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TWI785149B - Mask pair, double-sided exposure apparatus, and mask exchange method - Google Patents

Mask pair, double-sided exposure apparatus, and mask exchange method Download PDF

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TWI785149B
TWI785149B TW107140983A TW107140983A TWI785149B TW I785149 B TWI785149 B TW I785149B TW 107140983 A TW107140983 A TW 107140983A TW 107140983 A TW107140983 A TW 107140983A TW I785149 B TWI785149 B TW I785149B
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substrate
aforementioned
mask
marks
auxiliary
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TW107140983A
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TW201926414A (en
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名古屋淳
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日商亞多特克工程股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2022Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/2032Simultaneous exposure of the front side and the backside
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/42Alignment or registration features, e.g. alignment marks on the mask substrates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7019Calibration
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049Technique, e.g. interferometric

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

設計成即使在將基板留在曝光作業位置的狀態下仍可容易地進行交換後的光罩彼此之校準。 搭載於將基板(S)的兩面曝光之兩面曝光裝置的光罩對當中的第一光罩(1)具有第一光罩標記(11)及第一輔助光罩標記(12),第二光罩(2)具有第二光罩標記(21)及第二輔助光罩標記(22)。於光罩(1、2)彼此之校準時在遠離基板(S)之位置將第一輔助光罩標記(12)與第二輔助光罩標記(22)疊合,以相機(8)確認此狀態。於對於基板(S)之光罩(1、2)之校準時,將第一光罩標記(11)與第二光罩標記(21)疊合,通過基板(S)的校準開口(Sm)以相機(8)拍攝。It is designed so that alignment between exchanged reticles can be easily performed even when the substrate is left at the exposure work position. The first mask (1) mounted in the mask pair of the double-side exposure device for exposing both sides of the substrate (S) has a first mask mark (11) and a first auxiliary mask mark (12). The mask (2) has a second mask mark (21) and a second auxiliary mask mark (22). Superimpose the first auxiliary mask mark (12) and the second auxiliary mask mark (22) at a position away from the substrate (S) when the reticles (1, 2) are aligned with each other, and confirm this with the camera (8) state. When aligning the reticle (1, 2) of the substrate (S), the first reticle mark (11) and the second reticle mark (21) are superimposed, passing through the alignment opening (Sm) of the substrate (S) Shoot with camera (8).

Description

光罩對,兩面曝光裝置及光罩交換方法Mask pair, double-sided exposure apparatus, and mask exchange method

本案發明,有關撓性印刷基板等的製造中使用之捲對捲(roll-to-roll)方式這樣的兩面曝光裝置。The present invention relates to a double-sided exposure apparatus such as a roll-to-roll method used in the manufacture of flexible printed circuit boards and the like.

將規定圖樣的光照射至對象物而曝光之曝光裝置,係作為光微影(photo lithography)的核心技術而被使用於各種用途。曝光裝置雖有各種類型之物,但已知其中一種為對帶狀的長型的基板的兩面曝光之兩面曝光裝置。An exposure device that irradiates an object with a predetermined pattern of light to expose it is used in various applications as a core technology of photolithography. There are various types of exposure apparatuses, but one of them is known as a double-side exposure apparatus for exposing both sides of a strip-shaped elongated substrate.

例如,將撓性印刷基板這樣柔軟的基板予以曝光之裝置的情形中,會採用藉由捲對捲一面搬送基板一面進行曝光之構成。在基板的搬送路線的兩側(通常為上下),配置有一對曝光單元。在搬送路線的兩側設有光罩,曝光單元從兩側通過各光罩照射規定圖樣的光,進行曝光。 從料捲拉出之基板的搬送為間歇性,在搬送後停止的基板當中位於一對曝光單元之間之部位的兩面被照射規定圖樣的光,兩面同時受到曝光。For example, in the case of an apparatus for exposing a flexible substrate such as a flexible printed circuit board, a configuration in which exposure is performed while conveying the substrate by roll-to-roll is employed. A pair of exposure units are arranged on both sides (normally, upper and lower sides) of the substrate transport path. Masks are provided on both sides of the transport path, and the exposure unit irradiates light of a predetermined pattern through each mask from both sides to perform exposure. The conveyance of the substrate pulled out from the reel is intermittent, and both surfaces of the portion located between the pair of exposure units among the substrates stopped after conveyance are irradiated with light of a predetermined pattern, and both surfaces are exposed at the same time.

這樣的兩面曝光裝置,亦為曝光裝置的一種,因此校準(對位)精度會成為問題。捲對捲方式的裝置這樣對於帶狀的長型的基板做曝光之裝置的情形中,於光微影結束後會在長度方向的適當的位置切斷,而獲得最終的製品。切斷位置能夠適當選定,因此曝光裝置中的長度方向的校準,以往並不是太大的問題。另一方面,一對光罩,相互的位置關係必須以高精度被維持。亦即,其理由在於,若一對光罩的位置關係的精度不佳,則最終的製品中基板的一方之側的圖樣與另一方之側的圖樣會變得錯位,而容易造成製品缺陷。因此,會設計成如專利文獻1或專利文獻2般,針對一對光罩相互進行校準,以避免形成的圖樣之錯位。Such a double-side exposure device is also a type of exposure device, and therefore alignment (alignment) accuracy becomes a problem. In the case of a roll-to-roll system that exposes a strip-shaped elongated substrate, after photolithography is completed, it is cut at an appropriate position in the longitudinal direction to obtain a final product. Since the cutting position can be appropriately selected, alignment in the longitudinal direction in the exposure apparatus has not been a big problem in the past. On the other hand, for a pair of masks, the mutual positional relationship must be maintained with high precision. That is, the reason is that if the accuracy of the positional relationship between the pair of photomasks is not good, the pattern on one side of the substrate and the pattern on the other side of the substrate will become misaligned in the final product, which will easily cause product defects. Therefore, as in Patent Document 1 or Patent Document 2, it is designed to calibrate a pair of photomasks to avoid misalignment of the formed patterns.

以往的狀況係如上述般,惟最近僅將一對光罩相互校準仍不足夠,還逐漸要求對於基板之對位也要以足夠高的精度進行。舉出其中一個背後的原因,係伴隨製品的高度功能化,具有多層配線這樣複雜的構造之情形逐漸變多。The previous situation was as above, but recently, it is not enough to align only a pair of photomasks with each other, and it is gradually required to perform the alignment of the substrate with a sufficiently high accuracy. One of the reasons behind this is that with the highly functionalization of products, more and more cases have complex structures such as multilayer wiring.

若要示意一例,當於撓性印刷基板精密製作如多層配線這樣複雜的構造的情形下,多半為在帶狀的基板上已形成有圖樣,而在其上進一步塗布阻劑來進行曝光之情形。既存的圖樣,是沿著帶狀的基板的長度方向相距間隔形成多數個,形成有各個圖樣之部分最終會成為各個製品。在此情形下,於進一步的曝光中,必須對於已形成的圖樣以必要的位置精度進行曝光,而必須要對於基板之校準。To illustrate an example, when a complex structure such as multilayer wiring is precisely produced on a flexible printed circuit board, it is often the case that a pattern is formed on a tape-shaped substrate, and a resist is further coated on it for exposure. . Existing patterns are formed in plural at intervals along the longitudinal direction of the strip-shaped substrate, and the portions where the respective patterns are formed eventually become individual products. In this case, in the further exposure, the already formed pattern must be exposed with the necessary positional accuracy, and calibration of the substrate is necessary.

此外,依製品不同,會有在已形成有圖樣的部分的上方將另一撓性的方形的基板疊合(laminate),而對於該另一基板(以下稱為上層基板)進行曝光以形成圖樣之情形。在此情形下同樣地,上層基板是沿著帶狀的基板的長度方向相距間隔被疊合多數個,因此必須在對於各個上層基板而言做好校準之狀態下進行曝光。In addition, depending on the product, another flexible square substrate may be laminated on top of the part where the pattern has been formed, and the other substrate (hereinafter referred to as the upper substrate) is exposed to form a pattern. situation. In this case as well, since a plurality of upper substrates are stacked at intervals along the longitudinal direction of the strip-shaped substrate, exposure must be performed in a state where the respective upper substrates are aligned.

像這樣當對於基板之校準也受到要求的情形下,於將一對光罩相互校準以後,還必須一面保持該狀態一面將該一對光罩對於基板做校準。因此,專利文獻2中,採用一種透過設於基板之作為校準標記的開口(以下稱為校準用開口)而藉由相機拍攝兩側的光罩的校準標記之構成。 [先前技術文獻] [專利文獻]In such a case where alignment with respect to the substrate is also required, after aligning a pair of photomasks with each other, it is necessary to align the pair of photomasks with respect to the substrate while maintaining this state. Therefore, in Patent Document 2, a configuration is adopted in which the alignment marks of the reticles on both sides are photographed by a camera through an opening (hereinafter referred to as an opening for alignment) provided on the substrate as an alignment mark. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2000-155430號公報 [專利文獻2]日本特開2006-278648號公報[Patent Document 1] Japanese Patent Laid-Open No. 2000-155430 [Patent Document 2] Japanese Patent Laid-Open No. 2006-278648

[發明所欲解決之問題][Problem to be solved by the invention]

上述這樣對帶狀的長型的基板的兩面曝光之兩面曝光裝置中,一對光罩,若欲形成之圖樣相異,則會使用相異之物。是故,會發生必須因應製品來交換光罩之必要性。在此情形下,捲對捲搬送方式這樣從料捲將基板拉出而做曝光之類型的裝置中,會發生製品的品種在料捲的途中變更,而必須交換一對光罩之情形。In the double-side exposure apparatus for exposing both sides of a strip-shaped elongated substrate as described above, if a pair of photomasks have different patterns to be formed, different ones are used. Therefore, it is necessary to replace the photomask according to the product. In this case, in the apparatus of the roll-to-roll transfer method, in which the substrate is pulled out from the roll and exposed, the type of product may be changed in the middle of the roll, and a pair of photomasks must be exchanged.

在此情形下,暫且將基板捲取,造出在曝光作業位置沒有基板之狀態來交換一對光罩,就光罩的交換作業而言會比較順手。然而,將處理到長度方向的途中之基板暫且捲取,交換後再次拉出而造出原本的狀態非常地麻煩,會有導致裝置的運轉長時間停止之問題。是故,可以的話,較佳是能夠設計成基板維持不動而僅交換一對光罩。In this case, it is easier to exchange a pair of photomasks by rewinding the substrate for the time being so that there is no substrate at the exposure position. However, it is very cumbersome to take up the substrates that are processed in the longitudinal direction, and pull them out again after replacement to restore the original state, which may cause the problem that the operation of the device will stop for a long time. Therefore, if possible, it is preferable to design such that the substrate remains unchanged and only a pair of photomasks are exchanged.

然而,依發明者之檢討,得知了以往的光罩的情形下,由於與校準之間的關係,上述這樣的交換方法是非常費事的方法。針對這點,以下具體說明之。However, according to the review of the inventors, in the case of conventional photomasks, the above-mentioned exchange method is a very laborious method due to the relationship with calibration. In view of this point, it is explained in detail below.

若要對於基板而言將一對光罩以高精度校準,較佳是如專利文獻2揭示般,設計成各光罩的校準標記(以下稱為光罩標記)和基板的校準用開口在垂直於基板之光軸上並排,而藉由相機來確認此狀態之構成。此時,在各光罩設有複數個光罩標記,於同樣的位置關係下在基板亦設有複數個校準用開口。各光罩的位置受到調整以使各光罩標記及校準用開口各自在光軸上並排,藉此進行校準。 上述這樣的校準構造中,當然地,一個光罩中各光罩標記會落入基板的大小的範圍內。亦即,若將平行於基板的板面而垂直於長度方向之方向訂為基板寬幅方向,則一個光罩中的各光罩標記的基板寬幅方向之相隔距離,會比基板的寬幅還短。In order to align a pair of reticles with respect to the substrate with high precision, it is preferable to design the alignment mark of each reticle (hereinafter referred to as the reticle mark) and the alignment opening of the substrate to be perpendicular to each other as disclosed in Patent Document 2. They are aligned on the optical axis of the substrate, and the configuration of this state is confirmed by a camera. At this time, a plurality of mask marks are provided on each mask, and a plurality of alignment openings are also provided on the substrate in the same positional relationship. The positions of the reticles are adjusted so that the reticle marks and the openings for alignment are aligned on the optical axis, thereby performing alignment. In such an alignment structure as described above, of course, each mask mark in one mask falls within the range of the size of the substrate. That is, if the direction parallel to the board surface of the substrate and perpendicular to the longitudinal direction is defined as the substrate width direction, the distance between the substrate width direction of each mask mark in a mask will be greater than the width of the substrate. Still short.

