TWI707933B - Organic el element and method of producing same - Google Patents
Organic el element and method of producing same Download PDFInfo
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Abstract
本發明揭示一種有機電致發光元件,該有機電致發光元件具備:密封基板,其具有與元件基板對置之主表面;及,乾燥劑層,其設置在主表面上。在遠離主表面的外周之區域設置有乾燥劑層。從與主表面垂直之方向觀察時,相對於主表面的面積,乾燥劑層的面積比率為50%以上。The present invention discloses an organic electroluminescence element. The organic electroluminescence element includes: a sealing substrate having a main surface opposed to the element substrate; and a desiccant layer provided on the main surface. A desiccant layer is provided in an area away from the outer periphery of the main surface. When viewed from a direction perpendicular to the main surface, the area ratio of the desiccant layer relative to the area of the main surface is 50% or more.
Description
本發明係有關一種有機電致發光元件(有機EL元件)及其製造方法。The present invention relates to an organic electroluminescence element (organic EL element) and its manufacturing method.
為了防止有機電致發光元件的發光部由於水分引起之發光壽命的下降,有時藉由密封基板來密封已設置在基板上之發光部,進而在密封基板上設置吸水材料(例如,日本特開2006-331766號公報)。In order to prevent the light-emitting part of the organic electroluminescence element from decreasing the light-emitting life due to moisture, sometimes the light-emitting part that has been provided on the substrate is sealed by a sealing substrate, and then a water-absorbing material is provided on the sealing substrate (for example, Japanese Patent Application 2006-331766 Bulletin).
[發明所欲解決的問題] 當要製造一種具有設置在密封基板上的乾燥劑層之有機電致發光元件時,為了避免水分的混入,需要在惰性氣體等乾燥氣氛下在密封基板上形成乾燥劑層。但是,就步驟及設備的簡化的觀點而言,期望能夠在大氣氣氛下形成乾燥劑層,而無需乾燥氣氛。藉由使用吸水容量大的乾燥劑,期待即使在大氣氣氛下形成了乾燥劑層,乾燥劑層亦能夠保持足夠的吸水能力。然而,明確可知:即使使用吸水容量大的乾燥劑,若在大氣氣氛下在密封基板上形成乾燥劑層,則有機電致發光元件的發光面積比率,從剛製造出來之後的初期便容易不足。[The problem to be solved by the invention] When an organic electroluminescence element having a desiccant layer provided on a sealing substrate is to be manufactured, in order to avoid mixing of moisture, it is necessary to form a desiccant layer on the sealing substrate under a dry atmosphere such as an inert gas. However, from the viewpoint of simplification of steps and equipment, it is desirable to be able to form the desiccant layer in an atmospheric atmosphere without requiring a drying atmosphere. By using a desiccant with a large water absorption capacity, it is expected that the desiccant layer can maintain sufficient water absorption capacity even if the desiccant layer is formed in the atmosphere. However, it is clear that even if a desiccant with a large water absorption capacity is used, if the desiccant layer is formed on the sealing substrate in an air atmosphere, the light-emitting area ratio of the organic electroluminescent element is likely to be insufficient from the early stage immediately after its manufacture.
[解決問題的技術手段] 因此,本發明的一態樣的目的為提供一種有機電致發光元件,該有機電致發光元件即使在藉由包括在大氣氣氛下形成乾燥劑層的步驟之方法來製造時,亦能夠保持足夠的初始發光面積比率。[Technical means to solve the problem] Therefore, an object of one aspect of the present invention is to provide an organic electroluminescent element that can maintain sufficient levels even when manufactured by a method including a step of forming a desiccant layer in an atmospheric atmosphere. The initial light emitting area ratio.
本發明的一態樣係有關一種有機電致發光元件,其具備:元件基板;發光部,其設置在元件基板上;密封基板,其具有與元件基板對置之主表面;及,乾燥劑層,其設置在前述主表面上。One aspect of the present invention relates to an organic electroluminescence element, which includes: an element substrate; a light-emitting portion provided on the element substrate; a sealing substrate having a main surface opposed to the element substrate; and, a desiccant layer , Which is set on the aforementioned main surface.
