TWI710017B - Wafer wet processing station - Google Patents

Abstract

The present disclosure provides a wafer wet processing station including a soaking tank, a robot arm, and a single wafer processing apparatus. A wafer is immersed in the soaking tank pre-filled with a process liquid in such a manner that its plate surface is perpendicular to a horizontal plane. The robot arm includes a holding portion and a turning portion. The holding portion is configured to hold the wafer thereon. The turning portion is configured to control the holding portion to be turned with respect to the horizontal plane. The holding portion is turned by 90 degrees by the turning portion so that the wafer is transferred with its plate surface parallel to the horizontal plane. The single wafer processing apparatus is configured to apply a cleaning liquid to the surface of the wafer that has been soaked through the process liquid. The wafer wet processing station can be used to perform a series of cleaning processes such as immersion, spray cleaning on the wafer to clean the wafer with miniaturized chips and high-density interconnection layout.

Description

Wafer wet processing workstation

This disclosure relates to a workstation, especially a wafer wet processing workstation.

With the miniaturization of semiconductor components and the increase in the pattern density of interconnection patterns of chips, the wires gradually develop in the direction of smaller line width and fine line width and space, which makes the semiconductor cleaning and etching process Facing more severe challenges. At present, wafers or substrates usually require multiple cleaning and etching processes to ensure that the final cleaning and etching effect can meet the process specifications of the components, especially in photoresist stripping, metal lift-off, and in After the wafer de-bonding (post wafer de-bonding), the cleaning and removal process of the residues of the adhesive layer and the release layer on the surface of the wafer cannot be completed by a single process. Must combine wafer immersion and single wafer spray cleaning equipment.

On the other hand, the general wafer immersion equipment first transfers a plurality of wafers from the feed port through the conveying device, and places the wafers in the cassette one at a time, and then moves the cassette down to be immersed in the immersion tank. After soaking for a period of processing time, the cassette together with the wafers are moved upward from the soaking tank to leave the soaking tank. Finally, the immersed wafers are sent to the next process one by one by the holding and taking mechanism. However, in the wafer immersion equipment, if the wafers are placed horizontally and the cassette is completely immersed in the immersion tank, the holding and picking mechanism cannot take out the wafers individually and individually. It must wait until the cassette is lifted and left. After the soaking tank, the holding and taking mechanism can enter the cassette to take out the wafer. However, in the same cassette, the wafers taken out earlier often suffer from insufficient immersion, while the wafers taken out later are prone to be soaked for too long and cause damage to the wafers. In other words, the horizontal wafer immersion equipment cannot precisely control the immersion time of each wafer in the chemical immersion tank, which easily affects the yield of the wafer immersion process.

In view of this, it is necessary to provide a wafer wet processing workstation to solve the problems in the prior art.

In order to solve the above-mentioned problems of the conventional technology, the purpose of the present disclosure is to provide a wafer wet processing workstation, which is suitable for cleaning wafers with chip miniaturization and high-density wire layouts to remove the wafers attached to the surface of the wafer during the previous process. Residues, and can accurately control the chemical immersion time of each wafer.

To achieve the above objective, the present disclosure provides a wafer wet processing workstation, which includes a immersion tank, a cassette, a robotic arm, and a single wafer processing equipment. The cassette is arranged in the immersion tank, including a plurality of card slots, and each of the card slots is placed with a wafer, wherein the plurality of card slots are arranged at intervals along a horizontal direction, so that the wafer is perpendicular to the board surface Immerse in the soaking tank pre-filled with process liquid in a horizontal plane. The mechanical arm includes a holding part and a turning part. The wafer is held on the holding part. The turning portion is connected to the holding portion, wherein the turning portion controls the turning of the holding portion relative to the horizontal plane, and the turning portion turns the holding portion 90 degrees so that the wafer has its plate surface parallel to the horizontal plane. Transmit. Single wafer processing equipment is arranged downstream of the immersion tank, wherein the wafer soaked in the process liquid is placed in the single wafer processing equipment, and the single wafer processing equipment applies a cleaning liquid to the plate of the wafer surface.

