TWI777370B - Systems for applying materials to components - Google Patents

Abstract

Disclosed are systems for applying materials (e.g., thermal interface material, other material, etc.) from a supply (e.g., roll, reel, tape, etc.) of the material to a component, substrate, part, plate, another material, or other target surface. In exemplary embodiments, the system includes a tool (e.g., a roller, rolling device, etc.) configured to be movable relative to a supply of a material for positioning a portion of the material from the supply along a component (or other target surface), and thereby forcing, squeezing, or removing air pockets and/or bubbles out of the portion of the material when the tool is moved relatively along the portion of the material.

Description

System for applying material to parts

The present invention relates to a system for applying a material to a component.

This section provides background information related to the present disclosure which is not necessarily prior art.

Electrical components such as semiconductors, integrated circuit packages, transistors, etc. typically have pre-designed temperatures at which the electrical components operate optimally. Ideally, the pre-designed temperature is close to the temperature of the surrounding air. But the work of electrical components generates heat. Failure to remove heat can result in electrical components operating at temperatures significantly higher than their normal or expected operating temperatures. Such excessive temperatures can adversely affect the operating characteristics of electrical components and the operation of associated devices.

To avoid or at least reduce adverse operating characteristics from heat generation, heat should be removed, for example, by conducting heat from the operating electrical components to the heat sink. The heat sink is then cooled by conventional convection and/or radiation techniques. During conduction, heat can be transferred from the active electrical component to the heat sink by direct surface contact between the electrical component and the heat sink and/or by contact between the electrical component and the heat sink surface via an intermediate medium or thermal interface material. To improve heat transfer efficiency, the gap can be filled with a thermal interface material compared to filling the gap between the heat transfer surfaces with air, which is a poor thermal conductor.

Heat spreaders are commonly used to spread the heat from one or more heat generating components so that the heat is not concentrated in a small area when transferred to a heat sink. An integrated heat spreader (IHS) is an integrated heat spreader that can be used to extend the work of a central processing unit (CPU) or processor die A heat spreader for the generated heat. An integrated heat spreader or lid (eg, lid of an integrated circuit (IC) package, etc.) is typically a thermally conductive metal (eg, copper, etc.) plate mounted on top of a CPU or processor die.

Heat spreaders are also commonly used (eg, as lids, etc.) to protect chips or board mounted electronic components, often in conjunction with hermetically sealed packages. Thus, the heat spreader may also be referred to herein as a cover and vice versa.

A first thermal interface material or layer (referred to as TIM1 ) may be used between the integrated heat spreader or cover and the heat source to reduce hot spots and generally reduce the temperature of heat generating components or devices. A second thermal interface material or layer (referred to as TIM2) can be used between the lid or the integrated heat spreader and the heat sink to improve the heat transfer efficiency from the heat spreader to the heat sink.

For example, FIG. 1 illustrates an exemplary electronic device 11 having a TIM1 or a first thermal interface material 15 . As shown in FIG. 1, the TIM 1 or thermal interface material 15 is positioned between a heat spreader or cover 19 and a heat source 21, which may include one or more heat generating components or devices (eg, CPU, mold in underfill) , semiconductor devices, flip-chip devices, graphics processing units (GPUs), digital signal processors (DSPs), multiprocessor systems, integrated circuits, multicore processors, etc.), batteries, solar panels, etc. The TIM 2 or second thermal interface material 25 is positioned between the heat sink 29 and the heat spreader or cover 19 .

For example, the heat source 21 may include a central processing unit (CPU) or processor die mounted on a printed circuit board (PCB) 33 . PCB 33 may be made of FR4 (Flame Retardant Fiberglass Reinforced Epoxy Laminate) or other suitable material. Also in this example, the heat spreader or cover 19 is an integrated heat spreader (IHS) that may include metal or other thermally conductive structures. The heat spreader or cover 19 includes a peripheral ridge, flange or sidewall portion 37 . Adhesive 41 is applied to and along peripheral ridge 37 to attach heat spreader or cover 19 to PCB 33 . Thus, the peripheral ridge 37 may protrude down enough to extend around the silicon mold on the PCB 33 to allow contact between the adhesive 41 on the peripheral ridge 37 and the PCB 33 . Advantageously, adhesively attaching the heat spreader or cover 19 to the PCB 33 can also help strengthen the package attached to the base PCB. Pin connectors 45 are also shown in FIG. 1 . Heat sink 29 may typically include a base from which a series of fins protrude outwards.

As another example, an exemplary electronic device may include a thermal interface material positioned between a heat source and a heat sink without any intervening heat spreaders. In this example, the thermal interface material may thus be positioned directly between and/or against a heat sink and a heat source, which may include one or more heat generating components or devices (eg, CPU, Dies in underfill, semiconductor devices, flip chip devices, graphics processing units (GPUs), digital signal processors (DSPs), multiprocessor systems, integrated circuits, multicore processors, etc.), batteries, solar panels, etc.

This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.

Disclosed is a method for applying material to a part, substrate, element, plate, other material, or other target surface from a supply (eg, roll, reel, tape, etc.) of material (eg, thermal interface material, other materials, etc.) . In an exemplary embodiment, the system includes a tool (eg, a roller, a rolling device, etc.) configured to be movable relative to a supply of material to move portions of material from the supply along a component (or other The target surface) is positioned so that when the tool is relatively moved along the portion of the material, the air pockets and/or air bubbles are forced away from, squeezed out or removed from the portion of the material.

Further areas of application will become apparent from the description provided herein. The description and specific examples in this summary are for purposes of illustration only, and are not intended to limit the scope of the present disclosure.

11: Electronics

15: The first thermal interface material (TIM1)

19: Heat Diffuser/Cover

21: Heat source

25: Second Thermal Interface Material (TIM2)

29: Heat sink

33: Printed Circuit Board (PCB)

37: Peripheral Ridge/Flange/Sidewall

41: Adhesive

45: pin connector

100: System

104: Extruder

108: Mold

111: Material supply body

112: Strips/Tapes/Material Tapes

116: lining

120: Thermal Interface Material (TIM)

124: Cover/Integrated Heat Diffuser

128: Supply Body/Volume

132: Roller

136: Roller

140: Roller

144: Material Band

148: Scrap Roll

202: Tools

204: Extruder

208: Mold

210: Elastomeric Materials

212: Supplies/Materials

214: Pin

216: lining

218: Substrate

220: Thermal Interface Materials (TIM)

222: Materials Section

224: Target

300: System

302: Tools

308: Mold

312: Supply Body/Material Belt

316: lining

318: Support Surface

320: Materials

324: Parts

328: Supply/Volume

332: Roller

333: Leave material

340: Roller

344: Material Band

348: Scrap Reel/Reel

360: Roller/Rollers

444: No material left

The drawings described herein are for illustrative purposes only of selected embodiments and not all possible embodiments, and are not intended to limit the scope of the present disclosure.

[FIG. 1] is a cross-sectional view of an exemplary electronic device showing a thermal interface material (TIM1) positioned between a cover (eg, an integrated heat spreader (IHS), etc.) and a heat source (eg, one or more between heat-generating components, central processing units (CPUs), molds, semiconductor devices, etc.).

[ FIG. 2 ] illustrates an exemplary system for applying a thermal interface material to a cover according to an exemplary embodiment.

[ FIG. 3 ] illustrates exemplary shapes (eg, stars, arrows, squares, rectangles, ovals, etc.) that are feasible for thermal interface materials using the system according to the exemplary embodiment shown in FIG. 2 .

[FIG. 4] is configured to operatively transfer portions of material (eg, thermal interface materials, other materials, etc.) from a supply of material (eg, rolls, reels, tapes, etc.) to substrates, components, components A perspective view of an exemplary embodiment of a tool that targets a surface.

[FIG. 5] is a perspective view of the tool shown in FIG. 1 and also illustrates including a liner and thermal interface material positioned across the tool and between spring-loaded compressible and/or retractable guide pins (TIM) strips or bands.

[FIG. 6] illustrates an exemplary system including the tool shown in FIGS. 4 and 5 for applying material to a part, element, substrate or other target.

[FIG. 7] illustrates three different die cutting modes (A, B, C) that can be used when applying a material to a substrate, component, part, or other target surface, according to an exemplary embodiment.

[ FIGS. 8 to 20 ] illustrate the application of materials to target surfaces (eg, parts, liners, etc.) from a supply (eg, rolls, disks, tapes, etc.) of materials (eg, thermal interface materials, other materials, etc.) Exemplary embodiments of systems for substrates, elements, plates, target surfaces of other materials, other target surfaces, etc.). In the exemplary embodiment, the system includes a tool (eg, a roller, a rolling device, etc.) configured to be movable relative to a supply of material to move portions of material from the supply along a component (or other target surfaces) so that as the tool moves relative to the portion of the material, The air pockets and/or air bubbles are forced away from, squeezed out or removed from the portion of the material.

[Fig. 21] illustrates the tool and rolling device/roller of the system shown in Figs. 8 to 20. [Fig.

Example embodiments will now be described more fully with reference to the accompanying drawings.

Conventional phase change material (PCM) coating processes often include tabbed PCB components and are costly. There may be problems with properly coating the tabbed part and/or liner release by the end user or customer. With traditional coating processes, TIMs are limited in element configuration, shape, and size. Also, it may be difficult to keep the PCM material clean during any further steps after formation in a clean room. It may also be difficult to transport the tabbed element without twisting.

Thermal interface materials are typically provided as thermal pads with release liners on both sides of the thermal pad. In this case, a common installation method is to peel off one of the two release liners, attach the thermal pad to the target area, with the remaining release liner exposed or on top, and then peel the remaining release liner from the thermal pad. But some conventional phase change thermal interface materials are relatively easy to crack when the release liner is peeled off. Accordingly, disclosed herein are systems and processes for applying materials (eg, phase change thermal interface materials, other thermal interface materials, etc.) to components that can help reduce failure rates, such as reducing when a release liner is peeled off breakage of the material and/or alleviation of air entrapment and/or removal of air pockets and/or air bubbles within the material.

Disclosed herein is the incorporation of a wide range of materials (eg, thermal interface materials (TIMs), conductive elastomers (elastomers), electromagnetic interference (EMI) absorbers, EMI shielding materials, dielectric materials, thermally conductive materials, other interface materials, combinations thereof, individual layers, stacked layers thereof, etc.) applied (e.g., pushed, pressed, compacted, removed, severed, ripped, cut, blown, stamped, transferred, etc.) from a supply to a wide range of components, substrates as well as components (such as lids or integrated heat spreaders for integrated circuit (IC) packages, board level shields (eg, removable lids or covers for board level shields (BLS), etc.), heat sources (eg central Systems and processing of processing units (CPUs, etc.), heat removal/heat dissipation structures or components (eg, heat spreaders, heat sinks, heat pipes, vapor chambers, device enclosures or housings, etc.), membranes, and other substrates, etc. Exemplary implementation of .

In an exemplary embodiment, a tool is used to transfer a TIM or other material from a transport liner (broadly, a supply) to a target element, part or substrate. The tooling may include a tool that is cut or customized (eg, shaped and sized into a rectangle as shown in FIG. 4, etc.) mold. In FIG. 3, 310 denotes a thermal interface material. In operation, the mold may be relatively opposed along thermal interface materials (eg, phase change materials (PCM), other TIMs, etc.) or other materials (eg, conductive elastomers, electromagnetic interference (EMI) absorbers, EMI shielding materials, dielectrics A liner (eg, polyethylene terephthalate) disposed on the surface (eg, top or upper surface) of a supply (eg, roll, disk, etc.) of the material, combinations thereof, individual or stacked layers thereof, etc. (PET) carrier and/or release liner, etc.) (eg downwardly, upwardly, laterally, diagonally, rotationally, etc.) and pressed by means of the liner. In some embodiments, the mold may be moved relative to and by the liner along with pressure, dwell, heating and cooling, temperature control, etc., which may assist in cutting, adhering, releasing TIM or other materials from the liner, etc. to press.

