TW201905025A - Sealing resin composition, semiconductor package, and method of manufacturing semiconductor package - Google Patents

Abstract

A sealing resin composition comprising an epoxy resin, a hardener and a filler, the epoxy resin comprising a bisphenol-type epoxy resin and the 1,6-bis (glycidyloxy) naphthalene, 1,6 The proportion of bis (glycidyloxy) naphthalene in the whole epoxy resin is 10% to 30% by mass.

Description

Resin composition for sealing, semiconductor package and manufacturing method of semiconductor package

The present invention relates to a sealing resin composition, a semiconductor package, and a method for manufacturing a semiconductor package.

Previously, the major improvement in the performance of liquid sealing materials (bottom-filled materials) used in flip-chip-type semiconductor mounting technology has been how to meet the requirements for maintaining the reliability of semiconductor packages at a high level and responding to wiring patterns. There are many requirements for narrow pitch (improved injection). For example, Patent Document 1 describes a liquid sealing material that achieves good injection properties and fillet cracks after sealing by blending a specific amount of aminophenol epoxy resin into a bisphenol epoxy resin. ). [Prior Art Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2016/093148

[Problems to be Solved by the Invention] In recent years, as the size of semiconductor packages has increased, the sealing area has also tended to increase. Along with this, the possibility that an increase in stress generated between the sealing portion and the substrate inside the package affects the reliability of the package increases. Therefore, it is considered that the design of the sealing material is expected to increase in importance from the viewpoint of suppressing the stress generated inside the package.

The present invention has been made in view of the above-mentioned circumstances, and an object thereof is to provide a sealing resin composition which is excellent in injectability and excellent in suppressing a stress generated in a package, a semiconductor package obtained by using the sealing resin composition, and a manufacturing method thereof. [Means for solving problems]

Means for solving the problems include the following embodiments. <1> A resin composition for sealing, comprising an epoxy resin, a hardener, and a filler, the epoxy resin comprising a bisphenol-type epoxy resin and 1,6-bis (glycidyloxy) naphthalene, wherein The proportion of 1,6-bis (glycidyloxy) naphthalene in the entire epoxy resin is 10% to 30% by mass.

<2> The sealing resin composition according to <1>, wherein the bisphenol-type epoxy resin includes a bisphenol F-type epoxy resin.

<3> The sealing resin composition according to <1> or <2>, wherein the proportion of the bisphenol-type epoxy resin in the entire epoxy resin is 20% to 90% by mass.

<4> The sealing resin composition according to any one of <1> to <3>, wherein the epoxy resin further comprises a glycidylamine-type epoxy resin.

<5> The sealing resin composition according to <4>, wherein the glycidylamine-type epoxy resin includes a trifunctional or higher-functional glycidylamine-type epoxy resin.

<6> The resin composition for sealing according to any one of <4> or <5>, wherein a proportion of the glycidylamine-type epoxy resin in the entire epoxy resin is 10% by mass -60% by mass.

<7> A semiconductor package comprising a support, a semiconductor element disposed on the support, and the sealing resin according to any one of <1> to <6>, which seals the semiconductor element. Hardened composition.

<8> A method for manufacturing a semiconductor package, comprising filling a support with a sealing resin composition according to any one of <1> to <6> and a semiconductor element disposed on the support. A step of voids; and a step of hardening the sealing resin composition. [Effect of the invention]

According to the present invention, it is possible to provide a sealing resin composition which is excellent in injectability and excellent in suppressing a stress generated in a package, a semiconductor package obtained by using the sealing resin composition, and a method for manufacturing the same.

Hereinafter, the form for implementing this invention is demonstrated in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including the element steps, etc.) are not necessary except for the case where they are specifically stated. The same applies to numerical values and ranges, and does not limit the present invention.

