TWI795865B - Circuit board structure capable of shielding and heat dissipation and its manufacturing method - Google Patents

Abstract

The present invention relates to a shieldable and heat-dissipating circuit board structure and its manufacturing method. A control processing device is used to select a processing area for multiple electronic components on the circuit board, and multiple marking points are calculated for the areas where these electronic components are not located. The inside of the circuit board contains a copper foil layer that can form the contact surface, and the marking points are formed on the surface of the circuit board at a preset distance, and then the surface of the circuit board is sprayed with water-based environmental protection paint to form the first insulating layer. Carry out circuit board cutting operation to form a plurality of through holes, and spray water-based environmental protection paint on the surface of the first insulating layer to form a conductive layer, and the conductive layer is electrically connected to the copper foil layer inside the circuit board, and finally in The surface of the conductive layer is sprayed with water-based environmental protection paint to form the second insulating layer, so as to achieve the purpose of guiding the electromagnetic waves of these electronic components to the ground plane inside the circuit board through the conductive layer, and the heat energy is quickly dissipated on the surface of the first and second insulating layers. Drain.

Description

Circuit board structure capable of shielding and heat dissipation and its manufacturing method

The invention provides a circuit board structure capable of shielding and heat dissipation and its manufacturing method, especially to solve the problems of waterproofness, electromagnetic wave prevention, crosstalk interference and heat dissipation of electronic devices, and does not need to install a metal shielding case to eliminate electromagnetic wave interference , and can meet the trend of light, thin, short and miniaturized electronic devices, and can effectively reduce the production cost of manufacturing circuit boards.

Press, due to the rapid changes of the times and the ever-changing technology, people are now pursuing a more convenient and fast life, and portable electronic devices (such as smart phones, tablet computers or notebook computers and other electronic products) are also in modern life It is more common and more important. It has almost become an indispensable part of daily life. With the rise of the Internet and social networking sites, a single portable electronic device can handle most of the work, whether it is communication, The Internet, multimedia applications (such as videos or games) or various information can be easily obtained, used or disseminated in portable electronic devices.

However, at present, various portable electronic devices must use electric power to start and operate, so various portable electronic devices are equipped with batteries for supplying power, and the power is transmitted to circuit boards with various functions through the batteries. Supply the power required for the operation of the circuit board, and the power transmission between the battery and the circuit board can be carried out through the electrical connector. However, the electrical connectors currently used for power transmission use embedded buckles and clamping methods between the base body and the plurality of terminals. After the assembly and positioning of the electrical connector, it can be directly used for power transmission, and in actual application and implementation, there are still some shortcomings and inconveniences, for example: after the electrical connector is assembled and positioned, there is a gap between the seat and the plurality of terminals , it is easy for external moisture to infiltrate into the circuit board through the electrical connector, which will cause corrosion and oxidation of multiple contacts on the circuit board and pins of various electronic components, etc., which will easily affect the operation of the circuit board, and then short circuit or open circuit. Abnormal phenomena, and when the electronic device encounters rainy days or accidentally spills other liquids containing water, the interior of the electronic device is easily short-circuited due to moisture and affects its functionality. Pay attention to.

Moreover, today's electronic devices need to perform a large amount of signal processing, and the signal processing needs to be high-speed. Therefore, during the use of electronic devices, the internal electronic components will generate electromagnetic waves, crosstalk interference and high heat energy, and will also interfere with Other electronic equipment, or the internal electronic components interfere with each other and cannot work normally. Based on the above, in order to solve the problems of electromagnetic waves, crosstalk interference and heat dissipation, some manufacturers install metal covers on the circuit boards of electronic devices to cover the upper part of the electronic components through the metal covers, and then use the metal covers to Inductively absorbs and shields electromagnetic waves and crosstalk interference and provides heat dissipation. However, the current trend of electronic devices is light, thin, short, and miniaturized. Installing a metal cover will increase the overall thickness of the electronic device, and the metal cover Mold opening and assembly will also consume a lot of manufacturing time and cost, thereby failing to effectively enhance the market competitiveness of electronic devices.

