stress to the IC component, and uses the test head 5 and the tester 6 to test (check) whether the IC component operates properly in this state. Moreover, this electronic component testing device classifies IC components based on the test results.

In the electronic component testing device, a plurality of IC components to be tested are mounted on the customized tray KST (refer to Figure 5). In addition, in the processor 1 of the electronic component testing device, a pallet KST cycle is ordered (refer to Fig. 6). IC components are transferred from the customized tray KST to the test tray TST and tested. In addition, the IC element is represented by the symbol IC in the figure.

As shown in Fig. 1, a space 8 is provided under the processor 1, and a test head 5 is arranged in this space 8. An IC socket 50 is provided on the test head 5, and the IC socket 50 is connected to the tester 6 via a cable 7.

In this electronic component testing device, the IC components loaded on the test tray TST are in contact with the IC socket 50 on the test head 5 to be electrically connected, and the IC components in this state are supplied with electrical signals, and then according to the output from the tester 6 The signal, test (check) IC components. In addition, when the type of IC component is changed, the IC socket 50 and the core 730 described later are replaced with those suitable for the shape or the number of pins of the IC component.

As shown in FIGS. 2 and 3, the processor 1 includes a storage unit 200, a loading unit 300, a testing unit 100, and an unloading unit 400. The storage unit 200 stores IC components before or after the test. The loading unit 300 transfers the IC components transferred from the storage unit 200 to the testing unit 100. The test unit 100 is configured such that the IC socket 50 of the test head 5 faces the inside. The unloading unit 400 classifies the tested IC components that have been tested in the testing unit 100.

Fig. 4 is an exploded perspective view showing the IC storage used in the above-mentioned electronic component testing device. Fig. 5 is a perspective view showing a customized tray used in the above-mentioned electronic component testing device. As shown in FIG. 4, the storage unit 200 includes a pre-test storage 201 and a test-complete storage 202. The pre-test storage 201 is a customized tray KST for storing IC components before testing. After the test, the storage 202 stores a customized tray KST for storing IC components classified according to the test results. The pre-test storage 201 and the completed storage 202 include a frame-shaped tray support frame 203 and an elevator 204 that enters from the lower part of the tray support frame 203 and lifts upward. In the tray support frame 203, a plurality of customized trays KST are stacked. The stacked customized tray KST is moved up and down by the elevator 204. In addition, as shown in Fig. 5, the customized tray KST includes a plurality of recessed accommodating portions for accommodating IC components. The plurality of receiving parts are arranged in a plurality of rows and rows (for example, 14 rows and 13 rows). In addition, the pre-test storage 201 and the completed storage 202 have the same structure.

As shown in Figures 2 and 3, in the pre-test storage 201, two storage storage STK-B and two empty tray storage STK-E are set up. The two storage warehouses STK-B are adjacent to each other. Beside the two storage warehouses STK-B, the two empty tray storage warehouses STK-E are adjacent to each other. The empty tray storage STK-E is an empty customized tray KST that is stacked and transferred to the unloading part 400.

Next to the pre-test storage 201, a tested storage 202 is set. After testing the storage 202 here, 8 storages STK-1, STK-2,..., STK-8 are set. After the test, the storage 202 is configured to classify and store the tested IC components into 8 types at most according to the test results. For example, the tested IC components are in the storage 202 after the test. In addition to being classified into good and defective products, they can also be classified into good products with high speed, good products with medium speed, and low speed. Good products may be classified into defective products that need to be re-tested and defective products that do not need to be re-tested.

As shown in FIG. 2, the tray transfer arm 205 is provided between the storage unit 200 and the device base 101. The tray transfer arm 205 transfers the customized tray KST from the lower side of the device base 101 to the loading unit 300. Here, in the device base 101, a pair of window portions 370 are formed. The pair of window portions 370 arranges the customized tray KST transferred from the lower side of the device base 101 to the loading portion 300 by the tray transfer arm 205 to face the upper surface of the device base 101.

The loading unit 300 includes a component transport device 310. The component transport device 310 includes two rails 311, a movable arm 312, and a movable head 320. The two rails 311 are erected on the device base 101. The movable arm 312 reciprocates between the test tray TST and the customized tray KST along the two rails 311. In addition, the moving direction of the movable arm 312 is referred to as the Y direction. The movable head 320 is supported by the movable arm 312 and moves in the X direction. On the movable head 320, a plurality of suction pads (not shown) are mounted downward.

The component conveying device 310 moves the movable head 320 that has adsorbed a plurality of IC components with a plurality of suction pads from the order tray KST to a position corrector 360. Thereby, the IC component is transferred from the order tray KST to the position corrector 360. Next, the component carrier 310 is attached to the position corrector 360, and the positional relationship between the IC components is corrected by the movable arm 312 and the movable head 320. Then, the component conveying device 310 transfers the IC components to the test tray TST stopped in the loading unit 300. Thereby, the IC components are transferred from the order tray KST to the test tray TST.

