TWI797039B - Measurement system - Google Patents
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Abstract
Description
本發明是有關於一種測量系統,且特別是有關於一種測量物體輪廓之測量系統。The present invention relates to a measuring system, and in particular to a measuring system for measuring the contour of an object.
一般非接觸式的輪廓量測是採用雷射光源掃描方法,藉由將雷射光束投射於被測物體的表面以形成剖線,再藉由光學感測器來感知剖線的資訊,並透過分析來求得被測物體的表面之高度資訊,也就是輪廓資訊。為了能確定輪廓的尺寸,需要從光學感測器平面中的點到投射到被測物體的光平面中的點的映射,以便使光學感測器平面中的座標可以被變換到真實世界的座標。獲得這種映射的過程一般被稱為校準。由於未知的映射的標度、未知的光平面相對於光學感測器的投影畸變和未知的光學裝置的畸變,因此這種校準一般借助參考物體的測量而被確定。The general non-contact profile measurement adopts the laser light source scanning method, by projecting the laser beam on the surface of the object to be measured to form a section line, and then the information of the section line is sensed by the optical sensor, and passed through Analyze to obtain the height information of the surface of the measured object, that is, the contour information. In order to be able to determine the size of the profile, a mapping is required from points in the plane of the optical sensor to points in the plane of light projected onto the measured object, so that the coordinates in the plane of the optical sensor can be transformed into real-world coordinates . The process of obtaining such a map is generally called calibration. Due to the unknown scale of the map, the unknown projection distortion of the light plane relative to the optical sensor and the unknown distortion of the optics, this calibration is generally determined by means of measurements of a reference object.
然而,在要求高精度寬視野量測場域中,通常需要多組雷射光源和光學感測器同時對被測物體進行分段量測,由於光學感測器所接收之資訊受到不同雷射光源的硬體條件和設置條件之影響使得基準存在差異,導致光學感測器所得到的每組輪廓資訊的精度都有些不同,而無法直接併接使用,導致被測物體的整體輪廓資訊無法被準確地得知。However, in the field requiring high-precision wide-field measurement, usually multiple sets of laser light sources and optical sensors are required to measure the measured object in segments at the same time, because the information received by the optical sensors is affected by different lasers. The influence of the hardware conditions and setting conditions of the light source makes the benchmarks different, resulting in the accuracy of each set of profile information obtained by the optical sensor is somewhat different, and cannot be directly used in parallel, resulting in the overall profile information of the measured object being unable to be measured. Learn exactly.
本發明之一態樣係提供一種一種測量系統 ,適用於測量一物體的輪廓。測量系統包含多個光源、校準單元、感測器、多個對位輔助單元及計算單元。多個光源分別用以投射至該物體的一部分,其中每相鄰兩光源投射至該物體時具有一重疊區域。校準單元設置對應該物體的位置處。感測器用以接收該等光源投射至該物體時所反射的輪廓資訊。多個對位輔助單元分別設置於該校準單元中對應該重疊區域的位置。計算單元用以接收該感測器所得到的輪廓資訊以計算該物體的輪廓。One aspect of the present invention is to provide a measurement system suitable for measuring the contour of an object. The measurement system includes multiple light sources, a calibration unit, a sensor, multiple alignment auxiliary units and a calculation unit. A plurality of light sources are respectively used to project to a part of the object, wherein every two adjacent light sources have an overlapping area when projected to the object. The calibration unit is set corresponding to the position of the object. The sensor is used for receiving the profile information reflected when the light sources are projected onto the object. A plurality of alignment assisting units are respectively arranged at positions corresponding to the overlapping areas in the calibration unit. The calculation unit is used for receiving the outline information obtained by the sensor to calculate the outline of the object.
在一些實施例中,校準單元包括多個鋸齒形部,其中每一個鋸齒形部具有齒尖,且在兩個相鄰鋸齒形部之間形成齒穀。In some embodiments, the calibration unit includes a plurality of serrations, wherein each serration has a tip and a valley is formed between two adjacent serrations.
在一些實施例中,對位輔助單元包括相連的兩個邊部以及設置於兩邊部中間的一尖部,其中該邊部可以安置在該校準單元的該鋸齒形部的一邊上。In some embodiments, the alignment auxiliary unit includes two connected side parts and a pointed part disposed in the middle of the two side parts, wherein the side part can be placed on one side of the zigzag part of the alignment unit.