Therefore, how to solve the problems of water resistance, electromagnetic wave prevention, crosstalk interference and heat dissipation of the above-mentioned electronic devices, and at the same time conform to the trend of light, thin, short, and miniaturized electronic devices, is the relevant manufacturers engaged in this industry. Those who urgently want to study the direction of improvement.

Therefore, in view of the above-mentioned problems and deficiencies, the inventor collected relevant information, After many evaluations and considerations, and with many years of experience in this industry, through continuous creation and research and development, he designed this kind of circuit board structure that can shield and dissipate heat and the birth of the invention patent of its manufacturing method.

The main purpose of the present invention is to use the control processing device to select a processing area for multiple electronic components on the circuit board, and to calculate the multiple marking points in the area where these electronic components are not set, and the circuit board contains a surface that can form contact points. The copper foil layer is used to form these marked points on the surface of the circuit board at a preset distance, and then spray water-based environmental protection paint on the surface of the circuit board to form the first insulating layer, and the circuit board is cut outside these marked points to form a plurality of transparent holes, and spray water-based environmentally friendly paint on the surface of the first insulating layer to form a conductive layer, and the conductive layer is electrically connected to the copper foil layer inside the circuit board, and finally spray water-based environmentally friendly paint on the surface of the conductive layer to form the second Insulating layer, to achieve the purpose of guiding the electromagnetic waves, noise and other interference of these electronic components to the ground plane inside the circuit board through the conductive layer, and the heat energy can be guided and distributed on the surface of the first and second insulating layers for rapid discharge Scattering, which can meet the trend of light, thin, short and miniaturized electronic devices, and can effectively reduce the production cost of manufacturing circuit boards.

Another object of the present invention is that the first insulating layer and the second insulating layer are water-based environmental protection coatings, and the water-based environmental protection coatings include: base material [about 20%~50% by weight], heat dissipation material [about 10%~40% by weight], polymer material crosslinking agent [about 0.5%~30% by weight] and deionized water [about 10%~30% by weight]; wherein the base material system includes: Polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic One or a combination of polymers, ether-based polymers, or polyolefins; the heat-dissipating material is flake or fin-shaped boron nitride, aluminum oxide, or aluminum nitride; the polymer material crosslinking agent [is 0.5%~30% Percent by weight] system includes: high imine methyl etherified melamine resin (hmmm) or aziridine or carbodiimide (Garbodiimide), and further for amino (-NH2), carboxyl (-COOH), amide bond (- CONH- or -NHCO-) functional group.

Another object of the present invention is that the conductive layer is also a water-based environmental protection coating, then the water-based environmental protection coating comprises: %], polymer material crosslinking agent (0.5%~30% by weight) and deionized water (10%~30% by weight); then the base material system includes: carbon nanotubes, graphene, silver Copper and nickel, etc.; the binder system includes: polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, One or a combination of polydimethylsiloxane, acrylic polymers, ether polymers, or polyolefins; the crosslinking agent for polymer materials includes: high imine methyl etherified melamine resin ( hmmm) or aziridine or carbodiimide (Garbodiimide), and further for amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups.

Another object of the present invention is that the circuit board structure includes: a circuit board, a first insulating layer, a conductive layer and a second insulating layer, and the surface of the circuit board is provided with a plurality of electronic components, and the inside includes at least one layer that can form a contact layer. The copper foil layer on the point surface; the first insulating layer is formed on the surface of the circuit board and above the complex electronic components, and includes: base material [20%~50% by weight], heat dissipation material [10%~40% % by weight], polymer material crosslinking agent [0.5%~30% by weight] and deionized water [10%~30% by weight]; the conductive layer is formed on the top of the first insulating layer and includes: Base material [20%~50% by weight], binder [Binder, 0.5%~20% by weight], polymer material crosslinking agent [0.5%~30% by weight] and deionized water [for 10%~30% by weight]; and the second insulating layer is Formed above the conductive layer, it includes: base material [20%~50% by weight], boron nitride [10%~40% by weight], polymer crosslinking agent [0.5%~30% by weight] %] and deionized water (10%~30% by weight).

