TW201946330A - Integrated millimeter wave antenna structure reducing the area size of the overall antenna and avoiding damages to the circuits due to oxidation - Google Patents

Abstract

An integrated millimeter wave antenna structure includes a component board and a metal block stacked in order from top to bottom. The component board is provided with a first substrate. The first substrate is provided with a millimeter wave chip. A signal output point is disposed on the bottom surface of the first substrate. The metal block is provided with a vertical through hole corresponding to the signal output point. The component board and the metal block are fixed together by screwing. In this way, the present invention can reduce the area size of the overall antenna and avoid damages to the circuits due to oxidation. In addition, the present invention can flexibly change different antennas as required, so that the effects of reducing the testing, production, and maintenance costs are achieved, thereby greatly improving the practicality of the product.

Description

   Integrated millimeter wave antenna structure   

The invention relates to an antenna structure, in particular to a millimeter wave antenna structure.

Millimeter wave (hereinafter referred to as mmw) is an electromagnetic wave between microwave and light wave. Its frequency band is about 30GHz ~ 300GHz, and the corresponding wavelength is 1 ~ 10mm (mm). The millimeter wave has a large bandwidth. The narrow beam and small size have great application potential and market prospects in various fields including automotive radar, object recognition and high-speed communication (such as 5G mobile communication). However, due to the space loss of millimeter wave signals and The transmission loss is relatively serious, so the design and performance of the antenna system plays a very important role in the application and promotion of millimeter-wave technology. Among the existing technologies of millimeter-wave antennas, some focus on millimeter-wave antennas and RF chips (i.e. Millimeter wave chip) integration, such as disclosed in the Republic of China Patent No. I557854, but the integrated packaging structure of the RF chip and the millimeter wave antenna in this case is realized through semiconductor process technology, and the production cost is obviously higher.

In addition, some conventional millimeter-wave antennas have their antennas and RF chips placed on the same substrate in a plane-extending manner. However, this structure design has the following many improvements: First, antennas generally require A clearance area is reserved on the substrate, so this area on the substrate cannot be used to set other components. As a result, the area size of the entire millimeter wave antenna device becomes larger, which is not conducive to the miniaturization of the product. Secondly, this conventional millimeter-wave antenna has a signal connection line (such as a coplanar microstrip line, Coplanar Waveguide, CPW) between the antenna and the RF chip, which is exposed on the surface of the substrate, so it is easy to be damaged by oxidation. Problems that affect the life and reliability of the product. In addition, the conventional millimeter-wave antenna structure including the aforementioned I557854 patent binds both the antenna and the RF chip to the same packaging structure or substrate. As a result, it cannot be easily disassembled and assembled as required. 2. Replacement of components in the product (such as antennas with different patterns or specifications), lack of flexibility and convenience in production or use, and damage or failure of one of them will cause the entire product to fail to operate or even be scrapped, resulting in product testing Increase in production and maintenance costs. In addition, existing millimeter-wave antennas often lack structural design for heat dissipation and EMI prevention, or need to add additional components with related functions, but this will complicate the overall structure and increase production costs.

Therefore, how to improve the above problems is the technical difficulty that the applicant of this case wants to solve.

In view of the above problems existing in the existing millimeter wave antennas, the object of the present invention is to develop an integrated millimeter wave antenna structure capable of reducing the product area size.

Another object of the present invention is to develop an integrated millimeter wave antenna structure that can avoid or reduce the oxidation damage of the signal connection line between the millimeter wave chip and the antenna.

Another object of the present invention is to develop an integrated millimeter-wave antenna structure that can simultaneously dissipate heat and prevent EMI without additional components.

Yet another object of the present invention is to develop an integrated millimeter-wave antenna structure in which an antenna and a radio frequency chip are separably assembled so that different antennas can be easily replaced, thereby reducing testing, production, and maintenance costs.

