TWI700760B - Feeding method and device for chip peeling process - Google Patents

Abstract

The present invention is a method and device for feeding a wafer peeling process, which are used to feed a peeling mechanism for peeling a wafer to be peeled into a strip wafer on a machine. The method includes: providing a device There is a resistance part, a waste part at one end of the resistance part, and two chip wafers at the side edges of the resistance part; the chip wafer is placed on the machine with a material placement mechanism; The mechanism transports the chip wafers in the loading mechanism to a folding mechanism on the machine to perform stripping of the side portion and the scrap portion to be stripped to leave the strip wafers to be stripped; The mechanism transports the chip to be stripped in the folding mechanism to the stripping mechanism for stripping and folding into strip wafers; thereby, the chip stripping process can be executed consistently and efficiently, and the productivity is greatly increased.

Description

Feeding method and device for chip peeling process

The present invention relates to a feeding method and device, in particular to a feeding method and device used in the manufacturing process of chip-type resistors for chip-shaped wafer manufacturing.

According to the general chip-type resistors, a chip-shaped chip is usually used to process a multi-layered electroplated layer, and then peeled off into a strip-shaped chip, and then the strip-shaped chip is peeled into a granular resistor. This type of chip is peeled off The equipment for strip-shaped wafers is generally called a stacker, and the equipment for peeling strip-shaped wafers into granular resistors is generally called a pelletizer; the process of stripping wafers into strip-shaped wafers can be referred to, for example, by the applicant Patent cases such as the new M448052 "wafer peeling device", the M445766 "wafer transfer device", the M445761 "wafer collection device", the M445762 "wafer stacking device" and other patent cases; In the process of peeling wafers into strip wafers, the sheet wafers are often placed in a peeling mechanism in the No. M448052 "wafer peeling device", and a swing seat is pushed by a pushing mechanism to make the sheet wafers After the front end is positioned by a positioning device, the swing seat of the peeling mechanism is driven to swing up and down by the connecting rod driven by the eccentric wheel, so that the part of the chip wafer positioned by the positioning device is peeled into strips Wafer.

However, in the prior art, in the peeling machine, the chip wafer is directly placed in the swing seat for pushing. Because the chip wafer has a non-rectangular outline when it is made, it is placed When entering a guide slot in the swing seat, there may be obstruction, or when the pushing mechanism is pushing, the material jam is caused by skew, which causes the operator to spend a lot of time to eliminate the jam, which makes it difficult to perform high-efficiency production , There is still room for improvement.

The object of the present invention is to provide a material supply method for the chip peeling process that can make the process of peeling the sheet wafer into a strip wafer more effective.

Another object of the present invention is to provide a feeding device for a wafer peeling process that can make the process of peeling a sheet wafer into a strip wafer more effective.

Another object of the present invention is to provide a device for performing the feeding method of the wafer peeling process.

The method for supplying a wafer peeling process according to the object of the present invention includes: providing a sheet-like wafer including a resistive part, a waste part at one end of the resistive part, and two parts at both sides of the resistive part. Side part; provide a machine, the machine is equipped with a peeling mechanism, the peeling mechanism is performed to peel a wafer to be stripped into a strip of wafer; so that the chip wafer is placed on the machine Placement mechanism; a transport mechanism is used to transport the chip wafer in the placement mechanism to a folding mechanism on the machine, and the folding mechanism executes the stripping of the chip wafer to the outside edge and the waste portion. The stripping part is used to leave the chip to be stripped; the carrying mechanism is used to carry the chip to be stripped in the folding mechanism to the stripping mechanism for stripping and folding into strip wafers.

A feeding device for a wafer peeling process according to another object of the present invention includes: a machine is provided with: a peeling mechanism, which can swing up and down to peel a wafer to be peeled into strips A swing seat for the wafer; a material placing mechanism provided with a warehouse seat for stacking a sheet of wafer; a folding mechanism provided with a fold that can peel the sheet wafer into the wafer to be stripped Side frame; a conveying mechanism with a lifting seat that can be driven to move and convey the chip wafer and the chip to be stripped.

