TWI709006B - Pattern drawing device and pattern drawing method - Google Patents

Abstract

The substrate processing device is a method in which the patterns drawn on the substrate by the drawing lines of the multiple drawing units can be joined in the width direction of the substrate as the substrate moves in the longitudinal direction, and the multiple drawing units are arranged in the The width direction of the substrate. The control unit pre-stores calibration information about the positional relationship between the drawing lines formed on the substrate by each of the plurality of drawing units, and adjusts by the plurality of drawing lines based on the calibration information and the movement information output from the mobile measuring device The drawing position of the pattern formed on the substrate by the drawing beam of each unit.

Description

Pattern drawing device and pattern drawing method

The present invention relates to a substrate processing apparatus, a device manufacturing method, and a substrate processing method for forming a structure of microelectronic components on a substrate.

As a conventional substrate processing apparatus, there is a manufacturing apparatus that performs drawing at a predetermined position on a sheet medium (substrate) (for example, refer to Patent Document 1). The manufacturing device described in Patent Document 1 measures the expansion and contraction of the sheet substrate by detecting the alignment mark for a flexible long sheet substrate that is easy to expand and contract in the width direction, and corrects the drawing position (processing position) based on the expansion and contraction.

Patent Document 1: Japanese Patent Application Publication No. 2010-91990

In the manufacturing device of Patent Document 1, the pattern is drawn on the substrate by a plurality of drawing units by switching the spatial modulating device (DMD: Digital "Micro" Mirror" Device) while conveying the substrate in the conveying direction. In the manufacturing device of Patent Document 1, although the patterns adjacent to each other in the width direction of the substrate are bonded and exposed with a plurality of drawing units, in order to suppress the error of bonding exposure, feedback is performed for test exposure and The measurement result of the position error of the pattern at the junction generated by the development. However, although the frequency of the feedback steps including such testing, exposure, development, measurement, etc., depends on the frequency, the manufacturing line must be temporarily stopped, which not only reduces the productivity of the product, but may also cause waste of substrates.

The aspect of the present invention was developed in view of the above-mentioned problems, and its purpose is to provide a method that can reduce the bonding error between patterns even when a plurality of drawing units are used to join patterns in the width direction of the substrate for exposure (drawing). , And a substrate processing device, device manufacturing method, and substrate processing method that can draw large-area patterns on a substrate with high precision and stability.

The substrate processing apparatus according to the first aspect of the present invention includes: a conveying device that moves a part of the long sheet-like substrate in the long direction while being supported by a supporting member having a supporting surface that is curved in the long direction; The drawing device includes projecting a modulated drawing beam on the substrate supported by the supporting surface, and scanning along the width direction of the substrate crossing the longitudinal direction in a narrower range than the width of the substrate. The drawing lines obtained by the scanning describe a plurality of drawing units of a predetermined pattern, and the patterns drawn on the substrate by the drawing lines of the plurality of drawing units are in the width direction of the substrate along with the movement of the substrate in the longitudinal direction In the joining method, the plurality of drawing units are arranged in the width direction of the substrate; the measuring device is moved to output the movement information corresponding to the movement amount or the movement position of the substrate by the conveying device; and the control unit prestores information about the The calibration information of the positional relationship between the drawing lines formed on the substrate for each of the plurality of drawing units, and according to the calibration information and the movement information output from the mobile measuring device, each of the drawing units by the plurality of drawing units is adjusted The drawing position of the pattern formed by the drawing beam on the substrate.

The device manufacturing method of the second aspect of the present invention uses the substrate processing apparatus of the first aspect of the present invention to form the pattern on the substrate.

The substrate processing method of the third aspect of the present invention draws the pattern of the electronic component on the elongated sheet substrate, and is characterized in that it includes: an action of transporting the sheet substrate in the elongate direction at a predetermined speed; The light source device condenses a light beam in the ultraviolet wavelength range with a frequency Fz pulse oscillation on the surface of the sheet substrate into a point light, and the light beam is oscillated by an optical scanner so that the point light crosses the strip direction along the direction The action of scanning the line of drawing of the length LBL extending in the width direction; and during the scanning of the spot light, the action of adjusting the intensity of the spot light according to the drawing data corresponding to the pattern; set a pulse of the beam of light to form The distance between the point light and the point light formed by the concentrated light of the next pulse along the traced line is CXs, the effective size of the point light along the traced line is Xs, and the scanning time of the point light scanning the length LBL is Ts When it is set to satisfy the relationship of Xs>CXs and Fz>LBL/(Ts・Xs).

The substrate processing method of the fourth aspect of the present invention draws the pattern of the electronic component on the elongated sheet substrate, and is characterized in that it includes the step of transporting the sheet substrate in the elongate direction at a predetermined speed; The light source device condenses a light beam in the ultraviolet wavelength range with a frequency Fz pulse oscillating on the surface of the sheet substrate into a point light, and makes the point light extend along the width direction intersecting the longitudinal direction of the sheet substrate The step of line scanning; and during the point light scanning, the pattern is divided into pixel units according to the drawing data, and the light switching element is used to modulate the intensity of the light beam; the response frequency when the light switching element is modulated Fss and the pulse oscillation frequency Fz of the beam are set to a relationship of Fz>Fss.

According to an aspect of the present invention, it is possible to provide a substrate processing apparatus that reduces the bonding error during exposure of a bonding pattern in the width direction of a substrate using a plurality of drawing units, and can appropriately perform drawing on a substrate using a plurality of drawing units, Component manufacturing method. Furthermore, it is possible to provide a substrate processing method that improves the drawing accuracy (uniformity of exposure, etc.) or fidelity when a drawing unit draws a pattern along a drawing line.

The form (embodiment) for implementing the present invention will be described in detail with reference to the drawings. Of course, the present invention is not limited to the content described in the following embodiments. In addition, the constituent elements described below include those that are easy to imagine by the industry and those that are substantially the same. In addition, the constituent elements described below can be combined as appropriate. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the scope of the present invention.

[First Embodiment] FIG. 1 is a diagram showing the overall configuration of the exposure apparatus (substrate processing apparatus) of the first embodiment. The substrate processing apparatus of the first embodiment is an exposure apparatus EX that applies exposure processing to a substrate P, and the exposure device EX is incorporated in a component manufacturing system 1 that applies various processing to the exposed substrate P to manufacture components. First, the component manufacturing system 1 will be described.

＜Component manufacturing system＞ The component manufacturing system 1 is a production line (flexible display manufacturing line) for manufacturing flexible displays as components. Flexible displays, such as organic EL displays. In this component manufacturing system 1, a flexible long substrate P is rolled into a cylindrical supply reel (not shown) and the substrate P is sent out, and after various processes are continuously applied to the sent substrate P, The processed substrate P is wound as a flexible element on a so-called roll-to-roll (Ro11"to"Ro11) method in which a reel for recycling is not shown. In the component manufacturing system 1 of the first embodiment, the film-like sheet substrate P is sent out from the supply roll, and the substrate P sent out from the supply roll passes through the processing device U1, the exposure device EX, and the processing device U2 in this order After that, it is wound on a reel for recycling. Here, the substrate P to be processed by the component manufacturing system 1 will be described.

The substrate P is a foil made of metal or alloy such as resin film, stainless steel, and the like. The material of the resin film includes, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, and polycarbonate. Ester resin, polystyrene resin, polyvinyl alcohol resin and other materials one or more than two kinds.

For the substrate P, it is better to select, for example, the thermal expansion coefficient is not significant, and the amount of deformation due to heat during various treatments performed on the substrate P can be substantially ignored. The coefficient of thermal expansion can be set to be smaller than the threshold value corresponding to the processing temperature, for example, by mixing inorganic fillers in the resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, silicon oxide, and the like. In addition, the substrate P may be a single layer of ultra-thin glass with a thickness of about 100 μm manufactured by a float method or the like, or a laminate of the above-mentioned resin film, foil, etc. bonded to this ultra-thin glass.

The substrate P configured in this manner is wound into a roll shape to become a supply roll, and this supply roll is mounted in the component manufacturing system 1. The component manufacturing system 1 equipped with a supply reel repeatedly performs various processes for manufacturing components on the substrate P sent from the supply reel in the longitudinal direction. Therefore, patterns for a plurality of electronic components (display panels, printed circuit boards, etc.) are formed on the processed substrate P in a state of being connected at certain intervals in the longitudinal direction. In other words, the substrate P sent out from the supply reel is a multi-sided substrate. In addition, the substrate P may be modified and activated in advance by a predetermined pre-treatment, or a fine partition structure for precise patterning may be formed on the surface (concave and convex formed by imprinting) Constructor.

The processed substrate P is wound into a roll shape to be recovered as a recovery roll. The recycling reel is installed in a cutting device not shown. Equipped with a cutting device for recycling rolls, the processed substrate P is divided (cut) into individual components, which are then multiple components. The size of the substrate P, for example, the size in the width direction (the direction of the short side) is about 10 cm to 2 m, and the size in the length direction (the direction of the long strip) is more than 10 m. Of course, the size of the substrate P is not limited to the above size

Next, the component manufacturing system 1 will be described with reference to FIG. 1. The component manufacturing system 1 includes a processing device U1, an exposure device EX, and a processing device U2. In addition, Fig. 1 is an orthogonal coordinate system in which the X direction, the Y direction, and the Z direction are orthogonal. The X direction is the direction from the processing device U1 to the processing device U2 via the exposure device EX in the horizontal plane. The Y direction is the direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is the direction perpendicular to the X direction and the Y direction (vertical direction), and the XY plane is parallel to the installation surface E of the manufacturing line where the exposure device EX is installed.

The processing device U1 is a pre-processing (pre-processing) for the substrate P subjected to the exposure processing by the exposure device EX. The processing device U1 sends the pre-processed substrate P to the exposure device EX. At this time, the substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P on which a photosensitive functional layer (photosensitive layer) is formed.

Here, the photosensitive functional layer is coated on the substrate P as a solution, and dried to become a layer (film). A typical photosensitive functional layer has a photoresist as a material that is not needed after development. The liquid-repellent modified photosensitive silane coupling agent (SAM) in the part irradiated by ultraviolet rays or the part irradiated by ultraviolet rays is exposed Photosensitive reduction materials based on plating reduction. When a photosensitive silane coupling agent is used as the photosensitive functional layer, since the pattern portion on the substrate P exposed to ultraviolet rays is changed from liquid repellency to lyophilic, conductive ink is selectively coated on the lyophilic portion ( Ink containing conductive nano particles such as silver or copper) to form a pattern layer. When a photosensitive reducing material is used as the photosensitive functional layer, the plating reducing base will be exposed on the pattern portion of the substrate P exposed by ultraviolet rays. Therefore, immediately after exposure, the substrate P is immersed in a plating solution containing palladium ions or the like For a certain period of time, a patterned layer of palladium is formed (precipitated).

The exposure device EX draws patterns such as various circuits or various wirings for display panels on the substrate P supplied from the processing device U1. The details will be described later. This exposure device EX is a plurality of light beams LB (hereinafter also referred to as drawing light beams LB.) projected from each of the plurality of drawing units UW1 to UW5 to the substrate P and scanned in a predetermined scanning direction. The lines LL1 to LL5 are drawn, and a predetermined pattern is exposed on the substrate P.

The processing device U2 receives the substrate P after exposure processing by the exposure device EX, and performs post-process processing (post-processing) on the substrate P. The processing device U2, when the photosensitive functional layer of the substrate P is a photoresist, performs post-baking processing, development processing, cleaning processing, drying processing, etc., below the glass transition temperature of the substrate P. In addition, when the photosensitive functional layer of the substrate P is a photosensitive plating reduction material, the processing device U2 performs electroless plating, cleaning, drying, etc. In addition, when the photosensitive function layer of the substrate P is a photosensitive silane coupling agent, the processing device U2 performs selective coating treatment, drying treatment, etc. of the liquid ink of the lyophilic portion on the substrate P. Through this processing device U2, a patterned layer of the device is formed on the substrate P.

＜Exposure equipment (substrate processing equipment)＞ Next, the exposure apparatus EX will be described with reference to FIGS. 1 to 10. Fig. 2 is a perspective view showing the configuration of the main parts of the exposure apparatus of Fig. 1. Fig. 3 is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. 4 is a diagram showing the configuration of the rotating cylinder and the drawing device (drawing unit) of the exposure device of FIG. 1. Fig. 5 is a plan view showing the arrangement of the main parts of the exposure apparatus of Fig. 1; FIG. 6 is a perspective view showing the structure of a branched optical system of the exposure device of FIG. 1. FIG. FIG. 7 is a diagram showing the arrangement relationship of scanners in a plurality of drawing units of the exposure apparatus of FIG. 1. FIG. FIG. 8 is a diagram illustrating an optical structure used to eliminate the deviation of the drawing line caused by the tilt of the reflective surface of the scanner. Fig. 9 is a perspective view showing the arrangement relationship between the alignment microscope on the substrate and the encoder read head for drawing lines. Fig. 10 is a perspective view showing an example of the surface structure of a rotating cylinder of the exposure apparatus of Fig. 1.

As shown in Fig. 1, the exposure apparatus EX is an exposure apparatus that does not use a mask, a so-called maskless drawing exposure apparatus. In this embodiment, the substrate P is continuously moved in the conveying direction at a constant speed ( The longitudinal direction) is conveyed, and the spot light of the drawing beam LB is scanned at a high speed in the predetermined scanning direction (the width direction of the substrate P), and the drawing on the surface of the substrate P is performed accordingly, and the predetermined pattern is formed on the substrate P. Line (raster scan) direct drawing exposure device.

As shown in FIG. 1, the exposure apparatus EX includes a drawing device 11, a substrate transport mechanism 12, alignment microscopes AM1, AM2, and a control unit 16. The drawing device 11 includes a plurality of drawing units UW1 to UW5. The drawing device 11 draws a predetermined pattern by a plurality of drawing units UW1 to UW5 on a part of the substrate P that is transported in a state closely supported above the outer peripheral surface of the cylindrical rotating cylinder DR which is a part of the substrate transport mechanism 12. The substrate transport mechanism 12 transports the substrate P transported from the processing device U1 of the previous process to the processing device U2 of the subsequent process at a predetermined speed. The alignment microscopes AM1 and AM2 are used to align the relative position of the pattern to be drawn on the substrate P and the substrate P, and to detect the alignment marks formed on the substrate P in advance. The control unit 16 including a computer, a microcomputer, a CPU, an FPGA, etc., controls each part of the exposure apparatus EX and makes each part perform processing. The control unit 16 may be part or all of a higher-level control device of the control component manufacturing system 1. In addition, the control unit 16 is controlled by a higher-level control device. The upper control device may be other devices such as the main computer that manages the production line.

In addition, as shown in FIG. 2, the exposure apparatus EX includes a device frame 13 that supports at least a part of the drawing device 11 and the substrate transport mechanism 12 (rotating cylinder DR, etc.), and a detection rotating cylinder DR is mounted on the device frame 13 Rotating beam spot light SP position detection mechanism (encoder reading head shown in Figure 4 and Figure 9), such as rotation angle position and rotation speed, displacement of the rotation axis direction, and Figure 1 (or Figure 3, Figure 9) The alignment microscopes AM1, AM2, etc. are shown. Furthermore, in the exposure device EX, as shown in FIGS. 4 and 5, a light source device CNT that emits ultraviolet laser light (pulse light) as the drawing beam LB is provided. This exposure device EX distributes the drawing light beam LB emitted from the light source device CNT to each of the plurality of drawing units UW1 to UW5 constituting the drawing device 11 with a substantially equal amount of light (illuminance).

As shown in Fig. 1, the exposure device EX is housed in the temperature control room EVC. The greenhouse EVC is installed on the installation surface (ground) E of the manufacturing workshop through passive or active anti-vibration units SU1 and SU2. The anti-vibration units SU1 and SU2 are installed on the installation surface E to reduce vibration from the installation surface E. The temperature-regulating EVC keeps the inside at a predetermined temperature, thereby suppressing the change in the shape of the substrate P conveyed inside due to temperature.

The substrate transport mechanism 12 of the exposure apparatus EX has an edge position controller EPC, a drive roller DR4, a tension adjustment roller RT1, a rotating cylinder (cylindrical cylinder) DR, and a tension adjustment roller in order from the upstream side in the transport direction of the substrate P RT2, drive roller DR6, and drive roller DR7.

The edge position controller EPC adjusts the position of the substrate P conveyed from the processing device U1 in the width direction (Y direction). The edge position controller EPC uses the width direction end (edge) position of the substrate P sent from the processing unit U1 to be within the range of ± tens of μm to tens of μm relative to the target position, so that the substrate P is in the width The direction is slightly moved to correct the position of the substrate P in the width direction.

The driving roller DR4 of the clamping method rotates while clamping the front and back sides of the substrate P transferred from the edge position controller EPC, and sends the substrate P to the downstream side in the conveying direction to transfer the substrate P to the rotating cylinder DR Transport. Rotate the cylinder DR, while supporting the part of the pattern on the substrate P to be exposed to the cylindrical outer peripheral surface with a certain radius from the rotation center line (rotation axis) AX2 extending in the Y direction, and around the rotation center The line AX2 rotates to transport the substrate P in the longitudinal direction.

In order to make the rotating cylinder DR rotate around the rotation center line AX2, a shaft portion Sf2 and a shaft portion Sf2 that are coaxial with the rotation center line AX2 are provided on both sides of the rotation cylinder DR, as shown in Figure 2, through The bearing is supported by the device frame 13. To this shaft portion Sf2, a rotational torque from a drive source (motor, reduction gear mechanism, etc.) not shown in the figure is given. In addition, the plane including the rotation center line AX2 and the YZ plane parallel to each other is referred to as the center plane p3.