To achieve the above object, the present invention provides an integrated millimeter-wave antenna structure, which includes: a component board provided with a first substrate and a millimeter-wave wafer, the first substrate having an opposite first surface and a second substrate; Surface, the millimeter wave wafer is disposed on the first surface of the first substrate, the first substrate is provided with at least two positioning portions and at least one first coupling hole, and the element board is disposed on the second substrate of the first substrate There is at least one signal output point on the surface, and each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked below the second surface of the first substrate of the element board, and the metal block The length and width dimensions correspond to the length and width dimensions of the first substrate, and at least two positioned portions corresponding to each of the positioning portions and at least one each of the first coupling holes are provided above the metal block. A corresponding second coupling hole, so that both the element board and the metal block can be engaged through the concave-convex and complementary engagement between each of the positioning portions and each of the positioned portions, and the metal block is provided with at least one and each of the signals The point corresponding vertical through hole; at least one screw fixing, each of the screw fixing are disposed through each of the first coupling hole and the second coupling hole and be fixedly coupled to both the plate and the metal block member.

In addition, the present invention also provides an integrated millimeter wave antenna structure, which includes: an element board, which is provided with a first substrate and a millimeter wave chip, the first substrate has a first surface and a second surface opposite to each other, the millimeter The wave chip is disposed on the first surface of the first substrate. The first substrate is provided with at least two positioning portions and at least one first coupling hole. The element plate is provided on the second surface of the first substrate. At least one signal output point, each of which is electrically connected to the millimeter wave chip; a metal block is stacked below the second surface of the first substrate of the element board, and the length and width of the metal block are Is corresponding to the length and width of the first substrate, and at least two positioned portions corresponding to each of the positioning portions and at least one first portion corresponding to each of the first coupling holes are respectively provided above the metal block. Two coupling holes, so that both the element board and the metal block can be engaged with each other through the unevenness between each of the positioning portions and each of the positioned portions, and the metal block is provided with at least one corresponding to each of the signal output points A vertical through hole; an antenna plate is stacked below the metal block, the antenna plate is provided with a second substrate, and the length and width dimensions of the second substrate correspond to the length and width dimensions of the metal block. The two substrates have a first surface and a second surface opposite to each other. The antenna plate includes a microstrip antenna structure composed of a metal layer disposed on the first surface and the second surface of the second substrate. At least one third coupling hole corresponding to each of the second coupling holes is provided, and at least one signal feeding point corresponding to each of the vertical through holes is provided on the first surface of the second substrate, and each of the signal feeding points The entry points are respectively electrically connected to the microstrip antenna structure; at least one screw fastener, each screw fastener is respectively passed through the first coupling hole, the second coupling hole and the third coupling hole to connect the component board, the metal block and the antenna The three boards are fixedly combined.

The positioning portion is a positioning hole, and the positioned portion is a positioning protrusion.

The metal block is an aluminum block.

Wherein, at least one first electronic component is respectively provided on the first surface and the second surface of the first substrate, a depression is provided above the metal block, and each of the first surfaces on the second surface of the first substrate is The electronic component is accommodated in the recess.

In addition, the present invention also provides an integrated millimeter wave antenna structure, which includes: an element board, which is provided with a first substrate and a millimeter wave chip, the first substrate has a first surface and a second surface opposite to each other, the millimeter The wave chip is disposed on the first surface of the first substrate. The first substrate is provided with at least two positioning portions and at least one first coupling hole. The element plate is provided on the second surface of the first substrate. At least one signal output point, each of which is electrically connected to the millimeter wave chip; a metal block is stacked below the second surface of the first substrate of the element board, and the length and width of the metal block are Is corresponding to the length and width of the first substrate, and at least two positioned portions corresponding to each of the positioning portions and at least one first portion corresponding to each of the first coupling holes are respectively provided above the metal block. Two coupling holes, so that both the element board and the metal block can be engaged with each other through the unevenness between each of the positioning portions and each of the positioned portions, and the metal block is provided with at least one corresponding to each of the signal output points A vertical through hole, and each of the vertical through holes is provided with a wire; an antenna plate is stacked under the metal block, the antenna plate is provided with a second substrate, and the length and width dimensions of the second substrate and the The length and width of the metal block correspond. The second substrate has a first surface and a second surface opposite to each other. The antenna plate includes a metal layer formed on the first surface and the second surface of the second substrate. Microstrip antenna structure, and at least one third coupling hole corresponding to each of the second coupling holes is provided on the second substrate, and at least one vertical through hole is provided on a first surface of the second substrate. Corresponding signal feed points, each of the signal feed points are electrically connected to the microstrip antenna structure, and both ends of each of the wires are respectively connected to the signal output points of the component board and each of the antenna board. The signal feeding point is in contact with each other; at least one screw fastener, each screw fastener is respectively provided with each of the first coupling hole, the second coupling hole and the third coupling hole to fix and combine the component board, the metal block and the antenna board. .