如上述般交換一對光罩時,首先必須做光罩彼此之校準,但僅安裝各光罩的狀態下,各光罩標記和基板的校準用開口不會在一直線上並排,故從相機看來相反側(基板的背側)的光罩的光罩標記,會因基板而導致隱蔽。基板為遮光性的情形很多,塗布了阻劑之狀態就是其典型。在光罩標記因基板而隱蔽的狀態下,無法做光罩彼此之校準,故會變成首先找尋基板的校準用開口,使相反側的光罩的光罩標記位於該位置,然後再使臨面側的光罩的光罩標記位於一直線上這樣非常麻煩的作業。特別是,使相反側的光罩的光罩標記位於基板的校準用開口內之作業,不得不在光罩標記隱蔽的狀態下進行,因此成為非常麻煩的作業。When exchanging a pair of reticles as above, it is first necessary to align the reticles with each other. However, when each reticle is mounted, the markings on each reticle and the alignment openings on the substrate are not aligned in a straight line. The mask mark from the mask on the opposite side (backside of the substrate) will be hidden by the substrate. There are many cases where the substrate is light-shielding, and the state where the resist is coated is a typical example. In the state where the mask mark is hidden by the substrate, it is impossible to align the masks with each other. Therefore, the alignment opening of the substrate is first searched, and the mask mark of the mask on the opposite side is located at this position, and then the opposite side is aligned. It is very troublesome work that the mask mark of the mask on the side is located on a straight line. In particular, the operation of positioning the mask mark of the opposite mask in the alignment opening of the substrate has to be performed with the mask mark hidden, and thus becomes a very cumbersome operation.

作為另一方法,將光罩拉出至讓相反側的光罩的光罩標記不會因基板而隱蔽之位置,而在該位置做光罩彼此之校準的方法亦為可行。然而,於光罩彼此之校準時也必須使相機移動,而於做完校準後必須再次送返原本的位置。然後,校準完的一對光罩,亦必須送返曝光作業位置,但送返時一對光罩有沒有錯位,必須藉由相機來確認。然而,在送返的位置有著基板,因此相反側的光罩的校準標記無法以相機捕捉,而無法確認是否保持在被校準好之狀態。若要確認,會發生找尋基板的校準用開口,而使各光罩一體地移動以使各光罩標記位於該位置之必要性。由於這樣的事實,得知了以往習知的構成中,將基板留在曝光作業位置而做光罩之交換,由於與校準之間的關係,是非常費事而麻煩的作業。As another method, it is also possible to pull out the mask to a position where the mask mark of the mask on the opposite side is not hidden by the substrate, and align the masks at this position. However, it is necessary to move the camera when the reticles are aligned with each other, and it must be returned to the original position after the alignment is completed. Then, the pair of reticles that have been calibrated must also be returned to the exposure operation position, but whether the pair of reticles are misaligned when returning must be confirmed by the camera. However, since there is a substrate at the returned position, the alignment mark of the opposite photomask cannot be captured by a camera, and it cannot be confirmed whether it remains in an aligned state. For confirmation, it is necessary to search for the alignment opening of the board and move each mask integrally so that each mask mark is located at the position. From such a fact, it is known that in the conventional configuration, exchanging the mask while leaving the substrate at the exposure operation position is a very laborious and troublesome operation due to the relationship with calibration.

此申請案之發明,係為了解決這樣的待解問題而研發,目的在於提供一種即使在將基板留在曝光作業位置之狀態下仍可容易地進行交換後的光罩彼此之校準之光罩對的構成,而設計成藉由使用這樣的光罩對來使交換作業全體於短時間完畢。 [解決問題之技術手段]The invention of this application was developed to solve such unsolved problems, and the purpose is to provide a pair of reticles that can be easily exchanged for alignment between reticles even when the substrate is left at the exposure work position. The configuration is designed so that the entire exchange operation can be completed in a short time by using such a mask pair. [Technical means to solve the problem]

為解決上述待解問題,本案申請專利範圍第1項所述之發明,係由搭載於將基板的兩面曝光之兩面曝光裝置的第一光罩與第二光罩所組成之光罩對,具有下述構成,即, 第一光罩,具有為了做對於基板之校準而設置之第一光罩標記、及為了做對於第二光罩之校準而設置之第一輔助光罩標記, 第二光罩,具有為了做對於基板之校準而設置之第二光罩標記、及為了做對於第一光罩之校準而設置之第二輔助光罩標記, 第一光罩標記與第二光罩標記之在基板的寬幅方向的相隔距離,為基板的寬幅以下, 第一輔助光罩標記與第二輔助光罩標記之在基板的寬幅方向的相隔距離,超過基板的寬幅。 此外,為解決上述待解問題,申請專利範圍第2項所述之發明,具有下述構成,即,具備:將被捲成料捲之基板拉出而予以間歇性地饋送之搬送系統;及 被配置於包夾被饋送的基板的位置之如申請專利範圍第1項所述之光罩對;及 於搬送系統使基板停止而進行了校準之後,各自通過前述第一第二光罩對基板照射光而將基板的兩面曝光之曝光單元; 基板,具有對於應曝光的區域而言以規定的位置關係設置之校準標記, 設有:相機,可拍攝前述第一光罩標記、前述第二光罩標記及基板的校準標記;及 相機移動機構,使相機移動;及 校準手段,藉由來自拍攝了前述第一光罩標記、前述第二光罩標記及基板的校準標記之相機的拍攝資料,將前述第一第二光罩對於基板的應曝光的區域而言做對位; 相機移動機構,為能夠在為了將前述第一第二光罩對於基板而言做校準而拍攝前述第一光罩標記及前述第二光罩標記之基板校準位置,和為了將前述第一第二光罩彼此做校準而拍攝前述第一輔助光罩標記及前述第二輔助光罩標記之光罩校準位置之間,使相機移動之機構。 此外,為解決上述待解問題,申請專利範圍第3項所述之發明,具有下述構成,即,具備:將被捲成料捲之基板拉出而予以間歇性地饋送之搬送系統;及 被配置於包夾被饋送的基板的位置之如申請專利範圍第1項所述之光罩對;及 於搬送系統使基板停止而進行了校準之後,通過前述第一第二光罩對基板照射光而將基板的兩面曝光之曝光單元; 基板,具有對於應曝光的區域而言以規定的位置關係設置之校準標記, 設有:相機,可拍攝前述第一光罩標記、前述第二光罩標記及基板的校準標記;及 校準手段,藉由來自拍攝了前述第一光罩標記、前述第二光罩標記及基板的校準標記之相機的拍攝資料,將前述第一第二光罩對於基板的應曝光的區域而言做對位; 相機,配置於為了將前述第一第二光罩對於基板而言做校準而拍攝前述第一光罩標記及前述第二光罩標記之基板校準位置,並且設有不同於此相機之別的相機,此別的相機,配置於為了將前述第一第二光罩彼此做校準而拍攝前述第一輔助光罩標記及前述第二輔助光罩標記之光罩校準位置。 此外,為解決上述待解問題,申請專利範圍第4項所述之發明,係在將被捲成料捲之撓性的基板拉出而予以間歇性地饋送,而將被饋送的基板的兩面在曝光作業位置予以曝光之兩面曝光裝置中,於曝光作業位置將包夾基板而配置之一對第一第二光罩予以交換之光罩交換方法,具有下述構成,即, 具有:將基板留在曝光作業位置而交換既有的至少一方的光罩之交換步驟;及 於交換步驟之後,將基板留在曝光作業位置而將第一第二光罩做相互對位之光罩校準步驟; 第一光罩,具有為了做對於基板之校準而設置之第一光罩標記、及用於做對於第二光罩之校準而設置之第一輔助光罩標記, 第二光罩,具有為了做對於基板之校準而設置之第二光罩標記、及用於做對於第一光罩之校準而設置之第二輔助光罩標記, 第一光罩標記與第二光罩標記之在基板的寬幅方向的相隔距離,為基板的寬幅以下, 第一輔助光罩標記與第二輔助光罩標記之在基板的寬幅方向的相隔距離,超過基板的寬幅, 光罩校準步驟中,在遠離基板之位置將第一輔助光罩標記與第二輔助光罩標記重疊,藉此將第一第二光罩相互做對位。 [發明之功效]In order to solve the above-mentioned problems to be solved, the invention described in item 1 of the scope of patent application of this case is a photomask pair composed of a first photomask and a second photomask mounted on a double-sided exposure device that exposes both sides of the substrate, and has the following advantages: The following constitutes, namely, The first reticle has a first reticle mark arranged for alignment of the substrate, and a first auxiliary reticle mark arranged for alignment of the second reticle, The second reticle has a second reticle mark for alignment of the substrate, and a second auxiliary reticle mark for alignment of the first reticle, The distance between the first mask mark and the second mask mark in the width direction of the substrate is less than or equal to the width of the substrate, The distance between the first auxiliary mask mark and the second auxiliary mask mark in the width direction of the substrate exceeds the width of the substrate. In addition, in order to solve the above-mentioned problems to be solved, the invention described in claim 2 has the following configuration, that is, it has a conveying system that pulls out the substrate rolled into a roll and feeds it intermittently; and A pair of photomasks as described in Item 1 of the scope of the patent application, arranged at a position sandwiching the substrate to be fed; and An exposure unit for exposing both sides of the substrate by irradiating light to the substrate through the first and second masks respectively after the transfer system stops the substrate for alignment; a substrate having alignment marks arranged in a defined positional relationship with respect to the areas to be exposed, It is provided with: a camera capable of photographing the aforementioned first mask mark, the aforementioned second mask mark and the alignment mark of the substrate; and a camera moving mechanism to move the camera; and The calibration means is to make the above-mentioned first and second reticles for the area to be exposed on the substrate by using the photographed data from the camera that has photographed the above-mentioned first reticle mark, the above-mentioned second reticle mark and the alignment mark of the substrate. Counterpoint; The camera moving mechanism is capable of photographing the substrate calibration position of the aforementioned first mask mark and the aforementioned second mask mark in order to align the aforementioned first and second mask with respect to the substrate, and for aligning the aforementioned first and second mask marks. A mechanism for moving the camera between the reticle alignment positions of the first auxiliary reticle mark and the second auxiliary reticle mark for alignment between reticles. In addition, in order to solve the above-mentioned problems to be solved, the invention described in claim 3 has the following configuration, that is, it has a conveying system that pulls out the substrate rolled into a roll and feeds it intermittently; and A pair of photomasks as described in Item 1 of the scope of the patent application, arranged at a position sandwiching the substrate to be fed; and An exposure unit for exposing both sides of the substrate by irradiating light to the substrate through the first and second masks after the transfer system stops the substrate for calibration; a substrate having alignment marks arranged in a defined positional relationship with respect to the areas to be exposed, It is provided with: a camera capable of photographing the aforementioned first mask mark, the aforementioned second mask mark and the alignment mark of the substrate; and The calibration means is to make the above-mentioned first and second reticles for the area to be exposed on the substrate by using the photographed data from the camera that has photographed the above-mentioned first reticle mark, the above-mentioned second reticle mark and the alignment mark of the substrate. Counterpoint; A camera arranged at a substrate alignment position for photographing the first mask mark and the second mask mark for aligning the first and second masks with respect to the substrate, and having a camera different from the camera , this other camera is disposed at a mask alignment position for photographing the first auxiliary mask mark and the second auxiliary mask mark in order to align the first and second masks with each other. In addition, in order to solve the above-mentioned problems to be solved, the invention described in item 4 of the scope of patent application is to pull out the flexible substrate rolled into a roll and feed it intermittently, and the two sides of the substrate to be fed In the double-sided exposure apparatus for exposing at the exposure operation position, the mask exchange method for exchanging the first and second masks by placing the sandwiched substrate at the exposure operation position has the following configuration, that is, It has: the exchanging step of exchanging at least one of the existing photomasks while leaving the substrate at the exposure operation position; and After the exchange step, the substrate is left in the exposure operation position and the first and second masks are aligned to each other for mask alignment; The first reticle has a first reticle mark arranged for alignment of the substrate, and a first auxiliary reticle mark arranged for alignment of the second reticle, The second reticle has a second reticle mark arranged for alignment of the substrate, and a second auxiliary reticle mark arranged for alignment of the first reticle, The distance between the first mask mark and the second mask mark in the width direction of the substrate is less than or equal to the width of the substrate, The distance between the first auxiliary mask mark and the second auxiliary mask mark in the width direction of the substrate exceeds the width of the substrate, In the mask alignment step, the first auxiliary mask mark and the second auxiliary mask mark are overlapped at a position away from the substrate, thereby aligning the first and second masks. [Efficacy of Invention]