In a preferred embodiment, the holding portion of the robotic arm includes a pair of clamping arms and at least a pair of clamping jaws. The pair of clamping arms are spaced apart from each other. The pair of clamping jaws are arranged facing each other, and each of the clamping jaws is correspondingly arranged on one of the clamping arms, and each of the clamping jaws is in contact with the edge of the wafer to clamp the wafer on Between the pair of jaws.

In a preferred embodiment, each of the clamping jaws includes a groove, wherein the wafer is fixed in the groove.

In a preferred embodiment, the pair of clamping arms can move relative to each other to change the distance between the pair of clamping arms.

In a preferred embodiment, the wafer wet processing workstation further includes a conveying device adjacent to the robotic arm and arranged between the soaking tank and the single wafer processing equipment, wherein the conveying device will immerse the The wafer of the process liquid is transferred to the single wafer processing equipment. The conveying device includes a telescopic arm, and the telescopic arm can move relative to the holding part of the robot arm to extend between the pair of clamping arms.

In a preferred embodiment, the robotic arm further includes a lifting portion, which drives the holding portion to rise and fall in a vertical direction, and the lifting movement of the lifting portion drives the holding portion to move from the card along the vertical direction. The cassette takes out the wafer, or the holding part is driven to put the wafer into the cassette along the vertical direction by the descending movement of the lifting part.

In a preferred embodiment, the robot arm further includes a telescopic part connected with the turning part to drive the holding part to move along the horizontal direction.

In a preferred embodiment, the contact points between each wafer and the cassette are less than or equal to four.

In a preferred embodiment, the single wafer processing equipment includes a rotary etching table and a rotary cleaning table. The rotary etching table applies a chemical liquid to the plate surface of the wafer to remove the residue attached to the wafer. The rotary cleaning table is arranged downstream of the rotary etching table, and deionized water is applied to the plate surface of the wafer to remove the chemical liquid adhering to the wafer.

In a preferred embodiment, the immersion tank includes a vibrator connected to the cassette, wherein the vibrator vibrates the cassette and also vibrates the wafer placed on the cassette.

Compared with the prior art, the wafer wet processing workstation of the present disclosure can perform a series of cleaning processes such as chemical immersion, chemical liquid spray cleaning, and deionized water cleaning and drying on the wafers to achieve chip miniaturization and high-density wire layout Of wafer cleaning. In addition, the present disclosure provides a vertical immersion tank and a robot arm associated with the immersion tank, and connects the immersion tank, the robot arm, and the controller of the wafer wet processing station, so that the wafer immersion time can be precisely controlled .

In order to make the above and other objectives, features, and advantages of the present disclosure more obvious and understandable, the following will describe the preferred embodiments of the present disclosure in conjunction with the accompanying drawings in detail.

Please refer to FIG. 1, which shows a schematic diagram of a wafer wet processing workstation 1 according to a preferred embodiment of the present disclosure. The wafer wet processing workstation 1 includes an inlet 10, a conveying device 30, a robotic arm 40, a immersion tank 50, a single wafer processing equipment 60, and a discharge port 70. The transfer device 30 is configured to be movable between the inlet 10, the immersion tank 50, the single wafer processing equipment 60, and the outlet 70. The conveying device 30 is adjacent to the robot arm 40. The base of the robotic arm 40 is fixed on one side of the soaking tank 50, and the robotic arm 40 can perform a series of actions relative to the soaking tank 50, and the specific actions will be described in detail later.

