TWI790324B - Micro electrical-mechanical pump module - Google Patents

Abstract

A micro electrical-mechanical pump module is disclosed and comprises a microprocessor and a micro electrical-mechanical chip. The microprocessor sends a control signal. The micro electrical-mechanical chip electrically connects to the microprocessor and comprises a chip main body, plural micro electrical-mechanical pumps, plural connecting electrodes and at least one common electrode. The chip main body is a rectangular structure and comprises a shorter side. The plural micro electrical-mechanical pumps are disposed on the chip main body and each of them comprises a first electrode and a second electrode. The plural connecting electrodes are disposed on the chip main body, located nearby the shorter side, and respectively electrically connected to the first electrodes of the plural micro electrical-mechanical pumps. The at least one common electrode is disposed on the chip main body, located nearby the shorter side, and electrically connected to the second electrodes of the plural micro electrical-mechanical pumps. The microprocessor electrically connects to the plural connecting electrodes and the at least one common electrode, so as to transmit the control signal to the plural micro electrical-mechanical pumps.

Description

MEMS Pump Module

This case is about a microelectromechanical pump module, especially a microelectromechanical pump module that uses common electrodes to reduce the contacts of the microprocessor, thereby simplifying the contacts and wiring of the microelectromechanical pump.

With the rapid development of science and technology, the application of fluid conveying devices is becoming more and more diversified. For example, industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., and even the recent popular wearable devices can be seen. It can be seen that the traditional The pump has been gradually trending toward the miniaturization of the device, but it is difficult to reduce the size of the traditional pump to the millimeter level, so the current micro-fluid delivery device can only use the piezoelectric pump structure as the micro-fluid delivery device.

Although micro-electromechanical pumps can miniaturize the volume of the pump to the micron level, micro-level micro-electromechanical pumps will limit the amount of fluid transfer due to the small volume, so multiple micro-electromechanical pumps are required to be used together. Please refer to As shown in Figure 1, the current microelectromechanical pump modules are individually controlled by a high-end microprocessor 1, but the high-end microprocessor 1 itself is expensive, and each microelectromechanical pump 2 requires two microprocessors. Connecting to the device pin 11 increases the cost of the high-end microprocessor 1, resulting in the high cost of the micro-electro-mechanical pump module, which is difficult to popularize. Therefore, how to reduce the cost of the drive end of the micro-electro-mechanical pump module is the primary problem for the current micro-electro-mechanical pump. difficulties.

The main purpose of this case is to provide a microelectromechanical pump module, which reduces the contacts of the microprocessor through the common electrode, reduces the contacts and wiring of the microelectromechanical pump module, and further simplifies the microelectromechanical pump module.

In order to achieve the above purpose, the more general implementation of this case is to provide a microelectromechanical pump module, including: a microprocessor that sends a control signal; a microelectromechanical chip that is electrically connected to the microprocessor, and the microelectromechanical chip includes : A chip body is a rectangular shape with a short side; a plurality of micro-electromechanical pumps are arranged on the chip body and have a first electrode and a second electrode respectively; a plurality of connection electrodes are arranged on the chip The main body and adjacent to the short side, the connection electrodes are respectively electrically connected to the first electrodes of the micro-electromechanical pumps; and at least one common electrode is arranged on the chip body and adjacent to the short side, and the at least one common electrode is electrically connected to the micro-electromechanical pumps The second electrode; wherein, the microprocessor is electrically connected to the connection electrodes and the at least one common electrode, so as to transmit the control signal to the micro-electromechanical pumps.

100:MEMS pump module

1: High-end microprocessor

11: Microprocessor pin

2: microelectromechanical pump

3: Microprocessor

4: microelectromechanical chip

41: chip body

41a: Long side

41b: short side

42: microelectromechanical pump

42a: first electrode

42b: second electrode

42c: piezoelectric element

421: The first MEMS pump group

422: The second MEMS pump group

423: The third MEMS pump group

424: The fourth MEMS pump group

43: common electrode

43a: the first common electrode

43b: the second common electrode

43c: the third common electrode

43d: the fourth common electrode

44: Connecting electrodes

FIG. 1 is a schematic diagram of a MEMS pump module in the prior art.

Figure 2 is a schematic diagram of the MEMS pump module of this case.

Fig. 3 is a schematic diagram of the second embodiment of the MEMS chip of the MEMS pump module of this case.

Fig. 4 is a schematic diagram of the third embodiment of the MEMS chip of the MEMS pump module of this case.

Fig. 5 is a schematic diagram of the fourth embodiment of the micro-electro-mechanical chip of the micro-electro-mechanical pump module of the present case.

Fig. 6 is a schematic diagram of the fifth embodiment of the micro-electro-mechanical chip of the micro-electro-mechanical pump module of the present case.

