以下,對本發明之實施形態之一例進行說明。但本發明並不受下述實施形態所限制。
[本黏著片材積層體]
本發明之實施形態之一例的黏著片材積層體(稱為「本黏著片材積層體」)如圖1所示,係具備黏著材層、以可剝離之方式積層於該黏著材層之正面及背面之一側而成之被覆部I、及以可剝離之方式積層於該黏著材層之正面及背面之另一側而成之被覆部II的黏著片材積層體。此處,被覆部II為任意,亦可採用不積層被覆部II之構成。
<黏著材層>
本黏著片材積層體之黏著材層只要為若將被覆部I及被覆部II剝離則可作為雙面黏著片材而發揮功能,且具有若加熱則會柔軟化或熔融之熱熔性者即可。
黏著材層較佳為於100℃下之損耗正切tanδ(SA)為1.0以上。又,較佳為於30℃下之損耗正切tanδ(SB)未達1.0。
此處,損耗正切tanδ意指損耗彈性模數G''與儲存彈性模數G'之比(G''/G')。
由於將本黏著片材積層體進行加熱成型時之溫度通常為70~120℃,故而若於100℃下之損耗正切tanδ(SA)為1.0以上,則變得容易於黏著材層表面成型凹凸形狀。
又,若黏著材層於30℃下之損耗正切tanδ(SB)未達1.0,則於常態下可保持形狀,因此可保持於黏著材層表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀之狀態。
通常高分子材料兼具黏性性質與彈性性質,損耗正切tanδ為1.0以上,進而其值越大,黏性性質越強。另一方面,損耗正切tanδ未達1.0,進而其值越小,彈性性質越強。因此,藉由控制黏著材層於不同溫度下之損耗正切tanδ,可兼具成形性與形狀保持性。
就該觀點而言,黏著材層於100℃下之損耗正切tanδ(SA)較佳為1.0以上,其中較佳為1.5以上或30以下,其中較佳為3.0以上或20以下。
另一方面,黏著材層於30℃下之損耗正切tanδ(SB)較佳為未達1.0,其中較佳為0.01以上或0.9以下,其中較佳為0.1以上或0.8以下。
此處,黏著材層於100℃下之損耗正切tanδ(SA)及於30℃下之損耗正切tanδ(SB)可藉由調整構成黏著材層之組合物之成分或凝膠分率、重量平均分子量等而調整為上述範圍。
進而,黏著材層於100℃下之儲存彈性模數G'(SA)較佳為未達1.0×104
Pa。又,上述黏著材層於30℃下之儲存彈性模數G'(SB)較佳為1.0×104
Pa以上。
若黏著材層於100℃下之儲存彈性模數G'(SA)未達1.0×104
Pa,則可獲得充分之成形性,故而較佳,另一方面,若黏著材層於30℃下之儲存彈性模數G'(SB)為1.0×104
Pa以上,則就成形後之形狀穩定性之觀點而言較佳。
就該觀點而言,黏著材層於100℃下之儲存彈性模數G'(SA)較佳為未達1.0×104
Pa,其中進而較佳為5.0×101
Pa以上或5.0×103
Pa以下,其中進而較佳為1.0×102
Pa以上或1.0×103
Pa以下。
據此,黏著材層於100℃下之儲存彈性模數G'(SA)更佳為5.0×101
Pa以上且未達1.0×104
Pa,或為5.0×101
Pa以上且5.0×103
Pa以下,其中進而較佳為1.0×102
Pa以上且未達1.0×104
Pa,或為1.0×102
Pa以上且5.0×103
Pa以下,最佳為1.0×102
Pa以上且1.0×103
Pa以下。
又,就該觀點而言,黏著材層於30℃下之儲存彈性模數G'(SB)較佳為1.0×104
Pa以上,其中進而較佳為2.0×104
Pa以上或1.0×107
Pa以下,其中進而較佳為5.0×104
Pa以上或1.0×106
Pa以下。
又,據此,黏著材層於30℃下之儲存彈性模數G'(SB)更佳為1.0×104
Pa以上且1.0×107
Pa以下,或為1.0×104
Pa以上且1.0×106
Pa以下,其中更佳為2.0×104
Pa以上且1.0×107
Pa以下,或為2.0×104
Pa以上且1.0×106
Pa以下,最佳為5.0×104
Pa以上且1.0×106
Pa以下。
此處,黏著材層於100℃下之儲存彈性模數G'(SA)及黏著材層於30℃下之儲存彈性模數G'(SB)可藉由調整構成黏著材層之組合物之成分或凝膠分率、重量平均分子量等而調整為上述範圍。
黏著材層之損耗正切tanδ成為1.0之溫度較佳為50~150℃,其中進而較佳為60℃以上或130℃以下,其中進而較佳為70℃以上或110℃以下。
若黏著材層之損耗正切tanδ成為1.0之溫度為50~150℃,則可藉由預先將本黏著片材積層體加熱為50~150℃而進行模具成形。
黏著材層之基礎樹脂之玻璃轉移溫度(Tg)較佳為-50~40℃,其中進而較佳為-30℃以上或25℃以下,其中進而較佳為-10℃以上或20℃以下。此處,玻璃轉移溫度之測定係指使用示差掃描熱量計(DSC)而以3℃/分鐘之速度升溫時的基線移動之反曲點間之中點。
若黏著材層之基礎樹脂之玻璃轉移溫度(Tg)為上述範圍,則可對黏著材層賦予黏著性,進而,可將黏著材層之損耗正切tanδ成為1.0之溫度調整為50~150℃。
作為黏著材層之材料,只要為可製備為特定黏彈性行為之材料,則可使用先前公知之黏著片材。
例如可列舉:1)使用(甲基)丙烯酸酯系聚合物(為包括共聚物在內之含義,以下稱為「丙烯酸酯系(共)聚合物」)作為基礎樹脂,於其中調配交聯單體、視需要調配交聯起始劑或反應觸媒等,使其等進行交聯反應所形成之黏著片材;或
2)使用丁二烯或異戊二烯系共聚物作為基礎樹脂,於其中調配交聯單體、視需要調配交聯起始劑或反應觸媒等,使其等進行交聯反應所形成之黏著片材;或
3)使用聚矽氧系聚合物作為基礎樹脂,於其中調配交聯單體、視需要調配交聯起始劑或反應觸媒等,使其等進行交聯反應所形成之黏著片材;或
4)使用聚胺基甲酸酯系聚合物作為基礎樹脂之聚胺基甲酸酯系黏著片材等。
黏著材層本身之物性中除了上述之黏彈性性質或熱性質以外,於本發明中並非本質上之問題。但就黏著性、透明性、及耐候性等觀點而言,較佳為以上述1)之丙烯酸酯系(共)聚合物作為基礎樹脂者。
於要求電氣特性、低折射率等性能之情形時,較佳為以上述2)之丁二烯或異戊二烯系共聚物作為基礎樹脂者。
於要求耐熱性、較廣之溫度範圍中之橡膠彈性等性能之情形時,較佳為以上述3)之聚矽氧系共聚物作為基礎樹脂者。
於要求再剝離性等性能之情形時,較佳為以上述4)之聚胺基甲酸酯系聚合物作為基礎樹脂者。
作為上述黏著材層之一例,可例示由含有作為基礎樹脂之(甲基)丙烯酸系共聚物(a)、交聯劑(b)、及光聚合起始劑(c)之樹脂組合物所形成之黏著片材。
於該情形時,必須於未交聯狀態、即形成立體地交聯之網狀結構前之狀態下滿足上述黏彈性特性。就該觀點而言,黏著材層之凝膠分率較佳為40%以下。
若黏著材層之凝膠分率為40%以下,則可將構成黏著材層之分子鏈彼此之鍵結抑制於適當之範圍,故而於成形為賦形黏著片材積層體時可具備適度之流動性。
就該觀點而言,黏著材層之凝膠分率較佳為40%以下,其中尤佳為20%以下,其中尤佳為10%以下。再者,黏著材層之凝膠分率之下限並無限定,亦可為0%。
再者,上述黏著材層之凝膠分率並不限於使用含有作為基礎樹脂之(甲基)丙烯酸系共聚物(a)、交聯劑(b)、及光聚合起始劑(c)之樹脂組合物之情形,使用其他樹脂組合物作為黏著材層之情形時亦相同。
((甲基)丙烯酸系共聚物(a))
(甲基)丙烯酸系共聚物(a)可根據用於使其聚合之丙烯酸系單體或甲基丙烯酸系單體之種類、組成比率、進而聚合條件等而適當調整玻璃轉移溫度(Tg)等特性。
作為用於使丙烯酸酯聚合物聚合之丙烯酸系單體或甲基丙烯酸系單體,例如可列舉:丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸乙酯、甲基丙烯酸甲酯等。亦可使用使該等與親水基或有機官能基等共聚合而成之乙酸乙烯酯、丙烯酸羥基乙酯、丙烯酸、丙烯酸縮水甘油酯、丙烯醯胺、丙烯腈、甲基丙烯腈、氟丙烯酸酯、聚矽氧丙烯酸酯等。
丙烯酸酯聚合物中尤佳為(甲基)丙烯酸烷基酯系共聚物。
作為用於形成(甲基)丙烯酸烷基酯系共聚物之(甲基)丙烯酸酯、即丙烯酸烷基酯或甲基丙烯酸烷基酯成分,較佳為烷基為正辛基、異辛基、2-乙基己基、正丁基、異丁基、甲基、乙基、異丙基中之任一者之丙烯酸烷基酯或甲基丙烯酸烷基酯之1種或者選自該等之2種以上之混合物。
作為其他成分,亦可使具有羧基、羥基、縮水甘油基等有機官能基之丙烯酸酯或甲基丙烯酸酯進行共聚合。具體而言,可以適當地選擇性地組合上述(甲基)丙烯酸烷基酯成分與具有有機官能基之(甲基)丙烯酸酯成分而成之單體成分作為起始原料進行加熱聚合,而獲得(甲基)丙烯酸酯系共聚物聚合物。
其中,較佳可列舉丙烯酸異辛酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸2-乙基己酯等丙烯酸烷基酯之1種或選自該等之2種以上之混合物,或者可列舉使丙烯酸異辛酯、丙烯酸正辛酯、丙烯酸正丁酯、丙烯酸2-乙基己酯等中之至少1種以上與丙烯酸進行共聚合而成者。
作為使用該等單體之聚合處理,可採用溶液聚合、乳化聚合、塊狀聚合、懸浮聚合等公知之聚合方法,此時根據聚合方法而使用熱聚合起始劑或光聚合起始劑等聚合起始劑,藉此可獲得丙烯酸酯共聚物。
(丙烯酸系共聚物(A1))
作為黏著材層之較佳之基礎聚合物之一例,可列舉包含具有巨單體作為支鏈成分之接枝共聚物之(甲基)丙烯酸系共聚物(A1)。
若以上述丙烯酸系共聚物(A1)作為基礎樹脂而構成黏著材層,則黏著材層可於室溫狀態下保持片材狀並且表現出自黏性,具有若於未交聯狀態下加熱則會熔融或流動之熱熔性,進而,可使其光硬化,光硬化後可使其發揮優異之凝聚力而使其接著。
因此,若使用丙烯酸系共聚物(A1)作為黏著材層之基礎聚合物,則即使為未交聯狀態,亦於室溫(20℃)下表現出黏著性,且具有若加熱為50~100℃、更佳為60℃以上或90℃以下之溫度則會軟化或流動化之性質。
構成上述丙烯酸系共聚物(A1)之主鏈成分之共聚物之玻璃轉移溫度較佳為-70~0℃。
此時,所謂構成主鏈成分之共聚物成分之玻璃轉移溫度係指僅使組成丙烯酸系共聚物(A1)之主鏈成分之單體成分進行共聚合所獲得之聚合物之玻璃轉移溫度。具體而言,意指根據由該共聚物各成分之均聚物所獲得之聚合物之玻璃轉移溫度與構成比率,藉由Fox之計算式所算出之值。
再者,所謂Fox之計算式係藉由以下之式求出之計算值,可使用聚合物手冊[Polymer HandBook, J.Brandrup, Interscience, 1989]所記載之值而求出。
1/(273+Tg)=Σ(Wi/(273+Tgi))
[式中,Wi表示單體i之重量分率,Tgi表示單體i之均聚物之Tg(℃)]
由於構成上述丙烯酸系共聚物(A1)之主鏈成分之共聚物成分之玻璃轉移溫度會影響到室溫狀態下之黏著材層之柔軟性、或黏著材層對被黏著體之潤濕性、即接著性,因此為了黏著材層於室溫狀態下獲得適度之接著性(黏性),該玻璃轉移溫度較佳為-70℃~0℃,其中尤佳為-65℃以上或-5℃以下,其中尤佳為-60℃以上或-10℃以下。
但即使該共聚物成分之玻璃轉移溫度為相同之溫度,亦可藉由調整分子量而調整黏彈性。例如藉由減小共聚物成分之分子量,可使其進一步柔軟化。
作為上述丙烯酸系共聚物(A1)之主鏈成分所含之(甲基)丙烯酸酯單體,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸2-苯氧基乙酯、丙烯酸3,5,5-三甲基環己酯、對異丙苯基苯酚EO改性(甲基)丙烯酸酯、(甲基)丙烯酸雙環戊酯、(甲基)丙烯酸雙環戊烯酯、(甲基)丙烯酸雙環戊烯氧基乙酯、(甲基)丙烯酸苄酯等。該等亦可使用:具有親水基或有機官能基等之(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸甘油酯等含羥基之(甲基)丙烯酸酯;或(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基丁二酸、2-(甲基)丙烯醯氧基丙基丁二酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸、順丁烯二酸單甲酯、伊康酸單甲酯等含羧基單體;順丁烯二酸酐、伊康酸酐等含酸酐基單體;(甲基)丙烯酸縮水甘油酯、α-乙基丙烯酸縮水甘油酯、(甲基)丙烯酸3,4-環氧丁酯等含環氧基單體;(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯等含胺基之(甲基)丙烯酸酯系單體;(甲基)丙烯醯胺、N-第三丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-甲氧基甲基(甲基)丙烯醯胺、N-丁氧基甲基(甲基)丙烯醯胺、雙丙酮丙烯醯胺、順丁烯二醯胺、順丁烯二醯亞胺等含有醯胺基之單體;乙烯基吡咯啶酮、乙烯基吡啶、乙烯基咔唑等雜環系鹼性單體等。
又,亦可適當地使用能夠與上述丙烯酸系單體或甲基丙烯酸系單體共聚合之苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、乙烯基甲苯、丙烯腈、甲基丙烯腈、乙酸乙烯酯、丙酸乙烯酯、烷基乙烯醚、羥基烷基乙烯醚、烷基乙烯基單體等各種乙烯基單體。
又,丙烯酸系共聚物(A1)之主鏈成分較佳為含有疏水性之(甲基)丙烯酸酯單體與親水性之(甲基)丙烯酸酯單體作為構成單元。
若丙烯酸系共聚物(A1)之主鏈成分僅由疏水性單體構成,則可觀察到濕熱白化之傾向,故而較佳為亦將親水性單體導入至主鏈成分中而防止濕熱白化。
具體而言,作為上述丙烯酸系共聚物(A1)之主鏈成分,可列舉疏水性之(甲基)丙烯酸酯單體、親水性之(甲基)丙烯酸酯單體、及巨單體之末端之聚合性官能基進行無規共聚合而成之共聚物成分。
此處,作為上述之疏水性之(甲基)丙烯酸酯單體,例如可列舉:(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸雙環戊烯氧基乙酯、甲基丙烯酸甲酯。
又,作為疏水性之乙烯基單體,可列舉:乙酸乙烯酯、苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、乙烯基甲苯、烷基乙烯基單體等。
作為上述親水性之(甲基)丙烯酸酯單體,例如可列舉:丙烯酸甲酯、(甲基)丙烯酸、(甲基)丙烯酸四氫糠酯;或(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸甘油酯等含羥基之(甲基)丙烯酸酯;或(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基順丁烯二酸、2-(甲基)丙烯醯氧基丙基順丁烯二酸、2-(甲基)丙烯醯氧基乙基丁二酸、2-(甲基)丙烯醯氧基丙基丁二酸、丁烯酸、反丁烯二酸、順丁烯二酸、伊康酸、順丁烯二酸單甲酯、伊康酸單甲酯等含羧基單體;順丁烯二酸酐、伊康酸酐等含酸酐基單體;(甲基)丙烯酸縮水甘油酯、α-乙基丙烯酸縮水甘油酯、(甲基)丙烯酸3,4-環氧丁酯等含環氧基單體;甲氧基聚乙二醇(甲基)丙烯酸酯等烷氧基聚伸烷基二醇(甲基)丙烯酸酯;N,N-二甲基丙烯醯胺、羥基乙基丙烯醯胺等等。
丙烯酸系共聚物(A1)較佳為導入巨單體作為接枝共聚物之支鏈成分,而含有源自巨單體之重複單元。
所謂巨單體係具有末端之聚合性官能基與高分子量骨架成分之高分子單體。
巨單體之玻璃轉移溫度(Tg)較佳為高於構成上述丙烯酸系共聚物(A1)之共聚物成分之玻璃轉移溫度。
具體而言,由於巨單體之玻璃轉移溫度(Tg)會影響到黏著材層2之加熱熔融溫度(熱熔溫度),因此巨單體之玻璃轉移溫度(Tg)較佳為30℃~120℃,其中進而較佳為40℃以上或110℃以下,其中進而較佳為50℃以上或100℃以下。
若為此種玻璃轉移溫度(Tg),則可藉由調整分子量而保持優異之加工性或保管穩定性,並且可以於80℃附近熱熔之方式加以調整。
所謂巨單體之玻璃轉移溫度係指該巨單體本身之玻璃轉移溫度,可藉由示差掃描熱量計(DSC)進行測定。
又,為了達成於室溫狀態下可維持支鏈成分彼此相互拉近,作為黏著劑組合物進行物理性交聯之狀態,並且藉由加熱至適度之溫度可使上述物理性交聯解開而獲得流動性,亦較佳為調整巨單體之分子量或含量。
就該觀點而言,巨單體較佳為以5質量%~30質量%之比例含有於丙烯酸系共聚物(A1)中,其中較佳為6質量%以上或25質量%以下,其中較佳為8質量%以上或20質量%以下。
又,巨單體之數量平均分子量較佳為500以上且未達8000,其中較佳為800以上或未達7500,其中較佳為1000以上或未達7000。
巨單體可適當使用通常製造者(例如東亞合成公司製造之巨單體等)。
巨單體之高分子量骨架成分較佳為包含丙烯酸系聚合物或乙烯系聚合物。
作為上述巨單體之高分子量骨架成分,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸庚酯、丙烯酸2-乙基己酯、丙烯酸正辛酯、丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸鯨蠟酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異𦯉基酯、(甲基)丙烯酸2-苯氧基乙酯、丙烯酸3,5,5-三甲基環己酯、對異丙苯基苯酚EO改性(甲基)丙烯酸酯、(甲基)丙烯酸雙環戊酯、(甲基)丙烯酸雙環戊烯酯、(甲基)丙烯酸雙環戊烯氧基乙酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸羥基烷基酯、(甲基)丙烯酸、(甲基)丙烯酸縮水甘油酯、(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、(甲基)丙烯腈、(甲基)丙烯酸烷氧基烷基酯、烷氧基聚伸烷基二醇(甲基)丙烯酸酯等(甲基)丙烯酸酯單體;或苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、乙烯基甲苯、烷基乙烯基單體、乙酸乙烯酯、烷基乙烯醚、羥基烷基乙烯醚等各種乙烯基單體,該等可單獨使用或組合2種以上使用。
作為上述巨單體之末端聚合性官能基,例如可列舉:甲基丙烯醯基、丙烯醯基、乙烯基等。
(交聯劑(b))
交聯劑(b)可使用於使丙烯酸酯聚合物交聯時所使用之交聯單體。例如可列舉具有選自(甲基)丙烯醯基、環氧基、異氰酸酯基、羧基、羥基、碳二醯亞胺基、㗁唑啉基、氮丙啶基、乙烯基、胺基、亞胺基、醯胺基中之至少1種交聯性官能基之交聯劑,可使用1種或組合2種以上使用。
再者,上述交聯性官能基亦可經能夠去保護之保護基保護。
其中,可較佳地使用:具有2個以上(甲基)丙烯醯基之多官能(甲基)丙烯酸酯;具有2個以上異氰酸酯基、環氧基、三聚氰胺基、二醇基、矽氧烷基、胺基等有機官能基之多官能有機官能基樹脂;具有鋅、鋁、鈉、鋯、鈣等之金屬錯合物的有機金屬化合物。
作為上述多官能(甲基)丙烯酸酯,例如可列舉:1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、甘油縮水甘油醚二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、雙酚A聚乙氧基二(甲基)丙烯酸酯、雙酚A聚烷氧基二(甲基)丙烯酸酯、雙酚F聚烷氧基二(甲基)丙烯酸酯、聚伸烷基二醇二(甲基)丙烯酸酯、三羥甲基丙烷三氧基乙基(甲基)丙烯酸酯、ε-己內酯改性三(2-羥基乙基)異氰尿酸酯三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、丙氧化季戊四醇三(甲基)丙烯酸酯、乙氧化季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、丙氧化季戊四醇四(甲基)丙烯酸酯、乙氧化季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、三(丙烯醯氧基乙基)異氰尿酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、三季戊四醇六(甲基)丙烯酸酯、三季戊四醇五(甲基)丙烯酸酯、羥基特戊酸新戊二醇二(甲基)丙烯酸酯、羥基特戊酸新戊二醇之ε-己內酯加成物之二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、烷氧化三羥甲基丙烷三(甲基)丙烯酸酯、二(三羥甲基丙烷)四(甲基)丙烯酸酯等紫外線硬化型之多官能單體類,除此以外,可列舉:聚酯(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯、聚醚(甲基)丙烯酸酯等多官能丙烯酸酯低聚物類。
上述所列舉之中,就提高對被黏著體之密接性或抑制濕熱白化之效果之觀點而言,上述多官能(甲基)丙烯酸酯單體中,較佳為含有羥基或羧基、醯胺基等極性官能基之多官能單體或低聚物。其中,較佳為使用具有羥基或醯胺基之多官能(甲基)丙烯酸酯。
就防止濕熱白化之觀點而言,作為上述(甲基)丙烯酸酯共聚物、例如接枝共聚物之主鏈成分,較佳為含有疏水性之丙烯酸酯單體與親水性之丙烯酸酯單體,進而,作為交聯劑,較佳為使用具有羥基之多官能(甲基)丙烯酸酯。
又,為了調整密接性或耐濕熱性、耐熱性等效果,亦可進一步添加與交聯劑進行反應之單官能或多官能之(甲基)丙烯酸酯。
就使作為黏著劑組合物之柔軟性與凝聚力平衡之觀點而言,交聯劑之含量相對於上述(甲基)丙烯酸系共聚物100質量份,較佳為以0.1~20質量份之比例含有,其中尤佳為0.5質量份以上或15質量份以下之比例,其中尤佳為1質量份以上或13質量份以下之比例。
(光聚合起始劑(c))
於使丙烯酸酯聚合物交聯時,若適當添加交聯起始劑(過氧化起始劑、光聚合起始劑)或反應觸媒(三級胺系化合物、四級銨系化合物、月桂酸錫化合物等),則較為有效。
於紫外線照射交聯之情形時,較佳為調配光聚合起始劑(c)。
光聚合起始劑(c)根據自由基產生機制而大體分為2類,大致分為:可使光聚合性起始劑本身之單鍵斷裂分解而產生自由基之斷裂型光聚合起始劑;及光激發之起始劑與系統中之氫供與體形成激發錯合物而可使氫供與體之氫轉移之奪氫型光聚合起始劑。
該等中之斷裂型光聚合起始劑於藉由光照射而產生自由基時分解而成為其他化合物,一旦被激發則失去作為反應起始劑之功能。因此,若使用該分子內斷裂型作為於可見光區域內具有吸收波長之光聚合起始劑,則與使用奪氫型之情形相比,於藉由光線照射使黏著片材交聯後,光線反應性之光聚合性起始劑作為未反應殘渣殘留於本黏著劑組合物中而導致黏著片材之未預期之經時變化或促進交聯的可能性較低,故而較佳。又,關於光聚合性起始劑特有之著色,亦可適當選擇藉由成為反應分解物,使可見光區域之吸收消失而消色者,故而較佳。
另一方面,奪氫型之光聚合起始劑於藉由紫外線等活性能量線照射之產生自由基之反應時,不會產生如斷裂型光聚合起始劑之分解物,故而反應結束後難以成為揮發成分,可減少對被黏著體之損傷。
作為上述斷裂型光聚合起始劑,例如可列舉:2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、1-(4-(2-羥基乙氧基)苯基)-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-[4-{4-(2-羥基-2-甲基-丙醯基)苄基}苯基]-2-甲基-丙烷-1-酮、低聚(2-羥基-2-甲基-1-(4-(1-甲基乙烯基)苯基)丙酮)、苯基乙醛酸甲酯、2-苄基-2-二甲胺基-1-(4-𠰌啉基苯基)丁烷-1-酮、2-甲基-1-[4-(甲硫基)苯基]-2-𠰌啉基丙烷-1-酮、2-(二甲胺基)-2-[(4-甲基苯基)甲基]-1-[4-(4-𠰌啉基)苯基]-1-丁酮、雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)乙氧基苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)2,4,4-三甲基戊基氧化膦、或該等之衍生物等。
其中,就藉由斷裂型光聚合性起始劑,於反應後成為分解物而消色之方面而言,較佳為雙(2,4,6-三甲基苯甲醯基)-苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)乙氧基苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)2,4,4-三甲基戊基氧化膦等醯基氧化膦系光起始劑。
進而,就與包含具備巨單體作為支鏈成分之接枝共聚物之丙烯酸系共聚物之相容性而言,較佳為使用2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)乙氧基苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)2,4,4-三甲基戊基氧化膦等作為光聚合起始劑。
光聚合起始劑之含量並無特別限制。例如相對於(甲基)丙烯酸系共聚物100質量份而以0.1~10質量份、其中尤佳為以0.2質量份以上或5質量份以下、其中尤佳為以0.5質量份以上或3質量份以下之比例而含有。但就與其他要素之平衡性之方面而言,亦可超過該範圍。
光聚合起始劑可使用1種或組合2種以上使用。
除了上述成分以外,亦可視需要而適當調配具有近紅外線吸收特性之顏料或染料等色素、黏著賦予劑、抗氧化劑、抗老化劑、吸濕劑、紫外線吸收劑、矽烷偶合劑、天然物或合成物之樹脂類、玻璃纖維或玻璃珠等各種添加劑。
(黏著材層之層結構及厚度)
黏著材層除了單層以外,亦可為兩層、三層等複數層。
又,黏著材層亦可為具有基材層(不具有黏著性之層)作為芯層,且於該基材層之兩側積層包含黏著材之層而成之構成。於此種構成之情形時,作為芯層之基材層較佳為具有變得能夠對黏著片材積層體進行加熱成型之材質或特性。又,較佳為除了基材層以外之黏著材層於損耗正切tanδ(SA)、損耗正切tanδ(SB)、儲存彈性模數G'(SA)及儲存彈性模數G'(SB)方面具有上述特性。
黏著材層之厚度並無特別限定。其中較佳為20 μm~500 μm之範圍。若為該範圍,例如若為如厚度20 μm之較薄之黏著材層,則可提供印刷階差追隨性優異之黏著片材。又,若為如厚度500 μm之較厚之黏著材層,則藉由預先賦形相當於印刷階差之量,亦變得能夠抑制貼合時之黏著材之溢出。
因此,黏著材層之厚度較佳為20 μm~500 μm,其中進而較佳為30 μm以上或300 μm以下,其中進而較佳為50 μm以上或200 μm以下。
<被覆部I>
本黏著片材積層體如圖1所示具備如下之被覆部I,該被覆部I係以可剝離之方式積層於對黏著材層之正面及背面之一側、例如正面賦形凹凸之側而成。
被覆部I於100℃下之儲存彈性模數E'(MA)較佳為1.0×106
~2.0×109
Pa。
由於對本黏著片材積層體進行加熱成型時之溫度通常為70~120℃,故而若於100℃下之儲存彈性模數E'(MA)為1.0×106
~2.0×109
Pa,則於上述黏著劑組合物塑化至流動之溫度範圍內,被覆部I亦能夠充分地追隨凹凸形狀而變形,不僅如此,而且可於在成型時被被覆部I擠壓之黏著材層之表面高精度地、例如以避免角部變圓之方式成型所需凹凸形狀。
先前,作為積層於黏著片材之離型膜,多使用儲存彈性模數較高、換言之「較硬之」材料。其原因在於:對離型膜所要求之特性主要為保護黏著材層、及離型性。然而,根據本發明者等人之研究,發現於在將離型膜積層於黏著片材之狀態下進行加熱成形之新用途中,於要求加熱成型性之新課題之情形時,憑藉先前之離型膜所具備之如上所述之物理特性無法達成要求。因此,對加熱成型時所產生之現象、或黏著材層所具有之特性等進行了詳細調查,結果發現,設為與迄今為止通常使用之離型膜不同之特性對於解決加熱成型性之新課題而言有利。發現尤其是藉由將特定溫度下之儲存彈性模數控制為特定範圍,可解決上述課題。
就該觀點而言,被覆部I於100℃下之儲存彈性模數E'(MA)較佳為1.0×106
~2.0×109
Pa,其中進而較佳為5.0×106
Pa以上或1.0×109
Pa以下,其中進而較佳為1.0×107
Pa以上或5.0×108
Pa以下。
據此,被覆部I於100℃下之儲存彈性模數E'(MA)更佳為1.0×106
~1.0×109
Pa、或1.0×106
~5.0×108
Pa,其中,進而較佳為5.0×106
~2.0×109
Pa、或5.0×106
~1.0×109
Pa,最佳為1.0×107
~1.0×109
Pa以下、或1.0×107
~5.0×108
Pa。
又,被覆部I於30℃下之儲存彈性模數E'(MB)較佳為5.0×107
~1.0×1010
Pa。
若被覆部I於30℃下之儲存彈性模數E'(MB)為5.0×107
~1.0×1010
Pa,則於常態下可維持形狀保持性,故而操作較容易,例如容易剝離,不僅如此,由於並未過硬,因此可抑制於黏著材層形成非意圖需要之凹凸。
就該觀點而言,被覆部I於30℃下之儲存彈性模數E'(MB)較佳為5.0×107
~1.0×1010
Pa,其中進而較佳為1.0×108
Pa以上或8.0×109
Pa以下,其中進而較佳為1.0×109
Pa以上或5.0×109
Pa以下。
據此,被覆部I於30℃下之儲存彈性模數E'(MB)更佳為5.0×107
~8.0×109
Pa、或5.0×107
~5.0×109
Pa,其中,進而較佳為1.0×108
Pa~1.0×1010
Pa、或1.0×108
Pa~8.0×109
Pa,最佳為1.0×109
~8.0×109
Pa、或1.0×109
~5.0×109
Pa。
為了將被覆部I於30℃、100℃下之儲存彈性模數調整為上述,例如可藉由調整基礎樹脂之種類、共聚合樹脂成分、重量平均分子量、玻璃轉移溫度、結晶性等被覆部I之材料之條件,並且調整有無延伸、成形條件、於延伸之情形時調整延伸條件等製造條件而加以調整。但並不限定於該等方法。
進而,較佳為被覆部I於100℃下之儲存彈性模數E'(MA)、與被覆部I於30℃下之儲存彈性模數E'(MB)滿足以下之關係式(1)。
(1)・・E'(MB)/E'(MA)≧2.0
若被覆部I於100℃下之儲存彈性模數E'(MA)與被覆部I於30℃下之儲存彈性模數E'(MB)滿足上述關係式(1),則可獲得充分之成形性,故而更佳。
就該觀點而言,較佳為E'(MB)/E'(MA)≧2.0,其中進而較佳為30≧E'(MB)/E'(MA)或E'(MB)/E'(MA)≧3.0,其中尤佳為10≧E'(MB)/E'(MA)或E'(MB)/E'(MA)≧5.0。
為了調整為E'(MB)與E'(MA)成為上述關係,例如可藉由調整基礎樹脂之種類、共聚合樹脂成分、重量平均分子量、玻璃轉移溫度、結晶性等被覆部I之材料之條件,並且調整有無延伸、成形條件、於延伸之情形時調整延伸條件等製造條件而加以調整。但並不限定於該等方法。
進而又,較佳為上述黏著材層於100℃下之儲存彈性模數G'(SA)與上述被覆部I於100℃下之儲存彈性模數E'(MA)滿足以下之關係式(2)。
(2)・・1.0×103
≦E'(MA)/G'(SA)≦1.0×107
若上述黏著材層於100℃下之儲存彈性模數G'(SA)與上述被覆部I於100℃下之儲存彈性模數E'(MA)滿足上述關係式(2),則可獲得充分之成形性,故而更佳。
就該觀點而言,E'(MA)/G'(SA)較佳為1.0×103
~1.0×107
,其中尤佳為5.0×103
以上或5.0×106
以下,其中尤佳為1.0×104
以上或1.0×106
以下。
據此,E'(MA)/G'(SA)更佳為1.0×103
~5.0×106
、或1.0×103
~1.0×106
,進而較佳為5.0×103
~5.0×106
、或5.0×103
~1.0×106
,最佳為1.0×104
~5.0×106
、或1.0×104
~1.0×106
。
為了調整為E'(MA)及G'(SA)成為上述關係,調整黏著材層或被覆部I之特性即可。作為黏著材層之特性,例如可藉由調整構成黏著材層之組合物之成分或凝膠分率、重量平均分子量等而達成。又,作為被覆部I之特性,例如可藉由調整基礎樹脂之種類、共聚合樹脂成分、重量平均分子量、玻璃轉移溫度、結晶性等被覆部I之材料之條件,並且調整有無延伸、成形條件、於延伸之情形時調整延伸條件等製造條件而加以調整。但並不限定於該等方法。
對於被覆部I,進而於30℃環境下將上述被覆部I從黏著材層剝離時之剝離力F(C)較佳為0.2 N/cm以下。
若剝離力F(C)為0.2 N/cm以下,則可將上述被覆部I從黏著材層容易地剝離。
就該觀點而言,該剝離力F(C)較佳為0.2 N/cm以下,其中進而較佳為0.01 N/cm以上或0.15 N/cm以下,其中進而較佳為0.02 N/cm以上或0.1 N/cm以下。
進而,對於被覆部I,將黏著片材積層體於100℃下加熱5分鐘後冷卻至30℃,於30℃環境下將上述被覆部I從上述黏著材層剝離時之剝離力F(D)較佳為0.2 N/cm以下。
若將黏著片材積層體於100℃下加熱5分鐘後冷卻至30℃,並且於30℃環境下測得之剝離力F(D)與上述剝離力F(C)為相同程度,則即使將黏著片材積層體加熱成型,剝離力F(D)亦不發生變化,故而可將上述被覆部I從黏著材層容易地剝離。
就該觀點而言,該剝離力F(D)較佳為0.2 N/cm以下,其中進而較佳為0.01 N/cm以上或0.15 N/cm以下,其中進而較佳為0.02 N/cm以上或0.1 N/cm以下。
進而,被覆部I較佳為上述剝離力F(C)與上述剝離力F(D)之差之絕對值為0.1 N/cm以下。
若將黏著片材積層體於100℃下加熱5分鐘後冷卻至30℃,並且於30℃環境下測得之剝離力F(D)與通常狀態下之剝離力F(C)之差之絕對值為0.1 N/cm以下,則即使將黏著片材積層體加熱成型,剝離力F(D)亦不發生變化,故而可將上述被覆部I從黏著材層容易地剝離。
就該觀點而言,剝離力F(C)與剝離力F(D)之差之絕對值較佳為0.1 N/cm以下,其中進而較佳為0.08 N/cm以下,其中進而較佳為0.05 N/cm以下。
再者,被覆部I之剝離力F(C)及剝離力F(D)可藉由形成於被覆部I之一側之離型層之種類等加以調製。但並不限定於該方法。
