TWI812409B - Horizontal and vertical transpose device - Google Patents

Abstract

This invention is a horizontal and vertical transposition device, including a moving mechanism, a wafer cassette and a transposition mechanism; the moving mechanism includes a cassette frame; the wafer cassette is pivoted to the cassette frame; the transposition mechanism includes a moving mechanism The transpose driver, as well as the movable rod, the swing arm frame and the two swing arms. The movable rod connects the swing arm frame and the transpose driver. The two ends of the swing arm are respectively pivotally connected to the wafer cassette and the swing arm frame. When it is necessary to move the wafer When immersed in the chemical solution, the transpose driver drives the movable rod to drive the swing arm to push the wafer cassette to pivot relative to the cassette frame so that the edge of the wafer faces the notch of the immersion tank and moves the wafer relative to the chemical solution. When the liquid surface is placed vertically, the metal stripped from the wafer surface will sink directly to the bottom of the immersion tank without depositing on the surface of other wafers, which can improve the quality of the finished wafer.

Description

Horizontal and vertical transposition devices

This invention relates to devices for semiconductor manufacturing processes, specifically a horizontal and vertical transposition device.

The manufacturing of semiconductor wafers includes a metal stripping process. A common practice currently is to soak the wafers in a chemical solution. Through the interaction between the chemical solution and the wafer surface, the metal that needs to be removed is peeled off from the surface of the wafer. .

Usually, during the process of soaking wafers for metal stripping, multiple wafers are placed side by side through a wafer cassette, and the wafers are placed in batches into a soaking tank containing chemical solution, and multiple wafers are processed at one time. Metal stripping is carried out in circles to improve the efficiency of the process.

However, when loading wafers into the immersion tank through wafer cassettes, since most wafer cassettes arrange multiple wafers side by side from top to bottom, and each wafer is placed horizontally, when the wafers are placed downward into the immersion tank, When immersed in the tank, the metal stripped from the wafer surface may sink due to gravity and deposit on the surface of the wafer below, causing the metal stripping effect to be poor and resulting in poor quality of the final wafer product. Specification requirements.

In order to solve the problem that when the existing wafer cassette loads the wafers into the soaking tank, multiple wafers are placed side by side, and each wafer is placed horizontally, resulting in poor metal stripping effect, the purpose of this creation is to propose a method that can A horizontal and vertical transposition device that transposes the wafers carried by the wafer cassette from horizontal placement to vertical placement.

The horizontal and vertical transposition device proposed by this creation to solve the technical problem includes: A moving mechanism, which includes a cassette frame; the moving mechanism can be driven to move and bring the cassette frame close to or away from a soaking tank; a wafer cassette, which is pivotally connected to the cassette frame and is provided with a plurality of two side-by-side accommodating parts; each accommodating part can accommodate a wafer; and a transposition mechanism, which includes a transposition driver provided on the moving mechanism, a movable rod, a swing arm frame and two swing arms, the The movable rod is connected to the transposition driver; the swing arm frame is fixed to the movable rod; each swing arm includes a first end and a second end that are opposite to each other, and the first ends of the two swing arms are respectively pivoted to the swing arm. On both sides of the arm, the second ends of the two swing arms are respectively pivotally connected to both sides of the wafer cassette. The two swing arms can be driven by the transpose driver to swing and push the wafer cassette relative to the cassette. The magazine frame is pivoted so that the edge of the wafer accommodated in each receiving portion faces a notch of the soaking tank.

The horizontal and vertical transposition device, wherein the moving mechanism includes a main moving base and a sleeve; the sleeve fixes the main moving base and the cassette frame; the transposition driver is located on the main moving base base, the movable rod system can move through the main moving base, the sleeve and the cassette frame.

The horizontal and vertical transposition device, wherein the cassette frame includes a connecting plate and two lifting lug plates, the connecting plate is fixed to the casing, and the two lifting lug plates are respectively connected from both ends of the connecting plate. Extended, the two lifting lug plates are respectively pivotally connected to both sides of the wafer cassette; the swing arm frame and the two swing arms are located between the two lifting lug plates.

The horizontal and vertical transposition device, wherein the wafer cassette includes two setting plates and two cassette side plates; the two cassette side plates are located on both sides of the wafer cassette; each of the cassette side plates is connected to the wafer cassette. The two setting plates are provided with a plurality of latching slots arranged side by side; each receiving portion is formed by two opposite latching slots in the side plates of the two cassettes.

