TWI778179B - Scribing device and stand unit - Google Patents
Scribing device and stand unit Download PDFInfo
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- TWI778179B TWI778179B TW107140759A TW107140759A TWI778179B TW I778179 B TWI778179 B TW I778179B TW 107140759 A TW107140759 A TW 107140759A TW 107140759 A TW107140759 A TW 107140759A TW I778179 B TWI778179 B TW I778179B
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- 239000000758 substrate Substances 0.000 claims abstract description 64
- 230000002093 peripheral effect Effects 0.000 claims abstract description 38
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Slot Machines And Peripheral Devices (AREA)
Abstract
〔課題〕 一邊使劃線輪順暢旋轉,一邊穩定劃線的形成位置。 〔解決手段〕 一種支架單元30,該支架單元30包括保持溝63、插銷孔64a, 64b、劃線輪40及插銷軸50。當劃線輪40被推壓至基板表面時,劃線輪40的兩側面分別被推壓至保持溝63相互面對的內側面,如此,以設定貫通孔41與插銷軸50之間的間隙、保持溝63之內側面與劃線輪40之側面之間的間隙、插銷軸50相對於保持溝63之內側面的傾斜角。形成劃線輪41之貫通孔的內周面41C包含形成劃線輪之厚度方向所在之貫通孔之中央部的曲面,在上述曲面上,厚度方向所在之貫通孔41之中央部之直徑形成得比貫通孔之端部之直徑小。[Problem] The formation position of the scribe line is stabilized while the scribing wheel is smoothly rotated. [Solution] A stand unit 30 including a holding groove 63 , latch holes 64 a, 64 b , a scribing wheel 40 , and a latch shaft 50 . When the scribing wheel 40 is pushed to the surface of the substrate, the two side surfaces of the scribing wheel 40 are respectively pushed to the inner side surfaces of the holding grooves 63 facing each other, so as to set the gap between the through hole 41 and the pin shaft 50 , the gap between the inner side surface of the holding groove 63 and the side surface of the scribing wheel 40 , and the inclination angle of the latch shaft 50 relative to the inner side surface of the holding groove 63 . The inner peripheral surface 41C of the through hole forming the scribing wheel 41 includes a curved surface forming the central portion of the through hole in the thickness direction of the scribing wheel. It is smaller than the diameter of the end of the through hole.
Description
本發明是關於一種用來在基板上形成劃線的劃線裝置以及支架單元。The present invention relates to a scribing device and a holder unit for forming scribing lines on a substrate.
過去,玻璃基板等脆性材料基板的切割的進行是藉由於基板表面形成劃線的劃線製程及沿著已形成的劃線對基板表面附加既定的力的斷開製程。在劃線製程中,劃線輪的刀鋒一邊被推壓至基板表面,一邊沿著既定的線移動。為了形成劃線,使用包括劃線頭的劃線裝置。In the past, dicing of brittle material substrates such as glass substrates was performed by a scribing process in which a scribe line was formed on the substrate surface and a breaking process in which a predetermined force was applied to the substrate surface along the formed scribe line. In the scribing process, the blade of the scribing wheel moves along a predetermined line while being pushed against the surface of the substrate. To form a scribe line, a scribe device including a scribe head is used.
在以下專利文獻1中,揭示一種劃線裝置,其中,劃線輪一邊旋轉基板表面,一邊前進,藉此,於基板表面形成劃線。在此劃線裝置上,在形成於支架上的保持溝有劃線輪插入的狀態下,對形成於支架的孔與形成於劃線輪的孔這兩個孔插上插銷軸,藉此,劃線輪以可旋轉的狀態被支架保持。
[先行技術文獻]
[專利文獻]The following
[專利文獻1]WO2007/063979號公報[Patent Document 1] WO2007/063979
[發明所欲解決之問題][Problems to be Solved by Invention]
安裝於支架上的劃線輪需要在用來形成劃線的保持溝內旋轉。因此,保持溝的寬度變得比劃線輪的厚度稍微寬一點,於是劃線輪與保持部之間的間隙得以確保。藉由此間隙,劃線輪呈可在支架溝內沿著插銷軸移動的狀態。然而,當形成劃線時,若劃線輪朝向插銷軸方向移動,劃線的形成位置變得不穩定。因此,在習知的劃線裝置上,產生了劃線從既定位置偏移的問題。The scribing wheel mounted on the bracket needs to rotate within the retaining groove used to form the scribing. Therefore, the width of the holding groove becomes slightly wider than the thickness of the scribing wheel, so that the gap between the scribing wheel and the holding portion is secured. With this gap, the scribing wheel is in a state where it can move along the latch shaft in the bracket groove. However, when the scribe line is formed, if the scribe wheel moves in the direction of the latch shaft, the formation position of the scribe line becomes unstable. Therefore, in the conventional scribing device, there is a problem that the scribing line is deviated from the predetermined position.