本發明的另一態樣係有關一種上述有機電致發光元件之製造方法。該方法具備:在密封基板的主表面上形成乾燥劑層之步驟;在元件基板上形成發光部之步驟;及,以前述主表面與前述元件基板對置之方向,將密封基板黏接於元件基板上之步驟。密封基板,藉由介於元件基板與密封基板之間之密封劑黏接於元件基板上。形成由元件基板、密封基板及密封劑包圍之氣密空間,且在該氣密空間內配置發光部及乾燥劑層。Another aspect of the present invention relates to a method of manufacturing the above-mentioned organic electroluminescence device. The method includes: forming a desiccant layer on the main surface of a sealing substrate; forming a light-emitting portion on an element substrate; and adhering the sealing substrate to the element in a direction in which the main surface faces the element substrate Steps on the substrate. The sealing substrate is bonded to the element substrate by the sealant between the element substrate and the sealing substrate. An airtight space surrounded by the element substrate, the sealing substrate and the sealant is formed, and the light-emitting part and the desiccant layer are arranged in the airtight space.
發光部具有對置配置之一對電極及在該等之間設置之有機層。乾燥劑層設置在遠離前述主表面的外周之區域。從與前述主表面垂直之方向觀察時,相對於前述主表面的面積,乾燥劑層的面積比率為50%以上。The light-emitting part has a pair of electrodes arranged opposite to each other and an organic layer arranged between them. The desiccant layer is arranged in an area away from the outer periphery of the aforementioned main surface. When viewed from a direction perpendicular to the main surface, the area ratio of the desiccant layer relative to the area of the main surface is 50% or more.
[發明的效果] 若乾燥劑層的面積比率為50%以上,則即使在大氣氣氛下形成乾燥劑層時,有機電致發光元件亦容易保持足夠的初始發光面積比率。又,在遠離密封基板的主表面的外周之區域設置有乾燥劑層,藉此密封基板容易固定於元件基板上。[Effects of the invention] If the area ratio of the desiccant layer is 50% or more, the organic electroluminescence element can easily maintain a sufficient initial light-emitting area ratio even when the desiccant layer is formed in an air atmosphere. In addition, a desiccant layer is provided in an area away from the outer periphery of the main surface of the sealing substrate, whereby the sealing substrate can be easily fixed to the element substrate.
以下,對本發明的若干個實施形態進行詳細說明。但是,本發明並不限定於以下實施形態。Hereinafter, several embodiments of the present invention will be described in detail. However, the present invention is not limited to the following embodiments.
圖1係表示有機電致發光元件的一實施形態之剖面圖。圖1中所示之有機電致發光元件20,具備:元件基板1、設置在元件基板1上之發光部7、密封基板3、乾燥劑層10及密封劑5。Fig. 1 is a cross-sectional view showing an embodiment of an organic electroluminescence device. The organic electroluminescence element 20 shown in FIG. 1 includes an
密封基板3,具有:頂板部3A,其具有與元件基板1對置之矩形或正方形的平坦的主表面3S;及,側壁部3B,其從頂板部3A的外周端部沿與主表面3S垂直之方向延伸。頂板部3A及側壁部3B,形成將主表面3S作為底表面而具有之凹部。乾燥劑層10,形成於密封基板3的主表面3S上。The
密封劑5,介於密封基板3的側壁部3B與元件基板1之間,同時將密封基板3和元件基板1進行黏接。藉此,形成有由元件基板1、密封基板3及密封劑5包圍之氣密空間30。在該氣密空間30內配置發光部7及乾燥劑層10。密封基板3可以係不具有側壁部3B之平坦的板狀體,在該情形下,通常,密封劑5介於密封基板3的頂板部3A與元件基板1之間。在任何情形下,“與元件基板對置之主表面”係指在配置有發光部之氣密空間內與元件基板對置之表面。The sealant 5 is interposed between the