1: Control processing device

2: Working machine

3: circuit board

30: through hole

31: Processing area

32: Electronic components

33: Marking point

34: copper foil layer

4: The first preset atomization fixture

41: Water-based environmental protection coating

42: The first insulating layer

43: Second insulating layer

5: Preset robotic arm

6: The second preset atomization fixture

61: Water-based environmentally friendly conductive coating

62: Conductive layer

[Fig. 1] is a block diagram of the circuit board manufacturing equipment of the present invention.

[Fig. 2] is a schematic diagram of the first operation of the circuit board manufacturing of the present invention.

[Fig. 3] is a schematic diagram of the second operation of the circuit board manufacturing of the present invention.

[Fig. 4] is a schematic diagram of the third operation of the circuit board manufacturing of the present invention.

[Fig. 5] is a schematic diagram of the fourth action of circuit board manufacturing in the present invention.

[Fig. 6] is a schematic diagram of the fifth action of the circuit board manufacturing of the present invention.

[Fig. 7] is a schematic diagram of the sixth action of the circuit board manufacturing of the present invention.

[Fig. 8] is a schematic diagram of the seventh operation of the circuit board manufacturing of the present invention.

[Fig. 9] is a schematic diagram of the eighth operation of the circuit board manufacturing of the present invention.

[Fig. 10] is a flow chart of the circuit board manufacturing method of the present invention.

In order to achieve the above-mentioned purpose and effect, the technical means adopted in the present invention, its structure, and the method of implementation, etc., are hereby described in detail with respect to preferred embodiments of the present invention. Its features and functions are as follows, so that it can be fully understood.

Please refer to Figures 1 to 9, each of which is a functional block diagram of the circuit board manufacturing equipment of the present invention, the first schematic diagram of the circuit board manufacturing, the second schematic diagram of the operation, the third schematic diagram of the operation, the fourth schematic diagram of the operation, and the first schematic diagram of the circuit board manufacturing. Schematic diagram of fifth action, sixth action schematic diagram, seventh action The schematic diagram and the eighth schematic diagram of action, it can be clearly seen from the figure that the circuit board manufacturing equipment capable of shielding electromagnetic interference of the present invention includes: a control processing device 1, a working machine 2 and a circuit board 3, and its main components and features are detailed as follows:

Please refer to Figure 1, wherein the control processing device 1 can manufacture and process the plurality of circuit boards 3 arranged on the work machine 2, and the control processing device refers to an industrial computer (IPC) or an industrial server (Industrial Server) etc., and the circuit board 3 refers to a hard fiberglass circuit board or a flexible circuit board (FPC), etc., and the circuit board 3 includes at least one layer of copper foil layer 34 that can form a contact surface (as shown in Figure 4 ).

Please refer to Figures 2 and 3, wherein the control processing device 1 can select a processing area 31 on the circuit board 3 where a plurality of electronic components 32 are arranged, and calculate according to the area where these electronic components 32 are not installed in the processing area 31 A plurality of marking points 33, and these marking points 33 are point-like, linear or irregular shapes; The surface of the circuit board 3 is formed point by point. The aforementioned preset distance range is 0.5-5 cm (centimeter), and the preset glue dispensing fixture is included in the general prior art, so it will not be repeated here.