A feeding device for a wafer peeling process according to another object of the present invention includes: a device for performing the feeding method of the wafer peeling process.

According to the feeding method and device of the wafer peeling and folding process of the embodiment of the present invention, since a conveying mechanism is used on the machine to simultaneously transport the chip wafers in the material placing mechanism to a folding mechanism on the machine, the folding The mechanism performs peeling of the chip wafer at the side portion and the portion to be peeled off of the waste portion to leave the chip to be peeled; and the conveying mechanism is used to transfer the chip to be peeled in the folding mechanism to The stripping mechanism is peeled into strip wafers; therefore, the wafer stripping process is supplied from the initial sheet wafer and is stripped into the wafer to be stripped to stripped into strip wafers, which can be consistent and efficient Was executed and significantly increased production capacity.

Please refer to FIG. 1, the chip used for peeling in the embodiment of the present invention is a rectangular sheet wafer A, which has a rectangular area and a resistive part A1 with a laminated electroplating layer on the surface. In the folding sequence, the X-axis front end of the resistance part A1 forms a scrap part A2 without a build-up electroplating layer, the X-axis rear end of the resistance part A1 forms a clip part A3 without a build-up electroplating layer, and the resistance part A1 On both sides of the Y-axis, a section of the side portions A4 and A5 of the non-stacked electroplated layer narrower than the waste portion A2 and the clamping portion A3 are respectively formed; wherein, in the embodiment of the present invention, the side portions A4 and A5 are respectively Each division includes the inner sides A41 and A51 of the resistance part A1, and the outer sides A42 and A52 of the resistance part A1; the outer sides A42 and A52 include the resistance part A1, the scrap part A2, and the clip The side part of the holding part A3, and the inner sides A41 and A51 only include the side part of the resistance part A1; the boundaries between the parts are shown in Figures 1 and 2 respectively in the chip chip A groove-shaped line mark A6 is scribed on the lower surface of A, and the line mark A6 on the lower surface of the resistance part A1 is a rectangular grid (not shown in the figure) arranged in a matrix. Each rectangular grid is a resistor element. In the future, the resistance element will be peeled off into a lattice shape.

Please refer to FIGS. 3 and 4, before peeling into a strip wafer A8, the embodiment of the present invention first executes a step of listing the outer edges A42, A52 and the waste portion A2 of the sheet wafer A as the parts to be stripped , And perform a process of folding and stripping off the part to be stripped. After the chip chip A is peeled off the part to be stripped, the chip chip A forms a sheet that includes only the resistor portion A1, the clamping portion A3, and The chip A7 to be stripped on the inner sides A41 and A51. The chip to be stripped A7 in the embodiment of the present invention is peeled off to include a part of the resistance part A1 and the two inner sides Strip wafer A8 at the strip area of A41 and A51.

4, 5~6, the embodiment of the present invention is used on a machine B to peel the chip A7 to be peeled into a strip of chip A8 peeling mechanism C; in implementation As shown in the figure, a table B1 of the same machine B can be arranged in a straight line from left to right along the X axis, including: the peeling mechanism C, a material placing mechanism D, and a folding mechanism E A conveying mechanism F; among them, the peeling mechanism C includes: a swing seat C1 and a push that can be moved forward and backward depending on the transport direction of the wafer A7 to be peeled on the swing seat C1. Clip C2, the front end of the pendulum seat C1 is provided with a positioning device (not shown in the figure), the pendulum seat C1 is driven by a connecting rod C4 driven by an eccentric wheel C3 to drive the pendulum seat C1 to swing up and down, so as to be stripped After the chip A7 is placed on the swing seat C1, the clamping portion A3 at the rear end of the chip to be stripped A7 is clamped by the push clamp C2 and pushed forward along a straight line pushing flow path until the front end of the chip to be stripped A7 is positioned The device is positioned, and the connecting rod C4 is driven by the eccentric wheel C3 to drive the swing seat C1 to swing up and down, so that the part of the chip to be stripped A7 positioned by the positioning device is peeled off into the strip in Figure 4状wafer A8.

