TWI710049B - Substrate flushing device - Google Patents

Abstract

A substrate flushing device comprises a cleaning tank, a carrier, a rotation mechanism and a spray mechanism. The cleaning tank has a wall and defines a cleaning space. The carrier is configured to upright hold a substrate in the cleaning space. The rotation mechanism is connected to the carrier for driving the carrier to rotate in the cleaning space so as to rotate the substrate. The spray mechanism includes a plurality of nozzles for spraying a treatment liquid to flush the front and back of the substrate in the cleaning space. Therefore, the substrate is able to be flushed at a fixed angle, and is able to be rotated by a predetermined angle to be flushed at a different angle at different times such that the layer predetermined to be stripped in different areas on the substrate can be removed, the damage of the weaker surface structures of the substrate by impact can be avoided, and the process yield can be improved.

Description

Substrate washing device

The present invention relates to a substrate rinsing device, in particular to a substrate rinsing device used in a semiconductor manufacturing process.

In the semiconductor manufacturing process, some metal materials are not easy to be removed by etching to pattern the metal layer, and a metal lift-off process is required. By first patterning the photoresist layer and then depositing the metal layer, the original photoresist The pattern retained by the layer is the area where the metal layer needs to be removed. After the metal layer is deposited, the photoresist layer and the metal layer on it are peeled off, so that the metal layer not covering the photoresist layer can be retained and the metal Layer patterning.

In the current metal stripping process, the substrate is usually immersed in an Immersion Tank to soften the photoresist; then the substrate is moved to a chemical spray workstation, and the photoresist is sprayed with a spray of detergent. The layer and the metal layer on it are peeled off; then the substrate is moved to a water washing and drying station, and the substrate is rinsed with deionized water and rotated, and the substrate is dried after the deionized water rinse is completed. Existing chemical spray cleaning workstations usually set the substrate horizontally on a rotating mechanism. When the nozzle sprays the detergent on the substrate, the substrate is rotated at the same time to use centrifugal force to throw the rinsed detergent and stripped waste off the surface of the substrate. However, because the surface of the substrate is patterned to form a three-dimensional structure, when the nozzle is flushed with a higher pressure and the substrate is rotated while the substrate is being rinsed, the angle at which the lotion impacts the three-dimensional structure on the substrate cannot be controlled, resulting in a relatively strong part of the three-dimensional structure. Weak areas are likely to collapse due to the impact of the lotion, which will reduce the yield of the overall process.

Therefore, one of the objectives of the present invention is to provide a substrate rinsing device that can solve the aforementioned problems.

Therefore, in some embodiments, the substrate washing device of the present invention includes a washing tank, a carrier, a driving mechanism, and a spraying mechanism. The cleaning tank has a tank wall and defines a cleaning space. The carrier is used to carry a substrate and make the substrate stand upright in the cleaning space. The driving mechanism is connected with the carrier to drive the carrier to rotate in the cleaning space and drive the substrate to rotate. The spraying mechanism includes a plurality of nozzles to provide processing liquid to rinse the front and back of the substrate in the cleaning space.

In some embodiments, the carrier includes a base and a limit module. The base is rotatably disposed on the groove wall and connected to the driving mechanism to be driven to rotate by the driving mechanism. The limit The module is arranged on the base to hold the substrate.

In some embodiments, the base has an annular body, a rotating shaft connected to the driving mechanism, and a connecting portion connecting the annular body and the rotating shaft, and the annular body has a bearing surface on opposite sides and A connecting surface, the connecting surface is connected with the connecting portion.

In some embodiments, the limit module includes two supporting clamping units arranged on the annular body, two clamping units movably arranged on the annular body, and an actuating unit. Each bearing The holder clamping unit has a supporting member protruding from the supporting surface, and the supporting member has a limiting groove whose width matches the thickness of the substrate to accommodate the side edge of the substrate and To limit the position, each clamping unit has an abutting member, a clamping member, and an elastic member provided on the bearing surface, and the clamping member can be a clamp capable of clamping the substrate together with the abutting member A state and an open state that leaves the abutment member for mounting and removal of the substrate, and the buckle member is biased by the elastic member to constantly return to the clamping state and is converted when the actuation unit acts To the open state.