Please refer to Figs. 4 and 5, which utilize a first preset atomizing fixture 4 to spray water-based environmental protection paint 41 on the surface of the circuit board 3, and wait for it to solidify to form the first insulating layer 42, then the first The insulating layer 42 includes: base material [about 20%~50% by weight], heat dissipation material [about 10%~40% by weight], polymer material crosslinking agent [about 0.5%~30% by weight] %] and deionized water [about 10%~30% by weight], to be cured to form the first insulating layer 42 on the surface of the circuit board 3; and the composition of the base material includes: polyurethane, polyimide, Polycarbonate, Polyamide, Polyethylene Terephthalate, Polyethylene Naphthalate, Polyethylene One or a combination of amine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the heat dissipation material includes: sheet or fin-shaped boron nitride [10 %~40% by weight], aluminum oxide or aluminum nitride; the polymer material crosslinking agent [0.5%~30% by weight] includes: high imine methyl etherified melamine resin (hmmm) or aziridine Or carbodiimide (Garbodiimide), and further for amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups; and in order to clearly show these marking points 33 and The position of the first insulating layer 42 is temporarily omitted from the plurality of electronic components 32 in Fig. 5, and is hereby stated.

Please refer to Fig. 5, which uses a preset laser cutting tool (not shown) to carry out circuit board 3 cutting operation outside these marked points 33 one by one, and the preset laser cutting tool is in When cutting the circuit board 3, you can choose to completely cut the circuit board 3 circles or leave some uncut parts, which are all within the scope of protection of the present invention; after the aforementioned operations are completed, use the preset mechanical arm 5 to The circuit board 3 that has been cut to contain the marking points 33 is taken out, and the through holes 30 are respectively formed at the original marking points 33 of the circuit board 3 .

Please refer to Figures 6 and 7, which use a second preset atomization fixture 6 to spray water-based environmentally friendly conductive paint 61 on the surface of the circuit board 3, and make the water-based environmentally friendly conductive paint 61 fill the through holes 30, wait for it to solidify to form a conductive layer 62, and the conductive layer 62 is electrically connected with the copper foil layer 34 inside the circuit board 3, so as to form electromagnetic waves generated by the operation of these electronic components 32 through the conductive layer 62 , These through holes 30 are guided to the copper foil layer 34 inside the circuit board 3 for elimination; the conductive layer 62 can also be a water-based environmentally friendly conductive paint, and then the water-based environmentally friendly conductive paint system includes: base material [about 20 %~50% by weight], binder [Binder, 0.5%~20% by weight], polymer material crosslinking agent [0.5%~30% by weight] and deionized water [10%~30% by weight]; wherein the base material includes: carbon nanotubes, graphene, silver-coated copper and nickel, etc.; the binder [Binder] includes: polyurethane, polyimide, poly Carbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or One or a combination of polyolefins; the polymer material crosslinking agent includes: high imine methylated melamine resin (hmmm) or aziridine or carbodiimide (Garbodiimide), and further for amino (- NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups.

The above-mentioned conductive layer 62 is composed of carbon nanotubes, graphene, silver-coated copper and conductive colloid. The silver-coated copper system has a sheet structure, and the particle length ranges from 10 to 100 μm. And when the particle length of the silver-clad copper is within the aforementioned range, the complete shape of the silver-clad copper can be maintained, which is more conducive to reducing the resistance value of the conductive layer 62; the conductive glue system refers to gold glue, silver glue, aluminum glue , copper glue, graphite glue or a combination thereof; and the thickness range of the conductive layer 62 is 1 ~ 100 μm (micron), then the preferred embodiment thickness of the conductive layer 62 can be 20 ~ 60 μm (micron), that is, The resistance value measured at any two points in the conductive layer 62 is less than 10Ω (ohm).

