TWI778541B - Probe module - Google Patents

Abstract

The disclosure relates to a probe module adapted to be disposed in an assembly hole of a first strengthening board. An inner wall of the assembly hole is formed with an inner flange. The probe module includes a second strengthening board and an electric circuit board. The second strengthening board has an outer flange which has a physical area and multiple gap areas. The physical area is adapted to be against the inner flange of the assembly hole. The electric circuit board is disposed beneath the second strengthening board. The electric circuit board has a bottom surface. Multiple conductors and multiple probes are disposed on the bottom surface, and at least one of conductors is electrically connected to one of the probes.

Description

Probe Module

The present invention relates to a probe module suitable for semiconductor testing.

In the current wafer-level semiconductor testing methods, probing is a common method, and in the testing device used to perform probing, the probe card is the most critical main component. For example, the Republic of China Patent No. I425218, the probe card assembly provided by the patent mainly includes a circuit substrate, a reinforcement plate fixed on the circuit substrate, and an adjustment plate arranged on the reinforcement plate to be fixed under the adjustment plate. The probe head assembly. The probe head assembly passes through the central through hole of the circuit substrate and the central through hole of the reinforcement board. The probe head assembly mainly includes a probe insert provided with a plurality of probes, and an insert support which carries the probe insert and is fastened by screws. The probes are located under the circuit substrate and are used to touch the object to be tested, and are electrically connected to the connectors on the circuit substrate through a plurality of conductive pins and wires, and then communicate with a tester through the connectors. The machine is electrically connected.

The aforementioned probe head module is locked to the adjustment plate by a plurality of bolts and nuts, the adjustment plate is fixed to the reinforcement plate by a plurality of locking screws, and the plurality of adjustment screws pass through the adjustment plate and abut against the adjustment plate Reinforcement board. When the locking screws do not tighten the adjustment plate against the reinforcement plate, so that there is a gap between the adjustment plate and the reinforcement plate, the adjustment screws can be rotated by the user to make the adjustment plate there The position is close to or far away from the reinforcement board, so it takes time to adjust the orientation of the reinforcement board relative to the circuit substrate, so as to correct the orientation of the probes relative to the object to be tested, so that the needle tips of the probes are relative to the object to be tested. The test object has acceptable flatness.

However, due to the complicated structure of the above-mentioned probe card, it is time-consuming to assemble and difficult to disassemble, which causes considerable inconvenience to semiconductor inspectors.

The present invention provides a probe module, which can be arranged in an installation hole of a first reinforcing plate, and the inner wall of the installation hole has an inner flange. The probe module includes a second reinforcing plate and a circuit substrate. The second reinforcing plate has an outer flange, the outer flange includes a solid area and a plurality of notch areas, and the solid area is used for abutting against the inner flange of the mounting hole of the first reinforcing plate. The circuit substrate is disposed under the second reinforcing plate, and has a lower surface. The lower surface is provided with a plurality of conductors and a plurality of probes, and at least one of the conductors is electrically connected to one of the probes.

The probe module of the present invention can improve the problem that the probe module of the prior art is difficult to assemble and disassemble.

In the following embodiments, "up" or "down" is only used to describe the orientation shown in the drawings, and does not limit the actual orientation.

first embodiment

Referring to FIGS. 1A to 4 , an exemplary probe card 800 is shown, wherein the probe card 800 is formed by combining the probe card assembly 100 and the test circuit board 81 .

The probe card assembly 100 mainly includes a first reinforcing plate 11 , a fixed frame 12 , a probe module 13 and a sliding frame 14 . The first reinforcing plate 11 includes an upper surface 11a, a lower surface 11b and a mounting hole 11c, and the inner wall of the mounting hole 11c has an inner flange 11d. The first reinforcing plate 11 can be made of a metal material, such as aluminum or aluminum alloy or other metal materials, and is used for bonding to one side of the test circuit board 81 (as shown in FIG. 3 and FIG. 4 ) to strengthen the test circuit board 81 . rigidity. The fixing frame 12 is disposed on the upper surface 11a of the first reinforcing plate 11 and surrounds the mounting hole 11c. The probe module 13 is disposed in the mounting hole 11c, and includes an upper surface 13a, a lower surface 13b, and an outer flange 13d located between the upper surface 13a and the lower surface 13b. The outer flange 13d includes a solid area 13e and a plurality of notched areas 13f (four notched areas 13f are drawn in the figure), and the solid area 13e of the outer flange 13d abuts against the inner flange 11d of the first reinforcing plate 11 . As shown in FIG. 1B , the probe module 13 includes an upper cover 131 , a second reinforcing plate 133 and a circuit substrate 134 in sequence from top to bottom, wherein the outer flange 13d of the probe module 13 is located on the second reinforcing plate 133 , the upper surface 13a and the lower surface 13b of the probe module 13 are located on the upper cover 131 and the circuit substrate 134, respectively. The upper surface of the circuit substrate 134 is fixedly connected to the lower surface of the second reinforcing plate 133 .