In some embodiments, the buckling member has a pressing portion for pressing the substrate and a pushing portion located on the same side of the connecting surface, and the actuating unit has a coaxially through the rotating shaft. The supporting shaft of the rotating shaft, a power source connected to the supporting shaft, and an abutting portion extending from one end of the supporting shaft close to the annular body, the abutting portion being used to abut against the buckling parts of the clamping units The promoted department.

In some embodiments, the spraying mechanism includes a first nozzle module and a second nozzle module, a part of the nozzles is provided in the first nozzle module, and the other part is provided in the second nozzle module, The first nozzle module is used to rinse the front surface of the substrate and can be moved up and down in the cleaning space in a controlled manner, and the second nozzle module is used to rinse the back surface of the substrate and is positioned in the cleaning space.

In some embodiments, the carrier includes a supporting frame body and an annular frame body rotatably connected to the supporting frame body. The annular frame body is used to hold the substrate and the outer periphery is provided with a tooth part. The rotating mechanism includes a gear arranged in the cleaning space and capable of meshing with the tooth portion to drive the ring frame body to rotate.

In some embodiments, the spraying mechanism includes a first nozzle module and a second nozzle module, a part of the nozzles is provided in the first nozzle module, and the other part is provided in the second nozzle module, The first nozzle module and the second nozzle module are positioned opposite to each other in the cleaning space at intervals, wherein the first nozzle module is used to rinse the front surface of the substrate, and the second nozzle module is used to rinse the The back of the substrate.

The present invention has at least the following effects: by using the carrier to hold the substrate upright, the substrate can be flushed without rotating to fix the flushing angle, and the carrier can rotate at a predetermined angle to enable the surface of the substrate The structure is rinsed at different times and at different angles, so that the layer to be peeled in different areas on the substrate can be removed, and the weaker area of the structure can be prevented from being damaged by impact, so as to improve the process yield.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.

1 to 4, a first embodiment of the substrate rinsing device of the present invention is suitable for cleaning the surface of a substrate 5 that has undergone a soaking process in a semiconductor manufacturing process to remove the layer to be peeled off on the substrate 5. The substrate rinsing device includes A washing tank 1, a carrier 2, a driving mechanism 3 and a spraying mechanism 4.

The cleaning tank 1 has a tank wall 11 and defines a cleaning space 12.

The carrier 2 is used to hold the substrate 5 and make the substrate 5 stand upright in the cleaning space 12. In the first embodiment, the carrier 2 includes a base 21 and a limit module 22. The base 21 is rotatably disposed on the groove wall 11 and is connected to the driving mechanism 3 to be driven to rotate by the driving mechanism 3. Specifically, the base 21 has an annular body 211 connected to the driving mechanism 3 A rotating shaft 212 of the ring and a connecting portion 213 connecting the ring body 211 and the rotating shaft 212. The ring body 211 has a bearing surface 211a and a connecting surface 211b located on opposite sides. The connecting surface 211b and the connecting portion 213 connection.

The limiting module 22 is provided on the base 21 to hold the substrate 5. Specifically, the limiting module 22 includes two supporting and clamping units 221 provided on the annular body 211, and two movably The clamping unit 222 and the actuating unit 223 are provided on the ring body 211. Each supporting and clamping unit 221 has a supporting member 221a protruding from the supporting surface 211a, and the supporting member 221a has a limiting groove 221b, and the width of the limiting groove 221b is the same as the thickness of the substrate 5. It cooperates to accommodate the side edge of the substrate 5 and limit it. Each clamping unit 222 has an abutting member 222a, a clamping member 222b, and an elastic member 222c provided on the bearing surface 211a. The pressing member 222b has a pressing part 2221 for pressing the substrate 5 and a pushing part 2222 located on the same side of the connecting surface 211b.

