TWM634238U - Water cooling device for cooling dual heat sources - Google Patents

Abstract

This creation provides a water cooling device for cooling dual heat sources, which is a heat dissipation fin tube of a heat dissipation component connected to a first circulation pump, and the first circulation pump is connected to a first heat exchange component through a first pipeline, The first heat exchange component is in contact with and cools a first heat source. The first heat exchange component communicates with a second heat exchange component through a second pipeline. The first heat exchange component is in contact with and cools a second heat source. The heat source, the second heat exchange component communicates with the first circulating pump through a third pipeline, and uses the cooling fin tube to cool the fluid circulating in the water-cooling device used to cool the dual heat sources, so that the device cools the two heat sources at the same time A heat source further reduces the space occupied by the device.

Description

Water cooling device for cooling dual heat sources

This creation is about a water-cooling device for cooling dual heat sources, especially a heat dissipation structure that can be quickly disassembled and assembled on electronic components.

With the development of science and technology, today's computer hardware has been developed in the direction of high speed and high frequency, so as to improve the operating efficiency of the computer. Computer hardware operates in a high speed and high frequency environment for a long time, and relatively high temperature will be generated. In order for the memory to cooperate with the high-speed calculation of the processor, the operating temperature of the corresponding electronic components is getting higher and higher. The continuously rising temperature will inevitably affect the performance of the electronic components, and even cause the memory to be damaged.

Due to the popularity of e-sports and the popular trend of many computers being modified, many users or manufacturers of e-sports computers will replace the casings of e-sports computers with see-through casings, and this modification trend is gradually prevailing , The internal components of the gaming computer, such as: CPU, graphics card, memory, will have better performance than ordinary personal computers, so relatively more heat will be generated.

It is known that electronic components that generate heat, such as CPU, display card, and memory, are arranged on a circuit board and plugged into a computer system through a connection interface. Due to the demand of the above-mentioned gaming products, the operating frequency of related electronic components is gradually increasing to high frequency, which makes the electronic components have higher data transmission rate and higher power consumption, which makes the electronic components easier to accumulate heat; when the electronic components The working temperature is getting higher and higher. When the temperature exceeds the allowable value, the performance of the electronic components will be significantly reduced. At the same time, the error rate of the module to maintain data or calculation will increase, which will lead to the instability of the computer system. The excessive heat will reduce the electronic components. performance, so people will install heat sinks in these electronic components.

Continuing the above, in order to seek faster heat dissipation, the industry gradually introduces water-cooled heat sinks to overcome the problem of higher and higher operating temperatures of electronic components. Under such circumstances, the cooling equipment is often required to further reduce the size, so that the equipment can still perform high-speed data processing and calculation without stopping for a long time in the most limited space. For electronic components, if multiple electronic components need to be dissipated, they must occupy a lot of space, and multiple radiators will consume more energy. Under the trend of shrinking the size of the casing, the industry is in urgent need of a water cooler that can be used to cool more than one heat source. device.

In view of the above-mentioned problems in the prior art, this creation provides a water-cooling device for cooling dual heat sources, which uses two heat exchange components to cool the two heat sources respectively, and uses a heat dissipation component to flow through the two heat exchangers correspondingly. The heat of the fluid in the component is discharged, and the device is used to cool two heat sources at the same time, further reducing the occupied space of the device.

One purpose of this creation is to provide a water-cooling device for cooling dual heat sources, which uses a single heat dissipation component to communicate with two heat exchange components, and the two heat exchange components respectively cool two heat sources, and use this device to cool two The heat source further reduces the occupied space of the device, and the two heat exchange components communicate with each other, and one of the heat exchange components receives the fluid flowing through the other heat exchange component, reducing the energy consumption of the water cooling device.

