TWI778559B - Plasma antena module - Google Patents

Abstract

The invention relates to a plasma antenna module. Specifically, according to an embodiment of the present invention, a plasmonic antenna module is provided, comprising: an inner layer coil assembly, at least a part of which extends on a virtual plane and can make a first current flow; an outer layer coil assembly, which has a shape spaced apart from the aforementioned inner-layer coil assembly and extending in a direction around the aforementioned inner-layer coil assembly when viewed from a direction perpendicular to the aforementioned virtual plane, and is capable of causing a second current to flow; and an inductor having The inductor is electrically connected to the outer coil assembly and the inner coil assembly, and the inductor is configured to change the path of the current flowing through the inductor to adjust the magnitude of the first current and the second current.

Description

Plasma Antenna Module

The invention relates to a plasma antenna module.

Generally, semiconductor devices can be fabricated by performing various processes on a substrate. For example, various processes for treating the substrate may include etching (Etching), evaporation (Deposition), thermal treatment (Thermal), and imprint lithography (Imprint Lithography) and other processes. In particular, in the etching process, an operation in which the substrate can be etched by using plasma generated by a plasma processing apparatus may be performed.

On the other hand, plasma processing devices generally include an Inductively Coupled Plasma Source (ICP) type, a Capacitively Coupled Plasma Source (CCP) type, and an Electron Cyclotron Resonance Plasma Source (Electro Cyclotron). Resonance Plasma Source, ECR) type and Helicon Plasma Source (Helicon Plasma Source) type.

Such a plasma processing apparatus can convert a process gas into a plasma state by reacting a process gas with a high-frequency current when supplying current to a plasma antenna module, and can use the formed plasma to process a substrate (eg, etching, evaporation, etc.). At this time, the density of the plasma may be one of the important factors determining the processing speed of the substrate.

However, the density of the plasma may vary depending on the environmental conditions (eg, magnitude, location, etc.) of the plasma being processed, and, depending on the density of the plasma, the speed at which the substrate is processed may vary. For example, a portion of the substrate may be located where the plasma density is higher to be processed quickly, while another portion of the substrate may be located where the plasma density is lower and processed at a low speed. In this way, the plasma density is formed differently depending on the position of the substrate, and the substrate may not be uniformly processed. Therefore, there is a need for an apparatus that can process a substrate at a uniform speed by making the density of the plasma formed in the plasma apparatus uniform regardless of the position of the substrate.

[Problems to be Solved by Invention]

The embodiments of the present invention have been invented in view of the above-mentioned background, and aim to provide a plasmonic antenna module which can achieve a uniform density irrespective of the position by making the density of the plasma formed in the plasmonic device uniform. Speed to process wafers. [means to solve the problem]

According to an aspect of the present invention, there is provided a plasmonic antenna module, comprising: an inner layer coil assembly, at least a part of which extends on a virtual plane and is capable of allowing a first current to flow; an outer layer coil assembly, which is perpendicular to The aforementioned virtual plane has a shape that is spaced apart from the aforementioned inner layer coil assembly and extends in a direction surrounding the aforementioned inner layer coil assembly when viewed in the direction of the aforementioned virtual plane, and is capable of causing a second current to flow; an inductor that is separate from the aforementioned outer layer coil assembly and the inner layer coil assembly is electrically connected; and a connecting member, which can be selectively combined with the inductor; the connecting member is configured to be able to change the position of the connecting member to the inductor, so as to change the flow through the inductor by changing The path of the current to adjust the current ratio as a ratio of the aforementioned first current to the aforementioned second current.

Further, the inductor may have a plurality of loop portions arranged in one direction; the loop portion may extend in a direction around an imaginary axis extending in the one direction; A plurality of contact portions that are electrically connected; the plurality of contact portions are formed in different loop portions among the plurality of loop portions.

In addition, the aforementioned inductor may include: a plurality of loop members that are spaced apart in one direction; and a plurality of intermediary members that extend in the same direction as the aforementioned one direction or a direction shifted from the aforementioned one direction; the aforementioned plurality of One end of a part of the media members can be connected to one of the loop members of the plurality of loop members, and the other end of the media members can be connected to one of the loop members of the plurality of loop members. Parts are connected to another loop part adjacent to each other.

Further, the aforementioned loop member may have a closed loop shape extending from and returning to the aforementioned media member when viewed from the aforementioned one direction.

In addition, the above-mentioned inductor may further include a support member, at least a part of which has a shape corresponding to the shape of the above-mentioned loop member; one side end of the plurality of intermediate members can be matched with one of the plurality of loop members. One loop member is connected, and the other end can be connected to the other loop member adjacent to one of the loop members or the support member among the plurality of loop members.

In addition, as the number of the contact parts electrically connected to the connecting member increases, the value of the first current may increase, and the value of the second current may decrease.

In addition, the current ratio when the connecting member is electrically connected to two or more of the plurality of contact portions may be greater than the current ratio when the connecting member is not electrically connected to the contact portion. The plasmonic antenna module .

Moreover, the said inner layer coil assembly may be arrange|positioned inside the said outer layer coil assembly.

In addition, the plasmonic antenna module may be provided with one or more of the inductors; the outer-layer coil assembly and the inner-layer coil assembly may be connected in parallel to a power supply unit for supplying power from the outside.

In addition, the aforementioned plasmonic antenna module may further include: a connecting portion which is electrically connected to the aforementioned outer layer coil assembly and the aforementioned inner layer coil assembly body, and has a branch point; the aforementioned first current passes from the aforementioned power supply portion through the aforementioned a branch point and a first path toward the inner-layer coil assembly; the second current flows along a second path from the power supply part through the branch point and toward the outer-layer coil assembly; the one or more inductors are arranged one or more paths among the first path and the second path.

In addition, the one or more inductors may be arranged on the first path, and the one or more inductors may be connected in series with the inner-layer coil assembly by connecting one side to the inner-layer coil assembly.

In addition, the one or more inductors may be arranged on the second path, and the one or more inductors may be connected in series with the outer-layer coil assembly by connecting one side to the outer-layer coil assembly.

In addition, the aforementioned outer-layer coil assembly may include a plurality of outer-layer coils; the aforementioned inner-layer coil assembly includes a plurality of inner-layer coils; the aforementioned plasmonic antenna module is provided with a plurality of the aforementioned one or more inductors; A certain part of the inductor is connected in series with at least a part of the outer coils of the plurality of outer coils by connecting one side to at least a part of the outer coils of the plurality of outer coils; the other part of the inductors of the plurality of the foregoing inductors is connected by The at least a part of the inner layer coils among the plurality of inner layer coils are connected in series by connecting one side to at least a part of the inner layer coils of the plurality of inner layer coils.

According to another aspect of the present invention, there is provided a plasmonic antenna module, comprising: an inner layer coil assembly, at least a part of which extends on a virtual plane; an outer layer coil assembly, when viewed from a direction perpendicular to the aforementioned virtual plane having a shape spaced apart from the inner-layer coil assembly and extending in a direction surrounding the inner-layer coil assembly; and a support portion supporting the outer-layer coil assembly and the inner-layer coil assembly; the support portion includes: an outer layer a support body, which supports the aforementioned outer layer coil assembly; a first inner layer support body, which supports the aforementioned inner layer coil assembly body; An inner layer support body is combined; the plasmonic antenna module further includes a first combination part, the first combination part is used for combining the outer layer support body and the connection support body; the connection support body is formed for selectively inserting A plurality of coupling holes of the aforementioned first coupling member; a plurality of the aforementioned coupling holes are arranged in a direction parallel to the aforementioned virtual plane, and are arranged to be radially spaced with one of the plurality of aforementioned coupling holes as the center; and according to the aforementioned Which of the plurality of coupling holes the first coupling member is inserted into changes the position of coupling between the connection support and the outer support, so as to adjust the inner coil assembly relative to the outer coil assembly The relative position of the outer layer support body in the direction parallel to the virtual plane of the first inner layer support body is adjusted relative to the relative position of the body.

