TWI710768B - Testing apparatus and testing flow using the same - Google Patents

Abstract

A testing apparatus for testing a die which is flip-chip bonded on a circuit board is provided. The testing apparatus includes a testing module and a pick-and-place module. The testing module includes a plurality of probe pins. The pick-and-place module has a housing space. The pick-and-place module includes an adsorption head, a first gas pipe, and a second gas pipe. The adsorption head is located in the housing space. The first gas pipe is connected to the adsorption head. The second gas pipe is connected to the housing space. When testing the die, the circuit board and the die are placed in the housing space, and the adsorption head is in contact with a back surface of the die, the probe pins are electrically connected to the circuit board, and an end of the second gas pipe does not substantially contact the circuit board and the die. A testing flow using the aforementioned testing apparatus is also provided.

Description

Test device and test process using it

The present invention relates to a test device and a test process using the same, and more particularly to a test device suitable for testing a flip chip bonded to a circuit board and a test process using the same.

In recent years, with the rapid development of electronic technology and the emergence of high-tech electronic industries, more humane, better-functioning electronic products are constantly being introduced and designed toward the trend of light, thin, short and small.

However, thinner electronic products may be less resistant to pressure. Therefore, during the manufacturing process of electronic products (such as the test process of unfinished products or intermediate structures), it may be easily damaged or broken.

The invention provides a testing device and a testing process using the same, which can reduce the possibility of damage or chipping of a circuit board and/or a chip on the circuit board.

The test device of the present invention tests the wafer, and the wafer is flip-chip bonded to the circuit board. The test device includes a test module and a pick-and-place module. The test module includes multiple probes. The pick-and-place module has an accommodation space. The pick-and-place module includes an adsorption head, a first gas pipeline, and a second gas pipeline. The adsorption head is located in the containing space. The first gas pipeline is connected to the adsorption head. The second gas pipeline communicates with the accommodating space. When testing the wafer, the circuit board and the wafer are placed in the accommodating space, the adsorption head is in contact with the back of the wafer, a plurality of probes are electrically connected to the circuit board, and the end of the second gas pipeline is basically not Contact circuit boards and chips.

In an embodiment of the present invention, the first gas pipeline and the second gas pipeline are not connected to each other.

In an embodiment of the present invention, the pick-and-place module further includes an engaging groove, the engaging groove has a stepped surface and a bottom surface, and the stepped surface and the bottom surface constitute an accommodation space.

In an embodiment of the present invention, the adsorption head is disposed on the bottom surface, and the end of the second gas pipeline is located on the bottom surface.

In an embodiment of the present invention, the accommodating space has a first area and a second area, the first area has a first depth, the second area has a second depth, and the second depth is greater than the first depth.

In an embodiment of the present invention, the adsorption head is located in the second zone, and the end of the second gas pipeline is not located in the second zone.

The test procedure of the present invention includes the following steps. Provide the aforementioned test device. An electronic component is provided, wherein the electronic component includes a circuit board and a flip chip bonded to the circuit board. Pick up the electronic components with the pick-and-place module of the test device. Make the pick-and-place module for picking up electronic components close to the test module. The circuit board of the electronic component picked up by the pick-and-place module is electrically connected to a plurality of probes for testing.

In an embodiment of the present invention, the step of electrically connecting the circuit boards of the electronic components picked up by the pick-and-place module to the multiple probes includes the following steps (1) and (2) in sequence. Step (1): Make the pick-and-place module for picking up the electronic component and the test module close, so that the circuit board of the electronic component picked up by the pick-and-place module is electrically connected to at least one of the multiple probes. Step (2): Fill the accommodating space with gas through the second gas pipeline.

In an embodiment of the present invention, it further includes performing step (1) and step (2) multiple times.

In an embodiment of the present invention, after the electronic component is picked up by the pick-and-place module of the test device, the electronic component and the pick-and-place module basically form a closed space, and the end of the second gas pipeline is connected to the closed space.

Based on the above, the test device and the test process using the same of the present invention can reduce the possibility of damage or chipping of the circuit board and/or the chip on the circuit board.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

Fig. 1 is a partial flowchart of a test process according to an embodiment of the present invention. 2A to 2C are schematic partial side views of a test process according to an embodiment of the invention. FIG. 2D is a schematic partial side cross-sectional view of a test process according to an embodiment of the present invention. FIG. 2D may be the same or similar to the cross-sectional schematic diagram of the area R in FIG. 2A. Fig. 3 is a partial sequence diagram of a test process according to an embodiment of the present invention.