圖2係表示密封基板及乾燥劑層的一實施形態之俯視圖。圖2的俯視圖,示出從與密封基板3的主表面3S垂直之方向觀察密封基板3及乾燥劑層10之形態。如圖2所示,乾燥劑層10設置在從密封基板3的主表面3S的外周向其內側遠離之區域。圖2的俯視圖中,相對於主表面3S的面積,乾燥劑層10的面積比率為50%以上。該面積比率可以係60%以上、70%以上或75%以上。認為:若乾燥劑層10的面積比率增加,則在大氣氣氛下附著於密封基板3的主表面3S上之水分不容易影響發光部7。若面積比率為50%以上,則即使在形成乾燥劑層之後,在大氣氣氛下將密封基板放置例如3小時以上時,亦容易獲得具有充分大至98%以上的發光面積比率之有機電致發光元件。又,就確保密封基板與元件基板之間的穩定的黏接之觀點而言,乾燥劑層10的面積比率可以小於90%。乾燥劑層10的厚度可以係50μm以上且200μm以下。Fig. 2 is a plan view showing an embodiment of a sealing substrate and a desiccant layer. The top view of FIG. 2 shows the form of the
關於乾燥劑層10,如圖2所示,可以係單一膜,如圖3所示,可以包括線狀部。在圖3的實施形態的情形下,乾燥劑層10包含沿一定方向延伸之複數個線狀部。乾燥劑層10包括線狀部時的乾燥劑層10的面積比率,可以在與關於單一膜例示之上述範圍相同的範圍內。線狀部可以沿矩形或正方形主表面3S的任一邊延伸。如圖3所示,相鄰之線狀部可以分開,亦可以局部或整體接觸。通常,由於各線狀部具有相對於主表面3S平緩地傾斜之表面,因此即使相鄰之線狀部接觸,亦能夠區分各線狀部。關於各線狀部的寬度,例如,可以係0.5mm以上且50mm以下或1mm以上且10mm以下。在此,“線狀部的寬度”為線狀部的與長邊方向垂直之方向上的寬度。線狀部的厚度可以係50μm以上且200μm以下。乾燥劑層10的線狀部並不一定需要直線延伸,可以包括曲線狀部分。線狀部可以以直線或曲線狀延伸,而不交叉。例如,線狀部可以彎曲,亦可以以螺旋狀延伸。圖4係表示具有以螺旋狀延伸之線狀部之乾燥劑層的一例之俯視圖。圖4中所示之乾燥劑層10的螺旋狀線狀部,由沿主表面3S的各邊之複數個直線部分所構成。Regarding the
關於具有線狀部之乾燥劑層10,由於表面積大,因此相較於單一膜能夠發揮大的吸水能力。又,尤其,在主表面3S的面積大的情形下,相較於單一膜能夠輕易地形成之方面上,具有線狀部之乾燥劑層10係有利的。Regarding the
乾燥劑層10,例如含有:包含鹼土金屬的氧化物之氧化物粒子、及黏合劑樹脂。乾燥劑層10,例如能夠藉由包括將含有該等之乾燥劑組成物塗佈於密封基板的主表面3S上之方法來形成。The
乾燥劑層10中的氧化物粒子,包含能夠對氧化物粒子賦予吸水性能之鹼土金屬的氧化物。將氧化物粒子的質量作為基準,氧化物粒子通常包含80質量%以上或90質量%以上的鹼土金屬的氧化物。氧化物粒子,能夠包含1種或成分不同的2種以上的鹼土金屬的氧化物。The oxide particles in the
作為鹼土金屬的氧化物,例如可舉出氧化鎂(MgO)、氧化鈣(CaO)、氧化鍶(SrO)及氧化鋇(BaO)。鹼土金屬的氧化物,可以係氧化鎂、氧化鈣或它們的組合。Examples of alkaline earth metal oxides include magnesium oxide (MgO), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO). The oxide of alkaline earth metal may be magnesium oxide, calcium oxide or a combination thereof.
將乾燥劑層的質量作為基準,乾燥劑層10中的氧化物粒子的含量可以係40~80質量%。若氧化物粒子的含量大,則吸水容量增加,因此即使在大氣氣氛下形成乾燥劑層10時,亦容易保持足夠的吸水能力。就相同的觀點而言,將乾燥劑層的質量作為基準,氧化物粒子的含量可以係50質量%以上、55質量%以上或60質量%以上。Taking the mass of the desiccant layer as a reference, the content of oxide particles in the
氧化物粒子的平均粒徑並無特別限制,但是例如可以係0.01~30μm。若氧化物粒子的平均粒徑為該範圍,則傾向於可獲得更加高的吸水性能。就相同的觀點而言,氧化物粒子的平均粒徑可以係0.1μm以上、0.5μm以上或1μm以上,可以係20μm以下、10μm以下或5μm以下。在本說明書中,氧化物粒子的平均粒徑,係指藉由動態光散射式粒度分佈計測量出之體積分佈的中央值。該平均粒徑為利用使氧化物粒子分散於既定的分散介質中而製備之分散液測量出之值。The average particle diameter of the oxide particles is not particularly limited, but may be 0.01 to 30 μm, for example. If the average particle diameter of the oxide particles is in this range, higher water absorption performance tends to be obtained. From the same viewpoint, the average particle diameter of the oxide particles may be 0.1 μm or more, 0.5 μm or more, or 1 μm or more, and may be 20 μm or less, 10 μm or less, or 5 μm or less. In this specification, the average particle size of oxide particles refers to the median value of the volume distribution measured by a dynamic light scattering particle size distribution meter. The average particle diameter is a value measured using a dispersion prepared by dispersing oxide particles in a predetermined dispersion medium.
