TWI794811B - Liquid flow type heat dissipation device - Google Patents

Abstract

A liquid flow type heat dissipation device includes a base, a cover, a heat conduction box, an impeller and a driving component. The base includes a bottom and an annular wall. The annular wall is integrally connected to the bottom, and the bottom and the annular wall jointly surround a storage chamber. The cover is installed on the annular wall. The heat-conducting box is installed at the bottom of the base away from the side of the annular wall, and the heat-conducting box surrounds a heat exchange chamber. The heat exchange chamber communicates with the storage chamber. The impeller is rotatably located in the storage chamber. The driving component is installed on the cover and located outside the storage chamber, and is used for driving the impeller to rotate relative to the base. The impeller is located in the storage chamber and is surrounded by the annular wall.

Description

liquid cooling device

The invention relates to a cooling device, in particular to a liquid flow cooling device.

When the computer is running, the heat source inside the computer, such as the central processing unit, will generate heat due to high-speed computing. Therefore, the computer must be equipped with a cooling device to quickly and effectively remove the heat generated by the heat source, and keep the temperature of the heat source within the design range specified by the manufacturer. Cooling devices are generally divided into air-cooled and liquid-cooled. The air-cooled cooling device refers to the installation of cooling fins on the heat source, and the installation of a fan on the computer, so that the heat generated by the heat source can be taken away by the airflow generated by the fan. However, due to the noise generated when the fan is running, it is difficult to cool the heat source with high calorific value, such as the processor of a competitive computer. Therefore, at present, the computers used in sports are generally liquid-cooled. The liquid-cooled cooling device refers to the installation of a water-cooled head and a water-cooled row in the computer. The water-cooled head is in thermal contact with a heat source and connected to the water-cooled row through a flow tube. There is a pump in the water-cooling head, and the cooling liquid that absorbs heat can be driven by the pump to flow from the water-cooling head to the water-cooling row, and then flow back from the water-cooling row to the water-cooling head after the water-cooling row dissipates heat.

However, due to the large number of shell parts of the current water cooling head, the assembly efficiency is not good, and the waterproof design is difficult to be comprehensive. For example, if the water cooling head originally designed for a single heat source is modified and changed to a water cooling head for multiple heat sources, it may be difficult to strengthen the waterproof performance after the structural change, so that the modified water cooling head loses the waterproof effect and the water cooling liquid leakage.

The present invention is to provide a liquid flow heat dissipation device, so as to improve the assembly efficiency of the water-cooled head and increase the flexibility of the water-cooled head for future modification.

A liquid flow heat dissipation device disclosed in an embodiment of the present invention includes a base, a cover, a deflector, a heat conduction box, an impeller and a driving component. The base includes a bottom and an annular wall. The annular wall is connected to the bottom, and the bottom and the annular wall jointly surround a storage chamber. The cover includes a top, a convex portion and a surrounding portion. The top is installed on the circular wall. The convex part and the surrounding part protrude from the same side of the top, and the surrounding part surrounds the convex part. The protruding portion surrounds a driving assembly accommodating space on a side away from the bottom. The accommodating space of the drive assembly is not communicated with the storage chamber. The opposite two sides of the deflector are stacked on the base and the surrounding part respectively. The surrounding part, the convex part and the deflector jointly surround an impeller accommodating chamber. The heat conduction box is installed on the bottom of the base at a side away from the annular wall, and the heat conduction box has a heat exchange chamber. The impeller accommodation chamber communicates with the heat exchange chamber through the storage chamber. The impeller is rotatably located in the impeller accommodating chamber. The driving assembly is located in the accommodating space of the driving assembly and is used to drive the impeller to rotate relative to the base. Wherein, the bottom and the ring-shaped wall are integrally formed, and the convex part and surrounding part of the cover, the deflector and the impeller are all located in the storage chamber and surrounded by the ring-shaped wall. Wherein, the annular wall portion of the base has an external outlet and an external inlet, and the bottom has a first communication port and a second communication port. The external inlet communicates with the impeller accommodating chamber through the storage chamber. The impeller accommodating chamber communicates with the heat exchange chamber through the first communication port. The heat exchange chamber communicates with the external outlet through the second communication port. The first communication port connecting the impeller accommodating chamber and the heat exchange chamber deviates from the rotation axis of the impeller.

Another embodiment of the present invention discloses a liquid flow heat dissipation device comprising a base, a cover, a heat conduction box, an impeller and a driving component. The base includes a bottom and an annular wall. The annular wall is integrally connected to the bottom, and the bottom and the annular wall jointly surround a storage chamber. The cover is installed on the annular wall. The heat conduction box is installed on the bottom of the base at a side away from the annular wall, and the heat conduction box surrounds a heat exchange chamber. The heat exchange chamber communicates with the storage chamber. The impeller is rotatably located in the storage chamber. The driving assembly is installed on the cover and outside the storage chamber, and is used to drive the impeller to rotate relative to the base. Wherein, the impeller is located in the storage chamber and surrounded by the annular wall.

Another embodiment of the present invention discloses a liquid flow heat dissipation device comprising a base, a cover, a heat conduction box, a seal, an impeller and a driving component. The base has a storage chamber. The cover is mounted on the base. The heat conduction box includes a box body and a cover body. The cover covers the box so that the box and the cover together surround a heat exchange chamber. The heat conduction box is installed on the bottom of the base at a side away from the annular wall, and the cover has at least one opening and communicates with the storage chamber through the at least one opening. The size of the sealing member matches the size of the at least one opening. The seal is interposed between the cover and the base, and surrounds at least one opening. The impeller is rotatably located in the storage chamber. The driving assembly is installed on the cover and outside the storage chamber, and is used to drive the impeller to rotate relative to the base.

