TWI705064B - 含有苯并環氧化物摻合物之可固化組合物及其用途 - Google Patents
含有苯并環氧化物摻合物之可固化組合物及其用途 Download PDFInfo
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- TWI705064B TWI705064B TW105118199A TW105118199A TWI705064B TW I705064 B TWI705064 B TW I705064B TW 105118199 A TW105118199 A TW 105118199A TW 105118199 A TW105118199 A TW 105118199A TW I705064 B TWI705064 B TW I705064B
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- Prior art keywords
- benzo
- aryl
- curable
- resin composition
- fibers
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims description 34
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 title 1
- 239000004593 Epoxy Substances 0.000 title 1
- 239000011342 resin composition Substances 0.000 claims abstract description 17
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 38
- 239000002131 composite material Substances 0.000 claims description 35
- 125000005605 benzo group Chemical group 0.000 claims description 33
- 239000000835 fiber Substances 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 claims description 17
- -1 benzo Compound Chemical class 0.000 claims description 16
- 125000003118 aryl group Chemical group 0.000 claims description 14
- 239000012783 reinforcing fiber Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 13
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 9
- 230000001588 bifunctional effect Effects 0.000 claims description 8
- 125000001424 substituent group Chemical group 0.000 claims description 7
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229910052736 halogen Inorganic materials 0.000 claims description 5
- 150000002367 halogens Chemical class 0.000 claims description 5
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- 239000004760 aramid Substances 0.000 claims description 4
- 229920003235 aromatic polyamide Polymers 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- 239000003054 catalyst Substances 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 claims description 3
- 125000000623 heterocyclic group Chemical group 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 150000002989 phenols Chemical class 0.000 claims description 3
