CN220576166U - Punching die for flexible circuit board - Google Patents

Abstract

The utility model relates to a punching die for a flexible circuit board. The flexible circuit board punching die comprises an upper die structure and a lower die structure; the upper die structure comprises an upper die main body and a stripper plate movably arranged on the bottom surface of the upper die main body; the lower die structure comprises a lower die plate and a female die plate arranged on the top surface of the lower die plate, wherein the female die plate and the stripper plate are arranged up and down correspondingly; the upper die structure further comprises a built-in single-side cutter which is arranged at the bottom of the upper die main body in a protruding mode, a cutter avoiding groove is formed in the concave die plate, and the built-in single-side cutter is movably arranged on the stripper plate in a penetrating mode and is arranged up and down corresponding to the cutter avoiding groove. The utility model can solve the technical problems that when the traditional punching die is adopted to punch the substrate waste of the flexible substrate of the electronic element needing to be provided with the micro-connection points, the edge of the flexible substrate cannot be avoided, and the micro-connection points at the edge of the flexible substrate cannot be normally cut off.

Description

Punching die for flexible circuit board

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a flexible circuit board punching die.

Background

A flexible printed circuit board (Flexible Printed Circuit abbreviated as FPC) is a flexible printed circuit board having high reliability and excellent in which polyimide or polyester film is used as a base material. With miniaturization and functional diversification of electronic components, the printing effect on the electronic components is becoming higher (the size of the patch printing precision is maximized). In the production process, various components such as a Chip (Chip) and a B2B (Board-to-Board Connector), a MIC (microphone), a USBC (USB interface), a K2 (relay) component and the like are required to be printed on a flexible Board substrate by using an SMT (Surface Mounted Technology, surface mount technology) patch, and then a die-cut die is used to cut off the substrate waste to obtain an electronic component that can be mounted on a circuit Board.

Moreover, in order to meet the accuracy requirement of SMT printing operation, the flexible board substrate of the electronic component needs to meet the flatness and perpendicularity of the flexible board: spec. <0.10mm, cpk >1.33, and at the same time meets compliance board form factor tolerance: 0.05mm, cpk >1.67. Therefore, in order to meet the above requirements, when various components are mounted on a flexible board substrate using SMT technology, it is necessary to provide micro-connection points at the edge of the flexible board substrate of the electronic component so as to connect and support with the substrate waste, and die-cut and disconnect the substrate waste and the micro-connection points after the electronic component is mounted on the circuit board.

Therefore, when the traditional punching die is used for punching the micro-connection points connected with the substrate waste, the normal die knife edge needs to have knife edge strength of 0.8mm according to the die manufacturing specification, but the distance between the components and the edge of the flexible substrate is more and more short, the edge of the flexible substrate cannot be avoided, and the micro-connection points at the edge of the flexible substrate cannot be normally punched and disconnected.

Disclosure of Invention

The utility model provides a die-cut die for a flexible circuit board, which can solve the technical problem that when a traditional die-cut die is adopted to die-cut the substrate waste of a flexible circuit board substrate of an electronic element needing to be provided with micro-connection points in the prior art, the micro-connection points at the edge of the flexible circuit board substrate cannot be avoided from being located at the edge of the flexible circuit board substrate, and the edge of the flexible circuit board substrate cannot be normally cut.

In order to solve the technical problems, the utility model provides a flexible circuit board punching die, which comprises:

the upper die structure comprises an upper die main body and a stripper plate movably arranged on the bottom surface of the upper die main body;

the lower die structure comprises a lower die plate and a female die plate arranged on the top surface of the lower die plate, and the female die plate and the stripper plate are arranged up and down correspondingly;

the upper die structure further comprises a built-in single-side cutter protruding out of the bottom of the upper die main body, a cutter avoiding groove is formed in the concave die plate, and the built-in single-side cutter movably penetrates through the stripper plate and is correspondingly arranged up and down with the cutter avoiding groove.

Optionally, the built-in unilateral cutter comprises a cutter head part which is obliquely arranged, one side of the cutter head part is provided with a punching cutting edge, and the cutting edge surface of the punching cutting edge is aligned with one groove side surface of the cutter avoidance groove.

Optionally, the inclination angle of the cutter head is set to be 30-60 degrees;

the width of the punching blade is set to be 0.3-0.5mm.