Please refer to FIG. 1, FIG. 2A and FIG. 2D, in step S11, a testing device 100 is provided. The test device 100 includes a pick-and-place module 200 and a test module 300. The pick-and-place module 200 has an accommodation space 210. The pick-and-place module 200 includes an adsorption head 220, a first gas pipeline 230 and a second gas pipeline 240. The adsorption head 220 is located in the accommodating space 210. The first gas pipeline 230 communicates with the adsorption head 220. The second gas pipeline 240 communicates with the accommodating space 210. The test module 300 includes a plurality of probes 310.

In this embodiment, the first gas pipeline 230 may be directly connected to the adsorption head 220, and the second gas pipeline 240 may be directly connected to the accommodation space 210.

In this embodiment, the pick-and-place module 200 may further include an engaging slot (nes) 250. The engaging groove 250 can be fixed on the test arm 260 by means of clamps, clamps, locks or other suitable jigs or corresponding methods. The engaging groove 250 has a top surface 255 (ie, the surface furthest away from the test arm 260), a stepped surface 256, and a bottom surface 257 (ie, the surface closest to the test arm 260 in the accommodating space 210). The step surface 256 connects the top surface 255 and the bottom surface 257. The stepped surface 256 and the bottom surface 257 may constitute an open accommodation space 210. In other words, the accommodating space 210 in the engaging groove 250 may have a first zone 211 and a second zone 212, wherein the first zone 211 has a first depth T1, the second zone 212 has a second depth T2, and the second zone The depth T2 is greater than the first depth T1.

In this embodiment, the stepped surface 256 may include a first stepped surface 256a, a connecting surface 256b, and a second stepped surface 256c. The connecting surface 256b is located between the first stepped surface 256a and the second stepped surface 256c. The first step surface 256a may be connected to the top surface 255. The second step surface 256c may be connected to the bottom surface 257.

In this embodiment, the adsorption head 220 may be disposed on the bottom surface 257, and the end point 244 of the second gas pipeline 240 may be located on the bottom surface 257. In other words, the adsorption head 220 may be located in the second area 212 of the accommodating space 210, and the end point 244 of the second gas pipeline 240 is not located in the first area 211 of the accommodating space 210 (for example, it may be located in the accommodating space 210). The second area 212).

In this embodiment, the first gas pipeline 230 and the second gas pipeline 240 are not connected to each other. For example, in an open space, if pressurization or depressurization is performed through the first gas pipe 230, the air pressure in the second gas pipe 240 will not be correspondingly increased or depressurized. ; Or if the pressure is increased or decreased via the second gas line 240, the air pressure in the first gas line 230 will not be increased or decreased accordingly. To put it simply, in an open space, the increase or decrease of the air pressure in the first gas pipe 230 and the increase or decrease of the air pressure in the second gas pipe 240 are basically not linked.

In this embodiment, the adsorption head 220 may be made of a polymer material with elasticity. For example, the adsorption head 220 may include a rubber suction cup, and the end point 234 of the first gas pipeline 230 may be directly connected to the adsorption head 220, but the present invention is not limited thereto.

In this embodiment, the test module 300 may further include a socket 320 and a circuit board 330. The probe 310 may be embedded in the base 320, and the probe 310 may be electrically connected to a corresponding contact pad 338 on the circuit board 330. For example, the probe 310 may include a first conductive end 311, an elastic conductive member 312, and a second conductive end 313. The first conductive end 311 may protrude from the upper surface 325 of the base 320 to be in contact with the component under test (such as the electronic component 400 described later). The second conductive end 313 may protrude from the lower surface 327 of the base 320 to contact the corresponding contact pad 338 on the circuit board 330. The elastic conductive member 312 is located at the first conductive end 311 and the second conductive end 313.

In this embodiment, the elastic conductive member 312 is, for example, a spring made of conductive material. In other words, the probe 310 may be a pogo pin.

In one embodiment, the elastic coefficient of the elastic conductive member 312 is approximately 60 grams/millimeter (g/mm) to 90 grams/mm, but the invention is not limited thereto.

In an embodiment, the pick-and-place module 200 and/or the test module 300 may have alignment components, but the invention is not limited thereto. For example, the pick-and-place module 200 and the test module 300 may have guide holes and corresponding guide pins.

1 and 2B, in step S12, an electronic component 400 is provided. The electronic component 400 includes a circuit board 410 and a chip 420 (die). The circuit board 410 has a first surface 415 and a second surface 417 opposite to each other. The chip 420 is disposed on the first surface 415 of the circuit board 410, and the chip 420 can be electrically connected to the circuit board 410 through flip chip bonding.

