CN216817340U

CN216817340U - Liquid flow type heat dissipation device

Info

Publication number: CN216817340U
Application number: CN202123159712.2U
Authority: CN
Inventors: 蔡水发; 林宗伟
Original assignee: Cooler Master Co Ltd
Current assignee: Cooler Master Co Ltd
Priority date: 2021-05-12
Filing date: 2021-12-15
Publication date: 2022-06-24
Anticipated expiration: 2031-12-15
Also published as: TW202244449A; TWI794811B; CN121165907A; CN115344100B; CN115344100A

Abstract

The utility model discloses a liquid flow heat dissipation device, which comprises a base, a cover, a heat conduction box, an impeller and a driving component. The base includes a bottom and an annular wall. The annular wall portion is integrally connected to the bottom portion, and the bottom portion and the annular wall portion together surround a storage chamber. The cover is installed on the annular wall portion. The heat-conducting box is installed on a side of the bottom of the base away from the annular wall, and the heat-conducting box surrounds a heat exchange chamber. The heat exchange chamber communicates with the storage chamber. The impeller is rotatably located in the storage chamber. The driving component is installed on the cover and located outside the storage chamber, and is used for driving the impeller to rotate relative to the base. Wherein, the impeller is located in the storage chamber and is surrounded by the annular wall.

Description

Liquid flow type heat dissipation device

Technical Field

The present invention relates to a heat dissipation device, and more particularly to a fluid-type heat dissipation device.

Background

When the computer is running, the heat source inside the computer, such as the CPU, will generate heat due to the high-speed operation. Therefore, a cooling device must be installed in the computer to quickly and efficiently remove the heat generated from the heat source and maintain the temperature of the heat source within the design range specified by the manufacturer. The cooling device is generally classified into an air cooling type and a liquid cooling type. The air cooling device is to install heat dissipation fins on the heat source and install a fan on the computer, so as to take away the heat generated by the heat source through the airflow generated by the fan. However, the fan generates noise during operation, and it is difficult to cool a heat source having a high heat value, such as a processor of a sports computer. Therefore, the computers for sports generally adopt liquid cooling. The liquid cooling type cooling device is characterized in that a water cooling head and a water cooling bar are arranged on a computer, the water cooling head is in thermal contact with a heat source and is connected with the water cooling bar through a flow pipe. The water cooling head is internally provided with a pump, the cooling liquid capable of absorbing heat can be driven to flow from the water cooling head to the water cooling bar through the driving of the pump, and the cooling liquid flows back to the water cooling head from the water cooling bar after being radiated.

However, the number of the shell parts of the existing water cooling head is large, so the assembly efficiency is poor, and the waterproof design is difficult to complete. For example, if a water cooling head designed to be applied to a single heat source is modified to be applied to a water cooling head with multiple heat sources, the water cooling head may lose the waterproof effect after modification due to the difficulty in reinforcing the waterproof performance after structural modification, thereby causing leakage of the water cooling fluid.

SUMMERY OF THE UTILITY MODEL

The utility model provides a liquid flow type heat dissipation device, which is used for improving the assembly efficiency of a water cooling head and increasing the flexibility of the water cooling head for later modification.

The liquid flow heat dissipation device disclosed in an embodiment of the present invention includes a base, a cover, a baffle, a heat conduction box, an impeller, and a driving assembly. The base comprises a bottom and an annular wall. The annular wall portion is connected to the bottom portion, and the bottom portion and the annular wall portion surround a storage chamber together. The sealing cover comprises a top part, a convex part and a surrounding part. The top is arranged on the annular wall part. The convex part and the surrounding part protrude out of the same side of the top part, and the surrounding part surrounds the convex part inside. The convex part is surrounded with a driving component accommodating space at one side far away from the bottom part. The accommodating space of the driving assembly is not communicated with the storage chamber. The opposite two sides of the guide plate are respectively overlapped on the base and the surrounding part. The surrounding part, the convex part and the guide plate surround an impeller accommodating chamber together. The heat conduction box is arranged on one side of the bottom of the base, which is far away from the annular wall part, and the heat conduction box is provided with a heat exchange cavity. The impeller accommodating chamber is communicated with the heat exchange chamber through the storage chamber. The impeller is rotatably arranged in the impeller accommodating chamber. The driving component is positioned in the driving component accommodating space and used for driving the impeller to rotate relative to the base. The bottom and the annular wall are integrally formed, and the convex part and the surrounding part of the sealing cover, the guide plate and the impeller are all positioned in the storage chamber and surrounded by the annular wall. Wherein, the annular wall portion of base has an external export and an external entry, and the bottom has a first intercommunication mouth and a second intercommunication mouth. The external inlet is communicated with the impeller accommodating chamber through the storage chamber. The impeller accommodating chamber is communicated with the heat exchange chamber through the first communication port. The heat exchange chamber is communicated with the external outlet through a second communication port. The first communication port communicating the impeller accommodation chamber with the heat exchange chamber is offset from the rotational axis of the impeller.

In the above fluid-flow heat sink, the first communication port communicating the impeller accommodating chamber and the heat exchange chamber is located outside the 1/2 radius of the impeller.

In the above-mentioned liquid flow heat dissipation device, the flow guiding plate includes a plate portion and a plurality of supporting pillars, the plate portion is stacked on the surrounding portion, the supporting pillars protrude from one side of the plate portion away from the surrounding portion and abut against the bottom portion, so that a gap is maintained between the plate portion and the bottom portion, and the external inlet communicates with the impeller accommodating chamber through the gap.

In the above-mentioned liquid flow heat sink, the plate portion has an impeller cavity inlet and an impeller cavity outlet, the gap is communicated with the impeller accommodation chamber through the impeller cavity inlet, and the impeller accommodation chamber is communicated with the heat exchange chamber through the impeller cavity outlet and the first communication port.

The above-mentioned liquid flow heat sink further includes a shield fixed to the base and covering the cover, the driving assembly and a portion of the annular wall.

The liquid flow heat sink further includes a control circuit board fixed on the top of the cover and electrically connected to the driving assembly.

The above-mentioned liquid flow heat sink further includes at least one flow blocking member, the at least one flow blocking member is stacked on the heat conductive box, and the at least one flow blocking member covers at least a portion of the first communication hole.

The liquid flow heat sink includes a case and a cover, the cover is fixed to the case, the case is fixed to the bottom, the cover is disposed between the case and the bottom, the case has a plurality of heat dissipation fins, the cover has a notch and a first opening, the at least one flow blocking member is disposed between the cover and the heat dissipation fins and has a second opening, the second opening is aligned with the first opening, the impeller accommodation chamber is communicated with the heat exchange chamber through the first opening and the second opening, and the external outlet is communicated with the heat exchange chamber through the notch.

In the above-mentioned flow heat sink, the size of the second opening is smaller than the size of the first opening, and the second opening is dislocated from the first communication port.

In the above-mentioned flow heat sink, the cover and the at least one flow blocking member are two independent members.

In the above-mentioned liquid flow heat sink, the cover and the at least one flow blocking member are integrally formed.