鑑於該課題,本發明的目的在提供一種劃線裝置以及支架單元,其可在不妨礙劃線輪之旋轉的情況下,穩定劃線的形成位置。 [用以解決課題之手段]In view of this problem, an object of the present invention is to provide a scribing device and a stand unit capable of stabilizing the formation position of the scribing wheel without hindering the rotation of the scribing wheel. [Means to solve the problem]
本發明之第一型態是關於在基板表面形成劃線的劃線裝置。此型態之劃線裝置包括保持劃線輪的支架單元及於上述基板表面以可在垂直軸之周圍旋轉的狀態保持上述支架單元的劃線頭。上述支架單元包括被上述劃線輪插入的保持溝、橫跨上述保持溝而形成的插銷孔及插入被插入上述保持溝之上述劃線輪之貫通孔與上述插銷孔的插銷軸。當上述劃線輪被推壓至上述基板表面時,上述劃線輪的兩側面分別被推壓至上述保持溝相互面對的內側面,如此,以設定上述貫通孔與上述插銷軸之間的間隙、上述保持溝之內側面與上述劃線輪之側面之間的間隙、上述插銷軸相對於上述保持溝之內側面的傾斜角;形成上述劃線輪之上述貫通孔的內周面至少包含形成上述劃線輪之厚度方向所在之上述貫通孔之中央部的曲面;在上述曲面上,上述厚度方向所在之上述貫通孔之中央部之直徑形成得比上述厚度方向所在之上述貫通孔之端部之直徑小。A first aspect of the present invention relates to a scribing apparatus for forming scribing lines on the surface of a substrate. The scribing device of this type includes a holder unit for holding a scribing wheel and a scribing head for holding the holder unit on the surface of the substrate in a state of being rotatable around a vertical axis. The holder unit includes a holding groove into which the scribing wheel is inserted, a latch hole formed across the holding groove, and a latch shaft inserted into the through hole of the scribing wheel inserted into the holding groove and the latch hole. When the scribing wheel is pushed to the surface of the substrate, both side surfaces of the scribing wheel are respectively pushed to the inner side surfaces of the holding grooves facing each other, so that the distance between the through hole and the latch shaft is set. Gap, the gap between the inner side of the holding groove and the side of the scribing wheel, the inclination angle of the latch shaft relative to the inner side of the holding groove; the inner peripheral surface of the through hole forming the scribing wheel at least includes A curved surface forming the central portion of the through hole in the thickness direction of the scribing wheel; on the curved surface, the diameter of the central portion of the through hole in the thickness direction is formed to be larger than the diameter of the end of the through hole in the thickness direction. The diameter of the part is small.
根據本型態之劃線裝置,當上述劃線輪被推壓至上述基板表面時,上述劃線輪的兩側面分別被推壓至相互面對的內側面。因此,當形成劃線時,可抑制劃線輪朝向插銷軸方向移動。另一方面,劃線輪的貫通孔的內周面具有曲面,在此曲面上,厚度方向所在的貫通孔的中央部的直徑形成得比厚度方向所在的貫通孔的端部的直徑小,藉此,構成貫通孔的內周面與插銷軸的外周面產生線接觸。藉此,貫通孔的內周面41C容易相對於插銷軸而滑動,所以,可使劃線輪40順暢轉動。再者,貫通孔41的內周面41C與插銷軸50的外周面的接觸面積很小,所以,即使在基板15上形成劃線時所產生的碎玻璃、異物等進入貫通孔41的內周面41C與插銷軸50的外周面之間,也難以對劃線輪40的旋轉性產生影響。藉此,可抑制劃線輪40相對於插銷軸50的旋轉被妨礙。於是,可在不妨礙劃線旋轉的情況下,穩定劃線的形成位置。According to the scribing device of this aspect, when the scribing wheel is pressed against the surface of the substrate, the two side surfaces of the scribing wheel are respectively pushed to the inner side surfaces facing each other. Therefore, when a scribe line is formed, the movement of the scribe wheel toward the latch axis direction can be suppressed. On the other hand, the inner peripheral surface of the through hole of the scribing wheel has a curved surface on which the diameter of the center portion of the through hole in the thickness direction is formed to be smaller than the diameter of the end portion of the through hole in the thickness direction. Here, the inner peripheral surface constituting the through hole and the outer peripheral surface of the latch shaft are in line contact. Thereby, the inner
在本型態之劃線裝置上,上述插銷孔在構造上相對於上述保持溝的內側面垂直的方向,至少朝向與上述基板表面平行的方向而傾斜;上述插銷孔及插入上述貫通孔的上述插銷軸相對於上述保持溝的內側面垂直的方向,至少朝向與上述基板表面平行的方向傾斜。藉由此構造,如將在以下的實施型態說明的,可穩定劃線的形成位置。In the scribing device of this type, the latch hole is structurally inclined relative to a direction perpendicular to the inner surface of the holding groove, at least in a direction parallel to the surface of the substrate; The latch shaft is inclined at least in a direction parallel to the surface of the substrate with respect to a direction perpendicular to the inner surface of the holding groove. With this configuration, as will be described in the following embodiments, the formation position of the scribe line can be stabilized.