In the present disclosure, the term "step" includes the step in addition to the step that is independent of the other steps, even if it cannot be clearly distinguished from the other steps, as long as the purpose of the step is achieved. In the present disclosure, the numerical values indicated by "~" in the numerical range including "~" are used as the minimum value and the maximum value, respectively. In the numerical range described in this disclosure stepwise, an upper limit value or a lower limit value described in one numerical range may be replaced with an upper limit value or a lower limit value in another numerical range described in a stepwise manner. In addition, in the numerical range described in this disclosure, the upper limit value or lower limit value of the numerical range may be replaced with the value shown in the embodiment. In the present disclosure, each component may also include a plurality of compatible substances. When there are a plurality of substances corresponding to each component in the composition, unless otherwise specified, the content rate or content of each component refers to the total content rate or content of the plurality of substances present in the composition. In the present disclosure, a plurality of particles corresponding to each component may be included. In the case where there are a plurality of types of particles corresponding to each component in the composition, the particle size of each component refers to the value of a mixture of the plurality of types of particles present in the composition unless otherwise specified.

<Resin composition for sealing> The sealing resin composition according to this embodiment includes an epoxy resin, a hardener, and a filler. The epoxy resin includes a bisphenol-type epoxy resin and 1,6-bis (glycidyloxy). ) Naphthalene (epoxy resin represented by the following formula (1); hereinafter also referred to as specific naphthalene-type epoxy resin), the proportion of the specific naphthalene-type epoxy resin in the entire epoxy resin is 10% by mass to 30% by mass.

[Chemical 1]

The inventors have conducted studies, and as a result, it has been found that the sealing resin composition is excellent in injectability, has a low thermal expansion coefficient in a cured state, and has a low coefficient of elasticity. The sealing resin composition includes a bisphenol-type epoxy resin and The specific naphthalene-type epoxy resin is used as the epoxy resin, and the proportion of the specific naphthalene-type epoxy resin in the entire epoxy resin is 10% by mass to 30% by mass.

It is considered that when the thermal expansion coefficient in the cured state of the sealing resin composition is low, the difference in thermal expansion coefficient between the cured material and the support becomes small, and the effect of reducing the generated stress can be obtained. Moreover, it is thought that when the elasticity coefficient in the hardened state of the sealing resin composition is low, the effect of reducing the generated stress can be obtained.

Furthermore, in the resin composition for sealing of this embodiment, compared with methods such as increasing the amount of fillers and adding a flexible agent, it is possible to suppress the increase in viscosity before curing and reduce the coefficient of thermal expansion and elasticity after curing. Therefore, it is considered that It is possible to coexist good injection properties and stress reduction or relaxation effects.

Although the reasons for the low thermal expansion coefficient and the low coefficient of elasticity of the sealed resin composition having the above-mentioned hardened state in the cured state are not clear, it is presumed that the thermal expansion coefficient is reduced by including a specific naphthalene-type epoxy resin as the epoxy resin. In addition, the amount of the specific naphthalene-type epoxy resin is suppressed to a certain ratio or less, and the bisphenol-type epoxy resin is used in combination to maintain a low elastic modulus.

The resin composition for sealing is preferably liquid when used. More specifically, the viscosity at 25 ° C (viscosity at 10 rpm) is preferably 25 Pa · s or less. The viscosity at 110 ° C is preferably 0.12 Pa · s or less. The viscosity of the sealing resin composition is a value measured by a method described in Examples described later.

[Epoxy resin] The specific naphthalene-type epoxy resin is a liquid epoxy resin at normal temperature (25 ° C), and can also be obtained as a commercially available product. As a commercial item, the brand name "EPICLON HP-4032D" of DIC Corporation is mentioned, for example.

From the viewpoint of a decrease in the thermal expansion rate, the proportion of the specific naphthalene-type epoxy resin in the entire epoxy resin is 10% by mass or more, and preferably 15% by mass or more. From the viewpoint of maintaining the injectability well, the proportion of the specific naphthalene-type epoxy resin in the entire epoxy resin is 30% by mass or less, and preferably 25% by mass or less.

