TWI790581B - Plating device and method for cleaning contact members of the plating device - Google Patents

Abstract

The invention provides a technology with simple structure and cleanable contact components. The coating device 1000 of the present invention is equipped with: a coating tank, a substrate holder 20, a rotating mechanism, a lifting mechanism, a contact member 40, and a cleaning device 50 for cleaning the contact member 40. The cleaning device 50 has: a rotary shaft 51, a first arm 53 . The second arm 54 and the nozzle 55 having at least one discharge port are configured to clean the contact member 40 by contacting the contact member 40 with the cleaning fluid discharged from the discharge port.

Description

Plating device and method for cleaning contact members of the plating device

The invention relates to a plating device and a method for cleaning a contact member of the plating device.

Conventionally, a so-called cup-type plating apparatus has been known as a plating apparatus capable of performing a plating process on a substrate (for example, refer to Patent Document 1). Such a plating apparatus includes: a plating tank; a substrate holder disposed above an anode disposed inside the coating tank and holding a substrate serving as a cathode; and a rotation mechanism for rotating the substrate holder.

In the substrate holder of the above-mentioned de-plating device, generally speaking, a contact member for feeding power to the substrate is arranged. When the contact member is not clean, the resistance value of the contact member changes, which may cause the plating quality of the substrate to deteriorate. Therefore, a technique related to a cleaning device capable of cleaning the contact member has been developed (for example, refer to Patent Document 2).

[Prior Technical Literature] 〔Patent Document〕

[Patent Document 1] Japanese Unexamined Patent Publication No. 2008-19496

[Patent Document 2] Specification of U.S. Patent Application Publication No. 2013/0061875

However, the structure of the cleaning device of the above-mentioned conventional contact member is complicated.

One of the objects of the present invention is to provide a technique for cleaning a contact member with a simple structure.

(pattern 1)

In order to achieve the above object, the coating device of one aspect of the present invention has: a coating tank; a substrate holder, which is arranged above the anode disposed inside the aforementioned coating tank, and can hold a substrate as a cathode; a rotating mechanism, It is used to rotate the aforementioned substrate holder; the lifting mechanism is used to lift the aforementioned substrate holder; the contact member is configured on the aforementioned substrate holder and contacts the outer peripheral edge of the lower surface of the aforementioned substrate to feed power to the aforementioned substrate; and a cleaning device, which cleans the aforementioned contact member; the aforementioned cleaning device has: a rotary shaft, which is disposed outside the region in the radial direction of the aforementioned substrate holder, and extends in the vertical direction; a first arm, which is connected to the aforementioned a rotary shaft extending horizontally; a second arm extending upward from the end of the first arm opposite to the side connected to the rotary shaft; and a nozzle connected to the second arm The upper end has at least one discharge port that opens downward and discharges cleaning fluid; and is configured to clean the contact member by contacting the contact member with the cleaning fluid discharged from the discharge port.

When this aspect is adopted, the contact member can be cleaned by a cleaning device composed of a simple structure such as the above-mentioned rotary shaft, the first arm, the second arm, and the nozzle.

In addition, when this aspect is adopted, the nozzle can be arranged at a position farther from the connection position of the first arm in the rotary shaft by the two arms of the first arm and the second arm. Thereby, the contact member can be effectively cleaned. In addition, in this aspect, since the nozzle can be moved (rotational movement) by rotating the rotary shaft, Therefore, the cleaning position of the cleaning fluid can be changed easily. Thereby, a wide range of contact members can be easily cleaned.

(pattern 2)

In the above-mentioned form 1, the nozzle can also be extended toward the side of the rotary shaft from the upper end of the second arm as a starting point. When viewed in a plane, the axis extending in the length direction of the nozzle is the same as the length of the first arm. The angle formed by the axes extending in the same direction is not less than 10 degrees and not more than 70 degrees.

With this aspect, the cleaning fluid discharged from the discharge port of the nozzle can easily contact the contact member. Thereby, the contact member can be effectively cleaned.

(pattern 3)

The above aspect 1 or 2 may further include a control module, which is to control the aforementioned rotating mechanism, the aforementioned elevating mechanism, and the aforementioned cleaning device. The nozzles moved to the outside area in the radial direction of the substrate holder are moved to a lifting position where the nozzles in the inner area in the radial direction of the substrate holder do not interfere with the lifting position of the substrate holder by rotating the rotary shaft, and then, The substrate holder is lowered by the lifting mechanism so that the contact member is located below the discharge port, and then the rotary shaft is rotated to move the nozzle to the discharge port and the contact member in the inner region. In the relative cleaning position, next, the substrate holder is rotated by the rotation mechanism, and the cleaning fluid is discharged from the discharge port.

(pattern 4)

In the above-mentioned aspect 3, the control module may rotate the substrate holder by the rotation mechanism, and while the cleaning fluid is discharged from the discharge port, the rotary shaft may be rotated at the second position. A rotation direction and a second rotation direction opposite to the aforementioned first rotation direction rotate alternately. According to this aspect, the contact member can be effectively cleaned.

(pattern 5)

In any one of the above-mentioned aspects 1-4, the aforementioned second arm can also use the part of the aforementioned second arm connected to the aforementioned first arm as a starting point, and can be obliquely connected to the aforementioned end of the aforementioned first arm department. With this aspect, the discharge direction of the cleaning fluid from the discharge port of the nozzle can be easily adjusted.

(pattern 6)

In any one of the above-mentioned aspects 1 to 5, at least one of the discharge ports may include a plurality of discharge ports, and the types of the cleaning fluids discharged from the respective discharge ports are different from each other.

(pattern 7)

In any one of the above-mentioned aspects 1 to 6, the nozzle may further include a suction port which opens downward and sucks fluid.