在本型態之劃線裝置上,上述插銷孔在構造上相對於上述保持溝的內側面垂直的方向,朝向與上述基板表面垂直的方向而傾斜;上述插銷孔及插入上述貫通孔的上述插銷軸亦相對於上述保持溝的內側面垂直的方向,朝向與上述基板表面垂直的方向傾斜。藉由此構造,可進一步穩定劃線的形成位置。In the scribing device of this type, the latch hole is structurally inclined in a direction perpendicular to the inner surface of the holding groove and in a direction perpendicular to the surface of the substrate; the latch hole and the latch inserted into the through hole The axis is also inclined in the direction perpendicular to the surface of the substrate with respect to the direction perpendicular to the inner surface of the holding groove. With this configuration, the formation position of the scribe line can be further stabilized.
本發明的第二型態是關於一種支架單元,其可保持用來形成劃線的劃線輪。此型態之支架單元包括被上述劃線輪插入的保持溝、橫跨上述保持溝而形成的插銷孔及插入被插入上述保持溝之上述劃線輪之貫通孔與上述插銷孔的插銷軸。當上述劃線輪被推壓至上述基板表面時,上述劃線輪的兩側面分別被推壓至上述保持溝相互面對的內側面,如此,以設定上述貫通孔與上述插銷軸之間的間隙、上述保持溝之內側面與上述劃線輪之側面之間的間隙、上述插銷軸相對於上述保持溝之內側面的傾斜角;形成上述劃線輪之上述貫通孔的內周面至少包含形成上述劃線輪之厚度方向所在之上述貫通孔之中央部的曲面;在上述曲面上,上述厚度方向所在之上述貫通孔之中央部之直徑形成得比上述厚度方向所在之上述貫通孔之端部之直徑小。A second aspect of the present invention is directed to a carriage unit that can hold a scribing wheel used to form a scribing line. The bracket unit of this type includes a holding groove into which the scribing wheel is inserted, a latch hole formed across the holding groove, and a latch shaft inserted into the through hole of the scribing wheel inserted into the holding groove and the latch hole. When the scribing wheel is pushed to the surface of the substrate, both side surfaces of the scribing wheel are respectively pushed to the inner side surfaces of the holding grooves facing each other, so that the distance between the through hole and the latch shaft is set. Gap, the gap between the inner side of the holding groove and the side of the scribing wheel, the inclination angle of the latch shaft relative to the inner side of the holding groove; the inner peripheral surface of the through hole forming the scribing wheel at least includes A curved surface forming the central portion of the through hole in the thickness direction of the scribing wheel; on the curved surface, the diameter of the central portion of the through hole in the thickness direction is formed to be larger than the diameter of the end of the through hole in the thickness direction. The diameter of the part is small.
本型態之支架單元於基板表面上以可圍繞垂直軸的周圍旋轉的狀態被劃線頭保持,藉此,可得到與上述第一型態相同的效果。 [發明效果]The holder unit of this form is held by the scribing head on the surface of the substrate in a state of being rotatable around the vertical axis, whereby the same effect as the above-mentioned first form can be obtained. [Inventive effect]
如上所述,藉由本發明,可提供一種劃線裝置以及支架單元,其可在不妨礙劃線輪旋轉的情況下,穩定劃線的形成位置。As described above, according to the present invention, it is possible to provide a scribing device and a stand unit, which can stabilize the formation position of the scribing line without hindering the rotation of the scribing wheel.
本發明的效果以及意義藉由以下所示的實施型態之說明將會更加清晰。不過,以下所示的實施型態絕對是實施本發明時的其中一例,本發明不受記載於以下之實施型態中的任何內容所限制。The effect and meaning of this invention will become clearer by the description of the embodiment shown below. However, the embodiment shown below is absolutely one example when implementing the present invention, and the present invention is not limited by any content described in the following embodiment.
以下將參照圖面說明本發明的實施型態。此外,在各圖中,為了方便,標記了相互垂直的X軸、Y軸及Z軸。X-Y平面與水平面平行,Z軸方向為鉛直方向。Embodiments of the present invention will be described below with reference to the drawings. In addition, in each drawing, the X axis, the Y axis, and the Z axis which are perpendicular to each other are marked for convenience. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is the vertical direction.