In the first embodiment, each clamping unit 222 also has a pivotal member 222d disposed on the connecting surface 211b of the ring body 211 and located between the pressing portion 2221 and the pushed portion 2222. The member 222b is pivotally connected to the pivot member 222d and can swing with the pivot point P with the pivot member 222d as a fulcrum. The elastic member 222c can be a compression spring, and both ends abut against the annular body 211 and the pushed portion 2222 respectively, whereby the buckling member 222b can swing with the pivotal connection P with the pivotal member 222d as a fulcrum. In a clamping state (as shown in FIG. 3) that can clamp the substrate 5 together with the abutment member 222a and an open state (as shown in FIG. 3) away from the abutment member 222a for installation and removal of the substrate 5 4), and the clamping element 222b is biased by the elastic element 222c to constantly return to the clamping state.

The actuating unit 223 has a support shaft 223a that penetrates the shaft 212 coaxially with the shaft 212, a power source (not shown) connected to the support shaft 223a, and a support shaft 223a close to the ring A pushing portion 223c extending from one end of the body 211 is used to push against the pushing portion 2222 of the buckling member 222b of the clamping units 222 to convert the buckling member 222b to an open state. In the first embodiment, the power source is a pneumatic cylinder, the rotating shaft 212 is hollow and the supporting shaft 223a and the rotating shaft 212 are not linked to each other, that is, when the rotating shaft 212 rotates, the supporting shaft 223a will not follow When the supporting shaft 223a moves, the rotating shaft 212 will not move.

As shown in FIG. 3, when the actuating unit 223 does not interact with the clamping units 222, the elastic members 222c provide pre-pressure so that the clamping members 222b are in the clamping state. The abutting portion 2221 can clamp the substrate 5 together with the corresponding abutting member 222a. As shown in FIG. 4, when the pushing portion 223c of the actuating unit 223 moves toward the annular body 211, the pushing portion 223c pushes the pushed portions 2222 of the buckling members 222b to move against the annular body 211 , So that the retaining members 222b are pivoted and the pressing portions 2221 are separated from the corresponding abutting members 222a, that is, the retaining members 222b are converted to the open state. In the open state, a conveying device (not shown) can place the substrate 5 in the limiting grooves 221b of the supporting members 221a, and when the substrate 5 reaches the positioning, the clamping members 222b can be switched In this clamping state, the substrate 5 can be held by the carrier 2. In the same way, when the substrate 5 is to be taken out, the holding members 222b must be converted to the open state, and the holding members 222b shall be maintained in the open state. After the substrate 5 is taken out, it can be replaced with another one. After the substrate 5 to be processed is placed in another substrate 5, the holding members 222b are switched to the clamping state.

In the first embodiment, the driving mechanism 3 includes a pulley 31 and a motor (not shown). The pulley 31 is connected to the shaft 212 and the motor, so that the motor drives the pulley 31 to drive the shaft 212 to rotate. . The drive mechanism 3 can control the carrier 2 to rotate at a predetermined angle.