作為被覆部I之構成例,可列舉具備被覆基材層與離型層之構成例。藉由在被覆基材層之單面積層離型層,可以被覆部I容易從黏著材層剝離之方式構成。
此時,該被覆基材層較佳為具備以選自例如由聚酯、共聚合聚酯、聚烯烴及共聚合聚烯烴所組成之群中之1種樹脂或2種以上之樹脂作為主成分之延伸或未延伸之層、即包含以該等樹脂作為主成分之延伸或未延伸之膜之層的單層或複層。
其中,構成上述被覆部I之被覆基材層就機械強度或耐化學品性等觀點而言,較佳為具備包含以例如共聚合聚酯、聚烯烴、或共聚合聚烯烴作為主成分之延伸或未延伸之膜之層的單層或複層。
作為上述共聚合聚酯之具體例,例如可列舉:使作為二羧酸之間苯二甲酸、及作為二醇之環己烷二甲醇、1,4-丁二醇、二乙二醇等任意地共聚合而成之共聚合聚對苯二甲酸乙二酯。
作為上述聚烯烴之具體例,可列舉α-烯烴均聚物,例如可列舉丙烯均聚物或4-甲基戊烯-1之均聚物。
作為上述聚烯烴共聚物之具體例,例如可列舉:乙烯、丙烯、其他α-烯烴或乙烯基單體等之共聚物。
上述離型層較佳為製成除了聚矽氧等離型劑以外亦含有改性聚烯烴之層。
此處,作為構成上述離型層之改性烯烴,可列舉以經不飽和羧酸或其酸酐、或者矽烷系偶合劑改性之聚烯烴作為主成分之樹脂。
作為上述不飽和羧酸或其酸酐,可列舉:丙烯酸、甲基丙烯酸、順丁烯二酸、順丁烯二酸酐、檸康酸、檸康酸酐、伊康酸、伊康酸酐或該等之衍生物之單環氧化合物與上述酸之酯化合物、分子內具有能夠與該等酸反應之基之聚合物與酸之反應生成物等。又,亦可使用該等之金屬鹽。該等中,可更佳地使用順丁烯二酸酐。又,該等之共聚物可各自單獨使用或混合2種以上使用。
為了製造改性聚烯烴系樹脂,例如可於使聚合物進行聚合之階段預先使該等改性單體共聚合,亦可使暫時聚合之聚合物與該等改性單體進行接枝共聚合。又,作為改性聚烯烴系樹脂,可單獨使用該等改性單體或併用複數種,且適宜地使用其含有率為0.1質量%以上、較佳為0.3質量%以上、進而較佳為0.5質量%以上且為5質量%以下、較佳為4.5質量%以下、進而較佳為4.0質量%以下之範圍者。其中,可適宜地使用經接枝改性者。
作為改性聚烯烴系樹脂之適宜之例,可列舉:順丁烯二酸酐改性聚丙烯樹脂、順丁烯二酸酐改性聚乙烯樹脂、順丁烯二酸酐乙烯-乙酸乙烯酯共聚物等。
被覆部I之厚度就成形性之觀點而言,較佳為10 μm~500 μm,其中尤佳為20 μm以上或300 μm以下,其中尤佳為30 μm以上或150 μm以下。
<被覆部II>
如上所述,本黏著片材積層體可採用於黏著材層之正面及背面之一側以可剝離之方式積層被覆部I,並且於與該被覆部I為相反側、即黏著材層之正面及背面之另一側以可剝離之方式積層被覆部II而成之構成。由此,藉由在黏著材層之正面及背面之另一側以可剝離之方式積層被覆部II,可提高操作性。但亦可採用不積層被覆部II之構成。
只要被覆部II為以可剝離之方式積層於黏著材層之正面及背面之另一側而成者,則其材料及構成並無特別限定。
被覆部II例如可為與上述被覆部I相同之積層構成及材料,此時,可為與上述被覆部I相同之厚度,亦可為不同之厚度。
若被覆部II為與被覆部I相同之積層構成及材料,則可防止於加熱本黏著片材積層體時等產生翹曲。
被覆部II亦可採用構成與被覆部I相同,但於100℃下之儲存彈性模數E'(MA)、於30℃下之儲存彈性模數E'(MB)、該等之比率(E'(MB)/E'(MA))、剝離力F(C)、剝離力F(D)等與被覆部I不同者。
進而,被覆部II亦可為與上述被覆部I不同之積層構成及材料。
被覆部II亦可使用例如通常使用之離型膜(亦稱為「剝離膜」)。具體而言,可列舉如於100℃下之儲存彈性模數E'(MC)為2.0×109
~1.0×1011
Pa之材料,例如可使用雙軸延伸聚對苯二甲酸乙二酯(PET)膜等。
[被覆部I]
作為上述被覆部I之構成例,對以為於共聚合聚酯膜之單面設置有塗佈層之塗佈膜,且於100℃下之儲存彈性模數E'為1.5×109
Pa以下為特徵之塗佈膜(稱為「本塗佈膜」)進行說明。
若使用本塗佈膜,則藉由例如於將上述黏著片材積層體加熱後,將模具壓抵於設置有具有離型性之塗佈層之塗佈膜進行成型,而可於黏著片材表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀。又,由於塗佈膜於常態下可維持形狀保持性,故而操作較容易,不僅如此,由於其並未過硬,因此可抑制於黏著片材形成非意圖需要之凹凸。
<共聚合聚酯膜>
構成本塗佈膜之共聚合聚酯膜可為單層構成,亦可為積層構成,例如除了2層、3層構成以外,只要不超過本發明之主旨,則亦可為4層或4層以上之多層,並無特別限定。又,例如於採用3層構成(表層/中間層/表層)之情形時,亦可將其表層或中間層之任意1層、或2層以上之層設為共聚合聚酯成分,且將其餘層設為不含共聚合成分之聚酯成分而構成。
又,共聚合聚酯膜係指將藉由擠出法擠出之熔融聚酯片材冷卻後,視需要加以延伸而成之膜。
作為共聚合聚酯之二羧酸成分,較佳為對苯二甲酸,除此以外,亦可含有草酸、丙二酸、丁二酸、己二酸、壬二酸、癸二酸、鄰苯二甲酸、間苯二甲酸、萘二甲酸、二苯醚二羧酸、環己烷二羧酸等公知之二羧酸之一種以上作為共聚合成分。又,作為二醇成分,較佳為乙二醇,除此以外,亦可含有丙二醇、三亞甲基二醇、四亞甲基二醇、六亞甲基二醇、1,4-環己烷二甲醇、二乙二醇、三乙二醇、聚伸烷基二醇、新戊二醇等公知之二醇之一種以上作為共聚合成分。
其中,更佳為使作為二羧酸成分之鄰苯二甲酸、間苯二甲酸、作為二醇成分之1,4-環己烷二甲醇、1,4-丁二醇、二乙二醇等任意地共聚合而成之共聚合聚對苯二甲酸乙二酯。
共聚合成分之含量較佳為1 mol%以上且50 mol%以下,更佳為3 mol%以上或40 mol%以下,進而較佳為4 mol%以上或30 mol%以下。藉由共聚合成分之含量為1 mol%以上,於使其與黏著片材積層時,可於黏著片材表面形成凹形狀、凸形狀、或凹凸形狀。另一方面,藉由為50 mol%以下,不僅具有充分之尺寸穩定性,而且可充分抑制加工時之褶皺之產生。
共聚合聚酯膜之熔點較佳為以成為較佳為260℃以下、更佳為200~255℃之範圍之方式設計。藉由上述熔點為260℃以下,於延伸後之熱處理步驟中,即使為低於共聚合聚酯膜之熔點之溫度之熱處理,亦可獲得充分之強度。
就提高膜作業性之方面而言,較理想為於共聚合聚酯膜中含有粒子。作為粒子,可列舉:碳酸鈣、碳酸鎂、硫酸鈣、硫酸鋇、磷酸鋰、磷酸鎂、磷酸鈣、氟化鋰、氧化鋁、氧化矽、高嶺土等無機粒子;丙烯酸系樹脂、胍胺樹脂等有機粒子;將觸媒殘差粒子化而成之析出粒子,但並不限定於該等。該等粒子之粒徑或共聚合聚酯膜中之含量可根據目的而適當決定。所含有之粒子可為單成分,又,亦可同時使用2種成分以上。又,亦可適當添加各種穩定劑、潤滑劑、防靜電劑等。
共聚合聚酯膜中所含之粒子之平均粒徑較佳為0.1~5.0 μm。於上述粒子之平均粒徑未達0.1 μm之情形時,存在膜之滑動性變得不充分,而作業性降低之情形。另一方面,於上述粒子之平均粒徑超過5.0 μm之情形時,存在膜表面之平滑性受損之情形。
共聚合聚酯膜中所含之粒子之含量較佳為0.01~0.3重量%。於上述粒子之含量未達0.01重量%之情形時,存在膜之滑動性變得不充分,而作業性降低之情形。另一方面,於上述粒子之含量超過0.3重量%之情形時,存在膜表面之平滑性受損之情形。
作為於共聚合聚酯膜中添加粒子之方法,並無特別限定,可採用公知之方法。例如,可於製造聚酯之任意階段添加,較佳為於酯化之階段、或亦可於酯交換反應結束後縮聚反應開始前之階段以分散於乙二醇等中之漿料之形式添加而進行縮聚反應。又,可藉由使用附排氣孔之混練擠出機將分散於乙二醇或水等中之粒子之漿料與聚酯原料摻合之方法、或使用混練擠出機將經乾燥之粒子與聚酯原料摻合之方法、於聚酯製造步驟系統中使粒子析出之方法等進行。
共聚合聚酯之極限黏度通常為0.40~1.10 dl/g,較佳為0.45~0.90 dl/g,進而較佳為0.50~0.80 dl/g。若極限黏度未達0.40 dl/g,則有膜之機械強度變弱之傾向,於極限黏度超過1.10 dl/g之情形時,存在熔融黏度變高,而會對擠出機過度地施加負荷之情形。
繼而,對共聚合聚酯膜之製造例進行具體說明,但並不受以下之製造例任何限定。
較佳為如下方法:首先,使用先前所述之共聚合聚酯原料,藉由冷卻輥將從模具擠出之熔融片材冷卻固化而獲得未延伸片材。於該情形時,為了提高片材之平面性,必須提高片材與旋轉冷卻轉筒之密接性,可較佳地採用靜電施加密接法及/或液體塗佈密接法。
繼而,較佳為將所獲得之未延伸片材至少沿單軸方向延伸,更佳為沿雙軸方向延伸之雙軸延伸。例如,作為雙軸延伸,於逐次雙軸延伸之情形時,藉由輥或拉輻方式之延伸機使上述未延伸片材於一個方向上沿機械方向延伸。延伸溫度通常為70~120℃,較佳為75~110℃,延伸倍率通常為2.5~7.0倍,較佳為3.0~6.0倍。其次,沿與第一階段之延伸方向(機械方向)垂直之方向延伸。延伸溫度通常為70~170℃,延伸倍率通常為3.0~7.0倍,較佳為3.5~6.0倍。然後,繼續於150~270℃之溫度下,於拉伸下或30%以內之鬆弛下進行熱處理,而獲得雙軸配向膜。於上述雙軸延伸中,亦可採用將一個方向之延伸進行2階段以上之方法。於該情形時,較佳為以兩個方向之延伸倍率最終分別成為上述範圍之方式而進行。
又,關於共聚合聚酯膜之製造,亦可採用同時雙軸延伸。同時雙軸延伸係於通常70~120℃、較佳為75~110℃下將上述未延伸片材於溫度經控制之狀態下沿機械方向及寬度方向同時延伸並使其配向之方法。作為延伸倍率,以面積倍率計較佳為4~50倍,更佳為7~35倍,進而較佳為10~25倍。然後,繼續於150~250℃之溫度下,於拉伸下或30%以內之鬆弛下進行熱處理,而獲得雙軸延伸膜。關於採用上述延伸方式之同時雙軸延伸裝置,可採用螺旋方式、縮放儀方式、線型驅動方式等自先前起公知之延伸方式。
(塗佈層)
於本塗佈膜中,重要的是於共聚合聚酯膜之至少單面設置塗佈層。作為塗佈層,並無特別限定,可具體地列舉離型層、防靜電層、低聚物密封層、易接著層、底塗層等。其中,就製造與黏著片材積層而成之黏著片材積層體之方面而言,更佳為離型層。又,亦可將如上所述之功能層組合2種以上。
作為構成塗佈膜之塗佈層之具體例,以下對離型層進行說明。
具體而言,離型層所使用之樹脂之種類可列舉硬化型聚矽氧樹脂、氟系樹脂、聚烯烴系樹脂等,其中較佳為硬化型聚矽氧樹脂。可為硬化型聚矽氧樹脂,亦可為以硬化型聚矽氧樹脂作為主成分之類型,於無損及本發明之主旨之範圍內,亦可使用藉由與胺基甲酸酯樹脂、環氧樹脂、醇酸樹脂等有機樹脂之接枝聚合等獲得之改性聚矽氧型等。
作為硬化型聚矽氧樹脂之種類,可使用加成型、縮合型、紫外線硬化型、電子束硬化型、無溶劑型等任一硬化反應型。若列舉具體例,則可例示:信越化學工業股份有限公司製造之KS-774、KS-775、KS-778、KS-779H、KS-847H、KS-856、X-62-2422、X-62-2461、X-62-1387、X-62-5039、X-62-5040、KNS-3051、X-62-1496、KNS320A、KNS316、X-62-1574A/B、X-62-7052、X-62-7028A/B、X-62-7619、X-62-7213;Momentive Performance Materials製造之YSR-3022、TPR-6700、TPR-6720、TPR-6721、TPR6500、TPR6501、UV9300、UV9425、XS56-A2775、XS56-A2982、UV9430、TPR6600、TPR6604、TPR6605;Dow Corning Toray股份有限公司製造之SRX357、SRX211、SD7220、SD7292、LTC750A、LTC760A、LTC303E、SP7259、BY24-468C、SP7248S、BY24-452、DKQ3-202、DKQ3-203、DKQ3-204、DKQ3-205、DKQ3-210等。進而,為了調整離型層之剝離性等,亦可併用剝離控制劑。
於共聚合聚酯膜上形成離型層時之硬化條件並無特別限定。於藉由離線塗佈設置離型層之情形時,通常宜於120~200℃下3~40秒、較佳為於100~180℃下3~40秒為標準進行熱處理。又,亦可視需要而併用熱處理與紫外線照射等活性能量線照射。再者,作為用於藉由活性能量線照射進行之硬化之能量源,可使用自先前起公知之裝置、能量源。離型層之塗敷量(乾燥後)就塗敷性之方面而言,通常為0.005~1 g/m2
之範圍,較佳為0.005~0.5 g/m2
之範圍,進而較佳為0.01~0.2 g/m2
之範圍。於塗敷量(乾燥後)未達0.005 g/m2
之情形時,存在就塗敷性之方面而言缺乏穩定性,而難以獲得均勻之塗膜之情形。另一方面,於超過1 g/m2
而較厚地塗佈之情形時,存在離型層本身之塗膜密接性、硬化性等降低之情形。
作為於共聚合聚酯膜設置離型層之方法,可使用反向凹版塗佈、直接凹版塗佈、輥式塗佈、模嘴塗佈、棒式塗佈、淋幕式塗佈等先前公知之塗敷方式。關於塗敷方式,於「塗佈方式」(槙書店 原崎勇次著,1979年發行)中有記載例。
又,為了於共聚合聚酯膜設置塗佈層,亦可預先對其實施電暈處理、電漿處理、紫外線照射處理等表面處理。
(塗佈膜)
本塗佈膜之厚度通常為9 μm~250 μm,較佳為12 μm~125 μm,進而較佳為25 μm~75 μm。
於上述厚度未達9 μm之情形時,存在膜張力變得不充分,而產生於切條時容易產生褶皺等異常之情形。另一方面,若超過250 μm,則存在例如對具有曲面形狀之成形品之追隨性變得不充分之情形。
本塗佈膜於100℃下之儲存彈性模數E'為1.5×109
Pa以下,較佳為1.0×109
Pa以下。藉由上述儲存彈性模數E'為1.5×109
Pa以下,於使其與黏著片材積層時,可於黏著片材表面形成凹形狀、凸形狀、或凹凸形狀。為了使100℃下之儲存彈性模數E'滿足上述範圍,可藉由調整共聚合聚酯膜所含之共聚合成分之種類及含量而滿足。
另一方面,作為下限,並無特別限定,較佳為1.0×107
Pa以上,更佳為1.0×108
Pa以上。
本塗佈膜於120℃下加熱5分鐘後之收縮率為3.0%以下,較佳為2.5%以下。藉由上述收縮率為3.0%以下,而具有充分之尺寸穩定性,故而於使其與黏著片材積層時,可於黏著片材表面形成凹形狀、凸形狀、或凹凸形狀。進而,可抑制加工時褶皺之產生,因此不會將褶皺轉印至黏著片材,而可製造具有充分之外觀之黏著片材。
其中,於120℃下加熱5分鐘後之機械方向(MD)之收縮率較佳為3.0%以下,較佳為2.5%以下。另一方面,作為下限,並無特別限定,較佳為0.1%以上,更佳為0.5%以上。
又,於120℃下加熱5分鐘後之與機械方向垂直之方向(TD)之收縮率較佳為1.0%以下,較佳為0.8%以下。另一方面,作為下限,較佳為-1.0%以上,更佳為-0.5%以上。
本塗佈膜就成形加工時防止由低聚物(環狀三聚物)對模具之附著引起之污染之觀點而言,較佳為熱處理(180℃、10分鐘)後低聚物從塗佈層表面之提取量為1.0×10-3
mg/cm2
以下,更佳為5.0×10-4
mg/cm2
以下。
於上述低聚物提取量超過該範圍之情形時,存在成形加工時由低聚物對模具之附著引起之污染變得嚴重之情形。作為一例,於多次連續加熱成形之加工中,因析出低聚物之沈積導致促進模具污染,故而控制加熱時之低聚物析出量變得重要。基於上述理由,上述低聚物提取量越少越佳。
[本黏著片材積層體之製造方法]
作為本黏著片材積層體之製造方法之一例,例如可列舉如下方法:以2片被覆部I或II夾持黏著劑組合物,使用貼合機而形成黏著材層。又,作為其他方法,可列舉將黏著劑組合物塗佈於被覆部I或II而形成黏著材層之方法。但並不限定於該製造方法。
作為塗佈黏著劑組合物之方法,例如可列舉逆輥塗佈、凹版塗佈、棒式塗佈、刮刀塗佈等先前公知之塗敷方式。
[本賦形黏著片材積層體]
可使用本黏著片材積層體,以如下方式製作於黏著材層表面形成有凹凸形狀之賦形黏著片材積層體1(稱為「本賦形黏著片材積層體1」)。
如圖3所示,本賦形黏著片材積層體1可製成具備如下所述構成者:其具備黏著材層2、以可剝離之方式積層於該黏著材層2之正面及背面之一側而成之被覆部I、及以可剝離之方式積層於該黏著材層2之正面及背面之另一側而成之被覆部II,
黏著材層2於正面及背面之一側表面2A具備凹部、凸部或凹凸部(稱為「黏著片材表面凹凸部2B」),且正面及背面之另一側表面2C為平坦面,
被覆部I密接於上述黏著片材2之正面及背面之一側表面2A,於正面及背面之一側表面3A具備凹部、凸部或凹凸部(稱為「被覆部表面凹凸部3B」),且於片材背面3C具備與上述黏著片材表面凹凸部2B相符、換言之形成嵌合之凹凸之凸部、凹部或凸凹部(稱為「保護片材背面凸凹部3D」),
被覆部II沿上述黏著片材2之正面及背面之另一側表面2C包含平坦面。
再者,正面及背面之另一側表面2C可如圖3所示般製成平坦面,又,正面及背面之另一側表面2C亦可以具備凹部、凸部或凹凸部之方式形成。
具備此種構成之本賦形黏著片材積層體1可如圖2所示,藉由利用將上述本黏著片材積層體進行加壓成形、真空成形、壓空成形或輥壓成形,以一體方式對本黏著片材積層體賦形凹凸形狀而製造。
藉由以上述方式製造,可使黏著材層2之黏著片材表面凹凸部2B、被覆部I之保護片材表面凹凸部3B及保護片材背面凸凹部3D於同一部位各自對應而形成凹凸。
黏著材層2可用作例如用以將構成圖像顯示裝置之2個圖像顯示裝置構成構件(分別亦稱為「被黏著體」)貼合之雙面黏著片材。
即,上述黏著材層2中之黏著片材表面凹凸部2B可以與上述被黏著體之貼合面中之凹部、凸部或凹凸部(稱為「被黏著體表面凹凸部」)相符之方式形成,較佳為形成為同一輪廓形狀。藉此,可使本賦形黏著片材積層體1中之黏著片材表面凹凸部2B與作為被黏著體之圖像顯示裝置構成構件中之被黏著體表面凹凸部嵌合。
此處,作為上述圖像顯示裝置,例如可列舉:具備液晶顯示裝置(liquid crystal display,LCD)、有機EL(electroluminescence,電致發光)顯示裝置(OLED(organic light emitting diode,有機發光二極體))、電子紙、微機電系統(microelectromechanical system,MEMS)顯示器及電漿顯示器(PDP)等之智慧型手機、平板終端、行動電話、電視、遊戲機、個人電腦、汽車導航系統、ATM(automatic teller machine,自動櫃員機)、魚群探測儀等。但並不限定於該等。
此外,所謂作為被黏著體之圖像顯示裝置構成構件係構成該等圖像顯示裝置之構件,例如可列舉表面保護面板、觸控面板、圖像顯示面板等,本賦形黏著片材積層體1例如可用於將選自表面保護面板、觸控面板及圖像顯示面板中之任意2個被黏著體貼合。例如,可用於將表面保護面板與觸控面板、或觸控面板與圖像顯示面板貼合。但並不將被黏著體限定於該等。
<製造方法>
此處,對本賦形黏著片材積層體1之製造方法之詳細進行說明。
如上所述,可如圖2所示,藉由利用加熱上述本黏著片材積層體進行成形,以一體方式對本黏著片材積層體1賦形凹凸形狀而製造。
此時,作為成形加工方法,例如可列舉加壓成形、真空成形、壓空成形、利用輥之賦形、利用積層之賦形等。其中,就成形性及加工性之觀點而言,尤佳為加壓成形。
對更詳細之具體例進行說明。
藉由加熱器預熱本黏著片材積層體,於加熱為特定溫度之階段將本黏著片材積層體搬送至加壓成形機,利用預先仿照與被黏著體之印刷階差形狀相當之凹凸形狀之模具進行加壓加工,同時加以冷卻,藉此可使模具形狀轉印至本黏著片材積層體之單面,而製造於單面賦形有凹凸之本賦形黏著片材積層體1。
此時,本黏著片材積層體之預熱較佳為加熱為黏著材層柔軟化之溫度,具體而言,較佳為加熱為70~120℃。
凹凸賦形所使用之模具之材質並無特別限定。例如可列舉聚矽氧樹脂或氟樹脂等樹脂系材料、不鏽鋼或鋁等金屬系材料等。其中,由於對被黏著體之凹凸賦形要求高精度之成形性,因此尤佳為能夠控制成形時之溫度之金屬系之模具。
又,加壓加工後之冷卻可於開模後進行冷卻,亦可預先將模具冷卻,於加壓之同時進行冷卻。
再者,於本發明中,加壓壓力、加壓時間等成形之條件並無特別指定,根據所成形之尺寸或形狀、所使用之材料等適當調整即可。
又,於成形加工後亦可使用湯姆生刀(Thomson blade)或旋切刀等加以切割。
[本賦形黏著片材積層體之製造方法]
繼而,對具備具有黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I,且於該黏著材之一面賦形凹部、凸部或凹凸部(稱為「黏著材層表面凹凸部」)而成之構成之賦形黏著片材積層體之製造方法的尤佳之形態進行說明。
與下文所述之本製造方法1及本製造方法2相關之發明提出一種可於黏著材層表面高精度地形成與本被黏著體表面之凹凸部相符之黏著材層表面凹凸部、較佳為可連續地製造之新穎之賦形黏著片材積層體之製造方法。
作為本發明之實施形態之一例,提出一種新穎之賦形黏著片材積層體之製造方法(稱為「本製造方法1」),該賦形黏著片材積層體係具備具有黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I,且於該黏著材之一面賦形凹部、凸部或凹凸部(稱為「黏著材層表面凹凸部」)而成之構成者,該製造方法之特徵在於:其係具備黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I,並對黏著片材積層體進行加熱,將經加熱之黏著片材積層體成形,並且加以冷卻而製造賦形黏著片材積層體之製造方法,且對黏著片材積層體進行加熱,於被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之狀態下開始成形,於被覆部I之儲存彈性模數E'(MF)為5.0×107
~1.0×1010
Pa之狀態下結束成形。
於本製造方法1中,進而提出一種上述新穎之賦形黏著片材積層體之製造方法,其於將經加熱之黏著片材積層體成形時,使用經冷卻之模具進行成形。
根據本製造方法1,例如藉由將上述黏著片材積層體加熱後,被覆部I於特定之狀態下開始成形,且被覆部I於特定之狀態結束成形,而可於黏著材層表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀。
進而,於將經加熱之黏著片材積層體成形時,若使用經冷卻之模具進行成形,則可於成形之同時進行冷卻並且同時結束,故而可連續地進行上述製造方法。
<本製造方法1>
本製造方法1係本實施形態之一例之賦形黏著片材積層體之製造方法(稱為「本製造方法」)包括加熱下文所述之黏著片材積層體(加熱步驟)、將經加熱之黏著片材積層體成形並且加以冷卻(成形、冷卻步驟)之步驟之製造方法。
本製造方法1只要包括上述加熱步驟及上述成形、冷卻步驟,則亦可包括其他步驟。例如可視需要包括熱處理步驟、搬送步驟、切條步驟、裁斷步驟等步驟。但並不限定於該等步驟。
(黏著片材積層體)
作為本製造方法1中之起始構件之黏著片材積層體具備黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I即可,亦可具備其他構件。例如,如圖1所示,可例示具備黏著材層、以可剝離之方式積層於該黏著材層之正面及背面之一側而成之被覆部I、及以可剝離之方式積層於該黏著材層之正面及背面之另一側而成之被覆部II之黏著片材積層體。但是否具備被覆部II為任意,亦可採用不積層被覆部II之構成。
再者,關於黏著片材積層體之詳細情況係如上文所述。
(加熱步驟)
於本製造方法1中,較佳為加熱上述黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為1.0×106
~2.0×109
Pa之狀態。
若被覆部I之儲存彈性模數E'(M)為上述範圍,則可使被覆部I變形為適於成形之程度,且可對黏著材層之表面精度良好地賦形所需之凹凸形狀。
就該觀點而言,較佳為加熱黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為1.0×106
~2.0×109
Pa之狀態,其中進而較佳為設為5.0×106
Pa以上或1.0×109
Pa以下之狀態,其中進而較佳為設為1.0×107
Pa以上或5.0×108
Pa以下之狀態。
據此,更佳為加熱黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為1.0×106
~1.0×109
Pa、或1.0×106
~5.0×108
之狀態,其中,進而較佳為設為5.0×106
~2.0×109
Pa、或5.0×106
~1.0×109
Pa之狀態,最佳為設為1.0×107
~1.0×109
Pa、或1.0×107
~~5.0×108
之狀態。
此處,為了以加熱黏著片材積層體,被覆部I之儲存彈性模數E'(M)成為上述範圍之方式進行調整,可藉由根據構成被覆部I之組合物之成分或凝膠分率、重量平均分子量等調整加熱溫度而加以調整。但並不限定於該方法。
進而,進而更佳為加熱上述黏著片材積層體,而設為被覆部I之儲存彈性模數E'(M)為1.0×106
~2.0×109
Pa,且黏著材層之儲存彈性模數G'(S)未達1.0×104
Pa之狀態。
若將被覆部I之儲存彈性模數E'(M)調整為上述範圍,則可獲得如上所述之效果,除此以外,若黏著材層之儲存彈性模數G'(S)未達1.0×104
Pa,則可對黏著材層賦予充分之成形性。
就該觀點而言,較佳為加熱黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為上述範圍且黏著材層之儲存彈性模數G'(S)未達1.0×104
Pa之狀態,其中較佳為設為5.0×101
Pa以上或5.0×103
Pa以下之狀態,其中較佳為設為1.0×102
Pa以上或1.0×103
Pa以下之狀態。
據此,更佳為加熱黏著片材積層體而設為被覆部I之儲存彈性模數E'(M)為上述範圍且黏著材層之儲存彈性模數G'(S)為5.0×101
Pa以上且未達1.0×104
Pa、或為5.0×101
Pa以上且5.0×103
Pa以下之狀態,其中進而較佳為設為1.0×102
Pa以上且未達1.0×104
Pa、或1.0×102
Pa以上且5.0×103
Pa以下之狀態,最佳為設為1.0×102
Pa以上且1.0×103
Pa以下之狀態。
此處,黏著材層之儲存彈性模數G'(S)可根據構成黏著材層之組合物之成分或凝膠分率、重量平均分子量等調整加熱溫度而加以調整。但並不限定於該方法。
進而,尤佳為加熱黏著片材積層體而使黏著材層之損耗正切tanδ之值成為1.0以上。再者,下文對該損耗正切tanδ進行說明。
若黏著材層之損耗正切tanδ之值為1.0以上,則具有能夠成形之程度之柔軟性,故而較佳。
就該觀點而言,尤佳為加熱黏著片材積層體而使黏著材層之損耗正切tanδ之值成為1.0以上,其中進而較佳為使其成為1.5以上或20以下,進而,其中進而較佳為使其成為3.0以上或10以下。但上限並不限於此。
於本製造方法1中,較佳為加熱黏著片材積層體而使被覆部I之表面溫度成為70~180℃。
若被覆部I之表面溫度為70℃以上,則黏著材層充分軟化,且可使被覆部I能夠充分變形,若為180℃以下,則可抑制由熱收縮引起之褶皺之產生、或由熱引起之黏著材層之分解等弊端,故而較佳。
就該觀點而言,較佳為加熱上述黏著片材積層體而使被覆部I之表面溫度成為70~180℃,其中更佳為使其成為75℃以上或150℃以下,其中更佳為使其成為80℃以上或120℃以下。
作為黏著片材積層體之加熱方法,例如可列舉:使黏著片材積層體存在於內部具備電熱加熱器等加熱體之上下之加熱板之間而從上下加熱之方法、或以加熱板直接夾持之方法、使用加熱輥之方法、將其浸漬於熱水中之方法等。但並不限定於該等方法。
(成形、冷卻步驟)
於本步驟中,如上所述將經加熱之黏著片材積層體成形,於將黏著片材積層體成形之同時進行冷卻。即,直接將積層黏著材層及被覆部I而成為一體之狀態之黏著片材積層體成形。由此,利用模具將被覆部I成形,同時介隔該被覆部I亦將黏著材層成形。
於本步驟中,可於將經加熱之黏著片材積層體成形後進行冷卻,又,亦可於成形之同時進行冷卻。例如藉由利用經冷卻之模具進行加壓,可同時進行成形與冷卻並且同時結束。藉此,可如下文所述般連續地實施本製造方法1。
作為成形方法,只要可以一體方式對黏著片材積層體賦形凹凸形狀,則並不特別限定成形方法。例如可列舉:加壓成形、真空成形、壓空成形、利用輥進行之賦形、壓縮成形、利用積層進行之賦形等。其中,就成形性及加工性之觀點而言,尤佳為加壓成形。
模具之材質並無特別限定。例如可列舉聚矽氧樹脂或氟樹脂等樹脂系材料、不鏽鋼或鋁等金屬系材料等。其中,由於對被黏著體之凹凸賦形要求高精度之成形性,因此尤佳為能夠控制成形時之溫度之金屬系之模具。
模具之冷卻方法可採用通常進行之冷卻方法。例如可列舉水冷或利用壓縮空氣之冷卻方法。
對於模具,例如藉由如圖2所示,預先於開閉之一對模具中之至少一模具之內壁面設置特定之凹凸形狀,例如設置與黏著黏著材層之被黏著體之貼合面中的凹部、凸部或凹凸部相符之凹凸形狀,而可藉由使用該模具將黏著片材積層體進行加壓成形、真空成形、壓空成形或輥壓成形,將上述凹凸形狀轉印至黏著片材積層體而賦形。
於本步驟中,較佳為如上所述,於黏著片材積層體中之被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之狀態下開始成形。
此處,所謂「開始成形」,例如於使用模具之成形之情形時,意指關閉模具,即開始利用模具擠壓黏著片材積層體。
若被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之範圍,則可使被覆部I變形為適於成形之程度,且可對黏著材層之表面精度良好地賦形所需之凹凸形狀。
就該觀點而言,較佳為於被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之狀態下開始黏著片材積層體之成形,其中更佳為於為5.0×106
Pa以上或1.0×109
Pa以下之狀態下開始成形,其中更佳為於為1.0×107
Pa以上或5.0×108
Pa以下之狀態下開始成形。
據此,更佳為於被覆部I之儲存彈性模數E'(MS)為1.0×106
~1.0×109
Pa、或1.0×106
~5.0×108
Pa之狀態下開始黏著片材積層體之成形,其中,進而較佳為於為5.0×106
~1.0×109
Pa、或5.0×106
~5.0×108
Pa之狀態下開始成形,最佳為於為1.0×107
~1.0×109
Pa、或1.0×107
~5.0×108
Pa之狀態下開始成形。
進而,更佳為於被覆部I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa,且黏著材層之儲存彈性模數G'(SS)未達1.0×104
Pa之狀態下開始黏著片材積層體之成形。
若於被覆部I之儲存彈性模數E'(MS)為上述範圍之狀態下開始成形,則可獲得如上所述之效果,除此以外,若於黏著材層之儲存彈性模數G'(SS)未達1.0×104
Pa之狀態下開始成形,則可於黏著材層具有更充分之成形性之狀態下進行成形。
就該觀點而言,進而較佳為於被覆部I之儲存彈性模數E'(MS)為上述範圍之狀態且黏著材層之儲存彈性模數G'(SS)未達1.0×104
Pa之狀態下開始成形,其中進而較佳為於該G'(SS)為5.0×101
Pa以上或5.0×103
Pa以下之狀態下開始成形,其中進而更佳為於為1.0×102
Pa以上或1.0×103
Pa以下之狀態下開始成形。
據此,更佳為於被覆部I之儲存彈性模數E'(MS)為上述範圍之狀態且黏著材層之儲存彈性模數G'(SS)為5.0×101
Pa以上且未達1.0×104
Pa、或為5.0×101
Pa以上且5.0×103
Pa以下之狀態下開始成形,其中,進而較佳為於為1.0×102
Pa以上且未達1.0×104
Pa、或為1.0×102
Pa以上且5.0×103
Pa以下之狀態下開始成形,最佳為於為1.0×102
Pa以上且1.0×103
Pa以下之狀態下開始成形。
又,較佳為於上述被覆部I之表面溫度為70~180℃之狀態下開始成形。
若該被覆部I之表面溫度為70℃以上,則黏著材層充分軟化,且可使被覆部I能夠充分變形,若為180℃以下,則可抑制由熱收縮引起之褶皺之產生、或由熱引起之黏著材層之分解等弊端,故而較佳。
因此,較佳為於被覆部I之表面溫度為70~180℃之狀態下開始成形,其中更佳為使其成為75℃以上或150℃以下,其中更佳為使其成為80℃以上或120℃以下。
另一方面,於本步驟中,較佳為於上述被覆部I之儲存彈性模數E'(MF)為5.0×107
~1.0×1010
Pa之狀態下結束成形。
此處,所謂「結束成形」意指結束對黏著片材積層體施加成形壓力,若為模具成形,則意指打開模具。
若上述被覆部I之儲存彈性模數E'(MF)為5.0×107
Pa以上且1.0×1010
Pa以下之範圍,則成形後之形狀穩定性優異,故而較佳。
就該觀點而言,較佳為於上述被覆部I之儲存彈性模數E'(MF)為5.0×107
~1.0×1010
Pa之狀態下結束成形,其中更佳為於為1.0×108
Pa以上或8.0×109
Pa以下之狀態下結束成形,其中更佳為於為1.0×109
Pa以上或5.0×109
Pa以下之狀態下結束成形。
據此,於本步驟中,更佳為於上述被覆部I之儲存彈性模數E'(MF)為、5.0×107
~8.0×109
Pa、或5.0×107
~5.0×109
Pa之狀態下結束成形,其中,較佳為於為1.0×108
~8.0×109
Pa、或1.0×108
~5.0×109
Pa之狀態下結束成形,最佳為於為1.0×109
~8.0×109
Pa、或1.0×109
~5.0×109
Pa之狀態下結束成形。
進而,更佳為於上述被覆部I之儲存彈性模數E'(MF)處於上述範圍之狀態且黏著材層之儲存彈性模數G'(SF)為1.0×104
Pa以上之狀態下結束成形。
若於上述被覆部I之儲存彈性模數E'(MF)為上述範圍之狀態下結束成形,則可獲得如上所述之效果,除此以外,若於黏著材層之儲存彈性模數G'(SS)為1.0×104