圖1係以模式表示劃線裝置1之構造的圖。FIG. 1 is a diagram schematically showing the structure of a
劃線裝置1包括移動台10。移動台10與球螺栓11螺合。移動台10以可朝Y軸方向移動的狀態被一對導軌12支持。馬達的驅動使球螺栓11旋轉,藉此,移動台10沿著一對導軌12朝Y軸方向移動。The
在移動台10的上面,設置了馬達13。馬達13使位於上部的桌台14在XY平面旋轉,定位於既定角度。可藉由馬達13進行水平旋轉的桌台14包括未圖示出的真空吸附裝置。載置於桌台14上的基板15藉由此真空吸附裝置,被保持在桌台14上。On the upper surface of the moving table 10, a
基板15為玻璃基板、由低溫燒成陶瓷或高溫燒成陶瓷等所構成的陶瓷基板、矽基板、化合物半導體基板、藍寶石基板、石英基板等。又,基板15可在基板的表面或內部附著或包含薄膜或半導體材料。又,基板15可在其表面附著與脆性材料不相應的薄膜等物質。The
劃線裝置1在載置於桌台14的基板15的上方,包括2台相機16,其可拍攝在此基板15的表面所形成的對齊標記。又,橋接器17橫跨移動台10與其上部的桌台14,架設於支柱18a, 18b上。The
在橋接器17上,安裝有導引器19。劃線頭20被此導引器19導引,設置成朝X軸方向移動的狀態。劃線頭20於下端包括支架接頭21。劃線輪40被支架60保持的支架單元30透過支架接頭21安裝於劃線頭20上。On the
在使用劃線裝置1於基板15上形成劃線的情況下,首先,安裝有劃線輪40的支架60被安裝於劃線頭20上。接著,劃線裝置1藉由一對導軌16定位基板15。然後,劃線裝置1使劃線頭20移動至既定的位置,對劃線輪40施加既定的荷重,使其與基板15接觸。之後,劃線裝置1藉由使劃線頭20朝X軸方向移動,在基板15的表面形成既定的劃線。此外,劃線裝置1根據需要轉動桌台14或朝Y軸方向移動,與上述的情況相同,形成劃線。When forming a scribing line on the
在上述的實施型態中,例示了劃線頭朝X軸方向移動、桌台14朝Y軸方向移動且旋轉的劃線裝置,但劃線裝置也可是劃線頭與桌台進行相對移動的方式。例如,可為固定劃線頭、桌台朝X軸、Y軸方向移動並且旋轉的劃線裝置。又,在此情況下,相機16可被劃線頭20固定。In the above-mentioned embodiment, the scribing device in which the scribing head moves in the X-axis direction and the table 14 moves and rotates in the Y-axis direction is illustrated, but the scribing device may be a scribing device in which the scribing head and the table move relative to each other. Way. For example, it can be a scribing device in which a scribing head is fixed, and a table table moves and rotates in the X-axis and Y-axis directions. Again, in this case, the
接著,將參照圖2(a)、(b)說明支架單元30的構造。圖2(a)係從X軸正側來看支架單元30的正面圖,圖2(b)係從Y軸正側來看支架單元30的側面圖。此外,在圖2(a)、(b)中,直接安裝支架單元30的接頭21一起被圖示出來。Next, the configuration of the
在支架單元30上,劃線輪40、插銷軸50、支架60為一體。支架單元30如圖2(b)所示,藉由安裝螺栓31被安裝於支架接頭21上。支架接頭21由安裝部22、旋轉軸23及2個軸承24a, 24b所構成。安裝部22的剖面形狀為逆L字形。安裝部22由朝鉛直方向延伸的側壁22a及朝水平方向延伸的側壁22b所構成。旋轉軸23從安裝部22的側壁22b的頂部那側朝鉛直方向延伸。在軸承24a, 24b上,有旋轉軸23插通。On the
當支架單元30被安裝在支架接頭21上時,支架單元30的側面與安裝部22的側壁22a接觸,支架單元30的上面與側壁22b接觸。又,在側壁22a上,如圖2(a)所示,形成用來插入安裝螺栓31的螺栓孔25。When the
支架接頭21在安裝於安裝部22的支架單元30從劃線頭20下端露出的狀態下,被固定於劃線頭20的內部。此時,支架單元30以支架接頭21的旋轉軸23為中心自由旋轉。此外,點劃線表示旋轉軸23的軸中心S,虛線表示基板15的表面H。表面H與水平面平行,與旋轉軸23垂直。The holder joint 21 is fixed to the inside of the
在使用劃線裝置1在基板15的表面H上形成劃線的情況下,劃線輪40以朝圖2(b)所示的箭頭R的方向(X軸方向)前進的方式來旋轉。此外,劃線裝置1不使用支架接頭21,支架單元30本身為包括旋轉軸23或軸承24a, 24b等的構造。When forming a scribe line on the surface H of the board|
圖3係圖2的支架60的部分垂直剖面圖。為了方便,在圖3中,省略支架60的一部分構造的圖示。劃線輪40可以是以燒結鑽石、超硬合金等形成的圓板狀元件。在劃線輪40上,形成用來插入插銷軸50的貫通孔41。貫通孔41貫通劃線輪40的兩側面的中心而形成。貫通孔41的形狀的細節如後所述。FIG. 3 is a partial vertical cross-sectional view of the