Therefore, the present invention can reduce the area size of the overall antenna and avoid oxidative damage to the line. At the same time, it can flexibly replace different antennas as required, thereby reducing the testing, production and maintenance costs and other effects, and can greatly improve the practicality of the product Sex.

1‧‧‧component board

11‧‧‧ the first substrate

111‧‧‧first surface

112‧‧‧Second surface

12‧‧‧ millimeter wave chip

13‧‧‧The first electronic component

14‧‧‧Signal output point

15‧‧‧Positioning Department

16‧‧‧First combining hole

2‧‧‧ metal block

21‧‧‧ Positioned

22‧‧‧Second Combination Hole

23‧‧‧ vertical through hole

24‧‧‧ Depression

25‧‧‧ Lead

3‧‧‧ Antenna Board

31‧‧‧second substrate

311‧‧‧first surface

312‧‧‧Second Surface

32‧‧‧ metal layer

33‧‧‧Third combining hole

34‧‧‧Signal feed point

4‧‧‧ Screw Firmware

The first diagram is an exploded view of an embodiment of the present invention.

The second diagram is a combined schematic diagram of an embodiment of the present invention.

The third figure is a schematic side sectional view of an embodiment of the present invention.

The fourth figure is a schematic side sectional view of a second embodiment of the present invention.

The first diagram and the second diagram are respectively an exploded schematic diagram and a combined schematic diagram of an embodiment of the integrated millimeter wave antenna structure of the present invention. The integrated millimeter wave antenna structure includes: a component board 1, which is provided with a A first substrate 11 and a millimeter wave wafer 12. The first substrate 11 has a first surface 111 and a second surface 112 opposite to each other. In this embodiment and the first figure, the first surface 111 is a first substrate. 11 is an upper surface of the first substrate 11, and the second surface 112 is a lower surface of the first substrate 11. The millimeter wave wafer 12 is disposed on the first surface 111 of the first substrate 11, and the first substrate 11 is provided with At least two positioning portions 15 and at least one first coupling hole 16. The positioning portion 15 may be a positioning hole or a positioning protrusion. In this embodiment and the first figure, the positioning portion 15 is shown as a positioning hole. In addition, the number of the first coupling holes 16 is four and is distributed at four corners of the first substrate 11. The element board 1 is provided with at least one first electronic component on the first surface 111 of the first substrate 11. 13, specifically, the first electronic component 13 may be Various active and passive electronic components such as crystals, resistors, capacitors, and inductors. The first electronic component 13 may also be various electrical connectors such as signal connectors or power connectors. When there are a plurality of first electronic components 13, The first electronic components 13 may be a combination of the foregoing active and passive electronic components and / or electrical connectors. The component board 1 is provided with at least one signal output point 14 on the second surface 112 of the first substrate 11. The signal output points 14 are electrically connected to the millimeter wave chip 12, respectively. Generally speaking, the number of the signal output points 14 corresponds to the transmit channel and the receive channel of the millimeter wave chip 12. In total, for example, for a millimeter-wave chip 12 with 2 transmissions and 4 receptions (2T4R) (specific products such as Texas Instruments' IWR1642 millimeter-wave sensor chip), the number of signal output points 14 is 6, but the actual It is not limited to this.