The two sets of tension adjusting rollers RT1 and RT2 apply a predetermined tension to the substrate P wound and supported by the rotating cylinder DR. Two sets of clamping drive rollers DR6 and DR7 are arranged at a predetermined interval in the conveying direction of the substrate P, and a predetermined slack DL is given to the substrate P after exposure. The drive roller DR6 clamps and rotates the upstream side of the transported substrate P, and the drive roller DR7 rotates the downstream side of the transported substrate P, thereby transporting the substrate P to the processing device U2. At this time, since the substrate P is given a slack DL, it can absorb the change in the conveying speed of the substrate P on the downstream side of the driving roller DR6 in the conveying direction, and isolate the influence of the exposure processing of the substrate P due to the change in the conveying speed.

Therefore, the substrate transport mechanism 12 can adjust the position of the substrate P transported from the processing apparatus U1 in the width direction by the edge position controller EPC. The substrate transport mechanism 12 transports the substrate P whose position in the width direction has been adjusted to the tension adjustment roller RT1 by the driving roller DR4, and transports the substrate P passing the tension adjustment roller RT1 to the rotating cylinder DR. The substrate transport mechanism 12 rotates the rotating cylinder DR to thereby transport the substrate P supported by the rotating cylinder DR to the tension adjustment roller RT2. The substrate transfer mechanism 12 transfers the substrate P transferred to the tension adjustment roller RT2 to the drive roller DR6, and transfers the substrate P transferred to the drive roller DR6 to the drive roller DR7. Next, the substrate transport mechanism 12 uses the driving roller DR6 and the driving roller DR7 to transport the substrate P to the processing apparatus U2 while imparting slack DL to the substrate P.

2 again, the device frame 13 of the exposure device EX will be described. In Fig. 2, the X direction, the Y direction and the Z direction are an orthogonal orthogonal coordinate system, which is the same orthogonal coordinate system as in Fig. 1.

As shown in FIG. 2, the device frame 13 has a body frame 21, a three-point support mechanism 22, a first optical table 23, a moving mechanism 24, and a second optical table 25 in this order from the lower side in the Z direction. The main body frame 21 is a part installed on the installation surface E through the anti-vibration units SU1 and SU2. The main body frame 21 pivotally supports (supports) the rotating cylinder DR, the tension adjusting rollers RT1 (not shown), and RT2 so as to be rotatable. The first optical table 23 is provided on the upper side of the rotating cylinder DR in the vertical direction, and is provided on the main body frame 21 through the three-point seat 22. The three-point seat 22 supports the first optical table 23 with three supporting points, and the Z-direction position (height position) of each supporting point can be adjusted. Therefore, the three-point seat 22 can adjust the tilt of the platform surface of the first optical platform 23 relative to the horizontal plane to a predetermined tilt. In addition, when the device frame 13 is assembled, the main body frame 21 and the three-point base 22 can be adjusted in the X direction and the Y direction in the XY plane. On the other hand, after the device frame 13 is assembled, the main body frame 21 and the three-point base 22 are fixed in the XY plane (rigid state).

The second optical table 25 is provided on the upper side of the first optical table 23 in the vertical direction, and the transmission moving mechanism 24 is provided on the first optical table 23. The second optical table 25 has a table surface parallel to the table surface of the first optical table 23. The second optical table 25 is provided with a plurality of drawing units UW1 to UW5 of the drawing device 11. The moving mechanism 24 is capable of positioning the first optical table 23 and the second optical table 25 as the center of the predetermined rotation axis I extending in the vertical direction while keeping the table surfaces of the first optical table 23 and the second optical table 25 parallel. 2 The optical platform 25 is precisely rotated slightly. The rotation range is, for example, a structure in which the relative reference position is within ± hundreds of milliradians, and the angle can be set with a resolution of 1 to several milliradians. In addition, the moving mechanism 24 is also provided with the ability to position the second optical table 25 in the X direction and Y direction relative to the first optical table 23 while keeping the table surfaces of the first optical table 23 and the second optical table 25 in parallel. The precise micro-movement mechanism in at least one of the directions can slightly shift the rotation axis I from the reference position to the X direction or the Y direction with a resolution of μm. The rotation axis I, at the reference position, is extended in the vertical direction within the central plane p3 and passes through a predetermined point (the surface of the substrate P) on the surface of the substrate P (the drawing surface curved along the circumference) of the rotating cylinder DR. Midpoint in the width direction) (refer to Figure 3). With this kind of moving mechanism 24, the second optical table 25 is rotated or moved relative to the first optical table 23, that is, a plurality of drawing units UW1 to UW5 can be integrally adjusted relative to the rotating cylinder DR or wound around the rotating cylinder The position of the substrate P of the DR.

Next, the light source device CNT will be described with reference to FIG. 5. The light source device CNT is arranged on the body frame 21 of the device frame 13. The light source device CNT emits laser light projected on the substrate P as a drawing beam LB. The light source device CNT has a light source that emits light in a predetermined wavelength band suitable for exposing the photosensitive functional layer on the substrate P and in the ultraviolet band with strong photoactivity. As the light source, for example, a laser light source capable of continuously oscillating or oscillating YAG's third harmonic laser light (wavelength 355nm) in pulses of several KHz to several hundred MHz can be used.

The light source device CNT includes a laser light generating unit CU1 and a wavelength conversion unit CU2. The laser light generating unit CU1 includes a laser light source OSC, and fiber amplifiers FB1 and FB2. The laser light generating unit CU1 emits the fundamental wave laser light Ls. The fiber amplifiers FB1 and FB2 amplify the basic wave laser light Ls with optical fibers. The laser light generating unit CU1 injects the amplified fundamental wave laser light Lr into the wavelength conversion unit CU2. The wavelength conversion part CU2 is equipped with a wavelength conversion optical element, a beam splitter, a polarizing beam splitter, a beam, etc., and the third harmonic laser with a wavelength of 355nm is extracted by the use of such light (wavelength) selection parts (Draw light beam LB). At this time, the laser light source OSC that emits seed light is pulsed in synchronization with the system clock, etc., and the light source device CNT emits a drawing beam LB with a wavelength of 355 nm as pulsed light of about several KHz to several hundred MHz. Moreover, when using this kind of fiber amplifier, according to the state of pulse driving of the laser light source OSC, the light emission time of one pulse of the final laser light (Lr and LB) can be controlled to the order of picoseconds.

In addition, as a light source, for example, a mercury lamp with a bright line in the ultraviolet band (g-line, h-line, i-line, etc.), a laser diode with an oscillation peak in the ultraviolet band below 450nm, and a luminous Solid light sources such as diodes (LED), or KrF excimer laser light (wavelength 248nm) that emits far ultraviolet light (DUV light), ArF excimer laser light (wavelength 193nm), XeC1 excimer laser light (wavelength 308nm) Other gas laser light sources.

Here, the drawing light beam LB emitted from the light source device CNT is projected on the substrate P through the polarization beam splitter PBS provided in each drawing unit UW1 to UW5 as described later. Generally speaking, the polarization beam splitter PBS reflects the linearly polarized light beam of S polarization, and transmits the linearly polarized light beam of P polarization. Therefore, in the light source device CNT, the drawing light beam LB that enters the polarizing beam splitter PBS is preferably a laser light that emits a linearly polarized (S-polarized) light beam. In addition, since the energy density of the laser light is high, the illuminance of the light beam projected on the substrate P can be appropriately ensured.

Next, the drawing device 11 of the exposure device EX will also be described with reference to FIG. 3. The drawing device 11 is a so-called multi-beam drawing device 11 using a plurality of drawing units UW1 to UW5. This drawing device 11 splits the drawing light beam LB emitted from the light source device CNT into a plurality of stripes, and divides the branched plurality of drawing light beams LB along the plurality of stripes on the substrate P as shown in FIG. 3 (for example, 5 in the first embodiment) Lines) The drawing lines LL1 to LL5 are condensed into tiny point light (a few μm diameter) and scanned. The drawing device 11 joins the patterns drawn on the substrate P by each of the plurality of drawing lines LL1 to LL5 in the width direction of the substrate P. First, referring to FIG. 3, a plurality of drawing lines LL1 to LL5 (scanning traces of spot light) formed on the substrate P by scanning a plurality of drawing light beams LB by the drawing device 11 will be described.

As shown in FIG. 3, a plurality of drawing lines LL1 to LL5 are arranged in two rows in the circumferential direction of the rotating cylinder DR with the center plane p3 interposed therebetween. On the substrate P on the upstream side in the rotation direction, the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged parallel to the Y axis on the substrate P on the downstream side in the rotation direction, parallel to the Y axis The even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged.

The drawing lines LL1 to LL5 are formed substantially parallel to the width direction (Y direction) of the substrate P, that is, along the rotation center line AX2 of the rotating cylinder DR, and are shorter than the length of the substrate P in the width direction. Strictly speaking, each drawing line LL1 ~ LL5, when the substrate P is transported by the substrate transport mechanism 12 at a reference speed, the joint error of the pattern obtained by the multiple drawing lines LL1 ~ LL5 is the smallest, and the cylinder DR can be rotated relatively The extension direction (axis direction or width direction) of the rotation center line AX2 is inclined at a predetermined angle.

The odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged at predetermined intervals in the direction of the center line AX2 of the rotating cylinder DR. In addition, the even-numbered second drawing line LL2 and the fourth drawing line LL4 are arranged at predetermined intervals in the direction of the center line AX2 of the rotating cylinder DR. At this time, the second drawing line LL2 is arranged between the first drawing line LL1 and the third drawing line LL3 in the direction of the center line AX2. Similarly, the third drawing line LL3 is arranged between the second drawing line LL2 and the fourth drawing line LL4 in the direction of the center line AX2. The fourth drawing line LL4 is arranged between the third drawing line LL3 and the fifth drawing line LL5 in the direction of the center line AX2. In addition, the first to fifth drawing lines LL1 to LL5 are arranged so as to cover the full width of the exposure area A7 drawn on the substrate P in the width direction (axial direction).

The scanning direction of the point light of the drawing beam LB scanned along the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 is a one-dimensional direction and the same direction. In addition, the scanning direction of the point light of the drawing light beam LB scanned along the even-numbered second drawing line LL2 and the fourth drawing line LL4 is a one-dimensional direction and the same direction. At this time, the scanning direction (+Y direction) of the point light of the drawing beam LB scanned along the odd-numbered drawing lines LL1, LL3, LL5 and the scanning direction of the point light of the drawing beam LB scanned along the even-numbered drawing lines LL2, LL4 (- Y direction), as shown by the arrow in Figure 3, is the opposite direction. This is because each of the drawing units UW1 to UW5 has the same configuration, and the odd-numbered drawing unit and the even-numbered drawing unit are arranged in opposite directions in the XY plane by rotating 180°, and the drawing units UW1 to UW5 are arranged as light beams. The rotating polygon mirror of the scanner rotates in the same direction. Therefore, from the perspective of the conveying direction of the substrate P, the drawing start position of the odd-numbered drawing lines LL3 and LL5 and the drawing start position of the even-numbered drawing lines LL2 and LL4 are adjacent to each other in the Y direction with an error below the diameter of the spot light. Same (or the same). Similarly, the drawing end positions of the odd-numbered drawing lines LL1 and LL3 and the drawing end positions of the even-numbered drawing lines LL2 and LL4 are adjacent to each other in the Y direction with an error below the diameter of the spot light ( Or consistent).

As described above, each of the odd-numbered drawing lines LL1, LL3, and LL5 are arranged in a row in the width direction of the substrate P in such a way that they are substantially parallel to the rotation center line AX2 of the rotating cylinder DR on the substrate P. The even-numbered drawing lines LL2 and LL4 are arranged on the substrate P in such a way that they are substantially parallel to the rotation center line AX2 of the rotating cylinder DR, and are arranged in a row in the width direction of the substrate P.

Next, the drawing device 11 will be described with reference to FIGS. 4 to 7. The drawing device 11 has the above-mentioned multiple drawing units UW1 to UW5, a branched optical system SL that splits the drawing light beam LB from the light source device CNT and guided to the drawing units UW1 to UW5, and a calibration detection system 31 for calibration.

The branching optical system SL branches the drawing light beam LB emitted from the light source device CNT into a plurality of light beams, and directs the branched drawing light beams LB to the plural drawing units UW1 to UW5, respectively. The branched optical system SL includes a first optical system 41 that splits the drawing light beam LB emitted from the light source device CNT into two, a second optical system 42 that enters the drawing light beam LB by one of the branches of the first optical system 41, and The first optical system 41 branched into the third optical system 43 into which the other drawing light beam LB enters. In addition, the first optical system 41 of the branch optical system SL is provided with a beam displacement mechanism 44 that shifts the drawing light beam LB 2-dimensionally in a plane orthogonal to the traveling axis of the drawing light beam LB. The optical system 43 is provided with a beam displacement mechanism 45 for two-dimensionally traversing the drawing beam LB. In the branch optical system SL, a part of the light source device CNT side is disposed on the main body frame 21, and on the other hand, another part of the drawing units UW1 to UW5 is disposed on the second optical table 25.

The first optical system 41 has a 1/2 wave plate 51, a polarizer (polarization beam splitter) 52, a beam diffuser 53, a first mirror 54, a first relay lens 55, and a second relay lens 56. The beam shift mechanism 44, the second mirror 57, the third mirror 58, the fourth mirror 59, and the first beam splitter 60. In addition, it is not easy to understand the arrangement relationship of the components from FIGS. 4 and 5, so it is also explained with reference to the perspective view of FIG. 6.

As shown in FIG. 6, the drawing light beam LB emitted in the +X direction from the light source device CNT is incident on the 1/2 wave plate 51. The 1/2 wave plate 51 is rotatable within the incident surface of the drawing light beam LB. The polarization direction of the drawing light beam LB incident on the 1/2 wave plate 51 is a predetermined polarization direction corresponding to the rotation position (angle) of the 1/2 wave plate 51. The drawing light beam LB passing through the 1/2 wave plate 51 enters the polarizer 52. The polarizer 52 transmits the light component of the predetermined polarization direction contained in the drawing light beam LB, and on the other hand, reflects the light component of the other polarization direction to the +Y direction. Therefore, the intensity of the drawing light beam LB reflected by the polarizer 52 can be adjusted by the coordinated action of the 1/2 wave plate 51 and the polarizer 52 depending on the rotation position of the 1/2 wave plate 51.

A part of the drawing light beam LB (unnecessary light component) that has passed through the polarizer 52 is irradiated on the diffuser (light trap) 53. The diffuser 53 absorbs part of the light component of the incident drawing light beam LB to prevent the light component from leaking to the outside. Furthermore, it is also used to adjust various optical systems through which the drawing light beam LB passes. It is dangerous because the laser power is too strong in the maximum state, so that the diffuser 53 can absorb more light components of the drawing light beam LB , And change the rotation position (angle) of the 1/2 wave plate 51 to greatly attenuate the power of the drawing light beam LB toward the drawing units UW1 to UW5.

The drawing light beam LB reflected in the +Y direction by the polarizer 52 is reflected in the +X direction by the first mirror 54 and enters the beam displacement mechanism 44 through the first relay lens 55 and the second relay lens 56 and reaches the second reflection Mirror 57.

The first relay lens 55 converges the drawing light beam LB (substantially parallel light beam) from the light source device CNT to form a beam waist, and the second relay lens 56 converges and diverges the drawing light beam LB into a parallel light beam again.

The beam displacement mechanism 44, as shown in FIG. 6, includes two parallel plane plates (quartz) arranged along the traveling direction (+X direction) of the drawing beam LB, one of the parallel plane plates is set to be able to surround an axis parallel to the Y axis Inclined, the other parallel plane plate is set so that the edge is inclined around an axis parallel to the Z axis. According to the inclination angle of each parallel plane plate, the drawing light beam LB moves horizontally in the ZY plane and is emitted from the light beam displacement mechanism 44.

After that, the drawing light beam LB is reflected in the -Y direction by the second mirror 57, reaches the third mirror 58, and is reflected in the -Z direction by the third mirror 58 to reach the fourth mirror 59. The drawing light beam LB is reflected in the +Y direction by the fourth mirror 59 and enters the first beam splitter 60. The first beam splitter 60 reflects a part of the light quantity component of the drawing light beam LB in the −X direction to guide the second optical system 42, and guides the remaining light quantity component of the drawing light beam LB to the third optical system 43. In this embodiment, the drawing light beam LB directed to the second optical system 42 is then distributed to the three drawing units UW1, UW3, UW5, and the drawing light beam LB directed to the third optical system 43 is then distributed to two drawing units. Unit UW2, UW4. Therefore, the ratio of the reflectance to the transmittance of the first beam splitter 60 on the light dividing surface is preferably 3:2 (reflectance 60%, transmittance 40%), but it does not have to be so, it may be 1:1.

Here, the third reflecting mirror 58 and the fourth reflecting mirror 59 are arranged at a predetermined interval on the rotation axis I of the moving mechanism 24. That is, the center line of the drawing light beam LB (parallel light beam) reflected by the third mirror 58 and directed toward the fourth mirror 59 is set to coincide (coaxially) with the rotation axis I.

In addition, the structure including the third reflector 58 to the light source device CNT (the upper side in the Z direction in FIG. 4, surrounded by a two-dot chain line) is provided on the main body frame 21 side, and on the other hand, includes the fourth reflector The configuration of the mirror 59 to the plurality of drawing units UW1 to UW5 (the part surrounded by a two-dot chain line on the lower side in the Z direction in FIG. 4) is provided on the second optical table 25 side. Since the third reflecting mirror 58 and the fourth reflecting mirror 59 are arranged such that even if the first optical table 23 and the second optical table 25 are relatively rotated by the moving mechanism 24, the drawing beam LB will pass coaxially with the rotation axis I, so from the first The optical path of the drawing light beam LB from the 4 reflecting mirror 59 to the first beam splitter 60 is not changed. Therefore, even if the second optical table 25 is rotated relative to the first optical table 23 by the moving mechanism 24, the drawing light beam LB emitted from the light source device CNT provided on the side of the main body frame 21 can be appropriately and stably guided to the first optical table 23. 2 Plural drawing units UW1 to UW5 on the side of the optical table 25.