如以下說明般,按照本案申請專利範圍第1項之光罩對,能夠將基板維持配置在曝光作業位置而交換光罩,將基板維持配置在曝光作業位置而進行交換後的光罩彼此之校準,故沒有導致裝置的運轉長時間停止之問題。此時,光罩對具有輔助光罩標記,第一輔助光罩標記與第二輔助光罩標記的在基板寬幅方向之相隔距離係超過基板的寬幅,故能夠在遠離基板之位置捕捉兩側的輔助光罩標記而能夠做光罩彼此之校準。因此,於光罩彼此之校準完畢後不需要將光罩送返原本的位置這樣的移動動作,可極為簡便地在短時間進行光罩彼此之校準。 此外,按照本案申請專利範圍第2項所述之發明,除上述效果外,相機能夠在光罩彼此之校準與光罩對的對於基板之校準中兼用,故相機的台數只需較少,就這點成本會減低。 此外,按照本案申請專利範圍第3項所述之發明,除上述效果外,於光罩彼此之校準時係使用不同於和光罩對的對於基板之校準用的相機之別的相機,故構造上變得簡略,此外會節省相機的移動所需之時間。 此外,按照本案申請專利範圍第4項之發明,是將基板維持配置在曝光作業位置而交換光罩,將基板維持配置在曝光作業位置而進行交換後的光罩彼此之校準,故沒有導致裝置的運轉長時間停止之問題。此時,光罩對具有輔助光罩標記,第一輔助光罩標記與第二輔助光罩標記的在基板寬幅方向之相隔距離係超過基板的寬幅,會在遠離基板之位置捕捉兩側的輔助光罩標記而做光罩彼此之校準。因此,於光罩彼此之校準完畢後不需要將光罩送返原本的位置這樣的移動動作,可極為簡便地在短時間進行光罩彼此之校準。As explained below, according to the mask pair of claim 1 of the present application, the mask can be exchanged while maintaining the substrate at the exposure operation position, and the alignment between the exchanged masks can be performed while maintaining the substrate at the exposure operation position. , so there is no problem of stopping the operation of the device for a long time. At this time, the mask pair has auxiliary mask marks, and the distance between the first auxiliary mask mark and the second auxiliary mask mark in the width direction of the substrate exceeds the width of the substrate, so that the two images can be captured at a position far away from the substrate. Auxiliary reticle marking on the side enables alignment of reticles with each other. Therefore, after the alignment of the reticles is completed, there is no need to move the reticle to its original position, and the alignment of the reticles can be performed very simply and in a short time. In addition, according to the invention described in item 2 of the patent application scope of this application, in addition to the above-mentioned effects, the camera can be used for both the calibration of the reticle and the calibration of the reticle pair to the substrate, so the number of cameras only needs to be small. This will reduce the cost. In addition, according to the invention described in item 3 of the scope of patent application of this application, in addition to the above-mentioned effects, a camera different from the camera used for calibration of the substrate for the pair of reticles is used when calibrating the reticles, so in terms of structure It becomes simple and saves the time required for moving the camera. In addition, according to the invention of claim 4 of the scope of patent application of this application, the mask is exchanged while maintaining the substrate at the exposure operation position, and the alignment between the exchanged masks is performed while maintaining the substrate at the exposure operation position, so there is no damage to the device. The problem of long-term stoppage of operation. At this time, the mask pair has auxiliary mask marks, and the distance between the first auxiliary mask mark and the second auxiliary mask mark in the width direction of the substrate is greater than the width of the substrate, and the two sides will be captured at a position far away from the substrate. Auxiliary reticle marks for reticle alignment. Therefore, after the alignment of the reticles is completed, there is no need to move the reticle to its original position, and the alignment of the reticles can be performed very simply and in a short time.

接下來,說明本案實施方式(實施形態)。 首先,說明光罩對之發明之實施形態。圖1為實施形態之光罩對的立體概略圖。 所謂「光罩對」,為一對光罩的成組之意味。光罩對,由搭載於將基板的兩面曝光之兩面曝光裝置的第一光罩1與第二光罩2所組成。各光罩1、2為板狀,本實施形態中為方形。 由於是曝光所使用之物,在各光罩1、2描繪有欲轉印之圖樣。各光罩1、2中,將描繪有圖樣的區域稱為圖樣區域,圖1中以P表示。Next, an embodiment (embodiment) of the present invention will be described. First, an embodiment of the invention of the mask pair will be described. FIG. 1 is a perspective schematic view of a photomask pair according to the embodiment. The so-called "reticle pair" means a group of a pair of reticles. The mask pair consists of a first mask 1 and a second mask 2 mounted on a double-side exposure device that exposes both sides of a substrate. Each photomask 1, 2 is plate-shaped, and it is square in this embodiment. Since it is used for exposure, a pattern to be transferred is drawn on each mask 1, 2. In each photomask 1, 2, the area|region in which a pattern was drawn is called a pattern area, and is shown by P in FIG.

如圖1所示,在搭載於裝置之狀態下,第一光罩1與第二光罩2為水平的姿勢,是故相互平行。第一光罩1與第二光罩2,繞垂直的軸之旋轉方向的姿勢亦同一,方形的面對面的邊於第一光罩1與第二光罩2係面向同一方向。 如圖1所示,於曝光作業位置,基板S亦為水平的姿勢。當進行接觸(contact)曝光的情形下,各光罩1、2會從圖1所示狀態朝向基板S移動,緊貼於基板S。緊貼狀態下光各自通過各光罩1、2而照射而進行曝光。As shown in FIG. 1 , in the state of being mounted on the device, the first photomask 1 and the second photomask 2 are in a horizontal posture, so they are parallel to each other. The first photomask 1 and the second photomask 2 also have the same posture in the direction of rotation around the vertical axis, and the facing sides of the square face the same direction with respect to the first photomask 1 and the second photomask 2 . As shown in FIG. 1 , the substrate S is also in a horizontal posture at the exposure operation position. In the case of performing contact exposure, each mask 1 and 2 will move toward the substrate S from the state shown in FIG. 1 , and be in close contact with the substrate S. FIG. Light is irradiated and exposed through each photomask 1 and 2 in a close contact state.

如前述般,兩面曝光裝置中,會進行光罩對的對於基板S之校準。是故,在各光罩1、2,設有用來做此校準之標記11、21。以下,將設於第一光罩1之校準標記11稱為第一光罩標記,將設於第二光罩2之校準標記21稱為第二光罩標記。如圖1所示,本實施形態中,第一光罩標記11為圓周狀,第二光罩標記21為比第一光罩標記11還小之圓形的點。As mentioned above, in a double-sided exposure apparatus, alignment of a mask pair with respect to the board|substrate S is performed. Therefore, each mask 1, 2 is provided with marks 11, 21 for this calibration. Hereinafter, the alignment mark 11 provided in the 1st mask 1 is called a 1st mask mark, and the alignment mark 21 provided in the 2nd mask 2 is called a 2nd mask mark. As shown in FIG. 1 , in this embodiment, the first mask mark 11 has a circular shape, and the second mask mark 21 is a circular dot smaller than the first mask mark 11 .

如圖1所示,為了校準,在基板S也形成有校準用開口Sm作為校準標記。本實施形態中,校準用開口Sm呈圓形。本實施形態中,第一光罩標記11及第二光罩標記21比校準用開口Sm還小。如後述般,於對於基板S之校準時,第一第二光罩標記11、21會位於校準用開口Sm內。As shown in FIG. 1 , for alignment, an alignment opening Sm is also formed on the substrate S as an alignment mark. In the present embodiment, the opening Sm for alignment has a circular shape. In this embodiment, the 1st mask mark 11 and the 2nd mask mark 21 are smaller than the opening Sm for alignment. As will be described later, when aligning the substrate S, the first and second mask marks 11 and 21 are located in the opening Sm for alignment.

又,這樣的構成之實施形態之光罩對中,除了上述對於基板S之校準用的光罩標記11、21,還設有別的校準標記12、22。以下,將該些別的校準標記12、22當中設於第一光罩1者稱為第一輔助光罩標記,將設於第二光罩2者稱為第二輔助光罩標記。 該些輔助光罩標記12、22,是為了將光罩1、2彼此校準而特別設置之物。本例中,輔助光罩標記12、22在各光罩1、2各設有二個。Moreover, in the mask alignment of the embodiment with such a structure, other alignment marks 12, 22 are provided in addition to the above-mentioned mask marks 11, 21 for alignment with respect to the board|substrate S. FIG. Hereinafter, among these other alignment marks 12 and 22, those provided on the first reticle 1 are referred to as first auxiliary reticle marks, and those provided on the second reticle 2 are referred to as second auxiliary reticle marks. These auxiliary mask marks 12, 22 are specially provided for aligning the masks 1, 2 with each other. In this example, two auxiliary mask marks 12 , 22 are provided on each mask 1 , 2 .

又,各輔助光罩標記12、22,於基板S的寬幅方向,設於比第一第二光罩標記11、21還外側。若要更具體地說明,實施形態中,基板S被設想為帶狀的長型之物。基板S的寬幅方向,為沿著基板S的板面之方向且為對於長度方向而言垂直之方向。以下,將此方向稱為基板寬幅方向。Moreover, each auxiliary mask mark 12,22 is provided outside the 1st and 2nd mask mark 11,21 in the width direction of the board|substrate S. As shown in FIG. To describe it more specifically, in the embodiment, the substrate S is assumed to be long and strip-shaped. The width direction of the substrate S is a direction along the surface of the substrate S and a direction perpendicular to the longitudinal direction. Hereinafter, this direction is referred to as the substrate width direction.

如圖1所示,第一光罩標記11,於基板寬幅方向形成於圖樣區域P的外側。但,四個第一光罩標記11的基板寬幅方向的相隔距離,比基板S的寬幅(圖1中以Sw表示)還短。是故,當第一光罩1緊貼於基板S時,四個第一光罩標記11會位於基板1的板面內。 四個第二光罩標記21亦同,於基板寬幅方向在圖樣P的外側,以比基板S的寬幅Sw還短之相隔距離形成。是故,當第二光罩2緊貼於基板S時,四個第二光罩標記21會位於基板1的板面內。As shown in FIG. 1 , the first mask mark 11 is formed outside the pattern area P in the width direction of the substrate. However, the distance between the four first mask marks 11 in the substrate width direction is shorter than the width of the substrate S (indicated by Sw in FIG. 1 ). Therefore, when the first mask 1 is closely attached to the substrate S, the four first mask marks 11 will be located within the surface of the substrate 1 . The four second mask marks 21 are also formed at a distance shorter than the width Sw of the substrate S on the outside of the pattern P in the substrate width direction. Therefore, when the second mask 2 is closely attached to the substrate S, the four second mask marks 21 will be located within the surface of the substrate 1 .

另一方面,二個第一輔助光罩標記12,如圖1所示,基板寬幅方向的相隔距離比基板S的寬幅Sw還長。二個第二輔助光罩標記22,基板寬幅方向的相隔距離亦比基板S的寬幅Sw還長。 另,本實施形態中,將二個第一輔助光罩標記12相連之方向等於基板寬幅方向,將二個第二輔助光罩標記22相連之方向亦等於基板寬幅方向。此外,二個第一輔助光罩標記12的相隔距離,等於二個第二輔助光罩標記22的相隔距離。 這樣的第一第二輔助光罩標記12、22,如後述般,於光罩1、2彼此之校準時會受到利用。On the other hand, the distance between the two first auxiliary mask marks 12 in the substrate width direction is longer than the substrate S width Sw as shown in FIG. 1 . The distance between the two second auxiliary mask marks 22 in the width direction of the substrate is also longer than the width Sw of the substrate S. In addition, in this embodiment, the direction connecting the two first auxiliary mask marks 12 is equal to the width direction of the substrate, and the direction connecting the two second auxiliary mask marks 22 is also equal to the width direction of the substrate. In addition, the distance between the two first auxiliary mask marks 12 is equal to the distance between the two second auxiliary mask marks 22 . Such first and second auxiliary mask marks 12 and 22 are used when aligning the reticles 1 and 2 as will be described later.