As shown in FIG. 2 and FIG. 3, the test unit 100 includes a temperature environment chamber 110, a test chamber 120 and a normal temperature recovery chamber 130. The temperature environment chamber 110 applies a target high temperature or low temperature thermal stress to the IC components mounted on the test tray TST. The test chamber 120 presses the IC component that is thermally stressed in the temperature environment chamber 110 against the test head 5. The room temperature recovery chamber 130 removes thermal stress from the IC components that have been tested in the test chamber 120.

When a high temperature is applied to the IC element in the temperature environment chamber 110, the IC element is cooled to room temperature by blowing air in the normal temperature recovery chamber 130. On the other hand, when a low temperature is applied to the IC element in the temperature environment chamber 110, the IC element is heated by warm air or a heater in the normal temperature recovery chamber 130 to a temperature at which condensation does not occur.

As shown in FIG. 2, the temperature environment chamber 110 and the normal temperature recovery chamber 130 protrude more upward than the test chamber 120. Also, as shown schematically in Fig. 3, a vertical conveying device is installed in the temperature environment room 110, the first test tray TST exists between the test chambers 120, and the subsequent test trays TST are vertically conveyed by the device. Stand by in a supported state. The IC components mounted on the subsequent test trays TST are subjected to high temperature or low temperature thermal stress during standby.

In the center of the test chamber 120, a test head 5 is arranged. The test tray TST is transferred onto the test head 5. In the center of the test chamber 120, the terminal HB of the IC component mounted on the test tray TST (refer to Figures 16 and 17) and the terminal 51 of the IC socket 50 on the test head 5 (refer to Figures 16 and 17) Figure) Contact and test IC components. The test tray TST mounted on the tested IC component is transferred to the room temperature recovery room 130. In the room temperature recovery room 130, the IC components after the test are deheated to room temperature. The test tray TST mounted on the IC component that has been deheated is carried out to the unloading unit 400.

In the upper part of the temperature environment chamber 110, an entrance for carrying the test tray TST from the device base 101 into the temperature environment chamber 110 is formed. On the other hand, in the upper part of the normal temperature recovery chamber 130, an outlet for carrying the test tray TST out of the normal temperature recovery chamber 130 to the device base 101 is formed.

As shown in FIG. 2, the pallet conveying device 102 is installed on the device base 101. The tray transfer device 102 transfers the test tray TST from the device base 101 into the temperature environment chamber 110 and unloads the test tray TST from the normal temperature recovery room 130 to the device base 101. This pallet conveying device 102 is constituted by, for example, rotating rollers.

After the test tray TST is transferred from the normal temperature recovery room 130 to the device base 101 by the tray transfer device 102, all the IC components mounted on the test tray TST are transferred by the component transfer device 410 (described later) to correspond to the test result The customized pallet KST. Then, the test tray TST is transferred to the temperature environment chamber 110 via the unloading unit 400 and the loading unit 300.

As shown in FIG. 2, two component transport devices 410 are installed in the unloading unit 400. The component transport device 410 has the same structure as the component transport device 310 installed in the loading section 300. The two component transport devices 410 transfer the tested IC components from the test tray TST existing in the device base 101 to the customized tray KST corresponding to the test result.

Two pairs of windows 470 are formed on the device base 101. The two pairs of window parts 470 are arranged so that the ordered tray KST transferred to the unloading part 400 faces the upper surface of the device base 101. An unshown elevating workbench is installed under the two pairs of windows 470 and the aforementioned window 370. This lifting table lowers the customized tray KST mounted on the tested IC components and transfers it to the tray transfer arm 205.

Figure 6 is a perspective view showing the test tray TST. As shown in Figure 6, the test tray TST includes a rack 700 and a plurality of component carriers 710. The rack 700 includes a rectangular outer frame 701 and an inner frame 702 arranged in a lattice shape in the outer frame 701. The frame 700 includes a rectangular opening 703 that is divided into a plurality of columns and rows by an outer frame 701 and an inner frame 702.

The plural component carriers 710 are arranged in plural columns and plural rows. Each component carrier 710 is arranged to correspond to each opening 703 of the rack 700. The component carrier 710 includes a main body 720 and a plurality of cores 730 (for example, 4 as shown in FIG. 6). The main body 720 is a rectangular plate-shaped resin molded body, and a plurality of rows (two rows and two rows in this embodiment) form rectangular openings 721 having the same number (four in this embodiment) as the core 730.