又,在劃線輪40上,有用來形成稜線的V字形刀鋒部44形成於外周部。劃線輪40的厚度可為0.4~1.1mm,外徑可為1.0~5.0mm。又,貫通孔41的最小內徑可為0.4~1.5mm,刀鋒的刀鋒角度可為90~150°。Moreover, in the
插銷軸50可為燒結鑽石或超硬合金等所形成的圓板狀元件,其一端或兩端形成尖頭形狀的尖頭部51(參照圖2(a))。插銷軸50的直徑比劃線輪40的貫通孔41的最小內徑稍微小一點點。插銷軸50的直徑舉例而言,當貫通孔41的最小內徑為0.82mm時,可為0.77mm。在插銷軸50插入貫通孔41的狀態下,插銷軸50與貫通孔41之間有間隙產生。The
如圖3所示,刀鋒部44的先端及形成貫通孔41的內周面41C的直徑為最小的最小徑部41X形成於厚度方向DT所在的劃線輪40的中心上。換言之,在厚度方向DT上,劃線輪40在厚度方向DT的中心位置、刀鋒部44的先端位置、貫通孔41的最小徑部41X的位置彼此之間相等。As shown in FIG. 3 , the tip of the
貫通孔41為鼓狀。詳細地說,貫通孔41在厚度方向DT上從第一側面42a及第二側面42b朝向本體部41的中央形成內徑慢慢變小的曲面形狀。如圖3所示,在與厚度方向DT垂直的平面上被切開的劃線輪40之剖面上,劃線輪40所在的貫通孔41的內周面41C至少包含形成厚度方向DT所在之貫通孔41之中央部的曲面。在此曲面上,厚度方向DT所在的貫通孔41的中央部的直徑形成得比厚度方向DT所在的貫通孔41的端部的直徑小。The through
更詳細地說,貫通孔41的內周面41C以貫通孔41的中心軸為中心,呈軸對稱形狀,但為了說明,在沿著厚度方向DT的剖面上,將上方的內周面作為上方內周面41CU,將下方的內周面作為下方內周面41CL。上方內周面41CU從貫通孔41在厚度方向DT的第一側面42a那側的端部朝向中央然後因此朝向下方內周面41CL延伸成彎曲狀,從貫通孔41在厚度方向DT的中央朝向貫通孔41在厚度方向DT的第二側面42b那側的端部然後因此以與下方內周面41CL分離的狀態延伸成彎曲狀。從上方內周面41CU在厚度方向DT的第一側面42a那側的端部到中央的形狀、從貫通孔41在厚度方向DT的中央到在厚度方向DT的第二側面42b那側的端部的形狀都是以線段CL為中心的線對稱形狀。下方內周面41CL從貫通孔41在厚度方向DT的第一側面42a那側的端部朝向中央然後因此朝向上方內周面41CU延伸成彎曲狀,從貫通孔41在厚度方向DT的中央朝向貫通孔41在厚度方向DT的第二側面42b那側的端部然後因此以與上方內周面41CU分離的狀態延伸成彎曲狀。從下方內周面41CL在厚度方向DT所在的第一側面42a那側的端部到中央的形狀、從貫通孔41在厚度方向DT的中央到在厚度方向DT的第二側面42b那側的端部的形狀皆為以線段CL為中心的線對稱形狀。包含本實施型態之貫通孔41之上方內周面41CU及下方內周面41CL的全部內周面41C分別以單一或複數個曲率半徑來形成。More specifically, the inner
貫通孔41的內周面41C的曲率半徑宜大於貫通孔41的最小徑部41X的位置與刀鋒部44的先端緣之間的距離DX。在厚度方向DT所在的貫通孔41的兩端部上,形成錐狀部41a, 41b。錐狀部41a朝向第一側面42a擴張半徑,錐狀部41b朝向第二側面42b擴張半徑。貫通孔41的內周面41C所在的最小內徑(最小徑部41X的直徑)比插銷軸50的外徑大。The radius of curvature of the inner
本實施型態之貫通孔41的最小內徑(最小徑部41X的直徑)為φ0.82mm。在貫通孔41上,於厚度方向DT為被錐狀部41a, 41b夾持的鼓狀的部分在厚度方向DT的長度LH宜在0.44mm以上、0.6mm以下的範圍內。長度LH變長,隨之而來的是,劃線輪40相對於插銷軸50的傾斜度變小。貫通孔41的鼓狀部分在厚度方向DT的兩端部與刀鋒部44的先端緣之間的距離DW、貫通孔41的最小徑部41X的位置與刀鋒部44的先端緣之間的距離DX這兩者的差為高低差DY,高低差DY(DY=DX-DW)宜為0.1µm以上、0.5µm以下。高低差DY變小,隨之而來的是,劃線輪40相對於插銷軸50的傾斜度變小。The minimum inner diameter (diameter of the
支架60由不鏽鋼或碳鋼等所構成。支架60如圖2(b)所示,下部從側面來看,朝向下端而形成寬度變窄的梯形。又,在支架60的梯形部分,分別形成保持部62a, 62b,在保持部62a, 62b之間形成保持溝63。保持溝63相互面對的內側面65a, 65b與水平面(XY平面)垂直。The
此外,在圖2(a)、(b)的構造中,支架60由1種基材所構成,但亦可藉由固定分別具有保持部62a, 62b的2種基材來形成支架60。In addition, in the structure of FIG.2(a), (b), the
在保持部62a, 62b上,用來插入插銷軸50的插銷孔64a, 64b橫跨保持溝63而形成。插銷孔64a, 64b的直徑稍稍大於插銷軸50的直徑。插銷孔64a, 64b相對於與保持溝63之內側面65a, 65b垂直的方向,至少朝向與基板15之表面H平行的方向(與XY平面平行的方向)傾斜而形成。插銷孔64a, 64b也可相對於與保持溝63之內側面垂直的方向,進一步朝向與基板15之表面H垂直的方向(與YZ平面平行的方向)傾斜而形成。In the holding
