TWI763955B - Micro electrical-mechanical pump module - Google Patents

Abstract

A micro electrical-mechanical pump module is disclosed and comprises a microprocessor and a micro electrical-mechanical chip. The microprocessor sends a control signal. The micro electrical-mechanical chip electrically connects to the microprocessor and comprises a chip main body, plural micro electrical-mechanical pumps plural connecting electrodes and at least one common electrode. The chip main body is a rectangular structure and comprises a longer side. The plural micro electrical-mechanical pumps are disposed on the chip main body and each of them comprises a first electrode and a second electrode. The plural connecting electrodes are disposed on the chip main body, located nearby the longer side, and respectively electrically connect to the first electrodes of the plural micro electrical-mechanical pumps. The at least one common electrode is disposed on the chip main body, located nearby the longer side, and electrically connected to the second electrodes of the plural micro electrical-mechanical pumps. The microprocessor electrically connects to the plural connecting electrodes and the at least one common electrode, so as to transmit the control signal to the plural micro electrical-mechanical pumps.

Description

MEMS pump module

This case is about a MEMS pump module, especially a MEMS pump module that utilizes the arrangement of common electrodes to reduce the contacts of the microprocessor, thereby simplifying the contacts and wiring of the MEMS pump.

With the rapid development of technology, the applications of fluid delivery devices are becoming more and more diversified, such as industrial applications, biomedical applications, medical care, electronic cooling, etc., and even the recent popular wearable devices. There is a trend towards the miniaturization of the device by the pumping of the microfluidic pump, but it is difficult for the traditional pump to reduce the size to the millimeter level, so the current microfluidic delivery device can only use the piezoelectric pump structure as the microfluidic transmission device.

Although the MEMS pump can miniaturize the pump volume to the micrometer level, the micrometer-level MEMS pump will limit the fluid transmission due to its small volume, so multiple MEMS pumps are required to be used together. Please refer to As shown in Figure 1, the current MEMS pump modules are individually controlled by a high-end microprocessor 1, but the high-end microprocessor 1 itself is expensive, and each MEMS pump 2 requires two microprocessors The connection of the device pin 11 increases the cost of the high-end microprocessor 1, resulting in the high cost of the MEMS pump module, which is difficult to popularize. Therefore, how to reduce the cost of the driving end of the MEMS pump module is the primary problem for the current MEMS pump. difficulties.

The main purpose of this case is to provide a MEMS pump module, which can reduce the contacts of the microprocessor through the common electrode, reduce the contacts and wiring of the MEMS pump module, and further simplify the MEMS pump module.

In order to achieve the above purpose, a broader implementation aspect of the present application is to provide a MEMS pump module, which includes: a microprocessor that sends out a control signal; a MEMS chip that is electrically connected to the microprocessor, and the MEMS chip includes : a chip body, in the shape of a rectangle, with a long side; a plurality of micro-electromechanical pumps, arranged on the chip body, and having a first electrode and a second electrode respectively; a plurality of connection electrodes, arranged on the chip The main body is adjacent to the long side, the connecting electrodes are respectively electrically connected to the first electrodes of the MEMS pumps; and at least one common electrode is disposed on the chip body and adjacent to the long side, the at least one common electrode is electrically connected to the MEMS pumps the second electrode; wherein, the microprocessor is electrically connected to the connection electrodes and the at least one common electrode respectively, so as to transmit the control signal to the MEMS pumps.

Some typical embodiments embodying the features and advantages of the present case will be described in detail in the description of the following paragraphs. It should be understood that this case can have various changes in different aspects, all of which do not depart from the scope of this case, and the descriptions and diagrams therein are essentially used for illustration rather than limiting this case.