Pa以上之狀態下結束成形,則所成形之黏著材層可維持形狀。
就該觀點而言,較佳為於上述被覆部I之儲存彈性模數E'(MF)處於上述範圍之狀態且黏著材層之儲存彈性模數G'(SF)為1.0×104
Pa以上之狀態下結束成形,其中,進而較佳為於黏著材層之儲存彈性模數G'(SF)為5.0×104
Pa以上或5.0×107
Pa以下之狀態下結束成形,其中進而較佳為於為1.0×104
Pa以上或1.0×107
Pa以下之狀態下結束成形。
又,較佳為於上述被覆部I之表面溫度成為未達50℃之狀態下結束成形。例如,於加壓成形之情形時,較佳為於表面溫度成為未達50℃之狀態下打開模具。
若被覆部I之表面溫度未達50℃,且被覆部I之儲存彈性模數E'(MS)為5.0×107
~1.0×1010
Pa之範圍,則可抑制成形結束後於取出成形體時發生變形、或伴隨被覆部I之熱收縮而產生翹曲,故而較佳。
就該觀點而言,較佳為於被覆部I之表面溫度成為未達50℃之狀態下結束成形,其中較佳為於成為0℃以上或45℃以下之狀態下結束成形,其中較佳為於成為10℃以上或40℃以下之狀態下結束成形。
進而,較佳為上述成形開始時之被覆部I之儲存彈性模數E'(MS)與上述成形結束時之被覆部I之儲存彈性模數E'(MF)滿足以下之關係式(1)。
(1)・・E'(MF)/E'(MS)≧1.3
此處,若上述被覆部I之儲存彈性模數E'(MS)與上述成形結束時之被覆部I之儲存彈性模數E'(MF)滿足上述關係式(1),則於成形開始時軟至能夠成形之程度,且於成形結束後具有能夠維持所成形之形狀之程度之硬度,故而較佳。
就該觀點而言,較佳為E'(MF)/E'(MS)≧1.3,其中進而較佳為100≧E'(MF)/E'(MS)或E'(MF)/E'(MS)≧3.0,其中尤佳為50≧E'(MF)/E'(MS)或E'(MF)/E'(MS)≧5.0。但E'(MF)/E'(MS)之上限並不限定於此。
又,較佳為上述成形結束時之被覆部I之儲存彈性模數E'(MF)與上述成形結束時之黏著材層之儲存彈性模數G'(SF)滿足以下之關係式(2)。
(2)・・E'(MF)/G'(SF)≦1.0×107
此處,若上述成形結束時之被覆部I之儲存彈性模數E'(MF)與上述成形結束時之黏著材層之儲存彈性模數G'(SF)滿足上述關係式(2),則所成形之黏著材層可維持形狀。
就該觀點而言,較佳為E'(MF)/G'(SF)≦1.0×107
,其中進而較佳為1.0≦E'(MF)/G'(SF)或E'(MF)/G'(SF)≦5.0×106
,其中進而較佳為1.0×101
≦E'(MF)/G'(SF)或E'(MF)/G'(SF)≦1.0×106
。
雖然有所重複,但於本製造方法1中,可利用模具加壓成形,於開模後加以冷卻,亦可預先將模具冷卻,於加壓成形之同時進行冷卻。若如此預先將模具冷卻,於加壓成形之同時進行冷卻,則可同時結束成形與冷卻。藉此,可於結束成形及冷卻後立即將賦形黏著片材積層體搬送至下一步驟,故而可連續地製造賦形黏著片材積層體。
於在模具成形之同時進行冷卻之情形時,模具之表面溫度較佳為0~50℃。
若模具之表面溫度為50℃以下,則可於短時間內固定黏著片材積層體之形狀,所獲得之成形體精度良好,且可抑制伴隨成形後之冷卻過程中之熱收縮之翹曲,就該觀點而言較佳。
因此,模具之表面溫度較佳為0~50℃,其中進而較佳為10℃以上或40℃以下,其中較佳為15℃以上或30℃以下。
再者,加壓壓力、加壓時間等加壓成形之條件並無特別限定,根據所成形之尺寸或形狀、所使用之材料等適當調整即可。
(其他)
上述成形、冷卻步驟中獲得之賦形黏著片材積層體可直接捲取,又,亦可進行熱處理,又,亦可裁斷為特定之大小及形狀。
於裁斷時,例如可列舉使用湯姆生刀(Thomson blade)或旋切刀等進行裁斷之方法。
於本製造方法1中,較佳為連續製造賦形黏著片材積層體。
例如可將黏著片材積層體搬送至加熱單元、例如加熱器中,於該加熱單元中將搬送停止特定時間進行加熱,或一邊搬送一邊加熱後,將經加熱之黏著片材積層體搬送至成形單元、例如成形模具中,於該成形單元中,例如藉由經冷卻之模具進行加壓,於成形之同時進行冷卻,進而視需要搬送至下一單元中,而連續地製造賦形黏著片材積層體。
<本製造方法2>
作為本發明之實施形態之一例,提出一種賦形黏著片材積層體之製造方法(稱為「本製造方法2」),該賦形黏著片材積層體係具備具有黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I,且於該黏著材之一面賦形凹部、凸部或凹凸部(稱為「黏著材層表面凹凸部」)而成之構成者,該製造方法之特徵在於:其係對具備黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I之黏著片材積層體進行加熱,利用模具將經加熱之黏著片材積層體成形而製造賦形黏著片材積層體之製造方法,且對黏著片材積層體進行加熱,於被覆部I之表面溫度為70~180℃之狀態下開始成形,於被覆部I之表面溫度成為未達60℃後從模具取出賦形黏著片材積層體。
根據本製造方法2,藉由對黏著片材積層體進行加熱,於被覆部I之表面溫度為70~180℃之狀態下開始成形,於被覆部I之表面溫度成為未達60℃後從模具取出賦形黏著片材積層體,而例如可於黏著材層表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀。
本製造方法2係包括加熱下文所述之黏著片材積層體(加熱步驟)、將經加熱之黏著片材積層體成形並且冷卻(成形、冷卻步驟)之步驟之製造方法。
本製造方法2只要包括上述加熱步驟及上述成形、冷卻步驟,則亦可包括其他步驟。例如可視需要包括熱處理步驟、搬送步驟、切條步驟、裁斷步驟等步驟。但並不限定於該等步驟。
(黏著片材積層體)
作為本製造方法2中之起始構件之黏著片材積層體具備黏著材層及以可剝離之方式積層於該黏著材層之一面而成之被覆部I即可,亦可具備其他構件。例如,如圖1所示,可例示具備黏著材層、以可剝離之方式積層於該黏著材層之正面及背面之一側而成之被覆部I、及以可剝離之方式積層於該黏著材層之正面及背面之另一側而成之被覆部II之黏著片材積層體。但是否具備被覆部II為任意,亦可採用不積層被覆部II之構成。
再者,關於黏著片材積層體之詳細情況係如上文所述。
(加熱步驟)
於本步驟中,加熱上述黏著片材積層體而使被覆部I之表面溫度成為70~180℃。
若被覆部I之表面溫度為70℃以上,則黏著材層充分軟化,且可使被覆部I能夠充分變形,若為180℃以下,則可抑制由熱收縮引起之褶皺之產生、或由熱引起之黏著材層之分解等弊端,故而較佳。
就該觀點而言,較佳為加熱上述黏著片材積層體而使被覆部I之表面溫度成為70~180℃,其中更佳為使其成為75℃以上或150℃以下,其中更佳為使其成為80℃以上或120℃以下。
據此,更佳為加熱上述黏著片材積層體而使被覆部I之表面溫度成為70~150℃、或70~120℃,其中,進而較佳為使其成為75~150℃、或75~120℃,最佳為使其成為80~150℃、或80~120℃。
作為黏著片材積層體之加熱方法,例如可列舉:使黏著片材積層體存在於內部具備電熱加熱器等加熱體之上下之加熱板之間而從上下加熱之方法、或以加熱板直接夾持之方法、使用加熱輥之方法、將其浸漬於熱水中之方法等。但並不限定於該等方法。
(成形、冷卻步驟)
於本步驟中,較佳為於如上述般將被覆部I之表面溫度加熱至70~180℃之狀態下開始黏著片材積層體之成形。即,較佳為直接將積層黏著材層及被覆部I而成為一體之狀態之黏著片材積層體進行成形。藉此,可於將被覆部I成形之同時,亦介隔該被覆部I而將黏著材層成形。
於本步驟中,可於將經加熱之黏著片材積層體成形後進行冷卻,又,亦可於成形之同時進行冷卻。例如藉由利用經冷卻之模具進行加壓,可同時進行成形與冷卻並且同時結束。藉此,可如下文所述般連續地實施本製造方法2。
作為成形方法,只要可以一體方式對黏著片材積層體賦形凹凸形狀,則並不特別限定成形方法。例如可列舉:加壓成形、真空成形、壓空成形、利用輥進行之賦形(輥壓成形)、壓縮成形、利用積層進行之賦形等。其中,就成形性及加工性之觀點而言,尤佳為加壓成形。
於使用模具進行成形之情形時,模具之材質並無特別限定。例如可列舉聚矽氧樹脂或氟樹脂等樹脂系材料、不鏽鋼或鋁等金屬系材料等。其中,由於對被黏著體之凹凸賦形要求高精度之成形性,因此尤佳為能夠控制成形時之溫度之金屬系之模具。
模具之冷卻方法可採用通常進行之冷卻方法。例如可列舉水冷或利用壓縮空氣之冷卻方法。
對於模具,例如藉由如圖2所示,預先於開閉之一對模具中之至少一模具之內壁面設置特定之凹凸形狀,例如設置與黏著黏著材層之被黏著體之貼合面中的凹部、凸部或凹凸部相符之凹凸形狀,而可藉由使用該模具將黏著片材積層體進行加壓成形、真空成形、壓空成形或輥壓成形,將上述凹凸形狀轉印至黏著片材積層體而賦形。
如上所述,較佳為於上述被覆部I之表面溫度為70~180℃之狀態下開始成形。若該被覆部I之表面溫度為70℃以上,則黏著材層充分軟化,且可使被覆部I能夠充分變形,若為180℃以下,則可抑制由熱收縮引起之褶皺之產生、或由熱引起之黏著材層之分解等弊端,故而較佳。
因此,較佳為於被覆部I之表面溫度為70~180℃之狀態下開始成形,其中更佳為使其成為75℃以上或150℃以下,其中更佳為使其成為80℃以上或120℃以下。
另一方面,於本步驟中,較佳為於上述被覆部I之表面溫度成為未達60℃之狀態下結束成形。例如,於加壓成形之情形時,較佳為於表面溫度成為未達60℃之狀態下打開模具。
此處,所謂「結束成形」意指結束對黏著片材積層體施加成形壓力,若為模具成形,則意指打開模具。
若被覆部I之表面溫度未達60℃,則可抑制成形結束後於取出成形體時發生變形、或伴隨被覆部I之熱收縮而產生翹曲,故而較佳。
就該觀點而言,較佳為於被覆部I之表面溫度成為未達60℃之狀態下結束成形,其中較佳為於成為0℃以上或50℃以下之狀態下結束成形,其中較佳為於成為10℃以上或40℃以下之狀態下結束成形。
雖然有所重複,但於本製造方法2中,可利用模具加壓成形,於開模後加以冷卻,亦可預先將模具冷卻,於加壓成形之同時進行冷卻。若如此預先將模具冷卻,於加壓成形之同時進行冷卻,則可同時結束成形與冷卻。藉此,可於結束成形及冷卻後立即將賦形黏著片材積層體搬送至下一步驟,故而可連續地製造賦形黏著片材積層體。
於在模具成形之同時進行冷卻之情形時,模具之表面溫度較佳為未達60℃。
若模具之表面溫度未達60℃,則可於短時間內固定黏著片材積層體之形狀,所獲得之成形體精度良好,且可抑制伴隨成形後之冷卻過程中之熱收縮之翹曲,就該觀點而言較佳。
因此,模具之表面溫度較佳為未達60℃,其中進而較佳為0℃以上或50℃以下,其中進而較佳為10℃以上或40℃以下。
又,成形開始時與成形結束時之被覆部I之表面溫度之差較佳為10~100℃,其中進而較佳為20℃以上或90℃以下。藉由上述被覆部I之表面溫度之差為10~100℃,例如於將上述凹凸形狀轉印至黏著片材積層體而賦形時,可於結束成形及冷卻後立即將賦形黏著片材積層體搬送至下一步驟,故而可連續地製造賦形黏著片材積層體。
再者,加壓壓力、加壓時間等加壓成形之條件並無特別限定,根據所成形之尺寸或形狀、所使用之材料等適當調整即可。
(其他)
上述成形、冷卻步驟中獲得之賦形黏著片材積層體可直接捲取,又,亦可進行熱處理,又,亦可裁斷為特定之大小及形狀。
於裁斷時,例如可列舉使用湯姆生刀(Thomson blade)或旋切刀等進行裁斷之方法。
於本製造方法2中,較佳為連續製造賦形黏著片材積層體。
例如可將黏著片材積層體搬送至加熱單元、例如加熱器中,於該加熱單元中將搬送停止特定時間進行加熱,或一邊搬送一邊加熱後,將經加熱之黏著片材積層體搬送至成形單元、例如成形模具中,於該成形單元中,例如藉由經冷卻之模具進行加壓,於成形之同時進行冷卻,進而視需要搬送至下一單元中,而連續地製造賦形黏著片材積層體。
<用途>
此處,對本賦形黏著片材積層體1之利用用途之一例進行說明。
近年,隨著行動電話或智慧型手機、平板終端等通用化,因使用者失誤將其掉落等導致圖像顯示部受損之事例偏多。尤其是於圖像顯示裝置為觸控面板方式之情形時,不僅因破損而變得難以觀察到顯示,而且因物理障礙或水之滲入等導致觸控面板操作本身無法進行、或成為故障之原因。因此,存在進行僅更換圖像顯示部之維修、即修理之情形。
於圖像顯示裝置之維修中,於安裝新圖像顯示部時亦使用黏著片材。通常,維修較多情況下係修理作業者以手工作業進行,修理作業者必須熟練。即,若非熟練者,則於介隔黏著片材安裝圖像顯示部時,空氣會進入內部,或會擠出黏著材。
與此相對,若使用本賦形黏著片材積層體1,則由於可預先賦予精度較高之階差形狀等,因此例如藉由預先對黏著材層賦予與圖像顯示裝置之機種相對應之階差形狀,而可大幅簡化維修作業,無需修理作業者之熟練亦可實施。如上所述,本發明之黏著片材積層體可有用地用於圖像顯示裝置之維修。
<語句之說明>
於本說明書中,於表述為「X~Y」(X、Y為任意之數字)之情形時,若無特別說明,則表示「X以上且Y以下」之含義,並且亦包含「較佳為大於X」或「較佳為小於Y」之含義。
又,於表述為「X以上」(X為任意之數字)或「Y以下」(Y為任意之數字)之情形時,亦包含「較佳為大於X」或「較佳為未達Y」之含義。
於本發明中,片材與膜之邊界並不確定,於本發明中不必於文語上將兩者加以區別,故而於本發明中,稱為「膜」之情形時亦包含「片材」,稱為「片材」之情形時亦包含「膜」。
實施例
以下,藉由實施例進一步具體地說明本發明。但本發明並不限定於實施例。
[實施例、比較例之群1]
<被覆部1-I>
實施例1-1~1-3及比較例1-1(以下亦統稱為「實施例、比較例之群1」)中之黏著片材積層體之被覆部1-I使用以下之被覆部1-A~被覆部1-D。將各自之儲存彈性模數之值示於表1。
・被覆部1-A:於雙軸延伸間苯二甲酸共聚合PET膜(厚度:75 μm)之單面積層包含聚矽氧系化合物之離型層(厚度:2 μm)而成之膜。
・被覆部1-B:於包含4-甲基戊烯-1之未延伸之聚烯烴膜(厚度:50 μm)之單面積層包含改性聚烯烴之離型層(厚度:38 μm)而成之膜。
・被覆部1-C:包含含有未延伸聚丙烯之聚烯烴膜(厚度:70 μm)之膜。
・被覆部1-D:於雙軸延伸均聚PET膜(厚度:75 μm)之單面積層包含聚矽氧系化合物之離型層(厚度:2 μm)而成之膜。
<實施例1-1>
(雙面黏著片材之製作)
將作為(甲基)丙烯酸系共聚物(1-a)之數量平均分子量2400之聚甲基丙烯酸甲酯巨單體(Tg:105℃)15質量份(18 mol%)、丙烯酸丁酯(Tg:-55℃)81質量份(75 mol%)及丙烯酸(Tg:106℃)4質量份(7 mol%)無規共聚合而成之丙烯酸系共聚物(1-a-1)(重量平均分子量23萬)1 kg、作為交聯劑(1-b)之甘油二甲基丙烯酸酯(日油公司製造,製品名:GMR)(1-b-1)90 g、及作為光聚合起始劑(1-c)之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,製品名:Esacure TZT)(1-c-1)15 g均勻地混合,而製作黏著材層所使用之樹脂組合物1-1。所獲得之樹脂組合物之玻璃轉移溫度為-5℃。
利用經離型處理之PET膜(三菱樹脂公司製造,製品名:Diafoil MRV-V06,厚度:100 μm)與被覆部1-A之2片將所獲得之樹脂組合物1-1夾持,使用貼合機以樹脂組合物1-1之厚度成為100 μm之方式賦形為片材狀,而製作黏著片材積層體1-1。再者,以與樹脂組合物1-1相接之方式配置被覆部1-A之離型層側。
所獲得之黏著片材積層體1-1係使用真空壓空成形機(第一實業公司製造,FKS-0632-20形),藉由以下之製程進行熱成形,而製作賦形黏著片材積層體1-1。
即,藉由預熱為400℃之IR加熱器,加熱至黏著片材積層體1-1之表面達到100℃,繼而使用冷卻為25℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,而製作對表面賦形凹凸而成之賦形黏著片材積層體1-1。
<實施例1-2>
使用被覆部1-B代替上述被覆部1-A,除此以外,以與實施例1-1同樣之方式,製作黏著片材積層體1-2及賦形黏著片材積層體1-2。
<實施例1-3>
使用被覆部1-C代替上述被覆部1-A,除此以外,以與實施例1-1同樣之方式,製作黏著片材積層體1-3及賦形黏著片材積層體1-3。
<比較例1-1>
使用被覆部1-D代替上述被覆部1-A,除此以外,以與實施例1-1同樣之方式,製作黏著片材積層體1-4及賦形黏著片材積層體1-4。
<測定及評價方法>
對實施例1-1~1-3、比較例1-1中獲得之樣品之各種物性值之測定方法及評價方法進行說明。
(被覆部之彈性模數)
將實施例、比較例之群1所使用之被覆部1-A~1-D分別切成長度50 mm、寬度4 mm,使用動態黏彈性裝置(IT Meter and Control股份有限公司之DVA-200),以夾頭間距為25 mm並且施加1%之形變而進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。將所獲得之資料的於100℃下之儲存彈性模數之值設為E'(MA),將於30℃下之儲存彈性模數之值設為E'(MB)。
(黏著材層之彈性模數)
將實施例、比較例之群1中獲得之黏著材層重疊而積層為1 mm之厚度,使用流變儀(Thermo Fisher Scientific公司製造之MARSII)進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。
將所獲得之資料的於100℃下之儲存彈性模數之值設為G'(SA),將損耗彈性模數之值設為G''(SA),將於30℃下之儲存彈性模數之值設為G'(SB),將損耗彈性模數之值設為G''(SB),將各溫度條件下之G''/G'之值設為各黏著材層之損耗正切tanδ(SA,SB)。
(凝膠分率)
黏著材層之凝膠分率係分別採集約0.05 g之實施例、比較例之群1中獲得之黏著材層,藉由預先測定質量(X)之SUS絲網(#200)包裹為袋狀,將袋口彎折封閉,測定該包裹之質量(Y)後,將其浸漬於100 ml之乙酸乙酯中,於23℃下在暗處保管24小時後,取出包裹於70℃下加熱4.5小時而使所附著之乙酸乙酯蒸發,測定經乾燥之包裹之質量(Z),將所求出之質量代入下述式中而求出。
凝膠分率[%]=[(Z-X)/(Y-X)]×100
(成形性)
為了確認成形性,而使用以下所說明之模具實施實施例、比較例之群1之成形測試。即,如圖5所示,成形用之模具之上下一模具為長度270 mm、寬度170 mm、厚度40 mm之凸模具,上下另一模具為長度270 mm、寬度170 mm、厚度40 mm之鋁平板。
對於上述凸模具之成形面,如圖5所示,於中央設置縱187 mm、橫125 mm、高1 mm之凸部,進而,於該凸部之成形面內設置深度為25 μm、50 μm、75 μm、100 μm之4個俯視長方形狀(縱89 mm、橫58 mm)之成形凹部。
將藉由實施例、比較例之群1所記載之方法獲得之賦形有凹凸之賦形黏著片材積層體之被覆部1-A~1-D剝離,分別使用掃描式白色干涉顯微鏡,以非接觸方式計測相當於印刷階差之凹部與相當於顯示器面之凸部之高度。
計測成形體之凸部(與凹部之邊界部)相對於模具之深度100 μm之高度h,將由下述計算式導出之轉印率為50%以上者評價為○,將未達50%者評價為×。
轉印率(%)=h(成形體高度)/100(模具深度)×100
(剝離力)
將實施例、比較例之群1中所製作之黏著片材積層體切成長度150 mm、寬度50 mm,對被覆部1-A~1-D與黏著材層之界面以試驗速度300 mm/min進行180°剝離試驗。
將30℃環境下之剝離力設為F(C),將於100℃下加熱5分鐘後使其自然冷卻至30℃後之剝離力設為F(D),以所獲得之值分別作為被覆部1-A~1-D之剝離力。
將實施例及比較例中獲得之黏著片材積層體1-1~1-4及賦形黏著片材積層體1-1~1-4之評價結果示於表1。
[表1] 實施例1-1 實施例1-2 實施例1-3 比較例1-1
被覆部1-I 被覆部1-A 被覆部1-B 被覆部1-C 被覆部1-D
厚度 (μm) 75 50 70 75
儲存彈性模數E'(MA) (Pa) 2.1×108 1.9×108 1.7×108 2.3×109
儲存彈性模數E'(MB) (Pa) 2.8×109 1.6×109 1.0×109 4.0×109
E'(MB)/E'(MA) 13.3 8.4 5.9 1.7
黏著材層 儲存彈性模數
G'(SA) (Pa) 2.9×102 2.9×102 2.9×102 2.9×102
損耗彈性模數
G"(SA) (Pa) 1.4×103 1.4×103 1.4×103 1.4×103
tanδ(SA) 4.7 4.7 4.7 4.7
儲存彈性模數
G'(SB) (Pa) 6.1×104 6.1×104 6.1×104 6.1×104
損耗彈性模數
G''(SB) (Pa) 3.8×104 3.8×104 3.8×104 3.8×104
tanδ(SB) 0.6 0.6 0.6 0.6
凝膠分率 (%) 0 0 0 0
E'(MA)/G'(SA) 7.2×105 6.5×105 5.9×105 7.9×107
剝離力F(C) (N/cm) 0.04 0.06 0.05 0.03
剝離力F(D) (N/cm) 0.04 0.05 0.05 0.03
剝離力之差
|F(C)-F(D)| (N/cm) 0 0.01 0 0
成形性 〇 〇 〇 ×
(轉印率) (%) 80 85 75 20
根據表1及圖4之結果以及至此為止之試驗結果,確認到如實施例1-1至實施例1-3所示,藉由將於30℃下之儲存彈性模數E'(MB)為5.0×107
~1.0×1010
Pa且於100℃下之儲存彈性模數E'(MA)為1.0×106
~2.0×109
Pa之被覆部積層於黏著材層進行成形,而可對黏著材層高精度地賦形凹凸形狀。
另一方面,如比較例1-1所示,於使用通常廣泛使用之雙軸延伸均聚PET膜作為離型膜之情形時,即使於高溫範圍內被覆部之儲存彈性模數亦超過2.0×109
Pa,故而即使進行熱成形亦無法對黏著材層賦形充分之凹凸。
由此得知,藉由將於30℃下之儲存彈性模數E'(MB)為5.0×107
~1.0×1010
Pa且於100℃下之儲存彈性模數E'(MA)為1.0×106
~2.0×109
Pa之被覆部積層於黏著材層進行成形,而可良好地獲得賦形有凹凸之賦形黏著片材。
亦得知:藉由使用進而較佳為滿足黏著材層於100℃下之損耗正切tanδ(A)為1.0以上之條件且滿足黏著材層於30℃下之損耗正切tanδ(B)未達1.0之條件之黏著片材積層體,而可達成更高精度之賦形。
因此確認,藉由使用如上述之黏著片材積層體,精度良好地賦形相當於成為被黏著體之圖像顯示裝置之印刷階差的凹凸,而可製造與被黏著體之間無間隙、且即使於如印刷部為窄邊緣設計之被黏著體中黏著材亦可不溢出而良好地密接貼合之圖像顯示裝置用賦形黏著片材積層體。
又,就剝離力而言,測定剝離力F(D)時之加熱冷卻條件、即於100℃下加熱5分鐘後使其自然冷卻至30℃之條件係製造賦形黏著片材積層體時之典型之加熱冷卻條件。由於上述實施例中剝離力F(C)與剝離力F(D)之差之絕對值均為0.1 N/cm以下,故而確認賦形黏著片材積層體中之被覆部1-A~1-D之剝離力與黏著片材積層體中之被覆部1-A~1-D之剝離力相同。
[實施例、比較例之群2]
<被覆部2-I>
作為實施例2-1~2-4及比較例2-1(以下亦統稱為「實施例、比較例之群2」)中之黏著片材積層體之被覆部I,使用於雙軸延伸間苯二甲酸共聚合PET膜(厚度:75 μm)之單面積層包含聚矽氧系化合物之離型層(厚度:2 μm)而成之膜。將各自之儲存彈性模數之值示於表2。
<實施例2-1>
(雙面黏著片材之製作)
將作為(甲基)丙烯酸系共聚物(2-a)之數量平均分子量2400之聚甲基丙烯酸甲酯巨單體(Tg:105℃)15質量份(18 mol%)、丙烯酸丁酯(Tg:-55℃)81質量份(75 mol%)及丙烯酸(Tg:106℃)4質量份(7 mol%)無規共聚合而成之丙烯酸系共聚物(2-a-1)(重量平均分子量23萬)1 kg、作為交聯劑(2-b)之甘油二甲基丙烯酸酯(日油公司製造,製品名:GMR)(2-b-1)90 g、及作為光聚合起始劑(2-c)之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,製品名:Esacure TZT)(2-c-1)15 g均勻地混合,而製作黏著材層所使用之樹脂組合物2-1。所獲得之樹脂組合物之玻璃轉移溫度為-5℃。
利用經離型處理之PET膜(三菱樹脂公司製造,製品名:Diafoil MRV-V06,厚度:100 μm)與被覆部2-I之2片將所獲得之樹脂組合物2-1夾持,使用貼合機以樹脂組合物2-1之厚度成為100 μm之方式賦形為片材狀,而製作黏著片材積層體2-1。再者,以與樹脂組合物2-1相接之方式配置被覆部2-I之離型層側。
所獲得之黏著片材積層體2-1係使用真空壓空成形機(第一實業公司製造,FKS-0632-20形)及成形用模具,藉由以下之製程進行熱成形,而製作賦形黏著片材積層體2-1。
關於成形用之模具,如圖5所示,上下一模具為長度270 mm、寬度170 mm、厚度40 mm之凸模具,上下另一模具為長度270 mm、寬度170 mm、厚度40 mm之鋁平板。對於上述凸模具之成形面,如圖5所示,於中央設置縱187 mm、橫125 mm、高1 mm之凸部,進而,於該凸部之成形面內設置深度為25 μm、50 μm、75 μm、100 μm之4個俯視長方形狀(縱89 mm、橫58 mm)之成形凹部。
藉由預熱為400℃之IR加熱器,加熱至黏著片材積層體2-1之被覆部2-I之表面達到100℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為2.1×108
Pa且黏著材層之儲存彈性模數G'(SS)為2.9×102
Pa之狀態下,使用將模具表面溫度冷卻為30℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-1。
再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為13.3。
又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為4.6×104
。
又,成形開始時之黏著材層之損耗正切tanδ(SS)為4.8,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。
<實施例2-2>
對於實施例2-1所使用之黏著片材積層體2-1,使用預熱為400℃之IR加熱器,加熱至黏著片材積層體2-2之被覆部2-I之表面達到110℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為1.3×108
Pa且黏著材層之儲存彈性模數G'(SS)為9.6×101
Pa之狀態下,使用將模具表面溫度冷卻為30℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-2。
<實施例2-3>
對於實施例2-1所使用之黏著片材積層體2-1,使用預熱為400℃之IR加熱器,加熱至黏著片材積層體2-3之被覆部2-I之表面達到90℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為3.5×108
Pa且黏著材層之儲存彈性模數G'(SS)為8.9×102
Pa之狀態下,使用將模具表面溫度冷卻為30℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-3。
再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為8.0。
又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為4.6×104
。
又,成形開始時之黏著材層之損耗正切tanδ(SS)為2.7,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。
<實施例2-4>
對於實施例2-1所使用之黏著片材積層體2-1,使用預熱為400℃之IR加熱器,加熱至黏著片材積層體2-4之被覆部2-I之表面達到70℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為1.9×109
Pa且黏著材層之儲存彈性模數G'(SS)為6.4×103
Pa之狀態下,使用將模具表面溫度冷卻為25℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-4。
再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為1.4。
又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為4.6×104
。
又,成形開始時之黏著材層之損耗正切tanδ(SS)為1.4,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。
<比較例2-1>
對於實施例2-1所使用之黏著片材積層體2-1,使用預熱為400℃之IR加熱器,加熱至黏著片材積層體2-5之被覆部2-I之表面達到60℃並進行成形。即,於被覆部2-I之儲存彈性模數E'(MS)為2.4×109
Pa且黏著材層之儲存彈性模數G'(SS)為1.3×104
Pa之狀態下,使用將模具表面溫度冷卻為25℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,於被覆部2-I之儲存彈性模數E'(MF)為2.8×109
Pa且黏著材層之儲存彈性模數G'(SF)為6.1×104
Pa之狀態下打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體2-5。
再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為1.2。
又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為4.6×104
。
又,成形開始時之黏著材層之損耗正切tanδ(SS)為1.1,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。
再者,上述成形開始時之被覆部2-I之儲存彈性模數E'(MS)相對於上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)之比率E'(MF)/E'(MS)為8.0。
又,上述成形結束時之被覆部2-I之儲存彈性模數E'(MF)相對於上述成形結束時之黏著材層之儲存彈性模數G'(SF)之比率E'(MF)/G'(SF)為9.7×103
。
又,成形開始時之黏著材層之損耗正切tanδ(SS)為0.6,成形結束時之黏著材層之損耗正切tanδ(SF)為0.6。
<測定及評價方法>
對實施例2-1~2-4、比較例2-1中獲得之樣品之各種物性值之測定方法及評價方法進行說明。
(被覆部之彈性模數)
被覆部2-I之儲存彈性模數E'(MS)及E'(MF)係切成長度50 mm、寬度4 mm,使用動態黏彈性裝置(IT Meter and Control股份有限公司之DVA-200),以夾頭間距為25 mm並且施加1%之形變而進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。
將實施例及比較例之各成形開始時溫度下之儲存彈性模數之值設為E'(MS),將各成形結束時溫度下之儲存彈性模數之值設為E'(MF)。
再者,於實施例2-1中,由於成形開始時溫度為100℃,因此實施例2-1之儲存彈性模數E'(MS)係於100℃下之儲存彈性模數E'(MA)。
又,由於實施例、比較例之群2中成形結束時溫度均為30℃,因此關於任一實施例、比較例之群2,該E'(MF)均與30℃下之儲存彈性模數E'(MB)相同。
(黏著材層之彈性模數)
將實施例、比較例之群2中獲得之黏著材層重疊而積層為1 mm之厚度,使用流變儀(Thermo Fisher Scientific公司製造之MARSII)進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。
於所獲得之資料中,將100℃下之儲存彈性模數之值設為G'(SA),將損耗彈性模數之值設為G''(SA),將30℃下之儲存彈性模數之值設為G'(SB),將損耗彈性模數之值設為G''(SB),將各溫度條件下之G''/G'之值設為各黏著材層之損耗正切tanδ(SA,SB)。
另一方面,關於黏著材層之儲存彈性模數G'(SA)及G'(SB),將實施例、比較例之群2中獲得之黏著材層重疊而積層為1 mm之厚度,使用流變儀(Thermo Fisher Scientific公司製造之MARSII)進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。
於所獲得之資料中,將實施例、比較例之群2之各成形開始時溫度下的儲存彈性模數之值設為G'(SS),將損耗彈性模數之值設為G''(SS),將各成形結束時溫度下之儲存彈性模數之值設為G'(SF),將損耗彈性模數之值設為G''(SF),進而,將各溫度條件下之G''/G'之值設為各黏著材層之損耗正切tanδ(SS,SF)。
(凝膠分率)
關於黏著材層之凝膠分率,分別採集約0.05 g之實施例、比較例之群2中獲得之黏著材層,藉由預先測定質量(X)之SUS絲網(#200)包裹為袋狀,將袋口彎折封閉,測定該包裹之質量(Y)後,將其浸漬於100 ml之乙酸乙酯中,於23℃下在暗處保管24小時後,取出包裹於70℃下加熱4.5小時而使所附著之乙酸乙酯蒸發,測定經乾燥之包裹之質量(Z),將所求出之質量代入下述式中而求出。
