TWI700859B - Integrated millimeter wave antenna structure - Google Patents

Abstract

An integrated millimeter wave antenna structure, which includes element boards and metal blocks stacked in order from top to bottom, wherein: the element board is provided with a first substrate, the first substrate is provided with a millimeter wave chip, the first The bottom surface of the substrate is provided with a signal output point, the metal block is provided with a vertical through hole corresponding to the signal output point, and the element board and the metal block are fixed by a screw combination; thereby, the present invention can reduce the area of the overall antenna The size and avoid the oxidation and damage of the circuit, and at the same time, it can flexibly replace different antennas according to the needs, so as to reduce the cost of testing, production and maintenance, and thus greatly improve the practicability of the product.

Description

Integrated millimeter wave antenna structure

The present invention relates to an antenna structure, in particular to a millimeter wave antenna structure.

Millimeter wave (millimeter wave, hereinafter referred to as mmw) is an electromagnetic wave between microwave and light wave. Its frequency band is about 30GHz~300GHz, and the corresponding wavelength is 1~10mm (millimeter). Millimeter wave has a large bandwidth, The characteristics of narrow beam and small size have great application potential and market prospects in various fields including automotive radar, object recognition and high-speed communications (such as 5G mobile communications). However, due to the spatial loss of millimeter wave signals and the Transmission loss is relatively serious. Therefore, the design and performance of the antenna system play a very important role in the application and promotion of millimeter wave technology. Some of the existing technologies for millimeter wave antennas focus on millimeter wave antennas and RF chips (ie. The integration of millimeter-wave chips, such as disclosed in the Republic of China Patent No. I557854, but the integrated packaging structure of the RF chip and millimeter-wave antenna in this case is realized through semiconductor process technology, and the production cost is obviously higher.

In addition, some conventional millimeter-wave antennas have their antennas and RF chips arranged on the same substrate in a planar extension. However, this structural design has the following points worthy of improvement: First, because antennas generally require A clearance area is reserved on the substrate, so this area on the substrate cannot be used to install other components. As a result, the area size of the entire millimeter wave antenna device will become larger, which is not conducive to product miniaturization. Secondly, the signal connection line between the antenna and the RF chip of this conventional millimeter wave antenna (specifically, Coplanar Waveguide, CPW) is exposed on the surface of the substrate, which is prone to oxidation and damage. Problems, thereby affecting the life and reliability of the product. Furthermore, the conventional millimeter wave antenna structures including the aforementioned I557854 patent have both the antenna and the radio frequency chip tied to the same package structure or substrate. As a result, they cannot be easily disassembled and assembled as required. , Replacing components in the product (such as antennas with different patterns or specifications) is less flexible and convenient in production or use, and damage or failure of one of them will cause the entire product to fail or even be scrapped, resulting in product testing , Increase in production and maintenance costs. In addition, the existing millimeter wave antenna usually lacks a structural design for heat dissipation and EMI (electromagnetic interference) prevention, or requires additional components with related functions, but this will complicate the overall structure and increase production costs.

Therefore, how to improve the above problems is the technical difficulty that the applicant intends to solve.

In view of the above-mentioned problems of existing millimeter wave antennas, the purpose of the present invention is to develop an integrated millimeter wave antenna structure that can reduce the product area size.

Another object of the present invention is to develop an integrated millimeter wave antenna structure that can avoid or reduce the oxidation and damage of the signal connection line between the millimeter wave chip and the antenna.

Another objective of the present invention is to develop an integrated millimeter wave antenna structure that can dissipate heat and prevent EMI without additional components.

Another object of the present invention is to develop an integrated millimeter wave antenna structure that can be assembled separately from the antenna and the radio frequency chip, so that different antennas can be easily replaced, and the cost of testing, production and maintenance can be reduced.