The liquid flow heat sink comprises a bottom, an annular wall, a surrounding part, a guide plate and a heat exchange cavity, wherein the bottom is provided with a transverse partition structure, the annular wall is provided with at least one partition convex part, at least part of the surrounding part is pressed against the at least one partition convex part of the annular wall, the guide plate is pressed against the transverse partition structure so as to divide the storage cavity into an inlet cavity and an outlet cavity which are not communicated, the external inlet is communicated with the impeller accommodating cavity through the inlet cavity, and the external outlet is communicated with the heat exchange cavity through the outlet cavity.

In another embodiment of the present invention, a liquid-flow heat dissipation device includes a base, a cover, a heat conduction box, an impeller, and a driving assembly. The base comprises a bottom and an annular wall. The annular wall portion is integrally connected to the bottom portion, and the bottom portion and the annular wall portion jointly surround a storage chamber. The closing cap is installed in annular wall portion. The heat conduction box is arranged on one side of the bottom of the base, which is far away from the annular wall part, and the heat conduction box surrounds a heat exchange cavity. The heat exchange chamber is communicated with the storage chamber. The impeller is rotatably located in the storage chamber. The driving assembly is arranged on the sealing cover, is positioned outside the storage chamber and is used for driving the impeller to rotate relative to the base. Wherein, the impeller is positioned in the storage chamber and surrounded by the annular wall part.

In another embodiment of the present invention, a liquid-flow heat dissipation device includes a base, a cover, a heat conduction box, a sealing member, an impeller, and a driving assembly. The base has a storage chamber. The closing cap is installed in the base. The heat conduction box comprises a box body and a cover body. The cover body covers the box body, so that the box body and the cover body jointly surround a heat exchange cavity. The heat conduction box is arranged on one side of the bottom of the base, which is far away from the annular wall part, and the cover body is provided with at least one opening and is communicated with the storage cavity through the at least one opening. The size of the seal is matched to the size of the at least one opening. The sealing element is clamped between the cover body and the base and surrounds at least one opening. The impeller is rotatably located in the storage chamber. The driving assembly is arranged on the sealing cover, is positioned outside the storage chamber and is used for driving the impeller to rotate relative to the base.

The above-mentioned liquid flow heat sink device, wherein the sealing element includes an outer sealing ring, a first inner sealing ring and a second inner sealing ring, the first inner sealing ring and the second inner sealing ring are connected inside the outer sealing ring, the at least one opening includes a first opening and a second opening, the sizes of the first inner sealing ring and the second inner sealing ring are respectively matched with the sizes of the first opening and the second opening, and the first opening and the second opening are respectively surrounded inside.

The liquid flow heat sink device, wherein the sealing member has a first through hole and a second through hole, the at least one opening includes a first opening and a second opening, and the first through hole and the second through hole have sizes respectively matching the sizes of the first opening and the second opening and respectively surround the first opening and the second opening.

In another embodiment of the present invention, a liquid-flow heat dissipation device includes a base, a cover, a baffle, a heat conduction box, an impeller, and a driving assembly. The base comprises a bottom and an annular wall. The annular wall portion is connected to the bottom portion, and the bottom portion and the annular wall portion surround a storage chamber together. The sealing cover comprises a top part, a convex part and a surrounding part. The top is arranged on the annular wall part. The convex part and the surrounding part protrude out of the same side of the top part, and the surrounding part surrounds the convex part inside. The convex part is surrounded with a driving component accommodating space at one side far away from the bottom part. The accommodating space of the driving assembly is not communicated with the storage chamber. The opposite two sides of the guide plate are respectively overlapped on the base and the surrounding part. The surrounding part, the convex part and the guide plate surround an impeller accommodating chamber together. The heat conduction box is arranged on one side of the bottom of the base, which is far away from the annular wall part, and the heat conduction box is provided with a heat exchange cavity. The impeller accommodating chamber is communicated with the heat exchange chamber through the storage chamber. The impeller is rotatably arranged in the impeller accommodating chamber. The driving component is positioned in the driving component accommodating space and used for driving the impeller to rotate relative to the base. The bottom and the annular wall are integrally formed, and the convex part and the surrounding part of the sealing cover, the guide plate and the impeller are all positioned in the storage chamber and surrounded by the annular wall. Wherein, the annular wall part of the base is provided with an external outlet and an external inlet. The bottom part is provided with a first communicating port and a second communicating port. The guide plate is provided with an impeller cavity inlet and an impeller cavity outlet which are communicated with the impeller accommodating cavity. The external inlet is communicated with the inlet of the impeller cavity through the storage chamber. The outlet of the impeller cavity is communicated with the heat exchange cavity through the first communication port. The heat exchange chamber is communicated with the external outlet through a second communication port. The first communication port is not overlapped with the projection of the impeller cavity inlet at the bottom.

The liquid flow heat sink has a first communication port, wherein a projection of the first communication port and the impeller chamber outlet on the bottom does not overlap.

The flow guiding plate includes a plate portion and a plurality of supporting pillars, the plate portion is stacked on the surrounding portion, the supporting pillars protrude from one side of the plate portion away from the surrounding portion and abut against the bottom portion, so that a gap is maintained between the plate portion and the bottom portion, the gap is communicated with the external inlet and communicated with the impeller accommodating chamber through the impeller cavity inlet, and the impeller accommodating chamber is communicated with the heat exchange chamber through the impeller cavity outlet and the first communicating opening.

The liquid flow heat sink has an annular partition structure surrounding a channel, one end of the channel is connected to the first connection port, and the other end of the channel is connected to the outlet of the impeller cavity.

The above-mentioned liquid flow heat dissipation device further includes at least one flow blocking member, the at least one flow blocking member is stacked on the heat conduction box, the heat conduction box includes a box body and a cover body, the cover body is fixed on the box body, the box body is fixed on the bottom, the cover body is disposed between the box body and the bottom, the box body has a plurality of heat dissipation fins, the cover body has a first opening and a second opening, the at least one flow blocking member is clamped between the cover body and the heat dissipation fins and has a third opening, the third opening is aligned with the first opening, the impeller accommodation chamber communicates with the heat exchange chamber through the first opening and the third opening, and the external outlet communicates with the heat exchange chamber through the second opening.

The liquid flow heat sink includes an outer sealing ring, a first inner sealing ring and a second inner sealing ring, the first inner sealing ring and the second inner sealing ring are connected inside the outer sealing ring, and the sizes of the first inner sealing ring and the second inner sealing ring are respectively matched with the sizes of the first opening and the second opening and respectively surround the first opening and the second opening.

In the above-mentioned flow heat sink, the sealing member has a first through hole and a second through hole, and the sizes of the first through hole and the second through hole are respectively matched with the sizes of the first opening and the second opening, and the first opening and the second opening are respectively surrounded therein.

In the above fluid flow heat sink, the cover and the at least one flow blocking member are integrally formed.