凝膠分率[%]=[(Z-X)/(Y-X)]×100
(成形性)
將實施例、比較例之群2中獲得之賦形有凹凸之賦形黏著片材積層體之被覆部I剝離,分別使用掃描式白色干涉顯微鏡,以非接觸方式計測相當於印刷階差之凹部與相當於顯示器面之凸部之高度。
計測成形體之凸部(與凹部之邊界部)相對於模具之深度100 μm之高度h,將由下述計算式導出之轉印率為50%以上者評價為○,將未達50%者評價為×。
轉印率(%)=h(成形體高度)/100(模具深度)×100
(剝離力)
將實施例、比較例之群2中所製作之黏著片材積層體切成長度150 mm、寬度50 mm,對被覆部2-I與黏著材層之界面以試驗速度300 mm/min進行180°剝離試驗。
將30℃環境下之剝離力設為F(C),將於100℃下加熱5分鐘後使其自然冷卻至30℃後之剝離力設為F(D),以所獲得之值分別作為被覆部2-I之剝離力。
將實施例2-1~2-4及比較例2-1中獲得之賦形黏著片材積層體2-1~2-5之評價結果示於表2。
[表2] 實施例2-1 實施例2-2 實施例2-3 實施例2-4 比較例2-1
被覆部2-I 儲存彈性模數
E'(MS) (Pa) 2.1×108 1.3×108 3.5×108 1.9×109 2.4×109
儲存彈性模數
E'(MF) (Pa) 2.8×109 2.8×109 2.8×109 2.8×109 2.8×109
黏著材層 儲存彈性模數
G'(SS) (Pa) 2.9×102 9.6×101 8.9×102 6.4×103 1.3×104
損耗彈性模數
G"(SS) (Pa) 1.4×103 7.9×102 2.4×103 8.7×103 1.4×104
tanδ(SS) (-) 4.8 8.2 2.7 1.4 1.1
儲存彈性模數
G'(SF) (Pa) 6.1×104 6.1×104 6.1×104 6.1×104 6.1×104
損耗彈性模數
G''(SF) (Pa) 3.8×104 3.8×104 3.8×104 3.8×104 3.8×104
tanδ(SF) (-) 0.6 0.6 0.6 0.6 0.6
E'(MF)/E'(MS) (-) 13.3 21.5 8 1.5 1.2
E'(MF)/G'(SF) (-) 4.6×104 4.6×104 4.6×104 4.6×104 4.6×104
凝膠分率 (%) 0 0 0 0 0
剝離力F(C) (N/cm) 0.04 0.04 0.04 0.04 0.04
剝離力F(D) (N/cm) 0.04 0.04 0.04 0.04 0.04
|剝離力F(C)-剝離力F(D)| (N/cm) 0 0 0 0 0
成形開始溫度 (℃) 100 110 90 70 60
成形結束溫度 (℃) 30 30 30 30 30
成形性 (-) 〇 〇 〇 〇 ×
轉印率 (%) 80 75 80 70 40
根據表2及圖4之結果以及至此為止之試驗結果,確認到如實施例2-1至實施例2-4所示,藉由以成形開始時之被覆部2-I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa,且成形結束時之被覆部2-I之儲存彈性模數E'(MF)成為5.0×107
~1.0×1010
Pa之方式調整並進行成形,可對黏著材層高精度地賦形凹凸形狀。
另一方面,如比較例2-1所示,於成形開始時之被覆部2-I之儲存彈性模數E'(MS)大於2.0×109
Pa之情形時,即使進行熱成形亦無法對黏著材層賦形充分之凹凸。
由此得知,藉由以成形開始時之被覆部2-I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa且成形結束時之被覆部2-I之儲存彈性模數E'(MF)成為5.0×107
~1.0×1010
Pa之方式調整並進行成形,而可良好地獲得賦形有凹凸之賦形黏著片材。
亦得知:藉由以進而較佳為滿足成形開始時之黏著材層之損耗正切tanδ(SS)為1.0以上之條件且滿足成形結束時之黏著材層之損耗正切tanδ(SF)未達1.0之條件之方式調整並進行成形,而可達成更高精度之賦形。
因此確認,藉由使用如上述之黏著片材積層體,精度良好地賦形相當於成為被黏著體之圖像顯示裝置之印刷階差的凹凸,而可製造與被黏著體之間無間隙、且即使於如印刷部為窄邊緣設計之被黏著體中黏著材亦可不溢出而良好地密接貼合之圖像顯示裝置用賦形黏著片材積層體。
又,就剝離力而言,測定剝離力F(D)時之加熱冷卻條件、即於100℃下加熱5分鐘後使其自然冷卻至30℃之條件係製造賦形黏著片材積層體時之典型之加熱冷卻條件。由於上述實施例中剝離力F(C)與剝離力F(D)之差之絕對值均為0.1 N/cm以下,因此確認剝離力於加熱前後幾乎無變化。
進而得知,藉由加熱黏著片材積層體,於被覆部2-I之儲存彈性模數E'(MS)為1.0×106
~2.0×109
Pa之狀態下開始成形,於被覆部2-I之儲存彈性模數E'(MF)為5.0×107
~1.0×1010
Pa之狀態下結束成形,而可於黏著材層表面高精度地形成與被黏著體表面之凹凸部相符之凹凸形狀。
[實施例、比較例之群3]
<被覆部3-I>
作為實施例3-1~3-3及比較例3-1~3-2(以下亦統稱為「實施例、比較例之群3」)中之黏著片材積層體之被覆部3-I,使用於雙軸延伸間苯二甲酸共聚合PET膜(厚度:75 μm)之單面積層包含聚矽氧系化合物之離型層(厚度:2 μm)而成之膜。將各自之儲存彈性模數之值示於表3。
<實施例3-1>
(雙面黏著片材之製作)
將作為(甲基)丙烯酸系共聚物(3-a)之數量平均分子量2400之聚甲基丙烯酸甲酯巨單體(Tg:105℃)15質量份(18 mol%)、丙烯酸丁酯(Tg:-55℃)81質量份(75 mol%)及丙烯酸(Tg:106℃)4質量份(7 mol%)無規共聚合而成之丙烯酸系共聚物(3-a-1)(重量平均分子量23萬)1 kg、作為交聯劑(3-b)之甘油二甲基丙烯酸酯(日油公司製造,製品名:GMR)(3-b-1)90 g、及作為光聚合起始劑(3-c)之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,製品名:Esacure TZT)(3-c-1)15 g均勻地混合,而製作黏著材層所使用之樹脂組合物3-1。所獲得之樹脂組合物之玻璃轉移溫度為-5℃。
利用經離型處理之PET膜(三菱樹脂公司製造,製品名:Diafoil MRV-V06,厚度:100 μm)與被覆部3-I之2片將所獲得之樹脂組合物3-1夾持,使用貼合機以樹脂組合物3-1之厚度成為100 μm之方式賦形為片材狀,而製作黏著片材積層體3-1。再者,以與樹脂組合物3-1相接之方式配置被覆部3-I之離型層側。
所獲得之黏著片材積層體3-1係使用真空壓空成形機(第一實業公司製造,FKS-0632-20形)及成形用模具,藉由以下之製程進行熱成形,而製作賦形黏著片材積層體3-1。
關於成形用之模具,如圖5所示,上下一模具為長度270 mm、寬度170 mm、厚度40 mm之凸模具,上下另一模具為長度270 mm、寬度170 mm、厚度40 mm之鋁平板。對於上述凸模具之成形面,如圖5所示,於中央設置縱187 mm、橫125 mm、高1 mm之凸部,進而,於該凸部之成形面內設置深度為25 μm、50 μm、75 μm、100 μm之4個俯視長方形狀(縱89 mm、橫58 mm)之成形凹部。
藉由預熱為400℃之IR加熱器,加熱至黏著片材積層體3-1之被覆部3-I之表面達到100℃,使用將模具表面溫度冷卻為30℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-1。
<實施例3-2>
使用預熱為400℃之IR加熱器,將實施例3-1中所使用之黏著片材積層體3-1加熱至黏著片材積層體3-2之被覆部3-I之表面達到70℃,使用將模具表面溫度冷卻為30℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-2。
<實施例3-3>
使用預熱為400℃之IR加熱器,將實施例3-1中所使用之黏著片材積層體3-1加熱至黏著片材積層體3-3之被覆部3-I之表面達到100℃,使用將模具表面溫度調整為50℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-3。
<比較例3-1>
使用預熱為400℃之IR加熱器,將實施例3-1中所使用之黏著片材積層體3-1加熱至黏著片材積層體3-5之被覆部3-I之表面達到60℃,使用將模具表面溫度冷卻為30℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-4。
<比較例3-2>
使用預熱為400℃之IR加熱器,將實施例3-1中所使用之黏著片材積層體3-1加熱至黏著片材積層體3-5之被覆部3-I之表面達到100℃,使用將模具表面溫度調整為80℃之成形用模具,將該加熱狀態之黏著片材積層體3-1於鎖模壓8 MPa之條件下進行5秒之加壓成形後打開模具,而製作對表面賦形凹凸而成之賦形黏著片材積層體3-5。
<測定及評價方法>
對實施例3-1~3-3及比較例3-1~3-2中獲得之樣品之各種物性值之測定方法及評價方法進行說明。
(被覆部之彈性模數)
被覆部3-I之儲存彈性模數係切成長度50 mm、寬度4 mm,使用動態黏彈性裝置(IT Meter and Control股份有限公司之DVA-200),以夾頭間距為25 mm並且施加1%之形變而進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。
於所獲得之資料中,將30℃下之被覆部3-I之儲存彈性模數之值設為E'(MB),將100℃下之被覆部3-I之儲存彈性模數之值設為E'(MA)。
(黏著材層之彈性模數)
將實施例、比較例之群3中獲得之黏著材層重疊而積層為1 mm之厚度,使用流變儀(Thermo Fisher Scientific公司製造之MARSII)進行測定。於測定溫度範圍為-50℃~150℃、頻率為1 Hz、升溫速度為3℃/min之條件下進行測定。
於所獲得之資料中,將100℃下之儲存彈性模數之值設為G'(SA),將損耗彈性模數之值設為G''(SA),將30℃下之儲存彈性模數之值設為G'(SB),將損耗彈性模數之值設為G''(SB),將各溫度條件下之G''/G'之值設為各黏著材層之損耗正切tanδ(SA,SB)。
(成形性)
將實施例、比較例之群3中獲得之賦形有凹凸之賦形黏著片材積層體之被覆部I剝離,分別使用掃描式白色干涉顯微鏡,以非接觸方式計測相當於印刷階差之凹部與相當於顯示器面之凸部之高度。
計測成形體之凸部(與凹部之邊界部)相對於模具之深度100 μm之高度h,將由下述計算式導出之轉印率為50%以上者評價為「○」,將未達50%者評價為「×」。
轉印率(%)=h(成形體高度)/100(模具深度)×100
(翹曲、彎曲)
將實施例、比較例之群3之各成形條件下所製作之黏著片材積層體切成長度100 mm之正方形,計測各頂點之高度。將所獲得之4點之高度進行平均而以該值作為翹曲。將翹曲之高度未達10 mm者判定為「○」,將為10 mm以上者判定為「×」。
(剝離力)
將實施例、比較例之群3中所製作之黏著片材積層體切成長度150 mm、寬度50 mm,對被覆部3-I與黏著材層之界面以試驗速度300 mm/min進行180°剝離試驗。
將30℃環境下之剝離力設為F(C),將於100℃下加熱5分鐘後使其自然冷卻至30℃後之剝離力設為F(D),以所獲得之值分別作為被覆部3-I之剝離力。
將實施例3-1~3-3及比較例3-1~3-2中獲得之賦形黏著片材積層體3-1~3-5之評價結果示於表3。
[表3] 實施例3-1 實施例3-2 實施例3-3 比較例3-1 比較例3-2
成形開始溫度 (℃) 100 70 100 60 100
成形結束溫度 (℃) 30 30 50 30 80
被覆部3-I 儲存彈性模數
E'(MS) (Pa) 2.1×108 2.0×108 2.1×108 2.4×109 2.1×108
儲存彈性模數
E'(MF) (Pa) 2.8×109 2.8×109 2.6×109 2.8×109 8.4×108
黏著材層 儲存彈性模數
G'(SS) (Pa) 2.9×102 6.4×103 2.9×102 1.3×104 2.9×102
損耗彈性模數
G"(SS) (Pa) 1.4×103 8.7×103 1.4×103 1.4×104 1.4×103
tanδ(SS) (-) 4.8 1.4 4.8 1.1 4.8
儲存彈性模數
G'(SF) (Pa) 6.1×104 6.1×104 2.5×104 6.1×104 2.6×103
損耗彈性模數
G"(SF) (Pa) 3.8×104 3.8×104 2.0×104 3.8×104 4.8×103
tanδ(SF) (-) 0.6 0.6 0.8 0.6 1.8
剝離力F(C) (N/cm) 0.04 0.04 0.04 0.04 0.04
剝離力F(D) (N/cm) 0.04 0.04 0.04 0.04 0.04
|剝離力F(C)-剝離力F(D)| (N/cm) 0 0 0 0 0
成形性 (%) 〇
80 〇
75 〇
80 ×
40 〇
80
翹曲、彎曲 (mm) 〇
6.3 〇
3.8 〇
8.2 〇
2.5 ×
11.8
綜合評價 (-) 〇 〇 〇 × ×
根據表3之結果以及至此為止之試驗結果,確認到如實施例3-1至實施例3-3所示,藉由以於被覆部3-I之表面溫度為70~180℃之狀態下開始成形,於被覆部3-I之表面溫度成為未達60℃後結束成形,並從模具取出成形品之方式進行成形,而可對黏著材層高精度地賦形凹凸形狀。
另一方面,如比較例3-1所示,若成形開始時之被覆部3-I之溫度未達70℃,則即使進行熱成形亦無法對黏著材層賦形充分之凹凸。
又,得知如比較例3-2所示,若於結束成形並從模具取出成形品時被覆部3-I之表面溫度為70℃以上,則伴隨片材之熱收縮,成形品會產生翹曲或彎曲而欠佳。
由此得知,為了更高精度地進行凹凸賦形,較佳為以於被覆部3-I之表面溫度為70~180℃之狀態下開始成形,於被覆部3-I之表面溫度成為未達60℃後結束成形,並從模具取出成形品之方式進行成形。
因此確認,藉由使用如上述之黏著片材積層體,精度良好地賦形相當於成為被黏著體之圖像顯示裝置之印刷階差的凹凸,而可製造與被黏著體之間無間隙、且即使於如印刷部為窄邊緣設計之被黏著體中黏著材亦可不溢出而良好地密接貼合之圖像顯示裝置用賦形黏著片材積層體。
又,就剝離力而言,測定剝離力F(D)時之加熱冷卻條件、即於100℃下加熱5分鐘後使其自然冷卻至30℃之條件係製造賦形黏著片材積層體時之典型之加熱冷卻條件。由於上述實施例中剝離力F(C)與剝離力F(D)之差之絕對值均為0.1 N/cm以下,因此確認剝離力於加熱前後幾乎無變化。
[實施例之群4]
以下之實施例4-1~4-5(以下亦統稱為「實施例之群4」)中所使用之聚酯原料之製造方法如下所述。
(聚酯4-A之製造方法)
取對苯二甲酸二甲酯100份、乙二醇70份、及乙酸鈣一水合物0.07份置於反應器中,進行加熱升溫並且將甲醇蒸餾去除而進行酯交換反應,反應開始後,需要約4個半小時升溫為230℃,而實質性地結束酯交換反應。
繼而,添加磷酸0.04份及三氧化銻0.035份,按照常規方法進行聚合。即,緩緩提高反應溫度,最終設為280℃,另一方面,緩緩降低壓力,最終設為0.05 mmHg。4小時後,結束反應,按照常規方法進行碎片化而獲得聚酯4-A。所獲得之聚酯碎片之極限黏度IV為0.70 dl/g。
(聚酯4-B之製造方法)
於上述聚酯4-A之製造方法中,作為二羧酸單元,將對苯二甲酸設為78 mol%,將間苯二甲酸設為22 mol%,除此以外,藉由與聚酯A相同之方法進行製造而獲得聚酯4-B。所獲得之聚酯碎片之極限黏度IV為0.70 dl/g。
(聚酯4-C之製造方法)
於製造上述聚酯4-A時,添加平均粒徑3 μm之非晶質二氧化矽6000 ppm,而製作聚酯4-C。
(聚酯4-D之製造方法)
於製造上述聚酯4-A時,添加平均粒徑4 μm之非晶質二氧化矽6000 ppm,而製作聚酯4-D。
[實施例4-1]
藉由熔融擠出機將分別以65重量%、30重量%、5重量%之比例混合上述聚酯4-B、4-A、及4-D而成之原料熔融擠出,而獲得單層之無定形片材。
繼而,將片材共擠出至經冷卻之流延鼓上,使其冷卻固化而獲得無配向片材。繼而,於80℃下沿機械方向(縱向)延伸3.4倍後,進一步於拉輻機內經過預熱步驟,而於80℃下沿與機械方向垂直之方向(橫向)延伸3.9倍。進行雙軸延伸後,於185℃下進行3秒之熱處理,其後沿寬度方向進行6.4%之鬆弛處理,而獲得厚度50 μm之聚酯膜。將評價結果示於下述表4。
[實施例4-2]、[實施例4-3]
除了變更為下述表4所示之條件以外,以與實施例4-1相同之方式獲得聚酯膜。將評價結果示於下述表4。
[實施例4-4]
以將上述聚酯4-A及4-C分別以86重量%、14重量%之比例混合而成之原料作為表層用之原料,以將聚酯4-B及4-A分別以45重量%、55重量%之比例混合而成之原料作為中間層用之原料。分別藉由不同之熔融擠出機熔融擠出,而獲得2種3層積層(表層/中間層/表層)之無定形片材。
繼而,藉由將片材共擠出至經冷卻之流延鼓上,並使其冷卻固化,而獲得無配向片材。繼而,於82℃下沿機械方向(MD)延伸3.4倍後,進一步於拉輻機內經過預熱步驟,而於110℃下沿與機械方向垂直之方向(寬度方向,TD)延伸3.9倍。進行雙軸延伸後,於210℃下進行3秒之熱處理,其後沿寬度方向進行2.4%之鬆弛處理,而獲得厚度50 μm之聚酯膜。將評價結果示於下述表4。
[實施例4-5]
除了變更為下述表4所示之條件以外,以與實施例4-4相同之方式獲得聚酯膜。將評價結果示於下述表4。
<測定及評價方法>
對實施例之群4中獲得之樣品之各種物性值之測定方法及評價方法進行說明。
(1)儲存彈性模數(E')
關於實施例之群4中獲得之膜,以長度方向成為機械方向之方式採集長度方向30 mm×寬度方向5 mm之樣品。繼而,使用動態黏彈性裝置(IT Meter and Control公司製造之「DVA-220」),將樣品夾持於將間隔設置為20 mm之夾頭而加以固定後,以升溫速度10℃/min從常溫升溫至200℃,於頻率10 Hz下測定儲存彈性模數。根據所獲得之資料,讀取100℃下之儲存彈性模數。
(2)加熱收縮率
從實施例之群4中獲得之膜之寬度方向中央位置起,以樣品長度方向成為測定方向之方式將樣品切成短條狀(15 mm寬×150 mm長),於無張力狀態、120℃環境下熱處理5分鐘,測定熱處理前後之樣品之長度,藉由下述式計算膜之熱收縮率(%)。再者,下述式中之a為熱處理前之樣品長度,b為熱處理後之樣品長度。
加熱收縮率(%)=[(a-b)/a]×100
(3)加熱處理後之膜表面低聚物量
對於實施例之群4中獲得之膜,於氮氣環境下藉由180℃之熱風循環烘箱將聚酯膜處理10分鐘。使熱處理後之聚酯膜之表面與DMF(二甲基甲醯胺)接觸3分鐘,使析出至表面之低聚物溶解。該操作可採用於例如關於聚烯烴等合成樹脂製食品容器包裝等之自願性基準中,於溶出試驗中之單面溶出法所使用之溶出用器具中所記載之方法。
繼而,視需要藉由稀釋等方法調整所獲得之DMF之濃度,供給於液相層析儀(島津LC-2010)而求出DMF中之低聚物量,該值除以接觸DMF之膜面積,作為膜表面低聚物量(mg/cm2
)。
DMF中之低聚物量係根據標準試樣峰面積與測定試樣峰面積之峰面積比求出(絕對校準曲線法)。
標準試樣之製作係準確地稱量預先分取之低聚物(環狀三聚物),溶解於經準確地稱量之DMF中而製作。標準試樣之濃度較佳為0.001~0.01 mg/ml之範圍。
(4)成型加工適性
將作為(甲基)丙烯酸系共聚物之數量平均分子量2400之聚甲基丙烯酸甲酯巨單體(Tg:105℃)15質量份(18 mol%)、丙烯酸丁酯(Tg:-55℃)81質量份(75 mol%)及丙烯酸(Tg:106℃)4質量份(7 mol%)無規共聚合而成之丙烯酸系共聚物(重量平均分子量23萬)1 kg、作為交聯劑之甘油二甲基丙烯酸酯(日油公司製造,製品名:GMR)(b-1)90 g、及作為光聚合起始劑之2,4,6-三甲基二苯甲酮與4-甲基二苯甲酮之混合物(Lanberti公司製造,製品名:Esacure TZT)15 g均勻地混合,而製作黏著片材所使用之樹脂組合物。
利用2片由實施例之群4所示之聚酯膜獲得之離型膜上下夾持所獲得之樹脂組合物(上下之組合設為以相同之離型膜彼此夾持),使用貼合機以樹脂組合物之厚度成為100 μm之方式賦形為片材狀,而製作黏著片材積層體。再者,以與樹脂組合物相接之方式配置聚酯膜之離型層側。
所獲得之黏著片材積層體係使用真空壓空成形機(第一實業公司製造,FKS-0632-20形),藉由以下之製程進行熱成形,而製作賦形黏著片材積層體。即,藉由預熱為400℃之IR加熱器,加熱至黏著片材積層體之表面達到100℃,繼而使用冷卻為25℃之成形用模具,於鎖模壓8 MPa之條件下進行5秒之加壓成形,而製作對表面賦形凹凸而成之賦形黏著片材積層體。
將賦形有凹凸之賦形黏著片材積層體之聚酯膜剝離,分別使用掃描式白色干涉顯微鏡,以非接觸方式計測賦形黏著片材之凹部與凸部之高度,將成形體之高度設為h。
計測成形體之凸部相對於模具之深度100 μm之高度h,將由下述計算式導出之轉印率為70%以上者評價為○,將為50%以上且未達70%者評價為△,將未達50%者評價為×。
轉印率(%)=h(成形體高度)/100(模具深度)×100
(5)黏著層外觀(褶皺)
藉由以下所示之評價方法分別評價藉由(4)所記載之方法獲得之加壓成型前的黏著層積層體之外觀。
<評價方法>
○:得以無褶皺地層壓,保持良好之外觀。
×:膜產生褶皺,並且褶皺轉印至黏著層,為無法用作製品之狀態。[表4] 實施例4-1 實施例4-2 實施例4-3 實施例4-4 實施例4-5
原料調配
[重量%] 表層 - - - A/C=86/14 A/C=86/14
中間層 B/A/D=65/30/5 B/A/D=45/50/5 B/A/D=25/70/5 B/A=45/55 B/A=45/55
厚度[μm] 表層 - - - 1.5 3
中間層 50 50 50 47 44
製膜條件 MD延伸倍率[倍] 3.4 3.4 3.4 3.4 3.4
MD延伸溫度[℃] 80 80 80 82 82
TD延伸倍率[倍] 3.9 3.9 3.9 3.9 3.9
TD延伸溫度[℃] 90 100 110 110 110
熱處理溫度[℃] 200 210 220 210 210
鬆弛率M 6.4 6.4 6.4 2.4 2.4
100℃儲存彈性模數E'[Pa] 2.7×108 5.5×108 8.7×108 7.6×108 8.2×108
加熱收縮率
(120℃、5分鐘) MD[%] 2.5 1.6 1.1 2.2 2.1
TD[%] 0.6 0.2 0.0 -03 -0.2
低聚物量[mg/cm2
] 6.6×10- 4 2.9×10-4 1.8×10- 4 1.9×10- 5 5.0×10-5
成型加工適正 〇 〇 △ 〇 〇
黏著層外觀(褶皺) 〇 〇 〇 〇 〇
[產業上之可利用性]
本發明之賦形黏著片材積層體於形成例如個人電腦、移動終端(PDA)、遊戲機、電視(TV)、汽車導航系統、觸控面板、手寫板等之類之圖像顯示裝置時可適宜地使用。
又,本發明之黏著片材積層體或塗佈膜於形成此種賦形黏著片材積層體時可適宜地使用。Hereinafter, an example of an embodiment of the present invention will be described. However, the present invention is not limited by the following embodiments.
[This adhesive sheet laminate]
An adhesive sheet laminate (referred to as "the present adhesive sheet laminate"), which is an example of an embodiment of the present invention, is provided with an adhesive layer and laminated on the front side of the adhesive layer in a peelable manner as shown in FIG. An adhesive sheet laminate consisting of a covering part I formed on one side of the back surface and a covering part II formed by detachably laminated on the front side and the other side of the back side of the adhesive material layer. Here, the covering part II is arbitrary, and a structure in which the covering part II is not laminated can also be adopted.
<Adhesive layer>
The adhesive layer of this adhesive sheet laminate should be able to function as a double-sided adhesive sheet when the covering part I and covering part II are peeled off, and have a heat-melt property that softens or melts when heated. Can.
The adhesive material layer preferably has a loss tangent tanδ (SA) of 1.0 or more at 100°C. Also, it is preferable that the loss tangent tan δ (SB) at 30° C. is less than 1.0.
Here, the loss tangent tanδ means the ratio (G''/G') of the loss elastic modulus G'' to the storage elastic modulus G'.
Since the temperature for thermoforming this adhesive sheet laminate is usually 70-120°C, if the loss tangent tanδ(SA) at 100°C is 1.0 or more, it becomes easy to form unevenness on the surface of the adhesive layer .
In addition, if the loss tangent tanδ(SB) of the adhesive layer at 30°C is less than 1.0, the shape can be maintained under normal conditions, so it can be maintained on the surface of the adhesive layer with high precision to form the unevenness on the surface of the adherend. The state of the concave-convex shape.
Generally, polymer materials have both viscous and elastic properties, and the loss tangent tanδ is above 1.0, and the larger the value, the stronger the viscous property. On the other hand, the loss tangent tanδ is less than 1.0, and the smaller the value, the stronger the elastic property. Therefore, by controlling the loss tangent tanδ of the adhesive layer at different temperatures, both formability and shape retention can be achieved.
From this point of view, the loss tangent tanδ (SA) of the adhesive layer at 100° C. is preferably 1.0 or more, preferably 1.5 or more or 30 or less, and preferably 3.0 or more or 20 or less.
On the other hand, the loss tangent tanδ (SB) of the adhesive layer at 30°C is preferably less than 1.0, preferably 0.01 or more or 0.9 or less, and more preferably 0.1 or more or 0.8 or less.
Here, the loss tangent tanδ(SA) of the adhesive layer at 100°C and the loss tangent tanδ(SB) at 30°C can be adjusted by adjusting the composition or gel fraction and weight average of the composition constituting the adhesive layer. Molecular weight etc. are adjusted to the above range.
Furthermore, the storage elastic modulus G'(SA) of the adhesive layer at 100°C is preferably less than 1.0×104
Pa. Also, the storage elastic modulus G'(SB) of the adhesive material layer at 30°C is preferably 1.0×104
Above Pa.
If the storage elastic modulus G'(SA) of the adhesive layer at 100°C does not reach 1.0×104
Pa, sufficient formability can be obtained, so it is better. On the other hand, if the storage elastic modulus G'(SB) of the adhesive layer at 30°C is 1.0×104
Pa or more is preferable from the viewpoint of shape stability after molding.
From this point of view, the storage elastic modulus G'(SA) of the adhesive layer at 100°C is preferably less than 1.0×104
Pa, which is further preferably 5.0×101
Above Pa or 5.0×103
Pa or less, and more preferably 1.0×102
Above Pa or 1.0×103
Below Pa.
Accordingly, the storage elastic modulus G'(SA) of the adhesive layer at 100°C is more preferably 5.0×101
More than Pa and less than 1.0×104
Pa, or 5.0×101
Above Pa and 5.0×103
Pa or less, and more preferably 1.0×102
More than Pa and less than 1.0×104
Pa, or 1.0×102
Above Pa and 5.0×103
Below Pa, the best is 1.0×102
Above Pa and 1.0×103
Below Pa.
Also, from this point of view, the storage elastic modulus G'(SB) of the adhesive layer at 30°C is preferably 1.0×104
Pa or more, and more preferably 2.0×104
Above Pa or 1.0×107
Pa or less, and more preferably 5.0×104
Above Pa or 1.0×106
Below Pa.