To achieve the above objective, the present invention provides an integrated millimeter wave antenna structure, which includes: an element board provided with a first substrate and a millimeter wave chip. The first substrate has a first surface and a second surface opposite to each other. The millimeter-wave chip is disposed on the first surface of the first substrate. The first substrate is provided with at least two positioning portions and at least one first coupling hole respectively. The element board is mounted on the second surface of the first substrate. At least one signal output point is provided on the surface, and each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked under the second surface of the first substrate of the component board, and the metal block The length and width dimensions of the first substrate correspond to the length and width dimensions of the first substrate, and at least two positioned portions corresponding to the positioning portions and at least one of the first coupling holes are respectively provided above the metal block Corresponding to the second coupling hole, so that both the element board and the metal block can be engaged with each other through the concave-convex complementary between each of the positioning portions and each of the positioned portions, and the metal block is provided with at least one and each of the signal A vertical through hole corresponding to the output point; at least one screw member, each of the screw members respectively penetrates the first and second coupling holes to fix the element board and the metal block.

In addition, the present invention also provides an integrated millimeter wave antenna structure, which includes: an element board provided with a first substrate and a millimeter wave chip. The first substrate has a first surface and a second surface opposite to each other. The wave chip is arranged on the first surface of the first substrate. The first substrate is provided with at least two positioning portions and at least one first coupling hole. The element board is provided on the second surface of the first substrate. At least one signal output point, each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked under the second surface of the first substrate of the component board, and the length and width dimensions of the metal block Is corresponding to the length and width of the first substrate, and above the metal block are respectively provided with at least two positioned portions corresponding to each of the positioning portions and at least one second portion corresponding to each of the first coupling holes Two coupling holes, so that both the component board and the metal block can be engaged with each other through the concave and convex complementary between each positioning portion and each positioned portion, and at least one corresponding to each signal output point is provided on the metal block An antenna board is stacked under the metal block, the antenna board is provided with a second substrate, and the length and width of the second substrate correspond to the length and width of the metal block, the first The two substrates have a first surface and a second surface opposite to each other. The antenna board includes a microstrip antenna structure composed of a metal layer disposed on the first surface and the second surface of the second substrate. At least one third combining hole corresponding to each of the second combining holes is provided, and at least one signal feeding point corresponding to each of the vertical through holes is provided on the first surface of the second substrate, and each signal feeding The entry points are respectively electrically connected to the microstrip antenna structure; at least one screw member, and each screw member penetrates the first coupling hole, the second coupling hole and the third coupling hole to connect the element board, the metal block and the antenna The three boards are fixedly combined.

Wherein, the positioning portion is a positioning hole, and the positioned portion is a positioning protrusion.

Wherein, the metal block is an aluminum block.

Wherein, the first surface and the second surface of the first substrate are each provided with at least one first electronic component, the metal block is provided with a concave portion, and each of the first electronic components on the second surface of the first substrate The electronic component is accommodated in the recess.

In addition, the present invention also provides an integrated millimeter wave antenna structure, which includes: an element board provided with a first substrate and a millimeter wave chip. The first substrate has a first surface and a second surface opposite to each other. The wave chip is arranged on the first surface of the first substrate. The first substrate is provided with at least two positioning portions and at least one first coupling hole. The element board is provided on the second surface of the first substrate. At least one signal output point, each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked under the second surface of the first substrate of the component board, and the length and width dimensions of the metal block Is corresponding to the length and width of the first substrate, and above the metal block are respectively provided with at least two positioned portions corresponding to each of the positioning portions and at least one second portion corresponding to each of the first coupling holes Two coupling holes, so that both the component board and the metal block can be engaged with each other through the concave and convex complementary between each positioning portion and each positioned portion, and at least one corresponding to each signal output point is provided on the metal block Each vertical through hole is provided with a wire; an antenna board is stacked under the metal block, the antenna board is provided with a second substrate, and the length and width of the second substrate are the same The length and width of the metal block correspond to each other, the second substrate has a first surface and a second surface opposite to each other, and the antenna board includes a metal layer formed on the first surface and the second surface of the second substrate The microstrip antenna structure of the second substrate is provided with at least one third combining hole corresponding to each of the second combining holes, and the first surface of the second substrate is provided with at least one vertical through hole Corresponding signal feed points, each signal feed point is electrically connected to the microstrip antenna structure, and both ends of each wire are connected to each signal output point of the component board and each of the antenna board. The signal feed point is in contact; at least one screw member, each screw member is respectively penetrated through each of the first, second, and third coupling holes to fix the element board, the metal block and the antenna board .