The liquid flow type heat sink comprises a bottom, a sealing cover, a plurality of annular walls, a flow guide plate, an impeller accommodating chamber, a heat exchange chamber and an external inlet, wherein the bottom is provided with a transverse separation structure, the surrounding part of the sealing cover is provided with at least one separation convex part, the separation convex part is pressed against the annular walls, the flow guide plate is pressed against the transverse separation structure so as to divide the accommodating chamber into an inlet chamber and an outlet chamber which are not communicated, the external inlet is communicated with the impeller accommodating chamber through the inlet chamber, and the external outlet is communicated with the heat exchange chamber through the outlet chamber.

According to the liquid flow heat dissipation device of the embodiment, the annular wall part and the bottom part of the base are of an integrally formed structure and are bowl-shaped, so that the convex part and the surrounding part of the sealing cover, the flow guide plate and the impeller are all placed in the bowl-shaped base, the assembly procedure among the base, the sealing cover and the flow guide plate can be simplified, and the assembly difficulty of the liquid flow heat dissipation device is further reduced.

In addition, because the annular wall part and the bottom of the base are of an integrally formed structure and are bowl-shaped, most of the lower part of the storage chamber is sealed by the bottom, and only a small part of the annular wall part and the bottom of the storage chamber are provided with the first communicating port and the second communicating port which are communicated with the heat exchange chamber. Therefore, if the original heat conduction box of the fluid flow type heat dissipation device needs to be modified into a heat conduction box with a larger size, only hole holes are needed because of the simple matching, and the combination problem of the whole structure level faced by the prior art design is avoided. That is, the liquid-flow heat sink increases the flexibility of future modification. On the contrary, the base designed by the prior art mostly adopts an outer cover type design, and the heat conducting plate is in an open type design, and the base and the heat conducting plate form a complete closed cavity together. Once the size or shape of the heat conducting plate is changed, the base and the heat conducting plate cannot form a closed cavity, so that the problem of redesign is caused.

The foregoing description of the present disclosure and the following description of the embodiments are provided to illustrate and explain the principles of the present disclosure and to provide further explanation of the scope of the utility model as claimed.

Drawings

Fig. 1 is a perspective view of a fluid-flow heat dissipation device according to a first embodiment of the utility model.

Fig. 2 is an exploded view of fig. 1.

Fig. 3 is a schematic perspective cross-sectional view of the base of fig. 2.

Fig. 4 is a perspective view of the closure of fig. 2.

Fig. 5 is a schematic cross-sectional view of fig. 1.

Fig. 6 is a partially exploded view of fig. 1.

Fig. 7 is a partially exploded view of fig. 1.

Fig. 8 is a schematic perspective cross-sectional view of fig. 1.

Fig. 9 is another perspective cross-sectional view of fig. 1.

Fig. 10 is a perspective view of a flow-type heat sink according to a second embodiment of the utility model.

Fig. 11 is a perspective view of a flow-type heat sink according to a third embodiment of the utility model.

Fig. 12 is an exploded view of fig. 11.

Fig. 13 is a schematic perspective cross-sectional view of the base of fig. 12.

Fig. 14 is a perspective view of the closure of fig. 12.

Fig. 15 is a schematic cross-sectional view of fig. 11.

Fig. 16 is a partially exploded view of fig. 11.

Fig. 17 is a partially exploded view of fig. 11.

Fig. 18 is a schematic perspective cross-sectional view of fig. 11.

Fig. 19 is another perspective cross-sectional view of fig. 11.

Fig. 20 is an exploded view of a seat and a seal according to a fourth embodiment of the utility model.

Wherein, the reference numbers:

liquid flow type

heat dissipation device

10, 10a, 10b

The first water nozzle 20b

Second water nozzle 30b

Base plate

100, 100b, 100c

Bottoms

110, 110b, 110c

First communication ports

111, 111b, 111c

Second communication ports

112, 112b, 112c

Transverse partition structure 113

Annular partition structure 113b

Lateral partition structure 114b

Annular wall portion

120, 120b

External access ports

121, 121b, 121c

External outlets

122, 122b, 122c

Top surfaces

123, 123b

Annular grooves

124, 124b

Separation projection 125

Seal rings 150, 150b

Closure

200, 200b

The top 210, 210b

Convex parts

220, 220b

The

enclosure parts

230, 230b

Partition projection 231b

Flow guide plates

300, 300b

Plate parts

310, 310b

Impeller cavity inlets

311, 311b

Impeller cavity outlets

312, 312b

Support posts 320, 320b

Baffle

500, 500b

Second opening 510

Third opening 510b

Heat-conducting

box

600, 600a, 600b

Case

610, 610b

Heat absorbing

surfaces

611, 611b

Heat sink fins

612, 612b

Covers

620, 620b

Notch 621

First opening 622

First opening 621b

Second opening 622b

Sealing element 650b

Outer sealing ring 651b

First inner seal ring 652b

Second inner seal ring 653b

Seal 650c

First through hole 651b

Second through hole 652b

Impellers

700, 700b

Drive

assemblies

750, 750b

Control circuit boards

800, 800b

Shields

850, 850b

Directions A to M

Rotation axis AR

Storage chamber S1

Inlet chamber S11

Outlet chamber S12

Drive assembly accommodation space S2

Impeller accommodation chamber S3

Heat exchange chamber S4

Gap SG

Channel C1

Directions F1-14

Detailed Description

Please refer to fig. 1-2. Fig. 1 is a perspective view of a fluid-flow heat dissipation device according to a first embodiment of the utility model. Fig. 2 is an exploded view of fig. 1.

The liquid flow heat dissipation device 10 of the present embodiment is, for example, a water cooling head, and is configured to be thermally coupled to at least one heat source (not shown) and to take away heat generated by the heat source through liquid cooling. The heat source is, for example, a central processing unit or an image processor. The liquid-flow heat dissipation device 10 includes a base 100, a cover 200, a baffle 300, a heat conduction box 600, an impeller 700, and a driving component 750.

Referring to fig. 2 and 3, fig. 3 is a schematic perspective cross-sectional view of the base of fig. 2. The base 100 includes a bottom portion 110 and an annular wall portion 120. The annular wall 120 is connected to the bottom 110, for example, integrally formed, and the bottom 110 and the annular wall 120 together enclose a storage chamber S1. For example, the base 100 is an integrally molded structure manufactured by injection molding.

In the present embodiment, the bottom portion 110 has a first communication opening 111 and a second communication opening 112. The first communication port 111 and the second communication port 112 communicate with the storage chamber S1. The bottom 110 may also have a lateral partition structure 113, and the lateral partition structure 113 divides the bottom space of the storage compartment S1 into two parts. The annular wall 120 of the base 100 has an external inlet 121 and an external outlet 122. The external inlet 121 and the external outlet 122 are respectively connected to a water cooling drain (not shown) through a pipeline (not shown). The external inlet 121 and the external outlet 122 are communicated with the storage chamber S1, and the first communication port 111 and the second communication port 112 are communicated with each other through the storage chamber S1. In addition, the annular wall 120 may further have a top surface 123, an annular groove 124 and a plurality of separation protrusions 125. The annular groove 124 is located on the top surface 123, and the annular groove 124 receives a seal ring 150. The function of the partition protrusion 125 will be described later.