Another embodiment of the present invention discloses a liquid flow heat dissipation device comprising a base, a cover, a deflector, a heat conduction box, an impeller and a driving component. The base includes a bottom and an annular wall. The annular wall is connected to the bottom, and the bottom and the annular wall jointly surround a storage chamber. The cover includes a top, a convex portion and a surrounding portion. The top is installed on the circular wall. The convex part and the surrounding part protrude from the same side of the top, and the surrounding part surrounds the convex part. The protruding portion surrounds a driving assembly accommodating space on a side away from the bottom. The accommodating space of the drive assembly is not communicated with the storage chamber. The opposite two sides of the deflector are stacked on the base and the surrounding part respectively. The surrounding part, the convex part and the deflector jointly surround an impeller accommodating chamber. The heat conduction box is installed on the bottom of the base at a side away from the annular wall, and the heat conduction box has a heat exchange chamber. The impeller accommodation chamber communicates with the heat exchange chamber through the storage chamber. The impeller is rotatably located in the impeller accommodating chamber. The driving assembly is located in the accommodating space of the driving assembly and is used to drive the impeller to rotate relative to the base. Wherein, the bottom and the ring-shaped wall are integrally formed, and the convex part and surrounding part of the cover, the deflector and the impeller are all located in the storage chamber and surrounded by the ring-shaped wall. Wherein, the annular wall portion of the base has an external outlet and an external inlet. The bottom has a first communication port and a second communication port. The deflector has an impeller chamber inlet and an impeller chamber outlet which are connected to the impeller accommodating chamber. The external inlet is connected to the inlet of the impeller chamber through the storage chamber. The outlet of the impeller chamber communicates with the heat exchange chamber through the first communication port. The heat exchange chamber communicates with the external outlet through the second communication port. The first communication port does not overlap with the projection of the inlet of the impeller chamber on the bottom.

According to the liquid flow heat dissipation device of the above-mentioned embodiment, since the annular wall portion and the bottom of the base are integrally formed in a bowl-shaped structure, the convex portion and surrounding portion of the cover, the deflector and the impeller are all placed in the bowl-shaped The assembly procedure among the base, the cover and the deflector can be simplified by being inside the base, thereby reducing the difficulty of assembling the liquid flow heat sink.

In addition, since the annular wall and the bottom of the base are integrally formed in a bowl shape, and most of the bottom of the storage chamber is closed by the bottom, only a small part is designed with the first communication port and the heat exchange chamber. The second connection port. Therefore, if the original heat conduction box of the liquid flow heat sink needs to be refitted into a larger-sized heat conduction box, because the matching is simple, only hole-to-hole is required, and there is no integration problem at the overall structural level faced by conventional designs. In other words, the liquid flow cooling device increases the flexibility of future modification. On the contrary, the base of the conventional design mostly adopts the cover-type design, and the heat-conducting plate is an open design, and the two together form a complete airtight cavity. Once the size or shape of the heat conduction plate is changed, the base cannot form a closed cavity with the heat conduction plate, resulting in a problem that must be redesigned.

The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.

Please refer to Figure 1 to Figure 2. FIG. 1 is a schematic perspective view of a liquid flow heat sink according to a first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1 .

The liquid cooling device 10 of this embodiment is, for example, a water cooling head, which is used to thermally couple to at least one heat source (not shown), and take away the heat generated by the heat source through liquid cooling. The heat source is, for example, a CPU or an image processor. The liquid flow heat sink 10 includes a base 100 , a cover 200 , a deflector 300 , a heat conduction box 600 , an impeller 700 and a driving assembly 750 .

Please refer to FIG. 2 and FIG. 3 . FIG. 3 is a schematic three-dimensional cross-sectional view of the base in FIG. 2 . The base 100 includes a bottom 110 and an annular wall 120 . The annular wall portion 120 is, for example, integrally connected to the bottom 110 , and the bottom 110 and the annular wall portion 120 jointly surround a storage chamber S1 . For example, the base 100 is a one-piece structure manufactured through injection molding.

In this embodiment, the bottom 110 has a first communication port 111 and a second communication port 112 . The first communication port 111 and the second communication port 112 communicate with the storage chamber S1. The bottom 110 may also have a horizontal partition structure 113 , and the horizontal partition structure 113 divides the space below the storage chamber S1 into two parts. The annular wall portion 120 of the base 100 has an external inlet 121 and an external outlet 122 . The external inlet 121 and the external outlet 122 are respectively used to connect to a water cooling radiator (not shown) through a pipeline (not shown). Both the external outlet 122 and the external inlet 121 are connected to the storage chamber S1, and are connected to the first communication port 111 and the second communication port 112 through the storage chamber S1. The detailed communication relationship will be described later. In addition, the annular wall portion 120 can also have a top surface 123 , an annular groove 124 and a plurality of partition protrusions 125 . The annular groove 124 is located on the top surface 123 , and the annular groove 124 accommodates a sealing ring 150 . The function of the separating convex portion 125 will be described later.

Please refer to FIG. 2 and FIG. 4 . FIG. 4 is a perspective view of the cover shown in FIG. 2 . The cover 200 is mounted on the annular wall portion 120 of the base 100 to close one side of the storage chamber S1. For example, the cover 200 includes a top 210 , a raised portion 220 and a surrounding portion 230 . The top 210 is mounted on the annular wall portion 120 of the base 100 by, for example, screwing. The top 210 is stacked on the top surface 123 of the annular wall 120 , and the top 210 and the annular wall 120 together sandwich the sealing ring 150 to prevent the liquid in the storage chamber S1 from leaking from the gap between the top 210 and the annular wall 120 . The protruding portion 220 and the surrounding portion 230 protrude from the same side of the top 210 . Specifically, both the protruding portion 220 and the surrounding portion 230 protrude from the top 210 toward the bottom 110 of the base 100 . The surrounding part 230 surrounds the protruding part 220 inside, and the surrounding part 230 is separated from the protruding part 220 . The convex portion 220 is a concave portion on a side away from the bottom 110 and surrounds a driving assembly accommodating space S2. The accommodating space S2 of the driving component is not communicated with the storage chamber S1 through the barrier of the top 210 .

Please refer to FIG. 2 and FIG. 5 . FIG. 5 is a schematic cross-sectional view of FIG. 1 . Parts of the surrounding portion 230 of the cover 200 are pressed against the partitioning protrusions 125 of the annular wall portion 120 of the base 100 to divide the upper space of the storage chamber S1 into two parts.

Please refer to FIG. 2 and FIG. 6 . FIG. 6 is a partial exploded view of FIG. 1 . Two opposite sides of the deflector 300 are stacked on the bottom 110 of the base 100 and the surrounding portion 230 of the cover 200 respectively. For example, the deflector 300 includes a plate portion 310 and a plurality of support columns 320 . The plate portion 310 is stacked on the surrounding portion 230 , and the surrounding portion 230 , the convex portion 220 and the deflector 300 jointly surround an impeller accommodating chamber S3 .