As a result, the present invention can reduce the area size of the overall antenna and avoid oxidation and damage to the circuit. At the same time, it can also flexibly replace different antennas according to requirements, thereby achieving the effects of reducing testing, production and maintenance costs, and greatly improving the utility of the product Sex.

1‧‧‧Component board

11‧‧‧First substrate

111‧‧‧First Surface

112‧‧‧Second Surface

12‧‧‧millimeter wave chip

13‧‧‧The first electronic component

14‧‧‧Signal output point

15‧‧‧Positioning Department

16‧‧‧First joint hole

2‧‧‧Metal block

21‧‧‧Located part

22‧‧‧Second combination hole

23‧‧‧Vertical through hole

24‧‧‧Depression

25‧‧‧Wire

3‧‧‧Antenna Board

31‧‧‧Second substrate

311‧‧‧First Surface

312‧‧‧Second Surface

32‧‧‧Metal layer

33‧‧‧Third Combination Hole

34‧‧‧Signal feed-in point

4‧‧‧ Screw firmware

The first figure is an exploded schematic diagram of an embodiment of the present invention.

The second figure is a combined schematic diagram of an embodiment of the present invention.

The third figure is a schematic side sectional view of an embodiment of the present invention.

The fourth figure is a schematic side sectional view of the second embodiment of the present invention.

The first and second figures are respectively an exploded schematic diagram and a combined schematic diagram of an embodiment of the integrated millimeter-wave antenna structure of the present invention. The integrated millimeter-wave antenna structure includes: an element board 1 provided with a A first substrate 11 and a millimeter-wave chip 12. The first substrate 11 has a first surface 111 and a second surface 112 opposite to each other. In this embodiment and the first figure, the first surface 111 appears as a first substrate 11, the second surface 112 appears as the lower surface of the first substrate 11. The millimeter wave chip 12 is disposed on the first surface 111 of the first substrate 11, and the first substrate 11 is respectively provided with At least two positioning portions 15 and at least one first coupling hole 16, the positioning portion 15 may specifically be a positioning hole or a positioning protrusion. In this embodiment and the first figure, the positioning portion 15 is shown as a positioning hole, The number of the first coupling holes 16 is 4 and they are distributed on the four corners of the first substrate 11. The component board 1 is provided with at least one first electronic component on the first surface 111 of the first substrate 11 13. Specifically, the first electronic component 13 can be various active and passive electronic components such as transistors, resistors, capacitors, inductors, etc. The first electronic component 13 can also be various electrical connectors such as signal connectors or power connections. When there are a plurality of first electronic components 13, the first electronic components 13 may be a combination of the above-mentioned active and passive electronic components and/or electrical connectors. The component board 1 is on the first substrate 11 At least one signal output point 14 is provided on the two surfaces 112, and each of the signal output points 14 is electrically connected to the millimeter wave chip 12, generally speaking, the number of the signal output points 14 corresponds to the millimeter wave chip 12 The total number of transmit channel and receive channel, for example, for a millimeter wave chip 12 with 2 transmitters and 4 receivers (2T4R) (specific products such as Texas Instruments' IWR1642 millimeter wave sensor chip) , The number of signal output points 14 is 6, but in fact it is not limited to this.