The type of the bisphenol epoxy resin is not particularly limited, and examples thereof include bisphenol A epoxy resin, bisphenol F epoxy resin, and bisphenol AD epoxy resin. The bisphenol-type epoxy resin contained in the sealing resin composition may be only one type, or two or more types. From the viewpoint of using the sealing resin composition in a liquid state, the bisphenol-type epoxy resin is preferably liquid at normal temperature (25 ° C). From the viewpoint of viscosity reduction, the bisphenol-type epoxy resin is preferably a bisphenol F-type epoxy resin.

The proportion of the bisphenol-type epoxy resin in the entire epoxy resin is not particularly limited, and can be selected according to the required characteristics of the resin composition for sealing. For example, it can select from the range of 20 mass% or more and less than 90 mass%, and it can also select from the range of 30 mass%-80 mass%.

The sealing resin composition may include epoxy resins other than the specific naphthalene-type epoxy resin and bisphenol-type epoxy resin. The type of the epoxy resin other than the specific naphthalene-type epoxy resin and the bisphenol-type epoxy resin is not particularly limited, and can be selected according to the required characteristics and the like of the sealing resin composition. Specific examples include a compound selected from phenol compounds such as phenol, cresol, xylenol, resorcinol, and catechol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene. A composition obtained by condensing or co-condensing at least one phenolic compound and an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst to obtain a novolac resin and epoxidizing the novolac resin Novolac epoxy resin (phenol novolac epoxy resin, o-cresol novolac epoxy resin, etc.); the phenolic compound and aromatic aldehyde compounds such as benzaldehyde, salicylaldehyde, etc. under an acidic catalyst A triphenylmethane epoxy resin obtained by condensing or co-condensing a triphenylmethane type phenol resin and epoxidizing the triphenylmethane type phenol resin; and making the phenol compound, naphthol compound, and aldehyde compound Copolymer epoxy resin obtained by co-condensing under an acid catalyst and epoxidizing the novolak resin; biphenyl as a diglycidyl ether of an alkyl-substituted or unsubstituted biphenol Epoxy resins; stilbene type epoxy resins as diglycidyl ethers of stilbene phenol compounds; sulfur atom-containing epoxy resins as diglycidyl ethers such as bisphenol S; as butanediol, polyethylene glycol, Glycidyl ether epoxy resins such as polypropylene glycol; glycidyl epoxy resins that are glycidyl esters of polycarboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; Glycidylamine type epoxy resin obtained by substituting glycidyl active hydrogen such as aniline, diaminodiphenylmethane, isotricyanic acid and the like with a glycidyl group; dicyclopentadiene and a phenol compound Dicyclopentadiene type epoxy resin obtained by epoxidation of a co-condensation resin; diepoxidized vinyl cyclohexene, 3,4-epoxy cyclohexyl methyl obtained by epoxidation of an olefin bond in a molecule -3,4-epoxycyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spirocyclo (3,4-epoxy) cyclohexane-m-bis Alicyclic epoxy resin such as dioxane; p-xylene modified epoxy resin as glycidyl ether of p-xylene modified phenol resin; as m-xylene M-xylene modified epoxy resin of glycidyl ether of benzene modified phenol resin; terpene modified epoxy resin of glycidyl ether of terpene modified phenol resin; dicyclopentadiene modified phenol resin Glycidyl ether-modified dicyclopentadiene-modified epoxy resin; Glycidyl ether-modified cyclopentadiene-modified epoxy resin as cyclopentadiene-modified phenol resin; Polycyclic aromatic ring-modified phenol resin as shrinkage Polycyclic aromatic ring modified epoxy resin of glyceryl ether; naphthalene type epoxy resin as glycidyl ether of naphthalene ring-containing phenol resin; halogenated phenol novolac type epoxy resin; hydroquinone type epoxy resin; three Methylolpropane epoxy resin; linear aliphatic epoxy resin obtained by oxidizing olefin bonds with peracids such as peracetic acid; aralkylphenol resins such as phenol aralkyl resin and naphthol aralkyl resin An aralkyl-type epoxy resin and the like obtained by epoxidation. These epoxy resins may be used singly or in combination of two or more.

