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TWI800509B - 器件晶片的製造方法 - Google Patents

器件晶片的製造方法 Download PDF

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Publication number
TWI800509B
TWI800509B TW107114468A TW107114468A TWI800509B TW I800509 B TWI800509 B TW I800509B TW 107114468 A TW107114468 A TW 107114468A TW 107114468 A TW107114468 A TW 107114468A TW I800509 B TWI800509 B TW I800509B
Authority
TW
Taiwan
Prior art keywords
device wafer
wafer manufacturing
manufacturing
wafer
Prior art date
Application number
TW107114468A
Other languages
English (en)
Other versions
TW201903877A (zh
Inventor
立石俊幸
田淵智隆
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201903877A publication Critical patent/TW201903877A/zh
Application granted granted Critical
Publication of TWI800509B publication Critical patent/TWI800509B/zh

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Classifications

    • H10P54/00—
TW107114468A 2017-06-07 2018-04-27 器件晶片的製造方法 TWI800509B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-112711 2017-06-07
JP2017112711A JP2018207010A (ja) 2017-06-07 2017-06-07 デバイスチップの製造方法

Publications (2)

Publication Number Publication Date
TW201903877A TW201903877A (zh) 2019-01-16
TWI800509B true TWI800509B (zh) 2023-05-01

Family

ID=64573303

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107114468A TWI800509B (zh) 2017-06-07 2018-04-27 器件晶片的製造方法

Country Status (4)

Country Link
JP (1) JP2018207010A (zh)
KR (1) KR20180133808A (zh)
CN (1) CN109003942A (zh)
TW (1) TWI800509B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7319134B2 (ja) * 2019-08-01 2023-08-01 リンテック株式会社 半導体素子の製造方法
JP7500128B2 (ja) * 2020-05-29 2024-06-17 株式会社ディスコ ウェーハの加工方法
KR102580321B1 (ko) * 2021-04-14 2023-09-19 주식회사 루츠 형광체 제조방법
JP2023091141A (ja) * 2021-12-20 2023-06-30 株式会社ディスコ ウエーハの加工方法及びウエーハの加工装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1581443A (zh) * 2003-08-12 2005-02-16 株式会社迪斯科 晶片加工方法
JP2015023135A (ja) * 2013-07-18 2015-02-02 株式会社ディスコ ウエーハの加工方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003158097A (ja) * 2001-11-22 2003-05-30 Murata Mfg Co Ltd 半導体装置及びその製造方法
JP2006344816A (ja) * 2005-06-09 2006-12-21 Matsushita Electric Ind Co Ltd 半導体チップの製造方法
JP2012089721A (ja) * 2010-10-21 2012-05-10 Toshiba Corp 半導体装置の製造方法、半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1581443A (zh) * 2003-08-12 2005-02-16 株式会社迪斯科 晶片加工方法
JP2015023135A (ja) * 2013-07-18 2015-02-02 株式会社ディスコ ウエーハの加工方法

Also Published As

Publication number Publication date
CN109003942A (zh) 2018-12-14
JP2018207010A (ja) 2018-12-27
TW201903877A (zh) 2019-01-16
KR20180133808A (ko) 2018-12-17

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