TWI700762B - Wafer Tungsten Film Heater - Google Patents

Abstract

This creation is a wafer-plated tungsten film heater, which includes a heating plate, a vacuum device and a heating device; the center of the heating plate has a suction hole, and the top surface of the heating plate is formed with an inner ring groove, an outer ring groove, Plural inner radial grooves and plural outer radial grooves, the inner ring groove surrounds the air extraction hole, the outer ring groove surrounds the inner ring groove, both ends of the outer radial groove connect the inner ring groove and the outer ring groove, and the outer radial groove is arc-shaped In this way, the total length of the outer radial groove is longer due to the arc-shaped extension of the outer radial groove, and the effective exhaust area formed on both sides of the outer radial groove can therefore completely cover the inner ring groove and the outer ring The area between the grooves allows the gas between the outer heating block and the wafer to quickly move into the outer radial groove and be discharged, thereby speeding up the adsorption of the wafer on the heating plane to increase the yield.

Description

Wafer Tungsten Film Heater

The present invention is a heater for heating a substrate in a metal tungsten chemical vapor deposition process, and particularly refers to a wafer tungsten film heater for heating a wafer in a tungsten deposition process of a semiconductor wafer.

In the semiconductor manufacturing process, there is a tungsten deposition process. The tungsten deposition process is to deposit tungsten on the surface of the wafer by chemical vapor deposition to form conductive structures such as contacts or channels on the wafer.

The tungsten deposition process is carried out in a reaction chamber. There is a heater in the reaction chamber. The heater is a metal base. The top surface of the heater is protruded with a number of ceramic elastic bumps. The center of the heater is recessed with a vacuum adsorption device ; During the tungsten deposition process, the wafer is placed on the heater, while the precursor gas is filled with the reaction chamber, the heater first supports the wafer with ceramic elastic bumps with good heat insulation effect, so that the heater can be separated from the thin layer Air preheats the wafer; after the preheating is completed, the heater activates the central vacuum adsorption device to adsorb the wafer against the surface of the heater, and continue to heat the wafer to the processing temperature, so that the wafer surface and the precursor gas Function to deposit a thin film of tungsten on the wafer.

The existing heater is shown in Fig. 6, the top surface of the heater is a circular heating plane 91, the heating plane 91 is recessed with an air extraction hole 92, and the heating plane 91 is recessed with a plurality of connected air extraction holes 92 The inner radial groove 93, an inner ring groove 94 and a plurality of outer radial grooves 95 are provided with the aforementioned grooves to ensure that the suction force generated by the vacuum device can be evenly distributed on the plane of the wafer; After startup, the gas between the wafer and the top surface of the heater is drawn down through the exhaust hole 92 to make the bottom surface of the wafer The air pressure is lower than the air pressure on the top surface of the wafer, so that the bottom surface of the wafer moves toward the direction of contacting the heating plane 91; when the bottom surface of the wafer moves toward the direction of contacting the heating plane 91, the gap between the wafer and the heating plane 91 The gas in the middle is along the plane of the heating plane 91, moving from the periphery of the heating plane 91 to the suction hole 92. Specifically, most of the gas will first collect in the outer radial groove 95, and then pass through the inner radial groove. 93 flows to the exhaust hole 92, and then is drawn out by the vacuum device. Therefore, it is conceivable that the outer radial groove 95 will extend on both sides of the groove to form a long effective exhaust area. The gas in the effective exhaust area depends on the distance The grooves are very close, so the gas can quickly collect into the outer radial groove 95 and be discharged; however, because the outer radial groove 95 extends radially from the center of the heating plane 91 to the periphery of the heating plane 91, The spacing distance of the outer radial grooves 95 increases as the outer radial grooves 95 move away from the center of the heating plane 91, so that the distance between the center of the outer heating block 911 and the outer radial groove 95 becomes farther from the center of the heating plane 91. It is too large to be covered by the effective exhaust area formed by the grooves such as the outer radial groove 95, so that when the wafer moves downward, the gas between the outer heating block 911 and the wafer cannot quickly pass through the outer radial groove 95 When the groove is discharged, the wafer cannot be reliably attached to the heating surface 91; it takes time for the existing heater to wait for the wafer to attach to the heating surface 91 after the vacuum suction device is activated, which affects the production speed.

Therefore, the prior art wafer tungsten film heaters really need to be improved.

In view of the aforementioned shortcomings and deficiencies of the prior art, the present invention provides a wafer tungsten film heater to reduce the time required for the wafer to adhere to the heating plane.