The sliding frame body 14 is disposed on the inner wall of the fixed frame body 12 and can slide along an axial direction D1 (the direction indicated by the arrow in FIG. 3 and FIG. 4 ) to the release position (the state shown in FIG. 3 and FIG. 6 ) and between the fixed positions (as shown in Figure 4 and Figure 7). The inner wall of the sliding frame body 14 is provided with a plurality of pressing parts 141 (four pressing parts 141 are drawn in the drawing). When the sliding frame body 14 is in the release position as shown in FIG. In each notch area 13f of the outer flange 13d of the needle module 13, when the sliding frame body 14 is in the fixed position as shown in FIG. .

Through the above embodiment, the assembly and disassembly of the probe module 13 can be realized only by controlling the sliding of the sliding frame body 14 relative to the fixed frame body 12 along the axial direction D1. When the assembly process is to be performed, the sliding frame body 14 can be firstly slid along the axial direction D1 to the release position as shown in FIG. Afterwards, the assembly of the probe module 13 can be completed by simply sliding the sliding frame body 14 along the axial direction D1 to the fixed position as shown in FIG. 4 . Similarly, when personnel want to disassemble the probe module 13, they only need to reverse the above-mentioned assembly procedure.

In some embodiments, the outer flange 13d of the probe module 13 includes a first side 13g and a second side 13h which are opposite to and parallel to each other, and the first side 13g and the second side 13h are parallel to the axis to D1. The notch areas 13f of the outer flange 13d of the probe module 13 are respectively located on the first side 13g and the second side 13h, and the number of notch areas 13f on the first side 13g is equal to the number of notches on the second side 13h The number of areas 13f. In addition, each notch area 13f individually corresponds to one pressing portion 141 of the sliding frame body 14, so the number of pressing portions 141 is also equally distributed along both sides of the axial direction D1. The outer flange 13d of the probe module 13 is located on the second reinforcing plate 133 .

6 and 7 again, in some embodiments, each pressing portion 141 of the sliding frame body 14 includes a housing 1411 , an elastic body 1412 and a roller 1413 . The casing 1411 is fastened to the inner wall of the sliding frame body 14, and has an opening 1411a and an end wall 1411b opposite to the opening 1411a. The elastic body 1412 is disposed in the casing 1411 , one end is fixedly connected to the end wall 1411 a , and the other end is connected to the roller 1413 . In addition, the solid region 13e of the outer flange 13d of the probe module 13 further includes a plurality of ramp structures 13s, and the ramp structures 13s are adjacent to the respective notch regions 13f individually.

When the sliding frame 14 is in the release position as shown in FIG. 3 and FIG. 6 , the position of the pressing portion 141 is located above the notch area 13f of the outer flange 13d of the probe module 13 , that is, the roller 1413 is not in contact The solid region 13e of the outer flange 13d of the probe module 13 is formed. At this time, the elastic body 1412 is not compressed, and the lower edge of the roller 1413 is also slightly lower than the upper surface of the solid region 13e of the outer flange 13d of the probe module 13 . When the sliding frame 14 is pushed to slide from the release position to the fixed position, the rollers 1413 of each pressing portion 141 move and climb from the corresponding notch area 13f along the surface of the ramp structure 13s, and then move to the surface of the outer flange 13d. Physical area 13e. When the sliding frame body 14 is in the fixed position as shown in FIG. 4 and FIG. 7 , the elastic body 1412 is in a compressed state, so that the roller 1413 exerts a downward pressure on the solid area 13e of the outer flange 13d, thereby causing the probe module 13 It is fixed in the mounting hole 11c of the first reinforcing plate 11 .