Please refer to Figure 2, which is a schematic diagram of the MEMS pump module of the present invention. The micro-piezoelectric pump module 100 includes: a microprocessor 3, a micro-electro-mechanical chip 4, the micro-electro-mechanical chip 4 is electrically connected to the microprocessor 3, and the micro-electro-mechanical chip 4 includes a chip body 41, a plurality of micro-electro-mechanical pumps 42, At least one common electrode 43 and a plurality of connection electrodes 44, the chip body 41 is a rectangular shape with a long side 41a and a short side 41b, the MEMS pumps 42 are all disposed on the chip body 41, and each MEMS pump 42 has a A first electrode 42a and a second electrode 42b, and at least one common electrode 43 is also disposed on the chip body 41 adjacent to the long side 41a, and is electrically connected to all the second electrodes 42b of the MEMS pump 42, and the connecting electrodes 44 are disposed on The chip body 41 is adjacent to the long side 41a, the connecting electrodes 44 are respectively electrically connected to the first electrodes 42a of the MEMS pumps 42, wherein all the connecting electrodes 44 and at least one common electrode 43 on the chip body 41 are respectively electrically connected to the microelectromechanical pump 42. The processor 3 receives the control signal sent by the microprocessor 3. In addition, FIG. 2 is also a schematic diagram of the first embodiment of the present application. At least the number of the common electrodes 43 includes a first common electrode 43a. The number of electrodes 43 is one, and all the second electrodes 42b of the MEMS pumps 42 are electrically connected to the first common electrode 43a.

Please refer to FIG. 3, which is a schematic diagram of a second embodiment of the MEMS chip of the MEMS pump module of the present invention. At least one common electrode 43 includes a first common electrode 43a and a second common electrode 43b. The aforementioned The plurality of MEMS pumps 42 are divided into a first MEMS pump group 421 and a second MEMS pump group 422 according to their positions, wherein the MEMS pump 42 located in the first MEMS pump group 421 has its second electrode 42b are all electrically connected to the first common electrode 43a, and the second electrodes 42b of the MEMS pumps 42 located in the second MEMS pump group 422 are all electrically connected to the second common electrode 43b, so as to achieve the effect of partition control. The number of the common electrodes 43 in the embodiment is two.

Please refer to FIG. 4. FIG. 4 is a schematic diagram of the third embodiment of the MEMS chip of the MEMS pump module of the present invention. The third embodiment and the second embodiment have two common electrodes 43, so the common electrode 43 has a first common electrode 43a and a second common electrode 43b, the first common electrode 43a and the second common electrode 43b are separately disposed on both sides of the wafer body 41, and the first common electrode 43a and the second common electrode 43b are electrically connected, Moreover, the second electrodes 42b of the plurality of MEMS pumps 42 are electrically connected to the first common electrodes 43a and the second common electrodes 43b located on both sides at the same time. The impedance between the electrodes 43 reduces the power loss of the second electrode 42b farther from the common electrode 43 .

Please refer to FIG. 5. FIG. 5 is a schematic diagram of the fourth embodiment of the MEMS chip of the MEMS pump module of the present invention. At least one common electrode 43 includes a first common electrode 43a, a second common electrode 43b, a third common electrode 43 The common electrode 43c and a fourth common electrode 43d, the first common electrode 43a and the third common electrode 43c are arranged on one side of the wafer body 41 at intervals, and the second common electrode 43b and the fourth common electrode 43d are arranged at intervals on the side of the wafer body 41 . On the other hand, in this embodiment, the aforementioned plurality of MEMS pumps 42 are divided into a first MEMS pump group 421 , a second MEMS pump group 422 , and a third MEMS pump group 423 according to the location area and a fourth MEMS pump group 424, the first MEMS pump group 421 is composed of the MEMS pump 42 adjacent to the first common electrode 43a, and the first common electrode 43a is provided in the first MEMS pump group 421 The second electrodes 42b of all the MEMS pumps 42 are electrically connected; the second MEMS pump group 422 is composed of the MEMS pumps 42 adjacent to the second common electrode 43b, and the second common electrode 43b is used in the second MEMS pump group The second electrodes 42b of all the MEMS pumps 42 in the 422 are electrically connected; the third MEMS pump group 423 is composed of the MEMS pumps 42 adjacent to the third common electrode 43c, and the third common electrode 43c is used for the third MEMS pump located in the third MEMS pump. The second electrodes 42b of all the MEMS pumps 42 in the pump group 423 are electrically connected; the fourth MEMS pump group 424 is composed of the MEMS pumps 42 adjacent to the fourth common electrode 43d, and the fourth common electrode 43d is used for The second electrodes 42b of all the MEMS pumps 42 in the four MEMS pump group 424 are electrically connected to achieve the effect of partition control.