Referring to fig. 2 and 4, fig. 4 is a perspective view of the sealing cover of fig. 2. The cover 200 is mounted on the annular wall portion 120 of the base 100 to close one side of the storage chamber S1. For example, the cap 200 includes a top portion 210, a protrusion 220, and a surrounding portion 230. The top portion 210 is mounted to the annular wall portion 120 of the base 100 by, for example, screw locking. The top portion 210 is stacked on the top surface 123 of the annular wall portion 120, and the top portion 210 and the annular wall portion 120 jointly sandwich the sealing ring 150 to prevent the liquid in the storage chamber S1 from leaking from the gap between the top portion 210 and the annular wall portion 120. The protrusion 220 protrudes from the same side of the top portion 210 as the surrounding portion 230. Specifically, the protrusion 220 and the surrounding portion 230 both protrude from the top portion 210 toward the bottom portion 110 of the base 100. The surrounding portion 230 surrounds the protrusion 220, and the surrounding portion 230 is separated from the protrusion 220. The protrusion 220 is a concave portion on a side away from the bottom 110, and surrounds a driving assembly accommodating space S2. The driving-unit accommodating space S2 is not communicated with the storage chamber S1 by the obstruction of the top 210.

Referring to fig. 2 and 5, fig. 5 is a cross-sectional view of fig. 1. The surrounding portion 230 of the cover 200 partially presses against the partition protrusions 125 of the annular wall portion 120 of the base 100 to divide the space above the storage compartment S1 into two parts.

Referring to fig. 2 and 6, fig. 6 is a partially exploded view of fig. 1. Opposite sides of the baffle 300 are respectively overlapped on the bottom 110 of the base 100 and the surrounding portion 230 of the cover 200. For example, the baffle 300 includes a plate portion 310 and a plurality of support posts 320. The plate portion 310 is stacked on the surrounding portion 230, and the surrounding portion 230, the protruding portion 220 and the flow guiding plate 300 together surround an impeller accommodating chamber S3.

The supporting pillars 320 protrude from the plate portion 310 on a side away from the surrounding portion 230 and abut against the bottom portion 110, so that a gap SG is maintained between the plate portion 310 and the bottom portion 110, and the plate portion 310 abuts against the transverse partition structure 113. In this way, the transverse partition structure 113 divides the gap SG into two regions which are not directly connected, and the storage space S1 is divided into an inlet chamber S11 and an outlet chamber S12 by the separation of the transverse partition structure 113 and the partition protrusion 125. The inlet chamber S11 communicates with the circumscribed inlet 121. The outlet chamber S12 communicates with the peripheral outlet 122, and the inlet chamber S11 and the outlet chamber S12 do not communicate directly through the obstruction of the peripheral portion 230 of the cover 200. The plate portion 310 has an impeller cavity inlet 311 and an impeller cavity outlet 312. The external inlet 121 communicates with the impeller accommodating chamber S3 through the inlet chamber S11 in the storage chamber S1 and the gap SG and the impeller chamber inlet 311. The impeller accommodation chamber S3 communicates with the outlet chamber S12 of the storage chamber S1 through the impeller cavity outlet 312 to the external outlet 122.

Referring to fig. 2 and 7, fig. 7 is a partially exploded view of fig. 1. The heat conductive box 600 is disposed on a side of the bottom 110 of the base 100 away from the annular wall 120, and the heat conductive box 600 has a heat exchanging chamber S4. The impeller accommodation chamber S3 communicates with the heat exchange chamber S4 through the storage chamber S1. In addition, with reference to fig. 5, the first communication port 111 communicating the impeller accommodating chamber S3 and the heat exchange chamber S4 is located outside a range of 1/2 radius of the impeller 700.

The above-described respective chambers, the external inlet 121 and the external outlet 122 are communicated in a manner that the external inlet 121 communicates with the impeller accommodating chamber S3 through the inlet chamber S11 of the storage chamber S1, the impeller accommodating chamber S3 communicates with the heat exchange chamber S4 through the impeller chamber outlet 312 and the first communication port 111, and the heat exchange chamber S4 communicates with the external outlet 122 through the second communication port 112 and the outlet chamber S12 of the storage chamber S1. Further, the first communication port 111, which communicates the impeller housing chamber S3 with the heat exchange chamber S4, is offset from the rotation axis AR of the impeller 700 and is located at a tangential position of the impeller housing chamber S3. The impeller cavity inlet 311 is also offset from the axis of rotation AR of the impeller 700.

In this embodiment, the flow-type heat sink 10 may further include a flow blocking member 500, and the flow blocking member 500 is stacked on the heat conducting box 600. The baffle 500 covers at least a part of the first communication hole 111. In detail, the heat conductive box 600 includes a box body 610 and a cover 620. The case 610 has a heat-absorbing surface 611. The heat absorbing surface 611 is thermally coupled to at least one heat source. The heat source is, for example, a central processing unit or an image processor. In addition, the box 610 has a plurality of heat dissipation fins 612 on a side away from the heat absorption surface 611, so as to improve the heat exchange efficiency between the fluid flow heat sink 10 and the heat source. The cover 620 is fixed to the case 610 by a bonding means such as welding, pressing, or gluing, for example, to serve as a cover for the heat exchange chamber S4. The box 610 is fixed to the bottom 110, and the cover 620 is disposed between the box 610 and the bottom 110. The cover 620 has a notch 621 and a first opening 622. The flow blocking member 500 is sandwiched between the cover 620 and the heat dissipating fins 612 and has a second opening 510. The second opening 510 is aligned with the first opening 622, and the impeller accommodation chamber S3 communicates with the second opening 510 through the first opening 622 to the heat exchange chamber S4. The baffle 500 limits the direction and range of water flow, for example, through the second opening 510. The external outlet 122 communicates with the heat exchange chamber S4 through the notch 621. The size of the second opening 510 is smaller than that of the first opening 622, and the second opening 510 is offset from the first communication opening 111.

In the present embodiment, the cover 620 and the flow blocking member 500 are two independent members, but not limited thereto. In other embodiments, the cover and the flow blocking member are integrally formed.

In the embodiment, the flow blocking member 500 is located in the heat conductive box 600, but not limited thereto. In other embodiments, the baffle may be located outside the thermally conductive cartridge.

Please refer back to fig. 2. The impeller 700 is rotatably located in the impeller receiving chamber S3. The driving unit 750 is located in the driving unit accommodating space S2 and is used for driving the impeller 700 to rotate relative to the base 100. In addition, the protrusion 220, the surrounding portion 230, the baffle 300 and the impeller 700 of the cover 200 are all located in the storage chamber S1 and surrounded by the annular wall portion 120.

Please refer back to fig. 2. The liquid flow heat sink 10 may further include a control circuit board 800 and a shield 850. The control circuit board 800 is fixed on the top portion 210 of the cover 200, and the control circuit board 800 is electrically connected to the driving element 750 to adjust the rotation speed of the driving element 750 through the control circuit board 800. If the control circuit board 800 is provided with additional light sources and temperature sensors, the control circuit board 800 can also perform light effect control and temperature monitoring. The shield 850 is fixed to the base 100 and covers the cover 200, the driving assembly 750 and the partial annular wall 120. The shield 850 has the function of protecting the control circuit board and the driving components, and can also be used as a mounting place for decoration and lamp effect.