1A and FIG. 2 , in some embodiments, the fixed frame 12 has a through hole 121 , and the sliding frame 14 includes a handle portion 142 passing through the through hole 121 . The through hole 121 has a first inner wall surface 121 a and a second inner wall surface 121 b opposite to each other. When the sliding frame 14 is in the release position as shown in FIG. 3 , the handle portion 142 abuts against the first inner wall surface 121 a of the through hole 121 . . When the sliding frame body 14 is in the fixed position as shown in FIG. 4 , the handle portion 142 abuts against the second inner wall surface 121 b of the through hole 121 .

Referring to FIG. 5 , in some embodiments, the inner wall of the fixed frame body 12 is further provided with at least one positioning bead 125 , and the outer wall of the sliding frame body 14 is further provided with at least one positioning hole 145 , and the positioning bead 125 can be positioned along the fixed frame body 12 . When the sliding frame 14 is in the fixed position shown in FIG. 4 , the positioning balls 125 of the fixing frame 12 will be inserted into the positioning holes 145 of the sliding frame 14 . It should be noted that the positions of the positioning beads 125 and the positioning holes 145 can also be interchanged.

Second Embodiment

Please refer to FIGS. 8A , 8B, 9 and 14, which illustrate an exemplary probe card assembly 200 and a probe card 900, wherein the probe card 900 is combined with the test circuit board 91 by the probe card assembly 200 constituted.

The probe card assembly 200 mainly includes a first reinforcing plate 21 , a fixed frame 22 , a probe module 23 and a sliding frame 24 . The first reinforcing plate 21 includes an upper surface 21a, a lower surface 21b and an installation hole 21c, and the inner wall of the installation hole 21c has an inner flange 21d. The first reinforcing plate 21 can be made of a metal material, such as aluminum or aluminum alloy or other metal materials, and is used for bonding to one side of the test circuit board 91 (as shown in FIG. 10 and FIG. 11 ) to strengthen the test circuit board 91 . rigidity. The fixing frame 22 is disposed on the upper surface 21 a of the first reinforcing plate 21 and surrounds the mounting hole 21 c. The probe module 23 is disposed in the mounting hole 21c, and includes an upper surface 23a, a lower surface 23b, and an outer flange 23d located between the upper surface 23a and the lower surface 23b. The outer flange 23d includes a solid area 23e and a plurality of notched areas 23f (six notched areas 23f are drawn in the drawing), and the solid area 23e of the outer flange 23d abuts against the upper surface of the inner flange 21d of the first reinforcing plate 21 . In addition, the upper surface of the probe module 23 is provided with a second lifting ring 239 which is convenient for personnel to extract the probe module 23 . upper surface 23a.

8B and FIG. 14 , the probe module 23 includes an upper cover 231 , a second reinforcing plate 233 and a circuit substrate 234 in sequence from top to bottom, wherein the outer flange 23d of the probe module 23 is located on the second reinforcing plate 233 , the upper surface 23 a of the probe module 23 is the upper surface of the upper cover 231 , and the lower surface 23 b of the probe module 23 is the lower surface of the circuit substrate 234 . In addition, the second lifting ring 239 is fastened to the second reinforcing plate 233 . The upper surface of the circuit substrate 234 is fixedly connected to the lower surface of the second reinforcing plate 233 .

8B , 10 and 11 , in some embodiments, the outer flange 23d of the probe module 23 includes a first side 23g and a second side 23h that are opposite and parallel to each other, and the first side 23g and the second side 23h are parallel to the axial direction D2. The notch areas 23f of the outer flange 23d of the probe module 23 are respectively located on the first side 23g and the second side 23h, and the number of notch areas 23f on the first side 23g is equal to the number of notches on the second side 23h The number of zones 23f. In addition, each notch area 23f individually corresponds to one pressing portion 241 of the sliding frame body 24, so the number of pressing portions 241 is also equally distributed along both sides of the axial direction D2. The outer flange 23d of the probe module 23 is located on the second reinforcing plate 233 .

The sliding frame body 24 is disposed on the inner wall of the fixed frame body 22 and can slide along an axial direction D2 (the direction indicated by the arrow in FIG. 10 and FIG. 11 ) between the release position (the state shown in FIG. 10 ) and the fixed position ( between the states shown in Figure 11). The inner wall of the sliding frame body 24 is provided with a plurality of pressing parts 241 (six pressing parts 241 are drawn in the drawing), when the sliding frame body 24 is in the release position as shown in FIG. Each notch area 23f of the outer flange 23d of the needle module 23, when the sliding frame body 24 is in the fixed position as shown in FIG. 11, each pressing part 241 presses the solid area 23e of the outer flange 23d of the probe module 23 .

