TWI784565B - Server deivce - Google Patents

Abstract

A server device includes a bottom case, an electronic component, a cover and a heat dissipation device. The electronic component includes a circuit board and a heat source. The circuit board is arranged on the bottom case. The heat source is arranged on the circuit board. The cover is detachably covered on the bottom case. The heat sink includes an air-cooled heat exchanger and a liquid-cooled heat exchanger. The air-cooled heat exchanger is fixed and thermally coupled to the heat source. The liquid-cooled heat exchanger is fixed to the cover and thermally coupled to the air-cooled heat exchanger.

Description

servo device

The invention relates to a servo device, in particular to a servo device combined with liquid cooling and air cooling.

At present, servers are widely used by various enterprises. The scope of its development combines the application of the Internet and the telecommunications industry, and also penetrates into the lives of ordinary people, such as finance, finance, online banking, the use of online credit cards, artificial intelligence, etc. , all of these must rely on the powerful computing power of the server to do so. Taking artificial intelligence as an example, because artificial intelligence technology requires a larger amount of computing processing, it needs to be equipped with a large number of high-performance processors. However, the high-performance processor will also bring a lot of waste heat. If the waste heat cannot be discharged from the server immediately, the accumulated waste heat may reduce the computing performance of the high-performance graphics card, or even cause thermal shock.

The current practice is to add an open water cooling system inside the server to move the heat energy generated by the high-performance processor to the outside of the server through water cooling. However, the piping design of the current open water cooling system inside the server is complicated and needs to be interleaved between the memory and the CPU. However, because of the narrow gap, the difficulty of waterway design and installation increases.

The present invention provides a servo device, which simplifies the design complexity of the piping inside the server of the open water cooling system and improves the heat dissipation performance of the open water cooling system.

A servo device disclosed in an embodiment of the present invention includes a bottom case, an electronic component, a cover and a heat dissipation device. The electronic component includes a circuit board and a heat source. The circuit board is arranged on the bottom case. The heat source is arranged on the circuit board. The cover body is detachably covered on the bottom case. The cooling device includes an air-cooled heat exchanger and a liquid-cooled heat exchanger. An air-cooled heat exchanger is fixed and thermally coupled to a heat source. The liquid-cooled heat exchanger is fixed on the cover and thermally coupled to the air-cooled heat exchanger.

According to the servo device of the above-mentioned embodiment, the liquid-cooled heat exchanger is fixed on the cover, so that the flow pipes connected to the liquid-cooled heat exchanger can be fixed on the cover together, thereby avoiding occupying the space for electronic components on the circuit board.

The above description of the content of the present invention and the following description of the implementation are used to demonstrate and explain the principle of the present invention, and provide further explanation of the patent application scope of the present invention.

10: Servo device

100: Bottom shell

110: Bottom plate

120: side panel

200: Electronic components

210: circuit board

220: heat source

230: Expansion components

300: cover body

400: cooling device

410: Air Cooled Heat Exchanger

411: base

412: fin part

420: Liquid Cooled Heat Exchanger

430: flow tube

440: heat conduction parts

441: thermal contact section

442: Assembly section

450: Flexible thermal pad

500: air flow generator

N: normal direction

A, T: Direction

F: cooling airflow

FIG. 1 is a schematic perspective view of a servo device according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged schematic diagram of removing the cover from the servo device in FIG. 1 .

FIG. 3 is an exploded schematic diagram of FIG. 2 .

FIG. 4 is a schematic perspective view of the cover in FIG. 1 .

FIG. 5 is a schematic diagram of the action of the cover of the servo device in FIG. 1 .

FIG. 6 is a schematic cross-sectional view of the servo device in FIG. 1 .

See Figures 1 through 4. FIG. 1 is a perspective view of a servo device 10 according to a first embodiment of the present invention. FIG. 2 is a partially enlarged schematic view of the servo device 10 in FIG. 1 with the cover 300 removed. FIG. 3 is an exploded schematic diagram of FIG. 2 . FIG. 4 is a schematic perspective view of the cover 300 in FIG. 1 .

The server device 10 of this embodiment is, for example, a server. The servo device 10 includes a bottom case 100 , an electronic component 200 , a cover 300 and a heat dissipation device 400 .

The bottom case 100 includes a bottom plate 110 and two side plates 120 . The bottom plate 110 has a bearing surface. The two side plates 120 are respectively connected to opposite sides of the bottom plate 110 and extend toward the normal direction N of the bearing surface of the bottom plate 110 .