In order to achieve the above creative purpose, the technical means adopted by the present invention is to design a wafer heating with tungsten coating, which includes: a heating plate, which has: A heating plane, which is located on the top surface of the heating plate; an air extraction hole, which penetrates the heating plane and the bottom surface of the heating plate; an inner ring groove, which is recessed on the heating plane and surrounds the center of the heating plane And the air extraction hole; an outer ring groove, which is recessed on the heating plane, and surrounds the center of the heating plane and the inner ring groove; a plurality of inner radial grooves, which are recessed on the heating plane, and surround the The center of the heating plane is arranged at intervals; one end of the inner radial grooves communicates with the air extraction hole, and the other end communicates with the inner ring groove; a plurality of outer radial grooves are recessed on the heating plane and surround the center of the heating plane Are arranged at intervals; one end of the outer radial grooves communicates with the inner ring groove, the other end communicates with the outer ring groove, and the outer radial grooves extend in an arc shape; a plurality of elastic sheet grooves, the elastic sheet grooves surround the heating Are arranged at intervals on a plane, the elastic sheet grooves are located outside the inner ring groove, and each of the elastic sheet grooves communicates with at least two of the outer radial grooves; a vacuum device connected to the air suction hole of the heating plate; A heating device connected to the heating plate.

The advantage of the present invention is that, by making the outer radial groove arc-shaped to extend toward the periphery of the heating plane, the outer radial groove extends in an arc so that the total length of the outer radial groove is compared with that of the prior art linear extension. The radial groove is longer. Therefore, the effective exhaust area formed on both sides of the outer radial groove can completely cover the entire area of the outer heating block, so that the gas between the outer heating block and the wafer can quickly flow along The heating plane moves into the outer radial groove and is discharged, thereby shortening the speed at which the wafer is adsorbed against the heating plane after the vacuum suction device is activated, and the production speed is accelerated.

Furthermore, in the wafer heater with tungsten coating, the number of the outer radial grooves is greater than the number of the inner radial grooves.

Furthermore, in the wafer heater with tungsten coating, the number of the outer radial grooves is twice the number of the inner radial grooves.

Furthermore, in the wafer tungsten coating heater, the outer ring groove is adjacent to the periphery of the heating plane.

Furthermore, in the wafer tungsten coating heater, the heating plate further has: a blowing ring groove, which is recessed on the top surface of the heating plate and located outside the heating plane; The channels are recessed on the bottom surface of the heating plate and are arranged at intervals around the center of the heating plate, and each of the blowing channels is communicated with the blowing ring groove.

Furthermore, in the wafer tungsten coating heater, the heating plate further has a middle ring groove, which is recessed on the heating plane and surrounds the center of the heating plane and the inner ring groove; the outer ring The groove surrounds the middle ring groove.

Further, in the wafer tungsten film heater, the wafer tungsten film heater further includes a plurality of elastic pieces, the elastic pieces are respectively arranged in the plurality of elastic piece grooves of the heating plate, and the A convex point protrudes from one side surface, and the convex point of each elastic piece selectively protrudes upward from the heating plane.

10: Heating plate

11: Heating plane

111: inner heating block

112: External heating block

12: Exhaust hole

13: inner ring groove

14: Central groove

15: Outer ring groove

16: Blow ring groove

161: Blow Channel

17: Inner radial groove

18: Outer radial groove

19: Shrapnel groove

20: shrapnel

21: bump

A: Wafer

91: heating plane

911: External heating block

92: Vent

93: inner radial groove

94: inner ring groove

95: Outer radial groove

Figure 1 is a perspective view of the present invention.

Figure 2 is an exploded view of the components of the present invention.

Figure 3 is a schematic cross-sectional view of the present invention.

Figure 4 is a top view of the present invention.

Figure 5 is another schematic cross-sectional view of the present invention.

Fig. 6 is a top view of a prior art wafer tungsten film heater.

In the following, in conjunction with the drawings and the preferred embodiments of the present invention, the technical means adopted by the present invention to achieve the predetermined creative purpose are further described.

Please refer to FIGS. 1 to 3, the wafer tungsten coating heater of the present invention includes a heating plate 10, a plurality of elastic sheets 20, a vacuum device (not shown in the figure) and a heating device (not shown in the figure), The present invention is used to heat a wafer A; the elastic sheet 20 is arranged on the top surface of the heating plate 10, the wafer A is arranged spaced from the top surface of the heating plate 10 through the abutment of the elastic sheet 20, and the vacuum device is connected to the heating plate 10; When the vacuum device is activated, the gas between the wafer A and the heating plate 10 is evacuated by the vacuum device, so that the wafer A is attracted to the top surface of the heating plate 10 due to the pressure difference between the two sides.