黏合劑樹脂例如可以包含聚矽氧樹脂。乾燥劑層中的黏合劑樹脂,可以包含由聚合性化合物形成之交聯聚合物。聚合性化合物,例如可以係具有(甲基)丙烯醯氧基之改質聚矽氧。若該改質聚矽氧聚合,則乾燥劑組成物硬化,其結果,形成一種乾燥劑層,其包含作為聚矽氧樹脂之交聯聚合物。The binder resin may include silicone resin, for example. The binder resin in the desiccant layer may include a cross-linked polymer formed of a polymerizable compound. The polymerizable compound may be modified silicone having (meth)acryloxy groups, for example. When the modified silicone is polymerized, the desiccant composition is hardened, and as a result, a desiccant layer is formed, which contains a cross-linked polymer as a silicone resin.
具有(甲基)丙烯醯氧基之改質聚矽氧,例如由下述式(I)表示。式(I)中,R3 及R4 分別獨立地表示2價的有機基,R5 及R6 分別獨立地表示氫原子或甲基,x表示1以上的整數。R3 及R4 可以係伸烷基。 The modified polysiloxane having (meth)acryloxy groups is represented by the following formula (I), for example. In the formula (I), R 3 and R 4 each independently represent a divalent organic group, R 5 and R 6 each independently represent a hydrogen atom or a methyl group, and x represents an integer of 1 or more. R 3 and R 4 may be alkylene groups.
乾燥劑組成物,還可以含有能夠與具有(甲基)丙烯醯氧基之改質聚矽氧共聚之其他聚合性化合物。其他聚合性化合物,可以係具有1個或2個以上的(甲基)丙烯醯基之(甲基)丙烯酸化合物。就黏度的穩定性提高效果的觀點而言,相對於改質聚矽氧及其他聚合性化合物的總量,改質聚矽氧的含量可以係80~100質量%或90~100質量%。The desiccant composition may also contain other polymerizable compounds capable of copolymerizing with the modified polysiloxane having (meth)acryloxy groups. The other polymerizable compound may be a (meth)acrylic compound having one or more (meth)acrylic groups. From the viewpoint of the effect of improving the stability of viscosity, the content of the modified silicone can be 80-100% by mass or 90-100% by mass relative to the total amount of the modified silicone and other polymerizable compounds.
相對於乾燥劑組成物的總質量,乾燥劑組成物中的具有(甲基)丙烯醯氧基之改質聚矽氧及其他聚合性化合物的總量,可以係20~90質量%。若聚合性化合物的含量在該範圍內,則具有容易確保更加優異的塗佈性及吸水性能之傾向。就相同的觀點而言,相對於乾燥劑組成物的總質量,具有(甲基)丙烯醯氧基之改質聚矽氧及其他聚合性化合物的總量,可以係20質量%以上或50質量%以上,亦可以係90質量%以下或70質量%以下。With respect to the total mass of the desiccant composition, the total amount of the modified polysiloxane having (meth)acryloxy groups and other polymerizable compounds in the desiccant composition may be 20 to 90% by mass. If the content of the polymerizable compound is within this range, it tends to be easier to ensure more excellent coatability and water absorption performance. From the same point of view, relative to the total mass of the desiccant composition, the total amount of modified polysiloxane with (meth)acryloxy groups and other polymerizable compounds can be 20% by mass or more or 50% by mass % Or more, and may be 90% by mass or less or 70% by mass or less.