In the feeding device of the wafer peeling process: the material placement mechanism D is arranged on the table B1 of the machine B of the conveying path that the linear pushing flow path of the push clamp C2 extends straight back; the material placement The mechanism D is used to stack and position the sheet wafer A that has not been peeled off; the edge folding mechanism E is arranged on the conveying path extending straight backward from the linear pushing flow path of the push clamp C2, and the placing mechanism D And the folding mechanism E can be jointly set on a board B2, so that the two together form a module set on the table B1 of the machine B, and the material placing mechanism D is located on the peeling mechanism C and The edge folding mechanism E; the edge folding mechanism E is used to peel off the outer edges A42, A52 and the scrap part A2 of the sheet-shaped chip A to be peeled off to leave the chip to be peeled A7; the transport mechanism F , Set on the Y-axis side common of the peeling and folding mechanism C, the material placing mechanism D, and the hemming mechanism E, including a rectangular plate-shaped fixing seat F1 erected on the table B1 of the machine B, and its length Extending through the peeling and folding mechanism C, placing mechanism D, and folding mechanism E; the fixed seat F1 is provided with a drive that can be driven for linear displacement in the X axis through the peeling mechanism C, placing mechanism D, and folding mechanism E的提座F2;

Please refer to Figures 5 and 7, the side of the fixing seat F1 of the conveying mechanism F facing away from the peeling mechanism C, material placing mechanism D, and folding mechanism E is the back side F11, facing the peeling mechanism C, material placing One side of the mechanism D and the hemming mechanism E is the inner side F12; the back side F11 of the fixing seat F1 is provided with a horizontal X-axis slide rail F3 near the upper end edge F11; the carrying seat F2 is arranged on a fixing member F21 On a sliding seat F31 of the slide rail F3, the fixing member F21 is held by a belt F41 on the back side F11 of the fixing seat F1 driven by a driving member F4 of the motor such as a motor at the E end of the fixing seat F1. Linked, the X-axis horizontal linear displacement can be made on the slide rail F3. The fixing member F21 extends from the back side F11 of the fixing seat F1 toward the inner side F12 with a straddle F22 extending from the back side F11 to the inner side F12. A sliding cylinder F23 is provided between one end of F22 and the fixing part F21, so that the straddle F22 can be driven on the fixing part F21 to move up and down in the Z-axis direction. Below the other end of the straddle F22 is provided with the straddle F22. A pick-up head F24 that moves in conjunction with a displacement. The bottom surface F241 of the pick-up head F24 is a flat surface and is provided with negative pressure to adsorb the chip wafer A (or the wafer to be stripped A7).