The horizontal and vertical transposition device, wherein the wafer cassette includes two blocking posts, each of which is connected to the two setting plates; when the edge of the wafer accommodated in each of the receiving portions faces the immersion When the notch of the slot is formed, the positions of the two retaining posts are lower than the positions of the two setting plates.

The horizontal and vertical transposition device, wherein the wafer cassette includes two setting plates, two cassette side plates, and two blocking posts. The two cassette side plates are located on both sides of the wafer cassette; The cassette side plates are connected to the two setting plates and are provided with a plurality of cassette slots arranged side by side; each blocking post is connected to the two setting plates and is provided with a plurality of annular grooves arranged side by side; each receiving portion is composed of the two cassette side plates and Among the two blocking posts, two of the blocking grooves and two of the ring grooves are oppositely positioned; when the edge of the wafer accommodated in each receiving portion faces the opening of the soaking tank, the position of the two blocking posts is below the position of the two setting plates.

The horizontal and vertical transposition device, wherein the wafer cassette includes two first fixed shafts arranged coaxially and two second fixed shafts arranged coaxially, the two first fixed shafts and the two second fixed shafts Off-axis arrangement; the cassette frame is combined with the two first fixed shafts and can pivot relative to the wafer cassette with the first fixed shafts as the axis; the two swing arms are respectively connected with the two second fixed shafts The combination is capable of relatively pivoting with the wafer cassette with the corresponding second fixed axis as an axis.

In the horizontal and vertical transposition device, the cassette frame of the moving mechanism is provided with two pivot holes and two bearings; the two bearings are respectively sleeved on the first fixed shafts on the two pivot plates, and are respectively Set by the two pivot holes; each swing arm is provided with a pivot hole and a rotation bearing; the rotation bearing is sleeved with the corresponding one of the second fixed shafts and is supported by the pivot hole. Set.

In the horizontal and vertical transposition device, the transposition driver is a linear slide rail.

The efficiency improvements that can be obtained by the technical means of this creation are:

1. Compared with the existing wafer cassette when loading wafers into the soaking tank, multiple wafers are placed side by side, and each wafer is placed horizontally, so that the metal stripped from the wafer surface is easily deposited on the wafer below. On the surface; the horizontal and vertical transposition device of this invention drives the wafer cassette to pivot relative to the cassette frame through the transposition driver, so that the original surface faces the notch of the immersion tank and faces the chemical in the immersion tank. The liquid level of the solution is deflected by multiple wafers placed horizontally. Each wafer faces the edge of the immersion tank and is placed vertically relative to the liquid level of the chemical solution. Metal stripping is performed after being immersed in the chemical solution. process, since each The metal stripped off the surface of the wafer will sink directly to the bottom of the soaking tank and will not be deposited on the surface of other wafers. This can improve the effect of the metal stripping process and improve the quality of the final wafer product.

2. The horizontal and vertical transposition device of this invention can change the edge of each wafer to face the notch of the immersion tank before immersing the wafer cassette into the chemical solution contained in the immersion tank, that is, The wafers are placed vertically relative to the liquid level of the chemical solution in the immersion tank. In this way, during the process of immersing the plurality of wafers and the wafer cassette downward into the chemical solution, the wafers are placed vertically relative to the liquid level of the chemical solution. The contact area between the circle and the chemical solution is small, and the resistance it receives is also small, making the process of soaking in the chemical solution smoother.

10: Main drive

20:Mobile mechanism

21: Main mobile base

22:casing

23: Cassette rack

231:Connection board

232: Lifting ear plate

233: Pivot hole

234:Bearing

30:Wafer cassette

31: Setting board

32: Cassette side panel

321:Card slot

33:Blocking post

331: Ring groove

34: Pivot plate

341:Fixed shaft

40:Transposition mechanism

41: Transpose the drive

411:Orbit

412:Sliding seat

42: Connecting rod assembly

421:movable lever

422: Swing arm frame

423:Swing arm

424: Pivot hole

425:Transposed bearing

90:Trough cover

91: Maintenance window

92: Casing sealing

T: soaking tank

W:wafer

Figure 1 is a three-dimensional appearance view of the preferred embodiment of the present invention in use.