Movement of the mold relative to the liner also moves portions of the TIM or other material for transfer or application from the supply to the substrate or part. The liner is also removed from portions of the TIM or other material as the mold is removed and moved relatively away from (eg, lifted up away from) the TIM or other material. Portions of the TIM or other material of the size and shape desired by the particular customer remain left, eg, on the cover, heat source, heat removal/heat diffusion structure, and the like. During removal of the TIM or other material from the supply, the mold may be configured to reduce material thickness, create sticking, and tear the TIM or other material from the supply.

The machines or extruders used to press the die (eg, downwardly, upwardly, laterally, diagonally, rotationally, etc.) by means of a liner can range from manually operated extruders to highly automated machines. In some embodiments, at least a portion of the liner may remain in the TIM that is applied to the substrate or component or other materials, where the remaining gusset portion may be useful for protection, providing labels, providing tabs, and/or other reasons.

In an exemplary embodiment, the supply of material includes a supply (eg, roll, disk, etc.) of thermal interface material (eg, phase change material (PCM) or other non-metallic TIM (eg, plastic TIM, silicone elastomer TIM, etc.) , belt, etc.). In other exemplary embodiments, the supply of material may include a wide range of other materials such as other TIMs, non-thermally enhanced materials, thermal insulators, dielectric insulation, electrical insulators, conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, combinations thereof, individual layers thereof, stacked layers thereof, etc.).

In an exemplary embodiment, a compaction tool is used to compact the TIM or other material to the substrate or component (eg, cover, BLS, heat source, heat removal/heat dissipation structure, etc.). The compaction tool may include cavities and elastic materials within the cavities (eg, cotton, cork, gel, gel packs, rubber, elastomers, elastic plastics, elastic or sponge-like materials, fibrous materials, insulating materials, other elastic materials Wait). For example, the compaction tool may include a central foam core or a foam-filled core. Alternatively, the compaction tool may include another elastic material within the cavity or no cavity at all.

A die can be used to remove (eg, cut, tear, sever, etc.) TIM or other material with the liner without having to pierce the liner. The die may be integral with the compaction tool or separate from the compaction tool. In an exemplary embodiment, the TIM or other material is non-metallic such that there are no diffusion or solder joints between the non-metal and the substrate or component (eg, lid, BLS, heat source, heat removal/heat dissipation structure, etc.) . In contrast, non-metals can be naturally tacky and self-adhere to the liner or part without the need for any additional adhesive (although adhesives can also be used).

The mold may include one or more edges or sides (eg, single-sided or edge, both sides or edges, all sides or edges, etc.) one or more blades and/or at least one edge. In an exemplary embodiment, the mold may include a blade mold (eg, steel blade mold, etc.), Knife dies (eg, rounded knife dies, etc.), rotary dies, steel ruled dies with knives, rounded or dulled edges, and the like. In an alternative embodiment, the mold includes an integrated circuit mold (eg, a block of semiconductor material) having a TIM or other compaction tool for cutting, severing, or tearing away from the integrated circuit mold. One or more edges or sides of the material (eg, one or more edges, two sides or edges, all sides or edges, etc.) one or more edges. In yet another embodiment, the compaction tool may be operable to cut, tear, or sever TIM or other material without the use of a separate die (eg, without the use of a blade of a knife die, etc.). In this latter example, the compaction tool may include an elastic material (eg, foam-filled cavity, central foam core, etc.) that may be used to convert TIM or TIM from a supply (eg, roll, disk, belt, etc.) Other materials are compacted and transferred (eg, cut, torn, severed, etc.) onto the substrate or part.

In an exemplary embodiment, a rolling rotary mold may be used to apply or transfer TIM or other materials from a supply to a part or substrate. For example, rolling rotary molds can be used to apply or transfer TIM or other materials from a disk or roll onto the surface of a part or substrate. An example of this could be reel-to-reel or reel-to-reel processing of a rotary die between a supply reel or reel and a take-up or waste reel or reel. System components can be operated at a given speed such that a portion of the material is transferred from the supply roll or disk to the substrate or component surface by rotational transfer.

In exemplary embodiments, TIMs and other materials may be provided with textured and/or modeled surfaces during application or transfer from a supply to a component or substrate. Accordingly, exemplary embodiments disclosed herein include methods for texturing surfaces and/or producing textured or modeled surfaces on TIM and other materials. TIM or other materials may be transferred from a carrier or transport liner or other supply to heat sinks, lids, other elements, substrates or components, and the like. It has been found that the slightest imperfections in the liner are also transferred to the TIM or other materials during the coating/transfer process. For example, a thick layer of ink for marking on a liner can be imprinted to a TIM or other material that is applied or transferred from the liner to the part or substrate. As another example, the textured portion of the tool (eg, the textured foam core of the mold, the Textured elastic materials, etc.) can be used to apply TIM or other material to the surface of the TIM or other material when the textured portion of the tool is used to compact, press or otherwise apply the TIM or other material from the carrier liner to the part or substrate Provides texturing. As a further example, a separate stencil may also be used during the transfer process between the carrier liner and the tool (eg, between the foam core of the mold, etc.) to transfer TIM or other materials from the carrier liner to the part or substrate Generate and leave texture. As yet another example, one or more indicia from the item may also be transferred from the item between the backside of the foam core (or another elastic material) and the tool to be transferred to the part or substrate. The surface of the TIM or other material provides texturing. This finding allows for microtexturing of TIM and other materials during coating/transfer processing. Texturing of the surface can improve or aid in air removal and depressurization during assembly. The texturing of the surface can reduce contact components and make the TIM or other material softer and more compliant. Texturing can also be used to create identification marks on TIM or other materials transferred or coated from a liner or other supply. Micro-textured surfaces on TIM or other materials can also provide EMI shielding and/or absorption benefits. The conductive ink or other conductive substance on the liner can be transferred from the liner to the TIM or other material, resulting in a textured surface (eg, frequency selective surface (FSS), mesh, etc.) for EMI shielding purposes.

In an exemplary embodiment, the liner can be completely removed and not left because only a portion of the TIM or other material can be transferred from the liner and left on the part or substrate. In alternative embodiments, at least a portion of the carrier liner may remain on the portion of the TIM or other material that is transferred from the carrier liner to the substrate or part. This can be accomplished, for example, by cutting through the carrier liner with high pressure and/or sharp dies. The remaining portion of the carrier liner from the carrier liner that is transferred along with the TIM or other material may be useful for protection as a protective cover, providing labels, providing tabs, and/or other reasons. In other embodiments, downstream assist actions may be employed to subsequently add caps, tabs or substrates to portions of the TIM or other material previously applied to the substrate or component. Subsequent addition of covers, tabs, or liner may be useful for protection as a protective cover during shipping, providing labels, providing tabs, and/or other reasons. For example, if components are not assembled in a timely manner, TIM or other materials may be susceptible to contamination or other defects The sag effect so that the protective cover can be beneficial, eg, during transportation, during installation and assembly, and the like.

In an exemplary embodiment, a tool (eg, mold, etc.) is used to compact a TIM or other material from a supply to a substrate or component (eg, lid, BLS, heat source, heat removal/heat dissipation structure, etc.). The tool may include a cavity and an elastic material within the cavity. The elastic material may include specially shaped foam pieces that allow for mitigating air entrapment and removal of air pockets. Foam shapes can be configured to apply air/bubble free material over larger element sizes (eg, about 20 millimeters (mm), etc.). The foam may be in the form of a cylindrical shape or a cylindrical, hemispherical, chamfered, or flat piece inserted into a mold with a curved surface (eg, oversized or braced, etc.).

Due to the nature of the materials involved, the coating of irregular and/or complex geometry elements may not be feasible using traditional peel-and-stick methods. In contrast, traditional peel-and-stick method elements are typically limited to square or rectangular shapes. Exemplary embodiments disclosed herein may be used to coat or transfer shapes with complex geometries and/or irregularities such as circles, letters, elements with negative space, other shapes such as those shown in FIG. 3 (eg, Elements or parts of TIM or other materials of stars, arrows, squares, ovals, etc.)) etc.).

In some exemplary embodiments, a single element or portion of thermal interface material (TIM) or other material may be applied or transferred to a single component or substrate in a single action (eg, a single stroke, a single press of a mold, etc.). In other exemplary embodiments, multiple elements or portions of the same or different TIM and/or other materials may be applied or transferred simultaneously to different regions of the same single part or substrate in a single action or multiple upward mold strokes, for example. . In further exemplary embodiments, multiple parts or substrates of the same or different TIMs and/or other materials may be applied or transferred simultaneously to multiple parts or substrates, eg, by using a multiple-up mold (eg, in a single press of the mold) element or part.

In some exemplary embodiments, a single action (eg, a single stroke, a single press of the mold, etc.) is performed that includes the use of a foam core (or other elastic material) to adhere the TIM or other material to the part or substrate , and use a die edge (for example, the edge of a steel ruled die, a die tools, integrated circuit molds, etc.) imprint TIM or other material for release. Adhering and embossing can be done in a single stroke. In other exemplary embodiments, multiple actions (eg, multiple strokes, etc.) may be performed to adhere and imprint a TIM or other material. This may include first adhering or pre-adhering the TIM or other material with foam or other elastic material, and then using a mold (eg, blade mold, steel ruled mold, knife mold, integrated circuit mold, etc.) to imprint in a single action TIM or other material for release. Pre-sticking and embossing can be done on the same machine or on separate machines. Advantageously, sticking and imprinting in separate actions can help alleviate air entrapment and/or allow for faster overall processing.

In some exemplary embodiments, multiple actions (eg, multiple strokes, multiple printing actions, etc.) may be performed to stack materials of the same material or different materials (eg, TIM on TIM, etc.). Advantageously, this may allow for fewer SKUs (stock keeping units) by allowing a single thick layer to be built with multiple actions in the same location (eg, multiple 25 micron thick layers built into a final thick layer, etc.). This may also allow different layers to be placed or stacked on top of each other (such as a bottom or first TIM layer, an intermediate or second dielectric layer, and a top or third TIM layer, etc.). This may also allow for easier rework if not enough material is added.

In some exemplary embodiments, a mold is used to imprint in the TIM or other material to be transferred. For example, the raised base or edge of the integrated circuit can be used to make the imprints required to release and transfer TIM or other material from the supply. Oversized elastic material (eg, foam, etc.) or oversized molds including cores or cavities filled with elastic material (eg, foam, etc.) can be used to accomplish the transfer of imprinted TIM or other materials to lift bases or integrated circuits. Advantageously, this process may allow the entire surface of the lift submount or integrated circuit to be covered with TIM or other material.

At times, thermal interface materials or other materials may be required on both sides of an element, substrate or component. In some exemplary embodiments, thermal interface materials or other materials may be removed using dual heads (eg, dual print heads, etc.) that push the target element, component, or substrate in up/down, left/right, rotational, etc. movements Coated on both sides of the target element. Material applied to one side can be the same as applied to the other side of the element the same or different materials. By applying the TIM or other material to both sides of the element simultaneously, exemplary embodiments may allow for reduced processing and fixation time and/or cost compared to processes where the TIM may be applied to both sides of the element sequentially and not simultaneously .

