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TWI799413B - 偏置脈衝cmp溝槽圖案 - Google Patents

偏置脈衝cmp溝槽圖案 Download PDF

Info

Publication number
TWI799413B
TWI799413B TW107116216A TW107116216A TWI799413B TW I799413 B TWI799413 B TW I799413B TW 107116216 A TW107116216 A TW 107116216A TW 107116216 A TW107116216 A TW 107116216A TW I799413 B TWI799413 B TW I799413B
Authority
TW
Taiwan
Prior art keywords
groove pattern
biased pulse
pulse cmp
cmp groove
biased
Prior art date
Application number
TW107116216A
Other languages
English (en)
Other versions
TW201904723A (zh
Inventor
約翰巫 古葉
東尼寬 崔恩
傑弗瑞詹姆士 漢卓恩
傑弗瑞羅伯特 史塔克
Original Assignee
美商羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 美商羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201904723A publication Critical patent/TW201904723A/zh
Application granted granted Critical
Publication of TWI799413B publication Critical patent/TWI799413B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • H10P52/403—
    • H10P72/0402—
    • H10P90/15—
    • H10P95/04—
    • H10P95/06—
    • H10P95/062—
    • H10W20/062—
    • H10W20/092—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW107116216A 2017-06-14 2018-05-13 偏置脈衝cmp溝槽圖案 TWI799413B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201715623166A 2017-06-14 2017-06-14
US15/623166 2017-06-14
US201715625003A 2017-06-16 2017-06-16
US15/625003 2017-06-16
US15/726,027 US10777418B2 (en) 2017-06-14 2017-10-05 Biased pulse CMP groove pattern
US15/726027 2017-10-05

Publications (2)

Publication Number Publication Date
TW201904723A TW201904723A (zh) 2019-02-01
TWI799413B true TWI799413B (zh) 2023-04-21

Family

ID=64457742

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107116216A TWI799413B (zh) 2017-06-14 2018-05-13 偏置脈衝cmp溝槽圖案

Country Status (8)

Country Link
US (2) US10777418B2 (zh)
JP (1) JP7323271B2 (zh)
KR (1) KR102660716B1 (zh)
CN (1) CN109079649B (zh)
DE (1) DE102018004632A1 (zh)
FR (1) FR3067630B1 (zh)
SG (1) SG10201804560VA (zh)
TW (1) TWI799413B (zh)

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* Cited by examiner, † Cited by third party
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KR102059647B1 (ko) * 2018-06-21 2019-12-26 에스케이씨 주식회사 슬러리 유동성이 향상된 연마패드 및 이의 제조방법
US11331767B2 (en) * 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102222851B1 (ko) * 2019-05-29 2021-03-08 한국생산기술연구원 그루브가 형성된 연마용 패드
KR102746090B1 (ko) 2020-03-13 2024-12-26 삼성전자주식회사 Cmp 패드 및 이를 구비하는 화학적 기계적 연마 장치

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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918872A (en) * 1984-05-14 1990-04-24 Kanebo Limited Surface grinding apparatus
TW200640616A (en) * 2005-05-24 2006-12-01 Hynix Semiconductor Inc Polishing pad and chemical mechanical polishing apparatus using the same
TW200726573A (en) * 2005-09-16 2007-07-16 Jsr Corp Method of manufacturing chemical mechanical polishing pad
TW200815103A (en) * 2006-08-30 2008-04-01 Rohm & Haas Elect Mat CMP pad having overlaid constant area spiral grooves

Also Published As

Publication number Publication date
SG10201804560VA (en) 2019-01-30
KR102660716B1 (ko) 2024-04-26
CN109079649B (zh) 2020-11-17
US20200381258A1 (en) 2020-12-03
CN109079649A (zh) 2018-12-25
US10777418B2 (en) 2020-09-15
KR20180136376A (ko) 2018-12-24
TW201904723A (zh) 2019-02-01
FR3067630B1 (fr) 2022-04-01
FR3067630A1 (fr) 2018-12-21
US20180366333A1 (en) 2018-12-20
JP2019022931A (ja) 2019-02-14
JP7323271B2 (ja) 2023-08-08
DE102018004632A1 (de) 2018-12-20

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