In addition, the aforementioned plasmonic antenna module may further include: a main connection part, which can be electrically connected to the aforementioned inner layer coil assembly; the aforementioned support portion further includes a second inner layer support body supporting the aforementioned inner layer coil assembly; the aforementioned The second inner layer support body is formed with a through hole into which the second coupling member can be inserted to be electrically connected to the main connection member.

In addition, the aforementioned plasmonic antenna module may further include: an inductor, which becomes a medium for enabling the electrical connection between the aforementioned main connecting member and the aforementioned inner-layer coil assembly; the aforementioned second inner-layer support body is coupled to the aforementioned inductor through the aforementioned inductor. The aforementioned main connecting part.

In addition, a plurality of the coupling holes may be formed in the connection support body; and a plurality of the through holes may be formed in the second inner layer support body in the same manner as the separation distance between the plurality of coupling holes. .

In addition, at least a part of the plurality of the coupling holes and the plurality of the through holes may be arranged at positions corresponding to each other.

In addition, a guide protrusion may be formed on the first inner layer support body to protrude; the connecting support body may be inserted into the guide protrusion, and a guide groove for guiding the movement of the guide protrusion in one direction may be formed; the first inner layer The layer support body is configured to be movable in the one direction of the guide groove by the guide protrusion and fixedly supported by the connection support body to adjust the position relative to the connection support body in the one direction. [Inventive effect]

According to the embodiment of the present invention, there is an effect that the wafer can be processed at a uniform speed regardless of the position of the substrate by making the density of the plasma formed in the plasma apparatus uniform.

Specific embodiments for realizing the idea of the present invention will be described in detail below with reference to the drawings.

Meanwhile, in describing the present invention, when it is judged that the detailed description of the related well-known configuration or function may make the gist of the present invention unclear, the detailed description thereof is omitted.

In addition, when a constituent element is referred to as "connecting, supporting," "flowing," "supplying," "flowing," "combining" with another constituent element, it may also directly connect, support, flow, supply, flow , combined with the other constituent element, but it should be understood that there may also be other constituent elements in the middle.

The terms used in this specification are used to describe specific embodiments only, and are not intended to limit the present invention. Unless the context clearly defines otherwise, the expression of the singular includes the expression of the plural.

Further, terms including ordinal numbers such as first, second, etc., may be used to describe various constituent elements, but these constituent elements are not limited by such terms. These terms are only used for the purpose of distinguishing one constituent element from another constituent element.

The meaning of "comprising" as used in the specification embodies particular characteristics, regions, integers, steps, acts, elements and/or components, and does not exclude other specified characteristics, regions, integers, steps, acts, elements, components and/or the presence or addition of groups.

In addition, it should be noted that in this specification, expressions such as upper side and lower side are described based on the drawings, and may be expressed differently when the direction of the object is changed. On the other hand, the up-down direction in this specification may be the up-down direction in FIGS. 1 and 8 .

The specific structure of the plasmonic antenna module 1 according to an embodiment of the present invention will be described below with reference to the drawings.

Next, referring to FIGS. 1 and 2 , the plasmonic antenna module 1 of an embodiment of the present invention can convert the process gas into electricity by reacting the process gas in the chamber (not shown) with high-frequency current pulp. Such a plasmonic antenna module 1 can be arranged on the upper side of the chamber, and can receive power from the power supply unit 2 . In addition, the plasmonic antenna module 1 can provide a uniform plasma density into the chamber by making the current flow uniformly. Such a plasmonic antenna module 1 may include a connecting part 100 , a grounding module 200 , an outer coil assembly 300 , an inner coil assembly 400 , an inductor 500 , a supporting part 600 , a connecting part 700 and a coupling part 800 .

The plasmonic antenna module 1 may be configured such that the outer-layer coil assembly 300 and the inner-layer coil assembly 400 face the chamber (not shown). For example, the plasmonic antenna module 1 may be reversed in the direction shown in FIG. 1 so that the upper side of the outer layer coil assembly 300 and the inner layer coil assembly 400 faces the lower side and arranged on the upper side of the chamber.

Referring to FIGS. 2 and 3 , the connection part 100 may be an electrical channel for transmitting the current received from the power supply part 2 to the outer-layer coil assembly 300 and the inner-layer coil assembly 400 . Such a connection part 100 can be electrically connected to the outer-layer coil assembly 300 and the inner-layer coil assembly 400 , and can be connected to the outer-layer coil assembly 300 and the inner-layer coil assembly 400 in parallel. In other words, the current received from the power supply part 2 can be divided by the connection part 100 to flow into the outer layer coil assembly 300 and the inner layer coil assembly 400 . Such a connection part 100 may include a main connection part 110 , an outer layer connection part 120 , and an inner layer connection part 130 .

The main connection member 110 can electrically connect the outer-layer coil assembly 300 and the power supply part 2 , and can electrically connect the inner-layer coil assembly 400 and the power supply part 2 . In addition, the main connection part 110 may be divided into a plurality of ramifications to connect the outer layer coil assembly 300 and the inner layer coil assembly 400 in parallel. For example, the main connection part 110 may be divided into four branches. Three of the main connecting parts 110 divided into four branches can be connected to the outer layer coil assembly 300 through the outer layer connecting parts 120 . In addition, the other of the main connection parts 110 divided into four branches may be connected to the inner layer coil assembly 400 through the inner layer connection part 130 . Such a main connection member 110 may have a branch point C, which is a point at which the current received from the power supply unit 2 is divided into the outer layer connection member 120 and the inner layer connection member 130 . In this way, the current received from the power supply unit 2 can be divided with the branch point C as a reference, and can flow through the outer layer connection member 120 and the inner layer connection member 130 .

The outer layer connection part 120 may be configured to transmit the current received from the main connection part 110 to the outer layer coil assembly 300 . One side of such an outer layer connection member 120 is electrically connected to the main connection member 110 , and the other side is electrically connected to the outer layer coil assembly 300 . In addition, the outer layer connection part 120 may include a first outer layer connection part 121 connected to the first outer layer coil 310 , a second outer layer connection part 122 connected to the second outer layer coil 320 , and a third outer layer connection part to the third outer layer coil 330 Connection part 123 .

4 , the inner layer connection member 130 may be configured to transmit the current received from the main connection member 110 through the second inner layer support body 640 to be described later to the inner layer coil assembly 400 . One side of such an inner layer connection member 130 is electrically connected to the second inner layer support body 640 , and the other side is electrically connected to the inner layer coil assembly 400 . In addition, the inner layer connection part 130 may include a first inner layer connection part 131 connected to the first inner layer coil 410 , and a second inner layer connection part 132 connected to the second inner layer coil 420 .

2 and 3 , the grounding module 200 may be configured to electrically ground the outer-layer coil assembly 300 and the inner-layer coil assembly 400 . For example, the grounding module 200 may connect the outer-layer coil assembly 300 and the inner-layer coil assembly 400 to a place where the electric potential is zero, such as ground. Such a grounding module 200 may include an outer grounding portion 210 and an inner grounding portion 220 .

The outer layer ground portion 210 may be configured to electrically ground the outer layer coil assembly 300 . One side of such an outer layer ground portion 210 may be connected to the outer layer coil assembly 300 , and the other side may be connected to the outside. In addition, the outer layer ground part 210 may include a first outer layer ground 211 connected with the first outer layer coil 310 , a second outer layer ground 212 connected with the second outer layer coil 320 , and a third outer layer ground 213 connected with the third outer layer coil 330 .