According to this aspect, the cleaning fluid after cleaning adhering to the contact member can be sucked from the suction port. Thereby, since the cleaning fluid after cleaning can be suppressed from remaining on the contact member for a long period of time, the contact member can be brought into a clean state at an early stage.

(pattern 8)

In any one of the aforementioned aspects 1 to 7, the aforementioned substrate holder may also include: a first holding member that holds the upper surface of the aforementioned substrate; and a second holding member that holds the outer peripheral edge of the lower surface of the aforementioned substrate ; The aforementioned contact member is disposed on the aforementioned second holding member.

(pattern 9)

In order to achieve the above object, the contact member cleaning method of a coating device according to an aspect of the present invention, the aforementioned coating device is provided with: a coating tank; a substrate holder, which is arranged above the anode disposed inside the coating tank A substrate capable of holding a cathode; a contact member disposed on the substrate holder and in contact with the outer peripheral edge of the lower surface of the substrate to feed power to the substrate; and a cleaning device for cleaning the contact member; the cleaning device It has: a rotary shaft, which is arranged outside the region in the radial direction of the substrate holder, and extends in the vertical direction; a first arm, which is connected to the rotary shaft, and extends in the horizontal direction; a second arm, which It extends upward from the end of the first arm opposite to the side connected to the rotary shaft; and a nozzle connected to the upper end of the second arm has a downward opening and spits out at least one of the cleaning fluid. Discharge port; the cleaning method of the contact member includes: moving the nozzle which is moved to the outer area in the radial direction of the substrate holder to the inner area in the radial direction of the substrate holder by rotating the rotary shaft The nozzle does not interfere with the lifting position of the substrate holder. Then, by lowering the substrate holder, the contact member is positioned below the discharge port. Next, the nozzle is moved by rotating the rotary shaft. After reaching the cleaning position where the discharge port faces the contact member in the inner region, the substrate holder is rotated and the cleaning fluid is discharged from the discharge port.

In this aspect, the contact member can be cleaned by the cleaning device having a simple structure.

10: Plating tank

10a: Bottom

10b: Peripheral part

11: anode

12: resistor body

15: overflow tank

20: Substrate holder

21: first holding member

22: Second holding member

23: Connecting components

25: Outer area

26: Inner area

30: Rotating mechanism

31: axis of rotation

35: Tilt mechanism

36: Lifting mechanism

37: pivot

40: Contact member

45: sealing member

50: cleaning device

51: rotary axis

52: Actuator

53: First Arm

54: Second Arm

55: Nozzle

56a, 56b, 56c: Slots

57a, 57b, 57c: pump

58a, 58b, 58c: Piping

59a, 59b: outlet

60: suction port

61a, 61b, 61c: internal flow path

400: Plating module

800: Control module

1000: Plating device

La, Lb: cleaning fluid

Ps: plating solution

R1: the first direction of rotation

R2: Second direction of rotation

XL1, XL2, XL3: axis

Wf: Substrate

Wfa: below

Wfb: above

Fig. 1 is a perspective view showing the overall configuration of a coating device according to an embodiment.

Fig. 2 is a plan view showing the overall configuration of the coating device of the embodiment.

Fig. 3 is a structural schematic diagram of a coating module of the coating device of the embodiment.

Fig. 4 is a schematic view showing a state where the substrate of the embodiment is immersed in a plating solution.

Fig. 5(A) is a cross-sectional view schematically showing a part of the substrate holder according to the embodiment. Fig. 5(B) is a schematic cross-sectional view of the peripheral structure of the contact member of the embodiment.

Fig. 6 is a diagram schematically showing the overall configuration of the cleaning device of the embodiment.

Fig. 7 is a schematic plan view of a part of the cleaning device according to the embodiment.

Fig. 8 is a top view schematically showing the movement of the nozzle of the embodiment.

Fig. 9 is an example of a flow chart showing a series of controls performed when cleaning the contact member according to the embodiment.

Fig. 10 is a schematic diagram for explaining a modified example of the second arm of the embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the drawings are schematic illustrations for easy understanding of the characteristics of things, and the dimensions, ratios, etc. of each component may not necessarily be the same as the actual ones. In addition, X-Y-Z orthogonal coordinates are shown in some drawings for reference. The Z direction in the orthogonal coordinates corresponds to the upper side, and the -Z direction corresponds to the lower side (the direction in which gravity acts).

Fig. 1 is a perspective view showing the overall configuration of a coating device according to this embodiment. Fig. 2 is a plan view showing the overall configuration of the coating device of the present embodiment. As shown in Figures 1 and 2, the plating device 1000 has: a loading port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, A spin rinse dryer 600 , a conveying device 700 , and a control module 800 .

The loading port 100 is used to load substrates stored in a cassette such as a FOUP (Front Opening Pod) not shown in the figure in the coating apparatus 1000 , or a module for unloading substrates from the coating apparatus 1000 to a cassette. In this embodiment, four loading ports 100 are arranged side by side in the horizontal direction. However, the number and configuration of the loading ports 100 no matter what. The transfer robot 110 is a robot for transferring substrates, and is configured to transfer substrates between the load port 100 , the aligner 120 , and the transfer device 700 . When the transfer robot 110 and the transfer device 700 transfer the substrate between the transfer robot 110 and the transfer device 700 , the transfer of the substrate can be performed via a temporary stand (not shown).