Through the above embodiment, the assembly and disassembly of the probe module 23 can be realized only by controlling the sliding frame body 24 to slide relative to the fixed frame body 22 along the axial direction D2. When the assembly process is to be performed, the sliding frame body 24 can be firstly slid along the axial direction D2 to the release position shown in FIG. Afterwards, the assembly of the probe module 23 can be completed by simply sliding the sliding frame body 24 along the axial direction D2 to the fixed position as shown in FIG. 11 . Likewise, when personnel want to disassemble the probe module 23, they only need to reverse the above-mentioned assembly procedure.

Referring to FIGS. 10 to 14 , each pressing portion 241 of this embodiment includes a casing 2411 and a roller 2413 . The casing 2411 is fastened to the inner wall of the sliding frame 24 , and has an opening 2411 a . The roller 2413 is disposed in the casing 2411 and partially protrudes from the opening 2411 a of the casing 2411 . In addition, the solid region 23e of the outer flange 23d of the probe module 23 includes a plurality of ramp structures 23s, and the lower surface of the solid region 23e is further provided with a plurality of elastic bumps 235 (four are drawn in the drawing). Each ramp structure 23s is adjacent to each notch area 23f individually, and each elastic protrusion 235 protrudes from the lower surface of the solid area 23e so that the solid area 23e of the outer flange 23d abuts against the first reinforcing plate 21 through the elastic protrusion 235 the upper surface of the inner flange 21d.

Because the surfaces of the outer flange 23d of the probe module 23 and the inner flange 21d of the first reinforcing plate 21 may not be completely flat, the probe tips of the probe module 23 (not shown in the figure) are assembled after each other. ) were not on the same level at the time of testing. By disposing the elastic bumps 235 on the lower surface of the outer flange 23d of the probe module 23, the above problems can be solved through the elastic deformation of the elastic bumps 235. It should be noted that the elastic protrusions 235 may also be disposed on the upper surface of the inner flange 21 d of the first reinforcing plate 21 . In some embodiments, the elastic bump 235 can be realized by embedding a spring and a steel ball on the lower surface of the outer flange 23d of the probe module 23, wherein the steel ball can be changed to protrude from the outer flange through the deformation of the spring. The height of the lower surface of the 23d.

When the sliding frame body 24 is in the release position shown in FIG. 10 and FIG. 12 , the position of the rollers 2413 of each pressing part 241 is located above the notch area 23f of the outer flange 23d of the probe module 23 , that is, the rollers 2413 The lower edge of the roller 2413 is slightly lower than the upper surface of the solid area 23e of the outer flange 23d of the probe module 23 without touching the solid area 23e of the outer flange 23d of the probe module 23 . When the sliding frame body 24 is pushed to slide to the fixed position shown in FIG. 11 and FIG. 13 , the rollers 2413 of each pressing portion 241 move and climb along the surface of the ramp structure 23s from the corresponding notch area 23f, and then move to The solid region 23e applies a downward pressure to the solid region 23e. At this time, the height of the elastic bump 235 protruding from the lower surface of the outer flange 23d of the probe module 23 is reduced due to the downward pressure.

Referring to FIGS. 8A and 9 , in some embodiments, the fixed frame 22 of the probe card assembly 200 has a notch 221 , and the sliding frame 24 includes a handle portion 242 , wherein the handle portion 242 is located in the notch 221 of the fixed frame 22 and has a positioning hole 242a. The probe card assembly 200 also includes a stopper mechanism 29 disposed proximate the notch 221 . The stopper mechanism 29 includes a seat body 291 , a spring 292 and a stopper 293 . The seat body 291 is disposed opposite to the handle portion 242 and is adjacent to the notch 221 . The spring 292 (eg, a torsion spring or a V-shaped spring) is pivotally disposed on the seat body 291 . The stopper 293 is generally T-shaped and includes a first end 2931, a second end 2933 and a middle section 2932. The first end 2931 is opposite to the second end 2933 and faces the handle portion 242, and the middle section 2932 is located at the first end The spring 292 is pivotally connected between the 2931 and the second end 2933, so that the stopper 293 can use the spring 292 as a fulcrum to form a seesaw structure.