In the embodiment, the liquid flow heat dissipation device 10 is provided with a shield 850, but not limited thereto. In other embodiments, the shield may be omitted.

Referring to fig. 2, 8 and 9, fig. 8 is a schematic perspective cross-sectional view of fig. 1. Fig. 9 is another perspective cross-sectional view of fig. 1.

As shown in fig. 2 and 8, when the fluid-flow heat sink 10 is operated, the coolant flows into the inlet chamber S11 of the storage chamber S1 from the external inlet 121 in the direction a. Then, the cooling fluid in the inlet chamber S11 sequentially flows into the gap SG between the plate portion 310 of the baffle 300 and the bottom 110 of the base 100 along the direction B, C, D. Then, the coolant in the gap SG flows into the impeller housing chamber S3 through the impeller cavity inlet 311 in the direction E. Then, the coolant in the impeller accommodating chamber S3 is driven by the impeller 700 to be thrown to the tangent of the impeller accommodating chamber S3 along the direction F, G, and then sequentially flows through the impeller cavity outlet 312 and the first communication port 111 along the direction H.

Then, as shown in fig. 2 and fig. 9, the cooling liquid flows into the heat exchanging chamber S4 through the first opening 622 of the cover 620 in sequence along the direction I. The flow state of the cooling fluid is controlled through the second opening 510, so that the cooling fluid can flow into the micro flow channel between the heat dissipation fins 612 according to the heat exchange requirement. For example, the length design value, the width design value, or the shape of the opening may be adjusted according to the temperature distribution of the heat absorbing surface 611 in design, so as to concentrate the coolant flowing to the high temperature of the heat absorbing surface 611, thereby improving the heat exchange efficiency to the high temperature of the heat absorbing surface 611. Then, the cooling liquid in the heat exchanging chamber S4 sequentially flows along the direction J, K, L, M, and flows out from the external outlet 122 through the notch 621 of the cover 620 and the second communication port 112.

Because the pairing is simple and convenient, only hole holes are needed, and the combination problem of the whole structure level faced by the design of the prior art is avoided, so that the flexibility of the later modification of the liquid flow type heat dissipation device is increased. Please refer to fig. 10. Fig. 10 is a perspective view of a flow-type heat sink according to a second embodiment of the utility model. The structure of the flow-through heat sink 10a of the present embodiment is similar to the structure of the flow-through heat sink 10 of the previous embodiment, and the difference is only that the heat conduction box 600a with a larger size is adopted in the present embodiment. I.e., the heat conductive case 600a is larger in size than the heat conductive case 600. That is, if there is a need to replace the large-sized heat conduction box 600a, the assembler can directly replace the small-sized heat conduction box with the large-sized heat conduction box 600 a.

Please refer to fig. 11-12. Fig. 11 is a perspective view of a flow-type heat sink according to a third embodiment of the utility model. Fig. 12 is an exploded view of fig. 11.

The liquid-flow heat dissipation device 10b of the present embodiment is, for example, a water-cooling head, and is configured to be thermally coupled to at least one heat source (not shown) and to take away heat generated by the heat source through liquid cooling. The heat source is, for example, a central processing unit or an image processor. The fluid-flow heat sink 10b includes a base 100b, a cover 200b, a baffle 300b, a heat-conducting box 600b, an impeller 700b, and a driving assembly 750 b.

Referring to fig. 12 and 13, fig. 13 is a schematic perspective cross-sectional view of the base of fig. 12. The base 100b includes a bottom portion 110b and an annular wall portion 120 b. The annular wall portion 120b is connected to the bottom portion 110b, for example, integrally formed, and the bottom portion 110b and the annular wall portion 120b together enclose a storage chamber S1. For example, the base 100b is an integrally molded structure manufactured by means of injection molding.

In the present embodiment, the bottom portion 110b has a first communication opening 111b and a second communication opening 112 b. The first communication port 111b and the second communication port 112b communicate with the storage chamber S1. The bottom 110b may also have an annular partition structure 113b and a lateral partition structure 114 b. The annular partition structure 113b and the lateral partition structure 114b together divide the bottom space of the storage chamber S1 into three parts, which will be described later. The annular wall 120b of the base 100b has an external inlet 121b and an external outlet 122 b. The external inlet 121b and the external outlet 122b are respectively used for connecting a pipeline (not shown) through the first water nozzle 20b and the second water nozzle 30b, and are connected to a water cooling bar (not shown) through a pipeline. The external inlet 121b and the external outlet 122b are communicated with the storage chamber S1, and the first communication port 111b and the second communication port 112b are communicated with each other through the storage chamber S1. In addition, the annular wall 120b may have a top surface 123b and an annular groove 124 b. The annular groove 124b is located on the top surface 123b, and the annular groove 124b receives a seal ring 150 b.

Referring to fig. 12 and 14, fig. 14 is a perspective view of the sealing cap of fig. 12. The cover 200b is mounted on the annular wall portion 120b of the base 100b to close one side of the storage chamber S1. For example, the cover 200b includes a top portion 210b, a protrusion 220b and a surrounding portion 230 b. The top portion 210b is mounted to the annular wall portion 120b of the base 100b by, for example, screw locking. The top portion 210b is stacked on the top surface 123b of the annular wall portion 120b, and the top portion 210b and the annular wall portion 120b together sandwich the sealing ring 150b to prevent the liquid in the storage chamber S1 from leaking from the gap between the top portion 210b and the annular wall portion 120 b. The convex portion 220b and the surrounding portion 230b protrude from the same side of the top portion 210 b. Specifically, the protrusion 220b and the surrounding portion 230b both protrude from the top portion 210b toward the bottom portion 110b of the base 100 b. The surrounding portion 230b surrounds the protrusion 220b, and the surrounding portion 230b is separated from the protrusion 220 b. The protrusion 220b is a concave portion on a side away from the bottom 110b, and surrounds a driving assembly accommodating space S2. The driving assembly accommodating space S2 is not communicated with the storage chamber S1 by being blocked by the top portion 210 b. The surrounding portion 230b has a partitioning protrusion 231b protruding in the radial direction.

Referring to fig. 12 and 15, fig. 15 is a cross-sectional view of fig. 11. The partition protrusion 231b of the surrounding portion 230b of the cover 200b is at least partially pressed against the annular wall portion 120b of the base 100b to divide the upper space of the storage chamber S1 into two parts. That is, when the top portion 210b is stacked on the top surface 123b of the annular wall portion 120b, the partition protrusion 231b of the surrounding portion 230b abuts against the annular wall portion 120b to partition the storage chamber S1 into an inlet chamber S11 and an outlet chamber S12 together with the transverse partition structure 114b, which will be described later.