In order to achieve the purposes and effects mentioned above, this invention provides a water-cooling device for cooling dual heat sources, which is used for cooling a first heat source and a second heat source, and the water-cooling device for cooling dual heat sources includes: A heat dissipation component, a first pipeline, a first heat exchange component, a second pipeline, a second heat exchange component and a third pipeline, the heat dissipation component includes a frame, a heat dissipation fin tube and a first Circulation pump, the cooling fin tube is arranged inside one of the frames, the first circulation pump communicates with the two ends of the cooling fin tube, one end of the first pipeline communicates with the first circulation pump, and the first heat exchange component includes A second circulation pump and a first heat conduction element, the second circulation pump communicates with the other end of the first pipeline, the first heat conduction element is arranged under one of the second circulation pump, and the first heat conduction element corresponds to resist Connected to the first heat source, one end of the second pipeline communicates with the second circulation pump, the second heat exchange component includes a storage tank and a second heat conduction member, the storage tank communicates with the second pipeline At the other end, the second heat conduction element is arranged under one of the accommodating tanks, the second heat conduction element is correspondingly abutted against the second heat source, one end of the third pipeline communicates with the accommodating tank, and the third pipeline The other end communicates with the first circulating pump, wherein a fluid is arranged inside one of the cooling fin tubes, and the first circulating pump correspondingly transports the fluid to the third pipeline, and the fluid flows through the third pipeline to the accommodating tank, the fluid flows to the second pipeline after passing through the accommodating tank, the fluid flows to the second circulating pump after passing through the second pipeline, and flows to the second circulating pump after passing through the second circulating pump The first pipeline, the fluid flows through the first pipeline to the first circulation pump and the heat dissipation fin tube, wherein the first heat source generates heat energy and conducts it to the first heat conduction element, and then the first heat source The heat conduction element conducts to the second circulation pump, the second heat source generates heat energy and conducts to the second heat conduction element, and then conducts to the accommodating tank through the second heat conduction element; using this structure provides a cooling system that can cool the two heat sources at the same time. Water-cooled structure.

In an embodiment of the present invention, the first heat source is a central processing unit (CPU).

In an embodiment of the present invention, the second heat source is a solid state disk (SSD).

In one embodiment of the present invention, a first water inlet and a first water outlet are arranged on one side of the first circulation pump, the first water inlet communicates with one end of the cooling fin tube, and the first water outlet communicates with the The other end of the heat dissipation fin tube, the fluid enters the heat dissipation fin tube from the first water inlet, and the fluid flows through the heat dissipation fin tube to the first circulation pump from the first water outlet.

In one embodiment of the present invention, a second water inlet and a second water outlet are provided on the other side of the first circulating pump, the second water inlet communicates with the end of the first pipeline, and the second outlet The water port communicates with the other end of the third pipeline, the fluid enters the first circulating pump through the second water inlet after passing through the first pipeline, and the fluid enters the third pipeline through the second water outlet.

In an embodiment of the present invention, the heat dissipation component further includes a fan, and the fan is disposed on one side of the frame corresponding to the heat dissipation fin tube.

In one embodiment of the present invention, one of the gas enters one side of the fan, the gas enters the fan and flows to the inner side of the frame, and passes through an outer side of the heat dissipation fin tube, and the gas passes through the side of the heat dissipation fin tube After the outside, the gas flows out of the frame.

In an embodiment of the present invention, the first pipeline, the second pipeline and the third pipeline are each a flexible pipeline.

In an embodiment of the present invention, the second heat exchange component further includes a fixing frame, the fixing frame is arranged under one of the second heat conducting elements, and the fixing frame and the second heat conducting element interpose the second heat source.

In an embodiment of the present invention, the temperature of the first heat source is greater than or equal to the temperature of the second heat source.

In order to enable your review committee to have a further understanding and understanding of the characteristics of this creation and the achieved effects, I would like to provide examples and accompanying explanations, as follows:

In view of the problems of the above-mentioned prior art, the present creation is a first circulation pump of a heat dissipation component communicated with a second circulation pump of a first heat exchange component with a first pipeline, and the first heat exchange component is correspondingly cooled A first heat source, the second circulation pump of the first heat exchange component communicates with a storage tank of the second heat exchange component through a second pipeline, and the first heat exchange component corresponds to cooling a second heat source, the The accommodating tank of the second heat exchange component communicates with the first circulating pump with a third pipeline, and uses a heat dissipation fin tube of the heat dissipation component to cool a fluid flowing in these components, and this device solves the conventional problem If the technology needs to dissipate multiple electronic components, it must occupy a lot of space.

Please refer to Fig. 1, which is a structural explosion diagram of an embodiment of the invention, as shown in the figure, this embodiment is a water cooling device 1 for cooling dual heat sources, which is used for cooling a first heat source 2 and a The second heat source 3, the water-cooling device 1 for cooling dual heat sources includes a heat dissipation component 10, a first pipeline 20, a first heat exchange component 30, a second pipeline 40, and a second heat exchange component 50 and a third pipeline 60 .