The inner layer ground portion 220 may be configured to electrically ground the inner layer coil assembly 400 . One side of such an inner layer ground portion 220 may be connected to the inner layer coil assembly 400 , and the other side may be connected to the outside. In addition, the inner layer ground part 220 may include a first inner layer ground 221 connected to the first inner layer coil 410 , and a second inner layer ground 222 connected to the second inner layer coil 420 .

Referring to FIGS. 2 and 3 , the outer layer coil assembly 300 may be configured to form an electric field for deforming the process gas inside the chamber into plasma. Such an outer layer coil assembly 300 can provide a uniform plasma density inside the chamber. Further, the outer-layer coil assembly 300 may receive power from the power supply part 2 , and the second current may flow to the outer-layer coil assembly 300 . At least a portion of such an outer coil assembly 300 may extend on a virtual plane. For example, the outer layer coil assembly 300 may be formed to extend on a virtual plane parallel to the ground. Also, the outer-layer coil assembly 300 may be spaced apart from the inner-layer coil assembly 400 and extend in a direction surrounding the inner-layer coil assembly 400 when viewed from a direction perpendicular to the virtual plane. In other words, the outer layer coil assembly 300 may be formed to be disposed outside the inner layer coil assembly 400 when viewed from a direction perpendicular to the ground. The second current flowing in such an outer layer coil assembly 300 can be variably adjusted by the inductor 500 . The outer-layer coil assembly 300 may include the first outer-layer coil 310 , the second outer-layer coil 320 , and the third outer-layer coil 330 , at least a part of which has a curved shape, to have a ring shape.

The first outer layer coil 310 may be configured such that a portion of the first outer layer coil 310 surrounds the third outer layer coil 330 and another portion of the first outer layer coil 310 is surrounded by the second outer layer coil 320 . One end of such a first outer layer coil 310 may be connected to the first outer layer connection member 121 , and the other end of the first outer layer coil 310 may be connected to the first outer layer ground 211 .

The second outer layer coil 320 may be configured such that a portion of the second outer layer coil 320 surrounds the first outer layer coil 310 and another portion of the second outer layer coil 320 is surrounded by the third outer layer coil 330 . One end of the second outer layer coil 320 may be connected to the second outer layer connecting member 122 , and the other end of the second outer layer coil 320 may be connected to the second outer layer ground 212 .

The third outer coil 330 may be configured such that a portion of the third outer coil 330 surrounds the second outer coil 320 and another portion of the third outer coil 330 is surrounded by the first outer coil 310 . One end of the third outer coil 330 may be connected to the third outer connection member 123 , and the other end of the third outer coil 330 may be connected to the third outer ground 213 .

Such a first outer layer coil 310 and a second outer layer coil 320 may be configured such that a part of the outer peripheral surface of the first outer layer coil 310 and a part of the inner peripheral surface of the second outer layer coil 320 face each other. In addition, the first outer layer coil 310 and the third outer layer coil 330 may be configured such that a part of the inner peripheral surface of the first outer layer coil 310 and a part of the outer peripheral surface of the third outer layer coil 330 face each other.

As such, by configuring a portion of one of the first outer coil 310, the second outer coil 320, and the third outer coil 330 to surround the other, and the other portion to be surrounded by the other, the outer coil assembly 300 can have The specified ring shape. Here, the ring shape may include discontinuous prescribed circulation paths. In addition, the second current flowing in the outer coil assembly 300 may flow along the second path. Here, the second path may be a path from the power supply unit 2 to the outer-layer coil assembly 300 via the branch point C.

On the other hand, the first outer layer coil 310 , the second outer layer coil 320 , and the third outer layer coil 330 may be arranged such that a point on the side of the first outer layer coil 310 connected to the outer layer ground portion 210 is connected to the second outer layer coil 320 Among them, one point on the side connected to the power supply unit 2 faces each other. In addition, it may be configured such that one point of the second outer layer coil 320 on the side connected to the outer layer ground part 210 and one point of the third outer layer coil 330 on the side connected to the power supply part 2 face each other. Here, the portion corresponding to a point may be a portion where the first outer layer coil 310 and the second outer layer coil 320 face each other and a portion where the second outer layer coil 320 and the third outer layer coil 330 face each other. Therefore, in terms of the magnitude of the current flowing in the outer coil assembly 300 , a portion that decreases from the power supply portion 2 side toward the outer ground portion 210 side can be reduced by another portion that increases from the outer ground portion 210 side toward the power supply portion 2 side. part is compensated. In this way, in terms of the magnitude of the current flowing in the outer coil assembly 300 , a part that decreases from the side of the power supply part 2 toward the side of the outer layer ground part 210 is the other part that increases from the side of the outer layer ground part 210 to the side of the power supply part 2 is compensated so that it has the effect of remaining constant.

In addition, by constantly maintaining the magnitude of the current flowing through the outer-layer coil assembly 300, there is an effect that the plasma density can be uniformly supplied.

Referring to FIGS. 2 and 3 , the inner layer coil assembly 400 may be configured to form an electric field for deforming the process gas inside the chamber into plasma. Such an inner layer coil assembly 400 can provide a uniform plasma density into the chamber interior. In addition, the inner layer coil assembly 400 may receive power from the power supply part 2 through the inductor 500 , and the first current may flow to the inner layer coil assembly 400 . At least a part of such an inner layer coil assembly 400 may extend on a virtual plane. For example, the inner layer coil assembly 400 may be formed to extend on a virtual plane parallel to the ground. Further, the inner layer coil assembly 400 may be formed to be disposed inside the outer layer coil assembly 300 when viewed from a direction perpendicular to the ground. As a more detailed example, the inner layer coil assembly 400 may be configured to have the same height relative to the ground as the outer layer coil assembly 300 . However, this is only an example, and the inner layer coil assembly 400 may have a different height from the outer layer coil assembly 300 . On the other hand, the first current flowing in the inner-layer coil assembly 400 may be variably adjusted by the inductor 500 . In addition, the inner layer coil assembly 400 may be connected in parallel to the outer layer coil assembly 300 and the power supply unit 2 . Such an inner layer coil assembly 400 may include at least a portion of the first inner layer coil 410 and the second inner layer coil 420 having a curved shape to have a ring shape.

The first inner layer coil 410 may be configured such that a portion of the first inner layer coil 410 surrounds the second inner layer coil 420 and another portion of the first inner layer coil 410 is surrounded by the second inner layer coil 420 . One end of such a first inner layer coil 410 may be connected to the first inner layer connection member 131 , and the other end of the first inner layer coil 410 may be connected to the first inner layer ground 221 .

The second inner layer coil 420 may be configured such that a portion of the second inner layer coil 420 surrounds the first inner layer coil 410 and another portion of the second inner layer coil 420 is surrounded by the first inner layer coil 410 . One end of such a second inner layer coil 420 may be connected to the second inner layer connection member 132 , and the other end of the second inner layer coil 420 may be connected to the second inner layer ground 222 .

Such first inner layer coil 410 and second inner layer coil 420 may be configured such that a part of the outer peripheral surface of the first inner layer coil 410 and a part of the inner peripheral surface of the second inner layer coil 420 face each other. Also, the first inner layer coil 410 and the second inner layer coil 420 may be configured such that a portion of the inner peripheral surface of the first inner layer coil 410 and a portion of the outer peripheral surface of the second inner layer coil 420 face each other.