The wafer wet processing workstation 1 of the present disclosure can be used to perform a series of cleaning processes such as chemical immersion, chemical liquid spray cleaning, and DI Water cleaning and drying of the wafer. Taking the photoresist stripping process as an example, the wafer to be processed is input from the inlet 10, and the wafer to be processed is transferred to the robotic arm 40 by the transfer device 30. The robotic arm 40 puts the wafer into the immersion tank 50 for chemical immersion, so that the process liquid penetrates into the photoresist, thereby promoting swelling and dissolution of the photoresist. After the wafer is soaked, the robot arm 40 takes out the wafer and transfers it back to the transfer device 30, and transfers the wafer to the single wafer processing equipment 60 by the transfer device 30. Then, a horizontal single-wafer rotating device is used to sequentially apply chemical liquids to the wafers to remove photoresist residues, and apply deionized water to remove the remaining chemical liquids, so that the wafer can be thoroughly cleaned. Finally, the cleaned wafer is transferred to the discharge port 70 by the transfer device 30 for subsequent processing. The transfer of wafers and the actions of related equipment in the wafer wet processing workstation 1 will be described in detail later.

Please refer to FIG. 2, which shows the first action schematic diagram of the robotic arm 40 of the wafer wet processing workstation 1 in FIG. 1. The wafer wet processing workstation 1 also includes a cassette 90 arranged in the immersion tank 50. The cassette 90 includes a plurality of card slots 91, and each of the card slots 91 is used to place a wafer 2. It should be noted that the plurality of card slots 91 are arranged at intervals along the horizontal direction (that is, the X direction), so that the wafer 2 is immersed in the pre-filled process liquid 3 so that the surface of the wafer 2 is perpendicular to the horizontal plane (that is, the XY plane). Slot 50. The wafer wet processing workstation 1 of the present disclosure uses a vertical soaking tank 50 (vertical soaking tank) instead of a horizontal soaking tank. With this design, a plurality of wafers 2 are placed in the immersion tank 50 in the vertical direction, so that the process liquid 3 circulating up and down can fully contact the surface of each wafer 2, which prevents the use of a horizontal immersion tank because the wafers are placed horizontally It hinders the flow of the liquid medicine and the discharge of bubbles, which in turn leads to problems such as poor circulating flow field and back-contamination of impurities. In addition, the immersion tank 50 includes additional components 51 (including vibrators, heaters, circulation pipes, filters, etc.), so that the immersion tank 50 is equipped with heating, circulation, filtration, and vibration. (agitation) and other functions to promote the liquid medicine to keep flowing and fully contact the surface of each wafer 2. The vibrator of the additional component 51 is connected to the cassette 90 and is adjustable. The vibration frequency and amplitude are adjusted by the adjustable vibrator, so that the cassette 90 vibrates and the wafer 2 placed on the cassette 90 vibrates. In this way, the proper vibration of the wafer 2 during the vertical immersion process can promote the reaction between the wafer 2 and the process liquid 3 and prevent the process liquid 3 in the immersion tank 50 from generating flow field obstructions at the edge of the wafer 2.

As shown in FIG. 2, the robot arm 40 is used for picking, placing and transferring the wafer 2. The robot arm 40 includes a base 41, an elevating part 42, a telescopic part 43, a turning part 44, and a holding part 45. The base 41 is fixed on one side of the soaking tank 50. The elevating portion 42 is provided on the base 41 and is used to drive the telescopic portion 43, the turning portion 44, and the holding portion 45 to rise and fall together in the vertical direction (ie, the Z direction). The holding portion 45 is used to take and place the wafer 2 and hold the wafer 2 thereon. In addition, the lifting part 42 drives the holding part 45 to take out the wafer 2 from the cassette 90 in the vertical direction, or the lifting part 42 drives the holding part 45 to move the wafer in the vertical direction. 2Insert the cassette 90. The turning portion 44 is connected between the telescopic portion 43 and the holding portion 45. The telescopic portion 43 is used to drive the turning portion 44 and the holding portion 45 to move along the horizontal direction. Specifically, the telescopic part 43 includes a first section 431 and a second section 432. By controlling the first section 431 to approach the second section 432, the turning portion 44 and the holding portion 45 can be driven to move horizontally toward the base 41. In addition, by controlling the first section 431 to be away from the second section 432, the turning portion 44 and the holding portion 45 can be moved horizontally away from the base 41. The turning portion 44 is used to control the holding portion 45 to perform a turning action 46 relative to the horizontal plane. It should be understood that the robot arm 40 includes sensors, controllers, drivers and other components to achieve the lifting action of the lifting part 42, the telescopic action of the telescopic part 43, the turning action of the turning part 44, and the holding part 45 against the wafer 2 The pick and place action, etc.