The circuit board that can shield electromagnetic interference produced by the above process is applied to the electronic component carrier board test of the fifth generation mobile communication, and is measured under the condition that the thickness of the conductive layer is 20~60μm (micron), which can shield The test data of electromagnetic interference (EMI) is as follows:

It can be known from the above table that at any two test points on the ground plane formed by the copper foil layer 34, the measurable resistance value is between 3 and 4Ω, and with the number of grounding via holes (ungrounded, 5 points, 16 stickers, between two electronic components), the measurement distance (0.5~4cm), and the obtainable resistance value (3~10Ω) also slightly changes accordingly, but in the conductive layer 62, the plurality of via holes, The electromagnetic wave grounding path formed by the copper foil layer 34 all keeps an extremely low resistance value; The resistance value measured between the test points is about less than 10Ω (ohm); therefore, the effect of the present invention to shield the communication electronic components 32 on the circuit board 3 from electromagnetic waves generated by high-frequency operation can be achieved.

Please refer to Figures 8 and 9, which again use a first preset atomization fixture 4 Spray water-based environmental protection paint 41 on the surface of the conductive layer 62, and wait for it to solidify to form the second insulating layer 43, then the second insulating layer 43 is composed of: base material (about 20%~50% by weight), heat dissipation [about 10%~40% by weight], polymer material crosslinking agent [about 0.5%~30% by weight] and deionized water [about 10%~30% by weight]. The first insulating layer 42 is formed on the surface of the circuit board 3; and the composition of the base material includes: polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate One or a combination of alcohol ester, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the heat dissipation material includes: sheet-like or fin-like Boron nitride [10%~40% by weight], aluminum oxide or aluminum nitride; the polymer material crosslinking agent [0.5%~30% by weight] includes: high imine methyl etherified melamine resin ( hmmm) or aziridine or carbodiimide (Garbodiimide), and further for amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups.

The surface of the circuit board 3 is sprayed with water-based environmentally friendly conductive paint 61 to form a conductive layer 62, and the conductive layer 62 is electrically connected to the copper foil layer 34 inside the circuit board 3 to form the electronic components 32. Interference such as electromagnetic waves, crosstalk or noise generated is guided to the copper foil layer 34 inside the circuit board 3 through the conductive layer 62 and the through holes 30 for elimination, so as to solve the waterproof and anti-electromagnetic wave of electronic devices , The problem of crosstalk interference, and there is no need to install a metal shielding shell to eliminate interference such as electromagnetic waves, crosstalk or noise, but it can meet the trend of light, thin, short, and miniaturized electronic devices, and can effectively reduce the cost of manufacturing circuit boards. Production cost; As for the surface of the circuit board 3, water-based environmental protection coatings 41 of different materials are sprayed sequentially, and the first insulating layer 42, the conductive layer 62 and the second insulating layer 43 are formed in sequence, and the polymer materials in the materials of each layer are cross-linked The agent can form the link and bond between the polymer materials for the connection between the first insulating layer 42, the conductive layer 62 and the second insulating layer 43. The combination is better, the bonding effect is better, and the heat dissipation material is included in the first insulating layer 42 and the second insulating layer 43, then the heat dissipation material such as boron nitride (BN), aluminum oxide or aluminum nitride, etc., In order to have good heat conduction and heat dissipation; the present invention has excellent practicability in the field of producing wireless communication circuit boards, so a patent application is filed to seek patent protection.

Please refer to shown in Fig. 10, it is a flow chart of its manufacturing method for the shieldable and heat-dissipating circuit board structure of the present invention, and it comprises the following steps:

(A) Utilize the control processing device 1 to select a processing area on the circuit board 3 where the plurality of electronic components 32 are arranged, and calculate the plurality of marking points 33 according to the area where the electronic components 32 are not set in the processing area, and these marking points 33 is dotted, linear or irregular, and the circuit board 3 contains at least one layer of copper foil layer 34 that can form a contact surface.

(B) using a preset glue dispensing jig to place dots one by one on the surface of the circuit board 3 at a preset distance to form the marking points 33 .