在一些實施例中,該尖部的高度不等於該齒尖的高度。In some embodiments, the height of the tip is not equal to the height of the prong.
在一些實施例中,該計算單元將對應該重疊區域的兩輪廓資訊的數據進行相關係數的計算以得到對應該重疊區域的兩光源所得到的輪廓資訊的併接位置處。In some embodiments, the calculation unit calculates the correlation coefficient on the data of the two contour information in the overlapping area to obtain the merge position of the contour information obtained by the two light sources corresponding to the overlapping area.
在一些實施例中,該計算單元透過式(1)計算相關係數; …(1) 其中, X i 為物體的輪廓資訊在X軸的位置, Z i 為物體的輪廓資訊對應 X i 位置的高度, 為 X 1 至 X n 的平均數, 為 Z 1 至 Z n 的平均數。 In some embodiments, the calculation unit calculates the correlation coefficient through formula (1); ...(1) Among them, X i is the position of the object's contour information on the X axis, Z i is the height of the object's contour information corresponding to the position of Xi , is the average of X1 to Xn , is the average of Z 1 to Z n .
在一些實施例中,計算單元將該重疊區域的兩輪廓資訊的數據中具有最高相關係數的數據之位置設定為併接位置。In some embodiments, the calculation unit sets the position of the data with the highest correlation coefficient among the data of the two contour information in the overlapping area as the merged position.
在一些實施例中,該等光源系雷射光。In some embodiments, the light sources are laser light.
綜上所述,透過對位輔助單元,可得知兩相鄰光源投射至測量物體的重疊區域,再透過對此重疊區域的輪廓資訊進行相關係數的計算,可得到經由兩相鄰光源所得到的輪廓資訊的併接位置處,然後再進行接併的處理,從而得到量測物體的整體輪廓資訊。To sum up, through the alignment auxiliary unit, it can be known that two adjacent light sources are projected to the overlapping area of the measurement object, and then by calculating the correlation coefficient of the contour information of the overlapping area, the obtained value obtained by the two adjacent light sources can be obtained. The merged position of the contour information of the measured object is then processed to obtain the overall contour information of the measured object.
為了讓本發明之上述及其他目的、特徵、優點能更明顯易懂,下文將特舉本發明較佳實施例,並配合所附圖式,作詳細說明如下。In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments of the present invention will be exemplified below in detail together with the attached drawings.
請參照第1圖,第1圖係繪示依照本發明之一實施例的一種測量系統的示意圖。測量系統10包括多個光源12和感測器14。光源12適合於以入射光平面18照亮測量物體16,該光平面也可以被稱為光的片。感測器14適合於檢測從測量物體16反射的光20,並根據該反射光20生成圖像。在一實施例中,測量系統10還包括計算單元24,以適合於存儲和/或分析由感測器14記錄的圖像。Please refer to FIG. 1 , which is a schematic diagram of a measuring system according to an embodiment of the present invention.
在一實施例中,光源12為雷射光,使光平面18形成雷射平面。In one embodiment, the
請一併參照第2圖。第2圖係繪示依照本發明之一實施例的一種具有校準單元的測量系統10’的示意圖。如第2圖所示,測量系統10’中還包括校準單元32,其被被引入光平面18中的對應性位置中。在一實施例中,校準單元32包括有多個鋸齒形部34,其中每一個鋸齒形部34具有齒尖,且其中在兩個相鄰鋸齒形部34之間形成齒穀。如此一來,校準單元32包括其間相對距離已被預先確定的多個點。透過校準單元32,計算單元24可以準確地經由感測器14接收的反射光資訊計算出測量物體的輪廓資訊。Please also refer to Figure 2. FIG. 2 is a schematic diagram of a measurement system 10' with a calibration unit according to an embodiment of the present invention. As shown in FIG. 2 , a
如先前所述,測量系統10的多個光源12分別投射至測量物體16的一部分,並透過感測器14接收反射光以取得測量物體16每一部分的輪廓資訊,這些資訊可傳送至計算單元24以進行分析和產生對應的輪廓圖像。然而,由於每個光源12的硬體條件和設置條件之影響使得基準存在差異,導致光學感測器所得到的每組輪廓資訊的精度都有些不同,而無法直接併接使用。As mentioned above, the plurality of