The aligner 120 is a module for aligning the orientation range of the substrate or the positions of the grooves and the like to a specified direction. In this embodiment, two aligners 120 are arranged in parallel in the horizontal direction, but the number and arrangement of the aligners 120 are not limited. The pre-wetting module 200 wets the plated surface of the substrate before the plating process with a process liquid such as pure water or degassed water, and replaces the air inside the pattern formed on the surface of the substrate with the process liquid. The pre-wetting module 200 is configured to perform pre-wetting treatment for easily supplying the plating solution inside the pattern by replacing the treatment solution inside the pattern with the plating solution during plating. In this embodiment, two pre-humidity modules 200 are arranged side by side in the vertical direction, but the number and arrangement of the pre-humidity modules 200 are not limited.

The prepreg module 300 is used, for example, to etch and remove the high-resistance oxide film formed on the surface of the seed layer of the plated surface of the substrate before the plating process by etching with a treatment solution such as sulfuric acid or hydrochloric acid, and to clean or activate the plating. The method of pre-preg treatment of the substrate surface is formed. In this embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the prepreg modules 300 are not limited. The plating module 400 performs plating treatment on the substrate. In this embodiment, there are 2 sets of 12 plating modules 400, 3 of which are arranged side by side in the vertical direction and 4 in the horizontal direction, and a total of 24 plating modules 400 are installed, but only one of the plating modules 400 The quantity and configuration are not limited.

The cleaning module 500 is configured to perform cleaning processing on the substrate in order to remove the plating solution and the like remaining on the substrate after the plating processing. In this embodiment, two cleaning modules 500 are arranged side by side in the vertical direction, but the number and arrangement of the cleaning modules 500 are not limited. The spin rinse dryer 600 is a module used to dry the cleaned substrate by rotating it at high speed. In this embodiment, two units are arranged side by side in the vertical direction Spin rinsing dryers, but the number and configuration of spin rinsing dryers are not limited. The transfer device 700 is a device for transferring substrates between a plurality of modules in the plating device 1000 . The control module 800 is configured to control a plurality of modules of the coating device 1000, and can be configured, for example, by a general computer or a dedicated computer having an input/output interface with an operator.

An example of a series of plating processes in the plating apparatus 1000 will be described below. First, the substrate stored in the cassette is loaded into the loading port 100 . Continuing, the transfer robot 110 takes out the substrate from the cassette of the loading port 100 and transfers the substrate to the aligner 120 . The aligner 120 aligns the orientation range of the substrate or the positions of grooves and the like in a specified direction. The transfer robot 110 transfers the substrate aligned by the aligner 120 to the transfer device 700 .

The transfer device 700 transfers the substrate received from the transfer robot 110 to the pre-humidity module 200 . The pre-wet module 200 performs pre-wet treatment on the substrate. The conveying device 700 conveys the pre-wetted substrate to the prepreg module 300 . The prepreg module 300 performs prepreg treatment on the substrate. The conveying device 700 conveys the prepreg-processed substrate to the coating module 400 . The plating module 400 performs plating treatment on the substrate.

The transport device 700 transports the plated substrate to the cleaning module 500 . The cleaning module 500 cleans the substrate. The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600 . The spin rinse dryer 600 dries the substrate. The transfer device 700 transfers the dried substrate to the transfer robot 110 . The transfer robot 110 transfers the substrate received from the transfer device 700 to the cassette of the load port 100 . Finally, the cassette containing the substrate is carried out from the load port 100 .

In addition, the configuration of the coating apparatus 1000 described in FIGS. 1 and 2 is merely an example, and the configuration of the coating apparatus 1000 is not limited to those shown in FIGS. 1 and 2 .

Next, the plating module 400 will be described. In addition, since the plurality of plating modules 400 included in the plating apparatus 1000 of this embodiment have the same configuration, one plating module 400 will be described.

Fig. 3 is a structural schematic diagram of the coating module 400 of the coating device 1000 of the present embodiment. FIG. 4 is a schematic diagram showing a state where the substrate Wf is immersed in the plating solution Ps. The coating device 1000 of this embodiment is a cup-type coating device. The coating module 400 of the coating device 1000 mainly includes: a coating tank 10 , an overflow tank 15 , a substrate holder 20 , a rotating mechanism 30 , a tilting mechanism 35 , a lifting mechanism 36 , and a contact member 40 . In addition, the plating module 400 also includes a cleaning device 50 ( FIG. 6 etc.) described later, but the illustration of the cleaning device 50 is omitted in FIGS. 3 and 4 . In addition, in FIG. 3 , a part of the coating module 400 (plating tank 10 , overflow tank 15 , substrate holder 20 , etc.) is schematically shown in cross section.

The plating tank 10 of this embodiment is comprised by the bottomed container which has an opening in the upper part. Specifically, the plating tank 10 has: a bottom 10a; and an outer peripheral portion 10b extending upward from the outer peripheral edge of the bottom 10a; and an upper opening of the outer peripheral portion 10b. In addition, the shape of the outer peripheral part 10b of the coating tank 10 is not specifically limited, An example of the outer peripheral part 10b of this embodiment has a cylindrical shape.

The plating solution Ps is stored inside the plating tank 10 . A supply port (not shown) for supplying the plating solution Ps to the plating tank 10 is provided in the plating tank 10 . The plating liquid Ps should just be a solution containing the ion of the metal element which comprises a plating film, and the specific example is not specifically limited. In this embodiment, an example of the plating treatment is a copper plating treatment, and an example of the plating solution Ps is a copper sulfate solution. In addition, in this embodiment, predetermined additives are contained in the plating solution Ps. However, it is not limited to this configuration, and the plating solution Ps may be configured without any additives.

The anode 11 is arranged inside the plating solution Ps of the plating tank 10 . The specific type of the anode 11 is not particularly limited, and a soluble anode or an insoluble anode can be used. In this embodiment, the anode 11 is an insoluble anode. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, and the like can be used.