在劃線輪40插入保持溝63的狀態下,劃線輪40的貫通孔41與插銷孔64a, 64b有插銷軸50插入。如上所述,插銷孔64a, 64b相對於與保持溝63之內側面65a, 65b垂直的方向傾斜而形成,所以,插入插銷孔64a, 64b及貫通孔41的插銷軸50相對於與保持溝63之內側面65a, 65b垂直的方向,至少朝向與基板15之表面H平行的方向(與XY平面平行的方向)傾斜。In a state where the
在支架60的上部,形成用來插入安裝螺栓31的螺栓孔66。又,在保持部62a的Y軸正側的側面,以螺栓68a安裝緊固件67a,在保持部62b的Y軸反側的側面,以螺栓68b安裝緊固件67b。緊固件67a, 67b用來塞住插銷孔64a, 64b。In the upper part of the
在包括以上之構造的劃線裝置1上,在進行劃線的形成動作的過程中,當劃線輪40被推壓至基板15的表面H時,劃線輪40的兩側面分別被推壓至保持溝63相互面對的內側面65a, 65b。因此,在劃線的形成動作的過程中,可抑制劃線輪40沿著插銷軸50移動,藉此,可穩定劃線的形成位置。In the
以下將參照圖4(a)~(d)來說明劃線輪40的兩側面分別被推壓至保持溝63相互面對的內側面65a, 65b的動作。4( a ) to ( d ), the operation of pressing both side surfaces of the
圖4(a)~(d)分別係以模式表示支架60之動作的剖面圖。圖4(a)~(d)係剖面圖,其分別為從Z軸正側來看將支架60於插銷軸50之Z軸方向中央位置沿著與XY平面平行的平面切開的剖面。為了方便,在圖4(a)~(d)中,省略支架60的一部分構造的圖示。點劃線表示劃線輪40的刀鋒的稜線。FIGS. 4( a ) to ( d ) are cross-sectional views schematically showing the operation of the
圖4(a)表示劃線輪40被推壓至基板15之表面H前的狀態。在此狀態下,劃線輪40的稜線與XZ平面約略平行,劃線輪40的第一、第二側面42a, 42b、保持溝63的內側面65a, 65b之間,有間隙產生。插銷軸50相對於與保持溝63之內側面65a, 65b垂直的方向,朝向與XY平面平行的方向傾斜。FIG. 4( a ) shows a state before the
由此狀態,當劃線輪40被推壓至基板15的表面H時,劃線輪40的貫通孔41的中心軸與插銷軸50平行,劃線輪40上有力矩產生。如上所述,貫通孔41的直徑大於插銷軸50的直徑,所以,劃線輪40在貫通孔41與插銷軸50之間的間隙所容許的範圍內,可朝與XY平面平行的方向旋轉。於是,如上所述,當劃線輪40上有力矩產生時,如圖4(b)所示,藉由此力矩,劃線輪40朝順時針方向旋轉,劃線輪40的側面42a, 42b分別被推壓至保持溝63的內側面65a, 65b。In this state, when the
之後,伴隨劃線頭20的移動,當支架60朝X軸方向(箭頭R方向)移動時,產生使劃線輪40之稜線與劃線方向(箭頭R方向)平行的力矩。如圖2(a)、(b)所示,支架60可圍繞旋轉軸23的周圍旋轉,所以,藉由此力矩,如圖4(c)所示,為了使劃線輪40之稜線與劃線方向(箭頭R方向)平行,支架60朝逆時針方向旋轉。Then, when the
之後,如圖4(d)所示,在旋轉軸23(參照圖2(a)、(b))的周圍有支架60稍稍旋轉的狀態下,劃線動作得以進行。在此情況下,劃線輪40亦藉由對基板15之表面H施加的荷重,使第一、第二側面42a, 42b呈被推壓至保持溝63之內側面65a, 65b的狀態。在此狀態下,劃線輪40圍繞插銷軸50的周圍旋轉。Thereafter, as shown in FIG. 4( d ), in a state where the
在此,劃線輪40的第一、第二側面42a, 42b被推壓至保持溝63的內側面65a, 65b,即使劃線輪40相對於插銷軸50而傾斜,貫通孔41的內周面41C與插銷軸50接觸的位置傾向於位在劃線輪40在厚度方向DT的中央位置,所以,劃線輪40推壓保持溝63的瞬時變小。於是,即使劃線輪40在劃線輪40傾斜且與保持溝63之內側面65a, 65b接觸的狀態下旋轉,劃線輪40與保持溝63之間的摩擦力也能很小。Here, the first and
如此,在本實施型態中,於劃線的形成動作的過程中,劃線輪40的兩側面分別被推壓至保持溝63相互面對的內側面65a, 65b,所以,在劃線的形成動作的過程中,可抑制劃線輪40沿著插銷軸50移動。又,劃線輪的內周面在厚度方向DT從側面朝向本體部41的中央形成內徑慢慢變小的曲面形狀。因此,即使劃線輪40在劃線輪40傾斜且與保持溝63接觸的狀態下旋轉,貫通孔41的內周面41C與插銷軸50接觸的位置傾向於位於劃線輪40在厚度方向DT上的中央位置,於是可減少劃線輪40與保持溝63之間的摩擦力。藉此,可一邊使劃線輪順暢轉動,一邊穩定劃線的形成位置。In this way, in the present embodiment, in the process of forming the scribing line, the two side surfaces of the
<變形例>
接著,將說明上述實施型態的變形例。在本變形例中,除了使在與保持溝63之內側面垂直的方向為水平方向的插銷軸50的傾斜角產生變化以外,也使與保持溝63之內側面垂直的方向為鉛直方向的插銷軸50的傾斜角產生變化。<Variation>