Optionally, the inclination angle of the head part is set to 45 °;

the width of the punching blade is set to be 0.4mm.

Optionally, the built-in single-side cutter comprises a cutter body protruding from the bottom of the upper die body, the cutter head is arranged at the end of the cutter body, and the punching blade extends from the cutter head to the cutter body.

Optionally, a first element avoidance groove is formed in the bottom of the stripper plate, and one groove side surface of the first element avoidance groove is aligned with the cutting edge surface of the punching cutting edge.

Optionally, a second element avoidance groove is formed in the top of the female die plate, and one groove side surface of the second element avoidance groove is arranged at intervals with the edge surface of the punching edge.

Optionally, the bottom of taking off the flitch is equipped with first component and dodges the groove, the top of die board be equipped with first component dodges the groove and dodge the groove and correspond the second component of intercommunication, a side in groove is dodged to the first component with the cutting edge face alignment setting of die-cut cutting edge, a groove side in groove is dodged to the second component with the cutting edge face interval setting of die-cut cutting edge.

Optionally, the upper die main body comprises an upper die plate, an upper backing plate arranged at the bottom of the upper die plate, and an upper fixing plate arranged at the bottom of the upper backing plate, wherein the built-in unilateral cutter is arranged at the bottom of the upper fixing plate in a protruding manner, and the stripper plate is movably arranged at the bottom of the upper fixing plate.

Optionally, the upper die main body further comprises a plurality of guide posts protruding from the bottom of the upper backing plate or the bottom of the upper fixing plate, and the stripper plate is movably arranged on the plurality of guide posts in a penetrating manner;

the concave template is provided with a plurality of guide holes, and a plurality of guide posts and a plurality of guide holes are arranged in one-to-one correspondence.

The technical scheme provided by the utility model has the beneficial effects that:

when the electronic component formed on the flexible board substrate is punched, the electronic component can be placed on the concave template of the lower die structure, the waste region to be punched of the electronic component corresponds to the built-in single-side cutter arranged at the bottom of the upper die main body, the electronic component is clamped between the stripper plate and the concave template through the lower upper die structure, the built-in single-side cutter can further descend to punch the waste region of the electronic component, the substrate waste of the electronic component can be cut off to separate from the flexible board substrate, the stripper plate and the concave template are separated through lifting the upper die structure, and a punched product of the electronic component can be taken out.

Moreover, through setting up built-in unilateral cutter as the die-cut cutter in the bottom of the upper mould main part of last mould structure, for traditional die-cut cutter, required edge intensity is littleer (can be less than 0.7 mm), is convenient for make the cutting edge that built-in unilateral cutter is located the side correspond with the edge of the flexible board base plate of electronic component, can keep away the position to the edge of flexible board base plate when carrying out die-cut to electronic component, can normally cut off the little tie point at the edge of flexible board base plate, can make electronic component satisfy SMT printing operation precision requirement.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a flexible circuit board punching die according to an embodiment of the present utility model;

FIG. 2 is a schematic view of a partial enlarged structure of a portion A of FIG. 1;

fig. 3 is a schematic diagram of a partial discharge enlarged structure of a flexible circuit board die-cutting die with a single-sided cutter for die-cutting a flexible circuit board substrate of an electronic component according to an embodiment of the present utility model;

fig. 4 is a schematic diagram of a partial discharge enlarged structure when a flexible circuit board substrate of an electronic component is punched by a built-in single-side cutter of the flexible circuit board punching die according to the embodiment of the utility model;

fig. 5 is a schematic diagram of a partial discharge enlarged structure of a flexible circuit board die-cutting die with a single-sided cutter for die-cutting an electronic component according to an embodiment of the present utility model;

fig. 6 is a schematic diagram showing a partial-discharge enlarged structure of a flexible circuit board die-cutting die with a single-sided cutter for die-cutting an electronic component according to an embodiment of the present utility model.