In this way, the inner layer coil assembly 400 can have a predetermined ring shape by arranging so that a part of one of the first inner layer coil 410 and the second inner layer coil 420 surrounds the other part. Here, the ring shape may include discontinuous prescribed circulation paths. Also, the first current flowing to the inner layer coil assembly 400 may flow along the first path. Here, the first path may be a path from the power supply unit 2 to the inner layer coil assembly 400 via the branch point C.

On the other hand, the first inner-layer coil 410 and the second inner-layer coil 420 may be configured such that a point on the side of the first inner-layer coil 410 connected to the power supply part 2 is connected to the second inner-layer coil 420 . One point on the side where the inner layer ground parts 220 are connected face each other. In addition, the first inner layer coil 410 and the second inner layer coil 420 may be configured such that a point in the first inner layer coil 410 connected to the side of the inner layer ground portion 220 is connected to the second inner layer coil 420 One point on one side of the power supply unit 2 faces each other. Here, the portion corresponding to a point may be a portion where the first inner layer coil 410 and the second inner layer coil 420 face each other. Therefore, in terms of the magnitude of the current flowing through the inner layer coil assembly 400 , the portion that decreases from the side of the power supply portion 2 toward the side of the inner layer ground portion 220 can be reduced from the side of the inner layer ground portion 220 to the side of the power supply portion 2 . The added part of the side is compensated.

In this way, the magnitude of the current flowing through the inner layer coil assembly 400 increases from the inner layer ground portion 220 side toward the supply portion 2 side, which decreases from the power supply portion 2 side toward the inner layer ground portion 220 side. The other part of is compensated so that it has the effect of remaining constant.

In addition, by constantly maintaining the magnitude of the current flowing through the inner-layer coil assembly 400, there is an effect that the plasma density can be uniformly supplied.

The inductor 500 may be electrically connected to the outer layer coil assembly 300 and may be electrically connected to the inner layer coil assembly 400 . In addition, the inductor 500 may be configured to adjust the magnitude of the current flowing through the outer-layer coil assembly 300 and the inner-layer coil assembly 400 by changing the inductance of the inductor 500 . In other words, the inductor 500 may be configured to be able to change the path of the current flowing through the inductor 500 to adjust the magnitude of the first current and the second current. Furthermore, a plurality of inductors 500 may be provided.

For example, referring to FIG. 5 , the inductor 500 may be connected in series with the inner-layer coil assembly 400 to adjust the magnitude of the first current flowing through the inner-layer coil assembly 400 . At this time, the inductor 500 is arranged on the first path, and one side is connected to the main connection member 110 of the connection portion 100 , and the other side is connected to the inner layer coil assembly 400 via the inner layer connection member 130 . At this time, when the magnitude of the first current flowing to the inner layer coil assembly 400 is adjusted, the magnitude of the second current flowing to the outer layer coil assembly 300 may also be adjusted.

As another example, referring to FIG. 6 , the inductor 500 may be connected in series with the outer-layer coil assembly 300 to adjust the magnitude of the second current flowing through the outer-layer coil assembly 300 . At this time, the inductor 500 is disposed on the second path, one side is connected to the main connection member 110 of the connection portion 100 , and the other side is connected to the outer layer coil assembly 300 through the outer layer connection member 120 . In addition, a plurality of inductors 500 may be provided, and the plurality of inductors 500 may be connected in series with the first outer layer coil 310 , the second outer layer coil 320 , and the third outer layer coil 330 , respectively. Therefore, currents different from each other can be caused to flow through the first outer layer coil 310 , the second outer layer coil 320 , and the third outer layer coil 330 . At this time, when the magnitude of the second current flowing through the outer-layer coil assembly 300 is adjusted, the magnitude of the first current flowing through the inner-layer coil assembly 400 may also be adjusted.

As yet another example, referring to FIG. 7 , a plurality of inductors 500 may be provided, and a certain portion of the plurality of inductors 500 may be connected by connecting one side to at least a portion of the plurality of outer coils 310 , 320 , 330 It is connected in series with at least a part of the plurality of outer layer coils 310 , 320 and 330 . Furthermore, another portion of the plurality of inductors 500 may be connected in series with at least a portion of the plurality of inner layer coils 410 , 420 by being connected to at least a portion of the plurality of inner layer coils 410 , 420 . At this time, the inductor 500 may be disposed on the first path and the second path.

Referring to FIGS. 8 to 10 , the inductor 500 may have loop parts 501 , 502 , 503 , and 504 .

The loop portions 501 , 502 , 503 , 504 may extend in a direction around a virtual axis extending in one direction (eg, the up-down direction of FIG. 10 ). Further, the loop portions 501, 502, 503, 504 may be bent in a manner around the virtual axis, and each of the loop portions 501, 502, 503, 504 may have both ends thereof extending along the direction of the virtual axis to each other separated shapes. In this way, the loop portions 501 , 502 , 503 , and 504 extend around a virtual axis (for example, an axis extending in the up-down direction), so that when viewed from the virtual axis direction, the loop portions 501 , 502 , 503 , and 504 may have From a reference line extending in a predetermined direction (for example, a forward direction) from the virtual axis, it extends along a closed loop path and returns to the shape of the reference line. For example, referring to FIG. 10 , the loop portions 501, 502, 503, 504 may extend in a direction around a virtual axis extending in the up-down direction. Further, the loop portions 501 , 502 , 503 , and 504 have a shape extending from a reference line (edge of the medium member 520 to be described later) extending in a direction perpendicular to the up-down direction and returning to the reference line when viewed from the upper side, Thereby a closed loop can be formed.

A plurality of loop sections 501, 502, 503, 504 may be provided, and the plurality of loop sections 501, 502, 503, 504 may include a first loop section 501, a second loop section 502, a third loop section 503 and the fourth loop portion 504 . The description of the first loop portion 501 , the second loop portion 502 , the third loop portion 503 , and the fourth loop portion 504 will be described later. Such a plurality of loop portions 501 , 502 , 503 , and 504 may be arranged in the direction in which the virtual axis extends, that is, for example, in the up-down direction of FIG. 10 . In addition, the plurality of loop units 501 , 502 , 503 , and 504 may be configured such that a part of any one of the plurality of loop units 501 , 502 , 503 , and 504 is connected to the plurality of loop units 501 , 502 , 503 , and 504 part of the other. Such a plurality of loop portions 501 , 502 , 503 , 504 can be connected to each other so that current can flow along the plurality of loop portions 501 , 502 , 503 , 504 . Therefore, when viewed from one direction in which the plurality of loop portions 501, 502, 503, and 504 are arranged, the current flowing along the plurality of loop portions 501, 502, 503, and 504 can repeatedly flow through a predetermined closed loop.

On the other hand, a plurality of contact portions 521a, 522a, 523a, and 524a that can be electrically connected to the connecting member 700 may be formed in the plurality of loop portions 501, 502, 503, and 504. For example, the plurality of contact portions 521a, 522a, 523a, and 524a may be formed in the loop portions 501, 502, 503, and 504 which are different from each other among the plurality of loop portions 501, 502, 503, and 504. In addition, the plurality of contact portions 521a, 522a, 523a, and 524a may be formed in the loop portions 501, 502, 503, and 504 different from each other so as to be spaced apart by a predetermined distance.

On the other hand, the inductor 500 may be configured such that the second inner layer support body 640 is supported by the main connection member 110 . In other words, the inductor 500 may serve as a medium in a manner of electrically connecting the main connection part 110 and the second inner layer support body 640 . In addition, the second inner layer support body 640 may be combined with the main connection part 110 through the inductor 500 . One end of such an inductor 500 may support the second inner layer support body 640 , and the other end of the inductor 500 may be fixedly supported on the main connection part 110 . In addition, one end of the inductor 500 may be coupled to a through hole 641 formed in the second inner layer support body 640 to be described later. For example, in the inductor 500 , the hole formed at the end of one side may be combined with the second inner layer supporter 640 by the second combining member 820 . On the other hand, one side of the inductor 500 may be electrically connected to the main connection member 110 , and the other side may be electrically connected to the second inner layer support body 640 .