When the resin composition for sealing includes a bisphenol-type epoxy resin and an epoxy resin other than the bisphenol-type epoxy resin as the epoxy resin other than the specific naphthalene-type epoxy resin, the mass ratio of the bisphenol-type epoxy resin to the epoxy resin other than the epoxy resin (Bisphenol-type epoxy resin / other epoxy resin) is not particularly limited. For example, it can be selected from the range of 1/5 to 5/1.

When the sealing resin composition contains a bisphenol-type epoxy resin and an epoxy resin other than the epoxy resin other than the specific naphthalene-type epoxy resin, from the viewpoint of using the sealing resin composition in a liquid state, It is preferable to include an epoxy resin which is liquid at normal temperature (25 ° C), and more preferably to include a glycidylamine type epoxy resin. From the viewpoint of reducing the viscosity of the sealing resin composition, the molecular weight of the glycidylamine-type epoxy resin is preferably 300 or less.

The glycidylamine type epoxy resin may be difunctional or trifunctional or more. From the viewpoint of improving the heat resistance after curing, a glycidylamine-type epoxy resin having a trifunctional or higher function (having three or more epoxy groups in one molecule) is preferred. Examples of the difunctional or higher glycidylamine type epoxy resin include N, N-diglycidylaniline, N, N-diglycidyl-o-toluidine, and the like. Examples of the trifunctional or higher glycidylamine type epoxy resin include triglycidyl-p-aminophenol, 4,4'-methylenebis [N, N-bis (oxiranylmethyl) aniline. ]Wait. Among these, from the viewpoint of viscosity at normal temperature (25 ° C), triglycidyl-p-aminophenol is preferred.

When the resin composition for sealing contains a glycidylamine type epoxy resin as an epoxy resin, the ratio of a glycidylamine type epoxy resin is not specifically limited. For example, it is preferable that the ratio of the whole epoxy resin is 10 mass%-60 mass%.

[Hardener] The type of the hardener is not particularly limited, and can be selected according to the required characteristics and the like of the resin composition for sealing. Examples include amine hardeners, phenol hardeners, acid anhydride hardeners, polythiol hardeners, polyamidoamine hardeners, isocyanate hardeners, block isocyanate hardeners, and the like. The hardener may be used singly or in combination of two or more kinds.

From the viewpoint of using the sealing resin composition in a liquid state, the curing agent is preferably an amine curing agent. Examples of the amine hardener include diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexyl Aliphatic amine compounds such as methane, aromatic amine compounds such as 4,4'-diaminodiphenylmethane, 2-methylaniline, imidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropyl Imidazole compounds such as imidazole, imidazolines, 2-methylimidazolines, 2-ethylimidazolines, and the like.

Equivalent ratio of epoxy resin to hardener, that is, the ratio of the number of functional groups in the hardener (active hydrogen in the case of an amine hardener) to the number of functional groups in the epoxy resin (the number of functional groups in the hardener / ring The number of functional groups in the oxyresin is not particularly limited. From the viewpoint of reducing the amount of each unreacted component, it is preferably set in the range of 0.5 to 2.0, and more preferably set in the range of 0.6 to 1.3. From the viewpoint of formability and reflow resistance, it is more preferable to set the range to 0.8 to 1.2.

[Filling material] The type of the filling material is not particularly limited. Specific examples include silicon dioxide, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllium oxide, zirconia, zircon, and magnesium olive. Fosterite, frozen stone, spinel, mullite, titanium dioxide, talc, clay, mica and other inorganic materials. A filler having a flame retardant effect may also be used. Examples of the filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as a composite hydroxide of magnesium and zinc, and zinc borate.