(C) Spray water-based environmental protection paint 41 on the surface of the circuit board 3 by using the first preset atomization fixture 4. The water-based environmental protection paint 41 includes: base material [20%~50% by weight], heat dissipation material [ 10%~40% by weight], polymer material crosslinking agent [0.5%~30% by weight] and deionized water [10%~30% by weight], after it is cured to form on the surface of the circuit board The first insulating layer 42 .

(D) Cutting the circuit board 3 outside the marked points 33 one by one by using a preset laser cutting jig.

(E) Take out the cut circuit board 3 containing the marked points 33 by using a preset mechanical arm, and form through holes 30 at the original marked points 33 on the circuit board 3 .

(F) Utilize the second preset atomization fixture 6 to spray water on the surface of the circuit board 3 Environmentally friendly conductive paint 61, the water-based environmentally friendly conductive paint 61 series includes: base material [20%~50% by weight], binder [Binder, 0.5%~20% by weight], polymer material crosslinking agent [20%~20% by weight] 0.5%~30% by weight] and deionized water [10%~30% by weight], and the water-based environmentally friendly conductive coating 61 is filled in the through holes 30, and is cured to form a conductive layer 62, and the The conductive layer 62 is electrically connected to the copper foil layer 34 inside the circuit board 3 to form electromagnetic waves, crosstalk, noise and other interference generated by the operation of the electronic components 32, which can pass through the conductive layer 62, the transparent The hole 30 leads to the copper foil layer 34 inside the circuit board 3 for elimination.

(G) Utilize the first preset atomization fixture 4 to spray water-based environmental protection paint 41 on the surface of the conductive layer 62. The water-based environmental protection paint 41 includes: base material [20%~50% by weight], heat dissipation material [ 10%~40% by weight], polymer material crosslinking agent [0.5%~30% by weight] and deionized water [10%~30% by weight], after it is cured to form on the surface of the conductive layer The second insulating layer 43 .

The above-mentioned circuit board 3 is sprayed on the surface with water-based environmentally friendly paint 41, water-based environmentally friendly conductive paint 61 and water-based environmentally friendly paint 41 in sequence, and sequentially forms the first insulating layer 42, the conductive layer 62 and the second insulating layer 43 , wherein the polymer material cross-linking agent in each layer of paint can form links and bonds between the polymer materials, so that the bonding between the first insulating layer 42, the conductive layer 62 and the second insulating layer 43 is better, The combination effect is better, and the first insulating layer 42 and the second insulating layer 43 include heat dissipation materials, then the heat dissipation materials such as boron nitride (BN), aluminum oxide or aluminum nitride, etc., have good thermal conductivity , heat dissipation, the electromagnetic waves, crosstalk and other interference generated by the operation of these electronic components 32 are guided to the copper foil layer 34 inside the circuit board 3 through the conductive layer 62 and the through holes 30 for elimination, so as to solve the problem of electronic The waterproofness of the device and the problem of preventing electromagnetic waves and crosstalk interference, and the heat energy generated by these electronic components 32 during operation can pass through the first insulating layer 42, The conductive layer 62 is transmitted to the second insulating layer 43. The heat dissipation material in the first insulating layer 42 and the second insulating layer 43 guides the heat energy to the surface evenly and quickly dissipates the heat energy, which can effectively reduce the temperature of these electronic components. 32 to achieve the purpose of solving the problems of electromagnetic waves, crosstalk interference and heat dissipation of electronic devices. There is no need to install a metal shielding case on the outside of the electronic device, and it can also meet the trend of light, thin, short, and miniaturized electronic devices. The production cost of manufacturing circuit boards can be effectively reduced.

The above is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the present invention in the same way. Within the scope of the patent, I will cooperate with Chen Ming.