In the figure: 10. punching a die for the flexible circuit board; 20. an electronic component; 22. a component; 24. a flexible board substrate; 100. an upper die structure; 110. an upper template; 120. an upper backing plate; 130. an upper fixing plate; 140. a stripper plate; 142. a first element avoidance groove; 150. a guide post; 160. a single-side cutter is arranged in the cutter; 162. a cutter body; 164. a cutter head part; 166. punching a cutting edge; 1662. a knife edge surface; 200. a lower die structure; 210. a lower template; 220. a female template; 222. a cutter avoiding groove; 224. the second element evading groove; 230. and a guide hole.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 and 2, the present utility model proposes a flexible circuit board punching die 10, which includes an upper die structure 100 and a lower die structure 200 correspondingly matched with the upper die structure 100. The electronic component 20 to be punched can be placed on the lower die structure 200, and then the upper die structure 100 and the lower die structure 200 are clamped to punch the electronic component 20 to be punched, and the waste material of the electronic component 20 is cut off to obtain a finished product of the electronic component 20.

Specifically, the upper mold structure 100 may include an upper mold body, and a stripper plate 140 movably disposed on a bottom surface of the upper mold body. Furthermore, the lower die structure 200 may include a lower die plate 210 and a female die plate 220 disposed on the top surface of the lower die plate 210, where the female die plate 220 is disposed vertically corresponding to the stripper plate 140. The upper mold structure may further include a built-in single-sided cutter 160 protruding from the bottom of the upper mold body, where the female mold plate 220 is provided with a cutter avoiding groove 222, and the built-in single-sided cutter 160 is movably disposed on the stripper plate 140 and vertically corresponds to the cutter avoiding groove 222.

When the electronic component 20 formed by arranging the component 22 on the flexible board substrate 24 is punched, the electronic component 20 can be placed on the concave board 220 of the lower die structure 200, the waste area to be punched of the electronic component 20 corresponds to the built-in single-sided cutter 160 arranged at the bottom of the upper die main body, the electronic component 20 is clamped between the stripper plate 140 and the concave board 220 by the lower upper die structure 100, the built-in single-sided cutter 160 can be further made to descend to punch the waste area of the electronic component 20, the substrate waste of the electronic component 20 can be cut off to be separated from the flexible board substrate, the stripper plate 140 and the concave board 220 are separated by lifting the upper die structure 100, and a punched product of the electronic component 20 can be taken out.

Moreover, by setting the built-in single-side cutter 160 as a punching cutter at the bottom of the upper die main body of the upper die structure 100, compared with the traditional punching cutter, the required cutter edge strength is smaller (can be smaller than 0.7 mm), so that the punching cutter edge 166 with the built-in single-side cutter 160 at the side corresponds to the edge of the flexible board substrate 24 of the electronic component 20, thereby avoiding the position to the edge of the flexible board substrate 24 when the electronic component 20 is punched, normally cutting off the micro-connection point of the edge of the flexible board substrate, and enabling the electronic component to meet the precision requirement of SMT printing operation.

Further, as shown in fig. 1 and 2, the upper mold body of the upper mold structure 100 may include an upper mold plate 110, an upper pad 120 disposed at the bottom of the upper mold plate 110, and an upper fixing plate 130 disposed at the bottom of the upper pad 120, wherein a built-in single-side cutter 160 may be protruded at the bottom of the upper fixing plate 130, and a stripper plate 140 may be movably disposed at the bottom of the upper fixing plate 130. The upper mold plate 110 may form a basic structure of the upper mold structure 100, and provide a mounting base for the upper base plate 120 and the upper fixing plate 130, and the upper fixing plate 130 may be used to mount the built-in single-side cutter 160 and press the stripper plate 140; the stripper plate 140 movably disposed at the bottom of the upper fixing plate 130 may be moved toward or away from the upper fixing plate 130 to separate the die-cut object from the built-in single-side cutter 160.

In addition, the upper mold body may further include a plurality of guide posts 150 protruding from the bottom of the upper pad 120 or the bottom of the upper fixing plate 130, and the stripper plate 140 may be movably inserted through the plurality of guide posts 150; furthermore, the female die plate 220 of the lower die structure 200 may be provided with a plurality of guide holes 230, and the plurality of guide posts 150 are disposed in one-to-one correspondence with the plurality of guide holes 230. When the upper die structure 100 is pressed down to enable the built-in single-side cutter 160 on the upper die structure 100 to punch the electronic component 20 placed between the stripper plate 140 and the female die plate 220, the upper die structure can be stably and reliably lifted and moved by guiding the guiding posts 150 on the upper die main body and the guiding holes 230 on the female die plate 220, so that the built-in single-side cutter 160 can punch the electronic component 20 stably and accurately.