Figure 2 is a three-dimensional appearance view of the preferred embodiment of this invention.

Figure 3 is a side view of the preferred embodiment of the present invention, omitting part of the sleeve and the movable rod.

Figure 4 is a partially enlarged three-dimensional appearance view of the preferred embodiment of the present invention.

Figure 5 is a partially enlarged side view of the preferred embodiment of the present invention.

Figure 6 is an exploded view of some components of the preferred embodiment of the present invention.

Figures 7-8 are side views of the preferred embodiment of the invention.

Figure 9 is an action diagram of the preferred embodiment of the invention in use.

In order to understand the technical characteristics and practical effects of this invention in detail, and to realize it according to the content of the invention, the preferred embodiment as shown in the figures is further described in detail as follows: As shown in Figures 1 and 2, this invention A horizontal and vertical transposition device of a preferred embodiment is created, which includes a main driver 10 , a moving mechanism 20 , a wafer cassette 30 and a transposition mechanism 40 .

As shown in Figures 1 and 2, the moving mechanism 20 is provided on the main driver 10 and can be driven by the main driver 10 to move and approach a soaking tank T containing a chemical solution. In this preferred embodiment In this example, the main driver 10 uses a linear slide rail, which includes an upright rail and a slide block that can move along the rail. The moving mechanism 20 is fixed on the slide block of the main driver 10, and It can be driven by the main driver 10 to move up and down, thereby approaching or moving away from the soaking tank T located below; the operating principle and detailed structural features of the linear slide rail are common technologies in the relevant fields, and will not be discussed here. To elaborate further; in other preferred embodiments, as long as the main driver 10 can drive the moving mechanism 20 to move and be close to the soaking tank T, the main driver 10 can also be a pressure cylinder or a motor with a chain, gear or connection. A conventional power device such as a rod or a combination of a power device and a transmission mechanism.

As shown in Figures 1 to 3, the moving mechanism 20 includes a main moving base 21, a sleeve 22 and a cassette frame 23; the main moving base 21 is fixedly coupled to the slider of the main driver 10. The sleeve 22 is arranged upright and fixedly connected to the main moving base 21 and the cassette frame 23; as shown in Figures 3 to 5, the cassette frame 23 includes a connecting plate 231 and two lifting lug plates 232. The plate 231 is fixed to the sleeve 22; the two lifting lug plates 232 respectively extend downward from both ends of the connecting plate 231, and the two lifting lug plates 232 are respectively pivotally connected to both sides of the wafer cassette 30.

As shown in FIGS. 3 to 5 , the transposition mechanism 40 is provided on the moving mechanism 20 and includes a transposition driver 41 and a link assembly 42 ; the transposition driver 41 is provided on the main moving base of the moving mechanism 20 21; the link assembly 42 is combined with the transposition driver 41 and can be driven by the transposition driver 41 to move relative to the moving mechanism 20 and drive the wafer cassette 30 to pivot relative to the moving mechanism 20; in this article In a preferred embodiment, the transpose driver 41 is the same as the main driver 10 and uses a linear slide rail, which includes a track 411 and a slide base 412 that can move along the track. The link assembly 42 is combined with The sliding seat 412 of the transposed driver 41 can be driven by the transposed driver 41 to move relative to the moving mechanism 20. The operating principle and detailed structural features of the linear slide rail are common knowledge in the relevant fields. Technology will not be described in detail here.

As shown in Figures 3 to 6, the link assembly 42 includes a movable rod 421, a swing arm frame 422 and two swing arms 423. The movable rod 421 passes through the main moving base 21, the sleeve 22 and the card. Box rack 23, And the end of the movable rod 421 close to the main moving seat 21 is fixed to the sliding seat 412 of the transposition driver 41, and the end of the movable rod 421 close to the cassette frame 23 is fixedly combined with the swing arm frame 422; The appearance of the swing arm frame 422 is similar to the appearance of the cassette frame 23. It also includes a connecting plate and two lifting lug plates. The center of the connecting plate of the swing arm frame 422 is fixedly combined with the movable rod 421. The two lifting lug plates of the arm frame 422 respectively extend downward from both ends of the connecting plate of the swing arm frame 422. The size of the swing arm frame 422 is smaller than the size of the cassette frame 23, and the swing arm frame 422 and the The two swing arms 423 are located between the two lifting lug plates 232 of the cassette frame 23; each of the swing arms 423 includes a first end and a second end that are opposite to each other, and the first ends of the two swing arms 423 are respectively pivoted. On the two lifting lug plates of the swing arm frame 422, the second ends of the two swing arms 423 are respectively pivotally connected to both sides of the wafer cassette 30.