When the sliding frame 24 is in the fixed position shown in FIG. 11 , the first end 2931 of the stopper 293 rotates downward relative to the spring 292 by the elastic force of the spring 292 and abuts against the lower edge of the handle portion 242 . In this way, the sliding frame body 24 can be prevented from accidentally sliding from the fixed position to the release position. When a person wants to remove the probe module 23 , he only needs to press the second end 2933 of the stopper 293 , so that the first end 2931 of the stopper 293 is lifted and aligned with the positioning hole 242 a of the handle portion 242 . Since the size of the positioning hole 242a allows the first end 2931 of the stopper 293 to pass through the middle section 2932, the personnel can operate the handle 242 to slide the sliding frame body along the axial direction D2 to the position shown in FIG. 10 . the release position.

In some embodiments, in order to facilitate the personnel to quickly align the first end 2931 with the positioning hole 242a, the handle portion 242 is further provided with a limiting flange 242b, which is adjacent to the positioning hole 242a and located above the positioning hole 242a. When a person presses the second end 2933 of the stopper 293 to lift the first end 2931 of the stopper 293 to abut against the limiting flange 242b, the first end 2931 is just aligned with the positioning hole 242a. In this way, the personnel can quickly complete the disassembly or assembly of the probe module 23 .

8A, 8B, 9 and 14, the lower surface 23b of the circuit substrate 234 of the probe module 23 of the present embodiment is provided with a plurality of pogo pins (conductors) 237 and a plurality of probes 238, and the test circuit board 91 includes The upper surface 91a, the lower surface 91b, the through hole 91c, and the plurality of electrical contacts 917. The distance between two adjacent pogo pins 237 is greater than the distance between two adjacent probe needles 238 . The circuit substrate 234 has at least one side, and the pogo pins 237 are located between the probes 238 and the side of the circuit substrate 234 . The electrical contacts 917 of the test circuit board 91 are located on the upper surface 91a and around the through holes 91c. When the probe card assembly 200 and the test circuit board 91 are assembled to form the probe card 900, the test circuit board 91 is fixed on the bottom surface 21b of the first reinforcing plate 21 with its upper surface 91a, and the through holes 91c of the test circuit board 91 are Relative to the mounting hole 21 c of the first reinforcing plate 21 . One end of each pogo pin 237 located on the circuit substrate 234 of the probe module 23 is electrically connected to the electrical contact 917 of the test circuit board 91, and the other end is electrically connected to the circuit substrate 234 of the probe module 23, so that the test signal It can be transferred to each probe 238 from the test circuit board 91 via the circuit substrate 234 . In addition, the probes 238 of the probe module 23 protrude from the lower surface 91b of the test circuit board 91, so that when the probe card 900 is assembled on the testing machine, the probes 238 can pass through the probes on the device under test. The solder pads are electrically tested. In FIG. 14 , the pogo pins 237 are arranged around the probe pins 238 . In FIG. 14 , the pogo pins 237 are arranged in four straight lines around the probe pins 238 .

Although the present invention has been disclosed by the above examples, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the appended patent application.

100, 200: probe card assembly 800, 900: probe card 11: The first reinforcement board 11a: Upper surface 11b: lower surface 11c: Mounting holes 11d: inner flange 12: Fixed frame 121: perforation 121a: first inner wall surface 121b: Second inner wall surface 125: Positioning Beads 13: Probe module 13a: Upper surface 13b: Lower surface 13d: Outer Flange 13e: Physical area 13f: Gap area 13g: first side 13h: Second side 13s: Ramps Structure 131: upper cover 133: Second reinforcement plate 134: circuit substrate 14: Sliding frame 141: Press Department 1411: Shell 1411: Opening 1411b: End Wall 1412: Elastomers 1413: Roller 142: Handle 145: Positioning hole 21: The first reinforcing plate 21a: upper surface 21b: lower surface 21c: Mounting holes 21d: Inside flange 22: Fixed frame 221: Notch 23: Probe Module 23a: Upper surface 23b: lower surface 23d: Outer Flange 23e: Physical area 23f: Gap region 23g: first side 23h: Second side 23s: Ramps Structure 231: upper cover 233: Second reinforcement plate 234: circuit substrate 235: Elastic bump 237: Pogo Pin 238: Probe 239: Ring 24: Sliding frame 242: Handle 242a: Positioning hole 242b: Limit flange 241: Press Department 2411: Shell 2411a: Opening 2413: Roller 29: stop mechanism 291: Seat 292: Spring 293: Stopper 2931: First End 2932: Intermediate Section 2933: Second End 81, 91: Test circuit board 91a: upper surface 91b: lower surface 91c: perforation 917: Electrical Contacts D1: Axial D2: Axial