Also, according to this, the storage elastic modulus G'(SB) of the adhesive layer at 30°C is more preferably 1.0×104
Above Pa and 1.0×107
Below Pa, or 1.0×104
Above Pa and 1.0×106
Below Pa, which is more preferably 2.0×104
Above Pa and 1.0×107
Below Pa, or 2.0×104
Above Pa and 1.0×106
Below Pa, the best is 5.0×104
Above Pa and 1.0×106 Below Pa. Here, the storage elastic modulus G'(SA) of the adhesive layer at 100°C and the storage elastic modulus G'(SB) of the adhesive layer at 30°C can be adjusted by adjusting the composition of the adhesive layer Components, gel fraction, weight average molecular weight, etc. are adjusted to the above-mentioned ranges. The temperature at which the loss tangent tanδ of the adhesive layer becomes 1.0 is preferably 50 to 150°C, more preferably 60°C or higher or 130°C or lower, and even more preferably 70°C or higher or 110°C or lower. If the temperature at which the loss tangent tanδ of the adhesive layer becomes 1.0 is 50 to 150° C., mold molding can be performed by heating the present adhesive sheet laminate to 50 to 150° C. in advance. The glass transition temperature (Tg) of the base resin of the adhesive layer is preferably -50 to 40°C, more preferably -30°C or higher or 25°C or lower, and even more preferably -10°C or higher or 20°C or lower. Here, the measurement of the glass transition temperature refers to the midpoint between the inflection points of the baseline movement when the temperature is raised at a rate of 3° C./min using a differential scanning calorimeter (DSC). When the glass transition temperature (Tg) of the base resin of the adhesive layer is within the above range, adhesiveness can be imparted to the adhesive layer, and further, the temperature at which the loss tangent tanδ of the adhesive layer becomes 1.0 can be adjusted to 50 to 150°C. As a material for the adhesive layer, a conventionally known adhesive sheet can be used as long as it can be prepared to have a specific viscoelastic behavior. Examples include: 1) Using (meth)acrylate polymers (in the meaning of including copolymers, hereinafter referred to as "acrylate (co)polymers") as the base resin, and formulating crosslinking monomers therein body, if necessary, prepare a cross-linking initiator or reaction catalyst, etc., and make it cross-linked to form an adhesive sheet; or 2) use butadiene or isoprene-based copolymer as the base resin, in The adhesive sheet formed by formulating cross-linking monomers, cross-linking initiators or reaction catalysts, etc. if necessary, to make them undergo cross-linking reactions; or 3) using polysiloxane-based polymers as the base resin, Adhesive sheets formed by blending cross-linking monomers, blending cross-linking initiators or reaction catalysts, etc. if necessary, to make them undergo cross-linking reactions; or 4) using polyurethane-based polymers as the basis Resin based polyurethane adhesive sheet, etc. The physical properties of the adhesive layer itself are not an essential problem in the present invention except the above-mentioned viscoelastic properties or thermal properties. However, from the viewpoints of adhesiveness, transparency, and weather resistance, it is preferable to use the acrylate-based (co)polymer of the above-mentioned 1) as the base resin. When performances such as electrical characteristics and low refractive index are required, it is preferable to use the butadiene or isoprene-based copolymer of the above 2) as the base resin. When properties such as heat resistance and rubber elasticity in a wide temperature range are required, it is preferable to use the polysiloxane-based copolymer of the above 3) as the base resin. When performance such as re-peelability is required, it is preferable to use the polyurethane-based polymer of the above 4) as the base resin. As an example of the above-mentioned adhesive material layer, one formed of a resin composition containing a (meth)acrylic copolymer (a) as a base resin, a crosslinking agent (b), and a photopolymerization initiator (c) can be exemplified. Adhesive sheet. In this case, it is necessary to satisfy the above-mentioned viscoelastic properties in an uncrosslinked state, that is, a state before a three-dimensionally crosslinked network structure is formed. From this viewpoint, the gel fraction of the adhesive layer is preferably 40% or less. If the gel fraction of the adhesive layer is 40% or less, the bond between the molecular chains constituting the adhesive layer can be suppressed in an appropriate range, so it can have a moderate degree of flexibility when forming a shape-shaped adhesive sheet laminate. fluidity. From this point of view, the gel fraction of the adhesive layer is preferably 40% or less, particularly preferably 20% or less, particularly preferably 10% or less. Furthermore, the lower limit of the gel fraction of the adhesive material layer is not limited, and may be 0%. Furthermore, the gel fraction of the above-mentioned adhesive material layer is not limited to those containing (meth)acrylic copolymer (a), crosslinking agent (b), and photopolymerization initiator (c) as the base resin. In the case of the resin composition, it is the same when using another resin composition as an adhesive material layer. ((meth)acrylic copolymer (a)) The (meth)acrylic copolymer (a) can be selected according to the type of acrylic monomer or methacrylic monomer used for polymerization, composition ratio, and further Properties such as glass transition temperature (Tg) are appropriately adjusted according to polymerization conditions and the like. Examples of acrylic monomers or methacrylic monomers for polymerizing acrylate polymers include 2-ethylhexyl acrylate, n-octyl acrylate, n-butyl acrylate, ethyl acrylate, methyl Methyl acrylate, etc. Vinyl acetate, hydroxyethyl acrylate, acrylic acid, glycidyl acrylate, acrylamide, acrylonitrile, methacrylonitrile, fluoroacrylate, which are copolymerized with hydrophilic groups or organic functional groups, etc. can also be used , polysiloxane acrylate, etc. Among the acrylate polymers, an alkyl (meth)acrylate copolymer is particularly preferable. As the (meth)acrylate used to form an alkyl (meth)acrylate copolymer, that is, an alkyl acrylate or an alkyl methacrylate component, the alkyl group is preferably n-octyl or isooctyl. , 2-ethylhexyl, n-butyl, isobutyl, methyl, ethyl, isopropyl, one of the alkyl acrylates or alkyl methacrylates or one selected from these A mixture of two or more. As other components, acrylates or methacrylates having organic functional groups such as carboxyl groups, hydroxyl groups, and glycidyl groups can also be copolymerized. Specifically, a monomer component obtained by appropriately and selectively combining the above-mentioned alkyl (meth)acrylate component and a (meth)acrylate component having an organic functional group can be used as a starting material for thermal polymerization to obtain (meth)acrylate copolymer polymer. Among them, preferably one of alkyl acrylates such as isooctyl acrylate, n-octyl acrylate, n-butyl acrylate, and 2-ethylhexyl acrylate, or a mixture of two or more selected from them, or Examples thereof include copolymerization of at least one of isooctyl acrylate, n-octyl acrylate, n-butyl acrylate, and 2-ethylhexyl acrylate with acrylic acid. As the polymerization process using these monomers, well-known polymerization methods such as solution polymerization, emulsion polymerization, block polymerization, and suspension polymerization can be used. In this case, polymerization using a thermal polymerization initiator or a photopolymerization initiator or the like depends on the polymerization method. Starter with which acrylate copolymers can be obtained. (Acrylic Copolymer (A1)) As an example of a preferable base polymer of the adhesive material layer, a (meth)acrylic copolymer (A1) comprising a graft copolymer having a macromonomer as a branched chain component is mentioned. . If the above-mentioned acrylic copolymer (A1) is used as the base resin to form the adhesive material layer, the adhesive material layer can maintain a sheet shape at room temperature and exhibit self-adhesiveness. Melting or flowing hot-melt, and further, it can be photohardened, and after photohardening, it can exert excellent cohesive force and make it bond. Therefore, if the acrylic copolymer (A1) is used as the base polymer of the adhesive material layer, even in an uncrosslinked state, it exhibits adhesiveness at room temperature (20° C.), and has the property that if heated at 50 to 100 °C, more preferably above 60°C or below 90°C will soften or fluidize. As for the glass transition temperature of the copolymer which comprises the main chain component of the said acrylic copolymer (A1), -70-0 degreeC is preferable. In this case, the glass transition temperature of the copolymer component constituting the main chain component means the glass transition temperature of a polymer obtained by copolymerizing only the monomer components constituting the main chain component of the acrylic copolymer (A1). Specifically, it means the value calculated by Fox's calculation formula based on the glass transition temperature and composition ratio of the polymer obtained from the homopolymer of the respective components of the copolymer. In addition, the calculation formula of Fox is a calculated value obtained by the following formula, and can be obtained by using the value described in the polymer handbook [Polymer Handbook, J. Brandrup, Interscience, 1989]. 1/(273+Tg)=Σ(Wi/(273+Tgi)) [Wherein, Wi represents the weight fraction of monomer i, and Tgi represents the Tg (°C) of the homopolymer of monomer i] The glass transition temperature of the copolymer component of the main chain component in (A1) will affect the flexibility of the adhesive material layer at room temperature, or the wettability of the adhesive material layer to the adherend, that is, the adhesiveness, so in order to adhere The material layer obtains moderate adhesion (viscosity) at room temperature, and the glass transition temperature is preferably -70°C to 0°C, especially preferably above -65°C or below -5°C, especially preferably - Above 60°C or below -10°C. However, even if the glass transition temperature of the copolymer components is the same temperature, the viscoelasticity can be adjusted by adjusting the molecular weight. For example, by reducing the molecular weight of the copolymer component, it can be further softened. Examples of the (meth)acrylate monomer contained in the main chain component of the acrylic copolymer (A1) include methyl (meth)acrylate, ethyl (meth)acrylate, (meth)acrylic acid Propyl ester, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, third butyl (meth)acrylate, Amyl (meth)acrylate, Isoamyl (meth)acrylate, Neopentyl (meth)acrylate, Hexyl (meth)acrylate, Cyclohexyl (meth)acrylate, Heptyl (meth)acrylate , 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, tertiary butylcyclohexyl (meth)acrylate, ( Decyl methacrylate, Isodecyl (meth)acrylate, Undecyl (meth)acrylate, Lauryl (meth)acrylate, Cetyl (meth)acrylate, Hard (meth)acrylate Butyl esters, isostearyl (meth)acrylate, behenyl (meth)acrylate, iso-(meth)acrylate, 2-phenoxyethyl (meth)acrylate, 3,5 acrylate, 5-trimethylcyclohexyl ester, p-cumylphenol EO modified (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, bicyclo(meth)acrylate Pentenyloxyethyl ester, benzyl (meth)acrylate, etc. These can also be used: Hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, glycerin (meth)acrylate, etc. having a hydrophilic group or an organic functional group, etc. Hydroxyl-containing (meth)acrylates; or (meth)acrylic acid, 2-(meth)acryloxyethylhexahydrophthalic acid, 2-(meth)acryloxypropylhexahydro Phthalic acid, 2-(meth)acryloxyethylphthalic acid, 2-(meth)acryloxypropylphthalic acid, 2-(meth)acryloxyethylphthalic acid 2-(meth)acryloxypropylmaleic acid, 2-(meth)acryloxyethylsuccinic acid, 2-(meth)acryloxypropylmaleic acid, 2-(meth)acryloxypropylmaleic acid Carboxyl-containing monomers such as propyl succinic acid, crotonic acid, fumaric acid, maleic acid, itaconic acid, monomethyl maleate, and monomethyl itaconate; maleic acid Acid anhydride group-containing monomers such as olefinic anhydride and itaconic anhydride; glycidyl (meth)acrylate, α-glycidyl ethacrylate, 3,4-epoxybutyl (meth)acrylate, etc. containing epoxy groups Monomer; dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate and other amino-containing (meth)acrylate monomers; (meth)acrylamide, N - Tertiary butyl(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide base) acrylamide, diacetone acrylamide, maleic amide, maleimide and other monomers containing amide groups; vinylpyrrolidone, vinylpyridine, vinylcarbazole, etc. Heterocyclic basic monomers, etc. In addition, styrene, tert-butylstyrene, α-methylstyrene, vinyltoluene, acrylonitrile, methyl Various vinyl monomers such as acrylonitrile, vinyl acetate, vinyl propionate, alkyl vinyl ether, hydroxyalkyl vinyl ether, alkyl vinyl monomer, etc. Moreover, it is preferable that the main chain component of an acryl-type copolymer (A1) contains a hydrophobic (meth)acrylate monomer and a hydrophilic (meth)acrylate monomer as a structural unit. If the main chain component of the acrylic copolymer (A1) consists of only hydrophobic monomers, the tendency of wet heat whitening is observed, so it is preferable to also introduce a hydrophilic monomer into the main chain component to prevent wet heat whitening. Specifically, examples of main chain components of the acrylic copolymer (A1) include hydrophobic (meth)acrylate monomers, hydrophilic (meth)acrylate monomers, and terminals of macromonomers. A copolymer component formed by random copolymerization of polymerizable functional groups. Here, examples of the above-mentioned hydrophobic (meth)acrylate monomer include n-butyl (meth)acrylate, isobutyl (meth)acrylate, second-butyl (meth)acrylate, Tertiary butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, neopentyl (meth)acrylate, hexyl (meth)acrylate, ring (meth)acrylate Hexyl, heptyl (meth)acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, isooctyl acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, (meth) tert-butylcyclohexyl acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, (meth)acrylic acid Cetyl, Stearyl (meth)acrylate, Isostearyl (meth)acrylate, Behenyl (meth)acrylate, Iso(meth)acrylate, Cyclohexyl (meth)acrylate , Dicyclopentenyloxyethyl (meth)acrylate, methyl methacrylate. Moreover, examples of the hydrophobic vinyl monomer include vinyl acetate, styrene, tert-butylstyrene, α-methylstyrene, vinyltoluene, and alkyl vinyl monomers. Examples of the above-mentioned hydrophilic (meth)acrylate monomers include: methyl acrylate, (meth)acrylic acid, tetrahydrofurfuryl (meth)acrylate; or hydroxyethyl (meth)acrylate, (meth)acrylate base) hydroxypropyl acrylate, hydroxybutyl (meth)acrylate, glycerol (meth)acrylate and other hydroxyl-containing (meth)acrylates; or (meth)acrylic acid, 2-(meth)acryloxy 2-(meth)acryloxypropylhexahydrophthalate, 2-(meth)acryloxyethylhexahydrophthalate, 2-(meth)acryloxyethylhexahydrophthalate, base) acryloxypropyl phthalic acid, 2-(meth)acryloxyethylmaleic acid, 2-(meth)acryloxypropylmaleic acid, 2 -(Meth)acryloxyethylsuccinic acid, 2-(meth)acryloxypropylsuccinic acid, crotonic acid, fumaric acid, maleic acid, itaconic acid Carboxyl group-containing monomers such as , monomethyl maleate, and monomethyl itaconate; anhydride-containing monomers such as maleic anhydride and itaconate; glycidyl (meth)acrylate, α-ethyl Epoxy-containing monomers such as glycidyl acrylate and 3,4-epoxybutyl (meth)acrylate; alkoxypolyalkylene glycols such as methoxypolyethylene glycol (meth)acrylate (Meth)acrylates; N,N-Dimethacrylamide, Hydroxyethylacrylamide, etc. The acrylic copolymer (A1) preferably introduces a macromonomer as a branched chain component of the graft copolymer, and contains repeating units derived from the macromonomer. The so-called macromonomer system is a polymer monomer having a terminal polymerizable functional group and a high molecular weight skeleton component. The glass transition temperature (Tg) of the macromonomer is preferably higher than the glass transition temperature of the copolymer components constituting the above-mentioned acrylic copolymer (A1). Specifically, since the glass transition temperature (Tg) of the macromonomer will affect the heating and melting temperature (melt temperature) of the adhesive material layer 2, the glass transition temperature (Tg) of the macromonomer is preferably 30° C. to 120° C. °C, more preferably 40°C or higher or 110°C or lower, particularly preferably 50°C or higher or 100°C or lower. If it is such a glass transition temperature (Tg), excellent workability and storage stability can be maintained by adjusting the molecular weight, and it can be adjusted by thermal melting around 80°C. The so-called glass transition temperature of the macromonomer refers to the glass transition temperature of the macromonomer itself, which can be measured by a differential scanning calorimeter (DSC). In addition, in order to maintain the branched chain components close to each other at room temperature, as the adhesive composition undergoes physical cross-linking, and by heating to a moderate temperature, the above-mentioned physical cross-linking can be released to obtain fluidity It is also preferable to adjust the molecular weight or content of the macromonomer. From this point of view, the macromonomer is preferably contained in the acrylic copolymer (A1) at a ratio of 5 mass % to 30 mass %, preferably 6 mass % or more or 25 mass % or less, and preferably 8% by mass or more or 20% by mass or less. In addition, the number average molecular weight of the macromonomer is preferably 500 or more and less than 8000, preferably 800 or less and less than 7500, and preferably 1000 or less and less than 7000. As the macromonomer, a general manufacturer (for example, a macromonomer manufactured by Toagosei Co., Ltd., etc.) can be used appropriately. The high molecular weight skeleton component of the macromonomer preferably comprises an acrylic polymer or a vinyl polymer. Examples of the high-molecular-weight skeleton component of the macromonomer include: methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, (meth)acrylate base) n-butyl acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, third butyl (meth)acrylate, amyl (meth)acrylate, isobutyl (meth)acrylate Pentyl, neopentyl (meth)acrylate, hexyl (meth)acrylate, cyclohexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, Isooctyl acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, tert-butylcyclohexyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate ester, undecyl (meth)acrylate, lauryl (meth)acrylate, cetyl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, ( Behenyl Methacrylate, Iso(Meth)acrylate, 2-Phenoxyethyl (Meth)acrylate, 3,5,5-Trimethylcyclohexyl Acrylate, p-Cumyl Phenol EO modified (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, benzyl (meth)acrylate , hydroxyalkyl (meth)acrylate, (meth)acrylic acid, glycidyl (meth)acrylate, (meth)acrylamide, N,N-dimethyl(meth)acrylamide, ( (meth)acrylate monomers such as meth)acrylonitrile, alkoxyalkyl (meth)acrylate, alkoxy polyalkylene glycol (meth)acrylate; or styrene, tertiary Vinyl styrene, α-methyl styrene, vinyl toluene, alkyl vinyl monomer, vinyl acetate, alkyl vinyl ether, hydroxyalkyl vinyl ether and other vinyl monomers, which can be used alone or in combination Use more than 2 types. As a terminal polymerizable functional group of the said macromonomer, a methacryl group, an acryl group, a vinyl group etc. are mentioned, for example. (Crosslinking agent (b)) The crosslinking agent (b) can be used for the crosslinking monomer used for crosslinking an acrylate polymer. Examples include (meth)acryl group, epoxy group, isocyanate group, carboxyl group, hydroxyl group, carbodiimide group, oxazoline group, aziridinyl group, vinyl group, amine group, imine group The crosslinking agent of at least one kind of crosslinkable functional group among the group and the amide group can be used alone or in combination of two or more kinds. Furthermore, the above-mentioned crosslinkable functional group may be protected by a deprotectable protecting group. Among them, polyfunctional (meth)acrylates having two or more (meth)acryl groups; two or more isocyanate groups, epoxy groups, melamine groups, glycol groups, and siloxane groups can be preferably used. Polyfunctional organofunctional resins with organic functional groups such as amino groups and amino groups; organometallic compounds with metal complexes such as zinc, aluminum, sodium, zirconium, and calcium. Examples of the polyfunctional (meth)acrylate include: 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, glycerin di(meth)acrylate , glycerin glycidyl ether di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, tricyclodecane dimethanol dimethacrylate (meth)acrylate, bisphenol A polyethoxy di(meth)acrylate, bisphenol A polyalkoxy di(meth)acrylate, bisphenol F polyalkoxy di(meth)acrylate ester, polyalkylene glycol di(meth)acrylate, trimethylolpropane trioxyethyl(meth)acrylate, ε-caprolactone modified tris(2-hydroxyethyl)isocyanate Urate tri(meth)acrylate, Pentaerythritol tri(meth)acrylate, Propoxylated pentaerythritol tri(meth)acrylate, Ethoxylated pentaerythritol tri(meth)acrylate, Pentaerythritol tetra(meth)acrylate , propoxylated pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, polyethylene glycol di(meth)acrylate, tri(acryloxy ethyl) isocyanurate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tripentaerythritol hexa(meth)acrylate, three Pentaerythritol penta(meth)acrylate, hydroxypivalate neopentyl glycol di(meth)acrylate, di(meth)acrylate of ε-caprolactone adduct of hydroxypivalate neopentyl glycol , trimethylolpropane tri(meth)acrylate, alkoxylated trimethylolpropane tri(meth)acrylate, bis(trimethylolpropane)tetra(meth)acrylate and other ultraviolet curing types Examples of functional monomers include polyester (meth)acrylate, epoxy (meth)acrylate, urethane (meth)acrylate, polyether (meth)acrylate, etc. Multifunctional acrylate oligomers. Among the above-mentioned polyfunctional (meth)acrylate monomers, those containing a hydroxyl group, a carboxyl group, or an amide group are preferable from the viewpoint of improving the adhesion to the adherend or suppressing the effect of wet heat whitening. Polyfunctional monomers or oligomers with equipolar functional groups. Among them, it is preferable to use a polyfunctional (meth)acrylate having a hydroxyl group or an amide group. From the viewpoint of preventing wet heat whitening, as the main chain component of the above-mentioned (meth)acrylate copolymer, such as a graft copolymer, it is preferable to contain a hydrophobic acrylate monomer and a hydrophilic acrylate monomer, Furthermore, it is preferable to use the polyfunctional (meth)acrylate which has a hydroxyl group as a crosslinking agent. Moreover, in order to adjust effects, such as adhesiveness, heat-and-moisture resistance, and heat resistance, you may further add the monofunctional or polyfunctional (meth)acrylate which reacts with a crosslinking agent. From the viewpoint of balancing the flexibility and cohesive force of the adhesive composition, the content of the crosslinking agent is preferably contained in a ratio of 0.1 to 20 parts by mass relative to 100 parts by mass of the above-mentioned (meth)acrylic copolymer. , especially preferably at least 0.5 parts by mass or at most 15 parts by mass, particularly preferably at least 1 part by mass or less than 13 parts by mass. (Photopolymerization initiator (c)) When crosslinking the acrylate polymer, if a crosslinking initiator (peroxide initiator, photopolymerization initiator) or a reaction catalyst (tertiary amine system Compounds, quaternary ammonium compounds, tin laurate compounds, etc.), are more effective. In the case of crosslinking by ultraviolet irradiation, it is preferable to prepare a photopolymerization initiator (c). Photopolymerization initiators (c) are roughly divided into two types according to the mechanism of free radical generation, roughly divided into: cleavage-type photopolymerization initiators that can break and decompose the single bond of the photopolymerization initiator itself to generate free radicals ; and the photoexcited initiator and the hydrogen donor and donor in the system form an excited complex, which can make the hydrogen transfer of the hydrogen donor and the hydrogen abstraction type photopolymerization initiator. Among them, the cleavage-type photopolymerization initiator decomposes into other compounds when free radicals are generated by light irradiation, and loses its function as a reaction initiator once excited. Therefore, if this intramolecular cleavage type is used as a photopolymerization initiator having an absorption wavelength in the visible light region, compared with the case of using a hydrogen abstraction type, after the adhesive sheet is crosslinked by light irradiation, light reaction A photopolymerizable initiator that remains in the adhesive composition as an unreacted residue is less likely to cause unexpected changes over time in the adhesive sheet or to promote crosslinking, so it is preferable. Moreover, since the coloring peculiar to a photopolymerizable initiator can also be selected suitably by becoming a reaction decomposition product and disappearing the absorption in the visible light region, it is preferable. On the other hand, when the photopolymerization initiator of the hydrogen abstraction type is irradiated with active energy rays such as ultraviolet rays to generate free radicals, it will not produce decomposition products such as the photopolymerization initiator of the cleavage type, so it is difficult to react after the reaction. Become a volatile component, which can reduce the damage to the adherend. Examples of the aforementioned cleavage-type photopolymerization initiator include: 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy- 2-Methyl-1-phenyl-propan-1-one, 1-(4-(2-hydroxyethoxy)phenyl)-2-hydroxy-2-methyl-1-propan-1-one, 2-Hydroxy-1-[4-{4-(2-hydroxy-2-methyl-propionyl)benzyl}phenyl]-2-methyl-propan-1-one, oligo(2-hydroxy -2-methyl-1-(4-(1-methylvinyl)phenyl)acetone), methyl phenylglyoxylate, 2-benzyl-2-dimethylamino-1-(4- 𠰌linylphenyl)butan-1-one, 2-methyl-1-[4-(methylthio)phenyl]-2-𠰌linylpropan-1-one, 2-(dimethylamino )-2-[(4-methylphenyl)methyl]-1-[4-(4-𠰌linyl)phenyl]-1-butanone, bis(2,4,6-trimethylbenzene Formyl)-phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide Phosphine, bis(2,6-dimethoxybenzoyl) 2,4,4-trimethylpentylphosphine oxide, or derivatives thereof. Among them, bis(2,4,6-trimethylbenzoyl)-phenyl group is preferred in terms of decolorization after reaction as a decomposed product by the cleavage-type photopolymerizable initiator. Phosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide, bis(2,6 Acylphosphine oxide-based photoinitiators such as -dimethoxybenzoyl)2,4,4-trimethylpentylphosphine oxide. Furthermore, it is preferable to use 2,4,6-trimethylbenzoyldiphenyl Phosphine oxide, (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide, bis(2,6-dimethoxybenzoyl)2,4,4-trimethyl Amylphosphine oxide or the like is used as a photopolymerization initiator. The content of the photopolymerization initiator is not particularly limited. For example, 0.1 to 10 parts by mass, more preferably 0.2 parts by mass or more and 5 parts by mass or less, particularly preferably 0.5 parts by mass or more or 3 parts by mass with respect to 100 parts by mass of the (meth)acrylic copolymer Contain the following proportions. However, in terms of balance with other elements, it can also exceed this range. A photoinitiator can be used 1 type or in combination of 2 or more types. In addition to the above-mentioned ingredients, pigments such as pigments or dyes with near-infrared absorption characteristics, adhesion imparting agents, antioxidants, anti-aging agents, moisture absorbers, ultraviolet absorbers, silane coupling agents, natural products or synthetic materials can also be appropriately formulated as needed. Various additives such as resins, glass fibers or glass beads. (Layer Structure and Thickness of Adhesive Material Layer) The adhesive material layer may be a plurality of layers such as two layers or three layers in addition to a single layer. In addition, the adhesive material layer may have a base material layer (layer not having adhesive properties) as a core layer, and a structure in which layers including an adhesive material are laminated on both sides of the base material layer. In the case of such a structure, it is preferable that the base material layer which is a core layer has a material or characteristic which enables thermoforming of an adhesive sheet laminate. In addition, it is preferable that the adhesive material layer other than the base material layer has loss tangent tan δ (SA), loss tangent tan δ (SB), storage elastic modulus G'(SA), and storage elastic modulus G'(SB). above characteristics. The thickness of the adhesive layer is not particularly limited. Among them, the range of 20 μm to 500 μm is preferable. If it is this range, for example, if it is a thin adhesive material layer with a thickness of 20 micrometers, the adhesive sheet excellent in print level difference followability can be provided. Also, in the case of a thick adhesive material layer such as 500 μm in thickness, it becomes possible to suppress overflow of the adhesive material at the time of lamination by pre-shaping an amount corresponding to a printing step. Therefore, the thickness of the adhesive material layer is preferably 20 μm to 500 μm, more preferably 30 μm or more or 300 μm or less, and more preferably 50 μm or more or 200 μm or less. <Covering part I> This adhesive sheet laminate has the following covering part I as shown in FIG. Concave-convex sides are formed. The storage elastic modulus E'(MA) of the coating part I at 100°C is preferably 1.0×106
~2.0×109
Pa.
Since the temperature for thermoforming the adhesive sheet laminate is usually 70-120°C, if the storage elastic modulus E'(MA) at 100°C is 1.0×106
~2.0×109
Pa, within the temperature range from plasticizing to flowing of the above-mentioned adhesive composition, the covering part I can also fully follow the concave-convex shape and deform, not only that, but also the adhesive material layer that can be squeezed by the covering part I during molding The surface of the surface is formed into the desired concave-convex shape with high precision, for example, in such a way as to avoid rounding of the corners.
Previously, as a release film laminated on an adhesive sheet, a material with a high storage elastic modulus, in other words, a "harder" material was often used. The reason is that the characteristics required for the release film are mainly the protective adhesive layer and the release property. However, according to the research of the inventors of the present invention, it has been found that in the new application of thermoforming in the state where the release film is laminated on the adhesive sheet, when a new subject of thermoformability is required, it is difficult to rely on the previous release film. The above-mentioned physical characteristics possessed by the type film cannot meet the requirements. Therefore, after conducting detailed investigations on the phenomena that occur during thermoforming and the properties of the adhesive layer, it was found that setting properties that are different from those of release films that have been generally used so far can solve the new problem of thermoformability. beneficial. It was found that the above-mentioned problems can be solved by, inter alia, controlling the storage elastic modulus at a specific temperature to a specific range.
From this point of view, the storage elastic modulus E'(MA) of the coating portion I at 100° C. is preferably 1.0×106
~2.0×109
Pa, which is further preferably 5.0×106
Above Pa or 1.0×109
Pa or less, and more preferably 1.0×107
Above Pa or 5.0×108
Below Pa.
Accordingly, the storage elastic modulus E'(MA) of the covering portion I at 100°C is more preferably 1.0×106
~1.0×109
Pa, or 1.0×106
~5.0×108
Pa, wherein, preferably 5.0×106
~2.0×109
Pa, or 5.0×106
~1.0×109
Pa, the best is 1.0×107
~1.0×109
Below Pa, or 1.0×107
~5.0×108
Pa.
Also, the storage elastic modulus E'(MB) of the coating portion I at 30°C is preferably 5.0×107
~1.0×1010
Pa.
If the storage elastic modulus E'(MB) of the coating part I at 30°C is 5.0×107
~1.0×1010
Pa, the shape retention can be maintained under normal conditions, so it is easier to handle, for example, it is easy to peel off. Not only that, but also because it is not too hard, it can suppress the formation of unintended unevenness in the adhesive layer.
From this point of view, the storage elastic modulus E'(MB) of the coating portion I at 30° C. is preferably 5.0×107
~1.0×1010
Pa, which is further preferably 1.0×108
Above Pa or 8.0×109
Pa or less, and more preferably 1.0×109
Above Pa or 5.0×109
Below Pa.
Accordingly, the storage elastic modulus E'(MB) of the covering portion I at 30°C is more preferably 5.0×107
~8.0×109
Pa, or 5.0×107
~5.0×109
Pa, wherein, and further preferably 1.0×108
Pa~1.0×1010
Pa, or 1.0×108
Pa~8.0×109
Pa, the best is 1.0×109
~8.0×109
Pa, or 1.0×109
~5.0×109
Pa.
In order to adjust the storage elastic modulus of the covering part I at 30°C and 100°C to the above, for example, the covering part I can be adjusted by adjusting the type of base resin, copolymer resin composition, weight average molecular weight, glass transition temperature, crystallinity, etc. The conditions of the material, and adjust the manufacturing conditions such as whether or not to stretch, forming conditions, and adjusting the stretching conditions in the case of stretching. However, it is not limited to these methods.
Furthermore, it is preferable that the storage elastic modulus E'(MA) of the covering portion I at 100°C and the storage elastic modulus E'(MB) of the covering portion I at 30°C satisfy the following relational expression (1).
(1)・・E'(MB)/E'(MA)≧2.0
If the storage elastic modulus E'(MA) of the covering part I at 100°C and the storage elastic modulus E'(MB) of the covering part I at 30°C satisfy the above relation (1), sufficient molding can be obtained Sex, so better.
From this point of view, E'(MB)/E'(MA)≧2.0 is preferable, and 30≧E'(MB)/E'(MA) or E'(MB)/E' is more preferable (MA)≧3.0, especially 10≧E'(MB)/E'(MA) or E'(MB)/E'(MA)≧5.0.
In order to adjust E'(MB) and E'(MA) to have the above relationship, for example, the type of base resin, copolymer resin composition, weight average molecular weight, glass transition temperature, crystallinity, etc. Conditions, and adjust the production conditions such as whether there is stretching, forming conditions, and adjusting stretching conditions in the case of stretching. However, it is not limited to these methods.
Furthermore, it is preferable that the storage elastic modulus G'(SA) of the above-mentioned adhesive material layer at 100°C and the storage elastic modulus E'(MA) of the above-mentioned covering part I at 100°C satisfy the following relationship (2 ).
(2)・・1.0×103
≦E'(MA)/G'(SA)≦1.0×107
If the storage elastic modulus G'(SA) of the above-mentioned adhesive material layer at 100°C and the storage elastic modulus E'(MA) of the above-mentioned covering part I at 100°C satisfy the above-mentioned relational formula (2), then sufficient The formability is better.
From this point of view, E'(MA)/G'(SA) is preferably 1.0×103
~1.0×107
, which is preferably 5.0×103
Above or 5.0×106
Below, preferably 1.0×104
Above or 1.0×106
the following.
Accordingly, E'(MA)/G'(SA) is better to be 1.0×103
~5.0×106
, or 1.0×103
~1.0×106
, and preferably 5.0×103
~5.0×106
, or 5.0×103
~1.0×106
, the optimum is 1.0×104
~5.0×106
, or 1.0×104
~1.0×106
.
In order to adjust E′(MA) and G′(SA) to have the above-mentioned relationship, it is only necessary to adjust the characteristics of the adhesive material layer or the covering portion I. The characteristics of the adhesive layer can be achieved by, for example, adjusting the components of the composition constituting the adhesive layer, the gel fraction, the weight average molecular weight, and the like. In addition, as the characteristics of the covering part I, for example, the conditions of the material of the covering part I such as the type of the base resin, the copolymer resin component, the weight average molecular weight, the glass transition temperature, and the crystallinity can be adjusted, and the presence or absence of stretching and the molding conditions can be adjusted. , In the case of extension, adjust the manufacturing conditions such as extension conditions and adjust them. However, it is not limited to these methods.
For the covering part I, the peeling force F(C) when the covering part I is peeled from the adhesive layer in an environment of 30° C. is preferably 0.2 N/cm or less.
When peeling force F(C) is 0.2 N/cm or less, the said covering part I can be peeled easily from an adhesive material layer.
From this point of view, the peeling force F(C) is preferably 0.2 N/cm or less, more preferably 0.01 N/cm or more or 0.15 N/cm or less, and more preferably 0.02 N/cm or more or 0.1 N/cm or less.
Furthermore, for the covering part I, the peeling force F (D) when the above-mentioned covering part I is peeled off from the above-mentioned adhesive material layer in an environment of 30°C after heating the adhesive sheet laminate at 100°C for 5 minutes and then cooling to 30°C Preferably it is 0.2 N/cm or less.
If the adhesive sheet laminate is heated at 100°C for 5 minutes and then cooled to 30°C, and the peeling force F(D) measured at 30°C is at the same level as the above peeling force F(C), even if the Even when the adhesive sheet laminate is thermoformed, the peeling force F(D) does not change, so the above-mentioned covering portion I can be easily peeled off from the adhesive layer.
From this point of view, the peeling force F(D) is preferably 0.2 N/cm or less, more preferably 0.01 N/cm or more or 0.15 N/cm or less, and more preferably 0.02 N/cm or more or 0.1 N/cm or less.
Furthermore, the covering portion I is preferably such that the absolute value of the difference between the peeling force F(C) and the peeling force F(D) is 0.1 N/cm or less.
If the adhesive sheet laminate is heated at 100°C for 5 minutes and then cooled to 30°C, the absolute difference between the peel force F(D) measured at 30°C and the peel force F(C) under normal conditions If the value is 0.1 N/cm or less, the peeling force F(D) does not change even if the adhesive sheet laminate is thermoformed, so the covering portion I can be easily peeled off from the adhesive layer.
From this point of view, the absolute value of the difference between the peeling force F(C) and the peeling force F(D) is preferably 0.1 N/cm or less, more preferably 0.08 N/cm or less, and even more preferably 0.05 Below N/cm.
Furthermore, the peeling force F(C) and peeling force F(D) of the covering portion I can be adjusted by the type of the release layer formed on one side of the covering portion I, and the like. However, it is not limited to this method.
As a configuration example of the covering part I, a configuration example including a coating base material layer and a release layer can be mentioned. By laminating the release layer on one surface of the covering base material layer, the covering portion I can be easily peeled off from the adhesive material layer.
In this case, it is preferable that the covering base material layer has, as a main component, one resin or two or more resins selected from the group consisting of, for example, polyester, copolyester, polyolefin, and copolymerized polyolefin. The stretched or unstretched layer, that is, a single layer or a multilayer of a layer of a stretched or unstretched film containing these resins as a main component.
Among them, the covering base material layer constituting the above-mentioned covering part I preferably has an extended film containing, for example, a copolymerized polyester, a polyolefin, or a copolymerized polyolefin as a main component from the viewpoint of mechanical strength or chemical resistance. Or monolayer or multilayer of layers of unstretched film.
Specific examples of the above-mentioned copolymerized polyester include, for example, the use of isophthalic acid as a dicarboxylic acid, and cyclohexanedimethanol, 1,4-butanediol, diethylene glycol, etc. as a diol. Copolymerized polyethylene terephthalate formed by copolymerization.
Specific examples of the polyolefin include α-olefin homopolymers, for example, propylene homopolymers and 4-methylpentene-1 homopolymers.
Specific examples of the above-mentioned polyolefin copolymers include copolymers of ethylene, propylene, other α-olefins, vinyl monomers, and the like.
The above-mentioned release layer is preferably a layer containing a modified polyolefin in addition to a release agent such as polysiloxane.
Here, examples of the modified olefin constituting the release layer include resins whose main components are polyolefins modified with unsaturated carboxylic acids or anhydrides thereof, or silane-based coupling agents.
Examples of the unsaturated carboxylic acid or its anhydride include acrylic acid, methacrylic acid, maleic acid, maleic anhydride, citraconic acid, citraconic anhydride, itaconic acid, itaconic anhydride, or the like. Esters of monoepoxides of derivatives and the above-mentioned acids, reaction products of polymers having groups capable of reacting with the acids in their molecules and acids, etc. Moreover, these metal salts can also be used. Among these, maleic anhydride can be used more preferably. Moreover, these copolymers can be used individually or in mixture of 2 or more types, respectively.
In order to produce modified polyolefin-based resins, for example, the modified monomers may be copolymerized in advance at the stage of polymerizing the polymers, or the temporarily polymerized polymers may be graft-copolymerized with the modified monomers. . In addition, as the modified polyolefin resin, these modified monomers can be used alone or in combination, and the content is preferably 0.1% by mass or more, preferably 0.3% by mass or more, and more preferably 0.5% by mass. Mass % or more and 5 mass % or less, Preferably it is 4.5 mass % or less, More preferably, it is the range of 4.0 mass % or less. Among these, graft-modified ones can be suitably used.
Suitable examples of modified polyolefin resins include maleic anhydride-modified polypropylene resins, maleic anhydride-modified polyethylene resins, maleic anhydride ethylene-vinyl acetate copolymers, etc. .