Referring to fig. 12 and 16, fig. 16 is a partially exploded view of fig. 11. The opposite sides of the baffle 300b are respectively overlapped on the bottom 110b of the base 100b and the surrounding part 230b of the cover 200 b. For example, the baffle 300b includes a plate portion 310b and a plurality of support posts 320 b. The plate portion 310b is stacked on the surrounding portion 230b, and the surrounding portion 230b, the protruding portion 220b and the flow guiding plate 300b together surround an impeller accommodating chamber S3.

The supporting pillars 320b protrude from the plate portion 310b on a side away from the surrounding portion 230b and abut against the bottom portion 110b, so that a gap SG is maintained between the plate portion 310b and the bottom portion 110b, and the plate portion 310b abuts against the annular partition structure 113b and the transverse partition structure 114 b. In this way, the annular partition structure 113b separates a channel C1, and the transverse partition structure 114b divides the gap SG into two regions which are not directly connected. The inlet chamber S11 communicates with the circumscribed inlet 121 b. The outlet chamber S12 communicates with the external outlet 122b, and the inlet chamber S11 and the outlet chamber S12 are not directly communicated by the blocking of the annular partition structure 113b, the lateral partition structure 114b and the partition protrusion 231 b. The plate portion 310b has an impeller cavity inlet 311b and an impeller cavity outlet 312 b. The circumscribed inlet 121b communicates with the impeller accommodation chamber S3 through the inlet chamber S11 of the storage chamber S1 and the gap SG and the impeller chamber inlet 311 b. The impeller accommodation chamber S3 communicates with the first communication port 111b through the impeller chamber outlet 312b and the passage C1. In addition, referring again to fig. 5, the first communication port 111b does not overlap the projection of the impeller chamber inlet 311b on the bottom 110b, and the first communication port 111b does not overlap the projection of the impeller chamber outlet 312b on the bottom 110 b.

Referring to fig. 12 and 17, fig. 17 is a partially exploded view of fig. 11. The heat conductive box 600b is disposed on the bottom 110b of the base 100b at a side away from the annular wall 120b, and the heat conductive box 600b has a heat exchanging chamber S4. The impeller accommodation chamber S3 communicates with the heat exchange chamber S4 through the storage chamber S1.

The external inlet 121b communicates with the impeller accommodating chamber S3 via the inlet chamber S11 of the storage chamber S1, and the impeller accommodating chamber S3 communicates with the heat exchange chamber S4 via the impeller chamber outlet 312b, the channel C1, and the first communication port 111 b. The heat exchange chamber S4 communicates with the outlet chamber S12 of the storage chamber S1 through the second communication port 112b with the external outlet 122 b. Further, the first communication port 111b that communicates the impeller housing chamber S3 with the heat exchange chamber S4 is offset from the rotation axis AR of the impeller 700 b. The impeller cavity inlet 311b is also offset from the axis of rotation AR of the impeller 700 b. The impeller cavity outlet 312b is located tangentially to the impeller receiving chamber S3.

In this embodiment, the liquid-flow heat dissipation device 10b may further include a flow blocking member 500b, and the flow blocking member 500b is stacked on the heat conduction box 600 b. The baffle 500b covers at least a portion of the first communication hole 111 b. In detail, the heat conductive box 600b includes a box body 610b and a cover 620 b. The case 610b has a heat-absorbing surface 611 b. The heat absorbing surface 611b is used for being thermally coupled to at least one heat source. The heat source is, for example, a central processing unit or an image processor. In addition, the box 610b has a plurality of heat dissipation fins 612b on a side away from the heat absorption surface 611b to improve the heat exchange efficiency between the fluid-flow heat sink 10b and the heat source. The cover 620b is fixed to the case 610b by a bonding means such as welding, pressing, or gluing, for example, to serve as a cover for the heat exchange chamber S4. The box 610b is fixed to the bottom 110b, and the cover 620b is interposed between the box 610b and the bottom 110 b. The cover 620b has a first opening 621b and a second opening 622 b. The flow blocking member 500b is sandwiched between the cover 620b and the heat dissipating fins 612b and has a third opening 510 b. The third opening 510b is aligned with the second opening 622b, and the impeller accommodation chamber S3 communicates with the heat exchange chamber S4 through the second opening 622b and the third opening 510 b. The flow baffle 500b limits the direction and range of water flow, for example, through the third opening 510 b. The external outlet 122b communicates with the heat exchange chamber S4 through the second opening 622 b.

In the present embodiment, the cover 620b and the flow blocking member 500b are two independent members, but not limited thereto. In other embodiments, the cover and the flow blocking member are integrally formed.

In the present embodiment, the flow blocking member 500b is located in the heat conductive box 600b, but not limited thereto. In other embodiments, the baffle may be located outside the thermally conductive cartridge.

In this embodiment, the liquid flow heat sink 10b may further include a sealing member 650 b. The seal 650b includes an outer sealing ring 651b, a first inner sealing ring 652b, and a second inner sealing ring 653 b. The first inner seal ring 652b is connected to the second inner seal ring 653b and is attached to the inside of the outer seal ring 651 b. The sealing member 650b is installed at a side of the bottom 110b of the base 100b facing away from the storage chamber S1. The first inner seal ring 652b surrounds the first communication port 111b to prevent the fluid flowing from the first communication port 111b to the first opening 621b from leaking out. The second inner seal ring 653b surrounds the second communication port 112b to prevent the fluid flowing from the second opening 622b to the second communication port 112b from leaking out.

In the present embodiment, the outer sealing ring 651b, the first inner sealing ring 652b, and the second inner sealing ring 653b are connected to each other, but not limited thereto. In other embodiments, the outer sealing ring, the first inner sealing ring and the second inner sealing ring may also be three independent elements.

Please refer to fig. 12 and fig. 15 again. The impeller 700b is rotatably located in the impeller receiving chamber S3. The driving assembly 750b is located in the driving assembly accommodating space S2 and is used for driving the impeller 700b to rotate relative to the base 100 b. In addition, the protrusion 220b, the surrounding portion 230b, the baffle 300b and the impeller 700b of the cover 200b are all located in the storage chamber S1 and surrounded by the annular wall portion 120 b.

Please refer to fig. 12 again. The liquid flow heat sink 10b may further include a control circuit board 800b and a shield 850 b. The control circuit board 800b is fixed on the top portion 210b of the cover 200b, and the control circuit board 800b is electrically connected to the driving element 750b to adjust the rotation speed of the driving element 750b through the control circuit board 800 b. If the control circuit board 800b is provided with additional light sources and temperature sensors, the control circuit board 800b can also perform light effect control and temperature monitoring. The shield 850b is fixed to the base 100b and covers the cover 200b, the driving unit 750b and the partial annular wall 120 b. The shield 850b has a function of protecting the control circuit board and the driving unit, and can be used as a mounting place for decoration and lamp effect.

In the embodiment, the fluid-flow heat dissipation device 10b is provided with the shield 850b, but not limited thereto. In other embodiments, the shield may also be omitted. Further, in the present embodiment, the shield 850b is, for example, but not limited to, an integrally molded piece or an assembly of a plurality of elements.

Referring to fig. 12, 18 and 19, fig. 18 is a schematic perspective cross-sectional view of fig. 11. Fig. 19 is another perspective cross-sectional view of fig. 11.