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims 1
- 239000003365 glass fiber Substances 0.000 claims 1
- 125000001188 haloalkyl group Chemical group 0.000 claims 1
- 239000011160 polymer matrix composite Substances 0.000 abstract description 8
- 229920013657 polymer matrix composite Polymers 0.000 abstract description 7
- 150000005130 benzoxazines Chemical class 0.000 abstract 1
- 150000002118 epoxides Chemical class 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 11
- 238000009472 formulation Methods 0.000 description 11
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- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 238000005470 impregnation Methods 0.000 description 6
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- 239000012745 toughening agent Substances 0.000 description 5
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- 229920003319 Araldite® Polymers 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 3
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- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 2
- 125000006705 (C5-C7) cycloalkyl group Chemical group 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
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- 241000208340 Araliaceae Species 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
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- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
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- 238000013461 design Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- RZXMPPFPUUCRFN-UHFFFAOYSA-N p-toluidine Chemical compound CC1=CC=C(N)C=C1 RZXMPPFPUUCRFN-UHFFFAOYSA-N 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
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- 238000001721 transfer moulding Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- URFNSYWAGGETFK-UHFFFAOYSA-N 4,4'-Dihydroxybibenzyl Chemical compound C1=CC(O)=CC=C1CCC1=CC=C(O)C=C1 URFNSYWAGGETFK-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- QRAOZQGIUIDZQZ-UHFFFAOYSA-N 4-methyl-7-(4,4,5,5-tetramethyl-1,3,2-dioxaborolan-2-yl)-2,3-dihydro-1,4-benzoxazine Chemical compound C=1C=C2N(C)CCOC2=CC=1B1OC(C)(C)C(C)(C)O1 QRAOZQGIUIDZQZ-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- ALISGIDBUIJOHP-UHFFFAOYSA-N CC(C)(c(cc1)cc(C2)c1OCN2c1cc(C)ccc1)c(cc1C2)ccc1OCN2c1cc(C)ccc1 Chemical compound CC(C)(c(cc1)cc(C2)c1OCN2c1cc(C)ccc1)c(cc1C2)ccc1OCN2c1cc(C)ccc1 ALISGIDBUIJOHP-UHFFFAOYSA-N 0.000 description 1