另,各光罩1、2,在圖樣區域P以外基本上為透明。在透明的部分,例如形成有各光罩標記11、12、21、22作為黑色的圖樣。是故,各光罩標記11、12、21、22會藉由相機2而以足夠的對比度被辨視。In addition, each mask 1, 2 is basically transparent outside the pattern area P. As shown in FIG. In the transparent part, for example, each mask mark 11, 12, 21, 22 is formed as a black pattern. Therefore, each mask mark 11 , 12 , 21 , 22 can be recognized with sufficient contrast by the camera 2 .

接下來、說明搭載這樣的光罩對之實施形態之兩面曝光裝置。圖2為實施形態之兩面曝光裝置的正面概略圖。如圖2所示,兩面曝光裝置,具備搬送系統3、及曝光單元4。 實施形態之兩面曝光裝置,如前述般為將帶狀的基板曝光之裝置。這樣的基板,例如為聚醯亞胺製,舉例可為撓性印刷基板用的基板。Next, a double-sided exposure apparatus of an embodiment in which such a mask pair is mounted will be described. Fig. 2 is a schematic front view of a double-side exposure device according to the embodiment. As shown in FIG. 2 , the double-sided exposure apparatus includes a transport system 3 and an exposure unit 4 . The double-side exposure apparatus of the embodiment is an apparatus for exposing a tape-shaped substrate as described above. Such a substrate is, for example, made of polyimide, for example, a substrate for a flexible printed circuit board.

搬送系統3,為將被捲成料捲之基板S拉出而予以間歇性地送出之機構。搬送系統3,為將基板S水平地拉出而以水平的姿勢搬送之機構。具體而言,搬送系統3,具備:捲繞有未曝光的基板S之送出側芯滾筒31、及從送出側芯滾筒31將基板S拉出之送出側夾送滾筒(pinch roller)32、及供曝光後的基板S捲繞之捲取側芯滾筒33、及將曝光後的基板S拉出而使捲取側芯滾筒33捲取之捲取側夾送滾筒34。另,將搬送系統3所致之基板S的饋送方向訂為X方向,將和其垂直之水平方向訂為Y方向。Y方向為基板寬幅方向。將垂直於XY平面之方向訂為Z方向。 在送出側夾送滾筒32與捲取側夾送滾筒34之間,設定有曝光作業位置。曝光作業位置,為藉由曝光單元4而對基板S的兩面同時進行曝光之位置。The transport system 3 is a mechanism for intermittently sending out the substrate S wound into a roll. The transport system 3 is a mechanism that draws out the substrate S horizontally and transports it in a horizontal posture. Specifically, the transport system 3 includes: a delivery-side core roller 31 around which an unexposed substrate S is wound; a delivery-side pinch roller 32 that pulls the substrate S out from the delivery-side core roller 31; and The winding-side core roller 33 on which the exposed substrate S is wound, and the winding-side pinch roller 34 which pulls out the exposed substrate S and winds the winding-side core roller 33 . In addition, the feeding direction of the substrate S by the transfer system 3 is defined as the X direction, and the horizontal direction perpendicular thereto is defined as the Y direction. The Y direction is the width direction of the substrate. The direction perpendicular to the XY plane is defined as the Z direction. An exposure work position is set between the sending-side pinch roller 32 and the take-up-side pinch roller 34 . The exposure work position is a position where both surfaces of the substrate S are simultaneously exposed by the exposure unit 4 .

又,在此曝光作業位置搭載光罩對。如圖2所示,光罩對當中,第一光罩1配置於基板S的上側,第二光罩2配置於基板S的下側。亦即,成為藉由光罩對而包夾基板S之狀態。 第一光罩1搭載於第一光罩平台10,第二光罩2搭載於第二光罩平台20。各光罩平台10、20,為方形的框狀,為不對通過各光罩1、2之光照射造成妨礙的形狀。Moreover, the mask pair is mounted in this exposure work position. As shown in FIG. 2 , in the mask pairing, the first mask 1 is arranged on the upper side of the substrate S, and the second mask 2 is arranged on the lower side of the substrate S. As shown in FIG. That is, it becomes the state which sandwiched the board|substrate S by a photomask pair. The first mask 1 is mounted on the first mask stage 10 , and the second mask 2 is mounted on the second mask stage 20 . Each mask stage 10, 20 is a square frame shape, and it is a shape which does not obstruct the light irradiation which passes each mask 1, 2.

又,在光罩對,附設有使光罩1、2移動之光罩移動機構5。本實施形態中,光罩移動機構5,為能夠使第一光罩1、第二光罩2分別獨立移動,並且也能夠使二個光罩1、2一體地移動之機構。例如,藉由將使第一光罩平台10朝XY方向移動之機構固定於第一底板,將使第二光罩平台20朝XY方向移動之機構固定於第二底板,再設置使第一第二底板一體地朝XY方向移動之機構來實現。In addition, a mask moving mechanism 5 for moving the masks 1 and 2 is attached to the mask pair. In the present embodiment, the mask moving mechanism 5 is a mechanism capable of independently moving the first mask 1 and the second mask 2 and also capable of moving the two masks 1 and 2 integrally. For example, by fixing the mechanism for moving the first mask platform 10 in the XY direction to the first base plate, fixing the mechanism for moving the second mask platform 20 in the XY direction on the second base plate, and then setting the first It is realized by the mechanism that the two bottom plates move in the XY direction integrally.

另,光罩移動機構5,為藉由主控制器6而受到自動控制之機構,惟主控制器6具備未圖示之手動操作部,為亦可做手動操作之機構。 此外,在各光罩1、2,設有未圖示之Z方向移動機構。Z方向移動機構,為接觸曝光用,使各光罩1、2朝向基板S移動,而用來使其緊貼於基板S之機構。In addition, the mask moving mechanism 5 is a mechanism that is automatically controlled by the main controller 6, but the main controller 6 has a manual operation part not shown in the figure, and is a mechanism that can also be manually operated. In addition, Z direction movement mechanism which is not shown in figure is provided in each mask 1,2. The Z-direction moving mechanism is used for contact exposure, and is used to move the masks 1 and 2 toward the substrate S so as to be in close contact with the substrate S.

曝光單元4亦採用一對之物,以便能夠藉由各自通過這樣的一對光罩1、2做光照射,而將基板S的兩面曝光。通過第一光罩1而曝光之曝光單元4,設於第一光罩1的上側,朝下方照射光而曝光。通過第二光罩2而曝光之曝光單元4,設於第二光罩2的下側,朝上方照射光而曝光。The exposure unit 4 also employs a pair so that both sides of the substrate S can be exposed by light irradiation through such a pair of masks 1 , 2 each. The exposure unit 4 which exposes through the 1st mask 1 is provided in the upper side of the 1st mask 1, and irradiates light downward and exposes. The exposure unit 4 which exposes through the 2nd photomask 2 is provided in the lower side of the 2nd photomask 2, and irradiates light upwards and exposes.

二個曝光單元4為上下對稱之配置,構造上相同。亦即,各曝光單元4,具備光源41、及將來自光源41的光照射至光罩1、2之光學系統42等。如後述般,本實施形態之裝置為進行接觸曝光之裝置,各曝光單元4為對各光罩1、2照射平行光之單元。是故,光學系統42,包含準直透鏡。The two exposure units 4 are vertically symmetrical and identical in structure. That is, each exposure unit 4 is equipped with the light source 41, the optical system 42 which irradiates the light from the light source 41 to the reticle 1, 2, etc. As will be described later, the apparatus of this embodiment is an apparatus that performs contact exposure, and each exposure unit 4 is a unit that irradiates parallel light to each mask 1 , 2 . Therefore, the optical system 42 includes a collimating lens.

搬送系統3,於曝光作業位置的上游側與下游側包含緩衝區301、302。搬送系統3,包含配置於曝光作業位置的上游側之第一驅動滾筒35、及配置於曝光作業位置的下游側之第二驅動滾筒36。各驅動滾筒35、36,為夾送滾筒。 如圖2所示,送出側夾送滾筒32與第一驅動滾筒35之間成為送出側緩衝區301。此外,第二驅動滾筒36與捲取側夾送滾筒34之間成為捲取側緩衝區302。The transport system 3 includes buffer zones 301 and 302 on the upstream and downstream sides of the exposure work position. The transport system 3 includes a first drive roller 35 arranged upstream of the exposure work position, and a second drive roller 36 arranged downstream of the exposure work position. Each drive roller 35,36 is a pinch roller. As shown in FIG. 2 , a delivery-side buffer zone 301 is formed between the delivery-side pinch roller 32 and the first driving roller 35 . In addition, a winding-side buffer zone 302 is formed between the second driving roller 36 and the winding-side pinch roller 34 .

第一驅動滾筒35與第二驅動滾筒36,為進行通過了曝光作業位置的基板S之間歇饋送之要素。亦即,第一驅動滾筒35與第二驅動滾筒36為同步動作之滾筒,構成為藉由設定好的規定的行程(stroke)來饋送基板S。此行程,為一次的間歇饋送時基板S被饋送之距離,以下稱為饋送行程,圖1中以Lf表示。The first driving roller 35 and the second driving roller 36 are elements for performing intermittent feeding of the substrate S passing through the exposure work position. That is to say, the first driving roller 35 and the second driving roller 36 are synchronously acting rollers, and are configured to feed the substrate S by a predetermined stroke. This stroke is the distance that the substrate S is fed during one batch of intermittent feeding, hereinafter referred to as the feeding stroke, represented by Lf in FIG. 1 .

另一方面,送出側芯滾筒31與送出側夾送滾筒32,是因應在送出側緩衝區301之基板S的鬆弛量而同步被驅動。在送出側緩衝區301配置有未圖示之感測器,若鬆弛量變少則送出側芯滾筒31與送出側夾送滾筒32會同步動作,將基板S送出直到成為設定好的最大值的鬆弛量為止。 捲取側緩衝區302亦同,配置有未圖示之感測器。遵照來自感測器之訊號,若鬆弛量變多至限度,則捲取側夾送滾筒34與捲取側芯滾筒33會同步動作,將基板S捲取直到鬆弛量減少至設定好的最小值為止。On the other hand, the sending-side core roller 31 and the sending-side pinch roller 32 are synchronously driven in accordance with the slack of the substrate S in the sending-side buffer zone 301 . A sensor (not shown) is arranged in the sending-side buffer zone 301, and when the amount of slack decreases, the sending-side core roller 31 and the sending-side pinch roller 32 will operate synchronously, and the substrate S will be sent out until the slack reaches the set maximum value. up to the amount. The same is true for the take-up side buffer 302, and a sensor not shown is disposed therein. According to the signal from the sensor, if the amount of slack increases to the limit, the pinch roller 34 on the take-up side and the core roller 33 on the take-up side will act synchronously to wind up the substrate S until the amount of slack is reduced to the set minimum value. .

上述的搬送系統3的間歇饋送中,於藉由饋送行程Lf之饋送後的基板S的停止中,基板S的兩面藉由各曝光單元4而受到曝光,但在此之前,會藉由校準手段進行校準。校準手段,為使第一第二光罩1、2移動而對於基板S的應曝光區域做對位之手段。是故,前述的光罩移動機構5被涵括於校準手段。In the intermittent feeding of the conveyance system 3 described above, both sides of the substrate S are exposed by the exposure units 4 during the stop of the substrate S after the feeding by the feed stroke Lf, but before that, they are exposed by the calibration means. to calibrate. The calibration means is a means of aligning the area to be exposed on the substrate S in order to move the first and second masks 1 and 2 . Therefore, the aforementioned mask moving mechanism 5 is included in the calibration means.