The overflow tank 15 is constituted by a bottomed container disposed in the outer region in the radial direction of the coating tank 10 . The overflow tank 15 is for temporarily storing the plating solution exceeding the upper end of the outer peripheral portion 10b of the plating tank 10 Ps (that is, the plating solution Ps overflowing from the plating tank 10) is provided. A discharge port (not shown) for discharging the plating solution Ps of the overflow tank 15 from the overflow tank 15 is provided in the overflow tank 15 . The plating solution Ps discharged from the discharge port is temporarily stored in a storage tank (not shown), and then supplied to the plating tank 10 from the supply port again.

A porous resistor 12 is disposed above the anode 11 inside the plating tank 10 . The resistor 12 is constituted by a porous plate member having a plurality of holes (pores). The plating solution Ps on the lower side of the resistive body 12 can flow to the upper side of the resistive body 12 through the resistive body 12 . The resistor 12 is a member provided for uniforming the electric field formed between the anode 11 and the substrate Wf. Therefore, since the plating apparatus 1000 has the resistor 12, it is possible to easily achieve uniformity of the film thickness of the plating film (plating layer) formed on the substrate Wf.

The substrate holder 20 is a member for holding the substrate Wf as a cathode. The lower surface Wfa of the substrate Wf corresponds to the surface to be plated. The substrate holder 20 is connected to the rotation shaft 31 of the rotation mechanism 30 . The rotation mechanism 30 is a mechanism for rotating the substrate holder 20 . The rotation mechanism 30 can use known mechanisms such as motors.

The tilt mechanism 35 is a mechanism for tilting the rotation mechanism 30 and the substrate holder 20 . Tilt mechanism 35 can use known tilt mechanism such as piston, cylinder. The elevating mechanism 36 is supported by a support shaft 37 extending in the vertical direction. The elevating mechanism 36 is a mechanism for elevating the substrate holder 20 , the rotating mechanism 30 , and the tilting mechanism 35 in the vertical direction. As the lifting mechanism 36, known lifting mechanisms such as direct-acting actuators can be used.

As shown in FIG. 4 , when the coating process is performed on the lower surface Wfa (surface to be coated) of the substrate Wf, the rotating mechanism 30 rotates the substrate holder 20, and the elevating mechanism 36 moves the substrate holder 20 to the bottom, so that the substrate Wf It is immersed in the plating solution Ps of the plating tank 10 . In addition, when the substrate Wf is immersed in the plating solution Ps, the tilt mechanism 35 can also tilt the substrate holder 20 as necessary. After immersing the substrate Wf in the plating solution Ps, an electric current flows between the anode 11 and the substrate Wf by means of an energizing device (not shown). Thereby, a plated film is formed on the lower surface Wfa of the substrate Wf.

The action of the coating module 400 is controlled by the control module 800 . The control module 800 is provided with a microcomputer including: a CPU (Central Processing Unit) 801 as a processor; a memory unit 802 as a permanent storage medium, and the like. The control module 800 controls the controlled part of the coating module 400 by operating the CPU 801 as a processor according to the instructions of the program stored in the memory part 802 .

FIG. 5(A) is a cross-sectional view schematically showing an enlarged part of the substrate holder 20 (part A1 in FIG. 3 ). Referring to FIG. 3 and FIG. 5(A), the substrate holder 20 of this embodiment includes: a first holding member 21 holding the upper surface Wfb of the substrate Wf; and a second holding member 22 holding the outer periphery of the lower surface Wfa of the substrate Wf. The first holding member 21 of this embodiment has a disc shape. The second holding member 22 of this embodiment has a ring shape. The substrate holder 20 holds the substrate Wf with the substrate Wf sandwiched between the first holding member 21 and the second holding member 22 .

The first holding member 21 is connected to the lower end of the rotating shaft 31 . Specifically, the first holding member 21 of this embodiment is connected to the rotation shaft 31 in a detachable connection form (detachable connection form) from the rotation shaft 31 . In addition, the second holding member 22 of the present embodiment is connected to an intermediate portion of the rotating shaft 31 via a connecting member 23 .

In addition, the second holding member 22 of the present embodiment holds the outer peripheral edge of the lower surface Wfa of the substrate Wf via the sealing member 45 . The sealing member 45 is a member for preventing the plating solution Ps from coming into contact with the contact member 40 described later when the substrate Wf is immersed in the plating solution Ps. The sealing member 45 of this embodiment has a ring shape.

The contact member 40 is disposed on the substrate holder 20 . Specifically, the contact member 40 of this embodiment is disposed on the second holding member 22 of the substrate holder 20 . The contact member 40 is a member for feeding power to the substrate Wf by contacting the outer peripheral edge of the lower surface Wfa of the substrate Wf.

FIG. 5(B) is a schematic cross-sectional view (cross-sectional view along line B1-B1) of the peripheral configuration of the contact member 40 . In addition, in FIG. 5(B), illustration of the 1st holding member 21 and the board|substrate Wf is abbreviate|omitted. Referring to Figure 5(A) 5(B), a plurality of contact members 40 are arranged in the circumferential direction of the substrate holder 20 (specifically, in the circumferential direction of the second holding member 22).

Specifically, the plurality of contact members 40 of the present embodiment are equally arranged in the circumferential direction of the substrate holder 20 . The number of the plurality of contact members 40 is not particularly limited, but an example of this embodiment is twelve. The plurality of contact members 40 are electrically connected to an energizing device (not shown), and supply electric power supplied from the energizing device to the substrate Wf.

Next, the cleaning device 50 will be described. FIG. 6 is a diagram schematically showing the overall configuration of the cleaning device 50 . The cleaning device 50 is a device for cleaning the contact member 40 . Specifically, the cleaning device 50 of the present embodiment is provided with: a rotary shaft 51, an actuator 52, a first arm 53, a second arm 54, a nozzle 55, grooves (groove 56a, groove 56b, groove 56c), a pump ( pump 57a, pump 57b, pump 57c), and piping (piping 58a, piping 58b, piping 58c).

