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TWI796391B - 切晶帶一體型半導體背面密接膜 - Google Patents

切晶帶一體型半導體背面密接膜 Download PDF

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Publication number
TWI796391B
TWI796391B TW107142707A TW107142707A TWI796391B TW I796391 B TWI796391 B TW I796391B TW 107142707 A TW107142707 A TW 107142707A TW 107142707 A TW107142707 A TW 107142707A TW I796391 B TWI796391 B TW I796391B
Authority
TW
Taiwan
Prior art keywords
adhesive film
mentioned
dicing tape
adhesive layer
semiconductor
Prior art date
Application number
TW107142707A
Other languages
English (en)
Chinese (zh)
Other versions
TW201936869A (zh
Inventor
志賀豪士
佐藤慧
高本尚英
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW201936869A publication Critical patent/TW201936869A/zh
Application granted granted Critical
Publication of TWI796391B publication Critical patent/TWI796391B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H10W74/10—
    • H10W74/40—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW107142707A 2017-12-28 2018-11-29 切晶帶一體型半導體背面密接膜 TWI796391B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-254616 2017-12-28
JP2017254616A JP7015166B2 (ja) 2017-12-28 2017-12-28 ダイシングテープ一体型半導体背面密着フィルム

Publications (2)

Publication Number Publication Date
TW201936869A TW201936869A (zh) 2019-09-16
TWI796391B true TWI796391B (zh) 2023-03-21

Family

ID=67063422

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107142707A TWI796391B (zh) 2017-12-28 2018-11-29 切晶帶一體型半導體背面密接膜

Country Status (3)

Country Link
JP (1) JP7015166B2 (ja)
TW (1) TWI796391B (ja)
WO (1) WO2019130786A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7585219B2 (ja) * 2019-10-23 2024-11-18 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シートおよび保護膜付き小片の製造方法
CN115023801B (zh) * 2020-01-27 2025-08-29 琳得科株式会社 带保护膜的半导体芯片的剥离方法
WO2022085763A1 (ja) * 2020-10-22 2022-04-28 三菱エンジニアリングプラスチックス株式会社 樹脂組成物、成形品、樹脂組成物の使用、キット、レーザー溶着品、および、レーザー溶着品の製造方法
JP7667598B2 (ja) * 2021-03-31 2025-04-23 エヌシーシー ナノ， エルエルシー 集積回路製造の間に基板を取付および取外するための方法
KR102654651B1 (ko) * 2021-07-27 2024-04-04 동우 화인켐 주식회사 점착 시트, 이를 포함하는 광학 필름 및 화상 표시 장치
TWI884088B (zh) * 2024-09-30 2025-05-11 翌實實業股份有限公司 晶圓冷擴設備

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016174181A (ja) * 2014-03-24 2016-09-29 リンテック株式会社 保護膜形成フィルムおよび保護膜形成用シート
TW201635350A (zh) * 2015-03-20 2016-10-01 旺宏電子股份有限公司 製造半導體裝置的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5391158B2 (ja) * 2010-06-30 2014-01-15 古河電気工業株式会社 ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
JP5717420B2 (ja) * 2010-11-30 2015-05-13 日立マクセル株式会社 切削加工用粘着テープ
US10008406B2 (en) * 2014-12-25 2018-06-26 Denka Company Limited Adhesive sheet for laser dicing and method for manufacturing semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016174181A (ja) * 2014-03-24 2016-09-29 リンテック株式会社 保護膜形成フィルムおよび保護膜形成用シート
TW201635350A (zh) * 2015-03-20 2016-10-01 旺宏電子股份有限公司 製造半導體裝置的方法

Also Published As

Publication number Publication date
WO2019130786A1 (ja) 2019-07-04
JP2019121660A (ja) 2019-07-22
JP7015166B2 (ja) 2022-02-02
TW201936869A (zh) 2019-09-16

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