TWI799415B - Semiconductor device manufacturing method and expandable adhesive tape - Google Patents
Semiconductor device manufacturing method and expandable adhesive tape Download PDFInfo
- Publication number
- TWI799415B TWI799415B TW107117345A TW107117345A TWI799415B TW I799415 B TWI799415 B TW I799415B TW 107117345 A TW107117345 A TW 107117345A TW 107117345 A TW107117345 A TW 107117345A TW I799415 B TWI799415 B TW I799415B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- adhesive tape
- device manufacturing
- expandable adhesive
- expandable
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- H10P72/70—
-
- H10W70/60—
-
- H10W72/0198—
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Dicing (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-101122 | 2017-05-22 | ||
| JP2017101130 | 2017-05-22 | ||
| JP2017-101130 | 2017-05-22 | ||
| JP2017-101127 | 2017-05-22 | ||
| JP2017101127 | 2017-05-22 | ||
| JP2017101122 | 2017-05-22 | ||
| JP2017101120 | 2017-05-22 | ||
| JP2017-101120 | 2017-05-22 | ||
| JP2017-101125 | 2017-05-22 | ||
| JP2017101125 | 2017-05-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201901775A TW201901775A (en) | 2019-01-01 |
| TWI799415B true TWI799415B (en) | 2023-04-21 |
Family
ID=64395633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107117345A TWI799415B (en) | 2017-05-22 | 2018-05-22 | Semiconductor device manufacturing method and expandable adhesive tape |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7173000B2 (en) |
| KR (1) | KR102571926B1 (en) |
| CN (1) | CN110637355B (en) |
| TW (1) | TWI799415B (en) |
| WO (1) | WO2018216621A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020158768A1 (en) * | 2019-01-31 | 2020-08-06 | リンテック株式会社 | Expansion method and semiconductor device production method |
| WO2020170366A1 (en) * | 2019-02-20 | 2020-08-27 | 日立化成株式会社 | Manufacturing method for semiconductor device, and expand tape |
| KR20210019199A (en) * | 2019-08-12 | 2021-02-22 | (주)라이타이저 | Method for manufacturing display apparatus and display apparatus |
| KR102203639B1 (en) * | 2019-08-26 | 2021-01-15 | (주)라이타이저 | Method for manufacturing display apparatus and display apparatus |
| JP7389331B2 (en) * | 2019-10-31 | 2023-11-30 | 日亜化学工業株式会社 | Manufacturing method of light emitting device |
| WO2021102877A1 (en) * | 2019-11-29 | 2021-06-03 | 重庆康佳光电技术研究院有限公司 | Mass transfer carrier plate, mass transfer device, and method for same |
| JP7243606B2 (en) * | 2019-12-10 | 2023-03-22 | Jsr株式会社 | Method for manufacturing display device, method for transferring chip component, and radiation-sensitive composition |
| JP7459576B2 (en) * | 2020-03-12 | 2024-04-02 | 株式会社レゾナック | Panel and manufacturing method thereof, panel manufacturing member and manufacturing method thereof, and semiconductor chip |
| JP7415735B2 (en) * | 2020-03-27 | 2024-01-17 | 株式会社レゾナック | Manufacturing method for semiconductor packages |
| JP7582295B2 (en) * | 2020-03-27 | 2024-11-13 | 株式会社レゾナック | Semiconductor package manufacturing method |
| JP2022030093A (en) * | 2020-08-06 | 2022-02-18 | 昭和電工マテリアルズ株式会社 | Manufacturing method of semiconductor device and expanded tape |
| CN114823456B (en) * | 2021-01-19 | 2025-08-22 | 矽磐微电子(重庆)有限公司 | Transfer jig and chip mounting method |
| CN113571461A (en) * | 2021-07-02 | 2021-10-29 | 矽磐微电子(重庆)有限公司 | Method for forming chip packaging structure |
| WO2023032163A1 (en) * | 2021-09-03 | 2023-03-09 | 株式会社レゾナック | Method for producing semiconductor device, provisional fixation material, and application of provisional fixation material for production of semiconductor device |
| US20250014937A1 (en) * | 2021-09-27 | 2025-01-09 | Resonac Corporation | Method for manufacturing semiconductor device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036060A (en) * | 2012-08-07 | 2014-02-24 | Sharp Corp | Method and apparatus for manufacturing semiconductor device |
| JP2017076748A (en) * | 2015-10-16 | 2017-04-20 | リンテック株式会社 | Adhesive sheet, and method for manufacturing semiconductor device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3299601B2 (en) * | 1993-07-27 | 2002-07-08 | リンテック株式会社 | Adhesive sheet for attaching wafer |
| JP5582836B2 (en) * | 2010-03-26 | 2014-09-03 | 古河電気工業株式会社 | Dicing die bonding tape |
| JP5670249B2 (en) * | 2011-04-14 | 2015-02-18 | 日東電工株式会社 | Light emitting element transfer sheet manufacturing method, light emitting device manufacturing method, light emitting element transfer sheet, and light emitting device |
| JP6052304B2 (en) * | 2012-12-26 | 2016-12-27 | 日立化成株式会社 | Expanding method, semiconductor device manufacturing method, and semiconductor device |
| JP2015177060A (en) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
| CN106796893B (en) * | 2014-08-29 | 2019-09-20 | 住友电木株式会社 | Manufacturing method of semiconductor device and semiconductor device |
| JP6482865B2 (en) * | 2014-12-26 | 2019-03-13 | リンテック株式会社 | Manufacturing method of semiconductor device |
| JP2017005160A (en) * | 2015-06-12 | 2017-01-05 | 古河電気工業株式会社 | Tape for wafer processing |
| JP2017045935A (en) * | 2015-08-28 | 2017-03-02 | 日立化成株式会社 | Manufacturing method for semiconductor device using adhesive sheet and dicing tape |
-
2018
- 2018-05-18 WO PCT/JP2018/019325 patent/WO2018216621A1/en not_active Ceased
- 2018-05-18 CN CN201880033282.1A patent/CN110637355B/en active Active
- 2018-05-18 KR KR1020197031152A patent/KR102571926B1/en active Active
- 2018-05-18 JP JP2019520219A patent/JP7173000B2/en active Active
- 2018-05-22 TW TW107117345A patent/TWI799415B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014036060A (en) * | 2012-08-07 | 2014-02-24 | Sharp Corp | Method and apparatus for manufacturing semiconductor device |
| JP2017076748A (en) * | 2015-10-16 | 2017-04-20 | リンテック株式会社 | Adhesive sheet, and method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20200010203A (en) | 2020-01-30 |
| WO2018216621A1 (en) | 2018-11-29 |
| KR102571926B1 (en) | 2023-08-28 |
| JPWO2018216621A1 (en) | 2020-03-26 |
| TW201901775A (en) | 2019-01-01 |
| CN110637355B (en) | 2023-12-05 |
| JP7173000B2 (en) | 2022-11-16 |
| CN110637355A (en) | 2019-12-31 |
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