Among the fillers, silicon dioxide is preferred from the viewpoint of decreasing the thermal expansion coefficient, and alumina is preferred from the viewpoint of improving the thermal conductivity. The fillers may be used alone or in combination of two or more.

The content rate of the filler contained in the sealing resin composition is not particularly limited. From the viewpoint of coexistence of good fluidity and hardening of the filler, the content of the filler is preferably 30% to 90% by mass, and more preferably 50% to 75% by mass of the entire sealing resin composition. %.

When the filler is particulate, the average particle diameter is not particularly limited. For example, the volume average particle diameter is preferably 0.2 μm to 20 μm, and more preferably 0.5 μm to 15 μm. When the volume average particle diameter is 0.2 μm or more, an increase in viscosity of the sealing resin composition tends to be further suppressed. When the volume average particle diameter is 20 μm or less, there is a tendency that the filling property to a narrow gap is further improved. The volume average particle diameter of the filler can be used as the particle diameter when the cumulative volume from the small particle diameter side of the volume-based particle size distribution in the volume-based particle size distribution obtained by the laser scattering diffraction particle size distribution measurement device becomes 50% (D50) And the measurement was performed.

[Various Additives] The resin composition for sealing may contain various additives such as a hardening accelerator, a stress relaxation agent, a coupling agent, a release agent, and a colorant in addition to the components described above. In addition to the additives exemplified below, the sealing resin composition may optionally include various additives known in the art.

(Hardening accelerator) The resin composition for sealing may contain a hardening accelerator. The type of the hardening accelerator is not particularly limited, and can be selected according to the type of the epoxy resin and the hardener, the required characteristics of the resin composition for sealing, and the like.

When the sealing resin composition contains a hardening accelerator, the amount of the hardening accelerator is preferably 0.1 to 30 parts by mass based on 100 parts by mass of the hardening resin component (total of the epoxy resin and the hardener). , More preferably 1 to 15 parts by mass.

(Stress Relief Agent) The resin composition for sealing may contain a stress relief agent. Examples of the stress relaxation agent include particles such as thermoplastic elastomers, natural rubber (NR), acrylonitrile butadiene rubber (NBR), acrylic rubber, urethane rubber, and silicone rubber. Wait. The stress relieving agent may be used alone or in combination of two or more.

When the sealing resin composition contains a stress relieving agent, the amount of the stress relieving agent is preferably 0.1 to 30 parts by mass based on 100 parts by mass of the curable resin component (total amount of the epoxy resin and the curing agent). , More preferably 1 to 15 parts by mass.

(Coupling agent) The resin composition for sealing may contain a coupling agent. Examples of the coupling agent include silane compounds such as epoxy silane, mercapto silane, amine silane, alkyl silane, ureido silane, and vinyl silane, titanium compounds, aluminum chelate compounds, and aluminum / zirconium compounds. Among these, a silane compound is preferable from the viewpoint of fluidity. The coupling agents may be used singly or in combination of two or more kinds.

When the sealing resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, and more preferably 0.1 to 2.5 parts by mass based on 100 parts by mass of the filler.

(Colorant) The resin composition for sealing may contain a colorant. Examples of the colorant include carbon black, organic dyes, organic pigments, titanium oxide, lead, and iron oxide. The colorants may be used alone or in combination of two or more.

When the sealing resin composition contains a coloring agent, the amount of the coloring agent is preferably 0.01 to 10 parts by mass relative to 100 parts by mass of the curable resin component (total of the epoxy resin and the curing agent), and more preferably It is preferably from 0.1 to 5 parts by mass.

(Application of the resin composition for sealing) The resin composition for sealing can be used in various mounting technologies. In particular, it can be preferably used as an underfill material used in flip chip type mounting technology. For example, it can be used suitably for the use which fills the gap between the semiconductor element and support which were joined by the bump etc.