The second optical system 42 divides the drawing light beam LB from one of the branches of the first beam splitter 60 of the first optical system 41 to the odd number drawing units UW1, UW3, UW5 described later. The second optical system 42 has a fifth mirror 61, a second beam splitter 62, a third beam splitter 63, and a sixth mirror 64.

The drawing light beam LB reflected in the −X direction by the first beam splitter 60 in the first optical system 41 is reflected in the −Y direction by the fifth mirror 61 and then enters the second beam splitter 62. Part of the drawing light beam LB incident on the second beam splitter 62 is reflected in the -Z direction and directed to the odd-numbered drawing unit UW5 (refer to FIG. 5). The drawing light beam LB that has passed through the second beam splitter 62 enters the third beam splitter 63. Part of the drawing light beam LB incident on the third beam splitter 63 is reflected in the -Z direction and directed to the odd-numbered drawing unit UW3 (refer to FIG. 5). A part of the drawing light beam LB that has passed through the third beam splitter 63 is reflected in the -Z direction by the sixth mirror 64 and directed to the odd-numbered drawing unit UW1 (refer to FIG. 5). In addition, in the second optical system 42, the drawing light beams LB irradiated on the odd-numbered drawing units UW1, UW3, UW5 are slightly inclined with respect to the -Z direction.

In addition, in order to effectively utilize the power of the drawing light beam LB, the ratio of reflectivity to transmittance of the second beam splitter 62 is close to 1:2, and the ratio of reflectivity to transmittance of the third beam splitter 63 is close to 1: 1 is better.

On the other hand, the third optical system 43 branches the other drawing light beam LB of the first beam splitter 60 of the first optical system 41 to branch to the even-numbered drawing units UW2 and UW4 described later. The third optical system 43 includes a seventh mirror 71, a beam shift mechanism 45, an eighth mirror 72, a fourth beam splitter 73, and a ninth mirror 74.

The drawing light beam LB transmitted in the +Y direction by the first beam splitter 60 of the first optical system 41 is reflected in the +X direction by the seventh mirror 71, penetrates the beam displacement mechanism 45, and enters the eighth mirror 72. The beam displacement mechanism 45 is composed of two tiltable parallel plane plates (quartz) similar to the beam displacement mechanism 44, so that the drawing beam LB advancing toward the 8th mirror 72 in the +X direction is traversed in the ZY plane.

The drawing light beam LB reflected in the −Y direction by the eighth mirror 72 enters the fourth beam splitter 73. A part of the drawing light beam LB irradiated on the fourth beam splitter 73 is reflected in the -Z direction, and is directed to the even-numbered drawing unit UW4 (refer to FIG. 5). The drawing light beam LB that has passed through the fourth beam splitter 73 is reflected in the -Z direction by the ninth mirror 74, and is directed to the even-numbered drawing unit UW2. In addition, in the third optical system 43, the drawing light beam LB irradiated on the even-numbered drawing units UW2 and UW4 is also slightly inclined with respect to the -Z direction.

As described above, in the branch optical system SL, the drawing light beam LB from the light source device CNT is branched into a plurality of drawing units UW1 to UW5. At this time, the reflectance (transmittance) of the first beam splitter 60, the second beam splitter 62, the third beam splitter 63, and the fourth beam splitter 73 is adjusted to be appropriate depending on the number of branches of the drawing beam LB The reflectance is such that the beam intensity of the drawing light beam LB irradiated on the plurality of drawing units UW1 to UW5 is the same intensity.

The beam displacement mechanism 44 is arranged between the second relay lens 56 and the second mirror 57. The beam displacement mechanism 44 can finely adjust all the positions of the drawing lines LL1 to LL5 formed on the substrate P in the order of μm within the drawing surface of the substrate P.

In addition, the beam displacement mechanism 45 can finely adjust the even-numbered second drawing line LL2 and the fourth drawing line LL4 of the drawing lines LL1 to LL5 formed on the substrate P on the drawing surface of the substrate P in the order of μm.

4, 5, and 7, a plurality of drawing units UW1 to UW5 will be described. As shown in FIG. 4 (and FIG. 1), a plurality of drawing units UW1 to UW5 are arranged in two rows in the circumferential direction of the rotating cylinder DR with the center plane p3 interposed therebetween. A plurality of drawing units UW1 to UW5 are arranged on the side where the first, third, and fifth drawing lines LL1, LL3, LL5 are sandwiched between the central plane p3 (the side in the -X direction in Fig. 5), and the first drawing unit UW1 and the 3 drawing unit UW3 and fifth drawing unit UW5. The first drawing unit UW1, the third drawing unit UW3, and the fifth drawing unit UW5 are arranged at predetermined intervals in the Y direction. In addition, a plurality of drawing units UW1 to UW5 are arranged on the side where the second and fourth drawing lines LL2 and LL4 are arranged sandwiching the center plane p3 (+X direction side in FIG. 5), and the second drawing unit UW2 and the fourth drawing unit UW4 are arranged . The second drawing unit UW2 and the fourth drawing unit UW4 are arranged at a predetermined interval in the Y direction. At this time, as shown in FIG. 2 or FIG. 5, the second drawing unit UW2 is arranged in the Y direction between the first drawing unit UW1 and the third drawing unit UW3. Similarly, the third drawing unit UW3 is arranged between the second drawing unit UW2 and the fourth drawing unit UW4 in the Y direction. The fourth drawing unit UW4 is arranged in the Y direction between the third drawing unit UW3 and the fifth drawing unit UW5. In addition, as shown in FIG. 4, the first drawing unit UW1, the third drawing unit UW3, the fifth drawing unit UW5, the second drawing unit UW2, and the fourth drawing unit UW4 are centered on the center plane p3 when viewed from the Y direction. Symmetrical configuration.

Next, the configuration of the optical system in each drawing unit UW1 to UW5 will be described with reference to FIG. 4. In addition, since the drawing units UW1 to UW5 have the same configuration, the first drawing unit UW1 (hereinafter, simply referred to as drawing unit UW1) will be described as an example.

The drawing unit UW1 shown in FIG. 4 scans the point light of the drawing light beam LB along the drawing line LL1 (first drawing line LL1), and includes a light deflector 81, a polarization beam splitter PBS, a quarter wave plate 82, and a scanner 83. The bending mirror 84, the f-θ lens system 85, and the Y magnification correction optical member (lens group) 86B including the cylindrical lens 86. In addition, a calibration detection system 31 is provided adjacent to the polarization beam splitter PBS.

The optical deflector 81 uses, for example, an acousto-optic element (AOM: AcoustIic "Optic" Modulator). AOM is based on whether or not to generate a diffraction grating with ultrasonic waves (high frequency signal) internally, so that the primary diffracted light of the incident drawing beam is generated in the ON state of the predetermined diffraction angle direction, and the primary diffracted light is not generated Optical switching element that switches the OFF state.

The control unit 16 shown in FIG. 1 performs ON/OFF switching of the light deflector 81, thereby switching the projection/non-projection of the drawing light beam LB to the substrate P at high speed. Specifically, one of the drawing light beams LB distributed by the branch optical system SL passes through the relay lens 91 and is irradiated to the light deflector 81 slightly inclined with respect to the -Z direction. When the light deflector 81 is switched to OFF, the drawing light beam LB advances straight in an inclined state, and is shielded by the light shielding plate 92 provided after passing through the light deflector 81. On the other hand, when the optical deflector 81 is switched ON, the drawing beam LB (primary diffracted light) is deflected in the -Z direction, and is irradiated on the Z direction of the optical deflector 81 through the optical deflector 81 Polarizing beam splitter PBS. Therefore, when the light deflector 81 is switched ON, the spot light of the drawing beam LB is projected on the substrate P, and when the light deflector 81 is switched off, the spot light of the drawing beam LB is not projected on the substrate P.

In addition, since the AOM is arranged at the position of the light waist of the drawing light beam LB converged by the relay lens 91, the drawing light beam LB (primary diffracted light) emitted from the optical deflector 81 diverges. For this reason, a relay lens 93 that converts the divergent drawing light beam LB back to a parallel light beam is provided after the light deflector 81.

The polarization beam splitter PBS reflects the drawing light beam LB irradiated from the light deflector 81 through the relay lens 93. The drawing light beam LB emitted from the polarizing beam splitter PBS is based on the 1/4 wave plate 82, the scanner 83 (rotating polygon mirror), the bending mirror 84, the f-θ lens system 85, the optical member 86B for Y magnification correction, and the cylindrical surface The lens 86 advances sequentially, and condenses the light on the substrate P into a scanning spot light.

On the other hand, the polarizing beam splitter PBS and the quarter-wave plate 82 provided between the polarizing beam splitter PBS and the scanner 83 work together to project the drawing beam on the outer peripheral surface of the rotating cylinder DR below the substrate P The reflected light of LB proceeds in the reverse direction in the order of the Y-magnification correction optical member 86B, the cylindrical lens 86, the f-theta lens system 85, the bending mirror 84, and the scanner 83, so that the reflected light can penetrate. That is, the linearly polarized laser light of the drawing light beam LB that is irradiated to the polarizing beam splitter PBS from the light deflector 81 is S polarized light is reflected by the polarizing beam splitter PBS. In addition, the drawing light beam LB reflected by the polarization beam splitter PBS passes through the quarter wave plate 82, the scanner 83, the bending mirror 84, the f-theta lens system 85, the Y magnification correction optical member 86B, and the cylindrical lens 86 The spot light of the drawing beam LB irradiated on the substrate P and focused on the substrate P becomes circularly polarized light. The reflected light from the substrate P (or the outer peripheral surface of the rotating cylinder DR) travels in the opposite direction to the light transmission path of the drawing beam LB, and passes through the quarter wave plate 82 again, and becomes the linearly polarized laser light of the P polarization. Therefore, the reflected light reaching the polarization beam splitter PBS from the substrate P (or the rotating cylinder DR) passes through the polarization beam splitter PBS, and irradiates the photoelectric sensor 31Cs of the calibration detection system 31 through the relay lens 94.

As described above, the polarization beam splitter PBS is an optical splitter arranged between the scanning optical system including the scanner 83 and the calibration detection system 31. Since the alignment detection system 31 shares a part of the light transmitting optical system that transmits the drawing light beam LB to the substrate P, it is a simple and compact optical system.

As shown in FIGS. 4 and 7, the scanner 83 includes a mirror 96, a rotating polygon mirror (rotating polygon mirror) 97, and an origin detector 98. The drawing light beam LB (parallel light beam) passing through the quarter wave plate 82 is reflected in the XY plane by the reflecting mirror 96 through the cylindrical lens 95 and irradiated on the rotating polygon mirror 97. The rotating polygon mirror 97 includes a rotating shaft 97a extending in the Z direction and a plurality of reflecting surfaces 97b formed around the rotating shaft 97a. The rotating polygon mirror 97 rotates in a predetermined rotation direction with the rotation axis 97a as the center, so that the reflection angle of the drawing light beam LB (light beam intensity-modulated by the light deflector 81) irradiated on the reflecting surface 97b is in the XY plane According to the continuous change, the reflected drawing light beam LB is condensed into a point light by the bending mirror 84, the f-theta lens system 85, and the second cylindrical lens 86 (and the optical member 86B for Y magnification correction). The drawing line LL1 on P (similarly, scan along LL2～LL5). The origin detector 98 detects the origin of the drawing beam LB scanned along the drawing line LL1 of the substrate P (similarly, along LL2 to LL5). The origin detector 98 is arranged on the opposite side of the reflecting mirror 96 with the drawing light beam LB reflected on each reflecting surface 97b sandwiched.

In FIG. 7, for simplicity of explanation, although the origin detector 98 only shows a photodetector, in fact, it is provided with an LED and a semiconductor mine for projecting the detection beam toward the reflecting surface 97b of the rotating polygon mirror 97 projected toward the drawing beam LB. The origin detector 98 performs photoelectric detection of the light reflected by the detection beam on the reflective surface 97b through the narrow slit.

According to this, the origin detector 98 is set to output a pulse signal indicating the origin at a fixed time relative to the time when the spot light irradiates the drawing line LL1 (LL2 to LL5) on the substrate P.

The drawing light beam LB irradiated on the bending mirror 84 from the scanner 83 is reflected by the bending mirror 84 in the −Z direction, and enters the f-θ lens system 85 and the cylindrical lens 86 (and the optical member 86B for Y magnification correction).

When the reflective surfaces 97b of the rotating polygon mirror 97 are not strictly parallel to the center line of the rotating shaft 97a, but are slightly inclined (surface tilt), the point light projected on the substrate P forms the drawing line (LL1 ~ LL5), Each reflecting surface 97b is offset on the substrate P in the X direction. Therefore, using FIG. 8, it will be explained that by the arrangement of two cylindrical lenses 95 and 86, the tilt of each reflecting surface 97b of the rotating polygon mirror 97 can reduce or eliminate the deviation of the drawing lines LL1 to LL5 in the X direction.

The left side of Fig. 8 shows the state where the optical path of the cylindrical lens 95, the scanner 83, the f-theta lens system 85, and the cylindrical lens 86 are expanded on the XY plane, and the right side of Fig. 8 shows the state where the optical path is expanded on the XZ plane. status. As a basic optical configuration, the reflective surface 97b of the rotating polygon mirror 97 irradiated by the drawing light beam LB is arranged at the entrance pupil position (front focus position) of the f-θ lens system 85. Accordingly, relative to the rotation angle θp/2 of the rotating polygon mirror 97, the incident angle of the drawing light beam LB entering the f-θ lens system 85 becomes θp, which is proportional to the incident angle θp to determine the projection on the substrate P (irradiated surface) The upper point of light is in the high position of the image. In addition, by arranging the reflecting surface 97b at the front focal position of the f-θ lens system 85, the drawing light beam LB projected on the substrate P becomes a telecentric state at any position on the drawing line (it is the chief ray of the drawing light beam of the point light). Constantly parallel to the optical axis AXf of the f-theta lens system 85).

As shown in Fig. 8, the two cylindrical lenses 95 and 86 in the plane (XY plane) perpendicular to the rotation axis 97a of the rotating polygon mirror 97 function as parallel flat glass with zero power. , The Z direction (in the XZ plane) extending in the rotation axis 97a functions as a convex lens with a certain positive refractive power. Although the cross-sectional shape of the drawing light beam LB (substantially parallel light beam) incident on the first cylindrical lens 95 is a circle of several millimeters, when the focal position of the cylindrical lens 95 in the XZ plane is set through the mirror 96 in a rotating polygon When the reflecting surface 97b of the mirror 97 is on the reflecting surface 97b, it has a beam width of several mm in the XY plane. In the Z direction, the convergent slit-shaped point light extends on the reflecting surface 97b in the rotation direction to converge.

The drawing beam LB reflected on the reflecting surface 97b of the rotating polygon mirror 97 is a parallel beam in the XY plane, but in the XZ plane (the direction in which the rotation axis 97a extends) becomes a divergent beam and enters the f-θ lens system 85 . Therefore, the drawing light beam LB emitted from the f-θ lens system 85 is substantially parallel in the XZ plane (the direction in which the rotation axis 97a extends), but due to the action of the second cylindrical lens 86, it is That is, on the substrate P, the conveying direction of the substrate P orthogonal to the direction in which the drawing lines LL1 to LL5 extend is also condensed into point light. As a result, a small circular spot light is projected on each drawing line on the substrate P.

With the arrangement of the cylindrical lens 86, as shown on the right side of FIG. 8, in the XZ plane, the reflective surface 97b of the rotating polygon mirror 97 and the substrate P (irradiated surface) can be set in an optically image conjugate relationship. Therefore, even if each reflecting surface 97b of the rotating polygon mirror 97 has an inclination error with respect to the non-scanning direction (the direction in which the rotation axis 97a extends) orthogonal to the scanning direction of the drawing light beam LB, the drawing lines (LL1 to LL5) on the substrate P The position will not deviate from the non-scanning direction of the spot light (the conveying direction of the substrate P). As described above, by arranging the cylindrical lenses 95 and 86 before and after the rotating polygon mirror 97, it is possible to construct an optical system for correcting the inclination of the polygonal reflecting surface in the non-scanning direction.

Here, as shown in FIG. 7, the scanners 83 of the plurality of drawing units UW1 to UW5 are configured symmetrically with respect to the center plane p3. A plurality of scanners 83, and the three scanners 83 corresponding to the drawing units UW1, UW3, UW5 are arranged on the upstream side of the rotating cylinder DR in the direction of rotation (-X direction side in Fig. 7), and the drawing units UW2, UW4 The corresponding two scanners 83 are arranged on the downstream side of the rotation direction of the rotating cylinder DR (+X direction side in FIG. 7). The three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged to face each other across the center plane p3. In this way, the three scanners 83 on the upstream side and the two scanners 83 on the downstream side are arranged in a 180° rotation around the rotation axis I (Z axis). Therefore, when the three rotating polygon mirrors 97 on the upstream side irradiate the drawing light beam LB on the rotating polygon mirror 97 while rotating, for example, the drawing light beam LB reflected by the rotating polygon mirror 97 moves from the drawing start position to the drawing end position Scan to the predetermined scanning direction (for example, the +Y direction in Figure 7). On the other hand, when the two rotating polygon mirrors 97 on the downstream side rotate to the left while irradiating the drawing light beam LB on the rotating polygon mirror 97, the drawing light beam LB reflected by the rotating polygon mirror 97 moves from the drawing start position to the drawing end The position is scanned in the scanning direction opposite to the three rotating polygon mirrors 97' on the upstream side (for example, the -Y direction in Fig. 7).