In this embodiment, the circuit board 410 may have a core layer (not shown). The core layer may include a polymer glass fiber composite substrate, a glass substrate, a ceramic substrate, an insulating silicon substrate, and a polyimide (PI) glass fiber composite substrate. The core layer may form a double sided wiring board with at least two wiring layers located on opposite sides of the core layer. For example, the circuit board 410 may be a copper foil substrate (Copper Clad Laminate; CCL) or other suitable printed circuit boards, but the present invention is not limited thereto.

In an embodiment, the circuit board 410 may be referred to as a hard board (hard board PCB).

In an embodiment, the thickness of the circuit board 410 is substantially less than or equal to 1.6 millimeters (millimeter; mm), but the present invention is not limited thereto.

In one embodiment, the size of the circuit board 410 is approximately 10 mm×10 mm to 25 mm×25 mm, but the invention is not limited thereto.

In this embodiment, the chip 420 on the circuit board 410 may be a bare die. In other words, there will be no molding compound on the circuit board 410 encapsulating the chip 420.

In an embodiment, the connection pads on the chip 420 may be electrically connected to corresponding lines (not shown) in the circuit board 410 via corresponding bumps (not shown). The bumps may include tin, lead, gold or a combination of the above, but the invention is not limited thereto.

In an embodiment, an underfill (not shown) may be filled between the chip 420 and the circuit board 410, but the invention is not limited thereto.

In an embodiment, the thickness of the wafer 420 is substantially less than or equal to 1.0 millimeter (millimeter; mm), but the present invention is not limited thereto.

In this embodiment, the electronic component 400 may further include a plurality of conductive terminals 430. The plurality of conductive terminals 430 may be arranged on the second surface 417 of the circuit board 410 in an array, but the invention is not limited thereto. The conductive terminal 430 is, for example, a solder ball, but the invention is not limited thereto.

In an embodiment, the number of conductive terminals 430 may be greater than or equal to 400, but the present invention is not limited thereto.

1 and 2B, in step S20, the electronic component 400 is picked up by the pick-and-place module 200 of the test device 100.

For example, the suction head 220 of the pick-and-place module 200 can be moved above the chip 420 on the circuit board 410 first. Then, by evacuating the first gas pipe 230, the air pressure in the first gas pipe 230 is lower than that of the environment, so that the adsorption head 220 and the back surface 427 of the chip 420 (ie, relative to the active surface) (The surface of the active serface 425) is in contact with each other, and the wafer 420 can be fixed on the suction head 220. In other words, the circuit board 410 and the flip chip 420 bonded to the circuit board 410 can be placed in the accommodating space 210.

In this embodiment, after the electronic component 400 is picked up by the pick-and-place module 200 of the test device 100, the electronic component 400 and the pick-and-place module 200 basically constitute a closed space 270 (ie, a part of the accommodating space 210).

In this embodiment, by sucking the wafer 420 by the sucking head 220, the circuit board 410 of the electronic component 400 can be brought into contact with the connection surface 256b accordingly. In this way, the electronic component 400 can form a closed space 270 with the second step surface 256 c and the bottom surface 257. That is to say, when the first gas pipe 230 is pumped to adsorb the wafer 420, the air pressure in the enclosed space 270 will not be correspondingly decreased; or the second gas pipe 240 is supplied with air. When the air pressure in the enclosed space 270 is raised, the electronic component 400 is basically not separated from the suction head 220 of the pick-and-place module 200.

In this embodiment, the end 244 of the second gas pipeline 240 is connected to the closed space 270. In other words, the end 244 of the second gas pipe 240 basically does not contact the electronic component 400.

It is worth noting that the closed space 270 is not a completely closed system (closed system). For example, gas can be injected into the enclosed space 270 or extracted from the enclosed space 270 via a preset pipeline (such as the second gas pipeline 240); or some gas can be passed through a connection (such as a line The contact surface between the plate 410 and the connecting surface 256b) is transferred between the inside or outside of the enclosed space 270.

1 and 2B to 2C, in step S30, the pick-and-place module 200 for picking up the electronic component 400 is brought close to the test module 300.

In an embodiment, the pick-and-place module 200 for picking up the electronic component 400 can be moved toward the test module 300, but the invention is not limited to this. In another embodiment, the test module 300 can be moved toward the electronic component 400 picked up by the pick-and-place module 200.

1 and 2C, in step S40, the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 is electrically connected to a plurality of probes 310 for testing. In other words, the testing device 100 is suitable for testing the flip chip 420 bonded to the circuit board 410.

In this embodiment, the step of electrically connecting the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 to the plurality of probes 310 may include sequentially performing the following steps (1) and (2) )step.