[FIG. 1A] is an exploded schematic diagram of the components of the probe card according to the first embodiment of the present invention; [FIG. 1B] is an exploded schematic diagram of the probe module according to the first embodiment of the present invention; [FIG. 2] is a schematic diagram of the combination of the probe module and the reinforcing member according to the first embodiment of the present invention; [FIG. 3] is a schematic diagram of the probe module in the released state according to the first embodiment of the present invention; [FIG. 4] is a schematic diagram of the probe module in a fixed state according to the first embodiment of the present invention; [Fig. 5] is a partial perspective view of the probe card according to the first embodiment of the present invention; [Fig. 6] is a schematic cross-sectional view of the pressing portion of the first embodiment of the present invention along the AA section line of Fig. 3; [Fig. 7] is a schematic cross-sectional view of the pressing portion of the first embodiment of the present invention along the BB section line of Fig. 4; [FIG. 8A] is a schematic diagram of components exploded in the probe card according to the second embodiment of the present invention; [FIG. 8B] is an exploded schematic diagram of the probe module according to the second embodiment of the present invention; [ Fig. 9 ] is a schematic diagram of the combination of the probe module and the reinforcing member according to the second embodiment of the present invention; [FIG. 10] is a schematic diagram of the probe module in the released state according to the second embodiment of the present invention; [FIG. 11] is a schematic diagram of the probe module in a fixed state according to the second embodiment of the present invention; [Fig. 12] is a schematic cross-sectional view of the pressing portion of the second embodiment of the present invention along the CC section line of Fig. 10; [Fig. 13] is a schematic cross-sectional view of the pressing portion of the second embodiment of the present invention along the DD section line of Fig. 11; 14 is a schematic diagram of the bottom of the probe module according to the second embodiment of the present invention.

200: Probe Card Assembly

21: The first reinforcing plate

21a: upper surface

21b: lower surface

21c: Mounting holes

21d: Inside flange

22: Fixed frame

221: Notch

23: Probe Module

23a: Upper surface

23d: Outer Flange

23e: Physical area

23f: Gap region

23g: first side

23h: Second side

23s: Ramps Structure

231: upper cover

233: Second reinforcement plate

239: Ring

24: Sliding frame

242: Handle

242a: Positioning hole

242b: Limit flange

241: Press Department

29: stop mechanism

291: Seat

292: Spring

293: Stopper

2931: First End

2932: Intermediate Section

2933: Second End

900: Probe Card

91: Test the circuit board

91a: upper surface

91b: lower surface

Claims (9)

A probe module is used to be arranged in an installation hole of a first reinforcement plate of a probe card assembly, the inner wall of the installation hole has an inner flange, and the probe module comprises: a second reinforcement The board has an outer flange, the outer flange includes a first side and a second side opposite to each other and parallel to each other, the first side and the second side of the outer flange include a solid area and a plurality of notches area, the solid area is used for abutting the inner flange of the installation hole of the first reinforcing plate, wherein when a pressing part of the probe card assembly presses the solid area, the probe module is fixed in the installation hole , when the pressing portion of the probe card assembly corresponds to the notch area, the probe module is released; and a circuit substrate, disposed under the second reinforcing plate, has a lower surface, and the lower surface is provided with A plurality of conductors and a plurality of probes, at least one of the conductors is electrically connected with one of the probes. The probe module according to claim 1, wherein the probe module has an upper surface and a lower surface, and the second reinforcing plate is located between the upper surface of the probe module and the lower surface of the probe module between. The probe module according to claim 2, wherein the lower surface of the circuit substrate is the lower surface of the probe module. The probe module according to claim 3, further comprising: an upper cover disposed on the second reinforcing plate, the upper cover has an upper surface, and the upper surface of the upper cover is on the probe module surface. The probe module of claim 1, wherein the number of the notch areas located on the first side is equal to the number of notch areas located on the second side. The probe module of claim 5, wherein the solid area of the outer flange of the second reinforcing plate includes a plurality of ramp structures, and the ramp structures are adjacent to the notch areas individually. The probe module according to claim 1, wherein two adjacent gap regions are separated by the solid region. The probe module according to claim 7, wherein the probe card assembly comprises a sliding frame, and the pressing portion is disposed on the sliding frame. The probe module according to any one of claims 1 to 8, wherein a plurality of elastic bumps are provided on the lower surface of the solid region of the outer flange of the second reinforcing plate.

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