A metal block 2, which is stacked under the second surface 112 of the first substrate 11 of the element board 1, and the length and width of the metal block 2 are the same as those of the first substrate 11 Correspondingly, in this embodiment, the metal block 2 is roughly rectangular parallelepiped. More specifically, the metal block 2 may be an aluminum block, and at least two positioning portions 15 are provided above the metal block 2. The corresponding positioned portion 21 and at least one second coupling hole 22 corresponding to each of the first coupling holes 16. The positioned portion 21 may specifically be a positioning protrusion or a positioning hole. In the figure, the positioned portion 21 is shown as a positioning protrusion, so that both the element board 1 and the metal block 2 can pass through each of the positioning portions 15 and each of the positioned portions 21 to complement each other The metal block 2 is provided with at least one vertical through hole 23 corresponding to each of the signal output points 14. Therefore, in this embodiment, the number of the vertical through holes 23 is also 6 pcs.

An antenna board 3, the antenna board 3 is stacked under the metal block 2, the antenna board 3 is provided with a second substrate 31, and the length and width of the second substrate 31 is the same as the length and width of the metal block 2 Correspondingly, the second substrate 31 has a first surface 311 and a second surface 312 opposite to each other. In this embodiment and the first figure, the first surface 311 is the upper surface of the second substrate 31. The surface 312 appears as the lower surface of the second substrate 31. The antenna board 3 includes a metal layer 32 disposed on the first surface 311 of the second substrate 31 and a metal layer (not shown) on the second surface 312. The second substrate 31 is provided with at least one third coupling hole 33 corresponding to each of the second coupling holes 22, and the second substrate 31 is provided with at least one third coupling hole 33 on the first surface 311 The signal feed point 34 corresponding to each of the vertical through holes 23, and each of the signal feed points 34 are respectively electrically connected to the microstrip antenna structure, wherein the microstrip antenna structure should correspond to the millimeter wave chip 12 The number of receiving and transmitting channels. If the millimeter-wave chip 12 with 2 transmitters and 4 receivers is taken as an example, the microstrip antenna structure can be a 2T4R MIMO Antenna (2T4R MIMO Antenna). The detailed structure of the antenna structure is common knowledge in the field and is not the point of the present invention, so it will not be detailed here and omitted in the drawings.

Please refer to Figures 1 to 3 again. The element board 1, the metal block 2 and the antenna board 3 are provided with a first coupling hole 16, a second coupling hole 22, and a third coupling hole 33, respectively. The invention may also include at least one screw member 4, such as a screw, so that each screw member 4 can penetrate each of the first coupling hole 16, the second coupling hole 22, and the third coupling hole 33 to connect the element board 1, the metal The block 2 and the antenna board 3 are fixedly combined to complete the assembly operation of the integrated millimeter wave antenna structure of the present invention. At the same time, please continue to refer to the third figure. With the above structure, the metal block 2 Each of the vertical through holes 23 can have a function equivalent to a waveguide, so that the transmitted signal of the millimeter wave chip 12 can be coupled in sequence through the signal output point 14, the vertical through hole 23 and the signal feed The input point 34 is transmitted to the antenna board 3, or vice versa, the receiving signal of the antenna board 3 can also be coupled to the millimeter wave chip 12 through the signal feed point 34, the vertical through hole 23 and the signal output point 14 in sequence. Therefore, the present invention can achieve the effect of receiving and sending signals.

In addition, it is worth mentioning that, because the metal block 2 of the present invention can have the effect of a still-pipe, and the still-pipe is actually a kind of antenna (namely, horn antenna, which can be called a horn antenna or horn antenna in Chinese). In some feasible embodiments, the present invention can even omit the antenna board 3 while still maintaining a certain signal transmission and reception performance. At this time, the screw 4 only needs to be used to fix and combine the component board 1 and the metal block 2. Both are sufficient. For some specific applications, such as detection or scanning of objects under test at close range, the present invention can operate normally without the antenna board 3, which is the present invention. At the same time, with this, the present invention can also have the advantages of better reduction in size, simplified structure and lower cost.