The rotary shaft 51 is arranged in a region outside the substrate holder 20 in the radial direction of the substrate holder 20 . Specifically, the rotary shaft 51 of the present embodiment is arranged in the outer area of the substrate holder 20 and the outer area of the plating tank 10 . The rotary shaft 51 extends in the vertical direction. The upper end of the rotary shaft 51 is connected to the actuator 52 .

The actuator 52 is disposed outside the substrate holder 20 and coats the outside area of the plating tank 10 . The actuator 52 is controlled by the control module 800 to make the rotary shaft 51 rotate in the first rotation direction ( R1 ) and the second rotation direction ( R2 ). For the actuator 52 , for example, an electric motor that can rotate in the first rotation direction ( R1 ) and the second rotation direction ( R2 ) can be used.

The first arm 53 is connected to the lower end of the rotating shaft 51 and extends in the horizontal direction. The second arm 54 extends upward from the end of the first arm 53 on the opposite side to the side connected to the rotary shaft 51 . The first arm 53 and the second arm 54 function as connecting arms connecting the rotary shaft 51 and the nozzle 55 . First The arm 53 and the second arm 54 rotate integrally with the rotary shaft 51 when the rotary shaft 51 rotates. The lengths of the first arm 53 and the second arm 54 are set so that when the nozzle 55 is located at a cleaning position described later, the discharge port and the suction port behind the nozzle 55 face the contact member 40 .

The nozzle 55 is connected to the upper end of the second arm 54 . The nozzle 55 has at least one discharge port for directly discharging a cleaning fluid “cleaning fluid” toward the contact member 40 . Specifically, the nozzle 55 of the present embodiment has a plurality of discharge ports, and one example thereof has two discharge ports (discharge port 59a, discharge port 59b). However, the number of discharge ports which the nozzle 55 has is not limited to two, and may be more or less than two.

The discharge port 59a and the discharge port 59b open downward. The discharge port 59 a is configured to discharge the cleaning fluid La downward and directly toward the contact member 40 , and the discharge port 59 b is configured to discharge the cleaning fluid Lb of a different type from the cleaning fluid La directly downward to the contact member 40 . That is, in the present embodiment, the types of cleaning fluids that are directly discharged from the respective discharge ports to the contact member are different from each other. Specific examples of the cleaning fluid will be described later.

Moreover, the nozzle 55 of this embodiment also has the suction port 60. As shown in FIG. The suction port 60 opens downward and is configured to suck fluid.

Inside the nozzle 55 of this embodiment, an internal flow path 61a, an internal flow path 61b, and an internal flow path 61c are provided. The downstream end of the internal flow path 61 a communicates with the discharge port 59 a , the downstream end of the internal flow path 61 b communicates with the discharge port 59 b , and the upstream end of the internal flow path 61 c communicates with the suction port 60 .

The upstream end of the internal flow path 61a communicates with the groove 56a via the pipe 58a. The upstream end of the internal flow path 61b communicates with the groove 56b via the pipe 58b. The downstream end of the internal flow path 61c communicates with the tank 56c via the pipe 58c. The pump 57a for pressure-feeding the cleaning fluid La stored in the tank 56a toward the discharge port 59a is arranged in the piping 58a. In the piping 58b, the cleaning fluid Lb stored in the tank 56b is pressure-fed toward the discharge port 59b. The pump 57b. The pump 57c for pressure-feeding the fluid sucked from the suction port 60 toward the tank 56c is arranged in the piping 58c. The actions of the pump 57 a , the pump 57 b and the pump 57 c are controlled by the control module 800 .

When the pump 57a operates under the command of the control module 800, the cleaning fluid La in the tank 56a passes through the pipe 58a and the internal flow path 61a, and is discharged from the discharge port 59a. Similarly, when the pump 57b operates, the cleaning fluid Lb in the tank 56b passes through the pipe 58b and the internal flow path 61b, and is discharged from the discharge port 59b. When the pump 57c operates, the internal pressure of the piping 58c and the internal flow path 61c becomes negative pressure, whereby fluid (specifically, cleaning fluid after cleaning) is sucked from the suction port 60 . The fluid sucked by the suction port 60 is stored in the groove 56c through the internal flow path 61c and the piping 58c.

As an example of the cleaning fluid La of this embodiment, neutral water (specifically, pure water) is used. In addition, acidic water is used as an example of the cleaning fluid Lb of this embodiment. As an example of this acidic water of this embodiment, the water containing citric acid (citric acid water) is used. However, this is just an example of the cleaning fluid La and the cleaning fluid Lb, and the specific types of the cleaning fluid La and the cleaning fluid Lb are not limited thereto.

In addition, the cleaning fluid is not limited to liquid ones. Gases can also be used as the cleaning fluid. When specific examples thereof are given, for example, air may be used as one of the cleaning fluid La and the cleaning fluid Lb. In addition, the tank 56a is unnecessary when air is used for the cleaning fluid La. Similarly, the groove 56b is unnecessary when air is used as the cleaning fluid Lb.

FIG. 7 is a schematic top view of a part of the cleaning device 50 . In addition, illustration of the actuator 52 is abbreviate|omitted in FIG. 7 (about this, FIG. 8 mentioned later is also the same). In addition, in FIG. 7, the nozzle 55 is located in the elevation position mentioned later. The nozzle 55 of this embodiment has a shape (specifically, a rectangular shape) extending toward the side of the rotary shaft 51 starting from the upper end of the second arm 54 . When viewed in a plane (or viewed from above), the angle θ formed by the axis XL1 extending in the length direction of the nozzle 55 and the axis XL2 extending in the length direction of the first arm 53 (the angle formed when viewed from the side of the rotary shaft 51) is proportional to 0 degrees (°) greater than 90 degrees (°) A small angle is, specifically, an angle of not less than 10 degrees and not more than 70 degrees. More specifically, the formed angle θ is an angle of not less than 10 degrees and not more than 60 degrees, more specifically, an angle of not less than 10 degrees and not more than 50 degrees.