The plural bodies 720 are arranged on the lower side of the rack 700 in plural rows and plural rows. The main body 720 located at the outermost ring is arranged such that its outer periphery overlaps with the outer frame 701 or the inner frame 702, and the plurality of openings 721 overlap with the openings 703 of the frame 700. On the other hand, the other main body 720 is arranged such that the outer periphery thereof overlaps the inner frame 702, and the plurality of openings 721 overlap the opening 703 of the frame 700. These plural bodies 720 are fixed to the intersection of the outer frame 701 and the inner frame 702 and the intersection of the inner frame 702 on the frame 700.

Fig. 7 is an enlarged perspective view showing a part of the test tray TST. As shown in FIG. 7, the core 730 is detachably attached to the main body 720. The core 730 is configured to correspond to the respective openings 721, and is mounted to the main body 720 so as to be capable of fine movement (swimming) in a plane (in the X-Y plane in FIG. 7). The core 730 includes a core body (body part) 740 and a film (sheet) 750. The core body 740 is a resin molded body with a rectangular opening (through hole) 741 formed therein. A plurality of claw portions 742 and a plurality of guide portions 743 are formed on the outer peripheral portion of the core body 740. The main body 720 is formed with an engagement portion (not shown) to which the claw portion 742 is engaged, and a guide groove 722 into which the guide portion 743 is inserted. The core body 740 is supported by the main body 720 by the claw portion 742 being engaged with the engaging portion. When the core body 740 is mounted on the body 720, the guide portion 743 is inserted into the guide groove 722, and the core body 740 is pressed into the opening 721, whereby the claw portion 742 can be engaged with the engaging portion. On the other hand, by releasing the engagement between the claw portion 742 and the engaging portion, the core body 740 can be removed from the body 720.

Here, the engagement between the claw portion 742 and the engagement portion, and the engagement between the guide portion 743 and the guide groove 722 do not fix the core body 740 and the body 720, but allow the core body 740 and the body 720 to be relatively different. Fretting (swimming) in the plane. Thereby, as described later, the relative positioning of the core 730 and the IC socket 50 can be performed.

The film 750 is a rectangular film-shaped resin molded body. By fixing the outer peripheral part of the film 750 to the bottom of the core body 740, the film 750 constitutes the bottom of the core 730. IC components are placed on this film 750.

Fig. 8 is a perspective view showing the core 730 from the bottom side. Fig. 9 shows a bottom view of the core 730. FIG. 10 is a plan view showing the core 730. Fig. 11 shows a front view of the core 730. Fig. 12 shows a side view of the core 730. Figure 13 is the section 13-13 of Figure 9. Fig. 14 is an enlarged cross-sectional view showing a part of Fig. 13. As shown in these figures, the core body 740 includes a rectangular ring-shaped frame portion 744 forming the aforementioned opening 741, a pair of positioning plates 745 and 746, and a pair of rod receiving portions 747 and 748.

A plurality of shim pieces 749 are provided on the bottom surface (lower end surface) of the frame portion 744. The shim 749 is provided at the four corners of the bottom surface of the frame 744 and each side of the bottom surface of the frame 744. A plurality of pieces (for example, two pieces as shown in the figure) shim pieces 749 are provided on each side of the bottom surface of the frame portion 744. In contrast, in the outer peripheral portion 750A of the film 750, a plurality of openings 751 are formed in a manner corresponding to the positions of the shim 749. Each shim 749 includes a trunk portion 7491 (see FIG. 14) having a circular cross-sectional shape, and a head 7492 having a circular cross-sectional shape. The torso portion 7491 protrudes downward from the bottom surface of the frame portion 744 and is inserted through the opening 751 of the film 750. The head 7492 is larger in diameter than the trunk 7491 and the opening 751, and widens in the radial direction from the front end (lower end) of the trunk 7491. Thereby, the bottom surface of the head 7492 and the frame 744 sandwich the outer peripheral portion 750A of the film 750. In addition, the details of the structure of the outer peripheral portion 750A of the film 750, the bottom surface of the frame portion 744, and the shim 749 will be described later.

The positioning plate 745 is disposed on the upper end of the first side wall 7441 of the frame 744. The other positioning plate 746 is provided on the upper end of the second side wall 7442 of the frame 744. The first side wall 7441 and the second side wall 7442 face each other. The positioning plate 745 protrudes from the upper end of the first side wall 7441 to the opposite side of the opening 741, and the other positioning plate 746 protrudes from the upper end of the second side wall 7442 to the opposite side of the opening 741. A pair of guide portions 743 are provided on the upper surfaces of the positioning plates 745 and 746, respectively.

Claws 742 are provided at one end and the other end of the positioning plates 745 and 746 in the longitudinal direction, respectively. That is, the four claw portions 742 are arranged on the diagonal of the opening 741. A pair of claws 742 arranged at the opposite corners are arranged opposite to each other. On the other hand, the claw portions 742 adjacent to each other are arranged such that the directions differ by only 90°.