Compared with the conventional millimeter wave antenna, the present invention integrates the antenna and the radio frequency chip through a stacked structure design, which can effectively reduce the area size of the overall antenna structure. At the same time, the signal connection line between the millimeter wave chip 12 and the antenna It is mainly located inside the multi-layer circuit board (ie, the first substrate 11 and the second substrate 31), which can avoid or reduce the oxidation damage caused by the exposed circuit, thereby improving the life and reliability of the product. In addition, by using the screws 4 to assemble the main components of the present invention, the possible dielectric loss of the millimeter wave signal caused by the combination of glue, solder, etc. can be avoided, and the present invention can be improved or improved. The effect of signal receiving and sending is maintained. At the same time, the antenna and RF chip of the present invention can be assembled separately, so that different antennas can be easily replaced to improve the flexibility and convenience of production and use, and thereby reduce the cost of product testing, production and maintenance . In addition, it can be mentioned that in addition to its original function, the metal block 2 of the present invention can also have the effects of heat dissipation and EMI prevention, so there is no need to separately set other special heat dissipation elements and shielding elements. Furthermore, it can have better practicability.

In addition, please refer to the first and third figures. In an embodiment of the present invention, a recess 24 may be further provided on the metal block 2 so that the recess 24 can be used as a In this way, the component board 1 can move part of the first electronic components 13 to the second surface 112 of the first substrate 11 for installation, and place the first electronic components 13 on the component board 1 and The metal block 2 can be accommodated in the space of the recessed portion 24 after being combined, so that the area size of the element board 1 and the entire present invention can be further reduced.

In addition, please refer to FIG. 4 again, which is a schematic side sectional view of the second embodiment of the present invention. The difference in structure between this embodiment and the embodiments in FIGS. 1 to 3 is that the metal block 2 Each vertical through hole 23 is further provided with a wire 25, and two ends of each wire 25 are respectively opposite to each signal output point 14 of the element board 1 and each signal feed point 34 of the antenna board 3. Therefore, compared to the embodiments of the first to third figures of the present invention, the waveguide function of air is used as the medium and principle of energy transmission. The biggest feature of this embodiment is that each of the wires 25 is used as energy transmission The medium, so the same effect can be achieved.

However, the above detailed description is a specific description of the preferred embodiments of the present invention. These embodiments are not used to limit the scope of the present invention. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention shall be applied. Included in the scope of the patent in this case.

1‧‧‧Component board

112‧‧‧Second Surface

12‧‧‧millimeter wave chip

13‧‧‧The first electronic component

14‧‧‧Signal output point

2‧‧‧Metal block

23‧‧‧Vertical through hole

24‧‧‧Depression

3‧‧‧Antenna Board

34‧‧‧Signal feed-in point

4‧‧‧ Screw firmware

Claims (6)