From the viewpoint of formability, the thickness of the covering portion I is preferably 10 μm to 500 μm, more preferably 20 μm or more and 300 μm or less, especially preferably 30 μm or more and 150 μm or less.
<Cover II>
As mentioned above, in this adhesive sheet laminate, the covering part I can be laminated in a detachable manner on one of the front and back sides of the adhesive layer, and on the opposite side to the covering part I, that is, the front side of the adhesive layer. And the other side of the back is formed by laminating the covering part II in a detachable manner. Thus, by laminating the cover portion II on the other side of the front and back of the adhesive material layer in a detachable manner, workability can be improved. However, it is also possible to adopt a configuration in which the covering portion II is not laminated.
The material and configuration of the covering part II are not particularly limited as long as it is laminated on the other side of the front and back of the adhesive material layer in a detachable manner.
Covering portion II may have, for example, the same laminated structure and material as the above-mentioned covering portion I, and in this case, may have the same thickness as the above-mentioned covering portion I, or may have a different thickness.
If the covering part II has the same laminate structure and material as that of the covering part I, warpage can be prevented from occurring when the adhesive sheet laminate is heated.
The covering part II can also adopt the same composition as the covering part I, but the storage elastic modulus E'(MA) at 100°C, the storage elastic modulus E'(MB) at 30°C, and the ratio of these (E '(MB)/E'(MA)), peeling force F(C), peeling force F(D), etc. are different from the coating part I.
Furthermore, the covering part II may have a laminated structure and material different from the above-mentioned covering part I.
For the covering part II, for example, a commonly used release film (also referred to as a "release film") can also be used. Specifically, for example, the storage elastic modulus E'(MC) at 100°C is 2.0×109
~1.0×1011
As the material of Pa, for example, a biaxially stretched polyethylene terephthalate (PET) film or the like can be used.
[Cover part I]
As an example of the composition of the above-mentioned coating part I, a coating film is provided with a coating layer on one side of a copolymerized polyester film, and the storage elastic modulus E' at 100° C. is 1.5×109
The coating film characterized by Pa or below (referred to as "the present coating film") will be described.
If this coating film is used, for example, after heating the above-mentioned adhesive sheet laminate, pressing a mold against the coating film provided with a release coating layer for molding, it can be formed on the adhesive sheet. The surface is formed with a high-precision concave-convex shape that matches the concave-convex part of the surface of the adherend. In addition, since the coating film maintains shape retention under normal conditions, it is easy to handle, and because it is not too hard, it can suppress the formation of unintended unevenness on the adhesive sheet.
<Copolymerized polyester film>
The copolymerized polyester film constituting this coating film may be composed of a single layer or a laminated structure. For example, in addition to a 2-layer or 3-layer structure, as long as it does not exceed the gist of the present invention, it may also be 4 layers or 4 layers. The above multiple layers are not particularly limited. Also, for example, when a three-layer structure (surface layer/intermediate layer/surface layer) is adopted, any one layer or two or more layers of the surface layer or the intermediate layer may be used as a copolymerized polyester component, and the remaining The layer is constituted by a polyester component not containing a copolymerization component.
In addition, the co-polymerized polyester film refers to a film obtained by cooling a molten polyester sheet extruded by an extrusion method, and stretching it as necessary.
As the dicarboxylic acid component of the copolymerized polyester, terephthalic acid is preferred, in addition, oxalic acid, malonic acid, succinic acid, adipic acid, azelaic acid, sebacic acid, phthalic acid One or more kinds of known dicarboxylic acids such as dicarboxylic acid, isophthalic acid, naphthalene dicarboxylic acid, diphenyl ether dicarboxylic acid, and cyclohexanedicarboxylic acid are used as copolymerization components. Moreover, as a diol component, ethylene glycol is preferable, and other than that, propylene glycol, trimethylene glycol, tetramethylene glycol, hexamethylene glycol, 1,4-cyclohexane may be contained One or more kinds of known diols such as dimethanol, diethylene glycol, triethylene glycol, polyalkylene glycol, and neopentyl glycol are used as the copolymerization component.
Among them, phthalic acid and isophthalic acid as dicarboxylic acid components, 1,4-cyclohexanedimethanol, 1,4-butanediol, diethylene glycol, etc. as diol components are more preferable. Copolymerized polyethylene terephthalate formed by random copolymerization.
The content of the copolymerization component is preferably from 1 mol% to 50 mol%, more preferably from 3 mol% to 40 mol%, still more preferably from 4 mol% to 30 mol%. When the content of the copolymerization component is 1 mol% or more, a concave shape, a convex shape, or an uneven shape can be formed on the surface of the adhesive sheet when it is laminated with the adhesive sheet. On the other hand, by being 50 mol% or less, not only sufficient dimensional stability is obtained, but also generation of wrinkles during processing can be sufficiently suppressed.
The melting point of the copolymerized polyester film is preferably designed so as to be within a range of preferably 260°C or lower, more preferably 200 to 255°C. Since the above-mentioned melting point is 260° C. or lower, sufficient strength can be obtained even if the heat treatment is performed at a temperature lower than the melting point of the copolymerized polyester film in the heat treatment step after stretching.
From the viewpoint of improving film workability, it is preferable to contain particles in the copolymerized polyester film. Examples of particles include inorganic particles such as calcium carbonate, magnesium carbonate, calcium sulfate, barium sulfate, lithium phosphate, magnesium phosphate, calcium phosphate, lithium fluoride, aluminum oxide, silicon oxide, and kaolin; acrylic resin, guanamine resin, etc. Organic particles; Precipitated particles formed by granulating catalyst residues, but not limited to these. The particle diameter of these particles and the content in the copolymerized polyester film can be appropriately determined according to the purpose. The contained particles may be a single component, or two or more components may be used together. In addition, various stabilizers, lubricants, antistatic agents, etc. may be added appropriately.
The average particle diameter of the particles contained in the copolymerized polyester film is preferably 0.1-5.0 μm. When the average particle diameter of the said particle|grains is less than 0.1 micrometer, the sliding property of a film becomes insufficient, and workability may fall. On the other hand, when the average particle diameter of the said particle|grains exceeds 5.0 micrometers, the smoothness of a film surface may be impaired.
The content of the particles contained in the copolymerized polyester film is preferably 0.01 to 0.3% by weight. When content of the said particle|grains is less than 0.01 weight%, the sliding property of a film becomes insufficient, and workability may fall. On the other hand, when the content of the above particles exceeds 0.3% by weight, the smoothness of the film surface may be impaired.
The method of adding particles to the copolymerized polyester film is not particularly limited, and known methods can be employed. For example, it can be added at any stage of polyester production, preferably at the stage of esterification, or it can be added in the form of slurry dispersed in ethylene glycol or the like after the transesterification reaction and before the polycondensation reaction starts to carry out the polycondensation reaction. In addition, it is possible to mix the slurry of particles dispersed in ethylene glycol or water with the polyester raw material by using a kneading extruder with a vent hole, or to mix the dried particles by using a kneading extruder. The method of blending with polyester raw materials, the method of precipitating particles in the polyester production process system, etc. are carried out.
The intrinsic viscosity of the copolymerized polyester is usually 0.40-1.10 dl/g, preferably 0.45-0.90 dl/g, and more preferably 0.50-0.80 dl/g. If the limit viscosity is less than 0.40 dl/g, the mechanical strength of the film tends to be weakened. When the limit viscosity exceeds 1.10 dl/g, the melt viscosity becomes high and excessive load is applied to the extruder. situation.
Next, although the manufacture example of a copolymerization polyester film is demonstrated concretely, it is not limited to the following manufacture example at all.
Preferably, the following method is used: first, using the aforementioned co-polymerized polyester raw material, the melted sheet extruded from the die is cooled and solidified by a cooling roll to obtain an unstretched sheet. In this case, in order to improve the planarity of the sheet, it is necessary to improve the adhesion between the sheet and the rotating cooling drum, and the electrostatic application bonding method and/or the liquid coating bonding method can be preferably used.
Then, it is preferred to stretch the obtained unstretched sheet at least in a uniaxial direction, more preferably biaxially stretched in a biaxial direction. For example, as biaxial stretching, in the case of sequential biaxial stretching, the above-mentioned unstretched sheet is stretched in one direction along the machine direction by a stretching machine of a roll or spoke type. The stretching temperature is usually 70-120°C, preferably 75-110°C, and the stretching ratio is usually 2.5-7.0 times, preferably 3.0-6.0 times. Next, extend in a direction perpendicular to the extending direction (machine direction) of the first stage. The stretching temperature is usually 70-170° C., and the stretching ratio is usually 3.0-7.0 times, preferably 3.5-6.0 times. Then, heat treatment is continued at a temperature of 150-270° C. under stretching or relaxation within 30%, to obtain a biaxially oriented film. In the biaxial stretching described above, a method of stretching in one direction in two or more stages may also be employed. In this case, it is preferable to carry out so that the stretching ratios of two directions may respectively become the said range finally.
Moreover, simultaneous biaxial stretching can also be used for manufacture of a copolymerized polyester film. Simultaneous biaxial stretching is a method of simultaneously stretching and aligning the above-mentioned unstretched sheet in the machine direction and width direction at a temperature of usually 70-120°C, preferably 75-110°C, under temperature control. The elongation ratio is preferably 4 to 50 times in terms of area ratio, more preferably 7 to 35 times, and still more preferably 10 to 25 times. Then, heat treatment is continued under stretching or relaxation within 30% at a temperature of 150-250° C. to obtain a biaxially stretched film. For the simultaneous biaxial stretching device using the above-mentioned stretching method, conventionally known stretching methods such as a screw method, a pantograph method, and a linear drive method can be used.
(coating layer)
In this coating film, it is important to provide a coating layer on at least one side of the copolymerized polyester film. The coating layer is not particularly limited, and specific examples thereof include a release layer, an antistatic layer, an oligomer sealant layer, an easy-adhesive layer, and a primer layer. Among them, a release layer is more preferable in terms of producing an adhesive sheet laminate laminated with an adhesive sheet. Moreover, you may combine 2 or more types of functional layers mentioned above.
As a specific example of the coating layer which comprises a coating film, the release layer is demonstrated below.
Specifically, the types of resin used for the release layer include curable silicone resins, fluorine-based resins, and polyolefin-based resins, among which curable silicone resins are preferred. It may be a hardening silicone resin, or a type mainly composed of a hardening silicone resin. Within the scope of not detracting from the gist of the present invention, it may also be used by combining with urethane resin, ring Modified polysiloxane type obtained by graft polymerization of organic resins such as oxygen resin and alkyd resin, etc.
As the type of curable silicone resin, any curing reactive type such as addition type, condensation type, ultraviolet curing type, electron beam curing type, and solvent-free type can be used. If specific examples are given, it can be illustrated: KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-856, X-62-2422, X-62 manufactured by Shin-Etsu Chemical Co., Ltd. -2461, X-62-1387, X-62-5039, X-62-5040, KNS-3051, X-62-1496, KNS320A, KNS316, X-62-1574A/B, X-62-7052, X -62-7028A/B, X-62-7619, X-62-7213; YSR-3022, TPR-6700, TPR-6720, TPR-6721, TPR6500, TPR6501, UV9300, UV9425, XS56 manufactured by Momentive Performance Materials- A2775, XS56-A2982, UV9430, TPR6600, TPR6604, TPR6605; SRX357, SRX211, SD7220, SD7292, LTC750A, LTC760A, LTC303E, SP7259, BY24-468C, SP7248S, BY24-452, DKQ3- 202, DKQ3-203, DKQ3-204, DKQ3-205, DKQ3-210, etc. Furthermore, in order to adjust the peelability of a release layer, etc., you may use a peel control agent together.
The hardening conditions for forming the release layer on the copolymerized polyester film are not particularly limited. When the release layer is provided by off-line coating, it is generally suitable to conduct heat treatment at 120-200° C. for 3-40 seconds, preferably at 100-180° C. for 3-40 seconds. Moreover, active energy ray irradiation, such as heat treatment and ultraviolet irradiation, can also be used together as needed. In addition, as an energy source for curing by active energy ray irradiation, conventionally known devices and energy sources can be used. The coating amount of the release layer (after drying) is generally 0.005 to 1 g/m in terms of coatability2
range, preferably 0.005-0.5 g/m2
The range, and more preferably 0.01 ~ 0.2 g/m2
range. When the coating amount (after drying) does not reach 0.005 g/m2
In this case, there are cases where it is difficult to obtain a uniform coating film due to the lack of stability in terms of coatability. On the other hand, at more than 1 g/m2
On the other hand, in the case of thick coating, the coating film adhesion and curability of the release layer itself may decrease.
As a method of providing a release layer on a copolymerized polyester film, conventionally known methods such as reverse gravure coating, direct gravure coating, roll coating, die coating, rod coating, and curtain coating can be used. The coating method. About the application method, there is an example described in "Applying method" (Maki Shoten, Yuji Harasaki, published in 1979).
In addition, in order to provide a coating layer on the copolymerized polyester film, surface treatments such as corona treatment, plasma treatment, and ultraviolet irradiation treatment may be performed in advance.
(coating film)
The thickness of the coating film is usually 9 μm to 250 μm, preferably 12 μm to 125 μm, and more preferably 25 μm to 75 μm.
When the above-mentioned thickness is less than 9 μm, the film tension becomes insufficient, and abnormalities such as wrinkles are likely to occur during slitting. On the other hand, if it exceeds 250 μm, for example, followability to a molded article having a curved shape may become insufficient.
The storage elastic modulus E' of the coating film at 100°C is 1.5×109
Below Pa, preferably 1.0×109
Below Pa. By the above storage elastic modulus E' is 1.5×109
Pa below, when it is laminated with an adhesive sheet, a concave shape, a convex shape, or a concavo-convex shape can be formed on the surface of the adhesive sheet. In order to make the storage elastic modulus E' in 100 degreeC satisfy|fill the said range, it can be satisfied by adjusting the kind and content of the copolymerization component contained in a copolymerization polyester film.
On the other hand, the lower limit is not particularly limited, but is preferably 1.0×107
Above Pa, more preferably 1.0×108
Above Pa.
The shrinkage rate of the coated film after heating at 120°C for 5 minutes is less than 3.0%, preferably less than 2.5%. Since the above-mentioned shrinkage rate is 3.0% or less, it has sufficient dimensional stability, so when it is laminated with an adhesive sheet, a concave shape, a convex shape, or a concave-convex shape can be formed on the surface of the adhesive sheet. Furthermore, since generation of wrinkles during processing can be suppressed, an adhesive sheet having a sufficient appearance can be produced without transferring wrinkles to the adhesive sheet.
Among them, the shrinkage rate in the machine direction (MD) after heating at 120° C. for 5 minutes is preferably 3.0% or less, more preferably 2.5% or less. On the other hand, the lower limit is not particularly limited, but is preferably at least 0.1%, more preferably at least 0.5%.
Also, the shrinkage rate in the direction (TD) perpendicular to the machine direction after heating at 120° C. for 5 minutes is preferably 1.0% or less, more preferably 0.8% or less. On the other hand, the lower limit is preferably -1.0% or more, more preferably -0.5% or more.
From the viewpoint of preventing the contamination caused by the adhesion of the oligomer (cyclic trimer) to the mold during the forming process, it is preferable that the oligomer is free from coating after heat treatment (180°C, 10 minutes). The extraction amount on the surface of the layer is 1.0×10-3
mg/cm2
Below, preferably 5.0×10-4
mg/cm2
the following.
When the extraction amount of the above-mentioned oligomer exceeds this range, the pollution caused by the adhesion of the oligomer to the mold during the molding process may become serious. As an example, in the processing of multiple continuous heat forming, the deposition of precipitated oligomers promotes mold contamination, so it is important to control the amount of oligomers precipitated during heating. For the above reasons, the less the amount of extraction of the above-mentioned oligomers, the better.
[Manufacturing method of this adhesive sheet laminate]
As an example of the manufacturing method of this adhesive sheet laminate, the method of sandwiching the adhesive composition between two covering parts I or II, and forming an adhesive layer using a lamination machine is mentioned, for example. Moreover, as another method, the method of applying an adhesive composition to the covering part I or II and forming an adhesive material layer is mentioned. However, it is not limited to this manufacturing method.
As a method of coating an adhesive composition, conventionally known coating methods, such as reverse roll coating, gravure coating, bar coating, and knife coating, are mentioned, for example.
[This shaped adhesive sheet laminate]
Using this adhesive sheet laminate, a shaped adhesive sheet laminate 1 (referred to as "this shaped adhesive sheet laminate 1") in which concavo-convex shapes are formed on the surface of the adhesive layer can be produced as follows.
As shown in FIG. 3 , the shape-shaped adhesive sheet laminate 1 can be manufactured as follows: it has an adhesive layer 2 and is laminated on one of the front and back sides of the adhesive layer 2 in a peelable manner. The covering part I formed on one side, and the covering part II formed by laminating on the other side of the front and back of the adhesive material layer 2 in a detachable manner,
Adhesive material layer 2 has a concave portion, a convex portion or a concave-convex portion (referred to as “adhesive sheet surface concave-convex portion 2B”) on one side surface 2A of the front side and the back side, and the other side surface 2C of the front side and the back side is a flat surface,
The covering part 1 is closely attached to the front and back side surfaces 2A of the above-mentioned adhesive sheet 2, and one side surface 3A of the front and back side is provided with a concave part, a convex part or a concave-convex part (referred to as "covering part surface concave-convex part 3B"), And on the back surface 3C of the sheet, there are convex, concave, or concave-convex portions that conform to the concave-convex portion 2B on the surface of the adhesive sheet, in other words, forming a fitting concave-convex portion (referred to as “protective sheet back convex-concave portion 3D”),
The covering portion II includes a flat surface along the other side surface 2C of the front and back surfaces of the above-mentioned adhesive sheet 2 .
Moreover, the other side surface 2C of the front and back can be made into a flat surface as shown in FIG.
The shape-forming adhesive sheet laminate 1 having such a structure can be integrally formed by performing pressure forming, vacuum forming, pressure forming, or roll forming on the above-mentioned adhesive sheet laminate as shown in FIG. 2 . Method This adhesive sheet laminate is formed into a concavo-convex shape and manufactured.
By manufacturing in the above manner, the uneven portion 2B on the surface of the adhesive sheet of the adhesive layer 2, the uneven portion 3B on the surface of the protective sheet of the covering portion 1, and the uneven portion 3D on the back surface of the protective sheet can be formed corresponding to each other at the same position to form unevenness.
The adhesive material layer 2 can be used, for example as a double-sided adhesive sheet for bonding two image display device constituent members (each also referred to as an "adhered body") constituting the image display device.
That is, the concave-convex part 2B on the surface of the adhesive sheet in the adhesive material layer 2 can be matched with the concave part, convex part or concave-convex part (referred to as "surface concave-convex part of the adherend") on the bonding surface of the above-mentioned adherend. Formed, preferably formed into the same contour shape. Thereby, the surface unevenness 2B of the adhesive sheet in the shape-shaped adhesive sheet laminate 1 can be fitted with the unevenness on the surface of the adherend in the constituent member of the image display device as the adherend.
Here, as the above-mentioned image display device, for example, a device equipped with a liquid crystal display (liquid crystal display, LCD), an organic EL (electroluminescence, electroluminescence) display device (OLED (organic light emitting diode, organic light emitting diode) )), electronic paper, microelectromechanical system (microelectromechanical system, MEMS) display and plasma display (PDP), such as smart phones, tablet terminals, mobile phones, TVs, game consoles, personal computers, car navigation systems, ATM (automatic teller machine, automatic teller machine), fish detector, etc. But not limited to these.
In addition, the image display device constituting member as an adherend refers to a member constituting such an image display device, for example, a surface protection panel, a touch panel, an image display panel, etc., and the present shape-shaped adhesive sheet laminate 1 For example, it can be used to bond any two adherends selected from a surface protection panel, a touch panel, and an image display panel. For example, it can be used to bond a surface protection panel and a touch panel, or a touch panel and an image display panel. However, the adherend is not limited to these.
<Manufacturing method>
Here, the method of manufacturing the shape-shaped adhesive sheet laminate 1 will be described in detail.
As described above, as shown in FIG. 2 , the present adhesive sheet laminate 1 can be integrally formed with concavo-convex shapes by forming the above-mentioned present adhesive sheet laminate by heating, as shown in FIG. 2 .
In this case, as the forming method, for example, pressure forming, vacuum forming, pressure forming, forming by rolls, forming by lamination, etc. may be mentioned. Among them, pressure molding is particularly preferable from the viewpoint of formability and workability.
A more detailed specific example will be described.
The adhesive sheet laminate is preheated by the heater, and the adhesive sheet laminate is transported to the pressure forming machine at the stage of heating to a specific temperature, and the concave-convex shape corresponding to the printed step shape of the adherend is used in advance. The mold is pressurized and cooled at the same time, so that the shape of the mold can be transferred to one side of the adhesive sheet laminate, and the shape-forming adhesive sheet laminate 1 with concavities and convexities formed on one side can be manufactured.
At this time, the preheating of the adhesive sheet laminate is preferably heated to a temperature at which the adhesive layer softens, specifically, it is preferably heated to 70 to 120°C.
The material of the mold used for concave-convex shaping is not particularly limited. For example, resin-based materials such as silicone resin and fluororesin, metal-based materials such as stainless steel or aluminum, and the like are mentioned. Among them, since high-precision formability is required for the unevenness of the adherend, it is particularly preferable to use a metal mold that can control the temperature during forming.
In addition, the cooling after press working may be carried out after the mold is opened, or the mold may be cooled in advance, and the cooling may be performed while pressurizing.
Furthermore, in the present invention, molding conditions such as pressing pressure and pressing time are not particularly specified, and may be appropriately adjusted according to the size or shape to be molded, the material used, and the like.
In addition, after forming, it can also be cut using a Thomson blade, a rotary cutter, or the like.
[Manufacturing method of the shaped adhesive sheet laminate]
Then, for the covering part I which has an adhesive material layer and is laminated on one side of the adhesive material layer in a peelable manner, and forms a concave part, a convex part, or a concave-convex part on one side of the adhesive material (referred to as "adhesive A particularly preferred form of the method for manufacturing a shape-forming adhesive sheet laminate composed of "concave-convex parts" on the surface of the material layer will be described.
The invention related to the present manufacturing method 1 and the present manufacturing method 2 described below proposes an adhesive material layer surface concave-convex part that can be formed on the surface of the adhesive material layer with high precision and conforms to the concave-convex part of the surface of the adherend, preferably A method for producing a novel shaped adhesive sheet laminate that can be produced continuously.
As an example of an embodiment of the present invention, a novel method for manufacturing a shaped adhesive sheet laminate (referred to as "this manufacturing method 1") is proposed. The shaped adhesive sheet laminate system has an adhesive layer and can be The coating part I is laminated on one side of the adhesive material layer by peeling, and the surface of the adhesive material is formed with concave parts, convex parts or concave-convex parts (referred to as "adhesive material layer surface concave-convex part"). That is, the manufacturing method is characterized in that: it is equipped with an adhesive material layer and a coating part I laminated on one side of the adhesive material layer in a peelable manner, and the adhesive sheet laminate is heated, and the heated The manufacturing method of forming the adhesive sheet laminate and cooling it to produce a shape-shaped adhesive sheet laminate, and heating the adhesive sheet laminate, and the storage elastic modulus E'(MS) in the covering part I is 1.0× 106
~2.0×109
Forming starts under the state of Pa, and the storage elastic modulus E'(MF) of the covering part I is 5.0×107
~1.0×1010
Forming is completed in the state of Pa.
In this production method 1, a method for producing the above-mentioned novel shape-shaped adhesive sheet laminate is further proposed, which uses a cooled mold to form the heated adhesive sheet laminate.
According to this manufacturing method 1, for example, by heating the above-mentioned adhesive sheet laminate, the covering part I starts forming in a specific state, and the covering part I finishes forming in a specific state, so that the surface of the adhesive layer can be formed with high precision. Form the concave-convex shape conforming to the concave-convex part of the surface of the adherend.
Furthermore, when molding the heated adhesive sheet laminate, if the mold is cooled, the cooling can be performed simultaneously with the molding and the molding can be completed at the same time, so that the above-mentioned manufacturing method can be continuously carried out.
<This production method 1>
This production method 1 is a production method of a shape-shaped adhesive sheet laminate (referred to as "this production method") which is an example of this embodiment, including heating the adhesive sheet laminate described below (heating step), heating the heated A manufacturing method in which an adhesive sheet laminate is formed and cooled (forming and cooling steps).
This manufacturing method 1 may include other steps as long as it includes the above-mentioned heating step and the above-mentioned forming and cooling steps. For example, steps such as a heat treatment step, a transfer step, a strip cutting step, and a cutting step may be included as needed. But not limited to these steps.
(adhesive sheet laminate)
The adhesive sheet laminate as a starting member in the production method 1 may include an adhesive layer and a covering portion I detachably laminated on one side of the adhesive layer, or may include other members. For example, as shown in FIG. 1 , an adhesive material layer, a covering portion I formed by detachably laminated on one side of the front and back sides of the adhesive material layer, and a detachably laminated cover portion I on the adhesive material layer can be exemplified. The other side of the front and back of the material layer is the adhesive sheet laminate of the covering part II. However, it is optional whether or not the covering portion II is provided, and a configuration in which the covering portion II is not laminated may also be adopted.
In addition, the detail about the adhesive sheet laminated body is as above-mentioned.
(heating step)
In this production method 1, it is preferable to heat the above-mentioned adhesive sheet laminate so that the storage elastic modulus E'(M) of the covering portion I is 1.0×106
~2.0×109
The state of Pa.
If the storage elastic modulus E'(M) of the covering part I is in the above range, the covering part I can be deformed to a degree suitable for forming, and the surface of the adhesive material layer can be formed into a desired concave-convex shape with high precision. .
From this point of view, it is preferable to set the storage elastic modulus E'(M) of the covering portion I to be 1.0×10 for heating the adhesive sheet laminate.6
~2.0×109
The state of Pa, which is further preferably set to 5.0×106
Above Pa or 1.0×109
The state below Pa, which is more preferably set to 1.0×107
Above Pa or 5.0×108
The state below Pa.
Accordingly, it is more preferable to set the storage elastic modulus E'(M) of the covering portion I to be 1.0×10 for heating the adhesive sheet laminate.6
~1.0×109
Pa, or 1.0×106
~5.0×108
state, wherein, and further preferably set to 5.0 × 106
~2.0×109
Pa, or 5.0×106
~1.0×109
The state of Pa, the best is set to 1.0×107
~1.0×109
Pa, or 1.0×107
~~5.0×108
state.
Here, in order to adjust the storage elastic modulus E'(M) of the covering part I in the above-mentioned range by heating the adhesive sheet laminate, it is possible to adjust the composition according to the composition or gel content of the covering part I. Rate, weight average molecular weight, etc. are adjusted by adjusting the heating temperature. However, it is not limited to this method.
Furthermore, it is even more preferable to heat the above-mentioned adhesive sheet laminate so that the storage elastic modulus E'(M) of the covering portion I is 1.0×106
~2.0×109
Pa, and the storage elastic modulus G'(S) of the adhesive layer is less than 1.0×104
The state of Pa.
If the storage elastic modulus E'(M) of the covering part I is adjusted to the above range, the above-mentioned effects can be obtained. In addition, if the storage elastic modulus G'(S) of the adhesive layer is less than 1.0 ×104
Pa, sufficient formability can be imparted to the adhesive material layer.
From this point of view, it is preferable to heat the adhesive sheet laminate so that the storage elastic modulus E'(M) of the covering part I is within the above range and the storage elastic modulus G'(S) of the adhesive layer does not reach 1.0×104
The state of Pa, which is preferably set to 5.0×101
Above Pa or 5.0×103
The state below Pa, which is preferably set to 1.0×102
Above Pa or 1.0×103
The state below Pa.
Accordingly, it is more preferable to heat the adhesive sheet laminate so that the storage modulus E'(M) of the covering part I is within the above range and the storage modulus G'(S) of the adhesive layer is 5.0×101
More than Pa and less than 1.0×104
Pa, or 5.0×101
Above Pa and 5.0×103
The state below Pa, which is more preferably set to 1.0×102
More than Pa and less than 1.0×104
Pa, or 1.0×102
Above Pa and 5.0×103
For the state below Pa, it is best to set it as 1.0×102
Above Pa and 1.0×103
The state below Pa.
Here, the storage elastic modulus G'(S) of the adhesive material layer can be adjusted by adjusting the heating temperature according to the composition, gel fraction, weight average molecular weight, etc. of the composition constituting the adhesive material layer. However, it is not limited to this method.
Furthermore, it is more preferable to heat the adhesive sheet laminate so that the value of the loss tangent tanδ of the adhesive layer becomes 1.0 or more. Note that the loss tangent tan δ will be described below.
When the value of the loss tangent tanδ of the adhesive material layer is 1.0 or more, it has flexibility to the extent that it can be molded, so it is preferable.
From this point of view, it is particularly preferable to heat the adhesive sheet laminate so that the value of loss tangent tanδ of the adhesive layer becomes 1.0 or more, more preferably 1.5 or more or 20 or less, and even more preferably To make it above 3.0 or below 10. But the upper limit is not limited to this.
In this manufacturing method 1, it is preferable to heat the adhesive sheet laminate so that the surface temperature of the covering portion I becomes 70 to 180°C.
If the surface temperature of the covering part I is 70°C or higher, the adhesive material layer is sufficiently softened, and the covering part I can be deformed sufficiently, and if it is 180°C or lower, the generation of wrinkles caused by heat shrinkage, or the formation of wrinkles caused by heat shrinkage can be suppressed. The disadvantages such as the decomposition of the adhesive material layer are caused, so it is better.
From this point of view, it is preferable to heat the above-mentioned adhesive sheet laminate so that the surface temperature of the covering part I becomes 70 to 180° C., more preferably 75° C. It becomes 80 degreeC or more or 120 degreeC or less.
As a method of heating the adhesive sheet laminate, for example, a method of heating the adhesive sheet laminate between upper and lower heating plates equipped with a heating body such as an electric heater inside, or directly sandwiching the adhesive sheet laminate The method of holding it, the method of using a heating roller, the method of immersing it in hot water, etc. However, it is not limited to these methods.
(forming, cooling steps)
In this step, the heated adhesive sheet laminate is formed as described above, and is cooled while forming the adhesive sheet laminate. That is, the adhesive sheet laminate in which the laminated adhesive layer and the covering portion I are integrated is directly molded. Thereby, the covering part I is formed by using a mold, and the adhesive material layer is also formed via this covering part I at the same time.
In this step, the heated adhesive sheet laminate may be cooled after molding, or may be cooled simultaneously with molding. For example, by pressing with a cooled mold, forming and cooling can be performed simultaneously and ended at the same time. Thereby, this manufacturing method 1 can be implemented continuously as mentioned below.
The molding method is not particularly limited as long as the adhesive sheet laminate can be integrally formed with concavo-convex shapes. For example, pressure forming, vacuum forming, pressure forming, forming by a roll, compression forming, forming by lamination, etc. are mentioned. Among them, pressure molding is particularly preferable from the viewpoint of formability and workability.
The material of the mold is not particularly limited. For example, resin-based materials such as silicone resin and fluororesin, metal-based materials such as stainless steel or aluminum, and the like are mentioned. Among them, since high-precision formability is required for the unevenness of the adherend, it is particularly preferable to use a metal mold that can control the temperature during forming.
The cooling method of the mold can adopt the usual cooling method. For example, cooling methods using water cooling or compressed air can be mentioned.
For the mold, for example, as shown in Figure 2, a specific concave-convex shape is provided on the inner wall surface of at least one of the molds in the pair of open and close molds in advance, for example, in the bonding surface of the adherend that is provided with the adhesive layer. Concave-convex shape conforming to concave-convex part, convex part or concave-convex part, and the above-mentioned concave-convex shape can be transferred to the adhesive sheet by pressure forming, vacuum forming, pressure forming or roll forming of the adhesive sheet laminate using the mold The material is layered and shaped.
In this step, preferably as described above, the storage elastic modulus E'(MS) of the coating portion I in the adhesive sheet laminate is 1.0×106
~2.0×109
Forming begins in the state of Pa.
Here, "starting molding" means, for example, in the case of molding using a mold, that the mold is closed, that is, the pressing of the adhesive sheet laminate starts using the mold.
If the storage elastic modulus E'(MS) of the covering part I is 1.0×106
~2.0×109
In the range of Pa, the covering part I can be deformed to a degree suitable for forming, and the surface of the adhesive material layer can be formed into a desired concave-convex shape with high precision.
From this point of view, it is preferable that the storage elastic modulus E'(MS) of the covering portion 1 is 1.0×106
~2.0×109
In the state of Pa, the formation of the adhesive sheet laminate is started, and it is more preferably 5.0×106
Above Pa or 1.0×109
Forming begins at a state below Pa, and it is more preferably 1.0×107
Above Pa or 5.0×108
Forming starts at a state below Pa.
Accordingly, it is more preferable that the storage elastic modulus E'(MS) of the covering portion I is 1.0×106
~1.0×109
Pa, or 1.0×106
~5.0×108
In the state of Pa, the formation of the adhesive sheet laminate is started, and it is more preferably 5.0×106
~1.0×109
Pa, or 5.0×106
~5.0×108
Forming starts under the state of Pa, the best is 1.0×107
~1.0×109
Pa, or 1.0×107
~5.0×108
Forming begins in the state of Pa.
Furthermore, it is more preferable that the storage elastic modulus E'(MS) of the covering portion I is 1.0×106
~2.0×109
Pa, and the storage elastic modulus G'(SS) of the adhesive layer is less than 1.0×104
In the state of Pa, the forming of the adhesive sheet laminate starts.
If the storage elastic modulus E'(MS) of the covering part I is formed under the state of the above-mentioned range, the above-mentioned effects can be obtained. In addition, if the storage elastic modulus G'(MS) of the adhesive layer SS) less than 1.0×104
If molding is started in the state of Pa, molding can be performed in a state where the adhesive layer has more sufficient formability.
From this point of view, it is more preferable that the storage elastic modulus E'(MS) of the covering part I is within the above range and the storage elastic modulus G'(SS) of the adhesive material layer is less than 1.0×104
Forming starts under the state of Pa, and it is more preferable that the G'(SS) is 5.0×101
Above Pa or 5.0×103
Forming begins at a state below Pa, and it is more preferably 1.0×102
Above Pa or 1.0×103
Forming starts at a state below Pa.
Accordingly, it is more preferable that the storage elastic modulus E'(MS) of the covering part I is in the above range and the storage elastic modulus G'(SS) of the adhesive layer is 5.0×101
More than Pa and less than 1.0×104
Pa, or 5.0×101
Above Pa and 5.0×103
Forming begins at a state below Pa, and it is more preferably 1.0×102
More than Pa and less than 1.0×104
Pa, or 1.0×102
Above Pa and 5.0×103
Forming begins at a state below Pa, the best is 1.0×102
Above Pa and 1.0×103
Forming starts at a state below Pa.