The positioning plates 745 and 746 are rectangular plates, and the direction along the first side wall 7441 and the second side wall 7442 is defined as the longitudinal direction, and the direction orthogonal to the first side wall 7441 and the second side wall 7442 is defined as the width direction. A positioning hole 7451 is formed at the center of the positioning plate 745 in the longitudinal direction, and a positioning hole 7461 is formed at the center of the positioning plate 746 in the longitudinal direction. The positioning hole 7451 is a circular through hole. On the other hand, the positioning hole 7461 is an elliptical through hole. The length direction of the positioning hole 7461 is consistent with the width direction of the positioning plate 746. The core 730 is positioned in the IC socket 50 by inserting the positioning pin 55 described later into the positioning hole 7451 and inserting the positioning pin 56 described later into the positioning hole 7461.

The rod receiving portion 747 is provided on the third side wall 7443 of the frame portion 744. The other rod receiving portion 748 is provided on the fourth side wall 7444 of the frame portion 744. The third side wall 7443 and the fourth side wall 7444 are opposed to each other. The lower part of the rod accommodating part 747 is provided to protrude from the third side wall 7443 to the opposite side of the opening 741, and the upper part of the rod accommodating part 747 is provided to protrude upward from the third side wall 7443. The rod accommodating part 747 is formed in a rectangular box shape, and the rod 760 is accommodated inside. The lower part of the other rod accommodating portion 748 is provided to protrude from the fourth side wall 7444 to the opposite side of the opening 741, and the upper part of the rod accommodating portion 748 is provided to protrude upward from the upper end of the fourth side wall 7444. The rod accommodating part 748 is formed in a rectangular box shape, and the rod 761 is accommodated inside. The rod 760 has the same structure as the rod 761, and is arranged symmetrically.

At the center of the third side wall in the width direction, an opening 7443A is formed. In addition, an opening 747A is formed in the central part of the lower part of the rod receiving part 747 in the horizontal direction. On the other hand, an opening 7444A is formed in the center of the fourth side wall in the width direction. In addition, an opening 748A is formed in the center part of the lower part of the rod receiving part 748 in the horizontal direction. The rod 760 accommodated in the rod accommodating portion 747 is configured to be able to advance and retreat to the opening 741 through the opening 7443A. The rod 760 receives external force through the opening 747A, thereby retreating from the opening 741 into the rod accommodating portion 747, and by removing the external force, advances into the opening 741 through the opening 7443A. On the other hand, the rod 761 accommodated in the rod accommodating portion 748 is configured to be able to advance and retreat to the opening 741 through the opening 7444A. The rod 761 receives an external force through the opening 748A, thereby retreating from the opening 741 into the rod receiving portion 748, and by removing the external force, it advances into the opening 741 through the opening 7444A. A pair of rods 760 and 761 that are advanced into the opening 741 are pressed against the outer periphery of the IC device on the film 750 by the biasing force of the spring. Thereby, the IC element on the film 750 is pressed by a pair of rods 760 and 761.

At the center of the film 750, a rectangular opening 752 is formed. Here, a light sensor (not shown) is set at a predetermined position of the electronic component testing device, and the core 730 stops at the position of the light from the light sensor or the position of the light passing through the light sensor. The light sensor includes a light-emitting part and a light-receiving part facing upward and downward, and emits light at a timing when the opening 752 is located between the light-emitting part and the light-receiving part. In the case where the IC element is present on the film 750, since the light is blocked by the IC element, the IC element is detected. On the other hand, when the IC element is not present on the film 750, the light emitted from the light-emitting portion passes through the opening 752 and is received by the light-receiving element, so the IC element is not detected.

A plurality of small holes 753 are formed between the opening 752 of the film 750 and the outer peripheral portion 750A. The plurality of small holes 753 are provided to correspond to the plurality of spherical terminals HB provided on the bottom surface of the IC element. The diameter of the small hole 753 is set to be larger than the diameter of the terminal HB. Thereby, the terminal HB protrudes from the film 750 to the IC socket 50 side through the small hole 753. In addition, in this embodiment, since the plurality of terminals HB of the IC element are arranged in plural rows in a rectangular ring shape, the plurality of small holes 753 are arranged in plural rows in a rectangular ring shape. However, the arrangement of the terminal HB and the small hole 753 of the IC element is not limited to the arrangement of this embodiment, and can be changed as appropriate.

As shown in FIG. 14, on the bottom surface of the frame portion 744, a flat surface portion 7445 on the inner peripheral side and a slope portion 7446 on the outer peripheral side are formed. The part between the opening 751 of the film 750 and the small hole 753 abuts against the flat surface 7445. The inclined surface portion 7446 is inclined upward from the outer peripheral side of the flat surface portion 7445 to the frame portion 744. A shim 749 is formed on the inclined surface 7446. Specifically, not only the trunk portion 7491 of the shim 749 protrudes downward from the inclined surface portion 7446, but also the head 7492 of the shim piece 749 does not enter the flat portion 7445 and is formed in the inclined surface 7446.