As mentioned above, by forming the angle θ of 10 degrees or more and 70 degrees or less, the cleaning fluid discharged from the discharge ports 59a, 59b of the nozzle 55 can easily touch the contact member 40 (see FIG. 8 described later). Thereby, the contact member 40 can be effectively cleaned. However, the angle θ formed above is just an example, and an appropriate value for the angle θ formed in accordance with the length of the first arm 53, the length of the nozzle 55, and the like should be used.

In addition, referring to FIG. 6 and FIG. 7 , the discharge port 59 a, the discharge port 59 b, and the suction port 60 of the present embodiment are arranged in the direction of the axis line XL1 of the nozzle 55 . However, the layout of the discharge port 59a, the discharge port 59b, and the suction port 60 is not limited to this. As another example, the discharge port 59a, the discharge port 59b, and the suction port 60 may be arranged, for example, in a direction perpendicular to the axis XL1 of the nozzle 55 (that is, in the width direction of the nozzle 55).

FIG. 8 is a top view schematically showing the movement of the nozzle 55 . The cleaning device 50 of this embodiment rotates the rotary shaft 51 in the first rotation direction ( R1 ) and the second rotation direction ( R2 ) by the actuator 52 receiving the instruction of the control module 800 , so that the nozzle 55 is held on the substrate. The outer region in the radial direction of the holder 20 (that is, the outer region 25 ) and the inner region in the radial direction of the substrate holder 20 (that is, the inner region 26 ). When performing the process of cleaning the contact member 40, by disposing the nozzle 55 on the inner region 26 of the substrate holder 20, as described later, the cleaning fluid can effectively clean the inner region 26 of the substrate holder 20 including the contact member 40, or effectively Suction cleaning fluid.

Specifically, the control module 800 of this embodiment usually firstly moves the nozzle 55 to the avoiding position of the outer region 25 of the substrate holder 20 . In this embodiment, the avoided position is located on the substrate The outer area 25 of the holder 20 is also located at the outer area of the plating tank 10 . Therefore, the plating process of the above-mentioned substrate Wf in FIG. 4 is performed with the nozzle 55 in the avoided position.

In addition, when the control module 800 performs the process of cleaning the contact member 40 (referred to as “contact member cleaning process”), it performs a series of controls described below. Fig. 9 is an example of a flow chart showing a series of controls performed when cleaning the contact member. Each step in the flow chart of FIG. 9 is executed according to the program of the memory unit 802 by the CPU 801 of the control module 800 . Referring to FIG. 8 and FIG. 9, the contact member cleaning process will be described as follows.

First, the contact member cleaning process of this embodiment is performed in a state where the substrate Wf is detached from the substrate holder 20 . Furthermore, the first holding member 21 of the substrate holder 20 of this embodiment is also in the state of being detached from the plating module 400, and the contact member cleaning process is performed.

For example, when the control module 800 has a control command "cleaning start command" of the gist of starting the cleaning process of the contact member, it starts the flow chart of FIG. 9 . When giving an example, for example, operating the operation switch (this is the operation switch operated by the user) for transmitting the cleaning start command to the control module 800, the cleaning start command is transmitted to the control module 800, and the control module When 800 receives the transmission start cleaning command, the control module 800 starts the flow chart of FIG. 9 .

In step S10 of FIG. 9 , the control module 800 controls the actuator 52 to rotate the rotary shaft 51 in the first rotation direction ( R1 ), so that the nozzle 55 moved to the avoiding position of the outer region 25 moves to the substrate holder 20 The nozzle 55 in the inner region 26 does not interfere with the position of the substrate holder 20 in the "lift position".

Next, the control module 800 lowers the substrate holder 20 by the elevating mechanism 36, so that the contact member 40 is located below the discharge ports 59a, 59b and the suction port 60 of the nozzle 55 (step S11).

Then, the control module 800 controls the actuator 52 to make the nozzle 55 move to the inner region 26 in contact with the discharge ports 59a, 59b and the suction port 60 by rotating the rotary shaft 51 in the first rotation direction (R1). The relative "cleaning position" of the member 40 (step S12).

Then, the control module 800 rotates the substrate holder 20 by the rotation mechanism 30, and starts the operation of the pump 57a, the pump 57b, and the pump 57c, and starts to discharge the cleaning fluid La from the discharge port 59a and discharge the cleaning fluid La from the discharge port 59b. The cleaning fluid Lb is sucked from the suction port 60 (step S13). Thereby, the contact member 40 can be rotated, and discharge of the cleaning fluid La from the discharge port 59 a , discharge of the cleaning fluid Lb from the discharge port 59 b , and suction of the fluid from the suction port 60 can be started.

In this step S13, the cleaning fluid La discharged from the discharge port 59a and the cleaning fluid La discharged from the discharge port 59a can be discharged from the discharge port 59a by rotating the contact member 40 and discharging the cleaning fluid La from the discharge port 59a and the cleaning fluid Lb from the discharge port 59b. The cleaning fluid Lb spouted by 59 b effectively touches the contact member 40 to clean the contact member 40 .

