TWI708407B - 氣密封裝之製造方法 - Google Patents

氣密封裝之製造方法 Download PDF

Info

Publication number: TWI708407B
Authority: TW; Taiwan
Prior art keywords: container; transparent substrate; glass cover; glass; manufacturing
Prior art date: 2017-05-29

Application number

TW107108227A

Other languages

English (en)

Chinese (zh)

Other versions

TW201901992A (zh

Inventor

荒川浩士

Original Assignee

日商日本電氣硝子股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2017-05-29

Filing date

2018-03-12

Publication date

2020-10-21

2018-03-12 Application filed by 日商日本電氣硝子股份有限公司 filed Critical 日商日本電氣硝子股份有限公司

2019-01-01 Publication of TW201901992A publication Critical patent/TW201901992A/zh

2020-10-21 Application granted granted Critical

2020-10-21 Publication of TWI708407B publication Critical patent/TWI708407B/zh

Links

238000004519 manufacturing process Methods 0.000 title claims abstract description 38
239000011521 glass Substances 0.000 claims abstract description 131
239000000758 substrate Substances 0.000 claims abstract description 59
239000003566 sealing material Substances 0.000 claims abstract description 55
238000000034 method Methods 0.000 claims abstract description 11
230000001678 irradiating effect Effects 0.000 abstract description 12
239000000843 powder Substances 0.000 description 9
230000000052 comparative effect Effects 0.000 description 6
238000002844 melting Methods 0.000 description 5
MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
239000002241 glass-ceramic Substances 0.000 description 4
238000007789 sealing Methods 0.000 description 4
239000011358 absorbing material Substances 0.000 description 3
239000000919 ceramic Substances 0.000 description 3
238000010304 firing Methods 0.000 description 3
238000012986 modification Methods 0.000 description 3
230000004048 modification Effects 0.000 description 3
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
230000015556 catabolic process Effects 0.000 description 2
238000006731 degradation reaction Methods 0.000 description 2
230000000694 effects Effects 0.000 description 2
239000000945 filler Substances 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
238000005304 joining Methods 0.000 description 2
230000008018 melting Effects 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
238000010521 absorption reaction Methods 0.000 description 1
CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
239000005388 borosilicate glass Substances 0.000 description 1
150000001875 compounds Chemical class 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
229910052878 cordierite Inorganic materials 0.000 description 1
JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
229910052748 manganese Inorganic materials 0.000 description 1
239000000463 material Substances 0.000 description 1
229910052863 mullite Inorganic materials 0.000 description 1
229910000484 niobium oxide Inorganic materials 0.000 description 1
URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
238000004806 packaging method and process Methods 0.000 description 1
239000000049 pigment Substances 0.000 description 1
238000003825 pressing Methods 0.000 description 1
239000005361 soda-lime glass Substances 0.000 description 1
239000000243 solution Substances 0.000 description 1
229910052642 spodumene Inorganic materials 0.000 description 1
239000004575 stone Substances 0.000 description 1
XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
229910001887 tin oxide Inorganic materials 0.000 description 1
OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
229910052844 willemite Inorganic materials 0.000 description 1
229910052845 zircon Inorganic materials 0.000 description 1
LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical class [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 description 1
GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
229910000500 β-quartz Inorganic materials 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Ceramic Engineering (AREA)
Life Sciences & Earth Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Geochemistry & Mineralogy (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Joining Of Glass To Other Materials (AREA)
Electroluminescent Light Sources (AREA)
Laser Beam Processing (AREA)

TW107108227A 2017-05-29 2018-03-12 氣密封裝之製造方法 TWI708407B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2017105563A JP6972661B2 (ja)	2017-05-29	2017-05-29	気密パッケージの製造方法
JP2017-105563		2017-05-29

Publications (2)

Publication Number	Publication Date
TW201901992A TW201901992A (zh)	2019-01-01
TWI708407B true TWI708407B (zh)	2020-10-21

Family

ID=64455245

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW107108227A TWI708407B (zh)	2017-05-29	2018-03-12	氣密封裝之製造方法

Country Status (5)