Here, at the head 7492 of the shim 749, a horizontal plane 7492A is formed. The height position of this horizontal plane 7492A is set to be higher than the plane portion 7445. In addition, the film 750 includes an outer peripheral portion 750A that is inclined by abutting against the inclined surface portion 7446, and a flat surface portion 750B inside the outer peripheral portion 750A. The outer peripheral portion of the upper surface of this flat portion 750B abuts on the flat portion 7445. Therefore, the height of the bottom surface of the flat portion 750B is set to a position where the thickness of the thin film 750 is added to the flat portion 7445 to a low position. Therefore, the height of the lowest part (lowest point) of the shim 749 is set to a higher position than the height of the lowest part (lowest point) of the film 750.

Here, at the position of the opening 751 closer to the outer peripheral side of the film 750 than the center, the edge of the opening 751 is suspended from the trunk portion 7491, thereby applying tension to the film 750. The relative position of the trunk portion 7491 and the opening 751 or the diameter of the trunk portion 7491 and the opening 751 are set to form this state. As a method of setting the relative position of the trunk 7491 and the opening 751, for example, a method of setting the opening 751 at a position closer to the outer periphery of the film 750 than the center to form a gap between the edge of the opening 751 and the trunk 7491 . In addition, at a position closer to the outer periphery of the film 750 than the center of the opening 751, the edge of the opening 751 may be in contact with the trunk 7491. In this case, the contact pressure between the edge of the opening 751 near the center of the film 750 and the trunk 7491 needs to be smaller than the contact pressure between the edge of the opening 751 near the outer periphery of the film 750 and the trunk 7491.

FIG. 15 is an enlarged plan view showing the four corners of the bottom of the component carrier 710. As shown in FIG. 15, slits 754 are formed at the four corners of the film 750, respectively. At the four corners of the outer periphery of the film 750, there is a pair of extension lines of the boundary between the outer periphery 750A of the film 750 and the flat portion 750B. The four corners of the outer periphery of the film 750 are divided by a pair of the extension lines. When forming a rectangle, the extension line of one side overlaps the opening 751, and the extension line of the other side does not overlap the opening 751. A slit 754 is formed on an extension line that does not overlap with this opening 751.

Here, when the outer peripheral portion 750A of the film 750 applied with tension is inclined, the slits 754 are not formed in the four corners of the outer peripheral portion 750A of the film 750, and the slits 754 are formed at the four corners of the outer peripheral portion 750A of the film 750. wrinkle. In contrast, in the present embodiment, by forming slits 754 at the four corners of the outer peripheral portion 750A of the film 750, respectively, it is possible to prevent the occurrence of wrinkles at the four corners of the outer peripheral portion 750A of the film 750.

Figures 16 and 17 are cross-sectional views showing the state of testing (inspecting) IC components. As shown in FIG. 16, a pair of positioning pins 55 and 56 are set on the test head 5 in such a manner as to clamp a set of opposite sides of the rectangular IC socket 50. The positioning pin 55 on one side is fitted with the positioning hole 7451 of the core body 740, and the positioning pin 56 on the other side is fitted with the positioning hole 7461 of the other side. Thereby, the relative position of the core body 740 and the IC socket 50 is determined so that the terminal HB of the IC element is in contact with the terminal 51 of the IC socket 50.

As shown in FIG. 17, the pair of rods 760 and 761 that have advanced into the opening 741 are pressed against the outer periphery of the IC device on the film 750 by the biasing force of a spring not shown. Thereby, the IC component on the IC socket 50 is pressed by the pair of rods 760 and 761.

As shown in FIG. 16 and FIG. 17, the push rod 121 is installed above the IC socket 50 so as to be liftable. The push rod 121 is installed in a Z-axis driving device (for example, a fluid cylinder) not shown. When testing an IC component, the Z-axis driving device uses the push rod 121 to press the IC component onto the IC socket 50.

The IC socket 50 has a structure in which a plurality of terminals 51 are buried in an insulating sheet-shaped base material. The terminal 51 is composed of a conductive elastic member. The conductive elastic member constituting the terminal 51 can be exemplified by adding a conductive filler to synthetic rubber, or adding a conductive filler to synthetic resin such as polyester. The number and arrangement of the plurality of terminals 51 are set to correspond to the number and arrangement of the plurality of terminals HB of the IC component.

The test of the IC component is performed by the tester 6 in a state where the terminal HB of the IC component and the terminal 51 of the IC socket 50 are in electrical contact. The test result of the IC component is memorized in an address determined, for example, based on the identification number attached to the test tray TST and the number of the IC component allocated in the test tray TST.