The detailed pivot structure of the above-mentioned moving mechanism 20 and the wafer cassette 30 and the transposition mechanism 40 and the wafer cassette 30 will be introduced below together with the structural description of the wafer cassette 30 .

As shown in FIGS. 4 to 6 , the wafer cassette 30 includes two setting plates 31 , two cassette side plates 32 , two blocking posts 33 and two pivot plates 34 ; the two setting plates 31 are parallel, and the two cassettes Side plates 32 are respectively located on both sides of the wafer cassette 30. Each cassette side plate 32 connects the two setting plates 31 and includes a plurality of card slots 321 arranged side by side. The plurality of card slots of each cassette side plate 32 321 are respectively opposite to the plurality of slots 321 of the other cassette side plate 32 , that is, each slot 321 of each cassette side plate 32 is opposite to one of the corresponding slots 321 of the other cassette side plate 32 . The positions of the card slots 321 are opposite; the two blocking posts 33 are connected to the two setting plates 31 for blocking a plurality of wafers W.

As shown in FIGS. 4 to 6 , in this preferred embodiment, each retaining post 33 is further concavely provided with a plurality of annular annular grooves 331 , and the multiple annular grooves 331 of each retaining post 33 are respectively connected with another one. The plurality of annular grooves 331 of the blocking post 33 are in opposite positions, and any two opposite annular grooves 331 are in opposite positions to two opposite slots 321 of the two cassette side plates 32 to jointly form a receiving portion. The annular groove 331 mated with the card groove 321 ensures that each wafer W can be placed more stably and is less likely to swing arbitrarily in the wafer cassette 30 .

As shown in FIGS. 4 to 6 , the two pivot plates 34 are respectively fixed on the two cassette side plates 32 and located on both sides of the wafer cassette 30 . Each of the pivot plates 34 is T-shaped, and its Two fixed shafts 341 spaced apart are fixedly provided on the top. The two fixed shafts 341 are respectively defined as a first fixed shaft and a second fixed shaft. The two first fixed shafts of the two pivot plates 34 are coaxially arranged. The two second fixed shafts of the two pivot plates 34 are coaxially arranged, and the first fixed shaft and the second fixed shaft are arranged off-axis, that is, non-coaxially arranged; the cassette frame 23 is combined with the two pivot plates 34 is provided with a first fixed axis, and the cassette frame 23 and the wafer cassette 30 can relatively pivot with the first fixed axis as the axis; the two swing arms 423 are respectively connected with the two pivot plates 34 The second fixed shaft is combined and can pivot relative to the wafer cassette 30 with the second fixed shaft as the axis.

More specifically, in this preferred embodiment, each lug plate 232 of the cassette frame 23 is provided with a pivot hole 233 and a bearing 234. The bearing 234 is sleeved on the corresponding one of the pivot plates. 34, and is sleeved by the pivot hole 233, whereby the two lifting lug plates 232 of the cassette frame 23 are respectively pivotally connected to the two pivot plates 34; each swing arm 423 is provided with a The pivot hole 424 and a transposition bearing 425 are sleeved on the corresponding second fixed shaft of one of the pivot plates 34 and are sleeved by the pivot hole 424, whereby the Each of the two swing arms 423 is pivotally connected to a corresponding one of the pivot plates 34 .

Through the above-mentioned structure of the transposition mechanism 40, the moving mechanism 20 and the wafer cassette 30 being pivotally connected, as shown in Figures 7 and 8, before the horizontal and vertical transposition devices are in operation, the wafer cassette The plurality of wafers W carried by 30 are arranged side by side, and each wafer W is placed with its surface facing downwards to a notch of the immersion tank T, that is, it is placed horizontally relative to the liquid level of the chemical solution in the immersion tank T; then, When the movable rod 421 is driven by the transposition driver 41 and moves downward relative to the moving mechanism 20, the swing arm frame 422 will move downward relative to the moving mechanism 20 together with the movable rod 421. At this time, the two swing arms 423 will be driven by the swing arm frame 422 to swing, and push the wafer cassette 30 to pivot relative to the cassette frame 23 with the first fixed axes on the two pivot plates 34 as the axis. When the wafer cassette 30 is pivoted, the wafer cassette 30 accommodates a plurality of wafers W Subsequently, the wafers W among the plurality of side-by-side wafers W are deflected so that the edge of each wafer W faces the notch of the immersion tank T, that is, it is placed vertically relative to the liquid level of the chemical solution in the immersion tank T.