Please refer to Figure 8, the material placement mechanism D is provided with: a ㄇ-shaped seat frame D1 arranged on the seat plate B2 of the table B1, and a warehouse seat D2 arranged on the seat frame D1, the warehouse seat D2 There is a hollowed-out chamber D21. The cross-section of the chamber D21 is approximately a square shape, allowing the chip wafer A to be horizontally flat in the square section of the chamber D21, and the chamber D21 is in A corner seat D22 is provided at each of the four corners. Each corner seat D22 is provided with an inner angle D221 of 90 degrees facing the compartment D21. Each inner corner D221 is provided with a cushion with a convex surface on the two inner sides. D222, the four inner corners D221 are provided for the four corners of the chip chip A to be clamped in it; the chamber D21 is provided with a carrier D23 with an approximately flat upper surface, and a carrier D23 is placed underneath the carrier D23. The lower part of the table B extends through a space D11 in the seat frame D1 and is linked by a lifting rod D24 of the warehouse D21, and the lifting rod D231 is driven by a driving member D241, such as a motor, under the table B1 and the seat plate B2 , So that the carrier D23 can move up and down in the Z-axis in the compartment D21, so that the chip wafer A stacked on the carrier D23 in the compartment D21 can rise successively, so that the uppermost The chip A can be extracted at a fixed height each time; each corner seat D22 is provided with a hollow section D223 between the adjacent sides, and one of the sections D223 is provided outside the section D223. A cleaning nozzle D25 that blows air toward the stage D23 in the chamber D21 in the Y axis and a sensor D26 that can detect the chip wafer A on the stage D23; and a corner seat D22 is provided on the outside Abutment mechanism D27, the abutment mechanism D27 is provided with a fork-shaped abutment seat D271 which can be driven by a driving member D272 to move forward to perform a pairwise program on the chip wafer A. The fork-shaped abutment seat D271 includes Wrap around the two forks D273 of the section D223 on both sides of the corner seat D22 and extend through the two sides of the corner seat D22, and the abutment seat D271 is performed in a direction corresponding to the diagonal line of the chip wafer A on the stage D23 Horizontal displacement causes the two forks D273 to push against an outer side 52 of the chip wafer A and the outer side of the clamping portion A3 respectively, so that the chip wafer A is wrapped around the two forks D273. The inner corner D221 of the corner seat D22 in the diagonal direction of the corner seat D22 abuts against the protruding surface D222, so that the chip chip A bears against the other diagonal end under the driving force in the horizontal diagonal direction Align the position so that the chip wafer A that is extracted each time is maintained at a preset level and positioned for extraction.

Please refer to Figures 9 and 10, the hemming mechanism is provided with an H-shaped seat frame E1 on the seat plate B2, and a square-shaped frame-shaped hemming frame E2 on the seat frame E1; among them, the seat The frame E1 is erected on the upper surface of the seat plate B2 with two side plates E11 and E12 spaced apart. A spacer E13 is horizontally arranged at approximately the center height between the two side plates E11 to separate the space between the two side plates E11 and E12. The first section E14 and the second section E15 located below, and in the first section E14 located above, a drawer-shaped waste box E16 with an opening on the upper side is provided; the folding frame E2 is in the shape of a horizontal frame. The base E21 is set above the seat frame E1, the upper base E21 is provided with a hollowed out discharge area E211, and the two sides of the discharge area E211 are respectively provided below the upper base E21 on the seat frame E1. The two side frames E22 and E23 outside the side plates E11 and E12 are horizontally provided with a lower base E24 passing through the hollow sections E111 and E121 of the side plates E11 and E12 of the seat frame E1 between the lower ends of the two side frames E22 and E23; Z-axis slide rails E112 and E122 are respectively provided outside the two side plates E11 and E12, the slide rail E112 is provided with a slider E113, the slide rail E122 is provided with a slider E123, and the two side frames E22, E23 are respectively Each is fixed with the sliders E113 and E123; the lower base E24 is driven by a driving member E4 under the seat plate B2, so that the entire flange includes the upper base E21, the side frames E22, E23 and the lower base E24 The frame E2 can be within the height range of the hollow sections E111, E121, and the two side frames E22, E23 can be guided by the sliders E113, E123 on the slide rails E112, E122 on the side plates E11, E12 Make the Z-axis up and down displacement; the discharge area E211 of the upper base E21 is provided with two-side folding seats E212, E213, two-side folding seats, which are spaced apart and correspondingly on both sides of the Y-axis. E212 and E213 are respectively provided with first and second folding edges E214, E215 formed by inclined surfaces on the sides facing inward, and a vertical one is respectively formed below the first and second folding edges E214 and E215. The first and second guiding edges E216 and E217 are planar; the discharge area E211 of the upper base E21 is provided with a vertical end folding seat E218 on one side of the X-axis, and the end folding seat E218 is facing the The other side of the discharge zone E211 is provided with a third folding edge E219 constituted by an inclined surface above the third folding edge E219, and a vertical planar third guiding edge E220 is formed below the third folding edge E219; The position of the three-fold abutment edge E219 is lower than the first and second-fold abutment edges E214 and E215, and the end folding seat E218 and the two-side folding seat E212, E213 can be adjusted separately for up and down displacement, the first, Two, three guide edges E216, E217, E220 The enclosed area is smaller than the area of the chip wafer A, but larger than the area of the wafer A7 to be stripped in FIG. 3.