Please refer to Figures 3 and 4. Figure 3 shows the second action schematic diagram of the robotic arm 40 of the wafer wet processing workstation 1 in Figure 1, and Figure 4 shows the wafer wet processing workstation 1 in Figure 3 Three-dimensional schematic diagram. As shown in FIGS. 3 and 4, when the wafer 2 is soaked for a certain period of time, the robot arm 40 will take out the wafer 2 that has been soaked. Specifically, the turning portion 44 of the robot arm 40 rotates around an axis to drive the holding portion 45 to turn 90 degrees with respect to the horizontal plane, so that the holding portion 45 is transformed to be perpendicular to the horizontal plane. Then, the telescopic part 43 of the robot arm 40 drives the holding part 45 to move to the upper position of the wafer 2 to be taken out by the relative movement of the first section 431 and the second section 432. Then, the lifting part 42 of the robot arm 40 controls the holding part 45 to move down in the vertical direction to grab the target wafer 2.

Please refer to FIGS. 5 and 6. FIG. 5 shows a partial cross-sectional view of the wafer wet processing workstation 1 in FIG. 4, and FIG. 6 shows a side view of the gripper 452 of the robot arm 40. As shown in FIG. 5, the holding portion 45 of the robot arm 40 includes a pair of clamping arms 451 and two pairs of clamping jaws 452. The pair of clamping arms 451 are adjacent to each other and arranged at intervals. Each pair of clamping jaws 452 of the two pairs of clamping jaws 452 are disposed facing each other, and each clamping jaw 452 is correspondingly disposed on one of the clamping arms 451. That is, in this embodiment, two clamping jaws 452 are connected to each clamping arm 451, and the clamping jaw 452 on the clamping arm 451 and the other clamping jaw 452 on the other clamping arm 451 are mutually connected. Corresponding (for example, when the holding portion 45 is perpendicular to the horizontal plane, the pair of clamping jaws 452 are located at the same level). In addition, that the holding portion 45 grabs the target wafer 2 means that each clamping jaw 452 clamps the wafer 2 between the pair of clamping jaws 452 by contacting the edge of the wafer 2. Specifically, as shown in FIG. 6, each clamping jaw 452 includes a groove 453, and the edge of the wafer 2 is fixed in the groove 453 of the clamping jaw 452. It should be noted that the number of clamping jaws 452 in this embodiment is four, but it is not limited to this.

As shown in FIG. 5, the cassette 90 includes four cross bars 92. A row of card slots 91 is formed on each cross bar 90 for the wafer 2 to be placed. In addition, the wafer 2 placed in the cassette 90 only contacts the cross bar 92. That is, in this embodiment, there are four contact points between each wafer 20 and the cassette 90. It should be understood that in other embodiments, designs with other numbers of contact points can also be used. Preferably, the contact points between each wafer 20 and the cassette 90 are less than or equal to four. In the present disclosure, by designing the cassette 90 to have only four or less contact points with the edge of the wafer 2, the area of the cassette 90 that hinders the flow of the process liquid 3 can be minimized. In addition, the cross bars 92 of the cassette 90 are arranged to correspond to the bottom of the wafer 2 and do not touch the left and right sides of the wafer 2. Therefore, the holding portion 45 of the robot arm 40 can smoothly extend into the cassette 90 without structural interference with the cassette 90.