The electronic component 200 includes a circuit board 210 and two heat sources 220 . The circuit board 210 is disposed on the bottom case 100 , and the second heat source 220 is, for example, a CPU, and is disposed on the circuit board 210 .

In this embodiment, the electronic component 200 may further include a plurality of expansion components 230 . The expansion components 230 are, for example, interface card sets, and the expansion components 230 are separated to maintain gaps.

The cover body 300 is detachably covered on the two side panels 120 of the bottom case 100 , and the loading and unloading direction of the cover body 300 is parallel to the normal direction N of the bearing surface of the bottom panel 110 . That is to say, the servo device 10 of this embodiment belongs to the type in which the cover body 300 vertically covers the bottom case 100 .

The heat dissipation device 400 includes two air-cooled heat exchangers 410 and two liquid-cooled heat exchangers 420 . The two air-cooled heat exchangers 410 are fixed and thermally coupled to the two heat sources 220 respectively. detailed Specifically, each air-cooled heat exchanger 410 includes a base portion 411 and a plurality of fin portions 412 . The base 411 is fixed on the circuit board 210 through, for example, locking wires or buckle elements, and is in thermal contact with the heat source 220 . The fins 412 protrude from a side of the base 411 away from the heat source 220 .

The two liquid-cooled heat exchangers 420 are fixed on the cover 300 and thermally coupled to the two air-cooled heat exchangers 410 respectively. In detail, the heat dissipation device 400 further includes two heat conducting elements 440 and two flexible heat conducting pads 450 . Each heat conducting element 440 includes a thermal contact section 441 and two assembly sections 442 . The thermal contact section 441 is stacked on the fins 412 of the air-cooled heat exchanger 410 . The two assembly sections 442 are respectively connected to opposite sides of the thermal contact section 441 and fixed to the base 411 of the air-cooled heat exchanger 410 . The thermal contact section 441 and the second assembly section 442 surround the fins 412 . The flexible heat conduction pad 450 is stacked on the liquid-cooled heat exchanger 420 , and the air-cooled heat exchanger 410 is thermally coupled to the liquid-cooled heat exchanger 420 through the heat conduction element 440 and the flexible heat conduction pad 450 .

In this embodiment, the heat dissipation device 400 may further include a plurality of flow pipes 430 . These flow tubes 430 are integrally connected to the liquid-cooled heat exchanger 420, and the flow tubes 430 extend from the gap between the two expansion components 230 to the outside of the bottom case 100, so that the lock between the integrated flow tubes 430 and the external water tubes The attached part is located outside the bottom case 100, so the electronic component 200 is not easy to be short-circuited when the locked part leaks water. In addition, the flow tube 430 is accommodated in the gap between the two expansion components 230 , which is less likely to interfere with the wires of the expansion components 230 , making the design of the cable arrangement easier.

In this embodiment, the flow tube 430 is fixed on the cover body 300 , and besides being able to move together with the cover body 300 , it does not occupy the space of the circuit board 210 for disposing electronic components. However, the fixed position of the flow tube 430 is not intended to limit the present invention. In other embodiments, the flow tube can also be fixed on the bottom case.

In this embodiment, the servo device 10 can also include a plurality of airflow generators 500, and the airflow generators 500 are used to generate a cooling airflow to blow to the air-cooled heat exchanger 410, so as to improve the air-cooled heat exchanger 410 and the servo. The heat exchange efficiency of the air inside the device 10.

In this embodiment, the number of the heat source 220 , the air-cooled heat exchanger 410 , the liquid-cooled heat exchanger 420 , the heat conduction element 440 and the flexible heat conduction pad 450 is two, but it is not limited thereto. In other embodiments, the number of the heat source, the air-cooled heat exchanger, the liquid-cooled heat exchanger, the heat conduction element and the flexible heat conduction pad can also be changed to a single one.

In this embodiment, there are multiple airflow generators 500 , but it is not limited thereto. In other embodiments, the number of airflow generators can also be changed to a single one.

Please refer to Figure 5 and Figure 6. FIG. 5 is a schematic diagram of the operation of the cover 300 of the servo device 10 in FIG. 1 . FIG. 6 is a schematic cross-sectional view of the servo device 10 in FIG. 1 .