On the other hand, although the main connecting member 110 and the second inner layer support body 640 are electrically connected by the inductor 500 in this specification, the inductor 500 may be replaced by a bracket or the like as a conductor.

On the other hand, the inductor 500 may include a loop member 510 capable of forming a plurality of loop portions 501 , 502 , 503 , and 504 , an intermediate member 520 , and a support member 530 .

The loop member 510 may have a shape extending from a predetermined reference line and returning to the aforementioned reference line when viewed from one direction. In other words, the loop member 510 may have a curved closed-loop shape extending from the intermediary member 520 and returning to the intermediary member 520 when viewed from one direction (eg, the up-down direction of FIG. 8 ). For example, the loop member 510 may include any one of a ring shape, a U-shape, and a horseshoe shape. Further, the loop member 510 may extend so as to bend a portion around a virtual axis extending in the up-down direction. However, this is merely an illustration, and a known shape may be substituted as long as it is a shape capable of forming a predetermined closed loop. A plurality of such loop members 510 may be provided, one end of the loop member 510 may be connected to one of the plurality of loop members 510 through the intermediary member 520, and the other end of the loop member 510 may be connected to one of the plurality of loop members 510. The intermediary part 520 is an intermediary connected to another of the plurality of loop parts 510 . In addition, the plurality of loop parts 510 may include a first loop part 511 , a second loop part 512 and a third loop part 513 . In addition, the first loop member 511, the second loop member 512, and the third loop member 513 may be arranged to be spaced apart in one direction. On the other hand, although three loop members 510 are shown in the drawings of this specification, this is only an example, and any number of loop members 510 may be provided.

One end of the media member 520 may be connected to one of the plurality of loop members 510 and the other end of the plurality of loop members 510 may be connected to another or support member 530 adjacent to the aforementioned one. In addition, a plurality of intermediary parts 520 may be provided, and the plurality of intermediary parts 520 may include a first intermediary part 521 , a second intermediary part 522 , a third intermediary part 523 , and a fourth intermediary part 524 . In addition, the first intermediary member 521, the second intermediary member 522, the third intermediary member 523, and the fourth intermediary member 524 may extend in the same direction as one direction or a direction shifted from such one direction. Such a plurality of intermediary parts 520 may be connected between adjacent parts of the plurality of loop parts 510 so that current flows through at least a part of the plurality of loop parts 510 . On the other hand, although four media members 520 are shown in the drawings of this specification, this is only an example, and any number of media members 520 may be provided.

In addition, a plurality of contact portions 521a, 522a, 523a, and 524a that can be connected to the connecting member 700 may be formed on the plurality of intermediary members 521, 522, 523, and 524. The plurality of contact portions 521a, 522a, 523a, and 524a may include a first contact portion 521a, a second contact portion 522a, a third contact portion 523a, and a fourth contact portion 524a.

The first contact portion 521a, the second contact portion 522a, the third contact portion 523a, and the fourth contact portion 524a may be formed on the first intermediary member 521, the second intermediary member 522, the third intermediary member 523, and the third intermediary member 523, respectively. Four media components 524 . In addition, at least a part of the first contact part 521 a , the second contact part 522 a , the third contact part 523 a and the fourth contact part 524 a can be electrically connected by the connecting member 700 .

The support member 530 may be connected to the media member 520 in such a manner that current flows through the loop member 510 and the media member 520 . In addition, one end of the support member 530 may be connected to the media member 520 , and the other end may be connected to the main connection member 110 or the second inner layer support body 640 . A plurality of such support members 530 may be provided, and the plurality of support members 530 may include a first support member 531 and a second support member 532 . In addition, the plurality of support members 530 may be connected to a part of the edges arranged in the plurality of media members 520 . For example, one of the plurality of supporting members 530 connected to the main connecting member 110 may be connected to the intermediate member 520 arranged on the lower side edge of the plurality of intermediate members 520 . In addition, one of the plurality of support members 530 connected to the second inner layer support body 640 may be connected to the media member 520 arranged on the upper edge of the plurality of media members 520 . On the other hand, the support member 530 may have a shape corresponding to at least a part of the shape of the loop member 510 .

Next, the first loop portion 501 , the second loop portion 502 , the third loop portion 503 , and the fourth loop portion 504 will be described with reference to FIGS. 9 and 10 .

The first loop portion 501 may include a portion of the first loop member 511 , at least a portion of the first media member 521 and the first support member 531 . Such a first loop portion 501 may be arranged on the uppermost side, and may be connected to the second loop portion 502 . Also, at least a part of the first support member 531 may have a shape corresponding to another part of the first loop portion 501 . Such a first loop portion 501 may have a first contact portion 521a.

The second loop part 502 may include another part of the first loop part 511 , a second intermediate part 522 , and a certain part of the second loop part 512 . One side of such a second loop portion 502 may be connected to the first loop portion 501 , and the other side of the second loop portion 502 may be connected to the third loop portion 503 . Such a second loop portion 502 may have a second contact portion 522a.

The third loop part 503 may include another part of the second loop part 512 , a third intermediate part 523 , and a certain part of the third loop part 513 . One side of such a third loop portion 503 may be connected to the second loop portion 502 , and the other side of the third loop portion 503 may be connected to the fourth loop portion 504 . Such a third loop portion 503 may have a third contact portion 523a.

The fourth loop part 504 may include another part of the third loop part 513 , at least a part of the fourth intermediary part 524 and the second support part 532 . Such a fourth loop portion 504 may be arranged on the lowermost side, and may be connected to the third loop portion 503 . Further, at least a part of the second support member 532 may have a shape corresponding to a part of the third loop portion 503 . Such a fourth loop portion 504 may have a fourth contact portion 524a.

The aforementioned first loop portion 501 , second loop portion 502 , third loop portion 503 , and fourth loop portion 504 may have shapes corresponding to each other, and may be electrically connected to each other. Therefore, the current transmitted from the main connection member 110 to the fourth loop portion 504 can flow through the third loop portion 503 , the second loop portion 502 , and the first loop portion 501 in sequence and flow to the second inner layer support body 640 .

On the other hand, the inductor 500 may further include a support frame 505 for combining with the second inner layer support body 640 . Such a support frame 505 may be disposed between one end of the inductor 500 and the second inner layer support body 640 . In this way, the inductor 500 can be combined with the second inner layer support body 640 by the support frame 505 . However, this is only an example, and the inductor 500 and the second inner layer support body 640 may be directly bonded.

The engagement member 700 may be configured to be able to change the position of coupling to the inductor 500 to adjust the current ratio by changing the path of the current flowing through the inductor 500 . Here, the current ratio is defined as the ratio of the first current to the second current. On the other hand, the engagement member 700 may be selectively coupled to the inductor 500 . In addition, the connecting member 700 may be coupled to the inductor 500 in a manner of connecting at least a part of the plurality of contact portions 521a, 522a, 523a, and 524a. An example in which the connecting member 700 changes the path of the current flowing through the inductor 500 will be described in detail below.

Referring to FIG. 8 , the connecting member 700 may be connected to the first contact portion 521a, the second contact portion 522a, the third contact portion 523a, and the fourth contact portion 524a. At this time, current may flow along the first inductor path P1. Here, the first inductor path P1 may be a path including the first supporting part 531 , the intermediary part 520 , the connecting part 700 and the second supporting part 532 . At this time, the current may flow from the second support member 532 to the first support member 531 without passing through a part of the plurality of loop members 510 and the plurality of medium members 520 .