Fig. 7 is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module of this case.

Figure 8A is a schematic diagram of the electrical connection of the MEMS pump in this case.

Fig. 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor of this case.

Fig. 8C is a schematic diagram of the second embodiment of the control signal output by the microprocessor of this case.

Fig. 8D is a schematic diagram of the third embodiment of the control signal output by the microprocessor of this case.

Some typical embodiments embodying the features and advantages of the present application will be described in detail in the description in the following paragraphs. It should be understood that the present case can have various changes in different aspects without departing from the scope of the present case, and the descriptions and diagrams therein are used for illustration in nature rather than limiting the present case.

Please refer to Figure 2, which is a schematic diagram of the MEMS pump module of this case. The microelectromechanical pump module 100 includes: a microprocessor 3 and a microelectromechanical chip 4 . The microelectromechanical chip 4 is electrically connected to the microprocessor 3 , and the microelectromechanical chip 4 includes a chip body 41 , a plurality of microelectromechanical pumps 42 , at least one common electrode 43 and a plurality of connecting electrodes 44 . The chip body 41 is rectangular and has a long side 41a and a short side 41b. The microelectromechanical pumps 42 are all disposed on the chip body 41, and each microelectromechanical pump 42 has a first electrode 42a and a second electrode 42b respectively. And at least one common electrode 43 is also disposed on the chip body 41 and adjacent to the short side 41 b, and is electrically connected to the second electrodes 42 b of all MEMS pumps 42 . The connection electrodes 44 are disposed on the chip body 41 and adjacent to the short side 41 b, and the connection electrodes 44 are respectively electrically connected to the first electrodes 42 a of the MEMS pumps 42 . Wherein, all the connection electrodes 44 and at least one common electrode 43 on the chip body 41 are electrically connected to the microprocessor 3 respectively, so as to receive control signals sent by the microprocessor 3 . In addition, FIG. 2 is also a schematic diagram of the first embodiment of the micro-electromechanical chip of the present invention, and the number of at least one common electrode 43 includes a first common electrode 43a. The number of the common electrode 43 in this embodiment is one, and the second electrodes 42b of all the MEMS pumps 42 are electrically connected to the first common electrode 43a.

Please refer to Figure 3, which is a schematic diagram of the second embodiment of the MEMS chip of the MEMS pump module of this case. At least one common electrode 43 includes a first common electrode 43a and a second common electrode 43b, and the aforementioned plurality of microelectromechanical pumps 42 are divided into a first microelectromechanical pump group 421 and a second microelectromechanical pump group 422 according to their positions. , wherein the microcomputer located in the first microelectromechanical pump group 421 The electric pump 42, its second electrodes 42b are all electrically connected to the first common electrode 43a, and the microelectromechanical pumps 42 located in the second microelectromechanical pump group 422, its second electrodes 42b are all electrically connected to the second common electrode 43b , so as to achieve the effect of partition control. The number of common electrodes 43 in this embodiment is two.

Please refer to Figure 4, which is a schematic diagram of the third embodiment of the MEMS chip of the MEMS pump module of this case. The third embodiment is the same as the second embodiment, there are two common electrodes 43, so the common electrodes 43 also have a first common electrode 43a and a second common electrode 43b, but the first common electrode 43a and the second common electrode 43b are separated It is arranged on both sides of the chip body 41, and the first common electrode 43a is electrically connected to the second common electrode 43b, and the second electrodes 42b of the aforementioned plurality of microelectromechanical pumps 42 are electrically connected to the first common electrode 43a on both sides at the same time and the second common electrode 43b. The third embodiment can reduce the impedance between the second electrode 42 b of the MEMS pump 42 and the common electrode 43 , and reduce the power loss of the second electrode 42 b that is far from the common electrode 43 .