Due to the construction or design of the target part, it may sometimes be necessary to print, apply or transfer TIM or other materials in various directions other than the up/down direction. Some exemplary embodiments include multi-directional printing capabilities such that TIMs or other materials can be printed, applied or transferred to target parts in various orientations (including but not limited to up/down, lateral, diagonal, rotational, reverse, etc.). This may include printing, coating, or transferring TIM or other materials on multiple sides (eg, double-sided, etc.) or multiple target surfaces.

Referring to the drawings, FIG. 2 illustrates an exemplary system for applying material (eg, transferring from one or more supplies, etc.) to a component according to an exemplary embodiment embodying one or more aspects of the present disclosure 100. While FIG. 2 shows thermal interface material 120 (broadly, material) applied to a cover or integrated heat spreader 124 (broadly, component), system 100 may also be used to apply thermal interface material 120 and other materials Applied to a wide range of other components and substrates (such as board level shields (eg, removable covers or covers of board level shields (BLS), etc.), heat sources (eg, central processing units (CPUs), etc.), heat removal /Heat dissipating structures or components (eg, heat spreaders, heat sinks, heat pipes, vapor chambers, device enclosures or housings, etc.), uneven surfaces or ridges (eg, along a series of connected heat pipes, etc.) . Thus, aspects of the present disclosure should not be limited to use with any single type of material, substrate, element, component or to the application of thermal interface material to any specific location or portion of a substrate, element or component.

As shown in FIG. 2 , the system 100 includes an extruder 104 coupled to a die 108 . In operation, the extruder 104 and the die 108 are operable to compact and cut, cut, tear, etc. the strip or tape 112 including the liner 116 and the thermal interface material (TIM) 120 below the die 108 . part. As disclosed herein, alternative embodiments may include tools of different configurations than the extruder 104 and the die 108 .

For example, the die 108 may comprise a rounded knife die. The rounding knife mold may include a foam-filled core. In alternative embodiments, the mold 108 may include filling There are cavities or cores of different elastic materials such as cotton, cork, gels, gel packs, rubber, elastomers, elastic plastics, elastic or sponge-like materials, fibrous materials, insulating materials, etc. In yet other embodiments, the mold 108 may not require a core filled with an elastic material, depending on the particular type of material applied or transferred by the system 100 .

In this example, the foam-filled core of the mold 108 can compress the TIM 120 down onto a corresponding one of the lids 124 located below the mold 108 . The rounding knife die may then remove (eg, cut, tear, sever, etc.) the TIM 120 with the liner 116 , for example, without having to pierce the liner 116 . During this removal operation, the TIM 120 is extruded downward, and the liner 116 is pushed through the TIM 120 with the die 108 , which causes the TIM 120 to cut, tear or otherwise cut from itself without cutting the liner 116 . cut. Although a very thin portion of the TIM 120 may be left between the cover 124 and the liner 116, this portion is so thin that it breaks away from the remainder of the TIM 120 when the TIM 120 is substantially cut. For example, TIM 120 may start with an initial thickness of approximately 125 microns. The mold 108 can force the liner 116 down into the TIM 120 until the TIM thickness is reduced to about 25 microns or pushed away. Thus, the TIM 120 can thus have sloped edges on all four sides due to this method.

As shown in FIG. 2 , when the mold 108 is removed, the TIM 120 may remain on the cover 124 , and the next portion of the strip 112 and the next cover 124 are moved to a position below the mold 108 . For example, cover 124 may be advanced or moved relative to mold 108 via a conveyor belt or other feed/conveyor mechanism.

In the illustrated embodiment, the material strip 112 including the liner 116 and the TIM 120 is a web from a supply or roll 128 . Rollers 132, 136, 140 are used to unwind the web of material 112 from the supply 124 of roll material and travel to a position below the die 108 for compaction and cutting. After the TIM 120 has been compacted and removed from the strip 112 and coated and transferred to the cover 124, the remaining material tape 144 may be collected or recycled, such as wound onto a waste roll 148, allowed to fall into a waste basket, Wait. In other embodiments, more or fewer rolls may be used, and/or strips of material that do not start on a roll may be used. In this case, the strip of material can be placed in place by hand, with a jig, or by automated means.

In an exemplary embodiment, the system 100 preferably utilizes as much material as possible to minimize or at least reduce waste during the coating process (eg, minimize the amount of TIM material left on the liner, etc.). As shown in FIG. 2, the caps 124 are spaced a distance greater than the distance that the strips 112 are advanced after each compaction and cutting (broadly, removal) operation. After each compaction and cutting operation, the strip 112 is only advanced enough to allow compaction and cutting, cutting, tearing, etc. the next portion of the strip 112 to apply the TIM 120 to the next cover 124 (eg, a minimum distance) . In an exemplary embodiment, the width of the TIM 120 along the liner 116 may be equal to the width of the sheet of the TIM 120 that is compacted and applied/transferred to the cover 124 . In another exemplary embodiment, the width of the TIM 120 along the liner 116 (eg, 1 inch, etc.) may be greater than the width of the sheet of the TIM 120 that is compacted and applied/transferred to the lid 124 (eg, 3/4 inches, etc.).

In an exemplary embodiment, the material strip 112 may also include an underlining disposed along the lower surface or bottom of the TIM 120 . In such an embodiment, the lower liner can be removed manually or automatically (eg, with rewind and stripper bars, etc.) before the mold 108 applies the TIM 120 to the cover 124, manually or without manual intervention.

In an exemplary embodiment, the system 100 may include one or more heaters that allow heat to be applied or added to the top and/or that allow heat to be applied or added to the base or bottom. Heat can aid in cutting, tearing, severing, etc. of the material and/or adhesion of the material to the part. Alternatively, for example, the heat may be used to cut or otherwise remove (eg, without a knife or blade, etc.) portions of the material from the supply. Additionally or alternatively, the system 100 may be configured with cooling, thermoelectric modules, such as added to the top and mold for cutting TIMs and the like. A mold may be added to the top plate in some exemplary embodiments.

The roll 128 (broadly, the supply) may be provided in various sizes, such as 0.5 inches (12.7 millimeters (mm)), 1 inch (25.4 mm), etc.). The roll width can be selected based on the component size. For example, if the cover 124 (broadly the element) is 10mm*5mm, a roll with a width of 0.5 inches (12.7mm) can be used. The roll 128 is placed on the unwinder and passed through the coater or system 100 . If the roll 128 includes an underlining, the underlining can be removed as the material is rewound with small rewinds. Cover 124 and mold 108 may Oriented in the coater or system 100 to maximize utilization of the thermal interface material. The cover 124 may be placed in a fixture during the coating step to ensure good or perfect positioning and TIM placement. For small batches, orientation can be performed manually by hand, but for large batches, orientation can be performed automatically, for example, by an automated table (eg, a rotatable table or other table, etc.). System 100 may include a sensor system that advances the roll of TIM material for the next TIM coating. Alternatively, the system 100 may be configured with a set distance advancement process. Heating and cooling can be provided to improve coating robustness.

4-6 illustrate an exemplary embodiment of a tool 202 that implements one or more aspects of the present disclosure. Tool 202 is configured to operatively transfer portions of material (eg, thermal interface materials, other materials, etc.) from a supply of material (eg, rolls, reels, tapes, etc.) to substrates, components, parts, or other targets surface. Tool 202 may be used with system 100 shown in FIG. 2 or other suitable systems.

In the exemplary embodiment, tool 202 includes a mold 208 (eg, a blade mold, etc.) that is configured to cut a portion of material along only one edge or side of the portion of material. The tool 202 also includes a resilient material 210 for compacting, pressing, pushing, etc. the entire portion of the material so that other remaining attached edges or sides of the portion of the material as the portion of the material is applied to the part To be torn, cut, separated or separated from a supply of material.

The mold 208 may have a closed shape (eg, rectangular, non-rectangular, etc.). The tool 202 may include a cavity filled with one or more different elastic materials 210, such as cotton, cork, gel, gel bags, rubber, elastomers, elastic plastics, elastic or sponge-like materials, fibrous materials, insulation materials, other elastic materials, etc. For example, mold 208 may include a blade mold with a foam-filled core or a central foam core. In other embodiments, depending on the specific type of material applied or transferred by the system 100, the mold 108 may not require a core filled with an elastic material.

The elastic material 210 of the tool 202 may include a specially shaped sheet of elastic material (eg, foam, etc.) that allows for mitigation of air entrapment and for removal of air pockets and/or air bubbles. In this exemplified embodiment In this formula, the elastic material 210 may comprise a foam having a convexly curved, outwardly curved shape, or other suitable non-planar shape for the foam to be pressed or pushed as portions of the material are applied to the part to cause the The uncut sides or edges of the portion of material are torn, severed, separated or separated from the supply of material to extrude or force air bubbles or air pockets from the material portion.

One or more alignment members 214 (eg, pins, posts, guides, spring-loaded retractable pins, etc.) are provided or disposed about the mold 208 . Alignment member 214 may be configured to help align a supply of material (eg, roll of material, etc.) and press components of the material-applied portion to help inhibit lift when the liner is peeled off.

In the illustrated exemplary embodiment, the alignment member 214 includes a set of four pins or posts, each of which is adjacent to one of the four corners of the rectangular blade mold 208 in this example. The four pins or posts 214 may be retractable, compressible, spring loaded, or otherwise configured for pressing and/or applying a force (eg, spring force, etc.) against the component to Helps inhibit lift when the liner is peeled or otherwise removed from portions of the material applied to the part. In an exemplary embodiment, the four pins or posts 214 are retractable relative to the support surface or substrate 218 on which the pins or posts 214 are mounted and/or coupled.

Cooling units, cooling modules or devices (eg, recirculation coolers, thermoelectric modules, etc.) may be positioned before or upstream of tool 202 . The cooling module may be used to reduce the temperature of the material before portions of the material are applied to the component. Lowering the temperature of the material increases the stiffness of the material and reduces the release force required to release the liner from the material. The increased material hardness and reduced release force will make it easier to partially peel or otherwise remove the liner from the material applied to the part, which in turn may allow for a reduction in failure rates associated with material breakage during liner peel.

As shown in FIG. 6 , extruder 204 is coupled with die 208 . In operation, extruder 204 , die 208 and elastomeric material 210 apply portions of thermal interface material from supply 212 (eg, a strip or tape, including liner 216 and TIM 220 , etc.) to part or target 224 . For example, the TIM 220 The process of partially applying to the target 224 may include moving (eg, lowering, etc.) the die 208 relative to the target 224 via the extruder 204 and pressing the die 208 against the target 224 for a period of time (eg, a 2 or 3 second pause, etc.), The mold 208 is then moved (eg, lifted, etc.) relatively away from the target 224 .

At this point, the liner 216 needs to be peeled, separated or removed from the TIM 220. In conventional processing, due to the release force, the bottom of the target 224 would be lifted slightly and then dropped (if the weight is greater than the release force). And, if not inspected, it increases the failure rate of materials such as cracks, bubbles, etc. In the exemplary embodiments disclosed herein, pins 214 are provided around mold 208, which can help eliminate this problem. For example, when mold 208 is pressed against target 224, pin 214 may be compressed or retracted. As mold 208 moves away from target 224 (eg, lifts, etc.), pin 214 may then provide a force against target 224 (eg, from a compressed spring-loaded pin, etc.) to help hold target 224 down In place and inhibit lift of target 224 .

Pins 214 also help guide and align material 212 and seat it relative to mold 208 and part 224 . This in turn can provide better positioning accuracy in the Y direction, which is the vertical direction in FIG. 6 .