Please refer to FIG. 7, which shows a schematic diagram of the third action of the robotic arm 40 of the wafer wet processing workstation 1 in FIG. After the holding part 45 of the robot arm 40 grabs the target wafer 2, the lifting part 42 of the robot arm 40 controls the holding part 45 to rise in the vertical direction to take out the wafer 2 from the cassette 90. In the present disclosure, when the robotic arm 40 takes out the wafer 2, the wafer 2 rises in the vertical direction with its plate surface perpendicular to the horizontal plane, so the process liquid 3 easily flows back into the immersion tank 60 due to gravity. It can avoid that when the wafer 2 rises, a large amount of process liquid 3 is entrained on the surface of the wafer 2, which causes waste of the process liquid 3 and contamination of the robot arm 40. In addition, the cassette 90 of the present disclosure does not need to be moved (for example, to leave the immersion tank 50), but the robot arm 40 enters the immersion tank 50 to pick and place wafers.

Please refer to FIG. 8, which shows the first corresponding action diagram of the robotic arm 40 and the transfer device 30 of the wafer wet processing workstation 1 in FIG. 1. After the robotic arm 40 takes out the wafer 2 from the cassette 90, the turning portion 44 of the robotic arm 40 turns the holding portion 45 by 90 degrees so that the wafer 2 is transported with its plate surface parallel to the horizontal plane. Then, the robot arm 40 transfers the immersed wafer to the transfer device 30.

Please refer to Figures 9 and 10. Figure 9 shows the second corresponding action diagram of the robotic arm 40 and the transfer device 30 of the wafer wet processing workstation 1 in Figure 1, and Figure 10 shows the wafer in Figure 1 A schematic diagram of the second corresponding action of the robotic arm 40 and the conveying device 30 of the wet processing workstation 1. As shown in FIG. 9, the conveying device 30 includes a telescopic arm 31. The telescopic arm 31 can move relative to the holding portion 45 of the robot arm 40. Specifically, when the wafer on the robotic arm 40 is to be removed, the telescopic arm 31 of the transfer device 30 extends between the pair of clamping arms 451 of the robotic arm 40 and is located below the wafer 2. In addition, the telescopic arm 31 can use appropriate components to hold the wafer 2 thereon, such as a vacuum chuck, a clamping mechanism, and the like. As shown in FIG. 10, after the transfer device 30 fixes the wafer 2 on it, the pair of clamping arms 451 of the robot arm 40 can move relative to each other to change the distance between the clamping arms 451, thereby releasing the pair of crystals. The round clamp is fixed. Specifically, the relative movement of the pair of clamping arms 451 described here means that the pair of clamping arms 451 move away from each other to increase the distance between them (the distance is greater than the diameter of the wafer 2), Then the robot arm 40 will release the clamping and fixing of the wafer. It is understandable that when the pair of clamping arms 451 is clamping the wafer 2, the pair of clamping arms 451 first move away from each other to increase the distance between the two (the distance is greater than the wafer 2 Diameter), and then move closer to each other to reduce the distance between the two (the distance is approximately equal to the diameter of the wafer 2) to clamp the wafer 2 between the two. Then, the telescopic arm 31 of the transfer device 30 moves in a direction away from the robot arm 40, and the transfer device 30 transfers the wafer 2 downstream. Specifically, as shown in FIG. 1, the transfer device 30 is adjacent to the robot arm 40 and is provided between the immersion tank 50 and the single wafer processing equipment 60. The transfer device 30 is configured to transfer the wafer 2 immersed in the process liquid 3 to the single wafer processing equipment 60 downstream.