請一併參照第3圖與第4圖。第3圖係繪示依照本發明之一實施例的一種對位輔助單元的示意圖。第4圖係繪示依照本發明之一實施例的一種測量系統10’’的示意圖。如第4圖所示,測量系統10’’還包括多個對位輔助單元40(圖中僅繪示一個),對位輔助單元40位於相鄰的光源12投射至校準單元32的重疊區域的齒穀上。在一實施例中,如第3A圖所示,對位輔助單元40具有相連的兩個邊部41以及設置於兩邊部中間的一尖部43。對位輔助單元40的邊部可以完全服貼至校準單元32的鋸齒形部34的其中一邊,使得對位輔助單元40可以完整且穩固地設置在校準單元32的齒殼上。在一實施例中,尖部43的高度不等於鋸齒形部34的齒尖的高度,較佳地,尖部43的高度遠小於齒尖的高度,如第4圖所示,使得校準單元32在規則排列的鋸齒形部34中形成一個不規則的形狀,此不規則形狀位於兩相鄰的光源12投射至校準單元32的重疊區域中。然而本發明並不以此為限,可根據校準單元的形狀對應地設計對位輔助單元40的形狀,只要讓原本具規則排列的校準單元可在重疊區域形成明顯不規則且可容易識別的形狀即可。如此一來,當計算單元24在分析輪廓資訊時,透過對位輔助單元40所給出的資訊便可得知在對應對位輔助單元40的位置中是兩光源12投射的重疊區域,此區域也就是之後要進行併接輪廓資訊的位置。Please refer to Figure 3 and Figure 4 together. FIG. 3 is a schematic diagram of an alignment auxiliary unit according to an embodiment of the present invention. FIG. 4 is a schematic diagram of a measuring system 10'' according to an embodiment of the present invention. As shown in FIG. 4 , the
請參照第5A圖,第5A圖繪示了第4圖的測量系統10’’所得到的重疊區域的輪廓資訊。第5A圖(a)是經由測量系統10’’的左邊的光源12所得到的重疊區域的輪廓資訊,第5A圖(b)是經由測量系統10’’的右邊的光源12所得到的重疊區域的輪廓資訊。由於這兩筆輪廓資訊是經由不同的光源取得,因此兩者的資訊基準並不相同,必須進行校準後才能進行併接。在一實施例中,計算單元24將感測器接收到的輪廓資訊分別記錄在獨立的座標系統中,接著對這些輪廓資訊進行數據正規化以得到第5A圖的數據。接著,計算單元24透過式(1)來計算兩個圖表中數據的相關係數。
…(1)
其中,
X
i 為每一個數據在座標系統中的X軸座標(其代表被量測之物體的輪廓資訊在X軸的位置),
Z
i 為每一個數據在座標系統中的Z軸座標(其代表被量測之物體的輪廓資訊對應
X
i 位置的高度),
為
X
1 至
X
n 的平均數,
為
Z
1 至
Z
n 的平均數。
Please refer to FIG. 5A . FIG. 5A shows the contour information of the overlapping area obtained by the
相關係數r為X和Z的共異變數除以X的標準差和Z的標準差的乘積。X和Z的共異變數可以以式(2)表示,X的標準差可以以式(3)表示,Z的標準差可以以式(4)表示。因此,將式(2)除以式(3)和式(4)的乘積便可得到式(1)。 …(2) …(3) …(4) The correlation coefficient r is the covariance of X and Z divided by the product of the standard deviation of X and the standard deviation of Z. The common variable of X and Z can be expressed by formula (2), the standard deviation of X can be expressed by formula (3), and the standard deviation of Z can be expressed by formula (4). Therefore, formula (1) can be obtained by dividing formula (2) by the product of formula (3) and formula (4). …(2) ...(3) …(4)
具體來說,計算單元24可將第5A圖(a)的每一個位置的數據與第5A圖(b)中對應第5A圖(a)中相同位置(即相同的X座標上)的每一個數據計算出兩者的相關係數,其中每個數據代表著所量測到的物體的輪廓的其中一個位置的高度。接著,計算單元24將第5A圖(a)的所有數據位移一個單位後(例如右移一個X座標單位),再將第5A圖(a)位移後的每一個數據與第5A圖(b)中對應第5A圖(a)中位移後相同位置的每一個數據並計算出兩者的相關係數,以此類推直到完成所有可能的相關係數。在這所有計算過的相關係數中,相關係數越高代表兩個圖表的數據越接近併接的位置。因此,當完成所有數據的相關係數的計算後,相關係數最大的數據,便是可以進行併接的位置(也就是第5A圖(a)與第5A圖(b)相同的位置)。如第5B圖所示,第5B圖繪示了第4A圖的輪廓資訊進行併接後所得到的完整輪廓資訊,其中左半部對應於經由左邊光源12投射所得到的輪廓資訊,右半部對應於經由右邊光源12投射所得到的輪廓資訊。Specifically, the
由上述之實施方式可知,透過本發明所提供的對位輔助單元,可得知兩相鄰光源投射至測量物體的重疊區域,再透過對此重疊區域的輪廓資訊進行相關係數的計算,可得到經由兩相鄰光源所得到的輪廓資訊的併接位置處,然後再進行接併的處理,從而得到量測物體的整體輪廓資訊。It can be seen from the above-mentioned embodiments that through the alignment auxiliary unit provided by the present invention, it is possible to know the overlapping area where two adjacent light sources are projected onto the measurement object, and then calculate the correlation coefficient by calculating the contour information of the overlapping area, and obtain The merged position of the contour information obtained by two adjacent light sources is then merged to obtain the overall contour information of the measured object.