This exemplary embodiment may be used to coat or transfer portions of TIM or other material from a disk or roll onto the surface of a part or substrate, such as shown in FIG. 2 . In this example of a disk-to-disk or roll-to-roll process, tool 202 (eg, blade mold 208 and foam 210, etc.) is located on a supply disk or roll (eg, supply body 128, etc. in FIG. 2, etc.) and the tightening or scrap between disks or rolls (eg, waste 148 in Figure 2, etc.). System components can be run at a given speed such that portions of material are transferred from the supply roll or reel to the surface of the substrate or component.

This exemplary embodiment, including tool 202, may provide one or more (but not necessarily any or all) of the following features or advantages, such as easier transfer from a roll of material to a target surface, The material is positioned on the target surface, a wider and/or more variety of available target surfaces, and so on. Using alignment member 214 and mold 208, the system can be used to Material is applied to the part. Alignment members 214 may be used to direct the material to the correct position relative to the mold 208 and elastic material 214 (eg, below, etc.) and relative to (eg, above, etc.) the component to apply the material applied to the part.

As mentioned above, the tool 202 may be used with the system 100 shown in FIG. 1 . In such an exemplary embodiment, the mold blade 208 may cut along only one side or edge of the portion of the TIM 120 , and the elastic material 210 may compact or press the TIM 120 down to the cover located below the mold 108 The corresponding one of 124 is capped. Tool 202 may be used to remove (eg, cut, tear, sever, etc.) TIM 120 by way of liner 116 , eg, without piercing liner 116 , or the like. During this removal operation, the TIM 120 may be pressed down and the liner 116 pushed through the TIM 120 with the tool 202 , causing the TIM 120 to be severed, torn or cut from itself without cutting the liner 116 . Although a very thin portion of the TIM 120 may remain between the cover 124 and the liner 116 , the portion is so thin that it breaks away from the rest of the TIM 120 , essentially cutting the TIM 120 .

As shown in FIG. 2 , the TIM 120 may remain on the cover 124 when the mold 208 and the elastic material 210 are removed and the next portion of the strip 112 and the next cover 124 are moved into place under the mold 208 and the elastic material 210 . For example, cover 124 may be advanced or moved relative to mold 208 and elastic material 210 via a conveyor belt or other feed/conveyor mechanism.

Figure 7 illustrates three different cutting modes (A, B, C) that can be used when applying material to a substrate, component, component or other target surface in accordance with an exemplary embodiment. Among them, 111 represents the material supply body, 222 represents the material part, 333 represents the material left, and 444 represents no material left. As shown, the first die cutting mode (A) includes cutting all four sides or edges with a blade die. With this first die cutting mode (A), a large amount of material (residues) will be lost, but the dimensional accuracy determined by the blade die will be good.

The second die cutting mode (B) involves cutting two opposing sides or edges with a blade die. By this second die cutting mode (B), compared to the first die cutting mode (A), it is possible to reduce Loss of material (waste). However, when using the second die cutting mode (B), different roll widths may be required to meet different width requirements, since the width of the applied material (eg, TIM, etc.) is determined by or equal to the material roll width.

The third die cutting mode (C) involves cutting a single side or edge with a blade die. With this third die cutting mode (C), the length of the applied material (eg, TIM, etc.) is determined by or equal to the distance traveled by the roll of material.

In an exemplary embodiment, a system for applying a material to a component may generally include a tool capable of operatively transferring a portion of the material from a supply of material to the component. The first portion of the tool is configured to cut along a single side or edge of the portion of material. the second portion of the tool is configured to compact, press or push the portion of the material so that the uncut side or edge of the portion of the material attached to the supply of material is torn from the supply of material, cut, separate or separate.

The first portion of the tool may include a blade configured to cut along a single side or edge of the portion of material. The second portion of the tool may comprise an elastic material configured to compact, press or push against the portion of the material such that the uncut side or edge of the portion of the material attached to the supply of material is Tear, cut, separate or separate from a supply of material.

The tool may include a blade die having a first portion configured to cut along a single side or edge of the portion of the material. The second portion may comprise an elastic material configured to cause the material to attach to a supply of the material when the elastic material is compacted, pressed or pushed against the portion of the material Alleviates air entrapment and removes air pockets and/or air bubbles from the portion of the material when the uncut side or edge of the portion is torn, severed, separated or separated from the supply of the material.

The second portion may comprise foam configured for the foam to be configured for when the foam is compacted, pressed or pushed against the portion of the material and attached to the material The uncut side or edge of the portion of the material of the supply is torn from the supply of the material When opening, severing, separating or separating, air bubbles or packets of air are extruded or forced away from the portion of the material.

The second portion may have a convexly curved outer surface.

The system may include one or more alignment members configured to assist in aligning the portion of the material with the tool and the component and/or when removing the portion of the material. Helps inhibit lift of the part when the liner is partially removed.

The system may include means for reducing the temperature of the portion of the material before the portion of the material is applied to the component, increasing the temperature of the portion of the material by reducing the temperature of the portion of the material increase the stiffness of the portion of the material and reduce the release force required to peel the liner from the portion of the material.

The system may include one or more compressible and/or retractable pins configured to help guide the portion of the material into position relative to the tool and the component.

The tool may include a blade mold having a rectangular shape including four corners. The system may also include four compressible and/or retractable pins, each pin adjacent one of the four corners of the blade die, the compressible and/or retractable pins A pin is configured to help guide the portion of the material into position relative to the tool and the component.

In an exemplary embodiment, a system for applying a material to a component generally includes a tool capable of operatively transferring a portion of the material from a supply of material to the component. The system also includes means for reducing the temperature of the portion of the material before the portion of the material is applied to the component. By reducing the temperature of the portion of the material the stiffness of the portion of the material can be increased and the release force required to peel the liner from the portion of the material can be reduced.

The tool may include a blade configured to cut along at least one side or edge of the portion of the material. For example, the blade may be configured for use along a single side or edge as shown in FIG. 7 edge, two opposite sides or edges, or all sides or edges cut. The tool may comprise an elastic material configured to compress, press or push against the portion of the material to cause the portion of the material to be attached to the supply of the material. The uncut side or edge is torn, severed, separated or separated from the supply of material.

The elastic material may be configured for use when the elastic material is compacted, pressed or pushed against the portion of the material and attaches the uncut side of the portion of the material to the supply of the material Air entrapment is alleviated and air pockets and/or air bubbles are removed from the portion of the material as the edges are torn, severed, separated or separated from the supply of the material.

The system may include one or more alignment members configured to assist in aligning the portion of the material with the tool and the component and/or when removing the portion of the material Helps inhibit lift of the part when the liner is removed.

The system may include one or more compressible and/or retractable pins configured to help guide portions of material into position relative to tools and components.

The tool may include a die including a blade having a rectangular shape including four corners. The system may include four spring-loaded compressible and/or retractable pins, each pin adjacent one of the four corners of the blade die. A spring-loaded compressible and/or retractable pin may be configured to help guide the portion of the material into place relative to the tool and component.

In an exemplary embodiment, a system for applying a material to a component generally includes a tool capable of operatively transferring a portion of the material from a supply of material to the component. The system also includes one or more compressible and/or retractable pins configured to help guide the portion of the material into position relative to the tool and component.

The one or more compressible and/or retractable pins may be configured to help inhibit lift of the component when the liner is removed from the portion of the material.

The tool may include a blade configured to extend along the portion of the material to Cut one side or edge less. For example, the blade may be configured to cut along a single side or edge, two opposing sides or edges, or all sides or edges as shown in FIG. 7 . The tool may comprise a resilient material configured to compact, press or push the portion of the material to cause the portion of the material attached to the supply of the material to The uncut side or edge of the portion is torn, severed, separated or separated from the supply of material.

The elastic material may be configured to cause the uncut side or the uncut side of the portion of the material to be attached to the supply of the material when the elastic material is compacted, pressed or pushed against the portion of the material. Air entrapment is alleviated and air pockets and/or air bubbles are removed from the portion of the material as the edges are torn, severed, separated or separated from the supply of the material.

The system may include means for reducing the temperature of the portion of the material before the portion of the material is applied to the component. Decreasing the temperature of the portion of the material may increase the stiffness of the portion of the material and may decrease the release force required to peel the liner from the portion of the material.

The tool may include a blade mold having a rectangular shape including four corners. The one or more compressible and/or retractable pins may include four compressible and/or retractable pins, each pin adjacent one of the four corners of the blade mold.

In an exemplary embodiment, a method for applying a material to a component generally includes transferring a portion of the material from a supply of material to the component. The method may include one or more of the following steps: cutting along a side or edge of the portion of the material and compacting, pressing or pushing the portion of the material to cause the attachment the uncut side or edge of the portion of the material at the supply of the material is torn, severed, separated or separated from the supply of the material; and/or at the portion of the material lowering the temperature of the portion of the material before being applied to the part, increasing the hardness of the portion of the material by lowering the temperature of the portion of the material and reducing the amount of the material from the material the release force required to partially release the liner; and/or use one or more compressible and/or retractable pins to guide the portion of the material in place relative to the component.

The step of cutting along a single side or edge of the portion of material may include cutting along a single side or edge of the portion of material using a blade die.

The step of compressing, pressing or pushing the portion of the material may comprise compressing, pressing or pushing the portion of the material using an elastic material such that all portions attached to the supply of the material The uncut side or edge of the portion of the material is torn, severed, separated or separated from the supply of the material.

The step of using the elastic material to compress, press or push the portion of the material may also include using the elastic material to squeeze or force bubbles or packets of air from the portion of the material The package exits from the portion of the material.

As shown in Figure 7, the method may include cutting along one side, two opposite sides, or all sides of the portion of the material using a blade die.

FIGS. 8-21 illustrate a method for applying material 320 (eg, thermal interface material, other materials, etc.) to a target surface 324 (eg, a component) from a supply 312 (eg, roll, reel, tape, etc.) of material 320 , substrates, components, plates, target surfaces of other materials, other target surfaces, etc.) exemplary embodiments of a system 300 . In the exemplary embodiment, system 300 includes a rolling device or roller 360 (broadly a tool or device) configured to move relative to an upper liner 316 (eg, a carrier liner, etc.) of a supply 312 of material 320 ).

For example, the liner 316 may comprise a polyethylene terephthalate (PET) liner with a release coating. Also, for example, material 320 may include an interstitial thermal interface material (eg, Tflex ^™ UT20000 series ultra-thin interstitial thermal interface material, etc.). In an exemplary embodiment, material 320 includes a ceramic-filled silicon elastomer that does not include embedded reinforcing glass fibers, is electrically non-conductive, has a thermal conductivity of about 3 W/mK, has a V0 flammability rating, from -40°C Stable to 200°C with a Shore Hardness (3 seconds) of 55 Shore 00 at 0.41mm to 1mm and 85 Shore 00 at 0.2mm to 0.38mm, and/or with a hardness of from about 0.2mm (mm) to about 1.0 thickness in the range of millimeters. In other exemplary embodiments, other materials may also be used with system 300 .

The rolling device/roller 360 can be moved down into contact with the liner 316 (FIGS. 10 and 11), and can then be rolled along the liner 316 (FIGS. 11-13) to roll a portion of the material 320 from the supply 312 along the Part 324 (broadly the target surface) is positioned. At the same time, as the rolling device/roller 360 rolls along the liner 316, the rolling device/roller 360 is also capable of operatively forcing or removing air pockets and/or air bubbles from portions of the material 320. Partial extrusion (widely removal). See, for example, FIG. 20 illustrates a thermal interface material (TIM) 320 (broadly a material) applied by the system 300 to a component 324 (eg, a plate, other target surface, etc.) such that no air pockets and/or bubbles are present in the visible in the TIM 320. For example only, the TIM 320 shown in FIG. 20 may have a thickness of about 0.5 mm, a width of about 55.5 mm, and a length of about 55.5 mm. These specific dimensions are examples in nature, as system 300 may be configured differently to coat smaller or larger portions of material 320 .