為了光硬化,乾燥劑組成物還可以含有光自由基聚合起始劑。作為光自由基聚合起始劑,例如,可舉出1-羥基-環己基-苯基-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉代苯基)-1-丁酮、2,2-二甲氧基-1,2-二苯乙烷-1-酮、2-甲基-1[4-(甲基硫基)苯基]-2-嗎啉代丙烷-1-酮及1-[4-(2-羥乙氧基)-苯基]-2-羥基-2-甲基-1-丙烷-1-酮。在乾燥劑組成物包含光自由基聚合起始劑之情形下,相對於乾燥劑組成物中的聚合性化合物的質量,其含量例如可以係0.01~10質量%。For light curing, the desiccant composition may further contain a photo radical polymerization initiator. As the photoradical polymerization initiator, for example, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl) -1-butanone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-methyl-1[4-(methylthio)phenyl]-2-methyl Linopropane-1-one and 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propane-1-one. In the case where the desiccant composition contains the photoradical polymerization initiator, the content thereof can be, for example, 0.01 to 10% by mass relative to the mass of the polymerizable compound in the desiccant composition.
依需要,乾燥劑層及用於形成其之乾燥劑組成物還可以含有其他成分。例如,為了調節黏度或提高氧化物粒子的分散性等目的,乾燥劑層及乾燥劑組成物可以含有不具有聚合性基之聚矽氧化合物。If necessary, the desiccant layer and the desiccant composition used to form it may also contain other ingredients. For example, for the purpose of adjusting the viscosity or improving the dispersibility of oxide particles, the desiccant layer and the desiccant composition may contain a polysiloxane compound that does not have a polymerizable group.
乾燥劑組成物能夠在25℃下為糊狀。乾燥劑組成物在25℃條件下的黏度可以係5~500Pa•s。若乾燥劑組成物在25℃條件下的黏度在該範圍內,則藉由塗佈能夠更輕易地形成乾燥劑層。此處的黏度為藉由B型黏度計、流變計等旋轉黏度計測量出之值。The desiccant composition can be pasty at 25°C. The viscosity of the desiccant composition at 25°C can range from 5 to 500 Pa•s. If the viscosity of the desiccant composition at 25° C. is within this range, the desiccant layer can be formed more easily by coating. The viscosity here is the value measured by a rotary viscometer such as a B-type viscometer or rheometer.
構成有機電致發光元件20之元件基板1並無特別限定,但是典型地為具有絕緣性及透光性且具有矩形主表面之玻璃基板。藉由透明導電材料((例如,ITO(Indium Tin Oxide:氧化銦錫)),在元件基板1上形成有電極51。電極51例如藉由如下方法形成,該方法包含:藉由真空沉積法、濺射法等PVD(物理氣相沉積:Physical Vapor Deposition)法,在元件基板1上形成ITO膜之步驟;及,藉由利用光阻法之蝕刻將ITO膜形成為既定的圖案形狀之步驟。電極51可以被引出至氣密空間30的外側,藉此電極51可以與驅動電路連接。The
發光部7具有對置配置之一對電極51、52及在電極51及電極52之間設置之有機層40。電極51可以係陽極,且電極52可以係陰極。有機層40具有電洞注入層41、電洞傳輸層42、發光層43及電子傳輸層44,且從電極51側依次積層有該等。The
電洞注入層41例如由數10nm的膜厚的銅酞青(CuPc)形成。電洞傳輸層42例如由數10nm的膜厚的雙[N-(1-萘基)-N-苯基]聯苯胺(bis[N-(1-naphthyl)-N-phenyl]benzidine)(α-NPD)形成。發光層43例如由數10nm的膜厚的三(8-羥基喹啉)鋁(Alq3)形成。電子傳輸層44例如由數nm的膜厚的氟化鋰(LiF)形成。The
在有機層40的上表面上積層有電極52。電極52可以係藉由真空蒸鍍法等PVD法形成之金屬薄膜。作為金屬薄膜的材料,例如可舉出Al、Li、Mg、In等功函數小的金屬單質及Al-Li、Mg-Ag功函數小的合金。電極52例如以數10nm~數100nm或50nm~200nm的膜厚形成。電極52可以被引出至元件基板2的端部,藉此電極52可以與驅動電路連接。An
密封基板3可以係玻璃基板。大氣中的水分相對容易附著於玻璃基板的表面上。因此,在大氣氣氛下在作為密封基板3的玻璃基板上形成乾燥劑層10之情形下,應用如本實施形態那樣控制乾燥劑層10的面積比率之方法的利益大。The sealing
密封劑5能夠使用通常用於有機電致發光元件的密封之材料來形成。例如,能夠藉由紫外線硬化性樹脂來形成密封劑5。The sealant 5 can be formed using a material generally used for sealing of organic electroluminescent devices. For example, the sealant 5 can be formed of ultraviolet curable resin.