Here, by setting the lowest part (lowest point) of the shim 749 at a higher position than the lowest part (lowest point) of the film 750, and the lowest part of the shim 749 is located higher than the IC device The front end (lower end) of the terminal HB is at a higher position. Thereby, regardless of the protruding height of the terminal HB from the bottom surface of the IC element, the gap between the gap filler 749 and the upper surface of the IC socket 50 can be ensured.

FIG. 18 is a perspective view for explaining the method of mounting the film 750 on the core body 740. FIG. 19 is a cross-sectional view for explaining the method of mounting the film 750 to the core body 740. As shown in these figures, the outer peripheral portion 750A of the film 750 is fixed to the inclined surface portion 7446 of the core body 740 by thermal caulking. First, as shown in FIG. 18, the film 750 and the core body 740 are prepared. A plurality of openings 751 are formed in the outer periphery of the film 750. On the slope 7446 of the core body 740, a plurality of protrusions 749B are formed. The positions of the plurality of protrusions 749B correspond to the positions of the plurality of openings 751. In addition, an opening 749H is formed at the axis of the protrusion 749B.

Next, the film 750 is placed on the bottom of the core body 740. At this time, after aligning the positions of the plurality of protrusions 749B with the plurality of openings 751, all the protrusions 749B are inserted into the openings 751.

Then, as shown in FIG. 19, a shim 749 having a trunk 7491 and a head 7492 with a larger diameter than the trunk 7491 is formed, whereby the shim 749 and the inclined surface 7446 of the core body 740 sandwich the film 750 With this, the outer peripheral portion 750A of the film 750 is fixed to the inclined surface portion 7446 of the core body 740. In this step, a resin thermal caulking device not shown is used to pressurize the protrusion 749B from the front end side to the base end side to cause thermal deformation, thereby forming the shim 749. At this time, by forming an opening 749H in the axial center of the protrusion 749B, thermal deformation of the protrusion 749B that expands in the outer diameter direction is promoted compared to a solid protrusion.

Here, the size of the protrusion 749B and the conditions for thermal caulking are set so that the core 730 becomes a state where the film 750 faces upward, and the height of the horizontal plane 7492A of the shim 749 is greater than that of the flat portion 750B of the film 750. The height above is higher. In addition, the relative position of the opening 751 and the trunk portion 7491, the diameter of the opening 751 and the trunk portion 7491, the conditions for thermal caulking, etc., are set at a position closer to the outer peripheral side of the film 750 than the center of the opening 751. The edge of the 751 is suspended from the trunk 7491 to apply tension to the film 750.

As shown in the above description, in the component carrier 710 of this embodiment, the lowest point of the shim 749 is set higher than the lowest point of the film 750, and the lowest point of the shim 749 is located at a higher position than the lowest point of the film 750. The front end (lower end) of the terminal HB of the IC component is at a higher position. Thereby, regardless of the protruding height of the terminal HB from the bottom surface of the IC element, the gap between the gap filler 749 and the upper surface of the IC socket 50 can be ensured. Therefore, it can cope with the thinning of IC components, especially the dwarfing of terminals HB.

Here, it is also conceived that the outer peripheral portion of the film 750 is adhered to the bottom surface of the frame portion 744 without the need for a shim, so as to cope with the thinning of the IC device. However, in this case, wrinkles may be generated in the film 750 due to shrinkage of the adhesive. In contrast, in the component carrier 710 of this embodiment, by fixing the outer peripheral portion 750A of the film 750 to the bottom surface of the frame portion 744 through the shim 749, it is possible to prevent wrinkles from being generated in the film 750 as in the case of using an adhesive.

In addition, in the component carrier 710 of the present embodiment, the thin film 750 is made of the thin sheet constituting the bottom of the core 730. Compared with the case where the thin sheet is made of a thin metal material, the thin sheet is easy to be thinned and can be easily bent. The outer periphery of the sheet is 750A. Therefore, it can cope with the dwarfing of the terminal HB of the IC element and reduce the manufacturing cost of the sheet.

Furthermore, in the component carrier 710 of the present embodiment, the outer peripheral portion 750A of the film 750 is fixed to the bottom surface of the frame portion 744 by the shim 749 in a state where the film 750 is applied with tension. In this way, the positioning accuracy of the small holes 753 of the film 750 in the plane and in the height direction can be ensured. In particular, in the component carrier 710 of the present embodiment, on the bottom surface of the frame portion 744, the inclined surface portion 7446 is formed to be inclined from the inner peripheral side to the outer peripheral side of the bottom surface to the high side, and the inclined surface portion 7446 is formed in plural Piece shim 749. Therefore, by tilting the outer peripheral portion 750A of the film 750 to the flat portion 750B at an angle of less than 90∘, and suspending the opening 751 of the outer peripheral portion 750A from the trunk portion 7491 of the shim 749, it can be realized that the film 750 The outer peripheral portion 750A of the film 750 is fixed to the bottom surface of the frame portion 744 by the shim 749 in the state of applying tension. Therefore, the inclination angle of the outer peripheral portion 750A of the film 750 to the flat portion 750B is 90∘ or more. Compared with the case where the step portion is formed between the outer peripheral portion 750A and the flat surface 750B of the film 750, the film 750 can be easily provided. And tension, and to ensure the position accuracy of the film 750.