As shown in FIG. 9 , system 300 includes tool 302 configured to operatively transfer a portion of material 320 from liner 316 to component 324 . Tooling 302 may be similar or substantially identical to tooling (eg, extruder 104 and die 108 ) and/or tooling 202 ( FIGS. 4-6 ) of system 100 ( FIG. 2 ) disclosed herein. In other words, the tooling (eg, extruder 104 and die 108 ) and/or tool 202 ( FIGS. 4-6 ) of system 100 ( FIG. 2 ) may be used with the system 300 shown in FIGS. 8-21 .

The rolling device/roller 360 can operatively force air pockets and/or air bubbles away from the portion of the material 320 before the tool 302 transfers the portion of the material 320 from the liner 316 to the part 324 320 is partially extruded or removed. After the rolling device/roller operation, the tool 302 may then be used to sever, tear, separate, separate, and/or cut portions of the material 320 for release and transfer from the liner 316 of the supply 312 of material. As shown in FIGS. 16-18 , the tool 302 may be configured to operatively remove a portion of the material 320 from the material 320 without removing a portion of the material 320 from the component 324 when the tool 302 is removed and retracted upwardly away from the component 324 . Part of the liner 316 is removed and/or released.

As shown in FIGS. 10 and 11 , the system 300 may move the rolling device/roller 360 down into contact with the liner 316 of the supply 312 of material. The system 300 can then roll the rolling device/roller 360 (right to left in FIGS. 12 and 13 ) along the liner 316 while the rolling device/roller 360 is in contact with the liner 316 . Thereafter, as shown in FIGS. 13 and 14 , the system 300 may move up or retract the rolling device/roller 360 away from the liner 316 and out of contact with the liner 316 . The system 300 can move the rolling device/roller 360 (horizontally from left to right in Figures 14 and 15) back to its original starting position.

In the exemplary embodiment, tool 302 and rolling device or device 360 may be coupled for common horizontal and vertical movement. For example, the system 300 may move the rolling device/roller 360 with the die 308 of the tool 302 vertically or horizontally. The system 300 may also be configured such that the rolling device/roller 360 can also or alternatively be moved independently of the die 308 of the tool 302 .

11-13, the rolling device/roller 360 may be configured to contact the liner 316 at a non-perpendicular angle (eg, an angle of about 60 degrees, an angle of about 45 degrees, other acute angles, other non-perpendicular angles, etc.). The rolling device/roller 360 can be moved along the liner 316 (eg, automatically rolled by the system 300 along and in contact with the liner 316, etc.) to apply pressure (eg, down, against, or along the liner, etc.) to The portion of the material 320 is positioned against the component 324 from the supply 312 without removing or transferring the portion of the material 320 from the liner 316 . When rolling the rolling device/roller 360 along the liner 316 , the pressure applied by the rolling device/roller 360 to the liner 316 , against or along the liner 316 may act by removing air pockets from portions of the material 320 and /or air bubbles to help alleviate air entrapment. For example, the rolling device/roller 360 may be configured such that the rolling device/roller 360 applies pressure to the liner 316 (eg, is pressed or pushed against the liner 316 ) as the rolling device/roller 360 rolls along the liner 316 . ), the air pockets and/or air bubbles are extruded or forced away from the portion of material 320 and/or from below it.

In an exemplary embodiment, the rolling device/roller 360 may include an elastic material to reduce the force applied by the rolling device/roller 360 to the material 320 of the supply body 312, which may, for example, help The protective material 320 is not affected by thickness deformation or the like. For example, the supply of material 312 may comprise a relatively soft thermal interface material (TIM) or other material. Rollers/rollers 360 may include or be covered with a relatively soft foam or other elastic material (eg, rubber, elastomer, elastic plastic, elastic or sponge-like material, fibrous material, insulating material, other elastic material, etc.).

Tool 302 may include a cavity filled with one or more different elastic materials, such as cotton, cork, gel, gel bag, rubber, elastomer, elastic plastic, elastic or sponge-like material, fibrous material, insulating material , other elastic materials, etc. For example, mold 308 may include a blade mold with a foam-filled core or a central foam core. In other embodiments, depending on the specific type of material applied or transferred by system 300, mold 308 may not require a core filled with an elastic material.

In an exemplary embodiment, system 300 may include a cooling unit, cooling module, or device (eg, a recirculation cooler, thermoelectric module, etc.) for reducing the temperature of material 320 prior to applying portions of material 320 to component 324 . Decreasing the temperature of the material can increase the stiffness of the material and reduce the release force required to peel the liner 316 from the material 320 . The increased material stiffness and reduced release force will make it easier to peel or otherwise remove the liner 316 from the portion of the material 320 applied to the component 324, which in turn may allow for a reduction in the associated material breakage during liner peel. failure rate.

In an exemplary embodiment, die 308 is coupled to the extruder such that die 308 can be moved (eg, lowered, etc.) relative to part 324 or other target surface via the extruder. The extruder may be operable to press the die 308 against the part 324 for a period of time (eg, a pause of 2 or 3 seconds, etc.) and then move (eg, lift, retract, etc.) the die 308 relative to the part 324 . During this operation, the material 320 can be pressed down and the gusset 316 can be pushed through the material 320 using the tool 302, which results in the material 320 being severed, torn apart from itself without cutting the gusset 316 or cut. While a very thin portion of material 320 may remain between component 324 and liner 316 , this remaining portion may be so thin that it detaches from the remainder of material 320 , essentially cutting material 320 . The material 320 may remain on the part 324 as the mold 308 is moved or retracted away from the part 324 .

In the exemplary embodiment, material strip 312 including liner 316 and TIM 320 (broadly material) is a web from a supply or roll 328 . Rollers 332 , 340 may be used to unwind the web of material 312 from the supply 328 of roll material and travel to a position below the rolls/rollers 360 and the die 308 . After the TIM 320 has been applied and transferred to the part 324, the remaining material tape 344 may be collected or recycled, eg, wound onto a waste roll 348, allowed to fall into a waste basket, and the like. Thus, this exemplary embodiment may be used to apply or transfer portions of TIM or other materials from a disk or roll onto a surface or target surface of a component. In this example of a reel-to-reel or reel-to-reel process, the rolling device/roller 360 and tool 302 are between the supply reel or reel 328 and the take-up or waste reel or reel 348 . In other embodiments, more or fewer rolls may be used, and/or a strip of material that is not wound on a roll may be used. In this case, the strip of material can be placed in position by hand, with a gripper or by automated means.

FIGS. 8 and 20 illustrate the component 324 being manually placed onto and removed from the support surface 318 of the system 300 . In other exemplary embodiments, such as the system 100 shown in FIG. 2 , etc., the component 324 is automatically positioned (eg, placed below, aligned with the material supply 312 , the rolling device/roller 360 , and the tool 302 ) , mobile, etc.). For example, components may be aligned with and moved relative to tool 302 and rolls/rollers 360 via a conveyor belt or other feed/transport mechanism.

Accordingly, exemplary embodiments disclosed herein may include rolling devices or rollers configured to be moved into contact with and pressed against a liner (eg, carrier liner, etc.) of a supply of material. The rolling device/roller is capable of moving along the lining when in contact with the lining (eg auto-rolling, etc.), thereby applying pressure to the lining. The pressure applied to the liner by the rolling device/roller positions, presses or pushes portions of the material from the supply against the part (broadly the target surface) while also forcing air pockets and/or air bubbles from the portion of the material and/or exit, extrude or remove air pockets and/or air bubbles from and/or from below portions of the material.

Before removing the liner from the portion of the material along the part, make the rolling device/roller along the The backing liner (eg, carrier liner, etc., which is along the upper surface of the material of the supply body) moves relatively (eg, automatically moves down into contact therewith, etc.). The rolling device/roller may be configured to contact the liner at a non-perpendicular angle (eg, an angle of about 60 degrees, an angle of about 45 degrees, other acute angles, other non-perpendicular angles, etc.). The rolling device/roller moves along the liner (eg, rolls automatically along and in contact with the liner, etc.) to apply pressure (eg, down, against, or along the liner, etc.) With removal or transfer from the liner, a portion of the material from the supply is positioned against the component. The pressure applied by the rolling device/roller to the liner, against or along the liner when rolling the tumbling device/roller along the liner can alleviate air entrapment by removing air pockets and/or air bubbles from the material. For example, the rolling device/roller may be configured to encapsulate air as the rolling device/roller applies pressure to the liner (eg, is pressed or pushed against the liner) as the rolling device/roller rolls along the liner and/or air bubbles are extruded or forced out of a portion of the material and/or from below it, and/or air bubbles are forced away from the portion of the material and/or from below.

In an exemplary embodiment, the rolling device/roller includes an elastic material (eg, a roller covered with a relatively soft foam or other soft elastic material, etc.) to reduce the force applied to the material by the rolling device/roller, eg, This can help protect the material from thickness deformation, etc. For example, the material to be applied by the system may include a relatively soft thermal interface material (TIM) or other material. Rollers/rollers may comprise relatively soft foam or other elastic materials (eg, rubber, elastomers, elastic plastics, elastic or sponge-like materials, fibrous materials, insulating materials, other elastic materials, etc.).

In an exemplary embodiment, the rolling device/roller is the first tool, and the system further includes a second tool operative to transfer the portion of the material from the supply to the component. The rolling device/roller can be operable to force air pockets and/or air bubbles away from, extrude air pockets and/or air bubbles from the portion of the material before the second tool transfers the portion of the material from the supply to the part or remove. The second tool may be configured to operatively sever, tear, separate, separate and/or cut portions of material for release and transfer from the liner of the supply of material. The second tool may be configured to be operative to not remove the portion of the material from the part when the second tool is removed Next, the liner (eg, carrier liner) is removed and/or released from the portion of the material.

Thus, the rolling device/roller may be configured to be movable into contact with and along the liner to push or press portions of the material along (eg, under it, etc.) against the component, thereby When the rolling device/roller rolls along the liner while in contact with the liner, the air pockets and/or air bubbles are forced away from or extruded from the portion of the material.

In an exemplary embodiment, the rolling device/roller may be configured to move into contact with and roll along the liner at a non-perpendicular angle relative to the liner. The rolling device/roller may comprise an elastic material (eg foam, etc.) that rolls in contact with the lining to apply pressure to the lining to force air pockets and/or as the elastic material of the rolling device/roller rolls along the lining Air bubbles exit, extrude or remove air pockets and/or air bubbles from a portion of the material.

The rolling device/roller may be configured to be automatically moved by the system relative to the supply of material to automatically position the portion of material from the supply along the part such that when the rolling device/roller is automatically moved relative to the portion of the material At the same time, the air pockets and/or air bubbles are automatically forced away from, squeezed out or removed from the portion of the material.

In an exemplary embodiment, the system can include a first tool having a convexly curved outer surface configured to slide or translate along the portion of the material when the convexly curved outer surface is capable of sliding (eg, For rolling, etc.), the air pockets and/or air bubbles are forced away from, squeezed out or removed from the portion of the material.