Here, when viewed in the XZ plane of FIG. 4, the axis of the drawing light beam LB reaching the substrate P from the odd-numbered drawing units UW1, UW3, UW5 is in the same direction as the installation direction line Le1. That is, the azimuth line Le1 is set, and the line connecting the odd-numbered drawing lines LL1, LL3, LL5 and the rotation center line AX2 in the XZ plane. Similarly, when viewed in the XZ plane of FIG. 4, the axis of the drawing light beam LB reaching the substrate P from the even-numbered drawing units UW2 and UW4 is in the same direction as the installation azimuth line Le2. In other words, the azimuth line Le2 is set, and in the XZ plane, the line connecting the even-numbered drawing lines LL2, LL4 and the rotation center line AX2. Therefore, each traveling direction (primary ray) of the drawing light beam LB projected on the substrate P as a point light is set to face the rotation center line AX2 of the rotating cylinder DR.

The Y magnification correction optical member 86B is arranged between the f-θ lens system 85 and the substrate P. The optical member 86B for correcting Y magnification can magnify or reduce the drawing lines LL1 to LL5 formed by the drawing units UW1 to UW5 in the Y direction in an equal square.

Specifically, a penetrating parallel plane plate (quartz) of a certain thickness covering each of the drawing lines LL1 to LL5 can be mechanically bent in the direction in which the drawing line extends to make the drawing line's Y-direction magnification (Scan length) A variable mechanism, or a mechanism that moves a part of the three-group lens system of a convex lens, a concave lens, and a convex lens in the optical axis direction to change the Y-direction magnification (scan length) of the drawing line.

In the drawing device 11 configured in this way, the control section 16 controls each section to draw a predetermined pattern on the substrate P. That is, the control unit 16 performs ON/OFF modulation of the light deflector 81 according to the CAD information of the pattern to be drawn on the substrate P during the scanning direction of the drawing light beam LB projected on the substrate P Accordingly, the drawing beam LB is deflected to draw a pattern on the light sensing layer of the substrate P. In addition, the control unit 16 synchronizes the scanning direction of the drawing light beam LB scanned along the drawing line LL1 with the movement of the substrate P in the conveying direction by the rotation of the rotating cylinder DR, so that the portion corresponding to the drawing line LL1 in the exposure area A7 Describe the established pattern.

Next, referring to FIGS. 3 and 9 together, the alignment microscopes AM1 and AM2 will be described. The alignment microscopes AM1 and AM2 detect alignment marks formed in advance on the substrate P, or fiducial marks and fiducial patterns formed on the rotating cylinder DR. Hereinafter, the alignment mark of the substrate P and the reference mark and reference pattern of the rotating cylinder DR are simply referred to as marks. The alignment microscopes AM1 and AM2 are used to align the position of the substrate P and a predetermined pattern drawn on the substrate P, or to align the rotating cylinder DR and the drawing device 11.

The alignment microscopes AM1 and AM2 are arranged on the upstream side of the rotation direction of the rotating cylinder DR (the conveying direction of the substrate P) compared to the drawing lines LL1 to LL5 formed by the drawing device 11. Moreover, the alignment microscope AM1 is arranged on the upstream side of the rotation direction of the rotating cylinder DR than the alignment microscope AM2.

The alignment microscopes AM1 and AM2 are composed of an objective lens system GA (only a representative display pair shown in FIG. 9) that projects illumination light on the substrate P or rotating cylinder DR and incident on the mark generated light as a detection probe The objective lens of the quasi microscope AM2 is GA4), and the image of the mark (bright field image, dark field image, fluorescent image, etc.) received through the objective lens GA is photographed with 2D CCD, CMOS, etc. GD (Figure 9 is only representative of the shooting GD4 aimed at the microscope AM2). In addition, the illumination light for alignment is light in a wavelength band that has little sensitivity to the light-sensitive layer on the substrate P, for example, light with a wavelength of about 500 to 800 nm.

The alignment microscope AM1 is arranged in a row in the Y direction (the width direction of the substrate P) with a plurality of (for example, 3). Similarly, there are a plurality of alignment microscopes AM2 arranged in a row in the Y direction (the width direction of the substrate P) (for example, three). That is, there are six alignment microscopes AM1 and AM2 in total.

In FIG. 3, for ease of understanding, in each pair of objective lens systems GA of 6 alignment microscopes AM1 and AM2, the arrangement of each pair of objective lens systems GA1 to GA3 of 3 alignment microscopes AM1 is shown. The three pairs of objective lenses of the alignment microscope AM1 are GA1～GA3 on the observation area (detection position) Vw1～Vw3 on the substrate P (or the outer peripheral surface of the rotating cylinder DR), as shown in Fig. The Y direction where the center line AX2 is parallel, is arranged at a predetermined interval. As shown in FIG. 9, the optical axes La1 to La3 of the pairs of objective lenses GA1 to GA3 passing through the centers of the observation regions Vw1 to Vw3 are all parallel to the XZ plane. Similarly, each pair of objective lens of the three alignment microscope AM2 is the observation area Vw4～Vw6 on the substrate P (or the outer peripheral surface of the rotating cylinder DR) by GA, as shown in Figure 3, in parallel with the rotation center line AX2 The Y direction is arranged at a predetermined interval. As shown in FIG. 9, the optical axes La4 to La6 of the pair of objective lenses GA passing through the centers of the observation regions Vw4 to Vw6 are also parallel to the XZ plane. The observation areas Vw1 to Vw3 and the observation areas Vw4 to Vw6 are arranged at predetermined intervals in the rotation direction of the rotating cylinder DR.

The observation areas Vw1 to Vw6 of the alignment microscopes AM1 and AM2 for the marks are set on the substrate P and the rotating cylinder DR, for example, set in a range of 500-200 μm diagonal. Here, the optical axis La1 to La3 of the alignment microscope AM1, that is, the optical axis La1 to La3 of the objective lens system GA, are set to be aligned with the installation direction line extending from the rotation center line AX2 in the radial direction of the rotation cylinder DR Le3 is in the same direction. In this way, the azimuth line Le3 is set, and when it is observed in the XZ plane of FIG. 9, it is a line connecting the observation areas Vw1 to Vw3 of the alignment microscope AM1 and the rotation center line AX2. Similarly, the alignment of the optical axis La4~La6 of the microscope AM2, that is, the optical axis La4~La6 of the objective lens GA, is set to be aligned with the installation azimuth line extending from the rotation center line AX2 in the radial direction of the rotation cylinder DR Le4 is in the same direction. In this way, the azimuth line Le4 is set, and when observed in the XZ plane of FIG. 9, it is a line connecting the observation areas Vw4 to Vw6 of the alignment microscope AM2 and the rotation center line AX2. At this time, the alignment microscope AM1 is arranged on the upstream side of the rotation direction of the rotating cylinder DR compared with the alignment microscope AM2, so the angle formed by the center plane p3 and the installation azimuth line Le3 is greater than the center plane p3 and the installation azimuth line The angle formed by Le4 is large.

On the substrate P, as shown in FIG. 3, the exposure areas A7 drawn by each of the five drawing lines LL1 to LL5 are arranged at a predetermined interval in the X direction. Around the exposure area A7 on the substrate P, there are a plurality of alignment marks Ks1 to Ks3 (hereinafter referred to as marks) for position alignment, for example, formed in a cross shape.

In Fig. 3, the mark Ks1 is arranged at a certain interval in the X direction in the -Y side peripheral area of the exposure area A7, and the mark Ks3 is arranged at a certain interval in the X direction in the +Y side peripheral area of the exposure area A7. Further, the mark Ks2 is set in the center of the Y direction in the blank area between the two adjacent exposure areas A7 in the X direction.

The mark Ks1 is to be captured in sequence in the observation area Vw1 of the objective lens system GA1 of the alignment microscope AM1 and the observation area Vw4 of the objective lens system GA of the alignment microscope AM2, during the transport of the substrate P The way to form. In addition, the mark Ks3 is used in the observation area Vw3 of the objective lens GA3 of the alignment microscope AM1 and the observation area Vw6 of the objective lens GA of the alignment microscope AM2, which can be followed during the transportation of the substrate P The way of order capture is formed. Further, the mark Ks2 is to be respectively in the observation area Vw2 of the objective lens GA2 of the alignment microscope AM1 and the observation area Vw5 of the objective lens GA of the alignment microscope AM2, during the transport of the substrate P Formed by sequential capture.

Therefore, the three alignment microscopes AM1 and AM2 on both sides of the rotating cylinder DR in the three alignment microscopes AM1 and AM2 can observe or detect the marks Ks1 and Ks3 formed on both sides of the width direction of the substrate P at any time. In addition, the three alignment microscopes AM1 and AM2 in the Y-direction center of the rotating cylinder DR among the three alignment microscopes AM1 and AM2 can observe or detect the gap formed between the exposure areas A7 formed on the substrate P at any time. The mark Ks2 of the Ministry etc.

Here, the exposure device EX is a so-called multi-beam type drawing device, so in order to appropriately join the plural patterns drawn on the substrate P with the drawing lines LL1 to LL5 of the drawing units UW1 to UW5 in the Y direction. , Calibration is necessary to keep the joining accuracy of the multiple drawing units UW1～UW5 within the allowable range. In addition, the relative positional relationship of the alignment microscopes AM1 and AM2 to the observation areas Vw1 to Vw6 of the respective drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5 must be accurately determined by reference line management. To perform this baseline management, calibration is also necessary.

In the calibration for confirming the joining accuracy of the multiple drawing units UW1～UW5, and the calibration for the reference line management of the alignment microscopes AM1 and AM2, at least a part of the outer peripheral surface of the rotating cylinder DR of the support substrate P Set the fiducial mark or fiducial pattern. Therefore, as shown in FIG. 10, in the exposure apparatus EX, the rotating cylinder DR provided with the reference mark or reference pattern on the outer peripheral surface is used.

The rotating cylinder DR is formed with scale parts GPa and GPb that constitute a part of the rotation position detection mechanism 14 described later, as shown in FIGS. 3 and 9 on both ends of the outer peripheral surface. In addition, the rotating cylinder DR is provided with narrow restriction bands CLa and CLb formed by concave grooves or convex edges on the inside of the scale portions GPa and GPb. The Y-direction width of the substrate P is set to adjust the Y-direction interval of the two restriction belts CLa and CLb to be small. The substrate P is placed in the outer peripheral surface of the rotating cylinder DR and closely adheres to the inner area sandwiched by the restriction belts CLa and CLb. And be supported.

The rotating cylinder DR is provided with a plurality of line patterns RL1 (line patterns) inclined at +45 degrees relative to the rotation center line AX2 on the outer peripheral surface sandwiched by the restriction bands CLa and CLb, and the relative rotation center line AX2 is set to -45 A grid-like reference pattern (also used as a reference mark) RMP that is repeatedly engraved with a plurality of line patterns RL2 (line patterns) with a certain pitch (period) Pf1 and Pf2 with a degree of inclination. In addition, the width of the line pattern RL1 and the line pattern RL2 is LW.

The reference pattern RMP is an oblique pattern (oblique grid pattern) that is uniform across the entire surface in order to avoid changes in friction or tension of the substrate P at the contact portion between the substrate P and the outer peripheral surface of the rotating cylinder DR. In addition, the line patterns RL1 and RL2 do not necessarily have to be inclined at 45 degrees, and the line pattern RL1 may be made parallel to the Y axis, and the line pattern RL2 may be made into a grid pattern parallel to the X axis. In addition, it is not necessary to make the line patterns RL1 and RL2 cross at 90 degrees, and the rectangular area enclosed by the two adjacent line patterns RL1 and the adjacent two line patterns RL2 can be made into a square (or rectangle). The angle of the other rhombus crosses the line patterns RL1 and RL2.

Next, the rotation position detection mechanism 14 will be described with reference to FIGS. 3, 4, and 9. As shown in FIG. 9, the rotation position detection mechanism 14 optically detects the rotation position of the rotating cylinder DR, and can be applied to an encoder system using, for example, a rotary encoder. The rotation position detection mechanism 14 has scale parts GPa and GPb provided at both ends of the rotating cylinder DR, and a plurality of encoder read heads EN1, EN2, EN3, EN4 opposed to each of the scale parts GPa and GPb Mobile measuring device. In Figures 4 and 9, although only the four encoder heads EN1, EN2, EN3, and EN4 facing the scale part GPa are shown, the scale part GPB also has the oppositely arranged encoder heads EN1. EN2, EN3, EN4. The rotation position detection mechanism 14 can detect the displacement of the two ends of the rotating cylinder DR (the slight displacement in the Y direction extending from the rotation center line AX2) displacement gauges YN1, YN2, YN3, YN4.

The scales of the scale parts GPa and GPb are respectively formed in a ring shape in the circumferential direction of the outer peripheral surface of the rotating cylinder DR. The scale parts GPa and GPb are diffraction gratings in which concave or convex grid lines are engraved at a certain pitch (for example, 20 μm) in the circumferential direction of the outer peripheral surface of the rotating cylinder DR, and are configured as incremental scales. Therefore, the scale parts GPa and GPb rotate integrally with the rotation cylinder DR around the rotation center line AX2.

The substrate P is located inside the scale parts GPa and GPb avoiding both ends of the rotating cylinder DR, that is, it is wound inside the restriction belts CLa and CLb. If a strict arrangement relationship is required, set the outer peripheral surface of the scale parts GPa and GPb to be the same surface as the outer peripheral surface of the substrate P wound around the rotating cylinder DR (the same radius from the center line AX2). In order to achieve this, the outer peripheral surfaces of the scale parts GPa and GPb and the outer peripheral surface for winding the substrate relative to the rotating cylinder DR can be made into the thickness of the substrate P higher in the radial direction. Therefore, the outer peripheral surfaces of the scale portions GPa and GPb formed on the rotating cylinder DR can be set to have substantially the same radius as the outer peripheral surface of the substrate P. Therefore, the encoder heads EN1, EN2, EN3, EN4 can detect the scale parts GPa and GPb in the same radial direction as the drawing surface of the substrate P wound on the rotating cylinder DR, reducing the measurement position and processing position due to rotation The Abbe error caused by the difference of the diameter direction of the system.

The encoder reading heads EN1, EN2, EN3, EN4, viewed from the rotation center line AX2, are respectively arranged around the scale parts GPa and GPb, at different positions in the circumferential direction of the rotating cylinder DR. The encoder read heads EN1, EN2, EN3, and EN4 are connected to the control unit 16. Encoder reading heads EN1, EN2, EN3, EN4 project measuring beams toward the scale GPa and GPb, and perform photoelectric detection of the reflected beam (diffracted light) to detect changes in the circumferential position of the corresponding scale GPa and GPb The signal (for example, a 2-phase signal with a phase difference of 90 degrees) is output to the control unit 16. The control unit 16 performs digital processing by interpolating the detection signal with a counting circuit not shown, which can measure the angle change of the rotating cylinder DR with sub-micron resolution, that is, measure the circumference of its outer peripheral surface The direction position changes. The control unit 16 may also measure the conveying speed of the substrate P from the angle change of the rotating cylinder DR.

In addition, as shown in FIGS. 4 and 9, the encoder read head EN1 is arranged on the set orientation line Le1. The azimuth line Le1 is set in the XZ plane to connect the projection area (reading position) of the measuring beam of the encoder read head EN1 to the scale part GPa (GPb) and the rotation center line AX2. Furthermore, as described above, the azimuth line Le1 is set to be in the XZ plane, and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder head EN1 and the rotation center line AX2 and the line connecting the drawing lines LL1, LL3, LL5 and the rotation center line AX2 are the same azimuth line.

Similarly, as shown in Figures 4 and 9, the encoder read head EN2 is arranged on the set orientation line Le2. The azimuth line Le2 is set in the XZ plane to connect the projection area (reading position) of the measuring beam of the encoder read head EN2 to the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le2 is set to be in the XZ plane and connects the drawing lines LL2, LL4 and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder head EN2 and the rotation center line AX2 is the same azimuth line as the line connecting the drawing lines LL2, LL4 and the rotation center line AX2.

Furthermore, as shown in FIGS. 4 and 9, the encoder read head EN3 is arranged on the set orientation line Le3. The azimuth line Le3 is set in the XZ plane to connect the projection area (reading position) of the measuring beam of the encoder read head EN3 to the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le3 is set in the XZ plane, and connects the alignment microscope AM1 to the observation area Vw1 to Vw3 of the substrate P and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder head EN3 with the rotation center line AX2, and the line connecting the observation area Vw1～Vw3 of the microscope AM1 with the rotation center line AX2 are the same when viewed in the XZ plane Bearing line.

Similarly, as shown in Figures 4 and 9, the encoder read head EN4 is arranged on the set orientation line Le4. The azimuth line Le4 is set in the XZ plane to connect the projection area (reading position) of the measuring beam of the encoder read head EN4 to the scale part GPa (GPb) and the rotation center line AX2. In addition, as described above, the azimuth line Le4 is set in the XZ plane and connects the observation area Vw4 to Vw6 of the substrate P by the alignment microscope AM2 and the rotation center line AX2. It can be seen from the above that the line connecting the reading position of the encoder read head EN4 with the rotation center line AX2, and the line connecting the observation area Vw4～Vw6 of the microscope AM2 with the rotation center line AX2 are the same when viewed in the XZ plane Bearing line.

When the setting orientation of the encoder reading head EN1, EN2, EN3, EN4 (the angle direction in the XZ plane centered on the rotation center line AX2) is represented by the setting orientation line Le1, Le2, Le3, Le4, such as As shown in FIG. 4, a plurality of drawing units UW1 to UW5 and encoder reading heads EN1 and EN2 are arranged such that the azimuth lines Le1 and Le2 are set at an angle of ±θ° with respect to the center plane p3. The setting azimuth line Le1 and the setting azimuth line Le2 are set so that the encoder read head EN1 and the encoder read head EN2 are around the scale of the scale part GPa (GPb), in a state of non-interference in space.