Moreover, it is preferable to start forming in the state where the surface temperature of the said covering part I is 70-180 degreeC.
If the surface temperature of the covering part I is 70°C or higher, the adhesive material layer is sufficiently softened, and the covering part I can be deformed sufficiently, and if it is 180°C or lower, the generation of wrinkles caused by thermal shrinkage can be suppressed, or by Decomposition of the adhesive layer caused by heat and other disadvantages, so it is better.
Therefore, it is preferable to start forming at a state where the surface temperature of the covering part I is 70 to 180° C., more preferably 75° C. or higher or 150° C. or lower, and more preferably 80° C. or higher or 120° C. below ℃.
On the other hand, in this step, it is preferable that the storage elastic modulus E'(MF) of the above-mentioned covering part I is 5.0×107
~1.0×1010
Forming is completed in the state of Pa.
Here, "completion of molding" means that the application of molding pressure to the adhesive sheet laminate is completed, and in the case of mold molding, it means that the mold is opened.
If the storage elastic modulus E'(MF) of the above-mentioned covering part I is 5.0×107
Above Pa and 1.0×1010
The range of Pa or less is preferable since the shape stability after molding is excellent.
From this point of view, it is preferable that the storage elastic modulus E'(MF) of the above-mentioned coating portion I is 5.0×107
~1.0×1010
Forming is completed under the state of Pa, which is more preferably 1.0×108
Above Pa or 8.0×109
The forming is completed under the state of Pa or less, and it is more preferably 1.0×109
Above Pa or 5.0×109
Molding is completed in the state below Pa.
Accordingly, in this step, it is more preferable that the storage elastic modulus E'(MF) of the above-mentioned covering portion I is, 5.0×107
~8.0×109
Pa, or 5.0×107
~5.0×109
The forming is completed under the state of Pa, among which, it is preferably 1.0×108
~8.0×109
Pa, or 1.0×108
~5.0×109
Forming is completed under the state of Pa, the best is 1.0×109
~8.0×109
Pa, or 1.0×109
~5.0×109
Forming is completed in the state of Pa.
Furthermore, it is more preferable that the storage elastic modulus E'(MF) of the covering part I is in the above-mentioned range and the storage elastic modulus G'(SF) of the adhesive material layer is 1.0×104
Molding is completed in the state of Pa or higher.
If the molding is completed with the storage elastic modulus E'(MF) of the above-mentioned coating part I in the above-mentioned range, the above-mentioned effects can be obtained. In addition, if the storage elastic modulus G' of the adhesive layer (SS) is 1.0×104
When the forming is completed in the state of Pa or higher, the formed adhesive layer can maintain its shape.
From this point of view, it is preferable that the storage modulus E'(MF) of the covering portion I is in the above range and the storage modulus G'(SF) of the adhesive layer is 1.0×104
Forming is completed in the state above Pa, and it is more preferable that the storage elastic modulus G'(SF) of the adhesive material layer is 5.0×104
Above Pa or 5.0×107
Forming is completed at a state below Pa, and it is more preferably 1.0×104
Above Pa or 1.0×107
Molding is completed in the state below Pa.
In addition, it is preferable to complete the molding in a state where the surface temperature of the above-mentioned covering portion I is less than 50°C. For example, in the case of press molding, it is preferable to open the mold in a state where the surface temperature is less than 50°C.
If the surface temperature of the covering part I is less than 50°C, and the storage elastic modulus E'(MS) of the covering part I is 5.0×107
~1.0×1010
The range of Pa is preferable because it can suppress deformation when the molded body is taken out after molding, or warpage due to heat shrinkage of the covering part I.
From this point of view, it is preferable to complete the molding when the surface temperature of the covering portion 1 is less than 50°C, especially preferably when the surface temperature is 0°C or higher or 45°C or lower, and especially preferably 0°C or higher. Molding is completed in a state where the temperature becomes 10°C or higher or 40°C or lower.
Furthermore, it is preferable that the storage elastic modulus E'(MS) of the covering part I at the beginning of the above-mentioned forming and the storage elastic modulus E'(MF) of the covering part I at the end of the above-mentioned forming satisfy the following relational expression (1) .
(1)・・E'(MF)/E'(MS)≧1.3
Here, if the storage elastic modulus E'(MS) of the covering part I and the storage elastic modulus E'(MF) of the covering part I at the end of the above-mentioned forming satisfy the above-mentioned relational expression (1), then at the beginning of forming It is preferably soft enough to be molded and hard enough to maintain the molded shape after the molding is completed.
From this point of view, E'(MF)/E'(MS)≧1.3 is preferred, and 100≧E'(MF)/E'(MS) or E'(MF)/E' is further preferred. (MS)≧3.0, especially 50≧E'(MF)/E'(MS) or E'(MF)/E'(MS)≧5.0. However, the upper limit of E'(MF)/E'(MS) is not limited thereto.
Also, it is preferable that the storage elastic modulus E'(MF) of the covering part I at the end of the above-mentioned forming and the storage elastic modulus G'(SF) of the adhesive material layer at the end of the above-mentioned forming satisfy the following relational expression (2) .
(2)・・E'(MF)/G'(SF)≦1.0×107
Here, if the storage elastic modulus E'(MF) of the covering part I at the end of the above-mentioned forming and the storage elastic modulus G'(SF) of the adhesive material layer at the end of the above-mentioned forming satisfy the above-mentioned relational expression (2), then The formed adhesive material layer can maintain the shape.
From this viewpoint, it is preferable that E'(MF)/G'(SF)≦1.0×107
, which is further preferably 1.0≦E'(MF)/G'(SF) or E'(MF)/G'(SF)≦5.0×106
, which is further preferably 1.0×101
≦E'(MF)/G'(SF) or E'(MF)/G'(SF)≦1.0×106 . Although it is repeated, in this production method 1, the mold can be press-formed and cooled after opening the mold, or the mold can be cooled in advance and cooled while press-forming. If the mold is cooled in advance in this way, and the cooling is performed simultaneously with press molding, the molding and cooling can be completed at the same time. Thereby, the shape-shaped adhesive sheet laminate can be conveyed to the next step immediately after completion of shaping and cooling, and thus the shape-shaped adhesive sheet laminate can be continuously manufactured. In the case of cooling while molding the mold, the surface temperature of the mold is preferably 0 to 50°C. If the surface temperature of the mold is below 50°C, the shape of the adhesive sheet laminate can be fixed in a short period of time, and the precision of the molded body obtained can be good, and warpage accompanying heat shrinkage during the cooling process after molding can be suppressed. Better from this point of view. Therefore, the surface temperature of the mold is preferably 0 to 50°C, more preferably 10°C or higher or 40°C or lower, particularly preferably 15°C or higher or 30°C or lower. Furthermore, the conditions of press molding such as press pressure and press time are not particularly limited, and may be appropriately adjusted according to the size or shape to be formed, the material to be used, and the like. (Others) The shape-shaped adhesive sheet laminate obtained in the above forming and cooling steps can be wound up as it is, can also be heat-treated, and can also be cut into a specific size and shape. When cutting, the method of cutting using a Thomson blade, a rotary cutter, etc. is mentioned, for example. In this production method 1, it is preferable to continuously produce a shaped adhesive sheet laminate. For example, the adhesive sheet laminate may be conveyed to a heating unit such as a heater, and the conveyance may be stopped for a specified time in the heating unit for heating, or the heated adhesive sheet laminate may be conveyed to a molding machine after heating while conveying. In the forming unit, such as a forming mold, in the forming unit, for example, pressurized by a cooled mold, cooling is performed while forming, and then transferred to the next unit if necessary, and the shape-shaped adhesive sheet is continuously produced. laminated body. <This production method 2> As an example of an embodiment of the present invention, a method for producing a shaped adhesive sheet laminate (referred to as "this production method 2") is proposed. This shaped adhesive sheet laminate system has an adhesive material Layer and the coating part I laminated on one side of the adhesive material layer in a peelable manner, and form a concave part, a convex part, or a concave-convex part on one side of the adhesive material layer (referred to as "adhesive material layer surface concave-convex part") The characteristic of this manufacturing method is that it is to heat the adhesive sheet laminated body having the adhesive material layer and the covering part I laminated on one side of the adhesive material layer in a detachable manner, and use A method for manufacturing a shape-shaped adhesive sheet laminate by molding the heated adhesive sheet laminate with a mold, and heating the adhesive sheet laminate, starting when the surface temperature of the coating part I is 70-180°C After molding, the shape-forming adhesive sheet laminate was taken out from the mold after the surface temperature of the covering part I became less than 60°C. According to this production method 2, by heating the adhesive sheet laminated body, the molding starts in the state where the surface temperature of the covering part I is 70 to 180°C, and after the surface temperature of the covering part I becomes less than 60°C, it is removed from the mold. The shape-shaped adhesive sheet laminate is taken out, and, for example, a concave-convex shape that matches the concave-convex portion of the surface of the adherend can be formed on the surface of the adhesive layer with high precision. This production method 2 is a production method including the steps of heating the adhesive sheet laminate described below (heating step), forming and cooling the heated adhesive sheet laminate (forming, cooling step). This manufacturing method 2 may include other steps as long as it includes the above-mentioned heating step and the above-mentioned forming and cooling steps. For example, steps such as a heat treatment step, a transfer step, a strip cutting step, and a cutting step may be included as needed. But not limited to these steps. (Adhesive sheet laminate) The adhesive sheet laminate as a starting member in the production method 2 may include an adhesive layer and a covering portion I laminated on one side of the adhesive layer in a detachable manner, Other components may also be provided. For example, as shown in FIG. 1 , an adhesive material layer, a covering portion I formed by detachably laminated on one side of the front and back sides of the adhesive material layer, and a detachably laminated cover portion I on the adhesive material layer can be exemplified. The other side of the front and back of the material layer is the adhesive sheet laminate of the covering part II. However, it is optional whether or not the covering portion II is provided, and a configuration in which the covering portion II is not laminated may also be adopted. In addition, the detail about the adhesive sheet laminated body is as above-mentioned. (Heating step) In this step, the above-mentioned adhesive sheet laminate is heated so that the surface temperature of the covering portion I becomes 70 to 180°C. If the surface temperature of the covering part I is 70°C or higher, the adhesive material layer is sufficiently softened, and the covering part I can be deformed sufficiently, and if it is 180°C or lower, the generation of wrinkles caused by heat shrinkage, or the formation of wrinkles caused by heat shrinkage can be suppressed. The disadvantages such as the decomposition of the adhesive material layer are caused, so it is better. From this point of view, it is preferable to heat the above-mentioned adhesive sheet laminate so that the surface temperature of the covering part I becomes 70 to 180° C., more preferably 75° C. It becomes 80 degreeC or more or 120 degreeC or less. Accordingly, it is more preferable to heat the above-mentioned adhesive sheet laminate so that the surface temperature of the covering part I becomes 70 to 150° C., or 70 to 120° C. 120°C, preferably 80 to 150°C, or 80 to 120°C. As a method of heating the adhesive sheet laminate, for example, a method of heating the adhesive sheet laminate between upper and lower heating plates equipped with a heating body such as an electric heater inside, or directly sandwiching the adhesive sheet laminate The method of holding it, the method of using a heating roller, the method of immersing it in hot water, etc. However, it is not limited to these methods. (Shaping and cooling step) In this step, it is preferable to start the molding of the adhesive sheet laminate while heating the surface temperature of the coating part I to 70 to 180° C. as described above. That is, it is preferable to directly form the adhesive sheet laminate in which the laminated adhesive layer and the covering portion I are integrated. Thereby, while forming the covering part I, the adhesive material layer can also be formed via this covering part I. In this step, the heated adhesive sheet laminate may be cooled after molding, or may be cooled simultaneously with molding. For example, by pressing with a cooled mold, forming and cooling can be performed simultaneously and ended at the same time. Thereby, this manufacturing method 2 can be implemented continuously as mentioned below. The molding method is not particularly limited as long as the adhesive sheet laminate can be integrally formed with concavo-convex shapes. For example, pressure forming, vacuum forming, pressure forming, forming by a roll (roll forming), compression forming, forming by lamination, etc. are mentioned. Among them, pressure molding is particularly preferable from the viewpoint of formability and workability. When molding is performed using a mold, the material of the mold is not particularly limited. For example, resin-based materials such as silicone resin and fluororesin, metal-based materials such as stainless steel or aluminum, and the like are mentioned. Among them, since high-precision formability is required for the unevenness of the adherend, it is particularly preferable to use a metal mold that can control the temperature during forming. The cooling method of the mold can adopt the usual cooling method. For example, cooling methods using water cooling or compressed air can be mentioned. For the mold, for example, as shown in Figure 2, a specific concave-convex shape is provided on the inner wall surface of at least one of the molds in the pair of open and close molds in advance, for example, in the bonding surface of the adherend that is provided with the adhesive layer. Concave-convex shape conforming to concave-convex part, convex part or concave-convex part, and the above-mentioned concave-convex shape can be transferred to the adhesive sheet by pressure forming, vacuum forming, pressure forming or roll forming of the adhesive sheet laminate using the mold The material is layered and shaped. As described above, it is preferable to start forming in a state where the surface temperature of the above-mentioned covering portion I is 70 to 180°C. If the surface temperature of the covering part I is 70°C or higher, the adhesive material layer is sufficiently softened, and the covering part I can be deformed sufficiently, and if it is 180°C or lower, the generation of wrinkles caused by thermal shrinkage can be suppressed, or by Decomposition of the adhesive layer caused by heat and other disadvantages, so it is better. Therefore, it is preferable to start forming at a state where the surface temperature of the covering part I is 70 to 180° C., more preferably 75° C. or higher or 150° C. or lower, and more preferably 80° C. or higher or 120° C. below ℃. On the other hand, in this step, it is preferable to complete the molding in a state where the surface temperature of the above-mentioned covering portion I is less than 60°C. For example, in the case of press molding, it is preferable to open the mold in a state where the surface temperature is less than 60°C. Here, "completion of molding" means that the application of molding pressure to the adhesive sheet laminate is completed, and in the case of mold molding, it means that the mold is opened. If the surface temperature of the coating part I is less than 60° C., it is preferable to suppress deformation when the molded body is taken out after molding, or warping due to heat shrinkage of the coating part I. From this point of view, it is preferable to complete the forming when the surface temperature of the covering portion I is less than 60°C, especially preferably at 0°C or higher or 50°C or lower, and particularly preferably at Molding is completed in a state where the temperature becomes 10°C or higher or 40°C or lower. Although it is repeated, in this manufacturing method 2, the mold can be press-formed and cooled after the mold is opened, or the mold can be cooled in advance and cooled while press-forming. If the mold is cooled in advance in this way, and the cooling is performed simultaneously with press molding, the molding and cooling can be completed at the same time. Thereby, the shape-shaped adhesive sheet laminate can be conveyed to the next step immediately after completion of shaping and cooling, and thus the shape-shaped adhesive sheet laminate can be continuously manufactured. In the case of cooling while molding the mold, the surface temperature of the mold is preferably less than 60°C. If the surface temperature of the mold is less than 60°C, the shape of the adhesive sheet laminate can be fixed in a short time, and the obtained molded body has good precision, and can suppress warpage accompanying heat shrinkage during the cooling process after molding, Better from this point of view. Therefore, the surface temperature of the mold is preferably less than 60°C, more preferably 0°C or higher or 50°C or lower, and even more preferably 10°C or higher or 40°C or lower. Also, the difference in surface temperature of the coating portion I at the start of forming and the end of forming is preferably 10 to 100°C, and more preferably 20°C or higher or 90°C or lower. Since the surface temperature difference of the above-mentioned covering part I is 10 to 100°C, for example, when the above-mentioned concave-convex shape is transferred to the adhesive sheet laminate to form the shape, the shaped adhesive sheet can be formed immediately after finishing the forming and cooling. Since the laminate is transferred to the next step, a shape-shaped adhesive sheet laminate can be continuously produced. Furthermore, the conditions of press molding such as press pressure and press time are not particularly limited, and may be appropriately adjusted according to the size or shape to be formed, the material to be used, and the like. (Others) The shape-shaped adhesive sheet laminate obtained in the above forming and cooling steps can be wound up as it is, can also be heat-treated, and can also be cut into a specific size and shape. When cutting, the method of cutting using a Thomson blade, a rotary cutter, etc. is mentioned, for example. In this production method 2, it is preferable to continuously produce a shaped adhesive sheet laminate. For example, the adhesive sheet laminate may be conveyed to a heating unit such as a heater, and the conveyance may be stopped for a specified time in the heating unit for heating, or the heated adhesive sheet laminate may be conveyed to a molding machine after heating while conveying. In the forming unit, such as a forming mold, in the forming unit, for example, pressurized by a cooled mold, cooling is performed while forming, and then transferred to the next unit if necessary, and the shape-shaped adhesive sheet is continuously produced. laminated body. <Application> Here, an example of the utilization application of the shaped adhesive sheet laminate 1 will be described. In recent years, with the popularization of mobile phones, smart phones, tablet terminals, etc., there are many cases where the image display part is damaged due to user mistakes such as dropping them. In particular, when the image display device is a touch panel type, not only is it difficult to observe the display due to damage, but also the touch panel operation itself cannot be performed due to physical obstacles or water infiltration, or it becomes the cause of failure. . Therefore, there are cases where only the image display unit is replaced, that is, maintenance is performed. In the maintenance of the image display device, the adhesive sheet is also used when installing a new image display unit. Usually, maintenance is often performed manually by a repair operator, and the repair operator must be skilled. That is, if an unskilled person installs the image display part through the adhesive sheet, air may enter the inside or the adhesive may be squeezed out. On the other hand, if the shape-shaped adhesive sheet laminate 1 is used, since it is possible to preliminarily provide highly accurate step shapes, etc., for example, by preliminarily giving the adhesive material layer a pattern corresponding to the model of the image display device. The shape of the step difference can greatly simplify the maintenance work, and it can be implemented without the skill of the repair operator. As described above, the adhesive sheet laminate of the present invention can be usefully used for maintenance of image display devices. <Explanation of words> In this specification, when expressing "X~Y" (X, Y are arbitrary numbers), unless otherwise specified, it means "above X and below Y", and also Contains the meaning of "preferably greater than X" or "preferably less than Y". Also, when expressed as "more than X" (X is any number) or "below Y" (Y is any number), it also includes "preferably greater than X" or "preferably less than Y" meaning. In the present invention, the boundary between the sheet and the film is not definite, and it is not necessary to distinguish the two in the context of the present invention. Therefore, in the present invention, the term "film" also includes "sheet". The term "sheet" also includes "film". EXAMPLES Hereinafter, the present invention will be described more specifically by way of examples. However, this invention is not limited to an Example. [Group 1 of Examples and Comparative Examples] <Cover 1-I> Among Examples 1-1 to 1-3 and Comparative Example 1-1 (hereinafter collectively referred to as "Group 1 of Examples and Comparative Examples") As the covering part 1-I of the adhesive sheet laminate, the following covering parts 1-A to 1-D were used. Table 1 shows the values of the respective storage elastic moduli.・Coating part 1-A: A film formed by including a release layer (thickness: 2 μm) of a polysiloxane compound on a single layer of a biaxially stretched isophthalic acid copolymerized PET film (thickness: 75 μm).・Coating part 1-B: A release layer (thickness: 38 μm) of modified polyolefin is included in a single layer of an unstretched polyolefin film (thickness: 50 μm) including 4-methylpentene-1 into the film.・Covering portion 1-C: A film consisting of a polyolefin film (thickness: 70 μm) containing unstretched polypropylene.・Coating part 1-D: A film formed by including a release layer (thickness: 2 μm) of a polysiloxane compound on a single layer of a biaxially stretched homopolyester film (thickness: 75 μm). <Example 1-1> (Production of double-sided adhesive sheet) Polymethyl methacrylate macromonomer (Tg: 105 ℃) 15 parts by mass (18 mol%), 81 parts by mass (75 mol%) of butyl acrylate (Tg: -55 °C) and 4 parts by mass (7 mol%) of acrylic acid (Tg: 106 °C) random copolymerization 1 kg of Chengzhi acrylic copolymer (1-a-1) (weight average molecular weight: 230,000), glycerol dimethacrylate (manufactured by NOF Corporation, product name: GMR) as a crosslinking agent (1-b) (1-b-1) 90 g, and the mixture of 2,4,6-trimethylbenzophenone and 4-methylbenzophenone as photopolymerization initiator (1-c) (Lanberti company Manufactured, product name: Esacure TZT) (1-c-1) 15 g is evenly mixed to make the resin composition 1-1 used for the adhesive layer. The glass transition temperature of the obtained resin composition was -5 degreeC. The obtained resin composition 1-1 was sandwiched between a release-treated PET film (manufactured by Mitsubishi Plastics Corporation, product name: Diafoil MRV-V06, thickness: 100 μm) and two sheets of the covering part 1-A, and used The laminating machine formed the resin composition 1-1 into a sheet shape so that the thickness of the resin composition 1-1 became 100 μm, and produced the adhesive sheet laminate 1-1. In addition, the release layer side of the covering part 1-A is arrange|positioned so that it may be in contact with the resin composition 1-1. The obtained adhesive sheet laminate 1-1 was thermoformed by the following process using a vacuum pressure forming machine (manufactured by Daiichi Industrial Co., Ltd., FKS-0632-20 shape) to produce a shaped adhesive sheet laminate Body 1-1. That is, by preheating the IR heater at 400°C, heating until the surface of the adhesive sheet laminate 1-1 reaches 100°C, and then using the molding die cooled to 25°C, under the condition of clamping pressure 8 MPa Press molding for 5 seconds to produce a shaped adhesive sheet laminate 1-1 formed by shaping the unevenness on the surface. <Example 1-2> Except for using the covering part 1-B instead of the above covering part 1-A, in the same manner as in Example 1-1, an adhesive sheet laminate 1-2 and a shaped adhesive sheet were produced. Material laminate 1-2. <Example 1-3> Except for using the covering part 1-C instead of the above covering part 1-A, in the same manner as in Example 1-1, an adhesive sheet laminate 1-3 and a shaped adhesive sheet were produced Material laminates 1-3. <Comparative Example 1-1> Except for using the covered part 1-D instead of the above covered part 1-A, in the same manner as in Example 1-1, an adhesive sheet laminate 1-4 and a shaped adhesive sheet were produced Material laminates 1-4. <Measurement and Evaluation Methods> The measurement methods and evaluation methods of the various physical property values of the samples obtained in Examples 1-1 to 1-3 and Comparative Example 1-1 will be described. (Modulus of Elasticity of Coating Section) Coating sections 1-A to 1-D used in Group 1 of Examples and Comparative Examples were cut into lengths of 50 mm and widths of 4 mm, respectively, and a dynamic viscoelastic device (IT Meter and Control Co., Ltd.'s DVA-200), the distance between the chucks is 25 mm and the deformation is 1%. The measurement is carried out under the conditions that the measurement temperature range is -50°C to 150°C, the frequency is 1 Hz, and the heating rate is 3°C/min. The value of the storage modulus of elasticity at 100°C of the obtained data was defined as E'(MA), and the value of the storage modulus of elasticity at 30°C was defined as E'(MB). (Elastic modulus of adhesive material layer) The adhesive material layers obtained in Example and Comparative Example Group 1 were laminated to a thickness of 1 mm, and measured using a rheometer (MARSII manufactured by Thermo Fisher Scientific). The measurement is carried out under the conditions that the measurement temperature range is -50°C to 150°C, the frequency is 1 Hz, and the heating rate is 3°C/min. Set the value of the storage modulus of elasticity at 100°C as G'(SA), and the value of the loss modulus of elasticity as G''(SA), and the storage modulus of elasticity at 30°C The value of the number is set to G'(SB), the value of the loss elastic modulus is set to G''(SB), and the value of G''/G' under each temperature condition is set to the loss tangent of each adhesive layer tan delta (SA, SB). (Gel Fraction) The gel fraction of the adhesive material layer is about 0.05 g of the adhesive material layer obtained in Example and Comparative Example Group 1, respectively, and the mass (X) of the SUS screen (# 200) Wrap it in a bag shape, bend and close the bag mouth, measure the quality (Y) of the package, soak it in 100 ml of ethyl acetate, store it in a dark place at 23°C for 24 hours, then take out the package The adhered ethyl acetate was evaporated by heating at 70° C. for 4.5 hours, the mass (Z) of the dried package was measured, and the obtained mass was substituted into the following formula to obtain it. Gel fraction [%]=[(Z-X)/(Y-X)]×100 (Formability) In order to confirm the formability, the molding of Example and Comparative Example Group 1 was carried out using the mold described below test. That is, as shown in Figure 5, the upper and lower molds of the forming mold are convex molds with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm, and the upper and lower molds are aluminum alloys with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm. flat. For the forming surface of the above-mentioned convex mold, as shown in Figure 5, a convex part with a length of 187 mm, a width of 125 mm, and a height of 1 mm is provided in the center, and further, a depth of 25 μm and 50 μm is provided in the forming surface of the convex part. , 75 μm, and 100 μm in four rectangular shapes (89 mm in length and 58 mm in width) in plan view. The covering parts 1-A to 1-D of the shaped adhesive sheet laminates with concave and convex shapes obtained by the method described in Example and Comparative Example Group 1 were peeled off, and scanned white interference microscopes were used to observe Non-contact method measures the height of the concave portion corresponding to the printing level difference and the convex portion corresponding to the display surface. Measure the height h of the convex part (the boundary part with the concave part) of the molded product relative to the depth of the mold of 100 μm, and evaluate the transfer rate derived from the following calculation formula as ○ if it is 50% or more, and evaluate it if it is less than 50% for ×. Transfer rate (%) = h (formed body height) / 100 (mold depth) × 100 (peeling force) The adhesive sheet laminate produced in Example and Comparative Example Group 1 was cut into 150 mm in length and 150 mm in width 50 mm, conduct a 180° peel test at a test speed of 300 mm/min on the interface between the covering parts 1-A~1-D and the adhesive material layer. Let the peeling force at 30°C be F(C), and the peeling force after heating at 100°C for 5 minutes and cooling down to 30°C naturally as F(D), and use the obtained values as coatings Peel force of parts 1-A to 1-D. Table 1 shows the evaluation results of the adhesive sheet laminates 1-1 to 1-4 and the shaped adhesive sheet laminates 1-1 to 1-4 obtained in Examples and Comparative Examples. [Table 1] Example 1-1 Example 1-2 Example 1-3 Comparative example 1-1
Covering part 1-I Covering part 1-A Covering part 1-B Covering part 1-C Covering part 1-D
thickness (μm) 75 50 70 75
Storage elastic modulus E'(MA) (Pa) 2.1×10 8 1.9×10 8 1.7×10 8 2.3×10 9
Storage elastic modulus E'(MB) (Pa) 2.8×10 9 1.6×10 9 1.0×10 9 4.0×10 9
E'(MB)/E'(MA) 13.3 8.4 5.9 1.7
Adhesive layer Storage elastic modulus G'(SA) (Pa) 2.9×10 2 2.9×10 2 2.9×10 2 2.9×10 2
Loss modulus of elasticity G"(SA) (Pa) 1.4×10 3 1.4×10 3 1.4×10 3 1.4×10 3
tanδ(SA) 4.7 4.7 4.7 4.7
Storage elastic modulus G'(SB) (Pa) 6.1×10 4 6.1×10 4 6.1×10 4 6.1×10 4
Loss elastic modulus G''(SB) (Pa) 3.8×10 4 3.8×10 4 3.8×10 4 3.8×10 4
tanδ(SB) 0.6 0.6 0.6 0.6
gel fraction (%) 0 0 0 0
E'(MA)/G'(SA) 7.2×10 5 6.5×10 5 5.9×10 5 7.9×10 7
Peel force F(C) (N/cm) 0.04 0.06 0.05 0.03
Peel force F(D) (N/cm) 0.04 0.05 0.05 0.03
Difference in peel force |F(C)-F(D)| (N/cm) 0 0.01 0 0
Formability 〇 〇 〇 x
(transfer rate) (%) 80 85 75 20
According to the results of Table 1 and Figure 4 and the test results so far, it is confirmed that as shown in Example 1-1 to Example 1-3, the storage elastic modulus E'(MB) at 30°C is 5.0×107
~1.0×1010
Pa and the storage elastic modulus E'(MA) at 100°C is 1.0×106
~2.0×109
The coating part of Pa is laminated on the adhesive material layer and molded, and the concave-convex shape can be formed on the adhesive material layer with high precision.
On the other hand, as shown in Comparative Example 1-1, in the case of using the biaxially stretched homopoly PET film widely used as the release film, the storage elastic modulus of the coating part exceeds 2.0× even in the high temperature range. 109
Pa, so even if thermoforming is performed, sufficient unevenness cannot be formed on the adhesive material layer.
It can be known from this that the storage elastic modulus E'(MB) at 30°C is 5.0×107
~1.0×1010
Pa and the storage elastic modulus E'(MA) at 100°C is 1.0×106
~2.0×109
The coating part of Pa is laminated|stacked on the adhesive material layer and molded, and the shaping|molding adhesive sheet with uneven|corrugated shape can be obtained favorably.
It is also known that by using it, it is better to satisfy the condition that the loss tangent tanδ(A) of the adhesive layer at 100°C is 1.0 or more and satisfy the condition that the loss tangent tanδ(B) of the adhesive layer at 30°C is less than 1.0 Adhesive sheet laminates under the same conditions can achieve higher precision shaping.
Therefore, it was confirmed that by using the above-mentioned adhesive sheet laminate, unevenness corresponding to the printing level difference of an image display device serving as an adherend can be precisely formed, and no gap between the adherend and the adherend can be produced. Furthermore, it is a shape-shaped adhesive sheet laminate for an image display device in which the adhesive material does not overflow and can be adhered to the adherend with a narrow edge design such as the printed part.
In addition, in terms of peeling force, the heating and cooling conditions when measuring the peeling force F(D), that is, the conditions of heating at 100°C for 5 minutes and then allowing it to cool naturally to 30°C are those used when manufacturing a shape-shaped adhesive sheet laminate. Typical heating and cooling conditions. Since the absolute value of the difference between the peeling force F(C) and the peeling force F(D) in the above examples is 0.1 N/cm or less, it is confirmed that the covering parts 1-A to 1- The peeling force of D is the same as that of the covering parts 1-A to 1-D in the adhesive sheet laminate.
[Group 2 of Examples and Comparative Examples]
<Cover part 2-I>
As the coating part I of the adhesive sheet laminate in Examples 2-1 to 2-4 and Comparative Example 2-1 (hereinafter collectively referred to as "Example, Comparative Example Group 2"), it is used in biaxial stretching A single layer of phthalic acid copolymerized PET film (thickness: 75 μm) contains a release layer of polysiloxane compound (thickness: 2 μm). Table 2 shows the values of the respective storage elastic moduli.
<Example 2-1>
(Production of double-sided adhesive sheet)
As the (meth)acrylic copolymer (2-a), 15 parts by mass (18 mol%) of polymethyl methacrylate macromonomer (Tg: 105°C) with a number average molecular weight of 2400, butyl acrylate (Tg Acrylic copolymer (2-a-1) (weight average Molecular weight: 230,000) 1 kg, glycerol dimethacrylate (manufactured by NOF Corporation, product name: GMR) (2-b-1) 90 g as a crosslinking agent (2-b), and 90 g as a photopolymerization initiator A mixture of 2,4,6-trimethylbenzophenone and 4-methylbenzophenone (manufactured by Lanberti, product name: Esacure TZT) (2-c-1) 15 g Mix evenly to make the resin composition 2-1 used for the adhesive material layer. The glass transition temperature of the obtained resin composition was -5 degreeC.
The obtained resin composition 2-1 was sandwiched between a release-treated PET film (manufactured by Mitsubishi Plastics Corporation, product name: Diafoil MRV-V06, thickness: 100 μm) and two sheets of the covering part 2-1, and used The bonding machine formed the resin composition 2-1 into a sheet shape so that the thickness of the resin composition 2-1 became 100 μm, and produced the adhesive sheet laminate 2-1. In addition, the release layer side of the covering part 2-I is arrange|positioned so that it may contact with the resin composition 2-1.
The obtained adhesive sheet laminate 2-1 was thermoformed by the following process using a vacuum pressure forming machine (manufactured by Daiichi Industrial Co., Ltd., FKS-0632-20 shape) and a forming mold to produce a shape Adhesive sheet laminate 2-1.
Regarding the molds used for forming, as shown in Figure 5, the upper and lower molds are convex molds with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm, and the upper and lower molds are aluminum plates with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm. . For the forming surface of the above-mentioned convex mold, as shown in Figure 5, a convex part with a length of 187 mm, a width of 125 mm, and a height of 1 mm is provided in the center, and further, a depth of 25 μm and 50 μm is provided in the forming surface of the convex part. , 75 μm, and 100 μm in four rectangular shapes (89 mm in length and 58 mm in width) in plan view.
With the IR heater preheated at 400°C, the surface of the covering portion 2-I of the adhesive sheet laminate 2-1 was heated until it reached 100°C and formed. That is, the storage elastic modulus E'(MS) of the covering portion 2-I is 2.1×108
Pa and the storage elastic modulus G'(SS) of the adhesive layer is 2.9×102
In the state of Pa, using a molding die cooled to a mold surface temperature of 30°C, pressurized for 5 seconds under the condition of a clamping pressure of 8 MPa, the storage elastic modulus E'(MF ) is 2.8×109
Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×104
The mold was opened in the state of Pa, and the shaped adhesive sheet laminate 2-1 was produced by shaping the unevenness on the surface.
Furthermore, the ratio E'( MF)/E'(MS) was 13.3.
Also, the ratio E'(MF)/ G'(SF) is 4.6×104
.
Also, the loss tangent tan δ (SS) of the adhesive layer at the start of forming was 4.8, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6.
<Example 2-2>
For the adhesive sheet laminate 2-1 used in Example 2-1, an IR heater preheated at 400°C was used to heat the surface of the covering part 2-I of the adhesive sheet laminate 2-2 to 110°C. and take shape. That is, the storage elastic modulus E'(MS) of the covering portion 2-I is 1.3×108
Pa and the storage elastic modulus G'(SS) of the adhesive layer is 9.6×101
In the state of Pa, using a molding die cooled to a mold surface temperature of 30°C, pressurized for 5 seconds under the condition of a clamping pressure of 8 MPa, the storage elastic modulus E'(MF ) is 2.8×109
Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×104
The mold was opened in the state of Pa, and the shape-forming adhesive sheet laminate 2-2 formed by shaping the unevenness on the surface was produced.
<Example 2-3>
For the adhesive sheet laminate 2-1 used in Example 2-1, an IR heater preheated at 400°C was used to heat until the surface of the covering part 2-I of the adhesive sheet laminate 2-3 reached 90°C. and take shape. That is, the storage elastic modulus E'(MS) of the covering portion 2-I is 3.5×108
Pa and the storage elastic modulus G'(SS) of the adhesive layer is 8.9×102
In the state of Pa, using a molding die cooled to a mold surface temperature of 30°C, pressurized for 5 seconds under the condition of a clamping pressure of 8 MPa, the storage elastic modulus E'(MF ) is 2.8×109
Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×104
The mold is opened under the state of Pa, and the shape-forming adhesive sheet laminate 2-3 formed by shaping the unevenness on the surface is produced.