As shown in fig. 12 and 18, when the liquid flow type heat dissipating device 10b operates, the cooling liquid flows into the inlet chamber S11 of the storage chamber S1 from the external inlet 121b in the direction F1. Then, the coolant in the inlet chamber S11 flows into the gap SG between the plate portion 310b of the baffle 300b and the bottom 110b of the base 100b in the directions F2, F3, and F4 in order. Then, the coolant in the gap SG flows into the impeller accommodating chamber S3 through the impeller cavity inlet 311b in the direction F5. Then, the coolant in the impeller accommodating chamber S3 is driven by the impeller 700b to be thrown to the tangent of the impeller accommodating chamber S3 along the direction F6, and then sequentially flows through the impeller cavity outlet 312b, the channel C1 and the first communication port 111b at the tangent of the outer periphery of the impeller accommodating chamber S3 along the directions F7 and F8.

Then, as shown in fig. 12, 18 and 19, the cooling liquid flows into the heat exchanging chamber S4 through the second opening 622b and the third opening 510b of the cover 620b along the direction F9. The flow state of the cooling fluid is controlled through the third opening 510b, so that the cooling fluid can flow into the micro flow channel between the heat dissipating fins 612b according to the heat exchange requirement. For example, the design value of the length, the design value of the width, or the shape of the opening may be adjusted according to the temperature distribution of the heat absorbing surface 611b, so as to concentrate the coolant flowing to the high temperature of the heat absorbing surface 611b, thereby improving the heat exchange efficiency of the high temperature of the heat absorbing surface 611 b. Then, the cooling liquid in the heat exchange chamber S4 flows in the directions F10, F11, F12, F13, and F14 in sequence, and flows out from the external outlet 122b through the second opening 622b and the second communication port 112b of the cover 620 b.

Please refer to fig. 20. Fig. 20 is an exploded view of a seat and a seal according to a fourth embodiment of the utility model. The sealing element 650c of the present embodiment is used to replace the sealing element 650b of the previous embodiments, and the connection relationship and the position relationship between the sealing element and the base 100b and the heat conducting box 600b are similar, so the description thereof is omitted. Only the base 100c and the seal 650c will be described below. The base 100c includes a bottom portion 110c and an annular wall portion 120 c. The bottom portion 110c has a first communication port 111c and a second communication port 112 c. The annular wall 120c has an external inlet 121c and an external outlet 122 c. The external connection inlet 121c and the external connection outlet 122c directly or indirectly communicate the first communication port 111c and the second communication port 112 c. The sealing member 650c is, for example, a plate and has a first through hole 651c and a second through hole 652 c. The first through hole 651c is aligned with the first communication port 111c and the first opening 621b of the heat conductive box 600b (as shown in fig. 17), and the size of the first through hole 651c is matched with the size of the first opening 621b to prevent the fluid communicated between the first communication port 111c and the first opening 621b from leaking. The second through hole 652c is aligned with the second communication port 112c and the second opening 622b of the heat conductive box 600b (as shown in fig. 17), and the size of the second through hole 652c is matched with the size of the second opening 622b, so as to prevent the fluid flowing between the second communication port 112c and the second opening 622b from leaking.

In addition, because the annular wall part and the bottom of the base are of an integrally formed structure and are bowl-shaped, most of the lower part of the storage chamber is sealed by the bottom, and only a small part of the annular wall part and the bottom of the storage chamber are provided with the first communicating port and the second communicating port which are communicated with the heat exchange chamber. Therefore, if the original heat conduction box of the liquid flow type heat dissipation device needs to be modified into a heat conduction box with a larger size, the liquid flow type heat dissipation device can be modified more flexibly in the future because the pairing is simple and convenient, only hole holes are needed, and the combination problem of the whole structure layer faced by the design of the prior art is avoided. On the contrary, the base designed by the prior art mostly adopts an outer cover type design, and the heat conducting plate is in an open type design, and the base and the heat conducting plate form a complete closed cavity together. Once the size or shape of the heat conducting plate is changed, the base and the heat conducting plate cannot form a closed cavity, so that the problem of redesign is caused.

Although the present invention has been described with reference to the foregoing embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. A fluid-flow heat sink, comprising:

the base comprises a bottom and an annular wall part, the annular wall part is connected with the bottom, and the bottom and the annular wall part jointly surround a storage chamber;

the sealing cover comprises a top part, a convex part and a surrounding part, the top part is arranged on the annular wall part, the convex part and the surrounding part protrude out of the same side of the top part, the surrounding part surrounds the convex part, a driving assembly accommodating space is surrounded on one side of the convex part far away from the bottom part, and the driving assembly accommodating space is not communicated with the storage chamber;

the opposite two sides of the guide plate are respectively overlapped on the base and the surrounding part, the convex part and the guide plate surround an impeller accommodating chamber together;

the heat conduction box is arranged on one side of the bottom of the base, which is far away from the annular wall part, and is provided with a heat exchange chamber, and the impeller accommodating chamber is communicated with the heat exchange chamber through the storage chamber;

the impeller is rotatably positioned in the impeller accommodating chamber; and

the driving assembly is positioned in the driving assembly accommodating space and is used for driving the impeller to rotate relative to the base;

wherein, the bottom and the annular wall are integrally formed, and the convex part of the sealing cover, the surrounding part, the guide plate and the impeller are all positioned in the storage chamber and surrounded by the annular wall;

the bottom of the base is provided with a first communicating port and a second communicating port, the external inlet is communicated with the impeller accommodating chamber through the storage chamber, the impeller accommodating chamber is communicated with the heat exchange chamber through the first communicating port, the heat exchange chamber is communicated with the external outlet through the second communicating port, and the first communicating port communicated with the impeller accommodating chamber and the heat exchange chamber deviates from the rotation axis of the impeller.

2. The fluid-flow heat sink of claim 1, wherein the first communication port communicating the impeller-receiving chamber with the heat exchange chamber is located outside of 1/2 radius of the impeller.

3. The fluidic heat sink of claim 1, wherein the flow guiding plate comprises a plate portion and a plurality of supporting pillars, the plate portion is stacked on the surrounding portion, the supporting pillars protrude from a side of the plate portion away from the surrounding portion and abut against the bottom portion, so that a gap is maintained between the plate portion and the bottom portion, and the external inlet is in communication with the impeller housing chamber through the gap.

4. The fluid flow heat sink of claim 2, wherein the plate has an impeller cavity inlet through which the gap communicates with the impeller receiving chamber and an impeller cavity outlet through which the impeller receiving chamber communicates with the heat exchange chamber.

5. The fluid flow heat sink of claim 1, further comprising a shield secured to the base and covering the cover, the driving element, and a portion of the annular wall.

6. The fluidic heat sink of claim 1, further comprising a control circuit board fixed to the top of the cover and electrically connected to the driving assembly.

7. The fluid-flow heat sink of claim 1, further comprising at least one flow blocking member stacked on the heat conductive box, wherein the at least one flow blocking member covers at least a portion of the first communication opening.