In addition, the built-in single-sided knife 160 of the upper die structure 100 may include a knife head 164 disposed obliquely, one side of the knife head 164 being provided with a punching blade 166, a blade surface 1662 of the punching blade 166 being disposed in alignment with one groove side of the knife-avoiding groove 222. By arranging the punching blade 166 on one side of the bit portion 164 with the built-in single-side cutter 160, when the built-in single-side cutter 160 punches the waste region of the electronic component 20, the punching blade 166 on the side of the bit portion 164 can correspond to the edge of the flexible board substrate 24 of the electronic component 20, so that the bit portion 164 can cut off the micro-connection point of the edge of the flexible board substrate 24 of the electronic component 20 with smaller blade strength, thereby facilitating cutting off the substrate waste of the electronic component 20 to separate from the flexible board substrate 24. Specifically, the punching blade 166 is disposed on one side of the cutter head 164, the inclined surface is disposed on the other side, the punching blade 166 is disposed vertically, and the inclined surface may extend from the end of the punching blade 166 to the side of the stripper plate 140, so that the cutter head 164 forms a wedge shape with gradually reduced end, and the cutter edge width of the cutter head 164 may be reduced, so that the cutter edge strength required for punching may be reduced.

Further, the inclination angle of the bit portion 164 may be set to 30 ° -60 °, and the width of the punching blade 166 provided at the side of the bit portion 164 may be set to 0.3-0.5mm. By setting the bit portion 164 obliquely and setting the width of the punching blade 166 of the side face of the bit portion 164 to 0.3-0.5mm, the blade width of the bit portion 164 can be reduced, i.e., the blade strength required for punching the scrap region of the electronic component 20 can be reduced. In the present embodiment, the inclination angle of the cutter head portion 164 may be set to 45 °, and the width of the punching blade 166 may be set to 0.4mm. Further, the inclination angle of the bit portion 164 may be set to any angle of 30 ° -60 °, and the width of the punching blade 166 may be set to any width of 0.3-0.5mm, as needed.

Further, the built-in single-sided cutter 160 may include a cutter body 162 protruding from the bottom of the upper die body, a cutter head 164 may be provided at an end of the cutter body 162, and a punching blade 166 may extend from the cutter head 164 to the cutter body 162. The cutter body 162 may be provided in a long strip shape and may be extended in a vertical direction; also the punching blade 166 may extend in a vertical direction from the cutter head 164 to the cutter body 162, i.e. the punching blade 166 may be provided not only on the cutter head 164 with the single-sided cutter 160 built in, but also on both the cutter body 162 and the cutter head 164.

Further, as shown in fig. 3, in some embodiments, the bottom of the stripper plate 140 is provided with a first element relief groove 142, one groove side of the first element relief groove 142 being aligned with the blade surface 1662 of the piercing blade 166 of the built-in single-sided knife 160. In this embodiment, when the scrap area of the flexible board substrate 24 of the electronic component 20 is punched, if the component 22 of the electronic component 20 is located on the front surface of the flexible board substrate 24 (may be regarded as the top surface of the flexible board substrate), a relief space (i.e. the first component relief groove 142) may be provided at the bottom of the stripper plate 140 of the upper mold structure 100, so that when the upper mold structure 100 and the lower mold structure 200 are assembled, the component 22 of the electronic component 20 is located in the relief space provided on the stripper plate 140, and the flexible board substrate 24 of the electronic component 20 may be placed and abutted on the top surface of the female mold 220 of the lower mold structure 200, so that the scrap area of the flexible board substrate 24 of the electronic component 20 to be cut corresponds to the built-in single-sided knife 160, and then the micro-connection point of the edge of the flexible board substrate 24 may be cut off by the built-in knife 160, so that the substrate scrap is separated from the flexible board substrate 24. Also, during the punching process, the blade face 1662 of the punching blade 166 of the built-in single-sided cutter 160 is disposed facing the component 22 of the electronic component 20 (i.e., the blade face is disposed relatively close to the component).