Next, a modification of the above-described embodiment will be described. In this modification, in addition to changing the inclination angle of the
當使插銷軸50相對於與保持溝63之內側面垂直的方向朝鉛直方向傾斜時,藉由在進行劃線動作時所施加的荷重,在劃線輪40的貫通孔41沿著插銷軸50的狀態下,使劃線輪40朝鉛直方向旋轉。換言之,在圖5(a)的狀態下,當荷重使劃線輪40被推壓至基板15的表面H時,如圖5(b)所示,劃線輪40傾斜。藉由此傾斜,劃線輪40的側面42a, 42b被推壓至保持溝63的內側面65a, 65b,劃線輪40的移動得以被規範。When the
當插銷軸50相對於與保持溝63之內側面垂直的方向不僅朝水平方向也朝垂直方向傾斜時,使插銷軸50朝水平方向傾斜而導致劃線輪40之移動被規範的效果、使插銷軸50朝鉛直方向傾斜而導致劃線輪40之移動被規範的效果得以複合。藉此,在劃線動作中的劃線輪40在軸方向的移動被顯著地抑制,於是可進一步提高劃線的形成精度。When the
在此,當使插銷軸50朝鉛直方向傾斜時,如圖5(b)所示,劃線輪40在相對於基板15之表面H傾斜的狀態下被推壓。劃線輪40相對於此時之表面H的傾斜角在插銷軸50相對於與保持溝63之內側面65a, 65b垂直的方向為鉛直方向的傾斜角越大時,就越大。在此情況下,支架溝內的劃線輪的移動被抑制,因此,有劃線時的劃線輪的旋轉阻力變大的疑慮。不過,劃線輪40的貫通孔41的內周面為鼓狀,所以,下方內周面41CL與插銷軸50接觸的位置傾向於位於劃線輪40在厚度方向DT的中央位置,劃線輪40推壓保持溝63的瞬時變小。於是,即使劃線輪40在劃線輪40傾斜且與保持溝63接觸的狀態下旋轉,也可使劃線輪40與保持溝63之間的摩擦力變小。Here, when the
<實施型態的效果> 藉由本實施型態,可得到以下的效果。<Effect of the implementation form> According to this embodiment, the following effects can be obtained.
如圖4(a)~(d)所示,相對於與保持溝63之內側面65a, 65b垂直的方向,插銷軸50朝水平方向傾斜,所以,當劃線輪40被推壓至基板15的表面H時,劃線輪40的側面42a, 42b分別被推壓至保持溝63相互面對的內側面65a, 65ba。因此,當形成劃線時,可抑制劃線輪40朝與插銷軸50平行的方向移動。於是,可穩定劃線的形成位置。As shown in FIGS. 4( a ) to ( d ), the
再者,劃線輪的貫通孔41在厚度方向DT從第一側面42a及第二側面42b朝向本體部41的中央形成內徑慢慢變小的曲面形狀,所以,即使劃線輪40相對於插銷軸50傾斜,貫通孔41的內周面41C與插銷軸50接觸的位置傾向於位於劃線輪40在厚度方向DT的中央位置。藉此,使劃線輪40推壓保持溝63的瞬時變小,即使劃線輪40在劃線輪40傾斜且與保持溝63接觸的狀態下旋轉,也可使劃線輪40與保持溝63之間的摩擦力變小。Furthermore, the through
又,插銷軸50也宜相對於與保持溝63之內側面65a, 65b垂直的方向,朝與基板15之表面H垂直的方向(鉛直方向)傾斜。如此,可更進一步穩定劃線的形成位置。Also, the
以上說明了本發明的實施型態,但本發明不受上述實施型態的任何限制,又,本發明的實施型態也可是上述以外的各種變更。The embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and the embodiments of the present invention may be modified in various ways other than those described above.
例如,在上述實施型態1中,使用了不在刀鋒的稜線形成溝的劃線輪40,但亦可使用在稜線上以一定間隔形成溝的劃線輪。For example, in the above-described
又,在上述實施型態1中,相對於與保持溝63之內側面65a, 65b垂直的方向,使插銷孔朝水平方向或垂直方向傾斜,藉此來使插銷軸傾斜,但亦可使插銷軸與保持溝產生相對的傾斜。具體而言,插銷孔64a, 64b可朝與基板15之表面H平行的方向(與XY平面平行的方向)且與劃線方向R垂直的方向(與YZ平面平行的方向)而形成,並且,保持溝63的內側面65a, 65b可相對於與插銷孔64a, 64b垂直的方向,至少朝與基板15之表面H平行的方向(與XY平面平行的方向)傾斜而形成。保持溝63的內側面65a, 65b可相對於與插銷孔64a, 64b垂直的方向,更可朝與基板15之表面H垂直的方向(與YZ平面平行的方向)傾斜而形成。Moreover, in the above-mentioned
又,劃線頭20的構造、劃線裝置1的構造也可進行適宜的變更。在圖1中,表示了僅在基板15的單面形成劃線的劃線裝置,但本發明也可應用於在基板15的兩面上一起形成劃線的劃線裝置。Moreover, the structure of the
本發明的實施型態在專利申請範圍所示的技術思想的範圍內,可適宜地產生各種的變更。Various modifications can be appropriately made to the embodiment of the present invention within the scope of the technical idea shown in the scope of the patent application.