As shown in FIG. 1, the single wafer processing equipment 60 is arranged downstream of the immersion tank 50 for carrying the wafer 2 immersed in the process liquid 3 and applying cleaning liquid to the surface of the wafer 2. In this embodiment, the single wafer processing equipment 60 includes a first rotary etching table 610, a second rotary etching table 620, and a rotary cleaning table 630. The second rotary etching stage 620 is arranged downstream of the first rotary etching stage 610, and the rotary cleaning stage 630 is arranged downstream of the second rotary etching stage 620, so the wafer 2 will be sequentially placed on the first rotary etching stage 610, The second rotary etching table 620, and the rotary cleaning table 630. When the wafer 2 is placed on the first rotary etching stage 610 and the second rotary etching stage 620, different chemical liquids are applied to the surface of the wafer 2 to remove the residue attached to the wafer 2 . Moreover, when the wafer 2 is placed on the rotating cleaning table 630, the wafer 2 will be applied with deionized water to the surface of the wafer 2 to remove the chemical liquid attached to the wafer 2. For example, please refer to Fig. 11, which shows the working schematic diagram of the rotating table of the wafer wet processing workstation 1 in Fig. 1. The rotating table in FIG. 11 may be a part of the first rotating etching table 610, the second rotating etching table 620, or the rotating cleaning table 630. The rotating table includes a rotating seat 601, a carrying table 602, and a liquid supply device 603. The wafer 2 is placed on the carrier 602. The rotating seat 601 can rotate around an axis to drive the wafer 2 placed on it to rotate. The liquid supply device 603 can provide a corresponding liquid (such as chemical liquid or deionized water) to the surface of the wafer 2. Therefore, the wafer 2 can be cleaned with wafer miniaturization and high-density wire layout by performing the above-mentioned series of cleaning processes in the wafer wet processing workstation 1.

In summary, the wafer wet processing workstation of the present disclosure can be used to perform a series of cleaning processes such as chemical soaking, chemical liquid spraying, and DI Water cleaning and drying on the wafers, so as to realize the miniaturization and miniaturization of wafers. Cleaning of wafers with high-density wire layout. In addition, the wafer wet processing workstation of the present disclosure replaces the horizontal immersion tank with a vertical immersion tank. With this design, the wafers are placed in the immersion tank in the vertical direction, so that the process liquid circulating up and down can fully contact the surface of each wafer. This prevents the use of a horizontal immersion tank from obstructing the flow of the chemical liquid due to the horizontal placement of the wafer. Air bubbles are discharged, which in turn leads to problems such as poor circulating flow field and impurities back-wetting. On the other hand, the present disclosure provides a vertical immersion tank and a robot arm associated with the immersion tank, and connects the immersion tank, the robot arm, and the controller of the wafer wet processing station, so that the wafer can be precisely controlled. Soaking time. For example, for a wafer that is immersed first, when the predetermined immersion time is reached, the controller can instruct the robotic arm to first remove the wafer from the vertical immersion tank, so that precise control of each wafer in the chemical immersion tank can be achieved The soaking time.

The above are only the preferred embodiments of the present disclosure. It should be pointed out that for those skilled in the art, without departing from the principles of the present disclosure, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the present disclosure. protected range.

1: Wafer wet processing workstation 10: Inlet 30: Conveyor 31: Telescopic boom 40: mechanical arm 41: Pedestal 42: Lifting part 43: Telescopic part 431: first paragraph 432: second paragraph 44: Flip part 45: holding part 451: Clamping arm 452: Gripper 453: groove 46: flip action 50: Soaking tank 51: additional components 60: Single wafer processing equipment 610: The first rotary etching table 620: The second rotary etching table 630: Rotary cleaning table 601: Rotating seat 602: Carrier 603: Liquid Supply Device 70: Outlet 90: cassette 91: card slot 92: Crossbar 2: Wafer 3: Process liquid X, Y, Z: direction

Figure 1 shows a schematic diagram of a wafer wet processing workstation according to a preferred embodiment of the present disclosure; Figure 2 shows a schematic diagram of the first action of the robotic arm of the wafer wet processing workstation in Figure 1; Figure 3 shows a schematic diagram of the second action of the robotic arm of the wafer wet processing workstation in Figure 1; Figure 4 shows a three-dimensional schematic diagram of the wafer wet processing workstation shown in Figure 3; Figure 5 shows a partial cross-sectional view of the wafer wet processing workstation in Figure 4; Figure 6 shows the side view of the gripper of the robotic arm; Figure 7 shows a schematic diagram of the third action of the robotic arm of the wafer wet processing workstation in Figure 1; Figure 8 shows a schematic diagram of the first corresponding action of the robotic arm and the transfer device of the wafer wet processing workstation in Figure 1; Figure 9 shows a schematic diagram of the second corresponding action of the robotic arm and the transfer device of the wafer wet processing workstation in Figure 1; Figure 10 shows a schematic diagram of the second corresponding action of the robotic arm and the transfer device of the wafer wet processing workstation in Figure 1; and Figure 11 shows the working schematic diagram of the rotating table of the wafer wet processing workstation in Figure 1.