1: Control processing device

2: Working machine

3: circuit board

Claims (6)

A method of manufacturing a shieldable and heat-dissipating circuit board, which includes the following steps: (A) using a control processing device to select a processing area for the circuit board where a plurality of electronic components are arranged, and according to the fact that the electronic components are not installed in the processing area. A plurality of marking points are calculated in the component area, and these marking points are dotted, linear or irregular, and the circuit board contains at least one layer of copper foil layer that can form a contact surface; (B) using a preset The dispensing jig is set one by one on the surface of the circuit board at a preset distance to form the marking points; (C) spraying the surface of the circuit board with a water-based environmental protection paint by using the first preset atomization jig. The coating system includes: base material [20%~50% by weight], heat dissipation material [10%~40% by weight], polymer material crosslinking agent [0.5%~30% by weight] and deionized Water [10%~30% by weight], wait for it to solidify to form the first insulating layer on the surface of the circuit board; (D) use the preset laser cutting tool to cut the circuit board outside the marked points one by one; (E) Use the preset mechanical arm to take out the circuit board that has been cut and contain the marked points, and form through holes at the original marked points on the circuit board; (F) Use the second preset atomization fixture Spray water-based environmentally friendly conductive paint on the surface of the circuit board. The water-based environmentally friendly conductive paint system includes: base material [20%~50% by weight], binder [Binder, 0.5%~20% by weight], polymer material Cross-linking agent [0.5%~30% by weight] and deionized water [10%~30% by weight], and Fill the water-based environmentally friendly conductive paint into the through holes, and wait for it to solidify to form a conductive layer, and the conductive layer is electrically connected to the copper foil layer inside the circuit board to form electromagnetic waves generated by the operation of these electronic components , Noise interference is eliminated through the conductive layer and the through-holes leading to the copper foil layer inside the circuit board; and (G) using the first preset atomization fixture to spray water-based environmental protection on the surface of the conductive layer Coating, the water-based environmental protection coating system includes: base material [20%~50% by weight], heat dissipation material [10%~40% by weight], polymer material crosslinking agent [0.5%~30% by weight] percentage] and deionized water (10%~30% by weight), wait for it to solidify to form a second insulating layer on the surface of the conductive layer. The method for manufacturing a shieldable and heat-dissipating circuit board as described in claim 1, wherein the preset distance range in the step (B) is 0.5 cm (centimeter) to 5 cm (centimeter). The manufacturing method of a shieldable and heat-dissipating circuit board as described in claim 1, wherein the base material of (C) and (G) [20%~50% by weight] includes polyurethane, polyimide, polycarbonate ester, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or poly One or a combination of olefins; the heat dissipation material is flake or fin-shaped boron nitride [10%~40% by weight], aluminum oxide or aluminum nitride; the polymer material crosslinking agent [is 0.5%~30% by weight] include: high imine methylated melamine resin (hmmm) or aziridine or carbodiimide (Garbodiimide), and further for amino (-NH2), carboxyl (-COOH), Amide bond (-CONH- or -NHCO-) functional group. The method for manufacturing a shieldable and heat-dissipating circuit board as described in claim 1, wherein the thickness range of the conductive layer described in the step (F) is 1 to 100 μm (micrometer), and the thickness of the preferred embodiment of the conductive layer is 20~60μm (micrometer), the measured resistance value of any two points in the conductive layer is less than 10Ω (ohm). The method for manufacturing a shieldable and heat-dissipating circuit board as described in Claim 1, wherein the base material [20%~50% by weight] of the step (F) water-based environmentally friendly conductive coating includes: carbon nanotubes, graphite vinyl, silver-clad copper and nickel; the binder [Binder, 0.5%~20% by weight] includes: polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, One or a combination of polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymers, ether polymers, or polyolefins; the polymer material crosslinking agent [0.5%~30% by weight] is composed of: high imine methyl etherified melamine resin (hmmm) or aziridine or carbodiimide (Garbodiimide), and further for amino (-NH2), carboxyl (-COOH ), amide bond (-CONH- or -NHCO-) functional group. The method for manufacturing a shieldable and heat-dissipating circuit board as described in claim 5, wherein the silver-clad copper system is in a sheet structure, and the particle length ranges from 10 to 100 μm.

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