Referring to Fig. 1 again, as shown in the figure, in this embodiment, the heat dissipation assembly 10 includes a frame 12, a heat dissipation fin tube 14 and a first circulation pump 16, and the heat dissipation fin tube 14 is arranged on the frame 12 An inner side, wherein the first circulation pump 16 communicates with the two ends of the heat dissipation fin tube 14, one end of the first pipeline 20 communicates with the first circulation pump 16, and the first heat exchange assembly 30 includes a second circulation pump 32 And a first heat conduction member 34, the second circulation pump 32 communicates with the other end of the first pipeline 20, wherein the first heat conduction member 34 is arranged under one of the second circulation pump 32, and the first heat conduction member 34 is correspondingly abutted against the first heat source 2. In this embodiment, the first heat conduction element 34 is abutted against one of the first heat sources 2, but it is not limited here; one end of the second pipeline 40 communicates with The second circulating pump 32, the second heat exchange component 50 includes a housing tank 52 and a second heat conducting member 54, the housing tank 52 communicates with the other end of the second pipeline 40, the second heat conducting member 54 It is arranged under one of the accommodating grooves 52 , wherein the second heat conduction member 54 is in contact with the second heat source 3 , and in this embodiment, the second heat conduction member 54 is in contact with the second heat source 3 One above, but not limited here; one end of the third pipeline 60 communicates with the accommodating tank 52 , and the other end of the third pipeline 60 communicates with the first circulation pump 16 , where a circulation channel is completed.

Continuing the above, in this embodiment, the first heat source 2 is a central processing unit (CPU), including a fixed frame of the CPU, and the first heat exchange component 30 is used to exchange heat with the first heat source 2, To reduce the temperature of the first heat source 2 .

Continuing the above, in this embodiment, the second heat source 3 is a solid state disk (SSD), such as PCle SSD, and the second heat exchange component 50 is used to exchange heat with the second heat source 3 to reduce the second heat source 3. The temperature of heat source 3.

Continuing the above, in this embodiment, the heat dissipation fin tube 14 is taken as an example, but this embodiment is not limited here, and a plurality of heat dissipation fin tubes 14 can also be arranged inside the frame 12 to further improve thermal efficiency.

Continuing the above, in this embodiment, the first pipeline 20, the second pipeline 40, and the third pipeline 60 are each a flexible pipeline, such as a tube body made of plastic or silicone material, to adapt to different The chassis environment enables the first heat exchange component 30 and the second heat exchange component 50 to contact the first heat source 2 and the second heat source 3 on different planes and angles.

Referring again to Fig. 1 and Fig. 2A to Fig. 2B, Fig. 2A to Fig. 2B are schematic diagrams of the fluid flow path of an embodiment of the present invention, as shown in the figure, in this embodiment, a fluid F is set In one of the inner sides of the heat dissipation fin tube 14 of the heat dissipation component 10, the fluid F is allowed to flow on the inner side of the heat dissipation fin tube 14 to cool down, and the first circulation pump 16 correspondingly transports the fluid F to the third pipeline 60 One inner side, the fluid F flows to one inner side of the accommodating tank 52 of the second heat exchange component 50 after passing through the third pipeline 60, and the fluid F is internally circulated in the inner side of the accommodating tank 52, The fluid F flows to the inner side of the second pipeline 40 after passing through the containing tank 52 , and flows to one of the second circulation pump 32 of the first heat exchange component 30 after passing through the containing tank 52 Inside, the fluid F flows to the inside of the first pipeline 20 after passing through the second circulation pump 32, and the fluid F flows to the first circulation pump 16 of the heat dissipation assembly 10 after passing through the first pipeline 20 On the inner side, the first circulating pump 16 is used to deliver the fluid F to the cooling fin tube 14 for cooling, and completes a cycle here.

Continuing from the above, in this embodiment, the fluid F is coolant or water, which is not limited in this embodiment.

Continuing the above, in this embodiment, the first heat source 2 generates heat energy, which is conducted to the first heat conducting member 34 of the first heat exchange component 30, and then conducted to the second circulation pump by the first heat conducting member 34 32. At the same time, the fluid F flows inside the second circulation pump 32, and absorbs the heat energy transmitted to the second circulation pump 32, further reducing the temperature of the first heat source 2.

Continuing the above, in this embodiment, the second heat source 3 generates heat energy, which is conducted to the second heat conduction member 54 of the second heat exchange component 50 , and then conducted to the accommodating tank 52 by the second heat conduction member 34 , and at the same time, the fluid F flows in the inner side of the accommodating tank 52, and absorbs the heat energy conducted to the accommodating tank 52, further reducing the temperature of the second heat source 3.

Continuing from the above, in this embodiment, the first heat conduction element 34 can be integrally formed with the housing of the second circulation pump 32, and the material of the first heat conduction element 34 can be metal, silicone or graphene. Not limited here.

Continuing from the above, in this embodiment, the second heat conduction element 54 can be integrally formed with the shell of the accommodating tank 52, and the material of the second heat conduction element 54 can be metal, silicone or graphene, which is not included in this embodiment. this limit.

