TW202138816A - Probe module - Google Patents

Abstract

The disclosure relates to a probe module adapted to be disposed in an assembly hole of a first strengthening board. An inner wall of the assembly hole is formed with an inner flange. The probe module includes a second strengthening board and an electric circuit board. The second strengthening board has an outer flange which has a physical area and multiple gap areas. The physical area is adapted to be against the inner flange of the assembly hole. The electric circuit board is disposed beneath the second strengthening board. The electric circuit board has a bottom surface. Multiple conductors and multiple probes are disposed on the bottom surface, and at least one of conductors is electrically connected to one of the probes.

Description

Probe module

The invention relates to a probe module suitable for semiconductor testing.

In the current wafer-level semiconductor testing methods, probing is a common method, and the probe card is the most critical main component in the testing device used to perform the probing. For example, the Republic of China Patent No. I425218, the probe card assembly provided by the patent mainly includes a circuit substrate, a reinforcement plate fixed on the circuit substrate, and an adjustment plate arranged on the reinforcement plate to be fixed under the adjustment plate The probe head assembly. The probe head assembly passes through the central perforation of the circuit base and the central perforation of the reinforcement plate. The probe head assembly mainly includes a probe insert with a plurality of probes, and an insert support that carries the probe inserts and is locked by screws. The probes are located under the circuit substrate, used to touch the object to be tested, and are electrically connected to the connector on the circuit substrate by a plurality of conductive pins and wires, and then are connected to a test by the connector The machine is electrically connected.

The aforementioned probe head module is fixed to the adjustment plate by a plurality of bolts and nuts, the adjustment plate is fixed to the reinforcement plate by a plurality of locking screws, and the plurality of adjustment screws pass through the adjustment plate and abut against the adjustment plate. Reinforcement board. When the locking screws do not press the adjusting plate against the reinforcement plate and there is a gap between the adjusting plate and the reinforcement plate, each of the adjusting screws can be turned by the user to make the adjusting plate at that place The position is close to or far from the reinforcement plate, so that time-consuming adjustment of the position of the reinforcement plate relative to the circuit board is used to correct the position of the probes relative to the object to be measured, so that the tips of the probes are relative to the object to be tested. The measured object has acceptable flatness.

However, the complex structure of the probe card leads to time-consuming assembly and difficult disassembly, which causes considerable inconvenience to semiconductor inspection personnel.

The present invention provides a probe module that can be installed in a mounting hole of a first reinforcing plate, and the inner wall of the mounting hole has an inner flange. The probe module includes a second reinforcing plate and a circuit substrate. The second reinforcing plate has an outer flange, the outer flange includes a solid area and a plurality of notch areas, and the solid area is used to abut the inner flange of the mounting hole of the first reinforcing plate. The circuit substrate is arranged under the second reinforcing plate, and has a lower surface. The lower surface is provided with a plurality of conductors and a plurality of probes, and at least one of the conductors is electrically connected to one of the probes.

The probe module of the present invention can improve the problem of difficult assembly and disassembly of the probe module of the probe card of the prior art.

In the following embodiments, "up" or "down" is only used to illustrate the orientation shown in the drawings, and does not limit the actual orientation.

The first embodiment

Referring to FIGS. 1A to 4, an exemplary probe card 800 is shown. The probe card 800 is composed of a combination of a probe card assembly 100 and a test circuit board 81.

The probe card assembly 100 mainly includes a first reinforcing plate 11, a fixed frame 12, a probe module 13 and a sliding frame 14. The first reinforcing plate 11 includes an upper surface 11a, a lower surface 11b, and a mounting hole 11c. The inner wall of the mounting hole 11c has an inner flange 11d. The first reinforcing plate 11 may be made of a metal material, such as aluminum or aluminum alloy or other metal materials, to be combined with one side of the test circuit board 81 (as shown in FIGS. 3 and 4) to strengthen the test circuit board 81 rigidity. The fixed frame 12 is disposed on the upper surface 11a of the first reinforcing plate 11 and surrounds the mounting hole 11c. The probe module 13 is disposed in the mounting hole 11c, and includes an upper surface 13a, a lower surface 13b, and an outer flange 13d located between the upper surface 13a and the lower surface 13b. The outer flange 13d includes a solid area 13e and a plurality of notch areas 13f (the drawing shows four notch areas 13f), and the solid area 13e of the outer flange 13d abuts the inner flange 11d of the first reinforcing plate 11. As shown in FIG. 1B, the probe module 13 includes an upper cover 131, a second reinforcing plate 133, and a circuit board 134 in order from top to bottom. The outer flange 13d of the probe module 13 is located on the second reinforcing plate 133. The upper surface 13a and the lower surface 13b of the probe module 13 are located on the upper cover 131 and the circuit substrate 134, respectively. The upper surface of the circuit substrate 134 is fixedly connected to the lower surface of the second reinforcing plate 133.

