TWI799473B - 顯示面板及其製造方法 - Google Patents
顯示面板及其製造方法 Download PDFInfo
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- TWI799473B TWI799473B TW107142801A TW107142801A TWI799473B TW I799473 B TWI799473 B TW I799473B TW 107142801 A TW107142801 A TW 107142801A TW 107142801 A TW107142801 A TW 107142801A TW I799473 B TWI799473 B TW I799473B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3266—Details of drivers for scan electrodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3275—Details of drivers for data electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0162011 | 2017-11-29 | ||
| KR1020170162011A KR102606570B1 (ko) | 2017-11-29 | 2017-11-29 | 표시패널 및 그 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201926756A TW201926756A (zh) | 2019-07-01 |
| TWI799473B true TWI799473B (zh) | 2023-04-21 |
Family
ID=64559597
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107142801A TWI799473B (zh) | 2017-11-29 | 2018-11-29 | 顯示面板及其製造方法 |
| TW112109838A TWI841300B (zh) | 2017-11-29 | 2018-11-29 | 顯示面板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112109838A TWI841300B (zh) | 2017-11-29 | 2018-11-29 | 顯示面板 |
Country Status (5)
| Country | Link |
|---|---|
| US (5) | US10665617B2 (zh) |
| EP (2) | EP3493285B1 (zh) |
| KR (2) | KR102606570B1 (zh) |
| CN (2) | CN109841659B (zh) |
| TW (2) | TWI799473B (zh) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102606570B1 (ko) | 2017-11-29 | 2023-11-30 | 삼성디스플레이 주식회사 | 표시패널 및 그 제조방법 |
| KR102706723B1 (ko) * | 2018-03-07 | 2024-09-20 | 삼성디스플레이 주식회사 | 표시 패널 및 그 제조 방법 |
| CN109065505B (zh) * | 2018-08-10 | 2021-01-15 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其制造方法 |
| CN109494313A (zh) * | 2018-10-15 | 2019-03-19 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板及其制作方法 |
| KR102620972B1 (ko) * | 2018-10-23 | 2024-01-05 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| CN109168250B (zh) * | 2018-10-24 | 2020-04-17 | 合肥鑫晟光电科技有限公司 | 一种电路板及其制作方法、使用方法、显示装置 |
| CN109686758A (zh) * | 2018-12-04 | 2019-04-26 | 武汉华星光电半导体显示技术有限公司 | 一种柔性显示面板及其制备方法 |
| CN109671724B (zh) * | 2018-12-21 | 2020-11-24 | 武汉华星光电半导体显示技术有限公司 | 发光面板及显示装置 |
| CN109817680B (zh) * | 2019-01-31 | 2021-03-16 | 武汉华星光电半导体显示技术有限公司 | 柔性基板以及显示面板 |
| KR102777238B1 (ko) * | 2019-04-02 | 2025-03-06 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN110311051A (zh) * | 2019-06-19 | 2019-10-08 | 武汉华星光电半导体显示技术有限公司 | 显示面板及其制备方法、显示装置 |
| KR102658007B1 (ko) * | 2019-07-30 | 2024-04-17 | 삼성디스플레이 주식회사 | 표시패널, 이에 포함되는 박막 트랜지스터, 및 이의 제조 방법 |
| KR102736209B1 (ko) * | 2019-08-07 | 2024-12-03 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN110610948B (zh) * | 2019-08-30 | 2021-05-07 | 武汉华星光电半导体显示技术有限公司 | 阵列基板及显示装置 |
| KR20210027641A (ko) * | 2019-08-30 | 2021-03-11 | 삼성디스플레이 주식회사 | 표시패널 |
| CN110649068A (zh) * | 2019-09-02 | 2020-01-03 | 武汉华星光电半导体显示技术有限公司 | 一种阵列基板及其制备方法 |
| KR102714129B1 (ko) | 2019-09-27 | 2024-10-10 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조방법 |
| JP7585602B2 (ja) * | 2019-11-11 | 2024-11-19 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