8. The fluid-flow heat sink according to claim 7, wherein the heat conducting box comprises a box body and a cover, the cover is fixed to the box body, the box body is fixed to the bottom such that the cover is disposed between the box body and the bottom, the box body has a plurality of heat dissipating fins, the cover has a notch and a first opening, the at least one flow blocking member is disposed between the cover and the heat dissipating fins and has a second opening, the second opening is aligned with the first opening, the impeller receiving chamber is connected to the heat exchanging chamber through the first opening and the second opening, and the external outlet is connected to the heat exchanging chamber through the notch.

9. The flow heat sink of claim 7, wherein the second opening is smaller than the first opening, and the second opening is offset from the first communication opening.

10. The fluid-flow heat sink of claim 7, wherein the cover and the at least one flow-blocking member are separate members.

11. The fluid-flow heat sink of claim 7, wherein the cover and the at least one flow-blocking member are integrally formed.

12. The fluidic heat sink of claim 1, wherein the bottom further comprises a transverse partition structure, the annular wall further comprises at least one partition protrusion, the surrounding portion at least partially abuts against the at least one partition protrusion of the annular wall, and the flow guiding plate abuts against the transverse partition structure to divide the storage chamber into an inlet chamber and an outlet chamber which are not connected, the external inlet is connected to the impeller receiving chamber through the inlet chamber, and the external outlet is connected to the heat exchange chamber through the outlet chamber.

13. A fluid-flow heat sink, comprising:

the base comprises a bottom part and an annular wall part, the annular wall part is integrally connected with the bottom part, and the bottom part and the annular wall part jointly surround a storage chamber;

a sealing cover, which is arranged on the annular wall part;

the heat conduction box is arranged on one side of the bottom of the base, which is far away from the annular wall part, and surrounds a heat exchange chamber which is communicated with the storage chamber;

an impeller rotatably positioned in the storage chamber; and

the driving assembly is arranged on the sealing cover, positioned outside the storage chamber and used for driving the impeller to rotate relative to the base;

wherein, the impeller is positioned in the storage chamber and surrounded by the annular wall part.

14. A fluid-flow heat sink, comprising:

a base having a storage chamber;

the sealing cover is arranged on the base;

the heat conduction box comprises a box body and a cover body, the cover body covers the box body so as to enable the box body and the cover body to jointly surround a heat exchange cavity, the heat conduction box is arranged on one side of the base, and the cover body is provided with at least one opening and is communicated with the storage cavity through the at least one opening;

the size of the sealing element is matched with that of the at least one opening, and the sealing element is clamped between the cover body and the base and surrounds the at least one opening;

an impeller rotatably positioned in the storage chamber; and

and the driving assembly is arranged on the sealing cover, is positioned outside the storage chamber and is used for driving the impeller to rotate relative to the base.

15. The fluid-flow heat sink of claim 14, wherein the sealing element comprises an outer sealing ring, a first inner sealing ring and a second inner sealing ring, the first inner sealing ring and the second inner sealing ring are connected within the outer sealing ring, the at least one opening comprises a first opening and a second opening, the first inner sealing ring and the second inner sealing ring have dimensions that match the dimensions of the first opening and the second opening, respectively, and enclose the first opening and the second opening, respectively.

16. The flow heat sink of claim 14, wherein the sealing member has a first through hole and a second through hole, the at least one opening comprising a first opening and a second opening, the first through hole and the second through hole having dimensions matching and surrounding the first opening and the second opening, respectively.

17. A fluid-type heat dissipation device, comprising:

the impeller is rotatably positioned in the impeller accommodating chamber; and

the annular wall portion of the base is provided with an external outlet and an external inlet, the bottom is provided with a first communicating port and a second communicating port, the guide plate is provided with an impeller cavity inlet and an impeller cavity outlet which are communicated with the impeller accommodating cavity, the external inlet is communicated with the impeller cavity inlet through the storage cavity, the impeller cavity outlet is communicated with the heat exchange cavity through the first communicating port, the heat exchange cavity is communicated with the external outlet through the second communicating port, and the first communicating port is not overlapped with the projection of the impeller cavity inlet at the bottom.

18. The fluidic heat sink of claim 17, wherein the first communication port does not overlap a projection of the impeller chamber outlet onto the bottom.

19. The fluidic heat sink of claim 17, wherein the flow guide plate comprises a plate portion and a plurality of supporting pillars, the plate portion is stacked on the surrounding portion, the supporting pillars protrude from a side of the plate portion away from the surrounding portion and abut against the bottom portion, so that a gap is maintained between the plate portion and the bottom portion, the gap is communicated with the external inlet and communicated with the impeller-receiving chamber through the impeller-cavity inlet, and the impeller-receiving chamber is communicated with the heat exchange chamber through the impeller-cavity outlet and the first communicating opening.

20. The fluid-flow heat sink of claim 19, wherein the bottom portion has an annular partition structure surrounding a channel, one end of the channel communicating with the first communication port and the other end of the channel communicating with the impeller chamber outlet.

21. The fluid flow heat sink of claim 17, further comprising a shield secured to the base and covering the cover, the driving element, and a portion of the annular wall.

22. The fluidic heat sink of claim 17, further comprising a control circuit board fixed to the top of the cover and electrically connected to the driving assembly.

23. The fluid-flow heat sink according to claim 17, further comprising at least one flow blocking member stacked on the heat conducting box, wherein the heat conducting box comprises a box body and a cover, the cover is fixed on the box body, the box body is fixed on the bottom, the cover is disposed between the box body and the bottom, the box body has a plurality of heat dissipating fins, the cover has a first opening and a second opening, the at least one flow blocking member is sandwiched between the cover and the heat dissipating fins and has a third opening, the third opening is aligned with the first opening, the impeller accommodating chamber communicates with the heat exchanging chamber through the first opening and the third opening, and the external outlet communicates with the heat exchanging chamber through the second opening.

24. The fluid flow heat sink of claim 23, wherein the seal comprises an outer sealing ring, a first inner sealing ring and a second inner sealing ring, the first inner sealing ring and the second inner sealing ring are connected inside the outer sealing ring, the first inner sealing ring and the second inner sealing ring have dimensions respectively matching the dimensions of the first opening and the second opening and respectively surround the first opening and the second opening.

25. The flow heat sink of claim 23, wherein the sealing member has a first through hole and a second through hole, the first through hole and the second through hole having dimensions matching the dimensions of the first opening and the second opening, respectively, and surrounding the first opening and the second opening, respectively.

26. The fluid-flow heat sink of claim 23, wherein the cover and the at least one baffle are separate pieces.

27. The fluid-flow heat sink of claim 23, wherein the cover and the at least one flow blocking member are integrally formed.

28. The fluid-flow heat sink of claim 17, wherein the bottom further comprises a transverse partition structure, the enclosure of the cover further comprises at least one partition protrusion, the partition protrusion abuts against the annular wall, and the deflector abuts against the transverse partition structure to divide the storage chamber into an inlet chamber and an outlet chamber that are not connected to each other, the external inlet is connected to the impeller-receiving chamber through the inlet chamber, and the external outlet is connected to the heat exchange chamber through the outlet chamber.