The sliding frame 14 is arranged on the inner wall of the fixed frame 12 and can slide along an axial direction D1 (in the direction indicated by the arrow in Fig. 3 and Fig. 4) in the release position (the state shown in Fig. 3 and Fig. 6) and Between the fixed position (the state shown in Figure 4 and Figure 7). The inner wall of the sliding frame 14 is provided with a plurality of pressing parts 141 (the drawing shows four pressing parts 141). When the sliding frame 14 is in the release position as shown in FIG. Each notch area 13f of the outer flange 13d of the needle module 13, when the sliding frame 14 is in the fixed position as shown in FIG. 4, each pressing portion 141 presses the physical area 13e of the outer flange 13d of the probe module 13 .

Through the above embodiments, the assembly and disassembly of the probe module 13 can be realized only by controlling the sliding of the sliding frame 14 relative to the fixed frame 12 along the axial direction D1. When the assembly process is to be performed, the sliding frame 14 can be first slid along the axial direction D1 to the release position as shown in FIG. 3, and then the probe module 13 is placed in the mounting hole 11c of the first reinforcing plate 11. Afterwards, the assembly of the probe module 13 can be completed by sliding the sliding frame 14 along the axial direction D1 to the fixed position as shown in FIG. 4. Similarly, when a person wants to disassemble the probe module 13, he only needs to perform the above assembly procedure in reverse.

In some embodiments, the outer flange 13d of the probe module 13 includes a first side 13g and a second side 13h that are opposite and parallel to each other, and the first side 13g and the second side 13h are parallel to the axis. To D1. The notch area 13f of the outer flange 13d of the probe module 13 is located at the first side 13g and the second side 13h, and the number of notch areas 13f at the first side 13g is equal to the notch at the second side 13h The number of zone 13f. In addition, each notch area 13f individually corresponds to a pressing part 141 of the sliding frame body 14, so the number of pressing parts 141 is also equally distributed along the two sides of the axial direction D1. The outer flange 13d of the probe module 13 is located on the second reinforcing plate 133.

6 and 7 again, in some embodiments, each pressing portion 141 of the sliding frame 14 includes a housing 1411, an elastic body 1412 and a roller 1413. The housing 1411 is fixed to the inner wall of the sliding frame 14 and has an opening 1411a and an end wall 1411b opposite to the opening 1411a. The elastic body 1412 is arranged in the housing 1411 and has one end fixed to the end wall 1411a, and the other end connected to the roller 1413. In addition, the physical area 13e of the outer flange 13d of the probe module 13 further includes a plurality of ramp structures 13s, and these ramp structures 13s are individually adjacent to the notch areas 13f.

When the sliding frame 14 is in the release position as shown in FIGS. 3 and 6, the position of the pressing portion 141 is above the notch area 13f of the outer flange 13d of the probe module 13, that is, the roller 1413 is not in contact with The physical area 13e of the outer flange 13d of the probe module 13. At this time, the elastic body 1412 is not compressed, and the lower edge of the roller 1413 is slightly lower than the upper surface of the solid area 13e of the outer flange 13d of the probe module 13. When the sliding frame 14 is pushed to slide from the release position to the fixed position, the roller 1413 of each pressing part 141 moves and climbs along the surface of the ramp structure 13s from the corresponding notch 13f, and then moves to the outer flange 13d Physical area 13e. When the sliding frame 14 is in the fixed position as shown in FIGS. 4 and 7, the elastic body 1412 is in a compressed state, so that the roller 1413 will exert downward pressure on the physical area 13e of the outer flange 13d, thereby causing the probe module 13 It is fixed in the mounting hole 11c of the first reinforcing plate 11.

1A and FIG. 2, in some embodiments, the fixed frame body 12 has a through hole 121, and the sliding frame body 14 includes a handle portion 142 passing through the through hole 121. The through hole 121 has a first inner wall surface 121a and a second inner wall surface 121b opposite to each other. When the sliding frame 14 is in the release position as shown in FIG. 3, the handle portion 142 abuts against the first inner wall surface 121a of the through hole 121 . When the sliding frame 14 is at the fixed position as shown in FIG. 4, the handle portion 142 abuts against the second inner wall surface 121 b of the through hole 121.