An integrated millimeter wave antenna structure, comprising: an element board provided with a first substrate and a millimeter wave chip. The first substrate has a first surface and a second surface opposite to each other. The millimeter wave chip is disposed on the On the first surface of the first substrate, at least two positioning portions and at least one first coupling hole are respectively provided on the first substrate, and the component board is provided with at least one signal output point on the second surface of the first substrate, Each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked under the second surface of the first substrate of the component board, and the length and width of the metal block are the same as those of the first substrate Corresponding to the length and width dimensions of the metal block, and at least two positioned portions corresponding to each positioning portion and at least one second coupling hole corresponding to each of the first coupling holes are provided above the metal block, so that The element board and the metal block can be engaged with each other through the concave-convex complementary engagement between each positioning portion and each positioned portion, and the metal block is provided with at least one vertical through hole corresponding to each signal output point; at least; A screw member, each screw member is respectively penetrated through each of the first coupling hole and the second coupling hole to fix the element board and the metal block. An integrated millimeter wave antenna structure, comprising: an element board provided with a first substrate and a millimeter wave chip. The first substrate has a first surface and a second surface opposite to each other. The millimeter wave chip is disposed on the On the first surface of the first substrate, at least two positioning portions and at least one first coupling hole are respectively provided on the first substrate, and the component board is provided with at least one signal output point on the second surface of the first substrate, Each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked under the second surface of the first substrate of the component board, and the length and width of the metal block are the same as those of the first substrate Corresponding to the length and width dimensions of the metal block, and at least two positioned portions corresponding to each positioning portion and at least one second coupling hole corresponding to each of the first coupling holes are provided above the metal block, so that The component board and the metal block can be engaged with each other through the concave-convex complementary engagement between each positioning portion and each positioned portion, and the metal block is provided with at least one vertical through hole corresponding to each signal output point; The wire board is stacked under the metal block, the antenna board is provided with a second substrate, and the length and width of the second substrate correspond to the length and width of the metal block, and the second substrate has an opposite first substrate. A surface and a second surface, the antenna board includes a microstrip antenna structure composed of metal layers disposed on the first surface and the second surface of the second substrate, and at least one and each A third coupling hole corresponding to the second coupling hole, the first surface of the second substrate is provided with at least one signal feeding point corresponding to each of the vertical through holes, and each signal feeding point is connected to the micro The structure with antenna is electrically connected; at least one screw member, each screw member is respectively penetrated through each of the first coupling hole, the second coupling hole and the third coupling hole to fix the element board, the metal block and the antenna board . According to the integrated millimeter wave antenna structure described in item 2 of the scope of patent application, the positioning portion is a positioning hole, and the positioned portion is a positioning protrusion. In the integrated millimeter wave antenna structure described in item 2 of the scope of patent application, the metal block is an aluminum block. According to the integrated millimeter wave antenna structure described in item 2 of the scope of patent application, the first surface and the second surface of the first substrate are each provided with at least one first electronic component, and a recess is provided on the metal block , And each of the first electronic components on the second surface of the first substrate is accommodated in the recess. An integrated millimeter wave antenna structure, comprising: an element board provided with a first substrate and a millimeter wave chip. The first substrate has a first surface and a second surface opposite to each other. The millimeter wave chip is disposed on the On the first surface of the first substrate, at least two positioning portions and at least one first coupling hole are respectively provided on the first substrate, and the component board is provided with at least one signal output point on the second surface of the first substrate, Each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked under the second surface of the first substrate of the component board, and the length and width of the metal block are the same as those of the first substrate Corresponding to the length and width dimensions of the metal block, and at least two positioned portions corresponding to each positioning portion and at least one second coupling hole corresponding to each of the first coupling holes are provided above the metal block, so that The element board and the metal block can be engaged with each other through the concave-convex complementary between each positioning portion and each positioned portion, and the metal block is provided with at least one vertical through hole corresponding to each signal output point, and Each of the vertical through holes is provided with a wire; an antenna board is stacked under the metal block, the antenna board is provided with a second substrate, and the length and width of the second substrate are the same as the length and width of the metal block Corresponding in size, the second substrate has a first surface and a second surface opposite to each other, and the antenna board includes a microstrip antenna structure composed of a metal layer disposed on the first surface and the second surface of the second substrate, At least one third coupling hole corresponding to each of the second coupling holes is provided on the second substrate, and at least one signal feeding point corresponding to each of the vertical through holes is provided on the first surface of the second substrate , Each of the signal feed points is electrically connected to the microstrip antenna structure, and the two ends of each wire are respectively in contact with each of the signal output points of the component board and each of the signal feed points of the antenna board; At least one screw member, and each screw member is respectively penetrated through the first coupling hole, the second coupling hole and the third coupling hole to fix and combine the element board, the metal block and the antenna board.

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