Continuing the above, in this embodiment, the temperature of the first heat source 2 is greater than or equal to the temperature of the second heat source 3, so the fluid F is preferentially transported to the second heat source 3 after the heat dissipation fin tube 14 of the heat dissipation component 10 is cooled. The heat exchange component 50 corresponds to cooling the second heat source 3, and then transports the fluid F flowing through the second heat exchange component 50 to the first heat exchange component 50, corresponding to cooling the first heat source 2 with a higher temperature, so that The circulation of the cooling fluid reduces energy consumption.

Continuing the above, in this embodiment, the second heat exchange assembly 50 further includes a fixing frame 56, the fixing frame 56 is disposed under one of the second heat conducting elements 54, and the fixing frame 56 and the second heat conducting element 54 sandwiches the second heat source 3 so that the second heat conduction member 54 is in closer contact with the second heat source 3 to improve heat dissipation efficiency and prevent the second heat source 3 from loosening.

Referring to Fig. 1 to Fig. 2B again, as shown in the figure, in this embodiment, one side of the first circulation pump 16 is provided with a first water inlet 161 and a first water outlet 162, the first water inlet 161 communicates with one end of the heat dissipation fin tube 14, the first water outlet 162 communicates with the other end of the heat dissipation fin tube 14, the fluid F enters the heat dissipation fin tube from the first water inlet 161, and the fluid F passes through the heat dissipation fin tube 14 and then flows from the first water outlet 162 to the inner side of the first circulating pump 16 .

Continuing the above, in this embodiment, a second water inlet 163 and a second water outlet 164 are provided on the other side of the first circulation pump 16, and the second water inlet 163 communicates with the end of the first pipeline 20 , the second water outlet 164 is connected to the other end of the third pipeline 60, the fluid F passes through the first pipeline 20 and then enters the first circulation pump 16 through the second water inlet 163, and the fluid F comes from the The second water outlet 164 enters the third pipeline 60 .

Please refer to Fig. 3, which is a schematic diagram of the fan structure and its operation of an embodiment of the invention. As shown in the figure, this embodiment is based on the above-mentioned embodiment. The cooling fin tube 14 is disposed on one side of the frame 12. In this embodiment, the fan 18 is fixed on the side of the frame 12 with screws, but this embodiment is not limited thereto.

Continuing the above, in this embodiment, a gas A enters one side of the fan 18, and after the gas A enters the fan 18, the gas A flows to the inner side of the frame 12 and passes through one of the cooling fins 14 The outer side exchanges heat with the heat dissipation fin tube 14 to lower the temperature of the fluid F (as shown in Figure 2B) on the inside of the heat dissipation fin tube 14. After the gas A passes through the outside of the heat dissipation fin tube 14, the gas A flows out of the frame 12 .

Continuing from the above, in this embodiment, the gas A is air, which is not limited in this embodiment.

To sum up, this creation provides a water-cooling device for cooling dual heat sources, which uses a single heat dissipation component to communicate with two heat exchange components, and the two heat exchange components respectively cool the two heat sources. One heat source further reduces the space occupied by the device, and the two heat exchange components are connected to each other, and one of the heat exchange components receives the fluid flowing through the other heat exchange component, and the heat source with a higher cooling demand receives the lower cooling demand The cooling fluid of the heat source, while further reducing the volume, reduces the energy consumption of the overall water-cooling device, solving the problem that the conventional water-cooling device is that one radiator corresponds to one electronic component that generates heat. If multiple electronic components need to be dissipated, multiple spaces must be occupied The problem of solving the problem of conventional water-cooling devices and the need to use multiple radiators will consume more energy.

Therefore, this creation is indeed novel, progressive, and can be used in industry. It should meet the patent application requirements of our country's patent law.

However, the above is only an embodiment of this creation, and it is not used to limit the scope of implementation of this creation. Therefore, all equal changes and modifications based on the shape, structure, characteristics and spirit described in the patent scope of this creation, All should be included in the scope of the patent application for this creation.

1: Water cooling device for cooling dual heat sources 2: The first heat source 3: Second heat source 10: Cooling components 12: frame 14: cooling fin tube 16: The first circulation pump 161: The first water inlet 162: The first water outlet 163: Second water inlet 164: Second water outlet 18: fan 20: The first pipeline 30: The first heat exchange component 32: Second circulation pump 34: The first heat conducting member 40: Second pipeline 50: Second heat exchange component 52: storage tank 54: Second heat conducting member 56: fixed frame 60: The third pipeline A: gas F: Fluid

Figure 1: It is a structural explosion schematic diagram of an embodiment of this creation; Figures 2A to 2B: a schematic diagram of a fluid flow path of an embodiment of the present invention; and Figure 3: It is a schematic diagram of the fan structure and its operation in one embodiment of the invention.