- JZYYZPITDRKMHZ-UHFFFAOYSA-N CC(c(cc1C2)ccc1OCN2c1ccc(C)cc1)(c(cc1C2)ccc1OCN2c1ccc(C)cc1)c(cc1C2)ccc1OCN2c1ccc(C)cc1 Chemical compound CC(c(cc1C2)ccc1OCN2c1ccc(C)cc1)(c(cc1C2)ccc1OCN2c1ccc(C)cc1)c(cc1C2)ccc1OCN2c1ccc(C)cc1 JZYYZPITDRKMHZ-UHFFFAOYSA-N 0.000 description 1
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
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- 125000003342 alkenyl group Chemical group 0.000 description 1
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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- SYSQUGFVNFXIIT-UHFFFAOYSA-N n-[4-(1,3-benzoxazol-2-yl)phenyl]-4-nitrobenzenesulfonamide Chemical class C1=CC([N+](=O)[O-])=CC=C1S(=O)(=O)NC1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 SYSQUGFVNFXIIT-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
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- C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/046—Reinforcing macromolecular compounds with loose or coherent fibrous material with synthetic macromolecular fibrous material
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
- C08K5/357—Six-membered rings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
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Abstract
本發明提供一種可固化樹脂組合物,當用於聚合物基質複合材料時,其能夠在高溫下提供良好OHC效能。此樹脂組合物包括一或多種多官能苯并
Description
本申請案主張2015年6月12日申請之先前美國臨時申請案第62/174,759號之權益,該臨時申請案以引用的方式併入本文中。
近年來,聚合物基質複合(PMC)材料已用於高效能結構,諸如飛機部件及汽車部件,作為高強度、低重量之材料以替代金屬。PMC材料含有嵌入聚合物基質材料中之加強纖維,諸如碳、玻璃及芳族聚醯胺纖維。作為用於PMC材料之基質樹脂,由於熱固性樹脂之高耐溶劑性及耐熱性而主要使用其。
最廣泛用於PMC之聚合物為熱固性物,其屬於當固化時交聯且形成三維網狀結構之一類樹脂。一經固化,網狀結構為不可逆的且在其分解溫度以下,無法再成形或使其流動。
由於環氧樹脂與加強纖維之間的黏附性及所獲得之複合材料之機械特性(諸如強度及剛度),環氧樹脂經常用作聚合物基質材料。諸多航空航天應用使用需要在高溫及高壓下固化的胺固化之多官能環氧化物。含有熱塑性物及/或反應性橡膠化合物以抵消歸因於高度交聯的脆性之韌化環氧化物已變為複合材料飛機結構中之標準。
相比於其他熱固性樹脂(諸如環氧化物),苯并提供多個優點。彼等優點包括相對長之存放期、分子設計靈活性、低成本、高玻