Please refer to FIG. 6. FIG. 6 is a schematic diagram of the fifth embodiment of the MEMS chip of the MEMS pump module of the present invention. This embodiment has the same first common electrode 43a and second common electrode as the fourth embodiment. 43b, the third common electrode 43c and the fourth common electrode 43d, and their setting positions are also the same, the difference is that in this embodiment, the first common electrode 43a is electrically connected to the second common electrode 43b, and the third common electrode 43c is electrically connected to the fourth common electrode 43b. The common electrode 43d is divided into a first MEMS pump group 421 and a second MEMS pump group 422, and the first MEMS pump group 421 is adjacent to the first common electrode 43a or The MEMS pump 42 adjacent to the second common electrode 43b is formed, and the second MEMS pump group 422 is formed of the MEMS pump 42 adjacent to the third common electrode 43c or adjacent to the fourth common electrode 43d, thereby achieving partition control and reduce the distance between the common electrode 43 and the second electrode 42b, thereby reducing the loss of power transmission.

Please refer to FIG. 7. FIG. 7 is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module of the present invention. This embodiment and the fourth embodiment have the same first common electrode 43a and second common electrode 43a. The electrode 43b, the third common electrode 43c and the fourth common electrode 43d are also located at the same location. The difference is that in this embodiment, the first common electrode 43a, the second common electrode 43b, the third common electrode 43c and the fourth common electrode 43a The common electrodes 43d are all electrically connected to each other, so that the second electrodes 42b of the aforementioned plurality of MEMS pumps 42 can be electrically connected to the common electrodes 43 that are closer to them, such as the second electrodes of the MEMS pumps 42 adjacent to the first common electrode 43a. The electrode 42b is electrically connected to the first common electrode 43a, the second electrode 42b of the MEMS pump 42 adjacent to the second common electrode 43b is electrically connected to the second common electrode 43b, and so on. The electromechanical pump 42 can reduce the loss of the transmission power of each microelectromechanical pump 42 .

Please refer to Figure 8A and Figure 8B at the same time, Figure 8A is a schematic diagram of the electrical connection of the MEMS pump of the present invention, and Figure 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor of the present invention; the MEMS pump 42 further includes There is a piezoelectric element 42c, the first electrode 42a and the second electrode 42b transmit the voltage to the piezoelectric element 42c, and the piezoelectric element 42c is deformed due to the piezoelectric effect, thereby changing the internal pressure of the MEMS pump 42 for conveying Fluid, the first electrode 42a of the microelectromechanical pump 42 is electrically connected to the microprocessor 3 through the connection electrode 44 (as shown in the second figure), and the second electrode 42b is electrically connected to the microprocessor 3 through the common electrode 43 (as shown in the second figure). ), wherein the control signal output by the microprocessor 3 includes a certain voltage and a variable voltage. In this embodiment, the variable voltage can be a voltage that can be switched between a first voltage and a second voltage, And the voltage value of the constant voltage is between the voltage value of the first voltage and the voltage value of the second voltage, and the voltage value of the constant voltage can also be the middle value of the voltage value of the first voltage and the voltage value of the second voltage. ±10%, for example, when the first voltage is 1.5V, the second voltage is -1.5V, the constant voltage is 0V, the first voltage is 3V, and the second voltage is 0V, the constant voltage is 1.5V, so that The second electrode 42b of the microelectromechanical pump 42 receives a fixed voltage, and the first electrode 42a receives the first voltage and the second voltage that are continuously changing, so that the piezoelectric element 42c will change due to the continuous change between the first electrode 42a and the second electrode 42b. The voltage difference produces the deformation, which is used to transport the fluid. In addition, please continue to refer to Fig. 8C and Fig. 8D. Fig. 8C is a schematic diagram of the control signal output by the microprocessor in the second embodiment, and Fig. 8D is a schematic diagram of the control signal output by the microprocessor in the present application. The voltage can also be a continuously changing voltage between the first voltage and the second voltage. In addition to the square wave of the first embodiment, the control signal can also use a triangular wave (FIG. 8C) and a sine wave (FIG. 8D).

To sum up, this application provides a MEMS pump module, which allows the microprocessor to transmit a constant voltage to the second electrode of the MEMS pump through the common electrode, and then transmits the variable voltage to the first electrode of the MEMS pump. By changing the voltage on the first electrode, the voltage difference between the first electrode and the second electrode can be changed, and the piezoelectric element of the micro-electro-mechanical pump can be successfully driven to act to transmit the fluid. The pins of the processor can effectively control a plurality of micro-electromechanical pumps under the condition of reducing the cost of the microprocessor.