1: Water cooling device for cooling dual heat sources

2: The first heat source

3: Second heat source

10: Cooling components

12: frame

14: cooling fin tube

16: The first circulation pump

18: fan

20: The first pipeline

30: The first heat exchange component

32: Second circulation pump

34: The first heat conducting member

40: Second pipeline

50: Second heat exchange component

52: storage tank

54: Second heat conducting member

60: The third pipeline

Claims (10)

A water-cooling device for cooling dual heat sources, which is used for cooling a first heat source and a second heat source, the water-cooling device for cooling dual heat sources comprises: A heat dissipation component, which includes a frame, a heat dissipation fin tube and a first circulation pump, the heat dissipation fin tube is arranged inside one of the frame, and the first circulation pump communicates with the two ends of the heat dissipation fin tube; A first pipeline, one end of which communicates with the first circulation pump; A first heat exchange component, which includes a second circulation pump and a first heat conduction element, the second circulation pump communicates with the other end of the first pipeline, and the first heat conduction element is arranged under the second circulation pump side, the first heat-conducting member is correspondingly in contact with the first heat source; A second pipeline, one end of which communicates with the second circulation pump; A second heat exchange component, which includes a storage tank and a second heat conduction member, the storage tank communicates with the other end of the second pipeline, the second heat conduction member is arranged under one of the storage tanks, the the second heat conducting element is correspondingly abutted against the second heat source; and A third pipeline, one end of which communicates with the storage tank, and the other end of the third pipeline communicates with the first circulation pump; Wherein, a fluid is arranged inside one of the heat dissipation fin tubes, and the first circulation pump correspondingly delivers the fluid to the third pipeline, and the fluid flows to the accommodating tank after passing through the third pipeline, and the fluid passes through the The storage tank then flows to the second pipeline, the fluid passes through the second pipeline and then flows to the second circulation pump, the fluid passes through the second circulation pump and then flows to the first pipeline, and the fluid passes through the The first pipeline then flows to the first circulation pump and the cooling fin tube; Wherein, the first heat source generates heat energy and conducts it to the first heat conduction member, and then conducts heat energy to the second circulation pump from the first heat conduction member, and the second heat source generates heat energy and conducts it to the second heat conduction member, and then conducts heat energy from the first heat conduction member to the second circulation pump. The second heat conduction element conducts to the accommodating groove. The water-cooling device for cooling dual heat sources as claimed in claim 1, wherein the first heat source is a central processing unit (CPU). The water cooling device for cooling dual heat sources as claimed in claim 1, wherein the second heat source is a solid state disk (SSD). The water cooling device for cooling dual heat sources as described in Claim 1, wherein a first water inlet and a first water outlet are provided on one side of the first circulation pump, and the first water inlet is connected to one end of the cooling fin tube , the first water outlet communicates with the other end of the heat dissipation fin tube, the fluid enters the heat dissipation fin tube from the first water inlet, and the fluid flows through the heat dissipation fin tube from the first water outlet to the first circulating pump . The water-cooling device for cooling dual heat sources as described in Claim 4, wherein a second water inlet and a second water outlet are provided on the other side of the first circulation pump, and the second water inlet communicates with the first pipeline The end of the second water outlet is connected to the other end of the third pipeline. After passing through the first pipeline, the fluid enters the first circulating pump from the second water inlet, and the fluid enters the first circulation pump from the second water outlet. into the third line. The water-cooling device for cooling dual heat sources as described in Claim 1, wherein the heat dissipation component further includes a fan, and the fan is disposed on one side of the frame corresponding to the heat dissipation fin tube. The water-cooling device for cooling dual heat sources as described in claim 6, wherein one gas enters one side of the fan, and the gas enters the fan and then flows to the inner side of the frame and passes through an outer side of the cooling fin tube, After the gas passes through the outer side of the heat dissipation fin tube, the gas flows out of the frame. The water-cooling device for cooling dual heat sources as described in claim 1, wherein the first pipeline, the second pipeline and the third pipeline are each a flexible pipeline. The water-cooling device for cooling dual heat sources as described in claim 1, wherein the second heat exchange component further includes a fixing frame, the fixing frame is arranged under one of the second heat conducting elements, and the fixing frame and the first The second heat source is interposed between the two heat conducting members. The water-cooling device for cooling dual heat sources as described in Claim 1, wherein the temperature of the first heat source is greater than or equal to the temperature of the second heat source.

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