Exemplary embodiments of systems for applying (eg, transferring from a supply, etc.) thermal interface materials and other materials to components are disclosed. For example, thermal interface materials or other materials can be applied to a wide range of substrates, components, and components such as lids or integrated heat spreaders for integrated circuit (IC) packages, board level shields, heat sources such as central processing units ( CPU), etc.), heat removal/dissipation structures or components (eg, heat spreaders, heat sinks, heat pipes, vapor chambers, device enclosures or housings, etc.), etc.).

In an exemplary embodiment, the system may include a supply of material (eg, a thermal barrier rolls, reels or tapes of face material or other materials, etc.) and tools (eg, dies, etc.). The tool may operate to push (eg, compact, etc.) and remove (eg, cut, tear, shear, sever, separate, etc.) portions of the material from the supply between the tool and the component.

Materials may include non-metals. A portion of material may be coupled to a component without any diffusion bonding or welded joints between the portion and the component.

The liner may be along the surface of the supply of material. The tool is operable to remove a portion of the material from the supply by means of a liner. For example, the tool may be operable to push the lining through the portion of the material to sever the portion of the material from the supply without having to pierce the lining.

The tool may include a mold operable to compact and cut a portion of the material from the supply body between the tool and a corresponding one of the components. For example, the tool may include a rounding knife die with a foam-filled core. A foam-filled core can be used to compact portions of the material down onto the part. A rounding knife die may be used to cut portions of material from a supply body with a liner.

The system may be configured such that the portion of the material remains on the component, and the liner is removed from the portion of the material when the tool is removed and moved (eg, lifted up, etc.) away from the portion of the material. The system may be configured to remain on the part when the tool is removed and the next portion of the supply of material and the next part are moved to the location to which the material was applied.

The system may include a sensor system that advances a supply of material for subsequent application to subsequent components. Alternatively, the system may be configured with a set distance advancement process for the supply of material. The system may include a jig in which the part is placed and oriented relative to the mold to place material on the part. Components may include integrated circuit (IC) package lids or integrated heat spreaders, board level shields, heat sources (eg, central processing units (CPUs), etc.), heat removal/heat dissipation structures or components (eg, heat spreaders) , heat sinks, heat pipes, steam chambers, device enclosures or shells, etc.)

The system may be configured with heating and/or cooling features (eg, recirculating heater/cooling devices, thermoelectric modules, etc.) for applying heat and/or cooling during application of the material to the component, which These heating and/or cooling features may aid in the cutting, adhesion, release of TIM or other materials from the liner, temperature control of components and liner, and the like. For example, heat can aid in cutting of the material and/or adhesion of the material to the part. Alternatively, for example, the heat may be used to cut or otherwise remove (eg, without a knife or blade, etc.) portions of the material from the supply.

The system may include a roll of a supply of material. The rollers may be arranged to cause the supply of material to travel from the roll unwind and to a position aligned with the tool. Waste collection (eg, waste rolls, trash cans, etc.) can be used to collect the unused portion of the supply of thermal interface material that remains after the material has been applied to the part. The material may be a thermal phase change material without any tabs. As another example, a system or method may be configured to apply (eg, transfer from a roll, etc.) a thermal interface material or other material to a substrate (such as a film) to make a tab article or the like.

Exemplary embodiments of methods for applying materials to components are also disclosed. For example, thermal interface materials or other materials can be applied to a wide range of substrates and components (such as lids or integrated heat spreaders for integrated circuit (IC) packages, board level shields, heat sources (eg, central processing units (CPUs)) etc.), heat removal/heat dissipation structures or components (eg, heat spreaders, heat sinks, heat pipes, vapor chambers, device enclosures or housings, etc.), etc.).

In an exemplary embodiment, the method generally includes compacting and removing (eg, cutting, tearing, shearing, severing, separating, etc.) the portion of the material from the supply of material that is aligned with the component such that the portion of the material is It is applied to the components without diffusion bonding of the portion of the thermal interface material to a corresponding one of the components.

Compaction and removal may include pressing a tool (eg, a mold, etc.) with a liner disposed along the surface of the supply of material such that a portion of the material remains on the part and is removed and moved relatively away from the portion of the material after the tool is removed When the lining is removed from the material section. The method may include using a tool to push the liner through the portion of the material to sever the portion of the material from the supply without piercing the liner.

Compacting and removing may include using a tool to compact and remove portions of the material from the supply between the tool and the component.

The tool may include a mold, such as a radius knife mold with a foam-filled core, or the like. In this case, the method may include the steps of: using a foam-filled core for compacting the portion of the material onto the part; and using a radius knife die to cut the portion of the material from the supply of material.

The method may include advancing a corresponding one of the parts having material thereon away from the tool; and advancing a supply of material and the next part into a position aligned with the tool for applying the material to the next part. Advancing the supply of material may include the use of rollers to unwind and advance the supply of material from the supply roll to a position aligned with the tool. The method may include collecting unused portions of the supply of material that remain after the material is applied to the part.

Materials may include non-metals. The method may include the step of coupling a portion of material to the component without any diffusion bonding or welded joints between the portion and the component.

The method may include the steps of advancing a supply of material for subsequent application to the part while advancing the process using a sensor system or a set distance. The method may further comprise the step of placing the part in the fixture such that the part is oriented to place the material on the part. Components may include integrated circuit (IC) package lids or integrated heat spreaders, board level shields, heat sources (eg, central processing units (CPUs), etc.), heat removal/heat dissipation structures or components (eg, heat spreaders) , heat sinks, heat pipes, steam chambers, device enclosures or shells, etc.) The method may also include heating and/or cooling during compaction and/or removal.

Another exemplary embodiment includes an integrated heat spreader and a thermal interface material or other material over the integrated heat spreader applied (eg, compacted and cut, transferred from a supply, etc.) by a system or method disclosed herein . The electronics may include a patented integrated heat spreader and central processing unit or processor die. The integrated heat spreader may be operable to spread the heat generated by the central processing unit or processor die.

Another exemplary embodiment includes a board level shield (BLS) and shielding at the board level A thermal interface material or other material applied (eg, compacted and cut, transferred from a supply, etc.) by a system or method disclosed herein over a piece (BLS). The BLS may be adapted to provide electromagnetic interference (EMI) shielding for at least one component on the substrate. The BLS can include one or more sidewalls that define an opening and are configured to be mounted to the substrate generally around at least one component on the substrate; and a cover configured to cover by one or more A plurality of sidewalls define openings. Thermal interface material can be applied to the cover. When the one or more sidewalls are mounted to the substrate generally around the at least one component and the cover covers the opening defined by the one or more sidewalls, the thermal interface material and the cover may cooperate to define a thermally conductive thermal path from the at least one component , and the BLS is operable to provide EMI shielding for at least one component. The cover may be integral with or removably attached to the one or more side walls.

Another exemplary embodiment includes an assembly that includes a heat removal/heat dissipation structure, a printed circuit board with a heat source, and coated thereon (eg, compacted and cut, transferred from a supply, etc.) by a system or method disclosed herein ) board level shields with thermal interface material or other materials. The one or more sidewalls are mounted to the printed circuit board with the opening over the at least one component. The cover is positioned on the one or more side walls such that the opening defined by the one or more side walls is covered by the cover. The thermal interface material and the cover cooperate to define a thermally conductive thermal path from the heat source to the heat removal/heat dissipation structure. Board level shields are operable to provide EMI shielding from heat sources. The heat removal/heat dissipation structure may be a heat spreader. The heat source may be an integrated circuit on a printed circuit board.

A wide range of thermal interface materials and other materials (eg, non-thermally enhanced materials, thermal insulators, dielectric insulation, electrical insulators, conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, other The combination, its individual layers, its pairs of stacks, etc.) may be used in exemplary embodiments such as material 120 shown in FIG. 2, material 220 shown in FIG. 6, material 320 shown in FIG. 20, and the like. Advantageously, the exemplary embodiments disclosed herein may allow the production of TIMs that will have relaxed characteristics over current TIMs. Ease of handling and coating is important for TIM, but softness, shear thinning, and modulus that contribute to performance result in more difficult to coat materials. The exemplary coating processes disclosed herein may Allows easier application of materials that are often difficult to apply but have better properties.

Exemplary thermal interface materials that may be used in exemplary embodiments include thermal interstitials, thermal phase change materials, thermally conductive EMI absorbers or hybrid thermal/EMI absorbers, thermal putties, thermal pads, and the like. For example, exemplary embodiments may include a thermally conductive EMI absorber or a hybrid thermal/EMI absorber that is compacted, cut, and applied to a portion of an EMI shield, such as a shroud or cover or a board-level shield.

Exemplary embodiments may include one or more thermal interface materials produced by Laird (such as Tputty ^™ 502 series thermal gap fillers, Tflex ^™ series thermal gap fillers (eg, Tflex ^™ 300 series thermal gap fillers) , Tflex ^TM 600 series thermal interstitial materials, Tflex ^TM 700 series thermal interstitial materials, etc.), Tpcm ^TM series thermal phase change materials (for example, Tpcm ^TM 580 series thermal phase change materials, Tpcm ^TM 780 series thermal phase change materials, Tpcm TM series thermal phase change materials ^TM 900 Series Thermal Phase Change Materials, etc.), Tpli ^TM Series Interstitial Materials (eg, Tpli ^TM 200 Series Interstitial Materials, etc.), IceKap ^TM Series Thermal Interface Materials, and/or CoolZorb ^TM Series Thermally Conductive Microwave Absorber Materials (eg, CoolZorb ^TM 400 series of thermally conductive microwave absorbent materials, CoolZorb ^TM 500 series of thermally conductive microwave absorbent materials, CoolZorb ^TM 600 series of thermally conductive microwave absorbent materials, etc.), etc.). In some exemplary embodiments, the thermal interface material may include compatible interstitial fillers with high thermal conductivity. For example, the thermal interface material may include Laird's thermal interface materials such as Tflex ^™ 200, Tflex ^™ HR200, Tflex ^™ 300, Tflex ^™ 300TG, Tflex ^™ HR400, Tflex ^™ 500, Tflex ^™ 600, Tflex™ one or more of ^TM HR600, Tflex ^TM SF600, Tflex ^TM 700, Tflex ^TM SF800 thermal gap filler).

The thermal interface materials disclosed herein may include elastomeric and/or ceramic particles, metal particles, ferromagnetic EMI/RFI absorbing particles, metal or fiberglass mesh in a base of rubber, gel or wax, and the like. Thermal interface materials may include compatible or conformal silicon pads, non-silicon based materials (eg, non-silicon based interstitials, thermoplastic and/or thermoset polymeric elastomer materials, etc.), silk screen materials, polyurethane foams or gels, thermally conductive additives Wait. Thermal interface materials can be configured to be sufficiently conformal, compatible, and/or soft (eg, do not have to undergo phase transitions or reflow, etc.) to pass at low temperatures (eg, room temperature of 20°C to 25°C, etc.) Bending to adjust tolerance or clearance, and/or to allow the thermal interface material to conform (e.g., compress against, etc.) tightly when placed into contact (e.g., compress against, etc.) , to match the surface with a tighter fit and packaging method, etc.).

The thermal interface materials disclosed herein may include soft thermal interface materials formed from elastomers and at least one thermally conductive metal, boron nitride, and/or ceramic filler, such that the soft thermal interface materials are formed even without undergoing a phase transition or It is also conformal in the case of reflow. In some exemplary embodiments, the first and/or second thermal interface materials may comprise ceramic filled silicon elastomers, boron nitride filled silicon elastomers, or thermal phase change materials comprising generally unreinforced films.