FIG. 20 is a cross section showing the first modification of the core 730. As shown in FIG. 20, in the core 730 of the first modification, the outer peripheral portion 750A of the film 750 is bent at a right angle, and is fixed to the side surface of the frame portion 744 by the shim 749. In the core 730 of the first modification, the relative position of the trunk 7491 and the opening 751 or the diameter of the trunk 7491 and the opening 751 are also set to be closer to the outer peripheral side of the film 750 than the center of the opening 751 (refer to Figure 19) The position of the film 750 is suspended from the torso 7491 by the edge of the opening 751 (refer to Figure 19) to apply tension to the film 750.

Here, although illustration is omitted, the four corners of the outer peripheral portion 750A of the film 750 are formed with rectangular notches. This prevents the occurrence of wrinkles in the outer peripheral portion 750A of the film 750 that has been given tension at a right angle.

In the core 730 of the first modification, by setting the lowest point of the shim 749 to a higher position than the lowest point of the film 750, the lowest point of the shim 749 is arranged higher than the terminal HB of the IC element. A higher position at the bottom. Thereby, regardless of the protruding height of the terminal HB from the bottom surface of the IC element, the gap between the gap filler 749 and the upper surface of the IC socket 50 can be ensured.

Fig. 21 is a cross-sectional view showing a second modification of the core 730. As shown in Fig. 21, in the core 730 of the second modification, a step portion 7448 is formed on the bottom surface of the frame portion 744, and a flat portion 7445 on the inner peripheral side than this step portion 7448 is formed, and a step portion 7448 is formed. The flat portion 7447 on the outer peripheral side. The step portion 7448 is an inclined surface inclined upward from the inner peripheral side to the outer peripheral side. That is, the height of the flat portion 7447 on the outer peripheral side is set to a higher position than the flat portion 7445 on the inner peripheral side. The shim 749 is formed on the flat portion 7447 on the outer peripheral side.

The outer peripheral portion 750A of the film 750 is curved along the bottom surface of the frame portion 744, and is fixed to the flat portion 7447 on the outer peripheral side by the shim 749. In the core 730 of the second modification, the relative position of the trunk 7491 and the opening 751 or the diameter of the trunk 7491 and the opening 751 is also set to be closer to the outer peripheral side of the film 750 than the center of the opening 751 (refer to Figure 19) At the position of the film 750, tension is applied to the film 750 by suspending the edge of the opening 751 from the trunk 7491 (refer to Figure 19).

Here, although illustration is omitted, the four corners of the outer peripheral portion 750A of the film 750 are formed with slits 754 in the same manner as in the above-mentioned embodiment. This prevents wrinkles from occurring in the curved outer peripheral portion 750A of the film 750 to which the tension is applied.

The height of the horizontal plane 7492A of the head 7492 of the shim 749 is set at a higher position than the flat portion 7445. The outer peripheral portion of the upper surface of the flat portion 750B of the film 750 abuts the flat portion 7445. Therefore, the height of the lower surface of the flat portion 750B of the film 750 is set to a position where the thickness of the flat portion 7445 is low by adding only the thickness of the film 750. Therefore, the lowest point of the shim 749 is set at a higher position than the lowest point of the film 750. Thereby, regardless of the protruding height of the terminal HB from the bottom surface of the IC element, the gap between the gap filler 749 and the upper surface of the IC socket 50 can be ensured.

In addition, the above-described embodiments are described in order to facilitate the understanding of the present invention, and are not intended to limit the description of the present invention. Therefore, the elements disclosed in the above-mentioned embodiments also include all design changes or equivalents belonging to the technical scope of the present invention.

For example, in the above-mentioned embodiment, the thin film 750 constitutes the bottom of the core 730, but it is also possible to constitute the thin metal. In addition, the core 730 is mounted on the test tray TST via the main body 720, but the core 730 may be directly mounted on the test tray TST. In this case, it is only necessary to mount the core 730 to the test tray TST so as to be able to move (swim) slightly in the plane.