The support columns 320 protrude from the side of the plate portion 310 away from the surrounding portion 230 and abut against the bottom 110 , so that a gap SG is maintained between the plate portion 310 and the bottom 110 , and the plate portion 310 abuts against the transverse partition structure 113 . In this way, the horizontal partition structure 113 divides the gap SG into two areas that are not directly connected, and through the partition between the horizontal partition structure 113 and the partition protrusion 125, the storage chamber S1 is divided into an inlet chamber S11 and an outlet chamber S12. The entrance chamber S11 communicates with the external entrance 121 . The outlet chamber S12 communicates with the external outlet 122 , and the inlet chamber S11 and the outlet chamber S12 are not directly connected through the barrier of the surrounding portion 230 of the cover 200 . The plate portion 310 has an impeller chamber inlet 311 and an impeller chamber outlet 312 . The external inlet 121 communicates with the impeller accommodating chamber S3 through the inlet chamber S11 in the storage chamber S1 , the gap SG and the impeller cavity inlet 311 . The impeller accommodating chamber S3 communicates with the external outlet 122 through the impeller chamber outlet 312 and the outlet chamber S12 of the storage chamber S1 .

Please refer to FIG. 2 and FIG. 7 . FIG. 7 is a partial exploded view of FIG. 1 . The heat conduction box 600 is installed on a side of the bottom 110 of the base 100 away from the annular wall portion 120 , and the heat conduction box 600 has a heat exchange chamber S4 . The impeller accommodation chamber S3 communicates with the heat exchange chamber S4 through the storage chamber S1. In addition, referring to FIG. 5 , the first communication port 111 connecting the impeller accommodating chamber S3 and the heat exchange chamber S4 is located outside the radius of 1/2 of the impeller 700 .

The communication relationship between the above-mentioned chambers, the external inlet 121 and the external outlet 122 is that the external inlet 121 communicates with the impeller accommodation chamber S3 through the inlet chamber S11 of the storage chamber S1, and the impeller accommodation chamber S3 passes through the impeller cavity outlet 312 and The first communication port 111 communicates with the heat exchange chamber S4 , and the heat exchange chamber S4 communicates with the outlet chamber S12 of the storage chamber S1 through the second communication port 112 to communicate with the external outlet 122 . In addition, the first communication port 111 connecting the impeller accommodating chamber S3 and the heat exchange chamber S4 deviates from the rotation axis AR of the impeller 700 and is located at a tangent to the impeller accommodating chamber S3 . The impeller chamber inlet 311 is also offset from the axis of rotation AR of the impeller 700 .

In this embodiment, the liquid flow heat sink 10 may further include a baffle 500 , and the baffle 500 is stacked on the heat conduction box 600 . The baffle 500 covers at least part of the first communication port 111 . In detail, the heat conduction box 600 includes a box body 610 and a cover body 620 . The box body 610 has a heat absorbing surface 611 . The heat absorbing surface 611 is used for thermal coupling to at least one heat source (not shown). The heat source is, for example, a CPU or an image processor. In addition, the box body 610 has a plurality of heat dissipation fins 612 on a side away from the heat absorption surface 611 to improve the heat exchange efficiency between the liquid flow heat dissipation device 10 and the heat source. The cover body 620 is fixed to the box body 610 by, for example, welding, pressing or gluing to serve as a sealing cover of the heat exchange chamber S4. The box body 610 is fixed on the bottom 110 , and the cover 620 is interposed between the box body 610 and the bottom 110 . The cover 620 has a notch 621 and a first opening 622 . The baffle 500 is sandwiched between the cover 620 and the cooling fins 612 and has a second opening 510 . The second opening 510 is aligned with the first opening 622 , and the impeller accommodating chamber S3 communicates with the heat exchange chamber S4 through the first opening 622 and the second opening 510 . The baffle 500 restricts the water flow direction and the water flow range through the second opening 510 , for example. The external outlet 122 communicates with the heat exchange chamber S4 through the gap 621 . The size of the second opening 510 is smaller than the size of the first opening 622 , and the second opening 510 is misaligned with the first communication port 111 .

In this embodiment, the cover body 620 and the baffle 500 are two independent components, but it is not limited thereto. In other embodiments, the cover body and the baffle are integrally formed.

In this embodiment, the baffle 500 is located in the heat conduction box 600 , but it is not limited thereto. In other embodiments, the baffle can also be located outside the heat conducting box.

Please refer to Figure 2 again. The impeller 700 is rotatably located in the impeller accommodating chamber S3. The driving assembly 750 is located in the accommodating space S2 of the driving assembly and used to drive the impeller 700 to rotate relative to the base 100 . In addition, the convex portion 220 , the surrounding portion 230 , the deflector 300 and the impeller 700 of the cover 200 are all located in the storage chamber S1 and surrounded by the annular wall portion 120 .

Please refer to Figure 2 again. The liquid flow heat sink 10 may further include a control circuit board 800 and a cover 850 . The control circuit board 800 is fixed on the top 210 of the cover 200 , and the control circuit board 800 is electrically connected to the driving component 750 to adjust the rotation speed of the driving component 750 through the control circuit board 800 . If the control circuit board 800 is equipped with a light source and a temperature sensor, the control circuit board 800 can also perform light effect control and temperature monitoring together. The cover 850 is fixed on the base 100 and covers the cover 200 , the driving assembly 750 and part of the annular wall 120 . The cover 850 also has the function of protecting the control circuit board 800 and the driving component 750, and can also be used as a place for installing decoration and lighting effects.

In this embodiment, the liquid flow heat dissipation device 10 is equipped with a cover 850 , but it is not limited thereto. In other embodiments, the mask can also be omitted.

Please refer to FIG. 2 , FIG. 8 and FIG. 9 , and FIG. 8 is a schematic perspective view of FIG. 1 . FIG. 9 is another perspective cross-sectional schematic view of FIG. 1 .

As shown in FIG. 2 and FIG. 8 , when the liquid flow heat sink 10 is in operation, firstly, the cooling liquid flows from the external inlet 121 into the inlet chamber S11 of the storage chamber S1 along the direction A. Then, the coolant located in the inlet chamber S11 flows into the gap SG between the plate portion 310 of the deflector 300 and the bottom 110 of the base 100 along directions B, C, and D in sequence. Next, the coolant located in the gap SG flows into the impeller accommodating chamber S3 through the impeller cavity inlet 311 along the direction E. Next, the cooling liquid located in the impeller housing chamber S3 is first driven by the impeller 700 and thrown along the directions F and G to the tangent of the impeller housing chamber S3, and then flows through the impeller chamber outlet 312 and the second impeller chamber outlet 312 along the direction H in sequence. A communication port 111 .