Exemplary embodiments may include one or more thermal interface materials that have high thermal properties depending on the specific material used to make the thermal interface material and the percentage loading of the thermally conductive filler (if any). Conductivity (e.g., 1W/mK (Watts per meter per Kelvin), 1.1W/mK, 1.2W/mK, 2.8W/mK, 3W/mK, 3.1W/mK, 3.8W/mK, 4W/mK, 4.7 W/mK, 5W/mK, 5.4W/mK, 6W/mK). These thermal conductivities are merely examples as other embodiments may include thermal interface materials having thermal conductivities above 6 W/mK, less than 1 W/mK, or other values and in the range between 1 to 6 W/mK. Accordingly, aspects of the present disclosure should not be limited to use with any particular thermal interface material, as exemplary embodiments may include a wide range of thermal interface materials and other materials (eg, non-thermally enhanced materials, thermal insulators, dielectric insulators, electrical insulators) , conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, combinations thereof, individual layers thereof, stacked layers thereof, etc.).

Thermal interface materials and/or other materials applied by the systems and methods disclosed herein may include one or more suitable fillers and/or binders added to achieve various desired results. Exemplary fillers include pigments, plasticizers, processing aids, flame retardants, extenders, and the like. For example, tackifiers may be added to increase the viscosity of thermal interface materials or other materials, and the like. By way of further example, thermal interface materials and/or other materials applied by the systems and methods disclosed herein may include electromagnetic interference (EMI) Or microwave absorbers, conductive fillers, and/or magnetic particles to be operable or useful as EMI and/or RFI shielding materials. Examples of fillers include carbonyl iron, iron silicide, iron particles, iron-chromium compounds, metallic silver, carbonyl iron powder, iron-silicon-aluminum magnetic alloy (SENDUST) (an alloy containing 85% iron, 9.5% silicon, and 5.5% aluminum), Moalloys (alloys containing approximately 20% iron and 80% nickel), ferrites, magnetic alloys, magnetic powders, magnetic flakes, magnetic particles, nickel-based alloys and powders, chromium alloys, and any combination thereof. Thermal interface materials and/or other materials applied by the systems and methods disclosed herein may include one or more EMI absorbers formed from one or more of the above materials, wherein the EMI absorbers include particulates , spheroids, microspheres, ellipsoids, irregular spheres, strands, flakes, powders, and/or any or all combinations of these shapes.

A wide range of materials may be used for the cover (broadly the element) in the exemplary embodiments disclosed herein, including conductive materials such as metals (eg, aluminum, copper, etc.), alloys, natural graphite, synthetic graphite, or other suitable materials, etc.). By way of example, a non-exhaustive list of exemplary materials from which EMI shields or portions thereof may be fabricated includes cold rolled steel, nickel silver alloys, copper nickel alloys, stainless steel, tin plated cold rolled steel, tin plated copper alloys, carbon steel, brass, Copper, aluminum, copper beryllium, phosphor bronze, steel, alloys thereof, plastic material coated with conductive material, or any other suitable conductive and/or magnetic material. Since different materials may be used depending, for example, on a particular application, the materials disclosed in this application are provided herein for illustrative purposes only.

Additionally, the thermal interface materials and other materials disclosed herein can be applied to a wide range of components or components. (including lids or integrated heat spreaders for integrated circuit (IC) packages, board level shields (eg, removable lids or covers for board level shields (BLS), etc.), heat sources (eg, central processing units (CPUs), etc.) ), heat removal/heat dissipation structures or components (eg, heat spreaders, heat sinks, heat pipes, vapor chambers, device enclosures or housings, etc.), etc.). Thus, aspects of the present disclosure should not be limited to use with any single type of element or component or to application to any specific location or portion of an element or component.

In exemplary embodiments, portions of thermal interface material or other materials may be supplied from The body is removed and applied to the cover or cover of the Board Level Shield (BLS). The BLS cover or cover may be integral with or removably attached to the side wall of the BLS. For example, the BLS may include sidewalls integrally formed with the upper surface, cover, lid, or top of the BLS. For example, the side walls and the upper surface may be formed by stamping the same sheet of conductive material and then folding the stamped material so that the side walls are substantially perpendicular to the upper surface. Alternatively, the sidewalls may be fabricated separately and not integrally formed with the upper surface of the BLS. In some exemplary embodiments, the BLS may include a two-piece shield from which the upper surface, cover, cover, or top is removable and attachable to the sidewalls. In some exemplary embodiments, the BLS can include one or more inner walls, dividers, or spacers attached to and/or integral with the BLS. In this exemplary embodiment, the BLS cover, side walls, and inner walls may cooperatively define a plurality of independent EMI shielding compartments.

In some exemplary embodiments, removal (eg, one or more rolls, reels, or tapes of one or more of the same, different, and/or multilayer materials) may be removed from one or more supplies , pushing, pressing, compacting, removing, severing, tearing, cutting, blowing, etc.) multiple portions of material and applying them to either or both sides of a part or substrate. For example, multiple portions of the same thermal interface material (or another material) can be removed from a single supply of thermal interface material and coated along the underside or inside of the BLS lid or cover (or other component). Multiple different portions may be removed and applied from a single supply separately (eg, sequentially, sequentially, consecutively, etc.) or simultaneously. Alternatively, for example, multiple different portions of the same thermal interface material (or another material) may be removed and applied from different supplies separately or simultaneously. As another example, multiple different portions of different materials may be removed and applied separately or simultaneously from different supplies of different materials. The various portions may be adjacent (eg, abutted, touching, etc.) or spaced apart from each other along the BLS cover or cover. Additionally or alternatively, a number of different sections may be stacked on top of each other along the lower or inner side of the BLS or cover.

The portion of TIM or other material applied along the inside of the BLS cover or cover can be of the same thickness or different thicknesses to accommodate devices, components, etc. of varying heights that will be beneath the BLS. The portion of TIM or other material applied along the outside of the BLS cover or cover can also be of the same thickness or different thicknesses to suit the Heat spreaders, heat sinks, other heat removal/dissipation structures, etc. should vary in thickness.

In an exemplary embodiment, the supply of material may comprise a single roll, reel, tape, or other supply of a single layer of material or multiple layers of material. In other exemplary embodiments, the supply of material may include multiple rolls, reels, tapes, or other supplies of a single layer of material, which may be the same or different for the multiple supplies. In further exemplary embodiments, the supply of material may include multiple rolls, reels, tapes, or other supplies of multiple layers of material, which may be the same or different for the multiple supplies. In yet other exemplary embodiments, the supply of material may comprise at least one roll, reel, tape or other supply of a single layer of material or at least one roll, reel, tape or other supply of multiple layers of material. In some exemplary embodiments, the supply of material may include a supply having a bag or cavity (eg, carrier tape, etc.), the material to be applied (eg, blown from the bag, mechanically removed with a pick-and-place device, etc.) Portions (eg, portions of TIM or other materials, etc.) are positioned in the bag or cavity. In exemplary embodiments, portions from one or more supplies of material may be removed and applied separately (eg, sequentially, sequentially, consecutively, etc.) or simultaneously.

In an exemplary embodiment, the system may be used to remove portions of material (eg, TIMs, etc.) from a supply (eg, disks, rolls, tapes, etc.) and apply or transfer portions of material to components. For example, the system may cut the material portion from the supply, and the cutting process may also transfer the cut material portion to the part. Alternatively, for example, the system may shape and/or size the material portion, and the shaping and/or sizing process may also transfer the shaped and/or sized material portion to the part. As another example, the system may deform the material portion, and the deformation process may also transfer the deformed material portion to the part. As yet another example, the system may imprint and tear portions of material, and the process may also transfer portions of material to parts.

Example embodiments disclosed herein may be used with a wide range of heat sources, electronic devices, and/or heat removal/heat dissipation structures or components (eg, heat spreaders, heat sinks, heat pipes, device enclosures or housings, etc.). For example, a heat source may include one or more heat generating components or devices (eg, CPU, Dies in underfill, semiconductor devices, flip chips, graphics processing units (GPUs), digital signal processors (DSPs), multiprocessor systems, integrated circuits, multicore processors, etc.). Generally, a heat source may include any component or device that has a higher temperature than the thermal interface material or that otherwise provides or transfers heat to the thermal interface material regardless of whether the heat is generated by the heat source or solely by or transferred through the heat source. Accordingly, aspects of the present disclosure should not be limited to any particular use with any single type of heat source, electronic device, heat removal/heat dissipation structure, or the like.

Exemplary embodiments may provide one or more (but not necessarily any or all) of the following features or advantages, such as with some conventional phase change material (PCM) coatings with tabbed elements that add high cost Tab cancellation and reduced cost compared to processing. Exemplary embodiments may help resolve issues such as customer issues with properly applying tabbed elements, liner release issues, constraints on element configuration, shape, and size, during additional steps after formation in a clean room Difficulty keeping the material clean and/or shipping the tabbed element without twisting). The exemplary embodiments disclosed herein may allow for the provision of standard materials (eg, standard widths, thicknesses, and/or lengths, etc.), which may then be used with different molds that may be varied as desired for various shapes and sizes. The exemplary embodiments disclosed herein may be designed from a simpler form of pot to finished roll, may provide compact processing and smaller clean room requirements (Type 2), may require only limited work-in-progress (WIP) expenditures , may allow for simpler/smaller list of component numbers, PCM thicknesses and widths, may allow for a variety of mold shapes and components that are not cost-effective in tab format (eg, Figure 3, etc.), may allow for available Minimal dimensions become non-issue (eg, Figure 3, etc.), may allow liner release variation issues to be unimportant, and/or may allow "clean" material that excludes screening to remain between the liners until applied to the lid. In some exemplary embodiments, the TIM can be applied quickly and without twisting and trapped air, and the elements can be clean without being pumped out.

Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those skilled in the art. Numerous specific details are set forth, such as examples of specific components, apparatus, and methods, to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms, and that nothing should be construed as limiting the scope of the present disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. Additionally, the advantages and improvements that may be realized with one or more exemplary embodiments of the present invention are provided for illustration purposes only, and do not limit the scope of the present disclosure (as the exemplary embodiments disclosed herein may provide the aforementioned advantages and none or none of the improvements are provided and still fall within the scope of this disclosure).

Specific dimensions, specific materials, and/or specific shapes disclosed herein are exemplary in nature and do not limit the scope of the present disclosure. The disclosure of specific values and specific value ranges for a given parameter herein is not exhaustive of other values and value ranges that may be used in one or more of the examples disclosed herein. Furthermore, it is envisioned that any two specific values for a particular parameter recited herein may define the endpoints of a range of values that may be suitable for a given parameter (ie, the disclosure of first and second values for a given parameter). can be interpreted to disclose that any value between the first and second values may also be employed for a given parameter). For example, if a parameter X is exemplified herein as having a value of A and is also exemplified as having a value of Z, it is envisioned that the parameter X may have a range of values from about A to about Z. Similarly, it is contemplated that the disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping, or distinct) encompass values for which the endpoints of the disclosed ranges may be used to clamp All possible combinations of ranges. For example, if parameter X is exemplified herein as having a value in the range 1-10 or 2-9 or 3-8, it is also envisioned that parameter X may have values including 1-9, 1-8, 1-3, 1-2 , 2-10, 2-8, 2-3, 3-10 and other value ranges of 3-9.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. For example, when permissible phrases such as "may include," "may include," and the like are used herein, at least one embodiment includes or includes the feature. As used herein, the singular form "a" may be intended to include the plural form as well, unless the context clearly dictates otherwise. The terms "comprising" and "having" are inclusive and thus specify the presence of recited features, integers, steps, operations, elements and/or components, but do not exclude a The presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Method steps, procedures, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on," "engaged to," "connected to," or "coupled to" another element or layer, the element or layer can be directly on the other element or layer , directly engaged, connected or coupled to another element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (eg, "between" versus "directly between", "adjacent" to "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The term "about" when applied to a value indicates that the calculation or measurement allows for some inaccuracies in the value (approximately or reasonably close to the value; approximately). If for some reason the imprecision provided by "about" is not otherwise understood in the art in this ordinary sense, then "about" as used herein indicates at least the variation that might arise from ordinary measurement methods or the use of such parameters . For example, the terms "substantially," "approximately," and "approximately" may be used herein to mean within manufacturing tolerances. Alternatively, for example, the term "about" as used herein when modifying the invention or the amounts of ingredients or reactants employed refers to what may occur due to typical measurement and processing procedures used (eg, making a concentrate in the real world or solutions, due to accidental errors in these procedures; due to variations in the manufacture, source, or purity of the ingredients used to make the composition or to perform the method). The term "about" also includes amounts that vary due to the different equilibrium conditions used for the composition produced from the particular initial mixture. Whether or not modified by the term "about," the claimed scope includes numerical equivalents.