如圖2所示,裝置,具備控制包含搬送系統3或上述光罩移動機構5等的各部之主控制器6。在主控制器6,建置有控制使得裝置的各部以規定的手續動作之主順序程式(main sequence program)7。亦即,在主控制器6的記憶部60記憶有主順序程式7,而可藉由主控制器6的處理器(未圖示)來執行。主順序程式7,構成進行前述般的校準之校準手段。除此之外,主控制器6具備進行錯誤顯示等之顯示器61。As shown in FIG. 2 , the apparatus includes a main controller 6 for controlling each part including the transport system 3 and the above-mentioned mask moving mechanism 5 . In the main controller 6, a main sequence program (main sequence program) 7 for controlling each part of the device to operate in a predetermined procedure is installed. That is, the main sequence program 7 is stored in the storage unit 60 of the main controller 6 and can be executed by a processor (not shown) of the main controller 6 . The main sequence program 7 constitutes a calibration means for performing the aforementioned calibration. In addition, the main controller 6 includes a display 61 for displaying errors and the like.

針對校準手段所做之校準,參照圖2及圖3進一步詳細說明之。圖3為揭示有關實施形態之兩面曝光裝置中的校準之立體概略圖。 如圖2及圖3所示,裝置,具備校準用之相機8。本實施形態中,如前述般,第一光罩標記11、第二光罩標記21分別設有四個,故配合它們而設有四台的相機8。如圖3所示,四台相機,設於相當於方形的角之位置。The calibration performed by the calibration means is further described in detail with reference to FIG. 2 and FIG. 3 . Fig. 3 is a schematic perspective view showing alignment in the double-side exposure apparatus according to the embodiment. As shown in FIG. 2 and FIG. 3 , the device includes a camera 8 for calibration. In the present embodiment, four first mask marks 11 and four second mask marks 21 are respectively provided as described above, so four cameras 8 are provided in conjunction with these. As shown in FIG. 3, four cameras are installed at positions corresponding to corners of a square.

如前述般,校準有二種類,一種是光罩1、2彼此之校準,另一種是光罩對的對於基板S之校準。當中,在圖3(1)示意光罩1、2彼此之校準,在圖3(2)示意光罩對的對於基板S之校準。As mentioned above, there are two types of calibration, one is the calibration between the reticle 1 and 2, and the other is the calibration of the reticle pair with respect to the substrate S. Among them, FIG. 3(1) shows the alignment of the reticles 1 and 2, and FIG. 3(2) shows the alignment of the reticle pair with respect to the substrate S.

如圖2及圖3所示,各相機8,以光軸(內建的透鏡的光軸)A成為垂直之方式配置,而以拍攝下方之姿勢被安裝。在固設各相機8之台座,設有用來變更相機8的XY方向的位置之相機移動機構81。另,如圖2所示,各相機8連接至主控制器6,相機8的拍攝資料會被送至主控制器6。相機移動機構81,亦受到主控制器6控制。As shown in FIG. 2 and FIG. 3 , each camera 8 is arranged so that the optical axis (optical axis of the built-in lens) A becomes vertical, and is installed in a downward posture. A camera moving mechanism 81 for changing the position of the camera 8 in the XY direction is provided on the base where each camera 8 is fixed. In addition, as shown in FIG. 2 , each camera 8 is connected to the main controller 6 , and the shooting data of the cameras 8 will be sent to the main controller 6 . The camera moving mechanism 81 is also controlled by the main controller 6 .

首先,說明光罩1、2彼此之校準。 光罩1、2彼此之校準,是於初次將各光罩1、2搭載於裝置時,或如後述般交換光罩1、2時進行。針對光罩1、2彼此之校準,會使用四個相機8當中的兩側的二個相機。例如,圖3所示四個相機8,左側的二個相機被使用於光罩1、2彼此之校準。以下,將此二個相機8稱為兼用相機。First, alignment between the reticles 1 and 2 will be described. Alignment between the reticles 1 and 2 is performed when the respective reticles 1 and 2 are mounted on the device for the first time or when the reticles 1 and 2 are exchanged as described later. For the mutual calibration of the reticles 1, 2, two cameras on both sides of the four cameras 8 are used. For example, of the four cameras 8 shown in FIG. 3 , the two cameras on the left are used for the calibration of the reticles 1 and 2 . Hereinafter, these two cameras 8 are called dual-purpose cameras.

當進行光罩1、2彼此之校準的情形下,藉由相機移動機構8使兼用相機8事先移動至進行光罩1、2彼此之校準的位置(以下稱為光罩校準位置)。光罩校準位置,為光罩1、2的各第一第二輔助光罩標記12、22會落入視野之位置。換言之,各光罩1、2被配置成,各第一第二輔助光罩標記12、22會落入配置於光罩校準位置之兼用相機8的視野。此配置作業,多半為人工作業。另,往光罩校準位置之移動的方向,係和Y方向一致。When aligning the reticles 1 and 2, the camera moving mechanism 8 moves the combined camera 8 to a position where the reticles 1 and 2 are aligned (hereinafter referred to as a mask alignment position). The reticle alignment position is the position where each of the first and second auxiliary reticle marks 12 and 22 of the reticle 1 and 2 will fall into the field of view. In other words, each mask 1, 2 is arranged so that each of the first and second auxiliary mask marks 12, 22 falls into the field of view of the dual-purpose camera 8 arranged at the mask alignment position. This configuration work is mostly manual work. In addition, the moving direction to the mask calibration position is consistent with the Y direction.

藉由兼用相機8而被拍攝出的各輔助光罩標記12、22的像,會透過主控制器6而顯示於顯示器61。是故,作業者一面看著顯示器61的圖像一面手動操作光罩移動機構5,以使各第一輔助光罩標記12和各第二輔助光罩標記22重疊於同一直線上。如此一來,如圖3(1)所示,一對光罩1、2成為相互被校準之狀態。例如,將第一光罩1的位置維持固定,而使第二光罩2移動,使得各第二輔助光罩標記22和各第一輔助光罩標記12成為同一直線上。 本實施形態中,各第一輔助光罩標記12為圓周狀,各第二輔助光罩標記22為比第一輔助光罩標記12還小的圓形,故各第二輔助光罩標記22會位於各第一輔助光罩標記12內。然後,若各第二輔助光罩標記22的中心和各第一輔助光罩標記12的中心在必要的精度範圍內一致,則二個光罩1、2便成為相互被校準。The images of the auxiliary mask marks 12 and 22 captured by the dual-purpose camera 8 are displayed on the display 61 through the main controller 6 . Therefore, the operator manually operates the mask moving mechanism 5 while looking at the image on the display 61 so that the first auxiliary mask marks 12 and the second auxiliary mask marks 22 overlap on the same straight line. In this way, as shown in FIG. 3(1), a pair of photomasks 1 and 2 are aligned with each other. For example, the position of the 1st mask 1 is maintained fixed, and the 2nd mask 2 is moved so that each 2nd auxiliary mask mark 22 and each 1st auxiliary mask mark 12 may become the same straight line. In this embodiment, each first auxiliary mask mark 12 is circular, and each second auxiliary mask mark 22 is a circle smaller than the first auxiliary mask mark 12, so each second auxiliary mask mark 22 will Located in each first auxiliary mask mark 12 . Then, if the center of each second auxiliary mask mark 22 and the center of each first auxiliary mask mark 12 coincide within a necessary accuracy range, the two masks 1 and 2 are aligned with each other.

接下來,說明對於基板S之光罩對之校準。 當進行上述光罩1、2彼此之校準的情形下,兼用相機8會返回原本的位置。所謂原本的位置,為作為進行對於基板S之校準時的相機8的配置位置而設定好的位置。以下,將此位置稱為基板校準位置。Next, the alignment of the mask pair with respect to the substrate S will be described. When the above-mentioned alignment between the reticles 1 and 2 is performed, the dual-purpose camera 8 returns to its original position. The original position is a position set as an arrangement position of the camera 8 when calibration with respect to the board|substrate S is performed. Hereinafter, this position is referred to as a substrate calibration position.

基板校準位置,為相當於邊朝XY方向延伸的方形的角之位置。有關四個相機8的基板校準位置的關係,係和基板S的各校準用開口Sm的設計上的位置關係一致。是故,當各校準用開口Sm依設計般正確地形成,搬送系統3無誤差地進行了饋送行程Lf之間歇饋送的情形下,各校準用開口Sm會位於各相機8的光軸A上。實際上,由於各校準用開口Sm的形成位置的偏差或搬送系統3的間歇饋送的精度極限,於間歇饋送完畢時,各校準用開口Sm會從光軸A偏離。各相機8會採用具有足夠大的視野之物,以便即使在該狀況下各校準用開口Sm仍會落入各相機8的視野。The substrate calibration position is a position corresponding to a corner of a square whose sides extend in the XY direction. The relationship of the board calibration positions of the four cameras 8 is consistent with the design positional relationship of the calibration openings Sm of the board S. As shown in FIG. Therefore, when the calibration openings Sm are correctly formed as designed and the transfer system 3 performs intermittent feeding between the feeding strokes Lf without errors, the calibration openings Sm are located on the optical axes A of the cameras 8 . Actually, each calibration opening Sm deviates from the optical axis A when the intermittent feeding is completed due to the deviation of the forming positions of the calibration openings Sm or the accuracy limit of the intermittent feeding of the transport system 3 . Each camera 8 uses something with a sufficiently large field of view so that the calibration openings Sm fall into the field of view of each camera 8 even in this situation.

對於基板S之校準,是藉由主控制器6所的自動控制來進行。具體而言,是藉由主控制器6中建置的主順序程式7及從主順序程式7被叫出而執行的數個子程式來執行。 主控制器6中,作為從主順序程式7被叫出而執行之子程式,係建置著開口有無判定程式71、開口搜尋程式72、開口欠缺判定程式73、開口欠缺消弭程式74、標記隱蔽判定程式75、暫行校準程式76、標記欠缺判定程式77、標記欠缺消弭程式78、正式校準程式79。The calibration of the substrate S is carried out by the automatic control of the main controller 6 . Specifically, it is executed by the main sequence program 7 built in the main controller 6 and several subroutines called out from the main sequence program 7 to execute. In the main controller 6, as subroutines called out from the main sequence program 7 and executed, there are opening presence/absence determination program 71, opening search program 72, opening lack judgment program 73, opening lack elimination program 74, mark concealment determination Program 75 , provisional calibration program 76 , mark lack judgment program 77 , mark lack elimination program 78 , formal calibration program 79 .

最終進行校準的是正式校準程式79,但主順序程式7,於正式校準之前,會執行開口有無判定程式71來使其判定各校準用開口Sm是否被相機8拍攝到,若未被拍攝到,則執行開口搜尋程式72。開口搜尋程式72,對搬送系統3送出控制訊號,將基板S稍微倒退或饋送以使各校準用開口Sm落入各相機8的視野。The final calibration is the formal calibration program 79, but the main sequence program 7, before the formal calibration, will execute the opening presence or absence determination program 71 to make it judge whether each calibration opening Sm is photographed by the camera 8, if not photographed, Then the opening search program 72 is executed. The opening search program 72 sends a control signal to the conveyance system 3 to slightly reverse or feed the substrate S so that each calibration opening Sm falls into the field of view of each camera 8 .

此外,主順序程式7,執行開口欠缺判定程式73,使其判定是否有欠缺任一校準用開口Sm。若欠缺而被拍攝,則執行開口欠缺消弭程式74。開口欠缺消弭程式,藉由相機移動機構81使相機8移動來消弭欠缺。In addition, the main sequence program 7 executes the opening defect determination program 73 to determine whether any of the calibration openings Sm is missing. If it is lacking and is photographed, then execute the opening lack elimination program 74 . The opening defect elimination program uses the camera moving mechanism 81 to move the camera 8 to eliminate the defect.

此外,主順序程式7,執行標記隱蔽判定程式75,使其判定各第一第二光罩標記11、21是否隱蔽於基板S,若隱蔽,則執行暫行校準程式76。暫行校準程式76,以前次曝光時的校準完畢時的各光罩標記11、21的位置作為基準,算出使隱蔽消弭之移動量,將其送至光罩移動機構5而使各光罩1、2移動,藉此消弭隱蔽。In addition, the main sequence program 7 executes the mark concealment determination program 75 to determine whether each of the first and second mask marks 11 and 21 is concealed on the substrate S, and if concealed, executes the tentative calibration procedure 76 . The provisional calibration program 76 is based on the position of each mask mark 11, 21 when the calibration of the previous exposure is completed, and calculates the amount of movement to eliminate the concealment, and sends it to the mask moving mechanism 5 so that each mask 1, 21 2 Move, thereby eliminating concealment.