Next, as shown in FIG. 2 and FIG. 9 , the cooling liquid passes through the first opening 622 of the cover 620 and flows into the heat exchange chamber S4 along the direction I. The flow state of the cooling liquid is controlled through the second opening 510 , so that the cooling liquid can flow into the micro-channels between the cooling fins 612 according to the requirement of heat exchange. For example, in design, the length design value, width design value or shape of the opening can be adjusted according to the temperature distribution of the heat-absorbing surface 611, so as to concentrate the coolant flow to the high temperature of the heat-absorbing surface 611, thereby improving the temperature of the heat-absorbing surface 611. heat exchange efficiency. Then, the heat exchange chamber S4 flows along the directions J, K, L, and M in sequence, and flows out from the external outlet 122 through the notch 621 of the cover 620 and the second communication port 112 .

Because the pairing is simple, only hole-to-hole is required, and there is no integration problem at the overall structural level that conventional designs face, so the liquid flow heat sink can increase the flexibility of future modification. See Figure 10. FIG. 10 is a schematic perspective view of a liquid flow heat sink according to a second embodiment of the present invention. The structure of the liquid flow heat sink 10a of this embodiment is similar to the structure of the liquid flow heat sink 10 of the above-mentioned embodiment, the only difference is that this embodiment adopts a larger size heat conduction box 600a. That is, the size of the heat conduction box 600 a is larger than that of the heat conduction box 600 . That is to say, if there is a need to replace the large-size heat conduction box 600a, the assembler can directly replace the small-size heat conduction box 600 with the large-size heat conduction box 600a.

Please refer to Figure 11 to Figure 12. FIG. 11 is a schematic perspective view of a liquid flow heat sink according to a third embodiment of the present invention. FIG. 12 is an exploded schematic view of FIG. 11 .

The liquid cooling device 10b of this embodiment is, for example, a water cooling head, which is used to thermally couple to at least one heat source (not shown), and take away the heat generated by the heat source through liquid cooling. The heat source is, for example, a CPU or an image processor. The liquid flow heat sink 10b includes a base 100b, a cover 200b, a deflector 300b, a heat conduction box 600b, an impeller 700b and a driving assembly 750b.

Please refer to FIG. 12 and FIG. 13 . FIG. 13 is a schematic three-dimensional cross-sectional view of the base in FIG. 12 . The base 100b includes a bottom 110b and an annular wall 120b. The annular wall portion 120b is, for example, integrally connected to the bottom 110b, and the bottom 110b and the annular wall portion 120b jointly surround a storage chamber S1. For example, the base 100b is a one-piece structure manufactured through injection molding.

In this embodiment, the bottom 110b has a first communication port 111b and a second communication port 112b. The first communication port 111b and the second communication port 112b communicate with the storage chamber S1. The bottom 110b may also have an annular partition structure 113b and a horizontal partition structure 114b. The annular partition structure 113b and the transverse partition structure 114b together divide the space below the storage chamber S1 into three parts, which will be described later. The annular wall portion 120b of the base 100b has an external inlet 121b and an external outlet 122b. The external inlet 121b and the external outlet 122b are respectively used to connect to pipelines (not shown) through the first faucet 20b and the second faucet 30b, and to connect to a water cooling radiator (not shown) through the pipelines. Both the external outlet 122b and the external inlet 121b are connected to the storage chamber S1, and are connected to the first communication port 111b and the second communication port 112b through the storage chamber S1. The detailed communication relationship will be described later. In addition, the annular wall portion 120b can also have a top surface 123b and an annular groove 124b. The annular groove 124b is located on the top surface 123b, and the annular groove 124b accommodates a sealing ring 150b.

Please refer to FIG. 12 and FIG. 14 . FIG. 14 is a perspective view of the cover shown in FIG. 12 . The cover 200b is mounted on the annular wall portion 120b of the base 100b to close one side of the storage chamber S1. For example, the cover 200b includes a top portion 210b, a convex portion 220b and a surrounding portion 230b. The top 210b is, for example, mounted on the annular wall portion 120b of the base 100b by screwing. The top 210b is stacked on the top surface 123b of the annular wall 120b, and the top 210b and the annular wall 120b together sandwich the sealing ring 150b to prevent the liquid in the storage chamber S1 from leaking from the gap between the top 210b and the annular wall 120b. The convex portion 220b and the surrounding portion 230b protrude from the same side of the top 210b. Specifically, both the convex portion 220b and the surrounding portion 230b protrude from the top 210b toward the bottom 110b of the base 100b. The surrounding portion 230b surrounds the convex portion 220b, and the surrounding portion 230b is separated from the convex portion 220b. The protruding portion 220b is a concave portion on a side away from the bottom portion 110b, and surrounds a driving assembly accommodating space S2. The accommodating space S2 of the driving component is not communicated with the storage chamber S1 through the barrier of the top 210b. The surrounding portion 230b has a partition protrusion 231b protruding in the radial direction.

Please refer to FIG. 12 and FIG. 15 . FIG. 15 is a schematic cross-sectional view of FIG. 11 . The partition convex portion 231b of the surrounding portion 230b of the cover 200b and at least other parts press against the annular wall portion 120b of the base 100b to divide the upper space of the storage chamber S1 into two parts. That is to say, when the top 210b is stacked on the top surface 123b of the annular wall portion 120b, the partition convex portion 231b of the surrounding portion 230b abuts against the annular wall portion 120b, so as to cooperate with the transverse partition structure 114b to partition the storage chamber S1 into one The inlet chamber S11 and an outlet chamber S12 will be described later.

Please refer to FIG. 12 and FIG. 16 . FIG. 16 is a partial exploded view of FIG. 11 . Two opposite sides of the deflector 300b are stacked on the bottom 110b of the base 100b and the surrounding portion 230b of the cover 200b respectively. For example, the deflector 300b includes a plate portion 310b and a plurality of support columns 320b. The plate portion 310b is stacked on the surrounding portion 230b, and the surrounding portion 230b, the convex portion 220b and the deflector 300b jointly surround an impeller accommodating chamber S3.