Although the terms first, second, third, etc. may be used herein to describe various elements, parts elements, regions, layers and/or sections, but these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply an order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of example embodiments.

Spatially relative terms (such as "inner," "outer," "below," "below," "lower," "above," "upper," etc.) may be used herein for convenience of description as illustrated in the accompanying drawings Describes the relationship of one element or feature to another element or feature. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), thus interpreting the spatially relative descriptors used herein.

The foregoing description of the embodiments has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the present disclosure. Individual elements, intended or described uses or features of a particular embodiment are generally not limited to that particular embodiment, but, under appropriate circumstances, are interchangeable and can be used in a selected embodiment (even if that embodiment is not specifically shown or described). ). The same content can also be changed in many ways. Such variations are not considered to be a departure from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

300: System

302: Tools

308: Mold

318: Support Surface

324: Parts

328: Supply/Volume

332: Roller

340: Roller

344: Material Band

360: Roller/Rollers

Claims (23)

A system for applying a material to a component, the system comprising: a first tool configured to be movable relative to a supply of material to apply the material from the supply The portion is positioned along the part so that when the first tool is relatively moved along the portion of the material, air pockets and/or air bubbles are forced away from the portion of the material, removed from the portion of the material The portion of the material is extruded or removed; and a second tool operable to displace the portion of the material after the first tool has been relatively moved along the portion of the material; The portion is transferred from the supply to the component. The system for applying material to a component of claim 1, wherein: the first tool is configured to be relatively movable along a liner of the supply of the material so as not to apply the material with the portion of the material being transferred or removed from the liner, positioning the portion of the material from the supply along the part; and the second tool is operable at The first tool transfers the portion of the material from the liner to the part after the first tool has been relatively moved along the liner. The system for applying a material to a component of claim 2, wherein the first tool is configured to be movable into contact with and along the liner to move the material from the the portion of the material of the supply body is pushed or pressed against the part so that when the first tool moves along the liner while in contact with the liner, before the second tool transfers the portion of the material from the liner to the part, forcing air pockets and/or air bubbles away from the portion of the material or removing air pockets and/or air bubbles from the portion of the material The portion of the material is extruded. The system for applying material to a part of claim 3, wherein the first tool includes a roller configured to be movable into contact with and along the liner rolling to push or push the portion of the material from the supply against the part pressing so as to force air pockets and/or air bubbles away from, squeeze out air pockets and/or air bubbles from the portion of the material as the roller rolls along the liner or removal; and the second tool includes a die coupled to an extruder such that the die is movable relative to the part via the extruder to force air pockets and/or air bubbles from the The portion of the material is transferred from the supply to the component after the operation of exiting the portion of the material, extruding or removing air pockets and/or air bubbles from the portion of the material. The system for applying material to a part of claim 4, wherein: the roller is configured to move at a non-perpendicular angle relative to the liner into contact with the liner and along the the lining rolls; and the roller includes an elastic material that rollingly contacts the lining to apply pressure to the lining to roll the elastic material along the lining in the roller while the air pockets and/or air bubbles are forced away from, squeezed out or removed from the portion of the material. The system for applying a material to a component of any one of claims 1 to 5, wherein the first tool includes a convexly curved outer surface configured to be Said convexly curved outer surface is capable of relatively sliding movement along said portion of said material, forcing air pockets and/or air bubbles away from said portion of said material, removing air pockets and/or air bubbles from said portion of said material. The portion of the material is extruded or removed. A system for applying material to a component as claimed in any one of claims 1 to 5, wherein the first tool is configured to be automated by the system relative to the supply of the material moving to automatically position the portion of the material from the supply along the part so as to automatically force the first tool as the first tool is automatically moved relatively along the portion of the material Air pockets and/or air bubbles exit, extrude or remove air pockets and/or air bubbles from the portion of the material. The system for applying material to a part of any one of claims 1 to 3, wherein the first tool includes a roller configured to oppose along the portion of the material rolling to position the portion of the material from the supply along the component so that when the rollers are relatively rolled along the portion of the material, air pockets and/or air pockets are forced and/or air bubbles exit, extrude or remove air pockets and/or air bubbles from the portion of the material; and the second tool includes a die coupled to an extruder such that the die can be moved relative to the part via the extruder to force air pockets and/or air bubbles away from the portion of the material as the rollers force air pockets and/or air bubbles out of the material After the portion extrusion or removal operation, the portion of the material is transferred from the supply to the component. A system for applying material to a part as claimed in any one of claims 2 to 5, wherein the portion of the material is transferred from the liner to the part at the second tool before, the first tool is operable to force air pockets and/or air bubbles away from the portion of the material, extrude or remove air pockets and/or air bubbles from the portion of the material; After the operation of the first tool forcing, extruding or removing air pockets and/or air bubbles from the portion of the material, the second tool is configured to be operable to sever, tear, separate, separate and/or cut said portion of said material for release and transfer from said liner of said supply of said material; and said first The second tool is configured to be operable to remove and/or peel from the portion of the material without removing the portion of the material from the component when the second tool is removed the lining. A system for applying material to a component as claimed in any one of claims 1 to 5, wherein: the supply of the material includes one or more supplies of one or more of a thermal interface material, a conductive elastomer, an electromagnetic interference absorber, an electromagnetic interference shielding material, a dielectric material, and a thermally conductive material; and The components include one or more of a lid or integrated heat spreader of an integrated circuit package, a lid of a board level shield, a heat source, a heat removal/heat dissipation structure, and a substrate. A system for applying material to a part, the system including a tool configured to be movable into contact with and along a lining of a supply of material to With the portion of the material of the supply being transferred from the liner, the portion of the material is pushed, pressed or positioned against a component, thereby moving the tool along the liner while and before the portion of the material is transferred from the liner to the part, forcing air pockets and/or air bubbles away from the portion of the material, removing air pockets and/or air bubbles from the The portion of the material is extruded or removed. The system for applying material to a part of claim 11, wherein the tool includes a roller configured to be movable into contact with and roll along the liner, to push, press or position the portion of the material from the supply against the part, thereby forcing air pockets and/or air bubbles from the The portion of the material exits, air pockets and/or air bubbles are squeezed out or removed from the portion of the material. The system for applying material to a part of claim 12, wherein: the roller is configured to move at a non-perpendicular angle relative to the liner into contact with the liner and along the the lining rolls; and the roller includes an elastic material that rollingly contacts the lining to apply pressure to the lining to roll the elastic material along the lining in the roller while the air pockets and/or air bubbles are forced away from, squeezed out or removed from the portion of the material. The system for applying a material to a part of claim 11, wherein the tool includes a convexly curved outer surface configured to be When the liner is in contact while being slidably movable along the liner, air pockets and/or air bubbles are forced away from the portion of the material, and air pockets and/or air bubbles are forced away from the portion of the material. Partial extrusion or removal. A system for applying a material to a component as claimed in any one of claims 11 to 14, wherein the tool is configured to be automatically moved by the system to the supply of the material the liner contacts and moves along the liner to remove all of the material from the supply without transferring or removing the portion of the material from the supply from the liner the portion is automatically pushed, pressed or positioned against the part to automatically force air pockets and/or air bubbles away from the portion of the material as the tool is automatically moved along the liner , extrusion or removal of air pockets and/or air bubbles from the portion of the material. A system for applying material to a component as claimed in any one of claims 11 to 14, wherein: the tool is a first tool; the system further comprises a second tool capable of operatively transferring the portion of the material from the liner to the part; before the second tool transfers the portion of the material from the liner to the part, the first A tool operable to force air pockets and/or air bubbles away from said portion of said material, extrude or remove air pockets and/or air bubbles from said portion of said material; The second tool is configured to be operable after the operation of extruding or removing air pockets and/or air bubbles from the portion of the material. severing, tearing, separating, separating and/or cutting said portion of said material for release and transfer from said liner of said supply of said material; and The second tool is configured to be operable to remove and operatively remove the portion of the material from the component without removing the portion of the material from the component when the second tool is removed. /or peel off the liner. A system for applying a material to a component according to any one of claims 11 to 14, wherein the supply of material comprises a thermal interface material, a conductive elastomer, an electromagnetic interference absorber, an electromagnetic interference shielding material , one or more supplies of one or more of a dielectric material and a thermally conductive material; and the components include lids or integrated heat spreaders for integrated circuit packages, lids for board level shields, heat sources, heat removal/ one or more of a heat dissipation structure and a substrate. A system for applying material to a part, the system including a rolling device configured to be movable into contact with and rolling along a supply of material to transfer material from all The portion of the material of the supply is pushed, pressed or positioned against the part so that as the rolling device rolls along the supply of the material and the portion of the material is removed from the The air pockets and/or air bubbles are forced away from, squeezed out or removed from the portion of the material before the supply is transferred to the part. The system for applying material to a component of claim 18, wherein the rolling device is configured to be movable into contact with and along a lining of the supply of the material rolling to push, press or position the portion of the material from the supply against the part without transferring or removing the portion of the material from the liner . The system for applying material to a part of claim 18, wherein: the rolling device is configured to move at a non-perpendicular angle relative to the liner into contact with the supply of the material and rolling along the supply of the material; and the rolling means includes an elastic material that rollingly contacts the supply of the material should be adapted to apply pressure to the liner to force air pockets and/or air bubbles away from the portion of the material as the elastic material rolls along the supply of the material, trapping the air pockets and/or air bubbles are extruded or removed from the portion of the material. The system for applying material to a component of claim 18, wherein the rolling device is configured to be automatically moved by the system into contact with the supply of the material and along the the supply of the material is moved to automatically push, press or position the portion of the material from the supply against the part so that the rolling means automatically along the lining When moving, air pockets and/or air bubbles are automatically forced away from, squeezed out or removed from the portion of the material. A system for applying a material to a component as claimed in any one of claims 18 to 21, wherein: the system includes a tool operable to remove the portion of the material from the a supply is transferred to the part; and the rolling device is operable to force air pockets and/or air bubbles from the part before the tool transfers the portion of the material from the supply to the part The portion of the material exits, air pockets and/or air bubbles are squeezed out or removed from the portion of the material. A system for applying a material to a component as claimed in any one of claims 18 to 21, wherein the supply of material comprises a thermal interface material, a conductive elastomer, an EMI absorber, an EMI shielding material , one or more supplies of one or more of a dielectric material and a thermally conductive material; and the components include lids or integrated heat spreaders for integrated circuit packages, lids for board level shields, heat sources, heat removal/ one or more of a heat dissipation structure and a substrate.

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