5, in some embodiments, the inner wall of the fixed frame 12 is further provided with at least one positioning bead 125, and the outer wall of the sliding frame 14 is further provided with at least one positioning hole 145, the positioning bead 125 can be arranged along the fixed frame 12 The normal direction of the wall surface of the inner wall expands and contracts. When the sliding frame 14 is at the fixed position shown in FIG. 4, the positioning beads 125 of the fixed frame 12 will be inserted into the positioning holes 145 of the sliding frame 14. It should be noted that the positions of the positioning bead 125 and the positioning hole 145 can also be interchanged, that is, the positioning bead 125 can be arranged on the outer wall of the sliding frame 14 and the positioning hole 145 can be arranged on the inner wall of the fixed frame 12.

Second embodiment

Please refer to FIG. 8A, FIG. 8B, FIG. 9 and FIG. 14, which illustrate an exemplary probe card assembly 200 and a probe card 900, wherein the probe card 900 is a combination of the probe card assembly 200 and the test circuit board 91 Constituted.

The probe card assembly 200 mainly includes a first reinforcing plate 21, a fixed frame 22, a probe module 23 and a sliding frame 24. The first reinforcing plate 21 includes an upper surface 21a, a lower surface 21b, and a mounting hole 21c. The inner wall of the mounting hole 21c has an inner flange 21d. The first reinforcing plate 21 may be made of a metal material, such as aluminum or aluminum alloy or other metal materials, to be combined with one side of the test circuit board 91 (as shown in FIGS. 10 and 11) to strengthen the test circuit board 91 rigidity. The fixed frame 22 is disposed on the upper surface 21a of the first reinforcing plate 21 and surrounds the mounting hole 21c. The probe module 23 is disposed in the mounting hole 21c, and includes an upper surface 23a, a lower surface 23b, and an outer flange 23d located between the upper surface 23a and the lower surface 23b. The outer flange 23d includes a solid area 23e and a plurality of notched areas 23f (the drawing shows six notched areas 23f), and the solid area 23e of the outer flange 23d abuts against the upper surface of the inner flange 21d of the first reinforcing plate 21 . In addition, the upper surface of the probe module 23 is provided with a second lifting ring 239 that is convenient for personnel to extract the probe module 23, and the second lifting ring 239 can stand relative to the upper surface of the probe module 23 or flatly attach the probe module 23.的上面23a.

8B and FIG. 14, the probe module 23 includes an upper cover 231, a second reinforcing plate 233, and a circuit substrate 234 from top to bottom, wherein the outer flange 23d of the probe module 23 is located on the second reinforcing plate 233, the upper surface 23a of the probe module 23 is the upper surface of the upper cover 231, and the lower surface 23b of the probe module 23 is the lower surface of the circuit board 234. In addition, the second lifting ring 239 is fastened to the second reinforcing plate 233. The upper surface of the circuit substrate 234 is fixedly connected to the lower surface of the second reinforcing plate 233.

8B, 10, and 11, in some embodiments, the outer flange 23d of the probe module 23 includes a first side 23g and a second side 23h that are opposite and parallel to each other, and the first side 23g and the second side 23h are parallel to the axial direction D2. The notch areas 23f of the outer flange 23d of the probe module 23 are respectively located on the first side 23g and the second side 23h, and the number of notch areas 23f located on the first side 23g is equal to the number of notches located on the second side 23h The number of area 23f. In addition, each notch area 23f individually corresponds to a pressing part 241 of the sliding frame 24, so the number of pressing parts 241 is also equally distributed along the two sides of the axial direction D2. The outer flange 23d of the probe module 23 is located on the second reinforcing plate 233.

The sliding frame body 24 is disposed on the inner wall of the fixed frame body 22 and can slide along an axial direction D2 (in the direction indicated by the arrows in Figs. 10 and 11) in the release position (the state shown in Fig. 10) and the fixed position ( The state shown in Figure 11). The inner wall of the sliding frame 24 is provided with a plurality of pressing parts 241 (six pressing parts 241 are drawn in the drawing). When the sliding frame 24 is in the release position as shown in FIG. Each notch area 23f of the outer flange 23d of the needle module 23, when the sliding frame 24 is in the fixed position as shown in FIG. 11, each pressing portion 241 presses the physical area 23e of the outer flange 23d of the probe module 23 .