Please refer to Figure 1, Figure 3 and Figure 4, the aforementioned heating plate 10 has a heating plane 11, a suction hole 12, an inner ring groove 13, an outer ring groove 15, a plurality of inner radial groove 17, a plurality of outer A radial groove 18 and a plurality of elastic plate grooves 19, and in this embodiment, the heating plate 10 further includes a middle ring groove 14, a blowing ring groove 16 and a blowing channel 161; the aforementioned heating plane 11 is located on the heating plate 10 In this embodiment, the shape of the heating plane 11 is circular, and the diameter of the heating plane 11 is approximately the same as the diameter of the wafer A, but the shape of the heating plane 11 can also be a square or other shapes. The wafer A can be heated uniformly; the exhaust hole 12 penetrates the heating plane 11 and the bottom surface of the heating plate 10. In this embodiment, the exhaust hole 12 has a plurality of exhaust openings formed on the heating plane 11 around the center of the heating plane 11 , But not limited to this; the aforementioned inner ring groove 13, middle ring groove 14, and outer ring groove 15 are recessed on the heating plane 11, and surround the center of the heating plane 11 and the exhaust hole 12, and the middle ring groove 14 surrounds the inner ring groove 13. The outer ring groove 15 surrounds the middle ring groove 14 and the inner ring groove 13; in this embodiment, the outer ring groove 15 is adjacent to the periphery of the heating plane 11; the inner radial groove 17 is recessed on the heating plane 11 and surrounds the heating The center of the plane 11 is spaced apart, and one end of the inner radial groove 17 is connected to the suction hole 12, and specifically, one end of each inner radial groove 17 is respectively connected to the suction hole 12 through each suction opening; the inner radial groove 17 is relatively sucked The other end of the air hole 12 is connected to the inner ring groove 13, and the inner radial groove 17 The heating plane 11 located in the inner ring groove 13 is divided into a plurality of inner heating blocks 111 with approximately the same area; the outer radial groove 18 is recessed on the heating plane 11 and is arranged at intervals around the center of the heating plane 11; One end of the groove 18 is connected to the inner ring groove 13, and the other end is connected to the outer ring groove 15, and the outer radial groove 18 extends in an arc shape. The outer radial groove 18 will be located on the heating plane between the inner ring groove 13 and the outer ring groove 15 11 is divided into a plurality of outer heating blocks 112. By extending the outer radial groove 18 in an arc shape, the total length of the outer radial groove 18 is longer, and the two sides of the outer radial groove 18 are very close to the groove, which can quickly The effective exhaust area of the exhaust can therefore completely cover the entire area of the outer heating block 112, so the gas between the outer heating block 112 and the wafer A can quickly move into the outer radial groove 18 and be exhausted, reducing the number of wafers A The time required for adsorption and abutment on the heating plane 11; in this embodiment, the number of outer radial grooves 18 is twice that of the inner radial grooves 17, and each inner radial groove 17 has two outer radial grooves. The groove 18 corresponds to the inner ring groove 13 and the inner radial groove 17 on the opposite sides along the extension direction of the inner ring groove 13 is an outer radial groove 18, which will be closer to the inner diameter of the suction hole 12 The suction airflow to the groove 17 is evenly distributed to the two outer radial grooves 18, so that the force of the negative pressure adsorption can be evenly distributed on the plane of the entire wafer A, and at the same time, by the distance from the center of the heating plane 11 The outer radial grooves 18 are densely arranged between the inner ring groove 13 and the outer ring groove 15, so that the area of the outer heating block 112 and the width of the inner heating block 111 will not be too significantly different. When the wafer A moves downward When it is close to the heating plane 11, the gas between the top surface of the outer heating block 112 and the bottom surface of the wafer A can be quickly discharged through the outer radial groove 18, but the number of the outer radial groove 18 is not limited to this, only The number of outer radial grooves 18 may be greater than the number of inner radial grooves 17, and even the number of outer radial grooves 18 can be equal to the number of inner radial grooves 17; please refer to Figs. The ring groove 16 is recessed on the top surface of the heating plate 10 and located outside the heating plane 11; the aforementioned plural blowing channels 161 are recessed on the bottom surface of the heating plate 10 and are arranged at intervals around the center of the heating plate 10. The channel 161 communicates with the blowing ring groove 16; please refer to Figures 1 to 3, the aforementioned elastic sheet grooves 19 are arranged at intervals around the heating plane 11. In this embodiment, the elastic sheet grooves 19 are located in the inner ring groove 13 Outside, and each elastic piece groove 19 communicates with at least two outer radial grooves 18, so that the gas in the elastic piece groove 19 can quickly pass through the outer radial groove 18 However, it is not limited to this, and the same effect can be achieved by connecting the elastic groove 19 to the outer ring groove 15 or other grooves on the heating plane 11 and the air suction hole 12.

