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TWI799412B - 半導體裝置及其製造方法 - Google Patents

半導體裝置及其製造方法 Download PDF

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Publication number
TWI799412B
TWI799412B TW107113531A TW107113531A TWI799412B TW I799412 B TWI799412 B TW I799412B TW 107113531 A TW107113531 A TW 107113531A TW 107113531 A TW107113531 A TW 107113531A TW I799412 B TWI799412 B TW I799412B
Authority
TW
Taiwan
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
TW107113531A
Other languages
English (en)
Other versions
TW201843751A (zh
Inventor
本田一尊
佐藤慎
上野恵子
小関裕太
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW201843751A publication Critical patent/TW201843751A/zh
Application granted granted Critical
Publication of TWI799412B publication Critical patent/TWI799412B/zh

Links

Classifications

    • H10W72/071—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H10P95/90—
    • H10W72/072—
    • H10W72/073—
    • H10W72/20—
    • H10W72/30—
    • H10W74/15—
    • H10W90/722—
    • H10W90/732—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW107113531A 2017-04-21 2018-04-20 半導體裝置及其製造方法 TWI799412B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-084658 2017-04-21
JP2017084658 2017-04-21

Publications (2)

Publication Number Publication Date
TW201843751A TW201843751A (zh) 2018-12-16
TWI799412B true TWI799412B (zh) 2023-04-21

Family

ID=63855780

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107113531A TWI799412B (zh) 2017-04-21 2018-04-20 半導體裝置及其製造方法

Country Status (5)

Country Link
JP (2) JP7650621B2 (zh)
KR (2) KR20190142333A (zh)
CN (1) CN110582840A (zh)
TW (1) TWI799412B (zh)
WO (1) WO2018194156A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7619011B2 (ja) 2020-11-13 2025-01-22 株式会社レゾナック 半導体装置の製造方法及びこれに用いられる接着剤
JP2025005536A (ja) * 2023-06-28 2025-01-17 株式会社レゾナック 半導体装置を製造する方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201330217A (zh) * 2011-11-11 2013-07-16 住友電木股份有限公司 半導體裝置之製造方法
TW201333133A (zh) * 2011-12-16 2013-08-16 日立化成工業股份有限公司 接著劑組成物、膜狀接著劑、接著片、連接結構體及連接結構體的製造方法
JP2017045891A (ja) * 2015-08-27 2017-03-02 日立化成株式会社 半導体装置及びそれを製造する方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034542A (ja) * 1989-06-01 1991-01-10 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP4083601B2 (ja) * 2003-03-10 2008-04-30 住友ベークライト株式会社 接着フィルムおよびこれを用いた半導体パッケージならびに半導体装置
JP5217260B2 (ja) 2007-04-27 2013-06-19 住友ベークライト株式会社 半導体ウエハーの接合方法および半導体装置の製造方法
JP2009010057A (ja) * 2007-06-27 2009-01-15 Toray Ind Inc 電子素子の実装方法
JP5130939B2 (ja) * 2008-02-13 2013-01-30 東レ株式会社 半導体用接着組成物およびそれを用いた半導体装置の製造方法
EP2384103A4 (en) 2008-11-06 2014-01-08 Sumitomo Bakelite Co METHOD FOR PRODUCING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE
JP5948723B2 (ja) 2009-10-19 2016-07-06 住友ベークライト株式会社 電子装置の製造方法
JP2012074636A (ja) * 2010-09-29 2012-04-12 Sumitomo Bakelite Co Ltd 接合方法、半導体装置、多層回路基板および電子部品
JP5830847B2 (ja) * 2010-10-21 2015-12-09 富士通株式会社 半導体装置の製造方法及び接合方法
JP5867259B2 (ja) * 2012-04-17 2016-02-24 住友ベークライト株式会社 積層体の製造方法
JP5838903B2 (ja) 2012-04-17 2016-01-06 住友ベークライト株式会社 積層体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201330217A (zh) * 2011-11-11 2013-07-16 住友電木股份有限公司 半導體裝置之製造方法
TW201333133A (zh) * 2011-12-16 2013-08-16 日立化成工業股份有限公司 接著劑組成物、膜狀接著劑、接著片、連接結構體及連接結構體的製造方法
JP2017045891A (ja) * 2015-08-27 2017-03-02 日立化成株式会社 半導体装置及びそれを製造する方法

Also Published As

Publication number Publication date
JPWO2018194156A1 (ja) 2020-02-27
CN110582840A (zh) 2019-12-17
JP2024023787A (ja) 2024-02-21
JP7650621B2 (ja) 2025-03-25
TW201843751A (zh) 2018-12-16
KR20230133407A (ko) 2023-09-19
KR20190142333A (ko) 2019-12-26
JP7670108B2 (ja) 2025-04-30
WO2018194156A1 (ja) 2018-10-25

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