1: Wafer wet processing workstation

10: Inlet

30: Conveyor

40: mechanical arm

50: Soaking tank

60: Single wafer processing equipment

610: The first rotary etching table

620: The second rotary etching table

630: Rotary cleaning table

70: Outlet

Claims (10)

A wafer wet processing workstation, including: A soaking tank; A cassette is set in the soaking tank, and includes a plurality of card slots, and each of the card slots is placed with a wafer, wherein the plurality of card slots are arranged at intervals along a horizontal direction, so that the wafer is arranged on its surface Immerse into the soaking tank pre-filled with process liquid in a manner perpendicular to a horizontal plane; A robotic arm, including: A holding part, wherein the wafer is held on the holding part; and A turning part connected to the holding part, wherein the turning part controls the holding part to be turned over relative to the horizontal plane, and turning the holding part 90 degrees by the turning part makes the wafer parallel to the horizontal plane with its plate surface Way of delivery; and A single wafer processing equipment is arranged downstream of the immersion tank, wherein the wafer immersed in the process liquid is placed in the single wafer processing equipment, and the single wafer processing equipment applies a cleaning liquid to the wafer The board surface. For example, the wafer wet processing workstation of claim 1, wherein the holding part of the robot arm includes: A pair of clamping arms, spaced apart from each other; and At least a pair of clamping jaws are arranged facing each other, wherein each clamping jaw is correspondingly arranged on one of the clamping arms, and each clamping jaw contacts the edge of the wafer to clamp the wafer Hold between the pair of jaws. For example, the wafer wet processing workstation of claim 2, wherein each of the clamping jaws includes a groove, and the wafer is fixed in the groove. Such as the wafer wet processing workstation of claim 2, wherein the pair of clamping arms can move relative to each other to change the distance between the pair of clamping arms. For example, the wafer wet processing workstation of claim 2, wherein the wafer wet processing workstation further includes a conveying device adjacent to the robotic arm and arranged between the soaking tank and the single wafer processing equipment, wherein the conveying device Transferring the wafer soaked in the process liquid to the single wafer processing equipment; and The transmission device includes a telescopic arm, and the telescopic arm can move relative to the holding part of the mechanical arm to extend between the pair of clamping arms. For example, the wafer wet processing workstation of claim 1, wherein the robot arm further includes a lifting part that drives the holding part to rise and fall along a vertical direction, and the lifting part drives the holding part along the vertical direction The wafer is taken out from the cassette in the direction, or the holding portion is driven to place the wafer into the cassette along the vertical direction by the descending movement of the lifting portion. For example, the wafer wet processing workstation of claim 1, wherein the robot arm further includes a telescopic part connected with the turning part to drive the holding part to move along the horizontal direction. For example, the wafer wet processing workstation of claim 1, wherein the contact points between each wafer and the cassette are less than or equal to four. Such as the wafer wet processing workstation of claim 1, wherein the single wafer processing equipment includes: A rotary etching table, applying a chemical liquid to the surface of the wafer to remove residues attached to the wafer; and A rotary cleaning table is arranged downstream of the rotary etching table, and deionized water is applied to the plate surface of the wafer to remove the chemical liquid adhering to the wafer. For example, the wafer wet processing workstation of claim 1, wherein the immersion tank includes a vibrator connected to the cassette, and the vibrator vibrates the cassette and also vibrates the wafer placed on the cassette .

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