A metal block 2 is stacked below the second surface 112 of the first substrate 11 of the element board 1, and the length and width dimensions of the metal block 2 correspond to the length and width dimensions of the first substrate 11. Correspondingly, in this embodiment, the metal block 2 has a substantially rectangular parallelepiped shape. More specifically, the metal block 2 may be an aluminum block, and at least two and each of the positioning portions 15 are provided above the metal block 2 respectively. The corresponding positioned portion 21 and at least one second coupling hole 22 corresponding to each of the first coupling holes 16. The positioned portion 21 may be a positioning protrusion or a positioning hole. In this embodiment and the first In the figure, the positioned portion 21 is shown as a positioning protrusion, whereby the element board 1 and the metal block 2 are allowed to pass through the unevenness between each of the positioning portions 15 and each of the positioned portions 21 to complement each other. The metal block 2 is provided with at least one vertical through hole 23 corresponding to each of the signal output points 14. Therefore, in this embodiment, the number of the vertical through holes 23 is also 6.

An antenna plate 3 is stacked below the metal block 2. The antenna plate 3 is provided with a second substrate 31, and the length and width dimensions of the second substrate 31 are the same as those of the metal block 2. Correspondingly, the second substrate 31 has a first surface 311 and a second surface 312 opposite to each other. In this embodiment and the first figure, the first surface 311 is an upper surface of the second substrate 31, and the second substrate 31 The surface 312 appears as the lower surface of the second substrate 31. The antenna plate 3 includes a metal layer 32 disposed on the first surface 311 of the second substrate 31 and a metal layer (not shown) on the second surface 312. A microstrip antenna structure is formed, and at least one third coupling hole 33 corresponding to each of the second coupling holes 22 is provided on the second substrate 31, and at least one is provided on the first surface 311 of the second substrate 31 The signal feed-in points 34 corresponding to each of the vertical through holes 23 are electrically connected to the microstrip antenna structure, respectively, wherein the microstrip antenna structure should correspond to the Number of transmit and receive channels. If the above millimeter wave chip 12 with 2 transmissions and 4 receptions is taken as an example, The antenna structure can be a multiple-input multiple-output antenna with 2 transmissions and 4 receptions (2T4R MIMO Antenna), but the detailed structure of the microstrip antenna structure belongs to the common knowledge in the field and is not the invention of this case, so it is not allowed here. The details are omitted in the drawings.

Please refer to the first to third figures again. With the element board 1, the metal block 2, and the antenna board 3 being provided with a first coupling hole 16, a second coupling hole 22, and a third coupling hole 33, respectively, The invention may further include at least one screw fastener 4 such as a screw, so that each of the screw fasteners 4 can pass through the first coupling hole 16, the second coupling hole 22, and the third coupling hole 33, respectively, to connect the component board 1 and the metal. The three pieces of the block 2 and the antenna plate 3 are fixedly combined to complete the assembling operation of the integrated millimeter wave antenna structure of the present invention. At the same time, please continue to refer to the third figure. With the above structure, the metal block 2 Each of the vertical through holes 23 can have a function equivalent to a wave guide, so that the transmission signals of the millimeter wave chip 12 can be sequentially coupled through the signal output point 14, the vertical through holes 23, and the signal feed. The input point 34 is transmitted to the antenna plate 3, or vice versa, the received signal of the antenna plate 3 can also be transmitted to the millimeter wave chip 12 through the signal feed point 34, the vertical through hole 23, and the signal output point 14 in a coupling manner. , So that the present invention can achieve the effect of receiving and sending signals.

In addition, it is worth mentioning that since the metal block 2 of the present invention can have the effect of a waveguide, the waveguide is actually also one of the antennas (that is, horn antenna, which can be called a horn antenna or a horn antenna in Chinese), so In some feasible embodiments, the present invention can even omit the antenna board 3 while still maintaining a certain signal transmitting and receiving performance. At this time, the screw 4 need only be used to fix and combine the element board 1 and the metal block 2 Both can be used. For some specific applications, such as the detection or scanning of objects to be measured at a short distance, the present invention can work normally without the antenna plate 3, which is actually the present invention. At the same time, the invention also has the advantages of better size reduction, simplified structure and lower cost.