Through the above-mentioned embodiments, the assembly and disassembly of the probe module 23 can be realized only by controlling the sliding frame 24 to slide relative to the fixed frame 22 along the axial direction D2. When the assembly process is to be performed, the sliding frame body 24 can be first slid along the axial direction D2 to the release position as shown in FIG. 10, and then the probe module 23 is placed in the mounting hole 21c of the first reinforcing plate 21. Afterwards, the assembly of the probe module 23 can be completed by sliding the sliding frame body 24 along the axial direction D2 to the fixed position as shown in FIG. 11. Similarly, when a person wants to disassemble the probe module 23, he only needs to perform the above assembly procedure in reverse.

Referring to FIGS. 10 to 14, each pressing portion 241 of this embodiment includes a housing 2411 and a roller 2413. The casing 2411 is fixed to the inner wall of the sliding frame body 24 and has an opening 2411 a. The roller 2413 is disposed in the casing 2411 and partially protrudes out of the opening 2411 a of the casing 2411. In addition, the physical area 23e of the outer flange 23d of the probe module 23 includes a plurality of ramp structures 23s, and the lower surface of the physical area 23e is further provided with a plurality of elastic bumps 235 (four are drawn in the drawing). Each ramp structure 23s is individually adjacent to each notch area 23f, and each elastic protrusion 235 protrudes from the lower surface of the physical area 23e so that the physical area 23e of the outer flange 23d abuts against the first reinforcing plate 21 via the elastic protrusion 235 The upper surface of the inner flange 21d.

Since the outer flange 23d of the probe module 23 and the inner flange 21d of the first reinforcing plate 21 may not be completely flat with each other, after assembly, the probe tip of the probe module 23 (not shown) ) It is not on the same level during the test. By providing the elastic protrusion 235 on the lower surface of the outer flange 23d of the probe module 23, the above-mentioned problem can be solved through the elastic deformation of the elastic protrusion 235. It should be particularly noted that the elastic protrusion 235 may also be provided on the upper surface of the inner flange 21d of the first reinforcing plate 21. In some embodiments, the elastic bump 235 can be realized by embedding a spring and a steel ball on the lower surface of the outer flange 23d of the probe module 23, wherein the steel ball can be changed to protrude from the outer flange through the deformation of the spring. The height of the bottom surface of 23d.

When the sliding frame 24 is in the release position shown in FIGS. 10 and 12, the position of the roller 2413 of each pressing part 241 is above the notch area 23f of the outer flange 23d of the probe module 23, that is, the roller 2413 Without touching the physical area 23e of the outer flange 23d of the probe module 23, the lower edge of the roller 2413 is slightly lower than the upper surface of the physical area 23e of the outer flange 23d of the probe module 23 at this time. When the sliding frame 24 is pushed to slide to the fixed position shown in FIGS. 11 and 13, the roller 2413 of each pressing part 241 moves and climbs along the surface of the ramp structure 23s from its corresponding notch area 23f, and then moves to The physical area 23e exerts downward pressure on the physical area 23e. At this time, the height of the elastic protrusion 235 protruding from the lower surface of the outer flange 23d of the probe module 23 is reduced due to the downward pressure.

8A and 9, in some embodiments, the fixed frame 22 of the probe card assembly 200 has a recess 221, and the sliding frame 24 includes a handle 242, wherein the handle 242 is located in the recess 221 of the fixed frame 22 And has a positioning hole 242a. The probe card assembly 200 also includes a stop mechanism 29 disposed adjacent to the recess 221. The stop mechanism 29 includes a seat body 291, a spring 292 and a stop member 293. The seat body 291 is disposed opposite to the handle portion 242 and adjacent to the notch 221. The spring 292 (such as a torsion spring or a V-shaped spring) is pivotally arranged on the seat body 291. The stopper 293 is generally T-shaped and includes a first end 2931, a second end 2933, and a middle section 2932. The first end 2931 is opposite to the second end 2933 and faces the handle 242, and the middle section 2932 is located at the first end. 2931 and the second end 2933 are pivotally connected to the spring 292, so that the stopper 293 can use the spring 292 as a fulcrum to form a seesaw structure.