有機電致發光元件20例如能夠藉由如下方法來製造,該方法包括:在密封基板3的主表面3S上形成乾燥劑層10之步驟;在元件基板1上形成發光部7之步驟;及,以主表面3S與元件基板1對置之方向配置密封基板3,藉此形成具備元件基板1、發光部7、乾燥劑層10及密封基板3之有機電致發光元件20之步驟。The organic electroluminescence element 20 can be manufactured, for example, by a method including: a step of forming a
可以在大氣氣氛下在主表面3S上形成乾燥劑層10。在本說明書中提及之“大氣氣氛”可以係藉由一般的空調設備控制溫度及濕度之環境。例如,大氣氣氛可以係15~30℃、相對濕度40~80%的氣氛。在該情形下,在大氣氣氛下將乾燥劑組成物塗佈於密封基板3的主表面3S上。然後,依需要,使乾燥劑組成物的塗膜在大氣氣氛下硬化。乾燥劑組成物例如能夠使用分注器來進行塗佈。The
其他步驟能夠依據在有機電致發光元件之製造中通常採用之方法來進行。將密封基板黏接於元件基板上之步驟,通常在經除濕之乾燥氣氛下進行。The other steps can be performed according to the methods generally used in the manufacture of organic electroluminescent devices. The step of bonding the sealing substrate to the device substrate is usually carried out in a dehumidified and dry atmosphere.
>實施例> 以下,舉出實施例對本發明進行進一步具體地說明。但是,本發明並不限定於該些實施例。>Examples> Hereinafter, the present invention will be explained in more detail with examples. However, the present invention is not limited to these Examples.
1.乾燥劑組成物 將氧化鈣粒子、由式(I)表示之液態改質聚矽氧、黏度調節用聚矽氧(二甲基聚矽(Dimethyl silicone))、分散劑及光自由基聚合起始劑進行了混合。將所獲得之混合物以1000轉/分鐘進行離心攪拌5分鐘,而獲得了白色糊狀乾燥劑組成物。將乾燥劑組成物的質量作為基準,乾燥劑組成物中的氧化鈣粒子的含量為60質量%。1. Desiccant composition Calcium oxide particles, liquid modified polysiloxane represented by formula (I), polysiloxane for viscosity adjustment (Dimethyl silicone), dispersant and photo-radical polymerization initiator are mixed . The obtained mixture was centrifuged and stirred at 1000 rpm for 5 minutes to obtain a white paste-like desiccant composition. Taking the mass of the desiccant composition as a reference, the content of calcium oxide particles in the desiccant composition is 60% by mass.
2.有機電致發光元件之製作及其評價 (實施例) 藉由濺射法,在元件基板上形成了ITO膜(膜厚為140nm)。藉由基於光阻法之蝕刻將ITO膜圖案形成為既定圖案形狀,而形成了陽極。藉由電阻加熱法,在陽極的上表面上依次形成了作為電洞注入層的銅酞青(CuPc)膜(膜厚為70μm)、作為電洞輸送層的雙[N-(1-萘基)-N-苯基]聯苯胺(α-NPD)的膜(膜厚為30nm)、作為發光層的三(8-羥基喹啉)鋁(Alq3)的膜(膜厚為50nm)。進而,藉由物理氣相沉積,在發光層的上表面形成了作為電子傳輸層的氟化鋰(LiF)膜(膜厚為7nm)及作為陰極的鋁膜(膜厚為150nm)。2. Manufacture and evaluation of organic electroluminescence devices (Example) By sputtering, an ITO film (with a thickness of 140 nm) was formed on the element substrate. The ITO film is patterned into a predetermined pattern shape by etching based on the photoresist method to form the anode. By the resistance heating method, a copper phthalocyanine (CuPc) film (with a thickness of 70μm) as a hole injection layer and a bis[N-(1-naphthyl) as a hole transport layer were sequentially formed on the upper surface of the anode. )-N-phenyl]benzidine (α-NPD) film (film thickness: 30 nm), and tris(8-quinolinolato) aluminum (Alq3) film (film thickness: 50 nm) as a light-emitting layer. Furthermore, by physical vapor deposition, a lithium fluoride (LiF) film (film thickness of 7 nm) as an electron transport layer and an aluminum film (film thickness of 150 nm) as a cathode were formed on the upper surface of the light-emitting layer.