Furthermore, the ratio E'( MF)/E'(MS) was 8.0.
Also, the ratio E'(MF)/ G'(SF) is 4.6×104
.
Also, the loss tangent tan δ (SS) of the adhesive layer at the start of forming was 2.7, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6.
<Example 2-4>
For the adhesive sheet laminate 2-1 used in Example 2-1, an IR heater preheated at 400°C was used to heat until the surface of the covering part 2-I of the adhesive sheet laminate 2-4 reached 70°C. and take shape. That is, the storage elastic modulus E'(MS) of the coating portion 2-I is 1.9×109
Pa and the storage elastic modulus G'(SS) of the adhesive layer is 6.4×103
In the state of Pa, using a forming mold whose surface temperature was cooled to 25°C, and pressurized for 5 seconds under the condition of a clamping pressure of 8 MPa, the storage elastic modulus E'(MF ) is 2.8×109
Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×104
The mold is opened under the state of Pa, and the shape-forming adhesive sheet laminate 2-4 formed by shaping the unevenness on the surface is produced.
Furthermore, the ratio E'( MF)/E'(MS) was 1.4.
Also, the ratio E'(MF)/ G'(SF) is 4.6×104
.
Also, the loss tangent tan δ (SS) of the adhesive layer at the start of forming was 1.4, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6.
<Comparative example 2-1>
For the adhesive sheet laminate 2-1 used in Example 2-1, an IR heater preheated at 400°C was used to heat until the surface of the covering part 2-I of the adhesive sheet laminate 2-5 reached 60°C. and take shape. That is, the storage elastic modulus E'(MS) of the covering portion 2-I is 2.4×109
Pa and the storage elastic modulus G'(SS) of the adhesive layer is 1.3×104
In the state of Pa, using a forming mold whose surface temperature was cooled to 25°C, and pressurized for 5 seconds under the condition of a clamping pressure of 8 MPa, the storage elastic modulus E'(MF ) is 2.8×109
Pa and the storage elastic modulus G'(SF) of the adhesive layer is 6.1×104
Open the mold under the state of Pa, and make the shape-forming adhesive sheet laminate 2-5 formed by shaping the unevenness on the surface.
Furthermore, the ratio E'( MF)/E'(MS) was 1.2.
Also, the ratio E'(MF)/ G'(SF) is 4.6×104
.
Also, the loss tangent tan δ (SS) of the adhesive layer at the start of forming was 1.1, and the loss tangent tan δ (SF) of the adhesive layer at the end of forming was 0.6.
Furthermore, the ratio E'( MF)/E'(MS) was 8.0.
Also, the ratio E'(MF)/ G'(SF) is 9.7×103
.
In addition, the loss tangent tan δ (SS) of the adhesive material layer at the start of forming was 0.6, and the loss tangent tan δ (SF) of the adhesive material layer at the end of forming was 0.6.
<Measurement and evaluation method>
The measurement methods and evaluation methods of various physical property values of the samples obtained in Examples 2-1 to 2-4 and Comparative Example 2-1 will be described.
(Modulus of elasticity of the covering part)
The storage elastic modulus E'(MS) and E'(MF) of the coating part 2-I were cut into lengths of 50 mm and widths of 4 mm, using a dynamic viscoelastic device (DVA-200 from IT Meter and Control Co., Ltd.) , measured with a clamp distance of 25 mm and a 1% strain applied. The measurement is carried out under the conditions that the measurement temperature range is -50°C to 150°C, the frequency is 1 Hz, and the heating rate is 3°C/min.
Let the value of the storage elastic modulus at each molding start temperature in Examples and Comparative Examples be E'(MS), and let the storage elastic modulus value at each molding end temperature be E'(MF).
Furthermore, in Example 2-1, since the temperature at the beginning of forming is 100°C, the storage modulus E'(MS) of Example 2-1 is the storage modulus E'(MA) at 100°C ).
In addition, since the temperature at the end of molding in Example and Comparative Example Group 2 is 30°C, this E'(MF) is the same as the storage elastic modulus at 30°C for any Example and Comparative Example Group 2 E'(MB) is the same.
(Modulus of elasticity of the adhesive layer)
The adhesive material layers obtained in Group 2 of Examples and Comparative Examples were stacked to a thickness of 1 mm, and measured using a rheometer (MARSII manufactured by Thermo Fisher Scientific). The measurement is carried out under the conditions that the measurement temperature range is -50°C to 150°C, the frequency is 1 Hz, and the heating rate is 3°C/min.
In the obtained data, the value of the storage elastic modulus at 100°C is set as G'(SA), the value of the loss elastic modulus is set as G''(SA), and the storage elastic modulus at 30°C is The value of the number is set to G'(SB), the value of the loss elastic modulus is set to G''(SB), and the value of G''/G' under each temperature condition is set to the loss tangent of each adhesive layer tan delta (SA, SB).
On the other hand, regarding the storage elastic modulus G'(SA) and G'(SB) of the adhesive material layer, the adhesive material layers obtained in Example and Comparative Example Group 2 were stacked to a thickness of 1 mm, using A rheometer (MARSII manufactured by Thermo Fisher Scientific) was used for measurement. The measurement is carried out under the conditions that the measurement temperature range is -50°C to 150°C, the frequency is 1 Hz, and the heating rate is 3°C/min.
In the obtained data, the value of the storage elastic modulus at each temperature at the beginning of molding of the example and the comparative example group 2 is set to G'(SS), and the value of the loss elastic modulus is set to G'' (SS), the value of the storage elastic modulus at the temperature at the end of each forming is set as G'(SF), the value of the loss elastic modulus is set as G''(SF), and then the value of the elastic modulus under each temperature condition The value of G''/G' is set as the loss tangent tanδ(SS, SF) of each adhesive material layer.
(gel fraction)
Regarding the gel fraction of the adhesive material layer, about 0.05 g of the adhesive material layer obtained in Example and Comparative Example Group 2 were collected respectively, and wrapped into a bag with a SUS wire mesh (#200) whose mass (X) was previously measured. After measuring the mass (Y) of the package, immerse it in 100 ml of ethyl acetate, store it in the dark at 23°C for 24 hours, take out the package and heat it at 70°C After 4.5 hours, the adhered ethyl acetate was evaporated, the mass (Z) of the dried package was measured, and the obtained mass was substituted into the following formula to obtain it.
Gel fraction [%]=[(Z-X)/(Y-X)]×100
(formability)
The covering part I of the shaped adhesive sheet laminate with concavo-convex shapes obtained in Example and Comparative Example Group 2 was peeled off, and the concave part corresponding to the printing step was measured in a non-contact manner using a scanning white interference microscope. and the height of the convex part corresponding to the display surface.
Measure the height h of the convex part (the boundary part with the concave part) of the molded product relative to the depth of the mold of 100 μm, and evaluate the transfer rate derived from the following calculation formula as ○ if it is 50% or more, and evaluate it if it is less than 50% for ×.
Transfer rate (%) = h (formed body height) / 100 (mold depth) × 100
(Peel force)
The adhesive sheet laminate produced in Example and Comparative Example Group 2 was cut into lengths of 150 mm and width of 50 mm, and the interface between the covering part 2-I and the adhesive layer was tested at a test speed of 300 mm/min at 180°. Peel test.
Let the peeling force at 30°C be F(C), and the peeling force after heating at 100°C for 5 minutes and cooling down to 30°C naturally as F(D), and use the obtained values as coatings Peel Force of Section 2-I.
Table 2 shows the evaluation results of the shaped adhesive sheet laminates 2-1 to 2-5 obtained in Examples 2-1 to 2-4 and Comparative Example 2-1.
[Table 2] Example 2-1 Example 2-2 Example 2-3 Example 2-4 Comparative example 2-1
Covering part 2-I Storage elastic modulus E'(MS) (Pa) 2.1×10 8 1.3×10 8 3.5×10 8 1.9×10 9 2.4×10 9
Storage elastic modulus E'(MF) (Pa) 2.8×10 9 2.8×10 9 2.8×10 9 2.8×10 9 2.8×10 9
Adhesive layer Storage elastic modulus G'(SS) (Pa) 2.9×10 2 9.6×10 1 8.9×10 2 6.4×10 3 1.3×10 4
Loss elastic modulus G"(SS) (Pa) 1.4×10 3 7.9×10 2 2.4×10 3 8.7×10 3 1.4×10 4
tanδ(SS) (-) 4.8 8.2 2.7 1.4 1.1
Storage elastic modulus G'(SF) (Pa) 6.1×10 4 6.1×10 4 6.1×10 4 6.1×10 4 6.1×10 4
Loss elastic modulus G''(SF) (Pa) 3.8×10 4 3.8×10 4 3.8×10 4 3.8×10 4 3.8×10 4
tanδ(SF) (-) 0.6 0.6 0.6 0.6 0.6
E'(MF)/E'(MS) (-) 13.3 21.5 8 1.5 1.2
E'(MF)/G'(SF) (-) 4.6×10 4 4.6×10 4 4.6×10 4 4.6×10 4 4.6×10 4
gel fraction (%) 0 0 0 0 0
Peel force F(C) (N/cm) 0.04 0.04 0.04 0.04 0.04
Peel force F(D) (N/cm) 0.04 0.04 0.04 0.04 0.04
|Peel force F(C)-Peel force F(D)| (N/cm) 0 0 0 0 0
Forming start temperature (℃) 100 110 90 70 60
Forming end temperature (℃) 30 30 30 30 30
Formability (-) 〇 〇 〇 〇 x
transfer rate (%) 80 75 80 70 40
According to the results of Table 2 and FIG. 4 and the test results so far, it was confirmed that, as shown in Examples 2-1 to 2-4, by using the storage elastic modulus E of the covering part 2-I at the beginning of molding '(MS) is 1.0×106
~2.0×109
Pa, and the storage elastic modulus E'(MF) of the coating portion 2-I at the end of molding is 5.0×107
~1.0×1010
By adjusting and forming in the Pa method, it is possible to form the concave-convex shape of the adhesive layer with high precision.
On the other hand, as shown in Comparative Example 2-1, the storage elastic modulus E'(MS) of the coating portion 2-I at the start of molding was greater than 2.0×109
In the case of Pa, sufficient unevenness cannot be formed on the adhesive layer even by thermoforming.
From this, it can be seen that by taking the storage elastic modulus E'(MS) of the covering part 2-I at the beginning of forming as 1.0×106
~2.0×109
Pa and the storage elastic modulus E'(MF) of the covering part 2-I at the time of completion of molding becomes 5.0×107
~1.0×1010
By adjusting the method of Pa and performing molding, a shaped adhesive sheet with unevenness can be obtained favorably.
It is also known that by satisfying the condition that the loss tangent tan δ (SS) of the adhesive layer at the beginning of forming is 1.0 or more and satisfying the condition that the loss tangent tan δ (SF) of the adhesive layer at the end of forming is less than 1.0 Conditions can be adjusted and shaped to achieve higher precision shaping.
Therefore, it was confirmed that by using the above-mentioned adhesive sheet laminate, unevenness corresponding to the printing level difference of an image display device serving as an adherend can be precisely formed, and no gap between the adherend and the adherend can be produced. Furthermore, it is a shape-shaped adhesive sheet laminate for an image display device in which the adhesive material does not overflow and can be adhered to the adherend with a narrow edge design such as the printed part.
In addition, in terms of peeling force, the heating and cooling conditions when measuring the peeling force F(D), that is, the conditions of heating at 100°C for 5 minutes and then allowing it to cool naturally to 30°C are those used when manufacturing a shape-shaped adhesive sheet laminate. Typical heating and cooling conditions. Since the absolute values of the difference between the peeling force F(C) and the peeling force F(D) in the above-mentioned examples were all 0.1 N/cm or less, it was confirmed that the peeling force hardly changed before and after heating.
Furthermore, it was found that by heating the adhesive sheet laminate, the storage elastic modulus E'(MS) in the covering part 2-I was 1.0×106
~2.0×109
Forming starts under the state of Pa, and the storage elastic modulus E'(MF) of the coating part 2-I is 5.0×107
~1.0×1010
Forming is completed in the state of Pa, and the concave-convex shape conforming to the concave-convex part of the surface of the adherend can be formed on the surface of the adhesive layer with high precision.
[Group 3 of Examples and Comparative Examples]
<Cover part 3-I>
As the covering part 3-I of the adhesive sheet laminate in Examples 3-1 to 3-3 and Comparative Examples 3-1 to 3-2 (hereinafter collectively referred to as "Example and Comparative Example Group 3"), A film made of a release layer (thickness: 2 μm) of a polysiloxane compound in a single layer of a biaxially stretched isophthalic acid copolymerized PET film (thickness: 75 μm). Table 3 shows the values of the respective storage elastic moduli.
<Example 3-1>
(Production of double-sided adhesive sheet)
As (meth)acrylic copolymer (3-a), 15 parts by mass (18 mol%) of polymethyl methacrylate macromonomer (Tg: 105°C) with a number average molecular weight of 2400, butyl acrylate (Tg Acrylic copolymer (3-a-1) (weight average Molecular weight: 230,000) 1 kg, glycerol dimethacrylate (manufactured by NOF Corporation, product name: GMR) (3-b-1) 90 g as a crosslinking agent (3-b), and 90 g as a photopolymerization initiator A mixture of 2,4,6-trimethylbenzophenone and 4-methylbenzophenone (manufactured by Lanberti, product name: Esacure TZT) (3-c-1) 15 g Mix evenly to make the resin composition 3-1 used for the adhesive material layer. The glass transition temperature of the obtained resin composition was -5 degreeC.
The obtained resin composition 3-1 was sandwiched between a release-treated PET film (manufactured by Mitsubishi Plastics Corporation, product name: Diafoil MRV-V06, thickness: 100 μm) and two sheets of the covering part 3-1, and used The bonding machine formed the resin composition 3-1 into a sheet shape so that the thickness of the resin composition 3-1 became 100 μm, and produced the adhesive sheet laminate 3-1. In addition, the release layer side of the covering part 3-I is arrange|positioned so that it may be in contact with the resin composition 3-1.
The obtained adhesive sheet laminate 3-1 was thermoformed by the following process using a vacuum pressure forming machine (manufactured by Daiichi Industrial Co., Ltd., FKS-0632-20 shape) and a forming mold to produce a shape Adhesive sheet laminate 3-1.
Regarding the molds used for forming, as shown in Figure 5, the upper and lower molds are convex molds with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm, and the upper and lower molds are aluminum plates with a length of 270 mm, a width of 170 mm, and a thickness of 40 mm. . For the forming surface of the above-mentioned convex mold, as shown in Figure 5, a convex part with a length of 187 mm, a width of 125 mm, and a height of 1 mm is provided in the center, and further, a depth of 25 μm and 50 μm is provided in the forming surface of the convex part. , 75 μm, and 100 μm in four rectangular shapes (89 mm in length and 58 mm in width) in plan view.
With an IR heater preheated to 400°C, heat until the surface of the covering part 3-I of the adhesive sheet laminate 3-1 reaches 100°C, and use a molding die that cools the mold surface temperature to 30°C. Adhesive sheet laminate 3-1 in a heated state is pressurized for 5 seconds under the condition of clamping mold pressure 8 MPa, and then the mold is opened to produce a shape-shaped adhesive sheet laminate 3-1 formed by shaping the concave and convex on the surface .
<Example 3-2>
Using an IR heater preheated to 400°C, the adhesive sheet laminate 3-1 used in Example 3-1 was heated until the surface of the covering part 3-I of the adhesive sheet laminate 3-2 reached 70°C. , using a molding mold with the surface temperature of the mold cooled to 30°C, the heated adhesive sheet laminate 3-1 was press-molded for 5 seconds under the condition of a clamping pressure of 8 MPa, and then the mold was opened to produce a pair Shape-shaped adhesive sheet laminate 3-2 with shape-shaped unevenness on the surface.
<Example 3-3>
Using an IR heater preheated at 400°C, the adhesive sheet laminate 3-1 used in Example 3-1 was heated until the surface of the covering portion 3-I of the adhesive sheet laminate 3-3 reached 100°C. , using a molding mold with the surface temperature of the mold adjusted to 50°C, pressurize the heated adhesive sheet laminate 3-1 for 5 seconds under the condition of a clamping pressure of 8 MPa, and then open the mold to produce a pair A shape-shaped adhesive sheet laminate 3-3 with shape-shaped unevenness on the surface.
<Comparative example 3-1>
Using an IR heater preheated to 400°C, the adhesive sheet laminate 3-1 used in Example 3-1 was heated until the surface of the covering part 3-I of the adhesive sheet laminate 3-5 reached 60°C. , using a molding mold with the surface temperature of the mold cooled to 30°C, the heated adhesive sheet laminate 3-1 was press-molded for 5 seconds under the condition of a clamping pressure of 8 MPa, and then the mold was opened to produce a pair A shape-shaped adhesive sheet laminate 3-4 with shape-shaped unevenness on the surface.
<Comparative example 3-2>
Using an IR heater preheated to 400°C, the adhesive sheet laminate 3-1 used in Example 3-1 was heated until the surface of the covering part 3-I of the adhesive sheet laminate 3-5 reached 100°C. , using a molding mold with the surface temperature of the mold adjusted to 80°C, pressurize the heated adhesive sheet laminate 3-1 under the condition of a clamping pressure of 8 MPa for 5 seconds, and then open the mold to produce a pair A shape-shaped adhesive sheet laminate 3-5 formed with shape-shaped unevenness on the surface.
<Measurement and evaluation method>
Measurement methods and evaluation methods of various physical property values of the samples obtained in Examples 3-1 to 3-3 and Comparative Examples 3-1 to 3-2 will be described.
(Modulus of elasticity of the covering part)
The storage elastic modulus of coating part 3-I was cut into length 50 mm, width 4 mm, using dynamic viscoelasticity device (DVA-200 from IT Meter and Control Co., Ltd.), with the distance between chucks at 25 mm and applying 1 The % deformation is measured. The measurement is carried out under the conditions that the measurement temperature range is -50°C to 150°C, the frequency is 1 Hz, and the heating rate is 3°C/min.
In the obtained data, the value of the storage modulus of elasticity of the covering part 3-I at 30°C is set to E'(MB), and the value of the storage elastic modulus of the covering part 3-I at 100°C is set to is E'(MA).
(Modulus of elasticity of the adhesive layer)
The adhesive material layers obtained in Group 3 of Examples and Comparative Examples were laminated to a thickness of 1 mm, and measured using a rheometer (MARSII manufactured by Thermo Fisher Scientific). The measurement is carried out under the conditions that the measurement temperature range is -50°C to 150°C, the frequency is 1 Hz, and the heating rate is 3°C/min.
In the obtained data, the value of the storage elastic modulus at 100°C is set as G'(SA), the value of the loss elastic modulus is set as G''(SA), and the storage elastic modulus at 30°C is The value of the number is set to G'(SB), the value of the loss elastic modulus is set to G''(SB), and the value of G''/G' under each temperature condition is set to the loss tangent of each adhesive layer tan delta (SA, SB).
(formability)
The covering part I of the shaped adhesive sheet laminate with concavo-convex shapes obtained in Example and Comparative Example Group 3 was peeled off, and the concave part corresponding to the printing step was measured in a non-contact manner using a scanning white interference microscope. and the height corresponding to the convex part of the display surface.
Measure the height h of the convex part (the boundary part with the concave part) of the molded part relative to the mold at a depth of 100 μm, and evaluate the transfer rate derived from the following calculation formula as "○" if it is 50% or more, and if it is less than 50% rated as "×".
Transfer rate (%) = h (formed body height) / 100 (mold depth) × 100
(warping, bending)
The adhesive sheet laminate produced under each molding condition of Example and Comparative Example Group 3 was cut into a square with a length of 100 mm, and the height of each vertex was measured. The obtained heights of 4 points were averaged, and this value was made into warp. Those whose warping height was less than 10 mm were judged as "○", and those whose warping height was more than 10 mm were judged as "×".
(Peel force)
Cut the adhesive sheet laminate produced in Example and Comparative Example Group 3 to a length of 150 mm and a width of 50 mm, and test the interface between the covering part 3-I and the adhesive layer at 180° at a test speed of 300 mm/min. Peel test.
Let the peeling force at 30°C be F(C), and the peeling force after heating at 100°C for 5 minutes and cooling down to 30°C naturally as F(D), and use the obtained values as coatings Peel Force of Section 3-I.
Table 3 shows the evaluation results of the shaped adhesive sheet laminates 3-1 to 3-5 obtained in Examples 3-1 to 3-3 and Comparative Examples 3-1 to 3-2.
[table 3] Example 3-1 Example 3-2 Example 3-3 Comparative example 3-1 Comparative example 3-2
Forming start temperature (℃) 100 70 100 60 100
Forming end temperature (℃) 30 30 50 30 80
Covering part 3-I Storage elastic modulus E'(MS) (Pa) 2.1×10 8 2.0×10 8 2.1×10 8 2.4×10 9 2.1×10 8
Storage elastic modulus E'(MF) (Pa) 2.8×10 9 2.8×10 9 2.6×10 9 2.8×10 9 8.4×10 8
Adhesive layer Storage elastic modulus G'(SS) (Pa) 2.9×10 2 6.4×10 3 2.9×10 2 1.3×10 4 2.9×10 2
Loss elastic modulus G"(SS) (Pa) 1.4×10 3 8.7×10 3 1.4×10 3 1.4×10 4 1.4×10 3
tanδ(SS) (-) 4.8 1.4 4.8 1.1 4.8
Storage elastic modulus G'(SF) (Pa) 6.1×10 4 6.1×10 4 2.5×10 4 6.1×10 4 2.6×10 3
Loss elastic modulus G"(SF) (Pa) 3.8×10 4 3.8×10 4 2.0×10 4 3.8×10 4 4.8×10 3
tanδ(SF) (-) 0.6 0.6 0.8 0.6 1.8
Peel force F(C) (N/cm) 0.04 0.04 0.04 0.04 0.04
Peel force F(D) (N/cm) 0.04 0.04 0.04 0.04 0.04
|Peel force F(C)-Peel force F(D)| (N/cm) 0 0 0 0 0
Formability (%) 〇80 〇75 〇80 × 40 〇80
warping, bending (mm) 〇6.3 〇3.8 〇8.2 〇2.5 × 11.8
Overview (-) 〇 〇 〇 x x
According to the results in Table 3 and the test results so far, it was confirmed that, as shown in Examples 3-1 to 3-3, by starting with the surface temperature of the coating part 3-I at 70 to 180°C Molding is completed when the surface temperature of the covering part 3-I becomes less than 60° C., and the molded product is taken out from the mold to form a concave-convex shape with high precision.
On the other hand, as shown in Comparative Example 3-1, if the temperature of the covering portion 3-I at the start of forming is less than 70° C., sufficient unevenness cannot be formed on the adhesive layer even by thermoforming.
Also, as shown in Comparative Example 3-2, when the surface temperature of the coating portion 3-I is 70° C. or higher when the molding is completed and the molded product is taken out from the mold, warping of the molded product occurs due to heat shrinkage of the sheet. Curved or bent and not good.
From this, it can be seen that in order to form unevenness with higher precision, it is preferable to start forming at a state where the surface temperature of the covering portion 3-I is 70 to 180° C. After reaching 60°C, the molding is completed, and the molded product is taken out from the mold for molding.
Therefore, it was confirmed that by using the above-mentioned adhesive sheet laminate, unevenness corresponding to the printing level difference of an image display device serving as an adherend can be precisely formed, and no gap between the adherend and the adherend can be produced. Furthermore, it is a shape-shaped adhesive sheet laminate for an image display device in which the adhesive material does not overflow and can be adhered to the adherend with a narrow edge design such as the printed part.
In addition, in terms of peeling force, the heating and cooling conditions when measuring the peeling force F(D), that is, the conditions of heating at 100°C for 5 minutes and then allowing it to cool naturally to 30°C are those used when manufacturing a shape-shaped adhesive sheet laminate. Typical heating and cooling conditions. Since the absolute values of the difference between the peeling force F(C) and the peeling force F(D) in the above-mentioned examples were all 0.1 N/cm or less, it was confirmed that the peeling force hardly changed before and after heating.
[Embodiment Group 4]
The production method of the polyester raw material used in the following Examples 4-1 to 4-5 (hereinafter collectively referred to as "Example Group 4") is as follows.
(Manufacturing method of polyester 4-A)
Get 100 parts of dimethyl terephthalate, 70 parts of ethylene glycol, and 0.07 parts of calcium acetate monohydrate and place them in a reactor, heat up and remove methanol by distillation to carry out transesterification. After the reaction starts, you need The temperature was raised to 230° C. in about 4 and a half hours, and the transesterification reaction was substantially completed.
Next, 0.04 parts of phosphoric acid and 0.035 parts of antimony trioxide were added, and superposition|polymerization was performed by the usual method. That is, the reaction temperature was gradually increased until finally 280° C., while the pressure was gradually decreased until finally 0.05 mmHg. After 4 hours, the reaction was terminated, and fragmentation was performed according to a conventional method to obtain polyester 4-A. The intrinsic viscosity IV of the obtained polyester chip was 0.70 dl/g.
(Manufacturing method of polyester 4-B)
In the above-mentioned method for producing polyester 4-A, as dicarboxylic acid units, terephthalic acid was set at 78 mol%, and isophthalic acid was set at 22 mol%. Production was carried out in the same manner to obtain polyester 4-B. The intrinsic viscosity IV of the obtained polyester chip was 0.70 dl/g.
(Manufacturing method of polyester 4-C)
When producing the above-mentioned polyester 4-A, 6000 ppm of amorphous silica having an average particle diameter of 3 μm was added to produce polyester 4-C.
(Manufacturing method of polyester 4-D)
When producing the above-mentioned polyester 4-A, 6000 ppm of amorphous silica having an average particle diameter of 4 μm was added to produce polyester 4-D.
[Example 4-1]
The raw materials obtained by mixing the above-mentioned polyesters 4-B, 4-A, and 4-D at a ratio of 65% by weight, 30% by weight, and 5% by weight were melt-extruded by a melt extruder to obtain a monolayer The amorphous sheet.
Then, the sheet is co-extruded onto a cooled casting drum, cooled and solidified to obtain a non-aligned sheet. Then, after stretching 3.4 times in the machine direction (longitudinal direction) at 80°C, it was further preheated in a tenter, and stretched 3.9 times in the direction perpendicular to the machine direction (transverse direction) at 80°C. After biaxial stretching, a heat treatment was performed at 185° C. for 3 seconds, and then a 6.4% relaxation treatment was performed in the width direction to obtain a polyester film with a thickness of 50 μm. The evaluation results are shown in Table 4 below.
[Example 4-2], [Example 4-3]
Except having changed to the conditions shown in following Table 4, it carried out similarly to Example 4-1, and obtained the polyester film. The evaluation results are shown in Table 4 below.
[Example 4-4]
The above-mentioned polyester 4-A and 4-C are mixed at a ratio of 86% by weight and 14% by weight respectively as the raw material for the surface layer, and polyester 4-B and 4-A are respectively mixed at 45% by weight , 55% by weight of the raw material mixed as the raw material for the middle layer. Two types of amorphous sheets with three layers (surface layer/middle layer/surface layer) were obtained by melt extrusion with different melt extruders respectively.
Next, a non-oriented sheet is obtained by coextruding the sheet onto a cooled casting drum and allowing it to cool and solidify. Then, after stretching 3.4 times in the machine direction (MD) at 82°C, it was further preheated in the tenter, and stretched 3.9 times in the direction perpendicular to the machine direction (width direction, TD) at 110°C. After biaxial stretching, a heat treatment was performed at 210° C. for 3 seconds, and then a 2.4% relaxation treatment was performed in the width direction to obtain a polyester film with a thickness of 50 μm. The evaluation results are shown in Table 4 below.
[Example 4-5]
A polyester film was obtained in the same manner as in Example 4-4 except for changing the conditions shown in Table 4 below. The evaluation results are shown in Table 4 below.
<Measurement and evaluation method>
The measurement method and evaluation method of various physical property values of the sample obtained in Example group 4 are demonstrated.
(1) Storage elastic modulus (E')
About the film obtained in Example group 4, the sample of 30 mm in the longitudinal direction x 5 mm in the width direction was collected so that the longitudinal direction might become a machine direction. Next, using a dynamic viscoelasticity device ("DVA-220" manufactured by IT Meter and Control Co., Ltd.), the sample was clamped and fixed by clamps with a gap of 20 mm, and the temperature was increased from room temperature at a rate of 10°C/min. The temperature was raised to 200°C, and the storage elastic modulus was measured at a frequency of 10 Hz. According to the obtained data, read the storage elastic modulus at 100°C.
(2) heating shrinkage
Starting from the central position in the width direction of the film obtained in Example Group 4, cut the sample into short strips (15 mm wide x 150 mm long) in such a way that the sample length direction becomes the measurement direction, and in a tension-free state at 120°C Heat treatment for 5 minutes in the environment, measure the length of the sample before and after heat treatment, and calculate the heat shrinkage rate (%) of the film by the following formula. Furthermore, a in the following formula is the length of the sample before heat treatment, and b is the length of the sample after heat treatment.
Heat shrinkage rate (%)=[(ab-b)/a]×100
(3) The amount of oligomers on the surface of the film after heat treatment
Regarding the film obtained in Example Group 4, the polyester film was treated for 10 minutes in a 180° C. hot air circulation oven under a nitrogen atmosphere. The surface of the heat-treated polyester film was brought into contact with DMF (dimethylformamide) for 3 minutes to dissolve the oligomer deposited on the surface. This operation can be adopted, for example, the method described in the dissolution equipment used in the single-sided dissolution method in the dissolution test in the voluntary standards for food containers and packaging made of polyolefin and other synthetic resins.
Then, if necessary, adjust the concentration of the obtained DMF by dilution or other methods, supply it to a liquid chromatograph (Shimadzu LC-2010) to obtain the amount of oligomers in DMF, divide this value by the membrane area in contact with DMF, As the amount of oligomers on the membrane surface (mg/cm2
).
The amount of oligomers in DMF is calculated according to the peak area ratio of the peak area of the standard sample and the peak area of the measured sample (absolute calibration curve method).
The production of the standard sample is made by accurately weighing the oligomers (cyclic trimers) that have been fractionated in advance, and dissolving them in the accurately weighed DMF. The concentration of the standard sample is preferably in the range of 0.001-0.01 mg/ml.
(4) Molding suitability
15 parts by mass (18 mol%) of polymethyl methacrylate macromonomer (Tg: 105°C) as a (meth)acrylic copolymer with a number average molecular weight of 2400, butyl acrylate (Tg: -55°C) 1 kg of an acrylic copolymer (weight average molecular weight: 230,000) obtained by random copolymerization of 81 parts by mass (75 mol%) and 4 parts by mass (7 mol%) of acrylic acid (Tg: 106°C) as a crosslinking agent Glycerin dimethacrylate (manufactured by NOF Corporation, product name: GMR) (b-1) 90 g, and 2,4,6-trimethylbenzophenone and 4-methanol as photopolymerization initiators 15 g of a mixture of base benzophenones (manufactured by Lanberti, product name: Esacure TZT) were uniformly mixed to prepare the resin composition used for the adhesive sheet.
The obtained resin composition is clamped up and down by two release films obtained from the polyester film shown in Example Group 4 (the combination of the upper and lower sides is set to clamp each other with the same release film), and a laminating machine is used. The resin composition was molded into a sheet shape so that the thickness of the resin composition became 100 μm, and an adhesive sheet laminate was produced. In addition, the release layer side of the polyester film was arrange|positioned so that it might contact with a resin composition.
The obtained adhesive sheet laminate system was thermoformed by the following process using a vacuum pressure forming machine (manufactured by Daiichi Industrial Co., Ltd., FKS-0632-20 type) to produce a shaped adhesive sheet laminate. That is, by preheating the IR heater at 400°C, heating until the surface of the adhesive sheet laminate reaches 100°C, and then using the molding mold cooled to 25°C, under the condition of clamping pressure 8 MPa for 5 seconds Press forming to produce a shape-shaped adhesive sheet laminate formed by shaping the surface with concave-convex.
Peel off the polyester film of the shape-shaped adhesive sheet laminate with unevenness, and use a scanning white interference microscope to measure the height of the concave and convex parts of the shape-shaped adhesive sheet in a non-contact manner, and calculate the height of the formed body Set to h.
Measure the height h of the convex part of the molded part relative to the mold at a depth of 100 μm, and evaluate the transfer rate derived from the following formula as ○ if it is 70% or more, and evaluate it as △ if it is 50% or more and less than 70% , Those who did not reach 50% were evaluated as ×.
Transfer rate (%) = h (formed body height) / 100 (mold depth) × 100
(5) Adhesive layer appearance (wrinkled)
The appearances of the adhesive laminates obtained by the method described in (4) before press molding were respectively evaluated by the evaluation methods shown below.
<Evaluation method>
○: Can be laminated without wrinkles and maintains good appearance.
×: The film was wrinkled, and the wrinkle was transferred to the adhesive layer, and it was in a state where it could not be used as a product. [Table 4] Example 4-1 Example 4-2 Example 4-3 Example 4-4 Example 4-5
Raw material blending [wt%] surface layer - - - A/C=86/14 A/C=86/14
middle layer B/A/D=65/30/5 B/A/D=45/50/5 B/A/D=25/70/5 B/A=45/55 B/A=45/55
Thickness [μm] surface layer - - - 1.5 3
middle layer 50 50 50 47 44
Membrane conditions MD elongation ratio [fold] 3.4 3.4 3.4 3.4 3.4
MD extension temperature [°C] 80 80 80 82 82
TD extension magnification [fold] 3.9 3.9 3.9 3.9 3.9
TD extension temperature [°C] 90 100 110 110 110
Heat treatment temperature [°C] 200 210 220 210 210
Relaxation rate M 6.4 6.4 6.4 2.4 2.4
100℃ storage elastic modulus E'[Pa] 2.7×10 8 5.5×10 8 8.7×10 8 7.6×10 8 8.2×10 8
Heat shrinkage (120°C, 5 minutes) MD[%] 2.5 1.6 1.1 2.2 2.1
TD[%] 0.6 0.2 0.0 -03 -0.2
Amount of oligomers [mg/cm 2 ] 6.6×10 - 4 2.9×10 -4 1.8 × 10-4 1.9×10 - 5 5.0×10 -5
Proper molding 〇 〇 △ 〇 〇
Adhesive layer appearance (wrinkled) 〇 〇 〇 〇 〇
[Industrial availability]
The shape-shaped adhesive sheet laminate of the present invention can be used when forming an image display device such as a personal computer, a mobile terminal (PDA), a game machine, a television (TV), a car navigation system, a touch panel, a tablet, etc. Use appropriately.
In addition, the adhesive sheet laminate or coating film of the present invention can be suitably used when forming such a shaped adhesive sheet laminate.