These support columns 320b protrude from the side of the plate portion 310b away from the surrounding portion 230b and abut against the bottom 110b, so that the plate portion 310b and the bottom 110b maintain a gap SG, and the plate portion 310b abuts against the annular partition structure 113b and the lateral direction Partition structure 114b. In this way, the annular partition structure 113b partitions a channel C1, and the transverse partition structure 114b divides the gap SG into two areas that are not directly connected. The inlet chamber S11 communicates with the external inlet 121b. The outlet chamber S12 communicates with the external outlet 122b, and the inlet chamber S11 and the outlet chamber S12 are not directly connected through the barriers of the annular partition structure 113b, the transverse partition structure 114b and the partition protrusion 231b. The plate portion 310b has an impeller chamber inlet 311b and an impeller chamber outlet 312b. The external inlet 121b communicates with the impeller accommodating chamber S3 through the inlet chamber S11 of the storage chamber S1, the gap SG and the impeller cavity inlet 311b. The impeller accommodating chamber S3 communicates with the first communication port 111b through the impeller cavity outlet 312b and the channel C1. In addition, referring to FIG. 5 , the projections of the first communication port 111b and the impeller chamber inlet 311b on the bottom 110b do not overlap, and the projections of the first communication port 111b and the impeller chamber outlet 312b on the bottom 110b do not overlap.

Please refer to FIG. 12 and FIG. 17 . FIG. 17 is a partial exploded view of FIG. 11 . The heat conduction box 600b is installed on a side of the bottom 110b of the base 100b away from the annular wall portion 120b, and the heat conduction box 600b has a heat exchange chamber S4. The impeller accommodation chamber S3 communicates with the heat exchange chamber S4 through the storage chamber S1.

The communication relationship between the above-mentioned chambers, the external inlet 121b and the external outlet 122b is that the external inlet 121b communicates with the impeller accommodating chamber S3 through the inlet chamber S11 of the storage chamber S1, and the impeller accommodating chamber S3 passes through the impeller cavity outlet 312b, The channel C1 and the first communication port 111b communicate with the heat exchange chamber S4. The heat exchange chamber S4 communicates with the outlet chamber S12 of the storage chamber S1 through the second communication port 112b to communicate with the external outlet 122b. In addition, the first communication port 111b connecting the impeller accommodating chamber S3 and the heat exchange chamber S4 deviates from the rotation axis AR of the impeller 700b. The impeller cavity inlet 311b is also offset from the axis of rotation AR of the impeller 700b. The outlet 312b of the impeller chamber is located at the tangent position of the impeller accommodating chamber S3.

In this embodiment, the liquid flow heat dissipation device 10b may further include a baffle 500b, and the baffle 500b is stacked on the heat conduction box 600b. The baffle 500b covers at least part of the first communication port 111b. In detail, the heat conduction box 600b includes a box body 610b and a cover body 620b. The box body 610b has a heat absorbing surface 611b. The heat absorbing surface 611b is used for thermal coupling to at least one heat source. The heat source is, for example, a CPU or an image processor. In addition, the box body 610b has a plurality of heat dissipation fins 612b on a side away from the heat absorption surface 611b, so as to improve the heat exchange efficiency between the liquid flow heat dissipation device 10b and the heat source. The cover body 620b is fixed to the box body 610b by, for example, welding, pressing or gluing to serve as a sealing cover of the heat exchange chamber S4. The box body 610b is fixed on the bottom 110b, and the cover 620b is interposed between the box body 610b and the bottom 110b. The cover 620b has a first opening 621b and a second opening 622b. The baffle 500b is interposed between the cover 620b and the cooling fins 612b and has a third opening 510b. The third opening 510b is aligned with the second opening 622b, and the impeller accommodating chamber S3 communicates with the heat exchange chamber S4 through the second opening 622b and the third opening 510b. The baffle 500b restricts the water flow direction and the water flow range, for example, through the third opening 510b. The external outlet 122b communicates with the heat exchange chamber S4 through the second opening 622b.

In this embodiment, the cover body 620b and the baffle 500b are two independent components, but it is not limited thereto. In other embodiments, the cover body and the baffle are integrally formed.

In this embodiment, the baffle 500b is located in the heat conduction box 600b, but not limited thereto. In other embodiments, the baffle can also be located outside the heat conducting box.

In this embodiment, the liquid flow heat sink 10b may further include a sealing member 650b. The sealing member 650b includes an outer sealing ring 651b, a first inner sealing ring 652b and a second inner sealing ring 653b. The first inner sealing ring 652b is connected to the second inner sealing ring 653b, and connected to the outer sealing ring 651b. The sealing member 650b is installed on the bottom 110b of the base 100b on a side facing away from the storage chamber S1. The first inner sealing ring 652b surrounds the first communication port 111b to prevent the fluid flowing from the first communication port 111b to the first opening 621b from leaking out. The second inner sealing ring 653b surrounds the second communication port 112b to prevent the fluid flowing from the second opening 622b to the second communication port 112b from leaking out.

In this embodiment, the outer sealing ring 651b, the first inner sealing ring 652b and the second inner sealing ring 653b are connected to each other, but it is not limited thereto. In other embodiments, the outer sealing ring, the first inner sealing ring and the second inner sealing ring may also be three independent components.

Please refer to Figure 12 and Figure 15 again. The impeller 700b is rotatably located in the impeller accommodating chamber S3. The driving assembly 750b is located in the accommodating space S2 of the driving assembly, and is used to drive the impeller 700b to rotate relative to the base 100b. In addition, the convex portion 220b, surrounding portion 230b, deflector 300b and impeller 700b of the cover 200b are all located in the storage chamber S1 and surrounded by the annular wall portion 120b.

Please refer to Figure 12 again. The liquid flow heat sink 10b may further include a control circuit board 800b and a cover 850b. The control circuit board 800b is fixed on the top 210b of the cover 200b, and the control circuit board 800b is electrically connected to the driving component 750b to adjust the rotation speed of the driving component 750b through the control circuit board 800b. If the control circuit board 800b is equipped with a light source and a temperature sensor, the control circuit board 800b can also perform light effect control and temperature monitoring together. The cover 850b is fixed on the base 100b and covers the cover 200b, the driving assembly 750b and part of the annular wall 120b. The cover 850b also has the function of protecting the control circuit board 800b and the driving component 750b, and can also be used as a place for decoration and lighting effects.

In this embodiment, the liquid flow heat sink 10b is equipped with a cover 850b, but it is not limited thereto. In other embodiments, the mask can also be omitted. In addition, in this embodiment, the cover 850b is, for example but not limited to, an integrally formed part or an assembly made of a plurality of components.