璃轉移溫度(Tg)、高模數、相對低之黏度、良好阻燃特性、低吸濕性、在固化期間無副產物釋放及在固化時極低收縮。此外,苯并在加熱時能夠自我固化;亦即不需要額外的固化劑。然而,目前可獲得之多官能苯并在120℃以下之溫度下為玻璃態固體,使其難以使用諸如預浸及樹脂灌注之標準航空航天技術加工。
用於航空航天結構之複合材料的設計通常考慮材料之熱/濕效能。飛機必須考慮諸如高溫及高濕度水準之極端環境因素,因為其可能經歷數小時高溫而濕度水準為未知的。
航空航天複合材料之重要特性之一為熱濕壓縮效能(亦即在熱/濕條件下熱濕開孔壓縮或HW-OHC強度),此意謂長期暴露於濕氣後,OHC強度在高溫下降低之方法。
使用螺栓、鉚釘及其他扣件來組裝用於諸如飛機機身之主要結構的複合層合物為標準實踐。已經鑽孔以容納此等扣件之孔視為人工缺陷且在壓縮應力下可為故障點。OHC測試為預測複合材料中之此故障之公認方法。
諸多現存之PMC材料之OHC強度在室溫(例如21℃)下或室溫以下通常為恆定的,但當充滿濕氣時在高溫下可能會顯著劣化。已知高溫與濕氣一起會降低複合材料之抗壓強度。
已開發出可購自Cytec Industries Inc.的諸如Cycom® 977-3(高度交聯之環氧化物)及Cycom® 5250-4(雙順丁烯二醯亞胺)之樹脂系統用於高效能航空航天應用。基於此等樹脂系統之複合材料在高溫下在熱/濕條件下展現良好熱濕開孔壓縮(HW-OHC強度),因此其尤其適用於製造飛機之主要結構。
儘管存在諸多關於苯并化合物及其合成之公開案,但關於其在正常用於BMI之使用溫度(亦即149℃)下在熱濕條件下之OHC效能所知甚少。已認為相比於高度交聯之環氧化物系統及雙順丁烯二醯亞
胺系統之抗壓強度及拉伸強度,基於苯并之複合材料具有固有地良好的抗壓強度及拉伸強度。因此,將需要具有含有苯并之樹脂系統,其可用於製造在例如>105℃之高溫下具有良好HW-OHC強度之高效能複合材料。為此,需要高溫下之HW-OHC強度等效於或優於與用於航空航天應用之環氧化物及雙順丁烯二醯亞胺系統相關之強度。
本發明之一個態樣係關於一種可固化苯并-環氧化物混合樹脂組合物,當用於聚合物基質複合材料時,其能夠在例如>105℃、更確切而言121-149℃(或250-350℉)之高溫下提供良好OHC效能。根據一個實施例,此樹脂組合物包括以下各者作為主要組分:(A)含有兩個或兩個以上環氧基之環脂族環氧樹脂;(B)三官能苯并化合物;及(C)視情況存在的作為觸媒之苯酚化合物。
如本文所用之「可固化」組合物係指在固化之前的組合物,且「固化基質樹脂」係指由使可固化組合物固化而產生之固化樹脂。
(A)環氧樹脂組分與(B)三官能苯并組分之重量比可為5:95至90:10,且在一些實施例中為20:80至70:30。在一個實施例中,組分(A)及(B)之組合構成超過50重量%之組合物。在另一實施例中,組分(A)及(B)之組合構成超過80重量%之組合物。
環脂族環氧樹脂用作環氧化物組分,因為相比於其他類型之環氧樹脂,其提供破裂韌性、玻璃轉移溫度(Tg)及可加工性之良好平衡。適合環脂族環氧化物為每分子含有至少一個環脂族環及至少兩個
環氧乙烷環之化合物。在一較佳實施例中,環脂族環氧化物為3,4-環氧環己烷甲酸3',4'-環氧環己酯,表示為如下結構:
此結構之環氧化物可作為Araldite® CY-179購自Huntsman Advanced Materials。環脂族環氧化物之其他實例包括:EPONEX環氧樹脂,例如購自Momentive Specialty Chemicals之EPONEX Resin 1510;Epotec®環氧樹脂,例如購自Aditya Birla Chemicals之YDH 184、YDH 3000;購自Dow Chemical之ERLTM 4221(3',4'-環氧環己烷甲酸3,4-環氧環己基甲酯)。
其中R1、R2及R3係獨立地選自烷基(較佳C1-8烷基)、環烷基(較佳C5-7環烷基、尤其C6環烷基)及芳基,其中環烷基及芳基視情況經例如C1-8烷基、鹵素及胺基取代且較佳經C1-8烷基取代,且在經取代時,一或多個取代基(較佳一個取代基)可存在於各環烷基及芳基上;R4係選自氫、鹵素、烷基及烯基。
本文中所揭示之三官能苯并可藉由使用習知基於溶劑或無溶劑之合成方法使參苯酚與芳胺及甲醛反應而合成。更確切而言,苯胺參苯并(C)可藉由使1,1,1-參(4-羥基苯基)乙烷與苯胺及對甲醛(para-formaldehyde/p-formaldehyde))反應而合成。對參苯并(2)可藉由使1,1,1-參(4-羥基苯基)乙烷與對甲醛及對甲苯胺反應而合成,且間參苯并(3)可藉由使1,1,1-參(4-羥基苯基)乙烷與對甲醛及間甲苯胺反應而合成。
其他可能的苯酚化合物之實例包括4,4'-亞乙基雙酚、4,4'-[1-[4-[1-(4-羥苯基)-1-甲基乙基]苯基]亞乙基]雙酚、4-第二丁基-2,6,-二第三丁基苯酚、4,4'-(9-亞茀基)-二酚、4,4'-(1-3-伸苯基二亞異丙基)雙酚、4,4'亞環己基雙酚、4,4'-亞異丙基雙2,6-二甲基苯酚。若存在,則以組合物之總重量計,苯酚化合物之量可高達15重量%。