Moreover, by aligning one groove side surface of the first element escape groove 142 with the blade surface 1662 of the punching blade 166 of the built-in single-side cutter 160, the punching blade 166 of the built-in single-side cutter 160 is brought close to the edge of the flexible board substrate 24 of the electronic element 20 during punching, so that micro-connection points of the edge of the flexible board substrate 24 are easily punched and broken, and the substrate waste is separated from the flexible board substrate 24. In addition, during the punching process, the distance between the edge of the flexible board substrate of the electronic component 20 and the punching blade 166 of the built-in single-side cutter 160 can be adjusted by adjusting the position of the component 22 of the electronic component 20 in the avoiding space (i.e. the first component avoiding groove 142) at the bottom of the stripper plate 140, so as to facilitate cutting the micro-connection point.

Further, as shown in FIG. 4, in other embodiments, the top of the die plate 220 may be provided with a second element relief groove 224, and one groove side of the second element relief groove 224 may be spaced from the blade surface 1662 of the piercing blade 166 of the in-line single-sided knife 160. In this embodiment, when the scrap area of the flexible board substrate 24 of the electronic component 20 is punched, if the component 22 of the electronic component 20 is located on the opposite side of the flexible board substrate 24 (can be regarded as the bottom surface of the flexible board substrate 24), a relief space (i.e. the second component relief groove 224) can be provided on the top of the female die plate 220 of the lower die structure 200, so that when the upper die structure 100 and the lower die structure 200 are clamped, the component 22 of the electronic component 20 is located in the relief space provided on the female die plate 220, and the flexible board substrate 24 of the electronic component 20 can be abutted against the bottom surface of the stripper plate 140 of the upper die structure 100, and the flexible board substrate 24 of the electronic component 20 can be simultaneously placed on the top surface of the female die plate 220, and the scrap area of the flexible board substrate 24 of the electronic component 20 to be cut corresponds to the built-in cutter 160, and then the micro-connection points of the edge of the flexible board substrate 24 can be cut off by the built-in cutter 160, so that the substrate scrap and the flexible board substrate 24 are separated. Similarly, during the die-cutting process, the blade surface 1662 of the die-cutting blade 166 of the built-in single-sided knife 160 is disposed opposite the component 22 of the electronic component 20 (i.e., the blade surface is disposed relatively close to the component).

Moreover, by arranging one groove side surface of the second component avoiding groove 224 at a distance from the cutting surface 1662 of the punching cutting edge 166 of the built-in single-side cutter 160, the edge of the flexible board substrate 24 of the electronic component 20 located in the second component avoiding groove 224 can be located at a distance, and the punching cutting edge 166 of the built-in single-side cutter 160 is conveniently close to the edge of the flexible board substrate 24 of the electronic component 20 in the punching process, so that the micro-connection point of the edge of the flexible board substrate 24 can be conveniently punched and disconnected.

In addition, as shown in fig. 5, in other embodiments, a first element avoidance groove 142 is formed at the bottom of the stripper plate 140, a second element avoidance groove 224 corresponding to and communicating with the first element avoidance groove 142 is formed at the top of the female die plate 220, one side surface of the first element avoidance groove 142 is aligned with the blade surface 1662 of the punching blade 166, and one groove side surface of the second element avoidance groove 224 may be spaced from the blade surface 1662 of the punching blade 166. In this embodiment, when the scrap area of the flexible board substrate 24 of the electronic component 20 is punched, if the components are disposed on the front and the back of the flexible board substrate 24 of the electronic component 20, an avoidance space (i.e. the first component avoidance groove 142) may be disposed at the bottom of the stripper plate 140 of the upper die structure 100, and another avoidance space (i.e. the second component avoidance groove 224) may be disposed at the top of the female die plate 220 of the lower die structure 200, so that when the upper die structure 100 and the lower die structure 200 are clamped, the component 22 on the front of the electronic component 20 is disposed in the first component avoidance groove 142, the component 22 on the back of the electronic component 20 is disposed in the second component avoidance groove 224, and the flexible board substrate 24 of the electronic component 20 may be clamped between the bottom of the stripper plate 140 and the top of the female die plate 220, and the scrap area of the flexible board substrate 24 of the electronic component 20 to be cut corresponds to the built-in single-side cutter 160, and then the micro-connection point of the edge of the flexible board substrate 24 of the built-in cutter 160 may be cut. Similarly, during the punching process, the blade surface 1662 of the punching blade 166 of the built-in single-sided cutter 160 may be disposed to face the component 22 of the electronic component 20.