As another example, referring to FIG. 11 , the engaging member 700 may be connected with the first contact part 521a, the second contact part 522a and the third contact part 523a. At this time, current may flow along the second inductor path P2. Here, the second inductor path P2 may further include a loop part 510 and an intermediary part 520 on the basis of the first inductor path P1. Therefore, the second inductor path P2 is longer than the first inductor path P1, and the magnitude of the current flowing along the second inductor path P2 may be smaller than the magnitude of the current flowing along the first inductor path P1.

As yet another example, referring to FIG. 12 , the engaging member 700 may be connected with the first contact part 521a and the second contact part 522a. At this time, current may flow along the third inductor path P3. Here, the third inductor path P3 may further include a loop part 510 and an intermediary part 520 on the basis of the second inductor path P2. Therefore, the third inductor path P3 is longer than the second inductor path P2, and the magnitude of the current flowing along the third inductor path P3 may be smaller than the magnitude of the current flowing along the second inductor path P2.

As yet another example, referring to FIG. 13 , the engaging member 700 is not connected to the plurality of contact portions 521a, 522a, 523a, and 524a, or is connected to any one of the plurality of contact portions 521a, 522a, 523a, and 524a. At this time, current may flow along the fourth inductor path P4. Here, the fourth inductor path P4 may further include a loop part 510 and an intermediary part 520 on the basis of the third inductor path P3. Therefore, the fourth inductor path P4 is longer than the third inductor path P3, and the magnitude of the current along the fourth inductor path P4 may be smaller than the magnitude of the current flowing along the third inductor path P3.

Therefore, as the number of the contact portions 521a, 522a, 523a, and 524a electrically connected to the connecting member 700 increases, the current flowing through the inductor 500 flows along a shorter path, and the magnitude of the current flowing through the inductor 500 increases. Increase. In addition, as the magnitude of the current flowing through the inductor 500 increases, the value of the first current flowing through the inner coil assembly 400 increases, while the value of the second current flowing through the outer coil assembly 300 decreases. On the other hand, the current ratio when the connecting member 700 is electrically connected to two or more of the plurality of contact portions 521a, 522a, 523a, and 524a may be greater than that when the connecting member 700 is not electrically connected to the contact portions 521a, 522a, 523a, and 524a. current ratio during sexual connection.

In this way, the magnitude of the current flowing through the outer-layer coil assembly 300 and the inner-layer coil assembly 400 can be adjusted according to the position where the connecting member 700 is coupled to the inductor 500 .

Referring again to FIGS. 1 to 4 , the support portion 600 can support one or more of the outer-layer coil assembly 300 , the inner-layer coil assembly 400 , and the inductor 500 . Such a support part 600 may include an outer layer support body 610 , a connection support body 620 , a first inner layer support body 630 and a second inner layer support body 640 .

The outer layer supporter 610 may support the outer layer coil assembly 300 . Such an outer layer support 610 can be fixedly supported by a fixing portion (not shown) in the plasma processing apparatus. In addition, a plurality of outer layer support bodies 610 may be provided, and the plurality of outer layer support bodies 610 may support the outer layer coil assembly 300 . Fastening holes 611 for coupling the outer layer support body 610 and the connection support body 620 may be formed in such an outer layer support body 610 .

A first coupling member 810 to be described later can be inserted into the fastening hole 611 . For example, the fastening hole 611 may be formed with an internal thread that can engage with the external thread of the first coupling member 810 . Therefore, when the first coupling member 810 is inserted into the fastening hole 611 and the coupling hole 621 to be described later and fastened to the fastening hole 611 and the coupling hole 621 , the outer layer support body 610 can be coupled with the connection support body 620 .

Referring to FIG. 14 , the connection support body 620 may be supported on the outer layer support body 610 and may support the first inner layer support body 630 . A part of such a connection support body 620 may be provided so as to be able to be bonded to the outer layer support body 610 . In other words, a part of the connecting support body 620 may be combined with the outer layer support body 610 by the first combining member 810 . Also, another part of the connection support body 620 may be formed to be bent relative to a part coupled to the outer layer support body 610 and may support the first inner layer support body 630 . A coupling hole 621 into which the first coupling member 810 can be inserted and a guide groove 622 into which a guide protrusion 631 to be described later can be inserted may be formed in such a connection support body 620 .

A plurality of coupling holes 621 may be provided, and the plurality of coupling holes 621 may be arranged in the connection support body 620 along a direction parallel to the virtual plane in which the inner layer coil assembly 400 extends. In addition, the plurality of coupling holes 621 may be arranged to be radially spaced apart from one of the plurality of coupling holes 621 . The first coupling member 810 can be inserted into any one of the plurality of coupling holes 621 . On the other hand, one of the plurality of coupling holes 621 may be located at a position corresponding to the fastening hole 611 of the outer layer support body 610 , so that the connection support body 620 is coupled to the outer layer support body 610 . At this time, the first coupling member 810 is inserted through the fastening hole 611 and the coupling hole 621, so that the connection support body 620 and the outer layer support body 610 can be combined with each other.

On the other hand, the connection support body 620 may be configured to be able to change the bonding position relative to the outer layer support body 610 to adjust the relative position of the first inner layer support body 630 relative to the outer layer support body 610 . For example, the horizontal position of the first inner layer support body 630 relative to the outer layer support body 610 on a virtual plane parallel to the ground may be adjusted according to the position where the connection support body 620 is combined with the outer layer support body 610 .

In this way, the position of the connection support body 620 is adjusted in a state where the outer layer support body 610 is fixed, so that the inner layer coil assembly 400 can move independently of the outer layer coil assembly 300 .

In addition, by adjusting the joint position of the connection support body 620 and the outer layer support body 610 , the relative horizontal position of the inner layer coil assembly 400 with respect to the outer layer coil assembly 300 can be adjusted.

In addition, the inner layer coil assembly 400 is moved to one side relative to the outer layer coil assembly 300, so that the weight center of the coil assembly can be moved to one side, and the plasma density inside the chamber can be adjusted.

Referring to FIG. 14 , the guide grooves 622 may be formed in the connection support body 620 in such a manner that the guide protrusions 631 of the first inner layer support body 630 can be inserted. In addition, the guide groove 622 may provide a portion for the guide protrusion 631 of the first inner layer support body 630 to be fixedly supported to the connection support body 620 . In addition, the guide groove 622 may be formed to extend in one direction (eg, the up-down direction of FIG. 15 ), and may guide the movement of the guide protrusion 631 .

The first inner layer supporter 630 may support the inner layer coil assembly 400 . One end of such a first inner layer support body 630 may be connected to one of the plurality of connection supports 620 , and the other end of the first inner layer support body 630 may be connected to one of the plurality of connection supports 620 . another connection. In addition, the first inner layer support body 630 may be configured to be capable of changing the position relative to the outer layer support body 610 to adjust the relative position of the inner layer coil assembly 400 relative to the outer layer coil assembly 300 . Such a first inner layer support body 630 may be provided with a guide protrusion 631 slidably provided in the guide groove 622 of the connection support body 620 .

Referring to FIG. 15 , the guide protrusion 631 may be inserted into the inner side of the guide groove 622 and moved. In addition, the guide protrusion 631 can be fixedly supported on the connecting support body 620 by the guide groove 622 , so that the first inner layer support body 630 can be fixedly supported on the connecting support body 620 . Such guide protrusions 631 can move in the direction in which the guide grooves 622 extend. For example, in order to adjust the relative height of the first inner layer support body 630 with respect to the connection support body 620 , the guide protrusion 631 may move in one direction inside the guide groove 622 .