Please refer to Figure 5, which is a schematic diagram of the fourth embodiment of the MEMS chip of the MEMS pump module in this case, at least one common electrode 43 includes a first common electrode 43a, a second common electrode 43b, a third The common electrode 43c and a fourth common electrode 43d. The first common electrode 43a and the third common electrode 43c are arranged at intervals on one side of the wafer body 41, and the second common electrode 43b and the fourth common electrode 43d are arranged at intervals on the other side of the wafer body 41. In this embodiment, the aforementioned The plurality of MEMS pumps 42 are divided into a first MEMS pump group 421 , a second MEMS pump group 422 , a third MEMS pump group 423 and a fourth MEMS pump group 424 according to the location area. The first MEMS pump group 421 is formed by the MEMS pumps 42 adjacent to the first common electrode 43a, and the first common electrode 43a is used for the second electrodes 42b of all the MEMS pumps 42 in the first MEMS pump group 421 Electrical connection; the second microelectromechanical pump group 422 is formed by the microelectromechanical pumps 42 adjacent to the second common electrode 43b, and the second common electrode 43b is provided for the first microelectromechanical pumps 42 of all the microelectromechanical pumps 42 in the second microelectromechanical pump group 422 The two electrodes 42b are electrically connected; the third microelectromechanical pump group 423 is formed by the microelectromechanical pumps 42 adjacent to the third common electrode 43c, and the third common electrode 43c is provided for all the microelectromechanical pumps in the third microelectromechanical pump group 423 The second electrode 42b of the electromechanical pump 42 is electrically connected; the fourth microelectromechanical pump group 424 is formed by the microelectromechanical pump 42 adjacent to the fourth common electrode 43d, and the fourth common electrode 43d is located in the fourth microelectromechanical pump group 424 The second electrodes 42b of all micro-electromechanical pumps 42 are electrically connected, so as to achieve the effect of zone control.

Please refer to Figure 6, which is a schematic diagram of the fifth embodiment of the MEMS chip of the MEMS pump module of this case. This embodiment is the same as the fourth embodiment, having a first common electrode 43a, a second common electrode 43b, a third common electrode 43c, and a fourth common electrode 43d, and their setting positions are also the same, the difference being the first common electrode 43b in this embodiment. A common electrode 43a is electrically connected to the second common electrode 43b, and the third common electrode 43c is electrically connected to the fourth common electrode 43d, and the aforementioned plurality of microelectromechanical pumps 42 are divided into a first microelectromechanical pump group 421 and a second microelectromechanical pump group 421. Pump group 422 . The first microelectromechanical pump group 421 is composed of microelectromechanical pumps 42 adjacent to the first common electrode 43a or adjacent to the second common electrode 43b, and the second microelectromechanical pump group 422 is adjacent to the third common electrode 43c or adjacent to the fourth common electrode 43c. The electrode 43d is composed of the micro-electromechanical pump 42, so as to achieve the function of zone control, and reduce the distance between the common electrode 43 and the second electrode 42b, and reduce the loss of power transmission.

Please refer to Figure 7, which is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module of this case. This embodiment is the same as the fourth embodiment, with the first common electrode 43a, the second common electrode 43b, the third common electrode 43c and the fourth common electrode 43d, and their installation positions are also the same, the difference is that in this embodiment, the first common electrode 43a, the second common electrode 43b, the third common electrode 43c and the fourth common electrode 43c The electrodes 43d are all electrically connected to each other, so that the second electrodes 42b of the aforementioned plurality of microelectromechanical pumps 42 can be electrically connected to the common electrodes 43 that are closer to them, such as the second electrodes 42b of the microelectromechanical pumps 42 adjacent to the first common electrode 43a Then it is electrically connected to the first common electrode 43a, and the second electrode 42b of the microelectromechanical pump 42 adjacent to the second common electrode 43b is electrically connected to the second common electrode 43b, and so on, the common electrode 43 supplies the close microelectromechanical pump 42, which can reduce the loss of each micro-electromechanical pump 42 in transmitting power.

Please refer to Figure 2, Figure 8A and Figure 8B at the same time. Figure 8A is a schematic diagram of the electrical connection of the micro-electromechanical pump of this case, and Figure 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor of this case. The MEMS pump 42 further includes a piezoelectric element 42c. The first electrode 42a and the second electrode 42b transmit voltage to the piezoelectric element 42c, so that the piezoelectric element 42c is deformed due to the piezoelectric effect, thereby changing the internal state of the MEMS pump 42. pressure for fluid delivery. The first electrode 42a of the micro-electromechanical pump 42 is electrically connected to the microprocessor 3 through the connection electrode 44, and the second electrode 42b is electrically connected to the microprocessor 3 through the common electrode 43, wherein the control signal output by the microprocessor 3 includes A certain voltage and a variable voltage. In this embodiment, the variable voltage can be a voltage switched between a first voltage and a second voltage, and the voltage value of the constant voltage is between the voltage value of the first voltage and the voltage value of the second voltage, Moreover, the voltage value of the constant voltage can also be ±10% of the middle value between the voltage value of the first voltage and the voltage value of the second voltage. For example, when the first voltage is 1.5V and the second voltage is -1.5V, the constant voltage is 0V; when the first voltage is 3V and the second voltage is 0V, the constant voltage is 1.5V. The second electrode 42b of the microelectromechanical pump 42 receives a fixed voltage, and the first electrode 42a receives a variable voltage that continuously changes between the first voltage and the second voltage, so that the piezoelectric element 42c is caused by the gap between the first electrode 42a and the second electrode 42b. The continuously changing voltage difference between them creates deformation to transport the fluid. In addition, please continue to refer to Figure 8C and Figure 8D. Figure 8C is a schematic diagram of the second embodiment of the control signal output by the microprocessor in this case, and Figure 8D is a schematic diagram of the third embodiment of the control signal output by the microprocessor in this case. . The variable voltage can also be a voltage that varies continuously between the first voltage and the second voltage. In addition to the square wave in the first embodiment, the control signal can also use a triangular wave (as shown in Figure 8C) and a sine wave (as shown in Figure 8C). Figure 8D).