Since the loading and unloading direction of the cover 300 is parallel to the normal direction N of the bearing surface of the bottom plate 110, when the user assembles the internal components of the servo device 10 and starts to operate the servo device 10, the cover 300 can be moved along the direction A. Press down, and make the liquid-cooled heat exchanger 420 thermally coupled to the air-cooled heat exchanger 410 through the flexible heat-conducting pad 450 and the heat-conducting element 440 (as shown in FIG. 6 ). When the servo device 10 is running, on the one hand, the airflow generator 500 generates a cooling airflow F blowing towards the air-cooled heat exchanger 410 to take away the heat energy generated by the heat source 220 through the cooling airflow F. On the other hand, the heat conducting element 440 transfers the heat energy generated by the heat source 220 to the liquid-cooled heat exchanger 420 along the direction T, and then transfers to the outside of the servo device 10 through the flow tube 430 . In this way, two heat dissipation methods of air cooling and water cooling can coexist in the servo device 10 to further improve the heat dissipation efficiency of the servo device 10 . In addition, the heat dissipation device 400 of this embodiment is easier to introduce into old models due to its simple structure.

According to the servo device of the above-mentioned embodiment, the liquid-cooled heat exchanger is fixed on the cover, so that the flow pipes connected to the liquid-cooled heat exchanger can be fixed on the cover together, thereby avoiding occupying the space for electronic components on the circuit board.

In addition, the flow tube is accommodated in the gap between the two expansion components, which is less likely to interfere with the cables of the expansion components. In addition to making the cable management design easier, it will not interfere with the configuration of the input and output interfaces of the expansion components.

In addition, these flow tubes are integrally connected to the liquid-cooled heat exchanger, and the flow tubes extend from the gap between the two expansion components to the outside of the bottom shell, so that the locking place between the integrated flow tube and the external water pipe is located at the bottom. It is not easy to short-circuit the electronic components when water leaks from the lock.

In one embodiment of the present invention, the server of the present invention can be used for artificial intelligence (English: Artificial Intelligence, referred to as AI) computing, edge computing (edge computing), and can also be used as a 5G server, cloud server or vehicle Internet server use.

Although the present invention is disclosed above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar skills may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be defined in the scope of patent application attached to this specification.

100: Bottom shell

200: Electronic components

210: circuit board

220: heat source

400: cooling device

410: Air Cooled Heat Exchanger

420: Liquid Cooled Heat Exchanger

430: flow tube

440: heat conduction parts

450: Flexible thermal pad

500: air flow generator

Claims (10)

A servo device comprising: A bottom case; an electronic component including a circuit board and at least one heat source, the circuit board is arranged on the bottom case, the at least one heat source is arranged on the circuit board; a cover is detachably covered on the bottom case; And a heat dissipation device, comprising: at least one air-cooled heat exchanger fixed and thermally coupled to the at least one heat source; and at least one liquid-cooled heat exchanger fixed to the cover and thermally coupled to the at least one air-cooled heat exchanger. The servo device as described in claim 1, wherein the bottom case includes a bottom plate and two side plates, the two side plates are respectively connected to the opposite sides of the bottom plate, and the removal direction of the cover is parallel to the direction of a load-bearing surface of the bottom plate line direction. The servo device according to claim 1, wherein the at least one air-cooled heat exchanger comprises a base and a plurality of fins, the base is in thermal contact with the at least one heat source, and the fins protrude from the base away from One side of the at least one heat source. The server device according to claim 3, wherein the heat dissipation device further includes at least one heat conducting element, the at least one heat conducting element is fixed to the at least one air-cooled heat exchanger, and the at least one air-cooled heat exchanger passes through the heat conducting element Thermally coupled to the at least one liquid-cooled heat exchanger. The servo device as described in claim 4, wherein the at least one heat conduction element includes a thermal contact section and two assembly sections, the thermal contact section is stacked on the fins of the at least one air-cooled heat exchanger, and the two assembly sections The assembly section is respectively connected to opposite sides of the thermal contact section and is fixed on the base. The thermal contact section and the two assembly sections surround the fins. The server device as described in claim 4, further comprising at least one flexible heat conduction pad disposed on the at least one liquid-cooled heat exchanger, and the at least one liquid-cooled heat exchanger passes through the at least one flexible heat conduction pad coupled to the at least one heat conducting element. The server device according to claim 1, wherein the cooling device further includes at least one flow pipe, and the at least one flow pipe is integrally connected to the at least one liquid-cooled heat exchanger. The servo device according to claim 7, wherein the electronic component further includes two expansion components, and the at least one flow pipe extends from a gap between the two expansion components to the outside of the bottom case. The servo device according to claim 7, wherein the at least one flow pipe is fixed to the cover. The server device as claimed in claim 1 further includes an airflow generator for generating a cooling airflow to blow to the at least one air-cooled heat exchanger.

Images