The aforementioned elastic pieces 20 are arranged in the elastic grooves 19, and a convex point 21 protrudes from one side of each elastic piece 20. The convex points 21 of each elastic piece 20 can protrude upward from the heating plane 11, so that a layer is maintained between the wafer A and the heating plane 11 Air gap; the aforementioned vacuum device is connected to the exhaust hole 12 of the heating plate 10, and when the vacuum device is pumped through the exhaust hole 12, the wafer A is adsorbed against the heating plane 11, and the bumps 21 of the elastic sheet 20 are covered by the wafer A is pressed down into the groove 19 of the shrapnel.

The aforementioned heating device is connected to the heating plate 10 to provide a source of heat energy for wafer heating.

When this creation is in use, a robotic arm is used to place a wafer above the heating plane 11 of the heating plate 10, and the wafer A is first supported by the bumps 21 of the elastic sheet 20 to maintain an air gap with the heating plane 11 to proceed to wafer A. The preheating; after the wafer A is preheated to a proper temperature, the vacuum device is activated to adsorb the wafer A against the heating plane 11 for the tungsten deposition process.

In summary, the present invention reduces the time required for the wafer to attach to the heating plane by designing a plurality of outer radial grooves in an arc shape.

The above are only the preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed in the preferred embodiments as above, it is not intended to limit the present invention. Any technical field has Generally knowledgeable persons, without departing from the scope of the technical solution of the present invention, can use the technical content disclosed above to make slight changes or modifications into equivalent embodiments with equivalent changes. However, any content that does not depart from the technical solution of the present invention is based on this The technical essence of the invention makes any simple modifications, equivalent changes and modifications to the above embodiments still fall within the scope of the technical solutions of the present invention.

10: Heating plate

11: Heating plane

111: inner heating block

112: External heating block

13: inner ring groove

14: Central groove

15: Outer ring groove

16: Blow ring groove

17: Inner radial groove

18: Outer radial groove

19: Shrapnel groove

20: shrapnel

21: bump

Claims (7)

A wafer-plated tungsten film heater, comprising: a heating plate, which has: a heating plane located on the top surface of the heating plate; a suction hole which penetrates the heating plane and the bottom surface of the heating plate; An annular groove is recessed on the heating plane and surrounds the center of the heating plane and the air extraction hole; an outer ring groove is recessed on the heating plane and surrounds the center of the heating plane and the inner annular groove A plurality of inner radial grooves, which are recessed on the heating plane and are arranged at intervals around the center of the heating plane; one end of the inner radial grooves communicates with the suction hole, and the other end communicates with the inner ring groove; plural outer diameters Grooves, which are recessed on the heating plane and arranged at intervals around the center of the heating plane; one end of the outer radial grooves communicates with the inner ring groove, the other end communicates with the outer ring groove, and the outer radial grooves The grooves extend in an arc shape; a plurality of elastic sheet grooves are arranged at intervals around the heating plane, the elastic sheet grooves are located outside the inner ring groove, and each elastic sheet groove communicates with at least two of the outer diameters To the groove; a vacuum device, the vacuum device connected to the exhaust hole of the heating plate; a heating device, which is connected to the heating plate. The wafer tungsten coating heater according to claim 1, wherein the number of the outer radial grooves is greater than the number of the inner radial grooves. The wafer tungsten film heater according to claim 2, wherein the number of the outer radial grooves is twice the number of the inner radial grooves. The wafer tungsten coating heater according to any one of claims 1 to 3, wherein the outer ring groove is adjacent to the periphery of the heating plane. The wafer tungsten coating heater according to any one of claims 1 to 3, wherein the heating plate further has: a blowing ring groove, which is recessed on the top surface of the heating plate and located on the heating plane A plurality of blowing channels, which are recessed on the bottom surface of the heating plate, and are arranged at intervals around the center of the heating plate, each of the blowing channels communicates with the blowing ring groove. The wafer tungsten coating heater according to any one of claims 1 to 3, wherein the heating plate further has a middle ring groove, and the middle ring groove is recessed on the heating plane and surrounds the center of the heating plane and The inner ring groove; the outer ring groove surrounds the middle ring groove. The wafer tungsten film heater according to any one of claims 1 to 3, wherein the wafer tungsten film heater further comprises a plurality of elastic pieces, and the elastic pieces are respectively arranged in the plurality of elastic piece grooves of the heating plate Wherein, a convex point protrudes from one side of each elastic piece, and the convex point of each elastic piece selectively protrudes upward from the heating plane.

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