作為密封基板,準備了具有凹部之玻璃基板。玻璃基板的凹部由玻璃基板的主表面及包圍其之側壁部形成。凹部內的主表面為18mm×18mm的正方形。在25℃、相對濕度45%的氣氛下,藉由分配將乾燥劑組成物以線狀塗佈於凹部內的主表面上。藉此,形成了12個寬度為1.4mm、長度為15mm的直線狀塗膜。藉由紫外線照射使塗膜硬化,藉此形成了乾燥劑層。乾燥劑層相對於凹部內的主表面的面積之面積比率為78%。 準備共計4個藉由相同的方法形成有乾燥劑層之密封基板,並以下述順序將剛形成乾燥劑層之後的密封基板、或者在形成乾燥劑層之後在25℃、相對密度45%的環境下放置1小時、2小時或3小時之後的密封基板,與元件基板進行了貼合。As the sealing substrate, a glass substrate having recesses was prepared. The recessed part of the glass substrate is formed by the main surface of the glass substrate and the side wall part surrounding it. The main surface in the recess is a square of 18 mm×18 mm. Under an atmosphere of 25° C. and a relative humidity of 45%, the desiccant composition is applied in a line on the main surface of the recess by dispensing. Thereby, 12 linear coating films with a width of 1.4 mm and a length of 15 mm were formed. The coating film is cured by ultraviolet radiation, thereby forming a desiccant layer. The area ratio of the desiccant layer to the area of the main surface in the recess was 78%. Prepare a total of 4 sealing substrates with a desiccant layer formed by the same method, and place the sealing substrate immediately after the desiccant layer is formed, or after the desiccant layer is formed, in an environment at 25°C and a relative density of 45% The sealing substrate after being left for 1 hour, 2 hours or 3 hours was bonded to the element substrate.
在用乾燥氮氣替換後之手套箱內,藉由密封劑將密封基板與積層有陽極、有機層及陰極之元件基板進行了貼合。藉由紫外線照射及在85℃條件下加熱1小時而使密封劑硬化。藉此,獲得了一種在氣密空間內密封有發光部之有機電致發光元件。In the glove box replaced with dry nitrogen, the sealing substrate and the device substrate on which the anode, the organic layer and the cathode were laminated were bonded with a sealant. The sealant is cured by ultraviolet irradiation and heating at 85°C for 1 hour. In this way, an organic electroluminescence element with a light-emitting part sealed in an airtight space is obtained.
(比較例) 形成了6個寬度為1.4mm、長度為10mm的直線狀塗膜,除此以外,以與實施例相同的方式,製作了評價用有機電致發光元件。乾燥劑層相對於凹部內的主表面的面積之面積比率為36%。(Comparative example) Except that six linear coating films having a width of 1.4 mm and a length of 10 mm were formed, an organic electroluminescence element for evaluation was produced in the same manner as in the examples. The area ratio of the desiccant layer to the area of the main surface in the recessed portion was 36%.
(發光面積比率) 對各有機電致發光元件的發光面積比率(觀察到發光之部分相對於發光部的面積之面積比率)進行了測定。圖5係表示有機電致發光元件的發光面積比率與密封基板的放置時間之間的關係之圖表。確認到:若乾燥劑層的面積比率為50%以上且小於90%,則即使在大氣氣氛下形成乾燥劑層,然後在大氣氣氛下放置一定程度之情形下,亦可保持剛製造之後的有機電致發光元件的高發光面積比率。(Ratio of luminous area) The light-emitting area ratio (the area ratio of the area where light emission is observed to the area of the light-emitting portion) of each organic electroluminescence element was measured. FIG. 5 is a graph showing the relationship between the ratio of the light-emitting area of the organic electroluminescence element and the storage time of the sealing substrate. It has been confirmed that if the area ratio of the desiccant layer is 50% or more and less than 90%, even if the desiccant layer is formed in an air atmosphere, and then placed in an air atmosphere to a certain extent, it can maintain the state immediately after manufacturing. High luminous area ratio of electroluminescent elements.
依本發明的一態樣,可提供一種有機電致發光元件,該有機電致發光元件即使在藉由包括在大氣氣氛下形成乾燥劑層的步驟之方法來製造時,亦能夠保持足夠的初始發光面積比率。According to one aspect of the present invention, it is possible to provide an organic electroluminescent device which can maintain a sufficient initial stage even when it is manufactured by a method including a step of forming a desiccant layer in an atmospheric atmosphere Luminous area ratio.