Please refer to FIG. 12 , FIG. 18 and FIG. 19 . FIG. 18 is a schematic perspective view of FIG. 11 . FIG. 19 is another perspective cross-sectional schematic view of FIG. 11 .

As shown in FIG. 12 and FIG. 18 , when the liquid flow heat sink 10 b is in operation, firstly, the cooling liquid flows from the external inlet 121 b into the inlet chamber S11 of the storage chamber S1 along the direction F1 . Then, the coolant located in the inlet chamber S11 flows into the gap SG between the plate portion 310b of the deflector 300b and the bottom 110b of the base 100b along the directions F2, F3, and F4 in sequence. Then, the coolant located in the gap SG flows into the impeller accommodating chamber S3 through the impeller cavity inlet 311b along the direction F5. Next, the coolant in the impeller housing chamber S3 is first driven by the impeller 700b and thrown along the direction F6 to the tangent of the impeller housing chamber S3, and then flows through the impeller housing chambers along the directions F7 and F8 in sequence. The outlet 312b of the impeller cavity, the channel C1 and the first communication port 111b at the tangential position of the outer periphery of S3.

Next, as shown in FIG. 12 , FIG. 18 and FIG. 19 , the cooling liquid flows into the heat exchange chamber S4 through the second opening 622 b and the third opening 510 b of the cover 620 b in sequence along the direction F9 . The flow state of the cooling liquid is controlled through the third opening 510b, so that the cooling liquid can flow into the micro-channels between the cooling fins 612b according to the requirement of heat exchange. For example, in the design, the length design value, width design value or shape of the opening can be adjusted according to the temperature distribution of the heat absorption surface 611b, so as to concentrate the cooling liquid to flow to the high temperature of the heat absorption surface 611b, thereby improving the temperature of the heat absorption surface 611b. heat exchange efficiency. Then, the heat exchange chamber S4 flows along the directions F10, F11, F12, F13, F14 in sequence, and flows out from the external outlet 122b through the second opening 622b of the cover 620b and the second communication port 112b.

See Figure 20. Fig. 20 is an exploded schematic view of the base and the sealing element according to the fourth embodiment of the present invention. The sealing member 650c of this embodiment is used to replace the sealing member 650b of the above-mentioned embodiment, and its connection relationship and positional relationship with the base 100b and the heat conduction box 600b are similar, so details are not repeated here. In the following, only the base 100c and the sealing member 650c will be described. The base 100c includes a bottom 110c and an annular wall 120c. The bottom 110c has a first communication port 111c and a second communication port 112c. The annular wall portion 120c has an external inlet 121c and an external outlet 122c. The external inlet 121c and the external outlet 122c are directly or indirectly connected to the first communication port 111c and the second communication port 112c. The sealing member 650c is, for example, in the shape of a sheet, and has a first through hole 651c and a second through hole 652c. The first through hole 651c is aligned with the first communication port 111c and the first opening 621b of the heat conduction box 600b (as shown in FIG. 17 ), and the size of the first through hole 651c matches the size of the first opening 621b to avoid the second The fluid communicated between a communication port 111c and the first opening 621b leaks out. The second through hole 652c is aligned with the second communication port 112c and the second opening 622b of the heat conduction box 600b (as shown in FIG. 17 ), and the size of the second through hole 652c matches the size of the second opening 622b to avoid the second opening 622b. The fluid communicated between the second communication port 112c and the second opening 622b leaks out.

According to the liquid flow heat dissipation device of the above-mentioned embodiment, since the annular wall portion and the bottom of the base are integrally formed in a bowl-shaped structure, the convex portion and surrounding portion of the cover, the deflector and the impeller are all placed in the bowl-shaped The assembly procedure among the base, the cover and the deflector can be simplified by being inside the base, thereby reducing the difficulty of assembling the liquid flow heat sink.

In addition, since the annular wall and the bottom of the base are integrally formed in a bowl shape, and most of the bottom of the storage chamber is closed by the bottom, only a small part is designed with the first communication port and the heat exchange chamber. The second connection port. Therefore, if the original heat conduction box of the liquid flow heat sink needs to be refitted into a larger size heat conduction box, the pairing is simple, only hole-to-hole is required, and there is no integration problem at the overall structural level faced by conventional designs, so it can be used The liquid flow cooling device increases the flexibility of future modification. On the contrary, the base of the conventional design mostly adopts the cover-type design, and the heat-conducting plate is an open design, and the two together form a complete airtight cavity. Once the size or shape of the heat conduction plate is changed, the base cannot form a closed cavity with the heat conduction plate, resulting in a problem that must be redesigned.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

10, 10a, 10b: liquid flow cooling device 20b: The first nozzle 30b: Second faucet 100, 100b, 100c: base 110, 110b, 110c: bottom 111, 111b, 111c: the first communication port 112, 112b, 112c: the second communication port 113: Horizontal partition structure 113b: Ring partition structure 114b: Horizontal partition structure 120, 120b: ring wall 121, 121b, 121c: external entrance 122, 122b, 122c: external connection outlet 123, 123b: top surface 124, 124b: annular groove 125: Separate convex part 150, 150b: sealing ring 200, 200b: cover 210, 210b: top 220, 220b: convex part 230, 230b: Perimeter 231b: Partition convex part 300, 300b: deflector 310, 310b: plate part 311, 311b: impeller cavity inlet 312, 312b: the outlet of the impeller cavity 320, 320b: support columns 500, 500b: Baffles 510: second opening 510b: third opening 600, 600a, 600b: thermal conduction box 610, 610b: box body 611, 611b: heat absorbing surface 612, 612b: cooling fins 620, 620b: cover body 621: Gap 622: first opening 621b: first opening 622b: second opening 650b: Seals 651b: Outer sealing ring 652b: The first inner sealing ring 653b: Second inner sealing ring 650c: Seals 651c: the first through hole 652c: second through hole 700, 700b: impeller 750, 750b: drive components 800, 800b: control circuit board 850, 850b: mask A~M: direction AR: axis of rotation S1: storage compartment S11: Entrance chamber S12: Exit chamber S2: Accommodating space for drive components S3: impeller housing chamber S4: heat exchange chamber SG: Gap C1: channel F1~14: direction