1‧‧‧Processor 5‧‧‧Test head 6‧‧‧Tester 7‧‧‧Cable 50‧‧‧IC socket 51‧‧‧Terminal 55‧‧‧Locating pin 100‧‧‧Test part 101‧‧‧ Device base 102‧‧‧Pallet handling device 110‧‧‧Temperature environment room 120‧‧‧Test room 121‧‧‧Push rod 130‧‧‧Normal temperature recovery room 200‧‧‧Storage part 201‧‧‧Pre-test storage 202‧‧‧After testing storage warehouse 203‧‧‧pallet support frame 204‧‧‧lift 205‧‧‧pallet transfer arm 300‧‧‧loading part 310‧‧‧component handling device 311‧‧‧rail 312‧‧movable Arm 320‧‧‧Movable head 360‧‧‧Position corrector 370‧‧‧Window 400‧‧‧Unloading part 410‧‧‧Component handling device 470‧‧‧Window TST‧‧‧Test tray 700‧‧‧machine frame

701: Outer Frame

702: inner frame

703: open

710: Component Carrier

720: body

721: open

722: guide groove

730: Core

740: Core body (body part)

741: open

742: Claw

743: Guiding Department

744: frame

7441: 1st side wall

7442: 2nd side wall

7443: 3rd side wall

7443A: opening

7444: 4th side wall

7444A: opening

7445: Plane Department

7446: oblique face

7447: Plane Department

7448: step section

745, 746: positioning plate

7451, 7461: positioning hole

747, 748: pole housing

747A, 748A: opening

749: shim

7491: Torso

7492: head

7492A: horizontal plane

750: Film (sheet)

751, 752: Opening

753: small hole

754: Slit

760, 761: pole

Fig. 1 is a schematic cross-sectional view showing an electronic component testing device using a component carrier according to an embodiment of the present invention. Fig. 2 is a perspective view showing the electronic component testing device of Fig. 1. Fig. 3 is a schematic diagram for explaining the transfer of the tray of the electronic component testing device in Figs. 1 and 2. Fig. 4 is an exploded perspective view showing the IC storage used in the above-mentioned electronic component testing device. Fig. 5 is a perspective view showing a customized tray used in the above-mentioned electronic component testing device. Figure 6 is a perspective view of the test tray. Fig. 7 is an enlarged perspective view showing a part of the test tray. Fig. 8 is a perspective view showing the core from the bottom side. Figure 9 shows a bottom view of the core. Figure 10 is a plan view showing the core. Figure 11 shows a front view of the core. Figure 12 shows a side view of the core. Figure 13 is the section 13-13 of Figure 9. Fig. 14 is an enlarged cross-sectional view showing a part of Fig. 13. Figure 15 is an enlarged plan view showing the four corners of the bottom of the component carrier. Figure 16 is a cross-sectional view showing the state of testing (inspecting) IC components. Figure 17 is a cross-sectional view showing the state of testing (inspecting) IC components. Figure 18 is a perspective view for explaining the method of mounting the film on the core body. Figure 19 is a cross-sectional view for explaining the method of mounting the film on the core body.

Figure 20 is a cross section showing the first modification of the core.

Figure 21 is a cross-sectional view showing a second modification of the core.

50‧‧‧IC socket

51‧‧‧Terminal

121‧‧‧Putter

730‧‧‧Core

742‧‧‧Claw

7441‧‧‧First side wall

7443A‧‧‧Opening

7444A‧‧‧Opening

7446‧‧‧Slanted face

747, 748‧‧‧ pole housing

749‧‧‧Shim

7492‧‧‧Head

750A‧‧‧peripheral part

760, 761‧‧‧ bar

IC‧‧‧Component

HB‧‧‧Terminal

Claims (5)

A carrier for an electronic component testing device is installed on a rack of a tray carried by the electronic component testing device, and a socket of the electronic component testing device holds a plurality of tested electronic components whose terminals protrude from the bottom surface. It includes: a sheet, which mounts the electronic component to be tested, forms a plurality of through holes corresponding to the positions of the plurality of terminals, and forms the bottom of the carrier; and a body part, which is fixed by a plurality of shim The outer periphery of the sheet; the lowest point of the shim is set at a higher position than the lowest point of the sheet. For example, the carrier for the electronic component test device of the first item of the scope of patent application, wherein the bottom surface of the main body portion is inclined from the inner peripheral side to the outer peripheral side of the bottom surface to the high side; the plurality of gap fillers The sheet is formed on the inclined surface. For example, the carrier for the electronic component testing device in the first item of the scope of patent application, wherein the plurality of shim pieces are formed on the side surface of the main body. For example, the carrier for the electronic component test device of the first item of the scope of patent application, wherein the bottom surface of the main body portion has the height of the bottom surface on the outer peripheral side than the stepped portion becomes greater than the bottom surface on the inner peripheral side of the stepped portion The stepped portion is formed in a way of higher height; the plurality of shims are formed on the bottom surface on the outer peripheral side of the stepped portion. For example, the carrier for the electronic component test device of any one of the scope of the patent application, wherein the sheet is a thin film, and the outer peripheral part is fixed to the outer periphery by the plurality of shims in a state of being given tension The body part.

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