其中Z1係選自直接鍵、-C(R3)(R4)-、-C(R3)(芳基)-、-C(O)-、-S-、-O-、-S(O)-、-S(O)2-、二價雜環及-[C(R3)(R4)]x-伸芳基-[C(R5)(R6)]y-,或可使苯并部分之兩個苯甲基環稠合;且R1及R2係獨立地選自烷基(較佳C1-8烷基)、環烷基(較佳C5-7環烷
基、較佳C6環烷基)及芳基,其中環烷基及芳基視情況經例如C1-8烷基、鹵素及胺基取代且較佳經C1-8烷基取代,且在經取代時,一或多個取代基(較佳一個取代基)可存在於各環烷基及芳基上;在一個實施例中,Z1係選自直接鍵、-C(R3)(R4)-、-C(R3)(芳基)-、-C(O)-、-S-、-O-、二價雜環及-[C(R3)(R4)]x-伸芳基-[C(R5)(R6)]y-,或可使苯并部分之兩個苯甲基環稠合;R3、R4、R5及R6係獨立地選自H、C1-8烷基(較佳C1-4烷基且較佳甲基)及鹵化烷基(其中鹵素通常為氯或氟(較佳為氟)且其中鹵化烷基較佳為CF3);且x及y獨立地為0或1;在Z1係選自二價雜環時,其較佳為3,3-異苯并呋喃-1(3h)-酮,亦即其中式(III)化合物係衍生自酚酞;在Z1係選自-[C(R3)(R4)]x-伸芳基-[C(R5)(R6)]y-時,則鍵聯兩個苯并基團之鏈可進一步包含一或多個伸芳基及/或一或多個-C(R7)(R8)-基團,其中R7及R8係獨立地選自上文關於R3所定義之基團。
在一較佳實施例中,伸芳基為伸苯基。在一個實施例中,連接至伸苯基之基團可相對於彼此經組態於對位或間位。在一較佳實施例中,芳基為苯基。
基團Z1可為直鏈或非直鏈的,且通常為直鏈的。如式(I)中所示,基團Z1較佳在相對於苯并部分之氧原子的對位鍵結至各苯并部分之苯甲基,且此為較佳之異構組態。然而,在雙-苯并化合物中之一或兩個苯甲基中,基團Z1亦可連接於間位或鄰位中之任一者。因此,基團Z1可以對/對、對/間、對/鄰、間/間或鄰/間組態連接至苯甲基環。在一個實施例中,雙官能苯并樹脂組分包含異構體之混合物,較佳其中混合物之主要部分為展示於結構IV中之對/對
異構體,且較佳其以全部異構混合物之至少75mol%、較佳至少90mol%且較佳至少99mol%存在。
在另一實施例中,雙官能苯并係選自其中R1及R2係獨立地選自芳基、較佳苯基的化合物。在一個實施例中,芳基可經取代,較佳其中取代基係選自C1-8烷基,且較佳其中有單個取代基存在於至少一個芳基上。C1-8烷基包括直鏈及分支鏈烷基鏈。R1及R2較佳係獨立地選自未經取代之芳基、較佳未經取代之苯基。
可添加韌化劑(或增韌劑)以產生適用於高強度複合材料(諸如用於航空航天應用之複合材料)之韌化基質樹脂。適合韌化劑包括(但不限於)熱塑性韌化劑,諸如聚醚碸(PES)、PES及聚醚醚碸(PEES)之共聚物;彈性體,包括具有反應基之液態橡膠;顆粒韌化劑,諸如熱塑性顆粒、玻璃珠、橡膠顆粒及核殼橡膠顆粒。
功能性添加劑亦可包括於可固化組合物中以影響固化或未固化樹脂組合物之機械、流變、電學、光學、化學、耐火焰性及/或熱特性中的一或多者。該等功能性添加劑之實例包括(但不限於)填充劑、著色劑、流變控制劑、增黏劑、導電添加劑、阻燃劑、紫外(UV)保護劑及其類似添加劑。此等添加劑可呈各種幾何形狀之形式,包括(但不限於)顆粒、片狀、桿狀及其類似形狀。
若存在,則以組合物之總重量計,包括增韌劑及功能性添加劑的視情況選用之添加劑的總量高達15重量%。
本發明之另一態樣係關於複合材料及其製備方法。如上文所論述之可固化組合物可與加強纖維組合以形成複合材料。加強纖維可呈短纖維、連續纖維、絲狀纖維、纖維束、束、薄片、板層及其組合之形式。連續纖維可進一步採用單向、多向、非編織、編織、針織、縫合、捲繞及編繞組態,以及盤繞墊、氈墊及短切纖維墊結構中之任一者。纖維之組成可變化以獲得最終複合材料結構所需之特性。例示性纖維材料可包括(但不限於)玻璃、碳、芳族聚醯胺、石英、聚乙烯、聚酯、聚對伸苯基-苯并雙唑(PBO)、硼、聚醯胺、石墨、碳化矽、
氮化矽及其組合。為了製造諸如用於航空航天及汽車應用之材料的高強度複合材料,加強纖維較佳具有大於3500MPa之拉伸強度。
加強纖維可以60重量%至75重量%、較佳至少68重量%之含量存在於複合材料中。對於諸如用於工業及航空航天應用之結構的高效能結構,較佳使用按體積計30%至70%、更尤其50%至70%之由例如玻璃、芳族聚醯胺(例如Kevlar)或碳構成的連續纖維。
為了形成複合材料,可使用諸如(但不限於)預浸及樹脂灌注之習知加工技術用可固化組合物來浸漬或灌注加強纖維。
術語「浸漬」係指將可固化基質樹脂材料引入至加強纖維中以便藉由樹脂部分或完全囊封纖維。用於製備預浸物之基質樹脂可呈樹脂薄膜或液體之形式。另外,在浸漬之前基質樹脂呈可固化或未固化狀態。可藉由施加熱量及/或壓力促進浸漬。
舉例而言,用於製備預浸物之浸漬方法可包括:(1)使纖維連續地移動通過(經加熱之)熔融浸漬基質樹脂組合物浴以完全或實質上完全浸濕該等纖維;或(2)抵著平行流動之連續單向纖維薄片或織物網按壓頂部及底部樹脂薄膜,同時在導致樹脂薄膜呈熔融狀態之溫度下施加熱量。