In this preferred embodiment, the transposition mechanism 40 and the moving mechanism 20 are configured to pass through the sleeve 22 and the movable rod 421 of the cassette frame 23 in conjunction with the swing arm frame 422 and the two swing arms 423 To perform the operation, in fact, in other embodiments, the moving mechanism 20 can omit the setting of the sleeve 22, and the movable rod 421 does not penetrate the cassette frame 23, as long as the movable rod 421 is fixed The swing arm frame 422 and the two swing arms 423 are pivotally connected to the wafer cassette 30 and the swing arm frame 422, and can also achieve the effect of pushing the wafer cassette 30 to pivot relative to the cassette frame 23; this is better. The advantage of this embodiment is that the movable rod 421 is designed to penetrate the sleeve 22 and the cassette frame 23, so that the transposition mechanism 40 and the moving mechanism 20 are closely arranged, thereby reducing the space occupied.

In addition, in this preferred embodiment, the movable rod 421 passes through the cassette frame 23, and is fixed to the swing arm frame 422 of the movable rod 421 and the two swing arms pivotally connected to the swing arm frame 422. 423 is located between the two lifting lug plates 232 of the cassette frame 23 to further reduce the space occupied by the transposition mechanism 40 and the moving mechanism 20 .

In this preferred embodiment, the transposition mechanism 40 adopts the transposition driver 41 of a linear slide rail. In fact, in other embodiments, the transposition driver 41 of the transposition mechanism 40 can also be used. Motor or cylinder. When using a motor, it can be used with transmission components such as gears and racks to achieve the same effect as the transposition driver 41 using linear slide rails in this preferred embodiment, and even the transposition of the transposition mechanism 40 When the driver 41 adopts a pressure cylinder, the end of a piston rod of the transposition driver 41 using the pressure cylinder can be directly fixedly coupled to the wafer cassette 30, and the transposition driver 41 is directly connected to the end of the wafer cassette 30 in a pivotal manner. method, as long as the wafer cassette 30 is pivotally connected to the cassette frame 23 of the moving mechanism 20 and connected to the transposition driver 41, and the wafer cassette 30 can be driven by the transposition driver 41 relative to the cassette. When the rack 23 is pivoted, the edge of the wafer W accommodated in each receiving portion of the wafer cassette 30 can be directed toward the notch of the soaking tank T.

As shown in FIG. 8 , in this preferred embodiment, when the edges of the plurality of wafers W carried by the wafer cassette 30 face the slot of the soaking tank T below, the positions of the two blocking posts 33 are low. The position of the two cassette side plates 32 is used to prevent the plurality of wafers W from falling from the wafer cassette 30. In fact, in other embodiments, the two blocking posts 33 can be omitted and instead In order to connect a baffle between the two cassette side plates 32, that is, the two cassette side plates 32 and the baffle form an integral body. When multiple wafers W are placed vertically, the above-mentioned baffle can also be used to achieve The effect of preventing multiple wafers W from falling.

In this preferred embodiment, each of the receiving portions of the wafer cassette 30 is composed of two of the oppositely positioned cassette slots 321 and two of the two cassette side plates 32 and the two blocking posts 33 . The annular groove 331 is formed by the annular groove 331. In fact, in other embodiments, each blocking post 33 can be used simply to block the wafer W, eliminating the need for multiple annular grooves 331, and each of the receiving portions is It is formed by two opposite card slots 321 in the two cassette side plates 32 .