The displacement gauges YN1, YN2, YN3, and YN4 are respectively arranged around the scale part GPa or GPb when viewed from the rotation center line AX2, at different positions in the circumferential direction of the rotating cylinder DR. The displacement gauges YN1, YN2, YN3, and YN4 are connected to the control unit 16.

The displacement gauges YN1, YN2, YN3, and YN4 can detect the displacement at a position as close as possible to the drawing surface on the substrate P wound on the rotating cylinder DR in the radial direction to reduce the Abbe error. The displacement gauges YN1, YN2, YN3, YN4 project the measuring beam toward one of the two ends of the rotating cylinder DR, and the reflected beam (or diffracted light) is photoelectrically detected, and the corresponding rotating cylinder DR The detection signal of the position change in the Y direction (the width direction of the substrate P) at both ends is output to the control unit 16. The control unit 16 digitally processes the detection signal with a measurement circuit (counting circuit or interpolation circuit, etc.) not shown, and can measure the Y direction of the rotating cylinder DR (and substrate P) with sub-micron resolution The deflection changes. The control unit 16 may also measure the offset rotation of the rotating cylinder DR from the change of one of the two ends of the rotating cylinder DR.

Displacement gauges YN1, YN2, YN3, YN4, although only one of the four is sufficient, but for measuring the offset rotation of the rotating cylinder DR, etc., as long as there are more than three of the four, the rotation circle can be grasped One of the two ends of the cylinder DR moves (dynamic tilt change, etc.). Moreover, if the control unit 16 can align the marks or patterns on the measurement substrate P (or marks on the rotating cylinder DR, etc.) fixed by the microscopes AM1 and AM2 by the control unit 16, the displacement gauges YN1, YN2, YN3, YN4 can also be omitted. .

Here, the control unit 16 uses the encoder read heads EN1 and EN2 to detect the rotation angle positions of the scale unit (rotating cylinder DR) GPa and GPb, and use odd-numbered and even-numbered drawing units based on the detected rotation angle positions Description of UW1～UW5. In other words, the control unit 16 performs ON/OFF modulation of the light deflector 81 according to the CAD information of the pattern to be drawn on the substrate P during the scanning direction of the drawing light beam LB projected on the substrate P, but also The timing of the ON/OFF modulation using the light deflector 81 can be performed according to the detected rotation angle position, that is, the pattern can be drawn on the light sensing layer of the substrate P with good accuracy.

In addition, the control unit 16 can detect the alignment marks Ks1 to Ks3 on the substrate P by storing the alignment microscopes AM1 and AM2, and use the encoder read heads EN3 and EN4 to detect the scale portions GPa and GPb (rotating cylinder DR). ), the corresponding relationship between the positions of the alignment marks Ks1～Ks3 on the substrate P and the rotation angle position of the rotating cylinder DR can be obtained. Similarly, when the control unit 16 detects the reference pattern RMP on the rotating cylinder DR by storing the alignment microscopes AM1 and AM2, it uses the encoder reading heads EN3 and EN4 to detect the scale parts GPa and GPb (rotating cylinder DR) The rotation angle position of the rotation angle position can find the corresponding relationship between the position of the reference pattern RMP on the rotating cylinder DR and the rotation angle position of the rotating cylinder DR. As mentioned above, aligning the microscopes AM1 and AM2 can precisely measure the rotation angle position (or circumferential position) of the rotating cylinder DR at the moment of sampling the mark in the observation area Vw1～Vw6. In the exposure device EX, based on the measurement result, the alignment (alignment) of the substrate P and the predetermined pattern drawn on the substrate P, or the calibration of the rotating cylinder DR and the drawing device 11 is performed.

In addition, the actual sampling is based on the rotation angle position of the rotating cylinder DR measured by the encoder reading heads EN3 and EN4, which corresponds to the position of the mark on the substrate P or the reference pattern RMP on the rotating cylinder DR roughly known in advance. The corresponding angular position is about to write the image information output from the GD of the imaging systems of the alignment microscopes AM1 and AM2 into the image memory at a high speed. That is, the rotation angle position of the rotating cylinder DR measured by the encoder reading heads EN3 and EN4 is used as a trigger to sample the image information output from each photography system GD. Also, different from this, there are also pulses that respond to a clock signal of a certain frequency. The position of the rotation angle of the rotating cylinder DR measured by the encoder reading head EN3, EN4 (counting measurement value) and the GD from each imaging system The method of sampling the output image information at the same time.

In addition, since the mark on the substrate P and the reference pattern RMP on the rotating cylinder DR are moved in one direction relative to the observation area Vw1～Vw6, they are used as CCD or CMOS when sampling the image information output from each imaging system GD It is better to use the faster shutter speed for the photographic element. Along with this, the brightness of the illuminating light in the illuminating observation area Vw1～Vw6 must also be increased. As the illuminating light source for the microscopes AM1 and AM2, flashlights or high-brightness LEDs can also be considered.

FIG. 11 is an explanatory diagram showing the positional relationship between the drawing line and the drawing pattern on the substrate. The drawing units UW1 to UW5 draw the patterns PT1 to PT5 by scanning the point light of the drawing light beam LB along the drawing lines LL1 to LL5. The drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 are the drawing start ends PTa of the patterns PT1 to PT5. The drawing end positions EC1 to EC5 of the drawing lines LL1 to LL5 are the drawing ends PTb of the patterns PT1 to PT5.

The drawing start end PTa of the pattern PT1 and the drawing end PTb of the drawing end PTb are joined to the drawing end PTb of the pattern PT2. Similarly, the drawing start end PTa of the pattern PT2 is joined to the drawing start end PTa of the pattern PT3, the drawing end PTb of the pattern PT3 is joined to the drawing end PTb of the pattern PT4, and the drawing beginning PTa of the pattern PT4 is joined to the drawing beginning PTa of the pattern PT5. In this way, the patterns PT1 to PT5 drawn on the substrate P are joined in the width direction of the substrate P as the substrate P moves in the longitudinal direction, and the device pattern is drawn on the entire large exposure area A7.

Fig. 12 is an explanatory diagram showing the relationship between the point light of the drawing beam and the drawing line. Among the drawing units UW1 to UW5, the drawing lines LL1 and LL2 of the drawing units UW1 and UW2 will be described representatively. Since the drawing lines LL3 to LL5 of the drawing units UW3 to UW5 are also the same, the description thereof is omitted. By rotating the polygon mirror 97 at a constant speed, the beam spot SP of the drawing beam LB is along the drawing lines LL1 and LL2 on the substrate P, scanning the drawing from the drawing start position OC1, OC2 to the drawing end position EC1, EC2 The length of the line LBL.

Generally speaking, in the direct-tracing exposure method, even when the device is drawing a pattern of the smallest size that can be exposed, multiple exposures (multiple writing) of multiple spot lights SP are used to achieve high-precision and stable pattern drawing. As shown in Figure 12, set on the drawing lines LL1 and LL2, when the effective diameter of the spot light SP is Xs, since the drawing light beam LB is pulsed light, the point is generated by 1 pulsed light (lighting time in the order of picoseconds) The light SP and the point light SP generated by the next pulsed light are scanned in such a way that approximately 1/2 the distance CXs of the diameter Xs overlaps in the Y direction (main scanning direction).

In addition, at the same time as the main scanning of the spot light SP along the respective drawing lines LL1 and LL2, the substrate P is conveyed in the +X direction at a constant speed. Therefore, the respective drawing lines LL1 and LL2 move on the substrate P in the X direction at a constant pitch (sub scanning). The distance is also set here as about 1/2 the distance CXs of the diameter Xs of the spot light SP, but it is not limited to this. Accordingly, in the sub-scanning direction (X-direction), the adjacent point lights SP in the X-direction are exposed to overlap each other at a distance CXs of 1/2 of the diameter Xs (or other overlapping distances). Further, the beam spot light SP emitted at the drawing end position EC1 of the drawing line LL1 and the beam spot light SP emitted at the drawing end position EC2 of the drawing line LL2 move along with the substrate P in the longitudinal direction (ie Sub-scanning) Set the drawing start position OC1 and the drawing end position EC1 of the drawing line LL1 in the width direction (Y direction) of the substrate P (the Y direction) to set the drawing start position OC2 and the drawing end position EC2 of the drawing line LL2 .

For example, when the effective diameter Xs of the beam spot light SP is set to 4μm, 2 columns×2 rows of the spot light SP can be well exposed (a total of 4 spot lights arranged in two overlapping directions of the main scanning and sub-scanning) ) The area occupied or the area occupied by 3 columns×3 rows (a total of 9 spot lights arranged in the main scanning and sub-scanning directions) is the smallest size pattern, that is, the smallest size is about 6μm～8μm Line width pattern. In addition, when the reflecting surface 97b of the rotating polygon mirror 97 is set to 10 surfaces, and the rotation speed of the rotating polygon mirror 97 around the rotation axis 97a is 10,000 rpm or more, the line drawing (LL1～LL5) can be drawn by the rotating polygon mirror 97. ) The number of scans (set the scan frequency Fms) of the point light SP (drawing beam LB) on the upper point is 1666.66...Hz or more. This represents that more than 1666 drawing lines can be drawn on the substrate P in the transport direction (X direction) per second. Therefore, if the transfer distance (transfer speed) of the substrate P per second becomes slow, the overlapping distance CXs of the spot lights in the sub-scanning direction (X direction) can be set to a value less than 1/2 of the diameter Xs of the spot lights. For example, 1/3, 1/4, 1/5,... In this case, multiple scanning of the spot light along the drawing line to expose the same drawing pattern can increase the amount of exposure given to the photosensitive layer of the substrate P.

Moreover, when the transfer speed of the substrate P driven by the rotation of the rotating cylinder DR is about 5 mm/s, the X direction (the transfer direction of the substrate P) of the drawing line LL1 shown in FIG. 12 (the same applies to LL2 to LL5) ) The distance (distance CXs) is about 3μm.

In the case of this embodiment, the resolution R of the pattern drawing in the main scanning direction (Y direction) is determined by the effective diameter Xs and scanning frequency Fms of the spot light SP, and the acousto-optic element (AOM) constituting the optical deflector 81 ON/OFF minimum switching time is determined. As an acousto-optic element (AOM), when the highest response frequency Fss=50MHz is used, the time between the ON state and the OFF state can be about 20nS. Furthermore, since the effective scanning period of the drawing light beam LB of one reflecting surface 97b of the rotating polygon mirror 97 (point light scanning divided by the length of the drawing line LBL) is 1/min of the rotation angle of one reflecting surface 97b Therefore, when the length of the drawing line LBL is set to 30mm, the resolution R, which depends on the switching time of the light deflector 81, is R=LBL/(1/3)/(1/Fms)× (1/Fss)≒3μm.

From this relationship, in order to improve the resolution R of pattern drawing, for example, the acousto-optic element (AOM) of the optical deflector 81 uses the highest response frequency Fss of 100MHz, and sets the ON/OFF switching time to 10nsec. Accordingly, the decomposition ability R becomes half of 1.5μm. In this case, the transfer speed of the substrate P by the rotation of the rotating cylinder DR is half. As another method of improving the resolution capability R, for example, the rotation speed of the rotating polygon mirror 97 may also be increased.

Generally speaking, the photoresist used in the photolithography process is a material with a photoresist sensitivity Sr of about 30mj/cm ² . Suppose the transmittance ΔTs of the optical system is 0.5 (50%), the effective scanning period in one reflective surface 97b of the rotating polygon mirror 97 is about 1/3, the length of the drawing line LBL is 30mm, and the drawing unit UW1～UW5 If the number Nuw is 5 and the transfer speed Vp of the substrate P of the rotating cylinder DR is 5 mm/s (300 mm/min), the laser power Pw required by the light source device CNT can be estimated by the following formula.

Pw=30/60×3×30×5/0.5/(1/3)=1350mW

Suppose that when there are 7 drawing units, the laser power Pw required by the light source device CNT is as follows.

Pw=30/60×3×30×7/0.5/(1/3)=1890mW

For example, if the photoresistance sensitivity is about 80 mj/cm ² , in order to perform exposure at the same speed, a light source device CNT of about 3 to 5 W is required as a beam output. To replace the use of such a high-power light source, if the transfer speed Vp of the substrate P by the rotation of the rotating cylinder DR is reduced to 30/80 from the initial value of 5mm/s, it can be used as a beam output of about 1.4~1.9W The light source device for exposure.

Furthermore, if the length LBL of the drawing line is set to 30mm, and it is assumed that the spot diameter Xs of the beam spot light SP, and the resolution power determined by the light switch of the acousto-optic element (AOM) of the optical deflector 81 (the smallest grid of the designated beam position) (Grid), equivalent to 1 pixel) Xg is equal, when both are 3μm, suppose the rotation speed of the 10-sided rotating polygon mirror 97 is 10,000 rpm, and the time of 1 rotation of the rotating polygon mirror 97 is 3/500 seconds. When the effective scanning period of one reflecting surface 97b of the mirror 97 is 1/3 of the rotation angle of one reflecting surface 97b, the effective scanning time Ts (second) of one reflecting surface 97b can be (3/500)×( 1/10) × (1/3) is calculated, approximately Ts = 1/5000 (second). Accordingly, the light source device CNT is the pulse emission frequency Fz when the pulse laser is used, that is, Fz=LBL/(Ts·Xs) can be obtained, and Fz=50MHz is the lowest frequency. Therefore, in the embodiment, a light source device CNT that outputs a pulse laser with a frequency of 50 MHz or higher is required. In view of this, the emission frequency Fz of the light source device CNT is preferably more than twice (for example, 100 MHz) the highest response frequency Fss (for example, 50 MHz) of the acousto-optic element (AOM) of the optical deflector 81.

Furthermore, the acousto-optic element (AOM) of the optical deflector 81 is switched to the driving signal of the ON state/OFF state, in order to prevent the acousto-optic element (AOM) from transitioning from the ON state to the OFF state, or from the OFF state to the driving signal Pulse light emission is generated during the ON state, and it is preferable to perform control to synchronize the light source device CNT with the clock signal oscillating at the pulse light emission frequency Fz.

Next, the relationship between the spot diameter Xs of the beam spot light SP and the pulse emission frequency Fz of the light source device CNT is explained from the viewpoint of the beam shape (the intensity distribution of the two overlapping spot lights SP) using the graph of FIG. 13. The horizontal axis of FIG. 13 represents the drawing position of the spot light SP in the Y direction along the drawing line or the X direction along the conveying direction of the substrate P, or the size of the spot light SP, and the vertical axis represents the peak value of the individual spot light SP The intensity is normalized to a relative intensity value of 1.0. In addition, here, the intensity distribution of the individual spot light SP is assumed to be J1 and Gaussian distribution for explanation.

In Fig. 13, the intensity distribution J1 of a single spot light SP is assumed to have a diameter of 3 μm with an intensity of 1/e ² relative to the peak intensity. The intensity distributions J2～J6 show the simulation results of the integrated intensity distribution (profile) obtained on the substrate P when the two pulses of the spot light SP are divided into the main scanning direction or the sub-scanning direction. Make the position staggered amount (separation distance) different.

In the graph in Fig. 13, the intensity distribution J5 shows that the point light SP of 2 pulses is staggered by the same distance as the diameter of 3μm, and the intensity distribution J4 is the case where the distance of the point light SP of 2 pulses is 2.25μm. The distribution J3 is the case where the distance between the two-pulse point light SP is 1.5 μm. From this, the change of intensity distribution J3～J5 is obvious. In the case of intensity distribution J5, when the spot light SP with a diameter of 3μm is irradiated at an interval of 3μm, the integrated contour is the tumor shape with the highest center position of each of the two spot lights. , At the midpoint of the two spot lights, the normalized intensity can only be obtained at 0.3 degree. On the other hand, when the spot light SP with a diameter of 3 μm is irradiated at an interval of 1.5 μm, the integrated contour has obvious nodules in the contour, and the position of the midpoint between the two spot lights is roughly flat.

In addition, in Fig. 13, the intensity distribution J2 shows the cumulative profile when the separation distance of the spot light SP of 2 pulses is set to 0.75 μm, and the intensity distribution J6 is the half of the intensity distribution J1 of the individual spot light SP. The value of the total width (FWHM) 1.78μm when the integrated contour.

As mentioned above, when the pulse oscillation condition of two spot lights is irradiated at the same interval as the diameter Xs of the spot light SP, the interval distance CXs is shorter, because 2 nodules are likely to appear, so it is best to set it to The optimal separation distance without intensity unevenness (deterioration of drawing accuracy) during exposure. As with the intensity distribution J3 or J6 in Fig. 13, it is better to overlap the spacing distance CXs at a half-degree (for example, 40-60%) of the diameter Xs of the single spot light SP. This optimal separation distance CXs can be adjusted in the main scanning direction by adjusting the pulse emission frequency Fz of the light source device CNT, and the scanning speed of the spot light SP along the drawing line or the scanning time Ts (rotation speed of the rotating polygon mirror 97) At least one of them can be set. In the sub-scanning direction, it can be set by adjusting at least one of the scanning frequency Fms (rotation speed of the rotating polygon mirror 97) of the drawing line and the moving speed of the substrate P in the X direction.

For example, when the absolute value of the rotation speed of the rotating polygon mirror 97 (the scanning time Ts of the spot light) cannot be adjusted with high precision, by finely adjusting the pulse emission frequency Fz of the light source device CNT, the spot light in the main scanning direction Adjust the ratio of the SP spacing distance CXs to the point light diameter Xs (size) to the best range.