The second inner layer supporter 640 may support the inner layer coil assembly 400 and may be electrically connected with the inner layer coil assembly 400 . One end of the second inner layer support body 640 can be connected to the first inner layer coil 410 by the first inner layer connecting member 131 , and the other end of the second inner layer support body 640 can be connected by the second inner layer The component 132 is connected to the second inner layer coil 420 . In addition, the central portion of the second inner layer support body 640 can be fixedly supported on the main connecting member 110 by the inductor 500 , and can be electrically connected with the main connecting member 110 . On the other hand, through holes 641 for coupling the second inner layer support body 640 and the inductor 500 may be formed in the second inner layer support body 640 .

A plurality of through holes 641 may be provided, and the second coupling member 820 may be inserted into any one of the plurality of through holes 641 . In addition, the plurality of through holes 641 may be formed in the second inner layer support body 640 so as to be separated by the same distance as the separation distance between the plurality of coupling holes 621 . For example, at least a part of the plurality of through holes 641 may be arranged at positions corresponding to the plurality of coupling holes 621 .

On the other hand, the second inner layer support body 640 may be configured to be able to change the bonding position with respect to the inductor 500 to adjust the relative position with respect to the inductor 500 . For example, according to the position where the second inner layer supporting body 640 is bonded to the inductor 500 , the horizontal position of the second inner layer supporting body 640 relative to the inductor 500 on a virtual plane parallel to the ground may be adjusted.

The connecting member 700 can be configured to be able to change the position of coupling to the inductor 500 to adjust the magnitude of the current flowing through the outer coil assembly 300 and the inner coil assembly 400 by changing the path of the current flowing through the inductor 500 .

4 and 16 , the coupling part 800 may include a first coupling part 810 capable of coupling the outer layer supporter 610 and the connection supporter 620 , and a second coupling part 820 capable of coupling the second inner layer supporter 640 and the inductor 500 .

The first coupling member 810 can pass through one of the plurality of coupling holes 621 and engage with the fastening hole 611 to join the outer support body 610 and the connection support body 620 . In addition, in the case of the first coupling member 810 , the coupling hole 621 to be inserted may be changed according to the position where the connection support 620 is coupled to the outer layer support 610 . For example, as shown in FIG. 16 , the first coupling member 810 may be inserted into the coupling hole 621 formed in the center of the plurality of coupling holes 621 and engaged with the fastening hole 611 . As another example, as shown in FIG. 17 , when the connection support body 620 and the first inner layer support body 630 move to the right relative to the outer layer support body 610 , the first combination member 810 may be inserted into a plurality of combination holes 621 to form The coupling hole 621 on the left side is engaged with the fastening hole 611 .

The second coupling member 820 may be coupled to the inductor 500 and the second inner layer support 640 by penetrating through one of the plurality of through holes 641 and engaging with the inductor 500 . In addition, as for the second coupling member 820 , the through hole 641 to be inserted may be changed according to the position where the second inner layer support body 640 is coupled to the inductor 500 . For example, as shown in FIG. 16 , the second coupling member 820 may be inserted into the through hole 641 formed in the center portion of the plurality of through holes 641 and engaged with the inductor 500 . As another example, as shown in FIG. 17 , when the second inner layer support body 640 moves to the right with respect to the inductor 500 , the second coupling member 820 may be inserted into the through hole 641 formed on the left side among the plurality of through holes 641 and engage with the inductor 500 . The positions where the second coupling member 820 is inserted into the plurality of through holes 641 may correspond to the positions where the first coupling member 810 is inserted into the plurality of coupling holes 621 . Therefore, the connection support body 620 , the first inner layer support body 630 and the second inner layer support body 640 can move the same distance in the same direction and be supported on the outer layer support body 610 and the inductor 500 . Thereby, the relative position of the inner layer coil assembly 400 with respect to the outer layer coil assembly 300 can be adjusted.

Although the embodiments of the present invention have been described above as specific embodiments, these are merely examples, the present invention is not limited thereto, and should be construed to have the broadest scope based on the underlying ideas disclosed in this specification. Those skilled in the art to which the present invention pertains can combine/replace the disclosed embodiments to implement patterns in shapes not shown, again without departing from the scope of the present invention. In addition, those with ordinary knowledge in the technical field to which the present invention pertains can easily implement changes or modifications to the disclosed embodiments based on this specification. Obviously, such changes or modifications also belong to the scope of the present invention.

1: Plasma antenna module 2: Power supply part 100: Connection part 110: Main connecting parts 120: Outer connecting parts 121: The first outer layer connecting part 122: Second outer layer connecting part 123: The third outer connecting part 130: Internal connection parts 131: The first inner layer connecting part 132: Second inner layer connecting part 200: Grounding module 210: Outer grounding part 211: The first outer layer is grounded 212: Second outer ground 213: The third outer layer is grounded 220: Inner grounding part 221: The first inner layer is grounded 222: The second inner layer is grounded 300: Outer Coil Assembly 310: First outer coil 320: Second outer coil 330: Third outer coil 400: Inner Coil Assembly 410: First inner coil 420: Second inner coil 500: Inductor 501: First Ring Road Department 502: Second Ring Road Department 503: Third Ring Road Department 504: Fourth Ring Road Department 510: Loop Components 520: Media Parts 521: First media component 522: Second media component 523: Third media component 524: Fourth Media Component 521a: first contact part 522a: Second contact part 523a: The third contact part 524a: Fourth contact part 530: Support parts 600: Support Department 610: Outer support 611: Fastening holes 620: Connect the support 621: binding hole 630: First inner layer support 631: Guide protrusion 640: Second inner layer support 641: Through hole 700: Connecting parts 800: Joint 810: First bonding part 820: Second binding part C: divergence point P1: First Inductor Path P2: Second Inductor Path P3: Third Inductor Path P4: Fourth Inductor Path

1 is a perspective view of a plasmonic antenna module according to an embodiment of the present invention. [ Fig. 2 ] is a bottom perspective view of Fig. 1 . [ Fig. 3 ] is an exploded perspective view of Fig. 1 . [ Fig. 4 ] is a front view of Fig. 1 . [ Fig. 5] Fig. 5 is a conceptual diagram showing how the inductor of Fig. 1 is connected to the inner-layer coil assembly. [ Fig. 6] Fig. 6 is a conceptual diagram showing a state in which the inductor of Fig. 1 is connected to the outer-layer coil assembly. [ Fig. 7 ] is a conceptual diagram showing how the inductor of Fig. 1 is connected to the outer-layer coil assembly and the inner-layer coil assembly. [ Fig. 8] Fig. 8 is a perspective view of the inductor of Fig. 1 . [ Fig. 9] Fig. 9 is an exploded perspective view of the inductor of Fig. 8 . [ Fig. 10] Fig. 10 is an exploded perspective view of a plurality of loop portions of Fig. 8 . 11 is a perspective view showing an appearance of the connection member of FIG. 8 being connected to the second contact portion, the third contact portion, and the fourth contact portion. [ Fig. 12 ] A perspective view showing a state in which the engagement member of Fig. 8 is connected to the third contact portion and the fourth contact portion. [ Fig. 13 ] A perspective view showing a state in which the connecting member of Fig. 8 is not connected to the inductor. [ Fig. 14 ] is an enlarged view of part A of Fig. 3 . 15 is an enlarged view of a portion A when the connection support body of FIG. 1 is raised with respect to the first inner layer support body. [ Fig. 16 ] is a bottom view of Fig. 1 . 17 is a bottom view of the connection support body, the first inner layer support body, and the second inner layer support body of FIG. 1 when they are moved.