Step (1): Make the pick-and-place module 200 for picking up the electronic component 400 and the test module 300 close, so that the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 is electrically connected to multiple probes At least one of 310.

Step (2): Inject gas into the closed space 270 (ie, a part of the accommodating space 210) through the second gas pipeline 240.

After gas is injected into the closed space 270 through the second gas pipe 240, the air pressure in the closed space 270 can be increased. In this way, the pressure applied to the first surface 415 of the circuit board 410 (for example: the air pressure in the closed space 270) and the pressure applied to the second surface 417 of the circuit board 410 (for example: the probe 310) The stress directly or indirectly transferred to the second surface 417 due to the contact force of the conductive terminal 430 can be close to each other, and the possibility of damage or cracking of the circuit board 410 and/or the chip 420 on the circuit board 410 can be reduced.

In this embodiment, the aforementioned step (1) and the aforementioned step (2) may be performed multiple times.

Please refer to Figure 1, Figure 2C to Figure 2D and Figure 3. Figure 3 may be a diagram of the relationship between the corresponding relative pressure and the corresponding relative compression in the steps (1) to (6), the test steps, and the steps (7) to (12). It is worth noting that, in Figure 3, the horizontal axis is only used to indicate each step, and does not necessarily represent the length of time for each step; and, in Figure 3, each line (such as: solid line, The dotted line, dotted line) are only used to indicate the relative pressure and relative compression trend before and after each step, and do not necessarily represent the relative pressure or compression relationship of each step. In addition, in FIG. 3, the solid line can be the connection of the relative compression amount (such as triangular point) of the at least one probe 310 before and after each step is performed, and the dashed line can be the line before and after each step is performed. The connection of the pressure value (such as square dots) applied to the second surface 417 of the circuit board 410. The dotted and dashed lines can be applied to the first surface 415 of the circuit board 410 before and after each step is completed. Connection of pressure values (such as diamond points). In the vertical axis on the left side of FIG. 3, the values of the indicated relative pressures P ₁ to P ₁₀ increase sequentially. That is, the value of the relative pressure P ₁ is smaller than the value of the relative pressure P ₂ , the value of the relative pressure P ₂ is smaller than the value of the relative pressure P ₃ , and so on. In the vertical axis on the right side of FIG. 3, the values of the indicated relative compression amounts X ₁ to X ₁₀ increase in order. That is, the value of the relative compression amount X ₁ is smaller than the value of the relative compression amount X ₂ , the value of the relative compression amount X ₂ is smaller than the value of the relative compression amount X ₃ , and so on.

For example, referring to FIG. 3, the step of electrically connecting the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 to the plurality of probes 310 may include sequentially performing the following steps (1) to Step (6), wherein step (3) and step (5) are basically the same or similar to step (1), and step (4) and (6) are basically the same or similar to step ( 2) Steps.

After the aforementioned step (1) and the aforementioned step (2), the contact end of the probe 310 (such as the first conductive end 311; shown in FIG. 2D) can be made to contact the contact end of the electronic component 400 (E.g., the corresponding conductive terminal 430) has good contact, and/or the contact end of the probe 310 (e.g., the second conductive end 313) and the contact end of the circuit board 330 (e.g., the corresponding contact pad 338) (Shown in FIG. 2D) There is good contact, and the possibility of damage or chipping of the circuit board 410 and/or the chip 420 on the circuit board 410 can be reduced.

In this embodiment, after the electronic component 400 is electrically connected to the circuit board 330 through the probe 310, a test step can be performed. The testing step may include circuit testing or electrical testing, for example. The parameters (recipe) and content of the test step can be adjusted according to design or use requirements, and are not limited in the present invention.

In this embodiment, after stopping or completing the test step, the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 can be electrically separated from the corresponding probe 310.

The step of electrically separating the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 from the corresponding probe 310 may include the following steps (7) and (8) in sequence.

Step (7): Extract gas from the enclosed space 270 (ie, a part of the accommodating space 210) through the second gas pipeline 240.

Step (8): Keep the pick-and-place module 200 for picking up the electronic component 400 away from the test module 300.

After the gas is extracted from the closed space 270 through the second gas pipe 240, the air pressure in the closed space 270 can be reduced. In this way, the pressure applied to the first surface 415 of the circuit board 410 (for example: the air pressure in the closed space 270) and the pressure applied to the second surface 417 of the circuit board 410 (for example: the probe 310) The stress directly or indirectly transferred to the second surface 417 due to the contact force of the conductive terminal 430 can be close to each other, and the possibility of damage or cracking of the circuit board 410 and/or the chip 420 on the circuit board 410 can be reduced.