此外,主順序程式7,執行標記欠缺判定程式77來使其判定是否各光罩標記11、21欠缺而被拍攝。若欠缺而被拍攝,則執行標記欠缺消弭程式78。標記欠缺消弭程式78,算出用來使欠缺消弭之移動量,將其送至光罩移動機構5而使各光罩1、2移動,藉此使欠缺消弭。In addition, the main sequence program 7 executes the mark missing judgment program 77 to judge whether or not each mask mark 11, 21 is missing and photographed. If it is lacking and is photographed, the mark lacking elimination program 78 is executed. The marking defect elimination program 78 calculates the amount of movement for eliminating the defect, and sends it to the mask moving mechanism 5 to move the masks 1 and 2 to eliminate the defect.

依此方式,一旦各校準用開口Sm在沒有欠缺的狀態下被拍攝,各光罩標記11、21在沒有欠缺的狀態下位於各校準用開口Sm內,便成為可校準之狀態,主順序程式7會執行正式校準程式79。圖4為揭示有關正式校準程式79之平面概略圖。In this way, once each calibration opening Sm is photographed in a state without defects, and each mask mark 11, 21 is located in each calibration opening Sm in a state without defects, it becomes a state that can be calibrated, and the main sequence program 7 will execute the formal calibration routine 79. FIG. 4 is a schematic plan view showing the formal calibration procedure 79 .

正式校準程式79,首先於以光軸A上的點作為原點之座標系中,求出第一光罩標記11的中心與第二光罩標記21的中心。然後,判斷第一光罩標記11的中心和第二光罩標記21的中心是否在必要的精度下一致,若不一致,則對光罩移動機構5送出訊號以使光罩1、2的其中一方或雙方移動來使其一致。通常,於前次以前的曝光時會使兩者在必要的精度下一致,而該狀態會被保持。 確認了第一光罩標記11的中心和第二光罩標記21的中心在必要的精度下一致之後,正式校準程式79,求出該些中心的中間點。然後,正式校準程式79,求出基板S的校準用開口Sm的中心,求出和一對光罩標記11、21的中心的中間點之偏差,而算出用來使該偏差消弭之各光罩1、2的移動的方向與距離。The formal calibration program 79 first calculates the center of the first mask mark 11 and the center of the second mask mark 21 in the coordinate system with the point on the optical axis A as the origin. Then, it is judged whether the center of the first mask mark 11 and the center of the second mask mark 21 are consistent with the necessary accuracy, if not, a signal is sent to the mask moving mechanism 5 to make one of the mask 1, 2 Or both sides move to make it consistent. Usually, the previous exposure would bring the two together to the necessary precision, and that state would be maintained. After confirming that the center of the first mask mark 11 and the center of the second mask mark 21 coincide with the required precision, the program 79 is formally calibrated to find the middle point of these centers. Then, the formal calibration program 79 finds the center of the calibration opening Sm of the substrate S, finds the deviation from the middle point of the center of the pair of mask marks 11, 21, and calculates the mask used to eliminate the deviation. The direction and distance of the movement of 1 and 2.

校準程式,對於來自各相機8的拍攝資料進行上述這樣的資料處理,算出用來消弭偏差之各光罩1、2的移動的方向與距離。其後,針對從各拍攝資料獲得的移動的方向與距離求出平均,來作為最終的正式校準用的各光罩1、2的移動指令,將其回傳至主順序程式7。移動的方向與距離,是作為各者的向量(圖4中以箭頭表示)而被掌握,故針對各向量的方向係做合成,長度則取平均。The calibration program performs the above-mentioned data processing on the shooting data from each camera 8, and calculates the moving direction and distance of each mask 1, 2 to eliminate the deviation. Afterwards, the moving directions and distances obtained from each photographed data are averaged to serve as the movement commands of the masks 1 and 2 for the final main calibration, and are sent back to the main sequence program 7 . The direction and distance of movement are grasped as the vectors of each (shown by arrows in FIG. 4 ), so the direction of each vector is synthesized, and the length is averaged.

主順序程式7,將回傳值亦即移動指令送至光罩移動機構5,使一對光罩1、2一體地移動,使得各光罩標記11、21的中心在必要的精度下並排於一直線上。至此,正式校準結束。其後,主順序程式7,為了下一目標曝光區域R的曝光時之校準,會將正式校準完畢時間點下的各光罩標記11、21的中心的座標記憶至記憶部61。主順序程式7及各子程式71~79,是以進行上述這樣的動作之方式被編寫。The main sequence program 7 sends the return value, that is, the movement command, to the mask moving mechanism 5, so that the pair of masks 1, 2 are moved integrally, so that the centers of the mask marks 11, 21 are aligned at the required precision. Straight line. At this point, the formal calibration is over. Thereafter, the main sequence program 7 stores the coordinates of the centers of the mask marks 11 and 21 at the point in time when the official calibration is completed in the memory unit 61 for calibration during exposure of the next target exposure region R. The main sequence program 7 and the subroutines 71 to 79 are written to perform the above-mentioned operations.

接下來,針對上述構成之實施形態的兩面曝光裝置的全體的動作概略地說明之。 一對光罩1、2,於Z方向位於遠離基板S之待命位置。此位置,為進行光罩對的對於基板S之校準的XY平面所存在之位置。 控制訊號,會從正在執行主順序程式7之主控制器6被送至搬送系統3,以便將基板S饋送恰好饋送行程Lf的份量。如此一來,第一驅動滾筒35及第二驅動滾筒36會同步動作,基板S朝X方向前側(捲取側)被饋送恰好饋送行程Lf。Next, the overall operation of the double-side exposure apparatus according to the embodiment configured as described above will be schematically described. A pair of photomasks 1 and 2 are located at a standby position away from the substrate S in the Z direction. This position is a position where the XY plane for alignment of the mask pair with respect to the substrate S exists. A control signal is sent from the main controller 6 which is executing the main sequence program 7 to the conveying system 3, so as to feed the substrate S by just the amount of the feeding stroke Lf. In this way, the first driving roller 35 and the second driving roller 36 will act synchronously, and the substrate S will be fed toward the front side (winding side) in the X direction just at the feeding stroke Lf.

一旦饋送完畢的訊號從搬送系統3回傳至主控制器6,則主順序程式7進行上述一連串的校準動作。亦即,若校準用開口Sm不在各相機8的視野內則執行開口搜尋程式72,若任一校準用開口Sm欠缺則執行開口欠缺消弭程式74。此外,若有標記隱蔽則執行暫行校準程式76,若其中一個第一第二光罩標記11、21有欠缺則執行標記欠缺消弭程式78。其後,主順序程式7執行正式校準程式79。如此一來,校準便完畢。Once the signal that has been fed is returned from the conveying system 3 to the main controller 6, the main sequence program 7 performs the above-mentioned series of calibration operations. That is, if the calibration opening Sm is not within the field of view of each camera 8, the opening search program 72 is executed, and if any calibration opening Sm is missing, the opening lack elimination program 74 is executed. In addition, if there is a hidden mark, the temporary calibration program 76 is executed, and if one of the first and second mask marks 11 and 21 is defective, the mark-deficient elimination program 78 is executed. Thereafter, the main sequence program 7 executes the formal calibration program 79 . In this way, the calibration is complete.

其後,主順序程式7,對未圖示的Z方向移動機構送出控制訊號來使一對光罩1、2朝Z方向移動而使各光罩1、2緊貼於基板S。在此狀態下,主順序程式7取得來自各相機8的拍攝資料,判斷是否維持在被校準之狀態(各標記11、21,Sm的中心是否在必要的精度下一致)。若維持,則主順序程式7對各曝光單元4送出控制訊號,使其進行曝光。Thereafter, the main sequence program 7 sends a control signal to the Z-direction moving mechanism not shown to move the pair of masks 1 and 2 in the Z direction so that the respective masks 1 and 2 are brought into close contact with the substrate S. In this state, the main sequence program 7 obtains the shooting data from each camera 8, and judges whether to maintain the calibrated state (whether the centers of the marks 11, 21, Sm coincide with the necessary accuracy). If maintained, the main sequence program 7 sends a control signal to each exposure unit 4 to make it perform exposure.

於必要的曝光量用之規定時間的曝光之後,各曝光單元4停止光照射。其後,主順序程式7,對未圖示的Z方向移動機構送出控制訊號,使一對光罩1、2自基板S遠離,返回當初的待命位置。 一旦確認各光罩1、2返回了待命位置,則主順序程式7對搬送系統3送出控制訊號,使基板S朝X方向前側被饋送恰好饋送行程Lf的份量。其後,為和上述相同的動作,於基板S的饋送行程Lf之間歇饋送的休止時重覆做完校準後進行曝光之動作。After exposure for a predetermined time with a necessary exposure amount, each exposure unit 4 stops light irradiation. Thereafter, the main sequence program 7 sends a control signal to the Z-direction moving mechanism not shown, so that the pair of masks 1 and 2 are separated from the substrate S and return to the original standby position. Once it is confirmed that each photomask 1, 2 has returned to the standby position, the main sequence program 7 sends a control signal to the conveying system 3, so that the substrate S is fed toward the front side in the X direction by just the portion of the feeding stroke Lf. Thereafter, for the same operation as above, the operation of performing calibration and exposure is repeated during the pause of the intermittent feeding during the feeding stroke Lf of the substrate S.

當重覆動作時,若送出側緩衝區301的基板S的鬆弛量變少則送出側芯滾筒31及送出側夾送滾筒32會同步動作,將基板S送出至送出側緩衝區301。此外,若捲取側緩衝區302的基板S的鬆弛量變多,則捲取側芯滾筒33及捲取側夾送滾筒34會同步動作,將基板S捲取至捲取側芯滾筒33。When the operation is repeated, if the slack of the substrate S in the delivery-side buffer zone 301 decreases, the delivery-side core roller 31 and the delivery-side pinch roller 32 will operate synchronously to send the substrate S to the delivery-side buffer zone 301 . In addition, when the slack of the substrate S in the winding-side buffer zone 302 increases, the winding-side core roller 33 and the winding-side pinch roller 34 operate synchronously to wind the substrate S onto the winding-side core roller 33 .

重覆了這樣的動作後,當進行相異品種的製品用之曝光的情形下,必須做光罩1、2之交換。在此交換作業亦有很大的特徵點,故以下詳述之。 如前述般,於光罩1、2交換時,將處理到長度方向的途中之基板S暫且捲取,交換後再之拉出而造出原本的狀態非常地麻煩,故實施形態之裝置,基板S會維持不動而交換光罩1、2。亦即,將第一光罩1從第一光罩平台10拆卸,將別的第一光罩1安裝至第一光罩平台10。此外,將第二光罩2從第二光罩平台20拆卸,將別的第二光罩2安裝至第二光罩平台20。After repeating such operations, it is necessary to exchange masks 1 and 2 when exposing products of different types. The exchange operation here also has great features, so it will be described in detail below. As mentioned above, when the photomasks 1 and 2 are exchanged, it is very troublesome to temporarily wind up the substrate S that is processed in the middle of the longitudinal direction, and then pull it out after the exchange to restore the original state. Therefore, in the device of the embodiment, the substrate S S will remain still and exchange masks 1 and 2. That is, the first photomask 1 is detached from the first photomask stage 10 , and another first photomask 1 is mounted on the first photomask stage 10 . In addition, the second photomask 2 is detached from the second photomask stage 20 , and another second photomask 2 is mounted on the second photomask stage 20 .

其後,重新進行光罩1、2彼此之校準。這是因為光罩1、2之交換時,會有光罩平台10、20些微地錯位,或光罩1、2的安裝位置些微地錯位之情形的緣故。此外,因品種相異,也會有光罩1、2的尺寸或輔助光罩標記12、22的形狀相異之情形下,而必須重新校準。Thereafter, re-align the reticles 1 and 2 with each other. This is because when the photomasks 1 and 2 are exchanged, the photomask stages 10 and 20 may be slightly misaligned, or the mounting positions of the photomasks 1 and 2 may be slightly misaligned. In addition, depending on the type, the size of the reticle 1 and 2 or the shape of the auxiliary reticle marks 12 and 22 may be different, and recalibration is necessary.