When the sliding frame 24 is at the fixed position shown in FIG. 11, the first end 2931 of the stopper 293 rotates downward relative to the spring 292 by the elastic force of the spring 292 to abut the lower edge of the handle 242. In this way, the sliding frame 24 can be prevented from accidentally sliding from the fixed position to the released position. When a person wants to remove the probe module 23, he only needs to press the second end 2933 of the stopper 293, so that the first end 2931 of the stopper 293 is raised and aligned with the positioning hole 242a of the handle 242. Since the size of the positioning hole 242a can allow the first end 2931 of the stopper 293 and the middle section 2932 to pass, the person can operate the handle portion 242 to slide the sliding frame along the axial direction D2 as shown in FIG. 10 The release position.

In some embodiments, in order to facilitate personnel to quickly align the first end 2931 with the positioning hole 242a, the handle portion 242 is further provided with a limit flange 242b, which is adjacent to the positioning hole 242a and above the positioning hole 242a. When a person presses the second end 2933 of the stopper 293 to make the first end 2931 of the stopper 293 tilt up and abut against the limiting flange 242b, the first end 2931 is exactly aligned with the positioning hole 242a at this time. In this way, personnel can quickly complete the disassembly or assembly of the probe module 23.

Referring to FIGS. 8A, 8B, 9 and 14, the lower surface 23b of the circuit substrate 234 of the probe module 23 of this embodiment is provided with a plurality of pogo pins (conductors) 237 and a plurality of probes 238, and the test circuit board 91 includes The upper surface 91a, the lower surface 91b, the through hole 91c, and a plurality of electrical contacts 917. The distance between two adjacent spring pins 237 is greater than the distance between two adjacent probes 238. The circuit substrate 234 has at least one side, and the pogo pin 237 is located between the probe 238 and the side of the circuit substrate 234. The electrical contact 917 of the test circuit board 91 is located on the upper surface 91a and around the through hole 91c. When the probe card assembly 200 and the test circuit board 91 are assembled into a probe card 900, the test circuit board 91 is fixed to the lower surface 21b of the first reinforcement board 21 with its upper surface 91a, and the through hole 91c of the test circuit board 91 is It is opposite to the mounting hole 21c of the first reinforcing plate 21. One end of each pogo pin 237 located on the circuit board 234 of the probe module 23 is electrically connected to the electrical contact 917 of the test circuit board 91, and the other end is electrically connected to the circuit board 234 of the probe module 23 to enable the test signal It can be transmitted from the test circuit board 91 to each probe 238 via the circuit board 234. In addition, the probe 238 of the probe module 23 protrudes from the lower surface 91b of the test circuit board 91, so that when the probe card 900 is assembled on the testing machine, the probe 238 can be used to test the device. The pads are tested for electrical properties. In FIG. 14, the pogo pin 237 is arranged around the probe 238. As shown in FIG. 14, the pogo pin 237 is arranged in four straight rectangles around the probe 238.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be subject to the scope of the attached patent application.

100, 200: Probe card assembly 800, 900: Probe card 11: The first reinforcement board 11a: upper surface 11b: lower surface 11c: Mounting hole 11d: inner flange 12: Fixed frame 121: Piercing 121a: first inner wall surface 121b: second inner wall surface 125: positioning beads 13: Probe module 13a: upper surface 13b: lower surface 13d: Outer flange 13e: physical area 13f: gap area 13g: the first side 13h: second side 13s: ramp structure 131: upper cover 133: Second reinforcement board 134: Circuit Board 14: Sliding frame 141: Suppression Department 1411: shell 1411: opening 1411b: end wall 1412: elastomer 1413: Wheel 142: Handle 145: positioning hole 21: The first reinforcement board 21a: upper surface 21b: lower surface 21c: mounting hole 21d: inner flange 22: fixed frame 221: Notch 23: Probe module 23a: upper surface 23b: lower surface 23d: Outer flange 23e: physical area 23f: gap area 23g: the first side 23h: second side 23s: ramp structure 231: upper cover 233: second reinforcement board 234: circuit board 235: Elastic bump 237: pogo pin 238: Probe 239: The Ring 24: Sliding frame 242: Handle 242a: positioning hole 242b: Limiting flange 241: Suppression Department 2411: shell 2411a: opening 2413: Wheel 29: stop mechanism 291: Block 292: Spring 293: stop 2931: first end 2932: middle section 2933: second end 81, 91: test circuit board 91a: upper surface 91b: lower surface 91c: Piercing 917: electric contact D1: Axial D2: Axial