1‧‧‧劃線裝置
15‧‧‧基板
20‧‧‧劃線頭
30‧‧‧支架單元
40‧‧‧劃線輪
41‧‧‧貫通孔
42a,42b‧‧‧側面
50‧‧‧插銷軸
60‧‧‧支架
63‧‧‧保持溝
64a,64b‧‧‧插銷孔
65a,65b‧‧‧內側面
H‧‧‧表面1‧‧‧
[圖1]圖1係以模式來表示實施型態之劃線裝置之構造的圖。 [圖2]圖2(a)、(b)分別係實施型態之支架單元的正面圖及側面圖。 [圖3]圖3係實施型態之支架單元的部分垂直剖面圖。 [圖4]圖4(a)~(d)分別係以模式表示實施型態之支架之動作的剖面圖。 [圖5]圖5(a)、(b)分別係用來說明使實施型態之插銷軸相對於鉛直方向而傾斜時之作用的圖。[ Fig. 1] Fig. 1 is a diagram schematically showing the structure of a scribing device of an embodiment. [Fig. 2] Figs. 2(a) and (b) are a front view and a side view of the stent unit of the embodiment, respectively. [FIG. 3] FIG. 3 is a partial vertical cross-sectional view of the stent unit of the embodiment. [ Fig. 4] Figs. 4(a) to (d) are cross-sectional views schematically showing the operation of the stent of the embodiment. [ Fig. 5] Fig. 5(a) and (b) are views for explaining the action when the latch shaft of the embodiment is inclined with respect to the vertical direction, respectively.
40‧‧‧劃線輪 40‧‧‧Scribing wheel
41‧‧‧貫通孔 41‧‧‧Through hole
42a,42b‧‧‧側面 42a, 42b‧‧‧Side
50‧‧‧插銷軸 50‧‧‧pin shaft
60‧‧‧支架 60‧‧‧Bracket
62a,62b‧‧‧保持部 62a, 62b‧‧‧Maintaining Department
63‧‧‧保持溝 63‧‧‧Keep Ditch
64a,64b‧‧‧插銷孔 64a, 64b‧‧‧pin hole
65a,65b‧‧‧內側面 65a, 65b‧‧‧Inner side
Claims (4)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-252671 | 2017-12-27 | ||
| JP2017252671A JP6936485B2 (en) | 2017-12-27 | 2017-12-27 | Scrivener and holder unit |
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| Publication Number | Publication Date |
|---|---|
| TW201927711A TW201927711A (en) | 2019-07-16 |
| TWI778179B true TWI778179B (en) | 2022-09-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107140759A TWI778179B (en) | 2017-12-27 | 2018-11-16 | Scribing device and stand unit |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6936485B2 (en) |
| KR (1) | KR102577831B1 (en) |
| CN (1) | CN109968547B (en) |
| TW (1) | TWI778179B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202128579A (en) * | 2019-11-29 | 2021-08-01 | 日商三星鑽石工業股份有限公司 | Wheel support structure, holder, holder unit, and holder assembly |
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| JP4948725B2 (en) * | 2000-12-05 | 2012-06-06 | 三星ダイヤモンド工業株式会社 | Chip holder |
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| CN203431071U (en) * | 2013-07-17 | 2014-02-12 | 广东富华工程机械制造有限公司 | Supporting pin |
| KR20160076170A (en) * | 2014-12-22 | 2016-06-30 | 엠.제이.테크(주) | Scribing Wheel |
| CN105036536A (en) * | 2015-07-21 | 2015-11-11 | 北京沃尔德金刚石工具股份有限公司 | Cutter wheel used for cutting glass materials |
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- 2018-11-16 TW TW107140759A patent/TWI778179B/en active
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| JP2014205363A (en) * | 2005-12-01 | 2014-10-30 | 三星ダイヤモンド工業株式会社 | Chip holder |
| JP2011093186A (en) * | 2009-10-29 | 2011-05-12 | Mitsuboshi Diamond Industrial Co Ltd | Tip holder unit |
| CN105417945A (en) * | 2015-12-29 | 2016-03-23 | 郑州旭飞光电科技有限公司 | Knife rest assembly and knife rest of glass substrate linear cutting device |
| CN206244646U (en) * | 2016-12-08 | 2017-06-13 | 北京沃尔德金刚石工具股份有限公司 | A kind of alloy break bar |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109968547B (en) | 2021-12-03 |
| JP2019116083A (en) | 2019-07-18 |
| CN109968547A (en) | 2019-07-05 |
| KR102577831B1 (en) | 2023-09-12 |
| KR20190079569A (en) | 2019-07-05 |
| TW201927711A (en) | 2019-07-16 |
| JP6936485B2 (en) | 2021-09-15 |
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