在浸漬之後,預浸物呈可固化/部分固化狀態且仍為可彎曲的。將預浸物在一工具上以特定定向疊置於彼此上以形成層合物。預浸物層疊物隨後經受固化以形成複合材料部件。可在固化期間視構件及組態而施加壓力,但對於高效能構件使用高壓釜為最常見的。
固化可在>175℃、較佳180-200℃範圍內之高溫下進行。舉例而言,所需之固化概況可為以2℃/min自25℃至180℃勻變且在180℃下保持2小時,隨後繼續漸升至200℃且再保持2小時,隨後冷卻至室溫。較佳施加限制逸出氣體之變形效果或限制空隙形成之高壓(例如6.8-8.2巴之壓力)進行固化。
或者,可使用樹脂灌注方法形成複合材料部件,該方法涵蓋諸如樹脂轉注成形(RTM)及真空輔助樹脂轉注成形(VARTM)之加工技術。為了經由例如RTM或VaRTM方法之樹脂灌注來製造複合材料部件,第一步為形成呈所需構件形狀之乾燥纖維預成型坯。該預成型坯通常包括由乾燥加強纖維製得之多個織物層或板層,其賦予所得複合材料部件所需之加強特性。在形成纖維預成型坯之後,將該預成型坯置放於模具中。將可固化樹脂組合物直接注入纖維預成型坯中,且隨後使經樹脂灌注之預成型坯固化。當本發明之可固化樹脂組合物用於樹脂灌注方法時,較佳包括例如本文所揭示之苯酚化合物的觸媒。
根據表1中所示調配物製備八種不同的樹脂摻合物。除非另外說明,否則所有值均為重量百分比。
在室溫下於裝備有機械攪拌器之2L玻璃反應器中充分混合150g(0.49mol)之1,1,1-參(4-羥基苯基)乙烷及93g(3.1mol)對甲醛。隨後在室溫下添加143.6g(1.54mol)之苯胺以避免發泡。在室溫下隨著緩慢添加苯胺攪拌反應混合物。在內部反應溫度冷卻至60℃之後,隨後將反應器浸沒於在80℃下預熱之油浴中。所得反應混合物為黏性半固體。將油浴加熱至110℃後持續30分鐘。隨後當內部溫度為110℃以上時,將油浴加熱至130℃,將反應計時器設定為30分鐘。30分鐘後,使用刮勺將熔融反應混合物傾入鋁盤中,以將樹脂均勻分配於盤上且使其冷卻至室溫。隨後將所得金色結晶產物研磨為粉末。將粉末在70℃下於2L 1N NaOH溶液中洗滌兩次且在相同溫度下於2L水中視需要洗滌多次以獲得中性pH值。將產物在45℃下在真空烘箱中乾燥一週。
「m-Tris-BOX」係指如上文所述之間參苯并化合物(3)且根據於2015年12月28日申請且讓渡給Cytec Industries Inc.之美國專利申
請案第14/980,407號中所揭示之方法合成。
「p-Tris-BOX」係指如上文所述之對參苯并化合物(2)且根據於2014年12月8日申請且讓渡給Cytec Industries Inc.之美國專利申請案第14/562,799號中所揭示之方法合成。
由表1揭示之樹脂調配物形成樹脂薄膜。各樹脂薄膜具有約39gsm之薄膜重量。藉由使用熱熔層壓方法用樹脂薄膜浸漬網狀形式之單向IM7碳纖維來製備預浸物。碳纖維之標靶織物面重量(FAW)為145gsm及35%之樹脂含量/預浸物。使用熱熔預浸設備,同時將兩個樹脂薄膜施用至單向碳纖維網之頂部及底部,且藉助於加熱至160℉與230℉之間的溫度之熱板完成浸漬。藉由根據定向[+45/90/-45/0]3s疊置24個預浸物板層以形成複合材料面板來製備複合材料層合物。在製造複合材料面板期間,亦每隔4板層在真空下進行減積3分鐘。隨後,將複合材料面板真空裝袋且在180℃下在8.16巴下於高壓釜中固化2小時,且隨後在200℃下再固化2小時。
分別使用ASTM測試方法D6484及D766測試固化複合材料面板以測定開孔壓縮(OHC)及開孔拉伸(OHT)效能。
為獲得OHC資料,製備固化複合材料面板之12×1.5吋測試樣品。在各測試樣品之中心鑽出0.25吋之孔。藉由將樣品浸沒於設定在71℃下之水浴中2週來調節樣品。
OHC結果展示於表2中。
含有Araldite CY-179環脂族環氧化物及三官能苯并兩者之樹脂調配物(調配物5、6、10-12)在121℃及149℃之較高溫度下產生最佳濕OHC效能。相比於其他樹脂調配物,此等在121℃及149℃下之較高的濕OHC值亦伴隨乾及濕Tg之升高,參見表3。
基於調配物1、4、5、6及9之複合材料面板的開孔拉伸(OHT)值量測且報導於表4中。
Claims (10)
- 如請求項1至3中任一項之可固化樹脂組合物,其中該苯酚化合物(C)為硫代雙酚(TDP)。
- 如請求項1至3中任一項之可固化樹脂組合物,其中組份(A)及(B) 之組合構成超過50重量%之組合物。
- 一種複合材料,其包含用如請求項1至6中任一項之可固化組合物浸漬或灌注之加強纖維。
- 如請求項7之複合材料,其中該等加強纖維係選自碳纖維、玻璃纖維及芳族聚醯胺纖維。
- 一種預浸物,其包含用如請求項1至6中任一項之可固化組合物浸漬或灌注之加強纖維,其中加強纖維呈單向纖維或織物之形式。
- 一種固化複合材料部件,其由包含以下步驟之方法製備:(i)用如請求項1至6中任一項之可固化組合物浸漬或灌注加強纖維;及(ii)使該等經樹脂浸漬或經樹脂灌注之纖維固化。
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