Country	Link
JP (1)	JP6972661B2 (ja)
KR (1)	KR102478227B1 (ja)
CN (1)	CN110603235B (ja)
TW (1)	TWI708407B (ja)
WO (1)	WO2018220909A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7388112B2 (ja) *	2019-10-10	2023-11-29	日本電気硝子株式会社	接合体の製造方法及び接合体の製造装置
JP7511813B2 (ja) *	2020-09-29	2024-07-08	日本電気硝子株式会社	接合体の製造方法
JP7745825B2 (ja) *	2021-06-29	2025-09-30	日本電気硝子株式会社	接合体の製造方法及び接合体の製造装置
JP2023005724A (ja) *	2021-06-29	2023-01-18	日本電気硝子株式会社	接合体の製造方法及び接合体の製造装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001168222A (ja) *	1999-09-30	2001-06-22	Seiko Epson Corp	電子部品用パッケージの封止装置及び電子部品用パッケージの封止方法
JP2012252827A (ja) *	2011-06-01	2012-12-20	Canon Inc	気密容器の製造方法
CN103715371A (zh) *	2013-12-16	2014-04-09	京东方科技集团股份有限公司	一种封装方法及显示装置
TWM493160U (zh) *	2014-08-21	2015-01-01	Chunghwa Picture Tubes Ltd	玻璃膠密封裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001320256A (ja) *	2000-05-10	2001-11-16	Daishinku Corp	圧電振動デバイスの気密封止方法
JP5064142B2 (ja) *	2007-08-24	2012-10-31	シチズンファインテックミヨタ株式会社	圧電デバイスの製造方法
JP5673102B2 (ja) *	2008-11-26	2015-02-18	旭硝子株式会社	封着材料層付きガラス部材およびそれを用いた電子デバイスとその製造方法
DE102009006932A1 (de) *	2009-01-30	2010-08-19	Centrotherm Thermal Solutions Gmbh + Co. Kg	Anordnung und Verfahren zum gasdichten Versiegeln von OLED-Bauelementen
WO2011036605A1 (en) *	2009-09-22	2011-03-31	Koninklijke Philips Electronics N.V.	Glass package for sealing a device, and system comprising glass package
JP5590935B2 (ja) *	2010-03-29	2014-09-17	キヤノン株式会社	気密容器の製造方法
JP2012048895A (ja) *	2010-08-25	2012-03-08	Canon Inc	気密容器の製造方法
JP2014236202A (ja)	2013-06-05	2014-12-15	旭硝子株式会社	発光装置

2017
- 2017-05-29 JP JP2017105563A patent/JP6972661B2/ja active Active
2018
- 2018-02-21 WO PCT/JP2018/006117 patent/WO2018220909A1/ja not_active Ceased
- 2018-02-21 KR KR1020197021808A patent/KR102478227B1/ko active Active
- 2018-02-21 CN CN201880029501.9A patent/CN110603235B/zh active Active
- 2018-03-12 TW TW107108227A patent/TWI708407B/zh active

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2001168222A (ja) *	1999-09-30	2001-06-22	Seiko Epson Corp	電子部品用パッケージの封止装置及び電子部品用パッケージの封止方法
JP2012252827A (ja) *	2011-06-01	2012-12-20	Canon Inc	気密容器の製造方法
CN103715371A (zh) *	2013-12-16	2014-04-09	京东方科技集团股份有限公司	一种封装方法及显示装置
TWM493160U (zh) *	2014-08-21	2015-01-01	Chunghwa Picture Tubes Ltd	玻璃膠密封裝置

Also Published As

Publication number	Publication date
CN110603235A (zh)	2019-12-20
KR102478227B1 (ko)	2022-12-16
TW201901992A (zh)	2019-01-01
WO2018220909A1 (ja)	2018-12-06
JP2018199600A (ja)	2018-12-20
CN110603235B (zh)	2022-06-24
KR20200014261A (ko)	2020-02-10
JP6972661B2 (ja)	2021-11-24

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TWI708407B (zh)	2020-10-21	氣密封裝之製造方法
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TWI881172B (zh)	2025-04-21	接合體之製造方法
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US20070000600A1 (en)	2007-01-04	Seal of fluid port
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