The horizontal and vertical transposition device of the preferred embodiment of this invention is actually used as shown in Figure 1. A tank cover 90 is provided on the soaking tank T. When the horizontal and vertical transposition device is not in operation, the moving mechanism 20 The cassette frame 23, the wafer cassette 30, and the swing arm frame 422 and the swing arm 423 of the transposition mechanism 40 are all stationary and located inside the slot cover 90, and the slot cover 90 is provided with a maintenance window 91 In order to observe whether the above-mentioned components located in the groove cover 90 need maintenance; in addition, the groove cover 90 is provided with a casing sealing seat 92, and the casing sealing seat 92 is provided with a fitting hole, and there is a fitting hole in the fitting hole. Bearing, the sleeve 22 of the moving mechanism 20 is sleeved by the bearing provided in the matching hole of the sleeve seal 92, and when the moving mechanism 20 is driven by the main driver 10, the sleeve 22 can be relatively The casing seal 92 moves up and down.

The operation process of the horizontal and vertical transposition device is as follows. Before entering the immersion tank T for immersion and performing the metal stripping process, as shown in Figure 2 and Figure 7, multiple wafers W that have completed the previous process are placed side by side. It is accommodated in the wafer cassette 30, and each wafer W has its surface facing the slot of the immersion tank T below, so that it is placed horizontally relative to the liquid level of the chemical solution in the immersion tank T; at this time, first The transposition driver 41 is controlled to start to drive the wafer cassette 30 to pivot relative to the cassette frame 23, as shown in Figure 7 As shown in Figure 8, the plurality of wafers W accommodated in the wafer cassette 30 are deflected accordingly, so that among the plurality of side-by-side wafers W, each wafer W changes its edge to face the notch of the soaking tank T. , that is, placed vertically relative to the liquid level of the chemical solution in the immersion tank T.

As shown in FIG. 9 , then, the main driver 10 is controlled to start, driving the moving mechanism 20 to move downward and driving the wafer cassette 30 and the transposition mechanism 40 to move downward together, so that the cassette rack 23 and the The wafer cassette 30 is close to the immersion tank T, so that the wafer cassette 30 is immersed in the chemical solution contained in the immersion tank T to perform the metal stripping process; after the immersion is completed, the main driver 10 is controlled to drive the movement The mechanism 20 moves upward and returns to its original position, and then controls the transposition driver 41 to drive the wafer cassette 30 to pivot relative to the cassette frame 23, and the plurality of wafers W accommodated in the wafer cassette 30 accordingly Yaw, so that among the multiple wafers W side by side, each wafer W changes its surface to face the notch of the immersion tank T, that is, it is placed horizontally relative to the liquid level of the chemical solution in the immersion tank T, so that The subsequent conveying operation and the metal stripping process of the next batch of wafers W are performed.

Compared with the existing wafer cassette when loading wafers into the soaking tank, multiple wafers are placed side by side, and each wafer is placed horizontally, so that the metal stripped from the surface of the wafer is easily deposited on the surface of the wafer below. ; The horizontal and vertical transposition device of this invention drives the wafer cassette 30 to pivot relative to the cassette frame 23 through the transposition driver 41, so that the surface originally faces the notch of the soaking tank T, and faces the notch of the soaking tank T. The liquid level of the chemical solution in the wafer W is deflected horizontally. Each wafer W has its edge facing the slot of the immersion tank T, and the liquid level of the chemical solution in the immersion tank T is vertical. When placed, when immersed in a chemical solution for the metal stripping process, the metal stripped from the surface of each wafer W will directly sink to the bottom of the immersion tank T, and will not be deposited on the surface of other wafers W. It can improve the effect of the metal stripping process and improve the quality of the final product of wafer W.

In addition, the horizontal and vertical transposition device of the present invention can change the edge of each wafer W to face the immersion tank T before immersing the wafer cassette 30 into the chemical solution contained in the immersion tank T. mouth, that is, it is placed vertically relative to the liquid level of the chemical solution in the immersion tank T; in this way, many times When the wafer W and the wafer cassette 30 are immersed downward into the chemical solution, the contact area between the wafer W and the liquid surface of the chemical solution is small, and the resistance it receives is also small. Being smaller makes the process of soaking in the chemical solution smoother.

The above are only preferred embodiments of the present invention and do not impose any formal restrictions on the present invention. Anyone with ordinary knowledge in the technical field can use the present invention without departing from the scope of the technical solution proposed by the present invention. Equivalent embodiments with partial changes or modifications to the technical content disclosed in the creation, and which do not deviate from the content of the technical solution of this creation, still fall within the scope of the technical solution of this creation.