| CN111106261B (zh) * | 2019-12-06 | 2021-02-26 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
| KR102907068B1 (ko) * | 2019-12-17 | 2026-01-06 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN111834400B (zh) * | 2020-02-26 | 2021-10-12 | 昆山国显光电有限公司 | 显示面板及其制造方法、显示装置 |
| WO2021189669A1 (zh) * | 2020-03-23 | 2021-09-30 | 京东方科技集团股份有限公司 | 显示基板及其制备方法、显示母板和显示装置 |
| CN111613624B (zh) * | 2020-05-18 | 2022-08-05 | 武汉华星光电半导体显示技术有限公司 | 阵列基板及其制备方法 |
| CN111627965A (zh) * | 2020-05-26 | 2020-09-04 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板及显示装置 |
| WO2022041240A1 (zh) * | 2020-08-31 | 2022-03-03 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
| KR20220097678A (ko) | 2020-12-30 | 2022-07-08 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
| WO2024087198A1 (zh) * | 2022-10-28 | 2024-05-02 | 京东方科技集团股份有限公司 | 一种显示面板及显示装置 |
| KR20240083253A (ko) * | 2022-12-02 | 2024-06-12 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201619673A (zh) * | 2014-11-20 | 2016-06-01 | 群創光電股份有限公司 | 顯示面板 |
| CN107305305A (zh) * | 2016-04-22 | 2017-10-31 | 三星显示有限公司 | 显示装置 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6861711B2 (en) | 2003-01-03 | 2005-03-01 | Micrel, Incorporated | Thick gate oxide transistor and electrostatic discharge protection utilizing thick gate oxide transistors |
| KR101100999B1 (ko) | 2009-01-13 | 2011-12-29 | 삼성모바일디스플레이주식회사 | 씨모스 박막트랜지스터 및 그 제조방법과 이를 구비한 유기전계발광 표시장치 |
| KR101048965B1 (ko) | 2009-01-22 | 2011-07-12 | 삼성모바일디스플레이주식회사 | 유기 전계발광 표시장치 |
| JP2013012610A (ja) * | 2011-06-29 | 2013-01-17 | Dainippon Printing Co Ltd | 薄膜トランジスタおよびその製造方法 |
| US20150206977A1 (en) | 2012-06-19 | 2015-07-23 | Sharp Kabushiki Kaisha | Metal oxide transistor |
| KR102222680B1 (ko) * | 2013-02-01 | 2021-03-03 | 엘지디스플레이 주식회사 | 플렉서블 디스플레이 기판, 플렉서블 유기 발광 표시 장치 및 플렉서블 유기 발광 표시 장치 제조 방법 |
| US9818765B2 (en) * | 2013-08-26 | 2017-11-14 | Apple Inc. | Displays with silicon and semiconducting oxide thin-film transistors |
| KR102203100B1 (ko) * | 2013-10-30 | 2021-01-15 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102227474B1 (ko) * | 2013-11-05 | 2021-03-15 | 삼성디스플레이 주식회사 | 박막트랜지스터 어레이 기판, 유기발광표시장치 및 박막트랜지스터 어레이 기판의 제조 방법 |
| WO2015170450A1 (ja) * | 2014-05-09 | 2015-11-12 | 株式会社Joled | 薄膜トランジスタ基板及びその製造方法 |
| US9543370B2 (en) * | 2014-09-24 | 2017-01-10 | Apple Inc. | Silicon and semiconducting oxide thin-film transistor displays |
| KR102405257B1 (ko) | 2015-01-28 | 2022-06-03 | 삼성디스플레이 주식회사 | 표시 장치 |
| US9685469B2 (en) * | 2015-04-03 | 2017-06-20 | Apple Inc. | Display with semiconducting oxide and polysilicon transistors |
| KR102408898B1 (ko) | 2015-06-19 | 2022-06-16 | 엘지디스플레이 주식회사 | 박막 트랜지스터 기판 및 이를 이용한 표시장치 |
| KR102439841B1 (ko) * | 2015-08-31 | 2022-09-01 | 엘지디스플레이 주식회사 | 액정 표시장치 |
| KR102455318B1 (ko) * | 2015-10-30 | 2022-10-18 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| KR102414593B1 (ko) | 2015-12-30 | 2022-06-30 | 엘지디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
| TWI739796B (zh) | 2016-02-12 | 2021-09-21 | 日商半導體能源硏究所股份有限公司 | 半導體裝置及電子裝置及半導體晶圓 |
| JP6970511B2 (ja) | 2016-02-12 | 2021-11-24 | 株式会社半導体エネルギー研究所 | トランジスタ |