Compared with the conventional millimeter wave antenna, the present invention integrates the antenna and the radio frequency chip by adopting a stacked structure design. In addition to effectively reducing the area size of the overall antenna structure, at the same time, the signal connection line between the millimeter wave chip 12 and the antenna It is mainly located inside the multi-layer circuit board (ie, the first substrate 11 and the second substrate 31), so as to avoid or reduce the problem of oxidative damage caused by the exposure of the circuit, thereby improving the life and reliability of the product. In addition, the main components of the present invention are assembled by using the screw fastener 4, which can avoid the dielectric loss problems that may occur to the millimeter wave signal by using a combination of adhesive, solder, etc., and thus the present invention can be improved or improved. The effect of maintaining the signal transmitting and receiving effect is maintained. At the same time, the antenna and the RF chip of the present invention can also be separated and assembled, so that different antennas can be easily replaced to improve the flexibility and convenience in production and use, and further reduce the cost of product testing, production and maintenance. . In addition, it can be mentioned that the metal block 2 of the present invention has the effects of heat dissipation and EMI prevention in addition to the original function, so there is no need to separately provide other dedicated heat dissipation elements and shielding elements. Furthermore, it can have better practicality.

In addition, please refer to the first figure and the third figure. In one embodiment of the present invention, a recess 24 can be further provided above the metal block 2, so that the recess 24 can be used as a The accommodating space is such that the component board 1 can move part of the first electronic components 13 to the second surface 112 of the first substrate 11 for setting, and place the first electronic components 13 on the component board 1 and After the metal blocks 2 are combined, they can be accommodated in the space of the recessed portion 24, so that the area size of the element board 1 and even the whole of the present invention can be further reduced.

In addition, please refer to the fourth figure again, which is a schematic side sectional view of the second embodiment of the present invention. The structural difference between this embodiment and the embodiments of the first to third figures lies in that: A conductive wire 25 is further provided in each of the vertical through holes 23, and two ends of each of the conductive wires 25 are in phase with each of the signal output points 14 of the component board 1 and each of the signal feed points 34 of the antenna board 3. Therefore, in contrast to the first to third embodiments of the present invention, the waveguide effect of air is used as the medium and principle of energy transfer. The biggest feature of this embodiment is that each of the wires 25 is used as the energy transfer. Media, so you can achieve the same effect.

However, the above detailed descriptions are specific descriptions of the preferred embodiments of the present invention. These embodiments are not intended to limit the patent scope of the present invention, and any equivalent implementation or change that does not depart from the technical spirit of the present invention should be Included in the patent scope of this case.

Claims (6)