10: Main drive

20:Mobile mechanism

21: Main mobile base

22:casing

23: Cassette rack

30:Wafer cassette

40:Transposition mechanism

41: Transpose the drive

42: Connecting rod assembly

Claims (9)

A horizontal and vertical transposition device, which includes: a moving mechanism, which includes a cassette rack; the moving mechanism can be driven to move and move the cassette rack close to or away from a soaking tank; a wafer cassette, which Pivotably connected to the cassette frame, a plurality of side-by-side accommodating parts are provided; each accommodating part can accommodate a wafer; and a transposition mechanism, which includes a transposition driver and a movable lever provided on the moving mechanism. , a swing arm frame and two swing arms, the movable rod is connected to the transposition driver; the swing arm frame is fixed to the movable rod; each of the swing arms includes a first end and a second end that are oppositely positioned, and the two swing arms are The first end of the swing arm is pivotally connected to both sides of the swing arm frame, and the second ends of the two swing arms are respectively pivotally connected to both sides of the wafer cassette. The two swing arms can be driven by the transposition driver to swing. , and push the wafer cassette to pivot relative to the cassette frame, so that the edge of the wafer accommodated in each receiving portion faces a notch of the soaking tank. The horizontal and vertical transposition device according to claim 1, wherein the moving mechanism includes a main moving base and a sleeve; the sleeve fixes the main moving base and the cassette frame; the transposition driver device On the main moving base, the movable rod can movably pass through the main moving base, the sleeve and the cassette frame. The horizontal and vertical transposition device of claim 2, wherein the cassette frame includes a connecting plate and two lifting lug plates, the connecting plate is fixed to the casing, and the two lifting lug plates are respectively connected from the connection plate. The two ends of the plate are extended, and the two lifting lug plates are respectively pivotally connected to both sides of the wafer cassette; the swing arm frame and the two swing arms are located between the two lifting lug plates. The horizontal and vertical transposition device of claim 1, wherein the wafer cassette includes two setting plates and two cassette side plates; the two cassette side plates are located on both sides of the wafer cassette; The cassette side plate connects the two setting plates and is provided with a plurality of latching slots arranged side by side; each receiving portion is formed by two opposite latching slots in the two cassette side plates. The horizontal and vertical transposition device of claim 4, wherein the wafer cassette includes two blocking posts, each of which is connected to the two setting plates; when the edge of the wafer accommodated in each of the receiving portions When facing the notch of the soaking tank, the position of the two blocking posts is lower than the position of the two setting plates. The horizontal and vertical transposition device of claim 1, wherein the wafer cassette includes two setting plates, two cassette side plates, and two blocking posts, and the two cassette side plates are located on both sides of the wafer cassette. ; Each side plate of the cassette is connected to the two setting plates and is provided with a plurality of slots arranged side by side; each blocking post is connected to the two setting plates and is provided with a plurality of annular grooves arranged side by side; each receiving portion is composed of the two setting plates. Two of the cassette side plates and the two blocking posts are formed by two opposite slots and two annular grooves; when the edge of the wafer accommodated in each receiving portion faces the opening of the soaking tank, the two blocking The position of the column is lower than the position of the two setting plates. The horizontal and vertical transposition device according to any one of claims 1 to 6, wherein the wafer cassette includes two first fixed axes arranged coaxially and two second fixed axes arranged coaxially. The two first fixed axes are arranged coaxially. A fixed shaft and the two second fixed shafts are arranged off-axis; the cassette frame is combined with the two first fixed shafts and can pivot relative to the wafer cassette with the two first fixed shafts as axes; the two first fixed shafts are The swing arms are respectively combined with the two second fixed shafts and can pivot relative to the wafer cassette with the corresponding second fixed shafts as axes. The horizontal and vertical transposition device as claimed in claim 7, wherein the cassette frame of the moving mechanism is provided with two pivot holes and two bearings; the two bearings are respectively sleeved with the first fixing holes on the two pivot plates. axle, and are respectively sleeved by the two pivot holes; each swing arm is provided with a pivot hole and a transposition bearing; the transposition bearing is sleeved with the corresponding one of the second fixed shafts, and is supported by the The pivot hole is set. The horizontal and vertical transposition device according to any one of claims 1 to 6, wherein the transposition driver is a linear slide rail.