As described above, when the two spot lights SP overlap in the scanning direction, that is, when Xs>CXs, the light source device CNT sets the pulse emission frequency Fz to the relationship of Fz>LBL/(Ts·Xs) to satisfy Fz=LBL/(Ts・CXs) relationship. For example, when the pulse emission frequency Fz of the light source device CNT is 100MHz, and the rotating polygon mirror 97 is set to 10 faces and rotated at 10,000 rpm, the actual effect of the point light specified by 1/e ² or the full width at half maximum (FWHM) The diameter Xs is 3μm, and the pulsed laser beam (spot light) from each drawing unit UW1～UW5 can be irradiated on each drawing line LL1～LL5 at 1.5μm intervals (CXs) about half of the diameter Xs. According to this, the uniformity of exposure during pattern drawing is improved, and even fine patterns can obtain a faithful exposure image (resist image) based on the drawing data, achieving high-precision drawing.

Further, the resolution capability (the highest response frequency Fss) determined by the light switching speed of the acousto-optic element (AOM) and the pulse oscillation frequency Fz of the light source device CNT, if h is any integer, it must be converted to position or time The relationship of integer multiples must be the relationship of Fz=h·Fss. This is because in order to avoid the light switching sequence of the acousto-optic element (AOM), the ON/OFF is performed during the pulse beam emitted from the light source device CNT.

The exposure apparatus EX of the first embodiment uses the pulse laser light source CNT which combines the fiber amplifiers FB1 and FB2 and the wavelength conversion element of the wavelength conversion unit CU2, and therefore operates in the ultraviolet wavelength band (400-300nm) , Easily obtain this kind of pulsed light with high oscillation frequency.

In addition, the light switching of the acousto-optic element (AOM) is based on dividing the pattern to be drawn into pixel units of, for example, 3μm×3μm, with "0" and "1" indicating whether or not to irradiate the position of the point light of the pulse beam to each pixel unit Yuan column (delineation data) is performed. When the length of the drawing line LBL is 30mm, the number of pixels in one scan of the spot light becomes 10,000 pixels, and the acousto-optic element (AOM) has the responsiveness of switching the bit row of 10,000 pixels during the scanning time Ts ( Response frequency Fss). On the other hand, adjacent spot lights in the main scanning direction are set with the pulse oscillation frequency Fz, for example, to overlap about 1/2 of the diameter Xs. Therefore, in the above-mentioned relational expression Fz=h·Fss, it is better to set the relationship between the pulse oscillation frequency Fz and the response frequency Fss of the light switching of the acousto-optic element (AOM) with the integer h being 2 or more, that is, Fz>Fss.

Next, the adjustment method of the drawing device 11 of the exposure apparatus EX is demonstrated. Fig. 14 is a flowchart relating to the adjustment method of the exposure apparatus of the first embodiment. Fig. 15 is an explanatory diagram schematically showing the relationship between the reference pattern of the rotating cylinder and the drawing line. FIG. 16 is an explanatory diagram schematically showing the signal output from the photoelectric sensor that receives the reflected light from the reference pattern of the rotating cylinder in a bright field of view. The control unit 16 rotates the rotating cylinder DR as shown in FIG. 15 in order to perform calibration to grasp the positional relationship of the plurality of drawing units UW1 to UW5. The rotating cylinder DR can transport a transparent substrate P that is transparent to the drawing beam LB.

As described above, the reference pattern RMP is integrated with the outer peripheral surface of the rotating cylinder DR. As shown in FIG. 15, among the reference patterns RMP, an arbitrary reference pattern RMP1 moves with the movement of the outer peripheral surface of the rotating cylinder DR. Therefore, the reference pattern RMP1 passes the drawing lines LL1, LL3, and LL5, and then passes the drawing lines LL2, LL4. For example, the control unit 16 scans the drawing light beams LB of the drawing units UW1, UW3, UW5 after the same reference pattern RMP1 has passed the drawing lines LL1, LL3, and LL5. The control unit 16 scans the drawing light beam LB of the drawing units UW2 and UW4 after the same reference pattern RMP1 has passed the drawing lines LL2 and LL4 (step S1). Therefore, the reference pattern RMP1 becomes a reference for grasping the positional relationship of the drawing units UW1 to UW5.

The photoelectric sensor 31Cs of the calibration detection system 31 (FIG. 4) passes through the scanning optical system including the f-theta lens system 85 and the scanner 83 to detect the reflected light from the reference pattern RMP1. The photoelectric sensor 31Cs is connected to the control unit 16, and the control unit 16 detects the detection signal of the photoelectric sensor 31Cs (step S2). For example, the drawing units UW1 to UW5 draw each of the lines LL1 to LL5, and each of the plurality of drawing light beams LB scans a plurality of lines in a predetermined scanning direction.

For example, as shown in FIG. 16, the drawing units UW1 to UW5 draw the drawing light beam LB from the drawing start position OC1 along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR to draw the line length LBL (refer to Figure 12) Scan SC1 on line 1. Next, the drawing units UW1 to UW5 draw the drawing beam LB from the drawing start position OC1 along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR to draw the second of the line length LBL (see FIG. 12) Line scan SC2. Next, the drawing units UW1 to UW5 draw the light beam LB from the drawing start position OC1 along the direction (Y direction) of the rotation center line AX2 of the rotating cylinder DR to draw the third of the line length LBL (see FIG. 12) Line scan SC3.

Since the rotating cylinder DR rotates around the rotation center line AX2, the X-direction positions of the first scan SC1, the second scan SC2, and the third scan SC3 on the reference pattern RMP1 are different by ΔP1 and ΔP2. In addition, the control unit 16 may perform scanning of the drawing beam LB along the first line scan SC1 while the rotating cylinder DR is stationary, and then, after rotating the rotating cylinder DR for ΔP1 minute, it is stationary, and then the The scanning of the drawing beam LB of the scan SC2 in the second line, the rotating cylinder DR is rotated again by ΔP2 and then it is stationary, and the scanning of the drawing beam LB of the scan SC3 in the third line is performed, and each part is operated in this order.

As described above, the reference pattern RMP is set so that the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that cross each other formed on the outer peripheral surface of the rotating cylinder DR are smaller than the length LBL of the drawing line. Therefore, when the drawing light beam LB of the first line scan SC1, the second line scan SC2, and the third line scan SC3 is projected, the drawing light beam LB irradiates at least the intersection portions Cr1 and Cr2. The line patterns RL1 and RL2 are formed with concavities and convexities on the surface of the rotating cylinder DR. When the level difference between the unevenness of the surface of the rotating cylinder DR is set as a specific condition, the reflected light generated by the drawing light beam LB projected on the line patterns RL1 and RL2 will partly produce a difference in reflection intensity. For example, as shown in FIG. 16, when the line patterns RL1 and RL2 are recesses on the surface of the rotating cylinder DR, when the drawing light beam LB is projected on the line patterns RL1 and RL2, the reflected light reflected on the line patterns RL1 and RL2 is photo-induced The detector 31Cs receives light in the bright field.

The control unit 16 detects the edge position psc1 of the reference pattern RMP based on the output signal from the photoelectric sensor 31Cs. For example, the control unit 16 stores the first line scan position data Dsc1 and the intermediate value mpsc1 of the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the first line scan SC1.

Next, the control unit 16 stores the second line scan position data Dsc2 and the intermediate value mpsc1 of the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the second line scan SC2. In addition, the control unit 16 stores the scan position data Dsc3 of the third line and the intermediate value mpsc1 of the edge position psc1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the scan SC3 of the third line.

The control unit 16 calculates the intermediate value mpsc1 of the edge positions psc1 of the plurality of reference patterns RMP from the scanning position data Dsc1 of the first line, scanning position data Dsc2 of the second line, and scanning position data Dsc3 of the third line, mpsc1. The coordinate positions of the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2. As a result, the control unit 16 can also calculate the relationship between the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that cross each other and the drawing start position OC1. The same applies to the other drawing units UW2 to UW5, and the control unit 16 can calculate the relationship between the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that cross each other and the drawing start positions OC2 to OC5 (see FIG. 11). In addition, the aforementioned intermediate value mpsc1 can also be obtained from the peak value of the signal output from the photoelectric sensor 31Cs.

Above, the case where the reflected light reflected by the line patterns RL1 and RL2 is received by the photoelectric sensor 31Cs in a bright field has been explained. However, the photoelectric sensor 31Cs can also be used to darken the reflected light from the line patterns RL1 and RL2. The field of view receives light. Fig. 17 is an explanatory diagram schematically showing a photoelectric sensor that receives light reflected from a reference pattern of a rotating cylinder in a dark field. FIG. 18 is an explanatory diagram schematically showing a signal output from a photoelectric sensor that receives light reflected from a reference pattern of a rotating cylinder in a dark field. As shown in FIG. 17, the calibration detection system 31 has a light-shielding member 31f having a ring-shaped light transmitting portion between the relay lens 94 and the photoelectric sensor 31Cs. Therefore, the photoelectric sensor 31Cs receives edge scattered light or diffracted light among the reflected light reflected by the line patterns RL1 and RL2. For example, as shown in FIG. 18, when the line patterns RL1 and RL2 are recesses on the surface of the rotating cylinder DR, when the drawing beam LB is projected on the line patterns RL1 and RL2, the photoelectric sensor 31Cs will be reflected on the line patterns RL1 and RL2. The reflected light is received in the dark field.

The control unit 16 detects the edge position pscd1 of the reference pattern RMP based on the signal output from the photoelectric sensor 31Cs. For example, the control unit 16 stores the first line scan position data Dsc1 and the intermediate value mpscd1 of the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the first line scan SC1. Next, the control unit 16 stores the second line scan position data Dsc2 and the intermediate value mpscd1 of the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the second line scan SC2. The control unit 16 stores the scan position data Dsc3 of the third line and the intermediate value mpscd1 of the edge position pscd1 of the reference pattern RMP based on the output signal obtained from the photoelectric sensor 31Cs during the scan SC3 of the third line.

The control unit 16 calculates the intersecting value mpscd1 from the scan position data Dsc1 of the first line, scan position data Dsc2 of the second line, and scan position data Dsc3 of the third line, and the intermediate value mpscd1 of the edge positions pscd1 of the plurality of reference patterns RMP by calculation. The intersections Cr1 and Cr2 of the two line patterns RL1 and RL2. As a result, the control unit 16 calculates the relationship between the coordinate positions of the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that cross each other and the drawing start position OC1.

The same applies to the other drawing units UW2 to UW5. The control unit 16 can calculate the relationship between the intersections Cr1 and Cr2 of the two line patterns RL1 and RL2 that cross each other and the drawing start positions OC2 to OC5. As described above, when the reflected light reflected by the line patterns RL1 and RL2 is received by the photoelectric sensor 31Cs in the dark field, the accuracy of the edge positions pscd1 of the plurality of reference patterns RMP can be improved.

As shown in FIG. 14, the control unit 16 obtains the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error from the detection signal detected in step S2 (step S3). Fig. 19 is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating cylinder. Fig. 20 is an explanatory diagram schematically showing the relative positional relationship of a plurality of drawing lines. As described above, the odd-numbered first drawing line LL1, third drawing line LL3, and fifth drawing line LL5 are arranged. As shown in FIG. 19, the first drawing line LL1, the third drawing line LL3 and the fifth drawing line LL5 For each, the reference distance PL between the detected intersections Cr1 is stored in the control unit 16 in advance. Similarly, for each of the second drawing line LL2 and the fourth drawing line LL4, the reference distance PL between the detected intersection portions Cr1 is also stored in the control unit 16 in advance. In addition, for each of the second drawing line LL2 and the third drawing line LL3, the reference distance ΔPL between the detected intersection portions Cr1 is also stored in the control unit 16 in advance. Furthermore, for each of the fourth drawing line LL4 and the fifth drawing line LL5, the reference distance ΔPL between the detected intersection portions Cr1 is also stored in the control unit 16 in advance.

For example, as shown in FIG. 20, the control unit 16 has grasped the positional relationship with respect to the drawing start position OC1 of the first drawing line LL1 based on the signal from the origin detector 98 (refer to FIG. 7), and therefore can obtain the intersection Cr1 The distance BL1 from the drawing start position OC1. In addition, the control unit 16 has detected the position of the drawing start position OC3 of the third drawing line LL3 by the origin detector 98, and therefore can obtain the distance BL3 between the intersection Cr1 and the drawing start position OC3. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC1 and the drawing start position OC3 based on the distance BL1, the distance BL3 and the reference distance PL, and store the origin between the origins of the drawing beam LB scanned along the drawing lines LL1 and LL3 The distance between ΔOC13. Similarly, since the control unit 16 has detected the position of the drawing start position OC5 of the fifth drawing line LL5 by the origin detector 98, the distance BL5 between the intersection Cr1 and the drawing start position OC5 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC3 and the drawing start position OC5 based on the distance BL3, the distance BL5 and the reference distance PL, and store the origin between the origins of the drawing beam LB scanned along the drawing lines LL3 and LL5. The distance between ΔOC35.

Since the control unit 16 has detected the position of the drawing start position OC2 of the second drawing line LL2 by the origin detector 98, the distance BL2 between the intersection Cr1 and the drawing start position OC2 can be obtained. In addition, since the control unit 16 has detected the position of the drawing start position OC4 of the fourth drawing line LL4 by the origin detector 98, the distance BL4 between the intersection Cr1 and the drawing start position OC4 can be obtained. Therefore, the control unit 16 can obtain the positional relationship between the drawing start position OC2 and the drawing start position OC4 based on the distance BL2, the distance BL4, and the reference distance PL, and store the origin between the origins of the drawing beam LB scanned along the drawing lines LL2 and LL4 The distance between ΔOC24.

In addition, the control unit 16 can easily store the origin between the origin of the drawing light beam LB scanned along the drawing lines LL1 and LL2 because the drawing start position OC1 and the drawing start position OC2 are positions obtained through the same reference pattern RMP1. The distance between points is ΔOC12. As described above, the exposure apparatus EX can find the positional relationship between the origins (drawing start points) of the respective drawing units UW1 to UW5.

In addition, the control unit 16 can detect the joint error between the drawing start position OC2 and the drawing start position OC3 from the reference distance ΔPL between the intersection Cr1 detected on the second drawing line LL2 and the third drawing line LL3. Furthermore, it is possible to detect the joint error between the drawing start position OC4 and the drawing start position OC5 from the reference distance ΔPL between the intersection Cr1 detected on the fourth drawing line LL4 and the fifth drawing line LL5.

Two intersections Cr1 and Cr2 are detected during the period from the drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 to the drawing end positions EC1 to EC5. According to this, it is possible to detect the scanning direction from the drawing start position OC1 to OC5 to the drawing end position EC1 to EC5. As a result, the control unit 16 can detect the angular error of the drawing lines LL1 to LL5 with respect to the direction (Y direction) along the center line AX2.

The control unit 16 obtains the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error for the reference pattern RMP1. The reference pattern RMP including the reference pattern RMP1 is a grid-like reference pattern repeatedly engraved with a certain interval (period) Pf1 and Pf2. Therefore, the control unit 16 obtains the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error for the reference pattern RMP repeated at the respective pitches Pf1 and Pf2, and calculates and calculates the plurality of drawing lines Information about the deviation of the relative position relationship of LL1～LL5. As a result, the control unit 16 can further improve the accuracy of the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error.

Next, as shown in FIG. 14, the control part 16 performs the process of adjusting a drawing state (step S4). The control part 16, based on the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, and the scale part (rotating cylinder DR) GPa, GPb detected by the encoder reading heads EN1 and EN2 Adjust the drawing position of the odd-numbered and even-numbered drawing units UW1～UW5. The encoder read heads EN1 and EN2 can detect the conveyance amount of the substrate P based on the scale part (rotating cylinder DR) GPa and GPb.

Fig. 21 is an explanatory diagram schematically showing the relationship between the movement distance per unit time of the substrate and the number of drawing lines contained in the movement distance, similar to the previous Fig. 12. As shown in Figure 21, the encoder read heads EN1 and EN2 can detect and store the movement distance ΔX of the substrate P per unit time. In addition, it is also possible to sequentially detect a plurality of alignment marks Ks1 to Ks3 by the above-mentioned alignment microscopes AM1 and AM2 to obtain and store the movement distance ΔX.

The moving distance ΔX per unit time on the substrate P is drawn by the drawing unit UW1. The multiple drawing lines LL1 are drawn by the beam lines SPL1, SPL2, and SPL3 of the beam spot light SP, and the spot diameter Xs of each beam spot light SP Scan about 1/2 in the X direction (and Y direction) overlapping mode. Similarly, the beam spot SP on the drawing terminal PTb side of the drawing line LL1 and the beam spot SP on the drawing terminal PTb side of the drawing line LL2 are overlapped in the width direction of the substrate P as the substrate P moves in the longitudinal direction. Distance CXs junction.

For example, when the rotating cylinder DR moves up and down, the X-direction drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 are shifted, which may cause, for example, a magnification difference in the X direction. When the control unit 16 slows the conveying speed (moving speed) of the substrate P conveyed by the rotating cylinder DR, the X-direction separation distance CXs of the beam lines SPL1, SPL2, and SPL3 is reduced, and the drawing magnification in the X-direction can be adjusted to be reduced. Conversely, when the transfer speed (moving speed) of the substrate P transported by the rotating cylinder DR is increased, the X-direction separation distance CXs of the beam lines SPL1, SPL2, and SPL3 will increase, and the drawing magnification in the X-direction can be adjusted to increase. Above, the drawing line LL1 has been described with reference to FIG. 21, and the same is true for the other drawing lines LL2 to LL5. The control part 16, based on the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, and the scale part (rotating cylinder DR) GPa, GPb detected by the encoder reading heads EN1 and EN2 The rotation angle position changes the relationship between the moving distance ΔX of the substrate P per unit time in the longitudinal direction of the substrate P and the number of beam lines SPL1, SPL2, and SPL3 contained in the moving distance. Therefore, the control unit 16 can adjust the drawing positions of the odd-numbered and even-numbered drawing units UW1 to UW5 in the X direction.