In addition, according to this embodiment, as described above, the nozzle 55 not only has the discharge port but also has the suction port 60. In step S13, since the fluid is also sucked from the suction port 60, it is possible to suck and adhere to the contact member 40 from the suction port 60. The cleaning fluid after cleaning. Thereby, the cleaning fluid after cleaning (contaminated cleaning fluid) can be suppressed from remaining on the contact member 40 for a long period of time. As a result, the contact member 40 can be brought into a clean state at an early stage.

In addition, the control module 800 of the present embodiment simultaneously performs discharge of the cleaning fluid La from the discharge port 59a, discharge of the cleaning fluid Lb from the discharge port 59b, and suction of the fluid from the suction port 60 in step S13, but it is not limited to this. . In step S13, discharge of the cleaning fluid La from the discharge port 59a, discharge of the cleaning fluid Lb from the discharge port 59b, and suction of the fluid from the suction port 60 may be performed at different timings.

In this example, for example, in step S13 , the cleaning fluid La may be first discharged from the discharge port 59 a, then the cleaning fluid Lb may be discharged from the discharge port 59 b, and then the fluid may be suctioned from the suction port 60 . Alternatively, in step S13 , the cleaning fluid Lb may be discharged from the discharge port 59 b first, then the cleaning fluid La may be discharged from the discharge port 59 a, and then the fluid may be sucked from the suction port 60 . Alternatively, ejection and suction may be performed in an order other than these.

In addition, the conditions for ending the control of step S13 are not particularly limited. For example, the control module 800 may end the control of step S13 after a preset specified time elapses from the start of controlling step S13. That is, at this time, step S13 is performed within a specified time.

Alternatively, the control module 800 may end the control in step S13 when there is a "cleaning end command" of the control command to end the execution of the contact member cleaning process. When citing this example, for example, the operation switch used to transmit the end cleaning command to the control module 800 can also be operated, and the end cleaning command is transmitted to the control module 800. When the control module 800 receives the transmitted end cleaning When commanded, the control module 800 ends the control of step S13.

In addition, the control module 800 of this embodiment performs the following control specifically, when finishing the control of step S13. First, the control module 800 stops the rotation of the substrate holder 20 by the rotation mechanism 30, stops the operation of the pump 57a, the pump 57b, and the pump 57c, and discharges the cleaning fluid from the discharge ports 59a, 59b, And the suction of cleaning fluid from the suction port 60 is stopped. Next, the control module 800 rotates the rotating shaft 51 in the second rotation direction ( R2 ), and returns the nozzle 55 to the lifting position. Then, the control module 800 raises the substrate holder 20 to be higher than the nozzle 55 through the lifting mechanism 36 . Then, the control module 800 rotates the rotating shaft 51 in the second rotation direction ( R2 ), and returns the nozzle 55 to the avoiding position of the outer area 25 .

In addition, the cleaning method of the contact member of the plating apparatus 1000 of this embodiment is realized by the above-mentioned plating apparatus 1000. Therefore, in order to omit repeated description, the description of the contact member cleaning method is omitted.

According to the present embodiment as described above, the contact member 40 can be cleaned as described above by the cleaning device 50 having a simple structure. Thereby, the cost of the cleaning device 50 can be reduced, and the degradation of the plating quality of the substrate Wf due to contamination of the contact member 40 can be suppressed.

In addition, according to the present embodiment, the nozzle 55 can be arranged at a position farther from the connection position of the first arm 53 in the rotary shaft 51 by the two arms of the first arm 53 and the second arm 54 . Thereby, the contact member 40 can be effectively cleaned.

In addition, according to this embodiment, since the nozzle 55 can be rotated and moved by rotating the rotary shaft 51, the cleaning position of the cleaning fluid can be easily changed. Thereby, a wide area can be cleaned easily.

In addition, during the cleaning of the contact member 40 in the above-mentioned contact member cleaning process (in execution of step S13 ), that is, while the substrate holder 20 is rotated and the cleaning fluid is discharged from the discharge port, the rotary shaft 51 may also be rotated. The first rotation direction ( R1 ) and the second rotation direction ( R2 ) rotate alternately, and the contact member 40 is cleaned. With this configuration, the nozzle 55 can be swung about the rotary shaft 51 and the contact member 40 can be cleaned. Thereby, the contact member 40 can be effectively cleaned.

In addition, in the above-mentioned embodiment, the second arm 54 is configured so as not to incline with the part of the second arm 54 connected to the first arm 53 as a starting point, but it is not limited to this configuration. FIG. 10 is a schematic diagram for explaining a modified example of the second arm 54. As shown in FIG. Specifically, FIG. 10 schematically illustrates the situation in which the second arm 54 in the lifting position is recognized from the direction of the axis XL2 of the first arm 53 . For example, the second arm 54 can also connect the part of the second arm 54 connected to the first arm 53 (that is, the part connected to the first arm 53 The end portion on the opposite side to the side connected to the rotary shaft 51) is used as a starting point to be obliquely connected to the end portion of the first arm 53. With this configuration, the discharge direction of the cleaning fluid from the discharge port of the nozzle 55 can be easily adjusted by tilting the second arm 54 .

Specifically, the second arm 54 may be connected to the end of the first arm 53 so as to be inclined at a predetermined angle (θ2) in the vertical direction, starting from the part of the second arm 54 connected to the first arm 53 . For the specified angle (θ2), for example, an angle larger than 0 degrees (°) and smaller than 20 degrees (°) can be used.

More specifically, when the second arm 54 illustrated in FIG. 10 is recognized from the axis XL2 direction of the first arm 53, the axis XL3 extending in the length direction of the second arm 54 connects the second arm 54 to the first arm 54. The part of an arm 53 is used as a starting point, and can be connected to the end of the first arm 53 in a manner inclined at a specified angle (θ2) to the vertical direction (vertical direction to the ground) on one side and/or the other side.