The types of the semiconductor element and the support are not particularly limited, and can be selected from users generally used in the field of semiconductor packaging. The method of using the sealing resin composition to fill the gap between the semiconductor element and the support is not particularly limited. For example, it can be performed by a well-known method using a dispenser.

<Semiconductor Package> The semiconductor package according to this embodiment includes a support, a semiconductor element disposed on the support, and a cured product of the sealing resin composition that seals the semiconductor element.

In the semiconductor package, the types of the semiconductor element and the support are not particularly limited, and can be selected from users generally used in the field of semiconductor packaging. Regarding the semiconductor package, the hardened material of the resin composition for sealing has a low thermal expansion coefficient and a low elastic modulus. Therefore, when a stress is generated between the hardened body of the sealing resin composition and the support, the effect of suppressing the stress is excellent.

<Method for Manufacturing Semiconductor Package> The method for manufacturing a semiconductor package according to this embodiment includes a step of filling a gap between a support and a semiconductor element arranged on the support with the sealing resin composition; and The step of curing the sealing resin composition is described.

In the method, the types of the semiconductor element and the support are not particularly limited, and can be selected from users generally used in the field of semiconductor packaging. The method of filling the gap between the semiconductor element and the support with the sealing resin composition and the method of curing the sealing resin composition after filling are not particularly limited, and can be performed by a known method. [Example]

Hereinafter, the embodiments will be described in detail with examples, but the scope of the embodiments is not limited to these examples.

(Preparation of sealing resin composition) The components shown in Table 1 were mixed by the quantity shown in Table 1, and the sealing resin composition was prepared. The details of each component are as follows. "Eq" in Table 1 represents the ratio of the equivalent of the hardener (the total of the hardener 1 and the hardener 2 is 1). The "mass%" of the filler represents the ratio with respect to the entire sealing resin composition.

Epoxy resin 1 ... Liquid bisphenol F-type epoxy resin, trade name "YDF-8170C", Nippon Steel & Sumikin Chemical Co., Ltd. Epoxy resin 2 ... Triglycidyl-p-aminophenol, Trade name "jER 630", Mitsubishi Chemical Corporation Epoxy 3 ... 1,6-bis (glycidyloxy) naphthalene, trade name "EPICLON HP-4032D", DIC Corporation

Hardener 1 ... 2-methylaniline, trade name "jER Cure W", Mitsubishi Chemical Corporation Hardener 2 ... 4,4'-diaminodiphenylmethane, trade name "Kayaha (KAYAHARD) AA ", Nippon Kayaku Co., Ltd.

Filling materials ... High-purity synthetic spherical silica, trade name "SE2200-SEJ", average particle size: 0.5 μm, coupling agent of Admatechs Co., Ltd. 3-glycidyloxypropyl Trimethoxysilane, trade name "KBM-403", Shin-Etsu Chemical Industry Co., Ltd.

[Table 1]

(Evaluation of flow characteristics) Using an E-type viscometer (manufactured by Tokyo Keiki Co., Ltd., VISCONIC EHD type (trade name)) (cone angle 3 °, rotation speed: 10 revolutions per minute), resin composition for sealing was measured The viscosity (Pa · s) of the substance at 25 ℃. The results are shown in Table 1. Using AR2000 (TA Instrument), the viscosity (Pa · s) of the sealing resin composition at 110 ° C. was measured under conditions of a parallel plate of 40 mm and a shear rate of 32.5 (l / s). The results are shown in Table 1.

(Evaluation of injection property) A 25 μm gap was provided on a glass substrate, and a test piece in which a glass plate (20 mm × 20 mm) was fixed instead of a semiconductor element was prepared. Next, the test piece was placed on a hot plate set at 110 ° C., and the sealing resin composition was applied to one end side of the glass plate, and the time until the gap was filled with the sealing resin composition was measured (sec / sec). ). The results are shown in Table 1.