FIG. 22 is an explanatory diagram schematically illustrating the pulsed light that emits light in synchronization with the system clock of the pulsed light source. Hereinafter, the drawing line LL2 is also described with reference to FIG. 21, and the same is true for the drawing lines LL1, LL3 to LL5. The light source device CNT can simultaneously strike the beam spot light SP with the pulse signal wp as the system clock SQ. By changing the frequency Fz of the system clock SQ, the pulse interval Δwp (=1/Fz) of the pulse signal wp is also changed. The temporal pulse interval Δwp, on the drawing line LL2, corresponds to the interval distance CXs in the main scanning direction of the spot light SP of each pulse. The control unit 16 causes the beam spot light SP of the drawing light beam LB to scan the drawing line length LBL along the drawing line LL2 on the substrate P.

The control unit 16 has a function of partially changing the period of the system clock SQ during the scanning of the drawing light beam LB along the drawing line LL2 so that the pulse interval Δwp is increased or decreased at any position on the drawing line LL2. For example, when the original system clock SQ is 100 MHz, the control unit 16 changes the system clock SQ to 101 MHz (or 99 MHz) at regular intervals (periods) during the scanning of the length LBL of the drawing line. As a result, the amount of the beam spot light SP in the drawing line length LBL increases or decreases. In other words, the control unit 16 increases or decreases the duty ratio of the system clock SQ by a predetermined number of cycles (1 or more) during the period of scanning the length LBL of the drawing line. According to this, the interval between the beam spot lights SP generated by the light source CNT, that is, the variation component of the variable pulse interval Δwp, and the overlap distance CXs of the beam spot lights SP with each other changes. The distance between the drawing start end PTa and the drawing end PTb in the Y direction appears to be stretched.

For example, when the length of the drawing line LBL is 30 mm, it is divided into 11 equal parts, and the pulse interval Δwp of the system clock SQ is increased or decreased for each drawing length of approximately 3 mm (period interval). The increase or decrease of the pulse interval Δwp, as illustrated in Fig. 13, will not cause the range of the accumulated contour (intensity distribution) that changes with the change in the distance CXs between the two adjacent point lights SP to be greatly degraded, for example, the reference If the separation distance CSx is set to 50% of the diameter Xs (3μm) of the spot light, it is set to about ±15%. If the increase or decrease of the pulse interval Δwp is +10% (the interval distance CSx is 60% of the diameter Xs of the spot light), at 10 discrete locations in the drawing line of the length LBL, 1 pulse of spot light will be generated The position is shifted by 10% of the diameter Xs in the main scanning direction. As a result, the length LBL of the drawing line after drawing is extended by 3 μm relative to 30 mm. This means that the pattern drawn on the substrate P is expanded by 0.01% (100 ppm) in the Y direction. According to this, even when the substrate P is expanded and contracted in the Y direction, exposure can be performed in accordance with the expansion and contraction of the drawing pattern in the Y direction.

Set the position to increase or decrease the pulse interval Δwp, for example, to be able to scan the drawing line LL1～LL5 once, for example, preset to any value of every 100 pulses, every 200 pulses, ... of the system clock SQ . In this way, the amount of expansion and contraction in the main scanning direction (Y direction) of the drawing pattern can be changed in a relatively large range, and the magnification can be dynamically corrected in response to the expansion and deformation of the substrate P. Therefore, the control unit 16 of the exposure apparatus EX of this embodiment includes a system clock SQ generating circuit, which has a pulse interval Δwp with a certain original clock signal as the system clock SQ generating clock oscillation unit, It is a time shifting part that increases or decreases the time until the next clock pulse of the system clock SQ is generated relative to the pulse interval Δwp after the input of the original clock signal count (count) preset pulse number. In addition, in the drawing line (length LBL), the number of parts that increase or decrease the pulse interval Δwp of the system clock SQ is roughly determined by the magnification correction ratio (ppm) in the Y direction of the pattern to be drawn. If it is the smallest, it can be At least one of the scanning time Ts of the spot light SP corresponding to the length LBL.

FIG. 23 shows an example of a clock generating circuit that makes the pulse interval Δwp of the system clock SQ partially variable. In FIG. 23, the basic clock signal CKL with the same frequency as the system clock SQ is output from the clock oscillation unit 200. The basic clock signal CKL is applied to the delay circuit 202 that generates the system clock SQ by adding a predetermined delay time Td to each pulse of the basic clock signal CKL, and outputs an increase that increases the frequency of the basic clock signal CKL by, for example, 20 times. The multiplying circuit 204 for multiplying the clock signal CKs.

The delay circuit 202 internally has a counter that counts the number of pulses of the multiplied clock signal CKs to a predetermined value ΔNs. The period during which the counter counts the predetermined value ΔNs corresponds to the delay time Td. The predetermined value ΔNs is set by the preset circuit 206. The preset circuit 206 internally has the standard value Ns ₀ as the initial value of the predetermined value ΔNs, and transmits the preset value Dsb (the value corresponding to the change amount ΔTd of the delay time Td) from the outside (main CPU, etc.), and then The new set value ΔNs is overwritten with the previous set value ΔNs+Dsb.

The overwriting is performed in response to the completion pulse signal b from the counter circuit 208 that counts the pulses of the system clock SQ output from the delay circuit 202. The counter circuit 208 has the following structure, which counts the number of pulses of the system clock SQ to the preset value Dsa and outputs the completion pulse signal b, resets the count value to zero, and repeats the pulses of the system clock SQ again The number is counted. Although the preset value Dsa corresponds to the number of pulses Nck of the point light of a length LBL/N when the length LBL of the drawing line is divided by N, it does not necessarily correspond to the length LBL/N, and can be any value. In addition, the delay circuit 202, the preset circuit 206, and the counter circuit 208 constitute a time shift unit.

FIG. 24 is a timing diagram showing the time transition of the signals of each part in the circuit configuration of FIG. 23. The standard value Ns _{0 is} set as the initial value in the preset circuit 206, and the predetermined value ΔNs added to the delay circuit 202 by the facility is the standard value Ns ₀ . Before the counter circuit 208 counts to the set pulse number Nck, that is, the state before the completion of the generation of the pulse signal b, the predetermined value ΔNs from the preset circuit 206 is Ns0, and the delay circuit 202, as shown in FIG. 24, starts from the basic time The rise of each pulse of the pulse signal CKL counts the number of pulses of the multiplied clock signal CKs to a predetermined value ΔNs, and at the same time that the counting is completed, a pulse wp is output as the system clock SQ. Therefore, the delay time Td _{1 from} the rise of the pulse of the basic clock signal CKL to the rise of the corresponding pulse wp of the system clock SQ is equivalent to the time for counting the pulses of the doubled clock signal CKs to the predetermined value ΔNs.

In FIG. 24, the counter circuit 208 counts up to the preset value Dsa (pulse number Nck) by the pulse wp of the system clock SQ generated after the delay time Td ₁ from the pulse CKn of the basic clock signal CKL. The circuit 208 outputs the completion pulse signal b, and in response, the preset circuit 206 overwrites the new predetermined value ΔNs to the previous predetermined value ΔNs+Dsb. The preset value Dsb is a value corresponding to the change (ΔTd) of the pulse interval Δwp shown in FIG. 22. In FIG. 24, although it is set to a negative value, the positive value is also the same. Therefore, the pulse CKn under basic clock signal CKL of a front pulse CKn + 1 is generated, corresponding to the delay circuit 202 is set to a standard value Ns than the delay time Td of the delay time is set to _{0 shorter} ΔTd the predetermined value Td of ₂ ΔNs.

Thereby, the pulse interval Δwp' of the pulse wp' of the system clock SQ generated in response to the pulse CKn+1 of the basic clock signal CKL and the pulse wp of the previous moment is shorter than the previous pulse interval Δwp. After the pulse wp' is generated, the counter circuit 208 does not generate the completion pulse signal b until the system clock SQ, which is the next pulse number Nck, is not generated. Therefore, the predetermined value ΔNs set in the delay circuit 202 is maintained at the corresponding delay time Td ₂ The system clock SQ is output in a state uniformly delayed by a delay time Td ₂ relative to the basic clock signal CKL until the completion of the pulse signal b is next generated. Therefore, the ratio β between the pulse interval Δwp determined by the frequency Fz of the basic clock signal CKL and the pulse interval Δwp' corrected by the time offset becomes β=Δwp'/Δwp=1±(ΔTd/Δwp) (where, ΔTd <Δwp) The dimension along the width of the pattern drawn along the drawing line is larger than the design value specified by the drawing data when β>1, and smaller than the design value when β<1 (the situation in Figure 24).

In the above circuit configuration of Fig. 23, the pulse number Nck of the system clock SQ is counted repeatedly to make the pulse interval Δwp change time ΔTd of a pulse wp of the system clock SQ immediately after the generation of the pulse signal b is completed. . In addition, in the case of the circuit configuration of Fig. 23, if the standard value Ns ₀ stored in the preset circuit 206 is set to 20, and the preset value Dsb set from the outside is set to zero, no matter whether the completion pulse signal b is generated or not, the preset value ΔNs is maintained at 20 (the drawing magnification in the Y direction is not corrected). In addition, since the frequency of the doubled clock signal CKs is set to 20 times the frequency of the basic clock signal CKL, the predetermined value ΔNs is set to 20, and the preset value Dsb is set to +1 (or -1), Then the predetermined value ΔNs will be overwritten as 20, 21, 22, ・・・ (or 20, 19, 18・・・) every time the completion pulse signal b is generated, increasing (or decreasing). Furthermore, one pulse of the doubled clock signal CKs is equivalent to 1/20 (5%) of the standard pulse interval Δwp (pulse interval distance CXs), so if the preset value Dsb changes by ±1, the two consecutive ones The overlap ratio of the spot lights is changed in 5% units.

As mentioned above, the pulse beam output from the light source device CNT of the pulse laser in response to the system clock SQ of the partial increase in the pulse interval Δwp is supplied to each of the drawing units UW1 to UW5. Therefore, the drawing lines LL1 to Each drawing pattern of LL5 will expand and contract at the same ratio in the Y direction. Therefore, as illustrated in FIG. 12 (or FIG. 11), in order to maintain the accuracy of joining between the drawing lines adjacent in the Y direction, the drawing timing is corrected so that the drawing start positions OC1 to OC5 of the drawing lines LL1 to LL5 ( Or the drawing end position EC1～EC5) move in the Y direction.

An example of a circuit configuration that makes the pulse interval Δwp of the system clock SQ partially variable, in addition to the method of digitally variable delay times Td ₁ and Td ₂ as shown in Figs. 23 and 24, can also be analogous. Change the composition. Alternatively, the pulse interval Δwp' at one of the corrections may increase or decrease with respect to the standard pulse interval Δwp every time the counter circuit 208 counts the system clock SQ to the preset value Dsb (number of pulses Nck). For example The composition of some minor values of 1%. In this case, in one scan of the spot light along the length LBL of the scan line, it is only necessary to change the number of parts where the standard pulse interval Δwp is corrected to the pulse interval Δwp' according to the necessary magnification correction amount. For example, if the number of parts to be corrected is 100, the size of the pattern drawn in one scan of the spot light increases or decreases in the Y direction by an amount equivalent to the pulse interval Δwp.

Furthermore, the ON/OFF switching of the optical deflector (AOM) 81 shown in Figure 4 is performed in response to the serial bit string sent as drawing data (arrangement of bit value "0" or "1") , The sending of the bit value can be synchronized with the pulse signal wp of the system clock SQ (Figure 22) with the partial increase and decrease of the pulse interval Δwp. Specifically, during the period between the generation of one pulse signal wp and the generation of the next pulse signal wp, one bit value is sent to the driving circuit of the optical deflector (AOM) 81, and the sweetness value is "1", When the first bit value is "0", just switch the optical deflector (AOM) 81 from OFF state to ON state.

The control unit 16 can adjust the information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1～LL5 or the arrangement error of each other and the displacement gauges YN1, YN2, which can detect the offset of the two ends of the rotating cylinder DR The information detected by YN3 and YN4 is adjusted to the Y-direction drawing position performed by the odd-numbered and even-numbered drawing units UW1～UW5 to offset the Y-direction error caused by the rotation offset of the rotating cylinder DR. In addition, the control unit 16 can adjust the information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error of each other and the displacement gauge YN1, which can detect the offset of the two ends of the rotating cylinder DR The information detected by YN2, YN3, YN4 is changed to the length of the Y direction (the length of the drawing line LBL) performed by the odd and even drawing units UW1～UW5 to offset the rotation offset of the rotating cylinder DR The error in the Y direction.

Moreover, the control unit 16 can adjust the odd number and even number according to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error between each other and the information detected by the alignment microscopes AM1 and AM2. The X-direction or Y-direction drawing positions performed by the drawing units UW1 to UW5 are used to offset the X-direction or Y-direction error of the substrate P.

The exposure apparatus EX of the first embodiment includes, as described above, the drawing light beam LB from each of the drawing units UW1 to UW5 to include the predetermined points in the drawing surface of the drawing lines LL1 to LL5 formed on the substrate P The rotation axis I is the center, and the second optical table 25 is displaced relative to the first optical table 23 in the aforementioned drawing plane. The moving mechanism 24 is a displacement correction mechanism. With the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, when all of the plurality of drawing lines LL1 to LL5 have an error in at least one of the X direction and the Y direction, The control unit 16 can drive and control the drive unit of the moving mechanism 24 to displace the second optical table 25 in at least one of the X direction and the Y direction by offsetting the displacement of the error.

When the second optical table 25 is displaced in at least one of the X direction and the Y direction, the fourth mirror 59 shown in FIG. 6 is displaced in the X direction or the Y direction by the amount of displacement. In particular, the fourth mirror 59 is displaced in the Y direction, and when the drawing light beam LB from the third mirror 58 is reflected in the +Y direction, it is displaced in the Z direction. Therefore, the beam displacement mechanism 44 in the first optical system 41 corrects the displacement in the Z direction. Accordingly, the second optical system 42 and the third optical system 43 after the fourth mirror 59 can maintain the light beam LB to pass through the correct optical path.

In addition, in the exposure apparatus EX of the first embodiment, due to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, the plurality of drawing lines LL1 to LL5 are aligned in the X direction When there is an error in at least one of and in the Y direction, the control unit 16 can drive and control the driving unit of the moving mechanism 24 to make the drawing lines LL1～LL5 formed on the substrate P move slightly in the X or Y direction to offset the error The amount of displacement.

Furthermore, in the exposure apparatus EX of the first embodiment, due to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, the odd number of the plurality of drawing lines LL1 to LL5 Or when the even-numbered drawing line has an error in at least one of the X-direction and the Y-direction, the control unit 16 can drive and control the beam displacement mechanism 45 to offset the displacement of the error so that the even number formed on the substrate P The number drawing lines LL2 and LL4 move slightly in the X direction or the Y direction to fine-tune the relative positional relationship with the odd number drawing lines LL1, LL3, LL5 formed on the substrate P.

In addition, the control unit 16 can also adjust information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error between each other, and use displacement meters YN1, YN2, YN3, YN4 or alignment microscope AM1, For the information detected by AM2, adjust the Y magnification of the drawing units UW1～UW5. For example, the image height of the telecentric f-theta lens contained in the f-theta lens system 85 is proportional to the incident angle. Therefore, when only adjusting the Y magnification of the drawing unit UW1, the control unit 16 can individually adjust f based on the adjustment information (calibration information) and the information detected by the displacement meters YN1, YN2, YN3, YN4 or the alignment microscope AM1, AM2 －Theta lens is the focal distance f of 85, according to which the Y magnification is adjusted. In this adjustment mechanism, for example, a bending plate for magnification correction, a magnification correction mechanism for a telecentric f-theta lens, and a half (tiltable parallel plate glass) for displacement adjustment can be combined. More than one. In addition, the rotation speed of the rotating polygon mirror 97 rotating at a certain rotation speed can be slightly changed, that is, the separation distance CXs of each point light SP (pulsed light) drawn synchronously with the system clock SQ can be slightly changed (the adjacent The overlap of the spot lights is slightly staggered), and the Y magnification can also be adjusted as a result.

The exposure apparatus EX of the first embodiment includes, as described above, the drawing light beam LB from each of the drawing units UW1 to UW5 to include the predetermined points in the drawing surface of the drawing lines LL1 to LL5 formed on the substrate P The rotation axis I is the center, and the second optical table 25 is displaced relative to the first optical table 23 in the aforementioned drawing plane. The moving mechanism 24 is a displacement correction mechanism. Due to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error, the plurality of drawing lines LL1 to LL5 has an angular error relative to the Y direction. The control unit 16 can control the movement mechanism 24 The driving unit performs driving control so that the second optical table 25 rotates to offset the rotation amount of the angle error.

In addition, when it is necessary to individually perform rotation correction for each drawing unit UW1 to UW5, the f-θ lens system 85 and the second cylindrical lens 86 shown in FIG. 8 can be rotated slightly around the optical axis AXf, according to The drawing lines LL1 to LL5 are individually slightly rotated (inclined) on the substrate P. The light beam LB scanned by the rotating polygon mirror 97 is imaged (condensed) along the generatrix of the cylindrical lens 86 in the non-scanning direction. Therefore, by rotating the cylindrical lens 86 around the optical axis AXf, the drawing lines LL1 to LL5 can be made Rotate (tilt).

The exposure apparatus EX of the first embodiment only needs to process at least one of the processing of the drawing position adjustment performed by the control device in step S4. In addition, the exposure apparatus EX of the first embodiment may be combined with the processing of the drawing position adjustment performed by the control device in step S4.