    An integrated millimeter-wave antenna structure includes: a component board, which is provided with a first substrate and a millimeter-wave wafer, the first substrate has a first surface and a second surface opposite to each other, and the millimeter-wave chip is disposed on the substrate; On the first surface of the first substrate, the first substrate is respectively provided with at least two positioning portions and at least one first coupling hole, and the element board is provided with at least one signal output point on the second surface of the first substrate. Each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked below the second surface of the first substrate of the element board, and the length and width dimensions of the metal block are connected to the first substrate. Corresponding to the length and width dimensions, and at least two positioned portions corresponding to each of the positioning portions and at least one second coupling hole corresponding to each of the first coupling holes are respectively provided above the metal block, so that Both the element board and the metal block can be engaged through the concave-convex complementary engagement between each of the positioning portions and each of the positioned portions, and the metal block is provided with at least one vertical through hole corresponding to each of the signal output points; at least One Screw fixing, each of the screw fixing are disposed through each of the first coupling hole and the second coupling hole and be fixedly coupled to both the plate and the metal block member.         An integrated millimeter-wave antenna structure includes: a component board, which is provided with a first substrate and a millimeter-wave wafer, the first substrate has a first surface and a second surface opposite to each other, and the millimeter-wave chip is disposed on the substrate; On the first surface of the first substrate, the first substrate is respectively provided with at least two positioning portions and at least one first coupling hole, and the element board is provided with at least one signal output point on the second surface of the first substrate. Each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked below the second surface of the first substrate of the element board, and the length and width dimensions of the metal block are connected to the first substrate. Corresponding to the length and width dimensions, and at least two positioned portions corresponding to each of the positioning portions and at least one second coupling hole corresponding to each of the first coupling holes are respectively provided above the metal block, so that Both the element board and the metal block can be engaged through complementary projections and depressions between each of the positioning portions and each of the positioned portions, and the metal block is provided with at least one vertical through hole corresponding to each of the signal output points; one day line A plate is stacked below the metal block, the antenna board is provided with a second substrate, and the length and width dimensions of the second substrate correspond to the length and width dimensions of the metal block, and the second substrate has a first Surface and second surface, the antenna plate includes a microstrip antenna structure composed of a metal layer disposed on the first surface and the second surface of the second substrate, and the second substrate is provided with at least one and each of the A third coupling hole corresponding to the second coupling hole, the first surface of the second substrate is provided with at least one signal feeding point corresponding to each of the vertical through holes, and each of the signal feeding points is respectively connected to the microstrip. The antenna structure is electrically connected; at least one screw fastener, each of the screw fasteners passing through the first coupling hole, the second coupling hole, and the third coupling hole, respectively, to fix and combine the component board, the metal block and the antenna board.         According to the integrated millimeter wave antenna structure described in item 2 of the patent application scope, wherein the positioning portion is a positioning hole, and the positioned portion is a positioning protrusion.         The integrated millimeter wave antenna structure described in item 2 of the patent application scope, wherein the metal block is an aluminum block.         The integrated millimeter-wave antenna structure according to item 2 of the scope of patent application, wherein the first surface and the second surface of the first substrate are respectively provided with at least one first electronic component, and a depression is provided above the metal block. Each of the first electronic components on the second surface of the first substrate is received in the recess.         An integrated millimeter-wave antenna structure includes: a component board, which is provided with a first substrate and a millimeter-wave wafer, the first substrate has a first surface and a second surface opposite to each other, and the millimeter-wave chip is disposed on the substrate; On the first surface of the first substrate, the first substrate is respectively provided with at least two positioning portions and at least one first coupling hole, and the element board is provided with at least one signal output point on the second surface of the first substrate. Each of the signal output points is electrically connected to the millimeter wave chip; a metal block is stacked below the second surface of the first substrate of the element board, and the length and width dimensions of the metal block are connected to the first substrate. Corresponding to the length and width dimensions, and at least two positioned portions corresponding to each of the positioning portions and at least one second coupling hole corresponding to each of the first coupling holes are respectively provided above the metal block, so that The element board and the metal block can be engaged with each other through the unevenness between each of the positioning portions and each of the positioned portions, and the metal block is provided with at least one vertical through hole corresponding to each of the signal output points, and Each A wire is respectively arranged in the through hole; an antenna plate is stacked under the metal block, and the antenna plate is provided with a second substrate, and the length and width dimensions of the second substrate are in accordance with the length and width dimensions of the metal block. Correspondingly, the second substrate has a first surface and a second surface opposite to each other. The antenna plate includes a microstrip antenna structure composed of a metal layer disposed on the first surface and the second surface of the second substrate. The second substrate is provided with at least one third coupling hole corresponding to each of the second coupling holes. The first surface of the second substrate has at least one signal feeding point corresponding to each of the vertical through holes. The signal feed-in points are electrically connected to the microstrip antenna structure, respectively, and both ends of the wires are in contact with the signal output points of the component board and the signal feed-in points of the antenna board, respectively; at least one Screw fasteners. Each of the screw fasteners respectively penetrates the first coupling hole, the second coupling hole, and the third coupling hole to fix and combine the component board, the metal block, and the antenna board.