| KR102639568B1 (ko) * | 2016-03-11 | 2024-02-26 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 그 제조 방법 |
| TWI740908B (zh) | 2016-03-11 | 2021-10-01 | 南韓商三星顯示器有限公司 | 顯示設備 |
| KR102514411B1 (ko) * | 2016-03-31 | 2023-03-28 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 그 제조방법 |
| JP6756508B2 (ja) * | 2016-04-04 | 2020-09-16 | 株式会社ジャパンディスプレイ | 表示装置 |
| US10249695B2 (en) | 2017-03-24 | 2019-04-02 | Apple Inc. | Displays with silicon and semiconducting-oxide top-gate thin-film transistors |
| KR102432360B1 (ko) | 2017-10-13 | 2022-08-16 | 삼성디스플레이 주식회사 | 표시패널 및 그 제조방법 |
| CN107818991B (zh) | 2017-10-23 | 2020-06-05 | 京东方科技集团股份有限公司 | 一种阵列基板及其制备方法、显示面板 |
| US10847596B2 (en) | 2017-11-10 | 2020-11-24 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Bendable display panel and fabricating method thereof |
| KR102606570B1 (ko) | 2017-11-29 | 2023-11-30 | 삼성디스플레이 주식회사 | 표시패널 및 그 제조방법 |
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2017
- 2017-11-29 KR KR1020170162011A patent/KR102606570B1/ko active Active
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2018
- 2018-09-24 US US16/139,512 patent/US10665617B2/en active Active
- 2018-11-29 TW TW107142801A patent/TWI799473B/zh active
- 2018-11-29 CN CN201811444980.9A patent/CN109841659B/zh active Active
- 2018-11-29 EP EP18209266.8A patent/EP3493285B1/en active Active
- 2018-11-29 CN CN202510622684.7A patent/CN120500112A/zh active Pending
- 2018-11-29 TW TW112109838A patent/TWI841300B/zh active
- 2018-11-29 EP EP24210244.0A patent/EP4481822A3/en active Pending
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2020
- 2020-05-26 US US16/882,926 patent/US11127766B2/en active Active
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2021
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2023
- 2023-11-20 US US18/514,930 patent/US12136631B2/en active Active
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- 2024-10-11 US US18/913,255 patent/US20250040251A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201619673A (zh) * | 2014-11-20 | 2016-06-01 | 群創光電股份有限公司 | 顯示面板 |
| CN107305305A (zh) * | 2016-04-22 | 2017-10-31 | 三星显示有限公司 | 显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4481822A2 (en) | 2024-12-25 |
| US10665617B2 (en) | 2020-05-26 |
| KR102906856B1 (ko) | 2026-01-05 |
| KR102606570B1 (ko) | 2023-11-30 |
| US20200328233A1 (en) | 2020-10-15 |
| US20190164998A1 (en) | 2019-05-30 |
| US20210399021A1 (en) | 2021-12-23 |
| KR20190063502A (ko) | 2019-06-10 |
| CN109841659A (zh) | 2019-06-04 |
| US12136631B2 (en) | 2024-11-05 |
| TWI841300B (zh) | 2024-05-01 |
| CN120500112A (zh) | 2025-08-15 |
| EP3493285A1 (en) | 2019-06-05 |
| US20250040251A1 (en) | 2025-01-30 |
| CN109841659B (zh) | 2025-06-10 |
| EP4481822A3 (en) | 2025-03-05 |
| KR20230167329A (ko) | 2023-12-08 |
| TW201926756A (zh) | 2019-07-01 |
| TW202343848A (zh) | 2023-11-01 |
| US11824065B2 (en) | 2023-11-21 |
| US11127766B2 (en) | 2021-09-21 |
| US20240088167A1 (en) | 2024-03-14 |
| EP3493285B1 (en) | 2024-11-06 |
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