In this embodiment, the aforementioned step (7) and the aforementioned step (8) may be performed multiple times.

For example, referring to FIG. 3, the step of electrically separating the circuit board 410 of the electronic component 400 picked up by the pick-and-place module 200 from the corresponding probe 310 may include the following steps (7) to ( 12) Step, wherein step (9) and step (11) are basically the same or similar to step (7), and step (10) and step (12) are basically the same or similar to step (8) step.

After the aforementioned step (7) and the aforementioned step (8), the contact end of the probe 310 (such as the first conductive end 311) and the contact end of the electronic component 400 (such as the corresponding conductive The terminals 430) are electrically separated, and the possibility of damage or cracking of the circuit board 410 and/or the chip 420 on the circuit board 410 can be reduced.

In summary, the test device and the test process using it of the present invention can reduce the possibility of damage or chipping of the circuit board and/or the chip on the circuit board.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

100: test device 200: Pick and place module 210: housing space 211: District One T1: first depth 212: Second District T2: second depth 220: Adsorption head 230: The first gas pipeline 234: Endpoint 240: second gas pipeline 244: Endpoint 250: snap slot 255: top surface 256: Step Surface 256a: The first terrace 256b: Connection surface 256c: second step surface 257: Bottom 260: Test Arm 270: closed space 300: test module 310: Probe 311: first conductive terminal 312: Elastic conductive parts 313: second conductive terminal 320: Pedestal 325: upper surface 327: lower surface 330: circuit board 338: contact pad 400: electronic components 410: circuit board 415: first surface 417: second surface 420: chip 425: active 427: back 430: conductive terminal R: area S11, S12, S20, S30, S40: steps

Fig. 1 is a partial flowchart of a test process according to an embodiment of the present invention. 2A to 2C are schematic partial side views of a test process according to an embodiment of the invention. FIG. 2D is a schematic partial side cross-sectional view of a test process according to an embodiment of the present invention. Fig. 3 is a partial sequence diagram of a test process according to an embodiment of the present invention.

S11, S12, S20, S30, S40: steps

Claims (10)

A test device for testing a chip, the chip is flip-chip bonded to a circuit board, the test device includes: a test module, including a plurality of probes; and a pick-and-place module, which has an accommodation space, and The pick-and-place module includes: an adsorption head, located in the accommodating space; an exhaust gas pipeline, connected to the adsorption head; and an intake gas pipeline, connected to the accommodating space, wherein When the chip is tested, a closed space is formed between the pick and place module and the circuit board, the suction head is in contact with the back of the chip, and the plurality of probes are electrically connected to the circuit Board, and the end of the inlet gas pipeline basically does not contact the circuit board and the chip. The test device according to the first item of the scope of patent application, wherein the suction gas pipeline and the intake gas pipeline are not connected to each other. According to the test device described in item 1 of the scope of patent application, the pick-and-place module further includes an engaging groove, the engaging groove has a stepped surface and a bottom surface, and the stepped surface and the bottom surface constitute the container置空间. According to the test device described in item 3 of the scope of patent application, the adsorption head is arranged on the bottom surface, and the end point of the inlet gas pipeline is located on the bottom surface. The test device according to the first item of the scope of patent application, wherein the accommodating space has a first zone and a second zone, the first zone has a first depth, the second zone has a second depth, and the second depth is greater than the first zone One depth. The test device according to the fifth item of the scope of patent application, wherein the adsorption head is located in the second zone, and the end point of the inlet gas pipeline is not located in the first zone. A testing process, including: providing the testing device as described in the scope of the patent application; providing electronic components, including the circuit board and the flip chip bonded to the circuit board; using the testing device The pick-and-place module picks up the electronic component; and the pick-and-place module that picks up the electronic component is brought close to the test module; and the electronic component picked up by the pick-and-place module The circuit board is electrically connected to the plurality of probes for testing. The test process as described in item 7 of the scope of patent application, wherein the step of electrically connecting the circuit board of the electronic component picked up by the pick-and-place module to the plurality of probes includes the following steps: Steps (1) and (2): Step (1): Make the pick-and-place module that picks up the electronic component close to the test module so that it can be picked up by the pick-and-place module The circuit board of the electronic component is electrically connected to at least one of the plurality of probes; and step (2): injecting gas into the accommodating space through the intake gas pipeline . The test process described in item 8 of the scope of patent application further includes: performing the step (1) and the step (2) multiple times. As the test process described in item 7 of the scope of patent application, after the electronic component is picked up by the pick-and-place module of the test device, the electronic component and the pick-and-place module basically form a closed space, And the end of the intake gas pipeline is connected to the enclosed space.

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