FIG. 1 is a schematic perspective view of a liquid flow heat sink according to a first embodiment of the present invention. FIG. 2 is an exploded schematic diagram of FIG. 1 . FIG. 3 is a schematic three-dimensional cross-sectional view of the base of FIG. 2 . FIG. 4 is a schematic perspective view of the cover shown in FIG. 2 . FIG. 5 is a schematic cross-sectional view of FIG. 1 . FIG. 6 is a partially exploded schematic diagram of FIG. 1 . FIG. 7 is a partially exploded schematic diagram of FIG. 1 . FIG. 8 is a schematic three-dimensional cross-sectional view of FIG. 1 . FIG. 9 is another perspective cross-sectional schematic view of FIG. 1 . FIG. 10 is a schematic perspective view of a liquid flow heat sink according to a second embodiment of the present invention. FIG. 11 is a schematic perspective view of a liquid flow heat sink according to a third embodiment of the present invention. FIG. 12 is an exploded schematic view of FIG. 11 . FIG. 13 is a schematic three-dimensional cross-sectional view of the base of FIG. 12 . FIG. 14 is a schematic perspective view of the cover shown in FIG. 12 . FIG. 15 is a schematic cross-sectional view of FIG. 11 . FIG. 16 is a partially exploded schematic view of FIG. 11 . FIG. 17 is a partially exploded schematic diagram of FIG. 11 . FIG. 18 is a schematic three-dimensional cross-sectional view of FIG. 11 . FIG. 19 is another perspective cross-sectional schematic view of FIG. 11 . Fig. 20 is an exploded schematic view of the base and the sealing element according to the fourth embodiment of the present invention.

10: Liquid flow cooling device

100: base

110: bottom

113: Horizontal partition structure

120: ring wall

121: external entrance

122:External connection outlet

123: top surface

124: Ring groove

125: Separate convex part

150: sealing ring

200: capping

210: top

220: convex part

230: Waibu

300: deflector

310: Board

311:Impeller cavity inlet

312: Impeller cavity outlet

320: support column

500: Baffle

510: second opening

600: heat conduction box

610: box body

611: heat absorbing surface

612: cooling fins

620: cover body

621: Gap

622: first opening

700: impeller

750: drive components

800: Control circuit board

850: mask

AR: axis of rotation

S1: storage compartment

S2: Accommodating space for drive components

Claims (27)