In the first embodiment, the spraying mechanism 4 includes a first nozzle module 41 and a second nozzle module 42. The first nozzle module 41 and the second nozzle module 42 are respectively provided with a plurality of nozzles 43 . The first nozzle module 41 is used to rinse the front surface of the substrate 5 and can be moved up and down in the cleaning space 12 in a controlled manner, and the second nozzle module 42 is used to rinse the back surface of the substrate 5 and is positioned in the cleaning space Within 12. The first nozzle module 41 uses high pressure spray liquid, and the second nozzle module 42 uses low pressure spray liquid. When the spray mechanism 4 is working, the substrate 5 is held by the carrier 2 without rotating, and can fix the impact area of the substrate 5 relative to the nozzle 43 of the first nozzle module 41. In the first embodiment, the angle of the nozzle 43 of the first nozzle module 41 can be adjusted relative to the substrate 5, that is, the angle of the nozzle 43 of the first nozzle module 41 can be adjusted according to the patterned structure of the substrate 5 Moreover, since the surface structure of the same substrate 5 in different regions is different, the driving mechanism 3 can rotate the carrier 2 to rotate the substrate 5 to change the surface structure of the substrate 5 relative to the first nozzle module 41. Impacted area. The operation method can be, for example, to move the first nozzle module 41 from top to bottom to rinse the substrate 5 and then stop spraying liquid, and then rotate the carrier 2 to rotate the substrate 5 by a predetermined angle, while rotating the carrier 2 At the same time, the first nozzle module 41 is controlled to rise back to a position higher than the substrate 5, and after the carrier 2 is rotated, the first nozzle module 41 is moved from top to bottom to rinse the substrate 5 , And so on, until the substrate 5 needs to be rotated and rinsed after the area is rinsed, the carrier 2 is returned to the original position to facilitate the replacement of the substrate 5. When the first nozzle module 41 sprays liquid, the second nozzle module 42 also sprays liquid to rinse the back of the substrate 5 at the same time, so as to prevent the first nozzle module 41 from spraying the substance that is peeled off when the first nozzle module 41 rinses the front surface of the substrate 5 It splashes to the back of the substrate 5 and remains on the substrate 5.

The substrate 5 is held upright by the carrier 2, so that when the substrate 5 is washed, the lotion can leave the substrate 5 by gravity, and the carrier 2 can rotate to make the surface structure of the substrate 5 It can be rinsed at different angles, so that the layer to be peeled in different areas on the substrate 5 can be removed, and the weaker structure can be prevented from being damaged by impact, so as to improve the process yield.

5 and 6, a second embodiment of the substrate washing device of the present invention is substantially the same as the first embodiment. The difference is that in the first embodiment, the pressing parts 2221 of the holding members 222b are The pivot point P of the pivot member 222d is a fulcrum swing, but in the second embodiment, the pressing portions 2221 of the buckling members 222b move up and down. Specifically, in the second embodiment, the pushed portion 2222 has an inclined section 2223 and a vertical section 2224. The upper end of the inclined section 2223 is pivotally connected to the pressing portion 2221 and faces away from the annular body 211. The vertical section 2224 extends downward from the lower end of the inclined section 2223 and is used for the pushing portion 223c of the actuating unit 223 to push. The inclined section 2223 is pivotally connected to the pivotal member 222d, and can swing with the pivotal joint P with the pivotal member 222d as a fulcrum. Two ends of the elastic member 222c abut against the vertical section 2224 of the annular body 211 and the pushed portion 2222 respectively. Similarly, the buckling member 222b can be switched between a clamped state (as shown in FIG. 5) and an open state (as shown in FIG. 6). As shown in FIG. 6, when the pushing portion 2222 is pushed by the actuating unit 223, the pressing portion 2221 can be driven to move upward and away from the corresponding abutting member 222a. As shown in FIG. 5, in the actuating unit 223 When the action on the pushed portion 2222 is removed, the pushed portion 2222 is returned to the original position by the elastic member 222c and drives the pressing portion 2221 to move down and return to the original position. Since the moving direction of the pressing portion 2221 is parallel to the surface of the substrate 5, the force on the substrate 5 when the pressing portion 2221 moves to the surface of the substrate 5 can be reduced, and the risk of damage to the substrate 5 is further reduced.