When folding, the pickup head F24 sucks and transfers the sheet wafer A to the top of the hemming frame E2 of the hemming mechanism E, so that the sheet wafer A is located on the first, second, and third folding edges E214 , E215, and E219 are kept at a certain height and remain stationary, while the driving member E4 drives the lower base E23 to move the edge folding frame E2 up and move relative to the chip wafer A to make The upper base E21 of the hemming frame E2 moves up and moves toward the sheet wafer A adsorbed below the pickup head F24.

Please refer to Figures 11 and 12, because the first and second folding edges E213 and E214 are higher than the third folding edge E217, when the folding frame E2 rises from bottom to top, the upper base E21 The upper two side folding seats E212 and E213 first use the first and second folding edges E214 and E215 to abut against the two outer edges A42 and A52, and peel off the two outer edges A42 and A52 of the sheet chip A. ; Then the remaining scrap portion A2 is then touched by the third abutment edge E217 on the end folding seat E216 that is subsequently raised and peeled off; the outer edge A42 of the part to be stripped of the chip chip A is completed, After A52 and the waste part A2 are peeled off, the driving member E4 drives the lower base E23 to move the hemming frame E2 down, and the outer edges A42, A52 and the waste part A2 that are peeled off wait for peeling The removal part will fall through the section enclosed by the end folding seat E216 and the two-side folding seat E212, and fall into the waste box E15 to be collected, and the extraction head F24 will only absorb the remaining part in Figure 3 Strip wafer A7.

Please refer to FIG. 13, the extraction head F24 of the transport mechanism F is moved in the X axis from the peeling mechanism C to the material placement mechanism D in each transport cycle to extract a piece of the outer edge that has not been stripped. A42, A52, and the scrap part A2, and other parts of the chip wafer A to be stripped, and then move to the folding mechanism E for folding. After the folding is completed, the chip to be stripped A7 is directly transported past the set The top of the material mechanism D returns to the peeling mechanism C to peel and break into strip wafers.

The feeding method and device for the wafer peeling and folding process in the embodiment of the present invention, because the machine B uses a transport mechanism F to transport the chip wafer A in the material placement mechanism D to a folding mechanism on the machine B at the same time E, the edge folding mechanism E performs peeling of the chip wafer A at the side portions A4, A5 and the scrap portion A2 to be peeled away to leave the chip to be peeled A7; and the transport mechanism F performs The wafer to be stripped A7 in the folding mechanism E is transported to the stripping mechanism C to be stripped into a strip of wafer A8; therefore, the wafer stripping process is supplied by the original sheet wafer 7 and is stripped to form the strip. The stripping of the chip A7 to the stripping of the chip A8 can be performed consistently and efficiently, and the production capacity can be greatly increased.

However, the foregoing are only preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the description of the invention, All are still within the scope of the invention patent.