1: Plasma antenna module

2: Power supply part

100: Connection part

200: Grounding module

210: Outer grounding part

211: The first outer layer is grounded

212: Second outer ground

213: The third outer layer is grounded

220: Inner grounding part

221: The first inner layer is grounded

222: The second inner layer is grounded

300: Outer Coil Assembly

310: First outer coil

320: Second outer coil

330: Third outer coil

400: Inner Coil Assembly

410: First inner coil

420: Second inner coil

500: Inductor

600: Support Department

610: Outer support

620: Connect the support

630: First inner layer support

640: Second inner layer support

700: Connecting parts

C: divergence point

Claims (19)

A plasma antenna module, comprising: an inner layer coil assembly, at least a portion of which extends on the virtual plane and is capable of flowing a first current; an outer-layer coil assembly having a shape spaced apart from the inner-layer coil assembly and extending in a direction surrounding the inner-layer coil assembly when viewed from a direction perpendicular to the aforementioned virtual plane, and capable of causing a second current to flow; an inductor electrically connected to the outer coil assembly and the inner coil assembly; and an engagement member capable of being selectively coupled to the aforementioned inductor; The engagement member is configured to be able to change the position of coupling to the inductor to adjust a current ratio as a ratio of the first current to the second current by changing the path of the current flowing through the inductor. The plasma antenna module of claim 1, wherein, The aforementioned inductor has a plurality of loop portions arranged in one direction; The aforementioned loop portion extends in a direction around a virtual axis extending in the aforementioned one direction; A plurality of contact portions capable of being electrically connected to the connecting member are formed on the plurality of loop portions; The plurality of contact portions are formed in different loop portions among the plurality of loop portions. The plasma antenna module of claim 1, wherein, The aforementioned inductors include: a plurality of loop elements arranged spaced apart in one direction; and a plurality of media members extending in the same direction as the aforesaid one direction or a direction staggered from the aforesaid one direction; One end of a part of the media members of the plurality of media members can be connected to one of the loop members of the plurality of loop members, and the other end of the plurality of loop members can be connected to the loop member of the plurality of loop members. One loop element is connected adjacent to another loop element. The plasma antenna module of claim 3, wherein, The aforementioned loop member has a closed loop shape extending from and returning to the aforementioned media member when viewed from the aforementioned one direction. The plasma antenna module of claim 3, wherein, The aforementioned inductor further includes a support member, at least a portion of which has a shape corresponding to the shape of the aforementioned loop member; One end of the plurality of media members can be connected to one of the loop members, and the other end can be connected to the loop member of the plurality of loop members. The adjacent another loop member or the aforementioned support member is connected. The plasma antenna module of claim 2, wherein, As the number of the contact parts electrically connected to the connecting member increases, the value of the first current increases, and the value of the second current decreases. The plasmonic antenna module of claim 6, wherein, The current ratio when the connecting member is electrically connected to two or more of the plurality of contact portions is greater than the current ratio when the connecting member is not electrically connected to the contact portion. The plasma antenna module of claim 1, wherein, The inner-layer coil assembly is disposed inside the outer-layer coil assembly. The plasma antenna module of claim 1, wherein, provided with more than one of the aforementioned inductors; The outer layer coil assembly and the inner layer coil assembly are connected in parallel to a power supply unit for supplying power from the outside. The plasma antenna module of claim 9, further comprising: a connection part, which is electrically connected with the outer layer coil assembly and the inner layer coil assembly, and has a branch point; the first current flows along a first path from the power supply part through the branch point and toward the inner-layer coil assembly; the second current flows along a second path from the power supply part through the branch point and toward the outer-layer coil assembly; The one or more inductors are disposed on one or more paths among the first path and the second path. The plasmonic antenna module of claim 10, wherein, The one or more inductors are arranged on the first path, and the one or more inductors are connected in series with the inner-layer coil assembly by connecting one side to the inner-layer coil assembly. The plasmonic antenna module of claim 10, wherein, The one or more inductors are disposed on the second path, and the one or more inductors are connected in series with the outer-layer coil assembly by connecting one side to the outer-layer coil assembly. The plasmonic antenna module of claim 10, wherein, The aforementioned outer layer coil assembly includes a plurality of outer layer coils; The aforementioned inner layer coil assembly includes a plurality of inner layer coils; The aforementioned plasma antenna module is provided with a plurality of the aforementioned more than one inductors; a portion of the plurality of the aforementioned inductors is connected in series with at least a portion of the aforementioned at least a portion of the plurality of outer layer coils by having one side connected to at least a portion of the aforementioned plurality of outer layer coils; Another portion of the plurality of the aforementioned inductors is connected in series with the aforementioned at least a portion of the aforementioned at least a portion of the plurality of aforementioned inner layer coils by having one side connected to at least a portion of the aforementioned plurality of aforementioned inner layer coils. A plasma antenna module, comprising: an inner layer coil assembly, at least a portion of which extends on the virtual plane; an outer layer coil assembly having a shape spaced apart from the aforesaid inner layer coil assembly and extending in a direction surrounding the aforesaid inner layer coil assembly when viewed from a direction perpendicular to the aforesaid virtual plane; and a support part, which supports the aforementioned outer-layer coil assembly and the aforementioned inner-layer coil assembly; The aforementioned support portion includes: an outer layer support body supporting the aforementioned outer layer coil assembly; a first inner layer support that supports the aforementioned inner layer coil assembly; and a connecting support body, one side of which can be combined with the aforementioned outer layer support body, and the other side can be combined with the aforementioned first inner layer support body; The aforementioned plasmonic antenna module further includes a first combining member, and the first combining member is used for combining the aforementioned outer layer support body and the aforementioned connecting support body; A plurality of coupling holes for selectively inserting the first coupling member are formed in the connection support; The plurality of aforementioned coupling holes are arranged in a direction parallel to the aforementioned virtual plane, and are arranged to be radially spaced apart from a certain one of the plurality of aforementioned coupling holes; and Depending on which of the plurality of coupling holes the first coupling member is inserted into, the position of the coupling between the connection support and the outer support is changed, so that the inner layer can be adjusted relative to the outer coil assembly. The relative position of the coil assembly adjusts the relative position with respect to the aforementioned outer layer support body in a direction parallel to the aforementioned virtual plane of the aforementioned first inner layer support body. The plasma antenna module of claim 14, further comprising: a main connecting part, which can be electrically connected with the aforementioned inner layer coil assembly; The aforementioned support portion further includes a second inner layer support body supporting the aforementioned inner layer coil assembly; The second inner layer support body is formed with a through hole into which a second coupling member can be inserted to be electrically connected to the main connection member. The plasma antenna module of claim 15, further comprising: an inductor, which becomes a medium for enabling the electrical connection between the main connecting member and the inner-layer coil assembly; The second inner layer support body is combined with the main connecting member through the inductor. The plasmonic antenna module of claim 16, wherein, A plurality of the aforementioned coupling holes are formed on the aforementioned connecting support body; A plurality of the through-holes are formed in the second inner-layer support body so that the spacing distance is the same as the spacing distance between the plurality of the coupling holes. The plasmonic antenna module of claim 17, wherein, At least a part of the plurality of the coupling holes and the plurality of the through holes are arranged at positions corresponding to each other. The plasmonic antenna module of claim 14, wherein, A guide protrusion is formed protrudingly on the first inner layer support body; A guide groove for guiding the movement of the guide protrusion in one direction is formed in the connection support body so that the guide protrusion can be inserted; The first inner layer support body is configured to be movable in the one direction of the guide groove by the guide protrusion and fixedly supported by the connection support body to adjust the position relative to the connection support body in the one direction.

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