In addition, as shown in fig. 6, a second element avoidance groove 224 may be formed at the top of the female die plate 220, or a first element avoidance groove 142 may be formed at the bottom of the stripper plate 140, a second element avoidance groove 224 correspondingly communicating with the first element avoidance groove 142 may be formed at the top of the female die plate 220, one groove side surface of the second element avoidance groove 224 may be aligned with the cutting edge surface 1662 of the punching edge 166 of the built-in single-edge cutter 160, and the second element avoidance groove 224 may be integrally formed with the cutter avoidance groove 222. At this time, the flexible board substrate of the electronic component may rest on the top surface of the concave mold 220, and the blade surface 1662 of the punching blade 166 of the built-in single-side cutter 160 is disposed opposite to the side of the component 22 of the electronic component 20 (i.e. the blade surface is disposed relatively far away from the component), and the punching blade 166 of the built-in single-side cutter 160 may be close to the edge of the flexible board substrate 24 of the electronic component 20 during punching to facilitate punching and breaking of the micro-connection point.

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It should be noted that in the present utility model, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing is only a specific embodiment of the utility model to enable those skilled in the art to understand or practice the utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A flexible circuit board punching die, comprising:

the upper die structure comprises an upper die main body and a stripper plate movably arranged on the bottom surface of the upper die main body;

the lower die structure comprises a lower die plate and a female die plate arranged on the top surface of the lower die plate, and the female die plate and the stripper plate are arranged up and down correspondingly;

the upper die structure further comprises a built-in single-side cutter protruding out of the bottom of the upper die main body, a cutter avoiding groove is formed in the concave die plate, and the built-in single-side cutter movably penetrates through the stripper plate and is correspondingly arranged up and down with the cutter avoiding groove.

2. The flexible circuit board punching die according to claim 1, wherein the built-in single-sided cutter includes a cutter head portion provided obliquely, one side of the cutter head portion is provided with a punching blade, and a blade surface of the punching blade is provided in alignment with one groove side surface of the cutter escape groove.

3. The flexible wiring board punching die according to claim 2, wherein the inclination angle of the cutter head portion is set to 30 ° -60 °;

the width of the punching blade is set to be 0.3-0.5mm.

4. The flexible wiring board punching die according to claim 3, wherein an inclination angle of the cutter head portion is set to 45 °;

the width of the punching blade is set to be 0.4mm.

5. The flexible wiring board punching die according to claim 2, wherein the built-in single-sided cutter includes a cutter body protruding from a bottom of the upper die body, the cutter head is provided at an end of the cutter body, and the punching blade extends from the cutter head to the cutter body.

6. The flexible wiring board punching die according to any one of claims 2 to 5, wherein a first element escape groove is provided at a bottom of the stripper plate, and one groove side surface of the first element escape groove is disposed in alignment with a blade edge of the punching blade.

7. The flexible circuit board punching die according to any one of claims 2 to 5, wherein a second element escape groove is provided at a top of the die plate, and one groove side surface of the second element escape groove is provided at a distance from a blade surface of the punching blade.

8. The flexible circuit board punching die according to any one of claims 2 to 5, wherein a first element avoidance groove is formed in the bottom of the stripper plate, a second element avoidance groove which is correspondingly communicated with the first element avoidance groove is formed in the top of the female die plate, one side surface of the first element avoidance groove is aligned with the edge surface of the punching edge, and one groove side surface of the second element avoidance groove is spaced from the edge surface of the punching edge.

9. The flexible wiring board punching die according to any one of claims 1 to 5, wherein the upper die body includes an upper die plate, an upper pad plate provided at a bottom of the upper die plate, and an upper fixing plate provided at a bottom of the upper pad plate, the built-in single-side cutter is protruded at a bottom of the upper fixing plate, and the stripper plate is movably provided at a bottom of the upper fixing plate.

10. The flexible circuit board punching die according to claim 9, wherein the upper die main body further comprises a plurality of guide posts protruding from the bottom of the upper pad or the bottom of the upper fixing plate, and the stripper plate is movably inserted into the plurality of guide posts;

the concave template is provided with a plurality of guide holes, and a plurality of guide posts and a plurality of guide holes are arranged in one-to-one correspondence.