Referring to Figures 7 and 8, a third embodiment of the substrate washing device of the present invention includes a cleaning tank 1, a carrier 2, a driving mechanism 3, and a spraying mechanism 4 like the first embodiment. In the third embodiment, the carrier 2 includes a supporting frame body 23 and an annular frame body 24 rotatably connected to the supporting frame body 23. The annular frame body 24 is used to hold the substrate 5 and the outer periphery is provided with a ring Tooth portion 241. The driving mechanism 3 includes a gear 32 disposed in the cleaning space 12 and capable of meshing with the tooth portion 241 to drive the ring frame 24 to rotate. The gear 32 is connected to a motor (not shown) provided outside the cleaning tank 1 to be driven to rotate by the motor. The spraying mechanism 4 also includes a first nozzle module 41 and a second nozzle module 42, but the first nozzle module 41 and the second nozzle module 42 are positioned opposite to each other in the cleaning space 12 at intervals Inside, that is, both the first nozzle module 41 and the second nozzle module 42 are fixed in the cleaning space 12.

During operation, the supporting frame body 23 of the carrier 2 is connected to a lifting mechanism (not shown) and is driven by the lifting mechanism to move up and down. When the carrier 2 holds the substrate 5 and moves down to enter the cleaning space 12, The first nozzle module 41 and the second nozzle module 42 are not sprayed with lotion, after the carrier 2 is moved down to the position of the substrate 5 lower than the first nozzle module 41 and the second nozzle module 42 Then start the first nozzle module 41 and the second nozzle module 42 to spray the lotion, and then move the carrier 2 upward so that the substrate 5 is washed from top to bottom during the movement. If the substrate 5 needs to be rotated by a predetermined angle and then rinsed, the carrier 2 is moved down to make the ring frame body 24 contact the gear 32 of the driving mechanism 3, and the gear 32 drives the rotation. After the body 24 is rotated to a predetermined angle, the carrier 2 is moved down until the position of the substrate 5 is lower than the first nozzle module 41 and the second nozzle module 42, and then the first nozzle module 41 and the second nozzle module are activated. The two nozzle modules 42 spray the lotion, and repeat the aforementioned actions to rotate the substrate 5 at different angles to be rinsed. Therefore, the third embodiment can also achieve the effect that the layers to be peeled in different areas on the substrate 5 can be removed, and the areas with weaker structures can be prevented from being damaged by impact, so as to improve the process yield.

In summary, by using the carrier 2 to hold the substrate 5 upright, the substrate 5 can be washed without rotating to fix the washing angle, and the carrier 2 can be rotated at a predetermined angle to enable the substrate The surface structure of 5 is rinsed at different times and at different angles, so that the layer to be peeled in different areas on the substrate 5 can be removed, and the weaker area of the structure can be prevented from being damaged by impact, so as to improve the process yield.

However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.

1: cleaning tank 11: groove wall 12: Cleaning space 2: carrier 21: Pedestal 211: Ring 211a: bearing surface 211b: Connection surface 212: shaft 213: Connection 22: limit module 221: supporting clamping unit 221a: Supporting parts 221b: Limit slot 222: Clip unit 222a: leaning piece 222b: Withholding parts 2221: Depression 2222: Pushed Department 2223: inclined section 2224: vertical segment 222c: Elastic part 222d: pivot 223: Actuation Unit 223a: Support shaft 223c: Arrival Department 23: Support frame 24: Ring frame 241: Teeth 3: Drive mechanism 31: Pulley 32: Gear 4: Spraying mechanism 41: The first nozzle module 42: The second nozzle module 43: Nozzle 5: substrate P: pivot

Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is an incomplete perspective view of a first embodiment of the substrate washing device of the present invention; Figure 2 is another incomplete perspective view of the first embodiment; Figure 3 is an incomplete schematic cross-sectional view of the first embodiment; Figure 4 is another incomplete schematic cross-sectional view of the first embodiment; 5 is an incomplete schematic cross-sectional view of a second embodiment of the substrate washing device of the present invention; Figure 6 is another incomplete schematic cross-sectional view of the second embodiment; 7 is an incomplete perspective view of a third embodiment of the substrate washing device of the present invention; and Fig. 8 is an incomplete schematic front view of the third embodiment.

