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TWI705113B - 噴墨用硬化性組成物、使用其之硬化塗膜及印刷電路板 - Google Patents

噴墨用硬化性組成物、使用其之硬化塗膜及印刷電路板 Download PDF

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Publication number
TWI705113B
TWI705113B TW105126778A TW105126778A TWI705113B TW I705113 B TWI705113 B TW I705113B TW 105126778 A TW105126778 A TW 105126778A TW 105126778 A TW105126778 A TW 105126778A TW I705113 B TWI705113 B TW I705113B
Authority
TW
Taiwan
Prior art keywords
meth
acrylate
curable composition
manufactured
epoxy
Prior art date
Application number
TW105126778A
Other languages
English (en)
Chinese (zh)
Other versions
TW201726841A (zh
Inventor
吉川里奈
志村優之
松本博史
Original Assignee
日商太陽油墨製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015194912A external-priority patent/JP2017066302A/ja
Priority claimed from JP2015194911A external-priority patent/JP6783510B2/ja
Application filed by 日商太陽油墨製造股份有限公司 filed Critical 日商太陽油墨製造股份有限公司
Publication of TW201726841A publication Critical patent/TW201726841A/zh
Application granted granted Critical
Publication of TWI705113B publication Critical patent/TWI705113B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/101Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/102Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
TW105126778A 2015-09-30 2016-08-22 噴墨用硬化性組成物、使用其之硬化塗膜及印刷電路板 TWI705113B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015194912A JP2017066302A (ja) 2015-09-30 2015-09-30 インクジェット用硬化性組成物、これを用いた硬化塗膜およびプリント配線板
JP2015-194912 2015-09-30
JP2015194911A JP6783510B2 (ja) 2015-09-30 2015-09-30 インクジェット用硬化性組成物、これを用いた硬化塗膜およびプリント配線板
JP2015-194911 2015-09-30

Publications (2)

Publication Number Publication Date
TW201726841A TW201726841A (zh) 2017-08-01
TWI705113B true TWI705113B (zh) 2020-09-21

Family

ID=58423480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105126778A TWI705113B (zh) 2015-09-30 2016-08-22 噴墨用硬化性組成物、使用其之硬化塗膜及印刷電路板

Country Status (4)

Country Link
KR (1) KR20180063172A (ja)
CN (1) CN108141964B (ja)
TW (1) TWI705113B (ja)
WO (1) WO2017056663A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6416327B1 (ja) * 2017-06-06 2018-10-31 太陽インキ製造株式会社 インクジェット用硬化性組成物セット、硬化物、その製造方法、プリント配線板およびファンアウト型のウェハレベルパッケージ
JP7649261B2 (ja) * 2020-02-04 2025-03-19 積水化学工業株式会社 積層構造体の製造方法、積層構造体、及びインクジェット用組成物セット
KR102397057B1 (ko) * 2021-04-16 2022-05-12 유태재 열 경화 및 uv 경화가 동시에 가능한 화장품 용기용 잉크 조성물, 이를 포함하는 화장품 용기 및 화장품 용기의 제조 방법
CN115403969B (zh) * 2021-12-21 2023-09-12 南通恒华粘合材料科技有限公司 一种uv固化的高耐磨高疏水涂层及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012162688A (ja) * 2011-02-09 2012-08-30 Seiko Epson Corp 光硬化インクジェットインク組成物
JP2015089903A (ja) * 2013-11-05 2015-05-11 太陽インキ製造株式会社 プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3628020B2 (ja) * 1993-11-06 2005-03-09 アグファ・ゲヴェルト・ナームロゼ・ベンノートチャップ 保護感熱性記録材料を用いる直接熱像形成方法
TWI288142B (en) 2003-05-09 2007-10-11 Taiyo Ink Mfg Co Ltd Photocuring/thermosetting ink jet composition and printed wiring board using same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012162688A (ja) * 2011-02-09 2012-08-30 Seiko Epson Corp 光硬化インクジェットインク組成物
JP2015089903A (ja) * 2013-11-05 2015-05-11 太陽インキ製造株式会社 プリント配線板用硬化型組成物、これを用いた硬化塗膜及びプリント配線板

Also Published As

Publication number Publication date
TW201726841A (zh) 2017-08-01
KR20180063172A (ko) 2018-06-11
WO2017056663A1 (ja) 2017-04-06
CN108141964B (zh) 2020-08-11
CN108141964A (zh) 2018-06-08

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