此時,實施形態之光罩對,在第一第二光罩標記11、21之外還具有輔助校準標記12、22,故會利用它。亦即,如圖3(1)所示,藉由相機移動機構81使兼用相機8位於光罩校準位置。然後,一面以各兼用相機8拍攝各輔助校準標記12、22,一面將該圖像顯示於顯示器61,作業者一面看著顯示器61一面操作光罩移動機構5來進行光罩1、2彼此之校準。 一旦光罩1、2之校準完畢,藉由該些光罩1、2之曝光的準備便完畢,故其後重覆上述的動作。At this time, the mask pair of the embodiment has the auxiliary alignment marks 12, 22 in addition to the first and second mask marks 11, 21, so it is used. That is, as shown in FIG. 3(1), the dual-use camera 8 is positioned at the mask calibration position by the camera moving mechanism 81 . Then, each auxiliary alignment mark 12, 22 is photographed by each dual-purpose camera 8, and the image is displayed on the display 61, and the operator operates the reticle moving mechanism 5 while looking at the display 61 to perform mutual reticle 1, 2. calibration. Once the alignment of the photomasks 1 and 2 is completed, preparations for exposure through the photomasks 1 and 2 are completed, so the above-mentioned operations are repeated thereafter.

像這樣,按照實施形態之光罩交換方法,是維持將基板S配置於曝光作業位置而交換光罩1、2,維持將基板S配置於曝光作業位置而進行交換後的光罩1、2彼此之校準。因此,不會有導致裝置的運轉長時間停止之問題。 此外,實施形態之光罩對,具有輔助光罩標記12、22,第一輔助光罩標記12與第二輔助光罩標記22的在基板寬幅方向之相隔距離係超過基板S的寬幅Sw,故能夠在遠離基板S之位置以相機8拍攝兩側的各輔助光罩標記12、22,如此一來便能做光罩1、2彼此之校準。因此,於光罩1、2彼此之校準完畢後不需要將光罩1、2送返原本的位置這樣的移動動作,可極為簡便地在短時間進行光罩1、2彼此之校準。In this way, according to the mask exchange method of the embodiment, the masks 1 and 2 are exchanged while maintaining the substrate S at the exposure work position, and the masks 1 and 2 are exchanged while maintaining the substrate S at the exposure work position. the calibration. Therefore, there is no problem of stopping the operation of the device for a long time. In addition, the mask pair of the embodiment has auxiliary mask marks 12, 22, and the distance between the first auxiliary mask mark 12 and the second auxiliary mask mark 22 in the width direction of the substrate exceeds the width Sw of the substrate S. Therefore, the camera 8 can be used to photograph the auxiliary mask marks 12 and 22 on both sides at a position far away from the substrate S, so that the reticles 1 and 2 can be calibrated. Therefore, there is no need to move the masks 1 and 2 to their original positions after the alignment of the masks 1 and 2 is completed, and the alignment of the masks 1 and 2 can be performed very simply and in a short time.

上述實施形態之兩面曝光裝置,是構成為於光罩1、2彼此之校準時,藉由相機移動機構81使兼用相機8移動至光罩校準位置,但亦可在光罩校準位置配置專用的相機。相機的台數增加,故就這一點成本會增加,但會有相機移動機構81的構成簡化之優點、及節省使兼用相機8移動的時間之優點。 另,上述實施形態中,光罩1、2交換時的光罩1、2彼此之校準雖為手動作業,但在每當間歇饋送便反覆之曝光之前的校準動作中也會有進行光罩1、2彼此之校準的情形,此則為主控制器6所做的自動控制。此外,雖說明了光罩交換時的光罩1、2彼此之校準為手動作業,但亦可藉由主控制器6所做的自動控制來進行它。The double-sided exposure apparatus of the above-mentioned embodiment is configured to move the dual-purpose camera 8 to the mask alignment position by the camera moving mechanism 81 when the masks 1 and 2 are aligned with each other. camera. Since the number of cameras increases, the cost increases, but there are advantages of simplifying the configuration of the camera moving mechanism 81 and saving time for moving the dual-use camera 8 . In addition, in the above-mentioned embodiment, although the alignment of the reticle 1 and 2 when the reticle 1 and 2 are exchanged is a manual operation, the reticle 1 is also performed in the alignment operation before exposure that is repeated every time the intermittent feeding is performed. , 2 In the case of mutual calibration, this is the automatic control made by the main controller 6. In addition, although the alignment between the reticle 1 and 2 at the time of reticle exchange was described as a manual operation, it may be performed by automatic control by the main controller 6 .

另,上述實施形態中,搬送系統3是以捲對捲來搬送基板S之物,但亦可採用僅送出側為料捲式之構成。亦即,亦可在將曝光後的基板S於規定的位置切斷而進行其後的處理之製程中採用本案發明之兩面曝光裝置。 另,作為搬送系統3,亦有基板S的饋送方向為上下方向之情形。在此情形下,會在垂直的姿勢的基板S的兩面通過光罩進行曝光,曝光單元4會被配置於左右。In addition, in the above-mentioned embodiment, the conveyance system 3 conveys the object of the board|substrate S roll-to-roll, but it is also possible to adopt the structure which only the delivery side is a roll type. That is, the double-side exposure apparatus of the present invention can also be used in the process of cutting the exposed substrate S at a predetermined position and performing subsequent processing. In addition, as the conveyance system 3, the feeding direction of the board|substrate S may also be a vertical direction. In this case, both surfaces of the board|substrate S of a vertical posture are exposed through a photomask, and the exposure unit 4 is arrange|positioned on the left and right.

此外,上述實施形態中,基板S的校準標記為校準用開口Sm,但未必必須為開口。亦可於基板S中在目標曝光區域R的外側有透明的區域,而在該區域形成例如圓周狀的標記來作為校準標記。此外,亦可形成從基板S的邊緣切除之形狀來作為校準標記。另,作為基板S的校準標記的形狀,亦可為方形或三角形等其他形狀。In addition, in the said embodiment, although the alignment mark of the board|substrate S is the opening Sm for alignment, it does not necessarily have to be an opening. In the substrate S, there may be a transparent region outside the target exposure region R, and a circumferential mark may be formed in this region as an alignment mark, for example. In addition, a shape cut from the edge of the substrate S may also be formed as an alignment mark. In addition, as the shape of the alignment mark of the board|substrate S, other shapes, such as a square or a triangle, may be sufficient.

針對第一光罩標記11、第二光罩標記21,有時亦會採用圓周狀或圓形以外的形狀。例如,亦可一方為圓形而另一方為十字狀。另,亦有在第一光罩標記11進入至第二光罩標記21的內側之狀態下做校準之情形。這一點,針對第一輔助光罩標記12、第二輔助光罩標記22亦同。 另,亦有二個第一光罩標記11的基板寬幅方向的相隔距離或二個第二光罩標記21的相隔距離,和基板S的寬幅Sw一致之情形。例如,當基板S的校準標記設於基板S的兩側緣,或為設置在兩側緣之缺口的情形下,則會有二個第一光罩標記11的基板寬幅方向的相隔距離和基板S的寬幅,二個第二光罩標記21的基板寬幅方向的相隔距離和基板S的寬幅一致之情形。For the first mask mark 11 and the second mask mark 21 , a shape other than a circumferential shape or a circle may also be employed. For example, one side may be circular and the other side may be cross-shaped. In addition, there are cases where calibration is performed in a state where the first mask mark 11 enters the inside of the second mask mark 21 . This point also applies to the first auxiliary mask mark 12 and the second auxiliary mask mark 22 . In addition, the distance between the two first mask marks 11 in the substrate width direction or the distance between the two second mask marks 21 may coincide with the width Sw of the substrate S. For example, when the alignment marks of the substrate S are arranged on both sides of the substrate S, or in the case of gaps arranged on the two sides, there will be a distance between the two first mask marks 11 in the width direction of the substrate and The width of the substrate S and the distance between the two second mask marks 21 in the width direction of the substrate are consistent with the width of the substrate S.

又,相對於相機8而言比基板S還靠近之側的光罩標記(上述例子中為第一光罩標記11)不會被基板S遮擋,故亦可比校準用開口Sm還大。但,當基板S與光罩之對比度小的情形下會有圖像資料的處理變得困難之問題。若為在一對光罩標記11、21位於校準用開口Sm內之狀態下做校準之構成,則基板S與光罩標記11、21之對比度便不會成為問題,就這點而言較佳。Also, since the mask mark (in the above example, the first mask mark 11 ) closer to the substrate S with respect to the camera 8 is not blocked by the substrate S, it may be larger than the alignment opening Sm. However, when the contrast between the substrate S and the photomask is small, there is a problem that processing of image data becomes difficult. If the alignment is performed with the pair of mask marks 11, 21 located in the alignment opening Sm, the contrast between the substrate S and the mask marks 11, 21 will not become a problem, which is preferable. .

另,上述實施形態中,一個光罩1、2中的輔助光罩標記12、22的數量雖為2個,但亦可為3個或其以上,1個的情形亦有可能。例如,若為光罩平台10,20能夠將光罩1、2在繞Z方向之軸沒有偏差之狀態下予以保持之構造,則在各光罩1、2只要以各1個校準標記做對位即足夠,這樣的構成亦可能被採用。 此外,光罩交換方法之實施形態的說明中,雖說明了交換雙方的光罩1、2,但亦有僅交換一方的光罩1、2之情形。在此情形下,交換後的光罩1、2彼此之校準亦為必要,而具有上述輔助光罩標記12、22之構成,對於校準的簡化有所貢獻。In addition, in the above-mentioned embodiment, although the number of auxiliary mask marks 12, 22 in one mask 1, 2 is two, it may be three or more, and one case is also possible. For example, if the photomask stages 10 and 20 are capable of holding the photomasks 1 and 2 without deviation around the axis in the Z direction, only one calibration mark is required for each photomask 1 and 2. One bit is enough, and such a configuration may also be adopted. In addition, in the description of the embodiment of the mask exchange method, although both the masks 1 and 2 were exchanged, there may be a case where only one of the masks 1 and 2 is exchanged. In this case, it is also necessary to align the reticles 1 and 2 after exchange, and the configuration having the above-mentioned auxiliary mask marks 12 and 22 contributes to the simplification of alignment.

上述實施形態之裝置,雖是以接觸方式進行曝光之物,但上述校準的構成即使為近接(proximity)方式或投影方式之曝光仍會同樣地發揮效果,故該些方式亦可能被採用。 另,近接方式或投影曝光方式的情形下,不需要使一對光罩緊貼於基板,故亦有不設置使光罩朝Z方向移動之機構的情形。Although the device of the above-mentioned embodiment is exposed by a contact method, the effect of the above-mentioned alignment configuration is similarly exerted even by a proximity method or a projection method, so these methods may also be used. In addition, in the case of the proximity method or the projection exposure method, it is not necessary to bring a pair of masks into close contact with the substrate, so there may be no mechanism for moving the mask in the Z direction.

1‧‧‧第一光罩 11‧‧‧第一光罩標記 12‧‧‧第一輔助光罩標記 2‧‧‧第二光罩 21‧‧‧第二光罩標記 22‧‧‧第二輔助光罩標記 3‧‧‧搬送系統 4‧‧‧曝光單元 41‧‧‧光源 42‧‧‧光學系統 5‧‧‧光罩移動機構 6‧‧‧主控制器 61‧‧‧記憶部 7‧‧‧主順序程式 71‧‧‧開口有無判定程式 72‧‧‧開口搜尋程式 73‧‧‧開口欠缺判定程式 74‧‧‧開口欠缺消弭程式 75‧‧‧標記隱蔽判定程式 76‧‧‧暫行校準程式 77‧‧‧標記欠缺判定程式 78‧‧‧標記欠缺消弭程式 79‧‧‧正式校準程式 8‧‧‧相機 81‧‧‧相機移動機構 S‧‧‧基板 Sm‧‧‧校準用開口1‧‧‧The first mask 11‧‧‧First mask mark 12‧‧‧The first auxiliary mask mark 2‧‧‧Second mask 21‧‧‧Second Mask Marking 22‧‧‧Second Auxiliary Mask Marking 3‧‧‧Transportation system 4‧‧‧Exposure unit 41‧‧‧Light source 42‧‧‧Optical system 5‧‧‧Reticle moving mechanism 6‧‧‧Main controller 61‧‧‧memory department 7‧‧‧Main sequence program 71‧‧‧Determination program for presence or absence of opening 72‧‧‧Open search program 73‧‧‧Determination program for lack of opening 74‧‧‧Mouth gap elimination program 75‧‧‧Mark Concealment Judgment Program 76‧‧‧Temporary Calibration Program 77‧‧‧Determination program for mark deficiency 78‧‧‧Mark deficiency elimination program 79‧‧‧Formal calibration procedure 8‧‧‧Camera 81‧‧‧Camera moving mechanism S‧‧‧substrate Sm‧‧‧calibration opening

[圖1]實施形態之光罩對的立體概略圖。 [圖2]實施形態之兩面曝光裝置的正面截面概略圖。 [圖3]揭示有關實施形態之兩面曝光裝置中的校準之立體概略圖。 [圖4]揭示有關正式校準程式之平面概略圖。[ Fig. 1 ] A perspective schematic view of a mask pair according to the embodiment. [ Fig. 2 ] A schematic front cross-sectional view of a double-side exposure device according to the embodiment. [ Fig. 3 ] A schematic perspective view showing alignment in a double-side exposure device according to the embodiment. [Fig. 4] A schematic plan view revealing the formal calibration procedure.