This case can be modified by Shi Jiangsi, a person familiar with this technology, but it does not deviate from the protection of the scope of the patent application attached.

100: MEMS pump module 1: high-end microprocessor 11: microprocessor pin 2: MEMS pump 3: microprocessor 4: MEMS chip 41: chip body 41a: long side 41b: short side 42: micro Electromechanical pump 42a: first electrode 42b: second electrode 42c: piezoelectric element 421: first MEMS pump group 422: second MEMS pump group 423: third MEMS pump group 424: fourth MEMS pump Pump group 43: common electrode 43a: first common electrode 43b: second common electrode 43c: third common electrode 43d: fourth common electrode 44: connecting electrode

FIG. 1 is a schematic diagram of a MEMS pump module in the prior art. Figure 2 is a schematic diagram of the MEMS pump module of the present invention. FIG. 3 is a schematic diagram of the second embodiment of the MEMS chip of the MEMS pump module of the present invention. FIG. 4 is a schematic diagram of the third embodiment of the MEMS chip of the MEMS pump module of the present invention. FIG. 5 is a schematic diagram of the fourth embodiment of the MEMS chip of the MEMS pump module of the present invention. FIG. 6 is a schematic diagram of a fifth embodiment of the MEMS chip of the MEMS pump module of the present invention. FIG. 7 is a schematic diagram of the sixth embodiment of the MEMS chip of the MEMS pump module of the present invention. FIG. 8A is a schematic diagram of the electrical connection of the MEMS pump of the present invention. FIG. 8B is a schematic diagram of the first embodiment of the control signal output by the microprocessor of the present invention. FIG. 8C is a schematic diagram of a second embodiment of the control signal output by the microprocessor of the present invention. FIG. 8D is a schematic diagram of a third embodiment of the control signal output by the microprocessor of the present invention.

100: MEMS pump module

3: Microprocessor

4: MEMS chip

41: wafer body

41a: Long side

41b: Short side

42: MEMS pump

42a: first electrode

42b: second electrode

43: Common electrode

43a: first common electrode

44: Connect the electrodes

Claims (4)

A micro-electromechanical pump module comprises: a microprocessor, which sends out a control signal, the control signal includes a certain voltage; The rectangular shape has a long side; a plurality of micro-electromechanical pumps are arranged on the chip body, and respectively have a first electrode and a second electrode; a plurality of connection electrodes are arranged on the chip body and adjacent to the long side, The connection electrodes are respectively electrically connected to the first electrodes of the MEMS pumps; and at least one common electrode is disposed on the chip body and adjacent to the long side, the at least one common electrode is electrically connected to the second electrodes of the MEMS pumps; wherein , the microprocessor is respectively electrically connected to the connection electrodes and the at least one common electrode to transmit the control signal to the MEMS pumps, and the at least one common electrode includes a first common electrode and a second common electrode: The electromechanical pump can be divided into a first MEMS pump group and a second MEMS pump group, the second electrodes of the first MEMS pump group are electrically connected to the first common electrode, the second MEMS pump The second electrodes of the pump group are electrically connected to the second common electrode. The MEMS pump module as described in claim 1, wherein the at least one common electrode further comprises a third common electrode and a fourth common electrode. The MEMS pump module as described in claim 2, wherein the MEMS pumps can be further divided into the first MEMS pump group, the second MEMS pump group, and a third MEMS pump group group and a fourth MEMS pump group, the second electrodes of the first MEMS pump group are electrically connected to the first common electrode, and the second electrodes of the second MEMS pump group are electrically connected to the A second common electrode, the second electrodes of the third MEMS pump group are electrically connected The third common electrode, the second electrodes of the fourth MEMS pump group are electrically connected to the fourth common electrode. The MEMS pump module as described in claim 2, wherein the MEMS pumps can be divided into a first MEMS pump group and a second MEMS pump group, the first MEMS pump group The second electrodes are electrically connected to the first common electrode and the second common electrode, and the second electrodes of the second MEMS pump group are electrically connected to the third common electrode and the fourth common electrode.

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