1: cleaning tank

11: groove wall

12: Cleaning space

2: carrier

21: Pedestal

211: Ring

211a: bearing surface

211b: Connection surface

212: shaft

213: Connection

221: supporting clamping unit

221a: Supporting parts

221b: Limit slot

222: Clip unit

222a: leaning piece

222b: Withholding parts

2221: Depression

2222: Pushed Department

222c: Elastic part

222d: pivot

223: Actuation Unit

223a: Support shaft

223c: Arrival Department

3: Drive mechanism

31: Pulley

4: Spraying mechanism

41: The first nozzle module

42: The second nozzle module

43: Nozzle

5: substrate

P: pivot

Claims (8)

A substrate washing device includes: a cleaning tank having a tank wall and defining a cleaning space; a carrier for holding a substrate and making the substrate stand upright in the cleaning space; and a spraying mechanism including a plurality of nozzles To provide processing liquid to rinse the front and back of the substrate in the cleaning space; and a drive mechanism connected to the carrier to control the drive to rotate the carrier to a predetermined angle in the cleaning space and drive the substrate to rotate to The substrate is positioned at different positions relative to the spraying mechanism when being washed. The substrate washing device according to claim 1, wherein the carrier includes a base and a limit module, the base is rotatably disposed on the groove wall and connected to the driving mechanism to be driven by the driving mechanism When rotating, the limit module is arranged on the base to hold the substrate. The substrate washing device according to claim 2, wherein the base has an annular body, a rotating shaft connected to the driving mechanism, and a connecting portion connecting the annular body and the rotating shaft, and the annular body has two opposite sides. A bearing surface and a connecting surface of the connecting surface are connected with the connecting portion. According to claim 3, the substrate washing device, wherein the limit module includes two supporting and clamping units arranged on the annular body, two clamping units movably arranged on the annular body, and an actuator Unit, each supporting and clamping unit has a supporting member protruding from the supporting surface, and the supporting member has a limiting groove whose width matches the thickness of the substrate to accommodate the The side edge of the substrate and limit it, each clamping unit has a supporting surface arranged on the supporting surface Abutting piece, a buckling piece and an elastic piece, the buckling piece can be in a clamping state that can clamp the substrate together with the abutting piece and an open state that leaves the abutting piece for mounting and removing the substrate The buckling member is biased by the elastic member to constantly return to the clamping state and is converted to the open state when the actuation unit acts. The substrate washing device according to claim 4, wherein the holding member has a pressing part for pressing the substrate and a pushing part on the same side of the connecting surface, and the actuating unit has a coaxial with the rotating shaft A support shaft that penetrates the rotating shaft, a power source connected to the support shaft, and an abutting portion extending from an end of the support shaft close to the annular body, the abutting portion is used to abut the clamps The pushed part of the buckle unit of the buckle unit. The substrate washing device according to claim 2, wherein the spraying mechanism includes a first nozzle module and a second nozzle module, and a part of the nozzles is provided in the first nozzle module, and the other part is provided in the first nozzle module. Two nozzle modules, the first nozzle module is used to rinse the front surface of the substrate and can be moved up and down in the cleaning space in a controlled manner, and the second nozzle module is used to rinse the back surface of the substrate and is positioned in the cleaning space Inside. The substrate washing device according to claim 1, wherein the carrier includes a supporting frame body and a ring frame body rotatably connected to the supporting frame body, the ring frame body is used to hold the substrate and the outer periphery is provided with a ring The tooth part, the driving mechanism includes a gear which is arranged in the cleaning space and can mesh with the tooth part to drive the ring frame body to rotate. The substrate washing device according to claim 7, wherein the spraying mechanism includes a first nozzle module and a second nozzle module, and some of the nozzles are provided In the first nozzle module, the other part is arranged in the second nozzle module, the first nozzle module and the second nozzle module are positioned opposite to each other in the cleaning space, wherein the first nozzle module The group is used to rinse the front surface of the substrate, and the second nozzle module is used to rinse the back surface of the substrate.

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