A liquid flow heat dissipation device, comprising: a base, the base includes a bottom and an annular wall, the annular wall is connected to the bottom, and the bottom and the annular wall jointly surround a storage chamber; Cover, the cover includes a top, a convex part and a surrounding part, the top is installed on the annular wall part, the convex part and the surrounding part protrude from the same side of the top, and the surrounding part will protrude The protruding part is surrounded by a driving assembly accommodating space on the side away from the bottom, and the accommodating space of the driving assembly is not connected with the storage chamber; a deflector, the opposite two sides of the deflector The sides are respectively stacked on the base and the surrounding part, and the surrounding part, the convex part and the deflector jointly surround an impeller accommodating chamber; a heat conduction box is installed on the bottom of the base away from the annular wall One side of the part, and the heat conduction box has a heat exchange chamber, the impeller accommodation chamber is communicated with the heat exchange chamber through the storage chamber; an impeller is rotatably located in the impeller accommodation chamber; and A driving assembly is located in the accommodating space of the driving assembly, and is used to drive the impeller to rotate relative to the base; wherein, the bottom and the annular wall are integrally formed, and the convex portion of the cover, the surrounding portion, and the guide The flow plate and the impeller are located in the storage chamber and surrounded by the annular wall; wherein, the annular wall of the base has an external outlet and an external inlet, and the bottom has a first communication port and a the second communication port, the external access port communicates with the impeller accommodation chamber through the storage chamber, and the impeller accommodation chamber communicates with the heat exchange chamber through the first communication port, The heat exchange chamber communicates with the external outlet through the second communication port, and the first communication port connecting the impeller accommodating chamber and the heat exchange chamber deviates from the rotation axis of the impeller. The liquid flow heat dissipation device according to claim 1, wherein the first communication port connecting the impeller accommodating chamber and the heat exchange chamber is located outside the radius of 1/2 of the impeller. The liquid flow heat dissipation device as described in Claim 1, wherein the deflector comprises a plate portion and a plurality of support columns, the plate portion is stacked on the surrounding portion, and the support columns protrude from the plate portion away from the One side of the surrounding portion leans against the bottom so that a gap is maintained between the plate portion and the bottom, and the external inlet communicates with the impeller accommodating chamber through the gap. The liquid flow heat dissipation device as described in Claim 3, wherein the plate part has an impeller chamber inlet and an impeller chamber outlet, the gap communicates with the impeller housing chamber through the impeller chamber inlet, and the impeller housing chamber passes through The outlet of the impeller chamber and the first communication port communicate with the heat exchange chamber. The liquid flow heat dissipation device as described in claim 1 further includes a cover, the cover is fixed on the base, and covers the cover, the driving component and part of the annular wall. The liquid flow heat dissipation device as described in claim 1 further includes a control circuit board fixed on the top of the cover and electrically connected to the driving component. The liquid flow heat dissipation device according to claim 1 further comprises at least one baffle, which is stacked on the heat conduction box, and at least partially covers the first communication port. The liquid flow heat dissipation device as described in claim 7, wherein the heat conduction box includes a box body and a cover body, the cover body is fixed on the box body, the box body is fixed on the bottom, and the cover body is placed between the Between the box body and the bottom, the box body has a plurality of heat dissipation fins, the cover body has a gap and a first opening, and the at least one baffle is interposed between the cover body and the heat dissipation fins and has a second The second opening is aligned with the first opening, and the impeller accommodating chamber communicates with the heat exchange chamber through the first opening and the second opening, and the external outlet communicates with the heat exchange chamber through the gap. The liquid flow heat sink according to claim 8, wherein the size of the second opening is smaller than that of the first opening, and the second opening is misaligned with the first communication port. The liquid flow heat dissipation device according to claim 8, wherein the cover and the at least one baffle are two independent components. The liquid flow heat dissipation device according to claim 8, wherein the cover body and the at least one baffle member are integrally formed. The liquid flow heat dissipation device as described in Claim 1, wherein the bottom further has a transverse partition structure, the annular wall part further has at least one partition protrusion, and the surrounding part is at least partially pressed against the at least one part of the annular wall part. a partition convex part, and the deflector abuts against the transverse partition structure to divide the storage chamber into an inlet chamber and an outlet chamber which are not connected, and the external inlet communicates with the impeller through the inlet chamber The accommodating chamber, the external outlet communicates with the heat exchange chamber through the outlet chamber. A liquid flow heat dissipation device, comprising: a base with a storage chamber; a cover, the cover is installed on the base; a heat conduction box, including a box body and a cover, the cover covers the A box body, so that the box body and the cover body jointly surround a heat exchange chamber, the heat conduction box is installed on the side of the bottom of the base away from the annular wall portion, and the cover body has at least one opening, and communicate with the storage chamber through the at least one opening; a seal, the size of which matches the size of the at least one opening, the seal is interposed between the cover and the base, and surrounds the at least one opening; an impeller is rotatably located the storage chamber; and a driving assembly, installed on the cover and outside the storage chamber, and used to drive the impeller to rotate relative to the base. The liquid flow heat dissipation device according to claim 13, wherein the sealing member includes an outer sealing ring, a first inner sealing ring and a second inner sealing ring, the first inner sealing ring and the second inner sealing ring Connected inside the outer sealing ring, the at least one opening includes a first opening and a second opening, and the dimensions of the first inner sealing ring and the second inner sealing ring match the first opening and the second inner sealing ring respectively. The size of the opening, and surround the first opening and the second opening respectively. The liquid flow heat dissipation device according to claim 13, wherein the sealing member has a first through hole and a second through hole, the at least one opening includes a first opening and a second opening, and the first through hole The size of the second through hole is respectively matched with the size of the first opening and the second opening, and the first opening and the second opening are respectively surrounded. A liquid flow heat dissipation device, comprising: a base, the base includes a bottom and an annular wall, the annular wall is connected to the bottom, and the bottom and the annular wall jointly surround a storage chamber; Cover, the cover includes a top, a convex part and a surrounding part, the top is installed on the annular wall part, the convex part and the surrounding part protrude from the same side of the top, and the surrounding part will protrude Surrounded by the inner part, the raised part surrounds a drive assembly accommodating space on a side away from the bottom, and the drive assembly accommodating space is not connected to the storage chamber; A deflector, the opposite sides of the deflector are respectively stacked on the base and the surrounding part, the surrounding part, the convex part and the deflector jointly surround an impeller accommodating chamber; a heat conduction box, installed on the bottom of the base away from the side of the annular wall, and the heat conduction box has a heat exchange chamber, the impeller accommodating chamber communicates with the heat exchange chamber through the storage chamber; an impeller, rotatably located in the impeller accommodating chamber; and a driving assembly located in the accommodating space of the driving assembly and used to drive the impeller to rotate relative to the base; wherein the bottom and the annular wall are integrally formed, and the sealing The convex part of the cover and the surrounding part, the deflector and the impeller are all located in the storage chamber and surrounded by the annular wall; wherein, the annular wall of the base has an external outlet and an external inlet , the bottom has a first communication port and a second communication port, the deflector has an impeller chamber inlet and an impeller chamber outlet communicating with the impeller chamber, and the external inlet communicates with the impeller chamber through the storage chamber The inlet of the impeller chamber, the outlet of the impeller chamber communicates with the heat exchange chamber through the first communication port, and the heat exchange chamber communicates with the external outlet through the second communication port, the first communication port and the inlet of the impeller chamber The bottom projections do not overlap. The liquid flow heat dissipation device according to claim 16, wherein the projection of the first communicating port and the outlet of the impeller cavity on the bottom does not overlap. The liquid flow heat dissipation device according to claim 16, wherein the deflector includes a plate portion and a plurality of support columns, the plate portion is stacked on the surrounding portion, and the support columns protrude from the plate portion away from the one side of the surrounding portion and abut against the bottom so that a gap is maintained between the plate portion and the bottom, the The gap communicates with the external inlet, and communicates with the impeller accommodating chamber through the impeller chamber inlet, and the impeller accommodating chamber communicates with the heat exchange chamber through the impeller chamber outlet and the first communication port. The liquid flow heat dissipation device as described in Claim 18, wherein the bottom has an annular partition structure, and the annular partition structure surrounds a channel, one end of the channel communicates with the first communication port, and the other end of the channel communicates with the The outlet of the impeller chamber. The liquid flow heat dissipation device according to claim 16 further includes a cover, which is fixed on the base and covers the cover, the driving component and part of the annular wall. The liquid flow heat dissipation device according to claim 16 further comprises a control circuit board fixed on the top of the cover and electrically connected to the driving component. The liquid flow heat dissipation device as described in claim 16, further comprising at least one baffle, the at least one baffle is stacked on the heat conduction box, the heat conduction box includes a box body and a cover, and the cover is fixed In the box body, the box body is fixed on the bottom so that the cover is interposed between the box body and the bottom, the box body has a plurality of cooling fins, the cover body has a first opening and a second Opening, the at least one baffle is interposed between the cover and the cooling fins and has a third opening, the third opening is aligned with the first opening, and the impeller accommodating chamber passes through the first opening An opening communicates with the heat exchange chamber with the third opening, and the external outlet communicates with the heat exchange chamber through the second opening. The liquid flow heat dissipation device according to claim 22, wherein the sealing member includes an outer sealing ring, a first inner sealing ring and a second inner sealing ring, the first inner sealing ring and the second inner sealing ring Connected inside the outer sealing ring, the size of the first inner sealing ring and the second inner sealing ring are respectively matched with the size of the first opening and the second opening, and the first opening and the second opening are respectively The opening surrounds the inside. The liquid flow heat dissipation device according to claim 22, wherein the sealing member has a first through hole and a second through hole, and the sizes of the first through hole and the second through hole are respectively matched to the first opening and the size of the second opening, and surround the first opening and the second opening respectively. The liquid flow heat dissipation device according to claim 22, wherein the cover and the at least one baffle are two independent components. The liquid flow heat dissipation device according to claim 22, wherein the cover body and the at least one baffle member are integrally formed. The liquid flow heat dissipation device according to claim 16, wherein the bottom further has a horizontal partition structure, and the surrounding portion of the cover further has at least one partition convex portion, and the partition convex portion presses against the annular wall portion, And the deflector is against the transverse partition structure to divide the storage chamber into an inlet chamber and an outlet chamber which are not connected, and the external inlet is connected to the impeller accommodation chamber through the inlet chamber, The external outlet communicates with the heat exchange chamber through the outlet chamber.

Images