1‧‧‧元件基板
3‧‧‧密封基板
3A‧‧‧密封基板的頂板部
3B‧‧‧密封基板的側壁部
3S‧‧‧密封基板的主表面
5‧‧‧密封劑
7‧‧‧發光部
10‧‧‧乾燥劑層
20‧‧‧有機電致發光元件
30‧‧‧氣密空間
40‧‧‧有機層
41‧‧‧電洞注入層
42‧‧‧電洞傳輸層
43‧‧‧發光層
44‧‧‧電子傳輸層
51、52‧‧‧電極
1.‧‧
圖1係表示有機電致發光元件的一實施形態之剖面圖。 圖2係表示密封基板及乾燥劑層的一實施形態之俯視圖。 圖3係表示密封基板及乾燥劑層的一實施形態之俯視圖。 圖4係表示密封基板及乾燥劑層的一實施形態之俯視圖。 圖5係表示有機電致發光元件的發光面積比率與放置時間之間的關係之圖表。Fig. 1 is a cross-sectional view showing an embodiment of an organic electroluminescence device. Fig. 2 is a plan view showing an embodiment of a sealing substrate and a desiccant layer. Fig. 3 is a plan view showing an embodiment of the sealing substrate and the desiccant layer. Fig. 4 is a plan view showing an embodiment of the sealing substrate and the desiccant layer. Fig. 5 is a graph showing the relationship between the light-emitting area ratio of the organic electroluminescence element and the storage time.
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1‧‧‧元件基板 1.‧‧Component substrate
3‧‧‧密封基板 3‧‧‧Sealing substrate
3A‧‧‧密封基板的頂板部 3A‧‧‧Top plate of sealing substrate
3B‧‧‧密封基板的側壁部 3B‧‧‧Seal the side wall of the substrate
3S‧‧‧密封基板的主表面 3S‧‧‧The main surface of the sealing substrate
5‧‧‧密封劑 5‧‧‧Sealant
7‧‧‧發光部 7‧‧‧Lighting part
10‧‧‧乾燥劑層 10‧‧‧Desiccant layer
20‧‧‧有機電致發光元件 20‧‧‧Organic electroluminescent element
30‧‧‧氣密空間 30‧‧‧Airtight space
40‧‧‧有機層 40‧‧‧Organic layer
41‧‧‧電洞注入層 41‧‧‧hole injection layer
42‧‧‧電洞傳輸層 42‧‧‧Hole Transmission Layer
43‧‧‧發光層 43‧‧‧Light-emitting layer
44‧‧‧電子傳輸層 44‧‧‧Electron Transport Layer
51、52‧‧‧電極 51、52‧‧‧electrode
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| JP6649243B2 (en) * | 2016-12-27 | 2020-02-19 | 双葉電子工業株式会社 | Desiccant composition, sealing structure, and organic EL device |
| CN208014706U (en) * | 2018-04-24 | 2018-10-26 | 信利半导体有限公司 | A kind of OLED display screen |
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2018
- 2018-07-30 JP JP2018142572A patent/JP2020021558A/en active Pending
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2019
- 2019-07-23 CN CN201910665571.XA patent/CN110784950A/en active Pending
- 2019-07-29 TW TW108126701A patent/TWI707933B/en not_active IP Right Cessation
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| TW508976B (en) * | 1999-09-29 | 2002-11-01 | Sanyo Electric Co | Display device, electroluminescence device and light-emitting device having package structure for preventing invasion of moisture |
| CN100459212C (en) * | 2003-11-17 | 2009-02-04 | 三星Sdi株式会社 | Organic Electroluminescent Display |
| US20110045732A1 (en) * | 2008-05-12 | 2011-02-24 | Yamagata Promotional Organization For Industrial Technology | Method and device for manufacturing organic el light-emitting panel |
| CN102956675A (en) * | 2012-10-18 | 2013-03-06 | 京东方科技集团股份有限公司 | Drying agent layer preparation method, OLED (organic light emitting diode) display screen and packaging method of display screen |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2020021558A (en) | 2020-02-06 |
| TW202007745A (en) | 2020-02-16 |
| CN110784950A (en) | 2020-02-11 |
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