To sum up, this project provides a microelectromechanical pump module. By allowing the microprocessor to transmit the constant voltage to the second electrode of the microelectromechanical pump through the common electrode, and then transmit the variable voltage to the first electrode of the microelectromechanical pump, it only needs By adjusting the voltage on the first electrode, the voltage difference between the first electrode and the second electrode can be changed, and the piezoelectric element of the MEMS pump can be successfully driven to move to transmit fluid. In addition, the setting of the common electrode can greatly reduce the pins of the microprocessor, and can still effectively control a plurality of micro-electromechanical pumps while reducing the cost of the microprocessor.

This case can be modified in various ways by people who are familiar with this technology, but it does not deviate from the intended protection of the scope of the attached patent application.

100:MEMS pump module

3: Microprocessor

4: microelectromechanical chip

41: chip body

41a: Long side

41b: short side

42: microelectromechanical pump

42a: first electrode

42b: second electrode

43: common electrode

43a: the first common electrode

44: Connecting electrodes

Claims (4)

A micro-electromechanical pump module, comprising: a microprocessor, sending a control signal; a micro-electro-mechanical chip, electrically connected to the microprocessor, the micro-electro-mechanical chip includes: a chip body, which is a rectangular shape, with a short side; a plurality of micro-electromechanical pumps, arranged on the chip body, and respectively have a first electrode and a second electrode; a plurality of connection electrodes, arranged on the chip body and adjacent to the short side, and these connection electrodes are respectively electrically connected The first electrodes of the microelectromechanical pumps; and at least one common electrode, which is arranged on the chip body and adjacent to the short side, and the at least one common electrode is electrically connected to the second electrodes of the microelectromechanical pumps; wherein, all the electrodes on the chip body The connection electrodes and the at least one common electrode are respectively electrically connected to the microprocessor to transmit the control signal to the micro-electromechanical pumps, and the at least one common electrode includes a first common electrode and a second common electrode, and the micro-electrodes The electromechanical pump can be divided into a plurality of microelectromechanical pump groups, these microelectromechanical pump groups include a first microelectromechanical pump group and a second microelectromechanical pump group, the first microelectromechanical pump group The two electrodes are electrically connected to the first common electrode, and the second electrodes of the second microelectromechanical pump group are electrically connected to the second common electrode to control the microelectromechanical pumps in zones. The MEMS pump module according to claim 1, wherein the at least one common electrode further includes a third common electrode and a fourth common electrode. The microelectromechanical pump module as described in claim 2, wherein the microelectromechanical pump groups further include a third microelectromechanical pump group and a fourth microelectromechanical pump group, the third microelectromechanical pump group The second electrodes are electrically connected to the third common electrode, and the second electrodes of the fourth MEMS pump group are electrically connected to the fourth common electrode. A micro-electromechanical pump module, comprising: a microprocessor, sending a control signal; a micro-electro-mechanical chip, electrically connected to the microprocessor, the micro-electro-mechanical chip includes: a chip body, which is a rectangular shape, with a short side; a plurality of micro-electromechanical pumps, arranged on the chip body, and respectively have a first electrode and a second electrode; a plurality of connection electrodes, arranged on the chip body and adjacent to the short side, and these connection electrodes are respectively electrically connected The first electrodes of the microelectromechanical pumps; and at least one common electrode, which is arranged on the chip body and adjacent to the short side, and the at least one common electrode is electrically connected to the second electrodes of the microelectromechanical pumps; wherein, all the electrodes on the chip body The connection electrodes and the at least one common electrode are respectively electrically connected to the microprocessor to transmit the control signal to the microelectromechanical pumps, and the at least one common electrode includes a first common electrode, a second common electrode, and a first common electrode. Three common electrodes and a fourth common electrode, wherein the microelectromechanical pumps can be divided into a plurality of microelectromechanical pump groups, and the microelectromechanical pump groups include a first microelectromechanical pump group and a second microelectromechanical pump group , the second electrodes of the first microelectromechanical pump group are electrically connected to the first common electrode and the second common electrode, and the second electrodes of the second microelectromechanical pump group are electrically connected to the third common electrode and the fourth common electrode to control the microelectromechanical pumps in different regions.

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