A: Chip chip A1: Resistor part A2: Scrap part A3: Clamping part A4: Side part A41: Inner side A42: Outer side A5: Side part A51: Inner side A52: Outer side A6: Line mark A7: chip to be stripped A8: strip chip B: machine B1: table B2: seat plate C: peeling mechanism C1: pendulum seat C2: push clamp C3: eccentric wheel C4: connecting rod D: feeding mechanism D1: seat frame D11: space D2: warehouse seat D21: warehouse D22: corner seat D221: inner corner D222: cushion D223: section D23: carrier D231: lifting rod D24: lifting rod D241: driving part D25: cleaning nozzle D26: Sensor D27: Pushing mechanism D271: Arriving seat D272: Drive part D273: Fork E: Folding mechanism E1: Seat frame E11: Side plate E111: Hollowed section E112: Slide rail E113: Slider E12: Side plate E121: Hollow section E122: Slide rail E123: Slider E13: Spacer E14: First section E15: Second section E16: Waste box E2: Folding frame E21: Upper base E211: Discharge area E212: Side folding seat E213: Side Folding seat E214: First folding edge E215: Second folding edge E216: First leading edge E217: Second leading edge E218: End folding seat E219: Third folding edge E220: Third leading edge E22 : Side frame E23: Side frame E24: Lower base F: Conveying mechanism F1: Fixing seat F11: Upper edge F2: Carrying seat F21: Fixing piece F22: Cross frame F23: Sliding cylinder F24: Extraction head F241: Bottom surface F3: Slide rail F31: Slide

Fig. 1 is a three-dimensional schematic diagram of a chip wafer in an embodiment of the present invention. Figure 2 is an enlarged perspective view of a part of the chip wafer in the embodiment of the present invention. Fig. 3 is a three-dimensional exploded schematic view of the chip wafer in the embodiment of the present invention. Fig. 4 is a three-dimensional exploded schematic diagram of a chip to be stripped in an embodiment of the present invention. FIG. 5 is a three-dimensional schematic diagram of the feeding device of the wafer peeling process in the embodiment of the present invention. FIG. 6 is a schematic front view of the feeding device of the wafer peeling process in the embodiment of the present invention. Figure 7 is a three-dimensional schematic diagram of the transport mechanism in the embodiment of the present invention. Fig. 8 is a three-dimensional schematic diagram of the material placing mechanism in the embodiment of the present invention. Fig. 9 is a three-dimensional schematic diagram of the folding mechanism in the embodiment of the present invention. Figure 10 is a front view of the folding mechanism in the embodiment of the present invention. FIG. 11 is a schematic diagram of the upper base of the hemming mechanism and its upper mechanism and the pick-up head for absorbing sheet wafers in an embodiment of the present invention. Fig. 12 is a schematic diagram of the lifting action of the hemming frame of the hemming mechanism in the embodiment of the present invention. Fig. 13 is a schematic diagram of the conveying action of the conveying mechanism in the embodiment of the present invention.

B: Machine

B1: Countertop

B2: Seat plate

C: Stripping mechanism

C1: Seating

C2: Push clip

D: Feeding mechanism

E: Folding mechanism

F: Transport mechanism

F1: fixed seat

F2: Lift the seat

Claims (19)