According to the adjustment method of the substrate processing apparatus described above, in the exposure apparatus EX of the first embodiment, it is possible to omit (no need) to suppress the pattern PT1 to PT5 adjacent to each other in the width direction (Y direction) of the substrate P The test exposure of the joint error may greatly reduce its frequency. Therefore, the exposure apparatus EX of the first embodiment can shorten the time-consuming calibration operations such as test exposure, drying and development processes, and confirmation of exposure results. In addition, the exposure apparatus EX of the first embodiment can suppress the waste of the substrate P in the number of feedbacks due to test exposure. The exposure apparatus EX of the first embodiment can obtain the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error earlier. The exposure apparatus EX of the first embodiment can be corrected in advance based on the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error between each other, so that it can be easily corrected in the X direction or the Y direction. The components of displacement, rotation, magnification, etc. In addition, the exposure apparatus EX of the first embodiment can improve the accuracy of overlapping exposure on the substrate P.

In addition, although the exposure apparatus EX of the first embodiment has been described with the light deflector 81 including the acousto-optic element and the rotating polygon mirror 97 performing dot scanning of the drawing light beam LB as an example, it may be other than dot scanning. It is a way of drawing patterns using DMD (Digital Micro mirror Device) or SLM (Spatial light modulator).

[Second Embodiment] Next, the exposure apparatus EX of the second embodiment will be explained. Also, in the second embodiment, in order to avoid overlapping descriptions with the first embodiment, only the differences from the first embodiment will be described, and the same components as those in the first embodiment will be given to the first embodiment. The same symbols are used for description.

In the exposure apparatus EX of the second embodiment, the photoelectric sensor 31Cs of the calibration detection system 31 does not detect the reference pattern (which can also be used as a reference mark) RMP but detects the reflected light of the alignment marks Ks1 to Ks3 on the substrate P (Scattered light). The alignment marks Ks1 to Ks3 are arranged at positions on the substrate P in the Y direction passing any one of the drawing lines LL1 to LL5 of the plurality of drawing units UW1 to UW5. When the spot light SP of the drawing beam LB scans the alignment marks Ks1 to Ks3, the scattered light reflected by the alignment marks Ks1 to Ks3 is received by the photoelectric sensor 31Cs in the bright field or the dark field.

The control unit 16 detects the edge positions of the alignment marks Ks1 to Ks3 based on the signal output from the photoelectric sensor 31Cs. And similar to the first embodiment, the control unit 16 can obtain the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the arrangement error between them from the detection signal detected by the photoelectric sensor 31Cs .

In addition, the control unit 16 can adjust the odd number and even number drawing according to the adjustment information (calibration information) corresponding to the arrangement state of the plurality of drawing lines LL1 to LL5 or the mutual arrangement error and the information detected by the alignment microscopes AM1 and AM2. The drawing positions of the units UW1 to UW5 in the X direction or the Y direction are used to offset the error in the X direction or the Y direction of the substrate P. When the spot light SP of the drawing beam LB is projected on the alignment marks Ks1 to Ks3, the photosensitive layer on the alignment marks Ks1 to Ks3 is photosensitive, and the alignment marks Ks1 to Ks3 may collapse in the subsequent manufacturing process. Therefore, it is better to provide a plurality of rows of alignment marks Ks1 to Ks3, and the alignment microscopes AM1 and AM2 read the alignment marks Ks1 to Ks3 that have not been collapsed by exposure.

Therefore, the exposure apparatus EX of the second embodiment can be included in the pattern drawing data, and the spot light SP of the drawing beam LB can be scanned near the alignment marks Ks1 to Ks3 that are collapsed due to exposure. In the vicinity of the alignment marks Ks1～Ks3, the ON/OFF data of the light deflector (AOM) 81 is performed in a way that the spot light SP will not be irradiated. According to this, it is possible to obtain calibration information approximately in real time while performing exposure with the drawing light beam LB, and also to read the alignment marks Ks1 to Ks3 (the position of the substrate P).

The exposure apparatus EX of the second embodiment is the same as the exposure apparatus EX of the first embodiment, and it is possible to omit or greatly reduce the number of test exposures for suppressing bonding errors. In addition, in the exposure apparatus EX of the second embodiment, the pattern of the substrate P can be exposed at the same time, and error information such as the arrangement state or mutual arrangement relationship of the plurality of drawing lines LL1 to LL5 can be measured, early (almost real-time) ) Obtain the corresponding adjustment information (calibration information). Therefore, the exposure apparatus EX of the second embodiment can easily perform corrections and adjustments to maintain a predetermined accuracy while exposing the device pattern based on the error information of the early measurement or the adjustment information (calibration information). It suppresses the degradation of the joint accuracy between the drawing units of each error component such as displacement error, rotation error, and magnification error in the X-direction or Y-direction that are problematic in the multi-drawing head method. According to this, the exposure apparatus EX of the second embodiment can maintain the superposition accuracy during superposition exposure on the substrate P in a high state.

＜Component manufacturing method＞ Next, referring to FIG. 25, a method of manufacturing the element will be described. Fig. 25 is a flowchart showing the device manufacturing method of each embodiment.

In the device manufacturing method shown in FIG. 25, first, the function and performance design of a display panel formed using a self-luminous device such as organic EL is performed, and the required circuit patterns and wiring patterns are designed by CAD or the like (step S201). And prepare a supply reel on which the flexible substrate P (resin film, metal foil film, plastic, etc.) as the base material of the display panel is wound (step S202). In addition, the roll-shaped substrate P prepared in this step S202 may be one whose surface has been modified as necessary, or one that has been formed in advance (for example, micro-concave and convex through imprint method), or one that has been pre-laminated with light. Inductive functional film or transparent film (insulating material).

Next, a base layer composed of electrodes or wiring, insulating film, TFT (thin film semiconductor), etc., which constitute the display panel element is formed on the substrate P, and a light-emitting layer composed of self-luminous elements such as organic EL is formed by stacking on the base plate (Display pixel portion) (Step S203). In this step S203, it also includes the conventional lithography process of exposing and developing the photoresist layer using the exposure device EX described in the previous embodiments, and coating the photoresist with a photosensitive silane coupling agent The substrate P is subjected to pattern exposure to modify the surface to be water-repellent to form an exposure process for patterning, and the photosensitive catalyst layer is subjected to pattern exposure to impart selective plating reduction properties, and is formed by electroless plating Wet process of metal film patterns (wiring, electrodes, etc.), or printing process of drawing patterns with conductive ink containing silver nanoparticles.

Then, cut the substrate P for each display panel element continuously manufactured on the long substrate P in a roll manner, or attach a protective film (environmental barrier layer) or color filter film on the surface of each display panel element, etc., Assemble components (step S204). Then, a step of checking whether the display panel element can operate normally or whether it meets the desired performance and characteristics is performed (step S205). Through the above methods, display panels (flexible displays) can be manufactured. In addition, the electronic components made into the flexible long sheet-like substrate are not limited to the display panel, but can also be used as a flexible wiring network for connecting wires (wiring tapes) between various electronic parts mounted in automobiles, trams, etc. .

1: Component manufacturing system 11: Drawing device 12: Substrate transport mechanism 13: device frame 14: Rotation position detection mechanism 16: Control Department 23: 1st optical platform 24: mobile agency 25: 2nd optical platform 31: Calibration and Testing System 31Cs: Photoelectric sensor 31f: Shading member 73: 4th beam splitter 81: Optical deflector 83: Scanner 96: mirror 97: Rotating polygon mirror 97a: Rotation axis 97b: reflective surface 98: Origin detector AM1, AM2: Align the microscope DR: rotating cylinder EN1, EN2, EN3, EN4: Encoder reading head EX: Exposure device I: Rotation axis LL1～LL5: Drawing line PBS: Polarizing beam splitter UW1～UW5: Drawing unit

Fig. 1 is a diagram showing the overall configuration of the exposure apparatus (substrate processing apparatus) of the first embodiment. [Fig. 2] A perspective view showing the configuration of the main parts of the exposure apparatus in Fig. 1. [Fig. [Figure 3] is a diagram showing the arrangement relationship between the alignment microscope and the drawing line on the substrate. [Fig. 4] is a diagram showing the structure of the rotating cylinder and the drawing device of the exposure device of Fig. 1. [Fig. [FIG. 5] A plan view showing the arrangement of the main parts of the exposure apparatus of FIG. 1. [FIG. 6] A perspective view showing the structure of a branched optical system of the exposure device in FIG. 1. [Fig. 7] A diagram showing the arrangement relationship of a plurality of scanners of the exposure device in Fig. 1. [Fig. [Fig. 8] A diagram illustrating the optical structure used to eliminate the deviation of the drawing line caused by the tilt of the reflective surface of the scanner. [Figure 9] is a perspective view showing the arrangement relationship between the alignment microscope and the drawing line on the substrate and the encoder read head. [Fig. 10] A perspective view showing the surface structure of the rotating cylinder of the exposure device in Fig. 1. [Fig. [Fig. 11] An explanatory diagram showing the positional relationship between the drawing line and the drawing pattern on the substrate. [Fig. 12] is an explanatory diagram showing the relationship between the beam spot and the drawing line. [Figure 13] A graph that simulates the intensity distribution change caused by the overlap of the beam spots of 2 pulses obtained on the substrate. [FIG. 14] It is a flowchart about the adjustment method of the exposure apparatus of 1st Embodiment. [Fig. 15] is an explanatory diagram schematically showing the relationship between the reference pattern of the rotating cylinder and the drawing line. [Fig. 16] is an explanatory diagram schematically showing the signal output from the photoelectric sensor that receives the reflected light from the reference pattern of the rotating cylinder in the bright field. [Fig. 17] is an explanatory diagram schematically showing a photoelectric sensor that receives light reflected from a reference pattern of a rotating cylinder in a dark field. [Figure 18] is an explanatory diagram schematically showing the signal output from the photoelectric sensor that receives the reflected light from the reference pattern of the rotating cylinder in the dark field. [Fig. 19] is an explanatory diagram schematically showing the positional relationship between the reference patterns of the rotating cylinder. [Fig. 20] is an explanatory diagram schematically showing the relative positional relationship of a plurality of drawing lines. [Fig. 21] is an explanatory diagram schematically showing the relationship between the moving distance per unit time of the substrate and the number of drawing lines contained in the moving distance. [Fig. 22] An explanatory diagram showing the pulsed light synchronized with the system clock of the pulsed light source in a schematic manner. [FIG. 23] A block diagram illustrating an example of the circuit configuration of the system clock for generating a pulsed light source. [Fig. 24] is a timing diagram showing the transition of signals of various parts in the circuit configuration of Fig. 23. [Fig. 25] A flowchart showing the manufacturing method of each element.

31: Calibration and Testing System

31Cs: Photoelectric sensor

41: First Optical Department

42: The second optical system

43: The 3rd Department of Optics

44: beam displacement mechanism

45: beam displacement mechanism

51: 1/2 wavelength plate

52: Polarizer (polarizing beam splitter)

53: Diffuser

54: 1st mirror

55: The first relay lens

56: The second relay lens

57: 2nd mirror

58: 3rd mirror

59: 4th mirror

60: 1st beam splitter

61: 5th mirror

62: 2nd beam splitter

63: 3rd beam splitter

64: 6th mirror

71: 7th mirror

72: 8th mirror

73: 4th beam splitter

74: 9th mirror

81: Optical deflector

82: 1/4 wavelength plate

84: Bending Mirror

85: f-θ lens system

86: Cylindrical lens

86B: Optical component for Y magnification correction (lens group)

91: Relay lens

92: visor

93: Relay lens

94: Relay lens

95: Cylindrical lens

97: Rotating polygon mirror

97a: Rotation axis

97b: reflective surface

AX2: Rotation centerline

CNT: light source device

DR: rotating cylinder

EN1, EN2, EN3, EN4: Encoder reading head

GPa, GPb: scale part

I: Rotation axis

LB: beam

Le1~Le4: Set bearing line

P: substrate

PBS: Polarizing beam splitter

Sf2: Shaft

SL: Branch Optics

UW1~UW5: drawing unit

Claims (12)

A pattern drawing device that draws a pattern on the surface of a flexible sheet-like substrate based on drawing data, and is provided with: a conveying mechanism with a reference pattern formed on a part of the surface supporting the substrate to move the supported substrate In the sub-scanning direction along the surface; the drawing unit includes: a scanner for adjusting the beam of light modulated corresponding to the drawing data along the substrate supported by the conveying mechanism perpendicular to the sub-scanning direction Scanning in the main scanning direction; and an origin detector for generating an origin signal indicating that the light beam scanned along the main scanning direction becomes a scanning position corresponding to the starting point of drawing, the drawing unit draws the pattern on the substrate; The calibration detection system receives the reflected light generated when the beam scans the surface of the conveying mechanism or the surface of the substrate, and outputs a detection signal corresponding to the reference pattern or the mark formed on the substrate and the intensity changes; and control Section for determining the position of the drawing start point in the main scanning direction determined based on the origin signal from the origin detector, and the reference beam determined based on the detection signal from the calibration detection system The relationship between the scanning position of the pattern or the mark on the substrate is adjusted to the drawing position of the pattern by the drawing unit. The pattern drawing device according to claim 1, further comprising: a beam shifting mechanism, which is provided on the optical path of the beam before the scanner of the drawing unit, on a plane orthogonal to the travel axis of the beam The light beam is shifted internally to shift the drawing line of the light beam scanned on the substrate to the main scanning direction or the sub-scanning direction; the control unit drives and controls the beam shift in order to adjust the drawing position mechanism. The pattern drawing device according to claim 2, wherein the conveying mechanism includes a rotating cylinder that rotates around a center line set parallel to the main scanning direction, and is a cylinder with a certain radius from the center line A part of the outer peripheral surface of the shape forms the reference The pattern supports the substrate on the outer peripheral surface. The pattern drawing device according to any one of claims 1 to 3, wherein the scanner of the drawing unit includes: a rotating polygon mirror for scanning the light beam in the main scanning direction; and an f-θ lens It is provided for the beams deflected by the reflection surfaces of the rotating polygon mirror to be incident and projected on the substrate in a telecentric state; the calibration detection system is configured such that the beam scans the surface of the conveying mechanism or the surface of the substrate The generated reflected light is received by the f-θ lens system and the rotating polygon mirror. The pattern drawing device according to claim 4, wherein the drawing unit includes: a first cylindrical lens arranged in the optical path of the light beam facing the rotating polygon mirror for correcting the reflection surface of the rotating polygon mirror Surface tilt; and a second cylindrical lens arranged in the optical path of the light beam between the f-θ lens system and the substrate; the calibration detection system is configured to be from the surface of the conveying mechanism or the surface of the substrate The reflected light is received by the second cylindrical lens, the f-θ lens system, the rotating polygon mirror, and the first cylindrical lens in this order. The pattern drawing device according to claim 5, wherein the calibration detection system includes: a polarizing beam splitter for polarizing the light beam toward the first cylindrical lens and returning through the first cylindrical lens The reflected light is separated; and the photoelectric sensor, the reflected light returned through the polarizing beam splitter is photoelectrically detected in a bright field or a dark field. A pattern drawing method, based on drawing data, drawing a pattern on the surface of a flexible sheet-like substrate, including: by forming a reference pattern on a part of the surface supporting the substrate, the substrate is moved along the edge Follow the steps of the secondary scanning direction of the surface of the conveying mechanism; On the substrate moved by the transport mechanism, the light beam whose intensity has been adjusted corresponding to the drawing data is projected in a telecentric state from the drawing unit including the rotating polygon mirror and the f-θ lens system. The rotation of the mirror repeats the steps of scanning in the main scanning direction orthogonal to the sub-scanning direction; from the origin detector that detects the angular position of the reflective surfaces of the rotating polygon mirror, obtaining the scanning in the main scanning direction The light beam becomes the origin signal of the scanning position corresponding to the drawing start point; the reflected light generated when the light beam scans the surface of the conveying mechanism or the surface of the substrate passes through the f-θ lens system and the rotating polygon mirror The light-receiving calibration detection is the step of obtaining the detection signal corresponding to the intensity change of the reflected light generated when the beam scans the reference pattern or the mark formed on the substrate; and obtaining the determination based on the origin signal The relationship between the position of the drawing start point in the main scanning direction and the scanning position of the light beam on the reference pattern or the mark on the substrate determined according to the detection signal is adjusted to the drawing position of the pattern by the drawing unit step. The pattern drawing method according to claim 7, wherein a beam shift mechanism is provided, which is set in the optical path of the beam before entering the rotating polygon mirror, and causes the beam in a plane orthogonal to the traveling axis of the beam The beam shift makes the trace of the beam scanned on the substrate slightly shift to the main scanning direction or the sub-scanning direction; in the adjustment step, for the adjustment of the trace position, the beam shift is driven and controlled mechanism. The pattern drawing method according to claim 8, wherein the beam shifting mechanism is constituted by a parallel plane plate that can be tilted around an axis perpendicular to the traveling axis of the beam; in the adjustment step, the parallel plane plate is adjusted The tilt angle. The pattern drawing method according to claim 8, wherein the conveying mechanism includes a rotating cylinder that rotates around a center line set parallel to the main scanning direction, and a cylinder with a certain radius from the center line A part of the outer peripheral surface of the shape forms the reference The pattern supports the substrate on the outer peripheral surface. The pattern drawing method according to any one of claims 7 to 10, wherein the drawing unit includes: a first cylindrical lens arranged in the optical path of the light beam facing the rotating polygon mirror to correct the rotation The surface of the reflecting surface of the polygon mirror is inclined; and the second cylindrical lens is arranged in the optical path of the beam between the f-θ lens system and the substrate; the calibration detection system will start from the surface of the conveying mechanism or the The reflected light generated on the surface of the substrate sequentially passes through the second cylindrical lens, the f-θ lens system, the rotating polygon mirror, and the first cylindrical lens to receive light. The pattern drawing method according to claim 11, wherein the calibration detection system includes: a polarizing beam splitter for polarizing the light beam toward the first cylindrical lens and returning through the first cylindrical lens The reflected light is separated; and the photoelectric sensor, the reflected light returned through the polarizing beam splitter is photoelectrically detected in a bright field or a dark field.

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