[Figure 1A] is an exploded schematic view of the probe card of the first embodiment of the present invention; [Figure 1B] is an exploded schematic view of the probe module of the first embodiment of the present invention; [Figure 2] is a schematic diagram of the combination of the probe module and the reinforcing member of the first embodiment of the present invention; [Figure 3] is a schematic diagram of the probe module in the released state of the first embodiment of the present invention; [Figure 4] is a schematic diagram of the probe module in a fixed state according to the first embodiment of the present invention; [Figure 5] is a partial perspective view of the probe card of the first embodiment of the present invention; [FIG. 6] is a schematic cross-sectional view of the pressing part of the first embodiment of the present invention along the section line AA in FIG. 3; [FIG. 7] is a schematic cross-sectional view of the pressing part of the first embodiment of the present invention along the BB section line in FIG. 4; [Figure 8A] is an exploded view of the components of the probe card of the second embodiment of the present invention; [Figure 8B] is an exploded schematic view of the elements of the probe module of the second embodiment of the present invention; [Figure 9] is a schematic diagram of the combination of the probe module and the reinforcing member according to the second embodiment of the present invention; [Figure 10] is a schematic diagram of the probe module in the released state of the second embodiment of the present invention; [Figure 11] is a schematic diagram of the probe module in a fixed state according to the second embodiment of the present invention; [FIG. 12] is a schematic cross-sectional view of the pressing part of the second embodiment of the present invention along the CC section line of FIG. 10; [FIG. 13] is a schematic cross-sectional view of the pressing part of the second embodiment of the present invention along the line DD in FIG. 11; [Figure 14] is a schematic view of the bottom of the probe module of the second embodiment of the present invention.

200: Probe card assembly

21: The first reinforcement board

21a: upper surface

21b: lower surface

21c: mounting hole

21d: inner flange

22: fixed frame

221: Notch

23: Probe module

23a: upper surface

23d: Outer flange

23e: physical area

23f: gap area

23g: the first side

23h: second side

23s: ramp structure

231: upper cover

233: second reinforcement board

239: The Ring

24: Sliding frame

242: Handle

242a: positioning hole

242b: Limiting flange

241: Suppression Department

29: stop mechanism

291: Block

292: Spring

293: stop

2931: first end

2932: middle section

2933: second end

900: Probe card

91: test circuit board

91a: upper surface

91b: lower surface

Claims (10)

A probe module is used to be arranged in a mounting hole of a first reinforcing plate, the inner wall of the mounting hole has an inner flange, and the probe module includes: A second reinforcing plate having an outer flange including a solid area and a plurality of notch areas, the solid area being used to abut the inner flange of the mounting hole of the first reinforcing plate; and A circuit substrate is arranged under the second reinforcing plate and has a lower surface. The lower surface is provided with a plurality of conductors and a plurality of probes. At least one of the conductors is electrically connected to one of the probes. The probe module according to claim 1, wherein the probe module has an upper surface and a lower surface, and the second reinforcing plate is located between the upper surface of the probe module and the lower surface of the probe module between. The probe module according to claim 2, wherein the lower surface of the circuit substrate is the lower surface of the probe module. The probe module described in claim 3 further includes: An upper cover is arranged on the second reinforcing plate, the upper cover has an upper surface, and the upper surface of the upper cover is the upper surface of the probe module. The probe module according to claim 1, wherein the outer flange of the second reinforcing plate includes a first side and a second side that are opposite and parallel to each other, and the notch areas are located on the first side And the second side, and the number of notch areas on the first side is equal to the number of notch areas on the second side. The probe module according to claim 5, wherein the physical area of the outer flange of the second reinforcing plate includes a plurality of ramp structures, and the ramp structures are individually adjacent to the notch areas. The probe module according to claim 1, wherein two adjacent gap regions are separated by the physical region. The probe module according to claim 7, wherein each of the physical areas of the outer flange is used for pressing to fix the probe module in the mounting hole of the first reinforcing plate. The probe module according to claim 8, wherein each of the physical areas of the outer flange is used for pressing by a pressing part of a sliding frame, and each of the notch areas of the outer flange is used for the sliding When the pressing part of the frame corresponds to it, the probe module can be taken out from the mounting hole of the first reinforcing plate. The probe module according to any one of claims 1 to 9, wherein the lower surface of the physical area of the outer flange of the second reinforcing plate is provided with a plurality of elastic bumps.

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