(Evaluation of hardened material characteristics) The thermal expansion coefficient (ppm / ° C), elastic modulus (GPa), and glass transition temperature (° C) of the hardened material obtained by hardening the sealing resin composition were measured by the following methods, respectively. The results are shown in Table 1.

(Measurement method of thermal expansion coefficient) A thermomechanical analysis device (TMA2940, TA Instrument) was used to cut the hardened sealing resin composition into a diameter of 8 mm and a length of 20 mm. The measurement was performed at a temperature of 5 ° C / min from 0 ° C to 300 ° C. The slope of the tangent at 10 ° C to 30 ° C was defined as the thermal expansion rate (ppm / ° C). The results are shown in Table 1.

(Measurement method of coefficient of elasticity) Using a viscoelasticity measuring device (RSA III, TA Instrument), the cured resin composition for sealing was cut into a size of 50 mm × 10 mm × 3 mm, and the thickness Under the conditions of a distance of 40 mm and a frequency of 1 Hz, the three-point bending method was used to raise the value of the storage elastic coefficient (GPa) at 25 ° C from 5 ° C / min to 300 ° C from 20 ° C to 300 ° C. The results are shown in Table 1.

(Measuring method of glass transition temperature) It measured using the same apparatus and conditions as the said thermal expansion coefficient, and made the temperature corresponding to the intersection of a tangent line of 50 degreeC and 150 degreeC into glass transition temperature (degreeC). The results are shown in Table 1.

As shown in Table 1, the ratio of the bisphenol-type epoxy resin and the specific naphthalene-type epoxy resin as the epoxy resin and the specific naphthalene-type epoxy resin to the entire epoxy resin is 10% to 30% by mass. Compared with the sealing resin composition of the comparative example which does not satisfy the said conditions, the sealing resin composition of the Example has the outstanding injection property, and both the thermal expansion coefficient and the coefficient of elasticity are low. From this, it was revealed that even if a stress is generated between the hardened body of the sealing resin composition and the support, the effect of reducing or mitigating the stress is excellent.

The disclosure of Japanese Patent Application No. 2017-127581 is incorporated herein by reference in its entirety. All documents, patent applications, and technical specifications described in this specification are cited and incorporated into this specification to the same extent as if they were specifically and individually described and incorporated into each document, patent application, and technical specification by reference. in.

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Claims (8)

A sealing resin composition includes an epoxy resin, a hardener, and a filler. The epoxy resin includes a bisphenol-type epoxy resin and 1,6-bis (glycidyloxy) naphthalene. The 1,6 The proportion of bis (glycidyloxy) naphthalene in the whole epoxy resin is 10% to 30% by mass. The sealing resin composition according to item 1 of the scope of patent application, wherein the bisphenol-type epoxy resin includes a bisphenol F-type epoxy resin. The resin composition for sealing according to item 1 or item 2 of the scope of patent application, wherein the proportion of the bisphenol-type epoxy resin in the entire epoxy resin is 20% by mass or more and less than 90% quality%. The sealing resin composition according to any one of claims 1 to 3, wherein the epoxy resin further comprises a glycidylamine type epoxy resin. The sealing resin composition according to item 4 of the scope of application for a patent, wherein the glycidylamine-type epoxy resin includes a trifunctional glycidylamine-type epoxy resin. The sealing resin composition according to any one of item 4 or item 5, in which the glycidylamine type epoxy resin accounts for 10% by mass of the entire epoxy resin -60% by mass. A semiconductor package includes a support, a semiconductor element disposed on the support, and a sealing resin according to any one of claims 1 to 6 for sealing the semiconductor element. Hardened composition. A method for manufacturing a semiconductor package, comprising: filling a support with a sealing resin composition according to any one of claims 1 to 6 and a semiconductor element arranged on the support with a sealing resin composition; A step of voids; and a step of hardening the sealing resin composition.