In addition, when the second arm 54 is recognized from a direction perpendicular to the axis XL2 of the first arm 53 and a horizontal direction (for example, the Y direction in FIGS. 6 and 10 ), the axis extending in the length direction of the second arm 54 is used. The XL3 uses the part of the second arm 54 connected to the first arm 53 as a starting point, and is connected to the end of the first arm 53 in such a way that it can be inclined at a predetermined angle (θ2) in the vertical direction.

Above, the embodiments of the present invention have been described in detail, but the present invention is not limited to the embodiments, and various modifications and changes can be made within the scope of the present invention described in the claims.

20: Substrate holder

22: Second holding member

25: Outer area

26: Inner area

40: Contact member

50: cleaning device

51:Rotary axis

52: Actuator

53: First Arm

54: Second Arm

55: Nozzle

56a, 56b, 56c: Slots

57a, 57b, 57c: pump

58a, 58b, 58c: Piping

59a, 59b: outlet

60: suction port

61a, 61b, 61c: internal flow path

La, Lb: cleaning fluid

Claims (9)

A coating device is provided with: a coating tank; a substrate holder, which is arranged above the anode inside the coating tank, and can hold a substrate as a cathode; a rotating mechanism, which makes the substrate holder rotation; a lift mechanism, which lifts the aforementioned substrate holder; a contact member, which is arranged on the aforementioned substrate holder, and contacts the outer peripheral edge of the lower surface of the aforementioned substrate to feed power to the aforementioned substrate; and a cleaning device, which is used for cleaning The aforementioned contact member; the aforementioned cleaning device has: a rotary shaft, which is arranged outside the area in the radial direction of the aforementioned substrate holder, and extends in the vertical direction; a first arm, which is connected to the aforementioned rotary shaft, and extends in the horizontal direction extending; the second arm, which extends upward from the end of the first arm opposite to the side connected to the rotary shaft; and the nozzle, which is connected to the upper end of the second arm and has an opening facing downward, And at least one discharge port that directly discharges the cleaning fluid to the contact member; and is configured to clean the contact member by contacting the contact member with the cleaning fluid discharged from the discharge port. The coating device according to claim 1, wherein the nozzle extends toward the side of the rotary shaft with the upper end of the second arm as a starting point, and when viewed in a plan view, the axis extending in the longitudinal direction of the nozzle is the same as that in the first arm The angle formed by the axes extending in the longitudinal direction is not less than 10 degrees and not more than 70 degrees. Such as the coating device of claim 1, which further has a control module, which is to control the aforementioned rotating mechanism, the aforementioned lifting mechanism, and the aforementioned cleaning device. When the aforementioned control module performs the cleaning process of cleaning the contact member, By rotating the rotary shaft, the nozzles that move to the outside area in the radial direction of the substrate holder are moved to the plane viewing angle below the substrate holder. The radial direction of the substrate holder is raised and lowered in the inner area, and then the substrate holder is lowered by the lifting mechanism, so that the contact member is positioned below the discharge port, and then the rotary shaft is rotated, so that the The nozzle moves to a cleaning position where the discharge port in the inner region faces the contact member, and then the substrate holder is rotated by the rotation mechanism, and the cleaning fluid is discharged from the discharge port. The coating device according to claim 3, wherein the control module rotates the substrate holder through the rotating mechanism, and makes the rotating shaft rotate in the first rotation direction and in the same direction as the cleaning fluid is discharged from the discharge port. The second rotation direction opposite to the aforementioned first rotation direction rotates alternately. The coating device according to claim 1, wherein the second arm is connected to the end of the first arm obliquely by using the part of the second arm connected to the first arm as a starting point. The coating device according to claim 1, wherein at least one of the discharge ports includes a plurality of discharge ports, and the types of the cleaning fluids discharged from the respective discharge ports are different from each other. The coating device according to claim 1, wherein the nozzle is further provided with a suction port which opens downward and sucks fluid. As the coating device of claim 1, wherein the aforementioned substrate holder is provided with: a first holding member, which holds the upper surface of the aforementioned substrate; and a second holding member, which holds the outer peripheral edge of the lower surface of the aforementioned substrate; the aforementioned contact member is arranged on The aforementioned second holding member. A method for cleaning a contact member of a plating device, the aforementioned plating device comprising: a plating tank; a substrate holder disposed above the anode disposed inside the aforementioned coating tank and capable of holding a substrate serving as a cathode; a contact member , which is arranged on the aforementioned substrate holder, and is in contact with the outer peripheral edge of the lower surface of the aforementioned substrate to feed power to the aforementioned substrate; and a cleaning device, which cleans the aforementioned contact member; the aforementioned cleaning device has: a rotary shaft, which is tied to the aforementioned The radial direction of the substrate holder is arranged in the outer area and extends in the vertical direction; the first arm is connected to the aforementioned rotary shaft and extends in the horizontal direction; the second arm is connected to the aforementioned first arm. The end portion on the opposite side of the aforementioned rotary shaft extends upward; and the nozzle, which is connected to the upper end of the aforementioned second arm, has at least one outlet that opens downward and directly ejects the cleaning fluid to the aforementioned contact member; the aforementioned The contact member cleaning method includes: rotating the rotary shaft, and moving the nozzle that moves to the outside area in the radial direction of the substrate holder in the plane viewing angle below the substrate holder to the area located on the substrate holder. The lifting position of the inner region in the radial direction of the substrate holder in the plane view below the device, then, by lowering the substrate holder, the contact member is positioned below the discharge port, and then, by making the substrate holder lower The rotary shaft rotates to move the nozzle to a cleaning position where the discharge port faces the contact member in the inner region, and then rotates the substrate holder to discharge the cleaning fluid directly from the discharge port to the contact member. .

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