雖然本發明已以較佳實施例揭露,然其並非用以限制本發明,任何熟習此項技藝之人士,在不脫離本發明之精神和範圍內,當可作各種更動與修飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者爲準。Although the present invention has been disclosed with preferred embodiments, it is not intended to limit the present invention. Anyone skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection shall be determined by the scope of the attached patent application.
10 、10’ 、10’’:測量系統 12:光源 14:感測器 16:測量物體 18:入射光平面 20:反射光 24:計算單元 32:校準單元 34:鋸齒形部 40:對位輔助單元 41:邊部 43:尖部10, 10’, 10’’: measuring system 12: Light source 14: Sensor 16: Measuring Objects 18: Incident light plane 20: reflected light 24: Calculation unit 32: Calibration unit 34: zigzag part 40: Alignment auxiliary unit 41: Edge 43: tip
第1圖係繪示依照本發明之一實施例的一種測量系統的示意圖;FIG. 1 is a schematic diagram illustrating a measurement system according to an embodiment of the present invention;
第2圖係繪示依照本發明之一實施例的一種具有校準單元的測量系統的示意圖;FIG. 2 is a schematic diagram illustrating a measurement system with a calibration unit according to an embodiment of the present invention;
第3圖係繪示依照本發明之一實施例的一種對位輔助單元的示意圖;FIG. 3 is a schematic diagram illustrating an alignment auxiliary unit according to an embodiment of the present invention;
第4圖係繪示依照本發明之一實施例的一種測量系統的示意圖;FIG. 4 is a schematic diagram illustrating a measurement system according to an embodiment of the present invention;
第5A圖繪示了第4圖的測量系統所得到的重疊區域的輪廓資訊;以及Figure 5A shows the contour information of the overlapping area obtained by the measurement system in Figure 4; and
第5B圖繪示了第5A圖的輪廓資訊進行併接後所得到的完整輪廓資訊。FIG. 5B shows the complete contour information obtained after the contour information in FIG. 5A is merged.
10”:測量系統 10": measuring system
12:光源 12: Light source
14:感測器 14: Sensor
20:反射光 20: reflected light
24:計算單元 24: Calculation unit
34:鋸齒形部 34: zigzag part
41:邊部 41: Edge
43:尖部 43: tip
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| TW200612085A (en) * | 2004-10-08 | 2006-04-16 | Chroma Ate Inc | Adjustable light sources for image forming apparatus |
| CN104040287A (en) * | 2012-01-05 | 2014-09-10 | 合欧米成像公司 | Arrangement for optical measurements and related method |
| CN106164779A (en) * | 2014-04-01 | 2016-11-23 | 株式会社尼康 | Substrate processing apparatus, device manufacturing method, and adjustment method of substrate processing apparatus |
| CN104897616A (en) * | 2015-05-26 | 2015-09-09 | 北京理工大学 | Method and system for measuring multispectral bidirectional reflectance distribution function of sample of any shape |
| CN109109318A (en) * | 2017-06-26 | 2019-01-01 | 三纬国际立体列印科技股份有限公司 | Multi-light source adjusting device and using method thereof |
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| TW202405374A (en) | 2024-02-01 |
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