A feeding method for a wafer peeling process is used to feed a peeling mechanism for peeling a wafer to be peeled into a strip-shaped wafer on a machine, including: providing a piece of wafer, the wafer The chip is provided with a resistance part, a waste part at one end of the resistance part, and two side parts at both sides of the resistance part; Place the chip wafer on the machine with a material placement mechanism; The chip wafer in the material placement mechanism is transported to a folding mechanism on the machine, and the folding mechanism removes the chip wafer from the side part and the waste part to be stripped, so as to leave the waiting part. Stripping the chip; The conveying mechanism executes the transportation of the chip to be stripped in the folding mechanism to the stripping mechanism for stripping and folding into a strip wafer. For example, the material supply method of the wafer peeling process described in the scope of the patent application, wherein the wafer to be peeled after the edge folding is directly transported over the material placement mechanism and returned to the peeling mechanism for peeling Fold into strip wafers. For example, the feeding method of the wafer peeling process described in the scope of the patent application, wherein, in the feeding mechanism, an abutting mechanism is used to perform a pairwise process on the chip wafer placed therein, so that the chip wafer Under the driving force in the horizontal diagonal direction, align it against the other diagonal end. For the feeding method of the wafer peeling process described in the first item of the scope of patent application, wherein the side edge of the chip wafer includes an inner side adjacent to the resistance part and an outer side adjacent to the outside of the resistance part ; Wherein, the part to be stripped off of the side portion is the outer side. For example, in the feeding method of the wafer peeling process described in item 4 of the scope of patent application, in the hemming mechanism, the outer side edge is peeled off first, and then the waste part is peeled off. For example, the material supply method of the chip peeling process described in the scope of the patent application, wherein a folding frame is used in the folding mechanism to perform relative displacement with the sheet wafer to abut the part to be stripped, and Peel off the part to be peeled off. For example, the feeding method of the wafer peeling process described in the scope of the patent application, wherein the relative displacement is when the sheet wafer is held at a certain height and positioned stationary, and the hemming frame is raised from bottom to top. Peel off the part to be peeled off. For example, the material supply method for the chip peeling process described in item 1 of the scope of patent application, wherein the edge folding mechanism is to peel off the part to be peeled off by contacting with the inclined surface. A feeding device for the wafer peeling process, which is used to feed a peeling mechanism that peels a wafer to be peeled into a strip of wafers on a machine; including: a feeding mechanism with a stacking mechanism A warehouse seat for placing a piece of wafer; a folding mechanism with a folding rack that can peel and fold the piece of wafer into the chip to be stripped; a conveying mechanism that can be driven to move and A lifting seat for transporting the chip wafer and the wafer to be stripped. For example, the material supply device for the chip peeling process described in item 9 of the scope of patent application, wherein the material placing mechanism is provided with a frame, and the warehouse seat is arranged on the seat frame, and the warehouse seat is provided with a hollow warehouse Room, the warehouse is provided with a carrier that can be moved up and down. For example, the feeding device for the chip peeling process described in the scope of the patent application, wherein the bin is provided with a corner seat at each of the four corners, and each corner seat is provided with an inner corner facing the chamber, and the inner corners can be The sheet wafer is correspondingly arranged therein. For example, the feeding device for the chip peeling process described in the scope of patent application, wherein the material placing mechanism is provided with a pushing mechanism, and the pushing mechanism is provided with a pushing seat which can be driven to move forward to push the chip wafer . For example, in the feeding device of the chip peeling process described in the scope of patent application, the edge folding mechanism is provided with a frame, and the edge folding frame is arranged on the seat frame. For example, the supply device for the wafer peeling process described in the scope of the patent application, wherein the seat frame is provided with a spacer between the two side plates at a distance, and the spacer separates the space between the two side plates from the upper The first section and the second section located below, and a waste box is provided in the first section. For example, in the feeding device for the chip peeling process described in item 13 of the scope of patent application, the edge folding frame is provided with two side folding seats and one end folding seat which are spaced apart and correspond to each other. For example, the feeding device for the chip peeling process described in the scope of patent application, wherein the edge folding frame is provided with a horizontal frame-shaped upper base above the base, and the upper base is provided with a hollow discharge Two side frames are respectively provided under the upper base on both sides of the discharge area, and a lower base is horizontally arranged between the lower ends of the two side frames; the two side folding seats and the end folding seats are arranged on the upper base; The lower base is driven by a driving member to make the folding frame move up and down. For example, the feeding device for the chip peeling process described in the scope of the patent application, wherein the two side folding seats are respectively provided with first and second folding edges formed by inclined surfaces on the side facing inward; The end folding seat is provided with a third folding side formed by an inclined surface above one side. For example, in the feeding device for the wafer peeling process described in item 9 of the scope of patent application, the conveying mechanism is provided with a fixed seat, the fixed seat is provided with a horizontal slide rail, and the carrier can move on the slide rail; The carrying seat is extended with a straddle, the straddle can be driven to move up and down, the straddle is provided with an extraction head that moves in conjunction with the straddle, and the extraction head has a negative pressure to absorb the chip or The wafer to be stripped. A feeding device for a wafer peeling process includes: a device for executing the feeding method of the wafer peeling process as described in any one of items 1 to 8 in the scope of the patent application.

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