1‧‧‧第一光罩 1‧‧‧The first mask

2‧‧‧第二光罩 2‧‧‧Second mask

8‧‧‧相機 8‧‧‧Camera

11‧‧‧第一光罩標記 11‧‧‧First mask mark

12‧‧‧第一輔助光罩標記 12‧‧‧The first auxiliary mask mark

21‧‧‧第二光罩標記 21‧‧‧Second Mask Marking

22‧‧‧第二輔助光罩標記 22‧‧‧Second Auxiliary Mask Marking

A‧‧‧光軸 A‧‧‧optical axis

S‧‧‧基板 S‧‧‧substrate

R‧‧‧目標曝光區域 R‧‧‧Target exposure area

Lf‧‧‧饋送行程 Lf‧‧‧Feed Itinerary

Sm‧‧‧校準用開口 Sm‧‧‧calibration opening

Sw‧‧‧基板S的寬幅 Sw‧‧‧Substrate S width

Claims (4)

一種光罩對,係由搭載於將基板的兩面曝光之兩面曝光裝置的第一光罩與第二光罩所組成之光罩對,其特徵為,前述第一光罩,具有為了做對於前述基板之校準而設置之2個第一光罩標記、及為了做對於前述第二光罩之校準而設置之2個第一輔助光罩標記,前述第二光罩,具有為了做對於前述基板之校準而設置之2個第二光罩標記、及為了做對於前述第一光罩之校準而設置之2個第二輔助光罩標記,2個前述第一光罩標記在前述基板的寬幅方向的相隔距離為前述基板的寬幅以下,並且2個前述第二光罩標記之在前述基板的寬幅方向的相隔距離為前述基板的寬幅以下,2個前述第一輔助光罩標記在前述基板的寬幅方向的相隔距離超過前述基板的寬幅,並且2個前述第二輔助光罩標記之在前述基板的寬幅方向的相隔距離超過前述基板的寬幅,2個前述第一輔助光罩標記與2個前述第一光罩標記在同一直線上並排,該同一直線的方向於搭載於前述兩面曝光裝置時為和前述基板的寬幅方向一致之方向,2個前述第二輔助光罩標記與2個前述第二光罩標記在同一直線上並排,該同一直線的方向於搭載於前述兩面曝 光裝置時為和前述基板的寬幅方向一致之方向。 A pair of photomasks is a pair of photomasks composed of a first photomask and a second photomask mounted on a double-side exposure device that exposes both sides of a substrate. It is characterized in that the aforementioned first photomask has a 2 first mask marks provided for calibration of the substrate, and 2 first auxiliary mask marks provided for calibration of the aforementioned second mask. 2 second mask marks for calibration, and 2 second auxiliary mask marks for calibration of the first mask, the 2 first mask marks in the width direction of the substrate and the distance between the two aforementioned second mask marks in the width direction of the aforementioned substrate is less than or equal to the width of the aforementioned substrate, and the two aforementioned first auxiliary mask marks are placed between the aforementioned The distance in the width direction of the substrate exceeds the width of the substrate, and the distance between the two second auxiliary mask marks in the width direction of the substrate exceeds the width of the substrate, and the two first auxiliary lights The mask mark and the two first mask marks are aligned on the same straight line, and the direction of the same straight line is the same direction as the width direction of the substrate when mounted on the double-sided exposure device, and the two second auxiliary masks are The mark and the two aforementioned second mask marks are arranged side by side on the same straight line, and the direction of the same straight line is the same as that carried on the aforementioned two-sided exposure In the case of an optical device, the direction coincides with the width direction of the aforementioned substrate. 一種兩面曝光裝置,其特徵為,具備:將被捲成料捲之撓性的基板拉出而予以間歇性地饋送之搬送系統;及被配置於包夾被饋送的前述基板的位置之如申請專利範圍第1項所述之光罩對;及於前述搬送系統使前述基板停止而進行了校準之後,各自通過前述第一第二光罩對前述基板照射光而將前述基板的兩面曝光之曝光單元;前述基板,具有對於應曝光的區域而言以規定的位置關係設置之2個校準標記,設有:相機,可拍攝各前述第一光罩標記、各前述第二光罩標記及前述基板的各前述校準標記;及相機移動機構,使前述相機移動;及校準手段,藉由來自拍攝了各前述第一光罩標記、各前述第二光罩標記及前述基板的各前述校準標記之前述相機的拍攝資料,將前述第一第二光罩對於前述基板的應曝光的區域而言做對位;前述相機移動機構,為能夠在為了將前述第一第二光罩對於前述基板而言做校準而拍攝各前述第一光罩標記及各前述第二光罩標記之基板校準位置,和為了將前述第一第二光罩彼此做校準而拍攝各前述第一輔助光罩標記及各前述第二輔助光罩標記之光罩校準位置之間,使前述相機移動之機構。 A double-side exposure device characterized by comprising: a conveying system that pulls out a flexible substrate rolled into a roll and intermittently feeds it; The pair of photomasks described in claim 1 of the scope of patents; and after the transfer system stops the aforementioned substrate and performs alignment, each of the first and second photomasks irradiates the aforementioned substrate with light to expose both sides of the aforementioned substrate Unit; the substrate having two calibration marks arranged in a predetermined positional relationship with respect to the area to be exposed, and a camera capable of photographing each of the aforementioned first mask marks, each of the aforementioned second mask marks, and the aforementioned substrate each of the aforementioned calibration marks; and a camera moving mechanism that moves the aforementioned camera; For the shooting data of the camera, align the aforementioned first and second photomasks with respect to the area to be exposed on the aforementioned substrate; Calibrate and photograph the substrate alignment positions of each of the aforementioned first reticle marks and each of the aforementioned second reticle marks, and photograph each of the aforementioned first auxiliary reticle marks and each of the aforementioned first reticle marks in order to align the aforementioned first and second reticles with each other 2. A mechanism for moving the aforementioned camera between the mask alignment positions of the auxiliary mask marks. 一種兩面曝光裝置,其特徵為,具備:將被捲成料捲之撓性的基板拉出而予以間歇性地饋送之搬送系統;及被配置於包夾被饋送的前述基板的位置之如申請專利範圍第1項所述之光罩對;及於前述搬送系統使前述基板停止而進行了校準之後,各自通過前述第一第二光罩對前述基板照射光而將前述基板的兩面曝光之曝光單元;前述基板,具有對於應曝光的區域而言以規定的位置關係設置之2個校準標記,設有:相機,可拍攝各前述第一光罩標記、各前述第二光罩標記及前述基板的各前述校準標記;及校準手段,藉由來自拍攝了各前述第一光罩標記、各前述第二光罩標記及前述基板的各前述校準標記之前述相機的拍攝資料,將前述第一第二光罩對於前述基板的應曝光的區域而言做對位;前述相機,配置於為了將前述第一第二光罩對於前述基板而言做校準而拍攝各前述第一光罩標記及各前述第二光罩標記之基板校準位置,並且設有不同於前述相機之別的相機,前述別的相機,配置於為了將前述第一第二光罩彼此做校準而拍攝各前述第一輔助光罩標記及各前述第二輔助光罩標記之光罩校準位置。 A double-side exposure device characterized by comprising: a conveying system that pulls out a flexible substrate rolled into a roll and intermittently feeds it; The pair of photomasks described in claim 1 of the scope of patents; and after the transfer system stops the aforementioned substrate and performs alignment, each of the first and second photomasks irradiates the aforementioned substrate with light to expose both sides of the aforementioned substrate Unit; the substrate having two calibration marks arranged in a predetermined positional relationship with respect to the area to be exposed, and a camera capable of photographing each of the aforementioned first mask marks, each of the aforementioned second mask marks, and the aforementioned substrate each of the aforementioned calibration marks; and the calibration means, by taking the photographed data from the aforementioned camera of each of the aforementioned first mask marks, each of the aforementioned second mask marks, and each of the aforementioned calibration marks of the aforementioned substrate, the aforementioned first, second The two photomasks are aligned for the area to be exposed on the aforementioned substrate; the aforementioned camera is configured to photograph each of the aforementioned first photomask marks and each of the aforementioned photomasks in order to align the aforementioned first and second photomasks with respect to the aforementioned substrate. The substrate alignment position of the second reticle mark, and a camera different from the aforementioned camera is provided, and the aforementioned other camera is configured to photograph each of the aforementioned first auxiliary reticles in order to align the aforementioned first and second reticles with each other The reticle alignment position of the mark and each of the aforementioned second auxiliary reticle marks. 一種光罩交換方法,係在將被捲成料捲之撓性的基板拉出而予以間歇性地饋送,而將被饋送的前述基板的兩面在曝光作業位置予以曝光之兩面曝光裝置中,於曝光作業位置將包夾前述基板而配置之一對第一第二光罩予以交換之光罩交換方法,其特徵為,具有:將前述基板留在前述曝光作業位置而交換前述第一第二光罩的至少一方的光罩之交換步驟;及於前述交換步驟之後,將前述基板留在前述曝光作業位置而將前述第一第二光罩相互做對位之光罩校準步驟;前述第一光罩,具有為了做對於前述基板之校準而設置之2個第一光罩標記、及為了做對於前述第二光罩之校準而設置之2個第一輔助光罩標記,前述第二光罩,具有為了做對於前述基板之校準而設置之2個第二光罩標記、及為了做對於前述第一光罩之校準而設置之2個第二輔助光罩標記,2個前述第一光罩標記在前述基板的寬幅方向的相隔距離為前述基板的寬幅以下,並且2個前述第二光罩標記之在前述基板的寬幅方向的相隔距離為前述基板的寬幅以下,2個前述第一輔助光罩標記在前述基板的寬幅方向的相隔距離超過前述基板的寬幅,並且2個前述第二輔助光罩標記之在前述基板的寬幅方向的相隔距離超過前述基板的寬幅,前述光罩校準步驟中,在遠離前述基板之位置將各前 述第一輔助光罩標記與各前述第二輔助光罩標記重疊,藉此將前述第一第二光罩做相互對位。 A method for exchanging a photomask, in a double-sided exposure device that pulls out a flexible substrate rolled into a roll and feeds it intermittently, and exposes both sides of the fed substrate at an exposure work position, The method of exchanging the first and second photomasks in which the exposure operation position is arranged so as to sandwich the aforementioned substrate is characterized in that the first and second photomasks are exchanged while the aforementioned substrate is left in the aforementioned exposure operation position. The step of exchanging the photomask of at least one side of the mask; and after the aforementioned exchanging step, the step of aligning the aforementioned first and second photomasks by leaving the aforementioned substrate at the aforementioned exposure operation position; the aforementioned first photomask A mask having two first mask marks for alignment of the substrate and two first auxiliary mask marks for alignment of the second mask, the second mask, There are 2 second mask marks set for calibration of the aforementioned substrate, 2 second auxiliary mask marks set for calibration of the aforementioned first mask, and 2 aforementioned first mask marks The distance apart in the width direction of the substrate is not more than the width of the substrate, and the distance between the two second mask marks in the width direction of the substrate is not more than the width of the substrate, and the two second mask marks The distance between one auxiliary mask mark in the width direction of the substrate exceeds the width of the substrate, and the distance between the two second auxiliary mask marks in the width direction of the substrate exceeds the width of the substrate, In the aforementioned photomask alignment step, each front The first auxiliary mask marks overlap with each of the second auxiliary mask marks, thereby aligning the first and second masks.
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